WO2011125939A1

WO2011125939A1 - Optical waveguide structure and electronic apparatus

Info

Publication number: WO2011125939A1
Application number: PCT/JP2011/058433
Authority: WO
Inventors: 哲也森; 誠藤原
Original assignee: 住友ベークライト株式会社
Priority date: 2010-04-06
Filing date: 2011-04-01
Publication date: 2011-10-13
Also published as: TW201213360A

Abstract

Disclosed is an optical waveguide structure that has a wide degree of freedom of pattern shape design, can form a core section (light path) having high dimensional precision via a simple method, and is provided with an optical waveguide having excellent durability. Further disclosed is an electronic apparatus. One embodiment of the present disclosures is cited below. The optical waveguide structure (1) is provided with: an optical waveguide (9) formed from laminating a cladding layer (91, 92) on both surfaces of a core layer (93); conductor layers (51, 52) joined to both surfaces thereof; a light-path transformation unit (96) that bends the light path of the optical waveguide (9) nearly perpendicularly; and a light-emitting element (10) and an electric element (12). The core layer (93) has a core section (94) and cladding sections (95). The core section (94) is formed in a desired shape by means of selectively radiating light to the layer, which is configured from a composition containing: (A) a cyclic olefin resin, (B) at least one of either an oligomer having a cyclic ether group or a monomer having a cyclic ether group and having a refractive index that differs from the aforementioned A; and (C) a photoacid generator.

Description

Optical waveguide structure and electronic device

The present invention relates to an optical waveguide structure and an electronic device.
This application is based on Japanese Patent Application No. 2010-088096 filed in Japan on April 6, 2010, Japanese Patent Application No. 2010-089167 filed in Japan on April 8, 2010, and April 8, 2010. Furthermore, priority is claimed based on Japanese Patent Application No. 2010-089401 filed in Japan, the contents of which are incorporated herein by reference.

In recent years, optical branching couplers (optical couplers), optical multiplexers / demultiplexers, and the like have been developed as optical components in the field of optical communications, and optical waveguide devices used for these are promising. As this optical waveguide element (hereinafter, also simply referred to as “optical waveguide”), there are polymer optical waveguides that are easy to manufacture (patterning) and are versatile, in addition to the conventional quartz optical waveguides. Is being actively developed.

Such an optical waveguide is usually formed in a predetermined arrangement (pattern) on a substrate and handled as an optical waveguide structure. As this optical waveguide structure, a predetermined electric wiring circuit and an optical waveguide composed of a core part and a cladding part are formed on a substrate, and a light emitting element and a light receiving element are attached to this optical waveguide (electrical element) / Optical hybrid substrate) is disclosed (for example, see Patent Document 1).

However, the optical waveguide structure described in Patent Document 1 has the following problems.
1. The process of forming the optical waveguide is complicated, and the degree of freedom in designing and selecting the pattern shape of the core part constituting the optical path of the transmitted light is narrow.
2. The core pattern shape accuracy and dimensional accuracy are poor.
3. In manufacturing, it is difficult to position the light emitting element and the light receiving element, and the optical waveguide, and manufacturing (assembly) may be difficult particularly when the structure is complicated or the optical circuit is complicated.
4). When combined with an electrical wiring pattern, the degree of freedom in designing the wiring pattern is narrow. If priority is given to the design of the electrical wiring pattern, the degree of freedom in designing the optical path of the optical waveguide is reduced.
5. It is disadvantageous for integration and miniaturization.

JP 2004-146602 A

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical waveguide structure having an optical waveguide with a wide degree of freedom in designing a pattern shape and capable of forming a core portion (optical path) with high dimensional accuracy by a simple method. It is to provide a body and an electronic device.
In addition, the object of the present invention is to form a core part (optical path) with a high degree of dimensional accuracy by a simple method with a wide degree of freedom in designing a pattern shape in each of an electric circuit and an optical circuit, and durability. It is an object of the present invention to provide an optical waveguide structure provided with an excellent optical waveguide, and an electronic device provided with such an optical waveguide structure.
Further, the object of the present invention is to have a wide degree of freedom in designing the pattern shape of the optical circuit, to form a core part (optical path) with high dimensional accuracy by a simple method, and to easily position the electrical element. An object of the present invention is to provide an optical waveguide structure including an optical waveguide. Moreover, it is providing the electronic device provided with the said optical waveguide structure.

Such an object is achieved by the present inventions (1) to (131) below.
(1) having an optical waveguide comprising a core part and a clad part having different refractive indexes, and an optical path changing part for bending the optical path of the core part,
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure characterized by being formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition comprising:

(2) The optical waveguide structure according to (1), wherein the cyclic ether group in (B) is an oxetanyl group or an epoxy group.

(3) The optical waveguide structure according to (1) or (2), wherein the cyclic olefin resin of (A) is a norbornene resin.

(4) The refractive index of (B) is lower than that of (A),
(1) The cyclic olefin resin has a leaving group that is desorbed by an acid generated from the photoacid generator of (C) and lowers the refractive index of (A) by desorption. Thru | or the optical waveguide structure in any one of (3).

(5) The cyclic olefin resin of (A) has a leaving group that is eliminated by an acid generated from the photoacid generator of (C) in the side chain,
Said (B) is an optical waveguide structure as described in said (2) containing the 1st monomer as described in following formula (100).

(6) The optical waveguide structure according to (5), wherein (B) further includes at least one of the epoxy compound and the oxetane compound having two oxetanyl groups as the second monomer.

(7) The ratio of the second monomer to the first monomer is 0.1 to 1.0 in a weight ratio (weight of the second monomer / weight of the first monomer). The optical waveguide structure described.

(8) The leaving group has any one of the above (4) to (6) having at least one of an —O— structure, an —Si—aryl structure, and an —O—Si— structure. The optical waveguide structure described.

(9) The optical waveguide structure according to any one of (5) to (8), wherein the cyclic olefin resin of (A) is a norbornene resin.

(10) The optical waveguide structure according to (9), wherein the norbornene-based resin is a norbornene addition polymer.

(11) The optical waveguide structure according to (10), wherein the norbornene addition polymer has a repeating unit represented by the following formula (101).

[N in the formula is an integer of 0 or more and 9 or less. ]

(12) The optical waveguide structure according to (10) or (11), wherein the norbornene addition polymer has a repeating unit represented by the following formula (102).

(13) The content of the first monomer described in the formula (100) is 1 part by weight or more and 50 parts by weight or less with respect to 100 parts by weight of the cyclic olefin resin. An optical waveguide structure according to claim 1.

(14) The light according to any one of (1) to (13), wherein the concentration of the structure derived from (B) is different between a region irradiated with active radiation of the core layer and a non-irradiated region. Waveguide structure.

(15) The optical waveguide structure according to any one of (1) to (14), wherein the refractive index difference between the region irradiated with active radiation and the non-irradiated region of the core layer is 0.01 or more.

(16) In any one of the above (1) to (15), a region of the core layer that has been irradiated with active radiation is at least a part of the cladding part, and an unirradiated region is at least a part of the core part. Optical waveguide structure.

(17) The optical waveguide structure according to any one of (1) to (16), wherein the optical path conversion unit has a reflection surface that reflects at least part of transmission light transmitted through the core unit. .

(18) The optical waveguide according to (17), further including a hole provided in the core part, wherein the reflection surface is configured by a part or all of an interface between the core part and the hole. Structure.

(19) The optical waveguide structure according to (17) or (18), wherein the reflection surface is set to an inclination angle that totally reflects the transmitted light.

(20) An area where a projection when the reflecting surface is projected in the direction of the core and a cross section of the core overlaps is smaller than a cross-sectional area of the core, and transmitted light transmitted through the core is The optical waveguide according to any one of (17) to (19), wherein the optical waveguide includes a branching portion that branches into transmission light reflected by the reflection surface and transmission light that travels straight through the core portion other than the reflection surface. Structure.

(21) The area where the projection when the reflection surface is projected in the direction of the core and the cross-section of the core overlap is the same as the cross-sectional area of the core.
The optical waveguide structure according to any one of (17) to (20), wherein the core portion is set to be large only in a portion where the reflection surface of the core portion exists.

(22) The reflection surface is inclined with respect to the core portion, and at least one of both end portions in the inclined direction of the reflection surface is positioned outside an outer portion extending line of the core portion, and the core The optical waveguide structure according to any one of (17) to (21), wherein the portion swells in a state of surrounding the reflective surface.

(23) The above-mentioned optical waveguide is constituted by a laminate of both clad layers and a core layer interposed between the clad layers that constitute the clad part on both surfaces of the core layer. 1) The optical waveguide structure according to any one of (22).

(24) The optical waveguide structure according to (23), wherein the cladding layer is made of the same kind of material as the core layer.

(25) The optical waveguide structure according to (23) or (24), wherein the optical path conversion unit is formed across the core unit and at least one of the cladding layers.

(26) The optical waveguide structure according to any one of (1) to (24), wherein the optical path conversion unit is formed only in the core layer.

(27) In the core layer, the core portion is formed so as to be interrupted at an end portion or in the middle thereof,
The optical waveguide structure according to any one of (1) to (17), wherein the optical path conversion unit is formed in a portion where the core unit is interrupted.

(28) The above-mentioned, wherein the core part has a hole provided in a part where the core part is interrupted, and the reflection surface is configured by a part or all of an interface between the part where the core part is interrupted and the hole. The optical waveguide structure according to (27).

(29) The optical waveguide structure according to any one of (1) to (28), wherein at least one conductor layer is bonded to the optical waveguide.

(30) The optical waveguide structure according to any one of (1) to (28), wherein a conductor layer is bonded to both surfaces of the optical waveguide.

(31) The optical waveguide structure according to any one of (1) to (30), wherein the optical waveguide structure has an element having a light emitting part or a light receiving part and a terminal.

(32) The optical waveguide structure according to (29) or (30), wherein the optical waveguide structure includes an element having a light emitting portion or a light receiving portion and a terminal, and the terminal is electrically connected to the conductor layer.

(33) The optical waveguide structure according to the above (31) or (32), wherein there is no gap between the element and the optical waveguide.

(34) The optical waveguide structure according to any one of (31) to (33), wherein an outer surface of the element is sealed with a sealing material.

(35) The optical waveguide structure according to any one of (31) to (34), wherein the optical path conversion unit is formed at a position overlapping the light emitting unit or the light receiving unit in plan view.

(36) The optical waveguide structure according to any one of (31) to (35), wherein the element is configured as a chip carrier on which at least one of the elements is mounted.

(37) The optical waveguide structure according to (36), wherein the chip carrier has another optical waveguide.

(38) At least one substrate is bonded to the optical waveguide,
The substrate includes a translucent part having translucency with respect to transmission light transmitted through the core unit, and is configured to transmit the transmission light in the thickness direction of the substrate through the translucent part. The optical waveguide structure according to any one of (1) to (37).

(39) The optical waveguide structure according to (38), wherein the substrate itself has a transmittance of the transmission light of 80% or more, whereby a part of the substrate constitutes the light transmitting part.

(40) The optical waveguide structure according to (38) or (39), wherein the light transmitting part is configured by a through-hole penetrating the substrate.

(41) The optical waveguide structure according to (40), wherein the through-hole is filled with a material having a transmission light transmittance of 80% or more.

(42) The optical waveguide structure according to (38), wherein the light transmitting part is configured by a vertical optical waveguide that transmits the transmission light in a thickness direction of the substrate.

(43) The optical waveguide structure according to any one of (38) to (42), wherein the light transmitting portion includes a lens portion that can collect or diffuse the transmission light.

(44) The optical waveguide structure according to any one of (1) to (43), wherein the active radiation has a peak wavelength in a range of 200 to 450 nm.

(45) The optical waveguide structure according to any one of (1) to (44), wherein an irradiation amount of the active radiation is 0.1 to 9 J / cm ² .

(46) The optical waveguide structure according to any one of (1) to (45), wherein the active radiation is applied to the core layer through a mask.

(47) The optical waveguide structure according to any one of (1) to (46), wherein the core layer further includes an antioxidant.

(48) The optical waveguide structure according to any one of (1) to (47), wherein the core layer further includes a sensitizer.

(49) An electronic device comprising the optical waveguide structure according to any one of (1) to (48).
(50) It is composed of a laminated structure having an optical waveguide having a core part and a clad part having different refractive indexes, and a conductor layer,
A light guide that extends in the thickness direction and is optically connected to the core portion;
A conductor portion extending in the thickness direction and electrically connected to the conductor layer;
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure (51), which is formed in a desired shape by selectively irradiating active radiation to a core layer composed of a composition containing The optical waveguide structure according to (50), wherein the ether group is an oxetanyl group or an epoxy group.
(52) The optical waveguide structure according to (50) or (51), wherein the cyclic olefin resin of (A) is a norbornene resin.
(53) The refractive index of (B) is lower than that of (A),
The cyclic olefin resin has a leaving group that is detached by an acid generated from the photoacid generator of (C) and lowers the refractive index of (A) by the elimination. Thru | or the optical waveguide structure in any one of (52).
(54) The cyclic olefin resin of (A) has a leaving group that is eliminated by an acid generated from the photoacid generator of (C) in the side chain,
Said (B) is an optical waveguide structure as described in said (51) containing the 1st monomer as described in following formula (100).

(55) The optical waveguide structure according to (54), wherein (B) further includes at least one of the epoxy compound and the oxetane compound having two oxetanyl groups as a second monomer.
(56) In the above (55), the ratio of the second monomer to the first monomer is 0.1 to 1.0 by weight ratio (weight of the second monomer / weight of the first monomer). The optical waveguide structure described.
(57) In any one of the above (54) to (55), the leaving group has at least one of an —O— structure, an —Si—aryl structure, and an —O—Si— structure. The optical waveguide structure described.
(58) The optical waveguide structure according to any one of (54) to (57), wherein the cyclic olefin resin of (A) is a norbornene resin.
(59) The optical waveguide structure according to (58), wherein the norbornene-based resin is a norbornene addition polymer.
(60) The optical waveguide structure according to (59), wherein the norbornene addition polymer has a repeating unit represented by the following formula (101).

(61) The optical waveguide structure according to (59) or (60), wherein the norbornene addition polymer has a repeating unit represented by the following formula (102).

(62) The content of the first monomer described in the above formula (100) is 1 part by weight or more and 50 parts by weight or less with respect to 100 parts by weight of the cyclic olefin resin. An optical waveguide structure according to claim 1.
(63) The light according to any one of (50) to (62), wherein the concentration of the structure derived from (B) is different between a region irradiated with active radiation of the core layer and a non-irradiated region. Waveguide structure.
(64) The optical waveguide structure according to any one of (50) to (63), wherein the refractive index difference between the region irradiated with active radiation and the non-irradiated region of the core layer is 0.01 or more.
(65) The structure according to any one of (50) to (64), wherein the region of the core layer that has been irradiated with the active radiation is at least a part of the cladding part, and the unirradiated region is at least a part of the core part. Optical waveguide structure.
(66) The optical waveguide structure according to any one of (50) to (65), wherein the light guide path and the conductor portion are in contact with or close to each other.
(67) The optical waveguide structure according to (50) to (66), wherein the optical waveguide structure has a through hole, and the light guide path and the conductor portion are formed in the through hole.
(68) In the said through-hole, the said conductor part is an optical waveguide structure as described in said (67) arrange | positioned around the said light guide.
(69) The optical waveguide structure according to any one of (50) to (68), wherein the light guide path includes a core part similar to the core part of the optical waveguide.
(70) The optical waveguide structure according to any one of (50) to (68), wherein the light guide path includes a vertical optical waveguide having a core part and a clad part having different refractive indexes.
(71) The optical waveguide structure according to any one of (50) to (70), wherein the core portion of the light guide path is made of a material similar to that of the core portion or the cladding portion of the optical waveguide.
(72) The optical waveguide structure according to (71), wherein the core portion of the light guide path is formed by a method similar to that of the core portion of the optical waveguide.
(73) The optical waveguide structure according to any one of (50) to (72), wherein the light guide path has a circular cross-sectional shape.
(74) The optical waveguide structure according to any one of (50) to (73), further including an optical path conversion unit that bends the optical path of the optical waveguide.
(75) The optical waveguide structure according to (74), wherein the optical path conversion unit is provided at a connection portion between the core of the optical waveguide and the light guide.
(76) The optical waveguide structure according to (74) or (75), wherein the optical path conversion unit has a reflection surface that reflects at least a part of transmission light transmitted through the core unit.
(77) The optical waveguide is configured by the clad layer constituting the clad portion being bonded to both surfaces of the core layer, and the optical waveguide is configured by a laminate of both clad layers and the core layer interposed therebetween (50) The optical waveguide structure according to any one of (1) to (76).
(78) The optical waveguide structure according to any one of (50) to (77), wherein the conductor layer is bonded to at least one surface of the optical waveguide.
(79) The optical waveguide structure according to any one of (50) to (78), which includes an element having a light emitting part or a light receiving part and a terminal.
(80) The optical waveguide structure according to (79), wherein a terminal of the element is electrically connected to the conductor layer.
(81) The optical waveguide structure according to (79) or (80), wherein an outer surface of the element is sealed with a sealing material.
(82) The optical waveguide structure according to any one of (50) to (81), which has a hard or flexible substrate.
(83) The optical waveguide structure according to (82), wherein the optical waveguide is provided adjacent to the substrate.
(84) The optical waveguide structure according to (82) or (83), wherein at least one of the light guide path and the conductor portion is formed so as to penetrate the substrate.
(85) The optical waveguide structure according to any one of (82) to (84), wherein at least one of the light guide path and the conductor portion is formed substantially perpendicular to the substrate.
(86) Any of the above (50) to (85), having a plurality of conductor layers formed at different positions in the thickness direction, and these conductor layers are electrically connected to each other through the conductor portion An optical waveguide structure according to claim 1.
(87) The optical waveguide structure according to any one of (50) to (86), wherein the light guide path and the core portion are obtained by simultaneously performing at least a part of the forming process.
(88) The optical waveguide structure according to any one of (50) to (87), including a lens portion that can collect or diffuse transmission light.
(89) The optical waveguide structure according to (88), wherein the lens unit is provided at an end or inside of the light guide.
(90) An electronic apparatus comprising the optical waveguide structure according to any one of (50) to (89).
(91) An optical waveguide structure comprising a substrate, an optical waveguide having a core portion and a cladding portion having different refractive indexes, at least one electric element, and positioning means for determining an installation position of the electric element. ,
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure characterized by being formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition comprising:
(92) The optical waveguide structure according to (91), wherein the cyclic ether group of (B) is an oxetanyl group or an epoxy group.
(93) The optical waveguide structure according to (91) or (92), wherein the cyclic olefin resin of (A) is a norbornene resin.
(94) The refractive index of (B) is lower than that of (A),
The cyclic olefin resin has a leaving group that is eliminated by an acid generated from the photoacid generator of (C), and has a leaving group that lowers the refractive index of (A) by elimination. Thru | or the optical waveguide structure in any one of (93).
(95) The cyclic olefin resin of (A) has a leaving group that is eliminated by an acid generated from the photoacid generator of (C) in the side chain,
Said (B) is an optical waveguide structure as described in said (92) containing the 1st monomer as described in following formula (100).

(96) The optical waveguide structure according to (95), wherein (B) further includes at least one of the epoxy compound and the oxetane compound having two oxetanyl groups as a second monomer.
(97) The ratio of the second monomer to the first monomer is 0.1 to 1.0 by weight ratio (weight of the second monomer / weight of the first monomer). The optical waveguide structure described.
(98) The leaving group has any one of the above (95) to (97) having at least one of an —O— structure, an —Si—aryl structure and an —O—Si— structure. The optical waveguide structure described.
(99) The optical waveguide structure according to any one of (95) to (98), wherein the cyclic olefin resin of (A) is a norbornene resin.
(100) The optical waveguide structure according to (99), wherein the norbornene-based resin is an addition polymer of norbornene.
(101) The optical waveguide structure according to (100), wherein the addition polymer of norbornene has a repeating unit represented by the following formula (101).

(102) The optical waveguide structure according to (100) or 11, wherein the norbornene addition polymer has a repeating unit represented by the following formula (102).

(103) The content of the first monomer described in the formula (100) is 1 part by weight or more and 50 parts by weight or less based on 100 parts by weight of the cyclic olefin resin. An optical waveguide structure according to claim 1.
(104) The light according to any one of (91) to (103), wherein the concentration of the structure derived from (B) is different between a region irradiated with active radiation of the core layer and a non-irradiated region. Waveguide structure.
(105) The optical waveguide structure according to any one of (91) to (104), wherein the refractive index difference between the region irradiated with active radiation and the non-irradiated region of the core layer is 0.01 or more.
(106) In any one of (91) to (105), a region of the core layer that has been irradiated with active radiation is at least a part of the cladding part, and an unirradiated region is at least a part of the core part. Optical waveguide structure.
(107) The optical waveguide according to any one of (91) to (106), wherein the substrate is made of a resin material or a semiconductor material, or a fiber base material impregnated with a resin material. Structure.
(108) The clad layer constituting the clad portion is bonded to both surfaces of the core layer, and the optical waveguide is constituted by a laminate of both clad layers and the core layer interposed therebetween (91) ) To (107).
(109) The optical waveguide structure according to any one of (91) to (108), wherein the positioning means determines a position with respect to the core portion.
(110) The optical waveguide structure according to any one of (91) to (109), wherein the electric element is an element having a light emitting part or a light receiving part and a terminal.
(111) The optical waveguide structure according to any one of (91) to (110), wherein the optical waveguide includes an optical path conversion unit that bends an optical path of transmission light transmitted through the core unit.
(112) The optical waveguide structure according to (111), wherein the positioning unit positions the light emitting unit or the light receiving unit so that the position of the light emitting unit or the light receiving unit overlaps the position of the optical path conversion unit in plan view.
(113) The optical waveguide structure according to (111) or (112), wherein the optical path conversion unit includes a reflection surface that reflects at least a part of transmission light transmitted through the core unit.
(114) The substrate includes a light-transmitting part having a light-transmitting property with respect to transmission light transmitted through the core part, and the light-emitting part or the light-receiving part of the element and the core part through the light-transmitting part. And the optical waveguide structure according to any one of (110) to (113).
(115) The optical waveguide structure according to (114), wherein at least a part of the substrate has a light-transmitting property with respect to the transmission light, thereby forming the light-transmitting portion.
(116) The optical waveguide structure according to (114), wherein the translucent part is configured by a through-hole penetrating the substrate.
(117) The optical waveguide structure according to any one of (91) to (116), wherein the optical waveguide is provided adjacent to the substrate.
(118) The optical waveguide structure according to any one of (91) to (117), wherein the electric element includes an electronic circuit element.
(119) The electric element includes the element having a light emitting part or a light receiving part and a terminal, and the electronic circuit element having a function of driving the element or processing an output signal of the element. (117) The optical waveguide structure according to any one of (117).
(120) The optical waveguide structure according to any one of (91) to (119), which has at least one conductor layer.
(121) The optical waveguide structure according to (120), wherein a terminal of the electric element is electrically connected to the conductor layer.
(122) The optical waveguide structure according to any one of (91) to (121), wherein the positioning means uses a step formed at an edge of a recess formed in the substrate.
(123) The optical waveguide structure according to any one of (91) to (121), wherein the positioning unit is a positioning member fixedly installed on the substrate.
(124) The optical waveguide structure according to (123), wherein the positioning member is a plate material or a sheet material bonded to the substrate.
(125) The optical waveguide structure according to any one of (91) to (124), wherein the positioning means is configured by an abutting surface formed on the substrate or immovable with respect to the substrate.
(126) When the X direction and the Y direction orthogonal to each other are set on the plane of the substrate, the positioning unit performs positioning in at least one of the X direction and the Y direction. The optical waveguide structure according to any one of (125).
(127) When the X direction and the Y direction orthogonal to each other are set on the plane of the substrate, the positioning means performs positioning in each of the X direction and the Y direction (91) to (125) An optical waveguide structure according to any one of the above.
(128) The optical waveguide structure according to (126) or (127), wherein a longitudinal direction of the core portion coincides with the X direction or the Y direction.
(129) The optical waveguide structure according to any one of (91) to (128), further including a lens unit capable of collecting or diffusing transmission light transmitted through the core unit.
(130) The optical waveguide structure according to (129), wherein the lens portion is provided inside or near the surface of the substrate.
(131) An electronic apparatus comprising the optical waveguide structure according to any one of (91) to (130).

According to the present invention, the core part can be patterned by a simple method of irradiation with light and active radiation (active energy ray, electron beam, X-ray, etc.), and the pattern of the core part constituting the optical path of the optical circuit A core portion with a wide degree of freedom in shape design and high dimensional accuracy can be obtained.

In addition, when the core layer is made of a desired material, when the stress is applied to the optical waveguide or when the deformation occurs, in particular, even when repeatedly curved and deformed, delamination between the core portion and the cladding portion, Defects such as the occurrence of microcracks in the core are unlikely to occur, and as a result, the optical transmission performance of the optical waveguide is maintained and the durability is excellent.

Furthermore, when the core part is composed of a resin composition mainly composed of a norbornene resin (cyclic olefin resin), the core part and the cladding part are highly effective in that they are particularly strong against the deformation and hardly cause defects. The difference in refractive index of the optical waveguide can be further increased, and the optical waveguide is excellent in heat resistance. As a result, an optical waveguide having higher performance and durability is obtained.

In addition, when the optical path conversion unit is provided, the optical path of the transmission light can be bent in a desired direction, which increases the degree of freedom in designing the optical path and contributes to the integration of the optical circuit.

When the substrate has a light transmitting portion, an optical path that passes through the substrate can be formed, so that the degree of freedom in designing the optical path is further expanded. Further, when the light transmitting part has a lens part, it is possible to condense and diffuse the transmission light in the optical path as necessary, and the degree of freedom in designing the optical circuit is further expanded in combination with the bending of the optical path.

Further, when the optical waveguide structure has an element (light emitting element or light receiving element), the light emitted from the light emitting portion of the element is guided to another place by the optical waveguide by optically connecting to the optical waveguide, or Light from other places can be guided to the light receiving portion of the element by the optical waveguide, a small and integrated optical circuit can be formed, and the operation reliability of the optical circuit is also high.

In addition, when a conductor layer is formed, wiring to the element is easy and wiring suitable for the element is possible regardless of the type of element (terminal installation location) and the like, so that versatility is enhanced. Moreover, such a wiring circuit pattern using a conductor layer has a wide degree of freedom in design (for example, a degree of freedom in selection of a terminal installation location).

Such an optical waveguide structure of the present invention has a wide range of optical circuit (optical waveguide pattern) and electrical circuit design, high yield, high optical transmission performance, excellent reliability and durability, Rich in versatility. Therefore, by providing the optical waveguide structure of the present invention, various highly reliable electronic parts and electronic devices can be obtained.

In addition, in the case of having a light guide path and a conductor portion extending in the thickness direction of the laminated structure, it is possible to design a three-dimensional circuit for both an electric circuit and an optical circuit, and the degree of design freedom in each circuit design. Spread. In particular, by arranging the light guide path and the conductor portion together, particularly by forming both in the through hole, it contributes to the integration and miniaturization of the optical waveguide structure.

When the lens portion is provided, the transmission light can be condensed and diffused as necessary in the optical path, and coupled with the bending of the optical path, the degree of freedom in designing the optical circuit is further expanded.

In addition, in the case of having a conductor layer and a conductor portion conducting to the conductor layer, for example, wiring to the element can be easily performed, and wiring suitable for the element can be provided regardless of the type of element (terminal installation location). It becomes possible and rich in versatility. Moreover, such a wiring circuit pattern has a wide degree of freedom in design (for example, a degree of freedom in selection of a terminal installation location).

Such an optical waveguide structure of the present invention has a wide range of design of optical circuits (patterns of optical waveguides and light guides) and electrical circuits (patterns of conductor layers and conductors), good yield, and optical transmission performance. Is highly reliable, durable and versatile. Therefore, the optical waveguide structure of the present invention can be used for various electronic components, electronic devices, and the like.

By using the optical waveguide structure of the present invention, at least one conductor layer in which an electric circuit is formed and at least one optical waveguide in which an optical path is arranged one- or two-dimensionally in a plane direction are laminated. A multilayer optical / electrical hybrid (fusion) wiring board can be manufactured, and the wiring between layers (in the thickness direction of the layer) is made through a through-hole having both a light guide path and a conductor portion. However, connection (signal transmission / reception) is possible even in an optical circuit, and as a result, a three-dimensional optical / electrical hybrid substrate with a wide degree of freedom in circuit design can be provided.

Also, both electric circuits and optical circuits can be easily formed, and various shapes can be formed with high dimensional accuracy. In particular, the optical circuit can be formed with any shape and arrangement of the optical path (core part) by selecting the exposure pattern, and it can be sharply formed even with a thin optical path. The device can be downsized.

In addition, when the positioning means is provided, the positional relationship between the electric element and the optical waveguide (core portion) can be determined easily and accurately, and the manufacturing is easy and the optical transmission characteristics are excellent and the reliability is high. An optical circuit can be obtained, and a finer and more complicated circuit pattern can be formed.

In particular, after positioning the electric element with respect to the substrate, a core portion or the like is formed (formed by irradiation with actinic radiation or by further heating), or the core is positioned with respect to the substrate where the position of the electric element is predetermined. By forming a layer and further forming a core part, etc., the positional relationship between the light emitting part or light receiving part of the electric element and the core part (especially the incident part of the transmitted light to the core part or the outgoing part from the core part) is easy. And can be determined accurately.

In addition, when the optical path conversion unit is provided, the optical path of the transmitted light can be bent in a desired direction, so that the degree of freedom in designing the optical path is widened, and an optical circuit can be formed with a particularly short optical path length. This contributes to higher integration of optical circuits. Even in this case, the positioning means can be used to easily and accurately position the light emitting portion or the light receiving portion of the electric element and the optical path changing portion.

In addition, when the substrate has a light transmitting portion, an optical path passing through the substrate (an optical path in the thickness direction of the substrate) can be formed, so that the degree of freedom in designing the optical path is further expanded. Further, when the light transmitting part has a lens part, it is possible to condense and diffuse the transmission light in the optical path as necessary, and the degree of freedom in designing the optical circuit is further expanded in combination with the bending of the optical path.

In addition, when a conductor layer is provided, for example, wiring to the electric element can be easily performed, and wiring suitable for the electric element can be made regardless of the type of the electric element (terminal installation location). Rich. Moreover, such a wiring circuit pattern has a wide degree of freedom in design (for example, a degree of freedom in selection of a terminal installation location).

In addition, optical circuits can be easily formed, various shapes can be formed with high dimensional accuracy, and even narrow optical paths can be formed sharply, contributing to circuit integration and reducing device size. Can be achieved.

It is sectional drawing which shows 1st Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 2nd Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 3rd Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 4th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 5th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 6th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 7th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 8th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 9th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 10th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 11th Embodiment of the optical waveguide structure of this invention. It is a top view which shows 12th Embodiment of the optical waveguide structure of this invention. It is a top view which shows the other structural example of 12th Embodiment. It is a top view which shows the other structural example of 12th Embodiment. It is a perspective view which shows 13th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is a figure which shows typically the measuring method of the bending loss in an Example. It is sectional drawing which shows 14th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 15th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 16th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 17th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 18th Embodiment of the optical waveguide structure of this invention. FIG. 21 is a sectional view taken along line AA in FIG. 20. FIG. 23 is a sectional view taken along line BB in FIG. It is CC sectional view taken on the line in FIG. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is a figure which shows typically the measuring method of the bending loss in an Example. It is a top view which shows 19th Embodiment of the optical waveguide structure of this invention. FIG. 33 is a cross-sectional view taken along line AA in FIG. 32. FIG. 33 is a sectional view taken along line BB in FIG. 32. It is sectional drawing which shows 20th Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 21st Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows 22nd Embodiment of the optical waveguide structure of this invention. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is sectional drawing which shows typically the example of a process of the manufacturing method of an optical waveguide. It is a figure which shows typically the measuring method of the bending loss in an Example.

Hereinafter, the optical waveguide structure and the electronic device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

1 to 11 are cross-sectional views showing embodiments of the optical waveguide structure of the present invention. Hereinafter, a configuration example of the optical waveguide structure will be described with reference to these drawings. In the following description, the upper side in FIGS. 1 to 11 is “upper” or “upper”, and the lower side is “lower” or “lower”. Each figure is exaggerated in the thickness direction of the layer (the vertical direction in each figure).

20 to 24 are sectional views showing embodiments of the optical waveguide structure according to the present invention. FIGS. 25, 26 and 27 are sectional views taken along line AA in FIG. 25 is a cross-sectional view taken along line BB in FIG. 22 and a cross-sectional view taken along line CC in FIG. Hereinafter, a configuration example of the optical waveguide structure will be described with reference to these drawings. In the following description, the upper side in FIGS. 20 to 24 is “upper” or “upper”, and the lower side is “lower” or “lower”. 20 to 24 are exaggerated in the layer thickness direction (vertical direction in each figure).

32 is a plan view showing a nineteenth embodiment of the optical waveguide structure of the present invention, FIG. 33 is a sectional view taken along line AA in FIG. 32, and FIG. 34 is a sectional view taken along line BB in FIG. 35 is a sectional view showing a twentieth embodiment of the optical waveguide structure of the present invention, FIG. 36 is a sectional view showing a twenty-first embodiment of the optical waveguide structure of the present invention, and FIG. It is sectional drawing which shows 22nd Embodiment of an optical waveguide structure. Hereinafter, a configuration example of the optical waveguide structure will be described with reference to these drawings.

In the following description, the upper side in FIGS. 33 to 37 is “upper” or “upper”, and the lower side is “lower” or “lower”. 33 to 37 exaggerate the layer thickness direction (vertical direction in each figure). In addition, the horizontal direction (left-right direction) in FIG. 32 will be described as “X direction”, and the vertical direction (vertical direction) will be described as “Y direction” (however, the X direction and the Y direction are orthogonal to each other).

<First Embodiment: FIG. 1>
As shown in FIG. 1, the optical waveguide structure 1 of the present invention includes an optical waveguide 9, conductor layers 51 and 52 bonded to both surfaces of the optical waveguide 9, and an optical path conversion unit that bends the optical path of the optical waveguide 9. 96, a light emitting element 10, and an electric element 12.

The optical waveguide 9 is formed by laminating a clad layer (lower clad layer) 91, a core layer 93, and a clad layer (upper clad layer) 92 in this order from the lower side in FIG. A core portion 94 and a clad portion 95 having a predetermined pattern are formed. The core portion 94 is a portion that forms an optical path of the transmission light, and the cladding portion 95 does not form an optical path of the transmission light although it is formed in the core layer 93 and performs the same function as the cladding layers 91 and 92. Part.

In the configuration shown in FIG. 1, a core portion 94 is formed on the left side in FIG. 1 of a later-described reflective surface 961 of the core layer 93, and a cladding portion 95 is formed on the other portion of the core layer 93. .

The constituent material of the core layer 93 is a material whose refractive index changes by irradiation with light (for example, ultraviolet rays) or by further heating. Preferable examples of such materials include those containing a resin composition containing a cyclic olefin resin such as a benzocyclobutene polymer and a norbornene polymer (resin) as a main material, and include a norbornene polymer (mainly The material) is particularly preferred.

The core layer 93 made of such a material is excellent in resistance to deformation such as bending, and even when it is repeatedly curved and deformed, the core layer 94 and the clad portion 95 are separated from each other, and the layer adjacent to the core layer 93 ( The delamination with the clad layers 91 and 92) hardly occurs, and the occurrence of microcracks in the core portion 94 and the clad portion 95 is also prevented. As a result, the optical transmission performance of the optical waveguide 9 is maintained, and the optical waveguide 9 having excellent durability is obtained.

Examples of the constituent material of the core layer 93 include an antioxidant, a refractive index adjuster, a plasticizer, a thickener, a reinforcing agent, a sensitizer, a leveling agent, an antifoaming agent, an adhesion aid, and a flame retardant. The additive may be contained. Addition of an antioxidant has the effect of improving high temperature stability, improving weather resistance, and suppressing light deterioration. Examples of such an antioxidant include phenols such as monophenols, bisphenols, and triphenols, and aromatic amines. Further, the resistance to bending can be further increased by adding a plasticizer, a thickener, and a reinforcing agent.

The content of additives typified by the antioxidant (the total in the case of two or more types) is preferably about 0.5 to 40% by weight, preferably 3 to 30% by weight, based on the entire constituent material of the core layer 93. The degree is more preferred. If this amount is too small, the function of the additive cannot be sufficiently exhibited. If the amount is too large, the transmittance of light (transmitted light) transmitted through the core portion 94 depends on the type and characteristics of the additive. Decrease, patterning failure, refractive index instability and the like.

An example of a method for forming the core layer 93 is a coating method. Examples of the coating method include a method in which a core layer forming composition (varnish or the like) is applied and cured (solidified), and a method in which a curable monomer composition is applied and cured (solidified). In addition, a method other than the coating method, for example, a method of joining separately manufactured sheet materials may be employed.

The core layer 93 obtained as described above is selectively irradiated with light (active radiation) using a mask to pattern the core portion 94 having a desired shape.

Examples of light used for exposure include active energy rays such as visible light, ultraviolet light, infrared light, and laser light. Further, instead of using light, electromagnetic waves such as X-rays or particle beams such as electron beams may be used.

In the core layer 93, the part irradiated with light has a lower refractive index, and a difference in refractive index occurs between the part not irradiated with light. For example, a portion of the core layer 93 that is irradiated with light becomes the cladding portion 95, and a portion that is not irradiated becomes the core portion 94. The refractive index of the cladding part 95 is substantially equal to the refractive index of the cladding layers 91 and 92.

Further, the core portion 94 may be formed by irradiating the core layer 93 with light in a predetermined pattern and then heating. By adding this heating step, the difference in refractive index between the core portion 94 and the cladding portion 95 becomes larger, which is preferable. This principle will be described later in detail.

The pattern shape of the core portion 94 to be formed is not particularly limited, and is a straight shape, a shape having a curved portion, an irregular shape, a shape having a branching portion of a light path, a merging portion or a crossing portion, a condensing portion (a width etc. is reduced). Or a light diffusing part (a part where the width or the like is increased), or a combination of two or more of these. A feature of the present invention is that the core portion 94 having any shape can be easily formed by setting the light irradiation pattern.

The constituent material of each part of the optical waveguide 9 and the method of forming the core part 94 will be described in detail later.

The conductor layer 51 joined to the lower surface of the optical waveguide 9 and the conductor layer 52 joined to the upper surface are each patterned into a predetermined shape to constitute a desired wiring or circuit. Examples of the constituent material of the conductor layers 51 and 52 include various metal materials such as copper, a copper-based alloy, aluminum, and an aluminum-based alloy. The thickness of the conductor layers 51 and 52 is not particularly limited, but is usually preferably about 3 to 120 μm, and more preferably about 5 to 70 μm.

The conductor layers 51 and 52 are formed by, for example, metal foil bonding (adhesion), metal plating, vapor deposition, sputtering, or the like. For example, etching, printing, masking, or the like can be used for patterning the conductor layers 51 and 52.

The light emitting element 10 includes a light emitting unit 101 and a pair of

terminals

103 and 105 on the lower surface side in FIG. The light emitting unit 101 is located between the terminal 103 and the terminal 105. When the

terminals

103 and 105 are energized, the light emitting unit 101 emits light.

It should be noted that the light emitting part in the light emitting element 10 may be composed of one light emitting point, or may be a set of a plurality of light emitting points. As a set of a plurality of light emitting points, for example, the light emitting points are arranged in a row (for example, 1 × 4, 1 × 12) or in a matrix (for example, n × m: n, m And those in which a plurality of light emitting points are arranged randomly (irregularly). The same applies to a light receiving portion 111 in the light receiving element 11 described later.

The light emitting element 10 is mounted on the optical waveguide 9 such that the

terminals

103 and 105 are respectively joined (electrically connected) to predetermined portions of the conductor layer 52.

The electric element (electronic circuit element) 12 is composed of, for example, a semiconductor element (semiconductor chip). Although the function of the electric element 12 is not particularly limited, an example is one that constitutes a circuit for driving the light emitting element 10. The electric element 12 has two

terminals

123 and 125 on the lower surface side in FIG.

The electric element 12 is mounted on the optical waveguide 9 such that the

terminals

123 and 125 are joined (electrically connected) to predetermined portions of the conductor layer 52, respectively.

The lower part including the

terminals

103, 105, 123, and 125 of the light emitting element 10 and the electric element 12 is sealed with the underfill material 4. As a result, the gap between the light emitting element 10 and the electric element 12 and the optical waveguide 9 is sealed with the underfill material 4 without forming a gap. Further, the entire light emitting element 10 and electric element 12 (outer surface) are covered and sealed with the sealing material 6. As described above, the light emitting element 10 and the electric element 12 are entirely sealed, and in particular, the light emitting portion 101 is sealed without being exposed to the outside, so that it is protected from dirt, damage, oxidative degradation, and the like. Contributes to improving the reliability of electronic components.

The underfill material 4 is made of a material that substantially transmits light (transmitted light) emitted from the light emitting unit 101, and is preferably made of a transparent material.

The constituent material of the underfill material 4 is preferably a resin material having insulating properties, and examples thereof include an epoxy resin, a phenol resin, a urethane resin, and a polyimide resin.

Further, as the constituent material of the sealing material 6, a resin material having an insulating property is preferable, and examples thereof include an epoxy resin, a phenol resin, a norbornene resin, and a silicon resin.

As shown in FIG. 1, the optical waveguide 9 is formed with four through holes (through holes) 8 penetrating in the thickness direction. Each through-hole 8 is filled with a conductive material (for example, various metal materials such as copper, copper-based alloy, aluminum, aluminum-based alloy) to form a conductor post 81. The predetermined portions of the conductor layer 51 and the conductor layer 52 are electrically connected to each other through the conductor posts 81. In other words, the

terminals

103, 105, 123, and 125 of the light emitting element 10 and the electric element 12 can be energized through the conductor layer 51 on the lower surface side of the optical waveguide 9. Note that the terminal 105 and the terminal 123 are electrically connected and are connected to the ground side.

The core portion 94 of the optical waveguide 9 has a pattern shape that overlaps with the light emitting portion 101 of the light emitting element 10 in plan view (when viewed from above in FIG. 1) (that is, passes through directly under the light emitting portion 101). Is formed. The core portion 94 has a higher refractive index than that of the cladding portion 95 and has a higher refractive index than the cladding layers 91 and 92. The clad layers 91 and 92 constitute the clad portions located at the lower part and the upper part of the core part 94, respectively. With such a configuration, the core portion 94 functions as a light guide path surrounded by the clad portion on the entire outer periphery.

Such an optical waveguide 9 has an optical path conversion section 96 that bends the optical path of the core section 94. The optical path conversion unit 96 includes a reflection surface (mirror) 961 that reflects at least a part of the transmission light. The reflecting surface 961 is provided at a position directly below the light emitting unit 101.

The reflecting surface 961 is inclined by approximately 45 ° with respect to the optical path of the optical waveguide 9, that is, the longitudinal direction of the core portion 94, and has a function of reflecting most of the transmitted light (for example, 90% or more).

Such an optical path conversion unit 96 removes (deletes) a part of the optical waveguide 9 to form, for example, a triangular concave portion (hole) whose bottom is the bottom, and reflects one inclined surface thereof. The surface 961 is used. The reflection surface 961 may have a reflection film such as a multilayer optical thin film or a metal thin film (for example, an aluminum vapor deposition film) or a reflection increasing film. Although not shown, the concave portion of the optical path conversion unit 96 may be filled with a filler, particularly a filler having a refractive index different from that of the core 94.

In the configuration shown in the figure, the reflection surface 961 (the optical path conversion unit 96) is formed across the core layer 93 and the clad layer 92, but may be formed only in the core layer 93.

In the optical waveguide structure 1 of the present embodiment, when power is supplied between the

terminals

103 and 105 of the light emitting element 10 via the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 emits light, and FIG. The light emitted toward the middle and lower is sequentially transmitted through the underfill material 4 and the clad layer 92, reflected by the reflecting surface 961, bent by 90 °, enters the core portion 94 of the optical waveguide 9, and enters the clad portion (cladding). While repeating reflection at the interfaces with the

layers

91 and 92 and the side cladding portions 95), the core portion 94 proceeds in the longitudinal direction (left direction in FIG. 1).

Further, when energization is performed between the

terminals

123 and 125 of the electric element 12 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the electric element 12 is driven.

In FIG. 1, the leftmost conductor post 81 and the core portion 94 are shown to intersect with each other, but these are shifted in the front-rear direction of the paper surface of FIG. This optical path is designed not to interfere with the conductor post 81.

Second Embodiment: FIG. 2
FIG. 2 shows a second embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st Embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is the same as the optical path conversion unit 96 except for the configuration described above. In other words, the reflection surface (mirror) 961 constituting the optical path conversion unit 96 is located directly below the light emitting unit 101, but this reflection surface 961 is formed in three layers of the clad layer 91, the core layer 93, and the clad layer 92. It is formed across. That is, the triangular concave portion of the optical path conversion unit 96 is open to the lower surface of the optical waveguide 9.

The reflective surface 961 may have a reflective film or a reflection enhancement film such as a multilayer optical thin film or a metal thin film, or the concave portion of the optical path conversion unit 96 may be filled with a filler. Is the same as described above.

<Third Embodiment: FIG. 3>
FIG. 3 shows a third embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st Embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of this embodiment has a substrate 2, and an optical waveguide 9 is bonded to the lower surface of the substrate 2 via an adhesive layer 3. Similarly to the underfill material 4, the substrate 2 is made of a material that substantially transmits light (transmission light) emitted from the light emitting unit 101 (a material having translucency with respect to the transmission light). A transparent substrate made of a substantially transparent material.

Specifically, the optical characteristics of the substrate 2 are preferably such that the transmittance of transmitted light is 80% or more, more preferably 90% or more, and further preferably 95% or more. Since the board | substrate 2 has such an optical characteristic, the site | part just under the light emission part 101 in the board | substrate 2 comprises the translucent part 21 which permeate | transmits transmission light.

Similarly, the adhesive layer 3 is made of a material that substantially transmits transmission light emitted from the light emitting unit 101, and is preferably made of a transparent material.

Examples of the constituent material of the substrate 2 include epoxy resin, phenol resin, bismaleimide resin, bismaleimide / triazine resin, triazole resin, polycyanurate resin, polyisocyanurate resin, benzocyclobutene resin, polyimide resin, polybenzoxazole. Examples thereof include resins and norbornene resins. These materials may be used alone or in combination.

Further, the substrate 2 may be, for example, a fiber base such as glass fiber or resin fiber (woven fabric, nonwoven fabric, woven fabric, knitted fabric, etc.) impregnated with the resin material as described above (prepreg, etc.). For example, a glass cloth impregnated with an epoxy resin is called a glass epoxy substrate, but such a substrate can be used as the substrate 2. The substrate 2 including such a fiber base material is particularly advantageous when the optical waveguide 9 or the conductor layer (metal layer) is bonded to the substrate 2 because the substrate 2 including the fiber base is relatively thin but has high strength and low thermal expansion coefficient. It is.

Further, the substrate 2 may be a laminate of a plurality of layers. For example, a laminate of a first layer and a second layer made of resin materials having different compositions (kinds), a layer (sheet material) in which the fiber base material is impregnated with a resin material, and a resin material The thing which laminated | stacked the layer is mentioned. In addition, it cannot be overemphasized that the layer structure in a laminated body is not limited to this.

The thickness of the substrate 2 is not particularly limited, but is usually preferably about 50 μm to 1.2 mm, more preferably about 100 to 600 μm.

The substrate 2 may be hard (rigid) or flexible (flexible). Moreover, you may have both a hard board | substrate and a flexible board | substrate. In this case, the optical waveguide 9 has only to be formed on at least one of a hard substrate and a flexible substrate, and may be formed over both.

As the adhesive layer 3, a sheet material (bonding sheet) can be used, and examples of the constituent material thereof include an epoxy adhesive, an acrylic adhesive, a phenol resin adhesive, a cyanate resin adhesive, and a maleimide resin. System adhesives and the like. In particular, it is preferably made of a material having flux activity for preventing oxidation or the like.

The adhesive layer 3 may be formed on the lower surface of the substrate 2 or the upper surface of the optical waveguide 9 without using a sheet material as the adhesive layer 3. The adhesive layer 3 may be a laminate of two or more layers.

The thickness of the adhesive layer 3 is not particularly limited, but is preferably about 0.5 to 150 μm, more preferably about 10 to 70 μm.

The conductor layer 52 is formed on the upper surface of the substrate 2. In this case, a part of the conductor layer 52 is exposed outward from the sealing material 6. The conductor layer 51 formed on the lower surface of the optical waveguide 9 has a wiring pattern different from that of the first embodiment.

As shown in FIG. 3, two conductor posts 81 are provided so as to penetrate the optical waveguide 9, the adhesive layer 3, and the substrate 2, and the conductor layer 51 and the conductor layer 52 are predetermined via these conductor posts 81. The parts are conducting. That is, the terminal 105 of the light emitting element 10 and the terminal 123 of the electric element 12 are conducted through the conductor layer 51, the conductor post 81, and the conductor layer 52, and these are connected to the ground side.

When a current is applied between one conductor layer 52 and the conductor layer 51 exposed to the outside from the sealing material 6, the light emitting portion 101 emits light, and the other conductor layer 52 and the conductor exposed to the outside from the sealing material 6. When energized with the layer 51, the electric element 12 is driven.

In the optical waveguide structure 1 of the present embodiment, when power is applied between the

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 is turned on, and FIG. The light emitted toward the middle and lower is sequentially transmitted through the underfill material 4, the substrate 2 (translucent portion of the substrate 2), the adhesive layer 3, and the cladding layer 92, reflected by the reflecting surface 961, and bent by 90 °. The core portion 94 of the optical waveguide 9 enters the core portion 94 while being repeatedly reflected at the interface with the clad portions (cladding layers 91 and 92 and the side clad portions 95). )

<Fourth Embodiment: FIG. 4>
FIG. 4 shows a fourth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st and 3rd embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of this embodiment does not have the adhesive layer 3, except that the substrate 2 and the optical waveguide 9 are directly joined and the configuration of the optical path conversion unit 96 is different. This is the same as the embodiment. Since the board | substrate 2 and the optical waveguide 9 are directly joined, it contributes to thickness reduction of the optical waveguide structure 1. FIG.

The reflection surface (mirror) 961 constituting the optical path conversion unit 96 is located directly below the light emitting unit 101, but the reflection surface 961 extends over the three layers of the clad layer 91, the core layer 93, and the clad layer 92. Is formed. In other words, the optical path conversion unit 96 is configured by a triangular recess having a base on the upper side, and a reflecting surface 961 is formed on the slope. Such an optical path conversion unit 96 is provided adjacent to the substrate 2.

In the optical waveguide structure 1 of the present embodiment, when current is passed between the

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 emits light, and FIG. The light emitted toward the middle and lower is sequentially transmitted through the underfill material 4 and the substrate 2, reflected by the reflecting surface 961, bent by 90 °, enters the core portion 94 of the optical waveguide 9, and enters the cladding portion (cladding layer). 91, 92, and the clad part 95) on the side, and repeats reflection at the interface with the core part 94 along the longitudinal direction (left direction in FIG. 4).

<Fifth Embodiment: FIG. 5>
FIG. 5 shows a fifth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st and 3rd embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is the same as the third embodiment except for the configuration of the substrate 2. That is, the substrate 2 does not have a sufficient transmission light transmission property, and a through hole 22 penetrating the substrate 2 is formed at a position directly below the light emitting unit 101 in the substrate 2. The through hole 22 constitutes a light transmitting part 21 that transmits the transmitted light. That is, the through hole 22 serves as a light guide for guiding (transmitting) transmission light in the thickness direction of the substrate 2.

Although not shown in the drawing, the inside (all or a part) of the through-hole 22 is filled with a filler made of a material having a transmission light transmittance of 80% or more, preferably 90% or more, more preferably 95% or more. May be. Although not shown, by forming a layer made of a conductive material on the inner surface of the through hole 22 or the like, in addition to the optical transmission function, a function of transmitting an electrical signal may be provided.

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 emits light, and FIG. The light emitted toward the lower middle passes through the underfill material 4, passes through the through hole 22, passes through the adhesive layer 3 and the cladding layer 92, is reflected by the reflecting surface 961, and bends by 90 °. While entering the core portion 94 of the waveguide 9 and repeating reflection at the interface with the cladding portions (cladding layers 91 and 92 and the side cladding portions 95), the inside of the core portion 94 is in the longitudinal direction (left direction in FIG. 5). Proceed along.

<Sixth Embodiment: FIG. 6>
FIG. 6 shows a sixth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st, 4th and 5th embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is obtained by replacing the substrate 2 in the optical waveguide structure 1 of the fourth embodiment with the substrate 2 of the fifth embodiment. That is, the substrate 2 in the optical waveguide structure 1 of the present embodiment does not have a sufficient transmission light transmission property, and a through-hole (substrate 2) that penetrates the substrate 2 at a position directly below the light emitting unit 101. ) 22 in the thickness direction. The through hole 22 constitutes the light transmitting part 21.

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 is turned on, and FIG. Light emitted toward the middle and lower passes through the underfill material 4, passes through the through-hole 22, is reflected by the reflecting surface 961, bends 90 °, enters the core portion 94 of the optical waveguide 9, and enters the cladding portion. The light travels along the longitudinal direction (left direction in FIG. 6) in the core portion 94 while repeating reflection at the interfaces with the cladding layers 91 and 92 and the side cladding portions 95.

<Seventh Embodiment: FIG. 7>
FIG. 7 shows a seventh embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st and 5th embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is different from the fifth embodiment in the configuration of the light transmitting part (light guide path formed in the thickness direction) 21 of the substrate 2, and the other parts are the same as in the fifth embodiment. . That is, a vertical optical waveguide 23 composed of a core portion 24 and a clad portion 25 surrounding the outer periphery of the core portion 24 is inserted into a through hole 22 formed at a position directly below the light emitting portion 101 of the substrate 2. Has been.

The constituent material and the forming method of the core part 24 can be the same as those of the core part 94. Alternatively, the core part 24 may be the same as the filler in the through hole 22 described in the fifth embodiment. The constituent material of the clad part 25 can be the same as that of the clad part 95 or the

clad layers

91 and 92.

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 emits light, and FIG. The light emitted toward the middle and lower passes through the underfill material 4, passes through the core portion 24 of the vertical optical waveguide 23, passes through the adhesive layer 3 and the cladding layer 92, and is reflected by the reflecting surface 961 to be 90. ° Bends, enters the core portion 94 of the optical waveguide 9, and repeats reflection at the interface with the clad portions (cladding layers 91 and 92 and the side clad portions 95), while passing through the core portion 94 in the longitudinal direction (FIG. 7). (Middle left)

<Eighth embodiment: FIG. 8>
FIG. 8 shows an eighth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st and 6th embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is the same as that of the seventh embodiment in the configuration of the light guide formed in the thickness direction of the substrate 2 in the optical waveguide structure 1 of the sixth embodiment. is there. That is, a vertical optical waveguide 23 composed of a core portion 24 and a clad portion 25 surrounding the outer periphery of the core portion 24 is inserted into a through hole 22 formed at a position directly below the light emitting portion 101 of the substrate 2. Has been.

terminals

103 and 105 of the light emitting element 10 through the conductor layer 51, the conductor post 81, and the conductor layer 52, the light emitting unit 101 emits light, and FIG. The light emitted toward the middle and lower passes through the underfill material 4, passes through the core portion 24 of the vertical optical waveguide 23, is reflected by the reflecting surface 961, and is bent by 90 °, and the core portion 94 of the optical waveguide 9. Then, while reflecting repeatedly at the interface with the cladding part (cladding layers 91 and 92 and the side cladding part 95), the core part 94 advances in the longitudinal direction (left direction in FIG. 8).

<Ninth Embodiment: FIG. 9>
FIG. 9 shows a ninth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st and 8th embodiment, and it demonstrates centering around difference.

The optical waveguide structure 1 of the present embodiment is the same as that of the eighth embodiment except that the light transmitting portion 21 is provided with a lens portion 26 that can condense or diffuse transmission light. That is, a lens portion 26 composed of a convex lens (more precisely, a plano-convex lens) is provided on the upper end surface (incident side) of the vertical optical waveguide 23.

As a result, the light emitted downward from the light emitting unit 101 in FIG. 9 is transmitted through the underfill material 4 and then condensed by the lens unit 26 to narrow the light beam (beam). It passes through the core portion 24 of the optical waveguide 23, is reflected by the reflecting surface 961, is bent by 90 °, enters the core portion 94 of the optical waveguide 9, and passes through the core portion 94 along the longitudinal direction (left direction in FIG. 9). Go ahead. By providing such a lens portion 26, clearer (sharp) transmitted light can be obtained, and more excellent light transmission characteristics can be obtained.

Note that the lens unit 26 may be capable of diffusing transmitted light. In this case, a concave lens may be used.

In addition, the installation position of the lens unit 26 is not limited to the position illustrated in FIG. 9, and may be, for example, in the middle or lower part of the translucent unit 21, or other portions, for example, the incident side end of the core unit 94 or It may be an emission side end.

<Tenth Embodiment: FIG. 10>
FIG. 10 shows a tenth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st, 2nd embodiment, etc., and it demonstrates centering around difference.

Conductive layers

51 and 52 having a predetermined pattern shape are bonded to the lower surface and the upper surface of the optical waveguide 9 constituted by the

clad layers

91 and 92 and the core layer 93 located (interposed) therebetween. The predetermined portions of the conductor layer 51 and the conductor layer 52 are electrically connected to each other by two conductor posts 81 formed through the optical waveguide 9.

The optical waveguide 9 is formed with two optical

path conversion parts

96a and 96b. These optical

path conversion units

96a and 96b have

reflection surfaces

961a and 961b similar to those described above. In the optical waveguide 9, a core portion 94 is formed on the left side in FIG. 10 from the reflecting surface 961 a of the core layer 93 and the right side in FIG. 10 from the reflecting surface 961 b, and the other portion of the core layer 93 is the cladding portion 95. Is formed.

A chip carrier (element) 13 is mounted on the optical waveguide 9. The chip carrier 13 includes a substrate 2 ′, an optical waveguide 9 ′ different from the optical waveguide 9, a light emitting element 10, a light receiving element 11, conductor layers 54 and 55, and an electric element 12. Hereinafter, the configuration of the chip carrier 13 will be described in detail.

An optical waveguide 9 ′ composed of

clad layers

91, 92 and a core layer 93 positioned (interposed) therebetween is joined to the lower surface of the substrate 2 ′. In addition, conductor layers 54 and 55 having a predetermined pattern shape are bonded to the upper surface of the substrate 2 ', respectively. Constituent materials, formation methods, patterning methods, and the like of the conductor layers 54 and 55 are the same as those of the conductor layers 51 and 52.

The substrate 2 'may be substantially transparent or opaque, and may be hard (rigid) or flexible (flexible).

The predetermined portions of the conductor layer 54 and the conductor layer 55 are electrically connected to each other by four conductor posts 82 formed through the substrate 2 ′ and the optical waveguide 9 ′.

Further, four optical

path conversion parts

96c, 96d, 96e, 96f are formed in the optical waveguide 9 '. These optical

path conversion units

96c, 96d, 96e, and 96f have

reflection surfaces

961c, 961d, 961e, and 961f similar to those described above.

In the optical waveguide 9 ′, a core portion 94 is formed at a portion between the reflecting surface 961 c and the reflecting surface 961 d of the core layer 93 and a portion between the reflecting surface 961 e and the reflecting surface 961 f. The clad part 95 is formed in the other part.

An electric element (semiconductor element) 12 having four

terminals

123, 125, 127, and 129 is mounted on the top of the substrate 2 '. The electric element 12 is mounted on the substrate 2 ′ so that the

terminals

123, 125, 127, and 129 are joined (electrically connected) to predetermined portions of the conductor layer 55.

Although the function of the electric element 12 is not particularly limited, an example is one that constitutes a circuit for driving the light emitting element 10. The electric element 12 may further have a function (circuit) for processing (for example, signal amplification) the electric signal output from the light receiving element 11.

Such an electrical element 12 is entirely covered (sealed) with a sealing material 61 similar to the sealing material 6 and sealed.

A light emitting element 10 and a light receiving element 11 are mounted below the optical waveguide 9 '. The light emitting element 10 is the same as described above. The light receiving element 11 has a light receiving portion 111 and a pair of

terminals

113 and 115 on the upper surface side in FIG. The light receiving unit 111 is located between the terminal 113 and the terminal 115. When the light receiving unit 111 receives light (irradiates transmission light), the light is photoelectrically converted, a potential difference is generated between the

terminals

113 and 115, and an electric signal is output.

The light emitting element 10 is mounted below the optical waveguide 9 ′ so that the

terminals

103 and 105 are joined (electrically connected) to predetermined portions of the conductor layer 54. The light receiving element 11 is mounted below the optical waveguide 9 ′ so that the

terminals

113 and 115 are respectively joined (electrically connected) to predetermined portions of the conductor layer 54.

The light emitting element 10 and the light receiving element 11 have their upper portions including the

terminals

103, 105, 113, 115 sealed with the underfill material 4, and the light emitting element 10 and the light receiving element 11 as a whole (outer surface) It is covered and sealed with a sealing material 6.

The core portion 94 of the optical waveguide 9 ′ overlaps the light emitting portion 101 of the light emitting element 10 and the light receiving portion 111 of the light receiving element 11 in plan view (when viewed from above in FIG. 10) (that is, the light emitting portion 101). And a pattern shape (passing right above the light receiving portion 111).

The reflective surface 961d is provided at a position directly above the light emitting unit 101, the reflective surface 961e is provided at a position directly above the light receiving unit 111, and the reflective surface 961c is at a position directly above the reflective surface 961a. The reflection surface 961f is provided at a position directly above the reflection surface 961b.

Such a chip carrier 13 is mounted on the optical waveguide 9 such that predetermined portions of the conductor layer 52 and the conductor layer 54 are electrically connected by solder (solder balls) 7. In this case, the space between the

optical waveguides

9 and 9 ′ is sealed with an underfill material 41 similar to the underfill material 4.

A part of the conductor layer 52 is sealed with the underfill material 41, and a part of the conductor layer 52 is exposed to the outside without being sealed with the underfill material 41.

terminals

103 and 105 of the light emitting element 10, the light emitting unit 101 emits light, and the light emitted upward in FIG. 4, reflected by the reflecting surface 961 d and bent by 90 °, enters the core portion 94 of the optical waveguide 9 ′, and advances in the core portion 94 along the longitudinal direction (left direction in FIG. 10). Further, the transmission light emitted from the end portion of the core portion 94 is reflected by the reflecting surface 961c, bent 90 °, travels downward, passes through the underfill material 41 and the cladding layer 92, and is reflected by the reflecting surface 961a. It bends by 90 °, enters the core portion 94 of the optical waveguide 9, and advances in the core portion 94 along its longitudinal direction (left direction in FIG. 10).

On the other hand, the light that enters the core portion 94 from the right side of the optical waveguide 9 in FIG. 10 travels along the longitudinal direction (left direction in FIG. 10) in the core portion 94, is reflected by the reflecting surface 961b, and bends 90 °. Then, it passes upward, passes through the cladding layer 92 and the underfill material 41, is reflected by the reflecting surface 961f, bends 90 °, enters the core portion 94 of the optical waveguide 9 ′, and enters the core portion 94 in its longitudinal direction ( Proceed along the left direction in FIG. Further, the transmission light emitted from the end portion of the core portion 94 is reflected by the reflecting surface 961e, bent 90 °, travels downward, passes through the underfill material 4, and is received by the light receiving portion 111. As a result, a potential difference is generated between the

terminals

113 and 115, and an electric signal is output.

<Eleventh embodiment: FIG. 11>
FIG. 11 shows an eleventh embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st, 6th, 10th Embodiment, etc., and it demonstrates centering around difference.

An optical waveguide 9 composed of

clad layers

91 and 92 and a core layer 93 positioned (interposed) therebetween is bonded to the lower surface of the substrate 2. The conductor layer 52 having the pattern shape is joined.

The optical waveguide 9 is formed with two optical

path conversion parts

96a and 96b. The optical

path conversion units

96a and 96b have the same configuration as the optical path conversion unit 96 in the fourth, eighth, and ninth embodiments, and have the same reflecting

surfaces

961a and 961b, respectively.

In the optical waveguide 9, a core portion 94 is formed on the left side in FIG. 11 from the reflecting surface 961 a of the core layer 93 and the right side in FIG. 11 from the reflecting surface 961 b, and the other portion of the core layer 93 is the cladding portion 95. Is formed.

The substrate 2 does not have sufficient transmission light transmission (translucency), and the substrate 2 has a position directly above the reflection surfaces 961a and 961b (a position directly below the reflection surfaces 961c and 961f). Each of the through holes 22 is formed through the substrate 2. These through holes 22 constitute a light transmitting portion 21 that transmits the transmitted light. That is, these through holes 22 serve as a light guide for guiding (transmitting) transmission light in the thickness direction of the substrate 2.

Further, the lens portions 26 similar to those in the ninth embodiment are provided on the upper portions of both the through holes 22 (the light transmitting portions 21). For example, the through hole 22 is filled with a transparent first resin material having a relatively low refractive index, and the upper surface thereof is formed into a curved concave surface, and the concave surface is transparent with a higher refractive index than the first resin material. By filling the second resin material, it is possible to form the lens portion 26 in which the portion of the second resin material functions as a convex lens (plano-convex lens, biconvex lens, etc.). In addition, the present invention is not limited thereto, and only a convex lens (a plano-convex lens, a biconvex lens, etc.) may be installed in the through hole 22.

Further, the installation position of the lens part 26 with respect to the through hole 22 (the light transmitting part 21) is not limited to the upper part as illustrated, and may be in the middle or lower part of the through hole 22.

Although not shown in the drawing, the inside (all or a part) of the through-hole 22 is filled with a filler made of a material having a transmission light transmittance of 80% or more, preferably 90% or more, more preferably 95% or more. May be. Further, as in the seventh and eighth embodiments, the vertical optical waveguide 23 may be formed inside the through hole 22.

A chip carrier (element) 13 similar to that of the tenth embodiment is mounted on the optical waveguide 9 with the substrate 2.

terminals

103 and 105 of the light emitting element 10, the light emitting unit 101 emits light, and the light emitted upward in FIG. 4, reflected by the reflecting surface 961 d and bent by 90 °, enters the core portion 94 of the optical waveguide 9 ′, and advances in the core portion 94 along the longitudinal direction (left direction in FIG. 11). Further, the transmission light emitted from the end portion of the core portion 94 is reflected by the reflecting surface 961c, bent 90 °, travels downward, passes through the underfill material 41, and then is condensed by the lens portion 26 and the light flux. (Beam) is narrowed down, this light beam passes through the through hole 22, is reflected by the reflecting surface 961 a, bends 90 °, enters the core portion 94 of the optical waveguide 9, and enters the core portion 94 in its longitudinal direction (FIG. 11). (Middle left)

On the other hand, the light that enters the core portion 94 from the right side of the optical waveguide 9 in FIG. 11 travels along the longitudinal direction (left direction in FIG. 11) in the core portion 94, is reflected by the reflecting surface 961b, and bends 90 °. Then, the light passes through the through-hole 22 and is condensed by the lens portion 26 to narrow the light beam (beam). The light beam is transmitted through the underfill material 41, reflected by the reflecting surface 961f, and bent by 90 °. Then, the light enters the core portion 94 of the optical waveguide 9 ′ and proceeds along the longitudinal direction (left direction in FIG. 11) in the core portion 94. Further, the transmission light (condensed light beam) emitted from the end of the core portion 94 is reflected by the reflecting surface 961e, bent 90 °, travels downward, passes through the underfill material 4, and is received by the light receiving portion 111. Received light. As a result, a potential difference is generated between the

terminals

113 and 115, and an electric signal is output.

<Twelfth embodiment: FIG. 12>
FIG. 12 shows a twelfth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st Embodiment etc., and it demonstrates centering around difference.

FIG. 12 is a plan view of the optical waveguide structure 1. An optical waveguide 9 (optical waveguide structure 1) having an optical path changing portion shown in FIG. 12 has a branching portion 941 that branches the core portion 94 in a right angle direction in the middle of the core portion 94. A core portion 942 is formed from the branch portion 941 toward the lower side of FIG.

Further, a through hole 943 that penetrates the optical waveguide 9 in the thickness direction is formed in the branch portion 941. The through hole 943 has a triangular shape in plan view, and one side thereof is formed at an angle (inclination angle) of 45 ° with respect to both the axis of the core portion 94 and the axis of the core portion 942. It functions as an optical path conversion section that bends the optical path of the core section 94. That is, this one side is a reflection surface 944 that reflects a part of the transmission light that passes through the core portion 94. On the other hand, one of the remaining two sides is parallel to the axis of the core portion 94, and the remaining one side is parallel to the axis of the core portion 942.

The reflection surface 944 reflects a part of the transmitted light that travels from the right side to the left side of the core portion 94 in FIG. 12, and changes the traveling direction downward. Further, the transmitted light that is not reflected by the reflecting surface 944 travels straight through the branching portion 941 as it is. In this way, the branching unit 941 can branch the transmitted light into two.

The reflective surface 944 may have a reflective film such as a multilayer optical thin film or a metal thin film (for example, an aluminum vapor deposition film) or a reflection increasing film. Although not shown, the through hole 943 may be filled with a filler, particularly a filler having a refractive index different from that of the core portion 94 or the core portion 942.

Here, air is usually present when the through hole 943 is not filled with a filler. The reflection surface 944 bends the optical path of the core portion 94 or the core portion 942 based on the difference between the refractive index of the core portion 94 or the core portion 942 and the refractive index of air. Since the difference in refractive index between the photosensitive resin composition used in the present invention and air is relatively large, the allowable range of the total reflection angle on the reflecting surface 944 is also relatively large. Therefore, based on Snell's law, the inclination angle of the reflecting surface 944 can be set to an angle that totally reflects light propagating through the core portion 94 or the core portion 942. As a result, attenuation of light accompanying reflection at the reflecting surface 944 is suppressed, and a decrease in light propagation efficiency can be suppressed.

Further, in the branching portion 941, the ratio between the transmission light branched downward and the transmission light traveling straight without being branched is a projected image when the reflecting surface 944 is projected in the direction of the core portion 94 (hereinafter referred to as “reflecting surface”). 944 ”) and the cross-section of the core portion 94 changes. Specifically, if the projected image of the reflecting surface 944 does not completely cover the cross section of the core portion 94, the transmitted light can be branched at the branching portion 941. That is, if the overlapping area between the projected image of the reflecting surface 944 and the cross section of the core portion 94 is smaller than the cross-sectional area of the core portion 94, transmission light that travels straight without being branched at the branching portion 941 is generated. A branch at 941 is possible. The ratio of the overlapping area between the projected image of the reflecting surface 944 and the cross section of the core part 94 to the cross-sectional area of the core part 94 is the ratio of the transmitted light to be branched. In this way, the branching rate at the branching portion 941 can be set simply by setting the area and the formation position of the through-hole 943, so that the branching portion 941 can be easily formed.

13 and 14 are plan views showing other configuration examples of the twelfth embodiment, respectively.
The reflection surface 944 shown in FIG. 13 is configured such that the projection image completely covers the cross section of the core portion 94, and the cross-sectional area of the core portion 94 is the projection image of the reflection surface 944 and the core portion 94. It is the same as the overlapping area with the cross section of. Therefore, in the branching portion 941 shown in FIG. 13, all the transmitted light that passes through the core portion 94 is reflected by the reflecting surface 944.

Further, the core portion 94 shown in FIG. 13 has a widened portion 945 whose width is enlarged at the branching portion 941. In the widened portion 945, the outline of the core portion 94 swells so as not to interfere with the through hole 943. Specifically, when an outer extension line (outer part extension line) S of the core portion 94 is assumed in the widened portion 945, both end portions in the inclined direction of the reflecting surface 944 are located outside the extension line S. . With this configuration, the transmission efficiency of the transmission light by the reflection surface 944 is more reliably improved with respect to the transmission light that passes through the core portion 94.

Further, in this case, in the reflecting surface 944, the vicinity of both ends in the slope direction with low surface accuracy does not contribute to the reflection of the transmitted light, and the vicinity of the center with high surface accuracy reflects the transmitted light. For this reason, the accuracy of the reflection angle is increased, and unintended reflection is suppressed. As a result, the leakage of a part of the transmitted light reflected at an unintended angle is greatly reduced. It should be noted that, in the vicinity of both end portions in the slope direction of the reflective surface 944, it is inevitable that the processing accuracy is lowered when the through-hole 943 is formed, the surface roughness becomes high, or the angle of inclination of the reflective surface 944 is increased. Therefore, providing the widened portion 945 is effective from the viewpoint of preventing a decrease in transmission efficiency.

On the other hand, the core portion 94 shown in FIG. 14 has the same structure as the widened portion 945 shown in FIG. The reflection surface 944 shown in FIG. 14 is configured such that the projected image covers a part of the cross section of the core portion 94. A part of the transmitted light passing through the core portion 94 is reflected at an overlapping portion between the projected image of the reflecting surface 944 and the cross section of the core portion 94, and the remaining transmitted light travels straight without being reflected. Therefore, in the branching unit 941 shown in FIG. 14, the transmission light passing through the core unit 94 can be branched into two.

Further, when the extension line S on the outer periphery of the core portion 94 is assumed in the widened portion 945 shown in FIG. 14, one of the end portions in the inclined direction of the reflection surface 944 is located outside the extension line S. In this case, as in the case of FIG. 13 described above, of the reflecting surface 944, the vicinity of one end of the slope direction with low surface accuracy does not contribute to the reflection of the transmitted light, and the central region with high surface accuracy mainly transmits. Reflect light. For this reason, the accuracy of the reflection angle is increased, and unintended reflection is suppressed. As a result, the leakage of a part of the reflected light to the clad portion 95 is greatly reduced.

In the above twelfth embodiment, the case where the transmission light is reflected by one reflection surface 944 has been described, but the transmission light may be reflected by two or more reflection surfaces 944.

<13th Embodiment: FIG. 15>
FIG. 15 shows a thirteenth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, although this optical waveguide structure 1 is demonstrated, the description is abbreviate | omitted about the matter similar to the said 1st Embodiment etc., and it demonstrates centering around difference.

FIG. 15 is a perspective view of the optical waveguide structure 1. In the optical waveguide 9 (optical waveguide structure 1) having the optical path changing portion shown in FIG. 15, the core portion 94 is interrupted at the end portion, and the interrupted portion 946 is a clad portion located on the side of the core portion 94. 95. Then, by removing a part of the interrupted portion 946 of the core layer 93 and a part of each of the

clad layers

91 and 92 located on both sides thereof, a triangular recess having the base on the clad layer 91 side is formed. . The width of the recess is equal to or greater than the width of the core portion 94. In addition, one of the two surfaces corresponding to the oblique side of the concave portion is a reflective surface 961.

Such a reflection surface 961 includes an exposed surface of the clad layer 91, an exposed surface of the discontinuous portion 946, and an exposed surface of the clad layer 92. Since these exposed surfaces are all formed by processing a clad material, it is difficult to make a difference in processing rate at the time of processing when the reflecting surface 961 is formed. For this reason, processing unevenness hardly occurs and the reflective surface 961 with high smoothness can be formed. When the smoothness of the reflecting surface 961 is increased, the surface accuracy and optical characteristics of the reflecting surface 961 are improved. Therefore, the reflecting surface 961 can prevent a decrease in transmission efficiency during optical path conversion.

On the other hand, if the reflective surface 961 includes the exposed surface of the core portion 94, the processing rate is easily different between the core material and the clad material. Accuracy and optical characteristics may be reduced.

Of the two surfaces corresponding to the hypotenuse of the recess, the other surface other than the reflecting surface 961 may also have a function as a reflecting surface.

<Fourteenth embodiment: FIG. 20>
As shown in FIG. 20, an optical waveguide structure 1001 of the present invention includes a substrate 1002, an optical waveguide 1009 provided adjacent to the substrate 1002, and

conductor layers

1051 and 1052 bonded to both surfaces of the optical waveguide 1009, respectively. An optical path conversion unit 96 that bends the optical path of the optical waveguide 1009, a conductor layer 1053 bonded to the upper surface of the substrate 1002, a light emitting element 1010, and an electric element 1012.

As a constituent material of the substrate 1002, for example, epoxy resin, phenol resin, bismaleimide resin, bismaleimide / triazine resin, triazole resin, polycyanurate resin, polyisocyanurate resin, benzocyclobutene resin, polyimide, polybenzoxazole resin And resin materials such as norbornene resin and semiconductor materials such as silicon, gallium / arsenic, indium / phosphorus, germanium, silicon carbide, and silicon germanium. These materials may be used alone or in combination.

Further, the substrate 1002 may be a substrate (such as a prepreg) obtained by impregnating a fiber base material (woven fabric, nonwoven fabric, woven fabric, knitted fabric, etc.) such as glass fiber or resin fiber with a resin material as described above. For example, a glass cloth impregnated with an epoxy resin is referred to as a glass epoxy substrate, but such a substrate can be used as the substrate 1002. The substrate 1002 including such a fiber base material is particularly advantageous when the optical waveguide 1009 or the conductor layer (metal layer) is bonded to the substrate 1002 because the substrate 1002 including the fiber base is relatively thin but has high strength and low thermal expansion coefficient. It is.

Further, the substrate 1002 may be a stacked body of a plurality of layers. For example, a laminate of a first layer and a second layer made of resin materials having different compositions (kinds), a layer (sheet material) in which the fiber base material is impregnated with a resin material, and a resin material The thing which laminated | stacked the layer is mentioned. In addition, it cannot be overemphasized that the layer structure in a laminated body is not limited to this.

The thickness of the substrate 1002 is not particularly limited, but is usually preferably about 10 μm to 1.2 mm, and more preferably about 50 to 600 μm.

The substrate 1002 may be hard (rigid) or flexible (flexible). Further, both a hard substrate and a flexible substrate may be included. In this case, the optical waveguide 1009 only needs to be formed on at least one of a hard substrate and a flexible substrate, and may be formed over both.

An optical waveguide 1009 is bonded to the lower surface of the substrate 1002. The optical waveguide 1009 is formed by laminating a clad layer 1091, a core layer 1093, and a clad layer 1092 in this order from the lower side in FIG. 20. The core layer 1093 includes a core portion 1094 and a clad portion 1095 having a predetermined pattern. Is formed.

The core portion 1094 has a higher refractive index than the clad portion 1095, and also has a higher refractive index than the

clad layers

1091 and 1092. The

clad layers

1091 and 1092 constitute the clad portions located below and above the core portion 1094, respectively. With such a configuration, the core portion 1094 functions as an optical path of the transmission light 1018 surrounded by the cladding portion on the entire outer periphery.

In the configuration shown in FIG. 20, a core portion 1094 is formed on the left side in FIG. 20 of a reflection surface 1961 described later of the core layer 1093, and a cladding portion 1095 is formed on the other portion of the core layer 1093. .

As a constituent material of the core layer 1093, a material whose refractive index is changed by irradiation with active radiation (active energy ray, electron beam, X-ray or the like) or further heating is used. Preferable examples of such materials include those mainly composed of a resin composition containing a cyclic olefin-based resin such as a benzocyclobutene-based tree polymer or a norbornene-based polymer (resin), including a norbornene-based polymer ( The main material) is particularly preferred.

The core layer 1093 made of such a material is excellent in resistance to deformation such as bending, and even when repeatedly bent and deformed repeatedly, the core layer 1094 and the clad portion 1095 are separated from each other, and the layer adjacent to the core layer 1093 ( The delamination with the clad layers 1091 and 1092) hardly occurs, and the occurrence of microcracks in the core portion 1094 and the clad portion 1095 is also prevented. As a result, the optical transmission performance of the optical waveguide 1009 is maintained, and the optical waveguide 1009 excellent in durability is obtained.

Examples of the constituent material of the core layer 1093 include antioxidants, refractive index adjusters, plasticizers, thickeners, reinforcing agents, sensitizers, leveling agents, antifoaming agents, adhesion aids, flame retardants, and the like. The additive may be contained. Addition of an antioxidant has the effect of improving high temperature stability, improving weather resistance, and suppressing light deterioration. Examples of such an antioxidant include phenols such as monophenols, bisphenols, and triphenols, and aromatic amines. Further, the resistance to bending can be further increased by adding a plasticizer, a thickener, and a reinforcing agent.

The content of additives typified by the antioxidant (the total in the case of two or more types) is preferably about 0.5 to 40% by weight, preferably 3 to 30% by weight, based on the entire constituent material of the core layer 1093. The degree is more preferable. If this amount is too small, the function of the additive cannot be sufficiently exhibited. If the amount is too large, depending on the type and characteristics of the additive, the light transmitted through the core portion 1094 (transmitted light 1018) is transmitted. There is a risk of decreasing the rate, patterning failure, refractive index instability and the like.

An example of a method for forming the core layer 1093 is a coating method. Examples of the coating method include a method in which a core layer forming composition (varnish or the like) is applied and cured (solidified), and a method in which a curable monomer composition is applied and cured (solidified). In addition, a method other than the coating method, for example, a method of joining separately manufactured sheet materials may be employed.

The core layer 1093 obtained as described above is selectively irradiated with active radiation using a mask to pattern the core portion 1094 having a desired shape.

Examples of active radiation used for exposure include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, and X-rays. The electron beam can be irradiated at an irradiation dose of, for example, about 50 to 2000 KGy.

In the core layer 1093, the refractive index of the portion irradiated with the active radiation is changed (the refractive index may increase or decrease depending on the material of the core layer 1093), and the active radiation is not irradiated. A difference in refractive index occurs between the parts. For example, the portion of the core layer 1093 that has been irradiated with active radiation becomes the cladding portion 1095, and the portion that has not been irradiated becomes the core portion 1094. The reverse is also true. The refractive index of the cladding part 1095 is substantially equal to the refractive index of the

cladding layers

1091 and 1092.

Also, the core portion 1094 may be formed by irradiating the core layer 1093 with actinic radiation in a predetermined pattern and then heating. By adding this heating step, the difference in refractive index between the core portion 1094 and the cladding portion 1095 becomes larger, which is preferable. This principle will be described later in detail.

The pattern shape of the core portion 1094 to be formed is not particularly limited, and is linear, a shape having a curved portion, an irregular shape, a shape having a branching portion of a light path, a merging portion or a crossing portion, a condensing portion (a width etc. is reduced) Or a light diffusing part (a part where the width or the like is increased), or a combination of two or more of them. The feature of the present invention is that the core portion 1094 having any shape can be easily formed by setting the irradiation pattern of the active radiation.

The constituent material of each part of the optical waveguide 1009 and the method of forming the core part 1094 will be described in detail later.

The conductor layer 1051 bonded to the lower surface of the optical waveguide 1009, the conductor layer 1052 bonded to the upper surface, and the conductor layer 1053 bonded to the upper surface of the substrate 1002 are each patterned into a predetermined shape to obtain a desired wiring. Or it constitutes a circuit. Examples of the constituent materials of the conductor layers 1051 to 1053 include various metal materials such as copper, copper-based alloy, aluminum, and aluminum-based alloy. The thicknesses of the conductor layers 1051 to 1053 are not particularly limited, but are usually preferably about 3 to 120 μm and more preferably about 5 to 70 μm.

The conductor layers 1051 to 1053 are formed by, for example, metal foil bonding (adhesion), metal plating, vapor deposition, sputtering, or the like. For patterning the conductor layers 1051 to 1053, for example, methods such as etching, printing, and masking can be used.

The light emitting element 1010 has a light emitting portion 1101 and a pair of

terminals

1103 and 1105 on the lower surface side. The light emitting unit 1101 is located between the

terminals

1103 and 1105. When the

terminals

1103 and 1105 are energized, the light emitting unit 1101 emits light.

Note that the light-emitting portion of the light-emitting element 1010 may be a single light-emitting point or a plurality of light-emitting points. As a set of a plurality of light emitting points, for example, the light emitting points are arranged in a row (for example, 1 × 4, 1 × 12) or in a matrix (for example, n × m: n, m And those in which a plurality of light emitting points are arranged randomly (irregularly). The same applies to a light receiving portion in a light receiving element to be described later.

The light emitting element 1010 is mounted on the substrate 1002 such that the

terminals

1103 and 1105 are bonded (electrically connected) to the

portions

1531 and 1532 of the conductor layer 1053, respectively.

The electric element (electronic circuit element) 1012 is composed of, for example, a semiconductor element (semiconductor chip). Although the function of the electric element 1012 is not particularly limited, an example is one constituting a circuit for driving the light emitting element 1010. The electric element 1012 has two

terminals

1123 and 1125 on the lower surface side thereof.

The electric element 1012 is mounted on the optical waveguide 1009 such that the

terminals

1123 and 1125 are joined (electrically connected) to the

portions

1532 and 1533 of the conductor layer 1053, respectively.

The lower part including the

terminals

1103, 1105, 1123, and 1125 of the light emitting element 1010 and the electric element 1012 is sealed with an underfill material 1004. As a result, a gap is not formed between the light emitting element 1010 and the electric element 1012 and the optical waveguide 1009, and the underfill material 1004 is sealed. Further, the entire light emitting element 1010 and electric element 1012 (outer surface) are covered with a sealing material 1006 and sealed. As described above, the light-emitting element 1010 and the electric element 1012 are entirely sealed, and in particular, the light-emitting portion 1101 is sealed without being exposed to the outside. Contributes to improving the reliability of electronic components.

The underfill material 1004 is made of a material that substantially transmits light emitted from the light emitting unit 1101 (transmitted light 1018), and is preferably made of a transparent material.

As a constituent material of the underfill material 1004, an insulating resin material is preferable, and examples thereof include an epoxy resin, a phenol resin, a urethane resin, and a polyimide resin.

Further, as a constituent material of the sealing material 1006, an insulating resin material is preferable, and examples thereof include an epoxy resin, a phenol resin, a norbornene resin, and a silicon resin.

As shown in FIG. 20, the optical waveguide 1009 is formed with a through hole (through hole or via hole) 1008 penetrating in the thickness direction. The through hole 1008 is filled with a conductive material (for example, various metal materials such as copper, a copper-based alloy, aluminum, an aluminum-based alloy), and a conductor post (conductor portion) 1081 is formed. Through the conductor post 1081, predetermined portions of the conductor layer 1051 and the conductor layer 1052 are electrically connected to each other. In other words, the terminals of the light emitting element 1010 and the electric element 1012 can be energized by the conductor layer 1051 on the lower surface side of the optical waveguide 1009 and the conductor layer 1053 (parts 1531 and 1533) on the upper surface side of the substrate 1002. It has become. Note that the terminal 1105 and the terminal 1123 are electrically connected, and are connected to the ground side.

The optical waveguide 1009 has an optical path conversion unit 1096 that bends the optical path of the core unit 1094. The optical path conversion unit 1096 is provided at a connection portion between the core portion 1094 and the light guide path 1024 described later, that is, at the right end portion of the core portion 1094 in FIG. 20 and the lower end portion of the light guide path 1024. Thereby, an optical path can be bent efficiently and reliably.

The optical path conversion unit 1096 is configured by a reflection surface (mirror) 1961 that reflects at least a part of the transmission light 1018. The reflection surface 1961 is provided at a position directly below the light emitting unit 1101.

The reflecting surface 1961 is inclined by approximately 45 ° with respect to the optical path of the optical waveguide 1009, that is, the longitudinal direction of the core portion 1094, and has a function of reflecting most of the transmitted light 1018 (for example, 90% or more).

Such an optical path conversion unit 1096 is formed by removing (deleting) a part of the optical waveguide 1009 to form, for example, a concave portion having a triangular cross section, and using one inclined surface as the reflection surface 1961. The reflection surface 1961 may have a reflection film such as a multilayer optical thin film or a metal thin film (for example, an aluminum vapor deposition film) or a reflection increasing film. Although not illustrated, the concave portion of the optical path changing unit 1096 may be filled with a filler having a light-transmitting property with respect to the transmission light 1018.

In the illustrated configuration, the reflection surface 1961 (optical path conversion unit 1096) is formed across the clad layer 1091, the core layer 1093, and the clad layer 1092, but may be formed only in the core layer 1093. Further, a mirror component such as a prism, a mirror mirror, or a silicon mirror may be used.

A through hole 1022 penetrating the substrate 1002 is formed at a position directly below the light emitting unit 1101 on the substrate 1002. The cross-sectional shape of the through hole 1022 is not particularly limited, but in the present embodiment, it is circular (see FIG. 25). Other shapes include, for example, an ellipse, an oval, a rectangle (square), a hexagon, and an irregular shape.

A layer (conductor portion 1003) made of a conductive material (metal material) similar to that of the conductor layer 1051 is formed on the inner peripheral surface of the through hole 1022. With this conductor portion 1003, an electric signal or the like can be sent in the thickness direction of the substrate 1002 (hereinafter also simply referred to as “thickness direction”). In FIG. 25, the conductor portion 1003 is formed over the entire circumference of the inner peripheral surface of the through hole 1022 (in a ring shape), but may be partially formed in the circumferential direction.

Further, the conductor portion 1003 is formed substantially perpendicular to the substrate 1002. However, the present invention is not limited to this, and the conductor portion 1003 may be formed to be inclined at a predetermined angle with respect to the substrate 1002, or a part of the conductor portion 1003 may be deformed (bent, curved, branched, etc.). Good.

As a method of forming the conductor portion 1003, for example, a method of joining (adhering) a metal foil to the inner surface of the through hole 1022, a method of forming a metal layer on the inner surface of the through hole 1022 by a method such as metal plating, vapor deposition, sputtering, Examples thereof include a method in which a metal paste containing a metal filler is applied and heated (fired, cured, etc.) to form a metal layer.

The upper end portion of the conductor portion 1003 is electrically connected to the portion 1532 of the conductor layer 1053, and the lower end portion of the conductor portion 1003 is electrically connected to a predetermined portion of the conductor layer 1052. Thus, electrical signals can be exchanged between the conductor layers 1052 and 1053 formed at different positions in the thickness direction via the conductor portion 1003.

In addition, a portion inside the conductor portion 1003 in the through hole 1022 constitutes a light transmitting portion that transmits the transmission light 1018. That is, this portion serves as a light guide 1024 that guides (transmits) the transmission light 1018 in the thickness direction of the substrate 1002. In other words, the conductor portion 1003 is formed so as to surround the light guide path 1024. Thereby, the light guide 1024 and the conductor part 1003 can be efficiently arranged in the through hole 1022 having a limited size (inner diameter).

Further, the light guide 1024 is formed substantially perpendicular to the substrate 1002. However, the present invention is not limited thereto, and the light guide path 1024 may be formed to be inclined at a predetermined angle with respect to the substrate 1002, or a part of the light guide path 1024 may be deformed (curved, branched, etc.).

A portion inside the conductor portion 1003 in the through hole 1022 may be a cavity, but in this portion, a light-transmitting filler, that is, the transmittance of the transmitted light 1018 is 80% or more, preferably 90% or more. More preferably, the filler is filled with 95% or more of a material. This filler can be the same material as the core portion 1094 of the core layer 1093. Thereby, the light guide (core) 1024 can be easily formed, and advantages similar to those of the core 1094 described later can be obtained. Further, this filler can be the same material as the clad portion 1095 of the core layer 1093 or the same material as the

clad layer

1091 or 1092.

In the through hole 1022, the conductor portion 1003 and the light guide path 1024 are in contact with each other. However, the present invention is not limited to this. For example, the conductor portion 1003 and the light guide path 1024 form an intermediate layer (adhesive layer, insulating layer, etc.) not shown. It may be configured such that they are approaching each other.

The inner diameter of the through-hole 1022 is not particularly limited, but is usually preferably about 0.05 to 2 mm, more preferably about 0.1 to 0.5 mm.

Further, the outer diameter of the light guide path (core part) 1024 is not particularly limited, but is usually preferably about 0.005 to 0.3 mm, more preferably about 0.02 to 0.15 mm.

As described above, the conductor portion 1003 extending in the thickness direction and the light guide path 1024 are formed adjacent to each other, so that an electrical signal and an optical signal are transmitted in the thickness direction through one through hole 1022. be able to.

In the optical waveguide structure 1001 of the present embodiment, when energization is performed between the conductor layer 1051 and the portion 1531 of the conductor layer 1053, the conductor layer 1051 and the terminal 1105 are electrically connected via the conductor portion 1003 and the portion 1532. Therefore, power is supplied between the

terminals

1103 and 1105 of the light emitting element 1010, and the light emitting unit 1101 is turned on. Transmitted light 1018 emitted downward in FIG. 20 by turning on the light emitting unit 1101 passes through the underfill material 1004, passes through the light guide 1024 (core unit 1024) in the through hole 1022, and is reflected by the reflecting surface 1961. The core portion 1094 of the optical waveguide 1009 is bent, enters the core portion 1094, and repeats reflection at the interface with the clad portions (

cladding layers

1091 and 1092 and side clad portions 1095). It advances along the longitudinal direction (the left direction in FIG. 20) in 1094.

<Fifteenth embodiment: FIG. 21>
FIG. 21 shows a fifteenth embodiment of an optical waveguide structure 1001 of the present invention. Hereinafter, the optical waveguide structure 1001 will be described, but the description of the same matters (configuration, operation, etc.) as those in the fourteenth embodiment will be omitted, and differences will be mainly described.

The optical waveguide structure 1001 of the present embodiment is different from the fourteenth embodiment in the configuration of the light transmitting portion (near the through-hole 1022) of the substrate 1002, and is otherwise the same as the fourteenth embodiment. That is, the same conductor portion 1003 and light guide path 1024 as those described above are formed in the through hole 1022 of the substrate 1002, but a lens capable of condensing or diffusing the transmitted light 1018 below the through hole 1022. A portion 1026 is provided.

That is, a lens portion 1026 composed of a convex lens (more precisely, a plano-convex lens) is provided at the lower end of the light guide path 1024 (exit side of the transmission light 1018).

Accordingly, the transmission light 1018 emitted from the light emitting unit 1101 downward in FIG. 21 passes through the underfill material 1004, passes through the light guide 1024, and is condensed by the lens unit 1026, and the light beam (beam). The light beam is reflected by the reflecting surface 1961 and bent by 90 °, enters the core portion 1094 of the optical waveguide 1009, and travels in the core portion 1094 along the longitudinal direction (left direction in FIG. 21).

By providing such a lens portion 1026, clearer (sharp) transmitted light can be obtained, and more excellent light transmission characteristics can be obtained.

The lens unit 1026 may be capable of diffusing the transmission light 1018. In this case, a concave lens may be used.

The material of the lens constituting the lens portion 1026 may be a material different from the refractive index of the light guide 1024. Depending on whether the refractive index of the lens material is higher or lower than the refractive index of the light guide 1024, the function of the lens portion 1026 can be set to either a condenser lens or a diffusing lens.

Further, the installation position of the lens unit 1026 is not limited to the position illustrated in FIG. 21, and may be, for example, in the middle or upper end of the light guide 1024 (through hole 1022), or may be incident on another part, for example, the core unit 1094. It may be a side end or an emission side end.

<Sixteenth Embodiment: FIG. 22>
FIG. 22 shows a sixteenth embodiment of the optical waveguide structure 1001 of the present invention. Hereinafter, the optical waveguide structure 1001 will be described, but the description of the same matters (configuration, operation, etc.) as those in the fourteenth embodiment will be omitted, and differences will be mainly described.

The optical waveguide structure 1001 of the present embodiment is different from the fourteenth embodiment in the configuration of the light transmitting portion (near the through-hole 1022) of the substrate 1002, and is otherwise the same as the fourteenth embodiment. That is, a conductor portion 1003 similar to that described above is formed in the through hole 1022 of the substrate 1002, and a vertical optical waveguide 1023 is formed inside thereof.

The vertical optical waveguide 1023 includes a core portion 1024 and a clad portion 1025 surrounding the outer periphery of the core portion 1024. The core portion 1024 has a higher refractive index than the clad portion 1025. By forming such a vertical optical waveguide 1023 in the through-hole 1022, loss of light quantity due to light leakage or the like is further reduced as compared with the conductor portion 1024 in the fourteenth embodiment, and the transmission characteristics of the transmission light 1018 are improved. More improved.

The constituent material and the formation method of the core part 1024 can be the same as those of the core part 1094. Alternatively, the core portion 1024 may be the same as the light-transmitting filler described in the first embodiment. The constituent material of the clad portion 1025 can be the same as that of the clad portion 1095 or the

clad layers

1091 and 1092.

<Seventeenth Embodiment: FIG. 23>
FIG. 23 shows a seventeenth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, the optical waveguide structure 1001 will be described, but the description of the same matters (configuration, operation, etc.) as those in the fourteenth to sixteenth embodiments will be omitted, and differences will be mainly described.

The optical waveguide structure 1001 of this embodiment is the same as that of the sixteenth embodiment except that a lens portion 1026 is provided. That is, the conductor portion 1003 and the vertical optical waveguide 1023 similar to those described above are formed in the through hole 1022 of the substrate 1002, but the transmission light 1018 can be condensed or diffused below the through hole 1022. A lens portion 1026 similar to the above is provided.

The effect of providing the lens unit 1026, the lens material constituting the lens unit 1026, the installation position of the lens unit 1026, and the like are the same as described in the sixteenth embodiment.

<Eighteenth embodiment: FIG. 24>
FIG. 24 shows an eighteenth embodiment of the optical waveguide structure 1001 of the present invention. Hereinafter, the optical waveguide structure 1001 will be described, but the description of the same matters (configuration, operation, etc.) as those in the fourteenth to seventeenth embodiments will be omitted, and differences will be mainly described.

The optical waveguide structure 1001 of the present embodiment is different from the seventeenth embodiment in the configuration of the light transmitting portion (near the through hole 1022) of the substrate 1002, and is otherwise the same as the seventeenth embodiment. That is, as shown in FIG. 27, the cross-sectional shape of the through-hole 1022 of the substrate 1002 is a shape (an irregular shape) in which a circular portion 1222 and a rectangular portion 1224 are coupled, and the vertical optical waveguide 1023 (or The light guide 1024 may be inserted), and the conductor portion 1003 is inserted into the rectangular portion 1224. The upper end portion and the lower end portion of the conductor portion 1003 are electrically connected to the portion 1532 and the conductor layer 1052 of the conductor layer 1053, respectively.

In such a configuration, the volume (volume ratio) of the vertical optical waveguide 1023 and the conductor portion 1003 can be more accurately defined by setting the cross-sectional areas in advance in each of the circular portion 1222 and the rectangular portion 1224. There is. In addition, there is an advantage that the conductor portion 1003 can be formed only in a necessary direction in the circumferential direction of the circular portion 1222.

<Nineteenth Embodiment: FIGS. 32 to 34>
As shown in FIGS. 32 to 34, an optical waveguide structure 2001 of the present invention includes a substrate 2002, an optical waveguide 2009 formed under the substrate 2002, and an optical path conversion unit 2096 that bends the optical path of the optical waveguide 2009 ( A reflective surface 2961), a light emitting element 2010 and an electronic circuit element 2012 mounted on the substrate 2002, and a conductor layer 2005 formed on the upper surface of the substrate 2002.

Examples of the constituent material of the substrate 2002 include an epoxy resin, a phenol resin, a bismaleimide resin, a bismaleimide / triazine resin, a triazole resin, a polycyanurate resin, a polyisocyanurate resin, a benzocyclobutene resin, a polyimide, and a polybenzoxazole resin. And resin materials such as norbornene resin and semiconductor materials such as silicon, gallium / arsenic, indium / phosphorus, germanium, silicon carbide, and silicon germanium. These materials may be used alone or in combination.

Further, the substrate 2002 may be a substrate in which a fiber base material (woven fabric, nonwoven fabric, woven fabric, knitted fabric, etc.) such as glass fiber or resin fiber is impregnated with the above-described resin material (prepreg, etc.). For example, a glass cloth impregnated with an epoxy resin is called a glass epoxy substrate, but such a substrate can be used as the substrate 2. The substrate 2002 including such a fiber base material is particularly advantageous when the optical waveguide 2009 or a conductor layer (metal layer) is bonded to the substrate 2002 because the substrate 2002 including the fiber base is relatively thin but has high strength and a low coefficient of thermal expansion. It is.

Further, the substrate 2002 may be a stacked body of a plurality of layers. For example, a laminate of a first layer and a second layer made of resin materials having different compositions (kinds), a layer (sheet material) in which the fiber base material is impregnated with a resin material, and a resin material The thing which laminated | stacked the layer is mentioned. In addition, it cannot be overemphasized that the layer structure in a laminated body is not limited to this.

The thickness of the substrate 2002 is not particularly limited, but is usually preferably about 50 μm to 4 mm, more preferably about 100 μm to 1.5 mm, and further preferably about 150 μm to 1.2 mm. The substrate 2002 may be hard (rigid) or flexible (flexible). Of course, it may have both characteristics.

In this embodiment, since the transmission light 2018 is transmitted through the substrate 2002, the substrate 2002 has a transmittance of the transmission light 2018 of 80% or more, preferably 90% or more, more preferably 95% or more. It is supposed to be. In this manner, by configuring the substrate 2002 itself (all or a part of the substrate 2002) with a material having translucency with respect to the transmission light 2018, that is, by making the substrate 2002 a substantially transparent transparent substrate, The portion immediately below the light emitting portion 2101 in the substrate 2002 constitutes the light transmitting portion 2024 even if a through hole 2025 described later is not formed. The light emitting portion 2101 of the light emitting element 2010 and the core portion 2094 (optical path changing portion 2096) of the optical waveguide 2009 are optically connected via the light transmitting portion 2024.

An optical waveguide 2009 is bonded to the lower surface of the substrate 2002. In the configuration shown in the drawing, the optical waveguide 2009 is directly bonded to the lower surface of the substrate 2002 (the optical waveguide 2009 is adjacent to the substrate 2002). However, the configuration is not limited to this, and the optical waveguide 2009 is formed via at least one intermediate layer. It may be. The intermediate layer can be formed for any purpose, and examples thereof include an adhesive layer, a conductor layer (wiring pattern), an insulating layer, or a laminate of two or more layers including these.

Among these, as the adhesive layer, for example, a sheet material such as a bonding sheet can be used, and as its constituent materials, for example, an epoxy adhesive, an acrylic adhesive, a phenol resin adhesive, a cyanate resin adhesive Agents, maleimide resin adhesives and the like. In particular, it is preferably made of a material having flux activity for preventing oxidation or the like. This adhesive layer preferably has electrical insulation.

Further, as the adhesive layer, an adhesive layer made of a coating film may be formed on the lower surface of the substrate 2002 or the upper surface of the optical waveguide 2009 without using a sheet material. The thickness of the adhesive layer is not particularly limited, but is preferably about 0.5 to 150 μm, more preferably about 10 to 70 μm.

The optical waveguide 2009 is formed by laminating a clad layer 2091, a core layer 2093, and a clad layer 2092 in this order from the lower side in FIGS. 33 and 34. The core layer 2093 includes a core portion 2094 having a predetermined pattern and a clad. A portion 2095 is formed (see FIGS. 33 and 34).

The core portion 2094 has a higher refractive index than the clad portion 2095, and also has a higher refractive index than the

clad layers

2091 and 2092. The

clad layers

2091 and 2092 constitute the clad portions located at the lower part and the upper part of the core part 2094, respectively. With such a configuration, the core portion 2094 functions as an optical path of the transmission light 2018 surrounded by the cladding portion on the entire outer periphery.

The constituent material of the core layer 2093 is a material whose refractive index changes by irradiation with active radiation (active energy ray, electron beam, X-ray or the like) or by further heating. Preferable examples of such materials include those containing a resin composition containing a cyclic olefin resin such as a benzocyclobutene polymer and a norbornene polymer (resin) as a main material, and include a norbornene polymer (mainly The material) is particularly preferred.

The core layer 2093 made of such a material is excellent in resistance to deformation such as bending, and even when it is repeatedly curved and deformed, the core layer 2094 and the clad portion 2095 are separated from each other, and the layer adjacent to the core layer 2093 ( The delamination with the clad layers 2091 and 2092) hardly occurs, and the occurrence of microcracks in the core portion 2094 and the clad portion 2095 is also prevented. As a result, the optical transmission performance of the optical waveguide 2009 is maintained, and the optical waveguide 2009 having excellent durability is obtained.

The constituent material of the core layer 2093 includes, for example, an antioxidant, a refractive index adjuster, a plasticizer, a thickener, a reinforcing agent, a sensitizer, a leveling agent, an antifoaming agent, an adhesion aid and a flame retardant. The additive may be contained. Addition of an antioxidant has the effect of improving high temperature stability, improving weather resistance, and suppressing light deterioration. Examples of such an antioxidant include phenols such as monophenols, bisphenols, and triphenols, and aromatic amines. Further, the resistance to bending can be further increased by adding a plasticizer, a thickener, and a reinforcing agent.

The content of additives typified by the antioxidant (the total in the case of two or more types) is preferably about 0.5 to 40% by weight, preferably 3 to 30% by weight, based on the entire constituent material of the core layer 2093. The degree is more preferred. If this amount is too small, the function of the additive cannot be exhibited sufficiently. If the amount is too large, depending on the type and characteristics of the additive, light transmitted through the core portion 2094 (transmitted light 2018) is transmitted. There is a risk of decreasing the rate, patterning failure, refractive index instability and the like.

An example of a method for forming the core layer 2093 is a coating method. Examples of the coating method include a method in which a core layer forming composition (varnish or the like) is applied and cured (solidified), and a method in which a curable monomer composition is applied and cured (solidified). In addition, a method other than the coating method, for example, a method of joining separately manufactured sheet materials may be employed.

The core layer 2093 obtained as described above is selectively irradiated with actinic radiation using a mask to pattern the core portion 2094 having a desired shape.

In the core layer 2093, the portion irradiated with active radiation has its refractive index changed (the refractive index may increase or decrease depending on the material of the core layer 2093), and the active radiation was not irradiated. A difference in refractive index occurs between the parts. For example, the portion of the core layer 2093 that has been irradiated with active radiation becomes the cladding portion 2954, and the portion that has not been irradiated becomes the core portion 2094. The reverse is also true. The refractive index of the cladding part 2095 is substantially equal to the refractive index of the

cladding layers

2091 and 2092.

Also, the core portion 2094 may be formed by irradiating the core layer 2093 with actinic radiation in a predetermined pattern and then heating. By adding this heating step, the difference in refractive index between the core portion 2094 and the clad portion 2095 becomes larger, which is preferable. This principle will be described later in detail.

The pattern shape of the core portion 2094 to be formed is not particularly limited, and is linear, a shape having a curved portion, an irregular shape, a shape having a branching portion of a light path, a merging portion or a crossing portion, a condensing portion (the width and the like are reduced) Or a light diffusing part (a part where the width or the like is increased), or a combination of two or more of these. A feature of the present invention is that the core portion 2094 having any shape can be easily formed by setting the irradiation pattern of actinic radiation.

The constituent material of each part of the optical waveguide 2009 and the method of forming the core part 2094 will be described in detail later.

Such an optical waveguide 2009 has an optical path conversion unit 2096 that bends the optical path of the core unit 2094. The optical path conversion unit 2096 includes a reflection surface (mirror) 2961 that reflects at least a part of transmission light (light emitted from the light emitting unit 2101) 2018. The reflection surface 2961 is provided at a position directly below the light emitting unit 2101.

The reflecting surface 2961 is inclined by approximately 45 ° with respect to the optical path of the optical waveguide 2009, that is, the longitudinal direction of the core portion 2094 (the X direction in FIGS. 32 and 33, the front-rear direction in FIG. 34), and is emitted from the light emitting portion 2101. It has a function of reflecting most of the transmitted light 2018 (for example, 90% or more).

Such an optical path conversion unit 2096 is formed by removing (deleting) a part of the optical waveguide 2009 to form, for example, a concave portion having a triangular cross section (see FIG. 33), and using one inclined surface as the reflective surface 2961. It is. The reflection surface 2961 may have a reflection film or a reflection enhancement film such as a multilayer optical thin film or a metal thin film (for example, an aluminum vapor deposition film). Examples of a method for removing a part of the optical waveguide 2009 include a method such as cutting and laser light irradiation.

Although not shown, the concave portion of the optical path changing unit 2096 is filled with a filler, particularly a filler (sealing material) having a refractive index different from that of the core 2094, and a filler (sealing material) made of a metal material. Also good. Note that the reflection surface 2961 is not limited to the total reflection, and may be a part that reflects a part of the transmission light 2018 and transmits the remaining part, such as a half mirror or a dichroic mirror. In this case, the optical path conversion unit 2096 has a function as a beam splitter that separates the optical path in two directions (left direction and downward direction in FIG. 33). Such optical characteristics of the reflecting surface 2961 can be appropriately set according to the optical path design of the transmission light 2018.

In the configuration shown in the figure, the reflection surface 2961 (optical path conversion unit 2096) is formed across the clad layer 2091, the core layer 2093, and the clad layer 2092. However, the present invention is not limited to this, and for example, only in the core layer 2093. It may be formed.

The formation of the core portion 2094 and the formation of the optical path conversion portion 2096 may be performed before or after mounting (positioning and setting) a light emitting element 2010 or the like to be described later on the substrate 2002. In any case, the formation position is easily and accurately. I can grasp it. That is, since the position of the light emitting portion 2101 with respect to the substrate 2002 is specified by the positioning means 2033 described later, when forming the core portion 2094 and the optical path changing portion 2096 in the optical waveguide 2009 on the substrate 2002, the core portion 2094 The formation position (exposure location) and the formation position of the optical path conversion unit 2096 can be easily matched with the position corresponding to the light emitting unit 2101 (the position directly below the light emitting unit 2101).

In the upper part of the substrate 2002, two

recesses

2003 and 2004 that open to the upper surface and at least one side surface of the substrate 2002 are formed. A light emitting element 2010 and an electronic circuit element 2012 are inserted (installed) into the

recesses

2003 and 2004, respectively.

The light emitting element 2010 has a light emitting part 2101 on the lower surface side and a pair of

terminals

2103 and 2105 on the upper surface side (may further have other terminals). When energization is performed between both

terminals

2103 and 2105, the light emitting unit 2101 emits light and the transmission light 2018 is emitted.

Note that the light-emitting portion 2101 in the light-emitting element 2010 may be a single light-emitting point or a plurality of light-emitting points. As a set of a plurality of light emitting points, for example, the light emitting points are arranged in a row (for example, 1 × 4, 1 × 12) or in a matrix (for example, n × m: n, m And those in which a plurality of light emitting points are arranged randomly (irregularly). The same applies to a light receiving portion in a light receiving element to be described later.

The light emitting element 2010 is installed in the recess 2003 such that the light emitting portion 2101 is joined (contacted) to the bottom surface (lower surface) 2030 of the recess 2003. Note that a plurality of light emitting units 2101 may be arranged along the vertical direction in FIG.

The electronic circuit element 2012 is composed of, for example, a semiconductor element (semiconductor chip). The electronic circuit element 2012 has a plurality of terminals (terminals 2123, 2125) on the upper surface side. Note that the electronic circuit element 2012 may have other terminals in addition to the

terminals

2123 and 2125.

Although the function of the electronic circuit element 2012 is not particularly limited, an example is one that configures a circuit for driving the light emitting element 2010. Further, as will be described later, when a light receiving element is provided, one having a function of processing (for example, amplifying) an output signal from the light receiving element is exemplified.
When the optical waveguide structure 2001 includes both the light emitting element 2010 and the light receiving element, the electronic circuit element 2012 can have both of the functions described above.

In this specification, a light emitting element 2010, a light receiving element, an electronic circuit element 2012, other various elements, or an element obtained by combining two or more of these elements is referred to as an “electric element” or simply “element”.

In addition, the light emitting element 2010, the light receiving element, and the electronic circuit element 2012 are not limited to being configured as separate elements, but a configuration (composite element) in which at least two of them are connected or integrated (one chip). It may be.

The substrate 2002 is provided with positioning means 2033 and 2043 for determining an installation position of the electric elements (light emitting element 2010 and electronic circuit element 2012), particularly a position with respect to the substrate 2002. Hereinafter, the positioning means 2033 and 2043 will be sequentially described.

In the upper part of the substrate 2002, recesses 2003 and 2004 that are opened on the upper surface of the substrate 2002 are formed. The recess 2003 opens to the right and below in FIG. 32, and has a step with the upper surface of the substrate 2002 at the edge of the recess 2003, that is, to the left and above in FIG. Of these steps, an abutting surface 2031 is formed on the left side in FIG. 32, and an abutting surface 2032 is formed on the upper side in FIG. 32. The abutting

surfaces

2031 and 2032 stand up perpendicularly to the bottom surface 2030 of the recess 2003, and the abutting

surfaces

2031 and 2032 are also perpendicular to each other. Positioning means (for light emitting element) 2033 is constituted by the abutting

surfaces

2031 and 2032. Note that the positioning means 2033 may include a bottom surface 2030, whereby the substrate 2002 can be positioned in the thickness direction.

The light emitting element 2010 has a lower surface abutted against the bottom surface 2030 of the recess 2003 and two adjacent (orthogonal) side surfaces of the light emitting element 2010 abutted (pressed) against the contact surfaces 2031 and 2032 respectively. Installed in 2003. Thereby, the position of the light emitting element 2010 in the X direction is regulated by the abutting surface 2031, and the position in the Y direction is regulated by the abutting surface 2032. That is, the light emitting element 2010 is positioned in both the X direction and the Y direction (two-dimensional direction). In this way, positioning of the light emitting element 2010 in the plane direction (two-dimensional direction) with respect to the substrate 2002 can be reliably performed, and the operation allows the light emitting element 2010 to approach the recess 2003 with respect to the fixed substrate 2002. 32, it is only necessary to move (relatively move) in the upper left direction in FIG. 32 and bring it into contact with the abutting

surfaces

2031 and 2032 respectively, so that the positioning operation can be performed very easily.

In particular, since positioning is performed not only in the longitudinal direction (X direction) of the core portion 2094 but also in the width direction (Y direction) of the core portion 2094, for example, even when the width of the core portion 2094 is small (fine optical circuit). In addition, the position of the light emitting portion 2101 of the light emitting element 2010 can be accurately overlaid on the core portion 2094 (in plan view).

Such positioning means 2033 determines the position of the light emitting element 2010 (light emitting portion 2101) with respect to the substrate 2002. This is also possible by determining the position of the optical waveguide 2009 formed on the lower surface of the substrate 2002 with respect to the core portion 2094. In addition, since the optical path conversion unit 2096 (reflection surface 2961) has a positional relationship with the core unit 2094, the position relative to the optical path conversion unit 2096 (reflection surface 2961) is also determined.

That is, as shown in FIG. 32, the positioning unit 2033 performs positioning so that the position of the light emitting unit 2101 of the light emitting element 2010 overlaps the position of the optical path conversion unit 2096 (reflecting surface 2961) in plan view. As a result, the reflecting surface 2961 is positioned directly below the light emitting unit 2101, and the designed optical path can be accurately formed.

The depth of the recess 2003 is preferably substantially equal to the thickness of the light emitting element 2010 or larger than the thickness of the light emitting element 2010. As a result, the upper part of the light emitting element 2010 is accommodated in the recess 2003 without protruding from the recess 2003.

The recess 2004 is open to the left and below in FIG. 32, and has a step with the upper surface of the substrate 2002 at the edge of the recess 2003, that is, on the left and right and above in FIG. Of these steps, an abutment surface 2041 is formed on the right side in FIG. 32, and an abutment surface 2042 is formed on the upper side in FIG. The abutting

surfaces

2041 and 2042 stand up perpendicularly to the bottom surface 2040 of the recess 2004, and the abutting

surfaces

2041 and 2042 are also perpendicular to each other. The abutting

surfaces

2041 and 2042 constitute positioning means (for electronic circuit element) 2043 of the electronic circuit element 2012. Note that the positioning means 2043 may include a bottom surface 2040, whereby the substrate 2002 can be positioned in the thickness direction.

The electronic circuit element 2012 has its lower surface in contact with the bottom surface 2040 of the recess 2004, and two adjacent (orthogonal) side surfaces of the electronic circuit element 2012 are in contact (pressing contact) with the contact surfaces 2041 and 2042, respectively. Is installed in the recess 2004. Accordingly, the position of the electronic circuit element 2012 in the X direction is regulated by the abutting surface 2041 and the position of the electronic circuit element 2012 in the Y direction is regulated by the abutting surface 2042. That is, the electronic circuit element 2012 is positioned in both the X direction and the Y direction (two-dimensional direction). As described above, the electronic circuit element 2012 can be reliably positioned in the plane direction (two-dimensional direction) with respect to the substrate 2002, and the operation can be performed by placing the electronic circuit element 2012 in the recess 2004 with respect to the fixed substrate 2002. It is only necessary to make them approach, move (relatively move) in the upper right direction in FIG. 32, and abut against the abutting

surfaces

2041 and 2042, respectively, so that the positioning operation can be performed very easily.

Such positioning means 2043 determines the position of the electronic circuit element 2012 (terminals 2123 and 2125) with respect to the substrate 2002, which also determines the position with respect to the light emitting element 2010 positioned by the positioning means 2033. Furthermore, the position relative to the optical path conversion unit 2096 (reflection surface 2961) is also determined.

As described above, when the positional relationship between the electronic circuit element 2012 and the light emitting element 2010 is accurately determined, when the conductor layer 2005 described later is formed (patterning), particularly between the electronic circuit element 2012 and the light emitting element 2010. When forming the portion 2052 spanned over, it can be formed in a more accurate shape and position.

The depth of the concave portion 2004 is preferably substantially equal to the thickness of the electronic circuit element 2012 or larger than the thickness of the electronic circuit element 2012. Thus, the electronic circuit element 2012 is accommodated in the recess 2004 without the upper portion protruding from the recess 2004.

Note that the positioning means 2033 and 2043 in the present embodiment also perform positioning in the thickness direction of the substrate 2002 (directions orthogonal to the X direction and the Y direction) because the lower surface of the electric element also contacts the

bottom surfaces

2030 and 2040. Do. Therefore, the positioning means in the present embodiment can accurately perform positioning in the three-dimensional direction.

Further, the positioning means in the present embodiment is one directly formed on the substrate 2002 (the abutting

surfaces

2031, 2032, 2041, 2042), but is not limited to this, and is not stationary with respect to the substrate 2002, in particular, the substrate Another member may be fixedly installed with respect to 2002. An example of this is a positioning member that is fixed to the substrate 2002 and has an abutment surface on which an electrical element can come into contact.

In the present invention, the positioning means may position the electric element only in one of the X direction and the Y direction. In this case, positioning of the substrate 2002 in the thickness direction may or may not be performed.

A conductor layer (metal layer) 2005 is formed on the upper surface of the substrate 2002. The conductor layer 2005 is patterned into a predetermined shape to form a desired electrical wiring or electrical circuit.

In this embodiment, the conductor layer 2005 has

portions

2051, 2052, and 2053. The part 2051 is formed across the upper surface of the substrate 2002 and the upper surface of the electronic circuit element 2012 and is electrically connected to the terminal 2125. The region 2052 is formed across the upper surface of the substrate 2002, the upper surface of the light emitting element 2010, and the upper surface of the electronic circuit element 2012, and is electrically connected to the

terminals

2103 and 2125, respectively. The region 2053 is formed across the upper surface of the substrate 2002 and the upper surface of the light-emitting element 2010 and is electrically connected to the terminal 2105. The

part

2051 or 2053 is connected to, for example, the ground.

Examples of the constituent material of the conductor layer 2005 include various metal materials such as copper, a copper alloy, aluminum, an aluminum alloy, gold, a gold alloy, and solder. Depending on the constituent material of the substrate 2002 (for example, a substrate 2002 made of a semiconductor material), tungsten, a tungsten alloy, or the like can be used.

The thickness of the conductor layer 2005 is not particularly limited, but is usually preferably about 2 to 200 μm, more preferably about 3 to 120 μm, and further preferably about 5 to 70 μm.

The conductor layer 2005 is formed by a method such as bonding (adhesion) of metal foil, metal plating, vapor deposition, sputtering, or the like. For example, etching, printing, masking, or the like can be used for patterning on the conductor layer 2005.

When a metal that easily diffuses into the semiconductor material, such as copper, is used (contained) as the constituent material of the conductor layer 2005, the junction with the semiconductor material (when the substrate 2 is made of a semiconductor material) is, for example, titania or tantalum. It is preferable to form via a barrier layer (not shown) composed of, for example.

In addition, when a metal having poor adhesion to a semiconductor material, such as tungsten, is used as a constituent material of the conductor layer 2005, a bonding portion with the semiconductor material (when the substrate 2002 is formed of a semiconductor material) improves adhesion. It is preferable to form it through an adhesive layer (not shown) that can be used.

Note that the pattern of the conductor layer 2005 is not limited to that shown in FIGS. 32 to 34, and may have any shape and arrangement.

In addition, the formation position of the conductor layer 2005 is not limited to the upper portion (upper surface) of the optical waveguide structure 2001 as shown in the figure, but for example, the lower surface of the optical waveguide 2009 or the inside of the optical waveguide structure 2001 (for example, the optical waveguide 2009 and the like). A similar conductor layer (electrical wiring or electric circuit) may be formed between the substrate 2002 and the substrate.

In the optical waveguide structure 2001 of the present embodiment, when the electronic circuit element 2012 is operated to energize between the

terminals

2103 and 2105 of the light emitting element 2010, the light emitting unit 2101 is turned on and emitted downward in FIG. The transmitted light 2018 is sequentially transmitted through the light transmitting portion 2024 and the cladding layer 2092 of the substrate 2002, reflected by the reflecting surface 2961, bent by 90 °, enters the core portion 2094 of the optical waveguide 2009, and enters the cladding portion (cladding layer 2091). , 2092 and the side (left and right in FIG. 33) clad portion 2095), and repeats reflection in the core portion 2094 along the longitudinal direction (left direction in FIGS. 32 and 33).

<20th Embodiment: FIG. 35>
FIG. 35 shows a twentieth embodiment of an optical waveguide structure 2001 of the present invention. Hereinafter, the optical waveguide structure 2001 will be described, but the description of the same matters (configuration, operation, etc.) as those in the nineteenth embodiment will be omitted, and differences will be mainly described.

The optical waveguide structure 2001 of the present embodiment is the same as the nineteenth embodiment except for the configuration of the positioning means. In other words, in the present embodiment, the upper surface of the substrate 2002 is a flat surface, and the positioning means for determining the installation position of the electric element is composed of the positioning member 2006 fixedly installed on the substrate 2002.

The positioning member 2006 is formed of a plate material (or a sheet material) whose thickness is approximately equal to or thinner than the thickness of the light emitting element 2010 and / or the electronic circuit element 2012, and an adhesive layer 2007 is provided on the upper surface of the substrate 2002. Are joined (fixed).

As shown in the upper part of FIG. 35, the planar shape of the positioning member 2006 is substantially T-shaped, and is an L-shape with which two adjacent (orthogonal) side surfaces (corner portions) of the light emitting element 2010 abut. The abutting surface 2061 and an L-shaped abutting surface 2062 with which two adjacent (orthogonal) side surfaces (corner portions) of the electronic circuit element 2012 abut are provided.

The lower surface of the light emitting element 2010 is in contact with the upper surface of the substrate 2002, and two adjacent (orthogonal) side surfaces of the light emitting element 2010 are in contact (pressing contact) with the contact surface 2061, so that the X direction and Y Each direction position is regulated. That is, the light emitting element 2010 is positioned in both the X direction and the Y direction (two-dimensional direction).

Similarly, the lower surface of the electronic circuit element 2012 is in contact with the upper surface of the substrate 2002, and two adjacent (orthogonal) side surfaces of the electronic circuit element 2012 are in contact (pressing contact) with the abutting surface 2062. The positions in the X direction and the Y direction are restricted. That is, the electronic circuit element 2012 is positioned in both the X direction and the Y direction (two-dimensional direction).

By using such a positioning member 2006, there is an advantage that both the light emitting element 2010 and the electronic circuit element 2012 can be simultaneously positioned by one positioning member 2006. Further, by adjusting or changing the fixing position of the positioning member 2006 with respect to the substrate 2002, or selecting the positioning member 2006 having a different shape or size and fixing the positioning member 2006 to the substrate 2002, the electric element (the light emitting element 2010 and / or the electronic device) is selected. There is also an advantage that the installation position of the circuit element 2012) can be freely set or changed.

As the adhesive layer 2007, the same adhesive layer as described in the nineteenth embodiment can be used.

In the present embodiment, the planar shape and thickness of the positioning member 2006 are not limited to those shown in the drawings, and may be any shape and size. In this embodiment, both the light emitting element 2010 and the electronic circuit element 2012 are positioned by one positioning member 2006. However, the present invention is not limited thereto, and the light emitting element 2010 and the electronic circuit element 2012 are different positioning members. And the direction of the positioning is not particularly limited.

<21st Embodiment: FIG. 36>
FIG. 36 shows a twenty-first embodiment of an optical waveguide structure 2001 of the present invention. Hereinafter, the optical waveguide structure 2001 will be described, but the description of the same matters as in the nineteenth embodiment will be omitted, and differences will be mainly described.

The optical waveguide structure 2001 of the present embodiment is the same as the nineteenth embodiment except for the configuration of the substrate 2002. That is, the substrate 2002 may not have sufficient transmission light 2018, and a through hole 2025 penetrating the substrate 2002 is formed at a position directly below the light emitting portion 2101 in the substrate 2002. The through hole 2025 constitutes a light transmitting portion 2024 that transmits the transmission light 2018. That is, the through hole 2025 serves as a light guide for guiding (transmitting) transmission light in the thickness direction of the substrate 2002.

The cross-sectional shape of the through-hole 2025 is not particularly limited, and may be any shape such as, for example, a circle, an ellipse, a rectangle (square), a hexagon, other polygons, and an irregular shape.

Although not shown, the inside (all or a part) of the through-hole 2025 is filled with a filler made of a material having a transmission light transmittance of 80% or more, preferably 90% or more, more preferably 95% or more. May be. This filler may be made of the same material as the constituent material of any of the core portion 2094, the clad portion 2095, the clad layer 2091, and the clad layer 2092.

Although not shown, a layer made of a conductive material may be formed on the inner surface of the through hole 2025 and the like, thereby providing a function of transmitting an electrical signal in addition to the light transmission function.

In the optical waveguide structure 2001 of this embodiment, when the electronic circuit element 2012 is energized to energize between the

terminals

2103 and 2105 of the light emitting element 2010, the light emitting unit 2101 is turned on and emitted downward in FIG. The transmitted light 2018 passes through the through-hole 2025 of the substrate 2002, passes through the cladding layer 2092, is reflected by the reflecting surface 2961, bends 90 °, enters the core portion 2094 of the optical waveguide 2009, and enters the cladding portion (cladding layer). 2091, 2092, and the side (left and right clad portions 2095 in FIG. 33) are repeatedly reflected at the interface between the core portions 2094 along the longitudinal direction (left direction in FIG. 36).

<Twenty-second embodiment: FIG. 37>
FIG. 37 shows a twenty-second embodiment of the optical waveguide structure 2001 of the present invention. Hereinafter, the optical waveguide structure 2001 will be described, but the description of the same matters as those in the nineteenth and twenty-first embodiments will be omitted, and differences will be mainly described.

The optical waveguide structure 2001 of this embodiment is the same as that of the twenty-first embodiment except that a lens portion 2026 capable of condensing or diffusing the transmission light 2018 is provided in the light transmitting portion 2024 (through hole 2025). It is. That is, a lens portion 2026 formed of a convex lens (more precisely, a plano-convex lens) is provided in a lower portion (incident side to the optical waveguide 2009) in the through hole 2025.

As a result, the light emitted downward from the light emitting portion 2101 in FIG. 37 passes through the through hole 2025 of the substrate 2002, is condensed by the lens portion 2026, and the luminous flux (beam) is reduced. The light is reflected by the reflecting surface 2961 and bent by 90 °, enters the core portion 2094 of the optical waveguide 2009, and advances in the core portion 2094 along the longitudinal direction (left direction in FIG. 37). By providing such a lens portion 2026, clearer (sharp) transmitted light can be obtained, and more excellent light transmission characteristics can be obtained.

The lens unit 2026 may be capable of diffusing the transmission light 2018. In this case, a concave lens may be used.

Further, the installation position of the lens unit 2026 is not limited to the position shown in FIG. 37, and may be, for example, in the middle or upper part of the light transmitting unit 2024 (through hole 2025), or in other places, for example, the core unit 2094. It may be on the way or at the exit side end (left end in FIG. 37).

Also, such a lens portion 2026 may be provided for the optical waveguide structure 2001 of the nineteenth and twentieth embodiments.

In each of the above embodiments, the light emitting element 2010 can be replaced with a light receiving element. The light receiving element has, for example, a light receiving portion on the lower surface side and terminals (for example, a pair of terminals) on the upper surface side. When the light receiving portion receives the transmission light 2018, it is photoelectrically converted and an electrical signal is output from the terminal. This electric signal is input to the electronic circuit element 2012 and subjected to signal processing (for example, signal amplification).

Further, the optical waveguide structure 2001 of the present invention may include both a light emitting element and a light receiving element. In this case, the light emitted from the light emitting unit of the light emitting element can be received by the light receiving unit of the light receiving element via the optical path conversion unit 2096 and the optical waveguide 2009 (and the optical path conversion unit 2096).

The first to twenty-second embodiments have been described above. However, the present invention is not limited to these embodiments, and may have other configurations as long as the gist of the invention is not changed. Further, the present invention may be a combination of configurations included in any two or more of the first to twenty-second embodiments.

The optical waveguide structure of the present invention as described above is excellent in light transmission efficiency and durability. For this reason, by providing the optical waveguide structure of the present invention, high-quality optical communication can be performed between two points, and a highly reliable electronic device (electronic device of the present invention) is obtained.

Note that examples of the electronic device including the optical waveguide structure of the present invention include electronic devices such as a mobile phone, a game machine, a router device, a WDM device, a personal computer, a television, and a home server. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, since such an electronic device includes the optical waveguide structure according to the present invention, problems such as noise and signal degradation peculiar to electric wiring are eliminated, and a dramatic improvement in performance can be expected.

Furthermore, the amount of heat generated in the optical waveguide portion is greatly reduced compared to electrical wiring. Therefore, the degree of integration in the substrate can be increased to reduce the size, the power required for cooling can be reduced, and the power consumption of the entire electronic device can be reduced.

Further, the optical waveguide structure of the present invention as described above is in a state where the substrate or the optical waveguide is bent (bent state) by performing a bending operation, and the state where the bending operation is released and the substrate or the optical waveguide is extended. (Extended state) can be freely taken. For this reason, for example, it can be suitably used for hinges and slides of electronic devices such as mobile phones, game machines, PDAs, and notebook personal computers having hinges or slides. For example, in a mobile phone, when two points via a hinge part are connected by an optical waveguide structure, when the hinge part of the mobile phone is closed, the optical waveguide structure is bent and when the hinge part is opened, The optical waveguide structure is in an extended state.

In this way, the optical waveguide structure can maintain the electrical connection and the optical connection between two points sandwiching the movable part over a long period of time. For this reason, the mobile phone (electronic device) provided with the optical waveguide structure can improve the reliability.
Note that the electronic device to which the optical waveguide structure of the present invention is applied is not limited to the above-described ones. For example, it is suitable for application to electronic devices such as router devices, WDM devices, personal computers, televisions, home servers, and the like. is there. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, by providing such an electronic device with the opto-electric hybrid board according to the present invention, problems such as noise and signal deterioration peculiar to the electric wiring are eliminated, and a dramatic improvement in the performance can be expected.
In addition, the amount of heat generated in the optical waveguide portion is greatly reduced compared to electrical wiring. Therefore, the degree of integration in the substrate can be increased to reduce the size, the power required for cooling can be reduced, and the power consumption of the entire electronic device can be reduced.

<Optical waveguide manufacturing method>
Next, the manufacturing method of the

optical waveguides

9, 9 ′, 1009, 2009 (hereinafter also referred to as the optical waveguide 9) and the constituent materials of the respective parts in each of the embodiments will be described. In particular, the

core parts

94, 1094, A method for forming 2094 (hereinafter also referred to as a core portion 94) will be described in detail.

First, prior to the description of the method for forming the core portion 94, the photosensitive resin composition used for forming the core portion 94 will be described.

(Photosensitive resin composition)
The photosensitive resin composition used in this embodiment is
(A) a cyclic olefin resin;
(B) The refractive index is different from (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
Is provided.

Among these, from the viewpoint of reliably suppressing the occurrence of light propagation loss,
(C) a cyclic olefin resin (A) having a leaving group capable of leaving by an acid generated from a photoacid generator in the side chain;
It is preferable to contain the monomer of following formula (100).

Such a photosensitive resin composition is formed into a film to be an optical waveguide forming film, and further used as a film including regions having different refractive indexes, for example, an optical waveguide film.

That is, by using such a photosensitive resin composition, it is possible to provide an optical waveguide film or the like in which generation of light propagation loss is suppressed. In particular, when a curved optical waveguide is formed, generation of light propagation loss can be remarkably suppressed.

Furthermore, it is possible to provide an optical / electrical hybrid substrate including an optical wiring using such an optical waveguide film, the optical wiring, and an electric circuit. According to such an optical wiring and an opto-electric hybrid board, it is possible to improve EMI (electromagnetic wave interference), which has been a problem with the conventional electrical wiring, and the signal transmission speed can be greatly improved as compared with the conventional one.

Also, electronic equipment using optical waveguide film can be provided. By using the optical waveguide film, space saving can be achieved, which contributes to downsizing of electronic devices.

Specific examples of such electronic devices include computers, servers, mobile phones, game machines, memory testers, appearance inspection robots, and the like.

Hereinafter, the components of the photosensitive resin composition will be described in detail.
((A) Cyclic olefin resin)
The cyclic olefin resin of component (A) is added in order to ensure the film moldability of the photosensitive resin composition, and serves as a base polymer.

Here, the cyclic olefin resin may be unsubstituted or may be one in which hydrogen is substituted with another group.

Examples of cyclic olefin resins include norbornene resins and benzocyclobutene resins.

Among these, it is preferable to use a norbornene-based resin from the viewpoints of heat resistance and transparency.

As norbornene resin, for example,
(1) addition (co) polymer of norbornene type monomer obtained by addition (co) polymerization of norbornene type monomer,
(2) addition copolymers of norbornene monomers with ethylene and α-olefins,
(3) an addition polymer such as an addition copolymer of a norbornene-type monomer and a non-conjugated diene and, if necessary, another monomer;
(4) a ring-opening (co) polymer of a norbornene-type monomer, and a resin obtained by hydrogenating the (co) polymer if necessary,
(5) a ring-opening copolymer of a norbornene-type monomer and ethylene or α-olefins, and a resin obtained by hydrogenating the (co) polymer if necessary,
(6) Ring-opening copolymers such as norbornene-type monomers and non-conjugated dienes, or other monomers, and polymers obtained by hydrogenating the (co) polymers as necessary. Examples of these polymers include random copolymers, block copolymers, and alternating copolymers.

These norbornene resins include, for example, ring-opening metathesis polymerization (ROMP), combination of ROMP and hydrogenation reaction, polymerization by radical or cation, polymerization using cationic palladium polymerization initiator, other polymerization initiators ( For example, it can be obtained by any known polymerization method such as polymerization using a polymerization initiator of nickel or another transition metal).

Of these, addition (co) polymers are preferred as the norbornene-based resin. Addition (co) polymers are also preferred because they are rich in transparency, heat resistance and flexibility. For example, after forming a film with the photosensitive resin composition, an electrical component or the like may be mounted via solder. In such a case, an addition (co) polymer is preferable because it needs to have high heat resistance, that is, reflow resistance. Further, when a film is formed from the photosensitive resin composition and incorporated in a product, it may be used in an environment of about 80 ° C., for example. Even in such a case, an addition (co) polymer is preferable from the viewpoint of ensuring heat resistance.

Among them, the norbornene-based resin preferably includes a norbornene repeating unit having a substituent containing a polymerizable group or a norbornene repeating unit having a substituent containing an aryl group.

As the repeating unit of norbornene having a substituent containing a polymerizable group, the repeating unit of norbornene having a substituent containing an epoxy group, the repeating unit of norbornene having a substituent containing a (meth) acryl group, and an alkoxysilyl group At least one of the repeating units of norbornene having a substituent containing is preferable. These polymerizable groups are preferable because of their high reactivity among various polymerizable groups.

Moreover, if one containing two or more norbornene repeating units containing such a polymerizable group is used, both flexibility and heat resistance can be achieved.

On the other hand, by including a norbornene repeating unit having a substituent containing an aryl group, it is possible to more reliably prevent dimensional change due to water absorption due to the extremely high hydrophobicity derived from the aryl group.

Furthermore, the norbornene-based polymer preferably contains an alkylnorbornene repeating unit. The alkyl group may be linear or branched.

By including a repeating unit of alkyl norbornene, the norbornene-based polymer has high flexibility, and therefore can provide high flexibility (flexibility).

Further, a norbornene-based polymer containing an alkylnorbornene repeating unit is also preferable because of its excellent transmittance with respect to light in a specific wavelength region (in particular, a wavelength region near 850 nm).

For these reasons, as the norbornene-based resin, those represented by the following formulas (1) to (4) and (8) to (10) are preferable.

(In the formula (1), R ₁ represents an alkyl group having 1 to 10 carbon atoms, a represents an integer of 0 to 3, b represents an integer of 1 to 3, and p ₁ / q ₁ is 20 or less.)

The norbornene-based resin of the formula (1) can be produced as follows.
(1) is obtained by dissolving norbornene having R ₁ and norbornene having an epoxy group in the side chain in toluene and solution polymerization using Ni compound (A) as a catalyst.

In addition, the manufacturing method of norbornene which has an epoxy group in a side chain is as (i) (ii), for example.

(I) Synthesis of norbornenemethanol (NB—CH ₂ —OH) CPD (cyclopentadiene) and α-olefin (CH ₂ ═CH—CH ₂ —OH) produced by cracking of DCPD (dicyclopentadiene) under high temperature and high pressure React.

(Ii) Synthesis of epoxy norbornene It is formed by the reaction of norbornene methanol and epichlorohydrin.

In the formula (1), when b is 2 or 3, epichlorohydrin in which the methylene group is an ethylene group, a propylene group or the like is used.

Among the norbornene-based resins represented by the formula (1), from the viewpoint that both flexibility and heat resistance can be achieved, in particular, R ₁ is an alkyl group having 4 to 10 carbon atoms, and a and A compound in which each b is 1, for example, a copolymer of butylbornene and methyl glycidyl ether norbornene, a copolymer of hexyl norbornene and methyl glycidyl ether norbornene, a copolymer of decyl norbornene and methyl glycidyl ether norbornene, or the like is preferable.

(In Formula (2), R ₂ represents an alkyl group having 1 to 10 carbon atoms, R ₃ represents a hydrogen atom or a methyl group, c represents an integer of 0 to 3, and p ₂ / q ₂ Is 20 or less.)

The norbornene-based resin of the formula (2) is obtained by dissolving norbornene having R ₂ and norbornene having acryl and methacryl groups in the side chain in toluene, and performing solution polymerization using the Ni compound (A) described above as a catalyst. Obtainable.

Among the norbornene-based polymers represented by the formula (2), R ₂ is an alkyl group having 4 to 10 carbon atoms and c is 1 from the viewpoint of achieving both flexibility and heat resistance. Compounds such as copolymers of butylbornene and 2- (5-norbornenyl) methyl acrylate, copolymers of hexylnorbornene and 2- (5-norbornenyl) methyl acrylate, decylnorbornene and 2- (5-norbornenyl) methyl acrylate And a copolymer thereof are preferred.

(In Formula (3), R ₄ represents an alkyl group having 1 to 10 carbon atoms, each X ₃ independently represents an alkyl group having 1 to 3 carbon atoms, and d represents 0 to 3 carbon atoms. Represents an integer, and p ₃ / q ₃ is 20 or less.)

The resin of the formula (3) can be obtained by dissolving norbornene having R ₄ and norbornene having an alkoxysilyl group in the side chain in toluene, and solution polymerization using the Ni compound (A) described above as a catalyst. it can.

Among the norbornene-based polymers represented by the formula (3), in particular, a compound in which R ₄ is an alkyl group having 4 to 10 carbon atoms, d is 1 or 2, and X ₃ is a methyl group or an ethyl group, For example, a copolymer of butylbornene and norbornenylethyltrimethoxysilane, a copolymer of hexylnorbornene and norbornenylethyltrimethoxysilane, a copolymer of decylnorbornene and norbornenylethyltrimethoxysilane, butylbornene and triethoxysilylnorbornene Copolymer of hexyl norbornene and triethoxysilyl norbornene, copolymer of decyl norbornene and triethoxysilyl norbornene, copolymer of butylbornene and trimethoxysilyl norbornene, hexyl norbornene And copolymers of trimethoxysilyl norbornene, copolymers, etc. of decyl norbornene and trimethoxysilyl norbornene are preferred.

(Wherein R ₅ represents an alkyl group having 1 to 10 carbon atoms, and A ₁ and A ₂ each independently represent a substituent represented by the following formulas (5) to (7), (It is not the same substituent at the same time, and p ₄ / q ₄ + r is 20 or less.)

(4) is obtained by dissolving norbornene having R ₅ and norbornene having A ₁ and A ₂ in the side chain in toluene and solution polymerization using Ni compound (A) as a catalyst.

(In the formula (5), e represents an integer of 0 to 3, and f represents an integer of 1 to 3.)

(In formula (6), R ₆ represents a hydrogen atom or a methyl group, and g represents an integer of 0 to 3.)

(In Formula (7), X ₄ each independently represents an alkyl group having 1 to 3 carbon atoms, and h represents an integer of 0 to 3)

As the norbornene-based polymer represented by the formula (4), for example, any one of butyl norbornene, hexyl norbornene or decyl norbornene, 2- (5-norbornenyl) methyl acrylate, norbornenyl ethyl trimethoxysilane, Terpolymer with either triethoxysilyl norbornene or trimethoxysilyl norbornene, butyl bornene, hexyl norbornene or decyl norbornene, terpolymer of 2- (5-norbornenyl) methyl acrylate and methylglycidyl ether norbornene, butylbornene, Either hexyl norbornene or decyl norbornene and methyl glycidyl ether norbornene, norbornenyl ethyltrimethoxysilane, triethoxysilyl Terpolymers, etc. with either norbornene or trimethoxysilyl norbornene.

(In formula (8), R ₇ represents an alkyl group having 1 to 10 carbon atoms, R ₈ represents a hydrogen atom, a methyl group or an ethyl group, Ar represents an aryl group, and X ₁ represents oxygen Represents an atom or a methylene group, X ₂ represents a carbon atom or a silicon atom, i represents an integer of 0 to 3, j represents an integer of 1 to 3, and p ₅ / q ₅ is 20 or less is there.)

Norbornene having R ₇ and norbornene containing-(CH ₂ ) -X ₁ -X ₂ (R ₈ ) _3-j (Ar) _j in the side chain are dissolved in toluene, and solution polymerization is performed using a Ni compound as a catalyst. (8) is obtained.

Of the norbornene polymers represented by the formula (8), those in which X ₁ is an oxygen atom, X ₂ is a silicon atom, and Ar is a phenyl group are preferable.

Further, particularly from the viewpoint of flexibility, heat resistance and refractive index control, R ₇ is an alkyl group having 4 to 10 carbon atoms, X ₁ is an oxygen atom, X ₂ is a silicon atom, Ar is a phenyl group, R _A compound in which ₈ is a methyl group, i is 1 and j is 2, for example, a copolymer of butylbornene and diphenylmethylnorbornenemethoxysilane, a copolymer of hexylnorbornene and diphenylmethylnorbornenemethoxysilane, decylnorbornene and diphenylmethylnorbornenemethoxysilane Of these, the copolymer is preferred.
Specifically, it is preferable to use the following norbornene resin.

(R ₇ , R ₈ , p ₅ , q ₅ , and i in Formula (9) are the same as in Formula (8).)

From the viewpoint of flexibility, heat resistance, and refractive index control, in formula (8), R ₇ is an alkyl group having 4 to 10 carbon atoms, X ₁ is a methylene group, X ₂ is a carbon atom, and Ar is Compounds in which R ₈ is a hydrogen atom, i is 0, and j is 1, for example, a copolymer of butylbornene and phenylethylnorbornene, a copolymer of hexylnorbornene and phenylethylnorbornene, a copolymer of decylnorbornene and phenylethylnorbornene Etc.
Further, the following may be used as the norbornene resin.

(In Formula (10), R ₁₀ represents an alkyl group having 1 to 10 carbon atoms, R ₁₁ represents an aryl group, and k is 0 or more and 4 or less. P ₆ / q ₆ is 20 or less. is there.)

Further, p ₁ / q ₁ to p ₃ / q ₃ , p ₅ / q ₅ , p ₆ / q ₆ or p ₄ / q ₄ + r may be 20 or less, preferably 15 or less, About 0.1 to 10 is more preferable. Thereby, the effect including the repeating unit of multiple types of norbornene is exhibited.

The norbornene-based resin as described above preferably has a leaving group. Here, the leaving group is a group that is released by the action of an acid.

Specifically, those having at least one of —O— structure, —Si—aryl structure and —O—Si— structure in the molecular structure are preferable. Such an acid leaving group is released relatively easily by the action of a cation.

Among these, as the leaving group that causes a decrease in the refractive index of the resin by leaving, at least one of the —Si-diphenyl structure and the —O—Si-diphenyl structure is preferable.

For example, among the norbornene polymers represented by the formula (8), those in which X ₁ is an oxygen atom, X ₂ is a silicon atom, and Ar is a phenyl group have a leaving group.

In the formula (3), there are cases where the Si—O—X ₃ portion of the alkoxysilyl group is eliminated.

For example, when the norbornene-based resin of the formula (9) is used, it is presumed that the reaction proceeds as follows by the acid generated from the photoacid generator (denoted as PAG). Here, only the leaving group portion is shown, and the case where i = 1 is described.

Furthermore, in addition to the structure of the formula (9), the side chain may have an epoxy group. By using such a material, there is an effect that a film having excellent adhesion can be formed.
A specific example is as follows.

(In formula (31), p ₇ / q ₇ + r ₂ is 20 or less.)

The compound represented by the formula (31) includes, for example, hexyl norbornene, diphenylmethyl norbornene methoxysilane (norbornene containing —CH ₂ —O—Si (CH ₃ ) (Ph) ₂ in the side chain) and epoxy norbornene in toluene. It can be obtained by dissolving and solution polymerization using a Ni compound as a catalyst.

((B) Monomer having a cyclic ether group, oligomer having a cyclic ether group)
Next, the component (B) will be described.

Component (B) is at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group. This component (B) may have any refractive index different from that of the resin of component (A) and is compatible with the resin of component (A). The refractive index difference between the component (B) and the resin of the component (A) is preferably 0.01 or more.

The refractive index of the component (B) may be higher than that of the resin of the component (A), but the refractive index of the component (B) is preferably lower than that of the resin of the component (A).

Component (B) monomer having a cyclic ether group and oligomer having a cyclic ether group are polymerized by ring-opening in the presence of an acid. Considering the diffusibility of the monomer and oligomer, the molecular weight (weight average molecular weight) of the monomer and the molecular weight (weight average molecular weight) of the oligomer are preferably 100 or more and 400 or less, respectively.

Component (B) has, for example, an oxetanyl group or an epoxy group. Such a cyclic ether group is preferable because it is easily opened by an acid.

As the monomer having an oxetanyl group and the oligomer having an oxetanyl group, those selected from the group of the following formulas (11) to (20) are preferable. By using these, there is an advantage that transparency in the vicinity of a wavelength of 850 nm is excellent and both flexibility and heat resistance are possible. These may be used alone or in combination.

(In formula (18), n is 0 or more and 3 or less.)

Among the above monomers and oligomers, they are represented by the formulas (13), (15), (16), (17), and (20) from the viewpoint of ensuring a difference in refractive index from the resin of the component (A). It is preferable to use a compound.

Furthermore, considering the point that there is a difference in refractive index from the resin of component (A), the point that the molecular weight is small, the mobility of the monomer is high, and the point that the monomer does not easily volatilize, the formulas (20) and (15) It is particularly preferable to use a compound represented by:

Further, as the compound having an oxetanyl group, compounds represented by the following formulas (32) and (33) can be used. As the compound represented by the formula (32), trade name TOSOX manufactured by Toagosei Co., Ltd., and as the compound represented by formula (33), trade name OX-SQ manufactured by Toagosei Co., Ltd. can be used.

(In formula (33), n is 1 or 2)

Further, examples of the monomer having an epoxy group and the oligomer having an epoxy group include the following. The monomer and oligomer having an epoxy group are polymerized by ring-opening in the presence of an acid.

As the monomer having an epoxy group and the oligomer having an epoxy group, those represented by the following formulas (34) to (39) can be used. Among them, it is preferable to use an alicyclic epoxy monomer represented by the formulas (36) to (39) from the viewpoint that the strain energy of the epoxy ring is large and the reactivity is excellent.

In addition, the compound represented by the formula (34) is epoxy norbornene, and for example, EpNB manufactured by Promeras Corporation can be used. The compound represented by the formula (35) is γ-glycidoxypropyltrimethoxysilane. As this compound, for example, Z-6040 manufactured by Toray Dow Corning Silicone can be used. The compound represented by the formula (36) is 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. As this compound, for example, E0327 manufactured by Tokyo Chemical Industry can be used.

Furthermore, the compound represented by the formula (37) is 3,4-epoxycyclohexenylmethyl-3, '4'-epoxycyclohexenecarboxylate, and as this compound, for example, Celoxide 2021P manufactured by Daicel Chemical Industries, Ltd. is used. can do. The compound represented by the formula (38) is 1,2-epoxy-4-vinylcyclohexane, and as this compound, for example, Celoxide 2000 manufactured by Daicel Chemical Industries, Ltd. can be used.

Furthermore, the compound represented by the formula (39) is 1,2: 8,9 diepoxy limonene. As this compound, for example, (Celoxide 3000 manufactured by Daicel Chemical Industries, Ltd.) can be used.

Furthermore, as the component (B), a monomer having an oxetanyl group, an oligomer having an oxetanyl group, a monomer having an epoxy group, and an oligomer having an epoxy group may be used in combination.

The monomer having an oxetanyl group and the oligomer having an oxetanyl group have a slow initiation reaction for initiating polymerization but a fast growth reaction. On the other hand, a monomer having an epoxy group and an oligomer having an epoxy group have a fast initiation reaction for initiating polymerization, but have a slow growth reaction. Therefore, by using a monomer having an oxetanyl group, an oligomer having an oxetanyl group, a monomer having an epoxy group, and an oligomer having an epoxy group, when irradiated with light or actinic radiation, a portion irradiated with light or actinic radiation And a refractive index difference with an unirradiated part can be produced reliably.

The addition amount of the component (B) is preferably 1 part by weight or more and 50 parts by weight or less, more preferably 2 parts by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the component (A). . Thereby, the refractive index modulation between the core and the clad is possible, and there is an effect that both flexibility and heat resistance can be achieved.

((C) Photoacid generator)
Any photoacid generator may be used as long as it can generate Bronsted acid or Lewis acid by absorbing light (active radiation) energy. For example, triphenylsulfonium trifluoromethanesulfonate, tris (4-t-butyl) can be used. Sulfonium salts such as phenyl) sulfonium-trifluoromethanesulfonate, diazonium salts such as p-nitrophenyldiazonium hexafluorophosphate, ammonium salts, phosphonium salts, diphenyliodonium trifluoromethanesulfonate, (triccumyl) iodonium-tetrakis (pentafluorophenyl) borate, etc. Iazonium salts, quinonediazides, diazomethanes such as bis (phenylsulfonyl) diazomethane, 1-phenyl-1- (4-methylpheny ) Sulfonic acid esters such as sulfonyloxy-1-benzoylmethane, N-hydroxynaphthalimide-trifluoromethanesulfonate, disulfones such as diphenyldisulfone, tris (2,4,6-trichloromethyl) -s-triazine, 2 Mention may be made of compounds such as triazines such as-(3.4-methylenedioxyphenyl) -4,6-bis- (trichloromethyl) -s-triazine. These photoacid generators can be used alone or in combination.

The content of the photoacid generator is preferably 0.01 parts by weight or more and 0.3 parts by weight or less with respect to 100 parts by weight of the component (A), and is 0.02 parts by weight or more and 0.2 parts by weight or less. It is more preferable that Thereby, there exists an effect of a reactive improvement.

The photosensitive resin composition may contain additives such as a sensitizer in addition to the above components (A), (B), and (C).

The sensitizer increases the sensitivity of the photoacid generator to light (actinic radiation), reduces the time and energy required to activate (react or decompose) the photoacid generator, It has a function of changing the wavelength of light (active radiation) to a wavelength suitable for activation.

Such a sensitizer is appropriately selected according to the sensitivity of the photoacid generator and the peak wavelength of absorption of the sensitizer, and is not particularly limited. For example, 9,10-dibutoxyanthracene (CAS No. 76275) is selected. -14-4) anthracenes, xanthones, anthraquinones, phenanthrenes, chrysene, benzpyrenes, fluoranthenes, rubrenes, pyrenes, indanthrines, thioxanthen-9-one (Thioxanthen-9-ones) and the like, and these can be used alone or as a mixture.

Specific examples of the sensitizer include, for example, 2-isopropyl-9H-thioxanthen-9-one, 4-isopropyl-9H-thioxanthen-9-one, 1-chloro-4-propoxythioxanthone, phenothiazine Or a mixture thereof.

The content of the sensitizer in the photosensitive resin composition is preferably 0.01% by weight or more, more preferably 0.5% by weight or more, and further preferably 1% by weight or more. preferable. In addition, it is preferable that an upper limit is 5 weight% or less.

Furthermore, an antioxidant can be added to the core layer forming material 1900. Thereby, generation of undesired free radicals and natural oxidation of the polymer 1915 can be prevented. As a result, the characteristics of the obtained core layer 1093 (optical waveguide 1009) can be improved.

Examples of the antioxidant include Ciba (registered trademark, the same applies hereinafter) IRGANOX (registered trademark, the same applies hereinafter) 1076 and Ciba IRGAFOS (registered trademark, available) from Ciba Specialty Chemicals of Tarrytown, New York. The same applies hereinafter.) 168 is preferably used.

Other antioxidants include, for example, Ciba Irganox (registered trademark, hereinafter the same) 129, Ciba Irganox 1330, Ciba Irganox 1010, Ciba Cyanox (registered trademark, the same applies below) 1790, CibaI. (Registered trademark) 3114, Ciba Irganox 3125, etc. can also be used.

It should be noted that such an antioxidant can be omitted, for example, when the film 1910 is not exposed to oxidation conditions or when the period of time is extremely short.

Among the above photosensitive resin compositions, the cyclic olefin resin having a leaving group in the side chain as the component (A), the photoacid generator of the component (C), and the following formula (100) as the component (B) The photosensitive resin composition containing the 1st monomer as described in above is especially preferable.

Hereinafter, this particularly preferable photosensitive resin composition will be described.
As the cyclic olefin resin (A) constituting the cyclic olefin resin having a leaving group in the side chain, those described above can be used. For example, a polymer of a monocyclic monomer such as cyclohexene or cyclooctene, Examples include polymers of polycyclic monomers such as norbornene, norbornadiene, dicyclopentadiene, dihydrodicyclopentadiene, tetracyclododecene, tricyclopentadiene, dihydrotricyclopentadiene, tetracyclopentadiene, and dihydrotetracyclopentadiene. Among these, one or more cyclic olefin resins selected from polymers of polycyclic monomers are preferably used. Thereby, the heat resistance of resin can be improved.

In addition, as polymerization forms, known forms such as random polymerization and block polymerization can be applied. For example, specific examples of polymerization of norbornene monomers include (co) polymers of norbornene monomers, copolymers of norbornene monomers and other copolymerizable monomers such as α-olefins, A combined hydrogenated product corresponds to a specific example. These cyclic olefin resins can be produced by a known polymerization method. The polymerization methods include an addition polymerization method and a ring-opening polymerization method. Norbornene resin) is preferable (that is, an addition polymer of a norbornene compound). Thereby, it is excellent in transparency, heat resistance, and flexibility.

As the leaving group, a part of the molecule is cleaved by the action of an acid (H ⁺ ) generated from a photoacid generator, and then leaves. Specifically, those having at least one of the above-described —O— structure, —Si-aryl structure and —O—Si— structure in the molecular structure (side chain) are preferable. The leaving group as described above is released relatively easily by the action of acid (H ⁺ ).

Among the above-mentioned leaving groups, the leaving group that causes a decrease in the refractive index of the resin by leaving is preferably at least one of a -Si-diphenyl structure and a -O-Si-diphenyl structure.

The content of the leaving group is not particularly limited, but is preferably 10 to 80% by weight, particularly 20 to 60% by weight in the cyclic olefin resin having a leaving group in the side chain. Is more preferable. When the content is within the above range, it is particularly excellent in both flexibility and refractive index modulation function (effect of increasing the refractive index difference).

As such a cyclic olefin resin having a leaving group in the side chain, one having a repeating unit represented by the following formula (101) and / or the following formula (102) is preferable. Thereby, the refractive index of resin can be made high.

(In Formula 101, n is an integer of 0 or more and 9 or less.)

The photosensitive resin composition contains a monomer described in the above formula (100) (hereinafter referred to as a first monomer). Thereby, the refractive index difference between the left and right cores / claddings can be further expanded.

The content of the first monomer is not particularly limited, but is preferably 1 part by weight or more and 50 parts by weight or less, particularly 2 parts by weight, based on 100 parts by weight of the cyclic olefin resin having a leaving group in the side chain. It is preferable that it is 20 parts by weight or more. Thereby, the refractive index modulation between the core / cladding is made possible, and both flexibility and heat resistance can be achieved.

Thus, when the first monomer described above is used in combination with a cyclic olefin resin having a leaving group in the side chain, the reason for excellent balance between the refractive index modulation between the core and the clad and flexibility is as follows. It is considered as follows.

First, when the photosensitive resin composition as described above is used, the reason that the refractive index modulation between the core and the clad is excellent is that the first monomer undergoes a polymerization reaction by an acid generated by light (active radiation) irradiation or the like. This is because the first monomer is excellent in its reactivity when starting. When the reactivity of the first monomer is excellent, the curability of the first monomer is increased, and the diffusibility of the first monomer caused by the concentration gradient of the first monomer is improved. Thereby, the refractive index difference between the light (active radiation) irradiation region and the non-irradiation region can be increased.

Further, since the first monomer is monofunctional, the polymerization reaction proceeds and the crosslinking density as the photosensitive resin composition does not increase so much. Therefore, it is excellent in flexibility.

The photosensitive resin composition is not particularly limited, but may contain a second monomer different from the first monomer. The second monomer different from the first monomer may be a monomer having a different structure or a monomer having a different molecular weight.

Among these, the second monomer is contained as the component (B), and examples thereof include epoxy compounds, other oxetane compounds different from those represented by the formula (100), vinyl ether compounds, and the like. Among these, at least one of an epoxy compound (particularly an alicyclic epoxy compound) and a bifunctional oxetane compound (a monomer having two oxetanyl groups) is preferable. Thereby, the reactivity of the first monomer and the cyclic olefin resin can be improved, whereby the heat resistance of the waveguide can be improved while maintaining transparency.

Specifically, the second monomer includes the compound of the above formula (15), the compound of the above formula (12), the compound of the above formula (11), the compound of the above formula (18), and the compound of the above formula (19). And compounds of the above formulas (34) to (39).

The content of the second monomer is not particularly limited, but is preferably 1 part by weight or more and 50 parts by weight or less, particularly 2 parts by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the cyclic olefin resin. More preferably. Thereby, the reactivity with the first monomer can be improved.

Further, the combined ratio of the second monomer and the first monomer is not particularly limited, but is preferably 0.1 to 1, particularly preferably 0 by weight ratio (weight of the second monomer / weight of the first monomer). .1 to 0.6 is preferable. When the combined ratio is within the above range, the balance between the speed of reactivity and the heat resistance of the waveguide is excellent.

Although content of a photo-acid generator is not specifically limited, It is 0.01 weight part or more and 0.3 weight part or less with respect to 100 weight part of cyclic olefin resin which has a leaving group in the said side chain. In particular, it is more preferably 0.02 parts by weight or more and 0.2 parts by weight or less. If the content is less than the lower limit, the reactivity may decrease, and if the content exceeds the upper limit, the optical waveguide may be colored and light loss may decrease.

The photosensitive resin composition may contain a curing catalyst, an antioxidant and the like in addition to the above-mentioned cyclic olefin resin, photoacid generator, first monomer and second monomer.

The photosensitive resin composition used in the present invention can be used as a composition for forming the core portion 94.

(Optical waveguide manufacturing method)
16 to 18, 28, 29, 30, 38, 39, and 40 are cross-sectional views schematically showing process examples of the method for manufacturing an optical waveguide, respectively.

Here, a method for producing an optical waveguide using a photosensitive resin composition when the component (B) has a lower refractive index than the cyclic olefin resin of the component (A) will be described as an example. The method for manufacturing the optical waveguide 9 ′ is the same as that of the optical waveguide 9, and is represented by the optical waveguide 9.

First, as shown in FIGS. 16 (A), 28 (A), and 38 (A), the photosensitive resin composition is dissolved in a solvent to prepare

varnishes

900, 1900, and 2900 (hereinafter also referred to as varnish 900). The varnish 900 is applied on the cladding layers 91, 1091, and 2091 (hereinafter also referred to as the cladding layer 91).

Examples of the solvent for preparing the photosensitive resin composition in a varnish form include diethyl ether, diisopropyl ether, 1,2-dimethoxyethane (DME), 1,4-dioxane, tetrahydrofuran (THF), tetrahydropyran (THP), Ether solvents such as anisole, diethylene glycol dimethyl ether (diglyme), diethylene glycol ethyl ether (carbitol), cellosolv solvents such as methyl cellosolve, ethyl cellosolve, phenyl cellosolve, aliphatic hydrocarbon solvents such as hexane, pentane, heptane, cyclohexane , Aromatic hydrocarbon solvents such as toluene, xylene, benzene and mesitylene, and aromatic heterocyclic compounds such as pyridine, pyrazine, furan, pyrrole, thiophene and methylpyrrolidone Amide solvents such as N, N-dimethylformamide (DMF) and N, N-dimethylacetamide (DMA), halogenated solvents such as dichloromethane, chloroform and 1,2-dichloroethane, ethyl acetate, methyl acetate, ethyl formate And various organic solvents such as a sulfur compound solvent such as dimethyl sulfoxide (DMSO) and sulfolane, or a mixed solvent containing them.

Next, after applying the varnish 900 on the clad layer 91 of the optical waveguide 9, it is dried and the solvent is evaporated (desolvent). Thereby, as shown in FIGS. 16B, 28B, and 38B, the varnish 900 becomes a film 910 for forming an optical waveguide. This film 910 has core layers 93, 1093, and 2093 (hereinafter referred to as core layers) in which a core portion 94 and clad

portions

95, 1095, and 2095 (hereinafter also referred to as cladding portions 95) are formed by light irradiation, which will be described later. 93).

Here, examples of the method of applying the varnish 900 include a doctor blade method, a spin coating method, a dipping method, a table coating method, a spray method, an applicator method, a curtain coating method, and a die coating method. It is not limited. As the clad layer 91, for example, a sheet having a refractive index lower than that of a core portion 94 described later is used, and for example, a sheet containing a norbornene-based resin and an epoxy resin is used.

Next, the film 910 is selectively irradiated with light and actinic radiation (for example, ultraviolet rays).
At this time, as shown in FIGS. 17A, 29A, and 39 (A, as shown in FIG. 17A, a mask M in which an opening is formed is disposed above

films

910, 1910, and 2910 (hereinafter also referred to as film 910). The film 910 is irradiated with light (active radiation) through the opening of the mask M.

Examples of the light (active radiation) used include those having a peak wavelength in the wavelength range of 200 to 450 nm. Thereby, although depending on the composition of the photoacid generator, the photoacid generator can be activated relatively easily.
The constituent material of the mask M is appropriately selected depending on the active radiation to be irradiated. Specifically, the constituent material of the mask M is a material that can block the active radiation applied to the film 910. Any known material can be used for the mask M as long as it has such characteristics.

The mask M may be formed in advance (separately formed) (for example, plate-shaped) or may be formed on the film 910 by, for example, a vapor deposition method or a coating method.

Preferred examples of the mask M include photomasks made of quartz glass and PET base materials, stencil masks, metal thin films formed by vapor deposition methods (evaporation, sputtering, etc.), etc. Among these, it is particularly preferable to use a photomask or a stencil mask. This is because a fine pattern can be formed with high accuracy, and handling is easy, which is advantageous in improving productivity.

The irradiation amount of light (active radiation) is not particularly limited, but is preferably about 0.1 to 9 J / cm ² , more preferably about 0.2 to 6 J / cm ² , and More preferably, it is about 2 to 3 J / cm ² .

Note that the use of the mask M can be omitted when highly directional light (active radiation) such as laser light is used.

In the region of the film 910 irradiated with light (active radiation), acid is generated from the photoacid generator. The component (B) is polymerized by the generated acid.

In the region not irradiated with light (active radiation), no acid is generated from the photoacid generator, so component (B) does not polymerize. In the irradiated part, since the component (B) is polymerized to become a polymer, the amount of the component (B) is reduced. In response to this, the component (B) of the unirradiated part diffuses into the irradiated part, thereby causing a difference in refractive index between the irradiated part and the unirradiated part.

Here, when the component (B) has a lower refractive index than the cyclic olefin resin, the component (B) of the unirradiated part diffuses into the irradiated part, and the refractive index of the unirradiated part increases. The refractive index of the irradiated part is lowered.

Note that the refractive index difference between the polymer obtained by polymerizing the component (B) and the monomer having a cyclic ether group is about 0 or more and 0.001 or less, and the refractive index is considered to be substantially the same.

When such a photosensitive resin composition is used, it is possible to initiate polymerization of the component (B) with an acid generated from a photoacid generator.

Furthermore, the cyclic olefin resin used in the present invention does not necessarily have a leaving group, but when a cyclic olefin resin having a leaving group is used as the component (A), The following effects occur.

In the portion irradiated with light (active radiation), the leaving group of the cyclic olefin resin is eliminated by the acid generated from the photoacid generator. In the case of a leaving group such as a —Si-aryl structure, —Si-diphenyl structure, and —O—Si-diphenyl structure, the refractive index of the resin decreases due to the leaving. Therefore, the refractive index of the irradiated portion is further lowered as compared with that before the leaving group is removed.

Next, the film 910 is heated. In this heating step, the component (B) of the irradiated portion irradiated with light (active radiation) is further polymerized. On the other hand, in this heating step, the component (B) in the unirradiated part is volatilized. Thereby, in an unirradiated part, a component (B) decreases and it becomes a refractive index close | similar to cyclic olefin resin.

In this film 910, as shown in FIGS. 17 (B), 29 (B), and 39 (B), a region irradiated with light (active radiation) becomes a clad portion 95, and an unirradiated region is a core portion 94. Become. The structure concentration derived from the component (B) in the core portion 94 and the structure concentration derived from the component (B) in the cladding portion 95 are different. Specifically, the structure concentration derived from the component (B) in the core portion 94 is lower than the structure concentration derived from the component (B) in the cladding portion 95.

Further, the clad part 95 has a lower refractive index than the core part 94, and the refractive index difference between the clad part 95 and the core part 94 is 0.01 or more. As described above, the core portion 94 and the clad portion 95 are formed on the film 910, and the core layer 93 is obtained.

The heating temperature in this heating step is not particularly limited, but is preferably about 30 to 180 ° C., more preferably about 40 to 160 ° C.

The heating time is preferably set so that the polymerization reaction of the component (B) of the irradiated portion irradiated with light (active radiation) is almost completed, specifically about 0.1 to 2 hours. It is more preferable that the time is about 0.1 to 1 hour.

Thereafter, a film similar to that of the clad layer 91 is stuck on the core layer 93. This film becomes the

clad layers

92, 1092, and 2092 (hereinafter also referred to as the clad layer 92). The pair of

clad layers

91 and 92 are arranged so as to sandwich the core portion 94 from a direction different from the clad portion 95.

The clad layer 92 can also be formed by a method of applying a liquid material on the core layer 93 and curing (solidifying) it, instead of attaching a film-like one.

As a method for forming the clad layer 91 (92), a method in which a varnish containing a clad material (clad layer forming material) is applied and cured (solidified), and a method in which a curable monomer composition is applied and cured (solidified). Any method may be used.

When the clad layer 91 (92) is formed by a coating method, examples thereof include a spin coating method, a dipping method, a table coating method, a spray method, an applicator method, a curtain coating method, and a die coating method.

Examples of the constituent material of the clad layer 91 (92) include cyclic resins such as acrylic resin, methacrylic resin, polycarbonate, polystyrene, epoxy resin, polyamide, polyimide, polybenzoxazole, benzocyclobutene resin, and norbornene resin. These resins can be used, and one or more of these can be used in combination (polymer alloy, polymer blend (mixture), copolymer, composite (laminate), etc.).

Of these, epoxy resins, polyimides, polybenzoxazoles, cyclic olefin resins such as benzocyclobutene resins and norbornene resins, and those containing them (mainly) in terms of particularly excellent heat resistance It is preferable to use, and particularly, those mainly composed of norbornene-based resins (norbornene-based polymers) are preferable.

Since the norbornene-based polymer is excellent in heat resistance, in the optical waveguide 9 using this as a constituent material of the cladding layer 91 (92), when the conductor layer is formed on the optical waveguide 9, the conductor layer is processed to form a wiring. At this time, even when the optical element is heated to mount it, the clad layer 91 (92) can be prevented from being softened and deformed.

Moreover, since it has high hydrophobicity, it is possible to obtain the clad layer 91 (92) that is less likely to undergo dimensional changes due to water absorption.

Further, norbornene-based polymers or norbornene-based monomers that are raw materials thereof are preferable because they are relatively inexpensive and easily available.

Furthermore, when a material mainly composed of a norbornene-based polymer is used as the material of the clad layer 91 (92), the

clad layers

91 and 92 and the core layer 93 are excellent in resistance to deformation such as bending, even when repeatedly bent and deformed. The delamination is difficult to occur, and the occurrence of microcracks in the

clad layers

91 and 93 is also prevented. In addition, since it is the same kind of material that is suitably used as the constituent material of the core layer 93, the adhesion with the core layer 93 is further increased, and delamination between the clad layer 91 (92) and the core layer 93 is achieved. Can be prevented. For this reason, the optical transmission performance of the optical waveguide 9 is maintained, and the optical waveguide 9 having excellent durability can be obtained.

The average thickness of the

clad layers

91 and 92 is preferably about 0.1 to 1.5 times the average thickness of the core layer 93, more preferably about 0.3 to 1.25 times, Specifically, the average thickness of the

clad layers

91 and 92 is not particularly limited, but each is preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and more preferably about 10 to 60 μm. More preferably. Thereby, the function as a clad layer is suitably exhibited while preventing the optical waveguide 9 from becoming unnecessarily large (pressure film).

Through the above steps, the optical waveguide 9 shown in FIGS.
Moreover, when the optical waveguide 9 is obtained with the photosensitive resin composition used in the present invention, the solder reflow resistance is particularly excellent. Furthermore, even when the optical waveguide 9 is bent, the optical loss can be reduced.

In the above description, the case where the photosensitive resin composition is directly supplied onto the clad layer 91 to form the film 910 (core layer 93) has been described, but the film 910 (core layer) is formed on another substrate. 93), the obtained core layer 93 may be transferred onto the clad layer 91 or the clad layer 92, and then the clad layer 91 and the clad layer 92 may be overlapped via the core layer 93. .
Examples of the substrate include a silicon substrate, a silicon dioxide substrate, a glass substrate, a quartz substrate, and a polyethylene terephthalate (PET) film.

Next, the effect of this embodiment is demonstrated.
When light is applied to the photosensitive resin composition used in the present embodiment, an acid is generated from the photoacid generator, and the component (B) is polymerized only in the irradiated portion. Then, since the amount of the component (B) in the irradiated part is reduced, the component (B) in the non-irradiated part diffuses into the irradiated part, thereby causing a difference in refractive index between the irradiated part and the unirradiated part. Specifically, in this embodiment, since a substituted or unsubstituted cyclic olefin resin having a higher refractive index than that of the component (B) is used as the base polymer, the component (B) in the unirradiated portion is irradiated with the irradiated portion. The refractive index of the unirradiated part becomes higher than the refractive index of the irradiated part.

In addition to this, when the photosensitive resin composition is heated after irradiation with light (active radiation), the component (B) volatilizes from the unirradiated portion. Thereby, a refractive index difference further occurs between the irradiated portion and the unirradiated portion.

By using the photosensitive resin composition in this way, it is possible to reliably form a refractive index difference between the irradiated part and the non-irradiated part. Further, according to the present invention, the core portion can be patterned by a simple method of simply irradiating light (active radiation). For example, by appropriately selecting an exposure pattern such as a photomask, an optical path (core part) of any shape and arrangement can be formed, and a thin optical path can be formed sharply. This contributes to integration, and the device can be miniaturized. That is, according to the present invention, a core portion having a wide degree of freedom in designing the pattern shape of the core portion and high dimensional accuracy can be obtained.

Conventionally, a technique for crosslinking a norbornene resin having an oxetanyl group or the like with a thermal acid generator is known. However, the composition used in such a technique contains a norbornene-based resin having an oxetanyl group or the like as a base polymer. And the whole composition is heated and a crosslinked structure is produced in the whole composition. Therefore, this composition that has been conventionally used is selectively irradiated with light (active radiation) to generate an acid, thereby selectively polymerizing the monomer in a region where the monomer concentration is reduced. There is no technical idea that a density difference can be achieved by diffusion.

In contrast, when the photosensitive resin composition used in the present embodiment is selectively irradiated with light (active radiation), the amount of the component (B) in the irradiated portion decreases due to the generation of acid, so that the unirradiated portion The component (B) is diffused into the irradiated part, and as a result, a difference in refractive index occurs between the irradiated part and the unirradiated part.

Further, when the cyclic olefin resin has a leaving group that is desorbed by an acid generated from the photoacid generator and reduces the refractive index of the cyclic olefin resin of the component (A) by desorption, The refractive index of the region irradiated with light (active radiation) can be reliably lowered as compared with the unirradiated region.

On the other hand, when the cyclic olefin resin has no leaving group, the side chain is chemically stable, so the core portion, the cladding, and the like can be formed depending on conditions such as light (active radiation) irradiation and heating. It can suppress that the refractive index of a part changes.

Furthermore, in this embodiment, a norbornene resin is used as the component (A). Thereby, the light transmittance in a specific wavelength can be improved reliably, and reduction of propagation loss can be aimed at reliably.

Further, the clad part 95 has a lower refractive index than the core part 94, and the difference in refractive index between the clad part 95 and the core part 94 is 0.01 or more, so that light can be reliably confined in the core part 94. And the generation of light propagation loss can be suppressed.

On the other hand, conventionally, a composition containing a polymer, a monomer, a promoter and a catalyst precursor is known as a composition for forming an optical waveguide.

Among these, the monomer can form a reactant upon irradiation with light (active radiation), and the refractive index of the region irradiated with light (active radiation) can be made different from the refractive index of the unirradiated region.

The catalyst precursor is a substance capable of initiating a monomer reaction (polymerization reaction, crosslinking reaction, etc.), and a substance whose activation temperature changes due to the action of a co-catalyst activated by irradiation with light (active radiation). It is. Due to the change in the activation temperature, the temperature at which the monomer reaction starts is different between the irradiated region of light (active radiation) and the unirradiated region, and as a result, a reactant can be formed only in the irradiated region. .

On the other hand, the photosensitive resin composition used in this embodiment does not require a substance containing such a large amount of metal elements. For this reason, the increase of the propagation loss as described above is prevented, and the optical waveguide 9 excellent in propagation efficiency and heat resistance can be obtained.
Even when such a conventional composition is used, the core part and the clad part can be made separately by irradiation with light (active radiation). However, according to the photosensitive resin composition used in this embodiment, the core part Since the difference in refractive index between 94 and the clad portion 95 is further increased and the heat resistance is improved, the optical waveguide 9 with higher reliability can be obtained. This is mainly due to the optimization of the composition of component (A) and component (B).

By using such a photosensitive resin composition, the present invention can provide an optical waveguide film or the like in which generation of light propagation loss is suppressed. In particular, when a curved optical waveguide is formed, generation of light propagation loss can be remarkably suppressed.

Further, according to the manufacturing method as described above, the optical waveguide 9 having the core portion 94 having a desired shape and high dimensional accuracy can be obtained by a simple process and in a short time.

Next, the manufacturing method of a light guide is demonstrated.
When the single conductor portion 24 is formed in the through hole 1022 as in the fourteenth and fifteenth embodiments, the conductor portion 3 is first formed on the inner peripheral surface of the through hole 1022 by the method described above, Next, the core layer forming material 1900 is filled inside, and irradiation with active radiation and heating are performed as necessary (according to the composition and characteristics of the core layer forming material 1900) to form the core layer. The light guide 1024 is formed by curing the material 1900.

In this case, the formation of the core layer 1093 of the optical waveguide 1009 and the formation of the light guide 1024 may be performed separately, but all of the formation process of the core layer 1093 and the formation of the light guide 1024 of the optical waveguide 1009 or Some can be done at the same time. For example, all or part of the heating process can be performed simultaneously. Thereby, the number of manufacturing steps can be reduced, and manufacturing can be performed more easily and in a short time.

When the vertical optical waveguide 1023 is formed in the through hole 1022 as in the sixteenth, seventeenth and eighteenth embodiments, first, the entire circumference or a part (rectangular portion 1224) of the inner surface of the through hole 1022 is first described above. The conductor portion 1003 is formed by the above-described method, and then the core layer forming material 1900 described above is filled inside (or the circular portion 1222). Next, by the above-described method, actinic radiation is selectively radiated only to, for example, a portion to be the clad portion 1025 in the filled core layer forming material 1900 and, if necessary, (the core layer forming material 1900 Depending on the composition and characteristics, heating is performed at least once to form the core portion 1024 and the clad portion 1025. The irradiation method and conditions of actinic radiation, the heating method and conditions, and other matters can be the same as described above.

In this case, the formation of the core layer 1093 of the optical waveguide 1009 and the formation of the vertical optical waveguide 23 may be performed separately. All or part of it can be performed simultaneously. For example, all or a part of the supplying (coating and filling) step of the core layer forming material 1900, the active radiation irradiation step, the heating step, and the like can be performed simultaneously. Thereby, the number of manufacturing steps can be reduced, and manufacturing can be performed more easily and in a short time.

In the present invention, it goes without saying that the basic structure, layer structure, shape, number, arrangement, etc. of the optical waveguide structure are not limited to those shown in the drawings.

In each of the above embodiments, the light emitting element 1010 has been described as a representative example as an element, but a configuration in which a light receiving element having a light receiving portion is mounted instead of the light emitting element 1010 may be used. In this case, for example, the transmission light 1018 can be guided to the light receiving unit of the light receiving element by the optical waveguide 1009, the optical path conversion unit 1096, and the light guide (core unit) 1024. Of course, at least one set of both the light emitting element and the light receiving element may be mounted.

In each of the above embodiments, the example having the light emitting element 2010 has been described. However, the light emitting element 2010 or the light receiving element may be provided. Of course, one or two or more sets of both the light emitting element and the light receiving element may be mounted. Further, the electronic circuit element (electronic circuit unit) may be omitted.

The present invention has been described based on the illustrated embodiments. However, the present invention is not limited to these embodiments, and the configuration of each part can be replaced with any configuration that can exhibit the same function. In addition, an arbitrary configuration may be added.

Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a scope that can achieve the object of the present invention are included in the present invention.

In the above embodiment, the optical waveguide film is formed using the photosensitive resin composition. However, the present invention is not limited to this, and the optical waveguide film may be used for a hologram or the like. The above-mentioned photosensitive resin composition is suitable for forming a film in which a region having a high refractive index and a region having a low refractive index are mixed.

Next, examples of the present invention will be described.
A. Production of optical waveguide (Example 1)
(1) Synthesis of norbornene-based resin having a leaving group In a glove box filled with dry nitrogen in which the water and oxygen concentrations are both controlled to 1 ppm or less, 7.2 g (40.1 mmol) of hexylnorbornene (HxNB) ), 12.9 g (40.1 mmol) of diphenylmethylnorbornenemethoxysilane was weighed into a 500 mL vial, 60 g of dehydrated toluene and 11 g of ethyl acetate were added, and the top was sealed with a silicon sealer.

Next, 1.56 g (3.2 mmol) of Ni catalyst represented by the following chemical formula (B) and 10 mL of dehydrated toluene are weighed in a 100 mL vial, put a stirrer chip and sealed, and the catalyst is thoroughly stirred to completely Dissolved in.

When 1 mL of the Ni catalyst solution represented by the following chemical formula (B) is accurately weighed with a syringe, and quantitatively injected into the vial bottle in which the above two types of norbornene are dissolved, and stirred at room temperature for 1 hour, a marked increase in viscosity occurs. Was confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added, and the mixture was stirred to obtain a reaction solution.

In a 100 mL beaker, 9.5 g of acetic anhydride, 18 g of hydrogen peroxide (concentration 30%) and 30 g of ion-exchanged water were added and stirred to prepare a peracetic acid aqueous solution on the spot. Next, the total amount of this aqueous solution was added to the above reaction solution and stirred for 12 hours to reduce Ni.

Next, the treated reaction solution was transferred to a separatory funnel, the lower aqueous layer was removed, and then 100 mL of a 30% aqueous solution of isopropyl alcohol was added and vigorously stirred. The aqueous layer was removed after standing and completely separating the two layers. After repeating this water washing process three times in total, the oil layer was dropped into a large excess of acetone to reprecipitate the polymer produced, separated from the filtrate by filtration, and then in a vacuum dryer set at 60 ° C. Polymer # 1 was obtained by heating and drying for 12 hours. The molecular weight distribution of the polymer # 1 was Mw = 100,000 and Mn = 40,000 according to GPC measurement. Moreover, the molar ratio of each structural unit in the polymer # 1 was 50 mol% for the hexylbornene structural unit and 50 mol% for the diphenylmethylnorbornenemethoxysilane structural unit according to identification by NMR. The refractive index by Metricon was 1.55 (measurement wavelength: 633 nm).

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyl oxetane monomer (formula 20) 1st monomer represented by (Formula 100), Toa Gosei CHOX, CAS # 483303-25-9, molecular weight 186, boiling point 125 ° C./1.33 kPa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-2 g in 0.1 mL of ethyl acetate) and uniformly dissolved, and then filtered through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V1. It was.

(3) Production of optical waveguide film (production of lower clad layer)
A photosensitive norbornene resin composition (Avatrel 2000P varnish manufactured by Promeras Co., Ltd.) was uniformly applied on a silicon wafer with a doctor blade, and then placed in a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, the entire coated surface was irradiated with 100 mJ of ultraviolet light and heated in a dryer at 120 ° C. for 1 hour to cure the coating film to form a lower clad layer. The formed lower cladding layer had a thickness of 20 μm, was colorless and transparent, and had a refractive index of 1.52 (measurement wavelength: 633 nm).

(Formation of core layer)
After the photosensitive resin composition varnish V1 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(Formation of upper cladding layer)
A dry film in which Avatrel 2000P is laminated in advance on a polyethersulfone (PES) film so as to have a dry thickness of 20 μm is bonded to the above core layer, and put into a vacuum laminator set at 140 ° C. for thermocompression bonding. It was. Thereafter, 100 mJ was irradiated on the entire surface and heated in a dryer at 120 ° C. for 1 hour to cure Avatrel 2000P to form an upper clad layer to obtain an optical waveguide. At this time, the upper cladding layer was colorless and transparent, and its refractive index was 1.52.

(4) Evaluation (Evaluation of optical waveguide loss)
Light emitted from an 850 nm VCSEL (surface emitting laser) was introduced into the optical waveguide via a 50 μmφ optical fiber, received by a 200 μmφ optical fiber, and the light intensity was measured. The cutback method was used for the measurement. When the longitudinal direction of the optical waveguide is taken on the horizontal axis and the insertion loss is plotted on the vertical axis, the measured values are neatly arranged on a straight line, and the propagation loss can be calculated as 0.03 dB / cm from the inclination. .

(Refractive index difference between core and clad)
The difference in refractive index between the left and right core portions and the clad portion formed in the above (formation of the core layer) in the horizontal direction was determined as follows.

The optical waveguide was irradiated with a laser beam having a wavelength of 656 nm by “Optical waveguide” analyzer OWA-9500 manufactured by EXFO, Canada, and the refractive index of the core region and the cladding region was measured, and the difference between them was calculated. As a result, the refractive index difference was 0.02.

(Example 2)
(1) Synthesis of norbornene-based resin having no leaving group In a glove box filled with dry nitrogen in which the water and oxygen concentrations are both controlled to 1 ppm or less, 9.4 g of hexylnorbornene (HxNB) (53. 1 mmol) and 10.5 g (53.1 mmol) of phenylethylnorbornene were weighed into a 500 mL vial, 60 g of dehydrated toluene and 11 g of ethyl acetate were added, and the top was sealed with a silicon sealer.

Next, weigh 2.06 g (3.2 mmol) of Ni catalyst represented by the above chemical formula (B) and 10 mL of dehydrated toluene in a 100 mL vial, put a stirrer chip and seal tightly, and thoroughly stir the catalyst. Dissolved in.

When 1 mL of the Ni catalyst solution represented by the chemical formula (B) is accurately weighed with a syringe, and quantitatively injected into the vial bottle in which the two types of norbornene are dissolved and stirred at room temperature for 1 hour, a marked increase in viscosity is observed. confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added, and the mixture was stirred to obtain a reaction solution.

Next, the treated reaction solution was transferred to a separatory funnel, the lower aqueous layer was removed, and then 100 mL of a 30% aqueous solution of isopropyl alcohol was added and vigorously stirred. The aqueous layer was removed after standing and completely separating the two layers. After repeating this water washing process three times in total, the oil layer was dropped into a large excess of acetone to reprecipitate the polymer produced, separated from the filtrate by filtration, and then in a vacuum dryer set at 60 ° C. Polymer # 2 was obtained by heat drying for 12 hours. The molecular weight distribution of the polymer # 2 was Mw = 90,000 and Mn = 40,000 according to GPC measurement. The molar ratio of each structural unit in polymer # 2 was 50 mol% for the hexylbornene structural unit and 50 mol% for the phenylethylnorbornene structural unit according to identification by NMR. The refractive index by Metricon was 1.54 (measurement wavelength: 633 nm).

(2) Production of photosensitive resin composition 10 g of the purified polymer # 2 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyloxetane monomer (formula 20) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2), manufactured by Toagosei Co., Ltd. CHOX, CAS # 483303-25-9, molecular weight 186, boiling point 125 ° C./1.33 kPa) (1.36E-2 g, in 0.1 mL of ethyl acetate) was added and dissolved uniformly, and then filtered through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V2.

(3) Production of optical waveguide film (production of lower clad layer)
A lower clad layer similar to that in Example 1 was produced.

(Formation of core layer)
After the photosensitive resin composition varnish V2 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(Formation of upper cladding layer)
An upper clad layer similar to that in Example 1 was produced.

(4) Evaluation Evaluation was performed in the same manner as in Example 1. The propagation loss could be calculated as 0.04 dB / cm. The difference in refractive index between the core portion and the cladding portion was 0.01.

(Example 3)
(1) Synthesis of norbornene-based resin having a leaving group A norbornene-based resin was produced in the same manner as in Example 1.

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, an antioxidant Irganox 1076 (manufactured by Ciba Geigy) 0.01 g, a bifunctional oxetane monomer (formula (15), Toa Gosei, DOX, CAS # 18934-00-4, molecular weight 214, boiling point 119 ° C./0.67 kPa) 2 g, photoacid generator Rhodosil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-) 72-2) (1.36E-2 g in 0.1 mL of ethyl acetate) was added and dissolved uniformly, and then filtered through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V3.

(Formation of core layer)
After the photosensitive resin composition varnish V3 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

Example 4
(1) Synthesis of norbornene-based resin having a leaving group A norbornene-based resin was produced in the same manner as in Example 1.

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by Ciba Geigy), an alicyclic epoxy monomer ( Formula (37), manufactured by Daicel Chemical Industries, Celoxide 2021P, CAS # 2386-87-0, molecular weight 252 and boiling point 188 ° C./4 hPa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233- 72-2) (1.36E-2 g in 0.1 mL of ethyl acetate) was added and dissolved uniformly, and then filtered through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V4.

(Formation of core layer)
After the photosensitive resin composition varnish V4 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(Example 5)
(1) Synthesis of norbornene-based resin having a leaving group A norbornene-based resin was produced in the same manner as in Example 1.

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyl oxetane monomer (formula 20) 1 g of CHOX manufactured by Toagosei Co., Ltd., 1 g of an alicyclic epoxy monomer (manufactured by Daicel Chemical Industries, Celoxide 2021P), photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-) 2 g in 0.1 mL of ethyl acetate) and uniformly dissolved, and then filtered through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V5.

(Formation of core layer)
After the photosensitive resin composition varnish V5 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(4) Evaluation Evaluation was performed in the same manner as in Example 1. The propagation loss could be calculated as 0.03 dB / cm. The difference in refractive index between the core portion and the cladding portion was 0.01.

(Example 6)
(1) Synthesis of norbornene-based resin having a leaving group A norbornene-based resin was produced in the same manner as in Example 1.

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyl oxetane monomer (formula 20) And 1.5 g of photoacid generator Rhodosil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-2 g in 0.1 mL of ethyl acetate) and uniformly added. After dissolution, filtration was performed with a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V6.

(Formation of core layer)
After the photosensitive resin composition varnish V6 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(Example 7)
(1) Synthesis of norbornene-based resin having a leaving group In a glove box whose water and oxygen concentrations are both controlled to 1 ppm or less and filled with dry nitrogen, 6.4 g (36.1 mmol) of hexylnorbornene (HxNB) ), Diphenylmethylnorbornene methoxysilane (diPhNB) 8.7 g (27.1 mmol), epoxy norbornene (EpNB) 4.9 g (27.1 mmol) were weighed into a 500 mL vial, 60 g of dehydrated toluene and 11 g of ethyl acetate were added, The top was sealed with a silicon sealer.

Next, 1.75 g (3.2 mmol) of the Ni catalyst represented by the above chemical formula (B) and 10 mL of dehydrated toluene are weighed in a 100 mL vial, put a stirrer chip and sealed, and the catalyst is thoroughly stirred to completely Dissolved in.

When 1 mL of the Ni catalyst solution represented by the above chemical formula (B) is accurately weighed with a syringe, and quantitatively injected into the vial bottle in which the three types of norbornene are dissolved, and stirred at room temperature for 1 hour, a marked increase in viscosity occurs. Was confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added, and the mixture was stirred to obtain a reaction solution.

Next, the treated reaction solution was transferred to a separatory funnel, the lower aqueous layer was removed, and 100 mL of a 30% aqueous solution of isopropyl alcohol isopropyl alcohol was added and vigorously stirred. The aqueous layer was removed after standing and completely separating the two layers. After repeating this water washing process three times in total, the oil layer was dropped into a large excess of acetone to reprecipitate the polymer produced, separated from the filtrate by filtration, and then in a vacuum dryer set at 60 ° C. Polymer # 3 was obtained by heat drying for 12 hours. The molecular weight distribution of the polymer # 3 was Mw = 80,000 and Mn = 40,000 according to GPC measurement. Further, according to the identification by NMR, the molar ratio of each structural unit in the polymer # 3 is 40 mol% for the hexylbornene structural unit, 30 mol% for the diphenylmethylnorbornenemethoxysilane structural unit, and 30 mol% for the epoxynorbornene structural unit. there were. The refractive index by Metricon was 1.53 (measurement wavelength: 633 nm).

(2) Production of photosensitive resin composition 10 g of the purified polymer # 3 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyloxetane monomer (formula 20) And 1.0 g of CHO manufactured by Toa Gosei Co., Ltd. and a photoacid generator Rhodosil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-2 g in 0.1 mL of ethyl acetate) were uniformly added. After dissolution, filtration was performed with a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish V7.

(3) Production of optical waveguide film (production of lower clad layer)
A lower clad layer similar to that in Example 1 was produced.
(Formation of core layer)
After the photosensitive resin composition varnish V7 was uniformly applied on the lower clad layer with a doctor blade, it was put into a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a very clear waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(Formation of upper cladding layer)
An upper clad similar to that of Example 1 was produced.

(4) Evaluation Evaluation was performed in the same manner as in Example 1. The propagation loss could be calculated as 0.04 dB / cm. The refractive index difference between the core portion and the clad portion was 0.02.
The evaluation results of the optical waveguide films obtained in Examples 1 to 7 are shown in Table 1.

In Examples 1 to 7, when light is applied to the photosensitive resin composition, an acid is generated from the photoacid generator, and the monomer having a cyclic ether group is polymerized only in the irradiated portion. Then, since the amount of unreacted monomer in the irradiated part decreases, the monomer in the unirradiated part diffuses into the irradiated part in order to eliminate the concentration gradient generated between the irradiated part / unirradiated part.
Further, when heating is performed after light irradiation, the monomer volatilizes from the unirradiated portion.

As described above, the structure concentration derived from the monomer is different between the core portion and the cladding portion, the structure derived from the monomer having a cyclic ether group increases in the cladding portion, and the monomer derived from the monomer having a cyclic ether group is present in the core portion. There are fewer structures. This is recognized from the fact that a relatively large refractive index difference of 0.01 or more occurs between the core portion and the cladding portion.

In Examples 1 to 7, a linear optical waveguide is formed. However, when a curved optical waveguide (with a radius of curvature of about 10 mm) is formed, the optical loss is remarkable.

Furthermore, the optical waveguide films obtained in Examples 1 to 7 have high heat resistance and reflow resistance of 260 ° C.

(Example 8)
(1) Synthesis of norbornene resin having a leaving group In the synthesis of a norbornene resin having a leaving group, phenyldimethylnorbornenemethoxysilane was used instead of 12.9 g (40.1 mmol) of diphenylmethylnorbornenemethoxysilane. Example 1 was repeated except that 4 g (40.1 mmol) was used. The molecular weight of the obtained norbornene resin B (Formula 103) having a leaving group in the side chain was Mw = 110,000 and Mn = 50,000 according to GPC measurement. Further, according to the identification by NMR, the molar ratio of each structural unit was 50 mol% for the hexylnorbornene structural unit and 50 mol% for the phenyldimethylnorbornenemethoxysilane structural unit. The refractive index by Metricon was 1.53 (measurement wavelength: 633 nm).

(2) Production of photosensitive resin composition A photosensitive resin composition was obtained in the same manner as in Example 1 except that norbornene resin B was used instead of polymer # 1.

(3) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition containing the norbornene-based resin B was used.

When the loss evaluation of the optical waveguide was performed in the same manner as in Example 1, the propagation loss of the obtained optical waveguide film was 0.03 dB / cm.

Example 9
(1) The procedure was the same as Example 1 except that the following photosensitive resin composition was used.

10 g of the norbornene-based resin obtained in Example 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by Ciba Geigy), and a cyclohexyloxetane monomer (formula (100) represented by the formula (100)). 1 monomer, manufactured by Toa Gosei Co., CAS # 483303-25-9, molecular weight 186, boiling point 125 ° C./1.33 kPa) 1 g, bifunctional oxetane monomer (second monomer represented by the formula (104), manufactured by Toa Gosei Co., Ltd., DOX , CAS # 18934-00-4, molecular weight 214, boiling point 119 ° C./0.67 kPa) 1 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-2 g, ethyl acetate In 0.1 mL) After e uniformly dissolved, then filtered through 0.2 [mu] m PTFE filter to prepare a photosensitive resin composition varnish for clean core layer.

(2) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition of (1) above was used.

As in Example 1, when the loss evaluation of the optical waveguide was performed, the propagation loss of the obtained optical waveguide film was 0.04 dB / cm.

(Example 10)
Example 1 was repeated except that the following were used as the cyclic olefin.

(1) Synthesis of norbornene-based resin C Norbornene represented by the following formula (105) is obtained by ring-opening metathesis polymerization of phenylethylnorbornene (PENB) monomer using a known method (for example, JP-A-2003-252963). System resin C was obtained.

(2) Production of photosensitive resin composition A photosensitive resin composition was obtained in the same manner as in Example 1 except that the norbornene resin C was used instead of the polymer # 1.

(3) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition containing the norbornene-based resin C was used.

As in Example 1, when the loss evaluation of the optical waveguide was performed, the propagation loss of the obtained optical waveguide film was 0.05 dB / cm.

(Example 11)
An optical waveguide film was produced in the same manner as in Example 1 except that the amount of the first monomer was changed to 0.5 g.
The propagation loss of the obtained optical waveguide film was 0.10 dB / cm.

(Example 12)
An optical waveguide film was produced in the same manner as in Example 1 except that the blending amount of the first monomer was 4.0 g.
The propagation loss of the obtained optical waveguide film was 0.10 dB / cm.

(Comparative Example 1)
An optical waveguide film was produced in the same manner as in Example 1 except that the first monomer was not used.
The propagation loss of the obtained optical waveguide film was 0.90 dB / cm.

(Comparative Example 2)
(1) Synthesis of each component <Catalyst precursor: Synthesis of Pd (OAc) ₂ (P (Cy) ₃ ) ₂ >
In a 2-neck round bottom flask equipped with a funnel, a reddish brown suspension consisting of Pd (OAc) ₂ (5.00 g, 22.3 mmol) and CH ₂ Cl ₂ (30 mL) was stirred at −78 ° C.

A funnel was charged with a CH ₂ Cl ₂ solution (30 mL) of P (Cy) ₃ (13.12 mL (44.6 mmol)) and added dropwise to the stirred suspension over 15 minutes. As a result, the color gradually changed from reddish brown to yellow.

After stirring at −78 ° C. for 1 hour, the suspension was warmed to room temperature, further stirred for 2 hours, and diluted with hexane (20 mL).

Next, this yellow solid was filtered in the air, washed with pentane (5 × 10 mL), and vacuum-dried.

The secondary collection was separated by cooling the filtrate to 0 ° C., washed and dried as above. As a result, a catalyst precursor was obtained.

(2) Production of photosensitive resin composition 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by Ciba Geigy), and dimethylbis (norbornenemethoxy). Silane (SiX) 2.4 g, the above catalyst precursor (2.6E-2 g), photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS # 178233-72-2) (1.36E-2 g, in ethyl acetate 0.1 mL) ) And uniformly dissolved, followed by filtration with a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition varnish.

(Formation of core layer)
The varnish prepared on the lower clad layer was uniformly applied by a doctor blade, and then placed in a dryer at 45 ° C. for 15 minutes. After completely removing the solvent, a photomask was pressed and selectively irradiated with ultraviolet rays at 500 mJ / cm ² . The mask was removed, and heating was performed in three stages in a dryer at 45 ° C. for 30 minutes, 85 ° C. for 30 minutes, and 150 ° C. for 1 hour. It was confirmed that a waveguide pattern appeared after heating. Moreover, formation of the core part and the clad part was confirmed.

(4) Evaluation Evaluation was performed in the same manner as in Example 1. The propagation loss could be calculated as 0.05 dB / cm. The difference in refractive index between the core portion and the cladding portion was 0.005.

B. Evaluation of Optical Waveguide The following evaluations were performed on the optical waveguides obtained in the examples and comparative examples. The evaluation items are shown together with the contents. The obtained results are shown in Table 2.

1. Light loss Light emitted from an 850 nm VCSEL (surface emitting laser) was introduced into the optical waveguide via a 50 μmφ optical fiber, and received by a 200 μmφ optical fiber to measure the light intensity. The cutback method was used for the measurement, and the waveguide length was plotted on the horizontal axis and the insertion loss was plotted on the vertical axis. The measured values were neatly arranged on a straight line, and the propagation loss was calculated from the slope.

2. Heat resistance The optical waveguide was placed in a high-temperature and high-humidity tank (85 ° C., 85% RH), and propagation loss after 500 hours of wet heat treatment was evaluated. It was also confirmed in parallel presence or absence of degradation of the propagation loss due to reflow process (N ₂ atmosphere, a maximum temperature of 260 ° C. / 60 seconds).
Note that the measurement of the propagation loss here is the same as the one optical loss measurement method.

3. Bending loss of optical waveguide The bending loss of the light intensity of the optical waveguide film having a radius of curvature of 10 mm was evaluated. Light emitted from an 850 nm VCSEL (surface emitting laser) was introduced into the end face of the optical waveguide film via a 50 μmφ optical fiber, and the light intensity was measured from the other end with a 200 μmφ optical fiber (see the following formula) ). The increment of the loss that occurs when the optical waveguide film having the same length is bent is defined as “bending loss”. As shown in FIG. 19, the insertion loss and the optical waveguide film are linear when the optical waveguide film is curved. The “bending loss” is expressed by the difference from the insertion loss when the shape is made.

Insertion loss [dB] =-10 log (outgoing light intensity / incident light intensity)
Bending loss = (insertion loss on a curve)-(insertion loss on a straight line)

As is clear from Table 2, Examples 1 and 8-12 showed low optical loss and excellent optical waveguide performance.

In addition, Examples 1 and 8-12 showed that light loss after high-temperature and high-humidity treatment and after reflow treatment was small, and excellent in heat resistance.

Further, in particular, Examples 1, 8, 9, and 10 have a small bending loss, and it was suggested that sufficient performance is exhibited even when the optical waveguide is bent.

Furthermore, when the optical waveguide structures according to the first and nineteenth embodiments were produced using the optical waveguide films obtained in the examples and comparative examples, the optical waveguide films obtained in the examples were used. Each of the optical waveguide structures obtained had a lower transmission loss than the optical waveguide structure using the optical waveguide film obtained in each of the comparative examples.
In addition, the optical waveguide structure according to the fourteenth embodiment was produced using the optical waveguide films obtained in the examples and comparative examples, and the optical waveguide films obtained in the examples and comparative examples were vertically guided. When used for each of the waveguides, the optical waveguide structure using the optical waveguide film obtained in each example is less in transmission loss than the optical waveguide structure using the optical waveguide film obtained in each comparative example. A low one was obtained.

The optical waveguide structure of the present invention has a wide range of optical circuit (optical waveguide pattern) and electrical circuit design, high yield, high optical transmission performance, excellent reliability and durability, and versatility. Rich. Therefore, by providing the optical waveguide structure of the present invention, various highly reliable electronic parts and electronic devices can be obtained. Therefore, the present invention is extremely useful industrially.

DESCRIPTION OF SYMBOLS 1 Optical waveguide structure 2, 2 'board | substrate 21 Translucent part 22 Through-hole 23 Vertical optical waveguide 24 Core part 25 Clad part 26 Lens part 3

Adhesive layer

4, 41

Underfill material

51, 52, 54, 55

Conductor layer

6, 61 Sealing material 7 Solder 8 Through hole (through hole)
81, 82 Conductor post (conductive material)
9, 9 'Optical waveguide 91 Clad layer 92 Clad layer 93 Core layer 94 Core part 95 Clad part 96 Optical path conversion part 961 Reflecting

surface

96a, 96b, 96c, 96d, 96e, 96f Optical

path conversion part

961a, 961b, 961c, 961d, 961e, 961f Reflecting surface 10 Light emitting element 101 Light emitting part 103 Terminal 105 Terminal 11 Light receiving element 111 Light receiving part 113 Terminal 115 Terminal 12 Electric element (semiconductor element)
123 terminal 125 terminal 127 terminal 129 terminal 13 chip carrier 900 varnish 910 film 941 branch part 942 core part 943 through hole (hole)
944 Reflecting surface 945 Widened portion 946 Interrupted portion M Mask S Stretched line 1001 Optical waveguide structure 1002 Substrate 1022 Through hole (through hole)
1222 Circular portion 1224 Rectangular portion 1023 Vertical optical waveguide 1024 Light guide path (core portion)
1025 Clad part 1026 Lens part 1003 Conductor part 1004

Underfill material

1051, 1052, 1053

Conductor layer

1531, 1532, 1533 Site 1006 Sealing material 1008 Through hole (through hole)
1081 Conductor post (conductor part)
DESCRIPTION OF SYMBOLS 1009 Optical waveguide 1091 Clad layer 1092 Clad layer 1093 Core layer 1094 Core part 1095 Clad part 1096 Optical path conversion part 1961 Reflecting surface 1010 Light emitting element 1101 Light emitting part 1103 Terminal 1105 Terminal 1012 Electrical element (semiconductor element)
1123 Terminal 1125 Terminal 1018 Transmission light 1900 Varnish (core layer forming material)
1910 Film 2001 Optical waveguide structure 2002 Substrate 2024 Translucent part 2025 Through hole 2026 Lens part 2003 Recessed part 2030 Bottom face (lower face)
2031 Abutting surface (X direction regulation)
2032 Abutting surface (Y direction regulation)
2033 Positioning means (for light emitting element)
2004 Concave 2040 Bottom (lower surface)
2041 Abutting surface (X direction regulation)
2042 Abutting surface (Y direction regulation)
2043 Positioning means (for electronic circuit elements)
2005

Conductor layer

2051, 2052, 2053 Site 2006 Positioning member (plate material)
2061, 2062 Application surface 2007 Adhesive layer 2009 Optical waveguide 2091 Clad layer 2092 Clad layer 2093 Core layer 2094 Core part 2095 Clad part 2096 Optical path changing part 2961 Reflecting surface 2010 Light emitting element 2101

Light emitting part

2103, 2105 terminal 2012 Electronic circuit element (semiconductor) element)
2123, 2125 Terminal 2018 Transmission light 2900 Varnish (core layer forming material)
2910 films

Claims

An optical waveguide having a core part and a clad part having different refractive indexes, and an optical path conversion part for bending the optical path of the core part,
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure characterized by being formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition comprising:
The optical waveguide structure according to claim 1, wherein the cyclic ether group (B) is an oxetanyl group or an epoxy group.
The cyclic olefin resin (A) has a leaving group that is eliminated by an acid generated from the photoacid generator (C) in the side chain,
The optical waveguide structure according to claim 2, wherein (B) includes the first monomer represented by the following formula (100).
The optical path conversion unit has a reflection surface that reflects at least a part of transmission light transmitted through the core unit, and the reflection surface is set to an inclination angle that totally reflects the transmission light. The optical waveguide structure according to any one of claims 1 to 3.
A hole provided in the core portion, and the reflection surface is configured by a part or all of an interface between the core portion and the hole, and the reflection surface totally reflects the transmitted light. The optical waveguide structure according to any one of claims 1 to 4, wherein the optical waveguide structure is set to an inclination angle to be caused.
The area where the projection when the reflecting surface is projected in the direction of the core and the cross-section of the core overlap is the same as the cross-sectional area of the core.
The optical waveguide structure according to claim 4 or 5, wherein the core portion is set to be large only in a portion where the reflection surface of the core portion exists.
The optical waveguide structure according to any one of claims 1 to 6, wherein the optical path conversion unit is formed only in the core layer.
In the core layer, the core portion is formed so as to be interrupted at an end portion or in the middle thereof,
The optical waveguide structure according to any one of claims 1 to 7, wherein the optical path conversion unit is formed in a portion where the core unit is interrupted.
It is composed of a laminated structure having an optical waveguide having a core part and a clad part having different refractive indexes, and a conductor layer,
A light guide that extends in the thickness direction and is optically connected to the core portion;
A conductor portion extending in the thickness direction and electrically connected to the conductor layer;
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure characterized by being formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition comprising:
The optical waveguide structure according to claim 9, further comprising a through hole, wherein the light guide path and the conductor portion are formed in the through hole.
The optical waveguide structure according to claim 9 or 10, wherein the light guide path is constituted by a vertical optical waveguide having a core part and a clad part having different refractive indexes.
An optical waveguide structure comprising a substrate, an optical waveguide having a core portion and a cladding portion having different refractive indexes, at least one electrical element, and positioning means for determining an installation position of the electrical element,
The core part is
(A) a cyclic olefin resin;
(B) The refractive index is different from that of (A), and at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group;
(C) a photoacid generator;
An optical waveguide structure characterized by being formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition comprising:
The optical waveguide structure according to claim 12, wherein the positioning means positions the light emitting unit or the light receiving unit so that the position of the light emitting unit or the light receiving unit overlaps with the position of the optical path conversion unit in plan view.