WO2011154993A1 - 絶縁トランスおよび電源装置 - Google Patents

絶縁トランスおよび電源装置 Download PDF

Info

Publication number
WO2011154993A1
WO2011154993A1 PCT/JP2010/003811 JP2010003811W WO2011154993A1 WO 2011154993 A1 WO2011154993 A1 WO 2011154993A1 JP 2010003811 W JP2010003811 W JP 2010003811W WO 2011154993 A1 WO2011154993 A1 WO 2011154993A1
Authority
WO
WIPO (PCT)
Prior art keywords
iron core
primary
transformer
insulator
winding
Prior art date
Application number
PCT/JP2010/003811
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
叶田玲彦
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP2012519135A priority Critical patent/JPWO2011154993A1/ja
Priority to PCT/JP2010/003811 priority patent/WO2011154993A1/ja
Priority to DE112010005649T priority patent/DE112010005649T5/de
Publication of WO2011154993A1 publication Critical patent/WO2011154993A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/04—Fixed transformers not covered by group H01F19/00 having two or more secondary windings, each supplying a separate load, e.g. for radio set power supplies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards

Definitions

  • the present invention relates to an insulating transformer that obtains insulated power and a power supply device configured using the insulating transformer.
  • a relatively high voltage of 6 to 25 kV is required as an insulation withstand voltage between the primary and secondary in the power source for the gate drive of the inverter for railway vehicles and the power source for large industrial equipment.
  • it is required to make the parasitic capacitance between the primary and secondary as small as possible from the viewpoint of preventing malfunction of the device due to noise current.
  • an insulating transformer having a high withstand voltage and a low parasitic capacitance is used to realize the insulating function.
  • the insulation transformer needs to increase the distance between the primary winding and the secondary winding, and there is a problem that the volume of the insulation transformer increases.
  • Patent Document 1 a low parasitic capacitance transformer as shown in Patent Document 1 has been proposed for reducing parasitic capacitance.
  • This transformer is a multi-layered transformer, and the insulation between the fourth coil layer of the primary coil and the third coil layer of the secondary coil is made thicker than the thickness of the insulation between the other coil layers. The space between the third and fourth coil layers is widened, and the parasitic capacitance between the primary coil and the secondary coil is reduced.
  • Patent Document 1 a method of increasing the thickness of an insulator to ensure a withstand voltage and reducing parasitic capacitance is used. Multiple insulators are required, and it is difficult to reduce the transformer volume.
  • the problem to be solved by the present invention is to reduce the primary-secondary parasitic capacitance and the volume of the insulation transformer in a high voltage insulation transformer.
  • the insulation transformer of the present invention has a primary side iron core around which a primary winding is wound, a secondary side iron core around which a secondary winding is wound, and an insulator. And the secondary iron core are fixed and arranged on the insulator so as to face each other with the insulator interposed therebetween.
  • the primary side iron core and the secondary side iron core are pot-type ferrite cores, and the primary winding and the secondary winding are respectively disposed in the openings of the core so that the openings are opposed to each other. It is preferable to face each other with an insulator interposed therebetween.
  • the primary side iron core and the secondary side iron core are E-type ferrite cores, and they are preferably opposed to each other with an insulator interposed therebetween so that the leg portions of the cores face each other.
  • the insulator is composed of two insulators having a gap in the middle.
  • the primary iron core on one insulator side and the secondary iron core on the other insulator side face each other across the insulator. It is good to be arranged.
  • the insulator is preferably a printed circuit board on which electronic components are mounted.
  • the insulating transformer of the present invention has a primary side iron core around which a primary winding is wound and a secondary side iron core around which a secondary winding is wound, arranged via a gap, and is insulated at least in the gap.
  • the primary side iron core and the secondary side iron core winding are disposed so as to face each other.
  • An insulating transformer includes a primary iron core around which a primary winding is wound and a secondary iron core around which a secondary winding is wound, arranged via an insulator, at least of the iron core.
  • the periphery is covered with an insulating resin, and the winding surfaces of the primary side iron core and the secondary side iron core winding are arranged to face each other.
  • the power supply device of the present invention has a primary side iron core around which a primary winding is wound, a secondary side iron core around which a secondary winding is wound, and an insulator. And a secondary side iron core is provided with an insulating transformer fixed and arranged on the insulator so as to face each other across the insulator, and the circuit method for exciting the insulating transformer is a series resonance method using the leakage inductance of the insulating transformer. Is done.
  • the power supply device of the present invention has a primary side iron core around which a primary winding is wound, a secondary side iron core around which a secondary winding is wound, and an insulator.
  • An insulation transformer fixed and arranged on the insulator so that the secondary iron core is opposed to the insulator, a primary circuit connected to the primary winding of the insulation transformer, and a secondary winding of the insulation transformer
  • an isolation transformer is mounted on a printed circuit board together with circuit components constituting the primary side circuit and the secondary side circuit.
  • the insulator of the insulating transformer is the printed board, and the primary side iron core and the secondary side iron core are preferably arranged on each surface of the printed board.
  • the insulator of the insulation transformer is arranged such that the insulator is fixed vertically on the printed circuit board, the primary iron core is adjacent to the primary circuit, and the secondary iron core is 2 It is good to arrange
  • circuit components that make up the secondary circuit are preferably surface-mounted on the printed circuit board.
  • the power supply apparatus of the present invention incorporating at least one power switching device and its drive circuit incorporates an insulation transformer for supplying power to the drive circuit, and the insulation transformer is a primary side around which a primary winding is wound. It has an iron core and a secondary iron core around which a secondary winding is wound, and the primary iron core and the secondary iron core face each other with a filler filled on the drive circuit board interposed therebetween. And at least the primary iron core is fixed by a filler.
  • the number of mounted isolation transformers should be the same as the number of power switching elements.
  • an isolation transformer that can reduce the primary-secondary parasitic capacitance and can suppress the generation of noise current when a lightning surge occurs.
  • FIG. 1 is an exploded configuration diagram of an insulating transformer 19 according to the present invention.
  • the transformer primary part 11 is arranged on one side of the insulating plate 3 and the transformer secondary part 12 is arranged on the other side.
  • the transformer primary part 11 and the transformer secondary part 12 house the primary and secondary windings 2 and 4 in the pot type ferrite core 1.
  • the insulating plate 3 is not provided with a hole or the like, and is disposed so that the transformer primary portion 11 and the transformer secondary portion 12 face each other through the insulating plate.
  • cores 1a and 1b are circular so-called pot-type ferrite cores, which have cylindrical legs (1a1 and 1b1) at the center of the circle, and also at the periphery. It has a cylindrical leg (1a2 and 1b2), and has a shape having a space (1a3 and 1b3) recessed in a donut shape when viewed from the opening.
  • the primary winding 2 is spirally wound around a hollow portion 1a3 centering on the center leg of the core 1a to form a transformer primary portion 11.
  • the secondary windings 4a and 4b are also spirally wound around the hollow portion 1b3 of the core 1b to form the transformer secondary portion 12.
  • An enameled wire is used for the primary winding 2 and the secondary windings 4a and 4b, but a litz wire may be used.
  • the insulating plate 3 is made of an insulating material having a relatively low dielectric constant.
  • the dielectric constant of the insulator is: paper: 2.0 to 2.5, polyethylene: 2.3 to 2.4, polyester: 2.8 to 8.1, phenol resin: 3.0 to 12.0, porcelain: 4.0 to 7.0, glass / epoxy substrate: 4.5 to 5.2, polyurethane: 5.0 to 5.3, mica: 5.7 to 7.0, etc.
  • the parasitic capacitance can be reduced by particularly selecting a material having a low rate characteristic.
  • the insulating plate 3 is the same as or larger than the size of the bottom surface of the pot type ferrite cores 1a and 1b. In the case of widening, it is possible to ensure a longer edge distance between the primary and secondary sides.
  • the thickness of the insulating plate 3 is approximately 0.3 mm to 5.0 mm. The thicker the thickness, the higher the withstand voltage, and the parasitic capacitance can be reduced. On the other hand, the coupling between the primary and secondary is reduced, leading to a reduction in power supply efficiency. However, in the present invention, priority is given to improving reliability and reducing costs by reducing the withstand voltage and parasitic capacitance over the coupling between the primary and secondary.
  • the transformer primary part 11 and the transformer secondary part 12 described above are such that the core recesses (1a3 and 1b3) wound with the windings face the insulating plate 3 so that the front side and the back side of the insulating plate 3 are facing each other. It fixes to the insulating board 3 so that it may oppose. At this time, lead wires connected to the respective windings are drawn from between the transformer primary part 11, the transformer secondary part 12 and the insulating plate 3.
  • FIG. 2 is an exploded configuration diagram showing a second embodiment of an insulating transformer 19 according to the present invention.
  • the basic principle is the same as in FIG. 1, but in the case of FIG. 1, there is an advantage that the magnetic flux is difficult to leak, but a pot type ferrite core that is relatively difficult to manufacture is used. However, since it is unavoidable to be expensive, an existing core that is generally used and easy to manufacture is used.
  • each of the cores 1a and 1b is an E-shaped ferrite core, and has a total of three legs, the center leg is thick, and the two legs at both ends are thin.
  • the primary winding 2 is wound around the center leg of the core 1 a to form a transformer primary portion 11.
  • secondary windings 4a and 4b are wound around the center leg of the core 1b to form a transformer secondary portion.
  • a bobbin may be used when the primary winding and the secondary winding are wound and fixed to the core.
  • An enameled wire is used for the primary winding 2 and the secondary windings 4a and 4b, but a litz wire may be used.
  • the insulating plate 3 is made of an insulating material having a relatively low dielectric constant.
  • the parasitic capacitance can be reduced by selecting a material having a low dielectric constant value.
  • the thickness of the insulating plate 3 is approximately 0.3 mm to 5.0 mm. The thicker the thickness, the higher the withstand voltage, and the parasitic capacitance can be reduced. On the other hand, the coupling between the primary and secondary is reduced, leading to a reduction in power supply efficiency. However, in the present invention, priority is given to improving the reliability and reducing the cost by reducing the withstand voltage and parasitic capacitance over the coupling between the primary and secondary.
  • the transformer primary portion 11 and the transformer secondary portion 12 are opposed to the front side and the back side of the insulating plate 3 so that the tip ends of the core legs wound with the windings face the insulating plate 3. And fix to the insulating plate 3.
  • the core has several shapes. In short, it is important to arrange the winding surfaces of the primary and secondary windings to face each other.
  • FIG. 3 is a circuit configuration of a power supply device that rectifies the output of the isolation transformer 19 and supplies power to the load
  • FIG. 4 is a circuit configuration of a power supply device that rectifies the output of the isolation transformer 19 and supplies power to a plurality of loads. is there.
  • the primary side circuit 8 and the secondary side circuit 9 can be arbitrarily set. Is shown.
  • FIG. 3 is a circuit configuration diagram of a power supply device using the insulating transformer 19 of FIG. 1 or FIG.
  • the portion comprising the central insulating plate 3, the transformer primary portion 11, and the transformer secondary portion 12 is the insulating transformer of FIG. 1 or FIG.
  • the transformer primary part 11 side is connected to the DC power source 7 via the primary side circuit 8, and the transformer secondary part 12 side is connected to the load 10 a via the secondary side circuit 9.
  • the DC power source 7 is connected to the primary circuit 8.
  • the primary side circuit 8 includes a smoothing capacitor 20a, power MOSFETs 21a and 21b connected in series, a drive circuit 22, a resonance capacitor 23, a lossless snubber capacitor 24, an insulation signal receiving unit 25, and a control circuit 29, and the power MOSFETs 21a and 21b.
  • a resonance capacitor 23 is connected to the midpoint of the series body.
  • the source electrodes of the resonant capacitor 23 and the power MOSFET 21b are connected to the transformer primary unit 11 outside the primary side circuit 8.
  • the transformer primary part 11 is magnetically coupled to the transformer secondary part 12 via the insulating plate 3.
  • the transformer secondary unit 12 has a center tap configuration and is connected to rectifier diodes 26 a and 26 b in the secondary side circuit 9.
  • the secondary side circuit 9 there are a smoothing capacitor 20 b connected to the rectifier diodes 26 a and 26 b, an output voltage error amplifier circuit 27, and an insulation signal transmission unit 28, and the primary side circuit 8 is connected via the optical cable 18.
  • a signal is transmitted to the control circuit 29 from the insulated signal receiving unit 25.
  • the control circuit 29 generates a pulse signal in accordance with the signal input from the insulation signal receiving unit 25 and outputs it to the drive circuit 22.
  • the drive circuit 22 sends a gate signal to the power MOSFETs 21a and 21b to switch the power MOSFETs 21a and 21b.
  • the output control is frequency control, and the ON / OFF time ratio of the power MOSFETs 21a and 21b is constant without changing according to the output, and the drive frequency changes instead.
  • the transformer primary part 11 and the transformer secondary part 12 are magnetically coupled via the insulating plate 3, but since the ferrite iron core is separated by the insulating plate 3, the leakage inductance is higher than that of the conventional insulating transformer. Relatively large. Therefore, in this embodiment, this leakage inductance is used effectively. That is, by driving the power MOSFETs 21a and 21b at a frequency higher than the resonance frequency of this circuit, a resonance current flows in the series resonance circuit formed by the leakage inductance and the resonance capacitor 24, and the transformer secondary section 12 is powered. Communicated.
  • the secondary side circuit 9 rectifies the high-frequency alternating current transmitted to the transformer secondary part in the rectifier diodes 26a and 26b and accumulates it in the smoothing capacitor 20b.
  • the load 10a obtains a stable output by the smoothing capacitor 20b.
  • the voltage of the smoothing capacitor 20b is amplified from the output voltage command value by the output voltage error amplification circuit 27, and a signal is transmitted to the control circuit 29 via the insulation signal transmission unit 28, the optical cable 18, and the insulation signal reception unit 25.
  • the frequency for driving the power MOSFETs 21a and 21b changes to control the output voltage to be constant.
  • the insulation signal transmission unit 28, the optical cable 18, and the insulation signal reception unit 25 may use an optical fiber transmission link such as an opto wire or an isolator such as an EAIJ optical fiber connector called a tos link. Further, a shunt regulator may be used for the output voltage error amplifier circuit 27.
  • FIG. 4 is a circuit configuration diagram according to another embodiment of the power supply device using the insulating transformer 19 of FIG. 1 or FIG.
  • devices having the same functions as those in FIG. In particular, since the primary side overlaps with the circuit configuration of FIG. 3, its description is omitted.
  • the transformer secondary section 12 has a center tap configuration and is connected to the rectifier diodes 26a and 26b in the secondary side circuit 9. 4 differs from FIG. 3 in that the secondary side circuit 9 is provided with a smoothing capacitor 20c in addition to the smoothing capacitor 20b.
  • the configuration of the rectifier diode is also different from that shown in FIG. 3, and the smoothing capacitor 20c forms a negative potential power supply having the ground potential of the smoothing capacitor 20b as a positive electrode, and supplies power to the second load 10b.
  • the secondary side circuit 9 includes an output voltage error amplification circuit 27 and an insulation signal transmission unit 28, and the control circuit 29 via the optical cable 18 and the insulation signal reception unit 25 of the primary side circuit 8. A signal is transmitted to.
  • the control circuit 29 generates a pulse signal in accordance with the signal input from the insulation signal receiving unit 25 and outputs it to the drive circuit 22.
  • the drive circuit 22 sends a gate signal to the power MOSFETs 21a and 21b to switch the power MOSFETs 21a and 21b.
  • the output control is frequency control, and the ON / OFF time ratio of the power MOSFETs 21a and 21b is constant without changing according to the output, and the drive frequency changes instead.
  • the transformer primary part 11 and the transformer secondary part 12 are magnetically coupled via the insulating plate 3, but since the ferrite iron core is separated by the insulating plate 3, the leakage inductance is compared with the conventional insulating transformer. Big. Therefore, in the present invention, this leakage inductance is effectively used. That is, by driving the power MOSFETs 21a and 21b at a frequency higher than the resonance frequency of this circuit, a resonance current flows in the series resonance circuit formed by the leakage inductance and the resonance capacitor 24, and the transformer secondary section 12 is powered. Communicated.
  • the rectifier diodes 26a and 26b rectify the high-frequency alternating current transmitted to the transformer secondary part and store it in the smoothing capacitors 20b and 20c.
  • the loads 10a and 10b obtain stable voltages by the smoothing capacitors 20b and 20c, respectively.
  • the voltage of the smoothing capacitor 20b is amplified from the output voltage command value by the output voltage error amplification circuit 27, and a signal is transmitted to the control circuit 29 via the insulation signal transmission unit 28, the optical cable 18, and the insulation signal reception unit 25.
  • the frequency for driving the power MOSFETs 21a and 21b changes to control the output voltage to be constant.
  • the insulation signal transmission unit 28, the optical cable 18, and the insulation signal reception unit 25 may use an optical fiber transmission link such as an opto wire or an isolator such as an EAIJ optical fiber connector called a tos link. Further, a shunt regulator may be used for the output voltage error amplifier circuit 27.
  • a technique for mounting circuit components constituting the power supply device of FIG. 3 or FIG. 4 on a printed board will be described with reference to FIG. 5, FIG. 6, and FIG.
  • a primary circuit 8 and a secondary circuit 9 are also mounted on the printed board 6 in addition to the insulating transformer.
  • FIG. 5 is a cross-sectional view of a substrate on which circuit components constituting the power supply device of FIG. 3 or FIG. 4 are mounted as seen from the lateral direction.
  • a primary side circuit 8 and a secondary side circuit 9 are mounted on the printed board 6 shown in FIG. 1 to form a power supply device as a unit.
  • the primary circuit 8 is mounted on the left side of the printed circuit board 6 in FIG.
  • the insulating transformer 19 shown in FIG. 1 or FIG. 2 is mounted and arranged at the center.
  • the insulating transformer 19 is centered on the insulating plate 3 provided upright on the printed circuit board 6, and the left side where the primary side circuit 8 is mounted is the right side where the transformer primary part 11 and the secondary side circuit 9 are mounted. It is mounted so as to be the transformer secondary unit 12.
  • the mounting components for the primary side circuit 8 include a smoothing capacitor 20a, a power MOSFET 21a, a resonance capacitor 23, and an insulation signal receiving unit 25.
  • the mounting components for the secondary side circuit 9 include a rectifier diode 26a and a smoothing capacitor. 20b etc. are mounted.
  • the printed circuit board 6 uses an insertion board, but the primary circuit 8 is composed of lead type components (smoothing capacitor 20a, power MOSFET 21a, resonance capacitor 23) and surface mount components (insulated signal receiving unit 25). However, only the surface mount components (rectifier diode 26a, smoothing capacitor 20b) are used as the components of the secondary circuit 9. Thus, with respect to the secondary side circuit 9, there is no wiring pattern on the back side of the printed board, and insulation failure does not occur on the back side of the printed board.
  • FIG. 6 is also a cross-sectional view of the substrate viewed from the lateral direction.
  • the printed circuit board 6 is disposed on one surface of the insulating plate 3, and the components of the primary circuit 8 are mounted on the surface of the printed circuit board 6, and the transformer primary section 11 is mounted and fixed. Is done. Note that the printed circuit board 6 is installed on the insulating plate 3 at an appropriate interval h by the attachment component 100.
  • the surface mounting substrate 30 is directly disposed on the other surface of the insulating plate 3.
  • the components of the secondary circuit 9 are surface-mounted on the surface of the surface mounting substrate 30 and the transformer secondary portion 12 is also mounted.
  • the transformer primary part 11 and the transformer secondary part 12 are arranged and fixed so as to face each other with the gap between the insulating plate 3 and the interval h.
  • the insulating plate 3 is the same as or larger than the size of the bottom surface of the printed circuit board 6 and the surface mounting substrate 30. In the case of widening, it is possible to ensure a longer edge distance between the primary and secondary sides.
  • the thickness of the insulating plate 3 is approximately 0.3 mm to 5.0 mm. The thicker the thickness, the higher the withstand voltage, and the parasitic capacitance can be reduced. On the other hand, the coupling between the primary and secondary is reduced, leading to a reduction in power supply efficiency. However, in the present invention, priority is given to improving the reliability and reducing the cost by reducing the withstand voltage and parasitic capacitance over the coupling between the primary and secondary.
  • this printed circuit board 6 uses an insertion board, and the primary circuit 8 is composed of lead type components and surface mount components. As the components of the secondary circuit 9, only surface mount components are used. Note that the printed circuit board 6 may also be configured using a surface mounting board.
  • FIG. 7 is also a cross-sectional view of the substrate on which the circuit component of FIG. 3 or FIG.
  • the primary circuit 8 is mounted on the left side of the printed circuit board 6.
  • the transformer primary portion 11 is mounted and fixed on the back surface B side of the central portion of the printed circuit board 6.
  • the transformer secondary part 12 is mounted and fixed at a position corresponding to the surface A side of the printed circuit board 6 with respect to the position where the transformer primary part 11 is mounted.
  • a secondary circuit 9 is mounted on the right side from the position where the transformer secondary part 12 on the surface A side of the printed circuit board 6 is mounted.
  • the printed circuit board 6 uses an insertion board, but the constituent parts of the primary circuit 8 are composed of lead type parts and surface mounting parts, and the constituent parts of the secondary circuit 9 are only surface mounting parts. Use. Thereby, there is no wiring pattern on the back surface B of the printed circuit board with respect to the secondary circuit 9, and it is possible to prevent the occurrence of insulation failure on the back surface B side of the printed circuit board.
  • the thickness of the printed circuit board 6 is approximately 0.3 mm to 2.4 mm. The thicker the plate, the higher the withstand voltage, and the parasitic capacitance can be reduced.
  • the insulating transformer 19 reliably cuts off not only the primary winding and the secondary winding but also the primary side iron core and the secondary side iron core by the printed circuit board 6. Therefore, the primary winding and the secondary winding are reliably separated.
  • the parasitic capacitance between the primary and secondary can be reduced by using an insulating material having a low dielectric constant as the material of the printed circuit board.
  • the breakdown voltage of the transformer can be improved by increasing the thickness of the printed circuit board 6, and at the same time, the parasitic capacitance between the primary and secondary can be reduced.
  • an insulating transformer having a high withstand voltage can be obtained with a simple structure using a printed circuit board, so that the cost can be reduced.
  • FIG. 8 is a cross-sectional view of the insulating transformer 19.
  • the cores 1a and 1b are so-called pot-type ferrite cores having a circular shape, and have a cylindrical leg at the center of the circle and a cylindrical leg at the periphery, When viewed from the side, the inside has a shape that is recessed into a donut shape.
  • the cores 1a and 1b are E-type ferrite cores and have legs at the center and the peripheral part, so that the legs are recessed. Therefore, since the cross-sectional shape is the same in both FIG. 1 and FIG. 2, in the following description, the case where the insulating transformer of FIG. 1 is used (the cores 1a and 1b are circular so-called pot type ferrite cores) will be described. .
  • the core 1a and the core 1b containing the windings are opposed to each other while maintaining a predetermined distance H so that the coil surfaces face each other.
  • the portion 30 sandwiched between the cores 1a and 1b and the peripheral portion 40 of the cores 1a and 1b are filled with the insulating material 5 and hardened to form the insulating transformer 19.
  • a mold for the placement, fixation, or resin filling of the core in a predetermined position is appropriately prepared.
  • the insulating material 5 is an insulator, and a material such as a resin or ceramic having a relatively low dielectric constant, which can be freely deformed in the manufacturing process and has a characteristic of solidifying later.
  • the parasitic capacitance can be reduced by selecting a material having a low dielectric constant value.
  • the withstand voltage and the parasitic capacitance can be adjusted by the distance H between the cores 1a and 1b and the material of the insulating material.
  • the primary iron core and secondary iron core are separated so that the transformer structure can be simplified and the cost can be reduced. I can plan.
  • the insulating plate 3 is a disk-shaped insulating material having substantially the same diameter as the cores 1a and 1b, and is arranged so that the cores 1a and 1b face each other with their coil surfaces facing each other and the insulating plate 3 is sandwiched therebetween. Then, as shown in the figure, the peripheral portions 40 of the cores 1a and 1b are hardened with the insulating material 5 to form the insulating transformer 19.
  • FIG. 10 is a block diagram of a power module using the insulating transformer 19 of this embodiment.
  • the power module 13 includes two sets of power supply units 50 a and 50 b including an insulating transformer and its secondary circuit 9, and a gate circuit 60.
  • the primary side circuit 8 in FIG. 3 is not included in the modularization range here, so an appropriate primary side circuit can be applied. Since the gate circuit 60 is incorporated, control signal lines 61 and 62, a gate output terminal, and the like are installed.
  • transformer primary parts 11a and 11b there are transformer primary parts 11a and 11b, transformer secondary parts 12a and 12b, secondary side circuits 9a and 9b, drive circuits 16a and 16b, power devices 14a and 14b, and transformer primary parts 11a and 11b.
  • the transformer secondary section 12a is connected to the secondary circuit 9a
  • the secondary circuit 9a is connected to the drive circuit 16a
  • the drive circuit 16a is connected between the gate and emitter of the power device 14a.
  • FIG. 12 is a circuit diagram of a power module for a power module using the insulating transformer of this embodiment.
  • the DC power source 7 is connected to the primary circuit 8.
  • the primary circuit 8 includes a smoothing capacitor 20a, power MOSFETs 21a and 21b connected in series, a drive circuit 22, a resonance capacitor 23, and a lossless snubber capacitor 24.
  • a resonance capacitor is provided at the midpoint of the series of power MOSFETs 21a and 21b. 23 is connected.
  • the source electrodes of the resonant capacitor 23 and the power MOSFET 21b are connected in series with the transformer primary parts 11a and 11b outside the primary circuit.
  • the transformer primary parts 11a and 11b are magnetically coupled to the transformer secondary parts 12a and 12b inside the power module via the filler 17, as shown in FIG.
  • the transformer secondary parts 12a and 12b each have a center tap configuration, and the transformer secondary part 12a is connected to rectifier diodes 26a and 26b in the secondary side circuit 9a.
  • the transformer secondary unit 12b is connected to rectifier diodes 26c and 26d in the secondary side circuit 9b.
  • the rectifier diodes 26a and 26b are connected to the smoothing capacitor 20b.
  • the rectifier diodes 26c and 26d are connected to the smoothing capacitor 20c.
  • the circuit of FIG. 12 does not have a feedback circuit unlike FIGS. Instead, constant voltage circuits 31a and 31b are provided.
  • the drive circuit 22 generates a pulse having a constant frequency and a fixed pulse width, and sends a gate signal according to this pulse to the power MOSFETs 21a and 21b to switch the power MOSFETs 21a and 21b.
  • the high-frequency alternating current transmitted to the transformer secondary part is rectified by the rectifier diodes 26a and 26b and accumulated in the smoothing capacitor 20b.
  • the high-frequency alternating current transmitted to the transformer secondary part is rectified by the rectifier diodes 26c and 26d and accumulated in the smoothing capacitor 20c.
  • the constant voltage circuits 31a and 31b since there is no feedback circuit, output voltage fluctuations due to load fluctuations, temperature changes, and the like are stabilized by the constant voltage circuits 31a and 31b.
  • the drive circuits 16a and 16b obtain stable voltages by the constant voltage circuits 31a and 31b.
  • drive power of the power devices 14a and 14b is supplied from the secondary side circuits 9a and 9b to the drive circuits 16a and 16b.
  • drive signals for the power devices 14 a and 14 b are input from the outside of the power module 13.
  • the power devices 14a and 14b are illustrated as examples of IGBTs and anti-parallel diodes, but may be power MOSFETs or SiC switching devices.
  • the method of insulating between the primary and secondary of the insulating transformer for the power device driving power source by the filler in the power module is shown. This simplifies the structure of the isolation transformer of the power device drive power supply, enabling downsizing and cost reduction.
  • the same number of insulated transformers (two sets) as the number of IGBTs (two) as power switching devices are mounted on the power module.
  • the primary side circuit necessary for exciting these insulating transformers may be one circuit as shown in FIG.
  • the present invention described above it is possible to reduce the size and increase the reliability of the power supply device using the insulation transformer by suppressing the generation of the noise current when the lightning surge occurs.
  • the cost of the insulation transformer and the power supply device using the insulation transformer can be reduced.
  • it has the effect of reducing the size and increasing the reliability of a power supply device using an insulating transformer.
  • the primary iron core and secondary iron core are separated from each other, so the transformer structure can be simplified and the cost can be reduced. You can plan.
  • the present invention can be applied to a gate drive power supply device used in a railway vehicle inverter, an industrial power supply device, or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2010/003811 2010-06-08 2010-06-08 絶縁トランスおよび電源装置 WO2011154993A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012519135A JPWO2011154993A1 (ja) 2010-06-08 2010-06-08 絶縁トランスおよび電源装置
PCT/JP2010/003811 WO2011154993A1 (ja) 2010-06-08 2010-06-08 絶縁トランスおよび電源装置
DE112010005649T DE112010005649T5 (de) 2010-06-08 2010-06-08 Isoliertransformator und Leistungsquelle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/003811 WO2011154993A1 (ja) 2010-06-08 2010-06-08 絶縁トランスおよび電源装置

Publications (1)

Publication Number Publication Date
WO2011154993A1 true WO2011154993A1 (ja) 2011-12-15

Family

ID=45097628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/003811 WO2011154993A1 (ja) 2010-06-08 2010-06-08 絶縁トランスおよび電源装置

Country Status (3)

Country Link
JP (1) JPWO2011154993A1 (de)
DE (1) DE112010005649T5 (de)
WO (1) WO2011154993A1 (de)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013007850A1 (de) * 2013-05-08 2014-11-13 Sew-Eurodrive Gmbh & Co Kg Transformatoranordnung
GB2530321A (en) * 2014-09-19 2016-03-23 Murata Manufacturing Co Header for mounting a planar transformer on a mother board
CN105761910A (zh) * 2016-05-14 2016-07-13 保定元辰变压器制造有限公司 一种改进的干式变压器及其组装方法
KR101639579B1 (ko) * 2016-06-17 2016-07-22 제룡전기 주식회사 옥외용 건식변압기의 제조방법 및 이를 이용하여 제조된 옥외용 건식변압기
JP2016167937A (ja) * 2015-03-10 2016-09-15 オムロン株式会社 絶縁型双方向ｄｃ−ｄｃコンバータ、および電力変換システム
JP2017508284A (ja) * 2014-02-14 2017-03-23 フィリップス ライティング ホールディング ビー ヴィ 給電信号及びデータ信号を提供するためのトランス
JP6119012B1 (ja) * 2016-09-26 2017-04-26 音羽電機工業株式会社 耐雷トランス
KR20170078034A (ko) * 2015-12-29 2017-07-07 전자부품연구원 고밀도 전원용 전력변환장치
WO2018184730A1 (de) * 2017-04-07 2018-10-11 Sew-Eurodrive Gmbh & Co. Kg Verfahren zum herstellen eines systems zur induktiven übertragung von energie an ein mobilteil und vorrichtung zur durchführung des verfahrens
KR20190099667A (ko) * 2018-02-19 2019-08-28 청주대학교 산학협력단 박형 dc-dc 컨버터
KR20190108338A (ko) * 2018-03-14 2019-09-24 청주대학교 산학협력단 적층구조를 갖는 스위칭 전원장치
CN110462765A (zh) * 2017-03-16 2019-11-15 西门子股份公司 用于直流电压变换器的变压器
WO2020017082A1 (ja) * 2018-07-17 2020-01-23 株式会社日立製作所 変圧器、電力変換器ユニット、および電力変換器
WO2020255662A1 (ja) * 2019-06-20 2020-12-24 サンデン・アドバンストテクノロジー株式会社 スイッチング電源装置及びそれを備えた車載用電動コンプレッサ及びスイッチング電源装置の製造方法
US11322286B2 (en) * 2016-04-14 2022-05-03 Signify Holding B.V. Split transformer assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3905283B1 (de) * 2020-04-30 2023-11-22 ABB E-mobility B.V. Induktiver schnelllader
DE102023107213B3 (de) 2023-03-22 2024-05-08 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter und dessen Verwendung sowie Antrieb und Kraftfahrzeug mit einem solchen

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132146A (ja) * 1992-10-15 1994-05-13 Matsushita Electric Ind Co Ltd トランスおよびそれを用いた電子機器
JPH09115739A (ja) * 1995-10-24 1997-05-02 Seikosha Co Ltd 電磁装置
JPH11176652A (ja) * 1997-12-09 1999-07-02 Iwaki Electron Corp Ltd トランス
JP2000058336A (ja) * 1998-08-06 2000-02-25 Tdk Corp 電子部品のモールド構造
JP2001119114A (ja) * 1999-10-21 2001-04-27 Ricoh Co Ltd 実装構造及び実装方法
JP2002270435A (ja) * 2001-03-07 2002-09-20 Tdk Corp トランス及びこれを用いたスイッチング電源装置
JP2003051414A (ja) * 2001-05-29 2003-02-21 Toyota Motor Corp 樹脂モールド封止電磁機器およびその製造方法
JP2005168276A (ja) * 2003-11-12 2005-06-23 Sony Corp スイッチング電源回路
JP2009302158A (ja) * 2008-06-10 2009-12-24 Toyota Motor Corp 電圧変換装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646855A (en) 1987-06-30 1989-01-11 Toshiba Corp Production of moisture sensitive element
JP2000124032A (ja) * 1998-03-06 2000-04-28 Nippon Paint Co Ltd 非晶質金属箔及び絶縁性樹脂層からなるフィルム、コイル又はトランス
JP2002093625A (ja) * 2000-09-18 2002-03-29 Totoku Electric Co Ltd 空隙層の形成方法
JP5691137B2 (ja) * 2008-05-14 2015-04-01 富士電機株式会社 スイッチング電源

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132146A (ja) * 1992-10-15 1994-05-13 Matsushita Electric Ind Co Ltd トランスおよびそれを用いた電子機器
JPH09115739A (ja) * 1995-10-24 1997-05-02 Seikosha Co Ltd 電磁装置
JPH11176652A (ja) * 1997-12-09 1999-07-02 Iwaki Electron Corp Ltd トランス
JP2000058336A (ja) * 1998-08-06 2000-02-25 Tdk Corp 電子部品のモールド構造
JP2001119114A (ja) * 1999-10-21 2001-04-27 Ricoh Co Ltd 実装構造及び実装方法
JP2002270435A (ja) * 2001-03-07 2002-09-20 Tdk Corp トランス及びこれを用いたスイッチング電源装置
JP2003051414A (ja) * 2001-05-29 2003-02-21 Toyota Motor Corp 樹脂モールド封止電磁機器およびその製造方法
JP2005168276A (ja) * 2003-11-12 2005-06-23 Sony Corp スイッチング電源回路
JP2009302158A (ja) * 2008-06-10 2009-12-24 Toyota Motor Corp 電圧変換装置

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013007850B4 (de) 2013-05-08 2023-08-10 Sew-Eurodrive Gmbh & Co Kg Transformatoranordnung
DE102013007850A1 (de) * 2013-05-08 2014-11-13 Sew-Eurodrive Gmbh & Co Kg Transformatoranordnung
JP2017508284A (ja) * 2014-02-14 2017-03-23 フィリップス ライティング ホールディング ビー ヴィ 給電信号及びデータ信号を提供するためのトランス
GB2530321A (en) * 2014-09-19 2016-03-23 Murata Manufacturing Co Header for mounting a planar transformer on a mother board
GB2530321B (en) * 2014-09-19 2019-04-17 Murata Manufacturing Co Electronic device
US10178787B2 (en) 2014-09-19 2019-01-08 Murata Manufacturing Co., Ltd. Header for mounting a planar transformer on a motherboard
JP2016167937A (ja) * 2015-03-10 2016-09-15 オムロン株式会社 絶縁型双方向ｄｃ−ｄｃコンバータ、および電力変換システム
KR20170078034A (ko) * 2015-12-29 2017-07-07 전자부품연구원 고밀도 전원용 전력변환장치
KR102295096B1 (ko) * 2015-12-29 2021-08-31 한국전자기술연구원 고밀도 전원용 전력변환장치
US11322286B2 (en) * 2016-04-14 2022-05-03 Signify Holding B.V. Split transformer assembly
CN105761910B (zh) * 2016-05-14 2017-10-10 保定元辰变压器制造有限公司 一种改进的干式变压器及其组装方法
CN105761910A (zh) * 2016-05-14 2016-07-13 保定元辰变压器制造有限公司 一种改进的干式变压器及其组装方法
WO2017217601A1 (ko) * 2016-06-17 2017-12-21 제룡전기 주식회사 옥외용 건식변압기의 제조방법 및 이를 이용하여 제조된 옥외용 건식변압기
KR101639579B1 (ko) * 2016-06-17 2016-07-22 제룡전기 주식회사 옥외용 건식변압기의 제조방법 및 이를 이용하여 제조된 옥외용 건식변압기
JP2018056193A (ja) * 2016-09-26 2018-04-05 音羽電機工業株式会社 耐雷トランス
JP6119012B1 (ja) * 2016-09-26 2017-04-26 音羽電機工業株式会社 耐雷トランス
CN110462765A (zh) * 2017-03-16 2019-11-15 西门子股份公司 用于直流电压变换器的变压器
US11869705B2 (en) 2017-03-16 2024-01-09 Siemens Aktiengesellschaft Transformer for a DC/DC voltage converter
WO2018184730A1 (de) * 2017-04-07 2018-10-11 Sew-Eurodrive Gmbh & Co. Kg Verfahren zum herstellen eines systems zur induktiven übertragung von energie an ein mobilteil und vorrichtung zur durchführung des verfahrens
CN110462973A (zh) * 2017-04-07 2019-11-15 索尤若驱动有限及两合公司 用于制造用于感应式地将能量传输给可动对象的系统的方法以及用于实施所述方法的装置
CN110462973B (zh) * 2017-04-07 2023-06-27 索尤若驱动有限及两合公司 用于制造用于感应式地将能量传输给可动对象的系统的方法以及用于实施所述方法的装置
US11594914B2 (en) 2017-04-07 2023-02-28 Sew-Eurodrive Gmbh & Co. Kg Method for producing a system for inductively transmitting energy to a mobile part, and device for carrying out the method
US11101692B2 (en) 2017-04-07 2021-08-24 Sew-Eurodrive Gmbh & Co. Kg Method for producing a system for inductively transmitting energy to a mobile part, and device for carrying out the method
KR20190099667A (ko) * 2018-02-19 2019-08-28 청주대학교 산학협력단 박형 dc-dc 컨버터
KR102047245B1 (ko) * 2018-02-19 2019-11-21 청주대학교 산학협력단 박형 dc-dc 컨버터
KR102135111B1 (ko) * 2018-03-14 2020-08-26 청주대학교 산학협력단 적층구조를 갖는 스위칭 전원장치
KR20190108338A (ko) * 2018-03-14 2019-09-24 청주대학교 산학협력단 적층구조를 갖는 스위칭 전원장치
JP7026015B2 (ja) 2018-07-17 2022-02-25 株式会社日立製作所 変圧器、電力変換器ユニット、および電力変換器
JP2020013858A (ja) * 2018-07-17 2020-01-23 株式会社日立製作所 変圧器、電力変換器ユニット、および電力変換器
WO2020017082A1 (ja) * 2018-07-17 2020-01-23 株式会社日立製作所 変圧器、電力変換器ユニット、および電力変換器
CN114097050A (zh) * 2019-06-20 2022-02-25 三电高新技术株式会社 开关电源装置及具有该装置的车载用电动压缩机和开关电源装置的制造方法
JP2021002913A (ja) * 2019-06-20 2021-01-07 サンデン・アドバンストテクノロジー株式会社 スイッチング電源装置及びそれを備えた車載用電動コンプレッサ及びスイッチング電源装置の製造方法
WO2020255662A1 (ja) * 2019-06-20 2020-12-24 サンデン・アドバンストテクノロジー株式会社 スイッチング電源装置及びそれを備えた車載用電動コンプレッサ及びスイッチング電源装置の製造方法

Also Published As

Publication number Publication date
JPWO2011154993A1 (ja) 2013-08-01
DE112010005649T5 (de) 2013-11-28

Similar Documents

Publication Publication Date Title
WO2011154993A1 (ja) 絶縁トランスおよび電源装置
US10991501B2 (en) Transformer and power supply device including the same
KR102174244B1 (ko) 트랜스포머 및 이를 포함하는 전원공급장치
US8054152B2 (en) Transformer
RU2374713C2 (ru) Плоский высоковольтный трансформатор
US10460870B2 (en) Induction coil assembly and wireless power transfer system
US20160307690A1 (en) Embedded solenoid transformer for power conversion
KR101604325B1 (ko) 변압기와 이를 포함하는 고전압 전원장치
WO2006092991A1 (ja) 共振型トランスとそれを用いた電源ユニット
CN105529157A (zh) 嵌入式磁性部件变压器装置
US10050533B2 (en) High voltage high frequency transformer
US11791087B2 (en) Planar converter
US11336184B2 (en) Power converter
CN116762146A (zh) 变压器
JP2011087396A (ja) 電源装置およびパワーモジュール
KR102444844B1 (ko) 자기 결합 장치 및 이를 포함하는 평판 디스플레이 장치
CN115700010A (zh) 具有隔离的电子电路
JP2012069997A (ja) パワーモジュール
KR102513410B1 (ko) 트랜스포머 및 이를 포함하는 평판 디스플레이 장치
KR102552586B1 (ko) 트랜스포머 및 이를 포함하는 평판 디스플레이 장치
WO2024080038A1 (ja) トランス、及び電源装置
JP6260261B2 (ja) パルストランスおよびパルストランスを用いたゲート駆動回路
Sabate et al. Gate Driver Power Supply for Medium Voltage SiC Mosfets with Air Core Transformer
CN118553519A (zh) 电力变压器、电路板及变压器的制造方法
JP2021005691A (ja) フィルタユニット

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10852835

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2012519135

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1120100056498

Country of ref document: DE

Ref document number: 112010005649

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10852835

Country of ref document: EP

Kind code of ref document: A1