WO2011145421A1 - 電子部品筐体 - Google Patents
電子部品筐体 Download PDFInfo
- Publication number
- WO2011145421A1 WO2011145421A1 PCT/JP2011/059689 JP2011059689W WO2011145421A1 WO 2011145421 A1 WO2011145421 A1 WO 2011145421A1 JP 2011059689 W JP2011059689 W JP 2011059689W WO 2011145421 A1 WO2011145421 A1 WO 2011145421A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- component housing
- lid
- inclined portion
- heat
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
Definitions
- This invention relates to the structure of an electronic component casing.
- the inverter housed in the housing generates heat. Therefore, heat is trapped in the housing. In such a case, if the housing has the shape as described above, laminar air flows along the upper surface of the housing around the housing, and the heat dissipation effect from the housing is reduced. It was discovered by the present inventors that it was not good.
- the present invention has been made paying attention to such conventional problems, and an object of the present invention is to provide an electronic component casing that can efficiently dissipate the heat of the electronic components to be stored. is there.
- a sloped portion that protrudes from the upper surface and increases in height as it moves away from one side, and a plane that continuously descends from the upper end of the sloped portion or continues to the upper end.
- An electronic component housing is provided that includes a stepped portion that is lowered via a flat surface portion that is continuous with a lower end of the stepped portion.
- FIG. 1 is a perspective view showing a first embodiment of an electronic component housing according to the present invention.
- FIG. 2 is a diagram showing a first embodiment of an electronic component housing according to the present invention.
- FIG. 3 is a diagram illustrating air that flows around the electronic component housing while the vehicle is running.
- FIG. 4 is a diagram illustrating a result of analyzing the direction and speed of air flow around the electronic component housing.
- FIG. 5 is a diagram illustrating the air flow around the electronic component casing while the vehicle is running.
- FIG. 6 is a diagram for explaining the effect of this embodiment.
- FIG. 7 is a perspective view showing a second embodiment of the electronic component casing according to the present invention.
- FIG. 8 is a perspective view showing a third embodiment of the electronic component casing according to the present invention.
- FIG. 1 is a perspective view showing a first embodiment of an electronic component housing according to the present invention.
- FIG. 2 is a diagram showing a first embodiment of an electronic component housing according to the present invention.
- FIG. 9 is a perspective view showing a fourth embodiment of the electronic component casing according to the present invention.
- FIG. 10 is a perspective view showing a fifth embodiment of an electronic component housing according to the present invention.
- FIG. 11 is a perspective view showing a sixth embodiment of an electronic component housing according to the present invention.
- FIG. 1 is a perspective view showing a first embodiment of an electronic component housing according to the present invention.
- the electronic component housing 1 is disposed in the engine room or the motor room (see FIG. 3).
- the electronic component housing 1 includes a case 10 and a lid 20.
- the electronic component housing 1 houses the electronic component 30 (see FIG. 2).
- the electronic component housing 1 seals the electronic component 30.
- the electronic component housing 1 protects the stored electronic components from flying objects from outside, physical pressure and contamination (fine dust) and water intrusion.
- the electronic component housing 1 shields electromagnetic waves.
- Case 10 is fixed to the vehicle (see FIG. 3).
- the case 10 fixes the electronic component 30 to the bottom (see FIG. 2).
- the electronic component 30 includes a semiconductor element, a circuit, and the like.
- the electronic component 30 is, for example, an inverter. Such an electronic component 30 generates heat. Since the electronic component 30 is accommodated without protruding from the case 10, heat is likely to be trapped.
- the case 10 is preferably formed of a heat conductive material so that the heat can be easily released. Therefore, in the present embodiment, the case 10 is made of an aluminum alloy die casting.
- the lid 20 is placed on the case 10.
- the lid 20 closes the opening of the case 10.
- the lid 20 corresponds to the upper surface of the electronic component housing 1.
- the lid 20 is also made of an aluminum alloy die casting.
- the upper surface of the lid 20 includes an inclined portion 21, a flat surface portion 23, and a reference surface 25. That is, the lid 20 is convex with respect to the reference surface 25.
- the inclined portion 21 is a portion that is inclined so as to increase as the distance from the long side 21a increases.
- the upper side of the inclined portion 21 is a long side 21b.
- the plane part 23 continues to the long side 21b of the inclined part 21 through the step part 22. Further, the flat surface portion 23 continues to the reference surface 25 via the additional step portion 24.
- the flat surface portion 23 is lower than the long side 21 b of the inclined portion 21 and higher than the reference surface 25.
- the distance from the flat surface portion 23 to the long side 21b of the inclined portion 21, that is, the height h1 of the step portion 22, is larger than the distance from the reference surface 25 to the flat surface portion 23, that is, the height h2 of the additional step portion 24. That is, “h1> h2”.
- the reference surface 25 is a surface serving as a reference for the upper surface of the lid 20. In the present embodiment, the reference surface 25 extends around the periphery of the lid 20.
- the step portion 22 is a portion that descends from the upper end of the inclined portion 21 and reaches the flat surface portion 23.
- the additional step portion 24 is a step that further descends from the flat portion 23 and reaches the reference surface 25.
- FIG. 2 is a view showing a first embodiment of an electronic component housing according to the present invention
- FIG. 2 (A) is a plan view
- FIG. 2 (B) is a cross-sectional view along line BB in FIG. 2 (A).
- the lid 20 When viewed from above, the lid 20 is a rectangle composed of long sides 20a, 20b and short sides 20c, 20d, as shown in FIG.
- the right side is the inclined portion 21 and the left side is the plane portion 23 across the step portion 22 at the substantially center of the lid 20.
- the inclined portion 21 is a rectangle composed of long sides 21a and 21b and short sides 21c and 21d when viewed from above.
- the long sides 21 a and 21 b are parallel to the long sides 20 a and 20 b of the lid 20.
- the short sides 21 c and 21 d are parallel to the short sides 20 c and 20 d of the lid 20.
- the plane part 23 continues to the long side 23a through the step part.
- the flat surface portion 23 is a rectangle composed of long sides 23a and 23b and short sides 23c and 23d when viewed from above.
- the long sides 23 a and 23 b are parallel to the long sides 20 a and 20 b of the lid 20.
- the short sides 23 c and 23 d are parallel to the short sides 20 c and 20 d of the lid 20.
- the short side 23 c is on the extension of the short side 21 c of the inclined portion 21.
- the short side 23d is on the extension of the short side 21d of the inclined portion 21.
- the electronic component 30 is fixed to the bottom of the case 10.
- the electronic component 30 generates heat according to the amount of electricity. Therefore, it is desirable that the case 10 be formed of a heat conductive material so that the heat generated by the electronic component 30 can be released. Therefore, in the present embodiment, the case 10 is made of an aluminum alloy die casting.
- a coolant channel may be provided at the bottom of the case 10. The presence / absence of the refrigerant passage of the case 10, the material of the case 10, and the specifications thereof may be appropriately determined according to the heat generation amount of the electronic component 30.
- FIG. 3 is a diagram for explaining the air flowing around the electronic component casing while the vehicle is running.
- the electronic component housing 1 is mounted on the vehicle so that the long side 20a of the lid 20 is in front of the vehicle.
- the electronic component housing 1 in this embodiment is also disposed in the engine room or the motor room. While the vehicle is running, air taken in from the front grill flows around the electronic component housing 1. This will be described in more detail with reference to FIG.
- FIG. 4 is a diagram showing the results of analyzing the direction and speed of air flow around the electronic component housing.
- FIG. 5 is a diagram illustrating the air flow around the electronic component housing while the vehicle is running.
- the electronic component 30 fixed to the bottom surface of the electronic component housing 1 generates heat. Since the air heated by this heat rises, it tends to be trapped in the space between the lid 20 and the electronic component 30, particularly in the back side of the inclined portion 21 of the lid 20. This air is deprived of heat by the flowing air as shown by arrow A2. When air is cooled in this way, it descends. And it convects like the arrow B between the inclination part 21 of the lid
- the air turbulent as indicated by the arrow A3 is actively replaced with the air near the surface of the step portion 22 and the flat portion 23.
- the laminar flow is a regular flow with uniform flow velocity and direction.
- a boundary layer having a slow flow velocity exists due to the action of the drag of the object. Therefore, in the laminar flow, the exchange of air near the surface of the object is not active.
- turbulent flow includes vortex-like turbulence in which small portions of fluid are mixed irregularly. Therefore, when a turbulent flow flows along the surface of the object, the air is actively replaced near the surface of the object due to the turbulence.
- FIG. 6 is a diagram for explaining the effect of this embodiment.
- the inclined portion 21 and the flat portion 23 are formed on the upper surface of the lid 20.
- the inclined part 21 and the flat part 23 are not formed on the upper surface of the lid 20, and only the reference surface 25 is present, and the upper surface is flat.
- the inclined part 21 is formed in the lid 20 of the electronic component housing 1, the air flowing through the engine room or the motor room directly hits the inclined part 21. As a result, heat is easily radiated from the surface of the inclined portion 21 of the lid 20, the temperature of the surface of the inclined portion 21 is lowered, and the heat transfer efficiency is increased. Therefore, heat dissipation from the inclined portion 21 of the lid 20 to the outside air is promoted.
- the air flow changes from laminar flow to turbulent flow at the step 22 of the lid 20. Therefore, the air flowing as shown by the arrow A3 is actively replaced with the air near the surface of the step portion 22 and the flat portion 23, so that heat radiation from the step portion 22 and the flat portion 23 is promoted. Since heat is more easily transmitted as the temperature difference is larger, the heat transfer efficiency of the step portion 22 and the flat portion 23 is improved as the heat radiation effect of the step portion 22 and the flat portion 23 is higher.
- the lid 20 of the electronic component housing 1 can exhibit a heat dissipation effect over the entire length.
- the height h1 of the stepped portion 22 is made higher than the height h2 of the additional stepped portion 24. That is, “h1> h2”.
- the reason for this is as follows. That is, as the height of the stepped portion increases, a space for generating a vortex is secured, so that turbulent flow is easily generated. Turbulence improves the heat dissipation effect of the electronic component housing 1. Therefore, it is desirable that the step is as large as possible. However, there are many parts in the engine room and the motor room. There are many components around the electronic component housing 1. The overall height of the electronic component housing 1 is restricted by the layout with surrounding components. Therefore, the size of the step is also limited. Under such constraints, “h1> h2” is set in the present embodiment. By doing in this way, the turbulent flow which generate
- a flat portion 23 is formed on the lower side of the step portion 22.
- a reference surface 25 is formed on the lower side of the additional step portion 24.
- the unevenness 200 is formed on the back side of the flat portion 23 of the lid 20, the area in contact with the air heated by the electronic component 30 increases. For this reason, the heat of the warmed air is easily transmitted to the lid 20.
- the flat portion 23 is close to the electronic component 30 that is low in position and is a heat generation source. Since heat is more easily transmitted as the temperature difference is larger, the flat portion 23 near the electronic component 30 that is a heat source is more likely to transmit heat. Then, by forming the unevenness 200 on the back side of the flat portion 23, heat generated from the electronic component 30 is easily transmitted to the surface of the flat portion 23. And since a turbulent flow flows on the surface of the plane part 23 as mentioned above, the heat dissipation effect becomes very high. In addition, if the unevenness
- FIG. 7 is a perspective view showing a second embodiment of the electronic component casing according to the present invention.
- the stepped portion 22 is formed so as to descend continuously from the long side 21 b at the upper end of the inclined portion 21.
- the stepped portion 22 is formed so as to descend via a flat surface 26 continuous with the long side 21 b at the upper end of the inclined portion 21.
- FIG. 8 is a perspective view showing a third embodiment of the electronic component casing according to the present invention.
- the unevenness 210 is formed on the surface of the inclined portion 21 of the lid 20.
- the unevenness 210 is formed over the entire surface of the inclined portion 21 along the direction in which traveling wind flows through the inclined portion 21 from upstream to downstream.
- the inclined portion 21 of the lid 20 increases the area in contact with the outside air, that is, the heat radiation area, so that the heat radiation from the inclined portion 21 of the lid 20 to the outside air is further promoted.
- FIG. 9 is a perspective view showing a fourth embodiment of the electronic component casing according to the present invention.
- the unevenness 210 is formed on a part of the surface of the inclined portion 21 of the lid 20. That is, the unevenness 210 is formed along the direction in which the traveling wind flows through the inclined portion 21 from the upstream to the downstream, and in a part of the entire inclined portion 21. In FIG. 9, the unevenness 210 is formed in a half region of the inclined portion 21 from the long side 21 b at the upper end of the inclined portion 21.
- the highest temperature is the highest due to natural convection. That is, in the present embodiment, the vicinity of the long side 21b at the upper end of the inclined portion 21 is the highest temperature.
- corrugation 210 is formed in this place, heat dissipation efficiency is good.
- it is smaller than the unevenness
- FIG. 10 is a perspective view showing a fifth embodiment of an electronic component housing according to the present invention.
- the unevenness 211 is formed on the surface of the inclined portion 21 of the lid 20.
- the unevenness 211 is formed over the entire surface of the inclined portion 21 so as to be orthogonal to the direction in which the traveling wind flows through the inclined portion 21 from upstream to downstream.
- the inclined portion 21 of the lid 20 increases the area in contact with the outside air, that is, the heat radiation area, so that the heat radiation from the inclined portion 21 of the lid 20 to the outside air is promoted.
- the inclined portion 21 of the lid 20 has many small steps. As a result, fine vortices are formed in the irregularities 211, resulting in turbulent flow, so that the heat dissipation effect on the irregular surface is improved.
- FIG. 11 is a perspective view showing a sixth embodiment of an electronic component housing according to the present invention.
- the unevenness 211 is formed on a part of the surface of the inclined portion 21 of the lid 20. That is, the unevenness 210 is formed along the direction in which the traveling wind flows through the inclined portion 21 from the upstream to the downstream, and in a part of the entire inclined portion 21. In FIG. 9, the unevenness 210 is formed in a half region of the inclined portion 21 from the long side 21 b at the upper end of the inclined portion 21.
- the unevenness 211 is formed in the vicinity of the long side 21b at the upper end of the highest temperature inclined portion 21, the heat radiation efficiency is good. Moreover, it is small rather than the unevenness
- the electronic component casing is formed of aluminum alloy die casting, it is not limited thereto, and may be formed of iron, copper, magnesium, or the like.
- the construction method may also be a press or a mold.
- you may form a housing
- the electronic component housing includes a case and a lid that closes the upper portion of the case.
- the upper surface of the lid includes the inclined portion 21, the flat portion 23, and the reference surface 25.
- a case in which the case and the lid in each of the above embodiments are integrally formed may be used.
- an open / close door may be provided on the bottom or side of the housing, and electronic components may be accommodated from the door. That is, the present invention is not limited to the lid of the electronic component housing, and the same effect can be obtained if the upper surface is formed as described above.
- the surface of the inclined portion of the lid is provided with unevenness, but may be provided on the other surface of the lid.
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図1は、本発明による電子部品筐体の第1実施形態を示す斜視図である。
図7は、本発明による電子部品筐体の第2実施形態を示す斜視図である。
図8は、本発明による電子部品筐体の第3実施形態を示す斜視図である。
図9は、本発明による電子部品筐体の第4実施形態を示す斜視図である。
図10は、本発明による電子部品筐体の第5実施形態を示す斜視図である。
図11は、本発明による電子部品筐体の第6実施形態を示す斜視図である。
Claims (9)
- 電子部品(30)を収納する電子部品筐体であって、
上面(20)に凸設され、一つの側辺(21a)から離れるにつれて高さが高くなる傾斜部(21)と、
前記傾斜部(21)の上端(21b)に連続して下降する、又は上端(21b)に連続する平面(26)を介して下降する段部(22)と、
前記段部(22)の下端に連続する平面部(23)と、
を備えることを特徴とする電子部品筐体。 - 請求項1に記載の電子部品筐体において、
前記傾斜部(21)の裏側から前記電子部品(30)までには、内部空間が確保される、
ことを特徴とする電子部品筐体 - 請求項1又は請求項2に記載の電子部品筐体において、
前記平面部(23)から下降する追加段部(24)をさらに備える、
ことを特徴とする電子部品筐体。 - 請求項3に記載の電子部品筐体において、
前記段部(22)の段差は、前記追加段部(24)の段差よりも大きい、
ことを特徴とする電子部品筐体。 - 請求項1から請求項4までのいずれか1項に記載の電子部品筐体において、
前記傾斜部(21)の表面に設けられ、前記側辺(21a)に直交する凸凹(210)をさらに備える、
ことを特徴とする電子部品筐体。 - 請求項1から請求項4までのいずれか1項に記載の電子部品筐体において、
前記傾斜部(21)の表面に設けられ、前記側辺(21a)に平行する凸凹(211)をさらに備える、
ことを特徴とする電子部品筐体。 - 請求項5又は請求項6に記載の電子部品筐体において、
前記凸凹(210,211)は、前記傾斜部(21)の表面のうち上端(21b)に連続する少なくとも一部の領域に設けられる、
ことを特徴とする電子部品筐体。 - 請求項1から請求項7までのいずれか1項に記載の電子部品筐体において、
前記上面(20)の裏側に設けられる凸凹(200)をさらに備える、
ことを特徴とする電子部品筐体。 - 請求項1から請求項8までのいずれか1項に記載の電子部品筐体において、
前記傾斜部(21)の前記側辺(21a)が車両前方に位置するように、車両に搭載される、
ことを特徴とする電子部品筐体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US13/698,843 US9247677B2 (en) | 2010-05-21 | 2011-04-20 | Electronic component casing |
JP2012515797A JP5333666B2 (ja) | 2010-05-21 | 2011-04-20 | 電子部品筐体 |
EP11783358.2A EP2574158B1 (en) | 2010-05-21 | 2011-04-20 | Electronic component casing |
CN201180022080.5A CN103039136B (zh) | 2010-05-21 | 2011-04-20 | 电子零件箱体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010117472 | 2010-05-21 | ||
JP2010-117472 | 2010-05-21 |
Publications (1)
Publication Number | Publication Date |
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WO2011145421A1 true WO2011145421A1 (ja) | 2011-11-24 |
Family
ID=44991536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2011/059689 WO2011145421A1 (ja) | 2010-05-21 | 2011-04-20 | 電子部品筐体 |
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US (1) | US9247677B2 (ja) |
EP (1) | EP2574158B1 (ja) |
JP (1) | JP5333666B2 (ja) |
CN (1) | CN103039136B (ja) |
WO (1) | WO2011145421A1 (ja) |
Cited By (1)
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JP2020047843A (ja) * | 2018-09-20 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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USD968468S1 (en) * | 2021-01-06 | 2022-11-01 | Msd Llc | Cover for engine control unit |
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2011
- 2011-04-20 CN CN201180022080.5A patent/CN103039136B/zh active Active
- 2011-04-20 EP EP11783358.2A patent/EP2574158B1/en active Active
- 2011-04-20 WO PCT/JP2011/059689 patent/WO2011145421A1/ja active Application Filing
- 2011-04-20 JP JP2012515797A patent/JP5333666B2/ja active Active
- 2011-04-20 US US13/698,843 patent/US9247677B2/en active Active
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020047843A (ja) * | 2018-09-20 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
WO2020059240A1 (ja) * | 2018-09-20 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
US11406043B2 (en) | 2018-09-20 | 2022-08-02 | Hitachi Astemo, Ltd. | Electronic control device having a heat radiation structure |
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JP5333666B2 (ja) | 2013-11-06 |
CN103039136A (zh) | 2013-04-10 |
EP2574158A4 (en) | 2015-01-14 |
US9247677B2 (en) | 2016-01-26 |
JPWO2011145421A1 (ja) | 2013-07-22 |
CN103039136B (zh) | 2016-04-20 |
EP2574158B1 (en) | 2018-01-10 |
EP2574158A1 (en) | 2013-03-27 |
US20130063880A1 (en) | 2013-03-14 |
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