WO2011142320A1 - 電気泳動表示装置、電気泳動表示装置の製造方法及び接着剤層付き基材の製造方法 - Google Patents
電気泳動表示装置、電気泳動表示装置の製造方法及び接着剤層付き基材の製造方法 Download PDFInfo
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- WO2011142320A1 WO2011142320A1 PCT/JP2011/060665 JP2011060665W WO2011142320A1 WO 2011142320 A1 WO2011142320 A1 WO 2011142320A1 JP 2011060665 W JP2011060665 W JP 2011060665W WO 2011142320 A1 WO2011142320 A1 WO 2011142320A1
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- adhesive layer
- electrode substrate
- adhesive
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- thermoplastic
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
- G02F1/1681—Gaskets; Spacers; Sealing of cells; Filling or closing of cells having two or more microcells partitioned by walls, e.g. of microcup type
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Definitions
- the present invention relates to an electrophoretic display device capable of reversibly changing the visual state by the action of an electric field or the like, a method for manufacturing the electrophoretic display device, and a method for manufacturing a substrate with an adhesive layer.
- the electrophoretic display device has a configuration in which two electrode substrates, at least one of which is transparent, are arranged so as to face each other, and an electrophoretic ink is provided between the opposed electrodes, thereby forming a display panel. A display is obtained on the transparent electrode surface by applying an electric field to the display panel.
- An electrophoretic display device is a display medium that can obtain a desired display by controlling the direction of an electric field, is low in cost, has a viewing angle as wide as that of a normal printed material, consumes little power, and has a display memory property.
- Has attracted attention because of its advantages such as having.
- the electrophoretic particles used in the electrophoretic ink have a problem that the particles are likely to aggregate due to long-term storage, and the particles are unevenly distributed during repeated display. Have. Therefore, a method has been proposed in which the electrophoretic ink is filled into a large number of small compartments (cells) that are finely isolated to suppress aggregation and uneven distribution of particles.
- a technique for applying a coating solution to a fine portion for example, a screen printing method, an ink jet method, or the like is known. These techniques are used for manufacturing printed circuits and liquid crystal displays.
- the coating liquid As an example of applying the coating liquid to a fine part, there is an application in which an adhesive is applied as a coating liquid on the upper surface of a structure standing on the base material in order to bond the two base materials while keeping the distance between them constant. Can be mentioned. In this case, the structure and the substrate that are adherends are fixed via an adhesive.
- Patent Document 1 as a method of applying an adhesive to a spacer of an electrophoretic display panel, a transfer roll having an adhesive attached to its surface is driven to rotate, and the transfer roll and the substrate on which the spacer is formed are moved relative to each other. Thus, a method of applying an adhesive on the upper surface of the spacer has been proposed.
- Patent Document 3 proposes a method of transferring a hot melt adhesive that is solid in a standard state and exhibits adhesiveness only under specific conditions as a method of applying an adhesive to the spacer of an electrophoretic display panel. Has been.
- Patent Document 1 is based on the premise that charged particles fly in the gas phase.
- electrophoretic ink for example, a screen is placed on a substrate with a structure to which electrophoretic ink has been applied in advance.
- the adhesive is applied by the printing method, there is a problem that the applied electrophoretic ink comes into contact with the screen plate and the uniformity of ink filling is impaired.
- a non-contact printing method such as inkjet
- the durability of the display medium is lowered due to poor adhesion caused by compatibility / mixing of electrophoretic ink and adhesive.
- Patent Document 1 also describes a process of charging charged particles after forming an adhesive.
- electrophoretic ink liquid
- display due to poor adhesion caused by compatibility / mixing with the adhesive.
- the problem such as a decrease in the durability of the medium occurs as described above.
- the present invention has been made in view of such a point, and even when an electrophoretic ink is used, a decrease in the adhesive force between the upper surface of the structure and the counter electrode substrate is suppressed, and the structural durability of the electrophoretic display device is improved.
- One of the purposes is to improve the performance and display durability.
- a cell forming step for forming a plurality of cells made of an insulating structure standing on a first electrode substrate, and a film base having a thermoplastic adhesive layer formed on the surface.
- An adhesive layer transfer process for transferring the thermoplastic adhesive to the top surface of the structure by heating the material in contact with the top surface of the structure and peeling the thermoplastic adhesive in a softened state.
- An electrophoretic ink filling step of filling the electrophoretic ink, and a substrate bonding step of bonding the upper surface of the structure and the second electrode substrate while heating at a lower temperature than the adhesive layer transfer step.
- the second aspect of the present invention includes a step of forming a plurality of cells formed of an insulating structure standing on a first electrode substrate, and a first adhesive layer is formed on the upper surface of the structure A step of filling the cell with electrophoretic ink, a step of forming a second adhesive layer on the second electrode substrate, the second adhesive layer being substantially the same as the pattern shape of the upper surface of the structure, Bonding the first electrode substrate and the second electrode substrate by adhering the first adhesive layer and the second adhesive layer with the electrode substrate and the second electrode substrate facing each other. .
- a step of forming a plurality of cells formed of an insulating structure standing on a first electrode substrate, and a first adhesive layer is formed on the upper surface of the structure A step of bringing the second electrode substrate into contact with the upper surface of the structure on which the first adhesive layer is formed, and peeling the second electrode substrate from the upper surface of the structure, Transferring a part of the first adhesive layer formed on the surface of the second electrode substrate to form a second adhesive layer on the surface of the second electrode substrate; and a plurality of cells
- the step of filling the electrophoretic ink, the first electrode substrate and the second electrode substrate are arranged to face each other, and the first adhesive layer and the second adhesive layer are adhered to each other, thereby the first electrode substrate And a step of bonding the second electrode substrate.
- a step of forming a plurality of cells formed of an insulating structure standing on a first electrode substrate, and forming a first adhesive layer on the upper surface of the structure And a step of bringing the second electrode substrate into contact with the upper surface of the structure on which the first adhesive layer is formed, and then fixing a part of the first electrode substrate and a part of the second electrode substrate.
- a part of the first adhesive layer formed on the upper surface of the structure is transferred to the surface of the second electrode substrate by peeling off the non-fixed portion of the process and the second electrode substrate from the upper surface of the structure.
- the fifth aspect of the present invention includes a step of forming a structure on the surface of the first substrate, a step of forming a coating film of a thermoplastic material on the surface of the second substrate, A step of bringing the thermoplastic material layer formed on the surface of the second base material into contact with the upper surface of the structure standing on the surface of the base material; and heating the thermoplastic material layer to cause the structure and the thermoplastic A step of bonding the material layer, and a step of transferring the thermoplastic material layer to the upper surface of the structure by peeling the second substrate from the first substrate while the thermoplastic material layer is heated.
- the present invention even when the electrophoretic ink is used, a decrease in the adhesive force between the upper surface of the structure and the counter electrode substrate is suppressed, and the structural durability and display durability of the electrophoretic display device are improved. be able to.
- 6A and 6B illustrate a method for manufacturing the electrophoretic display device according to the first embodiment.
- 6A and 6B illustrate an example of a method for manufacturing an electrophoretic display device according to the first embodiment.
- 6A and 6B illustrate an example of a method for manufacturing an electrophoretic display device according to the first embodiment.
- 8A and 8B illustrate an example of a method for manufacturing an electrophoretic display device according to a second embodiment.
- 10A and 10B illustrate an example of a method for manufacturing an electrophoretic display device according to a third embodiment.
- 10A and 10B illustrate an example of a method for manufacturing an electrophoretic display device according to a third embodiment.
- 10A and 10B illustrate an example of a method for manufacturing an electrophoretic display device according to a fourth embodiment.
- 10A and 10B illustrate an example of a method for manufacturing an electrophoretic display device according to a fourth embodiment.
- the figure explaining the manufacturing method of the base material with an adhesive bond layer which concerns on 5th Embodiment The figure explaining an example of the manufacturing method of the base material with an adhesive bond layer which concerns on 5th Embodiment.
- an adhesive layer can be selectively and efficiently formed only on the upper surface of the structure, and the compatibility / mixing of the electrophoretic ink and the adhesive can be suppressed.
- a manufacturing method capable of suppressing damage to the electrophoretic ink at the time of manufacturing the apparatus will be described.
- the manufacturing method of the electrophoretic display device shown in the first embodiment includes a cell forming step of forming a plurality of cells made of an insulating structure standing on a first electrode substrate, and a thermoplastic adhesion to the surface.
- the film base on which the adhesive layer is formed is heated while being in contact with the upper surface of the structure, and the thermoplastic adhesive layer is transferred to the upper surface of the structure by peeling off the thermoplastic adhesive in a softened state.
- each step will be specifically described with reference to the drawings, but is not limited to those shown here.
- a plurality of cells (small chambers) 104 made of an insulating structure 103 standing on the first electrode substrate 100 are formed (see FIG. 1A).
- the plurality of cells 104 are separated from each other by an upright structure 103, and the shapes when viewed from the direction perpendicular to the electrode substrate surface are various, such as a circle, a rectangle (rectangle, square), and a hexagon. It can be provided in the form.
- the structure 103 may be referred to as a “rib” or a “spacer”.
- the first electrode substrate 100 may be formed of a substrate provided with an electrode.
- the first electrode layer 102 is provided on the first base material 101 having an insulating property.
- An insulating structure 103 can be formed over the electrode layer 102.
- the first substrate 101 is made of a transparent inorganic material such as glass, quartz, sapphire, MgO, LiF, or CaF 2, or an organic material such as fluorine resin, polyester, polycarbonate, polyethylene, polyethylene terephthalate, polyethylene naphthalate, or polyethersulfone. It can be formed using a polymer film or ceramic.
- the first electrode layer 102 is made of a transparent conductive material such as ITO, ZnO, SnO 2 , aluminum (Al), gold (Au), platinum (Pt), copper (Cu), silver (Ag), nickel (Ni ), A metal such as chromium (Cr). Further, conductive polymers such as PODET / PVS and PODET / PSS, and transparent conductive materials such as titanium oxide, zinc oxide, and tin oxide may be used. These materials can be formed by methods such as vapor deposition, ion plating, and sputtering. The shape of the 1st electrode layer 102 can be suitably selected according to the shape of the 2nd electrode layer used as a counter electrode. Note that the first electrode layer 102 may be provided in contact with the first base material 101, or a TFT element or the like may be provided over the first base material 101.
- a transparent conductive material such as ITO, ZnO, SnO 2 , aluminum (Al), gold (Au), platinum (Pt
- the first electrode substrate 100 is the front electrode substrate, in order to visually recognize the display of characters and the like formed from the electrophoretic ink through the first electrode substrate 100,
- the first substrate 101 and the first electrode layer 102 are preferably formed using a light-transmitting material.
- the structure 103 can be formed using a resin material such as a PET film.
- a resin material such as a PET film.
- a plurality of cells 104 can be formed by laser processing a synthetic resin such as a PET film having a certain thickness to form a shape such as a square, hexagon, or circle.
- a plurality of cells 104 can be formed by forming an insulating layer over the first electrode layer 102 and then patterning the insulating layer by a photolithography method.
- a thermoplastic resin can be formed over the first electrode layer 102, and the cell 104 made of the cross-shaped structure 103 can be formed by a method such as hot embossing.
- the adhesive layer transfer step is performed in a state where a roller-like adhesive layer 206 formed on the surface of the film-like substrate 205 is in contact with the upper surface of the structure 103.
- a temperature higher than the softening point of the thermoplastic adhesive is applied while pressing with the pressing bodies 113 and 114, and the film-like base material 205 is peeled off from the first electrode substrate 100 before the thermoplastic adhesive layer 206 is solidified.
- the thermoplastic adhesive layer 206 formed on the surface of the film substrate 205 can be transferred to the upper surface of the structure 103.
- thermoplastic adhesive layer By transferring the thermoplastic adhesive layer using a thermal laminating apparatus or the like in the adhesive layer transfer step, it is not necessary to align the adhesive layer and the structure, and to other parts than the structure. The formation of an excessive adhesive layer is suppressed, and the productivity can be remarkably improved.
- the thickness of the adhesive layer is determined by the thickness of the thermoplastic adhesive layer 206 formed on the substrate 205 on the film, the type of adhesive, the heating temperature, the load of the roller-shaped pressing bodies 113 and 114, and the like.
- the adhesive layer 107 can be controlled to a desired layer thickness by controlling the distance between the pressing body 113 and the pressing body 114.
- thermoplastic adhesive layer 107 In order to stably form the thermoplastic adhesive layer 107 on the structure 103, it is preferable to apply heat by the roller-shaped pressing bodies 113 and 114 in the adhesive layer transfer step.
- thermoplastic adhesive type used for the thermoplastic adhesive layer 206 a hot melt adhesive, paraffin wax, polyethylene resin, or the like can be used. These thermoplastic adhesives are selected by paying attention to the softening point.
- a thermoplastic adhesive that softens at a lower temperature than the above-mentioned other materials can be used.
- the electrophoretic ink filling step the electrophoretic ink 108 is filled into the cells 104 formed on the first electrode substrate 100 (see FIG. 1D).
- the natural cooling is performed so that the thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 does not flow out of the top surface of the structure 103.
- -Forced cooling hereinafter referred to as immobilization.
- the thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 may be cooled by applying dry air at about room temperature.
- thermoplastic adhesive layer 107 by fixing the thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 before filling the electrophoretic ink 108. Even so, it is possible to prevent the electrophoretic ink 108 and the thermoplastic adhesive layer 107 from being dissolved and dissolved.
- the timing for fixing the thermoplastic adhesive phase 107 may be performed after the substrate is peeled from the upper surface of the structure 103 in the adhesive layer transfer step and before the electrophoretic ink 108 is filled.
- the electrophoretic ink 108 only needs to contain at least one kind of electrophoretic particles.
- the electrophoretic ink 108 is formed of positively charged white particles, negatively charged black particles, and a dispersion medium in which these particles are dispersed. can do.
- white particles white pigments such as titanium oxide, white resin particles, or resin particles colored in white can be used.
- black particles black pigments such as titanium black and carbon black, resin particles colored black, and the like can be used. These particles can be arbitrarily used in various colors as long as the contrast can be displayed, and can be a combination of white and red, white and blue, yellow and black, and the like.
- a dye capable of displaying a contrast by dissolving it in a dispersion medium it is possible to use only one type of charged particle such as only white particles or only black particles.
- the first electrode substrate 100 and the second electrode substrate 200 are arranged to face each other, and the thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 is bonded to the second electrode substrate 200.
- the electrophoretic ink 108 is sealed in the cell 104 (see FIG. 1E).
- the thermoplastic adhesive layer 107 formed on the upper surface of the structure body 103 is softened to a state where it can be bonded by heat treatment, and bonded to the second electrode substrate 200. That is, the thermoplastic adhesive layer 107 once fixed before the electrophoresis ink filling step is softened again.
- thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 is brought into contact with the second electrode substrate 200, the temperature is equal to or higher than the softening point temperature of the thermoplastic adhesive layer 107.
- the first electrode substrate 100 and the second electrode substrate 200 are continuously pressed and bonded together (after thermocompression bonding) with the roller-shaped pressing bodies 116 and 117, and the thermoplasticity is applied.
- the adhesive layer 107 can be sealed by cooling and bonding.
- the second electrode substrate 200 may be formed of a substrate provided with electrodes.
- the second electrode layer 202 may be provided on the second base material 201.
- the second base 201 may be formed using any of the materials shown in the description of the first base 101.
- the second electrode layer 202 may be formed using any one of the materials described in the description of the second electrode 102.
- the electrophoretic display device when the second electrode substrate 200 is a front electrode substrate, the display of characters or the like formed from the electrophoretic ink through the second electrode substrate 200 is visually recognized.
- the second base 201 and the second electrode layer 202 are preferably formed using a light-transmitting material.
- the temperature (T2) for softening the thermoplastic adhesive layer 107 is preferably smaller than the boiling point (T3) of the electrophoretic ink 108 (T3> T2). This is because, when a temperature equal to or higher than the boiling point of the dispersion medium of the electrophoretic ink 108 is applied in the substrate bonding step, the dispersion medium volatilizes and decreases, thereby degrading the performance of the electrophoretic ink. Therefore, the material of the thermoplastic adhesive is preferably selected so that the softening point is smaller than the boiling point of the dispersion medium of the electrophoretic ink 108.
- the temperature (T1) at which the thermoplastic adhesive layer 206 in the adhesive layer transfer step is softened to a transferable state (T1) is the temperature at which the thermoplastic adhesive layer 107 in the substrate bonding step is softened to a state where it can be bonded ( Higher than T2) (T1> T2).
- T1> T2 the temperature at which the thermoplastic adhesive layer 107 in the substrate bonding step is softened to a state where it can be bonded
- the substrate bonding step it is preferable to heat only the second electrode substrate 200 side in order to suppress the volatilization of the dispersion medium from the electrophoretic ink as much as possible.
- the roller-shaped pressing body 116 in FIG. 3 is heated, and the roller-shaped pressing body 117 can be bonded together at a normal temperature (room temperature).
- a heating device such as a heater only on the roller-like pressing body 116 side.
- the cell 104 is sealed by bonding the thermoplastic adhesive layer 107 formed on the upper surface of the structure 103 and the second electrode substrate 200, the particles of the electrophoretic ink 108 are transferred to other cells. It becomes possible to suppress movement.
- an adhesive layer can be easily provided on the top surface of the structure even when an electrophoretic ink is used as the electrophoretic display device. It is possible to suppress the adhesive from being compatible with the electrophoretic ink.
- an electrophoretic ink when an electrophoretic ink is filled in a cell after an adhesive layer is formed on the upper surface of the structure, it may be formed on the upper surface of the structure depending on the material of the adhesive layer or the electrophoretic ink. It has been found that when the electrophoretic ink comes into contact with the surface of the adhesive layer, the adhesive strength of the adhesive layer may be reduced. Due to this decrease in adhesion, the two electrode substrates facing each other easily peel off and the electrophoretic ink leaks, and there is a gap between the structure and the electrode substrate, resulting in sufficient electrophoretic particles. It is conceivable that problems may arise in the structural durability and display durability of the electrophoretic display device, such as the problem that aggregation of the particles and uneven distribution cannot be suppressed.
- the present inventor impairs display performance by forming and bonding an adhesive layer on both the upper surface side of the structure formed on the first electrode substrate and the second electrode substrate side. In other words, it was found that the upper surface of the structure and the second electrode substrate can be firmly bonded.
- the method for manufacturing an electrophoretic display device shown in the second embodiment includes a step of forming a plurality of cells formed of an insulating structure standing on a first electrode substrate, and an upper surface of the structure.
- forming the first electrode substrate and the second electrode substrate by opposingly arranging the first electrode substrate and the second electrode substrate to bond the first adhesive layer and the second adhesive layer. And a step of bonding the substrates together.
- ⁇ Cell formation process> In the cell formation step, a plurality of small rooms (cells 104) made of an insulating structure 103 standing on the first electrode substrate 100 are formed (see FIG. 4A).
- the first electrode substrate 100 may be a substrate having electrodes.
- the first electrode layer 102 is provided on the first base material 101, and the first electrode substrate 100 is provided.
- An insulating structure 103 can be formed over the layer 102. Note that the materials, manufacturing methods, and the like described in Embodiment Mode 1 can be applied to materials, manufacturing methods, and the like applied to the first base material 101, the first electrode layer 102, and the structure body 103.
- First adhesive layer forming step In the first adhesive layer forming step, the first adhesive layer 105 is formed on the upper surface of the structure 103 (see FIG. 4B).
- thermosetting adhesive such as a thermosetting adhesive, a thermoplastic adhesive, and a photocurable adhesive
- thermoplastic adhesive can fix the adhesive only to the upper surface of the structure 103 by forming an adhesive layer 105 on the upper surface of the structure 103 while being melted or softened by heating and then cooling. . This makes it possible to suppress the inflow of the adhesive into the cell. Furthermore, since it can be melted or softened by heating again after filling with the electrophoretic ink, the substrates can be bonded together in the bonding step.
- the first adhesive layer 105 may be formed so as to suppress the inflow of the adhesive from the upper surface of the structure 103 into the cell.
- the first adhesive layer 105 can be formed using various methods such as gravure printing, screen printing, ink jetting, and transfer in accordance with the characteristics of the adhesive to be used, and it is particularly preferable to use a transfer method.
- the transfer method the base material 300 on which the adhesive 302 is formed is peeled after being brought into contact with the upper surface of the structure 103, whereby a part of the adhesive is applied to the surface of the base material 103. It can be transferred to the upper surface (see FIGS. 6A to 6C). This is because the first adhesive layer 105 can be selectively and easily formed on the upper surface of the structure 103 by using the transfer method. Note that in the case where the first electrode substrate 100 is a flexible substrate, the efficiency of the manufacturing process can be improved by performing transfer using a roll process.
- the electrophoretic ink 108 is filled into the cells 104 formed on the first electrode substrate 100 (FIG. 4C).
- a filling method for example, various methods can be used as long as the ink can be filled in the cell, such as coating using a die coater, printing using screen printing, or ink jet or dispenser filling. Can be used. Note that the materials and the like described in Embodiment Mode 1 can be applied to the materials and the like applied to the electrophoretic ink.
- ⁇ Second adhesive layer forming step> a second adhesive layer 203 that is substantially the same as the pattern shape on the upper surface of the structure is formed on the surface of the second electrode substrate 200 (see FIG. 4D).
- the second adhesive layer 203 is formed to be substantially the same as the pattern shape on the upper surface of the structure provided on the first electrode substrate 100 (see FIGS. 5A to 5D).
- the pattern shape on the upper surface of the structure is substantially the same as the pattern shape on the upper surface of the structure, as shown in FIGS. 5C and 5D, indicating that the second adhesive layer 203 is formed so as to correspond to the pattern shape on the upper surface of the structure.
- it represents a state in which the center of W1 and the center of W2 in FIG. 5A coincide.
- the relationship between W1 and W2 may be W1 ⁇ W2 as long as the display performance is not affected, and may be W1> W2 as long as the adhesive force can be secured.
- W1 W2 is particularly preferable from the viewpoints of adhesive strength and display properties.
- the second adhesive layer 203 is preferably formed of the same material as the first adhesive layer 105 or a material having an effect of improving the adhesiveness with respect to the material of the first adhesive layer 105. Thereby, the adhesiveness of the 1st adhesive bond layer 105 and the 2nd adhesive bond layer 203 can be improved.
- the first electrode substrate 100 and the second electrode substrate 200 are arranged to face each other, and the top surface of the structure body 103 and the second electrode substrate 200 are interposed through the first adhesive layer 105 and the second adhesive layer 203.
- the electrophoretic ink 108 is sealed in the cell 104 (see FIG. 4E).
- the adhesive used for the first adhesive layer 105 and the second adhesive layer 203 it is desirable to select a material having excellent adhesiveness with the second electrode substrate 200 and the structure 103.
- the adhesive force is significantly reduced. This decrease in adhesion force is due to the fact that the effective adhesion area decreases due to the presence of electrophoretic particles, and additives such as a surfactant in the electrophoretic ink 108 are added to the second electrode substrate 200 and the structure 103. It is thought to be caused by adhering to the surface.
- the adhesive layer is formed on the surfaces of the second electrode base material 200 and the structure 103, which are adherends, in the electrophoretic particles and the electrophoretic ink 108.
- the surfactant can be prevented from lowering the adhesive strength.
- electrophoretic particles or a surfactant in the electrophoretic ink 108 may be interposed between the first adhesive layer 105 and the second adhesive layer 203.
- the first adhesive layer 105 and the second adhesive layer 203 are softer than the second electrode substrate 200 and the structure 103, and in the bonding process, each of the adhesive layers is deformed, mixed, Alternatively, it is possible to expect sufficient wetting, securing of a contact area, and anchor effect by being compatible.
- thermoplastic material softens at a desired temperature (for example, 100 ° C., etc.), and the higher the temperature, the better the wetting with the base material. The property is improved.
- thermoplastic materials having tackiness (tackiness) even at room temperature and such materials can obtain adhesion and adhesion even at temperatures close to room temperature. The same applies to the following embodiments.
- the ultraviolet curable material absorbs and cures a desired accumulated light amount (for example, 3000 mJ / cm 2 ).
- a desired accumulated light amount for example, 3000 mJ / cm 2 .
- the first adhesive layer 105 and the second adhesive layer Immediately after the formation of 203, a part of the desired integrated light quantity is irradiated in advance to make it a semi-cured state, and then the electrophoretic ink 108 is filled into the cell 104 and a bonding process is performed, whereby the first adhesive layer 105
- the second electrode substrate 200, the second adhesive layer 203, and the structure 103 can be improved in adhesion, and the bonding process can achieve adhesion with a relatively small integrated light amount. The same applies to the following embodiments.
- the inventor forms an adhesive layer having substantially the same pattern shape on both the upper surface side of the structure formed on the first electrode substrate and the second electrode substrate side by transfer, and performs electrophoresis.
- the adhesive layer formed on both electrode substrates After laminating using the adhesive layer formed on both electrode substrates after filling with ink, the upper surface of the structure and the second electrode substrate are firmly bonded without impairing the display performance in a simple process. The knowledge that it can adhere was acquired.
- a step, a step of filling a plurality of cells with electrophoretic ink, and a first electrode substrate and a second electrode substrate are arranged to face each other to bond the first adhesive layer and the second adhesive layer. And a step of bonding the first electrode substrate and the second electrode substrate.
- the electrophoretic display device can be easily manufactured while reducing the complexity of the process.
- each process is demonstrated concretely with reference to drawings.
- the first electrode substrate 100 may be any substrate having an electrode.
- the first electrode substrate 100 has a structure in which the first electrode layer 102 is provided on the first base material 101 as shown in FIG.
- An insulating structure 103 can be formed over the layer 102. Note that the materials, manufacturing methods, and the like described in Embodiment Mode 1 can be applied to materials, manufacturing methods, and the like applied to the first base material 101, the first electrode layer 102, and the structure body 103.
- First adhesive layer forming step In the first adhesive layer forming step, the first adhesive layer 105 is formed on the upper surface of the structure 103 (see FIG. 7B). Note that the material, the manufacturing method, and the like described in Embodiment Mode 2 can be applied to the material, the manufacturing method, and the like applied to the first adhesive layer 105.
- the first adhesive layer 105 is in a softened state.
- the second electrode is formed after the first adhesive layer 105 is formed on the upper surface of the structure 103 and then cooled and fixed. What is necessary is just to make it contact with the board
- the first adhesive layer 105 is in a fixed state, the first adhesive layer 105 is heated or melted or softened before being brought into contact with the second electrode substrate 200, What is necessary is just to contact the 2nd electrode substrate 200.
- the first adhesive layer 105 is formed on the upper surface of the structure 103 and then heated or irradiated with ultraviolet rays.
- the second electrode substrate 200 may be contacted before being cured.
- ⁇ Second adhesive layer forming step> a part of the first adhesive layer 105 formed on the upper surface of the structure 103 is transferred to the surface of the second electrode substrate 200 by peeling the second electrode substrate 200 from the structure 103. .
- the second adhesive layer 203 having substantially the same pattern as the pattern shape of the upper surface of the structure 103 can be formed on the surface of the second electrode substrate 200 (see FIG. 7D).
- the second electrode substrate 200 may be formed of a substrate provided with electrodes.
- the second electrode layer 202 may be provided on the second base material 201. Note that the materials and the like described in Embodiment Mode 1 can be applied to the materials and the like applied to the second base member 201 and the second electrode layer 202.
- the first adhesive layer 105 remaining on the upper surface of the structure 103 can be fixed by cooling. Thereby, it is possible to suppress the inflow of the adhesive into the cell 104 and the like, and to prevent the first adhesive layer 105 from being dissolved in the electrophoretic ink in the electrophoretic ink filling step performed later. Become.
- the first adhesive layer 105 in the case where a thermosetting adhesive or a photocurable adhesive is used as the first adhesive layer 105, the minimum necessary amount that can be fixed after peeling the second electrode substrate 200 from the structure body 103. It is preferable that the first adhesive layer 105 remaining on the upper surface of the structure 103 is semi-cured by heating or irradiating with ultraviolet rays, and then completely adhered and cured by heating or irradiating with ultraviolet rays again in the bonding step. .
- the cured state includes a semi-cured state where the curing is not complete, and the cured state of the first adhesive layer 105 in the electrophoretic ink filling step is a semi-cured state, and further in the bonding step.
- One adhesive layer 105 is cured.
- the structure 103 having the first adhesive layer 105 formed on the upper surface is brought into contact with the second electrode substrate 200 and then peeled off, whereby the structure 103 is formed on the surface of the second electrode substrate 200. It is possible to easily form the second adhesive layer 203 that has substantially the same pattern as the pattern shape of the upper surface and is made of the same material.
- the pattern shape on the upper surface of the structure 103 is substantially the same as the pattern shape on the second electrode substrate 200 so as to correspond to the pattern shape on the upper surface of the structure 103, as shown in FIGS. 9A to 9C.
- 9A and 9B are cross-sectional views
- FIG. 9B is a plan view of the second electrode substrate 200
- FIG. 9C is a plan view of the first electrode substrate 100.
- the electrophoretic ink 108 is filled into the cells 104 formed on the first electrode substrate 100 (FIG. 8A). Note that the materials and the like described in the above embodiment can be applied to methods, materials, and the like applied to the electrophoretic ink.
- the first electrode substrate 100 and the second electrode substrate 200 are arranged to face each other, and the top surface of the structure body 103 and the second electrode substrate 200 are interposed through the first adhesive layer 105 and the second adhesive layer 203.
- the electrophoretic ink 108 is sealed in the cell 104 (see FIG. 8B). Note that when the first electrode substrate 100 and the second electrode substrate 200 are disposed to face each other, the upper surface pattern of the structure 103 and the pattern of the second adhesive layer 203 formed on the second electrode substrate 200 are overlapped. Align so that
- the adhesive layer 105 provided on the upper surface of the structure 103 and the second adhesive layer 203 provided on the second electrode substrate 200 are bonded to each other, Since the adhesive layer is formed, the adhesive force can be improved as compared with the case where the adhesive layer is provided only on the upper surface of the structure 103 or one side of the second electrode substrate 200.
- the adhesive layer is formed on the surfaces of the second electrode substrate 200 and the structure 103 that are adherends in advance, the surfactant in the electrophoretic particles and the electrophoretic ink 108 is used. And the like, and a decrease in adhesive force can be suppressed.
- electrophoretic particles or a surfactant in the electrophoretic ink 108 may be interposed between the first adhesive layer 105 and the second adhesive layer 203.
- the first adhesive layer 105 and the second adhesive layer 203 are softer than the second electrode substrate 200 and the structure 103, and in the bonding process, the respective adhesive layers are deformed, mixed, or By compatibility, sufficient wetting, securing of a contact area, and an anchor effect can be expected.
- the second adhesive layer 203 formed on the second electrode substrate 200 is obtained by transferring a part of the first adhesive layer 105 formed on the upper surface of the structure 103, that is, the first adhesive layer
- the adhesive layer 105 and the second adhesive layer 203 are made of the same material and have substantially the same pattern shape. Thereby, the adhesiveness of the 1st adhesive bond layer 105 and the 2nd adhesive bond layer 203 can be improved. Furthermore, since it is possible to reduce the formation of an adhesive layer on the surfaces of the first electrode substrate 100 and the second electrode substrate 200 in a region other than the region overlapping with the structure body 103, the second electrode substrate 200 is entirely covered with the second electrode substrate 200. Compared with the structure in which the second adhesive layer 203 is formed, the display contrast is prevented from being lowered by applying a desired voltage to the electrophoretic ink during driving, and is lower in order to exhibit the desired display contrast.
- the driving voltage can be set.
- the upper surface of the structure can be obtained without impairing display performance. It has been found that the second electrode substrate can be firmly bonded (the second embodiment). Further, the adhesive layer formed on the upper surface of the structure is brought into contact with the upper surface of the second electrode substrate, and a part of the adhesive layer formed on the upper surface of the structure is placed on the surface of the second electrode substrate. It has been found that, by transferring, variation in the pattern shape of the adhesive layer formed on both electrode substrates can be suppressed and the complexity of the process can be reduced (the above-described third embodiment).
- an adhesive layer having an approximate shape is formed on each opposing electrode substrate, and the adhesive layers formed on both electrode substrates are bonded together with high accuracy.
- a method of manufacturing an electrophoretic display device that does not require complicated positioning using a positioning device such as an image detection device and can simplify the bonding process will be described.
- the inventor forms a part of the adhesive layer formed on the upper surface of the structure on the first electrode substrate on the upper surface of the structure in the step of forming the adhesive layer on both the substrates and bonding them together. It has been found that an adhesive layer having a pattern shape substantially the same as the structure can be easily formed on the surface of the second electrode substrate by using a method in which the second electrode substrate is brought into contact and peeled and transferred. Further, with a part of the first electrode substrate and the second electrode substrate being fixed, transfer of the adhesive layer, filling of the electrophoretic ink, and bonding of the first electrode substrate and the second electrode substrate are performed. Thus, it has been found that in the bonding step after filling with the electrophoretic ink, the upper surface of the structure and the adhesive layer formed on the second electrode substrate can be aligned easily and accurately.
- the method for manufacturing an electrophoretic display device shown in the fourth embodiment includes a step of forming a plurality of cells formed of an insulating structure standing on a first electrode substrate, and an upper surface of the structure. Forming the first adhesive layer; contacting the second electrode substrate with the upper surface of the structure on which the first adhesive layer is formed; then, a part of the first electrode substrate and the second electrode substrate. The step of fixing a part of the electrode substrate and the non-fixed portion of the second electrode substrate are peeled off from the upper surface of the structure body, whereby a part of the first adhesive layer formed on the upper surface of the structure body is second.
- the cell is filled with the electrophoretic ink, and the first electrode layer is bonded to the first adhesive layer by bonding the first adhesive layer and the second adhesive layer. And a step of bonding the plate and the second electrode substrate.
- the fourth embodiment even when an adhesive layer having an approximate shape is formed on the opposing electrode substrates, and the adhesive layers formed on both electrode substrates are bonded to each other, the image is bonded. Bonding can be performed with high accuracy without performing complicated positioning using a positioning device such as a detection device, and the bonding process can be simplified. Below, each process is demonstrated concretely with reference to drawings.
- ⁇ Cell formation process> In the cell formation step, a plurality of small rooms (cells 104) made of an insulating structure 103 standing on the first electrode substrate 100 are formed (see FIG. 10A).
- the first electrode substrate 100 may be a substrate having an electrode.
- the first electrode substrate 100 has a structure in which a first electrode layer 102 is provided on a first base 101 as shown in FIG.
- An insulating structure 103 can be formed over the layer 102. Note that the materials, manufacturing methods, and the like described in Embodiment Mode 1 can be applied to materials, manufacturing methods, and the like applied to the first base material 101, the first electrode layer 102, and the structure body 103.
- First adhesive layer forming step In the first adhesive layer forming step, the first adhesive layer 105 is formed on the upper surface of the structure 103 (see FIG. 10B). Note that the material, the manufacturing method, and the like described in Embodiment Mode 2 can be applied to the material, the manufacturing method, and the like applied to the first adhesive layer 105.
- the first adhesive layer 105 is in a softened state.
- the second electrode is formed after the first adhesive layer 105 is formed on the upper surface of the structure 103 and then cooled and fixed. What is necessary is just to make it contact with the board
- FIG. In the case where the first adhesive layer 105 is in a fixed state, the first adhesive layer 105 is heated or melted or softened before being brought into contact with the second electrode substrate 200. The second electrode substrate 200 may be contacted.
- the first adhesive layer 105 is formed on the upper surface of the structure 103 and then heated or irradiated with ultraviolet rays.
- the second electrode substrate 200 may be contacted before being cured.
- a fixing region forming step for selectively forming a photocurable adhesive in a region to be a fixing portion is provided, and in the first bonding step, the fixing region forming step is performed.
- the first electrode substrate 100 and the second electrode substrate 200 can be selectively fixed by irradiating the photocurable adhesive thus applied with ultraviolet rays.
- a thermoplastic adhesive is used as the first adhesive layer 105
- the first electrode substrate 100 and the second electrode substrate 200 are formed after forming the thermoplastic adhesive on the upper surface of the structure 103 as described above.
- a photo-curing adhesive is selectively formed in a region to be one or both of the fixing portions, and then the second electrode substrate 200 is brought into contact with the upper surface of the structure 103. Subsequently, a part of the first electrode substrate 100 and the second electrode substrate 200 is obtained by irradiating the photocurable adhesive formed in the region to be the fixing portion with ultraviolet rays to cure the photocurable adhesive. This region can be selectively fixed.
- thermoplastic adhesive is used as the first adhesive layer 105 formed on the structure 103 and a photocurable adhesive is used as the adhesive formed on the fixing portion
- ultraviolet rays are irradiated.
- the photo-curable adhesive can be selectively cured without curing the thermoplastic adhesive, so that the position of the fixing portion can be controlled with high accuracy.
- first electrode substrate 100 and the second electrode substrate 200 can be fixed.
- staples staples
- the first electrode substrate 100 and the second electrode substrate 200 are formed using the above materials. A part of can be fixed.
- the location where the fixing portion is formed is not particularly limited, but it is preferably provided at the end of the first electrode substrate 100 (second electrode substrate 200) in consideration of the electrophoretic ink filling step to be performed later.
- the first electrode substrate 100 and the second electrode substrate 200 are rectangular, a fixing portion is formed along one end portion of each substrate.
- the adhering portion may be removed after a subsequent process (for example, a second bonding process).
- a subsequent process for example, a second bonding process.
- the second electrode substrate 200 may be formed of a substrate provided with electrodes.
- the second electrode layer 202 may be provided on the second base material 201. Note that the materials and the like described in Embodiment Mode 1 can be applied to the materials and the like applied to the second electrode substrate 200.
- At least one of the first electrode substrate 100 and the second electrode substrate 200 is preferably formed using a flexible material. From the viewpoint of filling the cells of the structure 103 of the first electrode substrate 100 with the electrophoretic ink, it is more preferable to form the second electrode substrate 200 using a flexible material.
- ⁇ Second adhesive layer forming step> a portion (non-fixed portion) that is not fixed to the first electrode substrate 100 in the second electrode substrate 200 is peeled off from the first adhesive layer 105. Thereby, a part of the first adhesive layer 105 formed on the upper surface of the structure 103 is transferred to the surface of the second electrode substrate 200. As a result, the second adhesive layer 203 having a pattern shape substantially the same as the upper surface pattern shape of the structure 103 can be formed on the surface of the second electrode substrate 200 (see FIG. 10D).
- the portion to be peeled is heated. It may be in a melted or softened state. As a result, it is possible to perform peeling using a portion that is not heated as a fixed portion.
- the first adhesive layer 105 remaining on the upper surface of the structure 103 by cooling after peeling the second electrode substrate 200 from the structure 103.
- thermosetting adhesive or a photocurable adhesive is used as the first adhesive layer 105
- the first adhesive layer 105 remaining on the upper surface of the structure 103 is semi-cured by heating or irradiating with ultraviolet rays, and then completely adhered and cured by heating or irradiating with ultraviolet rays again in the second bonding step. It is preferable.
- the first adhesive layer 105 in the electrophoretic ink filling step to be performed later is set to be harder than the first adhesive layer 105 in the first bonding step, so that the second electrode substrate 200 is formed.
- the second adhesive layer 203 is satisfactorily formed on the electrophoretic ink, and the inflow of the adhesive into the cells 104 and the first adhesive layer 105 are dissolved in the electrophoretic ink in the electrophoretic ink filling step. This can be suppressed.
- the cured state refers to a state in which the viscosity has increased or a state in which the fluidity has decreased.
- the first adhesive layer 105 in the electrophoresis ink filling step is the first bonded.
- the cured state includes a semi-cured state where the curing is not complete, and the cured state of the first adhesive layer 105 in the electrophoresis ink filling step is a semi-cured state, and the second bonding step. Then, the first adhesive layer 105 is further cured.
- the structure 103 having the first adhesive layer 105 formed on the upper surface is brought into contact with the second electrode substrate 200 and then the non-fixed portion is peeled off in a partially fixed state.
- the second adhesive layer 203 having the same pattern as the pattern shape of the upper surface of the structure 103 and made of the same material can be easily formed on the surface of the second electrode substrate 200.
- the pattern shape on the upper surface of the structure 103 is substantially the same as the pattern shape on the upper surface of the structure 103, as shown in FIGS. 12A to 12C.
- the adhesive layer 203 is formed, and preferably, the center of the width W1 of the first adhesive layer 105 in FIG. 12A and the center of the width W2 of the second adhesive layer 203 coincide with each other. It represents the state.
- FIG. 12A shows a cross-sectional view
- FIG. 12B shows a plan view of the second electrode substrate 200
- FIG. 12C shows a plan view of the first electrode substrate 100.
- the electrophoretic ink filling step the electrophoretic ink 108 is filled into the cells 104 formed on the first electrode substrate 100 (FIG. 11A). In this case, the first electrode substrate 100 and the second electrode substrate 200 are fixed in the fixing portion. Note that the materials and the like described in the above embodiment can be applied to materials and the like applied to the electrophoretic ink.
- the first adhesive layer 105 formed on the upper surface of the structure 103 is cooled and fixed before filling with the electrophoretic ink. Thereby, when the electrophoretic ink is filled, the first adhesive layer 105 can be prevented from flowing into the cell 104.
- ⁇ Second bonding step> the non-fixed portion of the second electrode substrate 200 is brought into contact with the upper surface of the structure body 103 again, and the structure body 103 is interposed through the first adhesive layer 105 and the second adhesive layer 203.
- the electrophoretic ink 108 is sealed in the cell 104 by bonding the upper surface of the electrode and the second electrode substrate 200 (see FIG. 11B).
- the bonding can be performed using the fixing portion as a reference for alignment.
- the fixing portion As a result, even when an adhesive layer having an approximate shape is formed on the opposing electrode substrates, and the adhesive layers formed on both electrode substrates are bonded to each other to perform bonding, positioning of the image detection device or the like is performed.
- the positional deviation between the first adhesive layer 105 and the second adhesive layer 203 can be effectively suppressed without performing complicated positioning using the apparatus.
- the positioning can be simplified by bonding the fixed portion as a reference for alignment, the bonding process can be simplified (high efficiency).
- the adhesive layer is formed on the surfaces of the second electrode substrate 200 and the structure 103, which are adherends, the electrophoretic particles, the surfactant in the electrophoretic ink 108, and the like. Therefore, a decrease in adhesive force can be suppressed.
- electrophoretic particles or a surfactant in the electrophoretic ink 108 may be interposed between the first adhesive layer 105 and the second adhesive layer 203.
- the first adhesive layer 105 and the second adhesive layer 203 are softer than the second electrode substrate 200 and the structure 103, and in the bonding process, the respective adhesive layers are deformed, mixed, or By compatibility, sufficient wetting, securing of a contact area, and an anchor effect can be expected.
- the second adhesive layer 203 formed on the second electrode substrate 200 is obtained by transferring a part of the first adhesive layer 105 formed on the upper surface of the structure 103, that is, the first adhesive layer
- the adhesive layer 105 and the second adhesive layer 203 are made of the same material and have substantially the same pattern shape. Thereby, the adhesiveness between the first adhesive layer 105 and the second adhesive layer 203 is improved, and the region overlapping the structure 103 is formed on the surfaces of the first electrode substrate 100 and the second electrode substrate 200. It can suppress that an adhesive bond layer is formed besides. Thereby, since the electrophoretic ink and the electrode are formed without using the adhesive, the driving voltage can be reduced as compared with the configuration in which the electrophoretic ink and the electrode are formed through the adhesive. .
- the inventor has examined the bonding of the upper surface of the structure and the electrode substrate.
- the method using a transfer roll increases the use of a coating liquid with higher wettability. It has been found that a situation can occur in which the liquid spreads out of the desired application area. Further, during application, the application liquid may be splashed and the application liquid may be applied to an unintended place.
- the medium and the coating liquid are compatible or the coating liquid elutes in the medium. This can happen.
- the application liquid can be selectively applied to the intended place, particularly in the place where the medium other than the application liquid and the application liquid are in contact, and the adhesion to the adherend is improved.
- a method for producing a substrate with an adhesive layer by an application method that can be applied efficiently in terms of application amount will be described.
- a plurality of cells 104 made of an insulating structure 103 erected on the first electrode substrate 100 are formed (see FIG. 13A).
- the plurality of cells 104 are separated from each other by a standing structure 103 and can be provided in various shapes such as a circle, a rectangle (rectangle, square), and a hexagon.
- the first electrode substrate 100 may be a substrate having electrodes.
- the first electrode substrate 100 can have a structure in which the first electrode layer 102 is provided over the first base material 101.
- the structure body 103 is formed over the first electrode layer 102.
- the materials, manufacturing methods, and the like described in Embodiment Mode 1 can be applied to materials, manufacturing methods, and the like applied to the first base material 101, the first electrode layer 102, and the structure body 103.
- thermoplastic material layer forming step a coating film of a thermoplastic material is formed on the surface of the film-like substrate 110 to form the thermoplastic material layer 111.
- thermoplastic material is preferably a material that is in a liquid state at the stage of application to the surface of the substrate 110 and that only the thermoplastic material remains when the solvent is removed after the coating film is formed.
- an adhesive layer 112 is formed on the upper surface of the structure 103 by a transfer method (see FIG. 13C).
- thermoplastic material layer 111 formed on the surface of the film-like substrate 110 is brought into contact with the upper surface of the structure 103 (see FIGS. 13A and 13B). Then, the thermoplastic material layer 111 and the upper surface of the structure 103 are bonded together while heating so that the temperature of the thermoplastic material layer 111 is equal to or higher than the softening point.
- thermoplastic material layer 111 is heated by selectively heating the first electrode substrate 100 side. Therefore, the thermoplastic material layer 111 becomes a thermoplastic material layer 111a in which a portion close to the first electrode substrate 100 has reached the softening point, and a portion in which the thermoplastic material layer 111 is away from the first electrode substrate 100 does not reach the softening point.
- the material layer 111b is formed (see FIG. 14A). Since the portion of the thermoplastic material layer 111 that is in contact with the structure body 103 becomes the thermoplastic material layer 111a that has reached the softening point, the adhesion of the thermoplastic material layer 111 to the structure body 103 can be increased.
- the timing of softening the thermoplastic material layer 111 may be after the solidified thermoplastic material layer 111 is brought into contact with the upper surface of the structure 103, or the thermoplastic material layer 111 may be structured. It may be before contacting the upper surface of 103. However, since the layer thickness of the thermoplastic material layer 111 may be disturbed at the standby position, it is preferably softened immediately before contact or after contact.
- a load may be applied from the outside of the base material 110 so as to press the structure 103 and the thermoplastic material layer 111.
- a load can be applied from the outside by pressing the base 110 and the first electrode substrate 100 with a roller-shaped pressing body so that the thermoplastic material layer 111 and the upper surface of the structure 103 are in contact with each other.
- the adhesion between the structure 103 and the thermoplastic material layer 111 can be increased.
- the base material 110 is peeled off from the upper surface of the structure body 103, whereby a part of the thermoplastic material layer 111 is transferred to the upper surface of the structure body 103, and an adhesive layer 112 is formed on the upper surface of the structure body 103 ( (See FIG. 13C).
- the thermoplastic material layer 111 is heated to a temperature equal to or higher than the softening point of the thermoplastic material.
- thermoplastic material layer 111 is heated by selectively heating the substrate 110 side. Therefore, the thermoplastic material layer 111 becomes the thermoplastic material layer 111a in which the part close to the base material 110 has reached the softening point, and the thermoplastic material layer 111b in which the part away from the base material 110 does not reach the softening point ( 14B). Since the portion of the thermoplastic material layer 111 that is in contact with the structure body 103 becomes the thermoplastic material layer 111b that does not reach the softening point, the transfer amount of the thermoplastic material layer 111 to the structure body 103 can be increased. As the amount of the thermoplastic material layer 111 transferred to the structure 103 increases, the thickness of the adhesive layer 112 increases, and the adhesive strength increases accordingly.
- the amount of the thermoplastic material layer 111 transferred to the structure 103 can be increased by raising the temperature of the base 110 higher than that of the first electrode substrate 100. Since the base material 110 is selectively heated, the temperature is usually higher than that of the first electrode substrate 100. Further, the first electrode substrate 100 may be selectively cooled to make a temperature difference.
- the adhesive transfer step by transferring the thermoplastic material using a thermal laminating apparatus or the like, it is possible to suppress misalignment of the adhesive layer 112 and improve productivity. .
- FIG. 15 is a schematic diagram showing the relationship between the transfer amount of the thermoplastic material layer 111 to the structure 103 and the adhesive layer 112 formed on the upper surface of the structure 103.
- FIG. 15A shows the adhesive layer 112 when the thermoplastic material layer 111 is transferred so as to cover the entire top surface of the structure 103.
- FIG. 15B shows the adhesive layer 112 when the amount of the thermoplastic material layer 111 transferred to the structure 103 is small compared to the case shown in FIG. 15A. If the adhesive layer 112 covers at least 1 ⁇ 4 of the entire area of the upper surface of the structure 103, the adhesive layer 112 can function as the adhesive layer 112. In this case, the adhesive layer 112 having good adhesion to the structure can be formed with a small amount of the thermoplastic material layer 111.
- FIG. 15C shows the adhesive layer 112 when the amount of the thermoplastic material layer 111 transferred to the structure 103 is larger than in the case shown in FIG. 15A.
- the adhesive layer 112 can exhibit the function as the adhesive layer 112 as long as the adhesive width d2 is shorter than twice the structure width d1, that is, the relationship d2 ⁇ d1 ⁇ 2 is satisfied. . In this case, the adhesive force of the adhesive layer 112 can be further improved.
- the adhesive layer 112 formed on the upper surface of the structure 103 needs to be solidified before the electrophoretic ink 108 is filled into the cells 104.
- the adhesive layer 112 may be cooled after the adhesive transfer step. As described above, by solidifying the adhesive layer 112 before filling the electrophoretic ink 108, even when the electrophoretic ink 108 touches the adhesive layer 112, the adhesive layer is included in the electrophoretic ink 108. It can suppress that 112 begins to melt
- the timing of solidifying the adhesive layer 112 is after the substrate 110 is peeled off from the upper surface of the structure 103 in the adhesive transfer step and before the electrophoretic ink 108 is filled in the electrophoretic ink filling step.
- the first electrode substrate 100 and the second electrode substrate 200 are disposed to face each other, and the upper surface of the structure 103 and the second electrode substrate 200 are bonded via the adhesive layer 112. Then, the electrophoretic ink 108 is sealed in the cell 104 (see FIG. 16B). At this time, the adhesive layer 112 is softened to a state where it can be bonded by heat treatment, and then bonded to the second electrode substrate 200. That is, the adhesive layer 112 once solidified before the electrophoresis ink filling process is softened again.
- the temperature of the adhesive layer 112 is set to a temperature equal to or higher than the softening point, and a roller-like pressing is performed.
- the adhesive layer 112 may be cooled and solidified after the first electrode substrate 100 and the second electrode substrate 200 are pressed and bonded together (after thermocompression bonding) with a body.
- the second electrode substrate 200 may be formed of a substrate provided with electrodes.
- a structure in which the second electrode layer 202 is provided over the second base material 201 can be employed.
- the second base 201 may be formed using any one of the materials shown in the description of the first base 101.
- the second electrode layer 202 may be formed using any of the materials described in the description of the first electrode layer 102.
- the second electrode substrate 200 is the front electrode substrate, the display of characters and the like formed from the electrophoretic ink is visually recognized through the second electrode substrate 200. Therefore, the second base 201 and the second electrode layer 202 are preferably formed using a light-transmitting material.
- the temperature (T2) for softening the adhesive layer 112 is preferably lower than the boiling point (T3) of the electrophoretic ink 108 (T3> T2). This is because when the temperature equal to or higher than the boiling point of the electrophoretic ink 108 is applied to the adhesive layer 112, the electrophoretic ink 108 volatilizes and decreases in volume. Therefore, it is preferable to select each material so that the softening point of the thermoplastic material layer 111 is smaller than the boiling point of the electrophoretic ink 108.
- the temperature (T2) for softening the adhesive layer 112 is lower than the temperature (T1) for softening the thermoplastic material layer 111 to a transferable state in the adhesive transfer step (T1> T2). Is preferred.
- the adhesive transfer step it is preferable to apply a high temperature (T1) in order to sufficiently dissolve the thermoplastic material layer 111 and peel it from the base material 110, while in the substrate bonding step. This is because, since the shape of the adhesive layer 112 is required to be maintained, it is necessary to soften the adhesive layer 112 at a temperature (T2) at which the adhesive layer 112 is not melted.
- the wettability between the structure body 103 and the thermoplastic material layer 111 is greater than the wettability between the base material 110 and the thermoplastic material layer 111 in order to improve the transfer reliability. That is, the contact angle ( ⁇ 1 ) at the interface between the structure 103 and the thermoplastic material layer 111 is equal to or less than the contact angle ( ⁇ 2 ) at the interface between the substrate 110 and the thermoplastic material layer 111 ( ⁇ 1 ⁇ ⁇ 2 ). Thus, it is preferable to select each material.
- Examples 1 to 5 performed for clarifying the effects of the present invention will be described. However, the present invention is not limited to the method of this example. Each of Examples 1 to 5 corresponds to the configuration of Embodiments 1 to 5, respectively. [Example 1]
- Example 1 will be described below. Here, an electrophoretic display device was manufactured and evaluated by the following method.
- thermoplastic adhesive hot melt resin manufactured by Toagosei Co., Ltd.
- ⁇ Cell formation process> an acrylate-based resist film having a thickness of 40 ⁇ m was bonded to a first electrode substrate (PET film on which an ITO film was formed as a transparent electrode) with a laminator, and then a structure was formed by a photoresist method.
- thermoplastic adhesive layer transfer process Next, the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a 125 ° C. thermal laminator, and a part of the thermoplastic adhesive layer is placed on the upper surface of the structure. Transcribed to. The average thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 7 ⁇ m, and no protrusion or outflow to any part other than the structure was observed.
- Electrophoresis ink white particles (lipophilic surface-treated titanium oxide, negatively charged)
- black particles ink composed of acrylic particles colored with carbon black (positively charged)
- normal dodecane normal dodecane
- an ultraviolet curable adhesive serving as a main seal (peripheral part sealant) of the electrophoretic display device was applied to the outer periphery of the part (cell forming part) filled with the electrophoretic ink.
- the electrophoretic display device manufactured by the method of the example can efficiently form the adhesive layer selectively only on the upper surface of the structure, and damage to the electrophoretic ink during the manufacture of the display device. As a result, the electrophoretic display device showed good display properties. Furthermore, the compatibility / mixing of the electrophoretic ink and the adhesive could be suppressed, and the electrophoretic display device had good durability. [Example 2]
- Example 2 will be described below.
- electrophoretic display devices were manufactured and evaluated by the methods shown in the following examples, comparative examples, and reference examples, respectively.
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- thermoplastic adhesive layer forming step The thermoplastic adhesive diluted with the above solvent was applied to the second electrode substrate (ITO-PET film) and dried using a screen printing method so as to match the honeycomb-shaped pattern of the structure.
- the film thickness after drying was 3 ⁇ m.
- the electrophoretic ink (white particles (lipophilic surface-treated titanium oxide) is applied to the first electrode substrate using a die coater. , Negatively charged), black particles (acrylic particles colored with carbon black (positively charged), ink composed of normal dodecane (boiling point 216 ° C.)) to apply electrophoretic ink to the cell composed of the structure. Filled.
- a main seal portion was formed using an ultraviolet curable adhesive on the outer periphery of the portion to which the electrophoresis ink was applied (cell forming portion).
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- a main seal portion was formed using an ultraviolet curable adhesive on the outer periphery of the portion to which the electrophoresis ink was applied (cell forming portion).
- the first electrode substrate coated with the electrophoretic ink and the second electrode substrate are bonded again through a thermal laminator, and then the main seal portion formed on the outer periphery of the cell forming portion is irradiated with ultraviolet rays to be cured by ultraviolet rays.
- An electrophoretic display panel was produced by curing the mold adhesive.
- the comparative example is different from the above example in that a thermoplastic adhesive layer is formed only on the upper surface of the structure (no adhesive layer is formed on the second electrode substrate).
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- thermoplastic adhesive diluted with the above solvent was applied and dried on a second electrode substrate (ITO-PET film) using a spin coater so that the film thickness after drying was 1 ⁇ m.
- the electrophoretic ink (white particles (lipophilic surface-treated titanium oxide) is applied to the first electrode substrate using a die coater. , Negatively charged), black particles (acrylic particles colored with carbon black (positively charged), ink composed of normal dodecane (boiling point 216 ° C.)) to apply electrophoretic ink to the cell composed of the structure. Filled.
- a main seal portion was formed using an ultraviolet curable adhesive on the outer periphery of the portion to which the electrophoresis ink was applied (cell forming portion).
- the reference example is different from the above example in that the second adhesive layer is formed on the entire surface of the second electrode substrate.
- Adhesive strength evaluation> A structure (example) in which an adhesive is formed and bonded to both the upper surface of the structure and the surface of the second electrode substrate (formed substantially the same as the pattern shape of the upper surface of the structure), and the upper surface of the structure Adhesive strength of a structure in which only an adhesive is formed and bonded (comparative example) and a structure in which an adhesive is formed and bonded to both the upper surface of the structure and the surface of the second electrode substrate (reference example) Evaluated.
- the evaluation of the adhesive force was performed in the example (the structure on which the first adhesive layer was formed, and the second electrode substrate on which the second adhesive layer was formed substantially the same as the pattern shape on the upper surface of the structure).
- the comparative example (the structure in which the first adhesive layer is formed and the second electrode substrate (without the adhesive layer)) and the reference example (the structure in which the first adhesive layer is formed and the second In the configuration used in the second electrode substrate on which the adhesive layer is formed), (a) a state in which no inclusion is present, (b) a state in which dodecane as a solvent is interposed, and (c) an electrophoretic ink is interposed.
- the adhesive strength was measured by bonding in three states.
- the electrophoretic ink used was that used in the examples and comparative examples.
- the measurement was performed according to the conditions of JIS K6854 “180 ° T-type peel test”. Specifically, the peeling rate was 50 mm / s, the peeling distance was 70 mm, and 10 mm front and back were excluded from the data. The results are shown in Table 1.
- the reflectance was measured using a spectrocolorimeter [SC-T (P), manufactured by Suga Test Instruments Co., Ltd.]. Measurement conditions were set as follows. Optical conditions: Diffuse illumination 8 ° light reception d8 method (excluding regular reflection) Light source: 12V50W halogen lamp Color measurement condition: D65 light 10 ° Field of view Measurement area: 5 ⁇
- the example in which the adhesive layer is formed on both the upper surface of the structure formed on the first electrode substrate and the second electrode substrate is the structure formed on the first electrode substrate. It was found that a higher adhesive force was obtained than in the comparative example in which the adhesive layer was formed only on the upper surface of the film. Further, from Table 2, in the display device in which the adhesive layer is formed only on the upper surface of the structure formed on the first electrode substrate as in the comparative example, the adhesion between the structure and the electrode substrate is insufficient due to insufficient adhesion. A gap was generated and the movement of particles occurred, whereas in the examples, no movement of particles occurred.
- the second adhesive layer that is substantially the same as the pattern shape of the upper surface of the structure is formed on the second electrode substrate, whereas in the reference example, the second adhesive layer is the second adhesive layer. This is because the second adhesive layer is formed on the entire surface of the electrode substrate. That is, in the reference example, the display property is deteriorated because the second adhesive layer covers the electrode surface, whereas in the example, the second adhesive layer is applied only to a portion corresponding to the structure. Therefore, it can be said that good display can be maintained without degrading the display property. [Example 3]
- Example 3 will be described below. Here, electrophoretic display devices were manufactured and evaluated by the methods shown in the following examples, comparative examples, and reference examples, respectively.
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- thermoplastic adhesive layer forming step After the second electrode substrate is brought into contact with the upper surface of the structure having the thermoplastic adhesive layer formed on the surface, the second electrode substrate is passed through a thermal laminator at 120 ° C. and peeled off in a heated state to thereby remove the upper surface of the structure. A part of the thermoplastic adhesive layer formed on was transferred to the surface of the second electrode substrate.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 3 to 6 ⁇ m, and the film thickness of the thermoplastic adhesive layer formed on the surface of the second electrode substrate was 1 to 4 ⁇ m.
- the electrophoretic ink (white particles (lipophilic surface-treated titanium oxide) is applied to the first electrode substrate using a die coater. , Negatively charged), black particles (acrylic particles colored with carbon black (positively charged), ink composed of normal dodecane (boiling point 216 ° C.)) to apply electrophoretic ink to the cell composed of the structure. Filled.
- a main seal portion was formed using an ultraviolet curable adhesive on the outer periphery of the portion to which the electrophoresis ink was applied (cell forming portion).
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- thermoplastic adhesive formed on the upper surface of the structure and the second electrode substrate After cooling the thermoplastic adhesive formed on the upper surface of the structure and the second electrode substrate, by applying electrophoretic ink (same as the example) to the first electrode substrate using a die coater, The cell made of the structure was filled with electrophoretic ink.
- the first electrode substrate coated with the electrophoretic ink and the second electrode substrate are bonded again through a thermal laminator, and then the main seal portion formed on the outer periphery of the cell forming portion is irradiated with ultraviolet rays to be cured by ultraviolet rays.
- An electrophoretic display panel was produced by curing the mold adhesive.
- the comparative example is different from the above example in that a thermoplastic adhesive layer is formed only on the upper surface of the structure (no adhesive layer is formed on the second electrode substrate).
- thermoplastic adhesive diluted with the above solvent was applied and dried on a second electrode substrate (ITO-PET film) using a spin coater so that the film thickness after drying was 1 ⁇ m.
- the electrophoretic ink (white particles (lipophilic surface-treated titanium oxide) is applied to the first electrode substrate using a die coater. , Negatively charged), black particles (acrylic particles colored with carbon black (positively charged), ink composed of normal dodecane (boiling point 216 ° C.)) to apply electrophoretic ink to the cell composed of the structure. Filled.
- the reference example is different from the above example in that the second adhesive layer is formed on the entire surface of the second electrode substrate.
- Optical conditions Diffuse illumination 8 ° light reception d8 method (* excluding regular reflection)
- Light source 12V / 50W halogen lamp
- Color measurement condition D65 10 ° field of view
- Measurement area ⁇ 15
- Operation Measured after standing 100 times on a desk in parallel with the tabletop and driving 100 times.
- ⁇ Judgment method> Based on adhesive force and visual observation, it determined as follows. ⁇ : The entire surface is in good contact (adhesive strength of 0.5 N / 25 mm or more, and there are traces of adhesion on the entire surface) ⁇ : Adhesive strength is weak but in close contact (adhesive strength 0.5 N / 25 mm or less) ⁇ : Not in close contact (adhesion cannot be measured, and there is a large break in the trace of the bonded part)
- Table 3 shows the results of evaluations 1 to 3 above.
- the second adhesive layer that is substantially the same as the pattern shape of the upper surface of the structure is formed on the second electrode substrate, whereas in the reference example, the second adhesive layer is the second adhesive layer. This is considered due to the fact that the second adhesive layer is formed on the entire surface of the electrode substrate. That is, in the reference example, the display property is deteriorated because the second adhesive layer covers the electrode surface, whereas in the example, the second adhesive layer is applied only to a portion corresponding to the structure. Therefore, it can be said that good display can be maintained without degrading the display property. [Example 4]
- Example 4 will be described below. Here, an electrophoretic display device was manufactured and evaluated by the following method.
- thermoplastic adhesive hot melt resin
- a solvent diluted with a solvent
- the PET film on which the thermoplastic adhesive layer is formed and the first electrode substrate on which the structure is formed are passed through a thermal laminator at 120 ° C. and peeled off in a heated state, whereby PET A part of the thermoplastic adhesive layer formed on the film was transferred to the upper surface of the structure.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 6 to 8 ⁇ m.
- ⁇ Fixed area forming step> A structure was formed, and an ultraviolet curable adhesive was applied to one end of the first substrate on which the thermoplastic adhesive layer was formed on the surface of the structure. .
- a second electrode substrate (ITO-PET film) was brought into contact with the upper surface of the structure formed on the first electrode substrate. Subsequently, one end of the first substrate was irradiated with ultraviolet rays, thereby fixing one end of the first electrode substrate and the second electrode substrate.
- ⁇ Second adhesive layer forming step> The first electrode substrate having the structure on which the thermoplastic adhesive layer is formed and the second electrode substrate in contact with the upper surface of the structure are passed through a thermal laminator at 120 ° C., and are not fixed in a heated state. Part of the thermoplastic adhesive layer formed on the upper surface of the structure was transferred to the surface of the second electrode substrate by peeling off the part.
- the film thickness of the thermoplastic adhesive layer formed on the upper surface of the structure was 3 to 6 ⁇ m, and the film thickness of the thermoplastic adhesive layer formed on the surface of the second electrode substrate was 1 to 4 ⁇ m.
- the electrophoretic ink (white particles (lipophilic surface-treated titanium oxide) is applied to the first electrode substrate using a die coater. , Negatively charged), black particles (acrylic particles colored with carbon black (positively charged), ink composed of normal dodecane (boiling point 216 ° C.)) to apply electrophoretic ink to the cell composed of the structure. Filled.
- a main seal portion was formed using an ultraviolet curable adhesive on the outer periphery of the portion (cell forming portion) to which the electrophoretic ink was applied, except for the fixed portion.
- the thermal laminator After aligning the first electrode substrate and the second electrode substrate coated with the electrophoretic ink on the basis of the fixing portion so that the first adhesive layer and the second adhesive layer are aligned, the thermal laminator is used as a reference.
- the electrophoretic display panel was manufactured by irradiating the main seal portion formed on the outer periphery of the cell forming portion with ultraviolet rays to cure the ultraviolet curable adhesive.
- an adhesive layer having an approximate shape is formed on each opposing electrode substrate with high accuracy (with reduced pattern variations).
- An adhesive layer could be easily formed.
- a positioning device such as an image detection device can be provided by using the fixing portion as a reference for alignment. Without the complicated positioning used, it was possible to effectively suppress the positional deviation between the first adhesive layer and the second adhesive layer and perform bonding with high accuracy. Furthermore, by bonding the fixed portion as a reference for alignment, it is possible to simplify the positioning, and it is possible to achieve simplification (high efficiency) of the bonding process.
- Example 5 an electrophoretic display device was manufactured by the method shown in the following examples.
- thermoplastic material layer forming step Using a comma roll, a thermoplastic material (hot melt resin) diluted with a solvent was applied on a substrate (PET film with a release agent) to a film thickness of 12 ⁇ m and then dried.
- thermoplastic material layer on the surface of the base material was brought into contact with the upper surface of the structure provided on the surface of the first electrode substrate.
- ⁇ Adhesive transfer process> The first electrode substrate and the base material are passed through a 120-degree thermal laminator, and the base material is peeled off in a heated state, whereby a part of the thermoplastic material layer formed on the base material surface is removed from the structure body. Transferred to the upper surface.
- the thickness of the adhesive layer transferred to the upper surface of the structure was about 6 to 8 ⁇ m.
- thermoplastic material formed on the upper surface of the structure was cured, the electrophoresis ink was applied to the ITO-PET film using a die coater, thereby filling the cells made of the structure with the electrophoresis ink. .
- the thermoplastic material formed on the upper surface of the structure remained without being dissolved or discharged.
- an ultraviolet curable adhesive was formed on the outer periphery of the portion to which the electrophoretic ink was applied (cell forming portion).
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Abstract
Description
第1の実施の形態では、構造体の上面だけに選択的に接着剤層を効率よく形成するとともに、電気泳動インクと接着剤との相溶・混合を抑制することができ、さらに電気泳動表示装置製造時の電気泳動インクへのダメージを抑制することができる製造方法について説明する。
セル形成工程では、第1の電極基板100上に立設した絶縁性の構造体103からなる複数のセル(小部屋)104を形成する(図1A参照)。複数のセル104は、立設した構造体103によりそれぞれ分離されており、電極基板面に対して垂直方向から見た場合の形状は、円形、矩形(長方形、正方形)、六角形等の様々な形で設けることができる。また、構造体103は、「リブ」又は「スペーサー」と呼ばれることがある。
接着剤層転写工程では、表面に熱可塑性接着剤層206が形成されたフィルム基材205から、熱可塑性接着剤層206を構造体103の上面に転写して熱可塑性接着剤層107を形成する。構造体103の上面に熱可塑性接着剤層107を選択的に形成するには、表面に熱可塑性接着剤層206が形成されたフィルム基材205を構造体103の上面に接触させた状態で加熱し、熱可塑性接着剤を軟化させた状態で剥がして構造体103の上面に熱可塑性接着剤層107を転写形成すればよい(図1B、図1C参照)。
電気泳動インク充填工程では、第1の電極基板100上に形成されたセル104に、電気泳動インク108を充填する(図1D参照)。なお、電気泳動インク108をセル104に充填する前に、構造体103の上面に形成された熱可塑性接着剤層107が構造体103の天面から流れ出さない程度の硬さとなるように自然冷却・強制冷却する(以下、固定化という。)。例えば、接着剤転写工程後に、構造体103の上面に形成された熱可塑性接着剤層107を室温程度のドライエアーを当てるなどして冷却すればよい。
基板貼り合わせ工程では、第1の電極基板100と第2の電極基板200を対向配置させて、構造体103の上面に形成された熱可塑性接着剤層107と第2の電極基板200を接着させることにより電気泳動インク108をセル104に封止する(図1E参照)。この際、加熱処理を行うことにより構造体103の上面に形成された熱可塑性接着剤層107を接着可能な状態まで軟化させて、第2の電極基板200に接着させる。つまり、電気泳動インク充填工程の前に一度固定化させた熱可塑性接着剤層107を再度軟化させる。
次に、本発明の第2の実施の形態について説明する。
セル形成工程では、第1の電極基板100上に立設した絶縁性の構造体103からなる複数の小部屋(セル104)を形成する(図4A参照)。
第1の接着剤層形成工程では、構造体103の上面に第1の接着剤層105を形成する(図4B参照)。
電気泳動インクの充填工程では、第1の電極基板100上に形成されたセル104に、電気泳動インク108を充填する(図4C)。充填する方法としては、例えば、ダイコーターなどによるコーティングや、スクリーン印刷などを用いた印刷法、あるいはインクジェットやディスペンサーによる充填など、セル内にインクを充填することが可能な方法であれば、各種方法を用いることができる。なお、電気泳動インクに適用する材料等については、上記実施の形態1で説明した材料等を適用することができる。
第2の接着剤層形成工程では、第2の電極基板200の表面に、構造体の上面のパターン形状と略同一である第2の接着剤層203を形成する(図4D参照)。
貼り合わせ工程では、第1の電極基板100と第2の電極基板200を対向配置させて、第1の接着剤層105と第2の接着剤層203を介して構造体103の上面と第2の電極基板200を接着させることにより、電気泳動インク108をセル104に封止する(図4E参照)。
次に、本発明の第3の実施の形態について説明する。
セル形成工程では、第1の電極基板100上に立設した絶縁性の構造体103からなる複数の小部屋(セル104)を形成する(図7A参照)。
第1の接着剤層形成工程では、構造体103の上面に第1の接着剤層105を形成する(図7B参照)。なお、第1の接着剤層105に適用する材料、製造方法等については、上記実施の形態2で説明した材料、製造方法等を適用することができる。
次に、表面に第1の接着剤層105が形成された構造体103の上面に第2の電極基板200を接触させる(図7C参照)。
次に、第2の電極基板200を、構造体103から剥がすことにより、第2の電極基板200の表面に構造体103の上面に形成された第1の接着剤層105の一部を転写する。その結果、第2の電極基板200の表面に、構造体103の上面のパターン形状と略同一パターンを有する第2の接着剤層203を形成することができる(図7D参照)。
電気泳動インクの充填工程では、第1の電極基板100上に形成されたセル104に、電気泳動インク108を充填する(図8A)。なお、電気泳動インクに適用する方法、材料等については、上記実施の形態で説明した材料等を適用することができる。
貼り合わせ工程では、第1の電極基板100と第2の電極基板200を対向配置させて、第1の接着剤層105と第2の接着剤層203を介して構造体103の上面と第2の電極基板200を接着させることにより、電気泳動インク108をセル104に封止する(図8B参照)。なお、第1の電極基板100と第2の電極基板200を対向配置においては、構造体103の上面パターンと第2の電極基板200上に形成された第2の接着剤層203のパターンが重畳するように位置合わせを行う。
次に、本発明の第4の実施の形態について説明する。
セル形成工程では、第1の電極基板100上に立設した絶縁性の構造体103からなる複数の小部屋(セル104)を形成する(図10A参照)。
第1の接着剤層形成工程では、構造体103の上面に第1の接着剤層105を形成する(図10B参照)。なお、第1の接着剤層105に適用する材料、製造方法等については、上記実施の形態2で説明した材料、製造方法等を適用することができる。
次に、表面に第1の接着剤層105が形成された構造体103の上面に第2の電極基板200を接触させる。そして、第1の電極基板100と第2の電極基板200の一部の領域を選択的に固着させる(図10C参照)。
次に、第2の電極基板200において第1の電極基板100に固着されていない部分(非固着部)を、第1の接着剤層105から剥がす。これにより、第2の電極基板200の表面に構造体103の上面に形成された第1の接着剤層105の一部を転写する。その結果、第2の電極基板200の表面に、構造体103の上面パターン形状と略同一のパターン形状を有する第2の接着剤層203を形成することができる(図10D参照)。
電気泳動インクの充填工程では、第1の電極基板100上に形成されたセル104に、電気泳動インク108を充填する(図11A)。この場合、第1の電極基板100と第2の電極基板200は固着部において固着された状態である。なお、電気泳動インクに適用する材料等については、上記実施の形態で説明した材料等を適用することができる。
第2の貼り合わせ工程では、第2の電極基板200の非固着部を再び構造体103の上面に接触させ、第1の接着剤層105と第2の接着剤層203を介して構造体103の上面と第2の電極基板200を接着させることにより、電気泳動インク108をセル104に封止する(図11B参照)。
次に、本発明の第5の実施の形態について説明する。
セル形成工程において、第1の電極基板100上に立設した絶縁性の構造体103からなる複数のセル104を形成する(図13A参照)。複数のセル104は、立設した構造体103によりそれぞれ分離されており、円形、矩形(長方形、正方形)、六角形等のさまざまな形状で設けることができる。
続いて、熱可塑性材料層形成工程において、フィルム状の基材110表面に、熱可塑性材料の塗膜を形成し、熱可塑性材料層111を形成する。
続いて、接着剤転写工程において、転写法によって構造体103の上面に接着剤層112を形成する(図13C参照)。
電気泳動インク充填工程において、第1の電極基板100上に形成された各セル104に、電気泳動インク108を充填する(図16A参照)。電気泳動インク108を充填する方法としては、例えば、ダイコーターなどによるコーティングや、スクリーン印刷などを用いた印刷法、あるいはインクジェットやディスペンサーによる充填などの各種方法を用いることができる。なお、電気泳動インクに適用する材料等については、上記実施の形態1で説明した材料等を適用することができる。
基板貼り合わせ工程では、第1の電極基板100と第2の電極基板200とを対向配置し、接着剤層112を介して構造体103の上面と第2の電極基板200とを接着することにより、電気泳動インク108をセル104に封止する(図16B参照)。このとき、接着剤層112を加熱処理によって接着可能な状態まで軟化させてから、第2の電極基板200に接着させる。つまり、電気泳動インク充填工程の前に一度固化させた接着剤層112を、再度軟化させることになる。
[実施例1]
次に、第1の電極基板(透明電極としてITO膜が形成されたPETフィルム)に、40μm厚のアクリレート系レジストフィルムをラミネーターで貼り合わせた後、フォトレジスト法により構造体を形成した。
次に、熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを125℃の熱ラミネーターに通し、熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は平均7μm厚であり、構造体以外の部分へのはみ出しや流出は見られなかった。
次に、室温まで冷却して構造体の上面に形成された熱可塑性接着剤層を固定化した後、第1の電極基板上の構造体によって形成されたセル内に、ダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより充填した。電気泳動インクを充填した後に構造体の上面を観察したところ、電気泳動インクと熱可塑性接着剤との相溶・混合は見られず、また接着剤の剥がれや流出なども見られなかった。
次に、電気泳動インクが充填された第1の電極基板と第2の電極基板(透明電極としてITO膜が形成されたPETフィルム)とを、第2の電極基板側が80℃となるように加熱したラミネーターに通して貼り合わせた後、メインシールとなる紫外線硬化型接着剤に紫外線を照射して硬化することにより電気泳動表示装置を作製した。
実施例1により作製した電気泳動表示装置の電極間に、+50V及び-50Vの電圧を交互に印加して白黒表示切換を行ったところ、良好な表示が得られた。また、電気泳動表示装置を地面に対して垂直に立てた状態で白黒表示の切り替えを10000回繰り返したが、セル間を電気泳動粒子が移動することによる表示劣化も見られなかった。さらに、電気泳動表示装置を50℃の環境下に3ヶ月静置した後に上記同様の表示切換を行ったところ、表示装置の破壊(基板同士の剥がれ、電気泳動インクの漏れなど)は見られず、初期の状態と変化なく良好な表示を得ることができた。さらにまた、1.5mの高さから電気泳動表示装置を50回落下した場合や、連続微振動を10時間加えた場合でも表示装置の破損は生じなかった。
[実施例2]
<セル形成工程>
第1の電極基板(ITO-PETフィルム)にアクリレート系レジストフィルムを、真空ラミネーターを用いて貼り合わせた後、フォトレジスト法によりハニカム形状のパターンを有する構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
上記溶剤で希釈した熱可塑性接着剤を、構造体のハニカム形状のパターンと一致するようにスクリーン印刷法を用いて第2の電極基板(ITO-PETフィルム)に塗布・乾燥した。乾燥後の膜厚は3μmであった。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを第1の接着剤層と第2の接着剤層が合わさるように位置合わせした後、熱ラミネーターに通して貼り合わせ、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
<セル形成工程>
第1の電極基板(ITO-PETフィルム)に50μm厚のアクリレート系レジストフィルムを真空ラミネーターを用いて貼り合わせた後、フォトレジスト法により構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(実施例と同じ)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを熱ラミネーターに通して再び貼り合わせた後、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
<セル形成工程>
第1の電極基板(ITO-PETフィルム)にアクリレート系レジストフィルムを、真空ラミネーターを用いて貼り合わせた後、フォトレジスト法によりハニカム形状のパターンを有する構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
上記溶剤で希釈した熱可塑性接着剤を、スピンコーターを用いて第2の電極基板(ITO-PETフィルム)に乾燥後の膜厚が1μmとなるように塗布・乾燥した。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを第1の接着剤層と第2の接着剤層が合わさるように位置合わせした後、熱ラミネーターに通して貼り合わせ、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
<接着力評価>
構造体の上面と第2の電極基板の表面(構造体の上面のパターン形状と略同一に形成)の双方に接着剤を形成して貼り合わせた構造(実施例)と、構造体の上面にのみ接着剤を形成して貼り合わせた構造(比較例)と、構造体の上面と第2の電極基板の表面の双方に接着剤を形成して貼り合わせた構造(参考例)について、接着力を評価した。
実施例、比較例および参考例で作製したそれぞれの電気泳動表示パネルを、縦置き(地面に対して垂直に立てた状態)で電気泳動表示パネルの電極間に+50V及び-50Vの電圧を交互に印加して白黒表示切換を10000回行い、初期の反射率と10000回表示切換後の反射率について測定し、粒子の移動(凝集と偏在)については目視で観察した。その結果を表2に示す。
なお、測定条件は下記の通りに設定した。
光学条件:拡散照明8°受光 d8方式(正反射を除く)
光源 :12V50Wハロゲンランプ
測色条件:D65光 10° 視野
測定領域:5φ
[実施例3]
<セル形成工程>
第1の電極基板(ITO-PETフィルム)にアクリレート系レジストフィルムを、真空ラミネーターを用いて貼り合わせた後、フォトレジスト法によりハニカム形状のパターンを有する構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
表面に熱可塑性接着剤層が形成された構造体の上面に第2の電極基板を接触させた後、120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、構造体の上面に形成された熱可塑性接着剤層の一部を第2の電極基板の表面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は3~6μmであり、第2の電極基板の表面に形成された熱可塑性接着剤層の膜厚は1~4μmであった。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを第1の接着剤層と第2の接着剤層が合わさるように位置合わせした後、熱ラミネーターに通して貼り合わせ、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
<セル形成工程>
第1の電極基板(ITO-PETフィルム)に50μm厚のアクリレート系レジストフィルムを真空ラミネーターを用いて貼り合わせた後、フォトレジスト法により構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(実施例と同じ)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを熱ラミネーターに通して再び貼り合わせた後、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
<セル形成工程>
第1の電極基板(ITO-PETフィルム)にアクリレート系レジストフィルムを、真空ラミネーターを用いて貼り合わせた後、フォトレジスト法によりハニカム形状のパターンを有する構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
上記溶剤で希釈した熱可塑性接着剤を、スピンコーターを用いて第2の電極基板(ITO-PETフィルム)に乾燥後の膜厚が1μmとなるように塗布・乾燥した。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを第1の接着剤層と第2の接着剤層が合わさるように位置合わせした後、熱ラミネーターに通して貼り合わせ、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
実施例、比較例および参考例の工程で製造した電気泳動パネルを、それぞれ下記の試験方法にて試験し良否を判定した。
<反射率測定>
反射率の測定は、分光測色計SC-T(P)、スガ試験機社製を用いた。測定条件は下記の通りに設定した。
光源:12V・50Wハロゲンランプ
測色条件:D65 10°視野
測定領域:φ15
動作:机上に、机の天板と並行に静置し、100回駆動後に測定した
コントラスト値(=黒反射率/白反射率)に基づいて下記の通り判定した。
○:良好な表示(コントラスト10以上)
△:動作はするが、良好ではない表示(コントラスト10~2)
×:ほぼ動作しない(コントラスト2以下)
<接着性>
接着性の測定は、電気泳動パネルの一部を幅25mmで裁断し、その一端で、対向する基板をそれぞれ外側に90度曲げた試料を使用して、JIS K6854「180°T型剥離試験」の条件に沿って行った。
接着力および目視に基づいて下記の通り判定した。
○:全面が良好に密着している(接着力0.5N/25mm以上、全面で接着の痕跡がみられる)
△:接着力は弱いが密着している(接着力0.5N/25mm以下)
×:密着していない(接着力測定不可、接着部の痕跡に大きな途切れがある)
<粒子移動抑制>
粒子の移動抑制は、電気泳動パネルを重力方向に対して垂直に立てた状態で1万回以上連続駆動表示させて行った。
表示部内で沈降が見られるかどうかを、目視で観察した結果に基づいて下記の通り判定した。
○:表示部内の全域に沈降が見られない。
△:表示部内の一部に沈降が見られる。
×:表示部内の全域で沈降が見られる。表示が出来ない部分が発生する。
[実施例4]
第1の電極基板(ITO-PETフィルム)に50μm厚アクリレート系レジストフィルムを、真空ラミネーターを用いて貼り合わせた後、フォトレジスト法によりハニカム形状のパターンを有する構造体を形成した。
剥離剤付きPETフィルム上に、溶剤で希釈した熱可塑性接着剤(ホットメルト樹脂)を、コンマロールを用いて膜厚12μm塗布した後に乾燥させた。次に、上記熱可塑性接着剤層が形成されたPETフィルムと、構造体が形成された第1の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま引き剥がすことにより、PETフィルムに形成された熱可塑性接着剤層の一部を構造体の上面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は、6~8μmであった。
構造体が形成され、該構造体の表面に熱可塑性接着剤層が形成された第1の基板の一方の端部(固着部となる領域)に、紫外線硬化型接着剤を塗布して形成した。
第1の電極基板に形成された構造体の上面に、第2の電極基板(ITO-PETフィルム)を接触させた。続いて、前記第1の基板の一方の端部に紫外線を照射することにより、第1の電極基板と第2の電極基板の一端を固着した。
熱可塑性接着剤層が形成された構造体を有する第1の電極基板と、構造体の上面に接触した第2の電極基板とを120℃の熱ラミネーターに通し、熱された状態のまま非固着部を引き剥がすことにより、構造体の上面に形成された熱可塑性接着剤層の一部を第2の電極基板の表面に転写した。構造体の上面に形成された熱可塑性接着剤層の膜厚は3~6μmであり、第2の電極基板の表面に形成された熱可塑性接着剤層の膜厚は1~4μmであった。
構造体の上面及び第2の電極基板上に形成された熱可塑性接着剤を冷却した後、第1の電極基板にダイコーターを用いて電気泳動インク(白粒子(親油性表面処理された酸化チタン、負帯電)、黒粒子(カーボンブラックにより着色されたアクリル粒子(正帯電)、ノルマルドデカン(沸点216℃)から構成されるインク)を塗布することにより、構造体からなるセルに電気泳動インクを充填した。
電気泳動インクが塗布された第1の電極基板と第2の電極基板とを第1の接着剤層と第2の接着剤層が合わさるように固着部を基準として位置合わせした後、熱ラミネーターに通して貼り合わせ、セル形成部の外周に形成したメインシール部に紫外線を照射して紫外線硬化型接着剤を硬化することにより、電気泳動表示パネルを作製した。
[実施例5]
コンマロールを用いて、基材(剥離剤付きPETフィルム)上に、溶剤で希釈した熱可塑性材料(ホットメルト樹脂)を膜厚12μmに塗布した後、乾燥させた。
ラミネーターを用いて、第1の電極基板(ITO-PETフィルム)に、アクリレート系レジストフィルムを貼り合わせた後、フォトレジスト法により構造体を形成した。
第1の電極基板の表面に設けられた構造体の上面に、基材表面の熱可塑性材料層を接触させた。
第1の電極基板および基材を120度の熱ラミネーターに通し、加熱された状態のまま基材を引き剥がすことにより、基材表面に形成された熱可塑性材料層の一部を、構造体の上面に転写した。構造体の上面に転写された接着剤層の膜厚は、約6~8μmであった。
次に、構造体の上面に形成された熱可塑性材料を硬化した後、ITO-PETフィルムにダイコーターを用いて電気泳動インクを塗布することにより、構造体からなるセルに電気泳動インクを充填した。電気泳動インクを塗布した後に、構造体の上面を観察した結果、構造体の上面に形成された熱可塑性材料は相溶・流出せずに残存していることが確認できた。
次に、電気泳動インクが塗布されたITO-PETフィルムと第2の電極基板(FPC基板)とを80℃の熱ラミネーターに通して貼り合わせた後、セル形成部の外周に紫外線を照射して紫外線硬化型接着剤を硬化することにより電気泳動表示パネルを作製できた。
Claims (16)
- 第1の電極基板上に立設した絶縁性の構造体で形成される複数のセルを形成する工程と、
表面に熱可塑性接着剤層が形成されたフィルム基材を前記構造体の上面に接触させた状態で加熱し、前記熱可塑性接着剤層を軟化させた状態で剥がすことにより、前記熱可塑性接着剤層を前記構造体の上面に転写する工程と、
前記セルに電気泳動インクを充填する工程と、
前記熱可塑性接着材層を前記構造体の上面に転写する工程よりも低い温度で加熱しながら、前記構造体の上面と第2の電極基板を接着させる工程と、を有する電気泳動表示装置の製造方法。 - 前記構造体の上面と第2の電極基板を接着させる工程において、前記第2の電極基板側だけを選択的に加熱することを特徴とする請求項1に記載の電気泳動表示装置の製造方法。
- 第1の電極基板上に立設した絶縁性の構造体で形成される複数のセルを形成する工程と、
前記構造体の上面に第1の接着剤層を形成する工程と、
前記セルに電気泳動インクを充填する工程と、
第2の電極基板上に、前記構造体の上面のパターン形状と略同一である第2の接着剤層を形成する工程と、
前記第1の電極基板と前記第2の電極基板を対向配置させて前記第1の接着剤層と前記第2の接着剤層を接着させることにより、前記第1の電極基板と前記第2の電極基板を貼り合わせる工程と、を有する電気泳動表示装置の製造方法。 - 第1の電極基板と、
前記第1の電極基板上に設けられた立設した絶縁性の構造体で形成された複数のセルと、
前記構造体の上面に設けられた第1の接着剤層と、
第2の電極基板と、
前記第2の電極基板の表面に、前記構造体の上面のパターン形状と略同一に形成された第2の接着剤層と、
前記セルに充填された電気泳動インクと、を有し、
前記構造体の上面に形成された第1の接着剤層と前記第2の電極基板の表面に形成された第2の接着剤層が接着して前記電気泳動インクが前記セルに封止された電気泳動表示装置。 - 第1の電極基板上に立設した絶縁性の構造体で形成される複数のセルを形成する工程と、
前記構造体の上面に第1の接着剤層を形成する工程と、
第2の電極基板を、前記第1の接着剤層が形成された前記構造体の上面に接触させる工程と、
前記第2の電極基板を前記構造体の上面から剥がすことにより、前記構造体の上面に形成された前記第1の接着剤層の一部を前記第2の電極基板の表面に転写して、前記第2の電極基板の表面に第2の接着剤層を形成する工程と、
前記複数のセルに電気泳動インクを充填する工程と、
前記第1の電極基板と前記第2の電極基板を対向配置させて、前記第1の接着剤層と前記第2の接着剤層を接着させることにより、前記第1の電極基板と前記第2の電極基板を貼り合わせる工程と、を有する電気泳動表示装置の製造方法。 - 前記構造体の上面に前記第1の接着剤層を形成する工程は、表面に接着剤層が形成された基材を前記構造体の上面に接触させた後に前記構造体の上面から剥がすことにより、前記基材表面に形成された接着剤層の一部を前記構造体の上面に転写して、前記構造体の上面に前記第1の接着剤層を形成することを特徴とする請求項5に記載の電気泳動表示装置の製造方法。
- 前記複数のセルに電気泳動インクを充填する工程における前記第1の接着剤層を、前記第2の電極基板を前記第1の接着剤層が形成された前記構造体の上面に接触させる工程における前記第1の接着剤層より硬化状態とすることを特徴とする請求項5に記載の電気泳動表示装置の製造方法。
- 第1の電極基板上に立設した絶縁性の構造体で形成される複数のセルを形成する工程と、
前記構造体の上面に第1の接着剤層を形成する工程と、
第2の電極基板を前記第1の接着剤層が形成された前記構造体の上面に接触させた後、前記第1の電極基板の一部と前記第2の電極基板の一部を固着する工程と、
前記第2の電極基板の非固着部を前記構造体の上面から剥がすことにより、前記構造体の上面に形成された前記第1の接着剤層の一部を前記第2の電極基板の表面に転写して、前記第2の電極基板の表面に第2の接着剤層を形成する工程と、
前記第1の電極基板の一部と前記第2の電極基板の一部を固着させた状態で、前記セルに電気泳動インクを充填する工程と、
前記第1の接着剤層と前記第2の接着剤層を接着させることにより、第1の電極基板と前記第2の電極基板を貼り合わせる工程と、を有する電気泳動表示装置の製造方法。 - 前記第1の電極基板と前記第2の電極基板を貼り合わせる工程において、前記第1の電極基板と前記第2の電極基板の位置合わせを、前記固着部を基準として行うことを特徴とする請求項8に記載の電気泳動表示装置の製造方法。
- 前記第1の電極基板の一部と前記第2の電極基板の一部を固着する工程の前に、前記第1の電極基板及び/又は前記第2の電極基板の所定の領域に光硬化性接着剤を形成する工程を有し、
前記第2の電極基板を前記第1の接着剤層が形成された前記構造体の上面に接触させた後に、前記光硬化性接着剤に紫外線を照射することにより前記第1の電極基板の一部と前記第2の電極基板の一部を固着することを特徴とする請求項8に記載の電気泳動表示装置の製造方法。 - 前記構造体の上面に前記第1の接着剤層を形成する工程は、表面に接着剤層が形成された基材を前記構造体の上面に接触させた後に前記構造体の上面から剥がすことにより、前記基材表面に形成された接着剤層の一部を前記構造体の上面に転写して前記構造体の上面に前記第1の接着剤層を形成することを特徴とする請求項8に記載の電気泳動表示装置の製造方法。
- 第1の基材の表面に、構造体を形成する工程と、
第2の基材の表面に、熱可塑性材料の塗膜を形成する工程と、
前記第1の基材の表面に立設された前記構造体の上面に、前記第2の基材の表面に形成された熱可塑性材料層を接触させる工程と、
前記熱可塑性材料層を加熱して、前記構造体と前記熱可塑性材料層とを貼り合わせる工程と、
前記熱可塑性材料層を加熱した状態で、前記第1の基材から前記第2の基材を剥離することにより、前記熱可塑性材料層を前記構造体の上面に転写する工程と、を有する接着剤層付き基材の製造方法。 - 前記構造体と前記熱可塑性材料層とを貼り合わせる工程において、前記加熱温度は、前記熱可塑性材料の軟化点以上である、請求項12に記載の接着剤層付き基材の製造方法。
- 前記熱可塑性材料層を前記構造体の上面に転写する工程において、前記加熱温度は、前記熱可塑性材料の軟化点以上である、請求項12に記載の接着剤層付き基材の製造方法。
- 前記熱可塑性材料層を前記構造体の上面に転写する工程において、前記第1の基材の温度よりも、前記第2の基材の温度の方が高い、請求項12に記載の接着剤層付き基材の製造方法。
- 前記構造体と前記熱可塑性材料層とを貼り合わせる工程において、前記第1の基材と前記第2の基材を押し付けるように外側から荷重をかける、請求項12に記載の接着剤層付き基材の製造方法。
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CN2011800346381A CN103003745A (zh) | 2010-05-14 | 2011-05-09 | 电泳显示装置、电泳显示装置的制造方法和带粘接剂层的基材的制造方法 |
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KR1020127032857A KR20130119330A (ko) | 2010-05-14 | 2011-05-09 | 전기 영동 표시장치, 전기 영동 표시장치의 제조 방법 및 접착제층이 부착된 기재의 제조 방법 |
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CN107077021B (zh) * | 2014-11-27 | 2020-10-02 | 株式会社Lg化学 | 基板接合方法和由该基板接合方法制备的显示基板 |
CN106444205B (zh) * | 2016-07-21 | 2019-05-17 | 中山大学 | 彩色电泳显示膜材的制备方法及转印技术在其中的应用 |
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