WO2011160897A1 - Eingekapseltes steuerungsmodul für ein kraftfahrzeug - Google Patents
Eingekapseltes steuerungsmodul für ein kraftfahrzeug Download PDFInfo
- Publication number
- WO2011160897A1 WO2011160897A1 PCT/EP2011/058111 EP2011058111W WO2011160897A1 WO 2011160897 A1 WO2011160897 A1 WO 2011160897A1 EP 2011058111 W EP2011058111 W EP 2011058111W WO 2011160897 A1 WO2011160897 A1 WO 2011160897A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base plate
- control module
- module according
- electrical
- protective mass
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Definitions
- the invention relates to control modules and methods for their production.
- the invention relates to a control module for a motor vehicle, a motor vehicle with a control module, and a method for producing a control module.
- Control modules for automotive automatic transmissions are installed in the transmission in such a way that they are completely or partially submerged in the transmission oil. These control modules contain electronics that must be packaged in an oil-tight housing so that the aggressive gear oil does not destroy the electronics. This tightness must be ensured within the operating temperature of the motor vehicle automatic transmission, d. H. in a temperature range of about minus 40 degrees Celsius to plus 150 degrees Celsius.
- hermetically sealed steel housings with glazed pins can be used for electrically contacting the electronics. It is also possible to use housings which are produced by a so-called molding process.
- Such a molded housing, that is sealed with an encapsulating resin, is described in EP 1 396 885 B1.
- a circuit carrier is equipped with electronic components and completely enclosed in the molding compound, wherein the electrical see-contacting of the circuit substrate is carried out through a stamped grid.
- the individual contact strips of the stamped grid emerge on the side surfaces of the mold housing.
- these contact strips are welded to the punched grid of the control module and then covered by plastic lids containing ribs which dive between the contact strips so as to provide protection against short circuits.
- All contact strips must have adhesion with the molding compound on all side surfaces in order to ensure the oil-tightness of the housing housing. This liability depends on many parameters, eg. B. also on the geometry and distribution of contact strips. When changing the contact strip arrangement, it may therefore be necessary to adapt the process accordingly.
- the two tool halves of the mold tool travel on the stamped grid and seal on it. This means that the spaces between the individual contact strips would also have to be sealed by the two tools, which, however, is costly due to part tolerances for technical reasons.
- the webs can be punched out even after the molding process in order to obtain an electrical separation of the individual contact strips. As a result, an additional process step, which also brings the risk of damage to the mold housing due to cracking, required.
- control module for a motor vehicle, a motor vehicle with a control module and a method for producing a control module according to the
- a control module for a motor vehicle which has a base plate, an electrical unit, an electrically insulated feed line and an insulating and environmentally protective mass.
- the electrical unit has at least one electronic module and is arranged on an upper side of the base plate.
- the electrically insulated lead serves to electrically connect the electronic assembly to an external electrical component and the insulating and environmental protective compound (which is, for example, an encapsulating resin) is applied to the top of the base plate and covers the electrical unit tightly , So it's an encapsulation.
- the base plate projects beyond the protective mass in planar expansion along the entire circumference of the base plate. In other words, therefore, the base plate protrudes, so has a larger footprint than the protective mass.
- the protective mass is applied only on the top of the base plate and not on the underside of the base plate.
- the base plate is received by a lower half of a Moldwerkmaschines before applying the protective mass and the corresponding upper half of the Moldwerkmaschines sealingly applied to the base plate, after which the protective mass is introduced into the mold.
- all electrical, insulated leads are mounted on the underside of the base plate which faces the protective mass.
- the electronic module or the electronic modules
- all leads are located on the underside of the base plate.
- the base plate has one or more openings, under which, the supply line / leads is / are arranged.
- the openings serve to carry out one or more electrical lines between the electronic module and the corresponding supply line.
- the supply line is arranged on the underside of the base plate.
- a motor vehicle is specified with a control module described above and below.
- the application of the mass to the top of the base plate using a Moldwerkmaschines with a tool base and a tool shell, wherein the base plate is applied during application of the protective mass in the tool base and wherein the tool shell during application of the protective mass along a circumferential sealing line rests on the top of the base plate.
- Fig. 1 shows an encapsulated control device according to an embodiment of the invention.
- FIG. 2 shows a sectional view of the control module of FIG. 1, including a partial region of a molding tool.
- FIG. 3 shows a construction stage of the control module of FIG. 1.
- FIG. 4 shows a further construction stage of the control module of FIG. 1.
- FIG. 5 shows a sectional representation of a subregion of the control module according to an exemplary embodiment of the invention.
- Fig. 1 shows an encapsulated (ie ummoldetes) control module according to an embodiment of the invention.
- the control module is, for example, a control module for an automatic transmission of a vehicle.
- the molding compound 13 is shown transparent for clarity.
- FIG. 2 shows a section through the control module of FIG. 1, which is shown in FIG. 1 as a section line A-A.
- the control module also referred to as control unit
- the electronic circuit which consists of the circuit substrate 8 with at least one electronic component or an electronic module 9 is on the base plate 1 glued or otherwise secured. This construction stage is shown in Fig. 4.
- control module The structure of the control module is described as follows analogous to the possible production process:
- strip-shaped flexible foil conductor elements (also called flex foil elements) 31, 32, 33, 34, 35 are glued under the corresponding opening 21, 22, 23, 24, 25 (see also FIG. 3 and sectional view, FIG. 2).
- the bonding of the foil conductor elements 31 to 35 with the base plate 1 seals the openings 21 to 25 downwards.
- Each foil conductor element is provided on the side opposite the opening 21 to 24 with a flat stiffening element 41, 42, 43, 44 (see FIG. 2).
- the reinforcing or stiffening element is a glued metal or plastic plate.
- the film conductor elements themselves are constructed, for example, as follows: An electrically conductive copper layer 6 is bonded to a base film 51.
- cover sheet 52 On the copper layer 6 is a cover sheet 52 (see Fig. 2). In the area of the openings 21 to 25, the cover film 52 is provided with at least one breakout 7, so that the electrically conductive copper layer is exposed.
- foil conductor elements with several layers can also be used.
- the base plate 1 with one or more openings 2, the associated glued foil conductor elements 2 and their reinforcing elements 4 are executed, depending on the number of inputs and outputs required for the electronic circuit.
- the spatial position of the openings on the base plate 1 is also freely selectable.
- a circuit carrier with at least one electronic component 9 (electronic assembly) can now be glued.
- the circuit carrier 8 connects the electronic components 9 with corresponding contact pads 10. These contact pads 10 are preferably electrically connected by wire bonding to the electrical tracks of the copper layer 6 in the flex foil elements 31 to 35, by the electric paths in the flex foil elements via the breakouts 7 be contacted.
- Fig. 4 shows the corresponding construction stage, in which the base plate with the Flexfolienianon (foil conductor elements) and the electronic circuit is completed. In this stage, it is z. B. possible to electrically check the entire electronic circuit and their contact.
- the construction stage shown in Fig. 4 is inserted into a mold.
- This mold tool is sketched in sections in FIG. 2 and has an upper half 201 and a lower half 202.
- the assembly is received in particular on the reinforcing elements 4 in the tool half 202 (see also Fig. 2, area Wu).
- the upper part of the Moldtechnikmaschines 201 moves to the base plate 1 and seals it in the area Wo.
- the area Wo forms a circumferential sealing line, as shown in FIG. 1 as a dotted line 12.
- the closing force of the mold tool can be mutually supported by the opposing portions Wu and Wo.
- the seal on the base plate 1 is easy because the base plate provides a flat surface with a good surface.
- the molding compound 13 is filled in a known manner and thus forms the housing for the electronic circuit.
- the tightness of this Moldgezzau- ses is ensured by the fact that the molding compound 13 on the base plate 1 circumferentially adheres (parallel to the dotted line 12) and the gluing of the Flexfolienstsammlung 3 is circumferentially sealed around the opening 2 tight.
- each contact strip of the stamped grid must have on all four sides of adhesion or tightness to prevent ingress of oil in the electronics area. Since the control units require a large number of contacts (inputs / outputs) in the order of 40 to 80 pieces, this results in 40 to 80 sealing lines.
- the sealing line to the base plate and one sealing line per opening in the base plate must be sealed. Thus, it is possible, for. As a control device with five openings (ie, for example, five foil conductor elements) to build, which contains 80 contact paths in the sum, but still has only six sealing lines (see Fig. 1). Furthermore, it is advantageous that all sealing lines are flat and not spatially, as to the leadframe contact strips. Also, the surface is in the range of Defined sealing lines and not like the punched edges in the lead frame contact strips strongly fluctuating due to process and material tolerances.
- the base plate material can be matched exactly to the coefficient of thermal expansion of the molding compound, since the base plate does not assume any electrical functions. The risk of crack formation due to different temperature expansions is therefore minimized.
- the layout of the flex foil elements or, more generally, of the electrically insulated feed lines (which can also be stamped grid) can be freely designed without this affecting the molding process. Even the arrangement of the opening is not critical, since the molding compound only has to seal along the line 12 parallel to the base plate. The seal of the leads takes over the bond 14 between the base plate 1 and the cover sheet 7 (see Fig. 2).
- stamping grid technique is the comparatively high current carrying capacity due to the larger cross sections of the conductors. Should it be z.
- the control device can be provided with a stamped grid according to Fig. 5.
- Such punched grids can be provided alternatively or in addition to film conductor elements.
- a plastic-encased stamped grid part 16 is inserted into an opening 2 of the base plate 1.
- This stamped grid part contains at least one printed conductor 17, which is made of a plastic material 18 in FIG is injected known manner.
- the punched grid is preferably contacted by wire bonding to the circuit carrier 8 of the electrical circuit analogously to the foil conductor elements.
- a portion 20 of each conductor is released so that the molding compound 13 can flow around the conductor on all four sides. This prevents the penetration of oil through the individual tracks.
- a seal is produced by bonding the encapsulation 18 to the base plate by the molding compound 13.
- the plastic extrusion coating with an adhesive 19 can be glued directly against the base plate.
- Another aspect of the invention is the mechanical fixation of the control unit in the control module or directly to a transmission part of the motor vehicle transmission. If a control unit is fixed in a known manner to a metal plate made of aluminum (eg the hydraulic control plate of the gearbox), considerable strains may occur in the case of corresponding temperature fluctuations. These strains are much larger than those of the molding compounds, which in turn brings with it the risk of cracks in the resin. In this regard, complex design solutions are often required to compensate for these strains (eg in the form of resilient elements).
- the base plate 1 of the control module can be designed so stiff that the different thermal expansions cause no deformation, but only stresses.
- thermal expansion leads to impressed stresses in the base plate, but not to stresses in the molding compound, whereby cracking can be avoided.
- the base plate of the control unit (control module) can therefore be provided in a simple manner with formations, which are provided for example with holes 15 in order to secure the control unit to the transmission (see Fig. 1). In this way, a heat conduction directly down through the base plate 1 is possible.
- the contact strips of the stamped grid are welded to the control module to contact this electrically. Since the electrical connection technology is also provided by plastic-stamped punched grids, strains from the punched grid of the control module are exposed to changes in temperature Transfer contact strip of the control unit punched grid. These strains also give rise to the risk of cracks / leaks.
- a simple mold tool with a simple seal can be used, in particular, no free-punching process is required after the molding process
- Reliable short-circuit protection can be provided at the contact point between the housing housing and the control module
- Changes / variants of the arrangement of the electrical contacting have no influence on the molding process per se ngen and variants of the arrangement of the electrical contact can be displayed without or with only low tooling costs, since no new punching tool and no new free-punching tool for the stamped grid is needed.
- a simple attachment of the control module is possible, this attachment initiates no forces in the molding compound and thus the
- the electrical contact is made by a flexible contact, which initiates no forces on the molding compound and thus does not endanger the tightness. Should z. B. for driving an electric oil pump lines to the control unit must be contacted, on which large currents (order of magnitude greater than 10 amps) must flow, it can also be used instead of a foil conductor element a stamped grid part. In addition, it should be noted that "comprehensive” and “having" no other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Transmission Device (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Motor Or Generator Frames (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180031186.1A CN102959703B (zh) | 2010-06-25 | 2011-05-19 | 用于机动车的封装控制模块 |
US13/703,928 US9637073B2 (en) | 2010-06-25 | 2011-05-19 | Encapsulated control module for a motor vehicle |
KR1020127033591A KR20130118225A (ko) | 2010-06-25 | 2011-05-19 | 자동차를 위한 캡슐화된 제어 모듈 |
EP11720117.8A EP2586059A1 (de) | 2010-06-25 | 2011-05-19 | Eingekapseltes steuerungsmodul für ein kraftfahrzeug |
JP2013515787A JP5603489B2 (ja) | 2010-06-25 | 2011-05-19 | 自動車用の密閉型のコントロールモジュール |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010030528A DE102010030528A1 (de) | 2010-06-25 | 2010-06-25 | Eingekapseltes Steuerungsmodul für ein Kraftfahrzeug |
DE102010030528.6 | 2010-06-25 |
Publications (1)
Publication Number | Publication Date |
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WO2011160897A1 true WO2011160897A1 (de) | 2011-12-29 |
Family
ID=44280941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/058111 WO2011160897A1 (de) | 2010-06-25 | 2011-05-19 | Eingekapseltes steuerungsmodul für ein kraftfahrzeug |
Country Status (7)
Country | Link |
---|---|
US (1) | US9637073B2 (de) |
EP (1) | EP2586059A1 (de) |
JP (1) | JP5603489B2 (de) |
KR (1) | KR20130118225A (de) |
CN (1) | CN102959703B (de) |
DE (1) | DE102010030528A1 (de) |
WO (1) | WO2011160897A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012201014A1 (de) * | 2012-01-24 | 2013-07-25 | Robert Bosch Gmbh | Getriebesteuermodul mit Öl-resistenten Leiterbahnen |
JP6041211B2 (ja) * | 2013-03-29 | 2016-12-07 | 住友電装株式会社 | 自動変速機用保持プレート、およびこれを備えた配線ユニット |
JP6086407B2 (ja) * | 2013-10-02 | 2017-03-01 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
DE102015218171B4 (de) * | 2015-09-22 | 2023-08-03 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung einer elektronischen Komponente und elektronische Komponente |
DE102016209416A1 (de) * | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Steuergeräteeinheit, insbesondere für ein Kraftfahrzeug, und Verfahren zum elektrischen Verbinden eines Stanzgitters aus im Wesentlichen Kupfer oder Aluminium mit elektrischen Bauelementen auf einer Montagefläche eines Leiterplattenelements |
DE102016209421A1 (de) * | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Steuergeräteeinheit, insbesondere für ein Kraftfahrzeug und Verfahren zum elektrischen Verbinden eines Stanzgitters aus im Wesentlichen Kupfer oder Aluminium mit elektrischen Bauelementen auf einer Montagefläche eines Leiterplattenelements |
DE102016209477A1 (de) | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Stanzgitteranordnung für ein Getriebesteuermodul mit durch eine gekapselte Drahtbondverbindung verbundenen Cu- und Al-Stanzgittern |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0834923A1 (de) * | 1996-10-07 | 1998-04-08 | Gec Alsthom Transport Sa | Elektronik-Halbleiterleistungsmodul und Leistungsunterbrecher damit |
EP1396885A1 (de) * | 2002-09-03 | 2004-03-10 | Hitachi, Ltd. | Elektronische kfz-Steuereinheit aus harzformmassen |
DE10315432A1 (de) | 2003-04-03 | 2004-10-14 | Conti Temic Microelectronic Gmbh | Anordnung zum elektrischen Verbinden |
US20060158804A1 (en) * | 2003-09-09 | 2006-07-20 | Sanyo Electric Co., Ltd. | Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof |
DE102007032142A1 (de) * | 2007-06-30 | 2009-01-02 | Robert Bosch Gmbh | Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls |
Family Cites Families (15)
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- 2011-05-19 WO PCT/EP2011/058111 patent/WO2011160897A1/de active Application Filing
- 2011-05-19 JP JP2013515787A patent/JP5603489B2/ja not_active Expired - Fee Related
- 2011-05-19 US US13/703,928 patent/US9637073B2/en not_active Expired - Fee Related
- 2011-05-19 CN CN201180031186.1A patent/CN102959703B/zh not_active Expired - Fee Related
- 2011-05-19 KR KR1020127033591A patent/KR20130118225A/ko not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
---|---|
DE102010030528A1 (de) | 2011-12-29 |
US20130147267A1 (en) | 2013-06-13 |
KR20130118225A (ko) | 2013-10-29 |
US9637073B2 (en) | 2017-05-02 |
JP2013532383A (ja) | 2013-08-15 |
CN102959703A (zh) | 2013-03-06 |
EP2586059A1 (de) | 2013-05-01 |
JP5603489B2 (ja) | 2014-10-08 |
CN102959703B (zh) | 2016-07-06 |
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