WO2011158729A1 - Module de source de lumière - Google Patents

Module de source de lumière Download PDF

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Publication number
WO2011158729A1
WO2011158729A1 PCT/JP2011/063253 JP2011063253W WO2011158729A1 WO 2011158729 A1 WO2011158729 A1 WO 2011158729A1 JP 2011063253 W JP2011063253 W JP 2011063253W WO 2011158729 A1 WO2011158729 A1 WO 2011158729A1
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WO
WIPO (PCT)
Prior art keywords
light source
led
support member
substrate
source module
Prior art date
Application number
PCT/JP2011/063253
Other languages
English (en)
Japanese (ja)
Inventor
昌寛 石田
広巳 村松
野口　卓志
Original Assignee
オスラム アクチエンゲゼルシャフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オスラム アクチエンゲゼルシャフト filed Critical オスラム アクチエンゲゼルシャフト
Publication of WO2011158729A1 publication Critical patent/WO2011158729A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module including an LED substrate, and more particularly to an LED line module including a line-shaped LED substrate including a plurality of LEDs.
  • the conventional technology is an LED line module that assumes an LED backlight. Since a plurality of LED chips are installed on a metal base to form a metal base substrate, there is a problem that a line-type LED substrate cannot be mounted.
  • the LED line module in which the heat sink and the reflective surface are configured as individual independent parts has a problem that the number of parts increases and costs increase.
  • the present invention has been made to solve the above-described problems, and provides an LED line module in which a reflective surface and a heat sink are integrally formed and an LED line substrate can be detachably attached. Objective.
  • the light source module is: In a light source module comprising a light source substrate support member that supports a light source substrate having a light source,
  • the light source substrate support member is A groove part having an opening on the irradiation direction side of the light source and having a pair of guide parts for storing side parts on both sides of the light source substrate;
  • a reflecting portion formed on the irradiation direction side from an edge of the opening of the groove; It is formed on the opposite side of the irradiation direction side, and includes a heat radiating part that radiates heat generated by the light source substrate.
  • the light source substrate support member is integrally formed.
  • the light source substrate support member has both end faces,
  • the pair of guide portions of the groove portion extends to the both end surfaces to form a pair of guide openings on the both end surfaces,
  • the side portions on both sides of the light source substrate are inserted into the guide opening portions formed on either one of the both end surfaces, and are accommodated in the pair of guide portions of the groove portion by sliding the guide portions. It is characterized by being.
  • the heat dissipating part includes a plurality of heat dissipating fins that extend to the opposite end surfaces of the heat dissipating fins and extend to the both end surfaces.
  • Each radiating fin of the plurality of radiating fins extends in a substantially radial direction from a substantially center line in the width direction of the bottom surface of the groove.
  • the light source module further includes a semi-cylindrical resin cover that covers the opening,
  • the light source substrate support member is A cover attachment guide portion for attaching the resin cover, the cover attachment guide portion for attaching the resin cover by sliding both side portions which are both sides of the resin cover.
  • the light source module has a substantially circular cross section perpendicular to the groove.
  • the light source substrate supporting member is a groove portion that is open on an irradiation direction side of the light source, and the light source A groove portion having a pair of guide portions for storing side portions on both sides of the substrate, a reflection portion formed on the irradiation direction side from an edge of the opening of the groove portion, and formed on the opposite side of the irradiation direction side, Since the heat radiation part for radiating the heat generated by the light source substrate is provided, the light source substrate can be detachably attached.
  • the light source substrate support member is integrally formed, the number of parts can be reduced and the cost can be reduced.
  • FIG. 1A is a plan view of the LED line module according to Embodiment 1 (a view seen from the irradiation direction side of the light source, as viewed from the arrow A), and FIG. FIG. 1B is a side view of the LED line module, and FIG. 1B-1 is an end view of the LED line module according to the first embodiment, and FIG. 1C is the first embodiment. It is a rear view (C arrow line view) of the LED line module which concerns on. It is a figure which shows the detail of the end elevation of the LED line module which concerns on Embodiment 1.
  • FIG. 3 is a plan view of an LED substrate support member provided in the LED line module according to Embodiment 1.
  • FIG. FIG. 3 is a plan view showing a state in which the LED substrate is mounted on the LED substrate support member according to Embodiment 1.
  • FIG. 3 is a diagram illustrating a dimensional relationship of each part of an end face of the LED line module according to the first embodiment.
  • FIG. 1A is a plan view of the LED line module 100 according to the present embodiment (a view seen from the irradiation direction side of the light source, a view from the arrow A), and FIG. FIG. 1B is a side view of the LED line module 100 (B arrow view), FIG. 1B-1 is an end view of the LED line module 100, and FIG. 1C is a rear view of the LED line module 100. (Arrow view).
  • FIG. 2 is a diagram showing details of an end view of the LED line module 100 according to the present embodiment.
  • FIG. 3 is a plan view of the LED substrate support member 110 included in the LED line module 100 according to the present embodiment.
  • FIG. 4 is a plan view showing a state in which the LED substrate 200 is mounted on the LED substrate support member 110 according to the present embodiment.
  • FIG. 5 is a diagram showing the relationship of dimensions of each part of the end face of the LED line module 100 according to the present embodiment.
  • the configuration of the LED line module 100 according to the present embodiment will be described with reference to FIGS.
  • the end view shown in FIG. 2 is substantially line symmetric with respect to the irradiation direction substantially center line 1138.
  • the cross section orthogonal to the longitudinal direction of the LED line module 100 which concerns on this Embodiment shall be substantially the same as the end elevation shown in FIG.
  • the LED line module 100 is an example of a light source module including an LED substrate support member 110 (an example of a light source substrate support member) that supports an LED substrate 200 (an example of a light source substrate) having LEDs 210 (an example of a light source).
  • a line-type LED substrate including a plurality of LEDs 210 is assumed as the LED substrate 200. Therefore, the LED line module 100 is an LED module on which a line-shaped LED substrate 200 can be mounted.
  • the LED line module 100 has a substantially cylindrical shape that is long in the longitudinal direction, as shown in FIGS. 1 (a) to 1 (c).
  • FIG. 2 is a diagram showing details of an end view of the LED line module 100 shown in (b-1) of FIG.
  • the LED line module 100 includes an LED board support member 110, an LED board 200 housed in the LED board support member 110, and an LED 210 installed (mounted) on the LED board 200. And a resin cover 120 attached to the substrate support member 110.
  • the LED substrate support member 110 is a substrate storage portion 113 (an example of a groove) that opens on the irradiation direction P side of the LED 210, and a pair of guide portions 1137 that store the substrate side portions 201 that are the side portions on both sides of the LED substrate 200.
  • the LED substrate support member 110 includes a reflecting portion 111 formed on the irradiation direction P side from an edge portion 1133 of an opening (hereinafter, opening portion 1131) of the substrate housing portion 113.
  • the LED board support member 110 is formed on the opposite side of the irradiation direction P side (the back side of the LED board 200, hereinafter referred to as the back side Q), and the metal heat sink 112 (dissipates heat generated by the LED board 200).
  • An example of a heat radiating part is provided.
  • the LED substrate support member 110 is integrally formed of a metal such as aluminum, for example.
  • the LED substrate support member 110 has a substantially semi-cylindrical shape (kamaboko shape) in a cross section perpendicular to the longitudinal direction (slide direction (see FIGS. 1 and 3)).
  • the LED substrate support member 110 has a semi-cylindrical arc-shaped portion on the back surface direction Q side, and heat radiation fins 1121 constituting the metal heat sink 112 are formed radially.
  • the metal heat sink 112 will be described later.
  • the LED substrate support member 110 is a planar portion (hereinafter also referred to as a planar portion) having a semi-cylindrical shape on the irradiation direction P side, and the light emitted from the substrate storage portion 113 (groove portion) for storing the LED substrate 200 and the LED 210 is used.
  • a reflecting portion 111 that reflects is formed.
  • FIG. 3 is a view of the LED substrate support member 110 viewed from the irradiation direction P. That is, FIG. 3 is a diagram showing a planar portion of the LED substrate support member 110.
  • the planar portion of the LED substrate support member 110 in FIG. 3 is a substantially rectangular shape that is long in the longitudinal direction and short in the lateral direction. A side portion along the longitudinal direction is referred to as a member side portion.
  • the resin cover 120 will be explained.
  • the material of the resin cover 120 is an acrylic resin or the like that is lighter than glass and is hard to break. As shown in FIG. 2, the resin cover 120 has a substantially semi-cylindrical shape that covers the planar portion of the LED substrate support member 110.
  • the resin cover 120 is attached to the LED board support member 110 such that the opening part of the resin cover 120 (opening part facing the arc-shaped part) is covered with the flat part of the LED board support member 110.
  • Cover protrusions 121 that engage with cover attachment portions 114 (an example of a cover attachment guide portion) formed on the LED substrate support member 110 are formed on the side edges 122 on both sides of the resin cover 120.
  • the cover protrusion 121 is a protrusion formed to bend the ends of the side edges 122 on both sides of the resin cover inward.
  • the resin cover 120 is attached to the LED substrate support member 110 by fitting the cover protrusion 121 to the cover attachment portion 114 which is a groove provided on the member side portion of the LED substrate support member 110.
  • the LED substrate support member 110 is a cover attachment portion 114 (cover attachment guide portion) to which the resin cover 120 is attached, and slides the cover protrusions 121 formed on both sides (side sides 122) of the resin cover 120.
  • the cover attaching part 114 to be attached is provided.
  • the cross section (end surface) orthogonal to the longitudinal direction is substantially circular as shown in FIG. 2, and the LED line module 100 is substantially cylindrical.
  • the cross section orthogonal to the substrate storage part 113 (groove part) is substantially circular, it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp.
  • the resin cover 120 has a substantially semicircular shape, and the side edges 122 on both sides are arranged on the plane portion of the LED substrate support member 110.
  • the shape of the resin cover 120 may be a shape in which the side edges 122 on both sides of the resin cover 122 are arranged closer to the back surface Q side than the surface of the planar portion of the LED substrate support member 110. That is, the side 122 on both sides of the resin cover 120 is shaped to reach the vicinity of the radiation fins 1121a and 1121e (see FIG. 5).
  • the semicircular shape has an arc shape with a central angle of about 180 °, but in this case, it has an arc shape of about 240 ° (or about 190 ° or more and about 250 ° or less).
  • the substrate storage portion 113 formed on the LED substrate support member 110 is a groove portion that opens on the irradiation direction P side, and has a pair of guide portions 1137 for storing the substrate side portions 201 that are the side portions on both sides of the LED substrate 200. It is a groove.
  • substrate storage part 113 is extended to the both end surfaces (end surface 115 of both sides) of the LED board support member 110.
  • FIG. In other words, the substrate storage portion 113 is a through-hole formed so as to penetrate to both end faces of the LED substrate support member 110, and is an opening portion 1131 that opens linearly along the longitudinal direction on the irradiation direction P side (FIG. 3). A through hole having a reference).
  • the substrate storage portion 113 includes a bottom surface 1134 of the groove portion, a pair of side walls 1135 that are side walls on both sides of the groove portion, and a pair of top surfaces formed on both sides of the opening 1131 with the upper surface portion 1136 facing the bottom surface 1134. Part 1136.
  • a portion surrounded by the bottom surface 1134, one side wall 1135, and one upper surface portion 1136 is a guide portion 1137.
  • the guide part 1137 exists on both sides of the opening 1131 and is an example of a pair of guide parts.
  • the side portions (substrate side portion 201) on both sides of the LED substrate 200 are slid on the guide portions 1137 of the substrate accommodating portion 113.
  • the LED substrate 200 is accommodated in the substrate accommodating portion 113.
  • the board storage portion 113 extends to the end faces 115 (both end faces) on both sides of the LED board support member 110, end face openings opened by the board storage section 113 on the both end faces 115 of the LED board support member 110.
  • a portion 1151 (an example of a guide opening) is formed (see FIG. 2). That is, the pair of guide portions 1137 of the substrate storage portion 113 extends to both end surfaces 115 to form a pair of end surface openings 1151 on the both end surfaces 115.
  • the board side parts 201 on both sides of the LED board 200 are inserted from the end face opening parts 1151 formed on either one of the end faces 115 of both sides, and slide on the guide part 1137, whereby the board side parts 201 of the board storage part 131 are inserted. It is stored in a pair of guide portions 1137.
  • the LED 210 attached to the LED substrate 200 is exposed from the opening portion 1131 to the irradiation direction P side. Is located.
  • a plurality of LEDs 210 are arranged in the opening portion 1131 in the longitudinal direction.
  • the LED 210 is located in the vicinity of a portion sandwiched between the edge portions 1133 on both sides of the opening portion 1131 of the substrate storage portion 113.
  • LED210 is located in the irradiation direction P side a little rather than the part pinched
  • the LED board support member 110 designs the board storage part 113 in consideration of the height of the LED board 200, the height of the LED 210 (LED chip), the width of the LED 210 (LED chip), and the like. It is preferable to determine the dimensions (width, height, thickness, length, etc.) of the bottom surface 1134, the side wall 1135, the top surface portion 1136, the opening portion 1131, the edge portion 1133, and the like.
  • the LED substrate 200 is configured such that the distance between the two LEDs 210 (distance connecting the approximate center of one LED 210 to the approximate center of the other LED 210) is 2L,
  • the distance from the end portion (end surface 115) of the substrate support member 110 is preferably L. This is because even when a plurality of LED line modules 100 are connected, the distance between the LEDs 210 is uniform.
  • the reflection portion 111 is a reflection surface formed on the irradiation direction P side from the edge portions 1133 on both sides of the opening portion 1131.
  • the surface of the reflecting portion 111 is inclined so as to gradually go in the irradiation direction P from the edge 1133 side (center side) toward the outside (resin cover 120 side). That is, the reflecting portion 111 has an inverted eight-shaped cross section.
  • the light emitted from the LED 210 is reflected by the reflecting portion 111 and irradiated in the irradiation direction P.
  • the reflection part 111 is integrally formed with the LED board support member 110, the light extraction efficiency can be improved with a small number of components.
  • the metal heat sink 112 (heat radiation part) includes a plurality of heat dissipating fins 1121 extending on the opposite side of the irradiation direction P side (back surface direction Q side).
  • the radiation fins 1121 are formed to extend to the end surfaces 115 on both sides of the LED substrate support member 110 (see FIGS. 1B and 1C).
  • Each radiation fin 1121 of the plurality of radiation fins extends in a substantially radial direction with a substantially center line 1132 (see FIGS. 2 and 3) in the width direction of the bottom surface 1134 of the substrate housing portion 113 as a central axis.
  • FIG. 5 is a diagram showing the dimensional relationship of each part of the end face of the LED line module 100 of the present embodiment.
  • five heat dissipating fins 1121a to 1121e are formed to extend radially about a substantially center line 1132 as a central axis. Further, the five heat radiation fins 1121a to 1121e have substantially the same length L5.
  • the angle between the plane portion of the LED substrate support member 110 and the radiation fin 1121a is ⁇ 1, the angle between the radiation fin 1121a and the radiation fin 1121b is ⁇ 2, the angle between the radiation fin 1121b and the radiation fin 1121c is ⁇ 3, and the radiation fin 1121c.
  • the angle between the heat dissipating fin 1121d is ⁇ 4, the angle between the heat dissipating fin 1121d and the heat dissipating fin 1121e is ⁇ 5, and the angle between the heat dissipating fin 1121e and the plane portion of the LED substrate support member 110 is ⁇ 6.
  • ⁇ 1 ( ⁇ 2 ⁇ 3 ⁇ 4 ⁇ 5 ⁇ 6) ⁇ 30 ° is preferable. This is because the heat dissipation efficiency of the metal heat sink 112 becomes uniform, leading to an improvement in the heat dissipation efficiency.
  • the heat radiation efficiency can be further improved by changing the angles of ⁇ 1 to ⁇ 6 depending on the flow of the air current in the vicinity of the metal heat sink 112 due to the installation location of the LED line module 100 or the like.
  • ⁇ 1 ⁇ 6 ⁇ 50 ° may be set, and ⁇ 2 ⁇ 3 ⁇ 4 ⁇ 5 ⁇ 20 ° may be set.
  • ⁇ 1 ⁇ 50 ° and ⁇ 2 ⁇ 3 ⁇ 4 ⁇ 5 ⁇ 6 ⁇ 26 ° may be set.
  • the number of the radiation fins 1121 may not be five.
  • the number of radiating fins 1121 may be three, seven, or other number.
  • the cross section of the LED line module 100 is the same as the end view shown in FIG.
  • the radius L1 of the semi-cylindrical resin cover 120 and 1/2 of the width of the LED substrate support member 110 that is, the distance (shortest distance) from the substantially center line to the side of the member.
  • L2 and the distance (shortest distance) L3 from the substantially center line 1132 to the tip of the radiation fin 1121 are substantially equal.
  • the cross section of the LED line module 100 has a substantially circular shape with a radius L1 ( ⁇ L2 ⁇ L3).
  • the ratio of L1: L2: L3 is about 1: 1: 1.
  • the LED line module 100 having a substantially elliptical cross section can be obtained.
  • the metal heat sink 112 is provided with a thick part 1122 having a substantially semicircular inverted kamaboko shape with a radius L4 in cross section.
  • the metal heat sink 112 has a structure that is not easily deformed, and the heat dissipation efficiency can be improved.
  • the ratio of the radius L4 of the thick portion 1122 to the length L5 of the radiating fin 1121 is about 5: 6 for L4: L5.
  • L4: L5 may be changed in consideration of heat dissipation efficiency, the installation location of the LED line module 100, and the like.
  • L4: L5 may be about 1: 1, alternatively about 1: 2, alternatively about 2: 3, or other ratios.
  • the heat radiating fins 1121 have been described as extending to the end surfaces 115 on both sides of the LED substrate support member 110.
  • a notch 1123 may be formed by notching the radiating fin 1121 at a predetermined position in the longitudinal direction.
  • a notch 1123 shown in FIG. 1C indicates that a portion of the heat radiation fin 1121 existing between the dotted lines is cut (notched).
  • the notch 1123 may be formed substantially orthogonal to the longitudinal direction, or may be formed inclined with respect to the longitudinal direction.
  • the plurality of cutout portions 1123 are formed so as to be evenly arranged in the longitudinal direction. For example, five notch portions 1123, 10 notch portions, 20 notch portions, or other number of notch portions 1123 may be formed. Further, the notch 1123 may not be formed.
  • the LED substrate support member 110 is arranged on the irradiation direction P side.
  • a substrate housing portion 113 groove portion having an opening 1131 and a pair of guide portions 1137 for housing the substrate side portions 201 on both sides of the LED substrate 200, and gradually from the edge 1133 of the opening 1131 to the irradiation direction P side.
  • a metal heat sink 112 heat dissipating part that dissipates heat generated by the LED substrate 200 and is formed on the substrate back direction Q side. Even the line-shaped LED substrate 200 can be accommodated.
  • the LED substrate support member 110 is integrally formed, so that the LED line module 100 with high LED light extraction efficiency can be provided without increasing the number of components. The cost can be reduced.
  • a pair of end surface openings 1151 are formed on both end surfaces 115 of the LED substrate support member 110, and the substrate side portion 201 of the LED substrate 200 is
  • the LED board is housed in the pair of guide parts 1137 of the board housing part 113 by sliding through the guide part 1137 inserted from the end face opening 1151 formed on one of the end faces 115 of the both end faces 115. Can be stored detachably.
  • the metal heat sink 112 includes the heat dissipating fins 1121 extending to the substrate back surface direction Q side and extending to the end surfaces 115 on both sides. Since each of the plurality of heat radiation fins 1121a to 1121e extends in a substantially radial direction from the substantially center line 1132 in the width direction of the bottom surface 1134, the heat radiation efficiency can be improved.
  • the semi-cylindrical resin cover 120 that covers the opening 1131 is provided, and the LED substrate support member 110 has a cover mounting portion 114 (cover mounting guide) for mounting the resin cover 120.
  • Cover cover portion 114 (cover mounting guide portion) that is mounted by sliding cover protrusions 121 (side portions) formed on both sides 122 of resin cover 120 without increasing the number of parts.
  • a resin cover 120 can be attached.
  • the cross section orthogonal to the substrate housing portion 113 is substantially circular, so that it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp. Can do.
  • LED line module 110 LED substrate support member, 111 reflection portion, 112 metal heat sink, 113 substrate storage portion, 114 cover mounting portion, 115 end face, 120 resin cover, 121 cover protrusion, 122 side, 200 LED substrate, 201 Substrate side, 210 LED, 210h end LED, 1121, 1121a, 1121b, 1121c, 1121d, 1121e radiating fin, 1122 thick part, 1123 notch part, 1131 opening part, 1132 substantially center line, 1133 edge part, 1134 Bottom surface, 1135 side wall, 1136 upper surface portion, 1137 guide portion, 1138 substantially central line in irradiation direction, 1151 end surface opening.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne un module linéaire à LED qui peut contenir un substrat à LED linéaire et qui peut améliorer l'efficacité d'extraction de lumière sans augmenter le nombre de composants. Un module linéaire à LED (100) est pourvu d'un élément de support de substrat à LED (110) destiné à supporter un substrat à LED (200) comportant une LED (210). L'élément de support de substrat à LED (110) est pourvu et fait partie d'une partie stockage de substrat (113) possédant une ouverture (1131) sur le côté direction de rayonnement de lumière (P), et une paire de parties de guidage (1137) pour stocker des parties latérales de substrat (201) des deux côtés du substrat à LED (200) ; d'une partie réfléchissante (111) s'étendant depuis une partie bord (1132) de l'ouverture (1131) sur le côté direction de rayonnement (P) ; et d'un puits thermique métallique (112) qui libère la chaleur produite depuis le substrat à LED (200) formé sur le côté direction de surface arrière de substrat (Q).
PCT/JP2011/063253 2010-06-14 2011-06-09 Module de source de lumière WO2011158729A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010134643A JP5634757B2 (ja) 2010-06-14 2010-06-14 光源モジュール
JP2010-134643 2010-06-14

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WO2011158729A1 true WO2011158729A1 (fr) 2011-12-22

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WO2013160834A3 (fr) * 2012-04-23 2014-01-09 Jevgeni Sevtsenko Profilé métallique pour source de lumière à del
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JP6198122B2 (ja) * 2013-07-19 2017-09-20 パナソニックＩｐマネジメント株式会社 発光ユニットおよび照明器具
JP5717114B1 (ja) * 2014-10-17 2015-05-13 株式会社アブラム 直管形発光ダイオード式照明灯
CN107208851B (zh) * 2015-02-23 2020-07-24 三菱电机株式会社 照明灯、照明灯用罩及照明装置
CN109323151A (zh) * 2018-09-03 2019-02-12 厦门普为光电科技有限公司 均匀发光的灯具
JP7037771B2 (ja) * 2020-03-16 2022-03-17 ウシオ電機株式会社 光照射ユニット及び光照射装置

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