TW201213360A - An optical waveguide structure and an electronic device - Google Patents

An optical waveguide structure and an electronic device Download PDF

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Publication number
TW201213360A
TW201213360A TW100110676A TW100110676A TW201213360A TW 201213360 A TW201213360 A TW 201213360A TW 100110676 A TW100110676 A TW 100110676A TW 100110676 A TW100110676 A TW 100110676A TW 201213360 A TW201213360 A TW 201213360A
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Taiwan
Prior art keywords
optical waveguide
light
core
layer
waveguide structure
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TW100110676A
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Chinese (zh)
Inventor
Tetsuya Mori
Makoto Fujiwara
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Sumitomo Bakelite Co
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Priority claimed from JP2010088096A external-priority patent/JP5278366B2/en
Priority claimed from JP2010089167A external-priority patent/JP2011221201A/en
Priority claimed from JP2010089401A external-priority patent/JP5310633B2/en
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201213360A publication Critical patent/TW201213360A/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/08Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/33Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain
    • C08G2261/332Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing only carbon atoms
    • C08G2261/3324Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing only carbon atoms derived from norbornene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/40Polymerisation processes
    • C08G2261/41Organometallic coupling reactions
    • C08G2261/418Ring opening metathesis polymerisation [ROMP]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The present invention provides an optical waveguide structure and an electronic device. The freedom degree of the pattern shape design of the optical waveguide is broad, and the high size accuracy of the core part (optical path) of the optical waveguide can be formed by the simple method. In addition, the optical waveguide has a long life. An example of the present invention is described below. The optical waveguide structure 1 is equipped with an optical waveguide 9 formed by laminating clad layers 91 and 92 on the both surfaces of a core layer 93, conductor layers 51 and 52 joined on the both surfaces of the optical waveguide 9, an optical path transforming section 96 which inflects the optical path of the optical waveguide at an almost right angle, a light-emitting element 10 and an electrical element 12. The core layer 93 has a core part 94 and a clad part 95. The core part 94 is formed in an intended shape by selectively irradiating an active radical ray to a layer constituted with a composition comprising (A) cyclic olefin resin, (B) at least one of a monomer containing cyclic ether group and an oligomer containing cyclic ether group which have a different refraction index from (A), and a photo-acid-generating agent.

Description

201213360 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種光波導結構體及電子裝置。 本案係基於2010年4月6日於日本提出申請之日本特 願2〇10-088096號、2010年4月8日於日本提出申請之日 本特願20^-08^67號、及2〇10年4月8日於日本^出申 請之日本特願2010-089401號並主張優先權,其内容被援用 於此。 【先前技術】 近年來,作為光通信領域之光零件,而開發有光分支 結合器(光耦合器)、光多工/解多工器等,並期待用於該等 之光波導型元件。作為該光波導型元件(以下亦簡稱為「光 波導」),除了先前之石英系光波導以外,亦有容易製造(圖 案化)且富於通用性之聚合物系光波導,最近正積極地進 行後者開發。 上述光波導通常於基板上由特定之配置(圖案)形成, 而以光波導結構體之形式進行處理。作為該光波導結構 體’揭示有於基板上形成特定之電氣配線電路、及由核心 4及包覆部所構成之光波導’進而於該光波導上安裝發光 义件及受光元件者(電氣/光混成基板)(例如參照專利文獻 1)。 然而’上述專利文獻1中所記載之光波導結構體存在 如下問題。 1 ·光波導之形成步驟複雜,構成傳輸光之光程之核心部 201213360 的圖案形狀之設計、選擇之自由度較窄。 2. 核心部之圖案形狀之精度或尺寸精度較差。 3. 製造時,存在難以進行發光元件及受光元件與光波 導疋位ϋ 結構複雜之情形或^電路複雜之情形 等、難以製造(組裝)之情形。 4·與電氣配線圖案袓人夕样π # ^ ^ 卡,σ之隋形時,該配線圖案之設計之 自由度較窄。又,若偎丰却_ & & a 馒先3又叶電氣配線圖案,則光波導之 光程設計之自由度變窄。 5·對積體化、小型化不利。 [專利文獻1]日本特開2004-146602號公報 【發明内容】 本發明之目的在於摇征 # a _ 仕於钕供一種具備可以簡單之方法形成 圖案形狀之設計之自由唐鲂庠p , lt ^ 田度較廣,尺寸精度較高之核心部(光 程),並且耐久性優昱夕土、+播u , 、之先波導的光波導結構體及電子裝 ,达π电米L ·%峪興无冤路 之各電路中,具備可以簡單之方法形成圖案形狀之設計之 自由度較廣,尺寸精度較高之核心部(光程),並且耐久性 優異之光波導的光波導結構體、及具備該光波導之 電子裝置。 進而,本發明之目的在於提供一種具備可以簡單之方 法形成光電路之圖_狀之設計的自由度較廣,尺寸精度 =核心部(光程h並且與電氣元件之定位容易之光波 波導結構體。又’本發明之目的在於提供—種具備 201213360 上述光波導結構體之電子裝置。 .上述目的係藉由下述(1)〜(131)之本發明而達成。 (1 ) 一種光波導結構體’其特徵在於:具有具備折射 率彼此不同之核心部與包覆部之光波導、及使上述核心部 之光程彎曲之光程轉換部, 上述核心部係藉由對由含有以下成分之組成物所構成 的核心層選擇性地照射活性放射線形成為所欲之形狀者: (A )環烯(CyCiic 〇iefin )樹脂、 (B) 折射率與上述(A)不同,且具有環狀醚基之單 體及具有環狀醚基之寡聚物中之至少一者、及 (C) 光酸產生劑(ph〇t〇_acid_generating agent)。 (2 )如上述(丨)之光波導結構體,其中上述(b )之 環狀醚基為氧雜環丁烧基(〇xetanyl group )或環氧基。 (3 )如上述(丨)或(2 )之光波導結構體,其中上述 (A)之環稀樹脂為降莰稀系樹脂。 (4 )如上述(1 )至(3 )中任一項之光波導結構體, 其中上述(B)之折射率低於上述(A), 上述環烯樹脂具有藉由由上述(C)之光酸產生劑產生 之酸而脫離,並藉由脫離而降低上述(a)之折射率之脫離 性基。 (5)如上述(2)之光波導結構體,其中上述(A)之 環烯樹脂於側鏈具有藉由由上述(c)之光酸產生劑產生之 酸而脫離之脫離性基, 上述(B)含有下述式(100)所記載之第1單體: 6 201213360201213360 VI. Description of the Invention: [Technical Field] The present invention relates to an optical waveguide structure and an electronic device. This is based on Japan's special offer No. 2〇10-088096, which was filed in Japan on April 6, 2010, and Japan's special offer, 20^-08^67, and 2〇10, which were filed in Japan on April 8, 2010. Japan's Japanese Patent Application No. 2010-089401, filed on Apr. 8, 2008, claims priority, the content of which is incorporated herein. [Prior Art] In recent years, an optical branching device (optocoupler), an optical multiplexer/demultiplexer, and the like have been developed as optical components in the field of optical communication, and are expected to be used for such optical waveguide type elements. In addition to the conventional quartz-based optical waveguide, a polymer-based optical waveguide which is easy to manufacture (patterned) and is versatile, has recently been actively used as the optical waveguide type element (hereinafter also referred to as "optical waveguide"). Carry out the latter development. The above optical waveguide is usually formed on a substrate by a specific arrangement (pattern) and processed in the form of an optical waveguide structure. As the optical waveguide structure, a specific electric wiring circuit and an optical waveguide formed of a core 4 and a cladding portion are formed on the substrate, and a light-emitting element and a light-receiving element are mounted on the optical waveguide (electrical/ Light-mixed substrate) (for example, refer to Patent Document 1). However, the optical waveguide structure described in the above Patent Document 1 has the following problems. 1 • The formation process of the optical waveguide is complicated, and the design of the pattern shape of the core portion of the optical path that constitutes the transmission light of 201213360 is narrow. 2. The accuracy or dimensional accuracy of the pattern shape of the core is poor. 3. At the time of manufacture, it is difficult to manufacture (assemble) when the light-emitting element, the light-receiving element, and the light-guide element are complicated in structure or the circuit is complicated. 4· With the electric wiring pattern 袓 夕 π ^ # ^ ^ card, σ 隋 shape, the design of the wiring pattern has a narrow degree of freedom. Moreover, if Yufeng _ && a 馒 first 3 and leaf electrical wiring pattern, the optical waveguide design of the optical path is less flexible. 5. It is not good for integration and miniaturization. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-146602. SUMMARY OF THE INVENTION The object of the present invention is to provide a free design for a design having a simple shape to form a pattern shape, lt ^ Tian The core part (optical path) with a wide range of dimensional accuracy and high durability, and the optical waveguide structure and electronic equipment of the waveguide with excellent durability, and the first waveguide, up to π electric meters L · % Each of the circuits of the flawless circuit has an optical waveguide structure of an optical waveguide having a wide degree of freedom in designing a pattern shape and having a high degree of dimensional accuracy, and having excellent durability. An electronic device having the optical waveguide. Further, an object of the present invention is to provide an optical waveguide structure having a wide degree of freedom in designing an optical circuit which can be formed in a simple manner, and having a dimensional accuracy = core portion (optical path h and easy positioning of electrical components) Further, an object of the present invention is to provide an electronic device including the above optical waveguide structure of 201213360. The above object is achieved by the present inventions (1) to (131) below. (1) An optical waveguide structure The body is characterized in that it has an optical waveguide having a core portion and a cladding portion having different refractive indices, and an optical path conversion portion that bends an optical path of the core portion, wherein the core portion is composed of the following components The core layer composed of the composition is selectively irradiated with active radiation to form a desired shape: (A) CyCiic 〇iefin resin, (B) having a refractive index different from that of (A) above, and having a cyclic ether At least one of a monomer and a oligomer having a cyclic ether group, and (C) a photoacid generator (ph〇t〇_acid_generating agent). (2) an optical waveguide structure as described above (丨) Body, where The cyclic ether group of (b) is an oxetanyl group or an epoxy group. (3) The optical waveguide structure according to the above (丨) or (2), wherein the above (A) (4) The optical waveguide structure according to any one of (1) to (3) above, wherein the refractive index of the above (B) is lower than the above (A), the above cyclic olefin The resin has a detachment group which is detached by the acid generated by the photoacid generator of the above (C) and which lowers the refractive index of the above (a) by detachment. (5) The optical waveguide structure of the above (2) The cycloolefin resin of the above (A) has a debonding group which is desorbed by an acid generated by the photoacid generator of the above (c) in the side chain, and the above (B) contains the following formula (100). The first monomer: 6 201213360

(6) 如上述(5、 出 而含有環氧化合物及且有2個導:構體’其中上述⑻進 化合物中至少__者作氣雜% 丁烧基之氧雜環丁炫 ^ 者作為第2單體。(6) as described above (5, which contains an epoxy compound and has two leads: a structure in which the above (8) is at least __ as a gas heterozygous oxirane The second monomer.

(7) 如上述(6)之光波導块 甘Λ L 體與上述第i^ 其中上述第2單 早體之比例以重量比(上述第2單體之會旦/ 上述第1單體之重量)計為…丨。。帛早體之重里/ 盆()如上述(4 )至(6 )中任-項之光波導結構體, 其中上述脫離性基具有_〇_社 中之至h種。 4 4方基結構及似卜結構 1中上述(5) i⑴中任"'項之光波導結構體, ,、甲上述(A)之環烯樹脂為降莰烯系樹脂。 / (⑻如上述⑼之光波導結構體,其中上述降 糸樹脂為降莰烯之加成聚合物。 ⑺)如上述(10)之光波導結構體,其中上述降茨稀 之加成聚合物具有下述式(丨01 )所記裁之重複單位: 201213360(7) The ratio of the ratio of the optical waveguide block of the above-mentioned (6) to the second precursor of the above-mentioned second single-precursor (the ratio of the second monomer to the first monomer) ) counted as...丨. . The optical waveguide structure of any one of the above-mentioned items (4) to (6), wherein the above-mentioned detachable group has a genus of the genus. 4 4 square structure and similar structure 1 In the above (5) i (1), the optical waveguide structure of the item ",", and the cycloolefin resin of the above (A) is a norbornene-based resin. (8) The optical waveguide structure according to the above (9), wherein the ruthenium resin is an addition polymer of norbornene. (7) The optical waveguide structure according to (10) above, wherein the above-mentioned reduced addition polymer Repeating unit with the following formula (丨01): 201213360

(101) [式中之η為0以上、9以下之整數]。 (12)如上述(10)或(11)之光波導結構體,其中上 述降莰烯之加成聚合物具有下述式(102)所記載之重複單 位:(101) [where η is an integer of 0 or more and 9 or less]. (12) The optical waveguide structure according to (10) or (11) above, wherein the addition polymer of the above-described norbornene has a repeating unit as described in the following formula (102):

13)如上述(5)至(12)中任 記載之第1單體之,'τ、% tθ 3里相對於 其中上述式(100)所 烯樹脂100重量份 項之光波 導結構 體, 宜為1重量份以上、一"介上述環 工、5〇畲息 惠里份以 下。 201213360 (14 )如上述(1 )至(13 )中任一項之光波導結構體, 其中於上述核心層之經活性放射線照射之區域、與未照射 區域,源自上述(B )之結構體濃度不同。 (I5 )如上述(1 )至(Η)中任一項之光波導結構體, 其中上述核心層之經活性放射線照射之區域與未照射區域 之折射率差為0.01以上。 (16 )如上述(1 )至(15 )中任一項之光波導結構體, 其中將上述核心層之經活性放射線照射之區域作為上述包 覆部之至少一部分’將未照射區域作為上述核心部之至少 一部分。 (17)如上述(1)至(16)中任一項之光波導結構體, 其中上述光紅轉換部具有將傳輸於上述核心部之傳輸光的 至少一部分反射之反射面。 (1 8 )如上述(丨7 )之光波導結構體,其具有設置於 上述核心部之空孔,上述反射面係由上述核心部與上述空 孔之界面之一部分或全部所構成。 (1 9 )如上述(i 7 )或(丨8 )之光波導結構體其中 上述反射面設定成使上述傳輸光全反射之傾斜角。 (20 )如上述(i 7 )至(丨9 )中任一項之光波導結構 體,其中使上述反射面於上述核心部方向投影之情形之投 ^與上述核心D卩之剖面所重疊的面積小於上述核心部之剖 積 有使傳輸於上述核心部之傳輸光分支為經上述 射面反射之傳輸光、與於上述反射面以外之上述核心部 中傳輸並直線前進之傳輸光的分支部。 201213360 (2 1 )如上述(17 )至(20 )中任一項之光波導結構 體,其中使上述反射面於上述核心部方向投影之情形之投 影與上述核心部之剖面所重疊的面積與上述核心部之剖面 積相同, 僅於上述核心部之存在上述反射面之部分較大地設定 上述核心部。 (22 )如上述(17 )至(21 )中任一項之光波導結構 體,其中上述反射面相對於上述核心部而傾斜,上述反射 面之斜面方向的兩端部之至少一者位於較上述核心部之外 廓部延伸線更外側,上述核心部以包圍上述反射面之狀態 膨脹。 (23 )如上述(1 )至(22 )中任一項之光波導結構體, 其中於上述核心層之兩面分別接合構成上述包覆部之包覆 層’由兩包覆層與介於該等之間之核心層之積層體構成上 述光波導® (24) 如上述(23)之光波導結構體,其中上述包覆 層係由與上述核心層同種之材料所構成。 (25) 如上述(23)或(24)之光波導結構體,其中 上述光程轉換部橫跨上述核心部、ik至少—土 /、考之上述包覆 層而形成。 (26 )如上述(1 )至(24 )中任一項之# 光,皮導結構體, 其中上述光程轉換部僅形成於上述核心層内。 (27 )如上述(1 )至(17 )中任一項之* 光波導結構體, 其中於上述核心層中’上述核心部係形成五 尺马於其端部或中 10 201213360 途中斷, 上述光程轉換部形成於上述核心部中斷之部分。 (28) 如上述(27)之光波導結構體,其具有設置於 上述核心部中斷之部分之空孔’上述反射面係由上述核心 部中斷之部分與上述空孔之界面之一部分或全部所構成。 (29) 如上述⑴至(28)中任—項之光波導結構體, 其中於上述光波導上接合有至少1層之導體層。 (3〇)如上述(1)至(28)中任一項之光波導結構體, 其中於上述光波導之兩面分別接合有導體層。 (3D如上述⑴至(3〇)中任一項之光波導結構體, 其具有具備發光部或受光部與端子之元件。 (32)如上述(29)或(3⑸之光波導結構體,里里 有具備發光部或受光部與端子 體層電連接。 上“子與上述導 (33) 如上述(31) 於上述元件與上述光波導 (34) 如上述(31) 體’其中上述元件係藉由 (35) 如上述(31) 體’其中上述光程轉換部 光部重疊之位置。 或(32)之光波導結構體,其中 之間不具有空隙部。 至(33)中任一項之光波導結構 封閉材料而封閉其外表面。 至(34)中任一項之光波導結構 <成於俯視時與上述發光部或受 (36)如上述()至 體’其中上述元件係 )令任-項之光波導結構 形式而構成。 、夕1個該元件之晶片載體之 201213360 ()士上述(36)之光波導結構體,其中上述晶片 載體具有另一光波導。 (38 )如上述(丨)至(37 )中任一項之光波導結構體, 其中於上述光波導上接合有至少1個基板, 上述基板具備對傳輸於上述核心部之傳輸光具有透光 性的透光部,構成為可經由上述透光部,於上述基板之厚 度方向傳輸上述傳輸光。 (39) 如上述(38)之光波導結構體,其中上述基板 本身之上述傳輸光之穿透率為8〇%以上,藉此上述基板之 一部分構成上述透光部。 (40) 如上述(38)或(39)之光波導結構體,其中 上述透光部係由貫通上述基板之貫通孔所構成。 (41) 如上述(40)之光波導結構體,其中於上述貫 通孔内填充有上述傳輸光之穿透率為80%以上之材料。 (42) 如上述(38)之光波導結構體,其中上述透光 部係由在上述基板之厚度方向傳輸上述傳輸光之垂直光波 導所構成。 (43 )如上述(38 )至(42 )中任一項之光波導結構 體’其中上述透光部具有可使上述傳輸光聚光或擴散之透 鏡部。 (44 )如上述(1 )至(43 )中任一項之光波導結構體, 其中上述活性放射線於200〜450 run之範圍内具有峰值波 長。 (45 )如上述(1 )至(44 )中任一項之光波導結構體, 12 201213360 其中上述活性放射線之照射量為〇.丨〜9 j/cm2 β (46 )如上述(1 )至(45 )中任一項之光波導結構體’ 其中上述活性放射線經由遮罩而照射至上述核心層。 (47 )如上述(1 )至(46 )中任一項之光波導結構體, 其中上述核心層進而含有抗氧化劑。 (48 )如上述(1 )至(47 )中任一項之光波導結構體, 其中上述核心層進而含有增感劑。 (49) 一種電子裝置,其特徵在於具備如上述(〇至 (48 )中任一項之光波導結構體。 (50 ) —種光波導結構體,其特徵在於:其係由具有 具備折射率彼此不同之核心部與包覆部之光波導、與導體 層的積層結構體所構成,並且具有 於厚度方向延伸且與上述核心部光學連接之導光 及 、 於与度方向延伸且與上述 上述核心部係藉由對由含有以下成分 、 的核心層選擇性地照射活性放射線形成^成物所構成 …環稀樹脂、 為所欲之形狀者: (B) 折射率與上述(a)不同,且具有产 體及具有環狀醚基之寡聚物中之至少—去 狀醚基之單 ^'、及 (C) 光酸產生劑。(13) The optical waveguide structure of the first monomer according to any one of the above (5) to (12), wherein the 'τ, % tθ 3 is relative to 100 parts by weight of the resin of the above formula (100), It is 1 part by weight or more, one " The optical waveguide structure according to any one of the above-mentioned (1), wherein the region of the core layer irradiated with active radiation and the unirradiated region are derived from the structure of the above (B) The concentration is different. (I5) The optical waveguide structure according to any one of the above (1), wherein the refractive index difference between the region irradiated with the active radiation of the core layer and the non-irradiated region is 0.01 or more. The optical waveguide structure according to any one of the above-mentioned (1), wherein the area of the core layer irradiated with the active radiation is at least a part of the cladding portion, and the unirradiated area is used as the core At least part of the ministry. (17) The optical waveguide structure according to any one of (1) to (16), wherein the light red converting portion has a reflecting surface that reflects at least a part of the transmitted light transmitted to the core portion. (1) The optical waveguide structure according to (7) above, wherein the optical waveguide structure has a hole provided in the core portion, and the reflection surface is formed by part or all of an interface between the core portion and the hole. (1) The optical waveguide structure according to (i7) or (?8) above, wherein the reflecting surface is set to an inclination angle at which the transmitted light is totally reflected. (20) The optical waveguide structure according to any one of (i7) to (9), wherein the projection of the reflecting surface in the direction of the core portion overlaps with the cross section of the core D? a cross-sectional area having a smaller area than the core portion is a branch portion that branches the transmitted light transmitted through the core portion into transmitted light reflected by the emitting surface and transmitted and linearly propagated in the core portion other than the reflecting surface. . The optical waveguide structure according to any one of the above-mentioned (17), wherein the projection of the projection surface in the direction of the core portion overlaps with the area of the core portion The core portion has the same sectional area, and the core portion is set to be large only in a portion of the core portion where the reflection surface exists. The optical waveguide structure according to any one of the above-mentioned (17), wherein the reflection surface is inclined with respect to the core portion, and at least one of both end portions of the reflection surface in a slope direction is located above The outer portion of the core portion has an outer extension line, and the core portion expands in a state of surrounding the reflection surface. (23) The optical waveguide structure according to any one of (1) to (22), wherein a cladding layer constituting the cladding portion is joined to both sides of the core layer by two cladding layers and The laminated body of the core layer between the equal parts constitutes the optical waveguide (24). The optical waveguide structure according to (23) above, wherein the cladding layer is made of the same material as the core layer. (25) The optical waveguide structure according to (23) or (24) above, wherein the optical path converting portion is formed across the core portion, ik at least - soil, and the coating layer. (26) The light guide structure according to any one of (1) to (24) above, wherein the optical path conversion portion is formed only in the core layer. (27) The optical waveguide structure according to any one of (1) to (17) above, wherein in the core layer, the core portion is formed by a five-footed horse at its end or in the middle of 10 201213360, The optical path conversion unit is formed in a portion where the core portion is interrupted. (28) The optical waveguide structure according to (27) above, comprising: a hole provided in a portion where the core portion is interrupted, wherein the reflecting surface is partially or wholly of an interface between the portion interrupted by the core portion and the hole Composition. (29) The optical waveguide structure according to any one of (1) to (28) above, wherein at least one conductor layer is bonded to the optical waveguide. The optical waveguide structure according to any one of the above (1) to (28), wherein a conductor layer is bonded to both surfaces of the optical waveguide. (3) The optical waveguide structure according to any one of the above (1) to (3), which has an element including a light-emitting portion or a light-receiving portion and a terminal. (32) The optical waveguide structure according to (29) or (3) above, There is a light-emitting portion or a light-receiving portion electrically connected to the terminal body layer. The upper portion and the above-mentioned guide (33) are as described above (31) in the above-mentioned element and the optical waveguide (34) as in the above (31) body, wherein the above-mentioned element system (35) The optical waveguide structure of (32), wherein the optical path conversion portion of the optical path conversion portion overlaps, or the optical waveguide structure of (32), wherein there is no gap portion therebetween. The optical waveguide structure encloses the material to close the outer surface thereof. The optical waveguide structure according to any one of (34) is formed in a plan view with the above-mentioned light-emitting portion or subjected to (36) as described above (to the body) The optical waveguide structure of the above-mentioned (36), wherein the wafer carrier has another optical waveguide. (38) The optical waveguide structure according to any one of the above (A) to (37), wherein At least one substrate is bonded to the optical waveguide, and the substrate includes a light transmitting portion that transmits light to the transmission light transmitted through the core portion, and is configured to transmit the transmission in a thickness direction of the substrate via the light transmitting portion (39) The optical waveguide structure according to (38), wherein the transmittance of the transmitted light of the substrate itself is 8% or more, whereby one of the substrates constitutes the light transmitting portion. In the optical waveguide structure of the above (38) or (39), the light transmitting portion is formed by a through hole penetrating the substrate. (41) The optical waveguide structure according to (40) above, wherein the through hole is The optical waveguide structure according to the above (38), wherein the light transmitting portion transmits the vertical light of the transmitted light in a thickness direction of the substrate. The optical waveguide structure of any one of the above-mentioned (38) to (42) wherein the light transmitting portion has a lens portion that can condense or diffuse the transmitted light. Any one of (1) to (43) The optical waveguide structure, wherein the active radiation has a peak wavelength in the range of 200 to 450 run. (45) The optical waveguide structure according to any one of (1) to (44) above, 12 201213360 wherein the active radiation The optical waveguide structure of any one of the above (1) to (45), wherein the active radiation is irradiated to the core layer via a mask. The optical waveguide structure according to any one of the above (1) to (46) wherein the core layer further contains an antioxidant. The optical waveguide structure according to any one of the above (1) to (47) wherein the core layer further contains a sensitizer. (49) An electronic device comprising: the optical waveguide structure according to any one of (48) above, wherein the optical waveguide structure is characterized in that it has a refractive index And an optical waveguide of the core portion and the cladding portion and a laminated structure of the conductor layer, and having a light guide extending in the thickness direction and optically connected to the core portion, and extending in the degreewise direction The core portion is formed by selectively irradiating a core layer containing the following components with an active radiation to form a ring-shaped resin, which is a desired shape: (B) the refractive index is different from (a) above. And having at least a de-etherified ether group of the product and the oligomer having a cyclic ether group, and (C) a photoacid generator.

丹甲上述(B ' —' --^ m 之環狀峻基為氧雜環丁烷基或環氧基。 (52)如上述(5〇)或(51)之光 又等結構體,其 13 201213360 上述(A )之環烯樹脂為降莰烯系樹脂。 (53) 如上述(50)至(52)中任一項之光波導結構 體,其中上述(B)之折射率低於上述(A), 上述環烯樹脂具有藉由由上述(C )之光酸產生劑產生 之酸而脫離,並藉由脫離而降低上述(A)之折射率之脫離 性基。 (54) 如上述(51 )之光波導結構體,丨中上述(a) 之環烯樹脂於側鏈具有藉由由上述之光酸產生劑產生 之酸而脫離之脫離性基, 上述(B)含有下述式(1〇〇)所記載之第】單體:The above-mentioned (B'-'-^ m ring-like group is oxetanyl group or epoxy group. (52) The light-equal structure of (5〇) or (51) above, The optical waveguide structure according to any one of the above (50), wherein the refractive index of the above (B) is lower than the above. (A) The cycloolefin resin has a debonding group which is desorbed by the acid generated by the photoacid generator of the above (C) and which is reduced in the refractive index of (A) by detachment. In the optical waveguide structure of (51), the cycloolefin resin of the above (a) has a debonding group which is desorbed by an acid generated by the photoacid generator described above in the side chain, and the above (B) contains the following formula: (1〇〇) the first monomer recorded:

。力 (100) (55) 如上述(54)之光波導έ士拔μ , 構體,其中上述(Β) 進而3有環氧化合物及具有2個氧 ^ , Λ . ^ 孔雜級丁烷基之氧雜環丁 垸化Ο物中之至少一者作為第2單體。 (56) 如上述(55)之光波導結構體,其中上述第2 早體與上述第丨單體之比例以重量 a / , .^ ϋ、上迷第2单體之重 里/上述第1單體之重量)計為〇.丨〜丨〇。 體, (57)如上述(54)至(55) 其中上述脫離性基具有-〇-結構 中任一項之光波導結構 、-Si-芳基結構及·〇·^_ 14 201213360 結構中之至少1種。 (58)如上述(54)至(;57) 體,其中上述(A)之環烯樹脂為降脂光波導結構 ',如f述(58)之光波導結構體,其中上述降贫 浠系樹脂為降莰稀之加成聚合物。 人 (6〇)如上述(59)之光波導結構體,其中上述降贫 烯之加成聚合物具有下述式(1G1)所記載之重複單位:人. (100) (55) The optical waveguide of the above (54), the structure of the optical waveguide, wherein the above (Β) and further 3 have an epoxy compound and have 2 oxygen, Λ. At least one of the oxetane quinones is used as the second monomer. (56) The optical waveguide structure according to (55) above, wherein the ratio of the second precursor to the second monomer is a weight a / , . . . , and the weight of the second monomer / the first single The weight of the body is counted as 〇.丨~丨〇. (57) The above-mentioned (54) to (55) wherein the above-mentioned detachable group has an optical waveguide structure of any one of -〇-structure, -Si-aryl structure, and 〇·^_ 14 201213360 structure At least one. (58) The above (54) to (;57), wherein the cycloolefin resin of the above (A) is a lipid-lowering optical waveguide structure, such as the optical waveguide structure of (58), wherein the above-mentioned abatement system is The resin is a reduced addition polymer. (6) The optical waveguide structure according to the above (59), wherein the addition polymer of the above-mentioned reduced olefin has a repeating unit described in the following formula (1G1):

(101) [式101中’ η為0以上、9以下之整數]。 (61 )如上述(59)或(60)之光波導結構體,其中 上述降莰烯之加成聚合物具有下述式(1〇2)所記載之重複 單位(101) [In the formula 101, η is an integer of 0 or more and 9 or less]. (61) The optical waveguide structure according to the above (59) or (60), wherein the addition polymer of the norbornene has a repeating unit as described in the following formula (1〇2)

15 S 20121336015 S 201213360

(62)如上述(54)至(61)中任一項之 體,其中上述式(1°。)所記載之第1單體之含量相Π冓 述環烯樹脂100重量份,宜Α^ 仴對於上 下。 刀且為1重夏份以上、50重量份以 (⑴如上述(50)至(62)中任—項之光波導 體’其中於上述核心層之經活性放射線照射之區域' 照射區域,源自上述(Β )之結構體濃度不同。 、 (64 )如上述(50 )至(63 )中杯—TS ^ , ^ 中任項之光波導結構 體,其中上述核心層之經活性放射線照射之區域與未照射 區域之折射率差為0.01以上。 ' (65) 如上述(5〇)至(⑷中任—項之光波導結構 體,其令將上述核心層之經活性放射線照射之區域作為上 述包覆部之至少一部分,將未照射區域作為上述核心部之 至少一部分。 (66) 如上述(50)至(65)中任一項之光波導結構 16 201213360 . 體’其中上述導光程與上述導體部接觸或接近。 (67 )如上述(5〇 )至(66 )中任一項之光波導結構 體’其具有貫通孔,上述導光程與上述導體部形成於上述 貫通孔内。 (68)如上述(67)之光波導結構體,其中於上述貫 通孔内上述導體部配置於上述導光程之周圍。 (Μ )如上述(5〇)至(68)中任一項之光波導結構 體,其中上述導光程係由與上述光波導之核心部同樣之核 心部所構成。 (70 )如上述(50 )至(68 )中任一項之光波導結構 體’其中上述導光程係由具備折射率彼此不同之核心部與 包覆部之垂直光波導所構成。 (71 )如上述(5〇)至(7〇)中任一項之光波導結構 體’其中上述導光程之核心部係由與上述光波導之核心部 或包覆部同樣之材料所構成。 (72)如上述(71)之光波導結構體,其中上述導光 私之核心部係以與上述光波導之核心部同樣之方法所形 成。 (73 )如上述(50)至(72)中任一項之光波導結構 體,其中上述導光程之橫剖面形狀形成圓形。 (74)如上述(5〇)至(73)中任一項之光波導結構 體,其具有使上述光波導之光程彎曲之光程轉換部。 (75 )如上述(74)之光波導結構體,其中上述光程 轉換部設置於上述光波導之核心部與上述導光程之連接 17 201213360 部。 (76 )如上述(74 )或(75 )之光波導結構體,其中 上述光私轉換部具有將傳輸於上述核心部之傳輪光之至少 一部分反射的反射面。 (77) 如上述(50)至(76)中任一項之光波導結構 體’其中於上述核心層之兩面分別接合構成上述包覆部之 包覆層’由兩包覆層與介於該等之間之核心層之積層體而 構成上述光波導。 (78) 如上述(50)至(77)中任一項之光波導結構 體,其中上述導體層與上述光波導之至少一面接合。 (79) 如上述(50)至(78)中任一項之光波導結構 體’其具有具備發光部或受光部與端子之元件。 (80 )如上述(79 )之光波導結構體,其中上述元件 之端子與上述導體層電連接。 (81 )如上述(79 )或(80 )之光波導結構體,其中 上述元件係藉由封閉材料而封閉其外表面。 (82 )如上述(50 )至(8丨)中任一項之光波導結構 體’其具有硬質或具有可撓性之基板。 (83)如上述(82)之光波導結構體,其中上述光波 導與上述基板鄰接而設置。 (84 )如上述(82 )或(83 )之光波導結構體,其中 上述導光私與上述導體部之至少一者係以貫通上述基板之 方式所形成。 (85 )如上述(82)至(84)中任一項之光波導結構 18 201213360 體,其中上述導光程與上述導體部之至少一者相對於上述 基板大致垂直地形成。 體 層 體 ()4上述(50)至(85)中任__項之光波導結構 '具有形成於厚度方向之不同位置的複數個之導體 該等導體層彼此經由上述導體部而電連接。 (87)如上述(5())至(86)中任—項 其中上述導光程與上述核心部係同時進行其等 步驟之至少一部分而獲得者。 (…如上述(5〇)至(87)中任—項之光波導結構 體,其具有可使傳輸光聚光或擴散之透鏡部。 (89 )如上述(88 )之光波導結 得趙’其中上述透鏡 部設置於上述導光程之端部或内部。 (90) —種電子裝置,其特徵在 %义具備如上述(5〇 ) 至(89 )中任一項之光波導結構體。 (91 ) -種光波導結構體,其係、具備基板、具 率彼此不同之核心部與包覆部之光波導 ^ 主少1個雷痛; 件、及決定上述電氣元件之設置位置 直之疋位手段者,苴 徵在於: q /、符 上述核心部係藉由對由含有以下 r成分之組成物所 的核心層選擇性地照射活性放射線形成為所# 、構成 (A) 環烯樹脂、 〜之形狀者: (B) 折射率與上述(a)不同,且具 s 體及具有環狀醚基之寡聚物中之至少一 、%狀鱗基之單 '者、及 (C )光酸產生劑。 19 201213360 (92) 如上述(91 )之光波導結構體,其中上述(B) 之環狀喊基為氧雜環丁烷基或環氧基。 (93) 如上述(91 )或(92)之光波導結構體,其中 上述(A )之環烯樹脂為降莰烯系樹脂。 (94 )如上述(9丨)至(93 )中任一項之光波導結構 體’其中上述(B)之折射率低於上述(a), 上述環稀樹脂具有藉由由上述(C)之光酸產生劑產生 之酸而脫離’並藉由脫離而降低上述(A)之折射率之脫離 性基。 (95)如上述(92)之光波導結構體,其中上述(a) 之環烯樹脂於側鏈具有藉由由上述(C)之光酸產生劑產生 之酸而脫離之脫離性基, 上述(B)含有下述式(1〇〇)所記載之第1單體:(62) The body of any one of the above (54) to (61), wherein the content of the first monomer described in the above formula (1°) is 100 parts by weight of the cycloolefin resin, preferably Α^仴 For up and down. The knives are one or more parts of the summer portion, and 50 parts by weight ((1) the optical waveguide body of the above-mentioned (50) to (62), wherein the region irradiated with the active radiation of the core layer is irradiated with the region The structure of the above (Β) is different. (64) The optical waveguide structure of any of the above-mentioned (50) to (63) cups - TS ^ , ^, wherein the core layer is irradiated with active radiation The refractive index difference from the unirradiated region is 0.01 or more. The optical waveguide structure of the above-mentioned (5) to (4), wherein the active layer of the core layer is irradiated with the active radiation as the above At least a part of the cladding portion, the unirradiated region is at least a part of the core portion. (66) The optical waveguide structure 16 201213360 according to any one of the above (50) to (65), wherein the light path is The optical waveguide structure of any one of the above (5) to (66) has a through hole, and the light guide and the conductor portion are formed in the through hole. (68) The optical waveguide structure according to (67) above, wherein The optical waveguide structure according to any one of the above (5) to (68), wherein the light guide is made of the light and the light is disposed in the through hole. (70) The optical waveguide structure of any one of the above-mentioned (50) to (68) wherein the optical path is made of a core portion and a package having refractive indices different from each other (71) The optical waveguide structure of any one of the above (5) to (7), wherein a core portion of the light guiding path is a core portion of the optical waveguide (72) The optical waveguide structure according to (71) above, wherein the core portion of the light guiding private body is formed in the same manner as the core portion of the optical waveguide. (73) The optical waveguide structure according to any one of the above (50), wherein the cross-sectional shape of the light guiding path is formed in a circular shape. (74) The one of (5) to (73) above. An optical waveguide structure having an optical path converting portion that bends an optical path of the optical waveguide. (75) as described above ( 74) The optical waveguide structure, wherein the optical path conversion portion is provided at a portion of the optical waveguide core portion and the light guiding path 17 201213360. (76) The optical waveguide structure according to (74) or (75) above The light-transmissive conversion portion has a reflection surface that reflects at least a portion of the transmission light transmitted to the core portion. (77) The optical waveguide structure of any one of the above (50) to (76) The optical waveguide is formed by bonding the two layers of the core layer to the cladding layer constituting the cladding portion by a laminate of the two cladding layers and the core layer interposed therebetween. The optical waveguide structure according to any one of the above (50), wherein the conductor layer is bonded to at least one surface of the optical waveguide. (79) The optical waveguide structure of any one of the above (50) to (78), which has an element including a light-emitting portion or a light-receiving portion and a terminal. (80) The optical waveguide structure according to (79) above, wherein the terminal of the element is electrically connected to the conductor layer. (81) The optical waveguide structure according to (79) or (80) above, wherein the above-mentioned element is closed by the sealing material. (82) The optical waveguide structure of any one of the above (50) to (8), which has a rigid or flexible substrate. (83) The optical waveguide structure according to (82) above, wherein the optical waveguide is provided adjacent to the substrate. (84) The optical waveguide structure according to (82) or (83) above, wherein at least one of the light guiding member and the conductor portion is formed to penetrate the substrate. The optical waveguide structure 18 201213360 according to any one of the above-mentioned (82), wherein the light guiding path and at least one of the conductor portions are formed substantially perpendicular to the substrate. The bulk layer body 4 of the above-mentioned (50) to (85) has a plurality of conductors formed at different positions in the thickness direction. The conductor layers are electrically connected to each other via the conductor portion. (87) The above-mentioned (5()) to (86), wherein the light guiding path is obtained by performing at least a part of the steps of the core portion simultaneously with the core portion. The optical waveguide structure according to any one of the above (5) to (87), which has a lens portion which can condense or diffuse the transmitted light. (89) The optical waveguide as described in (88) above is obtained. The above-mentioned lens portion is provided at the end or inside of the above-mentioned light guiding path. (90) An electronic device characterized by having the optical waveguide structure according to any one of the above (5) to (89). 91) - an optical waveguide structure, comprising: a substrate, an optical waveguide having a different core portion and a cladding portion having a different rate; and a lightning bar; and a position determining the position of the electrical component The means is: q /, the core portion is formed by selectively irradiating the active layer with the core layer containing the composition of the following r component, and forming (A) a cycloolefin resin, Shape: (B) a refractive index different from the above (a), and having at least one of an s body and an oligomer having a cyclic ether group, a single squaring group, and (C) photoacid 19201213360 (92) The optical waveguide structure of (91) above, wherein the ring of the above (B) is shouted The optical waveguide structure according to the above (91) or (92), wherein the cycloolefin resin of the above (A) is a norbornene-based resin. In the optical waveguide structure of any one of the above (9) to (93), wherein the refractive index of the above (B) is lower than the above (a), the cycloaliphatic resin has a photoacid produced by the above (C) (95) The optical waveguide structure according to the above (92), wherein the cycloolefin resin of the above (a) is on the side of the optical waveguide structure of the above (A) The chain has a detachable group which is detached by the acid generated by the photoacid generator of the above (C), and the above (B) contains the first monomer described in the following formula (1):

(96)如上述(95) 進而含有環氧化合物及J 境化合物中之至少一者f 如上述(95)之光波導結構體,其中上述(b) 氧化合物及具# 2個氧雜環丁烷基之氧雜環丁 氧化合物及具有2 之至少一者作為第2單體。(96) The optical waveguide structure according to (95) above, wherein the (b) oxygen compound and the #2 oxetane are contained in the above (95), further comprising at least one of an epoxy compound and a compound of the environment An alkyl oxetanyloxy compound and at least one of 2 are used as the second monomer.

如上述(96)《光波導結構體,其中上述第 第!單體之比例以重量比(上述第 其 t上述第2 第2單體之重 20 201213360 量/上述第丨單體之重量)計為〇1〜1()。 (98)如上述(95)至(97)中紅 舯甘山L ^中任—項之光波導結構 體,其中上述脫離性基具有-〇·έ+槿、 纴祕+ 、,°構、·S〗-芳基結構及-O-Si- 結構中之至少1種。 (99)如上述(95 )至(98 ) Φ杠 s V j中任—項之光波導結構 體,其中上述(A)之環稀樹脂為降^系㈣。 / (100)如上述(99)之光波導結構體,其$上述降获 #系樹脂為降莰烯之加成聚合物。 # U0O如上述⑴。)之光波導結構體,其中上述降As described above (96) "Optical waveguide structure, the above-mentioned first! The ratio of the monomers is 〇1 to 1() in terms of a weight ratio (the above-mentioned t second monomer weight 20 201213360/the weight of the second monomer). (98) The optical waveguide structure of the above-mentioned (95) to (97), wherein the dissociative group has -〇·έ+槿, 纴秘+, °, S-- at least one of an aryl structure and an -O-Si- structure. (99) The optical waveguide structure according to any one of (95) to (98) above, wherein the ring-thin resin of the above (A) is a reduced system (four). (100) The optical waveguide structure according to the above (99), wherein the #-reduced resin is an addition polymer of norbornene. # U0O如如1(1) above. Optical waveguide structure in which the above is lowered

(101) [式101中’ η為0以上、9以下之整數]。 (102)如上述(1〇〇)或(1〇ι)之光波導結構體,其 中上述降莰稀之加成聚合物具有下述式(102)所記載之重 複單位: 21 201213360(101) [In the formula 101, η is an integer of 0 or more and 9 or less]. (102) The optical waveguide structure according to the above (1〇〇) or (1〇ι), wherein the reduced-thinning addition polymer has a repeating unit described in the following formula (102): 21 201213360

(103 )如上述(95 )至(102)中任一項之光波導結 構體,其中上述式(1〇〇)所記載之第1單體之含量相對於 上述環烯樹脂1 〇〇重量份,宜為1重量份以上、50重量份 以下。 (104)如上述(91 )至(103)中任一項之光波導結 構體’其中於上述核心層之經活性放射線照射之區域與未 照射區域,源自上述(B )之結構體濃度不同。 (1 05 )如上述(9 1 )至(104 )中任一項之光波導結 構體,其中上述核心層之經活性放射線照射之區域與未照 射區域之折射率差為〇. 〇 1以上。 (106) 如上述(91)至(105)中任一項之光波導結 構體’其中將上述核心層之經活性放射線照射之區域作為 上述包覆部之至少一部分,將未照射區域作為上述核心部 之至少一部分。 (107) 如上述(91)至(丨〇6)中任一項之光波導結 構體,其中上述基板係由樹脂材料或半導體材料所構成或 22 201213360 由使纖維基材t含浸樹脂材料而成者所構成。 (108)如上述(91) 5 + 义至(107)中任一項之光波導結 構體’其令上述核心層之兩面分別接合構成上述包覆部之 包覆層…包覆層與介於該等之間之核心層之積層體而 構成上述光波導。 構體, 者。 109 )如上述(91 )至(1〇8 ) 其中上述定位手段係決定相對 中任一項之光波導結 於上述核心部之位置 (110)如上述⑼)至(1G9)中任—項之光波導結構 體,其中上述電氣元件為具有發光部或受光部與端子之元 件。 (1H)如上述至(11〇)中任一項之光波導結構 體,其中上述光波導具有使傳輸於上述核心部之傳輸光之 光程彎曲的光程轉換部。 (112 )如上述(i丨丨)之光波導結構體其巾上述定位 手段係以俯視時,上述發光部或上述受光部之位置與上述 光程轉換部之位置重疊之方式來定位。 、 (113)如上述(U1)或(112)之光波導結構體,其 中上述光程轉換部係由將傳輸於上述核心部之傳輸光之至 少一部分反射的反射面所構成。 (m)如上述(110)至(113)中任一項之光波導結 構體,其中上述基板具備具有對在上述核心部中所傳輸之 傳輸光之透光性的透光部,上述元件之上述發光部或上述 受光部與上述核心部經由該透光部而光學連接。 23 201213360 (115)如上述(n4)之光波導結構體,其令上述基板 之至少-部分具有對上述傳輸光之透光性,藉此構成:述 透光部。 其中上述透光 (116)如上述(114)之光波導結構體, 部係由貫通上述基板之貫通孔所構成。 (117) 如上述(91)至(116)中任一項之光波導結構 體,其中上述光波導與上述基板鄰接而設置❶ (118) 如上述(91)至(117)令任一項之光波導結構 體’其中上述電氣元件包含電子電路元件。 (119) 如上述(91)至(117)中任一項之光波導結構 體,其中上述電氣元件含有具有發光部或受光部與端子之 元件、及具有驅動上述元件或處理上述元件之輪出信號之 功能的電子電路元件。 (120)如上述(91 )至(U9)中任一項之光波導結構 體’其具有至少1層之導體層。 二(121 )如上述(120)之光波導結構體,其中上述電 氣元件之端子與上述導體層電連接。 (122) 如上述(91)至(121)中任一項之光波導結 冓體,其中上述定位手段係利用在形成於上述基板之凹部 之邊緣部形成的階差而成者。 (123) 如上述(91)至(121)中任一項之光波導結 籌體’其中上述定位手段係相對於上述基板固定設置之定 位構件。 (124)如上述(123)之光波導結構體,其中上述定 24 201213360 - 位構件係與上述基板接合之板材或片材。 d25)如上述(9〇至(124)中任一項之光波導結 構體’其中上述定位手段係由形成於上述基板或相對於上 述基板而不動之接觸面所構成。 (126) 如上述(91)至(125)中任一項之光波導結 構體’其令當設定於上述基板之平面上互相正交之χ方向 及Υ方向時,上述定位手段進行對於上述χ方向及上述γ 方向中之至少一方向的定位。 (127) 如上述(91)至(125)中任一項之光波導結 構體’其令當設定於上述基板之平面上互相正交之X方向 及Υ方向時,上述定位手段進行對於上述χ方向及上述Υ 方向之各方向的定位。 (128) 如上述(126)或(127)之光波導結構體,其 中上述核心部之長邊方向與上述X方向或上述γ方向一致。 (129) 如上述(91)至(128)中任一項之光波導結 構體,其具有可使傳輸於上述核心部之傳冑光聚光或擴散 之透鏡部。 (130 )如上述(129)之光波導結構體,其中上述透 鏡部設置於上述基板之内部或表面附近。 (131) —種電子裝置,其特徵在於具備上述(91)至 (1 30 )中任一項之光波導結構體。 &quot;根據本發明’可獲得能夠以光、活性放射線(活性能 ^光線、電子束、X射線等)之照射等簡單之方法進行核心 Ρ之圖案化,構成光電路之光程之核心部的圖案形狀之設 25 201213360 計之自由度較廣,並且尺寸精度較高之核心部。 又’於以所欲之材料構成核心層時,即便於應力作用 於光波導或發生變形,尤其是重複彎曲變形之情形時,亦 難以產生核心部與包覆部之層間剝離或於核心部内產生微 龜裂等缺陷,結果可維持光波導之光傳输性能,耐久性優 異0 進而,於由以降莰烯系樹脂(環烯系樹脂)為主之樹 脂組成物構成核心部之情形時,針對上述變形而難以產生 特別強之缺陷的效果較高,此外可進一步增大核心部與包 覆部之折射率差,並且耐熱性優異,結果可獲得性能更高 且耐久性更加優異之光波導。 又,於具有光程轉換部之情形時,可使傳輸光之光程 朝所欲之方向彎曲,因此,光程之設計之自由度較廣,亦 有助於光電路之積體化。 並且,於基板具有透光部之情形日夺,可形成通過基板 之光程,故光程之設計之自由度進一步擴大…於透光 部具有透鏡部之情形時,可於光程中視需要進行傳輸光之 聚光、擴散,與光程之彎曲等相互社人品$ „ 苛邳互結合而進一步擴大光電 路之設計之自由度。 又,於无波導結構體具有 Π 、|尤兀仵或受光元件) 之情形時,藉由與光波導光學連接, j以先波導將自元件 之發光部發出之光導入其他部位,哎者 4 #以先波導將來自其 他部位之光導入元件之受光部,可报占 了形成小型且積體化之光 電路,並且該光電路之運作之可靠性亦較高。 26 201213360 時,容易對上述元件進行配 端子之設置部位)等均適合 ’上述導體層之配線電路之 擇端子之設置部位之自由度) 又,於形成導體層之情形 線,且可貫現無論元件種類( 其之配線,富於通用性。並且 圖案的設計之自由度(例如選 較廣。 關於上述本發明之光波導結構體,光電路(光波導之 圖案)或電氣電路之設計之空間較寬,良率較高,可較高 地維持光傳輸性能,可靠丨 』罪性耐久性優異,富於通用性。 具備本發明之光料結構體,可獲得可靠性較 高之各種電子零件及電子裝置。 又,於具有於積層結構體之厚度方向延伸的導光程盘 導體部之情形時,電氣電路、光電路均可實現三維之電路 設計,於各電路設計中,設計之自由度擴大。尤其是,藉 由-併配置導光程與導體部,尤其是於貫通孔内形成^ 者,可有助於光波導結構體之積體化、小型化。 又’於具有光程轉換部之情形日夺,可使傳輸光之光程 朝所欲之方向彎曲,因此,光程之設計之自由度擴大,亦 有助於光電路之積體化。 於具有透鏡部之情形時,可於光程中視需要進行傳輪 光之聚光、擴散,與光程之彎曲等相互結合而進一步擴^ 光電路之設計之自由度。 又,於光波導結構體具有元件(發光元件或受光元件) 之情形時,藉由與光波導光學連接,可以光波導將自元件 之發光部發出之光導入其他部位,或者以光波導將來自其 27 201213360 他部位之光導入元件之受光部,可形成小型且積體化之光 電路,並且該光電路之運作之可靠性亦較高。 又,於具有導體層及與其導通之導體部之情形時,例 如容易對上述元件進行配線’可實現無論元件種類(端子 之設置部位均適合其之配線,富於通用性。並且,上 述配線電路之圖案的設計之自由度(例如選擇端子之設置 部位之自由度)較廣。 關於上述本發明之光波導結構體,光電路(光波導及 導光部之圖案)或電氣電路(導體層及導體部之圖案)之 設計之空間較寬,良率較好,可較高地維持光傳輸性能, 可靠性、耐久性優異,富於通用性。因此,本發明之光波 導結構體可用於各種電子零件、電子裝置等。 〃藉由使用本發明之光波導結構體,可製造將形成有電 軋電路之至少層之導體層、與於面方向一維或二維地配 置先程之至少1層之光波導積層而成的多層光·電混成(融 合)配線基板,藉由以同時具有導光程與導體部之貫通孔 進行層間之(層之厚度方向之)連接,無論電氣配線抑或 光電路均可進行連接(信號之授受),結果可提供一種電路 設計之自由度較廣之三維之光·電混成基板。 又,電氣電路、光電路之形成均較為容易,可尺寸精 度良好地形成各種形狀者。尤其是,關於光電路,藉由選 擇曝光圖案,可形成任意形狀或配置之総(核心部),又, 亦可明確地形成較細之#紐 ,,.( 平乂 j之先程,故有助於電路之積體化, 謀求裝置之小型化。 28 201213360 又於具有定位手段之情形時,能夠容易且正確地決 定電氣s件與光波導(核㈣)之位置關係而容易地製造, 且可獲得光傳輸特性優異、可靠性較高之光電路,又,可 幵;^成更加微細且複雜之電路圖案。 尤其疋,對基板進行電氣元件之定位後形成(藉由照 射活性放射線或藉由進一步加熱而形成)核心部等’或對 預先決定了電氣元件之位置之基板形成核心層,進而形成 核心部等,藉此可容易且進踮 早確地決定電氣元件之發光部或 受光部與核心部(尤其是,傳輸光入射至核心部之入射部 或自核心部之出射部)之位置關係。 又’於具有光程轉換部之情形時,可使傳輸光之光程 朝所欲之方向.彎曲’因此’光程之設計之自由度擴大,尤 其是可以較短之光程長形成光電路,有助於光電路之高積 體化。於該情形時,亦可藉由具有定位手段,而容易且準 確地進行電氣元件之發光部或受光部、與光程轉換部之定 位。 又,於基板具有透光部之情形時,可形成通過基板之 先程(基板之厚度方向之光程),故光程之設計之自由度進 -步擴大。又’於透光部具有透鏡部之情形時,可於光程 中視需要進行傳輸光之聚光、擴散,與光程之弯曲等相互 結合而進一步擴大光電路之設計之自由卢。 又,於具有導體層之情形時,例如i易對上述電氣元 件進行配線,可實現不論電氣元件之種類(端子之設置部 位)等均適合其之配線,富於通用性。並且,上述配線電 29 201213360 路之圖案的設計之自由度(例如端子之設置部位之選擇自 由度)較廣。 關於上述本發明之光波導結構體,光電路(光波導及 導光部之圖案)或電氣電路(導體層及導體部之圖案)之 設計之空間較宽’良率較好,可較高地維持光傳輸性能, 可靠性、耐久性優異,富於通用性。因此,本發明之光波 導結構體可用於各種電子零件、電子裝置等。 又光電路之形成較為容易,可尺寸精度良好地形成 各種形狀者,並且亦可明確地形成較細之光程,故有助於 電路之積體化,可謀求裝置之小型化。 【實施方式】 下依據隨附圖式所示之較佳之實施形態,對本 明之光波導結構體及電子裝置進行詳細說明。 :1目11刀別為表示本發明之光波導結構體之實 ==圖。以τ,—面參照該等圖,光波導 體之構成例進行說明下 為「上」或「上方」,下側設為「下」或「 :),各圖中誇張騎層之厚度方向(各圖之上下 圖20〜圖24分別為表 形態的剖面圖,g 25、圖 X月之光波導結構體之 線剖面圖、圖22中之B R 圆27为別為圖20中之 面圖。以下,^ 線剖面圖及圖24中之 w _ u下 面參照該等岡 成例進行說明。再者,於、 面對光波導結構體 ;以下說明中,將圖20〜圖24 30 201213360 上側設為「上」或「上方」,下側設為「下」戈「 又:圖2〇〜圖24中誇張描緣層之厚度方向二之下上方二 向)。 圖32係表示本發明之光波導結構體之第19患》 的平面圖,圖33為圖32中之A_A線剖面圖,圖= 中之B-B線剖面圖’圖35係表示本發明之光波導結構體之 第20實施形態的剖面圖,圖36係表示本發明之光波 構體之第21實施形態的剖面圖’圖37係表示本發明之: 波導結構體之第22實施形態的剖面圖。以 — 等圖,-面對光波導結構體之構成例進行說明U該 於以下說明中,將圖33〜圖37中之上側設為「上」 或上方」,下側設為「下」或「下方」。又3 中誇張描繪層之厚度方向( 圖 中之橫方向(左右方向)設為圖=方向)。又,將圖32 向)設為「Y方向」(其中χ太向」'縱方向(上下方 明。 向與γ方向正交)進行說 〈第1實施形態:圖i &gt; 如圖1所示,本發明 分別與光波導9之兩面接二=體=備光波導9、 之光程彎曲之光程轉換部 曰 、使先波導9 光波導9係圖!中,ό發“件1G、及電氣元件12。 覆層)9卜核心層93 下側依序積層包覆層(下側包 核心層93令形成有特定圖二層(上側包覆層)92而成者, 心部94係形成傳輸光、之核心部94與包覆部95 〇核 程之部分,包覆部95係雖形成 31 5 201213360 於核〜層93但不形成傳輪光之光程,而發揮與包覆層9 i、 92同樣之功能的部分。 於圖1所示之構成中,於核心層93之較下述反射面96ι 位於圖1中左側之部位形成核心部94,於核心層93之其以 外之部分形成包覆部95。 ' 作為核心層93之構成材料,可設為藉由光(例如紫外 線)之照射或藉由進-步加熱而改變折射率之材料。作為 上述材料之較佳例,可列舉以含有苯環丁稀系聚合物、降 成稀系聚合物(樹脂)等環烯系樹脂之樹脂 材料者,尤佳為含有降获婦系聚合物(作為主材料)乍者為主 由上述材料所構成之核心層93料曲等變形之耐性優 異,尤其是,即便於重複彎曲變形之情 :::94與包覆部95之剝離、或核…與 I )之層間剝離,亦可防止於核心部9 4内或包覆 4 95内產生微龜裂。其結果, 能, 于尤/皮導9之光傳輸性 月匕而可獲得耐久性優異之光波導9。 又,於核心層93之構成材料中例如亦可 劑、折射率調整劑、塑化劑、增黏劑 几 烟、τ 士 加強劑、增咸劑、 调平劑'消泡劑、密著助劑及難燃劑等添加 1 之添加具有提高高溫穩定性、提高耐候性=别 Μ: # η ^ 1 ,L. 卩制光劣化之 乍為上述抗氧化劑,例如可列舉: 三盼系等紛系、或芳香族胺系者。又,二?、雙紛系、 曰黏劑、加強劑,亦可進一步增大對彎曲之耐眭 上述抗氧化劑所代表之添加劑之含 巧千、2種以上之情 32 201213360 形時為合計)相對於核心層93之構成材料整體,較佳為Μ 〜4〇重量。/。左右,更佳為3〜3〇重量%左右。若該量過少·, ^無:充分發揮添加劑之功能,若量過多,則有根據添加 劑之種類或特性,而產生於核心部94中傳輸之光(傳輸光) 之穿透率之降低、圖案化不良、折射率不穩定等之虞。 作為核心層93之形成方法,可列舉塗佈法。作為塗佈 ’可列舉塗佈核心層形成用組成物(清漆等)並使其硬 =(固幻之方法、及塗佈具有硬化性之單體組成物並使 /、硬化(固化)之方法。又,亦可採用塗佈法以外之方法 例如接合另外製造之片材之方法。 使用遮罩,對以上述方式所得之核心層93選擇性地昭 射先(活性放射線),而使所欲形狀之核心部⑽案化。 作為用於曝光之光,可列舉可見 =等活性能量光線…亦可不使用光,而使二 線4電磁波、或電子束等粒子射線。 於核心層93中’經光照射之部位之折射率降低,與未 經光照射之部位之間產生折射率差。例如,核心層93之經 光照射之部位成為包覆卩95’未經照射之部位成為核心部 之㈣率與包覆層91、92之折射率大致相 #。 又,亦有藉由以特定之圖案對H 93照射光後進 :力二熱而形成核心部94之情形。藉由附加該加熱步驟,可 ::步增大核心部94與包覆部95之折射率差,故而較佳。 再者’關於該原理等,以下將作詳細闡述。 33 201213360 作為所形成之核心部94之圖案形狀,並無 , J為二狀:具有·f曲部之形狀、異形、具有光種之:支 :二合流部或交又部之形狀、聚光部(寬度 : 或光擴散部(寬度等婵大夕却八、★ 之#刀; 以上之形狀等任:=二或組合有該等中之2種 照射圖案,可容由設定光之 了今易地形成任意形狀之核心部94。 關於光波導9之各部之構成材料及 法等,以下將作詳細闡述。 94之形成方 與光波導9之與下面接合之導體層51及 導體層52分別圓牵彳卜士杜〜 /、上面接合之 電路。作二1 定之形狀,而構成所欲之配線戍 系合金、紹、紹系合金等各 了歹!舉銅、銅 尸疮廿紅此 合禋金屬材枓。導體層51、52之 居度並無制限定,通常較 52之 5〜70以m左右。 ’’’’ 左右,更佳為 導體層51、52例如為藉由金屬箔之 屬鑛敷、㈣、濺鍍等方法形成者。對導體接者)、金 例如可使用钮刻、印刷、遮蔽等方法/、2之圖 於圖1中,發光元件10於下面側 一對端子t有發先部⑻、與 .„ ^九口P 01位於端子103虚姑 之間。若於端子間通電,則發光:10=105 再者,發氺分姓, 彳《元4 I 01發光。 成者以外,亦中之發光部除了由1個發光點所構 力了為集合有複數個發 數個發光點者,例如‘。作為集合有複 點為叫個、…2個)2發先點配置成列狀(例如發光 2個)或行列狀(例如發光點為nxm個: 34 201213360 n、m為2以上之整數)者、或複數個發光點不規則地 (random)配置者等。下述受光元件11中之受光 丨丨 同樣。 發光元件10係以其等之端子103、1〇5分別與導體層 52之特定部位接合(電連接)之方式裝載於光波導9上。 電氣元件(電子電路元件)12例如由半導體元件(半 導體晶片)所構成。電氣元件12之功能並無特㈣定1 為一例,可列舉構成用以驅動發光元件1〇之電路者。於圖 1中,該電氣元件12於下面側具有2個端子123、125、。 電氣元件12係以其等之端子123、125 52之特定部位接合(電連接)之方式襄載於光波丄: 封門::元件1〇及電氣元件12係藉由底部填充材料4而 其等之端子103、105、123、125之下^藉此, 於毛先兀件10及電氣元件12、鱼 部,而由底部填充材料4所_、^導9之間未形成空隙 氣元杜所封閉。進而,發光元件10及電 如此般,二元::料6覆蓋並封閉其整體(外表面)。 其是發光元件12為其恤 其免受污染、損傷、氧Μ 封閉之結構,故可保護 可靠性 之 劣化等,有助於提高電子零件 底部填充材料4係由 之 之 光(傳輸光)之材料所構成穿透自發光部101發出 作為底部填充材料’較佳為由透明材料所構成。 樹脂材料,例如可, 構成材料,較佳為具有絕緣性 】牛.環氧樹脂、酚樹脂、胺曱酸乙 35 201213360 醋樹脂、聚醯亞胺樹脂等。 又,作為封閉材料6之構成材料,較佳為具有絕緣性 之樹脂材料,例如可列舉環氧樹脂、酚樹脂、降莰烯樹脂、 矽樹脂等。 士圆1所示,於光波導9中形成有貫通於其厚度方向 之4個貫通孔(thr〇ugh h〇le )8。各貫通孔8中填充有導電 材料(例如銅、銅系合金、在呂、紹系合金等各種金屬材料), 形成導體柱81。經由該等導體柱81,而使導體層51與導 體層52之特定部位彼此導通。即,對發光元件1〇及電氣 元件12之端子103、1〇5、123、125之通電可經由光波導9 之下面側之導體層51而進行。再者,端子1〇5與端子【Μ 導通’該等與接地側連接。 光波導9之核心部94係以俯視時(自圖i之上方觀察 時)與發光元件10之發光部101重疊(即,通過發光部ι〇ι 之正下方)之圖案形狀而形成。該核心部94之折射率高於 包覆部95,又,對包覆層91、92之折射率亦較高。包覆層 91及92係構成分別位於核心部94之下部及上部之包覆部 者。藉由上述構成,核心部94作為將其外周之全周包圍於 包覆部中之導光程而發揮功能。 上述光波導9具有使核心部94之光程彎曲之光程轉換 部96。該光程轉換部96係由反射傳輸光之至少一部分之反 射面(反射鏡)961所構成。該反射面961設置於發光部 1 〇 1之正下方位置。 反射面961相對於光波導9之光程即核心部94之長邊 36 201213360 方向大致呈45。傾斜, 上)之功能。 具有反射傳輸光 之·大半(例如9 0 %以 上述光程轉換部96係藉由去The optical waveguide structure according to any one of the above (95), wherein the content of the first monomer described in the above formula (1) is 1 part by weight relative to the cycloolefin resin. It is preferably 1 part by weight or more and 50 parts by weight or less. (104) The optical waveguide structure according to any one of the above (91) to (103) wherein the concentration of the structure derived from the above (B) is different from the area irradiated by the active radiation of the core layer and the unirradiated area . The optical waveguide structure according to any one of the above-mentioned (9), wherein the refractive index difference between the region irradiated with the active radiation of the core layer and the unilluminated region is 〇. (106) The optical waveguide structure of any one of the above-mentioned (91) to (105), wherein the region irradiated with the active radiation of the core layer is at least a part of the cladding portion, and the unirradiated region is used as the core At least part of the ministry. (107) The optical waveguide structure according to any one of (91) to (6), wherein the substrate is made of a resin material or a semiconductor material or 22 201213360 is formed by impregnating a fiber substrate t with a resin material. Composed of. (108) The optical waveguide structure according to any one of the above (91), wherein the two sides of the core layer are respectively joined to form a cladding layer of the cladding portion. The laminated body of the core layer between the layers constitutes the optical waveguide. Body, person. 109) The above-mentioned positioning means determines the position (110) of the optical waveguide junction of any one of the above-mentioned core portions as in the above (9)) to (1G9). In the optical waveguide structure, the electric component is an element having a light-emitting portion or a light-receiving portion and a terminal. The optical waveguide structure according to any one of the preceding claims, wherein the optical waveguide has an optical path converting portion that bends an optical path of transmitted light transmitted through the core portion. (112) The optical waveguide structure according to the above (i), wherein the positioning means is positioned such that a position of the light-emitting portion or the light-receiving portion overlaps with a position of the optical path conversion portion in a plan view. (113) The optical waveguide structure according to (U1) or (112) above, wherein the optical path converting portion is formed by a reflecting surface that reflects at least a part of the transmitted light transmitted to the core portion. The optical waveguide structure according to any one of the above-mentioned (110), wherein the substrate is provided with a light transmitting portion having a light transmissive property to the transmitted light transmitted through the core portion, the element The light-emitting portion or the light-receiving portion and the core portion are optically connected via the light-transmitting portion. The optical waveguide structure according to (n4) above, wherein at least a portion of the substrate has a light transmissive property to the transmitted light, thereby constituting a light transmitting portion. The light transmission (116) is the optical waveguide structure of the above (114), and the portion is formed by a through hole penetrating the substrate. The optical waveguide structure according to any one of the above (91) to (116), wherein the optical waveguide is adjacent to the substrate and is provided with ❶ (118) as in any one of (91) to (117) above. The optical waveguide structure 'where the above electrical component comprises an electronic circuit component. The optical waveguide structure according to any one of the above-mentioned (91), wherein the electric component includes an element having a light-emitting portion or a light-receiving portion and a terminal, and has a wheel for driving the element or processing the element An electronic circuit component that functions as a signal. (120) The optical waveguide structure of any one of the above (91) to (U9), which has at least one conductor layer. The optical waveguide structure according to the above (120), wherein the terminal of the electric component is electrically connected to the conductor layer. The optical waveguide junction according to any one of the above (91), wherein the positioning means is formed by a step formed on an edge portion of the concave portion formed on the substrate. (123) The optical waveguide assembly body according to any one of the above (91) to (121) wherein the positioning means is a positioning member fixedly disposed with respect to the substrate. (124) The optical waveguide structure according to (123) above, wherein the predetermined member is a sheet or sheet joined to the substrate. The optical waveguide structure of any one of the above-mentioned (9), wherein the positioning means is formed by a contact surface formed on the substrate or relative to the substrate. (126) as described above ( The optical waveguide structure of any one of (91), wherein the positioning means performs the χ direction and the γ direction when the χ direction and the Υ direction are orthogonal to each other on a plane of the substrate (127) The optical waveguide structure of any one of the above (91) to (125), wherein when set in the X direction and the Υ direction orthogonal to each other on the plane of the substrate, The positioning means performs the positioning in the respective directions of the χ direction and the Υ direction. (128) The optical waveguide structure according to the above (126) or (127), wherein the longitudinal direction of the core portion and the X direction or the above The optical waveguide structure according to any one of the above-mentioned (91) to (128), which has a lens portion that can condense or diffuse transmitted light transmitted through the core portion. (130) An optical waveguide structure according to (129) above, wherein The lens unit is provided in the vicinity of or in the vicinity of the substrate. (131) An electronic device comprising the optical waveguide structure according to any one of the above (91) to (1 30). It is possible to obtain a pattern shape of the core portion of the optical path of the optical circuit by a simple method such as irradiation with light or active radiation (active energy, electron beam, X-ray, etc.), etc. 25 201213360 The core part with a wide degree of freedom and high dimensional accuracy. When the core layer is composed of the desired material, even when the stress acts on the optical waveguide or is deformed, especially in the case of repeated bending deformation, It is difficult to cause defects such as peeling between the core portion and the cladding portion or micro-cracking in the core portion, and as a result, the optical transmission performance of the optical waveguide can be maintained, and the durability is excellent. Further, the decene-based resin (cycloolefin system) When the resin composition mainly composed of a resin is a core portion, it is difficult to produce a particularly strong defect with respect to the above deformation, and the core portion and the package can be further increased. The refractive index of the covering portion is poor, and the heat resistance is excellent, and as a result, an optical waveguide having higher performance and more excellent durability can be obtained. Further, in the case of having an optical path converting portion, the optical path of the transmitted light can be made to be desired. The direction is curved, so the design of the optical path is more flexible, and it also contributes to the integration of the optical circuit. Moreover, in the case where the substrate has a light transmitting portion, the optical path through the substrate can be formed, so the optical path The degree of freedom in the design is further expanded. When the light-transmitting portion has a lens portion, it is possible to collect and diffuse the transmitted light as needed in the optical path, and to integrate with the optical path and the like. Further, the degree of freedom in designing the optical circuit is further expanded. Also, in the case where the waveguideless structure has Π, | 兀仵 or light-receiving element, by optically connecting with the optical waveguide, j is used to illuminate the component by the first waveguide. The light emitted by the part is introduced into other parts, and the lighter 4' leads the light from other parts to the light receiving part of the component, and can occupy a small and integrated optical circuit, and the operation of the optical circuit is reliable. Also higher. 26 201213360, it is easy to place the terminal for the above-mentioned components, and the like, and it is suitable for the degree of freedom of the installation portion of the wiring terminal of the wiring layer of the above-mentioned conductor layer. The type of component (the wiring thereof is versatile. And the degree of freedom in the design of the pattern (for example, the selection is wider. Regarding the above-described optical waveguide structure of the present invention, the optical circuit (pattern of the optical waveguide) or the design space of the electrical circuit) Wide, high yield, high optical transmission performance, reliable, sinful durability, and versatility. With the light structure of the present invention, various electronic components with high reliability can be obtained. In the case of the light guide disk conductor portion extending in the thickness direction of the laminated structure, the electrical circuit and the optical circuit can realize a three-dimensional circuit design, and the degree of freedom in design is expanded in each circuit design. In particular, by arranging the light guiding path and the conductor portion, particularly in the through hole, it is possible to contribute to the integration of the optical waveguide structure. Miniaturization. In the case of the optical path conversion unit, the optical path of the transmitted light can be bent in the desired direction. Therefore, the degree of freedom in designing the optical path is enlarged, which also contributes to the integration of the optical circuit. In the case of having a lens portion, it is possible to combine the light collecting and diffusing of the transmitting light in the optical path as needed, and to combine with the bending of the optical path to further expand the degree of freedom in designing the optical circuit. When the waveguide structure has an element (light-emitting element or light-receiving element), by optically connecting with the optical waveguide, the optical waveguide can introduce light emitted from the light-emitting portion of the element into other parts, or the optical waveguide will be from its 27 201213360 The light-receiving portion of the light-introducing element of the portion can form a small and integrated optical circuit, and the reliability of the operation of the optical circuit is also high. Moreover, in the case of having a conductor layer and a conductor portion that is electrically connected thereto, for example, It is easy to wire the above-mentioned components'. It is possible to realize the versatility regardless of the type of components (the wiring of the terminals is suitable for the wiring of the terminals). The degree of freedom (for example, the degree of freedom in the location where the terminal is selected) is wide. The optical waveguide structure of the present invention, the optical circuit (the pattern of the optical waveguide and the light guiding portion) or the electrical circuit (the pattern of the conductor layer and the conductor portion) The design has a wide space, good yield, high optical transmission performance, excellent reliability, durability, and versatility. Therefore, the optical waveguide structure of the present invention can be used for various electronic parts, electronic devices, and the like.使用 By using the optical waveguide structure of the present invention, it is possible to manufacture a conductor layer in which at least one layer of the electric rolling circuit is formed, and an optical waveguide in which at least one layer is arranged one-dimensionally or two-dimensionally in the plane direction. The multilayer optical-electric hybrid (fused) wiring board can be connected by any of the electrical wiring or the optical circuit by connecting the layers (the thickness direction of the layer) with the light-conducting path and the through-hole of the conductor portion. As a result, a three-dimensional light/electric hybrid substrate having a wide degree of freedom in circuit design can be provided. Further, it is easy to form an electric circuit or an optical circuit, and it is possible to form various shapes with good dimensional accuracy. In particular, with regard to the optical circuit, by selecting the exposure pattern, it is possible to form a crucible (core portion) of any shape or configuration, and it is also possible to clearly form a thinner #纽,,. In order to reduce the size of the device, it is possible to reduce the positional relationship between the electrical component and the optical waveguide (core (4)) easily and accurately. An optical circuit having excellent optical transmission characteristics and high reliability can be obtained, and a more fine and complicated circuit pattern can be obtained. In particular, the substrate is formed by positioning the electrical component (by irradiating active radiation or borrowing The core portion or the like is formed by further heating or the core layer is formed on the substrate in which the position of the electrical component is determined in advance, thereby forming a core portion or the like, whereby the light-emitting portion or the light-receiving portion of the electric component can be easily and quickly determined. a positional relationship with the core portion (in particular, the incident portion of the transmitted light incident on the core portion or the exit portion from the core portion), and in the case of having the optical path conversion portion, The optical path of the transmitted light is in the desired direction. The degree of freedom in designing the curved 'thus' optical path is expanded, and in particular, the optical circuit can be formed with a shorter optical path length, contributing to the high integration of the optical circuit. In this case, the positioning unit can be used to easily and accurately position the light-emitting unit or the light-receiving unit of the electric component and the optical path conversion unit. Further, when the substrate has a light-transmitting portion, the substrate can be formed. The first step (the optical path in the thickness direction of the substrate), so the degree of freedom in the design of the optical path is further expanded. In the case where the light transmitting portion has the lens portion, the light can be collected in the optical path as needed. Further, the diffusion, the bending of the optical path, and the like are combined to further expand the design of the optical circuit. Further, when the conductor layer is provided, for example, it is easy to wire the electrical component, and the type of the electrical component can be realized ( The wiring of the terminal is suitable for the wiring of the terminal, and is versatile. Moreover, the degree of freedom in the design of the wiring pattern of the above-mentioned wiring is high (for example, the selection of the terminal is freely selected) Regarding the optical waveguide structure of the present invention described above, the design of the optical circuit (the pattern of the optical waveguide and the light guiding portion) or the electrical circuit (the pattern of the conductor layer and the conductor portion) is wider, and the yield is better. The optical transmission performance can be maintained at a high level, and the reliability and durability are excellent, and the versatility is excellent. Therefore, the optical waveguide structure of the present invention can be used for various electronic parts, electronic devices, etc. The formation of the optical circuit is relatively easy and can be sized. It is possible to form a variety of shapes with high precision, and it is also possible to form a finer optical path with a clear shape, which contributes to the integration of the circuit and can be miniaturized. [Embodiment] In the preferred embodiment, the optical waveguide structure and the electronic device of the present invention will be described in detail. The first and second blades are the actual == diagrams of the optical waveguide structure of the present invention. The light waves are referred to by the τ, - surface. For the description of the configuration of the conductor, the above is "upper" or "upper", and the lower side is set to "down" or ":". In each figure, the thickness direction of the riding layer is exaggerated (the figures are shown in the following figure 20 to 24). shape Sectional view, g 25, the section line X in FIG waveguide structure of FIG months, in the FIG. 22 B R 27 is not a circle in the sectional view of FIG 20. Hereinafter, the cross-sectional view of the line and the lower side of w__ in Fig. 24 will be described with reference to these examples. Furthermore, in the following description, the upper side of FIG. 20 to FIG. 24 30 201213360 is set to "up" or "upper", and the lower side is set to "down" and "lower". In Fig. 24, the thickness direction of the edge layer is exaggerated in the upper two directions. Fig. 32 is a plan view showing the 19th problem of the optical waveguide structure of the present invention, and Fig. 33 is a cross-sectional view taken along line A_A of Fig. 32. Fig. 35 is a cross-sectional view showing a twentieth embodiment of the optical waveguide structure of the present invention, and Fig. 36 is a cross-sectional view showing a twenty-first embodiment of the optical undulation structure of the present invention. In the present invention, a cross-sectional view of a twenty-fourth embodiment of the waveguide structure will be described with reference to the configuration of the optical waveguide structure, and the above description will be given to the upper side of FIGS. 33 to 37. Set to "Up" or "Up" and the lower side to "Down" or "Bottom". In the other three, the thickness direction of the drawing layer is exaggerated (the horizontal direction (left-right direction) in the figure is set as the figure = direction). Further, Fig. 32) is referred to as "Y direction" (wherein χ too direction "' longitudinal direction (upper and lower. Alignment with γ direction) <First embodiment: Fig. i &gt; In the present invention, the two sides of the optical waveguide 9 are respectively connected to the two sides of the optical waveguide 9; the optical waveguide 9, the optical path conversion portion of the optical path bending, and the optical waveguide 9 of the first waveguide 9; And the electrical component 12. The cladding layer 9 core layer 93 is sequentially laminated on the lower layer (the lower core layer 93 is formed with a specific layer 2 (upper cladding layer) 92), and the core portion 94 is formed. Forming a portion of the core portion 94 and the cladding portion 95 of the transmitted light, the cladding portion 95 is formed in the core to the layer 93, but does not form the optical path of the passing light, and functions as a cladding layer. 9 i, 92 the same function portion. In the configuration shown in Fig. 1, the core portion 94 is formed on the left side of the core layer 93 at a position on the left side of Fig. 1, and is outside the core layer 93. A portion of the cladding portion 95 is formed. ' As a constituent material of the core layer 93, it can be set by irradiation with light (for example, ultraviolet rays) or by stepwise heating. A material which changes the refractive index. As a preferable example of the above-mentioned material, a resin material containing a benzene ring-shaped polymer and a cycloolefin resin such as a reduced-polymer (resin) is preferable. The female polymer (as a main material) is mainly composed of the above-mentioned material, and the core layer 93 is excellent in resistance to deformation such as deformation, in particular, even in the case of repeated bending deformation: :: 94 and the covering portion 95 The peeling, or the delamination between the core and I) can also prevent microcracking in the core portion 94 or the coating 4 95. As a result, the light transmission property of the special/leather guide 9 can be prevented. Further, an optical waveguide 9 having excellent durability can be obtained. Further, as a constituent material of the core layer 93, for example, a dose agent, a refractive index adjuster, a plasticizer, a tackifier, a smoke, a ton enhancer, a salt-increasing agent, or the like may be used. Addition of the leveling agent 'antifoaming agent, adhesion aid and flame retardant, etc. 1 has the effect of improving high temperature stability and improving weather resistance. Μ Μ: # η ^ 1 , L. 光 光 光 光 乍 乍Examples of the oxidizing agent include those of the Sanyo system and the aromatic amine group. Contrasting, 曰 曰 、 、 、 加强 弯曲 眭 眭 眭 眭 眭 眭 眭 眭 眭 2012 2012 2012 2012 2012 眭 2012 2012 2012 2012 2012 眭 2012 2012 2012 2012 眭 眭 2012 眭 眭 眭 眭 2012 2012 2012 眭 2012 眭 2012 2012 2012 2012 2012 2012 The constituting material as a whole is preferably Μ 4 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The type or characteristics of the additive are caused by a decrease in the transmittance of light (transmission light) transmitted through the core portion 94, a poor patterning, an unstable refractive index, etc. As a method of forming the core layer 93, a coating method can be cited. Bufa. As a coating, a method of coating a core layer-forming composition (varnish or the like) and hardening it (a method of solid-shadowing, and a method of applying a curable monomer composition and/or curing (curing)) Further, a method other than the coating method, for example, a method of joining separately manufactured sheets may be employed. Using the mask, the core layer 93 obtained in the above manner is selectively exposed (active radiation) to make desired The core portion (10) of the shape is exemplified. As the light for exposure, an active energy ray such as visible = may be used, or a particle beam such as a second line 4 electromagnetic wave or an electron beam may be used without using light. The refractive index of the portion irradiated with light is lowered, and a difference in refractive index is generated between the portion irradiated with the light. For example, the portion of the core layer 93 that is irradiated with light becomes the core portion of the portion where the coating is not irradiated (4). The rate is substantially the same as the refractive index of the cladding layers 91 and 92. Further, there is a case where the core portion 94 is formed by irradiating light with H 93 in a specific pattern and then applying heat to the core portion 94. By adding this heating step, Can:: step to increase the core part 94 with It is preferable that the cladding portion 95 has a difference in refractive index. Further, the principle and the like will be described in detail below. 33 201213360 As the pattern shape of the formed core portion 94, there is no J, and the shape is two: The shape, shape, and light type of the curved part: branch: the shape of the merged part or the intersection, the concentrating part (width: or the light diffusing part (the width is equal to the big eve but the eight knives; The shape or the like: = two or a combination of the two types of illumination patterns, and it is possible to easily form the core portion 94 of an arbitrary shape from the set light. The constituent materials and methods of the optical waveguide 9 are The formation layer of 94 and the conductor layer 51 and the conductor layer 52 which are bonded to the lower side of the optical waveguide 9 respectively carry the circuit of the above-mentioned bonding, and the shape of the upper surface is formed. The wiring of the bismuth alloy, Shao, Shao alloy, etc. are all 歹! Lifting copper, copper acne blush, this 禋 metal material 枓. The conductor layer 51, 52 is not limited, usually than 52 5~ 70 or so. '''', left and right, more preferably the conductor layers 51, 52 are, for example It can be formed by methods such as metallization of metal foil, (4), sputtering, etc. For conductors, gold can be used, for example, by button engraving, printing, shielding, etc. / Figure 2, in Figure 1, the light-emitting element 10 The pair of terminals t on the lower side has a hair first part (8) and a '„^ nine port P 01 between the terminals 103. If the terminal is energized, the light is emitted: 10=105. Element 4 I 01 illuminates. In addition to the other, the illuminating part of the illuminating part is composed of a single illuminating point, and is composed of a plurality of illuminating points, for example, '. As a set, there is a complex point called a... Two) two-point vacancies are arranged in a column shape (for example, two light-emitting lights) or a matrix (for example, nxm light-emitting points: 34 201213360 n, m is an integer of 2 or more), or a plurality of light-emitting points are irregular ( Random) configurator, etc. The light receiving element in the light receiving element 11 described below is the same. The light-emitting element 10 is mounted on the optical waveguide 9 such that its terminals 103 and 1〇5 are bonded (electrically connected) to specific portions of the conductor layer 52, respectively. The electric component (electronic circuit component) 12 is composed of, for example, a semiconductor component (semiconductor wafer). The function of the electric component 12 is not limited to the case of the circuit for driving the light-emitting element 1 . In Fig. 1, the electrical component 12 has two terminals 123, 125 on the lower side. The electrical component 12 is mounted on the optical wave by bonding (electrically connecting) a specific portion of the terminals 123 and 125 52 thereof: the gate: the component 1 and the electrical component 12 are made of the underfill material 4, etc. The terminals 103, 105, 123, and 125 are formed by the ejector element 10, the electrical component 12, and the fish portion, and the gap between the underfill material 4 and the guide 9 is not formed. . Further, the light-emitting element 10 and the electric device are as follows: the binary material 6 covers and closes the entire (outer surface). It is a structure in which the light-emitting element 12 is protected from contamination, damage, and oxygen enthalpy, so that reliability degradation can be protected, and the light (transmission light) of the underfill material 4 of the electronic component can be improved. The material constituting the penetrating self-illuminating portion 101 as an underfill material is preferably composed of a transparent material. The resin material, for example, may be a constituent material, preferably having insulating properties: cow epoxy resin, phenol resin, amine bismuth citrate 35 201213360 vinegar resin, polyimine resin, and the like. Further, as a constituent material of the sealing material 6, a resin material having an insulating property is preferable, and examples thereof include an epoxy resin, a phenol resin, a norbornene resin, and an anthracene resin. As shown by the circle 1, a plurality of through holes 8 penetrating through the thickness direction of the optical waveguide 9 are formed. Each of the through holes 8 is filled with a conductive material (for example, various metal materials such as copper, a copper alloy, or a bismuth alloy) to form a conductor post 81. The conductor layers 51 and the specific portions of the conductor layer 52 are electrically connected to each other via the conductor posts 81. That is, the energization of the light-emitting element 1A and the terminals 103, 1〇5, 123, and 125 of the electric component 12 can be performed via the conductor layer 51 on the lower surface side of the optical waveguide 9. Furthermore, the terminals 1〇5 and the terminals [Μ conduction] are connected to the ground side. The core portion 94 of the optical waveguide 9 is formed in a pattern shape in which the light-emitting portion 101 of the light-emitting element 10 is superimposed (that is, directly under the light-emitting portion ι ι) in a plan view (when viewed from above the figure i). The core portion 94 has a higher refractive index than the cladding portion 95, and has a higher refractive index for the cladding layers 91, 92. The covering layers 91 and 92 constitute a covering portion located at the lower portion and the upper portion of the core portion 94, respectively. According to the above configuration, the core portion 94 functions as a light guiding path that surrounds the entire circumference of the outer circumference in the cladding portion. The optical waveguide 9 has an optical path converting portion 96 that bends the optical path of the core portion 94. The optical path converting portion 96 is constituted by a reflecting surface (mirror) 961 that reflects at least a part of the transmitted light. The reflecting surface 961 is disposed at a position directly below the light emitting portion 1 〇 1 . The reflecting surface 961 is substantially 45 with respect to the optical path of the optical waveguide 9, that is, the long side 36 201213360 of the core portion 94. Tilt, top) function. More than half of the reflected transmission light (for example, 90% by the optical path conversion unit 96 described above)

光波導9之一 之填充材料。 、方作為底邊之三角形之凹部(空 作反射面961者。反射面96丨例 或金屬薄膜(例如鋁蒸鍍膜)之 ,雖未圖示,但於光程轉換部96 、尤其疋折射率與核心部94不同 於圖示之構成中,反射面961 (光程轉換部96)橫跨 枱^層93與包覆層92而形成,亦可僅形成於核心層93内。 於本實施形態之光波導結構體丨中,若經由導體層51、 導體柱81及導體層52對發光元件1〇之端子105間 通電,則發光部101發光,圖1中朝下方發出之光依序穿 透底部填充材料4及包覆層92,經反射面961反射呈90。 脊曲,進入光波導9之核心部94 , 一面於與包覆部(包覆 層91、92及側方之包覆部95 )之界面重複反射,一面沿著 其長邊方向(圖1中左方向)於核心部94内前進。 又’若經由導體層51、導體柱81及導體層52對電氣 元件12之端子123、125間通電,則可驅動電氣元件12。 再者,於圖1中,圖中最左側之導體柱81與核心部94 父又而表示,該等偏離圖1之紙面之前後方向,核心部94 之光程不與導體柱81干涉。 &lt;第2實施形態:圖2&gt; 37 201213360 於圖2中表不本發明之光波導結構體i之第2實施形 態。以下,對該光波導結構體丨進行說明,關於與上述第丄 實施形態相同之事項,省略其說明,以不同點為中心加以 說明。 於本實施形態之光波導結構體丨中,光程轉換部%之 構成與上述不同,其以外均相同。即,構成光程轉換部% 之反射面(反射鏡)961位於發光部1〇1之正下方,該反射 面961橫跨包覆層91、核心層93及包覆層92之3層而形 成。即,光程轉換部96之三角形之凹部對光波導9之下面 開放。 再者,與上述相同之處在於,反射面961亦可具有如 多層光學薄膜或金屬薄膜之反射膜或反射增加膜,以及於 光程轉換部96之凹部亦可填充有填充材料。 、 &lt;第3實施形態:圖3 &gt; 於圖3中表示本發明之光波導結構體1之第3實施艰 態。以下,對該光波導結構體i進行說明,關於與上述第上 貫施形態相同之事項,省略其說明,以不同點為中心加以 說明。 本貫施形態之光波導結構體1具有基板2,於該基板2 之下面經由接著層3而㈣光波導9。基板2與底部填充材 抖4同樣地’係由實質上穿透自發光部1〇1發出之光(傳 輪光)之材料(具有對傳輸光之透光性之材料)所構成, 較佳為由實質上透明之材料所構成之透明基板。 若詳細闡述,則基板2之光學特性較佳為傳輸光之穿 38 201213360 -透率為8〇%以上’更佳為90%以上,進而更佳為95%以上。 由於基板2具有上述光學特性’故基板2之發光部ι〇ι之 正下方之部位構成使傳輸光透光之透光部2 1。 關於接著層3’亦同樣地由實質上穿透自發光部1〇1發 出之傳輸光的材料所構成,較佳為由透明之材料所構成。 作為基板2之構成材料,例如可列舉··環氡樹脂、酚 树月曰、雙順丁婦二醯亞胺樹脂、雙川頁丁稀二酿亞胺·三口井樹 脂、三唑樹脂、聚氰尿酸酯樹脂、聚三聚氰酸酯 (P ycyanurate )樹月曰、笨環丁烯樹脂、聚醯亞胺樹脂、聚 苯并哼哇樹脂、㈣烯樹脂等。又,該等材料可單獨使用, 亦可混合複數種而使用。 又,基板2亦可為例如於玻璃纖維、樹脂纖維等纖雉 基材(織布、不織布、織物、編織物等)中含浸如上所述 之樹脂材料而成者(預浸體等如,於玻料中含浸環 氧樹脂而成者稱作玻璃環氧基板,可將上述者用作基板2。 上述含纖維㈣之基板2即便_㈣,強度仍較高,又, 熱膨張率亦較低,故於基板2上接合光波導9或導體層(金 屬層)之情形時尤為有利。 s 又’基板2可為複數層之積層體i如可列舉將分別 由組成(種類)不同之樹脂材料所構成之第!層盘第2層 積層而成者、以及將於上述纖維基材中含浸樹脂材料而成 之層(片材)、與由樹脂材料所構成之層積層而成者。再者, 積層體之層構成當然並不限定於此。 基板2之厚度並無特別限定,通常較佳為5〇 〜1.2 39 201213360 mm左右,更佳為ι〇〇〜6〇〇以爪左右。 基板2可為硬質(rigid )者,亦可為具有可撓性 (以㈣e)者。λ,亦可具有硬質之基板與具有可挽性之 基板之兩者。於該情形時,光波導9只要形成於硬質之基 板與具有可撓性之基板之至少—者上即可,亦可橫跨兩者 而形成。 作為接著層3,可使用片材(接合片材),作為其構成 T料例如可列舉:環氧系接著劑、丙烯酸系接著劑、酚 :脂系接著劑、氰酸醋樹脂系接著劑、順丁烯二酿亞胺樹 月曰系接著劑等。尤其是,為抗氧化等,較佳為由具有助炼 活性之材料所構成。 、亦可不使用片材作為接著層3,❿於基板2之下面或光 波導9之上面形成塗膜之接著層3。又接著層3可為積層 2層以上而成者。 接著層3之厚度並無特別限定,較佳為〇.5〜15〇以m 左右,更佳為10〜70 左右。 導體層52形成於基板2之上面。於該情形時,導體層 52之-部分露出於封閉材料6之更外側。χ,形成於光波 導9之下面之導體層51與上述第丄實施形態之導體層η 相比’配線圖案不同。 如圖3所tf ’ 2個導體才主81貫通光波導9、接著層3 及基板2而设置,導體層51與導體層52之特定部位彼此 經由,等導餘81而導通發光元们〇之端子105、 與電軋兀件12之端子123經由導體層51、導體柱81及導 40 201213360 體層52而導通,該等連接於接地側。 若對於封閉材料6之更外側露出 w 有之導體 導體層51之間通電,則發光部1〇 曰-、 6之更外側露出之另一者之導體層52與導== 電,則可驅動電氣元件12。 於本實施形態之光波導結構體”,若經由導體層I 導體柱81及導體層52對發光元件1〇之端子1〇3、⑻間 通電’則㈣1〇1點亮,圖3中朝下方發出之光依序: 透底部填充材料4、基板2.(基板2之透光部)、接著層3 及包覆層92,經反射面961反射呈90。彎曲,進入光波導9 之核心部94,一面於與包覆部(包覆層91、92及側方之包 覆部95 )之界面重複反射,一面沿著其長邊方向(圖3中 左方向)於核心部94内前進。 &lt;第4實施形態:圖4 &gt; 於圖4中表示本發明之光波導結構體1之第4實施形 態。以下’對該光波導結構體1進行說明,關於與上述第i 及苐3貫施形癌相同之事項’省略其說明,以不同點為中 心加以說明。 本實施形態之光波導結構體1除了不具有接著層3,基 板2與光波導9直接接合之方面,及光程轉換部9 6之構成 不同之方面以外’與上述第3貫施形態相同。由於基板2 與光波導9直接接合,故有助於光波導結構體1之薄型化。 構成光程轉換部96之反射面(反射鏡)961位於發光 部101之正下方,該反射面961橫跨包覆層91、核心層93 201213360 及包覆層92之3層而形成。即,光程轉換部96係由以上 方作為底邊之三角形之凹部所構成’於其斜面形成反射面 961 »上述光程轉換部96與基板2鄰接而設置。 再者’與上述相同之處在於,反射面961亦可具有如 多層光學薄膜或金屬薄膜之反射膜或反射增加膜,以及於 光程轉換部96之凹部亦可填充有填充材料。 於本實施形態之光波導結構體1中,若經由導體層5 j、 導體柱81及導體層52對發光元件1〇之端子1〇3、1〇5間 通電,則發光部101發光,圖4中朝下方發出之光依序穿 透底部填充材料4及基板2,經反射面961反射呈9〇。f曲, 進入光波導9之核心部94,一面於與包覆部(包覆層9 j ' 92及側方之包覆部95)之界面重複反射,一面沿著其長邊 方向(圖4中左方向)於核心部94内前進。 &lt;第5實施形態:圖5 &gt; 於圖5中表示本發明之光波導結構體1之第5實施形 態。以下,對該光波導結構體1進行說明,關於與上述第i 及第3實施形態相同之事項,省略其說明,以不同點為中 心加以說明。 同’其以外與上述第3實施形態相同。即,基板2係习 分具有傳輸光之穿透性者,於基板2之發光部1〇丨之』 方位置形成貫通基板2之貫通孔22。該貫通孔22係構j 傳輸光透光之透光部21者。即,該貫通孔22成為於基1 之厚度方向對傳輸光進行導光(傳輪)之導光程。 42 201213360 再者,雖未圖示,但亦可於貫通孔22之内部(全部或 一部分)填充傳輸光之穿透率為80%以上、較佳為9〇%以 上、更佳為95%以上之材料的填充材料.。又,雖未圖示, 但亦可藉由在貫通孔22之内面等形成導電材料之層,而除 了具有光傳輸功能以外,亦具有傳輸電氣信號之功能。 於本實施形態之光波導結構體1中,若經由導體層51、 導體柱81及導體層52對發光元件10之端子ι〇3、1〇5間 通電,則發光部101發光,圖5中朝下方發出之光穿透底 部填充材料4’通過貫通孔22内,穿透接著層3及包覆層 92,經反射面961反射呈90。彎曲,進入光波導9之核心部 94 ’ 一面於與包覆部(包覆層91、92及側方之包覆部95 ) 之界面重複反射’ 一面沿著其長邊方向(圖5中左方向) 於核心部94内前進。 &lt;第6實施形態:圖6 &gt; 於圖6中表示本發明之光波導結構體1之第6實施形 態。以下’對該光波導結構體1進行說明,關於與上述第i、 第4及第5實施形態相同之事項,省略其說明,以不同點 為中心加以說明。 本貫施形態之光波導結構體1係於上述第4實施形態 之光波導結構體1中’將基板2更換成上述第5實施形態 之基板2而成者。即,本實施形態之光波導結構體1中之 基板2係不充分具有傳輸光之穿透性者,於發光部1 〇 1之 正下方位置形成貫通基板2之貫通孔(基板2之厚度方向 之導光程)22。該貫通孔22係構成透光部21者。 43 201213360 於本實施形態之光波導結構體1中,若經由導體層5卜 導體柱81及導體層52對發光元件1〇之端子103、105間 通電,則發光部1〇1點亮,圖6中朝下方發出之光穿透底 部填充材料4,通過貫通孔22内,經反射面961反射呈90° 彎曲’進入光波導9之核心部94,一面於與包覆部(包覆 層91、92及側方之包覆部95 )之界面重複反射,一面沿著 其長邊方向(圖6中左方向)於核心部94内前進。 &lt;第7實施形態:圖7 &gt; 於圖7中表示本發明之光波導結構體1之第7實施形 ^以下,對6亥光波導結構體1進行說明,關於與上述第1 及第5實施形態相同之事項,省略其說明,以不同點為中 心加以說明。 於本實施形態之光料結構體丨中,基板2之透光部 ▲(形成於厚度方向之導光程)21之構成與上述第5實施形 ,不同’其他與第5實施形態相同。即,於基板2之發光 部⑻之正下方位置所形成的貫通孔22内插入由核心部 24、及包圍該核心部24之外用夕勺荦加 光波導23。 之外周之包覆部25所構成的垂直 =部〜成材料或形成方法可與 :貫;Γ22Τ”4亦可使用… 3=:::真充材料相同者。包覆…構删 ”匕覆。”5或包覆層91、%相同。 於本實施形態之光波導結 導體柱81及導體層 巾右經由導體層51、 對發先70件10之端子⑻、105間 201213360 通電,則發光部101發光,圖7中朝下方發出之光穿透底 部填充材料4,通過垂直光波導23之核心部24内,穿透接 著層3及包覆層92,經反射面961反射呈90。贊曲,進入光 波導9之核心部94,一面於與包覆部(包覆層91、%及側 方之包覆部95 )之界面重複反射,一面沿著其長邊方向(圖 7中左方向)於核心部94内前進。 &lt;第8實施形態:圖8 &gt; 於圖8中表示本發明之光波導結構體丨之第8實施形 態。以下,對該光波導結構體1進行說明,關於與上述第丄 及第6實施形態相同之事項,省略其說明,以不同點為中 心加以說明。 本實施形態之光波導結構體1係於上述第6實施形態 之光波導結構體1中,使形成於基板2之厚度方向的導光 程之構成與第7實施形態之其相同而成者。即,於基板2 之發光部101之正下方位置所形成的貫通孔22内插入由核 心部24、及包圍該核心部24之外周之包覆部25所構成之 垂直光波導23。 於本實施形態之光波導結構體1中,若經由導體層5卜 導體柱81及導體層52對發光元件1〇之端子1〇3、1〇5間 通電,則發光部101發光,圖8中朝下方發出之光穿透底 部填充材料4,通過垂直光波導23之核心部24内經反射 面961反射呈90。彎曲,進入光波導9之核心部94,一面於 與包覆部(包覆層9卜92及側方之包覆部95 )之界面重複 反射,一面沿著其長邊方向(圖8中左方向)於核心部94 45 201213360 内前進^ &lt;第9實施形態:圖9 &gt; 於圖9中表示本發明之光波導結構體1之第9實施形 態。以下’對該光波導結構體1進行說明,關於與上述第i 及第8實施形態相同之事項,省略其說明,以不同點為中 心加以說明。 本實施形態之光波導結構體1係除了於透光部2 1設置 可使傳輸光聚光或擴散之透鏡部26以外,與上述第8實施 形態相同者◊即,於垂直光波導23之上端面(入射側)設 置由凸透鏡(準確而§為平凸透鏡)所構成之透鏡部26。 藉此,自發光部101朝圖9中下方發出之光穿透底部 填充材料4後,經透鏡部26聚光而集中其光束.(beam), 該光束通過垂直光波導23之核心部24内,經反射面961 反射呈90。彎曲,進入光波導9之核心部94,沿著其長邊方 向(圖9中左方向)於核心部94内前進。藉由設置上述透 鏡部26,可獲得更加明確(sharp )之傳輸光,而可獲得更 加優異之光傳輸特性。 再者,透鏡部26亦可為能夠擴散傳輸光者。於該情形 時’只要使用凹透鏡即可。 又,透鏡部26之設置位置並不限於圖9所示之位置, 例如亦可為透光部21之中途或下部,或者其他部位、例如 核心部94之入射側端部或出射側端部。 &lt;第10實施形態:圖1〇&gt; 於圖10中表示本發明之光波導結構體丨之第1〇實施 46 201213360 形態。以下,對該光波導結構體1進行說明,關於與上述 第1、第2實施形態等相同之事項,省略其說明,以不同點 為中心加以說明。 由包覆層91、92與位於(介於)其等之間核心層93 所構成的光波導9之下面及上面分別接合有特定圖案形狀 之導體層51及52’導體層51及導體層52之特定部位彼此 藉由貫通光波導9而形成之2個導體柱81分別電連接。 又,於光波導9中形成有2個光程轉換部96a、96b。 該等光程轉換部96a、96b分別具有與上述相同之反射面 96la、961b。於光波導.9中,於核心層93之較反射面“Η 位於圖Η)中左側、及較反射面961b位於圖1〇中右側之部 位形成核心部9 4,於核心層9 3夕·Ml丨、,al 赝93之其以外之部分形成包覆部 95。 於上述光波導9之上部裝載有晶片載體(元件)13。 晶片載體13具備基板2’、與光波導9不同之光波導9 光兀件10、受光元件u、導體# 發 以下,#f &quot; “ 潜54 55、及電氣元件12。 乂下對4载體13之構成進料細閣述。 々於基板2’之下面接合由包覆層Μ、%與 其等之間之核心層93所;^ i &quot;於) …m 光波導9,,於光波導9,之τ 面及土板2之上面分別接合特定圖案形狀 下 55。關於導體層54、55之構成材料、 層Μ及 法等,與上述導體層51、52相同。 / 、圖案化方 基板2'可為實質上透明 為硬質(rigid)去,介-!·* 透月者’又,可A filling material for one of the optical waveguides 9. The square is the concave portion of the triangle of the bottom edge (the surface is vacant as the reflection surface 961. The reflection surface 96 is an example or a metal film (for example, an aluminum vapor deposition film), although not shown, the optical path conversion portion 96, especially the refractive index of the ytterbium Unlike the configuration in which the core portion 94 is different from the one shown in the figure, the reflecting surface 961 (optical path converting portion 96) is formed to extend across the mesa layer 93 and the cladding layer 92, or may be formed only in the core layer 93. In the optical waveguide structure, when the terminal 105 of the light-emitting element 1 is electrically connected via the conductor layer 51, the conductor post 81, and the conductor layer 52, the light-emitting portion 101 emits light, and the light emitted downward in FIG. The underfill material 4 and the cladding layer 92 are reflected by the reflecting surface 961 to be 90. The ridges are bent into the core portion 94 of the optical waveguide 9, and the cladding portion (the cladding layers 91, 92 and the side cladding portion) The interface of 95) is repeatedly reflected, and proceeds in the longitudinal direction (leftward direction in Fig. 1) in the core portion 94. Further, if the terminal 123 of the electric component 12 is via the conductor layer 51, the conductor post 81, and the conductor layer 52 When 125 is energized, the electrical component 12 can be driven. Furthermore, in Figure 1, the leftmost side of the figure The body column 81 and the core portion 94 are further shown, and the optical path of the core portion 94 does not interfere with the conductor post 81 in the front and rear directions of the paper surface of Fig. 1. <2nd embodiment: Fig. 2> 37 201213360 In the second embodiment, the second embodiment of the optical waveguide structure i of the present invention is described. Hereinafter, the optical waveguide structure 丨 will be described, and the same matters as those of the above-described third embodiment will be omitted, and the differences will be mainly In the optical waveguide structure 本 of the present embodiment, the configuration of the optical path conversion unit % is the same as the above, that is, the reflection surface (mirror) 961 constituting the optical path conversion unit % is located in the light-emitting portion. Directly below 1〇1, the reflecting surface 961 is formed across three layers of the cladding layer 91, the core layer 93, and the cladding layer 92. That is, the triangular recess of the optical path converting portion 96 is open to the lower surface of the optical waveguide 9. Further, the same as the above, the reflecting surface 961 may have a reflective film or a reflection increasing film such as a multilayer optical film or a metal thin film, and the concave portion of the optical path converting portion 96 may be filled with a filling material. Third embodiment Fig. 3 &gt; Fig. 3 shows a third implementation of the optical waveguide structure 1 of the present invention. Hereinafter, the optical waveguide structure i will be described, and the same matters as those of the above-described first embodiment will be omitted. The optical waveguide structure 1 of the present embodiment has a substrate 2, and the optical waveguide 9 is formed on the lower surface of the substrate 2 via the bonding layer 3. The substrate 2 is the same as the underfill 4 The ground is composed of a material (light-transmitting material that transmits light from the light-emitting portion 1〇1), which is substantially transparent material. Transparent substrate. As described in detail, the optical characteristics of the substrate 2 are preferably transmitted light. 38 201213360 - The transmittance is 8% or more, more preferably 90% or more, and still more preferably 95% or more. Since the substrate 2 has the above-described optical characteristics, the portion directly under the light-emitting portion ι ι of the substrate 2 constitutes the light-transmitting portion 21 that transmits the transmitted light. Similarly, the adhesive layer 3' is made of a material that substantially penetrates the transmitted light emitted from the light-emitting portion 1〇1, and is preferably made of a transparent material. Examples of the constituent material of the substrate 2 include a ring-and-loop resin, a phenolic tree, a bismuth bismuth quinone imine resin, a Shuangchuan butyl succinimide, a three-necked resin, a triazole resin, and a poly Cyanurate resin, polycyanate (Pycyanurate), succinyl butadiene resin, polyimide resin, polybenzopyrene resin, (tetra) ene resin, and the like. Further, the materials may be used singly or in combination of plural kinds. Further, the substrate 2 may be, for example, a fiber material such as a glass fiber or a resin fiber (woven fabric, non-woven fabric, woven fabric, or knitted fabric) impregnated with the resin material as described above (prepreg or the like) The glass-impregnated epoxy resin is called a glass epoxy substrate, and the above-mentioned one can be used as the substrate 2. The above-mentioned fiber-containing (four) substrate 2 has a high strength even when _ (four), and the thermal expansion rate is also low. Therefore, it is particularly advantageous when the optical waveguide 9 or the conductor layer (metal layer) is bonded to the substrate 2. The s and the substrate 2 may be a laminate of a plurality of layers, such as a resin material which is different in composition (type). The second layer of the first layer of the formed layer is laminated, and the layer (sheet) in which the resin material is impregnated into the fiber substrate and the layered layer composed of the resin material are formed. The layer structure of the laminate is of course not limited thereto. The thickness of the substrate 2 is not particularly limited, and is usually preferably about 5 〇 to 1.2 39 201213360 mm, more preferably ι 〇〇 6 〇〇 around the claw. 2 can be rigid or flexible ((4)e) λ may also have both a hard substrate and a substrate having a slidability. In this case, the optical waveguide 9 is formed on at least a hard substrate and a flexible substrate. A sheet (joined sheet) can be used as the adhesive layer 3, and examples of the constituent T material include an epoxy-based adhesive, an acrylic adhesive, and a phenol: A fat-based adhesive, a cyanic acid-acetate-based adhesive, a maleimide-yield, a ruthenium-based adhesive, etc. In particular, it is preferably made of a material having a reinforcing activity, such as an antioxidant or the like. Alternatively, the sheet 3 may be used as the adhesive layer 3, and the adhesive layer 3 may be formed on the lower surface of the substrate 2 or on the upper surface of the optical waveguide 9. The layer 3 may be formed by laminating two or more layers. It is not particularly limited, and is preferably about 5 to 15 Torr, more preferably about 10 to 70. The conductor layer 52 is formed on the substrate 2. In this case, a part of the conductor layer 52 is exposed to the sealing material. 6 is further outside. χ, the conductor layer 51 formed under the optical waveguide 9 and the above The conductor layer η of the embodiment is different from the 'wiring pattern. As shown in FIG. 3, two conductors 81 are provided through the optical waveguide 9, the subsequent layer 3, and the substrate 2, and the specific portions of the conductor layer 51 and the conductor layer 52 are mutually connected. The terminal 105 that turns on the light-emitting elements and the terminal 123 of the electric rolling element 12 are electrically connected via the conductor layer 51, the conductor post 81, and the conductor 40 201213360 body layer 52 via the lead 81, and are connected to the ground side. When the conductor layer 51 is further energized between the outer side of the sealing material 6 and the conductor layer 51 is electrically connected to the outside of the light-emitting portion 1 〇曰-, 6 and the conductor layer 52 of the other one is exposed, the electric drive can drive the electric In the optical waveguide structure of the present embodiment, when the conductors 81 and the conductor layer 52 are electrically connected to the terminals 1 〇 3 and (8) of the light-emitting element 1 则, (4) 1 〇 1 is lit, FIG. 3 The light emitted from the lower side of the middle is sequentially passed through the underfill material 4, the substrate 2. (the light-transmitting portion of the substrate 2), the adhesive layer 3 and the cladding layer 92, and is reflected by the reflecting surface 961 to be 90. Bending, entering the core portion 94 of the optical waveguide 9, and repeatedly reflecting at the interface with the cladding portion (the cladding layer 91, 92 and the side cladding portion 95) along the longitudinal direction thereof (left in FIG. 3) The direction) advances within the core portion 94. &lt;Fourth Embodiment: Fig. 4 &gt; Fig. 4 shows a fourth embodiment of the optical waveguide structure 1 of the present invention. The optical waveguide structure 1 will be described below, and the description of the same items as the above-described i-th and third-order cancers will be omitted, and the differences will be mainly described. The optical waveguide structure 1 of the present embodiment is the same as the above-described third embodiment except that the bonding layer 3 is not provided, the substrate 2 is directly bonded to the optical waveguide 9, and the configuration of the optical path converting portion 96 is different. Since the substrate 2 is directly bonded to the optical waveguide 9, the optical waveguide structure 1 is made thinner. The reflecting surface (mirror) 961 constituting the optical path converting portion 96 is located directly under the light-emitting portion 101, and the reflecting surface 961 is formed across the cladding layer 91, the core layer 93 201213360, and the cladding layer 92. In other words, the optical path converting portion 96 is formed by a concave portion having a triangular shape as a bottom side, and a reflecting surface 961 is formed on the inclined surface. The optical path converting portion 96 is provided adjacent to the substrate 2. Further, the same as the above, the reflecting surface 961 may have a reflecting film or a reflection increasing film such as a multilayer optical film or a metal film, and the concave portion of the optical path converting portion 96 may be filled with a filling material. In the optical waveguide structure 1 of the present embodiment, when the terminals 1〇3 and 1〇5 of the light-emitting element 1 are electrically connected via the conductor layer 5j, the conductor post 81, and the conductor layer 52, the light-emitting unit 101 emits light. The light emitted from the lower side of the middle and lower sides penetrates the underfill material 4 and the substrate 2 in sequence, and is reflected by the reflecting surface 961 to be 9 〇. The f-curve enters the core portion 94 of the optical waveguide 9 and is repeatedly reflected at the interface with the cladding portion (the cladding layer 9 j '92 and the lateral cladding portion 95) along the longitudinal direction thereof (Fig. 4 The center left direction) advances within the core portion 94. &lt;Fifth Embodiment: Fig. 5 &gt; Fig. 5 shows a fifth embodiment of the optical waveguide structure 1 of the present invention. Hereinafter, the optical waveguide structure 1 will be described, and the same matters as those of the above-described first and third embodiments will be omitted, and the differences will be mainly described. Other than the above, it is the same as the above-described third embodiment. In other words, the substrate 2 is adapted to have the transparency of transmitted light, and the through hole 22 penetrating the substrate 2 is formed at a position of the light-emitting portion 1 of the substrate 2. The through hole 22 is configured to transmit the light transmitting portion 21 that transmits light. In other words, the through hole 22 is a light guiding path for guiding light (passing) of the transmitted light in the thickness direction of the base 1. 42 201213360 Further, although not shown, the transmittance of the light to be filled in the inside (all or part of) of the through hole 22 may be 80% or more, preferably 9% or more, and more preferably 95% or more. Filling material for the material. Further, although not shown, a layer of a conductive material may be formed on the inner surface of the through hole 22 or the like, and in addition to having an optical transmission function, it also has a function of transmitting an electrical signal. In the optical waveguide structure 1 of the present embodiment, when the terminals ι 3 and 1 〇 5 of the light-emitting element 10 are electrically connected via the conductor layer 51, the conductor post 81, and the conductor layer 52, the light-emitting portion 101 emits light, and in FIG. The light emitted downward passes through the underfill material 4' through the through hole 22, penetrates the adhesive layer 3 and the cladding layer 92, and is reflected by the reflecting surface 961 to be 90. Bending, entering the core portion 94' of the optical waveguide 9 and repeating the reflection on one side of the interface with the cladding portion (the cladding layer 91, 92 and the side cladding portion 95) along the longitudinal direction thereof (left in Fig. 5) The direction) advances within the core portion 94. &lt;Sixth Embodiment: Fig. 6 &gt; Fig. 6 shows a sixth embodiment of the optical waveguide structure 1 of the present invention. The optical waveguide structure 1 will be described below, and the description of the same items as the above-described i, fourth, and fifth embodiments will be omitted, and the differences will be mainly described. The optical waveguide structure 1 of the present embodiment is replaced by the substrate 2 of the fifth embodiment in the optical waveguide structure 1 of the fourth embodiment. In other words, in the optical waveguide structure 1 of the present embodiment, the substrate 2 does not sufficiently have the transparency of transmitted light, and a through hole penetrating through the substrate 2 is formed at a position directly below the light-emitting portion 1 (the thickness direction of the substrate 2). Guide light path) 22. The through hole 22 constitutes the light transmitting portion 21. In the optical waveguide structure 1 of the present embodiment, when the conductors 103 and the conductor layer 52 are electrically connected to the terminals 103 and 105 of the light-emitting element 1A, the light-emitting portion 1〇1 is turned on. The light emitted from the lower side of the middle portion penetrates the underfill material 4, passes through the through hole 22, is reflected by the reflecting surface 961 and is bent at 90° into the core portion 94 of the optical waveguide 9, and the surface is covered with the cladding portion 91. The interface between the 92 and the side cladding portion 95) is repeatedly reflected, and advances in the core portion 94 along the longitudinal direction (the left direction in FIG. 6). &lt;Seventh Embodiment: Fig. 7 &gt; Fig. 7 shows a seventh embodiment of the optical waveguide structure 1 of the present invention, and the sixth embodiment of the optical waveguide structure 1 will be described. In the case of the same embodiment, the description thereof will be omitted, and the differences will be mainly described. In the light-emitting material structure of the present embodiment, the configuration of the light-transmitting portion ▲ (light-guiding path formed in the thickness direction) 21 of the substrate 2 is different from that of the fifth embodiment described above, and the other configuration is the same as that of the fifth embodiment. In other words, the core portion 24 is inserted into the through hole 22 formed at a position directly under the light-emitting portion (8) of the substrate 2, and the optical waveguide 23 is surrounded by the core portion 24. The vertical part to the material or the forming method of the outer peripheral cladding portion 25 may be: Γ22Τ"4 may also be used... 3=::: the true filling material is the same. . 5 or the same of the cladding layer 91 and the %. The optical waveguide junction conductor post 81 and the conductor layer cover right of the present embodiment are energized via the conductor layer 51, and the terminals (8) and 105 of the first 70 pieces are energized by 201213360. 101 emits light, and the light emitted downward in FIG. 7 penetrates the underfill material 4, passes through the core portion 24 of the vertical optical waveguide 23, penetrates the adhesive layer 3 and the cladding layer 92, and is reflected by the reflecting surface 961 to be 90. And entering the core portion 94 of the optical waveguide 9 and repeatedly reflecting on the interface with the cladding portion (the cladding layer 91, the % and the side cladding portion 95), along the longitudinal direction thereof (the left direction in FIG. 7) The eighth embodiment of the optical waveguide structure 本 of the present invention is shown in Fig. 8. The optical waveguide structure 1 will be described below. The description of the same matters as the above-described sixth embodiment and the sixth embodiment will be omitted. The optical waveguide structure 1 of the present embodiment is the optical waveguide structure 1 of the sixth embodiment. The configuration of the light guiding path formed in the thickness direction of the substrate 2 and the seventh In the through hole 22 formed at a position directly under the light-emitting portion 101 of the substrate 2, a core portion 24 and a cladding portion 25 surrounding the outer periphery of the core portion 24 are inserted. In the optical waveguide structure 1 of the present embodiment, when the conductors 5 and the conductor layer 52 are electrically connected to the terminals 1〇3 and 1〇5 of the light-emitting element 1A, the light is emitted. The portion 101 emits light, and the light emitted downward in FIG. 8 penetrates the underfill material 4, and is reflected by the reflecting surface 961 in the core portion 24 of the vertical optical waveguide 23 to be 90. Bending, entering the core portion 94 of the optical waveguide 9, on one side Repeatedly reflecting the interface with the cladding portion (the cladding layer 92 and the side cladding portion 95), and advancing along the longitudinal direction (leftward direction in Fig. 8) in the core portion 94 45 201213360 ^ &lt; Ninth Embodiment: Fig. 9 shows a ninth embodiment of the optical waveguide structure 1 of the present invention. The optical waveguide structure 1 will be described below, and the first and eighth embodiments will be described. The same matters are omitted, and the description is omitted, and the differences are mainly described. The optical waveguide structure 1 of the embodiment is the same as the eighth embodiment except that the lens portion 26 that condenses or diffuses the transmitted light is provided in the light transmitting portion 21, that is, the upper end surface of the vertical optical waveguide 23 The (incident side) is provided with a lens portion 26 composed of a convex lens (accurately, a plano-convex lens). Thereby, light emitted from the light-emitting portion 101 toward the lower side in FIG. 9 penetrates the underfill material 4, and is then condensed by the lens portion 26. The beam is concentrated by light, and the beam passes through the core portion 24 of the vertical optical waveguide 23, and is reflected by the reflecting surface 961 to be 90. Bending, entering the core portion 94 of the optical waveguide 9, along the longitudinal direction thereof (Fig. 9 in the left direction) advances in the core portion 94. By providing the above-described lens portion 26, sharper transmission light can be obtained, and more excellent light transmission characteristics can be obtained. Further, the lens portion 26 may be a person capable of diffusing and transmitting light. In this case, it is sufficient to use a concave lens. Further, the installation position of the lens portion 26 is not limited to the position shown in Fig. 9, and may be, for example, the middle or the lower portion of the light transmitting portion 21, or other portions, for example, the incident side end portion or the exit side end portion of the core portion 94. &lt;Tenth Embodiment: Fig. 1A&gt; Fig. 10 shows a first embodiment of the optical waveguide structure 本 of the present invention 46 201213360. In the following, the optical waveguide structure 1 will be described, and the description of the same matters as those in the first and second embodiments will be omitted, and the differences will be mainly described. A conductor layer 51 and a 52' conductor layer 51 and a conductor layer 52 of a specific pattern shape are bonded to the lower surface and the upper surface of the optical waveguide 9 formed by the cladding layers 91 and 92 and the core layer 93 therebetween. The specific portions are electrically connected to each other by the two conductor posts 81 formed through the optical waveguide 9. Further, two optical path conversion units 96a and 96b are formed in the optical waveguide 9. The optical path converting sections 96a and 96b respectively have the same reflecting surfaces 96la and 961b as described above. In the optical waveguide, the core portion 94 is formed on the left side of the relatively reflective surface "Η" of the core layer 93 and the right side of the reflective surface 961b is located in the right side of FIG. A portion other than the other portions of the Al and the 赝 93 is formed with a cladding portion 95. A wafer carrier (element) 13 is mounted on the upper portion of the optical waveguide 9. The wafer carrier 13 is provided with a substrate 2' and an optical waveguide different from the optical waveguide 9. 9 Optical element 10, light-receiving element u, conductor # is issued below, #f &quot; "潜54 55, and electrical component 12. The composition of the 4 carrier 13 is summarized in the armpit. 々 under the substrate 2 ′ is bonded to the core layer 93 between the cladding layer %, % and the like; ^ i &quot; to ... m optical waveguide 9, in the optical waveguide 9, the τ surface and the soil plate 2 The upper surface is joined to a specific pattern shape 55. The constituent materials, layers, and the like of the conductor layers 54 and 55 are the same as those of the conductor layers 51 and 52 described above. /, patterned square substrate 2' can be substantially transparent for rigid (rigid), medium-!**

S〜者,亦可為具有可 J 視性(flexible)者。 201213360 導體層54及導體層55之特定部位彼此藉由貫通基板 2,及光波導9'形成之4個導體柱82而分別電連接。 又,於光波導9’中形成4個光程轉換部96c、96d、96e、 96f。該等光程轉換部96c、96d、96e、96f分別具有與上述 相同之反射面 961 c、96 1 d、961 e、96 1 f。 於光波導9'中,於核心層93之反射面961c與反射面 961d之間之部位 '及反射面96le與反射面961f之間之部 位形成核心部94,於核心層93之其以外之部分形成包覆部 95 ° 於基板2’之上部裝載具備4個端子123、125、127、12 之電氣元件(半導體元件)12。電氣元件12係以其等之对 子⑴、125、m、129分別與導體層55之特定部位接洽 (電連接)之方式裝載於基板上。 電氣元件12之功能並無特別限定,作為一例,可列舉 構成用以驅動發光元件10之電路者。又,電氣元件12 ,方 可進而具有對受光元件11所輸出之電氣信號進行處理 如信號之增幅)之功能(電路)。 上述電氣元件12係藉由與上述封閉材料6相同之封閉 材料61覆蓋並封閉其整體(外表面)。 2光波導9之下部裝載發光元件1()及受光元件! 光7L件1〇係與上述相 A丄- 者。又先兀件11於圖1〇中上面例 具有又光部111、及—對 f而子113、115。受光部111位於端 子u3與端子115之M — ^ I 之間。4受光部ill受光(照射傳輸光 則忒九進行光電轉換, 於鸲子113、115間產生電位差,而 48 201213360 輸出電氣信號。 發光元件10係以其等之端子103、1〇5分別與導體 54之特定部位接合(電連接)之方式裝載於光波導屮之9 部。受光元件11係以其等之端子113、U5分別與導體i 54之特定部位接合(電連接)之方式裝載於光波導&quot; t下 發光元件10及受光元件11係藉由底部填充材料4封閉 包含其等之端子103、105、113、115之上部,進而藉由二 閉材料6覆蓋並封閉發光元件10及受光元件u之整胃體(外 表面)。 光波導9’之核心部94係以俯視時(自圖丨〇之上方觀 察時)與發光元件10之發光部1〇1重疊且與受光元件1 之受光部111重疊(即,如通過發光部1〇1之正上方及a、· 部111之正上方之)之圖案形狀而形成。 又’反射面961d設置於發光部之正 丄万之位置, 反射面96le設置於受光部111之正上方夕#班 上万之位置,反射面 961c設置於反射面961a之正上方之位詈,β 6+工 心诅置反射面961 f設 置於反射面961b之正上方之位置。 上述晶片載體13係藉由焊料(焊料球)7使導體層a 與導體層54之特定部位彼此電連接而裝載於光波導9 θ上。 於該情形時’光波導9、9’間係藉由與上述底部填充材料* 相同之底部填充材料41而封閉。 導體層52之一部分藉由底部填充材料41而封閉,導 體層52之-部分未經底部填充材料41所封閉而露出至外 49 201213360 部。 於本實施形態之光波導結構體1中,若對發光元件10 之端子103、105間通電’則發光部1 〇 1發光,圖10中朝 上方發出之光穿透底部填充材料4,經反射面96Id反射呈 90°彎曲’進入光波導9,之核心部94,沿著其長邊方向(圖 1 〇中左方向)於核心部94内前進β進而,自核心部94之 立而部出射之傳輸光經反射面9 61 c反射呈9 0。變曲,朝下方 穿透底部填充材料41及包覆層92,經反射面961a反射呈 90°彎曲,進入光波導9之核心部94,沿著其長邊方向(圖 1 〇中左方向)於核心部94内前進。 另一方面,自光波導9之圖1 〇中右側進入核心部94 之光沿著其長邊方向(圖10中左方向)於核心部94内前 進,經反射面96!b反射呈90。彎曲,朝上方穿透包覆層% 及底部填充材料41,經反射面96lf反射呈9〇。彎曲,進入 光波導9,之核心部94,沿著其長邊方向(圖1〇中左方向) 於核心部94内前進。進而 輪光經反射面96le反射呈 材料4而於受光部111受光 生電位差而輸出電氣信號。 ’自核心部94之端部出射之傳 9〇°彎曲’朝下方穿透底部填充 。藉此,於端子113、ιι5間產 &lt;第11實施形態:圖1 於圖Π中表示本發明之 態。以下,對該光波導結構體 第6及第1 〇實施形態等相同 點為中心加以說明。 1 &gt; 光波導結構體1之第11實施形 1進行說明,關於與上述第i、 之事項’省略其說明,以不同 50 201213360 於基板2之下面接合由包覆層91、92與位於(介於) 其等之間之核心層93所構成的光波導9,於基板2之上面 接合特定圖案形狀之導體層 52。 又’於光波導9中形成2個光程轉換部96a、96b。光 程轉換部96a及96b為與上述第4、第8、第9實施形態之 光程轉換部96相同之構成,分別具有與上述相同之反射面 961a、961b。 於光波導9中,於核心層93之較反射面96u位於圖 11中左側、及較反射面961b位於圖u中右側之部位形成 核心部94’於核心層93之其以外之部分形成包覆部95。 基板2係不充分具有傳輸光之穿透性(透光性)者, 於基板2之反射面961a、961b之正上方位置(反射面96ic、 :6 1 f之正下方位置)分別形成貫通基板2之貫通孔Μ。該 等貫通孔22係構成使傳輸光透光之透光部21者。即,該 等貫通孔22成為於隸2之厚度方向對傳輸光進行導光 (傳輸)之導光程。 又’於兩貫通孔22(透光部21)之上部分別設置盘上 述第9實施形態相同之透鏡部26β例如,於貫通孔22内、填 充折射率相對較低之透明之帛him旨材料,^其上面形成 弯曲凹面,於該凹面内填充折射率高於上述第丨樹脂材料 之透明之第2樹脂材料’藉此可形成上述第2樹脂材料之 =發揮凸透鏡(平凸透鏡、雙凸透料)之功能的透鏡 又’並不限於此,亦可於貫通孔22内僅設置凸透铲 (平凸透鏡、雙凸透鏡等)。 兄 51 201213360 26之設置 之中途或下 又,對於貫通孔22 (透光部21)之透鏡部 位置並不限於如圖示之上部,亦可為貫通孔U 部。 再者’雖未圖示,但亦可於貫通孔22之内部(全部或 -部分)填充傳輸光之穿透率為8〇%以上、較佳為㈣以 上、更佳為95%以上之材料的填充材料。又,亦可與上述 第7、第8實施形態同樣地’於貫通孔22之内部形成垂: 光波導23。 於上述附基板2之光波導9之上部裝載與上述第1〇實 施形態相同之晶片載體(元件)1 3。 於本實施形態之光波導結構體i中,若對發光元件^ 〇 之端子103、105間通電,則發光部1〇1發光,朝圖u中上 方發出之光穿透底部填充材料4,經反射面96 1 d反射呈90。 彎曲,進入光波導9,之核心部94,沿著其長邊方向(圖u 中左方向)於核心部94内前進。進而,自核心部94之端 部出射之傳輸光經反射面961 c反射呈90。彎曲,朝下方穿 透底部填充材料41後’經透鏡部26聚光而集中其光束 (beam ),該光束通過貫通孔22内,經反射面961 a反射呈 90°彎曲,進入光波導9之核心部94,沿著其長邊方向(圖 11中左方向)於核心部94内前進。 另一方面,自光波導9之圖11中右侧進入核心部9 4 之光沿著其長邊方向(圖11中左方向)於核心部94内前進, 經反射面961b反射呈90°彎曲,朝上方通過貫通孔22内, 經透鏡部26聚光而集中其光束(beam),該光束穿透底部 52 201213360 填充材料41,經反射面961f反射呈9〇。蠻 9,之核心部94,沿蓍其長邊方向(圖丨丨左曲,進入光波導 94内前進。進而,自核心部94之端部向)於核心部 光之光束)經反射面961e反射呈9〇。彎曲,傳輸光(經聚 部填充材料4,於受光部111受光。II 下方穿透底 3日藉此’於端子113、115 間產生電位差而輸出電氣信號。 〈第12實施形態:圖12 &gt; &amp;於圖12中表示本發明之光波導結構體!之第η實施 形悲。以下,對該光波導結構體丨進 ^ &quot;兄明,關於與上述 苐1實施形態等相同之事項,省略立爷明 ,唂,、說明,以不同點為中 心加以說明。 圖12係光波導結構體!之平面圖。圖12所示之具有 光程轉換部之光波導9 (光波導結構體1)具有於其核心部 94之中途使核心部94朝直角方向分支之分支部941。自分 支部941朝圖12之下方形成核心部942。 又,於分支部941形成在厚度方向貫通光波導9之貫 通孔943。貫通孔943於俯視時形成三角形之形狀,其中1 邊係以相對於核心部94之軸線及核心部942之軸線之兩者 分別形成45。之角度(傾斜角)而形成,作為使核心部94 之光程脊曲之光程轉換部而發揮功能。即,該丨邊係將通 過核心部94之傳輸光之—部分反射的反射面944。另一方 面,剩餘2邊中之丨邊與核心部94之軸線平行,剩餘1邊 與核心部942之軸線平行。 於反射面944 ’將自圖12之右方朝左方進入核心部94 53 201213360 之傳輸光的一部分反射,將行進方向變更為下方。又,未 經反射面944反射之傳輸光就這樣於分支部gw中直進。 如此般,於分支部941,可將傳輸光分支成2股。 ▲再者,反射面944例如亦可具有如多層光學薄膜或金 屬薄膜(例如紐蒸鍍膜)之反射膜或反射増加膜。又,雖 未圖示,但亦可於貫通孔943内填充填充材料、尤其是折 射率與核心部94或核心部942不同之填充材料。 此處,於貫通孔943内未填充填充材料之情形時,通 常存在空1。反射面944係基於核心部94或核心部942之 折射率、與空氣之折射率之差而使核心部94或核心部州 之光程彎曲者。由於用於本發明之感光性樹脂組成物與空 氣之折㈣差相對較A,故反射s 944 ^進行全反射之 角度的容許範圍亦相對變大。因此,藉由依據斯奈爾定律, 可將反射® 944之傾斜角設定為使於核心部%或核心部 942中傳播之光全反射之角度。其結果,可抑制伴隨反射面 944之反射的光之衰減,從而抑制光之傳播效率之降低。 又,於分支部94丨’朝下方分支之傳輪光與未分支而直 線前進之傳輸光之比率’根據使反射面944於核心部94方 向投影之情形之投影像(以下稱作「反射φ州之投影像」) 與核心部94之橫剖面之重φ方法而變化。具體而言,只要 反射面944之投影像並非完全覆蓋核心部94之橫剖面者, 則可於分支部941進行傳輸光之分支。即,只要反射面_ 之投影像與核心部94之橫剖面之重複面積小於核心部94 之橫剖面積’則可產生於分支吾&quot;41未進行分支而直線前 54 201213360 進之傳輸光,故可於分支部94丨進行分支。、、 944之投影像與核心部94之橫剖面之重藉 射 邱94夕搀a丨品扯 复面積相對於核心 邛94之检剖面積的比例成為經分 ^ , 心得翰先之比例。如此 叙,僅藉由設定貫通孔943之面積^ $ 谓取形成位置便可設宕分 支部941之分支率,故容易形成分支部941。 圖13、14分別係表示第12實施形態之 平面圖。 僻取例‘ 圖U所示之反射面944係以其投影像完全覆蓋核心部 94之杈剖面之方式構成,且核心部%之橫剖面積與反射面 944之投影像及核心部94之橫剖面之重複面積相同。因此, 於圖Π所示之分支部941 ’通過核心部94之所有傳輸光經 反射面944反射。 又,圖13所不之核心部94於分支部94丨 大之加寬部.945。於加寬部945,以核心部94之外= 貫通孔943干涉之方式膨脹。具體而言,於加寬部945假 想核心部94之外廓之延伸線(外廓部延伸線)s時,反射 面944之斜面方向之兩端部位於較延伸線$更外側。藉此’ 對於通過核心部94之傳輸光,可更加確實地提高反射面944 之傳輸光之反射效率。 進而,於該情形時,反射面944中,面精度較低之斜 面方向之兩端部附近無助於傳輸光之反射,面精度較高之 中央附近反射傳輸光。因此,反射角度之精度亦變高,可 抑制不需要之反射。其結果,可大幅度減少以不需要之角 度反射的傳輸光之一部分漏出至包覆部95的情形。再者, 55 201213360 反射面944中,斜面方向之兩端部附近於形成貫通孔943 時,存在無法避免加工精度之降低,表面粗糙度變高,或 反射面944之傾斜角自目標角度偏離之虞,故就防止傳輸 效率之降低之觀點而言,設置上述加寬部945較為有效。 另一方面,圖14所示之核心部94亦具有與圖13所示 之加寬部945相同者。圖14所示之反射面944係以其投影 像覆蓋核心部94之橫剖面之—部分之方式構成。關於通過 核心部94之傳輸光,其一部分於反射面9料之投影像與核 心部94之橫剖面之重複部分經反射,剩餘之傳輸光未經反 射而於該狀態下直線前進。因此,於圖14所示之分支部 941,可將通過核心部94之傳輸光分支成2股。 又,於圖14所示之加寬部945假想核心部94之外廓 之延伸線S時’反射面944之斜面方向之兩端部中,一者 位於較延伸線s更外側。於該情形時,與上述圖13之情形 同樣,反射面944中,面精度較低之斜面方向之一者之兩 端部附近無助於傳輸光之反射,主要於面精度較高之中央 附近反射傳輸光。因此,反射角度之精度亦變高,可抑制 不需要之反射。其結果,可大幅度減少反射光之一部分漏 出至包覆部95之情形。 於以上之第1 2實施形態中,均對以1個反射面944反 射傳輸光之情形進行了說明,亦可以2個以上之反射面944 反射傳輸光。 &lt;第1 3實施形態:圖1 5 &gt; 於圖15中表示本發明之光波導結構體1之第13實施 56 201213360 : 形態。以下,對該光波導結構體1進行說明,關於與上述 第1實施形.態等相同之事項,省略其說明,以不同點為中 心加以說明。 圖15為光波導結構體1之斜視圖。於圖15所示之具 有光程轉換部之光波導9 (光波導結構體1 )中,核心部% 於其端部中斷’該中斷部分946與位於核心部94之側方之 包覆部95 —體化。並且,藉由去除核心層93之中斷部分 946之一部分、與位於其兩面側之各包覆層9丨、92之—部 为,形成以包覆層91側作為底邊之三角形之凹部。該凹部 之寬度設為核心部94之寬度以上。又,相當於凹部之斜邊 的2面中之一者成為反射面961。 上述反射面961係由包覆層91之露出面、中斷部分946 露出面及包覆層92之露出面所構成。該等露出面均為 加工包覆材料而形成纟,故於反射自961 t形成時,難以 於加工時之加工率上產生差異,因此,難以產生加工不均, :形成平滑性較高之反射面961。若反射面96ι之平滑性變 间,則可提向反射面961之面精度及光學特性,故反射面 成為可防止光程轉換時之傳輸效率之降低者。 ”此相對,若反射面961包含核心部94之露出面,則 於核心材料與包覆材料之間’容易於加工率上產生差異, 有產生加工不均’反射φ 961之面精度及光學特性降低 之虞。 _ 相虽於凹部之斜邊之2面中,反射面96丨以外 面亦可具有作為反射面之功能。 57 201213360 &lt;第14實施形態:圖2〇 &gt; 如圓20所示,本發明之光波導結構體ι〇〇ι具備基板 1〇〇2、與基板1002鄰接而設置之光波導1〇〇9、分別與光波 導1009之兩面接合之導體層1051、1〇52、使光波導謂 之光程彎曲之光程轉換部96、與基板1002之上面接合之導 體層1053、發光元件101〇、及電氣元件1〇12。 作為基板1002之構成材料,例如可列舉: ㈣脂、雙順丁稀二^胺樹脂、雙順丁烯二醯口井 招&quot;:、三。坐樹脂,尿酸醋樹脂、聚三聚氰酸醋樹脂、 苯% 丁烯樹脂、聚醯亞胺、聚苯并啊樹脂、降获烯樹脂等 樹脂材料;或矽、鎵-砷、銦_磷、鍺、碳化矽、矽鍺等半導 體材料。X ’該等材料可單獨使用,亦可混合複數種而使 用。 又,基板1002亦可為例如於玻璃纖維、樹脂纖維等纖 維基材(織布、不織布、織物、編織物等)中含浸如上所 ^之樹脂材料而成者(預浸體等)。例如,於玻璃布中含浸 壤氧樹脂而成者稱作玻璃環氧基才反,可將上述者用作基板 1002。上述含纖維基材之基板1〇〇2即便相對較薄,強度仍 較问又,熱膨張率亦較低,故於基板1 〇〇2上接合光波導 1009或導體層(金屬層)4情形時尤為有利。 又,基板1002亦可為複數層之積層體。例如可列舉將 分別由組成(種類)不同之樹脂材料所構成之第1層與第2 層積層而成者、以及將於上述纖維基材中含浸樹脂材料而 成之層(片材)、與由樹脂材料所構成之層積層而成者。再 58 201213360 者,積層體之層構成當然並不限定於此。 基板10G2之厚度並無特別限定,通常較佳為” 左右,更佳為5〇〜6〇〇 &quot;爪左右。 基板舰可為硬質(rigid)者,亦可為具有可挽性S~ can also be a person with flexibility. 201213360 The specific portions of the conductor layer 54 and the conductor layer 55 are electrically connected to each other by the four conductor posts 82 formed through the substrate 2 and the optical waveguide 9'. Further, four optical path converting portions 96c, 96d, 96e, and 96f are formed in the optical waveguide 9'. The optical path converting portions 96c, 96d, 96e, and 96f respectively have the same reflecting surfaces 961c, 961d, 961e, and 961f as described above. In the optical waveguide 9', a portion 94 between the reflecting surface 961c of the core layer 93 and the reflecting surface 961d and a portion between the reflecting surface 96le and the reflecting surface 961f form a core portion 94 outside the core layer 93. Forming the cladding portion 95 ° An electrical component (semiconductor component) 12 having four terminals 123, 125, 127, and 12 is mounted on the upper portion of the substrate 2'. The electric component 12 is mounted on the substrate such that the pairs (1), 125, m, and 129 are in contact with each other (electrically connected) to a specific portion of the conductor layer 55. The function of the electric component 12 is not particularly limited, and as an example, a circuit constituting the light-emitting element 10 can be cited. Further, the electric component 12 may further have a function (circuit) for processing an electric signal output from the light receiving element 11 such as an increase in a signal. The above-mentioned electric component 12 is covered by the same closing material 61 as the above-mentioned sealing material 6, and is closed (outer surface). 2 The light-emitting element 1 () and the light-receiving element are mounted on the lower part of the optical waveguide 9! The light 7L member 1 is the same as the above-mentioned phase A丄-. Further, the first member 11 has the light portion 111 and the pair of children 113 and 115 in the above example. The light receiving portion 111 is located between M - ^ I of the terminal u3 and the terminal 115. 4 The light-receiving unit ill receives light (the light is transmitted by the illuminating light, and the potential difference is generated between the scorpions 113 and 115, and 48 201213360 outputs an electrical signal. The light-emitting element 10 is connected to the conductors 54 and 154, respectively. The specific portion is bonded (electrically connected) to the optical waveguide 9. The light-receiving element 11 is mounted on the optical waveguide such that the terminals 113 and U5 are connected (electrically connected) to specific portions of the conductor i 54 . &lt; The lower light-emitting element 10 and the light-receiving element 11 are closed by the underfill material 4 to the upper portions of the terminals 103, 105, 113, 115 including the same, and the light-emitting element 10 and the light-receiving element are covered by the two closed materials 6 The whole body (outer surface) of the optical waveguide 9'. The core portion 94 of the optical waveguide 9' overlaps with the light-emitting portion 1〇1 of the light-emitting element 10 and is received by the light-receiving element 1 in a plan view (when viewed from above the figure). The portion 111 is formed by overlapping (i.e., directly above the light-emitting portion 1〇1 and directly above the a and the portion 111). The 'reflecting surface 961d is disposed at the position of the light-emitting portion, and is reflected. Face 96le is set at Immediately above the light portion 111, the position of the class is 10,000, the reflecting surface 961c is disposed at a position directly above the reflecting surface 961a, and the β 6+ centering surface reflecting surface 961 f is disposed directly above the reflecting surface 961b. The wafer carrier 13 is electrically connected to a specific portion of the conductor layer a and the conductor layer 54 by solder (solder balls) 7 and mounted on the optical waveguide 9 θ. In this case, the 'optical waveguides 9 and 9' are connected. It is closed by the same underfill material 41 as the underfill material *. One portion of the conductor layer 52 is closed by the underfill material 41, and a portion of the conductor layer 52 is not enclosed by the underfill material 41 to be exposed to the outside 49 In the optical waveguide structure 1 of the present embodiment, when the terminals 103 and 105 of the light-emitting element 10 are energized, the light-emitting portion 1 〇1 emits light, and the light emitted upward in FIG. 10 penetrates the underfill material 4 The core portion 94 enters the optical waveguide 9 and is reflected by the reflecting surface 96Id to enter the optical waveguide 9, and advances in the core portion 94 along the longitudinal direction thereof (the middle left direction of FIG. 1), and then stands from the core portion 94. And the part of the transmitted light passes through the reflecting surface 9 6 1 c reflection is 90. The curved portion penetrates the underfill material 41 and the cladding layer 92 downward, and is reflected by the reflecting surface 961a to be bent at 90°, and enters the core portion 94 of the optical waveguide 9 along the longitudinal direction thereof ( Fig. 1 左 center left direction) advances in the core portion 94. On the other hand, the light entering the core portion 94 from the right side in Fig. 1 of the optical waveguide 9 is along the longitudinal direction (left direction in Fig. 10) at the core portion. Advancing in 94, it is reflected by the reflecting surface 96!b to be 90. Bending, penetrating the coating layer % and the underfill material 41 upward, and reflecting 9 经 through the reflecting surface 96lf. The core portion 94, which is bent and enters the optical waveguide 9, advances in the core portion 94 along the longitudinal direction thereof (the left direction in Fig. 1A). Further, the wheel light is reflected by the reflecting surface 96le as the material 4, and the light receiving portion 111 receives a potential difference to output an electrical signal. 'After the end of the core portion 94, the 9'° bend' penetrates the underfill to the bottom. Thereby, it is produced between the terminals 113 and ιι5. The eleventh embodiment: Fig. 1 shows the state of the invention in the figure. Hereinafter, the sixth embodiment and the first embodiment of the optical waveguide structure will be mainly described. 1 &gt; The eleventh embodiment 1 of the optical waveguide structure 1 will be described, and the description of the items ith and the above will be omitted, and the cladding layers 91, 92 and the substrate are bonded to the lower surface of the substrate 2 with a difference of 50 201213360. The optical waveguide 9 composed of the core layer 93 between the electrodes is bonded to the conductor layer 52 of a specific pattern shape on the upper surface of the substrate 2. Further, two optical path converting portions 96a and 96b are formed in the optical waveguide 9. The optical path conversion units 96a and 96b have the same configuration as the optical path conversion unit 96 of the fourth, eighth, and ninth embodiments, and have the same reflection surfaces 961a and 961b as described above. In the optical waveguide 9, the lower reflecting surface 96u of the core layer 93 is located on the left side in FIG. 11, and the portion of the reflecting surface 961b located on the right side in the drawing u forms a core portion 94' to be covered in a portion other than the core layer 93. Department 95. The substrate 2 is insufficiently transmitted to transmit light (transparency), and a through substrate is formed at a position directly above the reflection surfaces 961a and 961b of the substrate 2 (positions directly below the reflection surfaces 96ic and 6 1 f). 2 through the hole Μ. The through holes 22 constitute a light transmitting portion 21 that transmits light. In other words, the through holes 22 serve as light guiding paths for guiding (transmitting) the transmitted light in the thickness direction of the second layer. Further, the lens portion 26β of the ninth embodiment is provided on the upper portion of the two through-holes 22 (light-transmitting portions 21). For example, in the through-hole 22, a transparent material having a relatively low refractive index is filled. Forming a curved concave surface thereon, and filling the concave surface with a transparent second resin material having a higher refractive index than the second resin material, thereby forming the second resin material = playing a convex lens (flat convex lens, double convex The lens of the function of the material is not limited thereto, and only a convex shovel (a plano-convex lens, a lenticular lens, or the like) may be provided in the through hole 22. Brother 51 201213360 26 In the middle or lower, the position of the lens portion of the through hole 22 (light transmitting portion 21) is not limited to the upper portion as shown in the drawing, and may be the through hole U portion. Further, although not shown, a material having a transmission light transmittance of 8% or more, preferably (four) or more, more preferably 95% or more may be filled in the inside (all or part) of the through hole 22. Filling material. Further, in the same manner as in the seventh and eighth embodiments described above, the optical waveguide 23 may be formed inside the through hole 22. A wafer carrier (element) 13 similar to that of the above-described first embodiment is mounted on the upper portion of the optical waveguide 9 of the substrate 2 described above. In the optical waveguide structure i of the present embodiment, when the terminals 103 and 105 of the light-emitting element are energized, the light-emitting portion 1〇1 emits light, and the light emitted upward in the drawing u penetrates the underfill material 4, and The reflecting surface 96 1 d reflects 90 degrees. The core portion 94, which is bent and enters the optical waveguide 9, advances in the core portion 94 along the longitudinal direction thereof (the left direction in Fig. u). Further, the transmitted light emitted from the end portion of the core portion 94 is reflected by the reflecting surface 961c to be 90. Bending, penetrating the underfill material 41 downward, condenses light through the lens portion 26 to concentrate its beam, and the light beam passes through the through hole 22, is reflected by the reflecting surface 961a and is bent at 90°, and enters the optical waveguide 9 The core portion 94 advances in the core portion 94 along the longitudinal direction thereof (the left direction in Fig. 11). On the other hand, light entering the core portion 94 from the right side in Fig. 11 of the optical waveguide 9 advances in the core portion 94 along the longitudinal direction thereof (left direction in Fig. 11), and is reflected by the reflecting surface 961b to be bent at 90°. The light passes through the through hole 22 and is concentrated by the lens portion 26 to concentrate the beam thereof. The light beam penetrates the bottom portion 52 201213360 filling material 41 and is reflected by the reflecting surface 961f to be 9 inches. The core portion 94 of the singularity 9 is along the longitudinal direction of the cymbal (the left chord of the figure, and enters the optical waveguide 94. Further, the light beam from the core portion is directed to the core portion) passes through the reflecting surface 961e. The reflection is 9 inches. The light is transmitted and transmitted (the light is received by the light-receiving portion 4 via the poly-portion material 4, and the electric potential is generated by the potential difference between the terminals 113 and 115 by the bottom of the II.) <Twelfth Embodiment: Fig. 12 &gt And FIG. 12 shows the η implementation of the optical waveguide structure of the present invention. Hereinafter, the optical waveguide structure is merged into the same structure as the above-described 苐1 embodiment. Fig. 12 is a plan view of an optical waveguide structure! Fig. 12 shows an optical waveguide 9 having an optical path conversion portion (optical waveguide structure 1) The branch portion 941 having the core portion 94 branched in the right-angle direction in the middle of the core portion 94. The core portion 942 is formed from the branch portion 941 toward the lower side in Fig. 12. Further, the branch portion 941 is formed to penetrate the optical waveguide 9 in the thickness direction. The through hole 943 has a triangular shape in plan view, and one side is formed by forming an angle (inclination angle) of 45 with respect to the axis of the core portion 94 and the axis of the core portion 942, respectively. Making the core 94 The optical path conversion portion of the optical path curvature functions. That is, the edge is a reflection surface 944 that is partially reflected by the light transmitted from the core portion 94. On the other hand, the remaining side and the core portion of the two sides The axis of 94 is parallel, and the remaining one side is parallel to the axis of the core portion 942. The reflecting surface 944' reflects a portion of the transmitted light from the right side of FIG. 12 to the left side into the core portion 94 53 201213360, and changes the traveling direction to the lower side. Further, the transmitted light that is not reflected by the reflecting surface 944 is linearly advanced in the branch portion gw. Thus, in the branch portion 941, the transmitted light can be branched into two strands. ▲ Further, the reflecting surface 944 can have, for example, a reflective film or a reflective film of a multilayer optical film or a metal film (for example, a neodymium film). Further, although not shown, the through hole 943 may be filled with a filler, in particular, a refractive index and a core portion 94 or a core portion. 942. Different filling materials. Here, when the filling material is not filled in the through hole 943, there is usually a space 1. The reflecting surface 944 is based on the difference between the refractive index of the core portion 94 or the core portion 942 and the refractive index of the air. Nuclear The optical path bender of the portion 94 or the core state. Since the difference between the photosensitive resin composition used in the present invention and the air (four) is relatively A, the allowable range of the angle of total reflection of the reflection s 944 ^ is relatively large. Therefore, by the Snell's law, the tilt angle of the reflection® 944 can be set to an angle at which the light propagating in the core portion % or the core portion 942 is totally reflected. As a result, the reflection accompanying the reflecting surface 944 can be suppressed. The attenuation of the light suppresses the decrease in the light propagation efficiency. Further, the ratio of the transmitted light that branches downward in the branch portion 94'' to the lower portion and the transmitted light that is straightly advanced in the branch portion' is based on the reflecting surface 944 at the core portion 94. The projection image in the case of the direction projection (hereinafter referred to as "reflection of the projection image of the φ state") and the weight φ of the cross section of the core portion 94 vary. Specifically, as long as the projection image of the reflecting surface 944 does not completely cover the cross section of the core portion 94, the branching portion 941 can perform branching of the transmitted light. That is, as long as the overlapping area of the cross-sectional view of the reflecting surface _ and the core portion 94 is smaller than the cross-sectional area of the core portion 94, it may be generated that the branch is not branched and the line is transmitted before the line 54 201213360, Therefore, it is possible to branch at the branch portion 94. , 944 cast image and core section 94 of the cross-section of the heavy borrowing Qiu 94 搀 搀 丨 丨 扯 复 复 复 复 相对 相对 相对 相对 相对 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛 邛As described above, the branching ratio of the branching portion 941 can be set only by setting the area of the through hole 943, and the branching portion 941 can be easily formed. 13 and 14 are plan views showing a twelfth embodiment. The reflecting surface 944 shown in Fig. U is constructed such that its projection image completely covers the cross section of the core portion 94, and the cross-sectional area of the core portion % and the projection image of the reflecting surface 944 and the horizontal portion of the core portion 94 The repeat area of the section is the same. Therefore, all of the transmitted light passing through the core portion 94 at the branch portion 941' shown in Fig. 反射 is reflected by the reflecting surface 944. Further, the core portion 94 shown in Fig. 13 has a widened portion 945 at the branch portion 94. In the widened portion 945, the outer portion of the core portion 94 is expanded by the through hole 943. Specifically, when the widening portion 945 assumes an extension line (outer portion extension line) s of the outer contour of the core portion 94, both end portions of the reflecting surface 944 in the oblique direction are located outside the extension line $. Thereby, the transmission efficiency of the transmitted light of the reflecting surface 944 can be more surely improved for the transmitted light passing through the core portion 94. Further, in this case, in the reflecting surface 944, the vicinity of both end portions in the oblique direction in which the surface precision is low does not contribute to the reflection of the transmitted light, and the transmitted light is reflected in the vicinity of the center having a high surface precision. Therefore, the accuracy of the reflection angle is also increased, and the unnecessary reflection can be suppressed. As a result, it is possible to greatly reduce the leakage of a part of the transmitted light reflected at an unnecessary angle to the covering portion 95. Further, in the reflection surface 944, in the reflection surface 944, when the through hole 943 is formed in the vicinity of both end portions in the slope direction, there is a possibility that the processing accuracy is not lowered, the surface roughness is increased, or the inclination angle of the reflection surface 944 is deviated from the target angle. That is, it is effective to provide the above-described widening portion 945 from the viewpoint of preventing a decrease in transmission efficiency. On the other hand, the core portion 94 shown in Fig. 14 also has the same as the widened portion 945 shown in Fig. 13. The reflecting surface 944 shown in Fig. 14 is constructed such that its projected image covers a portion of the cross section of the core portion 94. With respect to the transmitted light passing through the core portion 94, a portion of the projected image of the reflecting surface 9 and the cross section of the core portion 94 are reflected, and the remaining transmitted light is linearly advanced in this state without being reflected. Therefore, in the branch portion 941 shown in Fig. 14, the transmitted light passing through the core portion 94 can be branched into two strands. Further, in the widened portion 945 shown in Fig. 14, the extension line S of the outline of the core portion 94 is assumed, and one of the both end portions of the inclined surface of the reflecting surface 944 is located outside the extending line s. In this case, as in the case of the above-described FIG. 13, in the reflection surface 944, the vicinity of both end portions of one of the slope directions having a low surface precision does not contribute to the reflection of the transmitted light, mainly in the vicinity of the center having a high surface precision. Reflected transmission of light. Therefore, the accuracy of the reflection angle is also increased, and the unwanted reflection can be suppressed. As a result, it is possible to greatly reduce the occurrence of leakage of one of the reflected light to the covering portion 95. In the above-described first embodiment, the case where the light is reflected by one reflecting surface 944 is described, and the two or more reflecting surfaces 944 may reflect the transmitted light. &lt;Third Embodiment 3: Fig. 15 &gt; Fig. 15 shows a thirteenth embodiment of the optical waveguide structure 1 of the present invention. The optical waveguide structure 1 will be described below, and the description of the same matters as those of the above-described first embodiment and the like will be omitted, and the differences will be mainly described. Fig. 15 is a perspective view of the optical waveguide structure 1. In the optical waveguide 9 (optical waveguide structure 1) having the optical path conversion portion shown in Fig. 15, the core portion % is interrupted at its end by the interruption portion 946 and the cladding portion 95 located on the side of the core portion 94. - Body. Further, by removing a portion of the interrupted portion 946 of the core layer 93 and a portion of each of the cladding layers 9A, 92 on both sides thereof, a triangular recess having a side of the cladding layer 91 as a base is formed. The width of the concave portion is set to be equal to or larger than the width of the core portion 94. Further, one of the two faces corresponding to the oblique side of the concave portion serves as the reflecting surface 961. The reflecting surface 961 is composed of an exposed surface of the coating layer 91, an exposed surface of the interruption portion 946, and an exposed surface of the coating layer 92. Since these exposed surfaces are formed by processing a coating material, when the reflection is formed from 961 t, it is difficult to cause a difference in the processing rate at the time of processing. Therefore, it is difficult to cause processing unevenness, and a reflection having high smoothness is formed. Face 961. When the smoothness of the reflecting surface 96 is changed, the surface accuracy and optical characteristics of the reflecting surface 961 can be improved, so that the reflecting surface can prevent a decrease in transmission efficiency at the time of optical path switching. On the other hand, if the reflecting surface 961 includes the exposed surface of the core portion 94, the difference between the core material and the covering material is easy to occur, and the surface unevenness and optical characteristics of the processing unevenness 'reflection φ 961 are generated.降低In the two sides of the oblique side of the concave portion, the reflecting surface 96丨 may have a function as a reflecting surface on the outside. 57 201213360 &lt;Fourth embodiment: Fig. 2〇&gt; The optical waveguide structure ι〇〇ι of the present invention includes a substrate 1〇〇2, an optical waveguide 1〇〇9 disposed adjacent to the substrate 1002, and conductor layers 1051 and 1〇52 respectively bonded to both surfaces of the optical waveguide 1009. The optical path conversion portion 96 that bends the optical path is an optical path conversion portion 96 that is bonded to the upper surface of the substrate 1002, the light-emitting element 101A, and the electrical element 1〇12. As a constituent material of the substrate 1002, for example, (4) Fat, double-butadiene diamine resin, double-m-butylene bismuth well, &quot;:, 3. Resin, uric acid vinegar resin, poly-cyanuric acid vinegar resin, benzene% butene resin, polyfluorene Resins such as imine, polybenzoic resin, and olefin resin Or a semiconductor material such as germanium, gallium-arsenic, indium-phosphorus, antimony, antimony carbide, antimony or the like. X' these materials may be used singly or in combination of plural kinds. Further, the substrate 1002 may be, for example, A fiber base material (woven fabric, non-woven fabric, woven fabric, knitted fabric, or the like) such as glass fiber or resin fiber is impregnated with the above-mentioned resin material (prepreg or the like). For example, the glass cloth is impregnated with a lyophilized resin. The glass epoxy group can be used as the substrate 1002. The substrate 1〇〇2 of the fiber-containing substrate is relatively thin, the strength is still relatively high, and the thermal expansion rate is low. It is particularly advantageous when the optical waveguide 1009 or the conductor layer (metal layer) 4 is bonded to the substrate 1 〇〇 2. Further, the substrate 1002 may be a laminated body of a plurality of layers. For example, a resin having a different composition (type) may be mentioned. A layer formed by laminating the first layer and the second layer of the material, and a layer (sheet) obtained by impregnating the fiber substrate with a resin material and a layer composed of a resin material. 58 201213360, the layer composition of the layer However, not limited to the thickness of the substrate is not particularly limited 10G2, it is generally preferred as "about, more preferably 5〇~6〇〇 &quot;. Left paw. The substrate ship can be rigid or can be made

We)者。又,亦可具有硬質之基板與具有可撓性之 基板之兩者。於該情形時,光波導廳只要形成於硬質之 基板與具有可撓性之基板之至少一者上即可,亦可橫跨 者而形成》 於基板⑽2之下面接合光波導歷。光波導1〇〇9係 自圖20中下側依序積層包覆層1Q9i、n丨州及包覆 層1〇92而成者,於核心層⑽3形成特定圖案之核心部1〇94 與包覆部1095。 核心部1094之折射率高於包覆部1〇95,又,對包覆層 1091、1092之折射率亦較高。包覆層1〇91及&quot;Μ係構成 分別位於核心部1094之下卹β L_ 之下。卩及上部之包覆部者。藉由上述 構成,核心部10 9 4作A技甘al m 邗為將其外周之全周包圍於包覆部中之 傳輸光1 0 1 8之光程而發揮功能。 於圖2。所示之構成中,:核心層⑽之較下述反射 面1961位於圖2〇中左側之部位形成核心部難,於核心 層1093之其以外之部分形成包覆部1〇95。 作為核心層則之構成材料,可設為藉由活性放射線 (活性能量光線、電子束或χ射線等)之照射,或藉由進 步加熱而改變折射率之材料。作為上述材料之較佳例, 可列舉以含有苯環丁烯系聚合物、降获烯系聚合物(樹脂) 59 201213360 等環烯系樹脂之樹脂組成物作為主材料者,尤佳為含有降 莰烯系聚合物(作為主材料)者。 由上述材料所構成之核心層1093對彎曲等變形之财性 優異,尤其是,即便於重複彎曲變形之情形時,亦難以產 生核心部1094與包覆部1095之剝離、或核心層1〇93與鄰 接之層(包覆層1〇91、1092 )之層間剝離,亦可防止於核 心部1094内或包覆部丨095内產生微龜裂。其結果,可維 持光波導1009之光傳輸性能,而可獲得耐久性優異之光波 導 1 0 0 9。 入,万?枒 劑、折射率調整劑、塑化劑、增黏劑、加強劑、增感劑、 調平劑、消'泡劑、密著助劑及難燃劑等添加劑。抗氧化劑 之添加具有高溫穩定性之提高、耐候性之提高、及光劣化 之抑制之效果。作為上述抗氧化劑,例如可列舉單盼系、 =…系等紛系 '或芳香族胺系者。又,藉由添加 塑化劑、增黏劑、加強劑,亦可進一步增大對f曲之耐性。 之代表之添加劑之含有率(…以上 ^時為合計)相對於核心層則之構成材料整體,較 量:?〜40重量%左右,更佳為3〜3。重量%左右。若該 里-乂 ’則無法充分發揮添加劑之功能,若 :據添加劑之種類或特性,而產生於核心部i。二傳2 先(傳輸A 1G18)之穿透㈣降低 : 不穩定等之虞。 _茶化不良、折射率 作為核心層10 9 3之开^占古,土 — , ώ 七成方法,可列舉塗佈法Μ乍為塗 60 201213360 ' 佈法’可列舉塗佈核心層形成用組成物(清漆等)並使其 硬化(固化)之方法、塗佈具有硬化性之單體組成物並使 其硬化(固化)之方法。又,亦可採用塗佈法以外之方法、 例如接合另外製造之片材之方法。 使用遮罩’對以上述方式所得之核心層1 〇 9 3選擇性地 fl?、射活性放射線’使所欲形狀之核心部1094圖案化。 作為用於曝光之活性放射線,可列舉:可見光、紫外 光、紅外光、雷射光等活性能量光線或電子束、χ射線等。 電子束例如可以50〜2〇〇〇 KGy左右之照射量而照射。 於核心層1093中,經活性放射線照射之部位之折射率 發生變化(根據核心層丨〇93之材料,有折射率增大之情形 與減少之情形),與未經活性放射線照射之部位之間產生折 射率之差。例如’核心層1〇93之經活性放射線照射之部位 成為包覆部1095,未經照射之部位成為核心部1〇94。又, 亦存在與之相反之情形。包覆部1095之折射率與包覆層 1091、1092之折射率大致相等。 又,亦存在以特定之圖案對核心層1093照射活性放射 線後進订加熱,藉此形成核心部1㈣之情形。II由❹ &amp;加熱步驟’可進—步增大核心部1094與包覆部1〇95之 折射率差,故而較佳。再者’關於該原理等’以下將作詳 細闊述。 *料所形成之核心部1094之圖案形狀’並無特別限 =’:為直線狀、具有f曲部之形狀、異形、具有光程之 支卩〇流部或交又部之形狀、聚光部(寬度等減少之 61 201213360 部分)或光擴散部(寬度等增大之部分)、或組合有該等令 之2種以上之形狀等任意者。本發明之特徵在於,藉由执 定活性放射線之照射圖案,可容易地形成任意形狀之曰核Γ 部 1094 。 關於光波導1009之各部之構成材料及核心部1094之 形成方法等,以下將作詳細闌述。 與光波導刚9之下面接合之導_ i()5i 合之導體層1052、以及與甚炻1ΛΛ〇 祓 八_在彳及與基板1002之上面接合之導體層 刀別圓案化成特定之形狀’而構成所欲之配線或電 路。作為導體層1〇51〜1053之構成材料,例如可分別列舉 銅、銅系合金、鋁、鋁系合金等We). Further, it may have both a rigid substrate and a flexible substrate. In this case, the optical waveguide hall may be formed on at least one of the hard substrate and the flexible substrate, or may be formed by averaging the optical waveguide on the lower surface of the substrate (10) 2. The optical waveguide 1〇〇9 is formed by sequentially laminating the cladding layer 1Q9i, n丨zhou and the cladding layer 1〇92 from the lower side in FIG. 20, and forms a core portion of the specific pattern 1〇94 and the package in the core layer (10)3. Cover 1095. The refractive index of the core portion 1094 is higher than that of the cladding portion 1〇95, and the refractive index of the cladding layers 1091 and 1092 is also high. The cladding layers 1〇91 and &quot;Μ are formed under the shirts β L_ below the core portion 1094, respectively.卩 and the upper cladding. According to the above configuration, the core portion 10 9 functions as an optical path of the transmitted light 1 0 18 surrounded by the entire circumference of the outer periphery. In Figure 2. In the configuration shown, it is difficult for the core layer (10) to form a core portion at a portion on the left side in Fig. 2A from the reflection surface 1961, and a cladding portion 1〇95 is formed in a portion other than the core layer 1093. The constituent material of the core layer may be a material which is irradiated with active radiation (active energy ray, electron beam or xenon ray) or whose refractive index is changed by further heating. As a preferable example of the above-mentioned material, a resin composition containing a benzene cyclobutene-based polymer or a cycloolefin-based resin such as a olefin-based polymer (resin) 59 201213360 is used as a main material, and it is particularly preferable to contain a lowering agent. A terpene polymer (as a main material). The core layer 1093 composed of the above-described materials is excellent in the property of deformation such as bending, and in particular, even in the case of repeated bending deformation, it is difficult to cause peeling of the core portion 1094 and the covering portion 1095, or the core layer 1〇93 Peeling between the layers of the adjacent layers (cladding layers 1〇91, 1092) prevents microcracking in the core portion 1094 or in the cladding portion 095. As a result, the optical transmission performance of the optical waveguide 1009 can be maintained, and the optical waveguide excellent in durability can be obtained. In, million? Additives such as bismuth agent, refractive index modifier, plasticizer, tackifier, reinforcing agent, sensitizer, leveling agent, antifoaming agent, adhesion aid and flame retardant. The addition of the antioxidant has an effect of improving high-temperature stability, improvement in weather resistance, and suppression of photo-deterioration. As the antioxidant, for example, a single-demand system, a =-system, or the like, or an aromatic amine-based one can be mentioned. Further, by adding a plasticizer, a tackifier, and a reinforcing agent, the resistance to f can be further increased. The content of the additive represented by the additive (in total, when ^ is the total), and the composition of the core layer as a whole, the comparison: ~40% by weight or so, more preferably 3~3. About weight%. If the 乂-乂 ’ does not fully utilize the function of the additive, it is generated in the core i depending on the type or characteristics of the additive. Second pass 2 first (transmission A 1G18) penetration (four) reduction: instability and so on. _ Poor tea, refractive index as the core layer 10 9 3 open ^ Zhan ancient, soil -, ώ 70% of the method, can be cited as coating method 涂 coating 60 201213360 'clothing' can be cited for coating core layer formation A method of hardening (curing) a composition (varnish or the like), a method of applying a curable monomer composition, and hardening (curing). Further, a method other than the coating method, for example, a method of joining separately produced sheets may be employed. The core portion 1094 of the desired shape is patterned by using the mask 'to selectively extract the core layer 1 〇 9 3 obtained in the above manner, and to emit active radiation'. Examples of the active radiation used for exposure include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, xenon rays, and the like. The electron beam can be irradiated, for example, at an irradiation dose of about 50 to 2 〇〇〇 KGy. In the core layer 1093, the refractive index of the portion irradiated with the active radiation changes (according to the material of the core layer 丨〇93, the case where the refractive index is increased and decreased), and the portion irradiated with the active radiation The difference in refractive index is produced. For example, the portion of the core layer 1〇93 irradiated with the active radiation becomes the cladding portion 1095, and the portion not irradiated becomes the core portion 1〇94. Also, there is a contradiction. The refractive index of the cladding portion 1095 is substantially equal to the refractive indices of the cladding layers 1091, 1092. Further, there is a case where the core layer 1093 is irradiated with active radiation in a specific pattern and then heated in order to form the core portion 1 (four). It is preferable that the heating step of the ❹ &amp; heating step can further increase the refractive index difference between the core portion 1094 and the cladding portion 1 〇 95. Further, 'this principle and the like' will be described in detail below. * The pattern shape of the core portion 1094 formed by the material is not particularly limited = ': linear, with the shape of the f-curved portion, the profiled shape, the branching portion having the optical path or the shape of the intersection, and the condensing Any one of the parts (the portion where the width is reduced by 61, 201213360), the portion where the light is diffused (the portion where the width is increased, etc.), or the shape of the two or more types in which the order is combined. The present invention is characterized in that the nucleus ridge portion 1094 of an arbitrary shape can be easily formed by setting the irradiation pattern of the active radiation. The constituent materials of the respective portions of the optical waveguide 1009 and the method of forming the core portion 1094 will be described in detail below. The conductor layer 1052 which is bonded to the lower surface of the optical waveguide 9 and the conductor layer 102 which is bonded to the upper surface of the substrate 1002 are rounded into a specific shape. 'And constitute the desired wiring or circuit. Examples of the constituent material of the conductor layers 1 to 51 to 1053 include copper, a copper alloy, aluminum, an aluminum alloy, and the like.

裡兔屬材枓。導體層1051 〜《厚度並無特職定,通常分別較佳為3〜m _ 左右,更佳為5〜70 &quot;ni左右Q 金屬it層:51〜⑼3係例如藉由金屬^之接合(接著)、 Γ〇5 1〇Ί案化例如可使用㈣ '印刷、遮蔽等方法。 以兀件1010於其下面側具有發光部ιι〇卜與一對端 子1103 ' 11 〇5。發光邻1 ] 〇】你认山 x、 門。1 ☆發先°P 1101位於端子_與端子1105之 θ二:而子1103、1105間通電,則發光部1101發光。 再者,發光元件1〇1〇之發The rabbit is a scorpion. Conductor layer 1051 ~ "thickness is not specified, usually preferably about 3~m _, preferably 5~70 &quot;ni around Q metal it layer: 51~(9)3 is bonded by metal Then, Γ〇5 1 can be used, for example, (4) 'printing, masking, etc. can be used. The element 1010 has a light-emitting portion ιι and a pair of terminals 1103 '11 〇5 on its lower side. Luminous neighbor 1] 〇] You recognize the mountain x, the door. 1 ☆ The first time °P 1101 is located at the terminal _ and the terminal 1105 θ 2: while the sub-1103, 1105 is energized, the light-emitting portion 1101 emits light. Furthermore, the light-emitting element 1〇1〇

Pfc ^ ^ Μ . 除了由1個發光點所構 數個發光點Γ為集合有複數個發光點者。作為集合有複 點為⑽:;了列舉發光點配置成列狀(例如Μ 之數)者、或複數個發光點不規則地 62 201213360 : (random )配置者等。下述受光元件之受光部亦同樣。 發光元件1〇1〇係以其等之端子11〇3、1105分別與導體 層1053之部位1531、1532接合(電連接)之方式農載於 基板1002上。 電氣元件(電子電路元件)1012例如由半導體元件(半 導體晶片)所構成。電氣元件1012之功能並無特別限定, 作為一例,可列舉構成用以驅動發光元件1〇1〇之電路者。 該電氣元件1 〇 12於其下面側具有2個端子1123、1丨25。 電氣元件1012係以其等之端子1123、1125分別與導體 層1053之部位1532、1533接合(電連接)之方式裝載於 光波導1009上。 發光元件1010及電氣元件1012係藉由底部填充材料 1004而封閉包含其等之端子11〇3、11〇5、ιΐ23 ' &quot;Μ之下 部。藉此,於發光元件1〇1〇及電氣元件1〇12、與光波導 W09之間未形成空隙部,而由底部填充材料1〇〇4所封閉。 進,’發光元件1010及電氣元件1〇12係藉由封閉材料1〇〇6 覆^亚封閉其整體(外表面)。如此般,發光元件1〇1〇及 電氣元件1 〇 12為其整體被封閉,尤其是發光部11 〇 1未露出 至外4而經封閉之結構,故可保護其免受污染、損傷、氧 化劣化4 ’有助於提高電子零件之可靠性。 底部填充材们004係由實質上穿透自發光部11〇1發出 之光(傳輸光1〇18)之材料所構成,較佳為由透明 所構成。 作為底部填充材料1_之構成材料,較佳為具有絕緣 63 201213360 性之樹脂材料,例如可列舉環氧樹脂、酚樹脂、胺甲酸乙 酯樹脂、聚醯亞胺樹脂等。 又’作為封閉材料1 006之構成材料,較佳為具有絕緣 性之樹脂材料,例如可列舉環氧樹脂、酚樹脂 '降莰烯樹 脂、矽樹脂等。 如圖20所示’於光波導1〇〇9中形成貫通於其厚度方 向之貫通孔(through hole或via hole ) 1008。於該貫通孔 1008中填充有導電材料(例如銅、銅系合金 '鋁、鋁系合 金等各種金屬材料),形成導體柱(導體部)1〇81。經由該 導體柱1081,而使導體層105ι與導體層ι〇52之特定部位 彼此電連接。即,對發光元件1〇1〇及電氣元件1〇12之各 多而子之通電可藉由光波導1009之下面側之導體層1〇51與 基板1002之上面側之導體層1〇53 (部位1531、1533 )而 進行。再者,端子1105與端子1123導通,該等與接地側連 接。 光波導1009具有使核心部1094之光程彎曲之光程轉 換部1096。該光程轉換部1〇96設置於核心部ι〇94與下述 導光程1024之連接部’即核心部1 〇94之圖2〇中右端部且 導光程1024之下端部之部位。藉此,可有效地確實地使光 程彎曲。 §亥光程轉換部1096係由反射傳輸光1 〇 1 8之至少一部 分之反射面(反射鏡)1961所構成。該反射面1961設置於 發光部1101之正下方位置。 反射面1961相對於光波導1009之光程,即核心部1〇94 64 201213360 之長邊方向大致呈45。傾斜,具有反射傳輸光1〇18之大半 (例如90%以上)之功能。 上述光程轉換部1096係藉由去除(缺損)光波導1〇〇9 之一部分,例如使剖面形成三角形之凹部,並將其丨個傾 斜面用作反射面1961者。反射面1961例如亦可具有如多 層光學薄膜或金屬薄膜(例如鋁蒸鍍膜)之反射膜或反射 增加膜。又,雖未圖示,但於光程轉換部1〇96之凹部亦可 填充具有對傳輸光1 〇 1 8之透光性之填充材料。 於圖示之構成中,反射面1961 (光程轉換部丨〇96)橫 跨包覆層1091、核心層1〇93及包覆層1〇92而形成,亦可 僅形成於核心層1093内。又,亦可使用反射鏡零件,例如 稜鏡、鏡面反射鏡、矽反射鏡等。 於基板1002之發光部U01之正下方位置形成貫通基板 1002之貫通孔1〇22。貫通孔1〇22之剖面形狀並無特別限 定,於本實施形態中設為圓形(參照圖25&gt;作為其他形狀, 例如可列舉槽圓形、長圓形、矩形(四角形)、六角形、異 形等。 、 於貫通孔1022之内周面形成由與上述導體層1〇5&quot;目 同之導電材料(金屬材料)構成之層(導體部1〇〇3)。藉由 料體部1003,可於基板·之厚度方向(以下,亦簡稱 為「厚度方向」)傳送電氣信號等。再者,於圖Μ中,導 體部1003係遍及貫通孔1〇22 b 之内周面之全周(環狀)而 形成,亦可於周方向部分地形成。 又’導體部1003相對於基板1〇〇2大致垂直地形成。 65 201213360 但是,並不限於此,導體邦 髖。卩1003亦可相對於基板1002呈 特定角度傾斜而形成,或者導體邱 乂有等體。P 1003之一部分亦可發生 變形(彎曲、彎曲、分支等)。 作為導體部1003之形成方法,例如可列舉:於貫通孔 1022之内面接合(接著)金W法、於貫通孔1022之 内面藉由金屬鑛敷'蒸鍍、濺鍍等方法形成金屬層之方法、 及塗佈含有金屬填充料之金屬膏並進行力4 (燒成、硬化 等)形成金屬層之方法等。 導體部1003之上端部與導體層1053之部位1532電連 接’導體部aw之下端部與導體層1G52之特定部位電連 接。藉此,可經由導體部1〇〇3,於厚度方向之不同位置所 形成之導體層1052、1053間進行電氣信號之授受。 又,貫通孔1022内之較上述導體部1〇〇3更内側之部 分構成使傳輸光1G18透光之透光部。即,該部分成為於基 板1002之厚度方向對傳輸光1〇18進行導光(傳輸)之導 光程1024。換言之,導體部1〇〇3係以包圍導光程1〇24之 周圍之方式形成。藉此,可於限制大小(内徑)之貫通孔 1022内有效地配置導光程ι〇24與導體部1〇〇3。 又,導光程1024相對於基板1002大致垂直地形成。 但是,並不限於此,導光程1〇24亦可相對於基板ι〇〇2呈 特定角度傾斜而形成,或者導光程1〇24之一部分亦可發生 變形(彎曲、分支等)。 貫通孔1022内之較上述導體部1003更内側之部分可 為空洞’較佳為於該部分填充有具有透光性之填充材料, 66 201213360 :即傳輸光1018之穿透率為80%以上、較佳為9〇%以上、更 佳為95%以上之材料的填充材料。該填充材料可設為與核 心層H)93之核心部1094相同之材料。藉此,可容易形成 導光程(核心部)1024,且可獲得與下述核心部1094相同 之優點。又,該填充材料亦可設為與核心層1〇93之包覆部 1095相同之材料、或與包覆層1〇91或ι〇92相同之材料。 於貫通孔1022内,導體部10〇3與導光程1〇24接觸, 但並不限於此,例如亦可為如導體部1〇〇3與導光程1〇24 經由未圖示之中間層(接著層'絕緣層等)而接近之構成。 貫通孔1022之内徑並無特別限定,通常較佳為〇〇5〜 2 mm左右,更佳為〇.!〜〇 $ mm左右。 又,導光程(核心部)1024之外徑並無特別限定,通 常較佳為0.005〜〇.3 111111左右,更佳為0.〇2〜〇15111111左右。 如上述般,藉由使於厚度方向延伸之導體部1〇〇3與導 光程1024鄰接而形成,可以i個貫通孔1〇22,於厚度方向 傳輸電氣信號與光信號。 於本實施形態之光波導結構體1〇〇1中,若於導體層 1051與導體層1〇53之部位1531之間通電,則導體層⑺幻 與端子1105經由導體部1003及部位ι532而導通,故成為 對發光元件1 01 〇之端子丨1 〇3、u 05間通電,發光部11 〇 1 點亮。藉由發光部1101之點亮朝圖2〇中下方發出之傳輪光 1018穿透底部填充材料1〇〇4,通過貫通孔ι〇22内之導光 程1024 (核心部1024),經反射面1961反射呈9〇。彎曲, 進入光波導1009之核心部1〇94,一面於與包覆部(包覆層 67 201213360 1091、1092及側方(圖20中前後)之包覆部ι〇95 )之界 面重複反射,一面沿著其長邊方向(圖20中左方向)於核 心部1 0 9 4内前進。 〈第15實施形態:圖21&gt; 於圖21中表示本發明之光波導結構體1〇〇1之第Η實 施形態。以下’對該光波導結構體丨00丨進行說明,關於與 上述第14實施形態相同之事項(構成、運作等),省略其 說明,以不同點為中心加以說明。 關於本實施形態之光波導結構體10〇1,基板1〇〇2之透 光部(貫通孔1022附近)之構成與上述第14實施形態不 同’其他與第14實施形態相同。即,於基板ι〇〇2之貫通 孔1022内形成與上述相同之導體部1〇〇3與導光程ι〇24, 於貫通孔1022之下部設置可使傳輸光1〇18聚光或擴散之 透鏡部1026。 即,於導光程1024之下端(傳輸光1〇18之出射側) 設置由凸透鏡(準確而言為平凸透鏡)所構成之透鏡部 1026。 藉此,自發光部1101朝圖21中下方發出之傳輸光1〇18 穿透底部填充材料1 〇〇4後,通過導光程i〇24,經透鏡部 1026聚光而集中其光束(beam),該光束經反射面196丨反 射呈90彎曲,進入光波導1 〇〇9之核心部1094,沿著其長 邊方向(圖21中左方向)於核心部1〇94内前進。 藉由設置上述透鏡部1026,可獲得更加明確(sharp) 之傳輸光,而可獲得更加優異之光傳輸特性。 68 201213360 再者, 於該情形時 1018 者。 透鏡部1026亦可為能夠擴散傳輸光 ,只要使用凹透鏡即可。 構成透鏡部刪之透鏡之材料只要使用折射率與導光 程職不同之材料即可。藉由使透鏡材 低於導光程1024之折粉老 _ ^ ’率,可將透鏡部1 〇 2 6之功能設定 為聚光透鏡或擴散透鏡之任_者。 又’透鏡部1026之設置位置並不限於圖21所示之位 置,例如亦可為導光程1〇24(貫通孔ι〇22)之中途或上端、 或者其他之部位、例如核心部1〇94之入射側端部或出射側 端部。 &lt;第16實施形態:圖22&gt; 於圖22中部表示本發明之光波導結構體1〇〇1之第16 實施形態。以下,對該光波導結構體1〇〇1進行說明,關於 與上述第14實施形態相同之事項(構成、運作等),省略 其說明’以不同點為中心加以說明。 關於本實施形態之光波導結構體1〇〇1,基板1〇〇2之透 光。卩(貫通孔1022附近)之構成與上述第14實施形態不 同’其他與第14實施形態相同。即,於基板1〇〇2之貫通 孔1022内形成與上述相同之導體部ι〇〇3,於其内側形成垂 直光波導1023。 垂直光波導1023係由核心部1 〇24、與包圍該核心部 1024之外周之包覆部1〇25所構成。核心部1024之折射率 高於包覆部1025。藉由在貫通孔1022内形成如上所述之垂 直光波導1023,與上述第14實施形態之導體部丨〇24相比, 69 201213360 可進一步降低由漏光等引起之光量損失,而進一步提高傳 輸光101 8之傳輸特性。 核心部10 2 4之構成材料及形成方法可與核心部1 〇 9 4 相同。或者’核心部10 2 4亦可使用與上述1實施形態中所 述之具有透光性之填充材料相同者。包覆部1 〇 2 5之構成材 料可與包覆部1095或包覆層1091、1092相同。 〈第17實施形態:圖23 &gt; 於圖23中表示本發明之光波導結構體1之第丨7實施 形態。以下,對該光波導結構體1 〇〇 1進行說明,關於與上 述第14〜第16實施形態相同之事項(構成、運作等),省 略其說明’以不同點為中心加以說明。 本實施形態之光波導結構體100 1除了設置透鏡部丨〇26 以外,與上述第16實施形態相同。即’於基板1 〇 〇 2之貫 通孔1022内形成與上述相同之導體部i〇〇3與垂直光波導 1023,於貫通孔1〇22之下部設置可使傳輸光1〇18聚光或 擴散之與上述相同之透鏡部1026。 關於設置透鏡部1026之效果、構成透鏡部1〇26之透 鏡材料、透鏡部1026之設置位置等,與上述第16實施形 態中所述相同。 &lt;第18實施形態:圖24&gt; 於圖24中表示本發明之光波導結構體1〇〇1之第μ實 施形態。以下,對該光波導結構體1〇〇1進行說明,關於與 上述第14〜第17實施形態相同之事項(構成、運作等), 省略其έ兒明’以不同點為中心加以說明。 70 201213360 關於本實施形態之光波導結構體1〇〇1,基板1〇〇2之透 光部(貝通孔1022附近)之構成與上述第17實施形態不 同,其他與第17實施形態相同。即,如圖27所示,基板 1002之貫通孔丨022之橫剖面形狀為結合圓形部1222與矩 形。P 1224而成之形狀(異形),於圓形部丨222内插入垂直 光波導1023 (或者亦可為導光程1〇24),於矩形部KM内 插入導體部则。導體部刚之上端部及下端部分別與導 體層1053之部位1532及導體層1〇52電連接。 上述構成具有以下優點:藉由分別於圓形部丨222與矩 形部1224上預先設定橫剖面積,可更 導則與導體部_之體積(體積比)。又,亦丄僅 於圓形部1222之周方向之必要方向形成導體部ι〇〇3之優 點。 〈第19實施形態:圖32〜圖34&gt; .如圖32〜圖34所示,本發明之光波導結構體2001具 有:基板2002、形成於基板膽之下部之光波導2_、 使光波導2GG9之光程彎曲之光程轉換部2_ (反射面 2961)、裝載於基板議上之發光元件胸及電子電路元 件2〇12、以及形成於基板2〇〇2之上面之導體層2〇〇5。 作為基板2002之構成材料,例如可列舉:環氧樹脂、 酚?曰、雙順丁烯二醯亞胺樹脂、雙順丁烯二醢亞胺_三口井 ϋ t、二讀脂、$氰尿酸§旨樹脂、聚三聚《酿樹脂、 ^ _树月曰、聚醯亞胺、聚苯并°咢唑樹脂、降莰烯樹脂等 η月曰材料’或石夕、鎵_石申、銦_破、鍺、碳化石夕、石夕錄等半導 71 201213360 體材料。·^ 亦可混合複數種而使 又’该專材料可單獨使用 用。 維二基板2002例如亦可為於玻璃纖維、樹脂纖維等纖 土 1哉布、不織布、織物、編織物等)中含浸如上所 二:樹脂材料而成者(預浸體等)。例如,於玻璃布中含浸 秘月日而成者稱作玻璃環氧基板,可將上述者 ^上述含有纖維基材之基板·即便相對較薄,強㈣ n又,熱膨張率亦較低,故於基板2002上接合光波導 2009或導體層(金屬層)之情形時尤為有利。 八又,基板20〇2亦可為複數層之積層體。例如可列舉將 分別由組成(種類)不同之樹脂材料所構成之第第2 層積層而成者、及將於上述纖維基材中含浸樹脂封料而成 之層(片材)' 與由樹脂材料所構成之層積層而成者。再者, 積層體之層構成當然並不限定於此。 基板2002之厚度並無特別限定,通常較佳為5〇心 4 mm左右,更佳為1〇〇以m〜15mm左右,進而更佳為 150 /zm〜1.2 mm左右。基板2〇〇2可為硬質(rigid)者, 亦可為具有可撓性(f]exible )者。當然亦可為併有各特性 者0 又,關於基板2002,於本實施形態中,由於傳輸光2〇18 穿透基板2002,故基板2002設為傳輸光2018之穿透率為 80%以上、較佳為90%以上、更佳為95%以上者。如此般, 藉由以具有對傳輸光2018之透光性之材料構成基板2〇〇2 本身(基板2002之全部或一部分)’即,將基板2〇〇2設為 72 201213360 貫夤上透明之透明基板’而使基板2002之發光部2i〇i之 正下方部分亦可不形成下述貫通孔2〇25而構成透光部 2024。經由§亥透光部2024,而使發光元件2010之發光部 21〇1與光波導2009之核心部2094 (光程轉換部2〇96)光 學連接。 於基板2002之下面接合光波導2〇〇9。於圖示之構成 中,於基板2002之下面直接接合光波導2〇〇9(光波導2〇的 與基板2002鄰接)’但並不限於此,亦可經由至少【層之 中間層而形成。作為該中間^,可以任意目的形成,例如 可列舉接著層、導體層(配線圖案)、絕緣層、或含有該等 之2層以上之積層體。 作為其構成材料,例如可列舉 接著劑、酚樹脂系接著劑、氮 一醯亞胺樹脂系接著劑等。尤 由具有助溶活性之材料所構成 絕緣性。 其中,作為接著層,例如可使用如接合片材之片材, 舉:環氧系接著劑、丙烯酸系 氰酸S旨樹脂系接著劑、順丁烯 。尤其是’為抗氧化等,較佳為 。該接著層較佳為具有電氣Pfc ^ ^ Μ . In addition to the number of light-emitting points composed of one light-emitting point, there are a plurality of light-emitting points. As a set, the complex point is (10):; the light-emitting points are arranged in a column shape (for example, the number of Μ), or a plurality of light-emitting points are irregularly 62 201213360 : (random) configurator or the like. The light receiving unit of the light receiving element described below is also the same. The light-emitting element 1〇1〇 is implanted on the substrate 1002 so that the terminals 11〇3 and 1105 thereof are joined (electrically connected) to the portions 1531 and 1532 of the conductor layer 1053, respectively. The electrical component (electronic circuit component) 1012 is composed of, for example, a semiconductor component (a semiconductor wafer). The function of the electric component 1012 is not particularly limited, and as an example, a circuit constituting the light-emitting element 1〇1〇 can be cited. The electric component 1 〇 12 has two terminals 1123 and 1 丨 25 on the lower side thereof. The electric component 1012 is mounted on the optical waveguide 1009 such that the terminals 1123 and 1125 thereof are joined (electrically connected) to the portions 1532 and 1533 of the conductor layer 1053, respectively. The light-emitting element 1010 and the electrical component 1012 are closed by the underfill material 1004 to the terminals 11〇3, 11〇5, ιΐ23' &quot; Thereby, a gap portion is not formed between the light-emitting element 1〇1〇 and the electric element 1〇12 and the optical waveguide W09, and is closed by the underfill material 1〇〇4. In the light-emitting element 1010 and the electrical component 1〇12, the whole (outer surface) is closed by the sealing material 1〇〇6. In this way, the light-emitting element 1〇1〇 and the electrical component 1〇12 are entirely enclosed, and in particular, the light-emitting portion 11〇1 is not exposed to the outer portion 4 and is closed, so that it can be protected from contamination, damage, oxidation. Deterioration 4' helps to improve the reliability of electronic components. The underfill material 004 is composed of a material that substantially penetrates the light (transmission light 1〇18) emitted from the light-emitting portion 11〇1, and is preferably made of transparent. The constituent material of the underfill material 1_ is preferably a resin material having an insulating property of 2012 20126060, and examples thereof include an epoxy resin, a phenol resin, a urethane resin, and a polyimide resin. Further, as a constituent material of the sealing material 1 006, a resin material having an insulating property is preferable, and examples thereof include an epoxy resin, a phenol resin, a decylene resin, and an anthracene resin. As shown in Fig. 20, a through hole or via hole 1008 penetrating in the thickness direction is formed in the optical waveguide 1〇〇9. The through hole 1008 is filled with a conductive material (for example, various metal materials such as copper or copper alloy 'aluminum, aluminum alloy, and the like) to form a conductor post (conductor portion) 1〇81. The conductor layer 1051 and the specific portion of the conductor layer ι 52 are electrically connected to each other via the conductor post 1081. That is, the energization of each of the light-emitting element 1〇1〇 and the electrical element 1〇12 can be performed by the conductor layer 1〇51 on the lower surface side of the optical waveguide 1009 and the conductor layer 1〇53 on the upper surface side of the substrate 1002 ( The parts 1531, 1533) are carried out. Further, the terminal 1105 is electrically connected to the terminal 1123, and the terminals are connected to the ground side. The optical waveguide 1009 has an optical path conversion portion 1096 that bends the optical path of the core portion 1094. The optical path converting portion 1〇96 is provided at a portion where the core portion 194 is connected to the light guiding portion 1024, that is, the connecting portion of the light guiding path 1024, that is, the right end portion of the core portion 1A, 94, and the lower end portion of the light guiding path 1024. Thereby, the optical path can be effectively and surely bent. The holographic path conversion unit 1096 is constituted by a reflection surface (mirror) 1961 that reflects at least a part of the transmitted light 1 〇 18. The reflecting surface 1961 is disposed at a position directly below the light emitting portion 1101. The optical path of the reflecting surface 1961 with respect to the optical waveguide 1009, that is, the longitudinal direction of the core portion 1〇94 64 201213360 is substantially 45. It has a function of reflecting half of the transmitted light 1〇18 (for example, 90% or more). The optical path conversion unit 1096 removes (defects) a part of the optical waveguide 1〇〇9, for example, a concave portion having a triangular cross section, and a tilted surface thereof is used as the reflecting surface 1961. The reflecting surface 1961 may have, for example, a reflective film or a reflection-increasing film such as a multi-layer optical film or a metal film (e.g., an aluminum vapor-deposited film). Further, although not shown, the concave portion of the optical path converting portion 1A 96 may be filled with a filling material having a light transmissive property to the transmitted light 1 〇 18. In the configuration shown in the figure, the reflecting surface 1961 (optical path converting portion 丨〇96) is formed across the cladding layer 1091, the core layer 1〇93, and the cladding layer 〇92, or may be formed only in the core layer 1093. . Also, mirror parts such as cymbals, specular mirrors, 矽 mirrors, etc. can be used. A through hole 1〇22 penetrating through the substrate 1002 is formed at a position directly below the light emitting portion U01 of the substrate 1002. The cross-sectional shape of the through-holes 1 to 22 is not particularly limited, and is circular in the present embodiment (see FIG. 25). Examples of other shapes include a grooved circle, an oblong shape, a rectangular shape (a square shape), and a hexagonal shape. A layer (conductor portion 1〇〇3) composed of a conductive material (metal material) similar to the conductor layer 1〇5&quot; is formed on the inner circumferential surface of the through hole 1022. By the material portion 1003, An electric signal or the like can be transmitted in the thickness direction of the substrate (hereinafter also referred to as "thickness direction"). Further, in the figure, the conductor portion 1003 is spread over the entire circumference of the inner circumferential surface of the through hole 1 22b ( It is formed in a ring shape, and may be partially formed in the circumferential direction. Further, the conductor portion 1003 is formed substantially perpendicularly to the substrate 1〇〇2. 65 201213360 However, the present invention is not limited thereto, and the conductor is a hip. The substrate 1002 is formed to be inclined at a specific angle, or the conductor has a body. The P 1003 may be deformed (bending, bending, branching, etc.). As a method of forming the conductor portion 1003, for example, a through hole may be used. Within 1022 Bonding (subsequent) gold W method, a method of forming a metal layer by a method such as vapor deposition or sputtering of a metal ore on the inner surface of the through hole 1022, and applying a metal paste containing a metal filler to perform a force 4 (baking) a method of forming a metal layer, etc. The upper end portion of the conductor portion 1003 is electrically connected to the portion 1532 of the conductor layer 1053. The lower end portion of the conductor portion aw is electrically connected to a specific portion of the conductor layer 1G52. Thereby, the conductor portion can be connected. 1〇〇3, an electrical signal is transmitted between the conductor layers 1052 and 1053 formed at different positions in the thickness direction. Further, a portion of the through hole 1022 that is further inside than the conductor portion 1〇〇3 is configured to transmit light 1G18. The light transmissive portion, that is, the portion is a light guiding path 1024 for guiding (transmitting) the transmitted light 1〇18 in the thickness direction of the substrate 1002. In other words, the conductor portion 1〇〇3 surrounds the light guiding path. The periphery of 1〇24 is formed. Thereby, the light guiding path ι 24 and the conductor portion 1〇〇3 can be effectively disposed in the through hole 1022 of the limited size (inner diameter). Further, the light guiding path 1024 is opposed to The substrate 1002 is formed substantially vertically. However, The present invention is not limited thereto, and the light guiding path 1 〇 24 may be formed at a certain angle with respect to the substrate ι 2 , or a part of the light guiding path 1 〇 24 may be deformed (bending, branching, etc.). The portion of the inner portion of the conductor portion 1003 may be a hollow portion. Preferably, the portion is filled with a light-transmitting filler material. 66 201213360: that is, the transmittance of the transmitted light 1018 is 80% or more, preferably 9 A filler of 5% or more, more preferably 95% or more of the material. The filler may be made of the same material as the core portion 1094 of the core layer H) 93. Thereby, the light guiding path (core portion) 1024 can be easily formed, and the same advantages as the core portion 1094 described below can be obtained. Further, the filler may be made of the same material as the cladding portion 1095 of the core layer 1〇93 or the same material as the cladding layer 91 or 91. The conductor portion 10〇3 is in contact with the light guiding path 1〇24 in the through hole 1022. However, the conductor portion 10〇3 is not limited thereto, and may be, for example, the conductor portion 1〇〇3 and the light guiding path 1〇24 via the middle not shown. The layer (subsequent layer 'insulating layer, etc.) is close to the structure. The inner diameter of the through hole 1022 is not particularly limited, and is usually preferably about 5 to 2 mm, more preferably about !. Further, the outer diameter of the light guiding path (core portion) 1024 is not particularly limited, but is preferably about 0.005 to 111.3 111111, more preferably about 0. 〇 2 to 〇 15111111. As described above, by forming the conductor portion 1〇〇3 extending in the thickness direction adjacent to the light guiding path 1024, the through holes 1〇22 can be used to transmit electrical signals and optical signals in the thickness direction. In the optical waveguide structure 1A1 of the present embodiment, when the conductor layer 1051 is electrically connected to the portion 1531 of the conductor layer 1〇53, the conductor layer (7) is electrically connected to the terminal 1105 via the conductor portion 1003 and the portion ι532. Therefore, the terminals 丨1 〇3 and u 05 of the light-emitting element 101 are energized, and the light-emitting portion 11 〇1 is turned on. The passing light 1018 emitted from the lower portion of FIG. 2B by the lighting of the light-emitting portion 1101 penetrates the underfill material 1〇〇4, passes through the light guiding path 1024 (core portion 1024) in the through-hole 〇22, and is reflected. The surface 1961 reflects 9 turns. Bending, entering the core portion 1〇94 of the optical waveguide 1009, and repeatedly reflecting at the interface with the cladding portion (the cladding layer 67201213360 1091, 1092 and the side portion (front and rear in FIG. 20)) One side advances in the core portion 1 0 9 4 along the longitudinal direction thereof (the left direction in Fig. 20). <Fifteenth embodiment: Fig. 21> Fig. 21 shows a third embodiment of the optical waveguide structure 1〇〇1 of the present invention. In the following, the optical waveguide structure 丨00丨 will be described, and the same matters (configuration, operation, and the like) as those of the above-described fourteenth embodiment will be omitted, and the differences will be mainly described. In the optical waveguide structure 10A1 of the present embodiment, the configuration of the light transmitting portion (near the through hole 1022) of the substrate 1A2 is the same as that of the above-described fourteenth embodiment, and is the same as the fourteenth embodiment. That is, the same conductor portion 1〇〇3 and light guide ι 24 are formed in the through hole 1022 of the substrate ι 2, and the lower portion of the through hole 1022 is provided to condense or diffuse the transmitted light 1〇18. Lens portion 1026. That is, a lens portion 1026 composed of a convex lens (accurately, a plano-convex lens) is provided at the lower end of the light guiding path 1024 (the outgoing side of the transmitted light 1 〇 18). Thereby, the transmitted light 1 〇 18 emitted from the light-emitting portion 1101 toward the lower side in FIG. 21 penetrates the underfill material 1 〇〇 4, passes through the light guiding path i 〇 24, and condenses the light through the lens portion 1026 to concentrate the light beam (beam The light beam is bent at 90 by the reflection surface 196, enters the core portion 1094 of the optical waveguide 1 〇〇9, and advances in the core portion 1〇94 along the longitudinal direction thereof (the left direction in Fig. 21). By providing the above-described lens portion 1026, more transparent transmission light can be obtained, and more excellent optical transmission characteristics can be obtained. 68 201213360 Furthermore, in this case 1018. The lens portion 1026 may be capable of diffusing and transmitting light as long as a concave lens is used. The material constituting the lens of the lens portion may be a material having a refractive index different from that of the light guiding member. The function of the lens portion 1 〇 26 can be set to any one of a condensing lens or a diffusion lens by making the lens material lower than the aging rate of the light guiding path 1024. Further, the position at which the lens portion 1026 is disposed is not limited to the position shown in FIG. 21, and may be, for example, the middle or upper end of the light guiding path 1〇24 (through hole ι〇22), or other parts, for example, the core portion 1〇 The incident side end or the exit side end of 94. &lt;Thirteenth Embodiment: Fig. 22&gt; A sixteenth embodiment of the optical waveguide structure 1〇〇1 of the present invention is shown in the middle of Fig. 22 . In the following, the optical waveguide structure 1A will be described. The same matters (configuration, operation, etc.) as those of the above-described fourteenth embodiment will be omitted. The optical waveguide structure 1〇〇1 of the present embodiment is transparent to the substrate 1〇〇2. The configuration of 卩 (near the through hole 1022) is the same as that of the above-described fourteenth embodiment, and is the same as the fourteenth embodiment. That is, the same conductor portion ι 3 is formed in the through hole 1022 of the substrate 1 〇〇 2, and the vertical optical waveguide 1023 is formed inside. The vertical optical waveguide 1023 is composed of a core portion 1 〇 24 and a cladding portion 1 〇 25 surrounding the outer periphery of the core portion 1024. The core portion 1024 has a higher refractive index than the cladding portion 1025. By forming the vertical optical waveguide 1023 as described above in the through hole 1022, 69 201213360 can further reduce the amount of light loss caused by light leakage or the like, and further improve the transmitted light, compared with the conductor portion 24 of the above-described fourteenth embodiment. Transmission characteristics of 101 8. The constituent material and formation method of the core portion 10 2 4 can be the same as the core portion 1 〇 9 4 . Alternatively, the core portion 10 2 4 may be the same as the light-transmitting filler described in the above-described first embodiment. The constituent material of the covering portion 1 〇 25 can be the same as the covering portion 1095 or the cladding layers 1091 and 1092. <17th embodiment: Fig. 23 &gt; Fig. 23 shows a seventh embodiment of the optical waveguide structure 1 of the present invention. In the following, the optical waveguide structure 1 〇〇 1 will be described, and the same matters (configuration, operation, and the like) as those of the above-described 14th to 16th embodiments will be omitted. The optical waveguide structure 100 1 of the present embodiment is the same as the above-described sixteenth embodiment except that the lens portion 丨〇26 is provided. That is, the same conductor portion i3 and vertical optical waveguide 1023 are formed in the through hole 1022 of the substrate 1 〇〇 2, and the lower portion of the through hole 1 〇 22 is provided to condense or diffuse the transmitted light 1 〇 18 The lens portion 1026 is the same as described above. The effect of providing the lens portion 1026, the lens material constituting the lens portion 1A26, the installation position of the lens portion 1026, and the like are the same as those described in the above-described sixteenth embodiment. &lt;Eighth Embodiment: Fig. 24&gt; Fig. 24 shows a first embodiment of the optical waveguide structure 1〇〇1 of the present invention. In the following, the optical waveguide structure 1 〇〇 1 will be described, and the same matters (configuration, operation, and the like) as those of the above-described 14th to 17th embodiments will be omitted. In the optical waveguide structure 1〇〇1 of the present embodiment, the configuration of the light transmitting portion (near the beacon hole 1022) of the substrate 1〇〇2 is different from that of the seventeenth embodiment, and the other configuration is the same as that of the seventeenth embodiment. That is, as shown in Fig. 27, the cross-sectional shape of the through hole 022 of the substrate 1002 is a combination of the circular portion 1222 and the rectangular shape. In the shape of the P 1224 (shaped), the vertical optical waveguide 1023 (or the light guiding path 1 〇 24) is inserted into the circular portion 222, and the conductor portion is inserted into the rectangular portion KM. The upper end portion and the lower end portion of the conductor portion are electrically connected to the portion 1532 of the conductor layer 1053 and the conductor layer 1〇52, respectively. The above configuration has an advantage that the volume (volume ratio) of the conductor portion can be further controlled by setting the cross-sectional area in advance on the circular portion 222 and the rectangular portion 1224, respectively. Further, the advantage of the conductor portion ι 3 is formed only in the necessary direction in the circumferential direction of the circular portion 1222. <19th Embodiment: FIG. 32 to FIG. 34> As shown in FIG. 32 to FIG. 34, the optical waveguide structure 2001 of the present invention has a substrate 2002, an optical waveguide 2_ formed on the lower portion of the substrate, and an optical waveguide 2GG9. The optical path conversion unit 2_ (reflection surface 2961), the light-emitting element chest and the electronic circuit element 2〇12 mounted on the substrate, and the conductor layer 2〇〇5 formed on the substrate 2〇〇2 . Examples of the constituent material of the substrate 2002 include epoxy resin and phenol. Bismuth, bis-butenylene diimide resin, bis-n-butenylene diimide _ three wells t, second reading grease, $ cyanuric acid § resin, polytrimerization resin, ^ _ tree moon 曰, Polyamidene, polybenzopyrazole resin, norbornene resin, etc. η 曰 曰 material ' or Shi Xi, gallium _ Shi Shen, indium _ broken, 锗, carbonized stone eve, Shi Xilu and other semi-conducting 71 201213360 Body material. ·^ It is also possible to mix a plurality of types so that the special material can be used alone. The two-dimensional substrate 2002 may be, for example, a fiber material such as glass fiber or resin fiber, a non-woven fabric, a woven fabric, a woven fabric or the like, which is impregnated with the above resin material (prepreg or the like). For example, a glass epoxy substrate is obtained by impregnating a glass cloth with a secret moon, and the above-mentioned substrate containing the fiber substrate can be made relatively thin, strong (four) n, and the thermal expansion rate is low. Therefore, it is particularly advantageous when the optical waveguide 2009 or the conductor layer (metal layer) is bonded to the substrate 2002. Eighth, the substrate 20〇2 may also be a laminated body of a plurality of layers. For example, a layer in which a second layer composed of a resin material having a different composition (type) is laminated, and a layer (sheet) in which a resin material is impregnated into the fiber substrate is used, and a resin is used. The layered material is composed of layers. Further, the layer constitution of the laminate is of course not limited to this. The thickness of the substrate 2002 is not particularly limited, and is usually preferably about 5 mm, preferably about 1 mm to about 15 mm, and more preferably about 150/zm to 1.2 mm. The substrate 2〇〇2 may be rigid or may have flexibility (f]exible). Of course, in the case of the substrate 2002, in the present embodiment, since the transmitted light 2〇18 penetrates the substrate 2002, the substrate 2002 has a transmittance of 80% or more of the transmitted light 2018. It is preferably 90% or more, more preferably 95% or more. In this manner, the substrate 2〇〇2 itself (all or part of the substrate 2002) is formed by a material having light transmissivity to the transmitted light 2018. That is, the substrate 2〇〇2 is set to 72 201213360. In the transparent substrate 2, the portion directly under the light-emitting portion 2i〇i of the substrate 2002 may be formed without forming the through-holes 2〇25 described below. The light-emitting portion 21〇1 of the light-emitting element 2010 is optically connected to the core portion 2094 (optical-path conversion unit 2〇96) of the optical waveguide 2009 via the transparent portion 2024. The optical waveguide 2〇〇9 is bonded to the lower surface of the substrate 2002. In the configuration shown in the drawing, the optical waveguide 2〇〇9 is directly bonded to the lower surface of the substrate 2002 (the optical waveguide 2 is adjacent to the substrate 2002). However, the present invention is not limited thereto, and may be formed via at least the intermediate layer of the layer. The intermediate layer can be formed for any purpose, and examples thereof include an adhesive layer, a conductor layer (wiring pattern), an insulating layer, or a laminate including two or more layers. The constituent material thereof is, for example, a binder, a phenol resin-based adhesive, a nitrogen-imide-mine resin-based adhesive, or the like. Insulation is especially composed of a material having a solubilizing activity. Here, as the adhesive layer, for example, a sheet of a bonding sheet can be used, and an epoxy-based adhesive, an acrylic cyanate S-based resin-based adhesive, and a butene can be used. In particular, it is preferably an antioxidant or the like. The adhesive layer preferably has electrical

70 # m左右。70 # m or so.

2091、核心層2093及包覆層 形成特定圖案之核心部2 33及圖34中下侧依序積層包覆層 覆層2092而成者,於核心層2093 2094與包覆部2095 (參照圖33、 73 201213360 圖 3 4 ) 〇 核心部2094之折射率古 209 i、_之折射率亦較Γ二 〇95,又’對包覆層 干乃較円。包覆層2〇91及 分別位於核心部2094之下部及上部之包覆部者。藉由上: 構成,核心部2094作為將其外周之全 傳輸光20 1 8之光程而發揮功能。 α 、、包覆部中之 二料,可設為藉—線 (活性㈣先線、電子束或χ射線等)之照射,或藉由進 ^加熱而改變折射率之材料。作為上述材料之較佳例, 可列舉以含有苯環丁稀系聚合物、降获烯系聚 等環烯系樹脂之樹脂組成物作為主材料者,二广曰) 莰烯系聚合物(作為主材料)者。 U為3有降 由上述材料所構成之核心層對“等變形 優異,尤其是即便於重複f曲變形之情形 =…與包覆部2095之剝離、或核心層…= 之層(包覆層2〇91、2〇92)之層間剝離,亦可防止二:接 部2〇94内或包覆部2095内產生微龜裂。h果 光波導2_之光傳輸性能, ° I維持 2009。 」人性優異之光波導 ,^於核&quot;&quot;層2G93之構成材料中,例如亦可含有浐4 匕Μ、折射率調整劑、塑化劑、增黏劑、加強劑、几氧 解劑、消泡劑、密著助劑及難燃劑等 曰感:、 :::具有高溫穩定性之提高、耐候性之提高、 之效果。作為上述抗氧化劑,例如可列舉單紛系、 74 201213360 雙酚系、三酚系等酚系、或芳香族胺系者。 入’糟由添加 a化劑、増黏劑、加強劑,亦可進一步増大對彎曲之耐性。 上述抗氧化劑所代表之添加劑之含有率(於2種以 之情形時為合計)相對於核心層之構成材料整體= ,為0.5〜40重量%左右,更佳為3〜3〇重量%左右。若該 量過少,則無法充分發揮添加劑之功能,若量過多,則有 根據添加劑之種類或特性,而產生於核心部2〇94中傳輸之 光(傳輸光2018)之穿透率的降低、圖案化不良、折射率 不穩定等之虞。 作為核心層2G93之形成方法,可列舉塗佈法。作為塗 佈法,可列舉塗佈核心層形成用組成物(清漆等)並使其 硬化(固化)之方法、及塗佈具有硬化性之單體組成物並 使其硬化(固化)之方法。又,亦可採用塗佈法以外之方 法,例如接合另外製造之片材之方法。 使用遮罩’對以上述方式所得之核心層2 〇 9 3選擇性地 照射活性放射線,而使所欲形狀之核心部2〇94圖案化。 作為用於曝光之活性放射線,可列舉可見光、紫外光、 紅外光、雷射光等活性能量光線或電子束、χ射線等。電子 束例如可以50〜2000 KGy左右之照射量而照射。 於核心層2093中,經活性放射線照射之部位之折射率 發生變化(根據核心層2093之材料,有折射率增大之情形 與減少之情形),與未經活性放射線照射之部位之間產生折 射率之差。例如,核心層2093之經活性放射線照射之部位. 成為包覆部2954,未經照射之部位成為核心部2094。又, 75 201213360 亦存在與之相反之情形。包覆部2095之折射率與包覆層 2091、20 92之折射率大致相等。 又’亦存在以特定之圖案對核心層2093照射活性放射 線後’進行加熱’藉此形成核心部2094之情形。藉由附加 該加熱步驟,可進一步增大核心部2094與包覆部2095之 折射率差,故而較佳。再者’關於該原理等’以下將作詳 細闡述。 作為所形成之核心部2094之圖案形狀,並無特別限 定’可為直線狀、具有彎曲部之形狀、異形、具有光程之 分支部、合流部或交叉部之形狀、聚光部(寬度等減少之 刀)或光擴散部(寬度等增大之部分)、或組合有該等中 之2種以上之形狀等任意者。本發明之特徵在於,藉由設 定活性放射線之照射圖案,可容易地形成任意形狀之核心 部 2 0 9 4 〇 關於光波導2009之各部之構成材料及核心部2〇94之 形成方法等,以下將作詳細闡述。 上述光波導2009具有使核心部2094之光程彎曲之光 程轉換部2096。該光程轉換部2096係由反射傳輸光(自發 光部2 1 0 1出射之光)2〇丨8之至少一部分之反射面(反射鏡) 2961所構成。該反射面2961設置於發光部2101之正下方 位置。 反射面2961相對於光波導2009之光程,即核心部2〇94 之長邊方向(圖32及33中之x方向、圖34中之前後方向) 大致呈45。傾斜,具有將自發光部21〇1發出之傳輸光2〇18 76 201213360 : 之大半(例如90%以上)反射之功能。 述光程轉換# 2096係藉由去除(缺損)光波導2〇〇9 之刀,例如使剖面形成三角形之凹部(參照圖33 ),並 將其!個傾斜面用作反射面洲者。反射面2961例如亦 可具有如多層光學薄膜或金屬薄膜(例如銘蒸鐘膜)之反 射膜或反射增加膜。作為去除光波導2009之一部分之方 法,可列舉切削、雷射光之照射等方法。 又,雖未圖示,但亦可於光程轉換部2〇96之凹部填充 填充材料、尤其是折射率與核心部2〇94不同之填充材料(封 閉材料)、及金屬材料之填充材料(封閉材料)。再者,反 射面2961並不限於全反射者,例如亦可為如半反射鏡、分 色鏡等般反射傳輸光則之—部分,並穿透剩餘部分者。 於該情形時’絲轉換部廳具有作為將光程分離為2個 方向(圖33中左方向與下方向)之分光器之功能。上述反 射面2961之光學特性可根據傳輸光2〇18之光程設計而適 當設定。 再者,於圖示之構成中,反射面2961(光程轉換部Μ%) 橫跨包覆層2091、核心層2093及包覆層2〇92而形成,但 並不限於此’例如亦可僅形成於核心層2093内。 核心部2094之形成及光程轉換部2〇96之形成可在於 基板2002上裝載下述發光元件2〇1〇等(定位而設置)1 或後,於任一情形時均可容易且準確地把握其形成位置。 即’藉由下述定位手段2033可特定發光部21〇1相對於其 板2002之位置,故於基板2002上之光波導2009中形成二 77 201213360 心部2094或光程轉換部2096時,可容易使核心部2094之 形成位置(曝光部位)或光程轉換部2096之形成位置與對 應於發光部2101之位置(發光部2101之正下方位置)一 致0 於基板2002之上部形成對基板2002之上面及至少! 個側面開放之2個凹部2003及2004。於該等凹部2003及 2004分別插入(設置)發光元件2〇1〇及電子電路元件2〇 12。 發光元件2010於其下面側具有發光部21〇1,於上面侧 具有一對端子2103、2105 (亦可進而具有其他端子)。若於 兩端子2103、2105間通電,則發光部21〇1發光而出射傳 輸光2018。 再者,發光元件2010之發光部21〇1除了由丨個發光 點所構成者以外,亦可為集合有複數個發光㈣。作為集 合有複數個發光點者,例如可列舉發光點配置成列狀(例 如發光點為1x4個、1x12個)或行列狀(例如發光點為nxm 個:η、爪為2以上之整數)纟、或複數個發光點不規則地 — dom)配置者等。下述受光元件之受光部亦同樣。 發光元件2010係以其發光部21〇1與凹部2〇〇3之底面 (下面)2030接合(抵接)之方式設置於凹部内。再 者’發光部2101可沿著圖32中上下方向而配置複數個。 電子電路元件2012例如由半導體元件(半導體晶片) 所構成。該電子電路_2G12於其上面側具有複數個端子 (端子2123、2125)°再者,電子電路元件2〇12除了端子 2123 ' 2125以夕卜,亦可進而具有其他端子。 78 201213360 可列之功能並無特別限定,作為一例, 般,;=用以驅動發光元件之電路者。又,如下述 7、有雙光元件之情形時’可列 W來自該U元件之輪出錢之功能者。 a 於光波導結構體2001 之兩者之情形時,電子電路 之功能者。 具有發光元件2010與受光元件 元件2012可設為具有上述兩者 再者,於本說明書中,將發光元件2〇1〇、受光元件、 電子電路元件2〇12、其他各種元件、或複合有該等中之2 種以上之元件稱作「電氣元件」或簡稱為「元件」。 又,發光το件2010'受光元件及電子電路元件2〇12並 不限於分別由不同元件所構成之情形,亦可為使該等中之 至少2個連結或一體化(i個晶片)而&amp;之構成(複合元件 於基板2002,設置了決定上述電氣元件(發光元件2〇ι〇 及電子電路元件2012)之設置位置、尤其是相對於基板2〇〇2 之位置的定位手段2033、2043。以下,依序對該定位手段 2033、2043進行說明。 於基板2002之上部形成對基板2002之上面開放之凹 部2003及2004。凹部2003對圖32中右方及下方開放,於 凹°卩2003之邊緣部即圖32中左方及上方具有與基板2002 之上面之階差。該階差中,於圖32中左方形成接觸面203卜 於圖32中上方形成接觸面2032。接觸面2031及2032分別 相對於凹部2003之底面2030而垂直豎立,接觸面2〇31、 2032彼此形成直角。藉由該接觸面203 1及2032而構成定 79 201213360 位手段(發光元件用)2033。再者’於定位手段2033中亦 可包含底面2030 ’藉此,亦可進行基板2002之厚度方向之 定位。 發光元件2010藉由使其下面與凹部2〇〇3之底面2〇3〇 抵接’且使發光元件2 0 10之相鄰(正交)之2個側面分別 與接觸面2031及2032抵接(押接)而設置於凹部2003内。 藉此,發光元件2010藉由接觸面2〇31而規制χ方向之位 置’且藉由接觸面2032而規制γ方向之位置。即,發光元 件2〇1〇進行對X方向及γ方向之兩者(二維方向)之定位。 如此般,可確實地進行發光元件2〇1〇之相對於基板2〇〇2 之面方向(二維方向)之定位,並且該操作只要相對於經 固定之基板2002,使發光元件201〇與凹部2〇〇3接近,朝 圖32中左上方向移動(相對移動),而分別抵接接觸面“η 及2032即可,故可極其簡單地進行該定位操作。 尤其是,不僅於核心部2094之長邊方向(χ方向),而 且於核心部2094之寬度方向(γ方向)亦進行定位,故即 便於例如核心部2094之寬度較小之情形(微細之光電路) 時,亦可準確地使發光元件·之發光部2ι〇ι之位置與 核心部2094重疊(俯視時)。 藉由上述定位手段2033,可決定發光元件2〇10 (發夫 部2101 )相對於基板2〇〇2位 直具亦決定相對於形成% 基板細2之下面的光波導2_之核心部職的位置,违 而,光程轉換部雇(反射面2961 )相對於核心部_ 之位置關係已有特定’故亦有決定相對於光程轉換部讀 80 201213360 (反射面2961 )之位置之情形。 即’如圖32所示’定位手段2G33係以俯視時發光元 件2010之發光部2101之位置與光程轉換部廳(反射面 2961 )之位置重疊之方汰碓a 且之万式進仃定位。藉此,反射面2961位 於發光部2HH之正下方,可準確地形成如設計之光程。 凹。P 2003之深度較佳為與發光元件2㈣之厚度大致 相等或大於發光元件2〇1〇&gt;ίΐώ: # , U之厚度。措此,可使發光元件2010 不自凹部2003突屮J:卜如:ι 犬出,、上〇ρ而收納於凹部2〇〇3内。 凹。Ρ 2004對圖32中左方及下方開放,於凹部2〇〇3之 邊緣部即圖32中左右及上方具有與基板·2之上面之階 差。違階差中’於圖32中右方形成接觸面2041,於圖32 中上方形成接觸面2〇42。接觸面2〇41及2〇42分別相對於 凹口P 2GG4之底面2G4G而垂直g立,接觸面2Q41、2〇42彼 此亦形成直角。藉由該接觸面2〇41及2〇42而構成電子電 路元件2012之疋位手段(電子電路元件用)。再者, 於疋位手叙2043中亦可包含底面2〇4〇,藉此,亦可進行基 板2002之厚度方向之定位。 電子電路元件2012藉由使其下面與凹部2〇〇4之底面 2040抵接,且使電子電路元件2012之相鄰(正交)之2個 側面分別與接觸面2〇41及2()42抵接(押接)而設置於凹 # 2004内。藉此,電子電路元件2012藉由接觸面2041而 見制方向之位置,且藉由接觸面2042而規制Y方向之位 置。即,電子電路元件2〇12進行對X方向及γ方向之兩者 (一維方向)之定位。如此般,可確實地進行電子電路元 81 201213360 件2012相對於基板2〇〇2之面方向(二維方向)之定位 並且该操作只要相對於經固定之基板2〇〇2使電子電路元 2012與凹部_接近,朝圖32中右上方向移動 &lt;相^ 動)而分別與接觸面2〇4丨及2〇42抵接 ώ又π』極其簡 單地進行該定位操作。 藉由上述定位手段2043,可決定電子電路元件2〇丨2(端 子2123、2125)相對於基板2〇〇2之位置,其亦決定相對於 藉由定位手段2033而定位之發光元件2〇1〇之位置,進而 亦有決定相對於光程轉換部2096 (反射面2961 )之位置之 情形。 如此般’藉由準確決定電子電路元件2〇12與發光元件 2010之位置關係,可於形成(圖案化)下述導體層時, 尤其是形成架設於電子電路元件2〇12與發光元件2〇1〇之 間之部位2052時,可使其以更加準確之形狀及位置而形成。 凹部2004之深度較佳為與電子電路元件2〇12之厚度 大致相等,或者大於電子電路元件2〇12之厚度。藉此,可 使電子電路元件2012不自凹部2004突出其上部而收納於 凹部2004内。 再者,本實施形態之定位手段2033、2〇43由於電氣元 件之下面亦與底面2030、2040抵接,故亦進行對於基板2〇〇2 之厚度方向(分別與X方向及γ方向正交之方向)之定位。 因此,本貫施形態之定位手段係可準確地進行三維方向之 定位者。 又,本實施形態之定位手段係直接形成於基板2002者 82 201213360 (接觸面 2031、2032、2041、204?、伯* 2 0 4 2 ) ’但並不限於此,亦可 為相對於基板2002而伴捭石叙本 ^ ^ ^ 叩俅符不動者、尤其是相對於基板2〇〇2 而固定設置其他構件者。作為該例,可列舉固定於基板 2002,且具有電氣元件可抵接之接觸面之定位構件。 又’於本發明中,定位丰 疋位子&amp;亦可為使電氣元件僅定位 於X方向及Y方向中夕/工 V ., 肀之任一方向者。於該情形時,基板2002 之厚度方向之定位可進行亦可不進行。 於基板2〇02之上面形成有導體層(金屬層)2005。該 導體層2005圖案化成特定之拟肚二址上、 之元狀,而構成所欲之電氣配線 或電氣電路。 於本實施形態中,導體層聽具有部位205 1、2052 及则。部位20M橫跨基板職之上面與電子電路元件 2012之上面而形成,盘端+ ”鲕于2125電連接。部位2052橫跨 基板2002之上面、發井开杜, 牛2010之上面及電子電路元件 助之上面而形成,分別與端子咖及2125電連接。部 位2053橫跨基板職之上面與發光元件·之上面而形 成,與端子2105電連接。部朽wci上 ^ 。卩位205 1或2〇53例如與接地連 接。 作為導體層2005之構成鉍Μ ν , ^ ^ 再战材枓,分別可列舉例如銅、銅 糸合金、在呂、I呂系合金、今、a &lt;人 金金系合金、焊料等各種金屬 材料。又,根據基板2002之椹士从企丨/ 楫成材料(例如由半導體材料 構成之基板2 0 0 2 ),亦可使用植 ·»忧用鎢、鎢合金等。 導體層2005之厚度並盔姓… “,、特別限定,通常較佳為2〜2002091, the core layer 2093 and the cladding layer form a core portion 2 33 of a specific pattern and the lower layer sequential cladding layer coating layer 2092 in FIG. 34, and the core layer 2093 2094 and the cladding portion 2095 (refer to FIG. 33) , 73 201213360 Figure 3 4) The refractive index of the core part 2094 is 209 i, the refractive index of _ is also higher than that of Γ 〇 95, and 'dry to the coating layer. The cladding layer 2〇91 and the cladding portions located at the lower portion and the upper portion of the core portion 2094, respectively. With the above configuration, the core portion 2094 functions as an optical path for transmitting the entire light 20 1 8 on the outer periphery. The two materials in the α and the coating portion may be irradiated by a line (active (four) precursor, electron beam or xenon ray, etc.) or a material whose refractive index is changed by heating. As a preferable example of the above-mentioned material, a resin composition containing a benzene cyclobutane-based polymer or a cycloolefin-based resin such as a reduced olefin-based polymer as a main material, and a terpene-based polymer (as The main material). U is 3, and the core layer composed of the above materials is excellent in "equivalent deformation, especially in the case of repeated f-bending deformation = stripping with the covering portion 2095, or layer of the core layer ... = (cladding layer) 2 〇 91, 2 〇 92) layer peeling, can also prevent two: micro-cracks in the joint 2 〇 94 or in the cladding portion 2095. h optical transmission 2 _ optical transmission performance, ° I maintained 2009. The optical waveguide with excellent humanity, such as the core material of the layer 2G93, may also contain, for example, 浐4 匕Μ, a refractive index modifier, a plasticizer, a tackifier, a reinforcing agent, a polyoxygenating agent. , Defoamer, adhesion aid and flame retardant, etc.: ::: Improves high temperature stability, improves weather resistance, and has the effect. Examples of the antioxidant include a phenol system such as a single compound, a 74 201213360 bisphenol system, a trisphenol type, or an aromatic amine system. Adding a chemical, a viscous agent, and a reinforcing agent can further increase the resistance to bending. The content of the additive represented by the above-mentioned antioxidant (in total of the two types) is about 0.5 to 40% by weight, more preferably about 3 to 3% by weight, based on the total amount of the constituent material of the core layer. If the amount is too small, the function of the additive cannot be sufficiently exhibited. If the amount is too large, the transmittance of the light (transmission light 2018) generated in the core portion 2〇94 is lowered depending on the type or characteristics of the additive. Poor patterning, unstable refractive index, and the like. As a method of forming the core layer 2G93, a coating method can be mentioned. The coating method includes a method of applying a composition for forming a core layer (such as a varnish) and curing (curing), and a method of applying a curable monomer composition and curing (curing) the composition. Further, a method other than the coating method, for example, a method of joining separately produced sheets may be employed. The core layer 2 〇 9 3 obtained in the above manner is selectively irradiated with active radiation using a mask, and the core portion 2〇94 of the desired shape is patterned. Examples of the active radiation used for exposure include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, xenon rays, and the like. The electron beam can be irradiated, for example, at an irradiation dose of about 50 to 2000 KGy. In the core layer 2093, the refractive index of the portion irradiated with the active radiation changes (in the case where the refractive index is increased or decreased according to the material of the core layer 2093), and the refractive portion is irradiated with the portion irradiated with the active radiation. The difference between the rates. For example, the portion of the core layer 2093 that is irradiated with active radiation becomes the cladding portion 2954, and the portion that is not irradiated becomes the core portion 2094. Also, 75 201213360 also has the opposite situation. The refractive index of the cladding portion 2095 is substantially equal to the refractive index of the cladding layers 2091, 20 92. Further, there is a case where the core layer 2093 is irradiated with an active radiation in a specific pattern and then heated to form the core portion 2094. By adding this heating step, the difference in refractive index between the core portion 2094 and the cladding portion 2095 can be further increased, which is preferable. Further, 'this principle and the like' will be explained in detail below. The pattern shape of the formed core portion 2094 is not particularly limited to a shape that can be linear, has a curved portion, an irregular shape, a branch portion having an optical path, a shape of a merging portion or an intersection portion, and a condensing portion (width, etc.) Any of the reduced knives or the light-diffusing portion (the portion where the width or the like is increased) or a combination of two or more of the shapes. According to the present invention, by arranging the irradiation pattern of the active radiation, the core portion of the arbitrary shape can be easily formed, and the constituent materials of the respective portions of the optical waveguide 2009 and the method of forming the core portion 2〇94 can be easily formed. It will be elaborated. The optical waveguide 2009 has a path conversion unit 2096 that bends the optical path of the core portion 2094. The optical path conversion unit 2096 is composed of a reflection surface (mirror) 2961 that reflects at least a part of the transmitted light (light emitted from the spontaneous light portion 2 1 0 1) 2〇丨8. The reflecting surface 2961 is disposed at a position directly below the light emitting portion 2101. The optical path of the reflecting surface 2961 with respect to the optical waveguide 2009, that is, the longitudinal direction of the core portion 2〇94 (the x direction in FIGS. 32 and 33, and the front and rear directions in FIG. 34) is substantially 45. The tilting function has a function of reflecting the transmitted light 2 〇 18 76 201213360 : which is emitted from the light-emitting portion 21 〇 1 (for example, 90% or more). In the optical path conversion # 2096, the blade of the optical waveguide 2〇〇9 is removed (defectively), for example, the cross section is formed into a triangular recess (see Fig. 33), and this is added! The inclined faces are used as reflectors. The reflecting surface 2961 may, for example, also have a reflective film or a reflection increasing film such as a multilayer optical film or a metal film (e.g., a vapor film). As a method of removing a part of the optical waveguide 2009, methods such as cutting and irradiation of laser light can be cited. Further, although not shown, the recessed portion of the optical path conversion unit 2〇96 may be filled with a filler, in particular, a filler (closed material) having a refractive index different from that of the core portion 2〇94, and a filler of the metal material ( Closure material). Further, the reflecting surface 2961 is not limited to the total reflection, and may be, for example, a portion such as a half mirror or a dichroic mirror that reflects the transmitted light and penetrates the remaining portion. In this case, the 'wire conversion unit' has a function as a spectroscope that separates the optical path into two directions (the left direction and the lower direction in Fig. 33). The optical characteristics of the above-mentioned reflecting surface 2961 can be appropriately set in accordance with the optical path design of the transmitted light 2〇18. Further, in the configuration shown in the drawing, the reflecting surface 2961 (optical path converting portion Μ%) is formed across the cladding layer 2091, the core layer 2093, and the cladding layer 2〇92, but is not limited thereto. Only formed in the core layer 2093. The formation of the core portion 2094 and the formation of the optical path conversion portion 2〇96 may be performed by mounting the following light-emitting elements 2〇1〇 or the like (positioned) 1 or later on the substrate 2002, and in any case, can be easily and accurately Grasp the position of its formation. That is, the position of the light-emitting portion 21〇1 relative to the plate 2002 can be specified by the positioning means 2033 described below. Therefore, when the second hole 20120460 core portion 2094 or the optical path conversion portion 2096 is formed in the optical waveguide 2009 on the substrate 2002, It is easy to make the formation position (exposure portion) of the core portion 2094 or the formation position of the optical path conversion portion 2096 coincide with the position corresponding to the light-emitting portion 2101 (the position immediately below the light-emitting portion 2101), and form the opposite substrate 2002 on the upper portion of the substrate 2002. Above and at least! Two recesses 2003 and 2004 with two sides open. The light-emitting elements 2〇1〇 and the electronic circuit elements 2〇12 are inserted (arranged) in the recesses 2003 and 2004, respectively. The light-emitting element 2010 has a light-emitting portion 21〇1 on its lower side and a pair of terminals 2103 and 2105 on the upper surface side (and may have other terminals). When the two terminals 2103 and 2105 are energized, the light-emitting portion 21〇1 emits light to emit the transmitted light 2018. Further, the light-emitting portion 21〇1 of the light-emitting element 2010 may be a plurality of light-emitting devices (four) in addition to the light-emitting portions. As a plurality of light-emitting points, for example, light-emitting points are arranged in a row (for example, 1×4 or 1×12 light-emitting points) or in a matrix (for example, nxm light-emitting points: η, and claws are integers of 2 or more). , or a plurality of illuminating points irregularly - dom) configurator, and the like. The light receiving unit of the light receiving element described below is also the same. The light-emitting element 2010 is provided in the concave portion such that the light-emitting portion 21〇1 is joined (contacted) to the bottom surface (lower surface) 2030 of the concave portion 2〇〇3. Further, the light-emitting portion 2101 can be arranged in plural numbers along the vertical direction in Fig. 32. The electronic circuit component 2012 is composed of, for example, a semiconductor element (semiconductor wafer). The electronic circuit _2G12 has a plurality of terminals (terminals 2123, 2125) on its upper side. Further, the electronic circuit components 2〇12 may have other terminals in addition to the terminals 2123' to 2125. 78 201213360 The functions that can be listed are not particularly limited. As an example, the circuit is used to drive the light-emitting elements. Further, as described below, in the case of a bi-optical element, the function of the money from the U-component of the U-element can be listed. a The function of the electronic circuit in the case of both of the optical waveguide structures 2001. The light-emitting element 2010 and the light-receiving element element 2012 may have both of the above, and in the present specification, the light-emitting element 2〇1〇, the light-receiving element, the electronic circuit element 2〇12, other various elements, or a combination thereof may be used. Two or more elements are referred to as "electrical components" or simply as "components". Further, the light-emitting elements 2010's light-receiving elements and electronic circuit elements 2'12 are not limited to being composed of different elements, and at least two of them may be connected or integrated (i wafers). The configuration (the composite component is provided on the substrate 2002, and positioning means 2033, 2043 for determining the position of the above-mentioned electrical component (light-emitting component 2" and the electronic circuit component 2012), particularly the position relative to the substrate 2? Hereinafter, the positioning means 2033 and 2043 will be described in order. The concave portions 2003 and 2004 which are open to the upper surface of the substrate 2002 are formed on the upper portion of the substrate 2002. The concave portion 2003 is opened to the right and below in Fig. 32, and is concave. The edge portion, that is, the left side and the upper side in FIG. 32 has a step difference from the upper surface of the substrate 2002. In this step, a contact surface 203 is formed on the left side in FIG. 32, and a contact surface 2032 is formed on the upper side in FIG. 32. The contact surface 2031 is formed. And 2032 are vertically erected with respect to the bottom surface 2030 of the recessed portion 2003, and the contact faces 2〇31 and 2032 form a right angle with each other. The contact faces 203 1 and 2032 form a fixed position of 201213360 (for light-emitting elements) 2033. The bottom surface 2030 may be included in the positioning means 2033, whereby the positioning of the substrate 2002 in the thickness direction may be performed. The light-emitting element 2010 is brought into contact with the bottom surface 2〇3〇 of the concave portion 2〇〇3 by the light-emitting element 2010. The two side faces adjacent to each other (orthogonal) of the light-emitting elements 200 are abutted (adjoined) with the contact faces 2031 and 2032, and are provided in the recesses 2003. Thereby, the light-emitting elements 2010 are contacted by the contact faces 2〇31. The position in the χ direction is regulated and the position in the γ direction is regulated by the contact surface 2032. That is, the light-emitting element 2〇1〇 is positioned in both the X direction and the γ direction (two-dimensional direction). The positioning of the light-emitting element 2〇1〇 with respect to the surface direction (two-dimensional direction) of the substrate 2〇〇2 is surely performed, and the operation is such that the light-emitting element 201 and the concave portion 2 are opposed to the fixed substrate 2002. 3 is close, moving in the upper left direction in FIG. 32 (relative movement), and abutting the contact faces "n and 2032, respectively, so that the positioning operation can be performed extremely simply. In particular, not only in the longitudinal direction of the core portion 2094 (χ direction), and at the core 209 Since the width direction (γ direction) of 4 is also positioned, even when the width of the core portion 2094 is small (a fine optical circuit), the position of the light-emitting portion 2 ι ι of the light-emitting element can be accurately The core portion 2094 is overlapped (in a plan view). By the positioning means 2033, it can be determined that the light-emitting element 2〇10 (the driver part 2101) is directly aligned with respect to the substrate 2〇〇2, and is also determined below the lower surface of the % substrate. The position of the core position of the optical waveguide 2_, in violation of the positional relationship of the optical path conversion unit (reflection surface 2961) with respect to the core portion _ has been determined. Therefore, it is also determined to read with respect to the optical path conversion unit. The position of the (reflecting surface 2961). That is, as shown in FIG. 32, the positioning means 2G33 is positioned such that the position of the light-emitting portion 2101 of the light-emitting element 2010 in plan view overlaps with the position of the optical path conversion portion (reflection surface 2961). . Thereby, the reflecting surface 2961 is located directly under the light-emitting portion 2HH, and the optical path as designed can be accurately formed. concave. The depth of P 2003 is preferably substantially equal to or greater than the thickness of the light-emitting element 2 (4) or greater than the thickness of the light-emitting element 2〇1〇&gt;ίΐώ: # , U. In this way, the light-emitting element 2010 can be prevented from being protruded from the concave portion 2003 by the iv dog, and the upper 〇 ρ is accommodated in the concave portion 2〇〇3. concave. Ρ 2004 is open to the left and the lower side in Fig. 32, and has a step difference from the upper surface of the substrate 2 in the edge portions of the concave portion 2〇〇3, that is, left and right in Fig. 32. In the case of the step difference, the contact surface 2041 is formed on the right side in Fig. 32, and the contact surface 2〇42 is formed on the upper side in Fig. 32. The contact faces 2〇41 and 2〇42 are vertically erected with respect to the bottom surface 2G4G of the recess P 2GG4, respectively, and the contact faces 2Q41 and 2〇42 are also formed at right angles to each other. The contact means (for electronic circuit components) of the electronic circuit component 2012 are formed by the contact faces 2〇41 and 2〇42. Furthermore, the bottom surface of the hand piece 2043 may also include a bottom surface 2〇4〇, whereby the positioning of the substrate 2002 in the thickness direction may also be performed. The electronic circuit component 2012 is brought into contact with the bottom surface 2040 of the recessed portion 2〇〇4, and the two adjacent sides (orthogonal) of the electronic circuit component 2012 are respectively associated with the contact faces 2〇41 and 2()42. Abutted (pushed) and set in the recess # 2004. Thereby, the electronic circuit component 2012 sees the position of the direction by the contact surface 2041, and the position of the Y direction is regulated by the contact surface 2042. That is, the electronic circuit component 2〇12 performs positioning of both the X direction and the γ direction (one-dimensional direction). In this way, the positioning of the electronic circuit element 81 201213360 piece 2012 with respect to the plane direction (two-dimensional direction) of the substrate 2〇〇2 can be surely performed and the operation is as long as the electronic circuit element 2012 is made with respect to the fixed substrate 2〇〇2. This positioning operation is extremely simple in that it is close to the concave portion _, and is moved toward the upper right direction in Fig. 32 to be in contact with the contact faces 2〇4丨 and 2〇42, respectively. The position of the electronic circuit component 2〇丨2 (terminals 2123, 2125) relative to the substrate 2〇〇2 can be determined by the above-mentioned positioning means 2043, which also determines the light-emitting element 2〇1 positioned relative to the positioning means 2033. The position of the crucible is further determined depending on the position of the optical path conversion unit 2096 (reflection surface 2961). In this way, by accurately determining the positional relationship between the electronic circuit components 2〇12 and the light-emitting elements 2010, it is possible to form (pattern) the following conductor layers, in particular, to form the electronic circuit components 2〇12 and the light-emitting elements 2〇. When the portion 2052 is between 1 ,, it can be formed in a more accurate shape and position. The depth of the recessed portion 2004 is preferably substantially equal to the thickness of the electronic circuit component 2〇12 or greater than the thickness of the electronic circuit component 2〇12. Thereby, the electronic circuit element 2012 can be accommodated in the concave portion 2004 without protruding from the concave portion 2004. Further, since the positioning means 2033 and 2〇43 of the present embodiment are in contact with the bottom surfaces 2030 and 2040 on the lower surface of the electric component, the thickness directions of the substrate 2〇〇2 are also orthogonal to each other (the X direction and the γ direction are orthogonal to each other). The orientation of the direction). Therefore, the positioning means of the present embodiment is capable of accurately positioning the three-dimensional direction. Further, the positioning means of the present embodiment is formed directly on the substrate 2002 82 201213360 (contact faces 2031, 2032, 2041, 204?, Bo * 2 0 4 2 ) 'but is not limited thereto, and may be relative to the substrate 2002 And with the meteorites ^ ^ ^ 叩俅 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不As such an example, a positioning member that is fixed to the substrate 2002 and has a contact surface against which the electrical component can abut is exemplified. Further, in the present invention, the positioning of the abundance seat &amp; may also be such that the electrical component is positioned only in the X direction and the Y direction. In this case, the positioning of the substrate 2002 in the thickness direction may or may not be performed. A conductor layer (metal layer) 2005 is formed on the substrate 2〇02. The conductor layer 2005 is patterned into a specific shape on the two sides of the body to form a desired electrical wiring or electrical circuit. In the present embodiment, the conductor layer is provided with the portions 205 1 and 2052. The portion 20M is formed across the upper surface of the substrate and the upper surface of the electronic circuit component 2012, and the disk end +" is electrically connected to the 2125. The portion 2052 spans the upper surface of the substrate 2002, the well is opened, the top of the cow 2010, and the electronic circuit components The upper surface is formed electrically connected to the terminal coffee 2125. The portion 2053 is formed across the upper surface of the substrate and the upper surface of the light-emitting element, and is electrically connected to the terminal 2105. The part is 205 1 or 2 For example, the structure of the conductor layer 2005 is 铋Μ ν , ^ ^ and the materials are respectively exemplified by copper, copper bismuth alloy, ruthenium, Ilu alloy, present, a &lt; human gold It is a variety of metal materials such as alloys and solders. Also, according to the gentleman's / bismuth material (for example, a substrate made of a semiconductor material, the substrate of the substrate 2002), it is also possible to use tungsten and tungsten alloys. Etc. The thickness of the conductor layer 2005 and the name of the helmet... ",, particularly limited, usually preferably 2 to 200

Mm左右,更佳為3〜12〇Mm or so, better 3~12〇

左右,進而更佳為5〜70 M 83 201213360 m左右。 導體層2005係例如藉由金屬箔之接合(接著)、金屬 鍍敷、蒸鍍、濺鍍等方法形成者。對導體層2〇〇5之圖案化 例如可使用蝕刻、印刷 '遮蔽等方法。 、 作為導體層2005之構成材料,於使用(含有)容易擴 散於半導體材料中之金屬例如銅之情形時,與半導體材料 (由半導體材料構成基2之情形時)之接合部較佳為經 由例如由氧化鈦或组等構成之障壁層(未圖示)而形成。 又,作為導體層2005之構成材料,於使用與半導體材 料之密著性較差之金屬例如鶴之情形時,與半導體材料(由 半導體材料構成基板讀之情料)之接合部較佳為經由 可提高密著力之密著層(未圖示)而形成。 再者,導體層2005之圖案並不限於圖32〜圖34所示 者’可為任意形狀、配置者。 又,導體層2005之形成部位並不限於如圖示之光波; 、’·。構體2G01之上部(上面),例如亦可於光波|糊9之· 面、或光波導結構體2001之内部(例如光波導2_心 板2〇02之間)形成同樣之導體層(電氣配線或電氣電路) 於本實施形態之光波導結構體2〇〇1中若藉由電子^ 路元件2〇12之運作對發光元件2〇1〇之端子測、21〇5 ^ 通電,則發光部2101點亮’朝圖33中下方發出之傳⑸ 2018依序穿透基板2002之透光部2㈣及包覆層2㈣,每 反射面2961反射纟90。彎曲,進入光波導2_之核心匈 2094, 一面於與包覆部(包覆層2〇9卜2〇92及側方(圖3 84 201213360 - 中左右)之包覆部2095)之界面重複反射,一面沿著其長 邊方向(圖32及圖33中左方向)於核心部2094内前進。 &lt;第20實施形態·.圖35 &gt; 於圖35中表示本發明之光波導結構體2〇〇1之第2〇實 施形態。以下,對該光波導結構體2〇〇1進行說明,關於與 上述第19實施形態相同之事項(構成、運作等),省略其 說明’以不同點為中心加以說明。 關於本實施形態之光波導結構體2〇(H,定位手段之構 成不同,其以外與上述第19實施形態相同。即,於本實施 形態中,基板2002之上面形成平坦面,決定電氣元件之設 置位置之定位手段係由相對於基板2〇〇2而固定設置之定位 構件2006所構成。 該定位構件2006係由其厚度與發光元件2〇1〇及/或電 子電路元件2012之厚度大致同等或更薄之板材(或片材) 所構成,經由接著層2007而接合(固著)於基板2〇〇2之 上面。 如圖35之上部所示,定位構件2〇〇6之平面形狀大致 形成τ字狀,具有發光元件2010之相鄰(正交)之2個側 面(角部)所抵接的L字狀之接觸面2〇61、及電子電路元 件2012之相鄰(正交)之2個側面(角部)所抵接的匕字 狀之接觸面2062。 發光το件2010藉由使其下面與基板2〇〇2之上面抵 接,且使發光元件2010之相鄰(正交)之2個側面與接觸 面2061抵接(押接),而分別規制χ方向及γ方向之位置。 85 201213360 即,發光元件2010進行對χ方向及Y方向之兩者(二維方 向)之定位。 同樣地,電子電路元件2012藉由使其下面與基板2〇〇2 之上面抵接,且使電子電路元件2012之相鄰(.正交)之2 個側面與接觸面2 0 6 2抵接(押接),而分別規制χ方向及γ 方向之位置。即,電子電路元件2〇12進行對χ方向及γ方 向之兩者(二維方向)之定位。 藉由使用上述定位構件2006,具有可以!個定位構件 2006同時定位發光元件2〇1〇與電子電路元件2〇12之兩者 之優點。又,藉由調整或變更定位構件2〇〇6相對於基板2〇〇2 之固疋位置、或者選擇形狀或尺寸不同之定位構件2〇〇6而 固疋於基板2002上’亦具有可自由地設定或變更電氣元件 (發光元件2010及/或電子電路元件2〇12)之設置位置的 優點。 再者,作為接著層2007,可使用與上述第19實施形態 中所述之接著層相同者。 於本實施形態中’定位構件2〇〇6之平面形狀及厚度並 ,限於圖示者,可為任意形狀及尺寸者。&amp;,於本實施形 心中,以1個定位構件2006進行發光元件2〇1〇與電子電 元件20 1 2之兩者之定位,但並不限於此,發光元件2〇】〇 及電子電路元# 2012 ^藉由分別不同之定位構件而定 位又’其等之定位方向亦並無特別限定。 &lt;第2 1實施形態:圖3 6 &gt; 於圖36中表示本發明之光波導結構體2〇〇ι之第21實 86 201213360 施形態。以下,對該光波導結構體2〇〇丨進行說明,關於與 上述第1 9實施形態相同之事項,省略其說明,以不同點為 中心加以說明。 關於本實施形態之光波導結構體2〇〇丨,基板2〇〇2之構 成不同,其以外與上述第19實施形態相同。即,基板2〇〇2 可為不充分具有傳輸光2018之穿透性者,於基板2〇〇2之 發光部2101之正下方位置形成貫通基板2〇〇2之貫通孔 2025。该貫通孔2025係構成使傳輸光2〇18透光之透光部 2024者。即,該貫通孔2〇25成為於基板2〇〇2之厚度方^ 對傳輸光進行導光(傳輸)之導光程。 貝通孔2025之橫剖面形狀並無特別限定,例如可為圓 形、楕圓形、矩形(四角形)、六角形、其他多角形 等任意形狀。 立 〜門卻I全部或_ π分)亦可填充傳輸光之穿透率&amp; 8〇%以上、較佳為啊 ΐ二f佳為㈣以上之材料的填充材料。該填充材料亦。 τ為由與核心部2094、 層20”^ —土 卩·5、包覆層2〇91或包覆 之任者之構成材料相同的材料所構成。 又,雖未圖示,但於貫通孔2〇25 材料構成之戶,囍μ·认 印寻化成由導電 毒成之層精此,除了光傳輸功能 輸電氣信號之功能。 万了具有傳 於本實施形態之光波導結構體2〇 路元件2〇12之運作對右藉由電子電It is about 5~70 M 83 201213360 m or so. The conductor layer 2005 is formed by, for example, bonding (subsequent) of metal foil, metal plating, vapor deposition, sputtering, or the like. Patterning of the conductor layer 2〇〇5, for example, etching, printing, masking, or the like can be used. As a constituent material of the conductor layer 2005, when a metal such as copper which is easily diffused in the semiconductor material is used, the joint portion with the semiconductor material (in the case where the base 2 is composed of the semiconductor material) is preferably via, for example, It is formed of a barrier layer (not shown) made of titanium oxide or a group. Further, when a metal such as a crane having poor adhesion to a semiconductor material is used as a constituent material of the conductor layer 2005, it is preferable to use a joint portion of a semiconductor material (a substrate read from a semiconductor material). It is formed by increasing the adhesion layer (not shown). Further, the pattern of the conductor layer 2005 is not limited to those shown in Figs. 32 to 34, and may be any shape or arrangement. Further, the formation portion of the conductor layer 2005 is not limited to the light wave as shown in the figure; The upper portion (upper surface) of the structure 2G01 can be formed, for example, on the surface of the light wave | paste 9 or the inside of the optical waveguide structure 2001 (for example, between the optical waveguide 2 and the core plate 2 〇 02) to form the same conductor layer (electrical In the optical waveguide structure 2〇〇1 of the present embodiment, when the terminal of the light-emitting element 2〇1〇 is measured by the operation of the electronic component 2〇12, the light is emitted, and the light is emitted. The portion 2101 illuminates 'transmissions (5) 2018 which are emitted toward the lower side in FIG. 33 sequentially penetrates the light transmitting portion 2 (four) of the substrate 2002 and the cladding layer 2 (four), and each reflecting surface 2961 reflects the 纟 90. Bending, entering the core of the optical waveguide 2_Hung 2094, repeating the interface with the cladding portion (the cladding layer 2〇9卜2〇92 and the lateral side (Fig. 3 84 201213360 -) The reflection progresses in the core portion 2094 along the longitudinal direction (the left direction in Figs. 32 and 33). &lt;Twentyth Embodiment. Fig. 35 &gt; Fig. 35 shows a second embodiment of the optical waveguide structure 2〇〇1 of the present invention. In the following, the optical waveguide structure 2 〇〇 1 will be described, and the same matters (configuration, operation, and the like) as those of the above-described ninth embodiment will be omitted. The optical waveguide structure 2 (H of the present embodiment) is the same as the above-described 19th embodiment except that the configuration of the positioning means is different. That is, in the present embodiment, the upper surface of the substrate 2002 is formed into a flat surface, and the electrical component is determined. The positioning means for positioning is constituted by a positioning member 2006 fixedly provided with respect to the substrate 2'2. The positioning member 2006 is substantially equal in thickness to the thickness of the light-emitting element 2'' and/or the electronic circuit element 2012. A thinner plate (or sheet) is bonded (fixed) to the upper surface of the substrate 2〇〇2 via the adhesive layer 2007. As shown in the upper portion of Fig. 35, the planar shape of the positioning member 2〇〇6 is substantially Formed in a τ shape, the L-shaped contact surface 2〇61 having two side faces (corners) adjacent to each other (orthogonal) of the light-emitting element 2010, and the adjacent (orthogonal) of the electronic circuit component 2012 The U-shaped contact surface 2062 on which the two side surfaces (corner portions) abut. The light-emitting element 2010 is brought into contact with the upper surface of the substrate 2〇〇2 by the lower surface thereof, and the light-emitting element 2010 is adjacent to each other. The two sides of the intersection are in contact with the contact surface 2061 The position of the χ direction and the γ direction are separately adjusted. 85 201213360 That is, the light-emitting element 2010 performs positioning in both the χ direction and the Y direction (two-dimensional direction). Similarly, the electronic circuit component 2012 borrows The lower surface of the substrate 2〇〇2 is abutted against the upper surface of the substrate 2〇〇2, and the two sides of the adjacent (.ort.) of the electronic circuit component 2012 are abutted (adjoined) with the contact surface 2 0 6 2, and are separately regulated. The position of the χ direction and the γ direction, that is, the electronic circuit element 2 〇 12 performs positioning of both the χ direction and the γ direction (two-dimensional direction). By using the above-described positioning member 2006, it is possible to simultaneously Positioning the advantages of both the light-emitting element 2〇1〇 and the electronic circuit element 2〇12. Further, by adjusting or changing the solid-state position of the positioning member 2〇〇6 relative to the substrate 2〇〇2, or selecting a shape or size The different positioning members 2 〇〇 6 and fixed on the substrate 2002 ′ also have the advantage of being able to freely set or change the installation position of the electrical components (the light-emitting elements 2010 and/or the electronic circuit components 2 〇 12). Then layer 2007, can be used It is the same as the adhesive layer described in the nineteenth embodiment. In the present embodiment, the planar shape and thickness of the positioning member 2〇〇6 are limited to those of the drawings, and may be any shape and size. In the present embodiment, the positioning of the light-emitting element 2〇1〇 and the electronic component 20 1 2 is performed by one positioning member 2006, but the present invention is not limited thereto, and the light-emitting element 2〇 and the electronic circuit element # 2012 ^The positioning direction by the different positioning members is not particularly limited. <2nd Embodiment: Fig. 3 6 &gt; Fig. 36 shows the optical waveguide structure 2 of the present invention. 〇ι第21实86 201213360 方式 Form. The optical waveguide structure 2A will be described below, and the description of the same matters as those of the above-described first embodiment will be omitted, and the differences will be mainly described. The optical waveguide structure 2 of the present embodiment is different from the above-described nineteenth embodiment except that the configuration of the substrate 2〇〇2 is different. In other words, the substrate 2〇〇2 may have insufficient penetration of the transmitted light 2018, and a through hole 2025 penetrating the substrate 2〇〇2 is formed at a position directly below the light-emitting portion 2101 of the substrate 2〇〇2. The through hole 2025 constitutes a light transmitting portion 2024 that transmits the transmitted light 2〇18. In other words, the through hole 2〇25 serves as a light guiding path for guiding (transmitting) the transmitted light to the thickness of the substrate 2〇〇2. The cross-sectional shape of the Beton hole 2025 is not particularly limited, and may be any shape such as a circle, a circle, a rectangle (a square), a hexagon, or other polygons. The vertical ~ door but I or _ π points) can also fill the transmission of light transmission rate &amp; 8 〇% or more, preferably ah f f f is preferably (four) or more of the material filling material. The filling material is also. τ is composed of the same material as the constituent material of the core portion 2094, the layer 20", the soil layer 5, the cladding layer 2〇91, or the cladding. Further, although not shown, the through hole is formed. 2〇25 The material consists of the household, 囍μ· 印 · 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Operation of component 2〇12 to the right by electronic

作對發先几件2010之端子2103、21〇5 R 通電,則發光部21 〇 1 fj;古, 0 5間 點梵’朝圖36中下方發出之傳輸光 87 201213360 2018通過基板2002之貫通孔2025内’穿透包覆層2092, 經反射面2 9 6 1反射呈9 0。彎曲,進入光波導2 0 0 9之核心部 2094 ’ 一面於與包覆部(包覆層2091、2092及側方(圖33 中左右)之包覆部2095 )之界面重複反射,一面沿著其長 邊方向(圖36中左方向)於核心部2094内前進。 〈第22實施形態:圖37〉 於圖37中表示本發明之光波導結構體2〇〇ι之第22實 施形態。以下,對該光波導結構體2001進行說明,關於與 上述第19及第21實施形態相同之事項,省略其說明,以 不同點為中心加以說明。 本實施形態之光波導結構體2001係除了於透光部2〇24 (貫通孔2025 )設置可使傳輸光2018聚光或擴散之透鏡部 2026以外,與上述第21實施形態相同者。即,於貫通孔 2025内之下部(向光波導2009之入射側)設置由凸透鏡(準 痛而言為平凸透鏡)構成之透鏡部2026。 藉此,自發光部2101朝圖37中下方發出之光通過基 板2002之貫通孔2025内,經透鏡部2026聚光而集中其光 束(beam) ’該光束經反射面2961反射呈9〇。彎曲,進入光 波導2009之核心部2094,沿著其長邊方向(圖37中左方 向)於核心部2094内前進。藉由設置上述透鏡部2〇26,可 獲得更加明綠(sharp)之傳輪光,而可獲得更加優異之光 傳輸特性。 再者’透鏡部2 0 2 6亦可為可迪jt(播κ J与可擴散傳輸光2018者。於 該情形時,只要使用凹透鏡即可。 88 201213360 又,透鏡部2〇26之設置位置並不限於圖37所示之位 例如亦可為透光部2〇24 (貫通孔2〇25)之中途或上 ;戈者其广位、例如核心部2。94之中途或出射圖 37中左端部)。 、口 離之述透鏡部2〇26亦可對上述第19及第2〇實施形 ’“、 光/皮導結構體2 0 〇 1設置。 受光形態中,可形成將發光元件_替代為 於上面铜且f。觉先兀件例如於其下面側具有受光部, 2018 , r、有端子(例如一對端子),若受光部接受傳輸光 二i進行光電轉換,由端子輸出電氣信 號輸入至電子電路元株 电礼仏 之增幅)。 2,而進行信號處理(例如信號 本叙月之光波導結構體2〇〇 j 受光元件之兩者。於該情形時,可設為如自件與 先部發出之光經過光程轉換部2〇96、光波導:發 過光程轉換部2〇96 ), (進而紐 以上,對第Λ 先几件之焚光部所接受之構心 第1〜第22實施形態進行了纜 並非限定於該等者,^丁 了說明’但本發明 其他構成者。又,本發明Γ 之主旨’則亦可為 態中任意2種以上2亦可為組合有第1〜第22實施形 上之μ苑形態所具備之構成者。 % ^之本發明之光波導結構體成h 耐久性優異者。因此,藉由具備本發二專::率及 可於2點間進行高品質之光通信,而獲得 ^構體, 子裝置(本發明之電子裝置)。 靠丨生較向之電 89 201213360 再者,作為具備本發明之光波導結構體之電子裝置, 例如可列舉行動電話、遊戲機、路由器裝置、WDM裝置、 人電恥、電視、家庭伺服器等電子裝置類。該等電子裝 置均必須於例如LSI等演算裳置與ram等記憶裝置之間高 速傳輸大容量之資料。因此,藉由使上述電子裝置具備本 發明,光波導結構體,可消除電氣配線特有之雜訊、信號 劣化等不良情形’故可期待其性能之飛躍提高。 a進而,光波導部分與電氣配線相比,可大幅度削減發 二S。因此,可提高基板内之積體度而謀求小型化,且可 削減冷卻所欲之電力,而可削減電子裝置整體之消耗電力。 λ又,如上所述之本發明之光波導結構體成為可自由地 Λ取藉由進行折彎操作而使基板或光波導彎曲之狀態(彎 曲狀態)、與解除折彎操作而使基板或光波導伸張之狀態 (:張狀態)|。因此,例如可較佳地對具有鉸鏈部或滑 行動電老、遊戲機、pDA、筆記型個人電腦等電子裝 置之鉸鏈部或;骨動部使用。例如於行動電話中,於以光波 導結構體連接經過欽鏈部之2點間之情形時,當關閉行動 電,之较鏈部時’光波導結構體採取f曲狀態,當打開鉸 鍵。卩時’光波導結構體採取伸張狀態。 藉此,光波導結構體可長期維持夾持可動部之2點間 之電連接及光學連接。因此’具備光波導結構體之行動電 話(電子裝置)可提高其可靠性。 、再者,應用本發明之光波導結構體之電子裝置並不限 於上述者,例如可較佳地應用於路由器裝置、Wdm裝置、 201213360 ' 個人電腦、電視、家庭伺服器等電子裝置類。該等電子裝 置均必須於例如LSI等演算裝置與RAM等記憶裝置之間高 速傳輸大容量之資料。因此,藉由使上述電子裝置具備本 發明之光電氣混載基板,可消除電氣配線特有之雜訊、信 號劣化等不良情形’故可期待其性能之飛躍提高。 進而’光波導部分與電氣配線相比可大幅度削減發熱 里。因此,可提高基板内之積體度而謀求小型化,且可削 減冷卻所欲之電力,而可削減電子裝置整體之消耗電力。 &lt;光波導之製造方法&gt; 繼而’對上述各實施形態中之光波導9、9,、1〇〇9、2〇〇9 (以下亦s己作光波導9 )之製造方法及各部之構成材料等進 仃說明,尤其是對核心部94、1094、2094 (以下亦記作核 〜部94 )之形成方法進行詳細說明。 首先,在說明核心部94之形成方法之前,對用於形成 核心部94之感光性樹脂組成物進行說明。 (感光性樹脂組成物) 用於本實施形態之感光性樹脂組成物具備: (A) 環烯樹脂、 (B) 折射率與(A)不同,且具有環狀醚基之單體及 具有環狀趟基之寡聚物中之至少一者、及 (C )光酸產生劑。 其中,就確實地抑制光之傳播損失之產生之觀點而言, 較佳為具有於側鏈具有藉由由(C )光酸產生劑產生之 酸而脫離之脫離性基的環稀樹脂(A )、及 91 201213360 下逑式(100)之單體。When the terminal 2103, 21〇5 R of the first piece of 2010 is energized, the light-emitting part 21 〇1 fj; the ancient, 0 5 points of the van Gogh's transmission light 87 from the lower side of the figure 36 201213360 2018 through the through hole of the substrate 2002 Within 2025, it penetrates the cladding layer 2092 and is reflected by the reflecting surface 2 916 to be 90. Bending, entering the core portion 2094' of the optical waveguide 2 0 ′′ is repeatedly reflected at the interface with the cladding portion (the cladding layers 2091, 2092 and the side (left and right in FIG. 33)), along one side The longitudinal direction (the left direction in Fig. 36) advances in the core portion 2094. <Twenty-second embodiment: Fig. 37> Fig. 37 shows a twenty-second embodiment of the optical waveguide structure 2〇〇 of the present invention. The optical waveguide structure 2001 will be described below, and the description of the same matters as those of the above-described 19th and 21st embodiments will be omitted, and the differences will be mainly described. The optical waveguide structure 2001 of the present embodiment is the same as the twenty-first embodiment except that the light transmitting portion 2A24 (through hole 2025) is provided with a lens portion 2026 that can condense or diffuse the transmitted light 2018. That is, a lens portion 2026 composed of a convex lens (a plano-convex lens in terms of pain) is provided in a lower portion of the through hole 2025 (on the incident side of the optical waveguide 2009). Thereby, the light emitted from the light-emitting portion 2101 toward the lower side in Fig. 37 passes through the through hole 2025 of the substrate 2002, and is concentrated by the lens portion 2026 to concentrate the beam. The light beam is reflected by the reflecting surface 2961 to be 9 turns. The core portion 2094 which is bent and enters the optical waveguide 2009 advances in the core portion 2094 along the longitudinal direction thereof (the left direction in Fig. 37). By providing the above-described lens portion 2〇26, it is possible to obtain a more transparent transmission light, and more excellent light transmission characteristics can be obtained. Further, the 'lens portion 2 0 2 6 may be a squeezing jt (a gamma J and a diffusible light 2018. In this case, a concave lens may be used. 88 201213360 Further, the position of the lens portion 2 〇 26 The position shown in FIG. 37 is not limited to, for example, the middle or the upper portion of the light transmitting portion 2〇24 (through hole 2〇25), and the wide position of the light portion, for example, the core portion 2.94 or the outgoing image in FIG. Left end). The lens portion 2〇26 may be provided to the 19th and 2nd 形, and the light/sheath structure 2 0 〇1 may be provided. In the light receiving mode, the light emitting element _ may be replaced by The upper copper and the f-first member have, for example, a light receiving portion on the lower side thereof, 2018, r, and a terminal (for example, a pair of terminals). If the light receiving portion receives the transmitted light for photoelectric conversion, the terminal outputs an electrical signal to the electronic device. 2, and the signal processing (for example, the optical waveguide structure of the signal of the moon), both of the light-receiving elements. In this case, it can be set as self-contained The light emitted by the part passes through the optical path conversion unit 2〇96, the optical waveguide: the optical path conversion unit 2〇96), and further, the center of the first part of the light-emitting unit is received by the first to the first part. In the twenty-fifth embodiment, the cable is not limited to the above, and the description is made to 'but other components of the present invention. The subject matter of the present invention' may be any two or more of the two types. The constituents of the μ Court form in the first to the twenty-secondth embodiments. The optical waveguide structure of the present invention has excellent durability in h. Therefore, by providing a high-quality optical communication between two points and a high-quality optical communication between two points, a sub-device (the present invention) In the case of the electronic device including the optical waveguide structure of the present invention, for example, a mobile phone, a game machine, a router device, a WDM device, a person shame, a television, An electronic device such as a home server, which has to transmit a large-capacity data at a high speed between a memory device such as an LSI and a memory device such as a ram. Therefore, the optical device structure is provided by the electronic device including the present invention. The body can eliminate the problems such as noise and signal degradation that are unique to the electric wiring. Therefore, it is expected to improve the performance. In addition, the optical waveguide portion can be significantly reduced compared with the electric wiring. Therefore, it can be improved. The size of the substrate can be reduced, and the power required for cooling can be reduced, and the power consumption of the entire electronic device can be reduced. λ Further, the present invention as described above The optical waveguide structure is capable of freely capturing a state in which the substrate or the optical waveguide is bent (bending state) by performing a bending operation, and a state in which the substrate or the optical waveguide is stretched by releasing the bending operation (: tension state)| Therefore, for example, it can be preferably used for a hinge portion or a bone moving portion of an electronic device such as a hinge portion or a sliding machine, a game machine, a pDA, a notebook personal computer, etc. For example, in a mobile phone, an optical waveguide is used. When the structure is connected between the two points of the chain part, when the mobile power is turned off, the optical waveguide structure adopts the f-curve state when the chain portion is closed, and when the hinge key is opened, the optical waveguide structure adopts the extension state. Thereby, the optical waveguide structure can maintain electrical connection and optical connection between the two points of the movable portion for a long period of time. Therefore, the mobile phone (electronic device) having the optical waveguide structure can improve the reliability. Further, the electronic device to which the optical waveguide structure of the present invention is applied is not limited to the above, and can be preferably applied to, for example, a router device, a Wdm device, a 201213360' personal computer, a television, a home server, or the like. Each of these electronic devices must transmit a large amount of data at a high speed between a computing device such as an LSI and a memory device such as a RAM. Therefore, by providing the above-described electronic device with the optical-electric hybrid substrate of the present invention, it is possible to eliminate problems such as noise and signal degradation peculiar to the electric wiring, and it is expected that the performance will be greatly improved. Further, the optical waveguide portion can significantly reduce heat generation as compared with the electric wiring. Therefore, the size of the substrate can be increased and the size can be reduced, and the power required for cooling can be reduced, and the power consumption of the entire electronic device can be reduced. &lt;Manufacturing Method of Optical Waveguide&gt; Next, the manufacturing method and the respective parts of the optical waveguides 9, 9, 1〇〇9, 2〇〇9 (hereinafter also referred to as the optical waveguide 9) in the above embodiments The constituent materials and the like are described in detail, and in particular, the method of forming the core portions 94, 1094, and 2094 (hereinafter also referred to as the core portion 94) will be described in detail. First, the photosensitive resin composition for forming the core portion 94 will be described before explaining the method of forming the core portion 94. (Photosensitive Resin Composition) The photosensitive resin composition of the present embodiment comprises: (A) a cycloolefin resin; (B) a monomer having a refractive index different from (A) and having a cyclic ether group and having a ring At least one of the oligomers of the sulfhydryl group, and (C) a photoacid generator. Among them, from the viewpoint of surely suppressing the generation of light propagation loss, it is preferred to have a cycloaliphatic resin having a debonding group which is desorbed by an acid generated by the (C) photoacid generator in the side chain (A). ), and 91 201213360 The squat (100) monomer.

上述感光性樹脂組成物成形為膜狀而被作為光波導形 成用膜,進而用作含有折射率不同之區域之膜,例如光 導膜。 / 即,藉由使用上述感光性樹脂組成物,可提供抑制光 之傳播損失之產生的光波導膜等。其巾,於形成脊曲之光 波導之情形時,可明顯抑制光之傳播損失之產生。 進而,可提供使用上述光波導膜之光配線、具備上述 光配線、與電氣電路之光電氣混載基板。根據上述光配線 及光電氣混載基板,可改善於先前之電氣配線中成為問題 之EMI (電磁干擾可較先前大幅度提高信號傳達速度。 又,亦可提供使用光波導膜之電子裝置。藉由使用光 波導膜,可謀求省空間化,故可有助於電子裝置之小型化。 作為上述電子裝置,具體可列舉:電腦、伺服器、行 動電話 '遊戲機器、記憶體測試器、外觀檢査機器人等。 以下’依序對感光性樹脂組成物之成分進行詳細闡述。 ((A)環烯樹脂) 成分(A)之環稀樹脂係為禮保感光性樹脂組成物之膜 92 201213360 成形性而添加者,且 此處,環烯樹脂 所取代者β 係成為基質聚合物者。 可為未經取代者,亦可為氫經其他基 作為環烯樹脂,例如 系樹脂等。 lj +降莰烯系樹脂、苯環丁烯 透明性等觀點而言,較佳為 其中’就耐熱性、 使用降 莰烯系樹脂。 作為降获烯系樹脂,例如可列舉: ⑴使降㈣型單體進行加成(共)聚合而獲得之降 莰烯型單體之加成(共)聚合物、 ()降k烯型單體與乙烯或α-烯烴類之加成共聚物、 (3) 降莰烯型單體與非共軛二#、及才見需要之其他單 體之加成共聚物之類之加成聚合物、 (4) 降莰烯型單體之開環(共)聚合物、及視需要使 忒(共)聚合物氫化而成之樹脂、 (5 )降莰烯型單體與乙烯或α -烯烴類之開環共聚物、 及視需要使該(共)聚合物氫化而成之樹脂、 (6)降莰烯型單體與非共輛二烯、或其他單體之開環 共聚物、及視需要使該(共)聚合物氫化而成之聚合物之 類之開環聚合物。作為該等聚合物,可列舉無規共聚物、 嵌段共聚物、交替共聚物等。 該等降莰烯系樹脂例如可藉由開環複分解聚合 (ROMP )、ROMP與氫化反應之組合 '利用自由基或陽離 子之聚合、使用陽離子性鈀聚合起始劑之聚合、使用其以 93 201213360 外之聚合起始劑(例如鎳或其他過渡金屬之聚合起始劑) 之聚合等公知之所有聚合方法而獲得。 «玄等之中,作為降莰烯系樹脂,較佳為加成(共)聚 合物。就富於透明性'耐熱性及可撓性之方面而言,、加成 4合物亦較佳。例如有時藉由感光性樹脂組成物形 成膜後’㉟由焊料而安裝電氣零件等^於上述情形時,必 ^具有較高之4熱性即耐回焊性,故較佳為加A (共)聚 。物。又,藉由感光性樹脂組成物形成膜而組人製品中時, 有時例如力m:左右之環境下使用。於上述情形時,就確 保对熱性之觀點而言,較佳為加成(共)聚合物。 ,其中’降莰烯系樹脂較佳為含有具有含聚合性基之取 代基的降《烯之重複單位'或具有含芳基之取代基的降获 烯之重複單位者。 作為具有含有聚合性基之取代基的降莰烯之重複單 位’較佳為具有含有環氧基之取代基的降㈣之重複單 位具有含有(甲基)丙烯酸基之取代基的降莰烯之重複單 位、及,有含有院氧切基之取代基的降㈣之重複單位 乂 1種於各種聚合性基中,就反應性較高之方面 而言,較佳為該等聚合性基。 又右使用含有2種以上之上述含有聚合性基之降莰 稀之重複單位者,料謀求可撓性㈣熱性之並存。 另方面,藉由含有具有含芳基之取代基的降获烯之 重複單位,可利用源自芳基之極高之疏水性而更加確實地 防止由吸水引起之尺寸變化等。 94 201213360 ' 進而,降莰烯系聚合物較佳為含有烷基降莰烯之重複 單位者。再者,烷基可為直鏈狀或分支狀之任一者。 藉由含有烷基降莰烯之重複單位,由於降莰烯系聚合 物之柔軟性變高,故可賦予較高之可撓性(nexibnity)。 又,就對特定波長區域(尤其是850 nm附近之波長區 域:α之光之穿透率優異之方面.而言,含有烧基降㈣之重 複單位之降莰烯系聚合物亦較佳。 藉此,作為降莰烯系樹脂,較佳為以下式(丨)〜(* )、 (8)〜(1〇)所表示者。The photosensitive resin composition is formed into a film shape and used as a film for forming an optical waveguide, and further used as a film containing a region having a different refractive index, for example, a photoconductive film. In other words, by using the above-mentioned photosensitive resin composition, it is possible to provide an optical waveguide film or the like which suppresses generation of light propagation loss. The towel can significantly suppress the generation of light propagation loss in the case of forming a curved optical waveguide. Further, it is possible to provide an optical wiring using the optical waveguide film, and an optical-electric hybrid substrate including the optical wiring and the electric circuit. According to the optical wiring and the photo-electric hybrid substrate, EMI which is a problem in the prior electrical wiring can be improved (electromagnetic interference can greatly increase the signal transmission speed compared with the prior art. Further, an electronic device using the optical waveguide film can be provided. Since the optical waveguide film can be used to save space, it can contribute to miniaturization of the electronic device. Specific examples of the electronic device include a computer, a server, a mobile phone, a game device, a memory tester, and an appearance inspection robot. The following is a detailed description of the components of the photosensitive resin composition. ((A) Cycloolefin resin) The ring-thin resin of the component (A) is a film of a protective photosensitive resin composition 92 201213360 Formability Addition, and here, the β-system substituted by the cycloolefin resin is a matrix polymer. It may be an unsubstituted one, or a hydrogen-based other group may be used as a cycloolefin resin, for example, a resin or the like. From the viewpoints of transparency of the resin and benzocyclobutene, etc., it is preferable to use a norbornene-based resin in terms of heat resistance. Examples of the reduced ethylenic resin include, for example: (1) addition (co)polymer of a norbornene-type monomer obtained by addition (co)polymerization of a falling (tetra) type monomer, addition of () a reduced-k-type monomer and ethylene or an α-olefin Copolymer, (3) an alkylene-type monomer and a non-conjugated ##, and an addition polymer such as an addition copolymer of other monomers required, (4) a norbornene type monomer a ring-opening (co)polymer and, if necessary, a resin obtained by hydrogenating a ruthenium (co)polymer, (5) a ring-opening copolymer of a norbornene type monomer and an ethylene or an α-olefin, and optionally a resin obtained by hydrogenating the (co)polymer, (6) a ring-opening copolymer of a norbornene-type monomer and a non-co-diene, or another monomer, and if necessary, hydrogenating the (co)polymer a ring-opening polymer such as a polymer. Examples of the polymer include a random copolymer, a block copolymer, an alternating copolymer, etc. The decene-based resin can be, for example, subjected to ring-opening metathesis polymerization. (ROMP), a combination of ROMP and hydrogenation reaction 'polymerization by radical or cation, polymerization using a cationic palladium polymerization initiator, using 93 It is obtained by all known polymerization methods such as polymerization of a polymerization initiator (for example, a polymerization initiator of nickel or another transition metal) of 201213360. Among the mysterious resins, it is preferably a ruthenium-based resin. Copolymer). In terms of transparency, heat resistance and flexibility, addition compounds are also preferred. For example, sometimes a film is formed by a photosensitive resin composition, and '35 is soldered. When installing electrical parts, etc., in the above case, it is necessary to have a higher thermal property, that is, resistance to reflow, so it is preferable to add A (co)polymer. Further, a film is formed by forming a photosensitive resin composition. In the case of a human product, it may be used, for example, in a force m: in a left-right environment. In the above case, it is preferable to add an (co)polymer to the viewpoint of heat, wherein 'northene-based resin It is preferred to contain a repeating unit of a reduced alkene having a substituent having a polymerizable group or a repeating unit having a substituent having an aryl group. The repeating unit ' of the norbornene having a substituent having a polymerizable group is preferably a repeating unit having a substituent having an epoxy group and having a repeating unit having a substituent of a (meth)acryl group. The repeating unit and the repeating unit (4) having a substituent containing a hospital oxygen group are one kind of various polymerizable groups, and those having a higher reactivity are preferably such polymerizable groups. Further, in the case of using a repeating unit containing two or more kinds of the above-mentioned polymerizable groups, it is desired to coexist flexibility (IV). On the other hand, by containing a repeating unit of a reduced olefin having a substituent having an aryl group, it is possible to more reliably prevent dimensional change due to water absorption and the like by utilizing extremely high hydrophobicity derived from an aryl group. 94 201213360 ' Further, the norbornene-based polymer is preferably a repeating unit containing an alkyl norbornene. Further, the alkyl group may be either linear or branched. By the repeating unit containing an alkyl norbornene, since the softness of the norbornene-based polymer becomes high, high flexibility can be imparted. Further, in the specific wavelength region (especially, the wavelength region in the vicinity of 850 nm: the transmittance of light of α is excellent, the norbornene-based polymer having a repeating unit of the alkyl group (four) is also preferable. Therefore, as the norbornene-based resin, those represented by the following formulas (丨) to (*) and (8) to (1) are preferable.

(式⑴中,1表示碳數 又規基,a表示 1數b表不1〜3之整數,Pi/q!為20以下) j ( 1 )之降莰烯系樹脂可藉由以下方 错由使具有h之降㈣、與於側鍵 ^ 烯溶解於甲苯中,並使 衣氧基之降莰 液聚合而獲得(1)。 1 °物(A)作為觸媒進行溶 95 201213360(In the formula (1), 1 represents a carbon number and a regular group, a represents a number b, and an integer of 1 to 3, and Pi/q! is 20 or less.) The pyrene-based resin of j (1) can be obtained by the following (1) is obtained by dissolving a drop having h (four), a side bond, and toluene in a toluene solution. 1 ° substance (A) is dissolved as a catalyst 95 201213360

Ph PhPh Ph

再者’於側鏈具有環氧基之降莰烯之製造方法例如如 (i ) ' ( ii )所述。 (1)降莰烯甲醇(NB-CH2-〇H)之合成 使藉由DCPD (二環戊二烯)之裂解而生成之CPD (環 戍二稀)與α烯烴(CH2=CH-CH2-OH )於高溫高壓下反應。Further, a method for producing a norbornene having an epoxy group in a side chain is, for example, as described in (i) '(ii). (1) Synthesis of norbornene methanol (NB-CH2-〇H) CPD (cyclopentadiene) and alpha olefin (CH2=CH-CH2-) produced by cleavage of DCPD (dicyclopentadiene) OH) reacts at high temperature and pressure.

X= CHjOH (ii)環氧降莰烯之合成 藉由降莰烯甲醇與表氣醇之反應而生成。X = CHjOH (ii) Synthesis of epoxy norbornene It is formed by the reaction of norbornene methanol with surface gas alcohol.

再者,於式(1)中,於 丹有,於式Ci) T,於13為2或3之情形時 氣醇之亞曱基變成伸乙基、伸丙基等者。 使用表 式(1 )所表示之降莰焔糸也Further, in the formula (1), in the case of the formula Ci), in the case where 13 is 2 or 3, the sulfhydryl fluorenyl group becomes an ethyl group, a propyl group or the like. Using the formula shown in equation (1)

且a及b分別為1之化合物, &quot;,一 T — 一 求 求可撓性與 佳為Rl為碳數4〜1〇之烧基, 例如丁基降莰㈣甲基環氧丙 96 201213360 :基鍵降获婦之共聚物、己基降㈣與甲基環氧丙㈣㈣ 烯之共聚物、癸基降茨烯與甲基環氧丙基醚降莰烯之共聚 物等。 '、And a and b are compounds of 1 respectively, &quot;, a T - a request for flexibility and preferably Rl is a carbon number of 4 to 1 烧, such as butyl hydrazine (tetra) methyl epoxide 96 201213360 : a base bond-reducing copolymer of a woman, a copolymer of hexyl amide (tetra) and a methyl methacrylate (tetra) (tetra) ene, a copolymer of decyl decazene and methyl epoxypropyl ether decene, and the like. ',

(式⑺.中、反2表示碳數卜⑺之烷基,〜表示氫原 子或甲基,C表示〇〜3之整數,p2/q2為2〇以下) 式⑺之降莰烯系樹脂可藉由使具有&amp;之降莰烯與 於側鏈具有丙烯酸基及曱基丙烯酸基之降莰烯溶解於甲苯 中’使用上述Ni化合物(A)作為觸媒進行溶液聚合而獲 得。 再者⑺所表示之降获晞系聚合物中,就可挽性 與耐熱性之兩立之觀點而言,尤佳為b為碳數4〜ι〇之烷 基,且c為1之化合物,例如丁基降莰烯與丙烯酸2 (5_降 莰烯基)曱酯之共聚物、己基降莰烯與丙烯酸2_(5_降莰烯基) 曱酉旨之共聚物、癸基降莰烯與丙烯酸2_(5_降获烯基)甲酿1 共聚物等。 97 201213360(Formula (7). Middle and reverse 2 represent a carbon number (7) alkyl group, ~ represents a hydrogen atom or a methyl group, C represents an integer of 〇~3, and p2/q2 is 2 Å or less.) The decene-based resin of the formula (7) may be It is obtained by dissolving a decene having a &amp; and a decene having an acrylic group and a mercaptoacrylic acid group in a side chain in toluene by solution polymerization using the above Ni compound (A) as a catalyst. Further, in the lanthanide-reduced polymer represented by (7), in view of the standability of heatability and heat resistance, a compound in which b is an alkyl group having a carbon number of 4 to 〇, and c is 1 is preferable. , for example, a copolymer of butyl norbornene with 2 (5-northenyl) decyl acrylate, a copolymer of hexyl decene and 2 - (5 - norbornenyl) acrylate, a sulfhydryl group A copolymer of an alkene and an acrylic acid 2_(5_educted alkenyl group). 97 201213360

:3)中,R4表示碳數1〜10之烷基,各 轰:ΐ:雖金I 1 J Λ 甘八3刀/η 之烧基,d表示〇〜3之整數,p3/q3為 獨立表示碳數 20以下) 有烷〔基矽基之降^由使具有R4之降莰烯、與於側鏈具 …作h 解於甲苯中,使用上述Ni化合物 (A)作為觸媒進行溶液聚合而獲得。 為碳==“二之:_系聚合”,尤佳為〜 人物。之说基,且“ 1或Μ為甲基或乙基之化 基降获稀與降获稀基乙基三甲氧基梦炫之共 己基降获稀與降获稀基乙基三甲氧基石夕烧之共聚 丁二=稀與降获稀基乙基三甲氧切烧之共聚物、 盘基=與三乙氧基妙基降㈣之共聚物己基降㈣ 二基降获烯之共聚物、癸基降获烯與三乙氧基 之1= 聚物、丁基降㈣與三甲氧基石夕基降㈣ 八里ο $欠料—甲氧切基降获烯之共聚物、 六基降坎婦與三甲氧基石夕基降⑽之共聚物等。 98 201213360In 3), R4 represents an alkyl group having a carbon number of 1 to 10, each bomb: ΐ: although gold I 1 J Λ Gan 八 3 knives / η, the d represents an integer of 〇 〜 3, p3 / q3 is independent The carbon number is 20 or less. There is an alkane [the reduction of the fluorenyl group] is carried out by using the above-mentioned Ni compound (A) as a catalyst for solution polymerization of a decene having R4 and a side chain having a solution in toluene. And get. For carbon == "two: _ system aggregation", especially good for ~ characters. Said, and "1 or oxime is a methyl or ethyl group, which reduces the dilution and reduces the dilute ethyl dimethyl methoxy group, which reduces the dilution and the reduction of the dilute ethyl trimethoxy shi. Copolymerization of calcined diene = dilute and reduced copolymer of dilute ethyl trimethoate, disc base = copolymer with triethoxymide (four) hexyl group (tetra) copolymer of diradyl olefin, hydrazine Base-reduced olefin and triethoxyl 1 = polymer, butyl group (tetra) and trimethoxy sulphate (four) 八里ο $ 欠 - methoxy decyl olefin copolymer, hexa a copolymer of trimethoxycarbazide (10), etc. 98 201213360

之烧基,Αι及A2分別獨立 (式中,r5表示碳數 • ——“么&quot;词儿 表示下述式(5)〜(7)所表示之取代基,但並不 同一之取代基。又,2〇以下) 猎由使具有R6之降茨稀、與於側鍵具有 莰烯溶解於甲笨中,使用N 2之降 液聚合而獲得(4)。 化&amp;物(A)作為觸媒進行溶The base of the burnt group, Αι and A2 are independent (wherein, r5 represents the number of carbons; - "Mhy" word indicates a substituent represented by the following formula (5) to (7), but not the same substituent Further, 2 〇 or less) is obtained by diluting R6 with R6, dissolving it with a side bond, and dissolving it in a stupid liquid, and obtaining a liquid crystal by using N 2 (4). Dissolve as a catalyst

(式 5)中,e表示〇〜3之整數,f表示卜〗之整數)(Expression 5), where e represents an integer of 〇~3, and f represents an integer of 卜)

99 201213360 數) (式(6 )中 R6表示氫原子或曱基,g表示〇〜3之整99 201213360 number) (In the formula (6), R6 represents a hydrogen atom or a sulfhydryl group, and g represents a whole of 〇~3

之焼*基,h 一(弋(7 )中,X4分別獨立表示碳數1〜 表示〇〜3之整數) 列舉再:其:為式(4)所表示之降获稀系聚合物,例如可 ]舉·丁基降获烯、己基降获烯或癸基降获烯之任—者、 與丙烯酸2·(5·降获烯基)甲8旨、及降获稀基乙基三甲氧基石夕 烷、二乙氧基矽基降莰烯或三曱氧基矽基降莰烯之任一者 之二凡共聚物;丁基降莰烯、己基降莰烯或癸基降莰烯之 任一者、與丙烯酸2-(5-降莰烯基)甲酯、及曱基環氧丙基醚 降莰烯之三元共聚物;丁基降莰烯、己基降莰烯或癸基降 坎烯之任一者、與曱基環氧丙基醚降莰烯、降莰烯基乙基 —甲氧基石夕烧、二乙氧基石夕基降莰婦或三曱氧基石夕基降获 烯之任一者之三元共聚物等。 100 201213360焼 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基It can be used as a butyl-reduced olefin, a hexyl-reduced olefin or a fluorenyl-reduced olefin, and an acrylic acid (2·5-reduced alkenyl group), and a reduced ethylidene trimethoxy group. a copolymer of any one of a base stone, a diethoxy decyl decene, or a tridecyl decyl decene; a butyl decene, a hexyl decene or a decyl decene Any one, a terpolymer of 2-(5-northenyl)methyl acrylate, and a decyl epoxypropyl ether decene; butyl norbornene, hexyl decene or decyl Any of the decenes, with decyl epoxypropyl ether decene, nortenyl ethyl methoxy methoxy sulphur, diethoxy sylvestre or trisyloxy sulphate a terpolymer of any of the olefins, and the like. 100 201213360

Xl表示氧原子或亞甲基,\表 〇〜3之整數,i *千 J衣不1〜3之整 (式(8)中’R7表示 甲基或乙基,Ar表示芳基 示碳原子或梦原子,i表示 數’ p5/q5為20以下) τ〜, 兴於惻鏈含琴 -(CH+Xi-XKRAyAr)』之降莰烯溶解於甲Xl represents an oxygen atom or a methylene group, an integer of \ 〇 〜3, i * 千J clothing is not 1-3 (in the formula (8), 'R7 represents a methyl group or an ethyl group, and Ar represents an aryl group as a carbon atom. Or dream atom, i means the number 'p5/q5 is 20 or less) τ~, the 莰 chain contains the piano-(CH+Xi-XKRAyAr), the decene is dissolved in A

JL. A »/ *, 1史用 N 5物作為觸媒進行溶液聚合而獲得(8)。 再者,&lt; ⑴所表示之降获稀系聚合物中,較佳 為氧原子、X2為矽原子、Ar為苯基者。 ···、 進而,就可撓性、耐熱性及折射率控制之觀點而言, 八二:為:婁“’之貌基义為氧原子义為發原子、 ^為本基、R8為甲基、1為1、J為2之化合物,例如丁基 玉烯與二苯基甲基降莰 ^ ㈣與二苯基甲基嶋夕之共“、己基降 - ΜΛΨ Μ 甲氧基矽烷之共聚物、癸基降莰 本基I基降㈣甲氧基Μ之共聚物等。 八體而5 ’較佳為使用如下之降㈣系樹脂。 201213360JL. A »/ *, 1 History N 5 is used as a catalyst for solution polymerization to obtain (8). Further, in the reduced rare polymer represented by (1), an oxygen atom, X2 is a halogen atom, and Ar is a phenyl group. ···, Furthermore, in terms of flexibility, heat resistance, and refractive index control, VIII: is: “The appearance of 'the oxygen atom is the atom, the ^ is the base, and the R8 is the nail. a compound in which 1, 1 is 1, and J is 2, for example, a copolymer of butyl decene and diphenylmethyl oxime (4) with diphenylmethyl oxime, hexyl ruthenium - ruthenium methoxy decane And a sulfhydryl group-derived base group I-based (tetra) methoxy oxime copolymer. It is preferable to use the following (four) resin as the eighth body and 5'. 201213360

(式(9 )中之R7、R8、P5、q5、i與式(8 )相同) 又,就可撓性與耐熱性及折射率控制之觀點而言,亦 可為式(8)中,R7為碳數4〜1〇之烷基、&amp;為亞曱基、 \為碳原子、ΑΓ為苯基、Rg為氫原子、丨為〇 '』為之化 合物,例如丁基降莰烯與苯基乙基降莰烯之共聚物、己基 降ί人稀與本基乙基降获稀之共聚物、癸基降茨稀與苯基乙 基降莰烯之共聚物等。 進而,亦可使用如下者作為降莰烯系樹脂。(R7, R8, P5, q5, and i in the formula (9) are the same as in the formula (8)) Further, in terms of flexibility, heat resistance, and refractive index control, the formula (8) may be used. R7 is a C 4~1〇 alkyl group, &amp; is an anthracenylene group, \ is a carbon atom, ΑΓ is a phenyl group, Rg is a hydrogen atom, and 丨 is 〇', such as butyl norbornene and a copolymer of phenylethyl norbornene, a copolymer of hexyl thiophene and a condensed base ethyl group, a copolymer of fluorenyl thiol and phenylethyl norbornene, and the like. Further, the following may be used as the norbornene-based resin.

(10 ) (式(10)中’ 表示石反數1〜10之炫基,表示 方基,k為0以上、4以下。P6/q6為20以下) 102 201213360(10) (In the formula (10), the radix of the stone inverse number 1 to 10 represents a square group, and k is 0 or more and 4 or less. P6/q6 is 20 or less) 102 201213360

Pi q! P3/q3、p5/q5、p6/q6 或 p4/〜+ r 只要為加以 下p可’較佳為15以下,更佳為0.1〜10左右。藉此,可 充分發揮含有複數種降获稀之重複單位之效果。了 如上之降茨烯系樹脂較佳為具有脫離性 所謂脫離性係指藉由酸之作用而脫離者。 V、體而。,較佳為於分子結構中具有結構、Si· 基結構及-O-Si.結構中之至少〗種者。該酸脫離性基係藉由 陽離子之作用而相對容易地脫離。 其中,作為藉由脫離而降低樹脂之折射率之脫離性 基,k佳為-S!-二苯基結構及_〇_Si-二苯基結構之至少一者。 例如’式(8 )所表示之㈣烯系聚合物中,X,為氧原 子x2為石夕原?、Ar為苯基者成為具有脫離性基者。 又,式(3)中,有時於烷氧基矽基之Si_〇X3之部分 脫離。 例如,於使用式(9)之降莰烯系樹脂之情形時,可推 測藉由由光酸產生劑(記作PAG)產生之酸,如以下般進 行反應。再者,此處,僅表示脫離性基之部分,又,對i = 1之情形進行說明。Pi q! P3/q3, p5/q5, p6/q6 or p4/~+r may be preferably 15 or less, more preferably 0.1 to 10, as long as it is p. Thereby, the effect of containing a plurality of repeated units of reduced rareness can be fully utilized. The above-mentioned decyl-based resin preferably has detachment property. The detachment property means that it is detached by the action of an acid. V, body and. Preferably, it is at least one of a structure, a Si. group structure, and an -O-Si. structure in the molecular structure. The acid detachment group is relatively easily detached by the action of a cation. Here, as a detaching group which lowers the refractive index of the resin by detachment, k is preferably at least one of a -S!-diphenyl structure and a _〇_Si-diphenyl structure. For example, in the (4) olefin polymer represented by the formula (8), X is an oxygen atom x2 is Shi Xiyuan? When Ar is a phenyl group, it has a detachment base. Further, in the formula (3), the portion of Si_〇X3 of the alkoxyfluorenyl group may be detached. For example, in the case of using a decene-based resin of the formula (9), it is possible to carry out a reaction by the acid produced by a photoacid generator (referred to as PAG) as follows. Here, only the part of the detachment group is shown, and the case where i = 1 is explained.

進而,除了式(9 )之結構以外,亦可為於側鏈具有環 103 201213360 形成密著性優異之膜之效 :基者1由使用上述者具有可 果0 作為具體 例,有如下者Further, in addition to the structure of the formula (9), the film may be provided with a ring 103 201213360 in the side chain. The effect of the film having excellent adhesion is as follows: the base 1 has a specific value of 0 as the above, and the following

(式(3 1 )中 ’ P7/q7 + r2 為 20 以下) 式(3 1 )所示之化合物例如可藉由使己基降莰烯、與 一本基甲基降莰烯甲氧基矽烷(於側鏈含有 -CH2-0-Si(CH3)(Ph)2《降㈣)&amp;環氧降㈣溶解於甲苯 中,使用Ni化合物作為觸媒進行溶液聚合而獲得。 ((B )具有環狀醚基之單體、具有環狀醚基之募聚物) 繼而’對(B )之成分進行說明。 成分(B)係具有環狀醚基之單體及具有環狀醚基之寡 聚物中之至少一者。該成分(B )只要為折射率與成分(A ) 之樹脂不同,且與成分(A )之樹脂具有相溶性即可。成分 (B)與成分(A)之樹脂之折射率差較佳為〇 〇1以上。 再者,成分(B )之折射率可高於成分(a )之樹脂, 但較佳為成分(B )之折射率低於成分(a )之樹脂。 成分(B)之具有環狀醚基之單體、具有環狀醚基之寡 104 201213360 聚物係於酸之存在下,藉 寡聚物之擴散性,則該單體11::合(::若考慮到單體、 寡聚物之分子量( ,…(重量平均分子量)、 400以下。 句刀子量)分別較佳為100以上、 成刀(B )例如具有氧雜環丁烷 謎基藉由酸容易開環,故而較佳。 氧基上述%狀 :為具有氧雜環丁烧基之單體、具有氧雜環丁烧基之 券聚物,較佳為選自下述式(11)〜⑽之群令者。藉由 使用5玄等’具有波長850 nm附近之透明性優異,可使可撓 性與耐熱性並存之優點。又,該等可單獨使用,亦可混合 而使用。(In the formula (3 1 ), 'P7/q7 + r2 is 20 or less) The compound represented by the formula (3 1 ) can be, for example, by making hexylnordecene, and a radical methylnordecene methoxy decane (for example). In the side chain, -CH2-0-Si(CH3)(Ph)2 "Descending (tetra)) &amp; epoxy drop (iv) was dissolved in toluene and obtained by solution polymerization using a Ni compound as a catalyst. ((B) a monomer having a cyclic ether group or a polymer having a cyclic ether group) Next, the component of (B) will be described. Component (B) is at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group. The component (B) may be a resin having a refractive index different from that of the component (A) and compatible with the resin of the component (A). The difference in refractive index between the component (B) and the resin of the component (A) is preferably 〇 以上 1 or more. Further, the component (B) may have a higher refractive index than the component (a), but it is preferred that the component (B) has a lower refractive index than the component (a). The monomer having a cyclic ether group of the component (B) and the oligomer 104 having a cyclic ether group are in the presence of an acid, and by the diffusibility of the oligomer, the monomer 11:: When considering the molecular weight of the monomer or the oligomer (... (weight average molecular weight), 400 or less. The amount of the knife is preferably 100 or more, respectively, and the knives (B) have, for example, an oxetane It is preferred that the acid is easily ring-opened, and the above-mentioned oxy group is a monomer having an oxetan group and a valence group having an oxetan group, and is preferably selected from the following formula (11). ) The group of ~10 is used. By using 5 Xuan et al., which has excellent transparency near the wavelength of 850 nm, it can combine flexibility and heat resistance. Moreover, these can be used alone or mixed. .

(11 ) (12 ) 105 (14)201213360 c2h5(11) (12) 105 (14)201213360 c2h5

(16 )(16)

- 〇C2H5 voc2h5 (17 )- 〇C2H5 voc2h5 (17 )

(18 ) (式(18)中,n為0以上、3以下)(18) (in the formula (18), n is 0 or more and 3 or less)

106 (20) (20)201213360106 (20) (20)201213360

於如上之單體及寡聚物中,就確保與成分(A )之樹脂 之折射率差的觀點而言,較佳為使用式(丨3 )、(丨5 )、(丨6 )、 (17)、(20)所表示之化合物。 進而,若考慮到與成分(A )之樹脂具有折射率差之方 面、分子量較小而單體之運動性較高之方面、單體不容易 揮發之方面,則尤佳為使用式(20)、式(15)所表示之化 合物。 又,作為具有氧雜環丁烷基之化合物,可使用以下之 式(32 )、式(33 )所表示之化合物。作為式(32 )所表示 之化。物’可使用東亞合成製之商品名等,作為式 』3。3)所表示之化合物,可使用東亞合成製之商品名〇—In the above monomers and oligomers, from the viewpoint of ensuring a difference in refractive index from the resin of the component (A), it is preferred to use the formula (丨3), (丨5), (丨6), ( 17), the compound represented by (20). Further, it is preferable to use the formula (20) in view of the fact that the resin of the component (A) has a refractive index difference, the molecular weight is small, the mobility of the monomer is high, and the monomer is not easily volatilized. A compound represented by the formula (15). Further, as the compound having an oxetane group, a compound represented by the following formula (32) or formula (33) can be used. It is represented by the formula (32). As the compound represented by the formula "3. 3), the product name of the East Asia Synthetic Co., Ltd. can be used.

107 201213360107 201213360

(式(33)令’ η為!或2) 具有環氧基之寡聚物, 之單體、寡聚物係於酸 又,作為具有環氧基之單體、 例如可列舉如下去 卜者该具有環氧基 之存在下,藉由開環而聚合者。 作為具有環氧基之單體、 體具有%氧基之寡聚物,可使 用以下之式(34)〜(39)祕主_ 土 A % )所表不者。其中,就環氧環之 應’憂能量較大、沒施从成w μ生優異之觀點而言,較佳為使用式(36 ) 〜(39)所表示之脂環式環氧單體。 再者’式(34)所表示之化合物為環氧降莰烯作為 上述化合物,例如可使用Pr〇merus公司製造之ΕρΝΒ。式 (35 )所表示之化合物為7 •環氧丙氧基丙基三甲氧基矽 烷,作為該化合物,例如可使用T〇ray D〇w C〇rning SiHc〇ne 公司製造之Z-6040 〇又,式(36)所表示之化合物為2_(3,4_ 晨氧環己基)乙基二甲氧基石夕烧,作為該化合物,例如可使 用東京化成製造之E0327。 進而,式(37)所表示之化合物為3,4-環氧環己稀基甲 基-3,’4環氧環己嫦敌酸g旨,作為該化合物,例如可使用(Formula (33) Let 'n be ! or 2) an oligomer having an epoxy group, and the monomer or oligomer is based on an acid. Examples of the monomer having an epoxy group include, for example, the following In the presence of an epoxy group, it is polymerized by ring opening. As the monomer having an epoxy group and the oligomer having a % oxy group, the following formulas (34) to (39) may be used. Among them, the alicyclic epoxy monomer represented by the formulae (36) to (39) is preferably used from the viewpoint that the epoxy ring has a large energy and is not excellent in the properties of the epoxy ring. Further, the compound represented by the formula (34) is an epoxy norbornene as the above compound, and for example, ΕρΝΒ manufactured by Pr〇merus Co., Ltd. can be used. The compound represented by the formula (35) is 7 • glycidoxypropyltrimethoxydecane, and as the compound, for example, Z-6040 manufactured by T〇ray D〇w C〇rning SiHc〇ne Co., Ltd. can be used. The compound represented by the formula (36) is 2-(3,4-moroxycyclohexyl)ethyldimethoxycarbazide, and as the compound, for example, E0327 manufactured by Tokyo Chemical Industry Co., Ltd. can be used. Further, the compound represented by the formula (37) is 3,4-epoxycyclohexylmethyl-3,'4 epoxycyclohexanoic acid, and as the compound, for example, it can be used.

Daicel Chemical 公司製造之 Celloxide 2021P。又,式(38) 所表示之化合物為1,2-環氧-4-乙烯基環己烷,作為該化合 物,例如可使用Daicel Chemical公司製造之Celloxide 2000。 108 201213360 : 進而,式(39)所表示之化合物為1,2 : 8,9二環氧擰 檬烯,作為該化合物,例如可使用(Daicel Chemical公司 製造之 Celloxide 3000 )。Celloxide 2021P manufactured by Daicel Chemical. Further, the compound represented by the formula (38) is 1,2-epoxy-4-vinylcyclohexane, and as the compound, for example, Celloxide 2000 manufactured by Daicel Chemical Co., Ltd. can be used. 108 201213360: Further, the compound represented by the formula (39) is 1,2:8,8 epoxide, and as the compound, for example, Celloxide 3000 manufactured by Daicel Chemical Co., Ltd. can be used.

(3 6) (3?) 0(3 6) (3?) 0

進而,亦可併用具有氧雜環丁烷基之單體、具有氧雜 109 s 201213360 ==、::有環“之單&quot;有環氧基之 氧雜環丁烧基之單體、具有氧雜環丁燒基之寡聚 、開始聚合之開始反應較慢,但生長反應較快。與此 =,具有環氧基之單體、具有環氧基之募聚物雖然開始 聚3之開始反應較快,但生長反應較慢。因此,藉由併用 具有氧^環丁職之單體、具有氧雜環丁院基之寡聚物、 與/、有%氧基之單體、具有環氧基之寡聚⑯’可於昭射光 或活性放射線時,確實地產生光或活性放射線之照射部 分、與未照射部分之折射率差。 該(B )成分之添加量相對於(A)成分1〇〇重量份, 較佳為1重$份以上、5〇重量份以下,更佳為2重量份以 上' 2〇重置份以下。藉此,具有可實現核心/包覆間之折射 率調變’而謀求可撓性與耐熱性之並存之效果。 ((C)光酸產生劑) 作為光k產生劑,只要為吸收光(活性放射線)之能 里而生成布忍斯特酸或路易斯酸者即可,例如可列舉:三 苯基鎳三氟甲烷磺酸鹽、三(4·三級丁基苯基)鎳-三氟曱烷磺 酉欠鹽等鎳鹽類;對硝基苯基重氮六氟磷酸鹽等重氮鹽類; 鉍鹽類,鱗鹽類;二苯基錤三氟曱烷磺酸鹽、(三異丙苯基) 錤-四(五氟苯基)硼酸鹽等錐鹽類;醌二疊氮(quinone dlazide)類;雙(苯基磺醯基)重氮曱烷等重氮曱烷類;1-苯 基-1-(4-曱基苯基)磺醯氧基_卜苯甲醯基曱烷、N羥基萘二 曱醯亞胺-三氟曱烷磺酸酯等磺酸酯類;二苯基二砜等二砜 110 201213360 類’二(2,4,6 -三氣甲基)-均三D井、2-(3,4-亞曱二氧基笨 基)-4,6-雙(三氯甲基)_均三畊等三畊類等化合物。該等光酸 產生劑可單獨使用’或組合複數種而使用。 光酸產生劑之含量相對於(A )成分100重量份,較佳 為0.01重量份以上、0.3重量份以下,更佳為〇 〇2重量份 以上、0_2重量份以下。藉此,具有反應性提高之效果。 感光性樹脂組成物除了以上之(A )、( B )、( c )之成分, 亦可含有增感劑等添加劑。 增感劑係具有增大光酸產生劑對光(活性放射線)之 感度,減少光酸產生劑之活化(反應或分解)所欲之時間 或能量之功能,及使光(活性放射線)之波長變化為適合 於光酸產生劑之活化之波長的功能者。 作為上述增感劑,可根據光酸產生劑之感度或增感劑 之吸收之峰值波長而適當選擇,並無特別限定,例如可列 舉· 9,1〇-二丁氧基蒽(CAS編號第76275-14-4號)之類之 蒽類、π山酮類、慧醌類、菲類、筷類、苯并花類、淨類 (fluoranthenes )、紅螢烯類、祐類、陰丹士林類、硫卩星·9_ 酮類(thi〇xanthen-9-_s)等,該等可單獨使用,或以混 合物之形式使用。 作為增感劑之具體例,例如可列舉:2_異丙基_9h-硫 _9·嗣、4-異丙基-9H-硫口星冬嗣、n4_丙氧基氧硫卩星、^ 噻d井(phenothiazine )或該等之混合物。 增感劑之含量於感光性樹脂組成物中較佳為〇〇ι重: %以上,更佳為0.5重量%以上’進而更佳$ i重量%以上 111 201213360 再者,上限值較佳為5重量%以下。Further, a monomer having an oxetanyl group, a monomer having an oxa group 109 s 201213360 ==, :: a ring having a monocyclic ring having an epoxy group; The oligomerization of the oxetan group and the initiation of the polymerization start slowly, but the growth reaction is faster. In this case, the monomer having an epoxy group and the polymer having an epoxy group start to aggregate. The reaction is faster, but the growth reaction is slower. Therefore, by using a monomer having an oxygen ring, an oligomer having an oxetane group, and/or a monomer having a %oxy group, having a ring The oligomeric oxy group 16' can reliably generate a difference in refractive index between the irradiated portion of the light or the active radiation and the unirradiated portion when the light is emitted or the active radiation. The amount of the component (B) added is relative to the component (A). 1 part by weight, preferably 1 part by weight or more, 5 parts by weight or less, more preferably 2 parts by weight or more and 2 parts or less of the replacement part. Thereby, the core/coating refractive index can be achieved. Modifications and the effect of coexistence between flexibility and heat resistance. ((C) Photoacid generator) As a photo-k generator, only It is preferable to produce a Bronsted acid or a Lewis acid for absorbing light (active radiation), and examples thereof include triphenyl nickel trifluoromethanesulfonate and tris(4·tributylphenyl). Nickel salts such as nickel-trifluorodecanesulfonium sulphate; diazonium salts such as p-nitrophenyldiazonium hexafluorophosphate; sulfonium salts, scale salts; diphenylsulfonium trifluorosulfonate Cone salts such as salt, (triisopropylphenyl) ruthenium-tetrakis(pentafluorophenyl)borate; quinone dlazide; bis (phenylsulfonyl) diazonium Sulfonate; 1-phenyl-1-(4-mercaptophenyl)sulfonyloxy-p-benzoyldecane, N-hydroxynaphthalene imine-trifluorodecanesulfonate, etc. Acid esters; disulfones such as diphenyl disulfone 110 201213360 'di(2,4,6 -trimethylmethyl)-all three D wells, 2-(3,4-indenylenedioxyphenyl) -4,6-bis(trichloromethyl)_three-tillage and other compounds such as three-tillage. These photoacid generators can be used alone or in combination of multiple species. The content of photoacid generator is relative to (A 100 parts by weight of the component, preferably 0.01 part by weight or more and 0.3 part by weight or less More preferably, it is 2 parts by weight or more and 0 2 parts by weight or less, whereby the effect of improving reactivity is obtained. The photosensitive resin composition may be in addition to the above components (A), (B), and (c). An additive containing a sensitizer, etc. The sensitizer has a function of increasing the sensitivity of the photoacid generator to light (active radiation) and reducing the time (or reaction) of activation (reaction or decomposition) of the photoacid generator, and The wavelength change of the light (active radiation) is a function suitable for the wavelength of activation of the photoacid generator. The sensitizer may be appropriately selected depending on the sensitivity of the photoacid generator or the peak wavelength of absorption of the sensitizer. It is not particularly limited, and examples thereof include an anthraquinone such as 9,1〇-dibutoxy anthracene (CAS No. 76275-14-4), a π-ketone, a quinone, a phenanthrene, and a chopstick. , benzo-flowers, fluoranthenes, red fluorenes, auxiliaries, indanthrene, thiopurine 9 ketones (thi〇xanthen-9-_s), etc., which can be used alone, Or use in the form of a mixture. Specific examples of the sensitizer include, for example, 2—isopropyl_9h-sulfur—9·嗣, 4-isopropyl-9H-sulfanylindole, n4_propoxyoxysulfide, ^ Phenothiazine or a mixture of these. The content of the sensitizer is preferably 〇〇ι: % or more, more preferably 0.5% by weight or more, and further preferably more than $% by weight, in the photosensitive resin composition. 111 201213360 Further, the upper limit is preferably 5% by weight or less.

可謀求所得核心層丨093 (光波導1〇〇9) 之特性之提高。 作為該抗氧化劑,可較佳地使用可自NewThe characteristics of the obtained core layer 丨 093 (optical waveguide 1 〇〇 9) can be improved. As the antioxidant, it can be preferably used from New

Tarrytown 之 Ciba Specialty Chemicals 公司獲得之 ciba (註 冊商‘,以下相同)irganox (註冊商標,以下相同)1〇76 及Ciba IRGAFOS (註冊商標,以下相同)168。 又,作為其他抗氧化劑,例如亦可使用Ciba Irgan〇x(註 冊商標,以下相同)129、Ciba Irganox 1330、Ciba Irganox (註冊商標)3 114、Ciba Irganox 3 125 等。 再者’上述抗氧化劑例如於膜19丨〇未曝露於氧化條件 下之情形、或曝露時間極其短之情形等時亦可省略。 以上感光性樹脂組成物中,尤佳為含有作為成分(A ) 之於侧鏈具有脫離性基之環烯樹脂、成分(C )之光酸產生 劑、及作為成分(B )之下述式(1〇〇 )中記載之第1單體 的感光性樹脂組成物。Ciba Specialty Chemicals of Tarrytown obtained ciba (registered by ‘, the same as below) irganox (registered trademark, the same below) 1〇76 and Ciba IRGAFOS (registered trademark, the same below)168. Further, as the other antioxidant, for example, Ciba Irgan〇x (registered trademark, the same applies 129), Ciba Irganox 1330, Ciba Irganox (registered trademark) 3 114, Ciba Irganox 3 125, or the like can be used. Further, the above-mentioned antioxidant may be omitted, for example, when the film 19 is not exposed to oxidizing conditions or when the exposure time is extremely short. In the above photosensitive resin composition, a cycloolefin resin having a debonding group as a component (A), a photoacid generator containing the component (C), and the following formula as the component (B) are particularly preferable. A photosensitive resin composition of the first monomer described in (1).

112 201213360 以下對尤佳之邊感光性樹脂組成物進行說明。 作為構成上述於側鏈具有脫離性基之環稀樹脂之環稀 樹脂(A),可使用如上述者,例如可列舉:環己婦、環辛 稀等單環體單體之聚合物;降㈣、降茨二稀、二環戍二 烯、二氫二環戊二烯、四環十二稀、三環戊二稀、二氮三 環戊二婦、四環戊二稀、二氫四環戊二稀等多環體單體之 聚合物等。該等之中,可較佳地使用自多環體單體之聚合 物中選狀i種以上之環烯樹脂。藉此,可提高樹脂之耐 熱性。 再者,作為聚合形態,可應用無規聚合、谈段聚合等 公知之形態。例如作為降获稀型單體之聚合之具體例,降 莰烯型單體之(共)聚合物、降莰烯型單體與烯烴類等 可共聚之其他單體之共聚物、及該等共聚物之氣化物等符 合具體例。該等環婦樹脂可藉由公知之聚合法而製造,其 聚合方法有加成聚合法與開環聚合法,上述 以加成聚合法而獲得之環嫌斯炉r +廿 ,B 衣席樹月曰(尤其是降莰烯系樹脂) P ’降莰烯系化合物之加成聚合物)。藉此,透明性、耐 熱性及可撓性優異。 乍為上述脫離性基’係指藉由由光酸產生劑產生之酸 I H )之作用來切斷分早夕_如八 千之一。卩分而脫離者。具體而言, Γ其=分子結構中(側鏈)具有如上所述之·〇結構、-Sl- :二構及-〇-Sl-結構中之至少1種者。如上所述之脫離性 基藉由酸(H+)之作Μ 」之作用而相對容易地脫離。 113 201213360 上述脫離性基中,作為藉由脫離而降低樹脂之折射率 之脫離性基,較佳為-Si-二苯基結構及_〇_Si_二苯基結構之 至少一者。 上述脫離性基之含量並無特別限定,較佳為於上述側 鏈具有脫離性基之環烯樹脂中之丨〇〜8〇重量%,尤其是更 佳為20〜60重量%。若含量為上述範圍内,則尤其是可撓 性與折射率調變功能(增大折射率差之效果)之並存優異。 作為上述於側鏈具有脫離性基之環烯樹脂,較佳為呈 =下述式UCH)及/或下述式(1〇2)所表示之重複單位者、。 曰此’可提高樹脂之折射率。112 201213360 The following is a description of the preferred photosensitive resin composition. As the cycloaliphatic resin (A) constituting the cycloaliphatic resin having a cleavable group in the side chain, the above may be used, and examples thereof include a polymer of a monocyclic monomer such as cyclohexanol or cyclooctane; (4), Dizedil, Dicyclodecadiene, Dihydrodicyclopentadiene, Tetracyclodene, Tricyclopentadiene, Dinitrotricyclopentanyl, Tetracyclopentadiene, Dihydrotetragen A polymer of a polycyclic monomer such as cyclopentane or the like. Among these, it is preferred to use a cycloolefin resin selected from the group consisting of polycyclic monomer monomers. Thereby, the heat resistance of the resin can be improved. Further, as the polymerization form, a known form such as random polymerization or talk polymerization can be applied. For example, as a specific example of polymerization for reducing a rare monomer, a copolymer of a (re)polymer of a norbornene type monomer, a norene-type monomer, and another copolymerizable monomer such as an olefin, and the like The vaporization of the copolymer and the like are in accordance with specific examples. The ring-forming resin can be produced by a known polymerization method, and the polymerization method includes an addition polymerization method and a ring-opening polymerization method, and the above-mentioned ring-shaped furnace obtained by an addition polymerization method is a ring-shaped furnace. (especially a decene-based resin) P'-addition polymer of a decene-based compound). Thereby, it is excellent in transparency, heat resistance, and flexibility. The above-mentioned detachment group means that the cleavage is caused by the action of the acid I H generated by the photoacid generator. Those who are separated from each other. Specifically, it has a molecular structure (side chain) having at least one of the above-described ? structure, -Sl-: two structure, and -〇-Sl- structure. The detachment group as described above is relatively easily detached by the action of the acid (H+). 113 201213360 In the above-mentioned release group, at least one of a -Si-diphenyl structure and a _〇_Si_diphenyl structure is preferable as the detachment group which lowers the refractive index of the resin by detachment. The content of the above-mentioned detachable group is not particularly limited, and is preferably 8% to 8% by weight, particularly preferably 20 to 60% by weight, based on the olefin resin having a cleavable group in the side chain. When the content is within the above range, in particular, the flexibility and the refractive index modulation function (the effect of increasing the refractive index difference) are excellent. The cycloolefin resin having a cleavable group in the side chain is preferably a repeating unit represented by the following formula UCH) and/or the following formula (1〇2). This can increase the refractive index of the resin.

(101) 9以下之整數) (式101中,η為〇以上 114 201213360(101) an integer of 9 or less) (In the formula 101, η is 〇 or more 114 201213360

上述感光性樹脂組成物含有上述式(丨〇〇)所記栽之單 體(以下稱作第1單體藉此,可進—步擴大左右之核心 /包覆間之折射率差。 第1單體之含量並無特別限定,相對於上述於側鏈具 有脫離性基之環烯樹脂1〇〇重量份,較佳為!重量份以上: 5〇重量份以下,尤佳為2重量份以上、20重量份以下。藉 此,可實現核心/包覆間之折射率調變,謀求可撓性與耐熱 性之並存。 如上述般,於將上述第丨單體與於側鏈具有脫離性基 之環烯樹脂加以併用之情形時,核心/包覆間之折射率調變 與可撓性之平衡優異,其原因可認為如下。 首先,於使用如上之感光性樹脂組成物之情形時,核 心/包覆間之折射率言周變優異,其原因在於,藉㈣用光(活 性放射線)照射等所產生之酸,而使帛1單㈣始聚合反 應時,第1單體之反應性優異。若第i單體之反應性優異, 則第1單體之硬化性變高’藉由帛1單體之濃度梯度而產 115 201213360 生之第1單體之擴散性得到提高。藉此,可增大光(活性 放射線)照、射區域與未照身于區域之折射率差。 又,第1單體為—官能,故進行聚合反應,作為感光 性樹脂組成物之交聯密度並不那麼高。因此,可換性亦優 異。 上述感光性樹脂組成物並無特別限定,亦可含有與上 述第丨單體不同之第2單體。再者,所謂與上述第,;體 不同之第2單體,可為結構不同之單體,亦 同之單體。 里个 其中’第2單體可作為成分(B)而含有,例如可列舉 二::“勿、與式(1〇〇)所表示者不同之其他氧雜環丁烧 t、乙稀^化合物等。該等之中,較佳為環氧化合物 =^月旨環式環氧化合物)及二官能之氧雜環丁院化合 物(八有2個氧雜環丁烧基之單體)之至少丄種。藉此, 第1單體與上述環稀樹脂之反應性,藉:可保 持透明性’且提高波導之耐熱性。 :為第2單體,具體可列舉:上述式(15)之化合物、 述式(12)之化合物、上述式(11)之化合物、上述式(⑴ 之化合物、上述式(19)之化合物、上述式( 之化合物。 / 、 樹脂:第重旦2單體之含量並無特別限定,相對於上述環稀 重里份,較佳為1重量份以上、5〇重量份以下, 尤其疋更佳為2重量份以上、2〇重量份以 高與上述第丨單體之反應性。 #此,可k 116 201213360 又’上述第2單體與上述第1單 1乐1早體之併用比例亦並無 特別限疋,以重量比(上述第 曰 早體之重上述第1單體 之重里)af,.較佳為〇.1〜1,尤佳為〇 1 兀住马0.1〜0.6。若併用比例 為上述範圍内,則反應性之速度盥波 I仪,、/反導之耐熱性之平衡優 異0 光酸產生劑之含量並無特別限定,相對於上述於側鍵 具有脫離性基之環烯系樹脂⑽重量份,較佳為〇 〇1重量 份以上、〇.3重量份以下,尤其是更佳為0.02重量份以上、 〇.2重量份以下。若含量未滿下限值’則存在反應性降低之 情形,若超出上述上限值,則存在於光波導上產生著色, 光損失降低之情形。 •上述感光性樹脂組成物除了上述環烯系樹脂、光酸產 生剑第1單體及第2單體以外,亦可含有硬化觸媒、抗 氧化劑等。 又,用於本發明之感光性樹脂組成物可用作核心部% 之形成用之組成物。 (光波導之製造方法) 圖16〜18、28、29、30、38、39、40係分別模式地表 示光波導之製造方法之步驟例的剖面圖。 此處,以使用成分(B )之折射率低於成分(a )之環 稀樹脂之情形之感光性樹脂組成物製造光波導的方法為例 進行說明。再者’光波導9'之製造方法與光波導9相同, 故以光波導9為代表。 首先’如圖16(A)、28(A)、38(A)所示,使感光 117 201213360 性樹脂組成物溶解於溶劑中,製備清漆9〇〇、19〇〇、29〇〇 (以下亦記作清漆900)’將該清漆9〇〇塗佈於包覆層91、 1091、2091 (以下亦記作包覆層91)上。 作為將感光性樹脂組成物製備成清漆狀之溶劑,例如 可列舉。:二乙醚、二異丙醚、1&gt;2_二甲氧基乙烷(聰)、 1’4 一 〇可烧、四氫呋喃(THF )、四氫吡喃(THP )、苯甲醚、 二乙二醇二甲醚(diglyme)、二乙二醇乙醚(卡必醇)等醚 系溶劑;甲基赛路蘇、乙基赛路蘇、苯基赛路蘇等赛路 系溶劑;己烷、戊烷 '庚烷、環己烷等脂肪族烴系溶劑·; 甲苯、二甲苯、苯、均三甲苯等芳香族煙系溶劑;’ 口比口井、吱喃 '吼略、嗔吩、甲基吼嘻咬嗣等芳香族雜二 物系溶劑;N,N-:f基甲醯胺(DMF)、n,n•二甲基乙° (DMA)等醯胺系溶劑;二氯甲烷、氣仿、!,2_二^乙醯胺 函素化合物系溶劑,·乙酸乙酷、乙酸甲酿、甲酸乙崎= 系溶劑;二曱基亞石風(DMS〇)、環丁石風等硫化合物 之各種有機溶劑;或含有該等之混合溶劑。 冷4 繼而’於光波導9之包覆層91上塗佈清漆9〇〇後 行乾燥,使溶劑蒸發(脫溶劑)。藉此,如圖Μ 、進 (B)、38⑻所示’清漆_成為光波導形成用之' 28 該膜910藉由下述光之照射’而成為形成有核心部94^° 覆部W5、·(以下亦記作包覆部95)之核心層= 1093、2093 (以下亦記作核心層93 )。 ' 此處,作為塗佈清漆900之方法,例如可列舉· 法、旋塗法、浸潰法、台式塗佈(tablecoat)法1霧=刀 118 201213360 敷料器(applicator )法、簾塗佈法、模塗法之方法,但並 不限定於該等。作為包覆層91,例如可使用折射率低於下 述核心部94之片材,例如可使用含有降莰烯系樹脂與環氧 樹脂之片材。 繼而’對膜910選擇性地照射光、活性放射線(例如 紫外線)。 此時,於圖17(A)、29(A)、39(如A所示,膜91〇、 1910、2910(以下亦記作膜910)之上方配置形成有開口之 遮罩Μ。經由該遮罩M之開口對膜91〇照射光(活性放射 線)。 作為所使用之光(活性放射線),例如可列舉於波長2㈧ .450^ nm之範圍具有峰值波長者。藉此,雖亦取決於光酸 產生劑之組成,但可使光酸產生劑相對容易地活化。 作為上述遮罩M之構成材料,可根據所照射之活性放 射線而適當選定。具體而言,作為遮罩m之構成材料,可 ^㈣對照射至上_ 91G之活性放射線進行遮光之材 右為具有上述特性者,則遮罩Μ之材料太| n ± 公知之任意者。 Μ之材枓本身亦可使用 亦可可為預先所形成(另外形成)者(例如板狀者), 為:910上例如藉由氣相成膜法或塗佈法形成者。 作為遮罩Μ而較佳者之例 基材等所製作之光罩、模心罝 由石央玻璃或ΡΕΤ 濺鍍等)f A 、板遮罩、猎由氣相成臈法(蒸鍍、 或模板遮罩。豆原因在於 4之中,尤佳為使用光罩 -原因在於,可精度良好地形成微細圖案, 119 201213360 且操作容易,有利於提高生產性。 又,光(活性放射線)之照射量並無特別限定,較佳 為0.1〜9 j/cm2左右,更佳為0.2〜ό J/cm2左右 二石,進而更佳 為0.2〜3 J/cm2左右》 再者’於使用如雷射光般指向性較高之光(活性放射 線)之情形時’亦可省略遮罩Μ之使用。 膜910中,於經光(活性放射線)照射之區域,由光 酸產生劑產生酸。藉由所產生之酸而使成分(Β )聚人。 於未經光(活性放射線)照射之區域,未由光酸產沒 劑產生酸,故成分(Β )不進行聚合。於照射部分,成分(β 進行聚合形成聚合物,故成分(Β )量變少。與此相應,沖 照射部分之成分⑻擴散至照射部分,藉此,於照: 與未照射部分產生折射率差。 此處’於成分⑻之折射率低於環婦樹脂之情 由於未照射部分之成分⑻擴散至照射部分,而使 部分之折射率變高,且照射部分之折射率變低。 再者,成分(Β )進行聚合而成 基之單體之折射率差A 。物與具有環_ 外耵丰差為0以上、0.001以下+ 士 , 射率大致相同。 工 n s忍為折 酸:產用Γ “性樹脂組成物之情形時,可藉由由 -夂產生知彳產生之酸,而開始成 观刀(B)之聚合。 進而,用於本發明之環婦樹脂 基,於使用且右胺触 J未必具有脫離 於使用”有脫隸基之環烯 時,產生以下作用。 乍為成刀(A)之情: 120 201213360 於照射光(活性放射線)之部分,藉由由光酸產生劑 產生之酸,使環烯樹脂之脫離性基脫離。於_si_芳基結構、 -Si-二苯基結構及-〇_si-二苯基結構等脫離性基之情形時, 可藉由脫離而降低樹脂之折射率。因此,照射部分之折射 率與脫離性基之脫離前相比進一步降低。 繼而,加熱膜91 0。於該加熱步驟中,經光(活性放射 線)照射之照射部分之成分(B )進一步聚合。另一方面, 於該加熱步驟中,未照射部分之成分(B)揮發。藉此,於 未照射部分,成分(B )變少,形成接近於環烯樹脂之折射 率。 於5亥膜910中’如圖17(b)、29(b)、39(b)所示, 經光(活性放射線)照射之區域成為包覆部95,未照射區 域成為核心部94。核心部94中之源自上述成分(b)之結 構體濃度 '與_ 95中之源自上述成分⑻之結構體 濃度不同。具體而言,核心告&quot;”之源自成分⑻之結 構體濃度低於包覆部95中之源自成分(B)之結構體濃度。 〇後邛95之折射率低於核心部%,包覆部%與 核心部94之折射率差為Λ , 马0.01以上。藉由上述方式,於膜 910形成核心部94與包霜郫^ 、匕復4 95,而獲得核心層93。 該加熱步驟中之加埶、、田 。 '皿度並無特別限定,較佳為30〜 18〇°C左右,更佳為4〇〜16(rc左右 又,加熱時間較佳為讯a 马叹疋為經光(活性放射線)照射 之,、、、射部分的成分(B)夕取 紅杜电 聚口反應大致結束,具體而言, 較佳為〇.1〜2小時左右, 更佳為0.1〜1小時左右。 121 201213360 其後,於該核心層93上貼附與包覆層91相同之膜β 該膜成為包覆層92、1092、2092 (以下亦記作包覆層92)。 一對包覆層91、92係自與包覆部95不同之方向,以夾持 核心部94之方式配置。 再者,包覆層92亦可並非藉由貼附膜狀者而藉由在核 心層93上塗佈液狀材料並使其硬化(固化)之方法形成。 作為包覆層91 (92)之形成方法,可為塗佈含有包覆 材之清漆(包覆層形成用材料)並使其硬化(固化)之方 法、塗佈具有硬化性之單體組成物並使其硬化(固化)之 方法專任意方法。 於以塗佈法形成包覆層91 ( 92 )之情形時,例如可列 舉旋塗法、浸潰法、台式塗佈法、噴霧法、敷料器法、簾 塗佈法 '模塗法等方法。 作為包覆層9 1 ( 92 )之構成材料,例如可列舉:丙稀 酸系樹脂、曱基丙烯酸系樹脂、聚碳酸酯、聚苯乙烯、環 氧樹脂、聚醯胺、聚醯亞胺、聚苯并垮唑、苯環丁烯系樹脂 或降莰烯系樹脂等環烯系樹脂等,可組合該等中之1種戋2 種以上(聚合物合金、聚合物混合物(blend )、共聚物7複 合體(積層體)等)而使用。 不 忒等之中,尤其是就耐熱性優異之方面而言,較佳為 使:環氧樹脂、聚醯亞胺、聚苯并垮唑、苯環丁烯系樹脂或 降坎烯系樹脂等環烯系樹脂、或含有其等者(以其等為主 者)’尤佳為以降莰烯系樹脂(降莰烯系聚合物)為主者。 降莰烯系聚合物之耐熱性優異,故於使用其作為包覆 122 201213360 層91 (92)之構成材料之光波導9中,於光波導9中形成 導體層時、加工導體層形成配線時,即便於安裝光學元件 等進行加熱時,亦可防止包覆層91(92)軟化而發生變形。 又’由於具有車交高之疏水性,故可獲得難以產生由吸 水引起之尺寸變化等之包覆層91 (92)。 又降坎烯系聚合物或作為其原料之降莰烯系單體就 相對廉價’容易獲得之方面而言,亦較佳。 進而,右使用以降莰烯系聚合物為主者作為包覆層W (92)之材料’則對f曲等變形之耐性優異,即便於重複 f曲變形之情形時,亦難以產生包覆層9卜92與核心層^ 之層間剝離,防止於包覆層91、93之内部產生微龜裂。並 且由於與可較佳地用作核心層93之構成材料之材料為相 同種類,故成為與核心層93之密著性更高者,可防止包覆 層91 (92)與核心層93之間之層間剝離。藉此,可獲得能 夠、准持光波導9之光傳輸性能,耐久性優異之光波導9。 包覆層91、92之平均厚度較佳為核心層93之平均厚 度之0.145倍左右,更佳為〇.3〜⑶倍左右,具體而言, 匕覆層91、92之平均厚度並無特別限定,通常 1〜〜左右,更佳為5〜1。…左右,進而更佳: 10〜6〇心左右。藉此,可防止光波導9不必要地大型化 (壓臈化),且可較佳地發揮作為包覆層之功能。 藉由以上步驟,可獲得圖18、3〇、4〇所示之光波導9。 又,於藉由用於本發明之感光性樹脂組成物而獲得光 波導9之情料,焊料耐回焊性尤其優異。進而,即便於 123 201213360 彎曲光波導9之情形時亦可減少光損失。 再者’於上述說明巾,對將感光性樹脂組成物直接供 給至包覆層91上’形成膜9 i〇 (核心層之情形進行了 說明’亦可於另-基材上形成膜91G (核心、層93 )後,將 所得之核心層93轉印至包覆層91或包覆層92上,其後經 由核心層93而重疊包覆層91與包覆層%。 上述基板例如使用⑪基板、二氧切基板、玻璃基板、 石英基板' 聚對苯二甲酸乙二酯(pET)膜等。 繼而,對本實施形態之作用效果進行說明。 ,若對本實施形態中所使用之感光性樹脂組成物照射 光則由光酸產生劑產生酸,僅於照射部分進行成分⑼) 之聚合。由此,照射部分中之成分⑻之量變少,故未照 射部分之成分⑻擴散至照射部,藉此,於照射部分與未 照射部分產生折射率差。具體而t,於本實施形態中,由 錢用折射率高於成分(B)之經取代或未經取代之環稀樹 月曰作為基質聚合物’故由於未照射部分之成分⑻擴散至 照射部分而使未照射部分之折射率高於照射部分之折射 率。 此外,若於光(活性放射線)照射後進行感光性樹脂 =物之加熱,則成分⑻自未照射部分揮發。藉此,於 …、射部分與未照射部分進一步產生折射率差。 如此般藉由使用感光性樹脂纟且点私 T日、,且成物,可於照射部分與 未…射部分確實地形成折射率差。又,根據本發明,可僅 以照射光(活性放射線)之簡單方法使核心部圖案化。例 124 201213360 : 如,藉由適當選擇光罩等之曝光圖案,可形成任意形狀或 配置之光程(核心部),又,亦可明確地形成較細之光程, 故有助於電路之積體化’而謀求裝置之小型化。即,根據 本發明’可獲得核心部之圖案形狀之設計的自由度較廣, 並且尺寸精度較高之核心部。 再者’先前已知藉由熱酸產生劑使具有氧雜環丁烧基 等之降莰烯系樹脂交聯之技術。然而,用於上述技術之組 成物含有具有氧雜環丁烷基等之降莰烯系樹脂作為基質聚 合物。並且,該組成物係加熱組成物整體,使組成物整體 產生父聯結構者。因此,先前使用之該組成物中全無藉由 選擇性地照射光(活性放射線)來產生酸,而選擇性地產 生聚合,使單體擴散至單體濃度變少之區域,從而形成濃 度差之技術思想。 ’相對於此,本實施形態中所使用之感光性樹脂組成物 係發現如下者:若選擇性地照射光(活性放射線),則藉由 酸之產生而使照射部分中之成分(B )之量變少,故未照射 部分之成分(B )擴散至照射部分,藉此於照射部分與未照 射部分產生折射率差。 又,於將環烯樹脂設為具有藉由由光酸產生劑產生之 §文而脫離,並藉由脫離而降低成分(A )之環烯樹脂之折射 率的脫離(生基者之情形時,可使經光(活性放射線)照射 之區域之折&amp;率與未照射區域相tb確實地降低。 ^另方面,於將環烯樹脂設為不具有脫離性基者之情 形寺側鏈化學性變得穩定,故可抑制由於光(活性放射 125 201213360 線)照射或加熱等條件而使核心部、包覆部之折射率發生 變動。 進而’於本實施形態中’使用降莰烯系樹脂作為成分 (A)。藉此’可確實地提高特定波長下之光穿透性,而可 確實謀求傳播損失之降低。 又’包覆部95之折射率低於核心部94,藉由將包覆部 95與核心部94之折射率差設為〇,〇 1以上,可將光確實地 封入梭心部94内,而可抑制光之傳播損失之產生。 另一方面,先前已知含有聚合物、單體、助觸媒及觸 媒前驅物作為光波導形成用之組成物者。 其中’單體係藉由光(活性放射線)之照射形成反應 物,可使經光(活性放射線)照射之區域之折射率與未照 射區域之折射率不同者。 又’觸媒前驅物係可使單體之反應(聚合反應、交聯 反應等)開始之物質,且為利用藉由光(活性放射線)之 照射而活化的助觸媒之作用而使活化溫度發生變化之物 質。藉由該活化溫度之變化,而使光(活性放射線)之照 射區域與未照射區域之間,開始單體之反應之溫度不同, 結果僅於照射區域形成反應物。 與此相對’本實施形態中所使用之感光性樹脂組成物 無須設為上述含有大量金屬元素之物質。因此,可防止如 上所述之傳播損失之增加,而獲得傳播效率優異且財熱性 優異之光波導9。 即便於使用上述先前之組成物之情形時,亦可藉由光 126 201213360 (活性放射線)照射而分開製作核心部與包覆部,但根據 本實轭形態中所使用之感光性樹脂組成物,可進一步擴大 核〜。p 94與包覆部95之折射率差,且耐熱性得到提高, 故可獲得可靠性更高之光波導9。其主要係由使成分(a) 及成分(B)之組成最佳化而產生者。 本發明藉由使用上述感光性樹脂組成物,可提供光之 傳播損失之產生得到抑制之光波導膜m於形成彎 曲之光波導之情形時,i日日月5彳 时了明顯抑制光之傳播損失之產生。 又,根據如上之贺彳皮士 製&amp;方法,可以簡單之處理,並且於 短時間内獲得具有所欲之报业 。a &gt; 、 力^奴之形狀,且具有尺寸精度較高之核 心部94之光波導9。 繼而:對導光程之製造方法進行說明。 士上述第14及第15實施形態般,於貫通孔1022内形 成單一之導體部24之愔 隋形時,首先,藉由上述方法於貫 孔1022之内周面形成逡 ^ 成導體。&quot;,繼*,於其内側填充上述 核心層形成用材料1 n . ,視品要(根據核心層形成用材料 19 0 0之組成或特性)推彡_、工^ 進仃活性放射線之照射及加熱 心層形成用材料19〇〇 使核 藉此形成導光程1024。 於自亥情形時,朵、、由道 ^ 〇09之核心層1093之形成盥導 光程1024之形成可 成'、導 謂之核d 同時進行光波導 之全成步驟與導^難之形成步驟 分。藉此,可減少=:::行加熱步驟之全部或—部 間内進行製造。 ^驟數,更加容易且於更短之時 127 201213360 如上述第1 6第1 7及第1 8實施形態般,於貫通孔丨022 内形成垂直光波導1〇23之情形時,首先,藉由上述方法, 於貫通孔1022之内面之全周或一部分(矩形部1224)形成 導體部1003 ’繼而於其内側(或圓形部1222)填充上述核 心層形成用材料測、繼而,藉由上述方法,僅對經填充 之核心層形成用材料1900中例如應成為包覆部1〇25之部 位選擇性地照射活性放射線’視需要(根據核心層形成用 材料灣之組成或特性)進行至少i次加熱,而形成核心 部1024與包覆部1()25β關於活性放射線之照射方法或條 件、加熱方法或條件、及其他事項,可與上述相同。 於該情形時’光波導1009之核心層1〇93之形成與垂 直光波導23之形成可分別單獨進行,亦可同時進行光波導 聊之核心層聰之形成步驟與垂直光波導Η)23之形成 步驟之全部或—部分。例如,可同時進行核心層形成用材 料1900之供給(塗佈 '填充)步驟、活性放射線之照射步 驟、加熱步驟等中之全部或一部分。藉此,可減少製造之 步驟數’更加容易於更短之時間内進行製造。 再者,於本發明中’光波導結構體之基本結構、層構 成、各部之形狀、數量、配置等當然並不限定於圖示者。 又’於上述各實施形態中’作為元件,以發光元件ι〇ι〇 作為代表例進行了說明,亦可為裝載具有受光部之受光元 件而替代發光元件i G i 〇之構成。於該情形時,例如可藉由 光波導⑽9、光程轉換部職及導光程(核心部)Ml 而形成將傳…㈣導向受光元件之受光 128 201213360 然,亦可為將發光元件與受光元件之 又,*v L 4 裝载至少1組者。 ;上述各實施形態中,對具 _ 進行了今明t 八頁么先兀件2010之例 者:V可具有發光元件_及受光元件之任-或二r為將發光元件與受光元件之兩者裝… 略。 者。又’電子電路元件(電子電路部)亦可省 以上,基於圖示之各實施形態對本發明進 但本發明並不限^於該等,各部之構成可置換H 相同功能之任意構成’又’亦可附加任意構成 又,本發明並不限定於上述實施形態,可達成本 之目的之範圍的變形、改良等包含於本發明中。 又,於上述實施形態中,使用感光性樹月旨址成物形成 光波導膜,但並不限於此,亦可用於全像片等。上述感一 性樹脂組成物適合形成混合存在折射率較高之區域與折: 率較低之區域之膜。 一、 [實施例] 繼而’對本發明之實施例進行說明。 A·光波導之製造 (實施例1 ) (1)具有脫離性基之降获稀系樹脂之合成 於水分及氧氣濃度均控制在i ppm以下而充滿乾燥氮 氣之套手工作箱中,於500 mL小玻璃瓶稱量己基降莰烯 (hexyl norbornene) ( HxNB ) 7.2 g ( 40.1 mmol ^ J —本暴曱 基降莰烯曱氧基矽烷12_9g(40.1 mmol ),添加脫水甲笨6〇 129 201213360 g與乙自欠乙自曰llg’覆蓋碎製之封塞物(sea】er),密检上部。 繼而,於100 mL小玻璃瓶申稱量下述化學式(B )所 表不之Ni觸媒1.56 g ( 3.2 mmol)與脫水甲苯1〇 mL,放 入攪拌器晶片(stirrer chip)並密栓,充分攪拌觸媒使其完 全溶解。 利用注射器準確稱量該下述化學式(B)所表示之川 觸媒溶液1 mL ’冑纟定量地注入至上述溶解# 2種降获稀 之小玻璃瓶中,於室溫下揽#丨小時,結果確認到明顯之 黏度上升。此時’拔掉塞子,添加四氫呋喃(层 進行攪拌’獲得反應溶液。 於100 m L燒杯中添加乙酸酐9·5 g、過氧化氫水18丨 (濃度3〇%)、離子交換水30 g,進行攪拌,當場製備過乙 酸水溶液。繼而,將該水溶液總量添加至上述反應溶液中 攪拌12小時,進行Ni之還原處理。 繼而’將完成處理之反應溶液換移至分液漏斗中,去 除下部之水層後,添加異丙醆 共内醇之3〇%水溶液100 mL,進行 劇烈授拌。進行靜置,完全進行二層分離後去除水層。以 合計3次重複該水洗製程後,將油層滴加至非常過量之丙 酮中’使生成之聚合物再呤,,士 丹-人沈歲’藉由過濾與濾液分離後, 於設定為60°C之真空兹怪裇a 乾知機中加熱乾燥12小時,藉此獲得 聚合物#卜聚合物W之分早旦 里刀佈根據 GPC( Gel PermeationThe photosensitive resin composition contains a monomer recorded by the above formula (hereinafter referred to as a first monomer, whereby the refractive index difference between the core and the cladding can be further expanded. The content of the monomer is not particularly limited, and is preferably a part by weight or more based on 1 part by weight of the cycloolefin resin having a leaving group in the side chain: 5 parts by weight or less, particularly preferably 2 parts by weight or more. 20 parts by weight or less. Thereby, the refractive index change between the core and the coating can be achieved, and the flexibility and heat resistance can be achieved. As described above, the second monomer is desorbable from the side chain. When the cycloolefin resin is used in combination, the balance between the refractive index of the core and the coating is excellent in the balance of flexibility, and the reason is considered as follows. First, when the photosensitive resin composition as described above is used, The refractive index of the core/coating is excellent, because the reactivity of the first monomer is obtained by the polymerization of light (active radiation) or the like, and the polymerization of the first monomer is carried out. Excellent. If the reactivity of the i-th monomer is excellent, the first one The hardenability becomes higher. The yield of the first monomer produced by the concentration gradient of 帛1 monomer is increased. The diffusivity of the first monomer produced by 201213360 is improved. Thereby, the light (active radiation), the radiation area and the unilluminated area can be increased. Further, since the first monomer is a functional group, the polymerization reaction is carried out, and the crosslinking density of the photosensitive resin composition is not so high. Therefore, the recyclability is also excellent. The material is not particularly limited, and may further contain a second monomer different from the above-mentioned second monomer. Further, the second monomer different from the above-mentioned first embodiment may be a monomer having a different structure, and the same In the above, the 'second monomer' may be contained as the component (B), and for example, two: "No, other than the one represented by the formula (1〇〇), other oxetane, t, B a compound such as a dilute compound, etc., preferably an epoxy compound = a cyclic epoxy compound) and a difunctional oxetane compound (a monomer having two oxetan groups) At least one of the above, whereby the reactivity of the first monomer with the above-mentioned ring-thin resin, by: The transparency is improved, and the heat resistance of the waveguide is improved. The second monomer is specifically a compound of the above formula (15), a compound of the formula (12), a compound of the above formula (11), and the above formula ((1). The content of the compound, the compound of the above formula (19), the compound of the above formula (or the compound: /, the resin: the second heavy monomer) is not particularly limited, and is preferably 1 part by weight or more, and 5 parts by weight with respect to the above-mentioned ring-dense portion. It is more preferably 2 parts by weight or more and 2 parts by weight or more of the reactivity with the above-mentioned second monomer in the weight part or less. #本,可可 k 116 201213360 Further 'the above-mentioned second monomer and the above-mentioned first single There is no particular limitation on the ratio of the combination of the 1 and the 1 body, and the weight ratio (the weight of the first monomer in the above-mentioned first body) is af, preferably 〇.1 to 1, especially preferably 〇 1 兀 live horse 0.1~0.6. When the combined ratio is within the above range, the reactivity is high, and the balance of the heat resistance of the anti-conversion is excellent. The content of the photo-acid generator is not particularly limited, and has a debonding group with respect to the above-mentioned side bond. The amount by weight of the cycloolefin-based resin (10) is preferably 重量1 part by weight or more, 〇.3 parts by weight or less, more preferably 0.02 part by weight or more, or 0.2 part by weight or less. If the content is less than the lower limit value, the reactivity may be lowered. When the content exceeds the above upper limit, coloring may occur in the optical waveguide, and light loss may be reduced. The photosensitive resin composition may contain a curing catalyst, an antioxidant, or the like in addition to the above-mentioned cycloolefin-based resin, photo-acid-producing first monomer, and second monomer. Further, the photosensitive resin composition used in the present invention can be used as a composition for forming a core portion %. (Manufacturing Method of Optical Waveguide) Figs. 16 to 18, 28, 29, 30, 38, 39, and 40 are cross-sectional views each schematically showing a procedure example of a method of manufacturing an optical waveguide. Here, a method of producing an optical waveguide using a photosensitive resin composition in which the refractive index of the component (B) is lower than that of the epoxy resin of the component (a) will be described as an example. Further, the manufacturing method of the 'optical waveguide 9' is the same as that of the optical waveguide 9, and therefore the optical waveguide 9 is representative. First, as shown in Figs. 16(A), 28(A), and 38(A), the photosensitive 117 201213360 resin composition is dissolved in a solvent to prepare varnish 9 〇〇, 19 〇〇, 29 〇〇 (hereinafter also It is referred to as varnish 900)' The varnish 9 is applied to the coating layers 91, 1091, and 2091 (hereinafter also referred to as a coating layer 91). The solvent for preparing the photosensitive resin composition into a varnish is, for example, a solvent. Diethyl ether, diisopropyl ether, 1&gt;2-dimethoxyethane (Cong), 1'4 oxime, tetrahydrofuran (THF), tetrahydropyran (THP), anisole, diethyl An ether solvent such as diglyme or diethylene glycol diethyl ether (carbitol); a solvent such as methyl stilbene, ethyl 赛路苏, phenyl 赛路苏; hexane, An aliphatic hydrocarbon solvent such as pentane 'heptane or cyclohexane · an aromatic fumes such as toluene, xylene, benzene or mesitylene; 'mouth ratio well, 吱 吼 ' 吼 嗔, 嗔 、, A A solvent such as an aromatic heterodimer such as a bite; a guanamine solvent such as N,N-:f-methylformamide (DMF) or n,n•dimethylethyl (DMA); dichloromethane; Gas imitation,! , 2_2^ acetaminophen compound solvent, · ethyl acetate, acetic acid, acetic acid, ethyl acetate, solvent; diterpene sulphur (DMS 〇), ring butyl stone, etc. a solvent; or a mixed solvent of the same. The cold 4 is then applied to the cladding layer 91 of the optical waveguide 9 by applying varnish 9 〇〇 and then dried to evaporate the solvent (desolvation). Thereby, as shown in Fig. 进, (B), and 38 (8), 'varnish _ is used for forming an optical waveguide. 28 The film 910 is formed with a core portion 94? The core layer (hereinafter also referred to as the cladding portion 95) = 1093, 2093 (hereinafter also referred to as the core layer 93). Here, examples of the method of applying the varnish 900 include a method, a spin coating method, a dipping method, and a table coating method. 1 Fog=knife 118 201213360 Applicator method, curtain coating method The method of the die coating method, but is not limited to these. As the coating layer 91, for example, a sheet having a refractive index lower than that of the core portion 94 can be used, and for example, a sheet containing a norbornene-based resin and an epoxy resin can be used. Then, the film 910 is selectively irradiated with light or active radiation (e.g., ultraviolet light). At this time, in Fig. 17 (A), 29 (A), and 39 (as shown in A, a mask 形成 in which an opening is formed is disposed above the film 91 〇, 1910, and 2910 (hereinafter also referred to as a film 910). The opening of the mask M emits light (active radiation) to the film 91. The light (active radiation) used is, for example, a wavelength of 2 (eight) and a peak wavelength in the range of 450 μm. The composition of the photo-acid generator can be activated relatively easily. The constituent material of the mask M can be appropriately selected depending on the active radiation to be irradiated. Specifically, it is used as a constituent material of the mask m. (4) The material that illuminates the active radiation irradiated to the upper _91G is the one having the above characteristics, and the material of the mask 太 is too | n ± any known one. The material itself may be used or may be The formed (otherwise formed) (for example, a plate-shaped one) is formed by, for example, a vapor phase film formation method or a coating method on 910. The light produced by the substrate or the like is preferable as a mask. Cover, mold core, sapphire glass or enamel splash, etc.) f A , plate cover Cover and hunting are made by gas phase smelting method (vapor deposition, or stencil mask. The reason for beans is 4, especially the use of reticle - because the fine pattern can be formed accurately, 119 201213360 and easy to operate, favorable Further, the amount of irradiation of light (active radiation) is not particularly limited, but is preferably about 0.1 to 9 j/cm 2 , more preferably about 0.2 to ό J/cm 2 , and more preferably 0.2 to 2 3 J/cm2 or so" In the case of using light with high directivity (active radiation) such as laser light, the use of the mask can be omitted. In the film 910, the area irradiated by light (active radiation) The acid is generated by the photoacid generator, and the component (Β) is concentrated by the acid produced. In the region not irradiated with light (active radiation), the acid is not produced by the photoacid generator, so the component (Β In the irradiated portion, the component (β is polymerized to form a polymer, so the amount of the component (Β) is reduced. Accordingly, the component (8) of the irradiated portion is diffused to the irradiated portion, whereby the photo is irradiated with and not irradiated. Partially produces a refractive index difference. Here' When the refractive index of the component (8) is lower than that of the epoxy resin, since the component (8) of the unirradiated portion diffuses to the irradiated portion, the refractive index of the portion becomes high, and the refractive index of the irradiated portion becomes low. Further, the component (Β) The refractive index difference A of the monomer which is polymerized to form a base. The difference between the substance and the ring 耵 outer 为 is 0 or more, 0.001 or less + y, and the irradiance is substantially the same. The ns are enduring the acid: the Γ resin In the case of the composition, the polymerization of the knives (B) can be started by the production of the acid generated by the enthalpy. Further, the ring-forming resin base used in the present invention is not necessarily used in the use of the right amine. When it has a detachment from the use of a cycloolefin having a cleavage group, the following effects occur.乍为成刀(A): 120 201213360 In the part of the illuminating light (active radiation), the detachment group of the cycloolefin resin is detached by the acid generated by the photoacid generator. In the case of a detachment group such as a _si_aryl structure, a -Si-diphenyl structure, and a -〇-si-diphenyl structure, the refractive index of the resin can be lowered by detachment. Therefore, the refractive index of the irradiated portion is further lowered as compared with before the detachment of the detachment group. Then, the film 91 0 is heated. In this heating step, the component (B) of the irradiated portion irradiated with light (active radiation) is further polymerized. On the other hand, in this heating step, the component (B) of the unirradiated portion is volatilized. Thereby, the component (B) is reduced in the unirradiated portion, and a refractive index close to that of the cycloolefin resin is formed. In the 5th film 910, as shown in Figs. 17(b), 29(b), and 39(b), the region irradiated with light (active radiation) becomes the cladding portion 95, and the non-irradiated region becomes the core portion 94. The concentration of the structure derived from the above component (b) in the core portion 94 is different from the concentration of the structure derived from the above component (8) in _95. Specifically, the core concentration of the component (8) is lower than the concentration of the structure derived from the component (B) in the coating portion 95. The refractive index of the crucible 95 is lower than the core portion %, The difference in refractive index between the cladding portion % and the core portion 94 is Λ, and the horse is 0.01 or more. By the above-described manner, the core portion 94 and the cream 郫 匕 and 匕 4 4 95 are formed on the film 910 to obtain the core layer 93. In the step, the twisting, the field. The degree of the dish is not particularly limited, preferably about 30 to 18 ° ° C, more preferably 4 〇 ~ 16 (around rc, heating time is better for the news a horse sigh For the light-emitting (active radiation), the component (B) of the irradiated portion is substantially terminated, and specifically, it is preferably about 1 to 2 hours, more preferably 0.1. ~1 hour or so. 121 201213360 Thereafter, a film β similar to the coating layer 91 is attached to the core layer 93. The film is a coating layer 92, 1092, and 2092 (hereinafter also referred to as a coating layer 92). The cladding layers 91 and 92 are disposed in a direction different from the cladding portion 95 so as to sandwich the core portion 94. Further, the cladding layer 92 may not be borrowed. It is formed by coating a liquid material on the core layer 93 and hardening (curing) it by attaching a film shape. As a coating method of the coating layer 91 (92), it can apply a coating material. A method of hardening (curing) a varnish (a material for forming a coating layer), a method of applying a curable monomer composition, and hardening (curing) a method of forming a package by a coating method In the case of the coating layer 91 (92), for example, a spin coating method, a dipping method, a table coating method, a spray method, an applicator method, a curtain coating method, a die coating method, or the like can be mentioned. Examples of the constituent material of (92) include an acrylic resin, a mercapto acrylic resin, polycarbonate, polystyrene, epoxy resin, polyamine, polyimide, polybenzoxazole, A cycloolefin-based resin such as a benzenecyclobutene-based resin or a decene-based resin may be combined with one or more of these kinds (polymer alloy, polymer mixture (blend), and copolymer 7 composite (layered) Use, etc.), etc., especially in terms of excellent heat resistance Preferably, it is a cycloolefin-based resin such as an epoxy resin, a polyimine, a polybenzoxazole, a benzocyclobutene resin or a decene-based resin, or the like In particular, it is mainly a decene-based resin (northene-based polymer). The decene-based polymer is excellent in heat resistance, so it is used as a coating 122 201213360 layer 91 (92). In the optical waveguide 9 of the material, when the conductor layer is formed in the optical waveguide 9, and the wiring is formed in the processed conductor layer, even when the optical element or the like is heated, the coating layer 91 (92) can be prevented from being softened and deformed. 'Because of the hydrophobicity of the vehicle crossover, the coating layer 91 (92) which is less likely to cause dimensional changes due to water absorption or the like can be obtained. It is also preferable that the norbornene-based polymer or the norbornene-based monomer as a raw material thereof is relatively inexpensive and is easily available. Further, the use of the decene-based polymer as the material of the coating layer W (92) is excellent in resistance to deformation such as f-curvature, and it is difficult to produce a coating layer even when the f-bending deformation is repeated. The peeling between the layers of the core layer 92 and the core layer is prevented to cause microcracking inside the cladding layers 91 and 93. Further, since it is of the same kind as the material which can be preferably used as the constituent material of the core layer 93, the adhesion to the core layer 93 is higher, and the coating layer 91 (92) and the core layer 93 can be prevented. The layers are peeled off. Thereby, the optical waveguide 9 capable of holding and maintaining the optical transmission performance of the optical waveguide 9 and having excellent durability can be obtained. The average thickness of the cladding layers 91, 92 is preferably about 0.145 times the average thickness of the core layer 93, more preferably about 0.3 to (3) times. Specifically, the average thickness of the cladding layers 91, 92 is not particularly Limited, usually 1~~, preferably 5~1. ... around, and thus better: 10~6 〇 heart around. Thereby, the optical waveguide 9 can be prevented from being unnecessarily enlarged (compressed), and the function as a coating layer can be preferably exhibited. By the above steps, the optical waveguide 9 shown in Figs. 18, 3A, and 4B can be obtained. Further, in the case where the optical waveguide 9 is obtained by the photosensitive resin composition of the present invention, the solder reflow resistance is particularly excellent. Further, even in the case where the optical waveguide 9 is bent at 123 201213360, the light loss can be reduced. In the above description, the photosensitive resin composition is directly supplied onto the coating layer 91 to form a film 9 i (the case where the core layer is described), and the film 91G may be formed on the other substrate. After the core and the layer 93), the obtained core layer 93 is transferred onto the cladding layer 91 or the cladding layer 92, and thereafter the cladding layer 91 and the cladding layer % are overlapped via the core layer 93. The substrate is used, for example, 11 a substrate, a diced substrate, a glass substrate, a quartz substrate, a polyethylene terephthalate (pET) film, etc. Next, the effects of the present embodiment will be described. The photosensitive resin used in the present embodiment. When the composition is irradiated with light, an acid is generated by the photoacid generator, and polymerization of the component (9)) is carried out only in the irradiated portion. Thereby, the amount of the component (8) in the irradiated portion is reduced, so that the component (8) of the unexposed portion is diffused to the irradiating portion, whereby a refractive index difference occurs between the irradiated portion and the unirradiated portion. Specifically, in the present embodiment, the substituted or unsubstituted ring scutellaria having a higher refractive index than the component (B) is used as the matrix polymer, so that the component (8) of the unirradiated portion diffuses to the irradiation. Partly, the refractive index of the unirradiated portion is higher than the refractive index of the irradiated portion. Further, when the photosensitive resin = the object is heated after the irradiation of the light (active radiation), the component (8) is volatilized from the unirradiated portion. Thereby, a refractive index difference is further generated in the ..., the irradiated portion and the unirradiated portion. By using the photosensitive resin in a manner as described above, it is possible to form a refractive index difference between the irradiated portion and the unexposed portion by using the object. Further, according to the present invention, the core portion can be patterned by a simple method of irradiating light (active radiation). Example 124 201213360: If an exposure pattern such as a mask or the like is appropriately selected, an optical path (core portion) of an arbitrary shape or arrangement can be formed, and a finer optical path can be formed explicitly, thereby contributing to the circuit. The product is integrated and the device is miniaturized. Namely, according to the present invention, it is possible to obtain a core portion having a wide degree of freedom in designing a pattern shape of a core portion and having high dimensional accuracy. Further, a technique of crosslinking a norbornene-based resin having an oxetan group or the like by a thermal acid generator has been known. However, the composition used in the above technique contains a norbornene-based resin having an oxetane group or the like as a matrix polymer. Further, the composition heats the entire composition so that the composition as a whole has a parent structure. Therefore, the composition used in the prior art does not selectively generate light by selectively irradiating light (active radiation), and selectively generates polymerization to diffuse the monomer to a region where the monomer concentration becomes small, thereby forming a concentration difference. Technical thinking. In contrast, in the photosensitive resin composition used in the present embodiment, it is found that when light (active radiation) is selectively irradiated, the component (B) in the irradiated portion is caused by the generation of an acid. Since the amount is small, the component (B) which is not irradiated is diffused to the irradiated portion, whereby a refractive index difference is generated between the irradiated portion and the unirradiated portion. Further, in the case where the cycloolefin resin is desorbed by the photoacid generator, the refractive index of the cycloolefin resin of the component (A) is lowered by the detachment (in the case of the base) It is possible to surely reduce the folding &amplitude ratio of the region irradiated by the light (active radiation) to the unirradiated region phase tb. ^In other respects, the case of the cycloolefin resin is not the detachable matrix. Since the property is stabilized, it is possible to suppress the refractive index of the core portion and the cladding portion from being changed by conditions such as irradiation or heating of the light (active radiation 125 201213360 line). Further, in the present embodiment, 'the decene-based resin is used. As the component (A), it is possible to surely improve the light transmittance at a specific wavelength, and it is possible to surely reduce the propagation loss. Further, the refractive index of the cladding portion 95 is lower than that of the core portion 94 by The difference in refractive index between the covering portion 95 and the core portion 94 is 〇, 〇1 or more, and the light can be surely enclosed in the bobbin portion 94, and the generation of light propagation loss can be suppressed. On the other hand, it is known that the polymerization is contained. Matter, monomer, catalyst and catalyst precursor As a composition for forming an optical waveguide, wherein the 'single system forms a reactant by irradiation of light (active radiation), the refractive index of the region irradiated with light (active radiation) is different from that of the unirradiated region. Further, the 'catalyst precursor is a substance which starts a reaction of a monomer (polymerization reaction, crosslinking reaction, etc.) and is activated by a catalyst which is activated by irradiation of light (active radiation). The substance whose activation temperature changes is changed by the change of the activation temperature, and the temperature at which the reaction of the monomer starts is different between the irradiation region of the light (active radiation) and the non-irradiated region, and as a result, the reactant is formed only in the irradiation region. On the other hand, the photosensitive resin composition used in the present embodiment does not need to be a substance containing a large amount of a metal element as described above. Therefore, it is possible to prevent an increase in propagation loss as described above, and it is excellent in propagation efficiency and excellent in heat recovery. The optical waveguide 9. In the case where the above-mentioned previous composition is convenient to use, it can also be irradiated by the light 126 201213360 (active radiation). Although the core portion and the coating portion are formed, the refractive index difference between the core p. and the coating portion 95 can be further increased by the photosensitive resin composition used in the embodiment of the present yoke, and the heat resistance can be improved. The optical waveguide 9 having higher reliability is obtained, which is mainly produced by optimizing the composition of the component (a) and the component (B). The present invention can provide light propagation loss by using the above-mentioned photosensitive resin composition. When the optical waveguide film m which is suppressed is formed in the case where the curved optical waveguide is formed, the propagation loss of the light is remarkably suppressed at the time of the day, the sun, the moon, the moon, and the like. It is simple to process, and in a short time, obtains the optical waveguide 9 of the core portion 94 having the desired shape of the newspaper, a &gt; Next, the manufacturing method of the light guiding path will be described. In the case of forming the single conductor portion 24 in the through hole 1022 as in the fourteenth and fifteenth embodiments, first, a conductor is formed on the inner circumferential surface of the through hole 1022 by the above method. &quot;, followed by *, filling the core layer forming material 1 n . on the inner side thereof, and depending on the composition or characteristics of the core layer forming material 19 0 0, the irradiation of the active radiation And heating the core layer forming material 19 to cause the core to form the light guiding path 1024. In the case of self-hai, the formation of the optical path 1024 by the formation of the core layer 1093 of the channel 可09 can be formed as a ', the core of the derivative d, and the formation of the optical waveguide and the formation of the guide Step points. Thereby, it is possible to reduce the manufacturing of all or part of the =::: row heating step. ^The number of the steps is easier and shorter. 127 201213360 In the case of forming the vertical optical waveguide 1〇23 in the through hole 022 as in the above-described first, first, seventh, and eighth embodiments, first, By the above method, the conductor portion 1003' is formed on the entire circumference or a part (the rectangular portion 1224) of the inner surface of the through hole 1022, and then the inner layer (or the circular portion 1222) is filled with the material for forming the core layer, and then In the method of the core layer forming material 1900, for example, the active radiation is selectively irradiated to the portion of the filled core layer forming material 1900, for example (according to the composition or characteristics of the core layer forming material bay), at least i The heating method to form the core portion 1024 and the coating portion 1 () 25β with respect to the active radiation, the heating method or conditions, and other matters may be the same as described above. In this case, the formation of the core layer 1 〇 93 of the optical waveguide 1009 and the formation of the vertical optical waveguide 23 can be performed separately, and the core layer of the optical waveguide can be simultaneously formed and the vertical optical waveguide 23 23 Form all or part of the steps. For example, all or a part of the supply (coating & filling) step of the core layer forming material 1900, the irradiation step of the actinic radiation, the heating step, and the like may be simultaneously performed. Thereby, the number of steps of manufacturing can be reduced, making it easier to manufacture in a shorter period of time. Further, in the present invention, the basic structure, the layer constitution, the shape, the number, the arrangement, and the like of the optical waveguide structure are of course not limited to those shown in the drawings. Further, in the above-described respective embodiments, the light-emitting element ι 〇 〇 is used as a representative example, and a light-receiving element having a light-receiving portion may be mounted instead of the light-emitting element i G i 〇. In this case, for example, the optical waveguide (10) 9, the optical path conversion unit, and the optical path (core portion) M1 can be used to form the light receiving light transmitted to the light receiving element 128 201213360, or the light emitting element and the light receiving unit. In addition, *v L 4 loads at least one group. In the above embodiments, the example of the present invention is as follows: V may have a light-emitting element _ and any of the light-receiving elements - or two of the two may be a light-emitting element and a light-receiving element. Loading... Slightly. By. Further, the 'electronic circuit component (electronic circuit unit) may be omitted or more. The present invention is not limited to these embodiments based on the respective embodiments shown in the drawings, and the configuration of each component may replace any configuration of the same function of H. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like in the range of the object of the cost are included in the present invention. Further, in the above embodiment, the optical waveguide film is formed using the photosensitive tree-like object, but the invention is not limited thereto, and may be used for a full-image film or the like. The above-mentioned photosensitive resin composition is suitable for forming a film in which a region having a high refractive index and a region having a low refractive index are mixed. 1. [Embodiment] Next, an embodiment of the present invention will be described. A. Production of Optical Waveguide (Example 1) (1) Synthesis of a reduced-resistance resin having a release group is controlled in a hand-working box filled with dry nitrogen at a moisture and oxygen concentration of less than i ppm. ML small glass bottle weighing hexyl norbornene ( HxNB ) 7.2 g ( 40.1 mmol ^ J - the present sulphur-based decyl decyloxy decane 12_9g (40.1 mmol), adding dehydrated a stupid 6 〇 2012 2012 2012 2012 60 g and B from the 乙 曰 曰 曰 ' ' ' ' ' ' ' ' ' ' ' ' , , , , , , , , , , , , , , , , , , , 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰1.56 g (3.2 mmol) of the medium and 1 〇 mL of dehydrated toluene were placed in a stirrer chip and tightly plugged, and the catalyst was thoroughly stirred to completely dissolve it. The following chemical formula (B) was accurately weighed by a syringe. 1 mL of the Chuan catalyst solution was quantitatively injected into the above-mentioned dissolved #2 kinds of thin glass bottles, and the temperature was increased at room temperature for #丨 hours, and it was confirmed that the viscosity increased. At this time, the plug was pulled out. Add tetrahydrofuran (layer is stirred) to obtain the reaction solution. In a 100 m L beaker 9:5 g of acetic anhydride, 18 Torr of hydrogen peroxide (concentration: 3〇%), 30 g of ion-exchanged water, and stirring were carried out to prepare an aqueous solution of acetic acid on the spot. Then, the total amount of the aqueous solution was added to the above reaction solution and stirred. After 12 hours, the reduction treatment of Ni was carried out. Then, the reaction solution which was completed was transferred to a separatory funnel, and the lower aqueous layer was removed, and then 100 mL of a 3 % aqueous solution of isopropyl hydrazine copolyol was added thereto, and the reaction was vigorously carried out. After mixing, the water layer was removed after completely separating the two layers. After repeating the water washing process for 3 times in total, the oil layer was added dropwise to a very large amount of acetone, and the resulting polymer was further rubbed, Shi Dan-Human After being separated from the filtrate by filtration, it was dried by heating in a vacuum oven set to 60 ° C for 12 hours, thereby obtaining a polymer # GPC (Gel Permeation

Chromatography,凝膠滲透 W增析法)測疋,Mw = 10萬、Mn=4 萬。又’聚合物#1中之各姓 構早位之莫耳比根據NMR之鑑 定,己基降莰烯結構單付&amp; 為50 m〇i%、二苯基甲基降莰烯甲 130 201213360 軋基矽烷結構單位為50mol%。又,利用Metricon所得之批 射率為1.55 (測定波長:633 nm)。 # Η PhChromatography, gel permeation, W analysis, measurement, Mw = 100,000, Mn = 40,000. Moreover, the molar ratio of each of the surnames in the polymer #1 was determined by NMR, and the structure of the hexyl-norbornene structure was 50 m〇i%, and the diphenylmethylnorthene group 130 201213360 was rolled. The unit of the decane structure is 50 mol%. Further, the yield obtained by Metricon was 1.55 (measurement wavelength: 633 nm). # Η Ph

(B)(B)

聚合物#1 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量g之經純化之上述聚合 物#1,於其中添加均三甲苯40 g、抗氧化劑Irgan〇x 1〇76 (Ciba-Geigy公司製造)0.01 g、環己基氧雜環丁烷單體(式 20(式1〇〇)所示之第1單體,東亞合成製造之ch〇x、Polymer #1 (2) Production of photosensitive resin composition The purified polymer #1 was weighed in a 100 mL glass vessel, and thereto was added 40 mg of mesitylene and an antioxidant Irgan〇x 1〇. 76 (manufactured by Ciba-Geigy Co., Ltd.) 0.01 g, cyclohexyloxetane monomer (the first monomer represented by Formula 20 (Formula 1)), ch〇x manufactured by East Asia Synthetic Co., Ltd.

CAS#483303-25-9’ 分子量為 186,沸點為 125°C/1.33kPa) 2 g、光酸產生劑 Rhodorsil Photoinitiator 2074 ( Rhodia 公 司製造 ’ CAS#178233-72-2 ) ( 1.36E-2 g、乙酸乙酯 〇」mL 中)’均勻溶解後’藉由0.2 之PTFE過濾器進行過濾, 獲得潔淨之感光性樹脂組成物清漆V1。 (3)光波導膜之製造 (下側包覆層之製作) :;ί 131 201213360 、於石夕晶圓上,藉由到刀均勻塗佈感光性降获婦樹脂組 成物(Promerus公司製造,Avatrel 2000P清漆)後,投入 45 C之乾燥機中15分鐘。完全去除溶劑後,對經塗佈之整 個面照射紫外線100mJ,於乾燥機中以12〇t加熱i小時, 使塗膜硬化,形成下側包覆層。所形成之下側包覆層之厚 度為20 v m ’無色透明,折射率為丨52 (測定波長·· 6 = (核心層之形成) 於上述下側包覆層上’藉由刮刀均勻地塗佈感光性樹 脂組成物清漆VI後,投入45t:之乾燥機中15分鐘。完全 去除溶劑後,壓接光罩,以500 mJ/cm2選擇性地照射紫外 線。除去遮罩,於乾燥機中以45〇C3〇分鐘、以85它3〇分 鐘、以150tl小時分三個階段進行加熱。加熱後,確認^ 出現非常鮮明之波導圖案。又,確認到核心部及包覆部之 形成。 (上側包覆層之形成) 於聚醚砜(PES)膜上’冑預先以乾燥厚度成為2〇 # m之方式積層Avatrel 2000P而成之乾膜貼合於上述核心 層,投入設定為140t之真空貼合機中進行熱壓接。其後, 以100 mJ全面照射紫外線,於乾燥機中,以12〇t:加熱t 小時,使Avatrel 2000P硬化,形成上側包覆層,獲得光波 導。此時,上側包覆層無色透明,其折射率為i 52。 (4 )評價 (光波導之損失評價) 132 201213360 nm之VCSEL (表面 中’以200 沴之光 經由5〇 /z 之光纖,將自850 發光雷射)發出之光導入上述光波導 纖進行受光:測定光之強度。再者,測定係採用回截(迦 法將光波導之長邊方向作為橫轴,將插入損失繪製成縱 軸,結果測定值準確地排列於直線上,由其斜度可算出傳 播損失為0.03 dB/em。 (核心部與包覆部之折射率差) 上述(核心層之形成)所形成之於水平方向鄰接的左 右之核心部-包覆部間之折射率差係藉由以下方式求出。 藉由加拿大國EXF0公司製造之〇pHcal waveguide analyzer 〇WA_95〇0對光波導照射波長656 nm之雷射光, 分別實測核心區域及包覆區域之折射率,算出其等之差。 其結果’折射率差為0.02。 (實施例2) (1 )不具有脫離性基之降莰烯系樹脂之合成 於水分及氧氣濃度均控制在丨ppm以下而充滿乾燥氮 氣之套手工作箱中,於5〇〇mL小玻璃瓶中稱量己基降莰烯 (HxNB) 9.4 g( 53.1 mmol)、苯基乙基降获烯 1〇5g(53i mmol ),添加脫水甲苯6〇 g與乙酸乙酯u g,覆蓋矽製之 封塞物,密栓上部。 繼而,於100 mL小玻璃瓶中稱量上述化學式(B )所 表不之Νι觸媒2.06 g ( 3.2 mmol)與脫水甲苯1〇 mL,放 入攪拌器晶月並密栓,充分攪拌觸媒使其完全溶解。 以注射器準確稱量上述化學式(B)所表示之Ni觸媒 133 201213360 溶液1 mL ’將其定量地注入至上诚a 主上述命解有2種降莰烯之 玻璃瓶中,於室溫下⑷小時,結果確認到明顯之點声 上升。此時’拔掉塞子’添加四氫咳喃(THF) 6Qg二 拌,獲得反應溶液。 見 於⑽mL燒杯中添加乙酸酐95 g、過氧化氮水μ (濃度30%)、離子交換纟30git行授掉,當場製備過乙酸g 水溶液。繼而,將該水溶液總量添加至上述反應溶液中, 攪拌12小時進行Ni之還原處理。 繼而,將完成處理之反應溶液換移至分液漏斗中,去 除下部之水層後,添加異丙醇之3〇%水溶液1〇〇 mL,進行 劇烈攪拌。進行靜置,完全進行二層分離後去除水層。以 合計3次重複該水洗製程後,將油層滴加至非常過量之丙 酮中,使生成之聚合物再次沈澱,藉由過濾與濾液分離後, 於•又疋為60 C之真空乾燥機中加熱乾燥丨2小時,藉此獲得 聚合物#2。聚合物#2之分子量分佈根據Gpc:測定,Mw=9 萬Mn-4萬。又,聚合物#2中之各結構單位之莫耳比根據 NMR之鑑定,己基降莰烯結構單位為5〇 m〇i%、笨基乙基 降莰烯結構單位為50 mol%。又,利用Metric〇n所得之折 射率為1.54 (測定波長:633 nm)。 134 201213360CAS#483303-25-9' molecular weight 186, boiling point 125 °C / 1.33kPa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (Manufactured by Rhodia Company 'CAS#178233-72-2) ( 1.36E-2 g Ethyl acetate 〇"mL") 'after homogeneous dissolution' was filtered through a PTFE filter of 0.2 to obtain a clean photosensitive resin composition varnish V1. (3) Fabrication of an optical waveguide film (production of a lower cladding layer) :; ί 131 201213360 On a Shih-Ying wafer, a photosensitive resin composition (Promerus) is uniformly coated by a knife. After Avatrel 2000P varnish), put it into a 45 C dryer for 15 minutes. After the solvent was completely removed, the entire surface to be coated was irradiated with ultraviolet rays of 100 mJ, and heated in a dryer at 12 Torr for 1 hour to cure the coating film to form a lower cladding layer. The thickness of the underside cladding layer formed is 20 vm 'colorless and transparent, and the refractive index is 丨52 (measurement wavelength··6 = (formation of core layer) on the lower cladding layer' uniformly coated by a doctor blade After the photosensitive resin composition varnish VI was placed, it was put into a dryer of 45 t: for 15 minutes. After completely removing the solvent, the photomask was crimped, and ultraviolet rays were selectively irradiated at 500 mJ/cm 2 . The mask was removed and dried in a dryer. After 45 〇C3 〇 minutes, it was heated at 85 rpm for three minutes and at 150 tl hours. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. The formation of the coating layer is carried out on a polyethersulfone (PES) film. The dry film formed by laminating Avatrel 2000P in a dry thickness of 2 〇 #m is applied to the core layer, and a vacuum of 140 t is applied. The thermocompression bonding was carried out in the machine. Thereafter, the ultraviolet ray was irradiated at 100 mJ in total, and the Avatrel 2000P was hardened in a dryer at 12 Torr: for 12 hours to form an upper cladding layer to obtain an optical waveguide. The upper cladding layer is colorless and transparent, and its refraction It is i 52. (4) Evaluation (loss evaluation of optical waveguide) 132 VCSEL of 201213360 nm (the light emitted from the 850 illuminating laser through a 5 〇/z fiber in the surface of '200 沴 light) is introduced into the above light. The waveguide fiber receives light: the intensity of the light is measured. Further, the measurement system uses a back-cut (the method uses the longitudinal direction of the optical waveguide as the horizontal axis and the insertion loss as the vertical axis, and the measured values are accurately arranged on the straight line. The propagation loss can be calculated as 0.03 dB/em from the slope. (The difference in refractive index between the core portion and the cladding portion) The above-mentioned (formation of the core layer) is formed in the horizontal direction adjacent to the left and right core portions - between the cladding portions The difference in refractive index is obtained by the following method: The laser beam of 656 nm is irradiated to the optical waveguide by the pHcal waveguide analyzer 〇WA_95〇0 manufactured by EXF0 of Canada, and the refractive indices of the core region and the cladding region are respectively measured. The difference was found to be 0.02. (Example 2) (1) The synthesis of a decene-based resin having no detachment group was controlled to be equal to or less than 丨ppm and full. Dry nitrogen In a hand-held working box, weigh hexylpentene (HxNB) 9.4 g (53.1 mmol), phenylethyl-reduced olefin 1 〇 5 g (53 μmmol) in a 5 mL vial, add dehydrated toluene 6〇g and ethyl acetate ug, covering the encapsulation of tantalum and the upper part of the plug. Then, weigh the above-mentioned chemical formula (B) in a 100 mL vial to measure 2.06 g (3.2 mmol) 1 mL of dehydrated toluene was placed in a stirrer and the plug was tightly immersed, and the catalyst was thoroughly stirred to completely dissolve. Accurately weigh the Ni catalyst 133 201213360 solution represented by the above formula (B) with a syringe and accurately inject it into the glass bottle of the above two kinds of decene, at room temperature (4) In hours, the result confirmed that the apparent sound rose. At this time, the plug was removed and tetrahydrocethane (THF) 6Qg was added to obtain a reaction solution. In a (10) mL beaker, 95 g of acetic anhydride, nitrogen peroxide water μ (concentration: 30%), ion exchange enthalpy 30 git were added, and an aqueous solution of peracetic acid g was prepared on the spot. Then, the total amount of the aqueous solution was added to the above reaction solution, and the mixture was stirred for 12 hours to carry out a reduction treatment of Ni. Then, the reaction solution which had been subjected to the treatment was transferred to a separatory funnel, and after removing the lower aqueous layer, 1 〇〇 mL of a 3 〇% aqueous solution of isopropyl alcohol was added thereto, followed by vigorous stirring. The mixture was allowed to stand, and the water layer was removed after completely separating the two layers. After repeating the water washing process for a total of three times, the oil layer was added dropwise to a very large amount of acetone, and the resulting polymer was again precipitated, and after being separated from the filtrate by filtration, it was heated in a vacuum dryer of 60 C. The crucible was dried for 2 hours, whereby Polymer #2 was obtained. The molecular weight distribution of the polymer #2 was measured according to Gpc: Mw = 90,000 Mn to 10,000. Further, the molar ratio of each structural unit in the polymer #2 was determined by NMR, the structural unit of hexylpentene was 5 〇 m〇i%, and the structural unit of phenylethyl decene was 50 mol%. Further, the refractive index obtained by Metric〇n was 1.54 (measurement wavelength: 633 nm). 134 201213360

(2 )感光性樹脂組成物之製造 ’ 於100 mL之玻璃容器中稱量1〇 g經純化之上述聚合物 #2,於其中添加均三曱苯4〇 g、抗氧化劑Irgan〇x 1〇76 (Ciba-Geigy公司製造)001 g、環己基氧雜環丁烷單體(式 20所示者,東亞合成製造之ch〇X、CAS#483 303-25-9,分 子量為186,沸點為125〇c /133 kPa) 2 g、光酸產生劑(2) Production of photosensitive resin composition 'Weigh 1 〇g of the above-mentioned polymer #2 purified in a 100 mL glass vessel, to which is added trisylbenzene 4 〇g, an antioxidant Irgan 〇 x 1 〇 76 (manufactured by Ciba-Geigy Co., Ltd.) 001 g, cyclohexyl oxetane monomer (manufactured by Formula 20, manufactured by East Asia Synthetic, ch〇X, CAS#483 303-25-9, molecular weight 186, boiling point is 125〇c /133 kPa) 2 g, photoacid generator

Rhodorsil Photoinitiator 2074 ( Rhodia 公司製造,. CAS#178233-72-2) ( 1.36E-2 g,乙酸乙酯 〇」中),均 勻溶解後,藉由0.2 μ m之PTFE過濾器進行過濾,獲得潔 淨之感光性樹脂組成物清漆V2。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上’藉由刮刀均勻地塗佈感光性樹 月曰組成物清漆V2後,投入45°C之乾燥機中15分鐘。完全 去除’谷劑去除後,壓接光罩,以500 mJ/cm2選擇性地照射 紫外線。除去遮罩’於乾燥機中以45»c 分鐘、以85&lt;t 3〇 135 201213360 分鐘、以1 50°C 1小時分三個階段進行加熱。加熱後,確認 到出現非常鮮明之波導圖案。又,確認到核心部及包覆部 之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。傳播損失可算 出為0.04 dB/cm。核心部與包覆部之折射率差為〇.〇1。 (實施例3 ) (1 )具有脫離性基之降莰烯系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量1〇 g經純化之上述聚合物 #1 ’於其中添加均三曱苯4〇 g、抗氧化劑irgan〇x (Ciba-Geigy公司製造)〇.〇i g、二官能氧雜環丁烷單體(式 (15)所示者,東亞合成製造之d〇X、CAS#18934-00_4, 分子量為214,沸點為11STC/0.67 kPa) 2 g、光酸產生劑 Rhodorsil Photoinitiator 2074 ( Rhodia 公司製造, CAS#178233-72-2 ) ( 1.36E-2 g,乙酸乙酯(M mL 中),均 勻溶解後’藉由0.2 ym之PTFE過濾器進行過濾,獲得潔 淨之感光性樹脂組成物清漆V3。 (3 )光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 136 201213360 (核心層之形成) 於上述下側包霜u 復層上,藉由刮刀均勻地塗佈感光性指 脂組成物清漆V 3後,热λ / r 交投入45 C之乾燥機中15分鐘。完全 去除溶劑後’塵接光罩,以500 mW選擇性地照射紫外 線。除去遮罩,於乾燥機中以价30分鐘、卩85。(:30分 鐘、以15 0 °C 1小日秦八-如a ’刀二個P白段進行加熱。加熱後,確認到 出現非常鮮明之波導圖安 等圖案。又,確認到核心部及包覆部之 形成。 (上側包覆層之形成) 製作與貫細(例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。傳播損失可算 出為0.04dB/cm。核心部與包覆部之折射率差為〇〇1。 (實施例4) (1 )具有脫離性基之降莰烯系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量10g經純化之上述聚合物 #1,於其中添加均三曱苯40 g、抗氧化劑Irgan〇x 1〇76 (CMba-Gdgy公司製造)0.01 g、脂環式環氧單體(式(37 ) 所示者,Daicel Chemical 製造之 CeU〇xide 2〇21p、 CAS#2386-87-0,分子量為 252,沸點為 188〇c /4 hpa) 2 g、 光酸產生劑 Rhodorsil Photoinitiator 2074 (Rhodia 公司製 造 ’ CAS#178233-72-2 ) ( 1.36E-2 g,乙酸乙酯 〇1 mL 中), 137 201213360 均勻溶解後,藉由〇_2 // m之PTFE過濾器進行過據,獲得 潔淨之感光性樹脂組成物清漆V4。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由到刀均勻塗佈感光性樹月t 組成物清漆V4後,投入45°C之乾燥機中15分鐘。完全去 除溶劑後,壓接光罩,以50〇 mj/cm2選擇性地照射紫外線。 除去遮罩’於乾燥機中以45°C 30分鐘、以851 30分鐘、 以15(TC 1小時分三個階段進行加熱》加熱後,確認到出現 非常鮮明之波導圖案。又,榷認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。傳播損失可算 出為0.04 dB/cn^核心部與包覆部之折射率差為〇 〇ι。 (實施例5) (1 )具有脫離性基之降莰烯系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量log經純化之上述聚合物 於其中添加均三甲苯40 g '抗氧化劑irgan〇x襲 (⑽心⑽公司製造)〇·〇1 g、環己基氧雜環丁烧單體(式 138 201213360 20所示者’東亞合成製造之CHOX ) 1 g、脂環式環氧單體 (Dai cel Chemical 製造,Celloxide 2021P) 1 g、光酸產主 劑 Rhodorsil Photoinitiator 2074 ( Rhodia 公司製造, CAS#178233-72-2)( 1.36E-2 g’ 乙酸乙酉旨 0·1 rnL 中),均 勻溶解後’藉由〇_2 之PTFE過濾器進行過濾,獲得潔 淨之感光性樹脂組成物清漆V 5。 (3 )光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上’藉由刮刀均勻塗佈感光性樹脂 組成物清漆V5後,投入45r之乾燥機中15分鐘。完全去 除冷後,壓接光罩,以5〇〇 mJ/cm2選擇性地照射紫外線。 除去遮罩’於乾燥機中以45t3〇分鐘、以8代3〇、分鐘、 :=1小時分三個階段進行加熱。加熱後,確認到出現 非“明之波導圖案。又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同 出為0_03dB/cm。访A 貝。傳播損失可算 與包覆部之折射率差為0.01。 C貫施例6) ⑴具有脫離性基之降获烯系樹脂之合成 以與實施例1相同之古、t制A 战 J之方法製作降莰烯系樹脂。 139 201213360 (2 )感光性樹脂組成物之製造 於l〇〇mL之玻璃容器中稱量1〇g經純化之上述聚合物 #1,於其中添加均三甲苯40 g、抗氧化劑irgan〇x 1〇76 (Ciba-Geigy公司製造)〇.〇丨g、環己基氧雜環丁烷單體(式 20所示者,東亞合成製造之CH0X) 1 5 g、光酸產生劑 Rhodorsil Photoinitiatoi· 2074 ( Rh〇dia 公司製造, CAS#178233-72-2 )( 1.36E-2 g,乙酸乙酯 〇」mL 中),均 句溶解後’藉由0.2 &quot;m之PTFE過濾器進行過濾,獲得潔 淨之感光性樹脂組成物清漆V6。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由到刀均勻塗佈感光性樹脂 組成物清漆V6後,投入45°C之乾燥機中1 5分鐘》完全去 除溶劑後,壓接光罩,以5〇〇 mj/cm2選擇性地照射紫外線。 除去遮罩’於乾燥機中以45〇c加熱3〇分鐘、以85。匸加熱 3〇分鐘、以15〇°C加熱1小時分三個階段進行加熱。加熱 後’確認到出現非常鮮明之波導圖案。又,確認到核心部 及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。傳播損失可算 140 201213360 出為0.03 dB/cm。核心部與包覆部之折射率 卞左馬0.0 1 〇 (實施例7) (1)具有脫離性基之降莰烯系樹脂之合成 於水分及氧氣濃度均控制在1 ppm以下而充滿乾燥氮 氣之套手工作箱中,於500 mL小玻璃瓶中稱量己基降莰烯 (ΗχΝΒ) 6.4§(36.1_υ、二苯基甲基降茨歸曱氧切 烧(diPhNB) 8.7g(27.1mm〇i)、環氧降获烯(邱叫土49 g(27.lmm〇l)’添加脫水曱苯6〇g與乙酸乙酿丨^,覆蓋 矽製之封塞物,並密栓上部。 後 繼而,於1〇〇 mL小玻璃拖φ猫罢L、丄. 圾哨瓶中柄量上述化學式(B )所 表示之Nl觸媒丨‘^⑴職⑷與脫水甲笨1〇紅,放 入攪拌器晶片並密栓,充分攪拌觸媒使其完全溶解。 以注射器準確稱量該上述化學式 w、、 于巧1 β)所表示之Ni觸 、冷液1 mL,將其疋$地〉主入至上述溶解有3種降获稀之 2玻璃瓶中,於室溫下授拌1小時,確認到明顯之黏度上 升。此時拔掉塞子,添加氫 獲得反應溶液。 虱夫南(卿)心進行授拌, 2⑽mL燒杯中添加乙酸軒9 5 g、過氧化氣水心 (/農度30% )、離子交換水 ^ A g進订稅拌,當場製備過乙酸 水洛液。繼而,將該水溶 Μ ^ 履k里添加至上述反應溶液中攪 拌12小時,進行Ni之還原處理。 稅 繼而’將完成處理之反廊滋游妓兹5 \ 除下部之水声後… 分液漏斗中’去 異丙醇之3G%水溶液⑽‘,it行 劇烈攪拌。進行靜置,6 艰仃 凡全進订二層分離後去除水層。以 141 201213360 δ彳3次重複該水洗製程後,將油層滴加至非常過量之丙 酮中使生成之聚合物再次沈澱,藉由過濾與濾液分離後, 於没疋為60°C之真空乾燥機中加熱乾燥12小時,藉此獲得 聚合物#3。聚合物#3之分子量分佈根據Gpc測定, 萬、Μη == 4萬。又,聚合物#3中之各結構單位之莫耳比根 據NMR之鑑定,己基降莰烯結構單位為4〇m〇l%、二苯基 曱基降莰烯曱氧基矽烷結構單位為3〇 m〇1%'環氧降莰烯結 構單位為30mol%。又,利用Metricon所得之折射率為丨53 (測定波長:633 nm )。Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233-72-2) (1.36E-2 g, ethyl acetate), uniformly dissolved, filtered through a 0.2 μm PTFE filter The photosensitive resin composition varnish V2. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive sapphire composition varnish V2 was uniformly applied by a doctor blade, and then placed in a dryer at 45 ° C for 15 minutes. After the complete removal of the granules, the reticle is crimped and the ultraviolet ray is selectively irradiated at 500 mJ/cm2. The removal of the mask was carried out in a dryer at 45 » c minutes, at 85 &lt; t 3 〇 135 201213360 minutes, at 150 ° C for 1 hour in three stages. After heating, it was confirmed that a very distinctive waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Formation of Upper Side Coating Layer) The same upper side cladding layer as in Example 1 was produced. (4) Evaluation Evaluation was carried out by the same method as in Example 1. The propagation loss can be calculated as 0.04 dB/cm. The difference in refractive index between the core portion and the cladding portion is 〇.〇1. (Example 3) (1) Synthesis of norbornene-based resin having a debonding group A norbornene-based resin was produced in the same manner as in Example 1. (2) Production of photosensitive resin composition In a 100 mL glass container, 1 g of the purified polymer #1' was added thereto, and trisylbenzene 4 g was added thereto, and an antioxidant irgan〇x (Ciba- Ig.〇ig, a difunctional oxetane monomer (as shown in formula (15), d东亚X, CAS#18934-00_4, manufactured by East Asia, with a molecular weight of 214 and a boiling point of 11STC/0.67 kPa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233-72-2) ( 1.36E-2 g, ethyl acetate (in M mL), uniformly dissolved 'by 0.2 ym The PTFE filter was filtered to obtain a clean photosensitive resin composition varnish V3. (3) Production of optical waveguide film (production of lower cladding layer) A side cladding layer was produced in the same manner as in Example 1. 136 201213360 ( Formation of the core layer) On the lower layer of the lower cream layer, the photosensitive finger composition varnish V 3 was uniformly applied by a doctor blade, and then the heat λ / r was applied to the dryer of 45 C for 15 minutes. After removing the solvent, the dust is attached to the reticle, and the ultraviolet ray is selectively irradiated at 500 mW. The mask is removed in the dryer. The price is 30 minutes, 卩85. (: 30 minutes, 15 0 °C 1 small day Qin Ba - such as a 'knife two P white section heating. After heating, it is confirmed that there is a very distinctive waveguide figure and other patterns Further, the formation of the core portion and the cladding portion was confirmed. (Formation of the upper cladding layer) The upper cladding layer was formed in the same manner as in Example 1. (4) Evaluation was performed by the same method as in Example 1. Evaluation. The propagation loss was calculated to be 0.04 dB/cm. The difference in refractive index between the core portion and the cladding portion was 〇〇 1. (Example 4) (1) Synthesis and implementation of a decene-based resin having a detachment group The norbornene-based resin was produced in the same manner as in Example 1. (2) Production of photosensitive resin composition 10 g of the purified polymer #1 was weighed in a 100 mL glass vessel, and tris-benzene was added thereto. , antioxidant Irgan〇x 1〇76 (manufactured by CMba-Gdgy Co., Ltd.) 0.01 g, alicyclic epoxy monomer (expressed by formula (37), CeU〇xide 2〇21p, CAS#2386- manufactured by Daicel Chemical 87-0, molecular weight 252, boiling point 188〇c /4 hpa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (Rhodia Manufacture 'CAS#178233-72-2 ) ( 1.36E-2 g, ethyl acetate 〇 1 mL), 137 201213360 After homogeneous dissolution, it was cleaned by 〇_2 // m PTFE filter The photosensitive resin composition varnish V4. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive varnish t composition varnish V4 was uniformly applied to the knives, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the photomask was crimped and the ultraviolet rays were selectively irradiated at 50 〇 mj/cm 2 . The removal of the mask was carried out in a dryer at 45 ° C for 30 minutes, at 851 30 minutes, and after 15 (TC 1 hour in three stages of heating), it was confirmed that a very distinct waveguide pattern appeared. Formation of core portion and coating portion. (Formation of upper cladding layer) The same upper cladding layer as in Example 1 was produced. (4) Evaluation was performed by the same method as in Example 1. The propagation loss was calculated as 0.04 dB/cn^ The refractive index difference between the core portion and the cladding portion was 〇〇ι. (Example 5) (1) Synthesis of a decene-based resin having a detachment group was produced in the same manner as in Example 1. Terpene-based resin. (2) Production of photosensitive resin composition in a 100 mL glass container. Weighing the above-mentioned polymer purified by adding mesitylene 40 g 'antioxidant irgan〇x attack ((10) heart (10) Manufactured by the company) g·〇1 g, cyclohexyloxyxanthene monomer (CHOX, manufactured by East Asia Synthetic, as shown in 138 201213360 20) 1 g, alicyclic epoxy monomer (manufactured by Daicel Chemical, Celloxide) 2021P) 1 g, photoacid generator Rhodorsil Photoinitiator 2074 ( Rhodia Manufactured, CAS#178233-72-2) ( 1.36E-2 g' acetate in 0.1 rnL), uniformly dissolved, 'filtered by 〇_2 PTFE filter to obtain clean photosensitive resin Composition varnish V 5. (3) Production of optical waveguide film (production of lower cladding layer) A lower cladding layer was produced in the same manner as in Example 1. (Formation of core layer) on the lower cladding layer The photosensitive resin composition varnish V5 was uniformly applied by a doctor blade, and then placed in a 45r drier for 15 minutes. After the cold was completely removed, the mask was pressure-bonded, and the ultraviolet ray was selectively irradiated at 5 〇〇 mJ/cm 2 . The cover was heated in a drier at 45 t3 〇 minutes, 8 generations of 3 〇, minutes, and = 1 hour in three stages. After heating, it was confirmed that a non-"light waveguide pattern appeared. Further, the core portion and the package were confirmed. Formation of the coating portion (Formation of the upper cladding layer) The same upper cladding layer as in Example 1 was produced. (4) The evaluation was as 0 to 03 dB/cm as in Example 1. The transmission loss was counted as The refractive index difference of the cladding portion is 0.01. C. Example 6) (1) The olefinic tree having a detachment group The synthesis of the decene-based resin was carried out in the same manner as in the first embodiment of the present invention. 139 201213360 (2) The photosensitive resin composition was weighed and weighed in a glass container of 10 mL. g The above-mentioned polymer #1 was purified, and 40 g of mesitylene, an antioxidant irgan〇x 1〇76 (manufactured by Ciba-Geigy Co., Ltd.), 〇丨g, cyclohexyloxetane monomer ( As shown in Formula 20, CH0X) manufactured by East Asia Synthetic Co., Ltd. 15 g, photoacid generator Rhodorsil Photoinitiatoi· 2074 (manufactured by Rh〇dia, CAS#178233-72-2) ( 1.36E-2 g, ethyl acetate 〇 "mL"), after the dissolution of the average sentence, was filtered by a 0.2 &quot;m PTFE filter to obtain a clean photosensitive resin composition varnish V6. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive resin composition varnish V6 is uniformly applied to the knife, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the pressure is crimped. The photomask selectively irradiates ultraviolet rays at 5 〇〇mj/cm2. The mask was removed and heated in a dryer at 45 ° C for 3 minutes to 85. The crucible was heated for 3 minutes, heated at 15 ° C for 1 hour, and heated in three stages. After heating, it was confirmed that a very sharp waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Formation of Upper Side Coating Layer) The same upper side cladding layer as in Example 1 was produced. (4) Evaluation Evaluation was carried out by the same method as in Example 1. The propagation loss can be calculated as 140 201213360 as 0.03 dB/cm. The refractive index of the core portion and the cladding portion is 0.0 0.01 〇 (Example 7) (1) The synthesis of the decene-based resin having a detaching group is controlled to be less than 1 ppm and the dry nitrogen is controlled at a moisture and oxygen concentration. Weigh the hexyl decene in a 500 mL vial in a hand-operated box. 6.4 § (36.1_υ, diphenylmethyl-decazide-oxygen-cut (diPhNB) 8.7g (27.1mm〇) i), epoxy-reduced ene (Qiu called soil 49 g (27.lmm〇l) 'added dehydrated benzene benzene 6 〇 g and acetic acid 丨 , ^, covered with the tamping of the plug, and the upper part of the bolt. In the 1〇〇mL small glass, drag the φ cat to stop L, 丄. The amount of the handle in the whistle bottle is the above-mentioned chemical formula (B), the Nl catalyst 丨'^(1) position (4) and the dehydrated one stupid 1 blush, put into the stirring The wafer is tightly packed, and the catalyst is fully stirred to completely dissolve it. The above-mentioned chemical formula w, the Ni touch and the cold liquid represented by the formula 1 β) are accurately weighed by a syringe, and the product is introduced into the ground. The above-mentioned three kinds of glass bottles which were reduced in dilute were mixed, and the mixture was stirred at room temperature for 1 hour, and it was confirmed that the viscosity was increased. At this time, the plug was pulled out, and hydrogen was added to obtain a reaction solution. The husband of Yufu Nan (Qing) was mixed, adding acetic acid Xuan 9 5 g, peroxidizing gas water core (/agronomy 30%), ion exchange water ^ A g to the tax in 2 (10) mL beaker, and preparing acetic acid water on the spot. Then, add the water to the reaction solution and stir for 12 hours to carry out the reduction treatment of Ni. The tax will then be completed. ... in the separatory funnel, '3G% aqueous solution of isopropyl alcohol (10)', it is stirred vigorously. It is allowed to stand still, 6 hard to remove the water layer after the separation of the two layers. Repeat this with 141 201213360 δ彳3 times After the water washing process, the oil layer was added dropwise to a very large amount of acetone to precipitate the polymer again, separated from the filtrate by filtration, and dried by heating in a vacuum dryer at 60 ° C for 12 hours. Polymer #3. The molecular weight distribution of polymer #3 was determined according to Gpc, 10,000, Μη == 40,000. Further, the molar ratio of each structural unit in the polymer #3 was determined by NMR, and the hexyl decene structural unit was determined. 4〇m〇l%, diphenylfluorenylnordecene decyloxydecane structure The position is 3 〇 m 〇 1%' epoxy decene structural unit is 30 mol%. Further, the refractive index obtained by Metricon is 丨53 (measurement wavelength: 633 nm).

(2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量10g經純化之上述聚合物 #3’於其中添加均三甲| 4〇 g、抗氧化劑_酿1〇76 (Ciba-Geigy公司製造)〇.〇1 g、環己基氧雜環丁烷單體(式 20所示者,東亞合成製造之CHOX) 1 〇 Rhodorsil Photoinitiator 2074 ( Rhodia g、光酸產生劑 公司製造, CAS# 1782 3 3-72-2 )( 1.36E-2 g,乙酸乙酯 〇1 mL 中),均 句溶解後’藉由0.2 yn^PTFEm進行過渡,獲得潔 142 201213360 : 淨之感光性樹脂組成物清漆V7。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上’藉由刮刀均勻塗佈感光性樹脂 組成物清漆V7後,投入45 °C之乾燥機中15分鐘。完全去 除溶劑後,壓接光罩,以500 mJ/cm2選擇性地照射紫外線。 除去遮罩’於乾燥機中以45艺3〇分鐘、以85。〇 3〇分鐘、 以15(TC1小時分三個階段進行加熱。加熱後,確認到出現 非常鮮明之波導圖案。又, 又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上層包覆。 (4 )評價 出為 於表1中。(2) Production of photosensitive resin composition In a 100 mL glass container, 10 g of the purified polymer #3' was added thereto to add a uniformity of tetramethyl | 4 〇 g, an antioxidant _ brewing 1 〇 76 (Ciba-Geigy Manufactured by the company) 〇.1 g, cyclohexyl oxetane monomer (CHOX as shown in Formula 20, manufactured by Toago Chemical Co., Ltd.) 1 〇 Rhodorsil Photoinitiator 2074 (Manufactured by Rhodia g, Photoacid Generator, CAS# 1782 3 3-72-2 ) ( 1.36E-2 g, ethyl acetate 〇 1 mL), after dissolution, 'transition by 0.2 yn^PTFEm to obtain clean 142 201213360 : clean photosensitive resin composition varnish V7. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) The photosensitive resin composition varnish V7 was uniformly applied onto the lower cladding layer by a doctor blade, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the photomask was crimped and the ultraviolet rays were selectively irradiated at 500 mJ/cm2. The mask was removed in a desiccator at 45 art for 3 minutes and at 85. 〇3 〇, and 15 (TC1 hour, three stages of heating. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Upper cladding layer Formation) The same upper layer coating as in Example 1 was produced. (4) The evaluation was as shown in Table 1.

摸之評價結果示 β傳播損失可算 1差為0.02。 143 201213360 [表i]The evaluation result shows that the β-propagation loss can be calculated as 1 difference of 0.02. 143 201213360 [Table i]

於實施例1〜7中,若對感光性樹脂組成物照射光,則 由光酸產生劑產生酸,僅於照射部分.進行具有環狀醚基之 單體之聚合。並且,由於於照射部分中之未反應單體量變 少,故為消除於照射部分/未照射部分間所產生之濃度梯 度,未照射部分之單體擴散至照射部分。 144 201213360 發 又,若於光照射後進行加熱,則單體自未照射部分揮 根據以上’於核心部與包覆部之間,湄 碌自早體之結構 體濃度不同,於包覆部,源自具有環狀醚義 。 土 早體之結構 體變多,於核心部,源自具有環狀醚基之罩 遐之、、構體變 少。其原因可認為,於核心部與包覆部之間 j座生υ · 〇 1以上 之相對較大之折射率差.。 再者,於實施例1〜7中形成了直線狀之光波導,伸於 形成曲線狀(曲率半徑為1 〇 mm左右)之光波導之情形時; 光損失明顯較少。 進而,實施例1〜7中所得之光波導臈之耐熱性較高, 具有260°C之财回焊性。 (實施例8) (1 )具有脫離性基之降莰烯樹脂之合成 於具有脫離性基之降莰烯系樹脂之合成中,使用苯基 二曱基降莰烯曱氧基矽烷1〇 4 g ( 4〇 1 mm〇1)替代二苯基 曱基降莰烯曱氧基矽烷 12.9 g ( 40.1 mmo 1 ),除此以外,進 行與實施例1相同之操作。所得之於側鏈具有脫離性基之 降茨蝉系樹脂B (式1〇3 )之分子量根據GPC測定,Mw = 11萬、Μη = 5萬。又,各結構單位之莫耳比根據nmr之鑑 定’己基降莰烯結構單位為5〇 mol%、苯基二曱基降莰烯曱 氧基石夕烧結構單位為5〇 mol%。又,由Metricon所得之折 射率為1.53 (測定波長:633 nm) 〇 (2 )感光性樹脂組成物之製造 145 201213360 除了使用降莰稀系樹脂B替代聚合物#丨以外,與實施 例1同樣地獲得感光性樹脂組成物。 (3)光波導膜之製造 除了使用含有降莰烯系樹脂B之上述感光性樹脂組成 物以外,與實施例1同樣地獲得光波導臈。 與實施例1同樣地進行光波導之損失評價,結果所得 光波導膜之傳播損失為〇.03 dB/cm。In the examples 1 to 7, when the photosensitive resin composition is irradiated with light, an acid is generated from the photoacid generator, and polymerization of the monomer having a cyclic ether group is carried out only in the irradiated portion. Further, since the amount of the unreacted monomer in the irradiated portion is small, the monomer which is not irradiated is diffused to the irradiated portion in order to eliminate the concentration gradient generated between the irradiated portion and the unirradiated portion. 144 201213360 In addition, if heating is performed after light irradiation, the monomer is not irradiated from the unexposed portion according to the above relationship between the core portion and the cladding portion, and the concentration of the structure from the early body is different from that in the coating portion. Derived from a cyclic ether sense. The structure of the soil early body has a large number of bodies, and in the core part, it is derived from a hood having a cyclic ether group, and the structure is reduced. The reason for this is considered to be a relatively large refractive index difference between the core portion and the cladding portion. Further, in the first to seventh embodiments, a linear optical waveguide was formed and stretched in the case of an optical waveguide having a curved shape (having a radius of curvature of about 1 〇 mm); the light loss was remarkably small. Further, the optical waveguides obtained in Examples 1 to 7 have high heat resistance and have a reflow property of 260 °C. (Example 8) (1) Synthesis of a norbornene resin having a debonding group In the synthesis of a norbornene-based resin having a debonding group, phenyldidecylnordeceneoxydecane 1〇4 was used. The same operation as in Example 1 was carried out except that g (4 〇 1 mm 〇 1) was substituted for diphenyl decyl decylene decyloxy decane (12.9 g (40.1 mmo 1 )). The molecular weight of the reduced oxime resin B (formula 1 〇 3) obtained from the side chain having a cleavable group was measured by GPC, and Mw = 110,000 and Μ η = 50,000. Further, the molar ratio of each structural unit is 5 〇 mol% based on the identification of nmr, and the structural unit of phenyl fluorenyl decene oxime is 5 〇 mol%. Further, the refractive index obtained by Metricon was 1.53 (measuring wavelength: 633 nm) 〇 (2) Production of photosensitive resin composition 145 201213360 The same as in Example 1 except that the reduced-thinning resin B was used instead of the polymer #丨A photosensitive resin composition was obtained. (3) Production of optical waveguide film An optical waveguide was obtained in the same manner as in Example 1 except that the above-mentioned photosensitive resin composition containing a norbornene-based resin B was used. The loss of the optical waveguide was evaluated in the same manner as in Example 1. As a result, the propagation loss of the obtained optical waveguide film was 〇.03 dB/cm.

(103) (實施例9) (1 )除了使用以下者作為感光性樹脂組成物以外,進 行與實施例1相同之操作。 於100 mL之玻璃容器中稱量實施例i中所得之降莰烯 系樹脂10 g,於其中添加均三曱苯40 g、抗氧化劑Irgan〇x 1076 (Ciba-Geigy公司製造)〇.〇lg、環己基氧雜環丁烷單 體(式(100)所示之第1單體,東亞合成製造之Ch〇x、 CAS#483303-25-9,分子量為 186,沸點為 125〇c/l 33kpa) 146 201213360 ig、二官能氧雜環丁烷單體(式(104)所示之第2單體, 東亞合成製造之DOX、cAS# 18934-00-4,分子量為214, 沸點為 119°C/0.67 kPa) i g、光酸產生劑 Rh〇d〇rsil(103) (Example 9) (1) The same operation as in Example 1 was carried out except that the following was used as the photosensitive resin composition. 10 g of the decene-based resin obtained in Example i was weighed in a 100 mL glass vessel, and 40 g of stilbene was added thereto, and Irgan 〇x 1076 (manufactured by Ciba-Geigy Co., Ltd.) was added thereto. Cyclohexyloxybutane monomer (the first monomer represented by formula (100), Ch〇x, CAS#483303-25-9 manufactured by East Asia Synthetic, having a molecular weight of 186 and a boiling point of 125〇c/l 33kpa) 146 201213360 ig, difunctional oxetane monomer (second monomer represented by formula (104), DOX, cAS# 18934-00-4 manufactured by Toagosei, molecular weight 214, boiling point 119° C/0.67 kPa) ig, photoacid generator Rh〇d〇rsil

Photoinitiator 2074 ( Rhodia 公司製造,cas# 178233-72-2 ) (1.36E-2 g,乙酸乙酯(M mL中),均勻溶解後,藉由〇 2 /z m之PTFE過處器進行過遽’製備潔淨之核心層用之感光 性樹脂組成物清漆。 (2)光波導膜之製造 除了使用上述(1 )之感光性樹脂組成物以外,與實施 例1同樣地獲得光波導膜。 與實施例1同樣地進行光波導之損失評價,結果所得 光波導膜之傳播損失為0.04 dB/cm。Photoinitiator 2074 (manufactured by Rhodia Co., Ltd., cas# 178233-72-2) (1.36E-2 g, ethyl acetate (M mL), uniformly dissolved, passed through a 〇2 /zm PTFE passer) A photosensitive resin composition varnish for a clean core layer was prepared. (2) Production of Optical Waveguide Film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition of the above (1) was used. 1 The loss evaluation of the optical waveguide was carried out in the same manner, and as a result, the propagation loss of the obtained optical waveguide film was 0.04 dB/cm.

(104) (實施例10 ) 除了使用以下者作為環稀以外,進行與實施例1相同 之操作。 (1)降莰烯系樹脂c之合成 使用A头之手法(例如曰本特開2⑻弘⑸⑹號公 :)’進行苯基乙基降t烯(PENB)單體之開環複分解聚合, 獲得下述式(1〇5)所表示之嶋系樹脂C。 (2 )感光性樹脂組成物製造 147 201213360 除了使用降莰烯系樹脂c替代聚合物#1以外,與實施 例1同樣地獲得感光性樹脂組成物。 (3)光波導膜之製造 除了使用含有降莰烯系樹脂C之上述感光性樹脂組成 物以外,與實施例1同樣地獲得光波導膜。 與貫施例1同樣地進行光波導之損失評價,結果所得 光波導膜之傳播損失為0.05 dB/Cm。(104) (Example 10) The same operation as in Example 1 was carried out except that the following was used as the ring thinner. (1) Synthesis of a decene-based resin c. A ring-opening metathesis polymerization of a phenylethyl norbornene (PENB) monomer is carried out by using a method of the A-head (for example, 曰本特开 2(8)弘(5)(6)号:) The oxime resin C represented by the following formula (1〇5). (2) Manufacture of photosensitive resin composition 147 201213360 A photosensitive resin composition was obtained in the same manner as in Example 1 except that the norbornene-based resin c was used instead of the polymer #1. (3) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the above-mentioned photosensitive resin composition containing the norbornene-based resin C was used. The loss of the optical waveguide was evaluated in the same manner as in Example 1. As a result, the propagation loss of the obtained optical waveguide film was 0.05 dB/cm.

(實施例11 ) 除了將第1單體之調配量變更為〇 5 g以外,與實施例 1同樣地製作光波導膜。 再者,所知光波導膜之傳播損失為〇1〇 dB/cm。 (實施例1 2 ) 除了將第1單體之調配量變更為4.0g以外.,與實施例 1同樣地製作光波導膜。 再者,所得光波導膜之傳播損失為〇.1〇dB/cm。 148 201213360 (比較例1 ) 除了未使用第1單體以外,與實施例1同樣地製作光 波導膜。 再者’所得光波導膜之傳播損失為0.90 dB/cm。 (比較例2 ) (1)各成分之合成 〈觸媒前驅物:Pd(〇Ac)2(P(Cy)3)2之合成&gt; 於裝有漏斗之2 口圓底燒瓶中,於-78。(:下攪拌由 Pd(〇Ac)2 ( 5_〇〇 g,22 3 mm〇1)與 CH2cl2 ( 3〇 紅)所構成 之紅褐色懸浮液。 於漏斗中加入 P(Cy)3( 13.12 mL( 44.6 mmol))之 CH2C12 冷液(3 0 mL ),並且,用丨5分鐘滴加至上述攪拌懸浮液中。 其結果,自紅褐色緩緩變成黃色。 於7 8 C下搜拌1小時後,將懸浮液加溫至室温,進而 授拌2小時,以己烷(2〇 mL )加以稀釋。 繼而,於空氣中過渡該黃色之固體,以戍烧清洗(5χΐ〇 mL ) ’進行真空乾燥。 2次收集物係將濾液冷卻至〇它而分離,與上述同樣地 進行清洗並加以乾燥。藉此,獲得觸媒前驅物。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器中稱量1〇g經純化之上述聚合物 ^ ’於其中添加均三甲$ 40 g、抗氧化劑Irg靡刪 (Ciba-Geigy&amp;司製造)0_01 g、二曱基雙(降获稀甲氧基) 矽烷(SiX) 2.4g、上述觸媒前驅物(2 6E_2g)、光酸產生 149 201213360 劑 Rhodorsil Photoinitiator 2074 ( Rhodia 公司製、生 CAS#17823 3-72_2) ( 1.36E-2 g,乙酸乙酯 0.1 mL 中),均 勻溶解後,藉由0.2 &quot; m之PTFE過濾器進行過渡,獲得絮 淨之感光性樹脂組成物清漆。 (3 )光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均勻塗佈所製備之青 漆後,投入45°C之乾燥機中15分鐘。完全去除溶劑後,壓 接光罩,以500 mJ/cm2選擇性地照射紫外線。除去遮罩 於乾燥機中以45°C 30分鐘、以85°C 30分鐘、以 从1 5 〇 C 1小 時分三個階段進行加熱。加熱後,確認到出現波導圖案 又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層 (4 )評價 藉由與實施例1相同之方法進行評價。傳播損失可算 出為0.05 dB/cm。核心部與包覆部之折射率差為〇 〇〇5。 B.光波導之評價 對各實施例及比較例中所得之光波導進行以下呼價。 將評價項目與内容一併表示。將所得之結果示於表2中。 1.光損失 將自850 rnn之VCSEL (表面發光雷射)發出之光經由 150 201213360 5 0 // m多之光纖導入上沭本、,士措上 述九波導中,以200 // 之光纖進 行受光,測定光之強度》A去 ,.Λ χ 再者’測定係採用回戴法,將波 導長繪製成橫軸、插入損失緣製成縱軸,結果測定值準確 地排列於直線上’由其斜度算出傳播損失。 2.耐熱性 將上述光波導投入高溫高濕槽(85。〇,85%RH)中, 評價濕熱處理卿+時後之傳播損失。又,亦同時確認有 無因回焊處理(於N2環境下,最大溫度26CTC/60秒)引起 之傳播損失之劣化。 、再者,此處之傳播損失之測定與1之光損失之測定方 法相同。 3 ·光波導之彎曲損失 〇 八有1 〇 01111之曲率半徑之光波導膜的光強度之彎曲 相失進行評價。將自85Gnm之vcsel (表面發光雷射)發 光、里由50 &quot;爪多之光纖導入上述光波導膜之端面,以 2〇0/4之光纖自另—端進行受光,敎光之強度(參照 :二j )。將使長度相等之光波導膜彎曲時所產生的損失之 :量定義為「-曲損失」,如圖19所示,以使光波導膜形 j 狀之情形之插入損《與使光波導膜%成直線狀之情 形之插入損失的差表示「彎曲損失」。 =入損失[dB]=-i〇i〇g (出射光強度/入射光強度) 幫曲損失=(曲線下之插入損失)—( 損失) 151 201213360 [表2] 聚合物 單體 光损失 [dB/cm] 彎曲損失 [dB/cm] 耐熱性評1 η 85〇C85%RH 500 hr 260°C回焊 實施例1 圓 CHOX 0.03 0.7 0.05 0.04 實施例8 涵 CHOX 0.03 0.8 0·05 0.05 實施例9 與實施例1相同 CHOX DOX 0.04 0.9 0Ό4 — 0.05 實施例10 W CHOX 0.05 0.9 αΐό — 0.36 實施例11 與實施例1相同. CHOX 0.10 1.2 all — 0.11 實施例12 與實施例1相同 CHOX 0.10 1.1 0Λ2 ~~~ 0.11 比較例1 與實施例1相同 無 0.90 2.5 099 ~~ 1.12 比較例2 與實施例1相同 SiX 0.05 1.9 L35 —^ 1.50 由表2可明確般顯示,實施例卜8〜12之光損失較低, 光波導之性能優異。 又,顯示實施例1、8〜12之尚溫高濕處理後及回焊處 理後之光損失亦較小,耐熱性亦優異。 又,暗示,尤其是實施例1、8、9、1〇之彎曲損失亦 較小,即便使光波導彎曲而使用亦發揮充分之性能。 進而,使用各實施例及比較例中所得之光波導膜,製 作上述第1、第19實施形態之光波導結構體,結果與使用 152 201213360 各比較例中所得之光波導膜之光波導結構體相比,使用各 實施例中所得之光波導膜之光波導結構體分別可獲得 損失較低者。 ~ 又,使用各實施例及比較例中所得之光波導膜,製作 上述第14實施形態之光波導結構體’將各實施例及比較例 中所得之光波導膜亦分別用於垂直波導,結果與使用各比 較例中所得之光波導膜之光波導結構體相&amp;,使用各實施 1中斤得之光波導臈之光波導結構體可獲得傳輸損失較低 [產業上之可利用性] 本發明之光波導結構體的光電路(光波導之圖案)或 電氣電路之設計之处弓 二間較寬,良率較面,可較高地維持光 輸性能’可靠性、耐久性優異,富於通用性。因此,藉 ^具備本發明之光波導結構體,可獲得可靠性較高之各種 電子零件及電子# 电十扁置。因而,本發明於產業上極其有用。 【圖式簡單說明】. 0系表示本發明之光波導結構體之第1實施形態的 剖面圖。 S二表示本發明之光波導結構體之第2實施形態的 剖面圖。 圖 3 {系车· -— | ^不本發明之光波導結構體之第3實施形態的 圖。 圖4传矣-丄 、不本發明之光波導結構體之第4實施形態的 153 201213360 圖 剖面圖 圖 剖面圖 圖 剖面圖 係表示本發明之光波導結構體之第5實施形態的 係表示本發明之光波導結構體之第6實施形態的 人表示本發明之光波導結構體之第7實施形態的 剖面圖 系表示本發明之光波導結構體之第8實施形態的 剖面圖 圖9係表示本發明之光波導結構體之第9實施形態的 圖1〇係表示本發明之光波導結構體之第 施形態 的剖面圖。 剖面圖 圖11係表示本發明之光波導結構體之第u實施形 態的 態 圖12係表示本發明之光波導結構體 的平面圖。 ㈣之第12實施形 之平面圖。 之平面圖。 1 3實施形態 圖丨3係表示第12實施形態之其他構成例 圖14係表示第12實施形態之其他構成例 圖1 5係表示本發明之光波導結構體之 的斜視圖》 圖丨6係模式地表示光波導之製造 圖。 / 步驟例的剖面 圖1 7係模式地表示光波導之製造方 圖。 ,之步驟例的剖面 154 2〇1213360 圖 圖18係模式地表示光波導之製造方法之 步驟例的剖面 圖 圖⑺係模式地表示實施例之彎曲損失之剛定方法 的 態 圖2〇係表示本發明之光波導結構體之第 的剖面圖。 第14貫施形 施形態 圖21係表示本發明之光波導結構體之第15 6 的剖面圖。 貫 16實施形態 圖22係表示本發明之光波導結構體之第 的剖面圖。 圖23係表示本發明之光波導結構體之第 的剖面圖。 圖24係表示本發明之光波導結構體之第1 8 的剖面圖。 貫她形態 圖25為圖20中之A-A線剖面圖。 圖26為圖22中之B-B線音1j面圖。 圖27為圖24中之C-C線别面圖。 圖 圖28係模式地表示光波導之製造方法之步驟例的剖面 圖 圖 圖29係模式地表示光波導之製造方法之步驟例的剖面 圖30係模式地表示光波導之製造方法之步驟例的剖面 的 圖3 1係模式地表示實施例之彎曲損失之浪j定方、去 155 201213360 圖32係表示本發明之光波導結耩體之第丨9實施形ii 的平面圖。 圖33為圖32中之A-A線剖面阖。 圖34為圓32中之B-B線剖面圆。 圖35係表示本發明之光波導結構體之第20實施形態 的剖面圖。 圖36係表示本發明之光波導结構體之第21實施形態 的剖面圖。 圖37係表示本發明之光波導结構體之第22實施形態 的剖面圖。 圖3 8係模式地表示光波導之製造方法之步驟例的剖面 圖。 圖39係模式地表示光波導之製造方法之步驟例的剖面 圖40係模式地表示光波導之製造方法 圖。 步驟例的剖面 圖41係模式地表示實施例之彎曲損奂 圖。 失之剛定方法的 【主要元件符號說明】 1 光波導結構體 2 &gt; 2, 基板 21 透光部 22 貫通孔 156 201213360 23 垂直光波導 24 核心部 25 包覆部 26 透鏡部 3 接著層 4、41 底部填充材料 51 、 52 、 54 、 55 導體層 6、61 封閉材料 7 焊料 8 貫通孔 (through hole ) 81、82 導體柱 (導電材料) 9、9' 光波導 91 包覆層 92 包覆層 93 核心層 94 核心部 95 包覆部 96 光程轉換部 961 反射面 96a 、 96b 、 96c 、 96d 、 96e 、96f 光程轉換部 961a 、 961b 、 961c 、961d 、 961e、961f反射面 10 發光元件 101 發光部 103 端子 157 201213360 105 端子 11 受光元件 111 受光部 113 端子 115 端子 12 電氣元件(半導體元件) 123 端子 125 端子 127 端子 129 端子 13 晶片載體 900 清漆 910 膜 941 分支部 942 核心部 943 貫通孔(空孔) 944 反射面 945 加寬部 946 中斷部分 Μ 遮罩 S 延伸線 1001 光波導結構體 1002 基板 1022 貫通孔(through hole) 158 201213360 1222 1224 1023 1024 1025 1026 1003 1004 1051 、 1052 、 1053 1531 、 1532 、 1533 1006 1008 1081 1009 1091 1092 1093 1094 1095 1096 1961 1010 1101 1103 圓形部 矩形部 垂直光波導 導光程(核心部) 包覆部 透鏡部 導體部 底部填充材料 導體層 部位 封閉材料 貫通孔(through hole 導體柱(導體部) 光波導 包覆層 包覆層 核心層 核心部 包覆部 光程轉換部 反射面 發光元件 發光部 端子 159 201213360 1105 端子 1012 電氣 元 件 (半 導 體 元 件 ) 1123 端子 1125 端子 1018 傳輸 光 1900 清漆 ( 核 心層 形 成 用 材 料 ) 1910 膜 2001 光波 導 結 構體 2002 基板 2024 透光部 2025 貫通 孔 2026 透鏡 部 2003 凹部 2030 底面 ( 下 面) 203 1 接觸 面 ( 規制 X 方 向 ) 2032 接觸 面 ( 規制 Y 方 向 ) 2033 定位 手 段 (發 光 元 件 用 ) 2004 凹部 2040 底面 ( 下 面) 2041 接觸 面 ( 規制 X 方 向 ) 2042 接觸 面 ( 規制 Y 方 向 ) 2043 定位 手 段 (電 子 電. 路 元 件 用) 2005 導體 層 2051 &gt; 2052 ' 2053 部位 160 201213360 2006 定位構件(板材) 2061、 2062 接觸面 2007 接著層 2009 光波導 2091 包覆層 2092 包覆層 2093 核心層 2094 核心部 2095 包覆部 2096 光程轉換部 2961 反射面 2010 發光元件 2101 發光部 2103、 2105 端子 2012 電子電路元件(半導體元件) 2123 &gt; 2125 端子 2018 傳輸光 2900 清漆(核心層形成用材料) 2910 膜 161(Example 11) An optical waveguide film was produced in the same manner as in Example 1 except that the amount of the first monomer was changed to 〇 5 g. Furthermore, the propagation loss of the optical waveguide film is known to be 〇1〇 dB/cm. (Example 1 2) An optical waveguide film was produced in the same manner as in Example 1 except that the amount of the first monomer was changed to 4.0 g. Furthermore, the propagation loss of the obtained optical waveguide film was 〇1〇dB/cm. 148 201213360 (Comparative Example 1) An optical waveguide film was produced in the same manner as in Example 1 except that the first monomer was not used. Further, the propagation loss of the obtained optical waveguide film was 0.90 dB/cm. (Comparative Example 2) (1) Synthesis of each component <Catalyst precursor: Synthesis of Pd(〇Ac)2(P(Cy)3)2&gt; In a 2-neck round bottom flask equipped with a funnel, at - 78. (: A reddish brown suspension consisting of Pd(〇Ac)2 (5_〇〇g, 22 3 mm〇1) and CH2Cl2 (3 blush) was stirred under stirring. P(Cy)3 was added to the funnel (13.12) mL (44.6 mmol) of CH2C12 cold liquid (30 mL), and added dropwise to the stirred suspension over 5 minutes. As a result, it gradually turned from reddish brown to yellow. After the hour, the suspension was warmed to room temperature, and then mixed for 2 hours, and diluted with hexane (2 〇 mL). Then, the yellow solid was transferred in air and washed with sputum (5 χΐ〇 mL ). The mixture was vacuum-dried. The collected product was cooled to the same temperature and separated, and washed and dried in the same manner as above to obtain a catalyst precursor. (2) The photosensitive resin composition was produced in 100 mL. Weigh 1 〇g of the above-mentioned polymer purified in a glass container. Adding a uniform of $40 g, an antioxidant Irg靡 (Ciba-Geigy & Division) 0_01 g, and diterpene double Oxy) decane (SiX) 2.4g, the above catalyst precursor (2 6E_2g), photoacid generation 149 201213360 agent Rhodorsil Photoin Aitiator 2074 (manufactured by Rhodia Co., Ltd., raw CAS#17823 3-72_2) ( 1.36E-2 g, ethyl acetate 0.1 mL), uniformly dissolved, and then passed through a 0.2 &quot; m PTFE filter to obtain a floc Photosensitive resin composition varnish. (3) Production of optical waveguide film (production of lower cladding layer) A lower cladding layer was produced in the same manner as in Example 1. (Formation of core layer) Coating on the lower side On the layer, the prepared lacquer was uniformly applied by a doctor blade, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the reticle was crimped, and ultraviolet rays were selectively irradiated at 500 mJ/cm 2 . The cover was heated in a drier at 45 ° C for 30 minutes, at 85 ° C for 30 minutes, and at a temperature of 15 ° C for 1 hour in three stages. After heating, it was confirmed that the waveguide pattern appeared, and the core portion and the package were confirmed. Formation of the coating portion (Formation of the upper cladding layer) The evaluation of the upper side cladding layer (4) was carried out in the same manner as in Example 1. The propagation loss was calculated to be 0.05 dB/cm. The difference in refractive index between the core and the cladding is 〇〇〇 5. B. Evaluation of the optical waveguide The optical waveguides obtained in the respective examples and comparative examples were subjected to the following price. The evaluation items are shown together with the contents. The results obtained are shown in Table 2. 1. The light loss is from the 850 rnn VCSEL (surface luminescence laser) The light emitted by the 150 201213360 5 0 // m fiber is introduced into the upper stencil, and the above nine waveguides of the scholastic, the light is received by the optical fiber of 200 //, and the intensity of the light is measured, "A go, Λ χ The measurement system uses the back-wearing method, and the waveguide length is plotted on the horizontal axis and the insertion loss is formed on the vertical axis. As a result, the measured values are accurately arranged on the straight line, and the propagation loss is calculated from the slope. 2. Heat resistance The above-mentioned optical waveguide was placed in a high-temperature and high-humidity bath (85 〇, 85% RH), and the propagation loss after the wet heat treatment was evaluated. At the same time, it was confirmed whether or not the deterioration of the propagation loss due to the reflow treatment (maximum temperature of 26 CTC/60 seconds in the N2 environment) was observed. Furthermore, the measurement of the propagation loss here is the same as the measurement method of the light loss of 1. 3 · Bending loss of the optical waveguide 〇 The bending of the light intensity of the optical waveguide film having the radius of curvature of 有01 〇 01111 was evaluated. The vcsel (surface-emitting laser) light from 85Gnm is introduced into the end surface of the optical waveguide film by the optical fiber of 50 &quot; claws, and the light is received from the other end by the optical fiber of 2〇0/4, and the intensity of the light is Reference: two j). The amount of loss caused when the optical waveguide film having the same length is bent is defined as "-bending loss", as shown in Fig. 19, in order to make the optical waveguide film shape j-shaped, the insertion loss is made and the optical waveguide film is made. The difference in insertion loss in the case where % is linear indicates "bending loss". =input loss [dB]=-i〇i〇g (exit light intensity/incident light intensity) help loss = (insertion loss under the curve) - (loss) 151 201213360 [Table 2] Polymer monomer light loss [ dB/cm] bending loss [dB/cm] heat resistance rating η 85〇C85%RH 500 hr 260°C reflowing example 1 round CHOX 0.03 0.7 0.05 0.04 Example 8 culvert CHOX 0.03 0.8 0·05 0.05 Example 9 Same as Example 1 CHOX DOX 0.04 0.9 0Ό4 - 0.05 Example 10 W CHOX 0.05 0.9 αΐό - 0.36 Example 11 Same as Example 1. CHOX 0.10 1.2 all - 0.11 Example 12 Same as Example 1 CHOX 0.10 1.1 0Λ2 ~~~ 0.11 Comparative Example 1 Same as Example 1 No 0.90 2.5 099 ~~ 1.12 Comparative Example 2 Same as Example 1 SiX 0.05 1.9 L35 —^ 1.50 It can be clearly shown in Table 2 that the light of Example 8~12 The loss is low and the performance of the optical waveguide is excellent. Further, it was shown that the light loss after the temperature-and-humidity treatment and the reflow treatment of Examples 1 and 8 to 12 was small, and the heat resistance was also excellent. Further, it is suggested that in particular, the bending loss of Examples 1, 8, 9, and 1 is also small, and sufficient performance is exhibited even when the optical waveguide is bent and used. Further, the optical waveguide structures of the first and the ninth embodiments were produced by using the optical waveguide films obtained in the respective examples and the comparative examples. As a result, the optical waveguide structure of the optical waveguide film obtained in each comparative example of 152 201213360 was used. In contrast, the optical waveguide structure using the optical waveguide film obtained in each of the examples can respectively obtain a lower loss. Further, the optical waveguide film of the fourteenth embodiment was produced by using the optical waveguide film obtained in each of the examples and the comparative examples. The optical waveguide films obtained in the respective examples and the comparative examples were also used for the vertical waveguide. With the use of the optical waveguide structure of the optical waveguide film obtained in each of the comparative examples, the optical waveguide structure of the optical waveguide of each of the first embodiment can be used to obtain a low transmission loss [industrial availability] The optical circuit (pattern of the optical waveguide) or the electrical circuit of the optical waveguide structure of the present invention has a wide width between the two, and the yield is relatively high, and the optical transmission performance can be maintained at a high level, and the reliability and durability are excellent. For versatility. Therefore, by providing the optical waveguide structure of the present invention, various electronic components and electronic devices with high reliability can be obtained. Thus, the present invention is extremely useful in the industry. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 0 is a cross-sectional view showing a first embodiment of the optical waveguide structure of the present invention. S2 is a cross-sectional view showing a second embodiment of the optical waveguide structure of the present invention. Fig. 3 is a view showing a third embodiment of the optical waveguide structure of the present invention. Fig. 4 is a cross-sectional view showing a fourth embodiment of the optical waveguide structure of the present invention. Fig. 4 is a cross-sectional view showing a fifth embodiment of the optical waveguide structure of the present invention. A cross-sectional view showing a seventh embodiment of the optical waveguide structure of the present invention is a cross-sectional view showing an eighth embodiment of the optical waveguide structure of the present invention, and FIG. 9 is a view showing a sixth embodiment of the optical waveguide structure according to the present invention. Fig. 1A showing a ninth embodiment of the optical waveguide structure of the present invention is a cross-sectional view showing a first embodiment of the optical waveguide structure of the present invention. Fig. 11 is a view showing a state in which the optical waveguide structure of the present invention is in the second embodiment. Fig. 12 is a plan view showing the optical waveguide structure of the present invention. (4) A plan view of the twelfth embodiment. Floor plan. 1 3 embodiment FIG. 3 shows another configuration example of the twelfth embodiment. FIG. 14 shows another configuration example of the twelfth embodiment. FIG. 5 is a perspective view showing the optical waveguide structure of the present invention. FIG. The pattern of the optical waveguide is schematically shown. / Cross section of the step example Fig. 1 shows a schematic diagram of the manufacturing of the optical waveguide. FIG. 18 is a cross-sectional view showing a step example of a method for manufacturing an optical waveguide. FIG. A cross-sectional view of the optical waveguide structure of the present invention. Fig. 21 is a cross-sectional view showing the fifteenth aspect of the optical waveguide structure of the present invention. Fig. 22 is a cross-sectional view showing the first embodiment of the optical waveguide structure of the present invention. Figure 23 is a cross-sectional view showing the first portion of the optical waveguide structure of the present invention. Fig. 24 is a cross-sectional view showing the eighth embodiment of the optical waveguide structure of the present invention. Fig. 25 is a cross-sectional view taken along line A-A of Fig. 20. Figure 26 is a cross-sectional view taken along the line B-B of Fig. 22; Figure 27 is a cross-sectional view taken along line C-C of Figure 24; FIG. 28 is a cross-sectional view showing a step example of a method of manufacturing an optical waveguide. FIG. 29 is a cross-sectional view showing an example of a method of manufacturing an optical waveguide. FIG. Fig. 31 of the cross section schematically shows the wave of the bending loss of the embodiment, 155 201213360. Fig. 32 is a plan view showing the ninth embodiment of the optical waveguide junction of the present invention. Figure 33 is a cross-sectional view taken along line A-A of Figure 32. Figure 34 is a cross-sectional circle taken along the line B-B in circle 32. Figure 35 is a cross-sectional view showing a twentieth embodiment of the optical waveguide structure of the present invention. Figure 36 is a cross-sectional view showing a twenty-first embodiment of the optical waveguide structure of the present invention. Figure 37 is a cross-sectional view showing a twenty-second embodiment of the optical waveguide structure of the present invention. Fig. 3 is a cross-sectional view showing an example of the steps of a method of manufacturing an optical waveguide. Fig. 39 is a cross-sectional view schematically showing an example of the steps of a method of manufacturing an optical waveguide. Fig. 40 is a view schematically showing a method of manufacturing an optical waveguide. Cross section of the step example Fig. 41 is a view schematically showing a bending loss diagram of the embodiment. [Major component symbol description] 1 Optical waveguide structure 2 &gt; 2, Substrate 21 Transmissive portion 22 Through hole 156 201213360 23 Vertical optical waveguide 24 Core portion 25 Cover portion 26 Lens portion 3 Next layer 4 , 41 underfill material 51, 52, 54 , 55 conductor layer 6, 61 sealing material 7 solder 8 through hole 81, 82 conductor column (conductive material) 9, 9' optical waveguide 91 cladding layer 92 coating Layer 93 Core layer 94 Core portion 95 Cover portion 96 Optical path conversion portion 961 Reflecting surfaces 96a, 96b, 96c, 96d, 96e, 96f Optical path converting portions 961a, 961b, 961c, 961d, 961e, 961f Reflecting surface 10 Light-emitting elements 101 Light-emitting unit 103 Terminal 157 201213360 105 Terminal 11 Light-receiving element 111 Light-receiving part 113 Terminal 115 Terminal 12 Electrical component (semiconductor component) 123 Terminal 125 Terminal 127 Terminal 129 Terminal 13 Wafer carrier 900 Varnish 910 Film 941 Branch 942 Core 943 Through-hole (empty hole) 944 reflecting surface 945 widening portion 946 interruption portion 遮 mask S extension line 1 001 Optical waveguide structure 1002 Substrate 1022 Through hole 158 201213360 1222 1224 1023 1024 1025 1026 1003 1004 1051, 1052, 1053 1531, 1532, 1533 1006 1008 1081 1009 1091 1092 1093 1094 1095 1096 1961 1010 1101 1103 Round Rectangular portion vertical optical waveguide light guide (core portion) cladding portion lens portion conductor portion underfill material conductor layer portion sealing material through hole (through hole conductor column (conductor portion) optical waveguide cladding layer core layer core Part coating part optical path conversion part Reflecting surface light-emitting element Light-emitting part terminal 159 201213360 1105 Terminal 1012 Electrical component (semiconductor element) 1123 Terminal 1125 Terminal 1018 Transmission light 1900 Varnish (material for core layer formation) 1910 Film 2001 Optical waveguide structure 2002 Substrate 2024 Transmissive portion 2025 Through hole 2026 Lens portion 2003 Concave portion 2030 Bottom surface (below) 203 1 Contact surface (Regular X direction) 2032 Contact (Regulation Y direction) 2033 Positioning means (for light-emitting elements) 2004 Concave 2040 Bottom (bottom) 2041 Contact surface (regular X direction) 2042 Contact surface (regular Y direction) 2043 Positioning means (for electronic components. For conductor components) 2005 Conductor layer 2051 &gt; 2052 ' 2053 part 160 201213360 2006 locating member (plate) 2061, 2062 contact surface 2007 next layer 2009 optical waveguide 2091 cladding layer 2092 cladding layer 2093 core layer 2094 core portion 2095 cladding portion 2096 optical path conversion portion 2961 Reflecting surface 2010 Light-emitting element 2101 Light-emitting part 2103, 2105 Terminal 2012 Electronic circuit component (semiconductor element) 2123 &gt; 2125 Terminal 2018 Transmission light 2900 Varnish (material for core layer formation) 2910 Film 161

Claims (1)

201213360 七、申請專利範圍: 1. 一種光波導結構體’具有具備折射率彼此不同之枝、、 部與包覆部之光波導、及使該核心部之光程彎曲之光程轉 換部, 該核心部係藉由對由含有以下成分之組成物所構成的 核心層選擇性地照射活性放射線而形成為所欲之形狀者: (A) 環烯(cyclic olefin)樹脂、 (B) 折射率與該(A)不同’且具有環狀醚基之單體 及具有環狀醚基之寡聚物中之至少一者、及 (c)光酸產生劑(photo_acid_generatingagent)。 2·如申請專利範圍第i項之光波導結構體’其中,該(b) 之環狀醚基為氧雜環丁烷基(〇xetanyl gr〇叩)或環氧基。 3 ·如申請專利範圍第2項之光波導結構體,其中,該(A ) 之環烯樹脂於側鏈具有藉由由該(c)之光酸產生劑產生之 酸而脫離之脫離性基, 該(B)含有下述式(1〇〇)所記載之第1單體:201213360 VII. Patent application scope: 1. An optical waveguide structure body having an optical waveguide having a branch having a different refractive index, an optical waveguide having a portion and a cladding portion, and an optical path converting portion for bending an optical path of the core portion, The core portion is formed into a desired shape by selectively irradiating an active radiation composed of a core layer composed of a composition containing the following components: (A) a cyclic olefin resin, (B) a refractive index and The (A) at least one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group, and (c) a photoacid generator (photo_acid_generating agent). 2. The optical waveguide structure of the invention of claim i wherein the cyclic ether group of (b) is an oxetanyl group or an epoxy group. 3. The optical waveguide structure according to claim 2, wherein the cycloolefin resin of (A) has a debonding group which is detached from an acid generated by the photoacid generator of (c) in a side chain. (B) contains the first monomer described in the following formula (1〇〇): 至第3項中任一項之光波導結 具有將傳輸於該核心部之傳輪 4 ·如申凊專利範圍第1項 構體,其中’該光程轉換部 162 201213360 光之至少一部分反射的反射面,該反射面設定成使該傳輸 光全反射之傾斜角。 5 ·如申請專利範圍第1項至第4項中任一項之光波導結 構體’其具有設置於該核心部之空扎,該反射面係由該核 心部與該空孔之界面之一部分或全部所構成,該反射面設 定成使該傳輸光全反射之傾斜角。 6·如申請專利範圍第4項或第5項之光波導結構體,其 中’使該反射面於該核心部方向投影時之投影與該核心部 之剖面所重疊的面積,與該核心部之剖面積相同, 僅於5亥核心部之存在該反射面之部分較大地設定該核 心部。 7. 如申請專利範圍第1項至第6項中任一項之光波導結 構體’其中’該光程轉換部僅形成於該核心層内。 8. 如申請專利範圍第1項至第7項中任一項之光波導結 構體,其中,於該核心層中,該核心部係形成為於其端部 或中途中斷, 該光程轉換部形成於該核心部中斷之部分。 9. 種光波導結構體,其係由具有具備折射率彼此不同 之核〜部與包覆部之光波導、及導體層的積層結構體所構 成,並且具有 於厚度方向延伸且與該核心部光學連接之導光程、 及 於厚度方向延伸且與該導體層電連接之導體部, 該核心部係藉由對由含有以下成分之組成物所構成 核心層選擇性地照射活性放射線而形成為所欲之形狀者. 163 201213360 (A) 環烯樹脂、 (B) 折射率與該(A)不同,且具有環狀醚基之單體 及具有環狀驗基之寡聚物中之至少一者、及 (C )光酸產生劑。 10·如申請專利範圍第9項之光波導結構體,其具有貫 通孔,該導光程與該導體部形成於該貫通孔内。 11. 如申請專利範圍第9項或第10項之光波導結構體, 其中’該導光程係、由具有折射率彼此不同之核心部與包覆 部之垂直光波導所構成。 &lt; 12. -種光波導結構體’其具備基板 '具有折射率彼此 不同之核心部與包覆部之光波導、至彡i個電氣元件、及 決定該電氣元件之設置位置之定位手段, 該核心部係藉由對由含有以下成分之組成物所構成的 核心層選擇性地照射活性放射線而形成為所欲之形狀者: (A)環烯樹脂、 (B) 折射率與該(a)不同,且且女 U 且具有環狀醚基之單I 及具有環狀基之寡聚物中之至少一者及 (C) 光酸產生劑。 13.如申請專利範圍第12項之光波導結構體,其中。 定位手段係以俯視時,該發光部或該受光部之位置H 程轉換部之位置重疊之方式來定位。 一 7 164The optical waveguide junction according to any one of the items 3, wherein the optical transmission node to be transmitted to the core portion has the structure of the first embodiment of the invention, wherein the optical path conversion portion 162 201213360 reflects at least a portion of the light. A reflecting surface that is set to an inclination angle that causes the transmitted light to be totally reflected. The optical waveguide structure of any one of claims 1 to 4, which has an empty space disposed at the core portion, the reflective surface being a part of an interface between the core portion and the hole Or all of them, the reflecting surface is set to an inclination angle at which the transmitted light is totally reflected. 6. The optical waveguide structure according to claim 4 or 5, wherein 'the area where the projection of the reflecting surface is projected in the direction of the core portion overlaps with the cross section of the core portion, and the core portion The cross-sectional area is the same, and the core portion is set larger only in the portion where the reflecting surface is present in the core portion of the 5 hr. 7. The optical waveguide structure body of any one of claims 1 to 6, wherein the optical path conversion portion is formed only in the core layer. 8. The optical waveguide structure according to any one of claims 1 to 7, wherein in the core layer, the core portion is formed to be interrupted at an end or a middle thereof, the optical path conversion portion Formed in the part of the core interrupt. 9. An optical waveguide structure comprising a laminated structure including an optical waveguide having a core portion and a cladding portion having different refractive indices and a conductor layer, and extending in a thickness direction and the core portion a light guiding path of the optical connection and a conductor portion extending in the thickness direction and electrically connected to the conductor layer, wherein the core portion is formed by selectively irradiating the active layer with the core layer composed of the composition containing the following components Any desired shape. 163 201213360 (A) a cycloolefin resin, (B) at least one of a monomer having a refractive index different from the (A) and having a cyclic ether group and an oligomer having a cyclic group And (C) photoacid generator. 10. The optical waveguide structure of claim 9, which has a through hole, and the light guiding path and the conductor portion are formed in the through hole. 11. The optical waveguide structure according to claim 9 or 10, wherein the optical path length is constituted by a vertical optical waveguide having a core portion and a cladding portion having different refractive indices from each other. &lt; 12. An optical waveguide structure comprising a substrate 'an optical waveguide having a core portion and a cladding portion having different refractive indices, an electrical component, and a positioning means for determining an installation position of the electrical component. The core portion is formed into a desired shape by selectively irradiating an active radiation composed of a core layer composed of a composition containing the following components: (A) a cycloolefin resin, (B) a refractive index and the (a) And (C) a photoacid generator which is different from the female I and has a cyclic ether group and at least one of the oligomer having a cyclic group. 13. The optical waveguide structure of claim 12, wherein. The positioning means is positioned such that the position of the light-emitting portion or the position-receiving portion of the light-receiving portion overlaps in plan view. One 7 164
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