JP2008158474A - Optical element mounting component and optical element mounted component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element mounted component that has excellent thermal resistance as well as low water absorbency and that can reduce loss of light propagation, and to provide an optical element mounting component that has improved positioning accuracy in loading an optical element. <P>SOLUTION: The optical element mounting component includes: a wiring part which has a pad for loading an optical element with an electrode; and an optical circuit substrate composed of an optical waveguide layer, which is laminated on one side of the wiring part containing a loading part for loading the optical element with the electrode and containing a pad in the loading part, which is equipped with a core layer having a core part and a clad part that has a lower refractive index than the core part, and which is equipped with a clad layer installed in contact with at least one side of the core layer and provided with a lower refractive index than the core part. The optical circuit substrate is provided with a receptor structure for the purpose of electric conductance between the electrode of the optical element and the pad of the wiring part. The clad layer consists essentially of norbornene based polymer. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical element mounting component and an optical element mounting component.

  In recent years, electronic devices have been increasingly demanded for miniaturization and high performance. In particular, in order to cope with high-speed signals, studies are being made to increase the speed of signal transmission paths in electronic devices by connecting electronic components with optical signals. For connection by optical signal, an optical / electrical hybrid substrate having optical wiring and electrical wiring is used, and the optical wiring has an optical waveguide composed of a core portion and a cladding portion, and the core portion of the optical waveguide. The optical signal is transmitted by transmitting the light.

In an electronic device equipped with such a mixed optical / electrical board, an electronic component is mounted on the board, and an input / output signal of the electronic component is converted into an optical signal using an optical element and propagated to an optical waveguide. First, it is advantageous to use a structure in which an optical signal is converted back to an electrical signal using the other optical element and connected to the other electronic component. Conventionally, such a substrate has been integrated with a rigid substrate such as an optical waveguide formed in the rigid substrate. For example, an optical element and an electronic component are mounted on the substrate, The signal is transmitted from the mounting surface through the substrate through the electric wiring formed on the opposite side, and the optical signal is propagated from the optical waveguide formed in the substrate, and the insulating layer is passed through the optical waveguide. However, in such a structure, there is a limit to downsizing such that it cannot be further thinned, and Since there is a distance between the light emitting / receiving portion of the optical element and the core portion of the optical waveguide, it may affect the efficiency of light input from the light emitting portion to the core portion, and may cause problems in characteristics such as loss of light propagation. . Further, as one method for solving such a problem, there is a demand for alignment accuracy between the light emitting / receiving portion of the optical element and the core portion of the optical waveguide.
JP 2002-182049 A

  The present invention provides an optical element mounting component that has excellent heat resistance and low water absorption and can reduce loss of light propagation, and an optical element mounting component that has good alignment accuracy in mounting an optical element.

  The present invention is achieved by the following optical element mounting parts (1) to (63) and optical element mounting parts (64) to (69).

(1) a wiring component having a pad on which an optical element having an electrode is mounted;
A core comprising a core part and a clad part having a lower refractive index than the core part, laminated on one surface side of a wiring component having a mounting part for mounting an optical element having electrodes and a pad on the mounting part. An optical circuit board composed of an optical waveguide layer having a layer and a cladding layer provided in contact with at least one surface of the core layer and having a refractive index lower than that of the core portion;
Comprising
The optical circuit board includes a receptor structure for measuring electrical conduction between the electrode of the optical element and the pad of the wiring component,
The clad layer is a component for mounting an optical element, wherein the main material is a norbornene-based polymer.

(2) The optical element mounting component according to item (1), wherein the norbornene-based polymer is an addition polymer.

(3) The optical element mounting component according to (1) or (2), wherein the norbornene-based polymer includes a repeating unit of alkyl norbornene.

(4) The component for mounting an optical element according to any one of (1) to (3), wherein the norbornene-based polymer includes a norbornene repeating unit having a substituent containing a polymerizable group.

(5) The optical element mounting component according to any one of (1) to (4), wherein the norbornene-based polymer is mainly one represented by the following chemical formula 1.

[Wherein R represents an alkyl group having 1 to 10 carbon atoms, a represents an integer of 0 to 3, b represents an integer of 1 to 3, and p / q is 20 or less. ]

(6) The optical element mounting component according to (4) or (5), wherein at least a part of the norbornene-based polymer is cross-linked with a polymerizable group.

(7) The light according to any one of (1) to (6), wherein the average thickness of the cladding layer is 0.1 to 1.5 times the average thickness of the core layer. Component mounting parts.

(8) The core layer comprises a polymer, a monomer compatible with the polymer and having a refractive index different from that of the polymer, a first substance that is activated by irradiation with actinic radiation, and the reaction of the monomer. Forming a layer comprising a second substance that can be initiated and a second substance that has an activation temperature changed by the action of the activated first substance;
Thereafter, the first substance is activated in the irradiation region irradiated with the actinic radiation by selectively irradiating the layer with the actinic radiation, and the activation temperature of the second substance. Change
Next, by performing heat treatment on the layer, the lower one of the second substance or the second substance whose activation temperature has changed is activated, and the irradiation region or the Either one of the irradiated region and the unirradiated region is caused by reacting the monomer in any one of the unirradiated regions of actinic radiation to generate a refractive index difference between the irradiated region and the unirradiated region. The component for mounting an optical element according to any one of Items (1) to (7), wherein the core portion is obtained and the other is obtained as the cladding portion.

(9) The core layer was obtained by collecting the unreacted monomer from the other region as the reaction of the monomer progressed in either the irradiated region or the unirradiated region of the layer. The component for mounting an optical element according to item (8),

(10) The first substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the active radiation, and the second substance is produced by the action of the weakly coordinating anion. The component for mounting an optical element according to (8) or (9), wherein the activation temperature varies.

(11) The activation temperature of the second substance is lowered by the action of the activated first substance, and the irradiation with the active radiation is accompanied by heating at a temperature higher than the temperature of the heat treatment. The component for mounting an optical element according to any one of items (8) to (10), which is activated without any problem.

(12) The component for mounting an optical element according to (11), wherein the second substance includes a compound represented by the following formula Ia.
(E (R) ₃ ) ₂ Pd (Q) ₂ ... (Ia)
[Wherein E (R) ₃ represents a neutral electron donor ligand of Group 15; E represents an element selected from Group 15 of the periodic table; and R represents a hydrogen atom (or One of its isotopes) or a moiety containing a hydrocarbon group, Q represents an anionic ligand selected from carboxylate, thiocarboxylate and dithiocarboxylate. ]

(13) The component for mounting an optical element according to (11) or (12), wherein the second substance includes a compound represented by the following formula Ib.
[(E (R) ₃ ) _a Pd (Q) (LB) _b ] _p [WCA] _r (Ib)
[Wherein E (R) ₃ represents a neutral electron donor ligand of Group 15; E represents an element selected from Group 15 of the periodic table; and R represents a hydrogen atom (or One of its isotopes) or a moiety containing a hydrocarbon group, Q represents an anionic ligand selected from carboxylate, thiocarboxylate and dithiocarboxylate, LB represents a Lewis base, WCA Represents a weakly coordinating anion, a represents an integer of 1 to 3, b represents an integer of 0 to 2, the sum of a and b is 1 to 3, p and r are This represents the number that balances the charge between the palladium cation and the weakly coordinated anion. ]

(14) The optical element mounting component according to item (13), wherein p and r are each selected from an integer of 1 or 2.

(15) Item (8) to Item (14), wherein the core layer is obtained by heat-treating the layer at a second temperature higher than the temperature of the heat-treatment after the heat-treatment. The component for mounting optical elements according to any one of items 1).

(16) The core layer is obtained by heat-treating the layer at a third temperature higher than the second temperature after the heat treatment at the second temperature (15 The component for mounting an optical element according to the item).

(17) The optical element mounting component according to (16), wherein the third temperature is 20 ° C. or more higher than the second temperature.

(18) The component for mounting an optical element according to any one of (8) to (17), wherein the monomer includes a crosslinkable monomer.

(19) The component for mounting an optical element according to any one of (8) to (18), wherein the monomer is mainly a norbornene monomer.

(20) The component for mounting an optical element according to item (18), wherein the monomer is mainly a norbornene-based monomer and contains dimethylbis (norbornenemethoxy) silane as the crosslinkable monomer.

(21) The polymer has a leaving group capable of leaving at least a part of the molecular structure from the main chain by the action of the activated first substance, and selectively selects the actinic radiation for the layer. The component for mounting an optical element according to any one of Items (8) to (20), wherein the leaving group of the polymer is released in the irradiated region when irradiated to the region.

(22) The first substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the actinic radiation, and the leaving group is separated from the acid by the action of the cation. The component for mounting an optical element according to item (21), which is a sex group.

(23) The core layer has a substance activated by irradiation with actinic radiation, a main chain and a branch from the main chain, and at least a part of the molecular structure is detached from the main chain by the action of the activated substance. Forming a layer comprising a polymer having a leaving group capable of
Thereafter, by selectively irradiating the layer with the actinic radiation, the substance is activated in the irradiation region irradiated with the actinic radiation, and the leaving group of the polymer is released, By producing a refractive index difference between the irradiation region and the non-irradiation region of the active radiation, either the irradiation region or the non-irradiation region was obtained as the core portion, and the other was obtained as the cladding portion. The component for mounting an optical element according to any one of (1) to (7).

(24) The optical element mounting component according to item (23), wherein the core layer is obtained by subjecting the layer to heat treatment after irradiation with the active radiation.

(25) The substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the actinic radiation, and the leaving group is an acid leaving group that is released by the action of the cation. A component for mounting an optical element according to Item (23) or Item (24).

(26) In the item (22) or the item (25), the acid leaving group has at least one of an —O— structure, an —Si—aryl structure and an —O—Si— structure. The component for mounting optical elements described.

(27) The component for mounting an optical element according to any one of (21) to (26), wherein the leaving group causes a decrease in the refractive index of the polymer due to the leaving.

(28) The component for mounting an optical element according to (27), wherein the leaving group is at least one of a -Si-diphenyl structure and a -O-Si-diphenyl structure.

(29) The component for mounting an optical element according to any one of (8) to (28), wherein the active radiation has a peak wavelength in a range of 200 to 450 nm.

(30) The optical element mounting component according to any one of (8) to (29), wherein an irradiation amount of the active radiation is 0.1 to 9 J / cm ² .

(31) The optical element mounting component according to any one of (8) to (30), wherein the active radiation is applied to the layer through a mask.

(32) The component for mounting an optical element according to any one of (8) to (31), wherein the layer further includes an antioxidant.

(33) The optical element mounting component according to any one of (8) to (32), wherein the layer further includes a sensitizer.

(34) The optical element mounting component according to any one of (8) to (33), wherein the polymer is mainly a norbornene-based polymer.

(35) The component for mounting an optical element according to item (34), wherein the norbornene-based polymer is an addition polymer.

(36) The core portion is configured with a first norbornene-based material as a main material, and the cladding portion is configured with a second norbornene-based material having a lower refractive index than the first norbornene-based material. The optical element mounting component according to any one of (1) to (7).

(37) The first norbornene-based material and the second norbornene-based material both contain the same norbornene-based polymer, and a reaction of a norbornene-based monomer having a refractive index different from that of the norbornene-based polymer. The component for mounting an optical element according to item (36), wherein the refractive indexes thereof are different due to different contents of the objects.

(38) The reaction product is at least one of a polymer of the norbornene-based monomer, a crosslinked structure for crosslinking the norbornene-based polymers, and a branched structure branched from the norbornene-based polymer (37) Item for mounting optical element according to item.

(39) The optical element mounting component according to (37) or (38), wherein the norbornene-based polymer includes a repeating unit of aralkyl norbornene.

(40) The component for mounting an optical element according to (37) or (38), wherein the norbornene-based polymer includes a repeating unit of benzylnorbornene.

(41) The component for mounting an optical element according to (37) or (38), wherein the norbornene-based polymer includes a repeating unit of phenylethylnorbornene.

(42) The norbornene-based polymer has a main chain and a leaving group that is branched from the main chain, and at least a part of the molecular structure can be separated from the main chain,
The core part and the clad part are different in the number of leaving groups bonded to the main chain, and the content of a reaction product of a norbornene monomer having a refractive index different from that of the norbornene polymer. The component for mounting an optical element according to any one of Items (37) to (41), which has different refractive indexes due to being different.

(43) The core layer is composed mainly of a norbornene-based polymer having a main chain and a branching group that is branched from the main chain, and at least a part of the molecular structure of which can be released from the main chain,
In the item (36), the first norbornene-based material and the second norbornene-based material are different in refractive index due to a difference in the number of the leaving groups bonded to the main chain. The component for mounting optical elements described.

(44) The optical element mounting component according to Item (42) or (43), wherein the norbornene-based polymer includes a repeating unit of diphenylmethylnorbornenemethoxysilane.

(45) The component for mounting an optical element according to any one of (37) to (44), wherein the norbornene-based polymer includes a repeating unit of alkyl norbornene.

(46) The component for mounting an optical element according to any one of (37) to (44), wherein the norbornene-based polymer includes a repeating unit of hexylnorbornene.

(47) The optical element mounting component according to any one of (37) to (46), wherein the norbornene-based polymer is an addition polymer.

(48) The receptor structure according to (1) to (47), wherein the receptor structure includes a conductor portion that electrically connects the electrode of the optical element and the pad of the mounting portion. The component for optical element mounting of any one of Claims.

(49) The optical element mounting component according to Item (48), wherein the conductor portion in the receptor structure portion includes a conductor post provided on a wiring component side bottom in the receptor structure.

(50) The optical element mounting component according to item (49), wherein the conductor post of the conductor portion in the receptor structure portion protrudes from the optical element mounting surface of the optical circuit board.

(51) The component for mounting an optical element according to any one of (1) to (50), wherein an adhesive layer is provided between the wiring component and the optical circuit board.

(52) The optical element mounting component according to item (51), wherein the first adhesive layer electrically connects the electrode of the optical element and the pad of the mounting portion.

(53) The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and the solder powder and the curing agent having flux activity are present in the resin. The component for mounting an optical element according to item (51) or item (52).

(54) The optical element mounting component according to any one of (1) to (53), wherein the optical circuit board has a conductor circuit on the optical waveguide layer.

(55) The optical circuit board includes a conductor circuit on the optical element mounting surface side and the optical circuit board. The conductive member of the wiring component is used for electrical connection with the wiring component on the conductor circuit. The component for mounting an optical element according to any one of Items (1) to (54), which has a conductor portion for metal bonding.

(56) Item (1) to Item (1), wherein the optical circuit board includes an optical path conversion unit that bends the optical path of the core unit toward the light emitting / receiving unit of the optical element. The component for mounting an optical element according to any one of (55).

(57) The optical element mounting component has any one of the items (1) to (56), wherein the two wiring components are joined in a bridge shape by the optical circuit board. 2. The component for mounting an optical element according to item 1.

(58) The optical waveguide layer has a plurality of core parts, and the core part has a plurality of stages of optical path connection parts at an end opposite to the side where the receptor structure part is provided. Item 5. The optical element mounting component according to any one of Items (1) to (57), wherein the component is optically connected to a multi-fiber optical connector having a plurality of stages of optical fiber holes.

(59) In the paragraph (58), the optical connection component having a plurality of stages of optical path connections is a multi-fiber optical connector having a plurality of stages of optical fiber holes or an optical element having a plurality of stages of light receiving / emitting sections. The optical element mounting component described.

(60) The optical waveguide layer is bent at the end opposite to the side on which the receptor structure portion is provided, with the optical path of the core portion directed toward the optical path connection portion of the plurality of stages. The component for mounting an optical element according to item (59), which has an optical path conversion unit to be operated.

(61) The optical waveguide layer is adjacent to the other end of the optical waveguide from one end to the other end so that the optical path changing unit is arranged to face the optical path connecting units of the plurality of stages. The optical element mounting component according to item (60), which has a staggered structure end portion that is patterned in order with respect to the plurality of stages of optical path connecting portions.

(62) The core portion end portion is configured such that the core portion is curved toward the end portion so that the patterning is disposed so as to face the plurality of stages of optical path connecting portions. The component for mounting an optical element according to item (61).

(63) The optical element mounting component according to any one of (1) to (62), wherein the optical circuit board has an alignment hole.

(64) an optical element having an electrode;
The component for mounting an optical element according to any one of (1) to (63),
Comprising
The optical element is mounted on the pad of the wiring component having a pad for mounting the optical element through the optical circuit board in the optical element mounting component,
The optical circuit board and the wiring component, the optical element mounting, wherein the electrode of the optical element and the pad of the wiring component are electrically joined via a receptor structure formed on the optical circuit board parts.

(65) The optical element mounting component according to item (64), wherein the electrical connection part in the receptor structure part is constituted by a protrusion provided on the electrode of the optical element and a conductor post. .

(66) The electrical connection part in the receptor structure part is formed by metal bonding of a conductor post protruding from the optical element mounting surface of the optical circuit board and an electrode of the optical element (65). The optical element mounting component according to the item).

(67) A conductor circuit formed on the optical element mounting surface side of the optical circuit board and a conductor circuit penetrating the optical circuit board and being electrically connected to the conductive member of the wiring component on the conductor circuit. The optical element mounting component according to any one of items (64) to (66), wherein the conductive portion and the conductive member of the wiring component are metal-bonded.

(68) The optical element mounting component according to any one of (64) to (67), wherein the wiring component in the optical element mounting component is an electronic device wiring component.

(69) Any of the (64) to (68) items, wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board. The optical element mounting component according to Item 1.

ADVANTAGE OF THE INVENTION According to this invention, the optical element mounting component which is provided with the optical circuit board which is excellent in heat resistance and has low water absorption, has high mounting accuracy, and can reduce the loss of light propagation is obtained. Since the optical element mounting component of the present invention has a short distance between the light receiving and emitting part of the optical element and the core part of the optical waveguide, it can transmit light efficiently and can be thinned.
According to the present invention, it is possible to obtain an optical element mounting component that has good alignment accuracy in mounting an optical element and that can be easily mounted. The component for mounting an optical element of the present invention is not limited as long as the optical circuit board and the wiring component are separately prepared and have a portion on which the optical element can be mounted. Therefore, the size can be reduced and the degree of freedom of design is increased.

  The present invention is laminated on one surface side of a wiring component having a pad for mounting an optical element having an electrode, a mounting portion for mounting the optical element having an electrode, and a wiring component having a pad on the mounting portion. A core layer including a core portion, a cladding portion having a refractive index lower than that of the core portion, and a cladding layer provided in contact with at least one surface of the core layer and having a refractive index lower than that of the core portion. An optical circuit board composed of an optical waveguide layer, and the optical circuit board includes a receptor structure for electrically connecting the electrode of the optical element and the pad of the wiring component, The clad layer is a component for mounting an optical element mainly composed of a norbornene-based polymer. According to this, an optical circuit board having excellent heat resistance and low water absorption is provided. A good location alignment accuracy, it is easy to implement an optical element, furthermore, the combination freedom of the optical circuit board and the wiring part is high, parts for optical element mounting miniaturization becomes possible to obtain.

  According to another aspect of the present invention, there is provided an optical element having an electrode and the optical element mounting component, and the optical element is mounted on the optical element mounting component via the optical circuit board. The optical element is mounted on the pad of the wiring component having a pad, and the optical circuit board and the wiring component form an electrode of the optical element and a pad of the wiring component on the optical circuit board. The optical element mounting component is electrically bonded via the receptor structure formed. According to this, an optical element mounting component with high mounting accuracy and reduced light propagation loss can be obtained. Since the optical element mounting component of the present invention has a short distance between the light receiving and emitting part of the optical element and the core part of the optical waveguide, it can transmit light efficiently and can be thinned.

Hereinafter, the optical element mounting component and the optical element mounting component of the present invention will be described in detail.
The receptor structure in the present invention is an optical element mounting through hole provided in an optical circuit board, and the through hole has a structure in which the optical element and the electrical circuit of the wiring component are electrically connected by an electrical conductor. It will be. Further, the through hole can be used as an alignment portion between the light emitting / receiving portion of the optical element and the core portion of the optical waveguide, and by providing this, the mounting accuracy is improved and the loss of light propagation is further reduced. Can be reduced.
Examples of the optical element in the present invention include a light receiving element and a light emitting element.

  The optical circuit board in the present invention has an optical waveguide layer having a core part and a clad part. Preferably, when the optical element is mounted on the optical element mounting part of the wiring component, the optical element substrate is electrically conductive. It is provided with a receptor structure or a through hole for receptor structure for electrical connection between the electrode of the member and a conductive member such as a pad of the wiring component. The optical circuit board may have a conductor circuit on the optical waveguide layer, and a conductor post for passing through the electric circuit or the electric circuit and the optical circuit board in the clad portion to achieve electrical conduction on both sides. And so on.

In the present invention, the optical circuit board may be optically connected to an optical connection component having a plurality of stages of optical waveguides having optical waveguides formed in multiple lines.
Examples of the optical connecting component having the optical path connecting portion of the plurality of stages include those having an optical path connecting function between optical components, and those having a function of introducing / deriving light into / from the optical path of the optical waveguide. As an example, a multi-fiber optical connector having a plurality of stages of optical fiber holes and an optical element having a plurality of stages of light receiving / emitting portions can be cited.

  In the optical circuit board that is optically connected to the optical connection component having the multi-stage optical path connection section, for example, a multi-fiber optical connector having a multi-stage optical fiber hole or an optical element having a multi-stage receiving / emitting section is used. When used, the optical waveguide layer in the optical circuit board has a plurality of core parts, and the core part has a plurality of stages of optical fiber holes at the end opposite to the side where the receptor structure part is provided. A multi-fiber optical connector and an optical element having a plurality of stages of light receiving / emitting portions, and an optical path of the core portion to the core portion, the optical fiber hole and the light receiving / light emitting portion. A structure that is optically connected to a multi-core optical connector having a plurality of stages of optical fiber holes or an optical element having a plurality of stages of light receiving / emitting sections, provided with an optical path conversion section bent toward the optical element having It can be. At this time, the optical path changing part in the core part is preferably arranged so as to face the optical fiber hole and the light receiving / emitting part, and has a staggered structure end part. The core portion end portion is formed such that the core portion is curved toward the end portion so that the patterning is arranged to face the optical fiber hole and the light receiving / emitting portion. Preferred in design. By doing so, it is possible to reduce the size of the optical circuit board without using a plurality of optical waveguide layers or using a plurality of multi-fiber optical connectors.

  In the present invention, the staggered structure is directed from one end in the short direction of the optical waveguide to the other end so that the optical path conversion sections in the plurality of core sections are shifted so as to fit the optical fiber holes and the light receiving / emitting sections. The adjacent optical fiber holes and light receiving / emitting portions of the adjacent stages are repeatedly patterned in order like the first stage, the second stage, the first stage, and the second stage. When the optical fiber hole and the light receiving / emitting section are three-tiered, the first, second, third, first, second, third, etc. Patterning is performed so that the optical path changing part is shifted toward the end so as to fit the optical fiber hole and the light receiving / emitting part. In the drawing, the lengths of the core end portions are alternated, but the lengths may be the same depending on how the optical path conversion unit is provided.

  The multi-fiber optical connector having a plurality of stages of optical fiber holes has an optical fiber hole as the optical path connecting portion. For example, as an array of optical fiber holes, 16 cores (8 cores × 2 rows (stages)) ), 24 cores (12 cores x 2 rows (stages)), 32 cores (8 cores x 4 rows (stages)), 60 cores (12 cores x 5 rows (stages)), 80 cores (16 cores x 5 rows (stages)) Step)). At this time, 125 μm can be used as the diameter of the hole, and 250 μm, 500 μm, or the like is used as the pitch interval between the holes. Moreover, as a cross-sectional area of such a multi-fiber optical connector, for example, 2.5 mm × 4.4 to 8.4 mm is used although it depends on the arrangement of the optical fiber holes.

  As the optical element having the plurality of stages of light receiving / emitting parts, the light receiving part and the light emitting part serve as an optical path connecting part, and the optical element in which the light receiving / emitting parts are formed in a plurality of stages, and these are arranged in one stage Even if the optical elements are arranged, they can be used as a plurality of stages by arranging two or more optical elements arranged in one stage.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

  In the present invention, the optical waveguide layer in the optical circuit board has an optical path changing portion (not shown, but formed at the position of the optical fiber hole 114) in the core portion 115 in the optical fiber hole 114. A staggered structure end that is repeatedly patterned in order with respect to the adjacent optical fiber hole from one end to the other end in the short direction of the optical waveguide so that they are arranged to face each other. (FIG. 31), and in this case, the patterning is performed such that the core portion is curved toward an end portion (having a curved portion 117. FIG. 31) so as to be disposed so as to face the optical fiber hole. It is preferable in terms of design to have been made. The curved portion may be a bent portion and may be deformed to such an extent that no optical loss occurs.

  In the optical circuit board, by providing an alignment hole opposite to the fixing guide (FIG. 38), the alignment hole and the fixing guide are fitted to each other so that the optical path conversion portion and the optical fiber hole of the optical circuit board are formed. It becomes possible to fit passively accurately.

  FIG. 1 is a perspective view (partially cut away) showing an embodiment of an optical waveguide layer used when manufacturing an optical circuit board in an optical element mounting component of the present invention.

In the following description, the upper side in FIG. 1 is “upper” or “upper”, and the lower side is “lower” or “lower” (the same applies to the following drawings).
Each figure is exaggerated in the thickness direction of the layer (the vertical direction in each figure).

  The optical waveguide layer 90 shown in FIG. 1 is an optical waveguide structure 9 having an optical waveguide layer 90 and conductor layers 901 and 902 provided on the upper surface and the lower surface, respectively, and these layers are joined. (Figure 2). Thereby, the optical circuit board which has a conductor circuit can be manufactured. At this time, the conductor layer may be provided on one surface side.

  The constituent materials of the conductor layers 901 and 902 are, for example, various metal materials such as copper, copper-based alloy, aluminum, and aluminum-based alloy, indium tin oxide (ITO), and fluorine-containing indium tin oxide (FTO). And various oxide materials.

  The average thickness of each of the conductor layers 901 and 902 is preferably about 10 to 90% of the average thickness of the optical waveguide layer 90, and more preferably about 20 to 80%. Specifically, the average thickness of the conductor layers 901 and 902 is not particularly limited, but is usually preferably about 3 to 100 μm and more preferably about 5 to 70 μm. Thereby, it is possible to make the conductor layers 901 and 902 excellent in conductivity while preventing the flexibility of the optical waveguide structure 9 from being lowered.

  In the configuration shown in FIG. 2, the conductor layers 901 and 902 both have a flat plate shape (sheet shape). In this case, after processing into a predetermined pattern of the conductor layers 901 and 902, an optical element (light emitting element, light receiving element, etc.) is mounted at a desired location, thereby manufacturing a composite device including an optical circuit and an electric circuit. can do.

  The conductor layers 901 and 902 may be previously patterned (wiring). Moreover, you may abbreviate | omit either one of the conductor layers 901 and 902 as needed.

  Further, between the conductor layers 901 and 902 and the optical waveguide layer 90, one layer or two or more layers for any purpose (for example, the purpose of improving adhesion) may be provided.

  The optical waveguide layer 90 is formed by laminating a clad layer (lower clad layer) 91, a core layer 93, and a clad layer (upper clad layer) 92 in this order from the lower side in FIG. A core portion 94 having a predetermined pattern and a clad portion 95 adjacent to the core portion (waveguide channel) 94 are formed.

  The difference in refractive index between the core portion 94 and the clad portion 95 is not particularly limited, but is preferably about 0.3 to 5.5%, and particularly preferably about 0.8 to 2.2%. If the difference in refractive index is less than the lower limit, the effect of transmitting light may be reduced, and even if the upper limit is exceeded, no further increase in light transmission efficiency can be expected.

The refractive index difference is expressed by the following equation, where A is the refractive index of the core portion 94 and B is the refractive index of the cladding portion 95.
Refractive index difference (%) = | A / B-1 | × 100

  In the configuration shown in FIG. 1, the core portion 94 is formed in a straight line shape in a plan view, but may be curved or branched in the middle, and the shape is arbitrary. In addition, if the manufacturing method of the optical waveguide structure 9 which is mentioned later is used, the core part 94 of a complicated and arbitrary shape can be formed easily and with a sufficient dimensional accuracy.

  The core section 94 has a quadrangular shape such as a square shape or a rectangular shape (rectangular shape).

  The width and height of the core portion 94 are not particularly limited, but are preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and still more preferably about 10 to 60 μm.

  The core portion 94 is made of a material having a higher refractive index than that of the cladding portion 95, and is made of a material having a higher refractive index than the cladding layers 91 and 92.

  The clad layers 91 and 92 constitute the clad portions located at the lower part and the upper part of the core part 94, respectively. With such a configuration, the core portion 94 functions as a light guide path whose outer periphery is surrounded by the cladding portion.

  The average thickness of the clad layers 91 and 92 is preferably about 0.1 to 1.5 times the average thickness of the core layer 93, more preferably about 0.3 to 1.25 times, Specifically, the average thickness of the clad layers 91 and 92 is not particularly limited, but it is usually preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and about 10 to 60 μm. More preferably. Thereby, the function as a clad layer is suitably exhibited while preventing the optical waveguide layer 90 from becoming unnecessarily large (pressure film).

  The constituent materials of the clad layer 91, the clad portion 95, and the clad layer 92 may be the same (same type) or different from each other, but they have the same or similar refractive index. Is preferred. Details of the constituent materials of the cladding layers 91 and 92 and the core layer 93 will be described later.

  The optical waveguide layer 90 in the present invention is slightly different depending on the optical characteristics of the material of the core portion 94 and is not particularly limited. For example, the optical waveguide layer 90 is preferably used in data communication using light in the wavelength region of about 600 to 1550 nm. .

Next, an example of a method for manufacturing the optical waveguide layer 90 and the optical waveguide structure 9 will be described.
<First manufacturing method>
First, the first manufacturing method of the optical waveguide layer 90 and the optical waveguide structure 9 will be described.

  3-8 is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer 90 and the optical waveguide structure in this invention, respectively.

[1A] First, a layer 910 is formed over a supporting substrate 951 (see FIG. 3).
The layer 910 is formed by a method in which a core layer forming material (varnish) 900 is applied and cured (solidified).

  Specifically, the layer 910 is formed by applying the core layer forming material 900 on the support substrate 951 to form a liquid film, and then placing the support substrate 951 on a ventilated level table so that the surface of the liquid film is not coated. It is formed by leveling the uniform part and evaporating (desolving) the solvent.

  When the layer 910 is formed by a coating method, examples thereof include a doctor blade method, a spin coating method, a dipping method, a table coating method, a spray method, an applicator method, a curtain coating method, a die coating method, and the like. It is not done.

  As the support substrate 951, for example, a silicon substrate, a silicon dioxide substrate, a glass substrate, a quartz substrate, a polyethylene terephthalate (PET) film, or the like is used.

  The core layer forming material 900 contains a light-induced heat-developable material (PITDM) composed of a polymer 915 and an additive 920 (in this embodiment, including at least a monomer, a promoter, and a catalyst precursor). It is a material in which a monomer reaction occurs in the polymer 915 by irradiation with actinic radiation and heating.

  In the resulting layer 910, any polymer (matrix) 915 is distributed substantially uniformly and randomly, and the additive 920 is substantially uniformly and randomly dispersed within the polymer 915. ing. Thereby, the additive 920 is substantially uniformly and arbitrarily dispersed in the layer 910.

  The average thickness of the layer 910 is appropriately set according to the thickness of the core layer 93 to be formed, and is not particularly limited, but is preferably about 5 to 200 μm, and preferably about 10 to 100 μm. More preferably, it is about 15 to 65 μm.

  The polymer 915 has sufficiently high transparency (colorless and transparent) and is compatible with the monomer described later, and the monomer can react (polymerization reaction or crosslinking reaction) as described later. Even after the monomers are polymerized, those having sufficient transparency are preferably used.

  Here, “having compatibility” means that the monomer is at least mixed and does not cause phase separation with the polymer 915 in the core layer forming material 900 or the layer 910.

  Examples of such polymers 915 include cyclic olefin resins such as norbornene resins and benzocyclobutene resins, acrylic resins, methacrylic resins, polycarbonates, polystyrenes, epoxy resins, polyamides, polyimides, polybenzoxazoles, and the like. Among them, one or a combination of two or more thereof (polymer alloy, polymer blend (mixture), copolymer, etc.) can be used.

  Among these, those mainly composed of norbornene resins (norbornene polymers) are preferable. By using a norbornene-based polymer as the polymer 915, the core layer 93 having excellent optical transmission performance and heat resistance can be obtained.

  Moreover, since norbornene-type polymer has high hydrophobicity, the core layer 93 which cannot produce the dimensional change by water absorption etc. easily can be obtained.

  The norbornene polymer may be either one having a single repeating unit (homopolymer) or one having two or more norbornene repeating units (copolymer).

  Examples of such norbornene-based polymers include (1) addition (co) polymers of norbornene monomers obtained by addition (co) polymerization of norbornene monomers, and (2) norbornene monomers and ethylene or α-olefins. (3) addition polymers such as addition copolymers with norbornene-type monomers and non-conjugated dienes, and other monomers as required, (4) ring opening of norbornene-type monomers ( A (co) polymer, and a resin obtained by hydrogenating the (co) polymer if necessary, (5) a ring-opening copolymer of a norbornene-type monomer and ethylene or α-olefins, and ( (Co) polymer hydrogenated resin, (6) ring-opening copolymer of norbornene type monomer and non-conjugated diene or other monomer, and (co) polymerization if necessary And a ring-opening polymer such as a polymer obtained by hydrogenating the body. Examples of these polymers include random copolymers, block copolymers, and alternating copolymers.

  These norbornene-based polymers include, for example, ring-opening metathesis polymerization (ROMP), combination of ROMP and hydrogenation reaction, polymerization by radical or cation, polymerization using a cationic palladium polymerization initiator, and other polymerization initiators ( For example, it can be obtained by any known polymerization method such as polymerization using a polymerization initiator of nickel or another transition metal).

  Among these, as the norbornene-based polymer, those having at least one repeating unit represented by the following chemical formula 2 (Structural Formula B), that is, an addition (co) polymer is preferable. This is preferable because it is rich in transparency, heat resistance and flexibility.

  Such a norbornene-based polymer is suitably synthesized by using, for example, a norbornene-based monomer described later (a norbornene-based monomer represented by Chemical Formula 4 described below or a crosslinkable norbornene-based monomer).

  In order to obtain a polymer 915 having a relatively high refractive index, a monomer having an aromatic ring (aromatic group), a nitrogen atom, a bromine atom or a chlorine atom in the molecular structure is generally selected, A polymer 915 is synthesized (polymerized). On the other hand, in order to obtain a polymer 915 having a relatively low refractive index, a monomer having an alkyl group, a fluorine atom or an ether structure (ether group) is generally selected in the molecular structure, and the polymer 915 is synthesized ( Polymerization).

  As the norbornene-based polymer having a relatively high refractive index, those containing a repeating unit of aralkylnorbornene are preferable. Such norbornene-based polymers have a particularly high refractive index.

  Examples of the aralkyl group (arylalkyl group) of the aralkylnorbornene repeating unit include benzyl group, phenylethyl group, phenylpropyl group, phenylbutyl group, naphthylethyl group, naphthylpropyl group, fluorenylethyl group, fluorene group, and the like. Examples thereof include a nylpropyl group, and a benzyl group and a phenylethyl group are particularly preferable.

  A norbornene-based polymer having such a repeating unit is preferable because it has a very high refractive index.

  Further, the norbornene-based polymer preferably contains an alkylnorbornene repeating unit. Since a norbornene-based polymer containing a repeating unit of alkylnorbornene has high flexibility, high flexibility (flexibility) can be imparted to the optical waveguide layer 90 by using such norbornene-based polymer.

  Examples of the alkyl group that the alkylnorbornene repeating unit has include a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group, and a hexyl group is particularly preferable. These alkyl groups may be either linear or branched.

  By including the repeating unit of hexyl norbornene, it is possible to prevent the refractive index of the entire norbornene-based polymer from being lowered and to maintain high flexibility. Such a norbornene-based polymer is preferable because of its excellent transmittance with respect to light in the wavelength region as described above (particularly in the wavelength region near 850 nm).

  Preferred examples of such norbornene polymers include hexyl norbornene homopolymer, phenylethyl norbornene homopolymer, benzyl norbornene homopolymer, hexyl norbornene and phenylethyl norbornene copolymer, and hexyl norbornene and benzyl norbornene copolymer. However, it is not limited to these.

  The core layer forming material 900 of this embodiment includes a monomer, a promoter (first substance), and a catalyst precursor (second substance) as the additive 920.

  The monomer reacts in the active radiation irradiated region by irradiation with actinic radiation, which will be described later, and forms a reactant. Due to the presence of this reactant, the monomer refracts in the irradiated region in the layer 910 and in the non-active radiation irradiated region. It is a compound that can cause a rate difference.

  Here, as this reaction product, a polymer (polymer) formed by polymerizing a monomer in a polymer (matrix) 915, a crosslinked structure that cross-links the polymers 915, and a polymer 915 that is polymerized from the polymer 915 Examples thereof include at least one of branched structures (branch polymer and side chain (pendant group)).

  Here, in the layer 910, when it is desired that the refractive index of the irradiated region is high, a polymer 915 having a relatively low refractive index and a monomer having a high refractive index with respect to the polymer 915 are combined. When used and it is desired that the refractive index of the irradiated region be low, a polymer 915 having a relatively high refractive index and a monomer having a low refractive index for this polymer 915 are used in combination.

  Note that “high” or “low” in the refractive index does not mean the absolute value of the refractive index but means a relative relationship between certain materials.

  When the refractive index of the irradiated region in the layer 910 decreases due to the monomer reaction (reactant generation), the portion becomes the cladding portion 95, and when the refractive index of the irradiated region increases, the portion becomes the core portion 94. It becomes.

  Such a monomer is not particularly limited as long as it is a compound having a polymerizable site, and examples thereof include norbornene monomers, acrylic acid (methacrylic acid) monomers, epoxy monomers, styrene monomers, and the like. These can be used alone or in combination of two or more.

Among these, it is preferable to use a norbornene-based monomer as the monomer.
By using the norbornene-based monomer, it is possible to obtain the core layer 93 (optical waveguide layer 90) having excellent optical transmission performance and excellent heat resistance and flexibility.

  Here, the norbornene-based monomer is a generic term for monomers containing at least one norbornene skeleton represented by the following chemical formula 3 (structural formula A), and examples thereof include compounds represented by the following chemical formula 4 (structural formula C). .

[Wherein, a represents a single bond or a double bond, R ^{1 to} R ⁴ each independently represents a hydrogen atom, a substituted or unsubstituted hydrocarbon group, or a functional substituent; Represents an integer of 0 to 5; However, when a is a double bond, either one of R ¹ and R ² or one of R ³ and R ⁴ does not exist. ]

Examples of the unsubstituted hydrocarbon group (hydrocarbyl group) include, for example, a linear or branched alkyl group having 1 to 10 carbon atoms (C _{1 to} C ₁₀ ), a linear or branched carbon number of 2 -10 (C ₂ -C ₁₀ alkenyl group, linear or branched alkynyl group having 2 to 10 carbon atoms (C ₂ -C ₁₀ ), cycloalkyl having 4 to 12 carbon atoms (C ₄ -C ₁₂ ) Group, C 4-12 (C ₄ -C ₁₂ ) cycloalkenyl group, C 6-12 (C ₆ -C ₁₂ ) aryl group, C 7-24 (C ₇ -C ₂₄ ) aralkyl group In addition, R ¹ and R ² , R ³ and R ⁴ may each be an alkylidenyl group having 1 to 10 carbon atoms (C _{1 to} C ₁₀ ).

  Specific examples of the alkyl group include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group. , Nonyl and decyl groups, but are not limited thereto.

  Specific examples of the alkenyl group include, but are not limited to, a vinyl group, an allyl group, a butenyl group, and a cyclohexenyl group.

  Specific examples of the alkynyl group include, but are not limited to, ethynyl group, 1-propynyl group, 2-propynyl group, 1-butynyl group and 2-butynyl group.

  Specific examples of the cycloalkyl group include, but are not limited to, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

  Specific examples of the aryl group include, but are not limited to, a phenyl group, a naphthyl group, and an anthracenyl group.

  Specific examples of the aralkyl group include, but are not limited to, a benzyl group and a phenylethyl (phenethyl) group.

  Further, specific examples of the alkylidenyl group include, but are not limited to, a methylidenyl group and an ethylidenyl group.

  Examples of the substituted hydrocarbon group include those in which some or all of the hydrogen atoms of the hydrocarbon group are substituted with halogen atoms, that is, halohydrocarbyl groups, perhalohydrocarbyl groups. Or halogenated hydrocarbon groups such as perhalocarbyl groups.

  In these halogenated hydrocarbon groups, the halogen atom substituted with a hydrogen atom is preferably at least one selected from a chlorine atom, fluorine and bromine, more preferably a fluorine atom.

  Among these, specific examples of the perhalogenated hydrocarbon group (perhalohydrocarbyl group, perhalocarbyl group) include, for example, a perfluorophenyl group, a perfluoromethyl group (trifluoromethyl group), and a perfluoroethyl group. Perfluoropropyl group, perfluorobutyl group, perfluorohexyl group and the like.

As the halogenated alkyl group, those having 11 to 20 carbon atoms can be suitably used in addition to those having 1 to 10 carbon atoms. That is, as the halogenated alkyl group, a group that is partially or completely halogenated, linear or branched, and represented by the general formula: —C _Z X ″ _{2Z + 1} can be selected. Here, X '' represents a halogen atom or a hydrogen atom each independently, and Z represents the integer of 1-20.

In addition to the halogen atom, the substituted hydrocarbon group may be a linear or branched alkyl group having 1 to 5 carbon atoms (C _{1 to} C ₅ ), a haloalkyl group, an aryl group, and a cycloalkyl group. Examples thereof include a substituted cycloalkyl group, aryl group and aralkyl group (aralkyl group).

Moreover, as a functional substituent, for example, — (CH ₂ ) _n —CH (CF ₂ ) ₂ —O—Si (Me) ₃ , — (CH ₂ ) _n —CH (CF ₃ ) ₂ —O—CH ₂ —O—CH ₃ , — (CH ₂ ) _n —CH (CF ₃ ) ₂ —O—C (O) —O—C (CH ₃ ) ₃ , — (CH ₂ ) _n —C (CF ₃ ) ₂ — OH, — (CH ₂ ) _n —C (O) —NH ₂ , — (CH ₂ ) _n —C (O) —Cl, — (CH ₂ ) _n —C (O) —O—R ⁵ , — ( ^{_{CH 2) n-O-R}} 5, - (CH 2) n -O-C (O) -R 5, - (CH 2) n -C (O) -R 5, - (CH 2) n -O —C (O) —OR ⁵ , — (CH ₂ ) _n —Si (R ⁵ ) ₃ , — (CH ₂ ) _n —Si (OR ⁵ ) ₃ , — (CH ₂ ) _n —O—Si (R ⁵⁾ ) ₃ and-(C _{H 2) n -C (O)} -OR 6 , and the like.

Here, in each of the formulas above, each, n is an integer of 0, ^{R 5} are each independently a hydrogen atom, a linear or branched C 1 to 20 _(C 1 -C ₂₀₎ alkyl group, a linear or branched halogenated or perhalogenated alkyl group having a carbon number 1 to 20 _(C 1 _{-C 20)} linear or branched C 2 to 10 _(C 2 ~ alkenyl group of C _10), a linear or branched alkynyl group having 2 to 10 carbon atoms _(C 2 _{~C 10),} a cycloalkyl group having 5 to 12 carbon atoms _(C 5 _{~C 12),} to 6 carbon atoms -14 (C ₆ -C ₁₄ ) aryl group, C 6-14 (C ₆ -C ₁₄ ) halogenated or perhalogenated aryl group or C 7-24 (C ₇ -C ₂₄ ) aralkyl group Represents.

Incidentally, the hydrocarbon group represented by R ⁵ represents the same hydrocarbon groups as those represented by R ¹ to R ^4. As represented by R ^{1 to} R ⁴ , the hydrocarbon group represented by R ⁵ may be halogenated or perhalogenated.

For example, when R ⁵ is a halogenated or perhalogenated alkyl group having 1 to 20 carbon atoms (C _{1 to} C ₂₀ ), R ⁵ is represented by the general formula: —C _Z X ″ _{2Z + 1} . Here, z and X ″ are the same as defined above, and at least one of X ″ is a halogen atom (for example, a bromine atom, a chlorine atom, or a fluorine atom).

Here, the perhalogenated alkyl group is a group in which all X ″ are halogen atoms in the above general formula, and specific examples thereof include a trifluoromethyl group, a trichloromethyl group, —C ₇ F _15. Although _-C 11 _{F 23} and the like, but are not limited to.

  Specific examples of the perhalogenated aryl group include, but are not limited to, a pentachlorophenyl group and a pentafluorophenyl group.

Examples of R ⁶ include —C (CH ₃ ) ₃ , —Si (CH ₃ ) ₃ , —CH (R ⁷ ) —O—CH ₂ CH ₃ , —CH (R ⁷ ) OC (CH ₃ ). ₃ and the cyclic group of the following Chemical Formula 5

Here, R ⁷ represents a hydrogen atom or a linear or branched alkyl group having ₁ to ₅ carbon atoms (C _{1 to} C ₅ ).

  Examples of the alkyl group include methyl group, ethyl group, propyl group, i-propyl group, butyl group, i-butyl group, t-butyl, pentyl group, t-pentyl group, and neopentyl group.

  In the cyclic group represented by Chemical Formula 5, an ester bond is formed between the single bond extending from the ring structure and the acid substituent.

Specific examples of R ⁶ include, for example, a 1-methyl-1-cyclohexyl group, an isobornyl group, a 2-methyl-2-isobornyl group, a 2-methyl-2-adamantyl group, a tetrahydrofuranyl group, Examples thereof include a tetrahydropyranoyl group, a 3-oxocyclohexanoyl group, a mevalonic lactonyl group, a 1-ethoxyethyl group, and a 1-t-butoxyethyl group.

Other examples of R ⁶ include a dicyclopropylmethyl group (Dcpm) and a dimethylcyclopropylmethyl group (Dmcp) represented by the following chemical formula 6.

  Moreover, it can replace with said monomer for a monomer, or can also use a crosslinkable monomer (crosslinking agent) with said monomer. This crosslinkable monomer is a compound capable of causing a crosslinking reaction in the presence of a catalyst precursor described later.

  The use of the crosslinkable monomer has the following advantages. That is, since the crosslinkable monomer is polymerized faster, the time required for the formation (process) of the core layer 93 (optical waveguide layer 90) can be shortened. Moreover, since the crosslinkable monomer is difficult to evaporate even when heated, an increase in vapor pressure can be suppressed. Furthermore, since the crosslinkable monomer is excellent in heat resistance, the heat resistance of the core layer 93 can be improved.

  Among these, the crosslinkable norbornene-based monomer is a compound including a norbornene-based moiety (norbornene-based double bond) represented by Formula 3 (Structural Formula A).

  As the crosslinkable norbornene-based monomer, there are a compound of a continuous polycyclic ring system and a compound of a linked multicyclic ring system.

  Examples of the continuous polycyclic ring-based compound (continuous polycyclic ring-based crosslinkable norbornene-based monomer) include compounds represented by the following chemical formula (7).

[Wherein Y represents a methylene (—CH ₂ —) group, and m represents an integer of 0 to 5. However, when m is 0, Y is a single bond. ]

  For simplicity, norbornadiene is considered to be included in a continuous polycyclic ring system and includes a polymerizable norbornene double bond.

  Specific examples of this continuous polycyclic compound include, but are not limited to, compounds represented by the following chemical formula (8).

  On the other hand, examples of the linked polycyclic ring-based compound (linked polycyclic ring-based crosslinkable norbornene-based monomer) include compounds represented by the following chemical formula (9).

[Wherein, a independently represents a single bond or a double bond; m independently represents an integer of 0 to 5; and R ⁹ independently represents a divalent hydrocarbon. Represents a group, a divalent ether group or a divalent silyl group. N is 0 or 1. ]

  Here, the divalent substituent refers to a group having two bonds that can be bonded to the norbornene structure at the end.

Specific examples of the divalent hydrocarbon group (hydrocarbyl group) include an alkylene group represented by the general formula:-(C _d H _2d )-(d is preferably an integer of 1 to 10). And a divalent aromatic group (aryl group).

The divalent alkylene group is preferably a linear or branched alkylene group having 1 to 10 carbon atoms (C _{1 to} C ₁₀ ), such as a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, Examples include a hexylene group, a heptylene group, an octylene group, a nonylene group, and a decylene group.

The branched alkylene group is one in which a main chain hydrogen atom is substituted with a linear or branched alkyl group.
On the other hand, the divalent aromatic group is preferably a divalent phenyl group or a divalent naphthyl group.

The divalent ether group is a group represented by —R ¹⁰ —O—R ¹⁰ —.
Here, R ¹⁰ independently represents the same as R ⁹ .

  Specific examples of this linked polycyclic ring compound include compounds represented by the following chemical formula 10, chemical formula 11, chemical formula 12, chemical formula 13, and chemical formula 14, as well as fluorine-containing compounds represented by chemical formulas 15 and 16. Fluorine-containing crosslinkable norbornene-based monomer), but is not limited thereto.

  The compound represented by this formula 11 is dimethylbis [bicyclo [2.2.1] hept-2-ene-5-methoxy] silane, which is named dimethylbis (norbornenemethoxy) silane (“ Abbreviated as “SiX”).

[Wherein, n represents an integer of 0 to 4. ]

[Wherein, m and n each represent an integer of 1 to 4. ]

  Among various crosslinkable norbornene monomers, dimethylbis (norbornenemethoxy) silane (SiX) is particularly preferable. SiX has a sufficiently low refractive index with respect to a norbornene-based polymer containing a repeating unit of alkylnorbornene and / or a repeating unit of aralkylnorbornene. For this reason, the refractive index of the irradiation region irradiated with actinic radiation, which will be described later, can be reliably lowered to form the clad portion 95. Moreover, the refractive index difference between the core part 94 and the clad part 95 can be increased, and the characteristics (optical transmission performance) of the core layer 93 (optical waveguide layer 90) can be improved.

  In addition, you may make it use the above monomers individually or in arbitrary combinations.

  The catalyst precursor (second substance) is a substance capable of initiating the above-described monomer reaction (polymerization reaction, crosslinking reaction, etc.), and is a promoter (first substance) activated by irradiation with actinic radiation described later. It is a substance whose activation temperature changes by the action of.

  As the catalyst precursor (procatalyst), any compound may be used as long as the activation temperature changes (increases or decreases) with irradiation of actinic radiation. Those whose activation temperature decreases with irradiation are preferred. As a result, the core layer 93 (optical waveguide layer 90) can be formed by heat treatment at a relatively low temperature, and unnecessary heat is applied to the other layers, so that the characteristics (optical transmission performance) of the optical waveguide layer 90 are degraded. Can be prevented.

  As such a catalyst precursor, a catalyst precursor containing (mainly) at least one of the compounds represented by the following formulas (Ia) and (Ib) is preferably used.

[In the formulas Ia and Ib, E (R) ₃ represents a neutral electron donor ligand of group 15, respectively, E represents an element selected from group 15 of the periodic table, and R represents , Represents a moiety containing a hydrogen atom (or one of its isotopes) or a hydrocarbon group, and Q represents an anionic ligand selected from carboxylate, thiocarboxylate and dithiocarboxylate. In Formula Ib, LB represents a Lewis base, WCA represents a weakly coordinating anion, a represents an integer of 1 to 3, b represents an integer of 0 to 2, and a and b , P and r represent numbers that balance the charge of the palladium cation and the weakly coordinated anion. ]

Typical catalyst precursors according to Formula Ia include Pd (OAc) ₂ (P (i-Pr) ₃ ) ₂ , Pd (OAc) ₂ (P (Cy) ₃ ) ₂ , Pd (O ₂ CCMe ₃ ) ₂ (P (Cy) ₃ ) ₂ , Pd (OAc) ₂ (P (Cp) ₃ ) ₂ , Pd (O ₂ CCF ₃ ) ₂ (P (Cy) ₃ ) ₂ , Pd (O ₂ CC ₆ H ₅ ) ₃ (P (Cy) ₃ ) ₂ may be mentioned, but is not limited thereto. Here, Cp represents a cyclopentyl group, and Cy represents a cyclohexyl group.

  The catalyst precursor represented by the formula Ib is preferably a compound in which p and r are each selected from integers of 1 and 2.

Typical catalyst precursors according to such formula Ib include Pd (OAc) ₂ (P (Cy) ₃ ) ₂ . Here, Cy represents a cyclohexyl group, and Ac represents an acetyl group.

  These catalyst precursors can efficiently react with a monomer (in the case of a norbornene-based monomer, an efficient polymerization reaction, a crosslinking reaction, etc. by an addition polymerization reaction).

  In the state where the activation temperature is lowered (active latent state), the catalyst precursor has an activation temperature lower by about 10 to 80 ° C. (preferably about 10 to 50 ° C.) than the original activation temperature. Is preferred. Thereby, the refractive index difference between the core part 94 and the clad part 95 can be produced reliably.

Such a catalyst precursor includes (mainly) one containing at least one of Pd (OAc) ₂ (P (i-Pr) ₃ ) ₂ and Pd (OAc) ₂ (P (Cy) ₃ ) _2. Is preferred.

Hereinafter, Pd (OAc) ₂ (P (i-Pr) ₃ ) ₂ may be abbreviated as “Pd545”, and Pd (OAc) ₂ (P (Cy) ₃ ) ₂ may be abbreviated as “Pd785”. .

  The cocatalyst (first substance) is a substance that can be activated by irradiation with actinic radiation to change the activation temperature of the catalyst precursor (procatalyst) (the temperature at which the monomer reacts).

  As the cocatalyst (cocatalyst), any compound can be used as long as it has a molecular structure that changes (reacts or decomposes) when activated by irradiation with actinic radiation. A compound (photoinitiator) that decomposes upon irradiation with actinic radiation and generates a cation such as a proton or other cation and a weakly coordinated anion (WCA) that can be substituted with a leaving group of the catalyst precursor ( (Mainly) is preferably used.

Examples of the weak coordination anion include tetrakis (pentafluorophenyl) borate ion (FABA ⁻ ), hexafluoroantimonate ion (SbF ₆ ⁻ ), and the like.

  Examples of the promoter (photoacid generator or photobase generator) include tetrakis (pentafluorophenyl) borate and hexafluoroantimonate represented by the following chemical formula 18 as well as tetrakis (pentafluorophenyl). Examples include gallates, aluminates, antimonates, other borates, gallates, carboranes, halocarboranes, and the like.

An example of such a cocatalyst commercially available is “RHODORSIL (registered trademark, the same applies hereinafter) available from Rhodia USA, Cranberry, NJ.
“PHOTOINITIATOR 2074 (CAS No. 178233-72-2)”, “TAG-372R ((dimethyl (2- (2-naphthyl) -2-oxoethyl) sulfo) available from Toyo Ink Manufacturing Co., Ltd., Tokyo, Japan” Nitrotetrakis (pentafluorophenyl) borate: CAS number 193957-54-9)), “MPI-103 (CAS number 87709-41-9)” available from Midori Chemical Co., Tokyo, Japan, “TAG-371 (CAS No. 193957-53-8)” available from Toyo Ink Manufacturing Co., Ltd., Tokyo, Japan, “TTBPS-TPFPB” (Tris (available from Toyo Gosei Kogyo Co., Ltd., Tokyo, Japan) 4-tert-butylphenyl) sulfonium tetrakis (pentapentafluoro) Rophenyl) borate) ”,“ NAI-105 (CAS No. 85342-62-7) ”available from Midori Chemical Industries, Tokyo, Japan, and the like.

  When RHODORSIL PHOTOINITIATOR 2074 is used as the cocatalyst (first substance), ultraviolet rays (UV light) are preferably used as actinic radiation (chemical rays) described later, and mercury lamps ( A high-pressure mercury lamp) is preferably used. Thereby, ultraviolet rays (active radiation) having sufficient energy of less than 300 nm can be supplied to the layer 910, and RHODOLSIL PHOTOINITIATOR 2074 can be efficiently decomposed to generate the above-described cation and WCA.

  Moreover, you may make it add a sensitizer in the core layer forming material (varnish) 900 as needed.

  The sensitizer increases the sensitivity of the cocatalyst to actinic radiation, reduces the time and energy required for the activation (reaction or decomposition) of the cocatalyst, and the wavelength of the actinic radiation to a wavelength suitable for the activation of the cocatalyst It has a function of changing the wavelength.

  Such a sensitizer is appropriately selected depending on the sensitivity of the promoter and the peak wavelength of absorption of the sensitizer, and is not particularly limited. For example, 9,10-dibutoxyanthracene (CAS No. 76275) is selected. 14-4) anthracenes, xanthones, anthraquinones, phenanthrenes, chrysenes, benzpyrenes, fluoranthenes, rubrenes, pyrenes, indanthrines, thioxanthen-9-ones (Thioxanthen-9-ones) and the like, and these are used alone or as a mixture.

  Specific examples of the sensitizer include 2-isopropyl-9H-thioxanthen-9-one, 4-isopropyl-9H-thioxanthen-9-one, 1-chloro-4-propoxythioxanthone, phenothiazine, and these Of the mixture.

  9,10-dibutoxyanthracene (DBA) can be obtained from Kawasaki Kasei Kogyo Co., Ltd., Kanagawa, Japan.

  The content of the sensitizer in the core layer forming material 900 is not particularly limited, but is preferably 0.01% by weight or more, more preferably 0.5% by weight or more, and 1% by weight or more. More preferably. In addition, it is preferable that an upper limit is 5 weight% or less.

  Furthermore, an antioxidant can be added to the core layer forming material 900. Thereby, generation | occurrence | production of an undesired free radical and the natural oxidation of the polymer 915 can be prevented. As a result, it is possible to improve the characteristics of the obtained core layer 93 (optical waveguide layer 90).

  Examples of the antioxidant include Ciba (registered trademark, the same applies hereinafter) IRGANOX (registered trademark, the same applies hereinafter) 1076 and Ciba IRGAFOS (registered trademark, available) from Ciba Specialty Chemicals of Tarrytown, New York. The same applies hereinafter.) 168 is preferably used.

  Other antioxidants include, for example, Ciba Irganox (registered trademark, hereinafter the same) 129, Ciba Irganox 1330, Ciba Irganox 1010, Ciba Cyanox (registered trademark, the same applies below) 1790, Ciba Irg. (Registered trademark) 3114, Ciba Irganox 3125, etc. can also be used.

  Note that such an antioxidant can be omitted, for example, when the layer 910 is not exposed to oxidation conditions or when the exposure period is extremely short.

  Examples of the solvent used for preparing the core layer forming material (varnish) 900 include diethyl ether, diisopropyl ether, 1,2-dimethoxyethane (DME), 1,4-dioxane, tetrahydrofuran (THF), tetrahydropyran (THP). ), Ether solvents such as anisole, diethylene glycol dimethyl ether (diglyme), diethylene glycol ethyl ether (carbitol), cellosolv solvents such as methyl cellosolve, ethyl cellosolve, phenyl cellosolve, aliphatic hydrocarbons such as hexane, pentane, heptane, cyclohexane Solvent, aromatic hydrocarbon solvent such as toluene, xylene, benzene, mesitylene, aromatic heterocyclic compound solvent such as pyridine, pyrazine, furan, pyrrole, thiophene, methylpyrrolidone, Amide solvents such as N, N-dimethylformamide (DMF) and N, N-dimethylacetamide (DMA), halogen compound solvents such as dichloromethane, chloroform and 1,2-dichloroethane, ethyl acetate, methyl acetate, ethyl formate, etc. Examples thereof include various organic solvents such as ester solvents, sulfur compound solvents such as dimethyl sulfoxide (DMSO) and sulfolane, and mixed solvents containing these.

  As a method for removing (desolving) the solvent from the liquid film formed on the support substrate 951, for example, natural drying, heating, leaving under reduced pressure, or blowing of an inert gas (blow) or the like is performed. Examples include forced drying.

  As described above, the layer 910 that is a film-like solidified product (or cured product) of the core layer forming material 900 is formed on the support substrate 951.

  At this time, the layer (dry film of PITDM) 910 has a first refractive index (RI). This first refractive index is due to the action of the polymer 915 and monomers that are uniformly dispersed (distributed) in the layer 910.

  [2A] Next, a mask (masking) 935 in which an opening (window) 9351 is formed is prepared, and the layer 910 is irradiated with active radiation (active energy light) 930 through the mask 935 (FIG. 4). reference).

  Hereinafter, a case where a monomer having a refractive index lower than that of the polymer 915 is used as a monomer, and a catalyst precursor whose activation temperature decreases with irradiation of the active radiation 930 will be described as an example.

  That is, in the example shown here, the irradiation region 925 of the active radiation 930 becomes the clad portion 95.

  Therefore, in the example shown here, an opening (window) 9351 equivalent to the pattern of the clad portion 95 to be formed is formed in the mask 935. This opening 9351 forms a transmission part through which the active radiation 930 to be irradiated passes.

  In the optical circuit board, staggered structure end portions patterned so that a plurality of core portions of the optical waveguide formed in multiple stripes are curved toward an end portion opposite to the side where the receptor structure portion is provided. In the case of forming what is included, a pattern having such a shape may be used.

  The mask 935 may be formed in advance (separately formed) (for example, plate-shaped) or may be formed on the layer 910 by, for example, a vapor deposition method or a coating method.

  Preferred examples of the mask 935 include a photomask made of quartz glass or a PET base material, a stencil mask, a metal thin film formed by a vapor deposition method (evaporation, sputtering, etc.), etc. Among these, it is particularly preferable to use a photomask or a stencil mask. This is because a fine pattern can be formed with high accuracy, and handling is easy, which is advantageous in improving productivity.

  In FIG. 4, an opening (window) 9351 equivalent to the pattern of the clad portion 95 to be formed is obtained by partially removing the mask along the pattern of the non-irradiated region 940 of the active radiation 930. In the case of using a photomask made of quartz glass, PET base material, or the like, it is also possible to use a photomask provided with a shielding portion of active radiation 930 made of a shielding material made of metal such as chromium. it can. In this mask, the part other than the shielding part is the window (transmission part).

  The actinic radiation 930 to be used is not particularly limited as long as it can cause a photochemical reaction (change) to the promoter. For example, in addition to visible light, ultraviolet light, infrared light, and laser light, an electron beam or X Lines or the like can also be used.

  Among these, the actinic radiation 930 is appropriately selected depending on the type of co-catalyst and the type of sensitizer when it contains a sensitizer, and is not particularly limited, but has a peak wavelength in the range of 200 to 450 nm. It is preferable to have it. Thereby, a cocatalyst can be activated comparatively easily.

The irradiation dose of the actinic radiation 930 is preferably in the range of about 0.1~9J / cm ^2, more preferably about ^{0.2~6J / cm 2, 0.2~3J / cm} 2 of about More preferably. Thereby, a promoter can be activated reliably.

  When the layer 910 is irradiated with the active radiation 930 through the mask 935, the cocatalyst (first substance: cocatalyst) present in the irradiation region 925 irradiated with the active radiation 930 reacts by the action of the active radiation 930. (Binding) or decomposition to release (generate) cations (protons or other cations) and weakly coordinating anions (WCA).

  These cations and weakly coordinating anions cause a change (decomposition) in the molecular structure of the catalyst precursor (second substance: procatalyst) present in the irradiation region 925, and this changes the active latent state (latent potential). Active state).

  Here, the catalyst precursor in the active latent state (or the latent active state) has an activation temperature lower than the original activation temperature, but there is no temperature increase, that is, at about room temperature, the irradiation region. It refers to a catalyst precursor that is in a state where a monomer reaction cannot occur within 925.

  Therefore, even after irradiation with the active radiation 930, if the layer 910 is stored at, for example, about −40 ° C., the state can be maintained without causing a monomer reaction. For this reason, the core layer 93 can be obtained by preparing a plurality of layers 910 after irradiation with the active radiation 930 and subjecting them to heat treatment at once, which is highly convenient.

  Note that in the case where light having high directivity such as laser light is used as the active radiation 930, the use of the mask 935 may be omitted.

[3A] Next, the layer 910 is subjected to heat treatment (first heat treatment).
Thereby, in the irradiation region 925, the catalyst precursor in the active latent state is activated (becomes active), and monomer reaction (polymerization reaction or cross-linking reaction) occurs.

  As the monomer reaction proceeds, the monomer concentration in the irradiation region 925 gradually decreases. As a result, a difference in monomer concentration occurs between the irradiated region 925 and the unirradiated region 940, and in order to eliminate this, the monomer diffuses from the unirradiated region 940 (monomer diffusion) and collects in the irradiated region 925. come.

  As a result, in the irradiated region 925, the monomer and its reaction product (polymer, cross-linked structure or branched structure) increase, and the structure derived from the monomer greatly affects the refractive index of the region, so that the first refraction The second refractive index lower than the refractive index. As the monomer polymer, an addition (co) polymer is mainly produced.

  On the other hand, in the unirradiated region 940, the amount of monomer decreases due to the diffusion of the monomer from the region to the irradiated region 925, so that the influence of the polymer 915 greatly appears on the refractive index of the region, and the first refraction The third refractive index is higher than the refractive index.

  In this way, a refractive index difference (second refractive index <third refractive index) occurs between the irradiated region 925 and the non-irradiated region 940, and the core portion 94 (non-irradiated region 940) and the cladding portion 95. (Irradiation region 925) is formed (see FIG. 5).

  Although the heating temperature in this heat processing is not specifically limited, It is preferable that it is about 30-80 degreeC, and it is more preferable that it is about 40-60 degreeC.

  The heating time is preferably set so that the reaction of the monomer in the irradiation region 925 is almost completed. Specifically, the heating time is preferably about 0.1 to 2 hours, and 0.1 to 1 hour. More preferred is the degree.

[4A] Next, the layer 910 is subjected to a second heat treatment.
As a result, the catalyst precursor remaining in the unirradiated region 940 and / or the irradiated region 925 is activated (activated) directly or with activation of the cocatalyst, thereby causing the regions 925 and 940 to be activated. The remaining monomer is reacted.

  In this way, by reacting the monomers remaining in the regions 925 and 940, the core portion 94 and the clad portion 95 obtained can be stabilized.

  The heating temperature in the second heat treatment is not particularly limited as long as it can activate the catalyst precursor or the cocatalyst, but is preferably about 70 to 100 ° C, and is about 80 to 90 ° C. Is more preferable.

  The heating time is preferably about 0.5 to 2 hours, more preferably about 0.5 to 1 hour.

[5A] Next, the layer 910 is subjected to a third heat treatment.
Thereby, the internal stress generated in the obtained core layer 93 can be reduced, and the core portion 94 and the cladding portion 95 can be further stabilized.

  The heating temperature in the third heat treatment is preferably set to 20 ° C. or more higher than the heating temperature in the second heat treatment, specifically, preferably about 90 to 180 ° C., 120 to 160 ° C. More preferred is the degree.

The heating time is preferably about 0.5 to 2 hours, more preferably about 0.5 to 1 hour.
The core layer 93 is obtained through the above steps.

  For example, when a sufficient refractive index difference is obtained between the core portion 94 and the clad portion 95 in a state before the second heat treatment or the third heat treatment is performed, this step is performed. [5A] and the step [4A] may be omitted.

  [6A] Next, the cladding layer 91 (92) is formed on the support substrate 952 (see FIG. 6).

  As a method for forming the clad layer 91 (92), a method in which a varnish containing a clad material (clad layer forming material) is applied and cured (solidified), and a method in which a curable monomer composition is applied and cured (solidified). Any method may be used.

When the clad layer 91 (92) is formed by a coating method, examples thereof include a spin coating method, a dipping method, a table coating method, a spray method, an applicator method, a curtain coating method, and a die coating method.
As the support substrate 952, a substrate similar to the support substrate 951 can be used.

  As a constituent material of the clad layer 91 (92), a material mainly composed of a norbornene polymer is used. Since the norbornene-based polymer is excellent in heat resistance, in the optical waveguide layer 90 using this as a constituent material of the clad layer 91 (92), when forming the conductor layers 901 and 902 in the optical waveguide layer 90, the conductor layer 901, When the wiring is formed by processing 902, the cladding layer 91 (92) can be prevented from being softened and deformed even when heated to mount an optical element or the like.

  Moreover, since it has high hydrophobicity, it is possible to obtain the clad layer 91 (92) that is less likely to undergo dimensional changes due to water absorption.

  Norbornene-based polymers or norbornene-based monomers that are raw materials thereof are also preferable because they are relatively inexpensive and easily available.

  Further, when a material mainly composed of norbornene-based polymer is used as the material of the clad layer 91 (92), the material is preferably the same as the material suitably used as the constituent material of the core layer 93. Further, it becomes higher, and delamination between the clad layer 91 (92) and the core layer 93 can be prevented. For this reason, the optical waveguide layer 90 having excellent durability can be obtained.

  Examples of such norbornene-based polymers include (1) addition (co) polymers of norbornene monomers obtained by addition (co) polymerization of norbornene monomers, and (2) norbornene monomers and ethylene or α-olefins. (3) addition polymers such as addition copolymers with norbornene-type monomers and non-conjugated dienes, and other monomers as required, (4) ring opening of norbornene-type monomers ( A (co) polymer, and a resin obtained by hydrogenating the (co) polymer if necessary, (5) a ring-opening copolymer of a norbornene-type monomer and ethylene or α-olefins, and ( (Co) polymer hydrogenated resin, (6) ring-opening copolymer of norbornene type monomer and non-conjugated diene or other monomer, and (co) polymerization if necessary And a ring-opening polymer such as a polymer obtained by hydrogenating the body. Examples of these polymers include random copolymers, block copolymers, and alternating copolymers.

  These norbornene-based polymers include, for example, ring-opening metathesis polymerization (ROMP), combination of ROMP and hydrogenation reaction, polymerization by radical or cation, polymerization using a cationic palladium polymerization initiator, and other polymerization initiators ( For example, it can be obtained by any known polymerization method such as polymerization using a polymerization initiator of nickel or another transition metal).

  Among these, as the norbornene-based polymer, an addition (co) polymer is preferable. This is preferable because it is rich in transparency, heat resistance and flexibility.

  The norbornene-based polymer preferably includes a norbornene repeating unit having a substituent containing a polymerizable group. Thereby, in the clad layer 91 (92), the polymerizable groups of at least a part of the norbornene-based polymer can be crosslinked directly or via a crosslinking agent. Depending on the type of polymerizable group, the type of crosslinking agent, the type of polymer used for the core layer 93, the norbornene-based polymer and the polymer used for the core layer 93 can be cross-linked. In other words, it is preferable that at least a part of the norbornene-based polymer is crosslinked at the polymerizable group.

  As a result, the strength of the clad layer 91 (92) itself can be improved, and the adhesion between the clad layer 91 (92) and the core layer 93 can be improved.

  Examples of such a polymerizable group include one or a combination of two or more of an epoxy group, a (meth) acryl group, an alkoxysilyl group, and the like, and an epoxy group is particularly preferable. Epoxy groups are preferred because of their high reactivity among various polymerizable groups.

  Further, the norbornene-based polymer preferably contains an alkylnorbornene repeating unit. The alkyl group may be linear or branched. Since a norbornene-based polymer containing a repeating unit of alkylnorbornene has high flexibility, high flexibility (flexibility) can be imparted to the optical waveguide layer 90 by using such norbornene-based polymer.

  A norbornene-based polymer containing an alkylnorbornene repeating unit is also preferable because of its excellent transmittance for light in the wavelength region as described above (particularly in the wavelength region near 850 nm).

  Therefore, as the norbornene-based polymer used for the clad layer 91 (92), those represented by the following chemical formula 19 are suitable.

[Wherein R represents an alkyl group having 1 to 10 carbon atoms, a represents an integer of 0 to 3, b represents an integer of 1 to 3, and p / q is 20 or less. ]

  Such a norbornene-based polymer has a relatively low refractive index in addition to the above-described characteristics. By forming the clad layer 91 (92) using the norbornene-based polymer as a main material, optical transmission of the optical waveguide layer 90 is achieved. The performance can be further improved.

  Among the norbornene-based polymers represented by Chemical formula 19, compounds in which R is an alkyl group having 4 to 10 carbon atoms and a and b are each 1, for example, butylbornene and methylglycidyl ether norbornene A copolymer, a copolymer of hexyl norbornene and methyl glycidyl ether norbornene, a copolymer of decyl norbornene and methyl glycidyl ether norbornene, and the like are preferable.

  Moreover, although p / q should just be 20 or less, it is preferable that it is 15 or less, and about 0.1-10 is more preferable. Thereby, the effect including the repeating unit of 2 types of norbornene is exhibited.

  In order to directly crosslink epoxy groups in a norbornene-based polymer containing a norbornene-based repeating unit having a substituent containing an epoxy group, the same kind of substance as the above-mentioned promoter (light) is used in the cladding layer forming material. An acid generator or a photobase generator) may be mixed, and the epoxy group may be cleaved and crosslinked by the action of this substance.

  In addition, in order to crosslink epoxy groups via a crosslinking agent, a compound having at least one epoxy group as a crosslinking agent may be further mixed in the cladding layer forming material.

  As such a crosslinking agent, for example, 3-glycidoxypropyltrimethoxysilane (γ-GPS), silicone epoxy resin, and the like are preferably used.

  This cross-linking reaction between epoxy groups may be performed at the final stage of this step [6A], or may be performed after obtaining the optical waveguide layer 90 in the next step [7A].

  Further, various additives may be added (mixed) to the cladding layer forming material.

  For example, the monomer, catalyst precursor, and co-catalyst mentioned in the core layer forming material may be mixed in the cladding layer forming material as additives. Thereby, in the clad layer 91 (92), the refractive index of the clad layer 91 (92) can be changed by reacting the monomer in the same manner as described above.

  In this case, since it is not required to provide a difference in refractive index in the clad layer 91 (92), it is possible to omit the promoter and use a catalyst precursor that is easily activated by heating.

Examples of such catalyst precursors include [Pd (PCy ₃ ) ₂ (O ₂ CCH ₃ ) (NCCH ₃ )] tetrakis (pentafluorophenyl) borate, [2-methylly Pd (PCy3) 2] tetrakis (pentafluorophenyl). ) Borate, [Pd (PCy3) 2H (NCCH3)] tetrakis (pentafluorophenyl) borate, [Pd (P (iPr) 3) 2 (OCOCH3) (NCCH3)] tetrakis (pentafluorophenyl) borate, and the like.

Examples of other additives include the antioxidants described above. By mixing the antioxidant, it is possible to prevent deterioration of the clad material (norbornene polymer) due to oxidation.
As described above, the clad layer 91 (92) is formed on the support substrate 952.

  [7A] Next, the core layer 93 is peeled from the support substrate 951, and the core layer 93 is sandwiched between the support substrate 952 on which the cladding layer 91 is formed and the support substrate 952 on which the cladding layer 92 is formed ( (See FIG. 7).

Then, as indicated by an arrow in FIG. 7, pressure is applied from the upper surface side of the support substrate 952 on which the cladding layer 92 is formed, and the cladding layers 91 and 92 and the core layer 93 are pressure bonded.
Thereby, the clad layers 91 and 92 and the core layer 93 are joined and integrated.

  Further, this crimping operation is preferably performed under heating. The heating temperature is appropriately determined depending on the constituent materials of the clad layers 91 and 92 and the core layer 93, and is usually preferably about 80 to 200 ° C, more preferably about 120 to 180 ° C.

  Next, the support substrate 952 is peeled off and removed from the cladding layers 91 and 92, respectively. Thereby, the optical waveguide layer 90 in the present invention is obtained.

  [8A] Next, when forming a conductor circuit, conductor layers 901 and 902 are formed on the upper and lower surfaces of the optical waveguide layer 90, respectively (see FIG. 8).

As a method for forming each of the conductor layers 901 and 902, for example, a chemical vapor deposition method (CVD method) such as a plasma CVD method, a thermal CVD method, or a laser CVD method, a vacuum deposition method, a sputtering method, or an ion is used. Among the bonding of conductive sheet materials by dry plating methods such as physical vapor deposition methods (PVD methods) such as plating methods, wet plating methods such as electrolytic plating, immersion plating and electroless plating, and laminating methods At least one of the following can be used. Thereby, high adhesiveness between each of the conductor layers 901 and 902 and the optical waveguide layer 90 is obtained.
As described above, the optical waveguide structure 9 used in the present invention is completed. The conductor layer may be only on one side.

  In a preferable example of such an optical waveguide layer 90 and the optical waveguide structure 9, in the core layer 93, the core portion 94 is configured using the first norbornene-based material as a main material, and the cladding portion 95 is configured using the first norbornene-based material. A second norbornene material having a lower refractive index is used as a main material, and the cladding layers 91 and 92 each have a lower refractive index than the first norbornene material (core portion 94 of the core layer 93). It is composed mainly of polymer.

  The first norbornene-based material and the second norbornene-based material both contain the same norbornene-based polymer, but contain a reaction product of a norbornene-based monomer having a refractive index different from that of the norbornene-based polymer. Due to the different amounts, the refractive indices are different from each other.

  Since the norbornene-based polymer has high transparency, the optical waveguide layer 90 and the optical waveguide structure 9 having such a configuration can provide high optical transmission performance of the optical waveguide layer 90.

  Further, with such a configuration, not only high adhesion between the core portion 94 and the clad portion 95 but also high adhesion between the core layer 93, the clad layer 91, and the clad layer 92 can be obtained. Even when deformation such as bending occurs in the layer 90 and the optical waveguide structure 9, peeling between the core portion 94 and the clad portion 95 and peeling between the core layer 93 and the clad layers 91 and 92 hardly occur. It is also possible to prevent microcracks from occurring in the 94 and the clad portion 95. As a result, the optical transmission performance of the optical waveguide layer 90 is maintained.

  Further, since the norbornene-based polymer has high heat resistance and high hydrophobicity, the optical waveguide layer 90 (optical waveguide structure 9) having such a configuration has excellent durability.

  Further, since the optical waveguide layer 90 can be provided with high heat resistance and high hydrophobicity, the conductor layers 901 and 902 can be employed by adopting various methods as described above while preventing deterioration (deterioration) of the characteristics. Can be reliably formed. In particular, even when the conductor layers 901 and 902 are formed so as to overlap with the core portion 94 important for light transmission, the core portion 94 can be prevented from being deteriorated or deteriorated.

  Further, according to the manufacturing method as described above, the optical waveguide layer 90 and the optical waveguide structure 9 having the core portion 94 having a desired shape and high dimensional accuracy with a simple process and in a short time. Can be obtained.

<Second production method>
Next, a second manufacturing method of the optical waveguide layer 90 and the optical waveguide structure 9 will be described.

  Hereinafter, the second manufacturing method will be described, but the description will focus on differences from the first manufacturing method, and description of similar matters will be omitted.

  In the second manufacturing method, the composition of the core layer forming material 900 is different, and the rest is the same as the first manufacturing method.

That is, the core layer forming material 900 used in the second production method is a release agent (substance) that is activated by irradiation with actinic radiation and the action of the release agent activated by branching from the main chain and the main chain. Thus, at least a part of the molecular structure contains a polymer 915 having a leaving group (leaving pendant group) that can leave from the main chain.
As the releasing agent, the same promoter as that mentioned in the first production method can be used.

  Examples of the polymer 915 used in the second production method include those obtained by substituting the substituents of the polymer 915 exemplified in the first production method with a leaving group, and polymers 915 exemplified in the first production method. The thing which introduce | transduced the leaving group is mentioned.

  The refractive index of the polymer 915 changes (increases or decreases) due to the leaving (cleavage) of the leaving group.

  The leaving group may be any of those leaving by the action of a cation, anion or free radical, that is, any of an acid (cation) leaving group, a base (anion) leaving group, and a free radical leaving group. Although it is good, it is preferably a group capable of leaving by the action of a cation (proton) (acid group leaving group).

  As the acid leaving group, those having at least one of an —O— structure, an —Si—aryl structure and an —O—Si— structure in its molecular structure are preferable. Such an acid leaving group is released relatively easily by the action of a cation.

  Among these, as the acid leaving group that causes a decrease in the refractive index of the polymer 915 by leaving, at least one of a -Si-diphenyl structure and a -O-Si-diphenyl structure is preferable.

  In addition, as a free radical leaving group which leaves | separates by the effect | action of a free radical, the substituent etc. which have an acetophenone structure at the terminal are mentioned, for example.

  The polymer 915 is preferably a norbornene polymer for the same reason as described in the first production method, and more preferably a norbornene polymer containing a repeating unit of alkyl (particularly hexyl) norbornene. preferable.

  In consideration of the above, as the polymer 915 whose refractive index decreases due to the leaving group leaving, a homopolymer of diphenylmethylnorbornenemethoxysilane or a copolymer of hexylnorbornene and diphenylmethylnorbornenemethoxysilane is preferably used. .

  Hereinafter, as an example, a case where the polymer 915 has a refractive index that decreases due to the removal of a leaving group (particularly, an acid leaving group) will be described.

  That is, in the example shown here, the irradiation region 925 of the active radiation 930 becomes the clad portion 95.

[1B] A step similar to the step [1A] is performed.
At this time, the layer (dry film of PITDM) 910 has a first refractive index (RI). This first refractive index is due to the action of the polymer 915 that is uniformly dispersed (distributed) in the layer 910.

[2B] A step similar to the step [2A] is performed.
When the layer 910 is irradiated with the actinic radiation 930 through the mask 935, the release agent present in the irradiation region 925 irradiated with the actinic radiation 930 reacts (bonds) or decomposes by the action of the actinic radiation 930, and becomes a cation. Liberate (generate) protons (or other cations) and weakly coordinating anions (WCA).

  Then, the cation causes the leaving group itself to leave the main chain, or cleaves from the middle of the molecular structure of the leaving group (photo bleach).

  As a result, in the irradiated region 925, the number of leaving groups in a complete state is decreased as compared with the unirradiated region 940, and the second refractive index is lower than the first refractive index. At this time, the refractive index of the unirradiated region 940 is maintained at the first refractive index.

  In this way, a refractive index difference (second refractive index <first refractive index) occurs between the irradiated region 925 and the non-irradiated region 940, and the core portion 94 (non-irradiated region 940) and the cladding portion 95. (Irradiation region 925) is formed.

In this case, the irradiation dose of the actinic radiation 930 is preferably in the range of about 0.1~9J / cm ^2, more preferably about 0.3~6J / cm ^2, 0.6~6J / More preferably, it is about cm ² . Thereby, a release agent can be activated reliably.

[3B] Next, the layer 910 is subjected to heat treatment.
As a result, the leaving group detached (cut) from the polymer 915 is removed from the irradiated region 925 or rearranged or cross-linked in the polymer 915.

  Further, at this time, it is considered that a part of the leaving group remaining in the cladding part 95 (irradiation region 925) is further detached (cut).

  Therefore, the refractive index difference between the core portion 94 and the cladding portion 95 can be further increased by performing such heat treatment.

  The heating temperature in this heat treatment is not particularly limited, but is preferably about 70 to 195 ° C, and more preferably about 85 to 150 ° C.

  Further, the heating time is set so as to sufficiently remove the leaving group detached (cut) from the irradiation region 925, and is not particularly limited, but is preferably about 0.5 to 3 hours, More preferably, it is about 2 hours.

  For example, when a sufficient refractive index difference is obtained between the core portion 94 and the cladding portion 95 in a state before the heat treatment, this step [3B] may be omitted. .

Moreover, the process of 1 time or several times of heat processing (for example, about 150-200 degreeC x about 1 to 8 hours) can also be added as needed.
The core layer 93 is obtained through the above steps.

[4B] A step similar to the step [6A] is performed.
[5B] A step similar to the step [7A] is performed.
[6B] A step similar to the step [8A] is performed. (When forming a conductor layer.)
As described above, the optical waveguide layer 90 and the optical waveguide structure 9 used in the present invention are completed.

  In a preferable example of such an optical waveguide layer 90 and the optical waveguide structure 9, the core layer 93 is composed of a norbornene-based material as a main material, and the cladding layers 91 and 92 are refracted from the core portion 94 of the core layer 93, respectively. The main material is a norbornene-based polymer having a low rate.

  The core portion 94 and the clad portion 95 are mainly composed of a norbornene-based polymer having a main chain and a main chain branched from the main chain and having a leaving group capable of leaving at least a part of the molecular structure from the main chain. The core part 94 and the clad part 95 have different refractive indexes due to the difference in the number of leaving groups bonded to the main chain.

  Since the norbornene-based polymer has high transparency, the optical waveguide layer 90 and the optical waveguide structure 9 having such a configuration can provide high optical transmission performance of the optical waveguide layer 90.

  Further, with such a configuration, not only high adhesion between the core portion 94 and the clad portion 95 but also high adhesion between the core layer 93, the clad layer 91, and the clad layer 92 can be obtained. Even when deformation such as bending occurs in the layer 90 and the optical waveguide structure 9, peeling between the core portion 94 and the clad portion 95 and peeling between the core layer 93 and the clad layers 91 and 92 hardly occur. It is also possible to prevent microcracks from occurring in the 94 and the clad portion 95. As a result, the optical transmission performance of the optical waveguide layer 90 is maintained.

  Further, since the norbornene-based polymer has high heat resistance and high hydrophobicity, the optical waveguide layer 90 (optical waveguide structure 9) having such a configuration has excellent durability.

  Further, since the optical waveguide layer 90 can be provided with high heat resistance and high hydrophobicity, the conductor layers 901 and 902 can be employed by adopting various methods as described above while preventing deterioration (deterioration) of the characteristics. Can be reliably formed. In particular, even when the conductor layers 901 and 902 are formed so as to overlap with the core portion 94 important for light transmission, the core portion 94 can be prevented from being deteriorated or deteriorated.

  Further, according to the manufacturing method as described above, the optical waveguide layer 90 and the optical waveguide structure 9 having the core portion 94 having a desired shape and high dimensional accuracy with a simple process and in a short time. Can be obtained.

  In particular, according to the second manufacturing method, at least actinic radiation may be used, and the core layer 93 can be formed by an extremely simple process.

<Third production method>
Next, a third manufacturing method of the optical waveguide layer 90 and the optical waveguide structure 9 will be described.

  Hereinafter, the third manufacturing method will be described, but the description will focus on differences from the first and second manufacturing methods, and the description of the same matters will be omitted.

  In the third manufacturing method, a combination of the core layer forming materials used in the first and second manufacturing methods is used as the core layer forming material 900. Otherwise, the first or second manufacturing method is used. It is the same as the method.

  That is, the core layer forming material 900 used in the third manufacturing method includes a polymer 915 having a leaving group as described above, a monomer, a promoter (first substance), and a catalyst precursor (second Substance). The cocatalyst is the same as the release agent in the second production method, and has a function of releasing the release agent.

  In such a core layer forming material 900, the refractive index difference between the core portion 94 and the clad portion 95 is more increased in the obtained core layer 93 due to the combination of the selected leaving group and the selected monomer. It becomes possible to adjust in stages.

  As described above, a monomer having a refractive index lower than that of the polymer 915 is used as a monomer, and a catalyst precursor whose activation temperature is reduced with irradiation of the active radiation 930 is used as a polymer 915. If a material whose refractive index is lowered by the removal of the leaving group is used, the irradiation region 925 can be used as the cladding portion 95, and the core layer 93 having a very large refractive index difference from the core portion 94 can be obtained.

  Hereinafter, a case where such a combination of the polymer 915, the monomer, and the catalyst precursor is used will be described as an example.

  That is, in the example shown here, the irradiation region 925 of the active radiation 930 becomes the clad portion 95.

[1C] A step similar to the step [1A] is performed.
At this time, the layer (dry film of PITDM) 910 has a first refractive index (RI). This first refractive index is due to the action of the polymer 915 and monomers that are uniformly dispersed (distributed) in the layer 910.

[2C] A step similar to the step [2A] is performed.
When the layer 910 is irradiated with the active radiation 930 through the mask 935, the cocatalyst (first substance: cocatalyst) present in the irradiation region 925 irradiated with the active radiation 930 reacts by the action of the active radiation 930. Alternatively, it decomposes to liberate (generate) cations (protons or other cations) and weakly coordinating anions (WCA).

  These cations and weakly coordinating anions cause a change (decomposition) in the molecular structure of the catalyst precursor (second substance: procatalyst) present in the irradiation region 925, and this changes the active latent state (latent potential). Active state).

  In addition, the cation causes the leaving group itself to leave the main chain, or cleaves from the middle of the molecular structure of the leaving group.

  As a result, in the irradiated region 925, the number of leaving groups in a complete state is reduced as compared with the unirradiated region 940, and the refractive index is lowered to be lower than the first refractive index. At this time, the refractive index of the unirradiated region 940 is maintained at the first refractive index.

In this case, the irradiation dose of the actinic radiation 930 is preferably in the range of about 0.1~9J / cm ^2, more preferably about 0.2~5J / cm ^2, 0.2~4J / More preferably, it is about cm ² . Thereby, a promoter can be activated reliably.

[3C] The same step as the above step [3A] is performed.
Thereby, in the irradiation region 925, the catalyst precursor in the active latent state is activated (becomes active), and monomer reaction (polymerization reaction or cross-linking reaction) occurs.

  As the monomer reaction proceeds, the monomer concentration in the irradiation region 925 gradually decreases. As a result, there is a difference in monomer concentration between the irradiated region 925 and the unirradiated region 940, and the monomer diffuses from the unirradiated region 940 and collects in the irradiated region 925 in order to eliminate this.

  In addition, by this heat treatment, the leaving group detached (cut) from the polymer 915 is removed from, for example, the irradiation region 925, or rearranged or crosslinked in the polymer 915.

  As a result, in the irradiated region 925, the monomer and its reactant (polymer, cross-linked structure and branched structure) increase, and the structure derived from the monomer greatly affects the refractive index of the region. The refractive index is further lowered to the second refractive index due to a decrease in the leaving (cleaved) leaving group.

  On the other hand, in the unirradiated region 940, the amount of monomer decreases due to the diffusion of the monomer from the region to the irradiated region 925, so that the influence of the polymer 915 greatly appears on the refractive index of the region, and the first refraction The third refractive index is higher than the refractive index.

  In this way, a refractive index difference (second refractive index <third refractive index) occurs between the irradiated region 925 and the non-irradiated region 940, and the core portion 94 (non-irradiated region 940) and the cladding portion 95. (Irradiation region 925) is formed.

[4C] A step similar to the step [4A] is performed.
[5C] A step similar to the step [5A] is performed.
[6C] The same step as the above step [6A] is performed.
[7C] The same step as the above step [7A] is performed.
[8C] The same step as the above step [8A] is performed. (When forming a conductor layer.)
As described above, the optical waveguide layer 90 and the optical waveguide structure 9 used in the present invention are completed.

  In a preferable example of the optical waveguide layer 90 and the optical waveguide structure 9, the core layer 93 includes a main chain and a leaving group that is branched from the main chain, and at least a part of the molecular structure can be separated from the main chain. A norbornene-based polymer having a refractive index different from that of the norbornene-based polymer, and the core portion 94 and the clad portion 95 have different numbers of leaving groups bonded to the main chain. Due to the different contents of the reactants of the monomers, the refractive indexes thereof are different, and the clad layers 91 and 92 are mainly composed of norbornene polymers having a lower refractive index than the core portion 94 of the core layer 93. Configured as

  Since the norbornene-based polymer has high transparency, the optical waveguide layer 90 and the optical waveguide structure 9 having such a configuration can provide high optical transmission performance of the optical waveguide layer 90.

  Further, with such a configuration, not only high adhesion between the core portion 94 and the clad portion 95 but also high adhesion between the core layer 93, the clad layer 91, and the clad layer 92 can be obtained. Even when deformation such as bending occurs in the layer 90 and the optical waveguide structure 9, peeling between the core portion 94 and the clad portion 95 and peeling between the core layer 93 and the clad layers 91 and 92 hardly occur. It is also possible to prevent microcracks from occurring in the 94 and the clad portion 95. As a result, the optical transmission performance of the optical waveguide layer 90 is maintained.

  Further, since the norbornene-based polymer has high heat resistance and high hydrophobicity, the optical waveguide layer 90 (optical waveguide structure 9) having such a configuration has excellent durability.

  Further, since the optical waveguide layer 90 can be provided with high heat resistance and high hydrophobicity, the conductor layers 901 and 902 can be employed by adopting various methods as described above while preventing deterioration (deterioration) of the characteristics. Can be reliably formed. In particular, even when the conductor layers 901 and 902 are formed so as to overlap with the core portion 94 important for light transmission, the core portion 94 can be prevented from being deteriorated or deteriorated.

  Further, according to the manufacturing method as described above, the optical waveguide layer 90 and the optical waveguide structure 9 having the core portion 94 having a desired shape and high dimensional accuracy with a simple process and in a short time. Can be obtained.

  In particular, according to the third manufacturing method, the refractive index difference between the core portion 94 and the cladding portion 95 can be set in multiple stages.

<Fourth manufacturing method>
Next, a fourth method for manufacturing the optical waveguide layer 90 and the optical waveguide structure 9 will be described.

  9 to 14 are cross-sectional views schematically showing a process example of the fourth manufacturing method of the optical waveguide layer 90 and the optical waveguide structure used in the present invention.

  Hereinafter, although the 4th manufacturing method is explained, it explains centering on difference with the 1st-3rd manufacturing methods, and omits the explanation about the same matter.

  In the fourth manufacturing method, the formation process of the optical waveguide layer 90 is different, and the other processes are the same as those in the first to third manufacturing methods.

  That is, as the core layer forming material 900 and the clad layer forming material, the same materials as described in the first to third manufacturing methods can be used.

  In the following description, the case where the materials described in the first manufacturing method are used as the core layer forming material will be described as a representative.

[1D] First, a clad layer forming material (first varnish) is applied onto the support substrate 1000 using the same method as described above to form the first layer 1110 (see FIG. 9). .
As the support substrate 1000, a substrate similar to the support substrate 951 can be used.

  The average thickness of the first layer 1110 is not particularly limited, but is preferably about 5 to 200 μm, more preferably about 10 to 100 μm, and still more preferably about 15 to 65 μm.

  [2D] Next, a core layer forming material (second varnish) is applied onto the first layer 1110 using the same method as described above to form the second layer 1120 (FIG. 10).

  The core layer forming material may be applied after the first layer 1110 is almost completely dried, or may be applied before the first layer 1110 is dried.

  In the latter case, the first layer 1110 and the second layer 1120 are mixed with each other at the interface between them. In this case, in the obtained optical waveguide layer 90, the adhesion between the clad layer 91 and the core layer 93 can be improved.

  In this case, each of the first varnish and the second varnish is prepared so that the viscosity (normal temperature) is preferably about 100 to 10000 cP, more preferably about 150 to 5000 cP, and further preferably about 200 to 3500 cP. Thus, the first layer 1110 and the second layer 1120 can be prevented from being mixed more than necessary at the interface between them, and the thicknesses of the first layer 1110 and the second layer 1120 can be reduced. Nonuniformity can be prevented.

  The viscosity of the second varnish is preferably higher than that of the first varnish. Accordingly, it is possible to reliably prevent the first layer 1110 and the second layer 1120 from being mixed more than necessary at the interface between them.

  The average thickness of the second layer 1120 is not particularly limited, but is preferably about 5 to 200 μm, more preferably about 15 to 125 μm, and still more preferably about 25 to 100 μm.

[3D] Next, a clad layer forming material (third varnish) is applied onto the second layer 1120 using the same method as described above to form the third layer 1130 (FIG. 11).
The third layer 1130 can be formed in the same manner as the second layer 1120.

The average thickness of the third layer 1130 is not particularly limited, but is preferably about 5 to 200 μm, more preferably about 10 to 100 μm, and still more preferably about 15 to 65 μm.
Thereby, the laminated body 2000 is obtained.

[4D] Next, the solvent in the laminate 2000 is removed (desolvent).
Examples of the method for removing the solvent include methods such as heating, leaving under atmospheric pressure or reduced pressure, and spraying (blowing) an inert gas, etc., but a method using heating is preferred. Thereby, it is possible to remove the solvent relatively easily and in a short time.

  The heating temperature is preferably about 25 to 60 ° C, and more preferably about 30 to 45 ° C.

  The heating time is preferably about 15 to 60 minutes, and more preferably about 15 to 30 minutes.

  [5D] Next, a mask (masking) 935 in which an opening (window) 9351 is formed is prepared, and active radiation (active energy ray) 930 is irradiated to the stacked body 2000 through the mask 935 (FIG. 12).

  When the stacked body 2000 is irradiated with the active radiation 930 through the mask 935, the promoter (first substance: cocatalyst) present in the irradiation region 925 irradiated with the active radiation 930 of the second layer 1120 is: It reacts or decomposes by the action of actinic radiation 930 to liberate (generate) cations (protons or other cations) and weakly coordinating anions (WCA).

  These cations and weakly coordinating anions cause a change (decomposition) in the molecular structure of the catalyst precursor (second substance: procatalyst) present in the irradiation region 925, and this changes the active latent state (latent potential). Active state).

[6D] Next, heat treatment (first heat treatment) is performed on the stacked body 2000.
Thereby, in the irradiation region 925, the catalyst precursor in the active latent state is activated (becomes active), and monomer reaction (polymerization reaction or cross-linking reaction) occurs.

  As the monomer reaction proceeds, the monomer concentration in the irradiation region 925 gradually decreases. As a result, there is a difference in monomer concentration between the irradiated region 925 and the unirradiated region 940, and the monomer diffuses from the unirradiated region 940 and collects in the irradiated region 925 in order to eliminate this.

  As a result, in the irradiated region 925, the monomer and its reaction product (polymer, cross-linked structure or branched structure) increase, and the structure derived from the monomer greatly affects the refractive index of the region, so that the first refraction The second refractive index lower than the refractive index.

  On the other hand, in the unirradiated region 940, the amount of monomer decreases due to the diffusion of the monomer from the region to the irradiated region 925, so that the influence of the polymer 915 greatly appears on the refractive index of the region, and the first refraction The third refractive index is higher than the refractive index.

  In this way, a refractive index difference (second refractive index <third refractive index) occurs between the irradiated region 925 and the non-irradiated region 940, and the core portion 94 (non-irradiated region 940) and the cladding portion 95. (Irradiation region 925) is formed (see FIG. 13).

[7D] Next, the stacked body 2000 is subjected to a second heat treatment.
As a result, the catalyst precursor remaining in the unirradiated region 940 and / or the irradiated region 925 is activated (activated) directly or with activation of the cocatalyst, thereby causing the regions 925 and 940 to be activated. The remaining monomer is reacted.

  In this way, by reacting the monomers remaining in the regions 925 and 940, the core portion 94 and the clad portion 95 obtained can be stabilized.

[8D] Next, the stacked body 2000 is subjected to a third heat treatment.
Thereby, the internal stress generated in the obtained core layer 93 can be reduced, and the core portion 94 and the cladding portion 95 can be further stabilized.
Through the above steps, the optical waveguide layer 90 of the present invention is obtained.

  [9D] Next, when forming a conductor layer, conductor layers 901 and 902 are formed on the upper and lower surfaces of the optical waveguide layer 90, respectively (see FIG. 14). The conductor layer may be only on one side.

This can be performed in the same manner as in the step [8A].
As described above, the optical waveguide layer 90 and the optical waveguide structure 9 used in the present invention are completed.

  In such a method, the core portion 94 can be visually confirmed in the stacked body 2000 after the first heat treatment.

  Further, as the first varnish and the third varnish, the same composition as that of the second varnish, that is, one containing a polymer 915, a monomer, a promoter and a catalyst precursor may be used. Accordingly, the monomer reaction causes the interface between the first layer 1110 and the third layer 1130 and the second layer 1120, and / or beyond the interface, in the first layer 1110 and the third layer 1130. And the peeling between the clad layers 91 and 92 and the core layer 93 can be prevented more reliably.

  Further, in this case, for example, I: As the polymer 915 of the first layer 1110 and the third layer 1130, one having a refractive index (RI) relatively lower than the refractive index of the polymer 915 of the second layer 1120 is selected. II: The same monomer as the second layer 1120 is used as the monomer of the first layer 1110 and the third layer 1130, but the catalyst precursor in the first layer 1110 and the third layer 1130 and The monomer ratio may be adjusted to be lower than that of the second layer 1120.

  Accordingly, even when the active radiation 930 is irradiated, it is possible to prevent the formation of a region having a refractive index higher than that of the core portion 94 of the core layer 93 in the cladding layers 91 and 92.

  When a material containing a polymer 915 having a leaving group is used as the core layer forming material (second varnish), the cladding layer forming material (first varnish, third varnish) A polymer prepared using a polymer 915 having no releasing group is used, or a polymer 915 having a releasing group is used, but a polymer containing no releasing agent may be used.

  Thereby, in the first layer 1110 and the third layer 1130, it is possible to prevent the leaving group from leaving (decomposing) from the polymer 915.

  In the fourth production method, it is preferable to use the first varnish and the third varnish containing a norbornene-based polymer having a substituent containing an epoxy structure at the terminal and a promoter. Thereby, when forming the core part 94 and the clad part 95, an epoxy structure is cleaved and a reaction (polymerization) with the polymer 915 of the core layer 93 comes to occur. As a result, the adhesion of the cladding layers 91 and 92 to the core layer 93 can be improved.

  Examples of such norbornene-based polymers include copolymers of hexyl norbornene (HxNB) and norbornene methyl glycidyl ether (AGENB).

  In this case, a promoter that is not activated when the core layer 93 is formed may be selected. For example, a cocatalyst that does not absorb actinic radiation suitable for activating the cocatalyst contained in the second varnish or is activated by the action of heat in place of the actinic radiation may be selected.

  Examples of such a co-catalyst include a non-absorbing photobase generator (PBG) and a thermal base generator (TBG).

  The optical waveguide layer 90 and the optical waveguide structure 9 as described above can pattern the core portion 94 by a simple method of irradiation with actinic radiation, and design the pattern shape of the core portion (optical circuit) 94. The core portion 94 with a wide degree of freedom and high dimensional accuracy can be obtained.

  In addition, since the conductor layers 901 and 902 are formed in advance, wiring to the element (formation of an electric circuit) is easy, and wiring suitable for it is possible regardless of the type of element (terminal installation location). Therefore, the degree of freedom of the configuration of the wiring circuit (for example, the degree of freedom of selection of the terminal installation location) is wide and versatile.

  Since the optical waveguide structure 9 can form both the wiring (electric circuit) and the core portion (optical circuit) 94 with a high arrangement density, an efficient circuit design in a hybrid optical and electric circuit. As well as further circuit integration.

  Such an optical waveguide structure 9 has a wide range of optical circuit (optical waveguide pattern) and electrical circuit design, good yield, high optical transmission performance, excellent reliability and durability, and versatility. Therefore, it can be used for various electronic parts and electronic devices.

  In each of the first to fourth manufacturing methods, the support substrates 951, 952, and 1000 have been described as being removed. However, these are made of a conductive material, and the conductor layer 901 is left as it is without being removed. , 902 may be used. When a conductor circuit is formed on the optical waveguide layer, the conductor circuit can be formed by using a supporting substrate on the surface side on which the conductor circuit is formed as a conductor layer and etching it into a desired pattern.

  Moreover, you may abbreviate | omit either one or both of the clad layers 91 and 92 as needed.

  Needless to say, the method of forming the core layer 93 is not limited to the method described above.

  In addition, the optical waveguide layer 90 is not limited to the illustrated configuration, and may be configured such that, for example, a plurality of core layers are stacked between two cladding layers. It may be configured by sequentially stacking layers, or may be configured by stacking a plurality of stacked bodies in which one core layer is provided between two cladding layers.

  In addition, an inclined surface (reflecting surface) inclined by approximately 45 ° with respect to the optical path, that is, the longitudinal direction of the core portion 94 may be formed in the middle of the core portion 94. Thereby, the light (transmission light) propagating through the core portion 94 can be bent by approximately 90 ° on this inclined surface.

  Then, by appropriately setting the direction of the inclined surface, the optical path of the transmitted light is changed not only in the core layer 90 (two-dimensional direction) but also in a three-dimensional direction including the thickness direction of the optical waveguide layer 90. It becomes possible.

  This inclined surface can be formed by, for example, cutting or removing (deleting) the core portion 94. A reflective film such as a multilayer optical thin film or a metal thin film (for example, an aluminum vapor deposition film) or a reflection increasing film may be formed on the inclined surface.

  The core part has a staggered structure end patterned so as to bend toward the end opposite to the side on which the receptor structure is provided. What has an optical path changing part bent toward an optical fiber hole is provided by the above-mentioned method.

Next, a method for manufacturing the receptor structure will be described.
As a manufacturing method of the receptor structure portion, the receptor structure portion may be formed using the optical waveguide layer 90 or the optical waveguide structure 9 obtained above. For example, the receptor structure portion may be formed on the optical waveguide layer 90 obtained above. Obtained by providing a through hole 104 for the receptor structure that penetrates the optical element mounting surface and the wiring component joining surface by placing a mask having an opening at a predetermined position for forming the structure and irradiating with a laser. (Optical circuit board (G1) 106) (FIG. 15B). Even when the optical waveguide structure 9 is used, the receptor structure can be formed by the same method.

  The receptor structure part is formed on the optical element mounting part in accordance with at least the position of the conductive member (electrode, metal protrusion) of the optical element. Further, as will be described later, in the receptor structure through-hole 104, an additional conductor portion is processed in accordance with a desired receptor structure.

  The size of the receptor structure through-hole 104 is not limited as long as an optical element can be mounted and the conductive member for electrically connecting the optical element and the wiring component can be disposed. Although it can be about -125 micrometers, it is not limited to this. The shape of the through hole is not particularly limited, such as a columnar shape or a prismatic shape.

  Examples of the laser include a carbon dioxide laser, an excimer laser, and an ultraviolet laser. Further, as a method of forming the through hole, a method by laser irradiation has been described, but any method may be used as long as it is a method suitable for this manufacturing method, and a method such as plasma dry etching or chemical etching can also be exemplified. .

  In the present invention, an adhesive layer may be provided on a joint surface between the optical circuit board and the wiring component. When the adhesive layer used in the present invention is bonded by soldering or the like in the metal bonding between the electrode of the optical element and the pad of the wiring component in the optical element mounting, and the metal bonding of the conductor post provided in the receptor, etc. An adhesive containing a thermosetting flux that acts as a flux at the time of soldering is preferable. Examples include an adhesive containing a resin (A) having a phenolic hydroxyl group and a resin (B) that is a curing agent for the resin. It may be possible to electrically connect the conductive members such as the electrodes, and examples thereof include those containing a resin and conductive particles. The conductive particles are not particularly limited as long as they have conductivity. Various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold, and metal alloys thereof And metal powders such as metal oxides and solder, conductive carbon powders such as carbon and graphite, and particles such as glass, ceramics and plastics coated with the metal. More preferably, the adhesive layer contains solder powder and a curing agent having flux activity. Among these, the solder powder and the curing agent having flux activity are preferably present in the resin, but the adhesive layer used in the present invention is formed from an adhesive tape formed as an adhesive dry film. It is preferred that Further, by using a solder powder and a hardener having flux activity as the adhesive layer, the solder powder particles are concentrated and moved to the conductive member portion by a self-alignment effect in the bonding process, and are stable. A metal bond can be formed to allow electrical bonding.

Next, the manufacturing method of the adhesive bond layer in this invention is demonstrated.
First, the adhesive agent can be prepared and applied directly to the portion where the adhesive layer is to be formed, using this as an application liquid, to form the adhesive layer.
Moreover, it can be set as an adhesive dry film by apply | coating the said coating liquid on peeling base materials, such as a polyester sheet, and drying at predetermined temperature. The dry film thus obtained can be used as an adhesive tape, which can be used after adjusting to a desired size.

  Further, in the production of the dry film, on the release substrate, the coating liquid is applied only to a portion where the adhesive layer is formed by coating using a printing method or a dispenser, and dried at a predetermined temperature. You may produce the adhesive dry film in which the pattern of the adhesive bond layer was previously formed only in the adhesion location.

  Next, in the case where an adhesive layer is provided on the joint surface between the optical circuit board and the wiring component, an optical circuit board with an adhesive may be prepared, but in describing the optical circuit board with an adhesive layer, a representative As an example, an example using the optical circuit board having the receptor structure portion obtained above and an adhesive containing a resin, a curing agent having flux activity, and solder powder will be described.

First, using the optical circuit board (G1) 106 obtained by providing the receptor structure through-hole 104 in the optical waveguide layer 90 obtained above, a predetermined position of the joint surface of the optical circuit board 106 with the wiring component Then, an adhesive layer 107 is formed (FIG. 15C).
Thus, in the optical waveguide layer 90 having the core portion and the cladding portion, the optical waveguide layer 90 is provided with a receptor structure for electrical connection between the electrode of the optical element and the pad of the wiring component, and the joint surface with the wiring component In addition, an optical circuit board (G1) 108 with an adhesive having an adhesive layer for electrically connecting the electrodes and the pads can be obtained.

  As a method for forming the adhesive layer, for example, in the optical circuit board G1 obtained above, the adhesive is directly applied to a predetermined position on the joint surface with the wiring component to form a coating film. This can be dried to form an adhesive layer. Further, in the optical circuit board G1 obtained as described above, an adhesive layer can be formed by pasting the adhesive dry film on a predetermined position of the joint surface with the wiring component. The adhesive dry film can be adjusted in advance to a desired size, and the adhesive dry film on which the pattern is formed is adjusted in advance to a desired size, so that it is temporarily pressure-bonded at a predetermined position. Therefore, the operation can be easily performed. As a temporary pressure bonding condition of such an adhesive dry film, it is sufficient that the solder powder in the adhesive is not melted and the resin is cured and bonded at a temperature at which the resin is not hardened. Examples of the method include pressure bonding at a temperature of about 0.1 MPa to 2 MPa and a pressure of about 1 second to 10 seconds.

  Next, in the optical circuit board, a conductor circuit is provided on the optical element mounting surface, and the conductor circuit and the wiring component are electrically connected with each other. A conductor part for metal bonding to the conductive member of the wiring component may be formed, a method of forming a conductor circuit on the optical circuit board, and electrical conduction between both sides of the optical circuit board through the optical circuit board A method for forming a conductor portion for measuring the above will be described.

First, in the optical circuit board (G1) 106 obtained above, the optical circuit board (G1) obtained in the same manner as described above using the optical waveguide structure 9 having a conductor layer on at least the surface side to be the optical element mounting surface. ) 106 ′ (FIG. 16A), and then the conductor circuit 303 formed by the conductor layer 901 penetrating the optical waveguide layer 90 on the conductor layer 901 and the conductive member of the wiring component A via is formed at a position where a conductor portion is formed for metal bonding to (not shown).
As a method for forming the via, any method may be used as long as it is suitable for this manufacturing method, and examples thereof include laser, plasma dry etching, and chemical etching. Examples of the laser include a carbon dioxide gas laser, an excimer laser, and an ultraviolet laser.

Next, using the conductor layer 901 as an electroplating lead (electrically conductive member), a conductor portion (conductor post 302) is formed in the via by electroplating (FIG. 16B), and then the conductor layer is formed. The conductive circuit 303 is formed by etching 901 (optical circuit board (G2) 305) (FIG. 16C).
At this time, a gold film 304 is preferably formed by electroplating or the like at the joint portion between the conductor portion (conductor post 302) of the optical circuit board and the conductive member of the wiring component (FIG. 16 (c)). The gold film may be formed after nickel or the like is formed by electrolytic plating as the prevention layer. Similarly, a solder film (solder layer) may be formed on the tip surface of the conductor portion by electrolytic plating.

  Examples of the method for forming the conductor portion (conductor post 302) include a method of forming by electroless plating and a method of printing a conductive paste containing copper and solder. The conductor portion (conductor post 302) is made of a metal or an alloy thereof, and examples of the metal include copper, solder, nickel, gold, tin, silver, and palladium, among which copper having low resistance is preferable. The conductor post (conductor post 302) varies depending on the method of metal bonding, but in order to improve the bondability, the solder post can be formed of one layer of solder or two layers of copper and solder. When the solder layer is formed on the conductor post, the solder film need not be formed.

Next, in the case of forming an adhesive layer, the optical circuit board (G2) 305 obtained above is used in the same manner as described above at a predetermined position on the joint surface of the optical circuit board 305 with the wiring component. Then, an adhesive layer 306 is formed (FIG. 16D). Examples of the method for forming the adhesive layer include a method of directly applying an adhesive and a method of temporarily pressing an adhesive dry film in the same manner as the optical circuit board G1 with an adhesive.
Thus, the optical waveguide layer 90 having the core portion and the clad portion is provided with a receptor structure for electrical connection between the electrode of the optical element and the pad of the wiring component, and a conductor is provided on the optical element mounting surface. A conductor 303 has a circuit 303 and penetrates the optical waveguide layer 90 on the conductor circuit 303 to make electrical connection between the conductor circuit 303 and the wiring component, and is metal-bonded to the conductive member of the wiring component. A post (conductor portion) 302 is formed, and an optical circuit board (G2) 307 with an adhesive having an adhesive layer for electrically connecting the conductive members on the joint surface with the wiring component can be obtained.

Next, a method of providing a conductor portion for electrically connecting the electrode of the optical element and the pad portion of the wiring component in the optical circuit board used in the present invention will be described.
The conductor portion is provided in the receptor structure by filling a part or all of a conductor such as a conductor post from the bottom of the wiring component side in the receptor structure.

  First, an optical circuit board (G1) 106 ″ (FIG. 17A) obtained in the same manner as described above is prepared by using the optical waveguide structure 9 having a conductor layer at least on the surface side of the wiring component bonding surface. ,

  Next, in the receptor structure through-hole 104, the conductor layer 902 is formed as a lead for electroplating (a conductive member for power feeding), and a conductor post (conductor portion) 402 is formed from the bottom surface on the wiring component side of the conductor portion by electrolytic plating. (FIG. 17B). At this time, when the optical element is mounted, in order to facilitate the bonding when the conductive post 402 and the conductive member such as the projecting portion provided on the electrode of the optical element or the electrode are metal-bonded. In order to form a sufficient thickness for bonding from the bottom, a part is filled and formed.

Next, the conductor layer 902 is removed by etching. Further, preferably, a joint portion between the pad portion of the wiring component on the conductor post 402 provided in the receptor structure through-hole 104 of the optical circuit base substrate 106 ″ and the conductive member of the optical element on the conductor post 402. Gold coatings 403a and 403b are formed on the joint by electroplating or the like (optical circuit board (G3) 405) (FIG. 17C). Alternatively, the gold films 403a and 403b may be formed after nickel or the like is formed by electrolytic plating as a metal diffusion prevention layer.
Here, the entire conductor layer 902 is removed, but in the etching of the conductor layer 902, partial etching is performed so as to cover at least the position (the bottom surface on the wiring component side of the conductor portion) where electrical connection is made with the pad portion of the wiring component. Conductor circuit may be formed. Thereby, the conductor circuit electrically connected with the conductor post of the conductor part in the said receptor structure can be formed in the joint surface with the said wiring component.

Examples of the method for forming the conductor post 402 include a method of forming by electroless plating, a method of printing a conductive paste containing copper, solder, and the like, in addition to a method of forming by electroplating. Forming a copper post by electrolytic plating is very preferable because the shape of the tip of the copper post can be freely controlled.
The material of the conductor post 402 is made of metal or an alloy thereof, and examples of the metal include copper, solder, nickel, gold, tin, silver, and palladium. Among them, copper having low resistance is preferable. Although the conductor post 402 differs depending on the method of metal bonding, in order to improve bondability, the solder post 402 can be formed of one layer of solder or two layers of copper and solder. When a solder layer is formed on the conductor post 402, the solder film need not be formed.
The conductor post 402 may be any material having etching resistance when the conductor layer 902 is removed by etching. Usually, the conductor layer 902 is used as an etching resist between the conductor post 402 and the conductor layer 902. It is preferable to provide a metal layer having etching resistance with a different material. If the metal diffusion preventing layer can be used as an etching resist, it can be replaced with this.

Next, using the optical circuit board (G3) 405 obtained above, an adhesive layer 406 is formed at a predetermined position on the joint surface of the optical circuit board 405 with the wiring component (FIG. 17D). )).
Examples of the method for forming the adhesive layer include a method of directly applying an adhesive and a method of temporarily pressing an adhesive dry film in the same manner as the optical circuit board G1 with an adhesive.

  Thus, in the optical waveguide layer 90 having the core portion and the clad portion, the optical waveguide layer 90 includes a receptor structure for electrical connection between the electrode of the optical element and the pad portion of the wiring component, and in the receptor structure, In an optical circuit board provided with a conductor part for electrically joining (metal joining) the electrode of the optical element and the pad part of the wiring component, as the conductor part, the wiring part side in the receptor structure It is possible to obtain an optical circuit board with adhesive (G3) 407 in which a conductor post 402 provided at the bottom is formed and an adhesive layer electrically connecting the conductive members is provided on the joint surface with the wiring component. it can.

  An optical circuit board (optical circuit board G3) in which a conductor portion for metal-bonding the conductive member of the optical element and the conductive member of the wiring component is provided in the receptor structure is an optical element mounting surface. A conductor part for passing through the optical circuit board and conducting electrical connection between the conductor circuit and the wiring part, and a conductor part for metal bonding to the conductive member of the wiring part on the conductor circuit. May be formed. In this case, in the step of providing the conductor portion in the receptor structure, the optical circuit base substrate (G2) 305 obtained above is used in place of the optical circuit base substrate (G1) 106 ″, and the same procedure is performed. It can be formed by filling part or all of a conductor such as a conductor post from the bottom of the wiring component side in the structure (optical circuit board (G3 ′) 1101 (FIG. 16E)). Further, by providing an adhesive layer in the same manner as described above, an optical circuit board (G3 ′) 1102 with an adhesive can be obtained (FIG. 16E).

The optical circuit board (G3) 405 has a structure similar to that of the optical circuit board (G4) 503 described later, and further protrudes from the optical element mounting surface of the optical circuit board 405 into the receptor structure as a conductor portion. Can be provided. More specifically, as an additional conductor portion on the conductor post 402 in the receptor structure formed on the optical circuit board 405, the stud bump 408 protrudes from the optical element mounting surface of the optical circuit board 405 into the receptor structure. (Optical circuit board (G3 ″) 409). At this time, the gold film 403a may or may not be present.
By providing an adhesive layer on the optical circuit board (G3 ″) 409 on which the stud bump 408 is formed in the same manner as described above, an optical circuit board (G3 ″) 410 with an adhesive can be obtained (FIG. 17). (E)).

  As a method for forming the stud bump, a wire bonder or the like is used to form a nail head by connecting a gold wire to an electrode pad by a thermocompression bonding method (ball bonding method), and then at the base of the nail head. There is a method in which protruding electrodes formed by cutting a wire are stacked in layers.

  Further, in the present invention, the projection of the optical element is not provided on the electrode of the optical element, and the electrode of the optical element and the receptor structure part in the optical circuit circuit board can be directly joined. In such a case, in the step of forming the conductor post 402 of the optical circuit board G3 from the bottom of the conductor part on the wiring component side, the optical circuit board 106 ″ (at least the conductor layer 902 is provided on the surface in contact with the wiring part). ) (FIG. 18A), the conductor post 501 is filled into the receptor structure through-hole 104 so as to protrude from the optical element mounting surface of the optical circuit board (FIG. 18B). .

Next, the conductor layer 902 is removed by etching. Further, preferably, a joint portion between the pad portion of the wiring component on the conductor post (conductor portion) 501 provided in the receptor structure through-hole 104 of the optical circuit board 106 ″ and the electrode of the optical element on the conductor post 501. The gold films 502a and 502b are formed by electroplating or the like (optical circuit board (G4) 503) (FIG. 18C). Alternatively, the gold films 502a and 502b may be formed after nickel or the like is formed by electrolytic plating as a metal diffusion prevention layer.
Here, the conductor layer 902 is entirely removed, but the conductor circuit may be formed by performing partial etching in the same manner as the optical circuit board (G3). Thereby, the conductor circuit electrically connected with the conductor post of the conductor part in the said receptor structure can be formed in the joint surface with the said wiring component.
The conductor post 501 is the same as the optical circuit board (G3) in terms of formation method, material, and structure.

Next, using the optical circuit board (G4) 503 obtained above, an adhesive layer 504 is formed in the same manner as described above at a predetermined position on the joint surface of the optical circuit board 503 with the wiring component. (FIG. 18 (d)). Examples of the method for forming the adhesive layer include a method of directly applying an adhesive and a method of temporarily pressing an adhesive dry film in the same manner as the optical circuit board G3 with an adhesive.
Thus, in the optical waveguide layer 90 having the core portion and the clad portion, the optical waveguide layer 90 includes a receptor structure for electrical connection between the electrode of the optical element and the pad portion of the wiring component, and in the receptor structure, In the optical circuit board provided with the conductor part for electrically joining (metal joining) the electrode of the optical element and the pad part of the wiring component, as the conductor part, as the conductor part in the receptor structure A conductor post 501 protruding from the optical element mounting surface of the optical circuit board is formed, and an adhesive-attached optical circuit board having an adhesive layer electrically connecting the conductive members to the joint surface with the wiring component ( G4) 505 can be obtained.

  An optical circuit board (optical circuit board G4) in which a conductor part for metal bonding the electrode of the optical element and the pad part of the wiring component is provided in the receptor structure is the same as the optical circuit board G3. In addition, a conductive circuit of the wiring component and a metal are provided on the conductive circuit so as to have a conductive circuit on the optical element mounting surface, penetrate the optical circuit board, and establish electrical conduction between the conductive circuit and the wiring component. A conductor portion for joining may be formed. In this case, in the step of providing the conductor portion in the receptor structure, the optical circuit base substrate (G2) 305 obtained above is used in place of the optical circuit base substrate (G1) 106 ″, and the same procedure is performed. It can be formed by filling a conductor such as a conductor post from the bottom of the wiring component side in the structure so as to protrude the optical element mounting surface of the optical circuit board (optical circuit board (G4 ′) 1201 (FIG. 16). (F)) Further, by providing an adhesive layer in the same manner as described above, the optical circuit board (G4 ′) with adhesive can obtain 1202 (FIG. 16F).

  In the optical circuit board, when an alignment hole facing the fixing guide is provided, examples of the method include an ablation method using an excimer laser and a precision drilling method using an NC drill. The size of the alignment hole is, for example, 500 to 700 μm in diameter, and the error is preferably about ± 0.5 to 0.8 μm.

Next, wiring components will be described.
As the wiring component used in the present invention, when mounting the optical element, a mounting portion pad is provided for electrical conduction between the electrode of the optical element and a conductive member such as an electrical circuit of the wiring component, and insulation is provided. The circuit board which has a layer and a circuit layer is mentioned, The multilayer circuit board which overlap | superposed this may be sufficient, and a rigid circuit board, a flexible circuit board, etc. can be used. The wiring component only needs to be provided with at least the optical element mounting portion, but an electronic component may be mounted. The wiring component may be a component such as a semiconductor element substrate or a connector. Furthermore, wiring components for electronic devices such as computers, liquid crystal displays, game machines, car navigation systems and mobile phones can be used as the wiring components.

FIG. 28 is a cross-sectional view showing an example of a wiring component used in the present invention.
As shown in FIG. 28A, the wiring component 601 has an opening 603 that is opened by a drilling machine in a core substrate 602 having an insulating layer. Conductor circuits 604 are formed on both surfaces of the core substrate 602.
At this time, the conductor circuit 604 is provided with a pad serving as a mounting portion for electrical connection between the electrode of the optical element and a conductive member such as an electric circuit of the wiring component when the optical element is mounted. When the optical elements are mounted on both surfaces of the wiring component via the optical circuit board, the pads may be provided on the conductor circuits on both surfaces of the wiring component.
The inside of the opening 603 is plated, and the conductor circuits 604 on both surfaces of the core substrate 602 are conducted.

  As said insulating layer, what is comprised from the resin composition using insulating resins, such as cyanate resin, cyclic olefin resin, a phenol resin, and an epoxy resin, can be mentioned, for example. In particular, when mounting an optical element, in order to reduce the dimensional change, a cyanate resin and / or a prepolymer thereof having characteristics such as high heat resistance and low linear expansion coefficient, and a resin composition containing an epoxy resin are used. It is preferable to use it.

A method for manufacturing such a wiring board will be described with reference to FIG. 28. For example, the core substrate (for example, double-sided copper foil of FR-4) 602 is provided with an opening 603 by opening with a drilling machine. Thereafter, the opening 603 is plated by electroless plating so that both surfaces of the core substrate 602 are electrically connected. Then, by etching the copper foil, a conductor circuit 604 including a pad serving as a mounting portion for establishing electrical conduction between the conductive member of the optical element and the conductive member of the wiring component is formed (FIG. 28A). .
It is preferable to form a gold film 605 on the surface of the pad by electroplating or the like (FIG. 28B), and after forming nickel or the like as a metal diffusion prevention layer by electrolytic plating, the gold film is formed. You may do it.

  The conductor circuit 604 may be made of any material as long as it is suitable for this manufacturing method. However, it is preferable that the conductor circuit 604 can be removed by a method such as etching or peeling in the formation of the conductor circuit. Are preferably resistant to the chemicals used in this. Examples of the material of the conductor circuit 604 include copper, copper alloy, 42 alloy, and nickel. In particular, the copper foil, the copper plate, and the copper alloy plate are most preferable for use as the conductor circuit 604 because not only electrolytic plated products and rolled products can be selected, but also various thicknesses can be easily obtained.

  Further, although the adhesive layer is provided in the optical circuit board, the adhesive layer may be provided on the wiring component. In that case, in the wiring component obtained above, on the bonding surface (one side or both sides) of the core substrate 602 with the optical circuit board (there is no adhesive layer at this time) so as to cover the conductor circuit 604, In the same manner as described above, an adhesive layer 606 is formed (FIG. 28C).

Next, the optical element mounting component will be described using specific embodiments.
<First Mode (FIG. 19)>
As shown in FIG. 19 (c) or FIG. 19 (d), the first mode is an optical component having a wiring component provided with an optical element mounting portion for mounting an optical element, a core portion, and a cladding portion. An optical element mounting component comprising a waveguide layer and comprising an optical circuit board having a receptor structure for conducting electrical conduction between the conductive member of the optical element and the conductive member of the wiring component. An optical element is mounted on the optical element mounting portion of the wiring component via the optical circuit board, and the electrode of the optical element and the pad of the wiring component are on the electrode of the optical element. The provided metal protrusion is directly metal-bonded as a conductor in the receptor structure.

  The optical element 701 used in the first embodiment has a metal protrusion (bump) 702 that becomes a conductor in the receptor structure on the electrode (FIG. 19A). Examples of the material of the metal protrusion 702 include gold, copper, solder, and the like, which are selected according to a metal bonding method.

A detailed example of the optical element 701 will be described with reference to FIG. 30. For example, in an optical element having a single light receiving part or light emitting part, the optical element 701 is provided on the signal line connecting electrode on the light receiving / emitting part 703 side. The metal projection (conductive member) 702a, the metal projection 702b provided on the ground connection electrode, and the positioning and fixing metal projection 702c are exemplified (FIG. 30 (a), shown from three directions). Figure.) By providing one positioning fixing protrusion, positioning and fixing of the optical element can be ensured, and a plurality of positioning fixing protrusions can be provided. Further, the optical element may be a plurality of light receiving units or light emitting units. For example, four optical elements having the above single light receiving unit or light emitting unit may be arranged in parallel (FIG. 30). (B)). The plurality of optical elements included in the light receiving section or the light emitting section are used in an optical circuit board having a plurality of core sections, and the number of light receiving sections or light emitting sections is also determined according to the number of core sections.
As for the size of the metal protrusion, it is sufficient that the metal protrusion is accommodated in the receptor structure through-hole and has a size that allows sufficient metal bonding with the oppad of the wiring component. When there are a plurality of metal protrusions, the pitch between the metal protrusions corresponds to the pitch between the conductive members of the optical element, and is generally 125 μm or 250 μm, but it may be about several tens of μm. good.

Next, an example of the manufacturing method of a 1st aspect is demonstrated.
First, the optical circuit board (G1) 106 obtained above and a wiring component 601 ′ in which a gold film 605 is formed on a land are prepared, these are aligned and overlapped, and an optical element mounting component (G1) is prepared. 704 is obtained (FIG. 19B).
In the alignment, passive alignment in which the light emitting / receiving elements are mounted along the through holes for the receptor structure is possible. Thereby, both mounting accuracy and mounting speed can be improved.

  Next, the metal protrusion 702 formed on the optical element 701 having the metal protrusion is transferred to the receptor structure through-hole 104 formed on the optical circuit board (G1) 106 in the optical element mounting component (G1) 704. An optical element mounting component (G1) on which an optical element is mounted by performing ultrasonic bonding while applying weight so that the metal projection 702 is pressed against the gold film 605 after being aligned and placed in a predetermined position. ) 705 is obtained (FIG. 19C).

  As a specific example of the ultrasonic bonding method, for example, after the metal protrusion 702 is placed in a predetermined position of the receptor structure through-hole 104, an ultrasonic bonding apparatus is generally used at a frequency of 15 kHz. With a rated power of 3000 W, a weight of about 1 kN is applied, and the metal protrusion 702 is pressed against the gold film 605 and can be vibrated for 0.5 seconds to perform bonding.

In addition, in the case of having an adhesive layer on the joint surface between the optical circuit board and the wiring component,
First, the optical circuit board (G1) 108 with the adhesive layer obtained above and the wiring component 601 ′ in which the gold film 605 is formed on the optical element mounting portion pad are prepared and formed on the optical circuit board (G1) 106. The receptor structure through-hole 104 and the gold film 605 on the pad are aligned and overlapped to obtain an optical element mounting component (G1) 704 ′ (FIG. 19D). At this time, the optical circuit board (G1) 108 with an adhesive layer and the wiring component 601 'are temporarily pressure-bonded by the adhesive layer. As conditions for the temporary pressure bonding, the optical circuit board (G1) with an adhesive layer is used. It can be performed in the same manner as the temporary pressure bonding condition of the adhesive dry film in 108.

  In the alignment, passive alignment in which the optical element is mounted along the through hole for the receptor structure is possible. Thereby, both mounting accuracy and mounting speed can be improved.

  Next, the metal protrusion 702 formed on the optical element 701 having the metal protrusion is transferred to the receptor structure through-hole 104 formed on the optical circuit board (G1) 106 in the optical element mounting component (G1) 704. The optical circuit board (G1) 106 and the wiring component 601 ′ are adhered to each other, and the optical circuit board (G1) 106 and the wiring component 601 ′ are bonded, and the metal projection 702 of the optical element 701 and the optical element mounting portion of the wiring component 601 ′ are aligned. The pad is metal-bonded to obtain an optical element mounting component (G1) 705 ′ on which the optical element is mounted (FIG. 19E).

  As the bonding method, the bonding can be performed by heating at a predetermined temperature. The bonding temperature can be set according to the solder powder material and the resin material in the adhesive layer.

  The bonding temperature is preferably higher than the melting temperature of the solder powder and is a temperature at which the resin is melted. In this viewpoint, the bonding temperature is preferably higher than 100 ° C., more preferably 120 ° C. or higher. Moreover, it is preferable that the melt viscosity of the resin is low at the bonding temperature. From this viewpoint, the bonding temperature is preferably 250 ° C. or lower, and more preferably 200 ° C. or lower. In addition, from the viewpoint of expanding the region where the resin has a low melt viscosity, it is preferable to lower the bonding temperature, but it is desirable to set in consideration of the heat resistance of the optical circuit board and the optical element.

  In bonding, from the viewpoint of causing solder powder to flow onto the surface of the metal projection and moving it more efficiently, it is preferable to pressurize with a predetermined pressure during bonding. The pressurizing pressure is preferably 0 MPa or more, more preferably 1 MPa or more, from the viewpoint of more reliably forming the solder region. In addition, even if the pressure applied intentionally to the adhesive layer is 0 MPa, a predetermined pressure may be applied to the adhesive layer by the weight of the member disposed on the adhesive layer. Further, from the viewpoint of further improving the connection reliability, the pressure is preferably 20 MPa or less, and more preferably 10 MPa or less.

  The resin in the adhesive layer is melted by the heating. Further, the solder powder in the adhesive layer is melted. The melted solder powder moves from a resin (not shown) in a self-aligned manner onto the metal protrusion 702 of the optical element 701 and the optical element mounting part pad of the wiring component 601 ′. Since the solder powder self-aligns with the electrode (metal protrusion) and the opposing region of the conductive member of the pad, solder is applied to the region between the metal protrusion 702 of the optical element 701 and the optical element mounting portion pad of the wiring component 601 ′. A region is formed.

  Further, a hardener (not shown) having a flux activity present in the resin efficiently moves to the interface between the solder powder and the conductive member, and also removes an oxide film on the surface of the solder powder. And each conductive member are directly metal-bonded and electrically connected. Thereafter, by cooling the optical element mounting component (G1) 705 'on which the optical element is mounted, the resin in the adhesive layer is cured, and the state in which the conductive members are joined by the solder region is maintained.

  Here, when an adhesive dry film is used as the adhesive layer, heat treatment may be performed at a predetermined single temperature at the time of bonding, and the optical circuit board and the wiring component can be easily bonded. However, the heat treatment at the time of bonding is not limited to treatment at a single temperature, for example, step cure after heating at 150 ° C. for 100 seconds and then heating at 180 ° C. for 100 seconds, or after thermocompression bonding at 160 ° C. for 10 seconds, You may perform the postcure which oven-cure at 180 degreeC for 10 minutes. Further, since the conductive member and the solder in the adhesive layer are connected by metal bonding of solder particles constituting the solder powder, the connection resistance is low and the connection reliability is high.

  Further, in the manufacture of the optical element mounting component (G1) 704 ′, the optical circuit board (G1) 108 with the adhesive layer and the wiring component 601 ′ were temporarily bonded by the adhesive layer. Here, the optical circuit board (G1) 108 with the adhesive layer and the wiring component 601 ′ are bonded to each other by the adhesive layer by the same method as the bonding method in the optical element mounting component (G1) 705 (main pressure bonding). Thus, an optical element mounting component (G1) 704 ′ can be manufactured. At this time, it is desirable that the gold film 605 on the optical element mounting portion pad is exposed from the adhesive layer 107. Next, the optical element 701 is mounted in the receptor structure through-hole 104 of the optical element mounting component (G1) 704 ′, and the metal protrusion 702 of the optical element 701 is loaded so as to be pressed by the gold film 605. It is also possible to obtain an optical element mounting component (G1) 705 ′ on which an optical element is mounted by applying ultrasonic bonding while applying.

  As a specific example of the ultrasonic bonding method, for example, after the metal protrusion 702 is placed in a predetermined position of the receptor structure through-hole 104, bonding can be performed under the same conditions as described above.

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G1) 106, and the optical element 701 are sequentially arranged. The optical circuit board (G1) 106 and the wiring component 601 ′ are bonded together, and the metal projection 702 of the optical element 701 and the optical element of the wiring component 601 ′ are superposed at predetermined positions and bonded in the same manner as described above. An optical element mounting component (G1) 705 ′ on which an optical element is mounted can be obtained by metal bonding the mounting portion pad. Moreover, you may use wiring components with an adhesive layer.

The adhesive layer (adhesive dry film) used in the present invention is excellent in adhesiveness with an adherend and has an excellent electrical connection reliability between conductive members. In addition, the adhesive layer (adhesive dry film) used in the present invention can be reliably bonded even when the bonding area of the conductive member in the adherend is small, and the solder powder is self-adhering to the opposing region of the conductive member. Since alignment is performed and the connection is made through the solder region, a slight deviation in alignment between the conductive members can be allowed.
The adhesive layer has a resin and a solder region that penetrates the resin in a state after bonding. A curing agent having flux activity may or may not remain in the resin.

<Second Mode (FIG. 20)>
As shown in FIG. 20 (c) or FIG. 20 (e), the second mode is the first mode, wherein the optical circuit board has a conductor circuit on the optical element mounting surface and penetrates the optical circuit board. In order to establish electrical continuity between the conductor circuit and the wiring component, an optical circuit board (G2) 305 in which a conductor portion for metal bonding with a conductive member of the wiring component is formed on the conductor circuit is used. The metal projection (conductive member) provided on the electrode of the optical element and the electrode of the optical element and the pad of the wiring component are directly connected as a conductor part in the receptor structure. A conductor portion (conductive member) for metal-bonding, penetrating the optical circuit board on the conductor circuit formed on the optical element mounting surface, and metal-bonding to the conductive member of the wiring component, and corresponding to it The conductive member of the wiring component is metal-bonded It is intended.
As the optical element 801 used in the second mode, one having a metal projection (bump) (conductive member) 802 that becomes a conductor in the receptor structure, similar to the one used in the first mode, is used. (FIG. 20A).

Next, an example of the manufacturing method of the second aspect will be described.
First, the optical circuit board (G2) 305 obtained above and a wiring component 601 ′ in which a gold film 605 is formed on a land for mounting an optical element are prepared, and the receptor formed on the optical circuit board (G2) 305 is prepared. A conductor post 302 as a conductor portion for aligning the structural through-hole 104 and the gold film 605 on the land, penetrating the optical circuit board and metal-bonding the pad of the wiring component, and The corresponding wiring component pads (not shown) are aligned, overlapped while being applied with weight, and metal bonded to the wiring component pads penetrating the optical circuit board by ultrasonic bonding. Therefore, the conductor post 302 and the corresponding wiring component pad are metal-bonded to obtain the optical element mounting component (G2) 803 (FIG. 20C).

Next, the metal protrusion 802 of the optical element 801 having the metal protrusion and the receptor structure through-hole 104 formed in the optical element mounting component (G2) 803 are aligned and stored in a predetermined position. Then, while applying a weight so that the metal protrusion 802 is pressed against the gold film 605, ultrasonic bonding is performed to obtain an optical element mounting component (G2) 804 on which the optical element is mounted (FIG. 20D). ).
The weighting and ultrasonic bonding conditions at this time are the same as in the first aspect.

  In the above description, the optical element mounting component (G2) is formed by metal-connecting the conductor portion and the corresponding wiring component pad through the optical circuit board and metal-bonding the wiring component pad. ) The method of mounting the optical element after forming 803 has been described. However, the conductor post 302 and the corresponding wiring component pad that penetrate the optical circuit board and metal-bond the pad of the wiring component are described. And aligning the metal protrusion 802 of the optical element 801 having the metal protrusion and the receptor structure through-hole 104 formed in the optical element mounting component (G2) 803, and It is also possible to perform metal bonding by ultrasonic bonding all at once at the same time.

In addition, in the case of having an adhesive layer on the joint surface between the optical circuit board and the wiring component,
First, the optical circuit board (G2) 307 with the adhesive layer obtained above and the wiring component 601 ′ in which the gold film 605 is formed on the optical element mounting portion pad are prepared and formed on the optical circuit board (G2) 305. Conductor portion for aligning the receptor structure through-hole 104 and the gold film 605 on the pad, and penetrating the optical circuit board and metal-connecting the conductive member other than the pad of the wiring component As shown in FIG. 20, the conductor post 302 and a conductive member (not shown) other than the pad of the wiring component corresponding thereto are aligned and overlapped to obtain an optical element mounting component (G2) 803 ′ (FIG. 20). (D)). At this time, the optical circuit board (G2) 307 with the adhesive layer and the wiring component 601 ′ are temporarily bonded by the adhesive layer in the same manner as the optical element mounting component (G1) 704 ′.

Next, the metal protrusion 802 of the optical element 801 having the metal protrusion and the receptor structure through-hole 104 formed in the optical circuit board (G2) 305 in the optical element mounting component (G2) 803 ′ are positioned. In addition, the optical circuit board (G2) 305 and the wiring component 601 ′ are bonded together in a predetermined position, and the metal protrusion 802 of the optical element 801 and the optical element mounting portion pad of the wiring component 601 ′ are bonded. In addition, the conductor post 302 and the corresponding conductive member other than the pad of the wiring component are metal-bonded to each other and to metal-connect the conductive member of the wiring component penetrating the optical circuit board. Thus, an optical element mounting component (G2) 804 ′ on which the optical element is mounted is obtained (FIG. 20E).
The bonding method at this time is the same as in the first embodiment.

  Further, in the production of the optical element mounting component (G2) 803 ′, the optical circuit board (G2) 307 with an adhesive layer and the wiring component 601 ′ were temporarily bonded with the adhesive layer. Here, the optical circuit board (G2) 307 with the adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer by the same method as the bonding method in the first aspect. A component mounting component (G2) 803 ′ can be manufactured. At this time, it is desirable that the gold film 605 on the optical element mounting portion pad (conductive member) is exposed from the adhesive layer 306. Next, the optical element 801 is mounted in the receptor structure through-hole 104 of the optical element mounting component (G2) 803 ′, and the metal protrusion 802 of the optical element 801 is loaded so as to be pressed by the gold film 605. It is also possible to obtain an optical element mounting component (G2) 804 ′ on which an optical element is mounted by applying ultrasonic bonding while applying the above. The ultrasonic bonding method is as described above.

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G2) 305, and the optical element 801 are In order, the optical circuit board (G2) 305 and the wiring component 601 ′ are bonded together, and the metal protrusion 802 of the optical element 801 and the wiring component 601 ′ are overlapped. An optical element mounting portion pad is metal-bonded, and the conductor post 302 and the corresponding wiring component conductive member are metal-bonded to penetrate the optical circuit board and metal-connect the conductive member of the wiring component. Thus, an optical element mounting component (G2) 804 ′ on which the optical element is mounted can be obtained. Moreover, you may use wiring components with an adhesive layer.

  In addition to the above aspect, in the present invention, an optical element having no metal protrusion on the electrode (conductive member) can be used. As such an aspect, a 3rd aspect and a 4th aspect are demonstrated.

As a third aspect, an optical circuit board (G1) 106 ″ (FIG. 21 (a) obtained in the same manner as described above using an optical waveguide structure 9 having a conductor layer at least on the surface side of the wiring component bonding surface. )) Can be used. At this time, the conductor layer may be provided so as to cover at least the receptor structure through-hole 104.
First, an optical circuit board (G1) 106 ″ is prepared (FIG. 21A), then stud bumps 1302 are formed in the receptor structure (FIG. 21B), and then the conductor layer is formed. The entire surface 1301 is removed by etching to obtain an optical circuit board (G1 ′) 1303 having stud bumps (FIG. 21C). At this time, the circuit may be formed by partially removing the metal plate 1301.

  As a method for forming the stud bump, a wire bonder or the like is used to form a nail head by connecting a gold wire to an electrode pad by a thermocompression bonding method (ball bonding method), and then at the base of the nail head. There is a method in which protruding electrodes formed by cutting a wire are stacked in layers.

Next, when an adhesive layer is provided, an optical circuit board (G1 ′) 1303 having stud bumps is used to bond the optical circuit board (G1 ′) 1303 to a predetermined position on the joint surface with the wiring component. An agent layer 1304 is formed (FIG. 21D).
Examples of the method for forming the adhesive layer include a method of directly applying an adhesive and a method of temporarily pressing an adhesive dry film in the same manner as the optical circuit board G1 with an adhesive.
In this manner, in the optical waveguide layer 90 having the core portion and the cladding portion, a receptor structure for establishing electrical conduction between the electrode of the optical element and the pad of the wiring component, and the electric structure in the receptor structure. An adhesive-equipped optical circuit board (G1 ′) 1305 having a stud bump as a conductive member for conducting electricity and having an adhesive layer electrically connecting the conductive members on the joint surface with the wiring component Obtainable.

  Next, an optical circuit board with adhesive (G1 ′) 1305 obtained above and a wiring component 601 ′ in which a gold film 605 is formed on the optical element mounting portion pad are prepared, and an optical circuit board (G1 ′) 1305 is prepared. The stud bump 1302 formed in the above and the gold film 605 on the pad are aligned and overlapped to obtain an optical element mounting component (G1 ′) 1306 (FIG. 21E). At this time, the optical circuit board (G1 ') 1305 with the adhesive layer and the wiring component 601' are temporarily pressure-bonded with the adhesive layer in the same manner as the optical element mounting component (G1) 704 '. Further, at this time, ultrasonic bonding may be performed in order to ensure the bonding between the stud bump and the gold film.

Next, the electrode of the optical element 1307 is aligned with the protruding stud bump 1302 in the receptor structure formed on the optical circuit board 106 in the optical element mounting component (G1 ′) 1306, and the electrode of the optical element 1307 is While applying a weight so as to be pressed against the stud bump 1302, ultrasonic bonding is performed in the same manner as described above, and the electrode of the optical element 1307 and the stud bump 1302 are bonded to each other by the same method as the bonding method in the first mode. Then, bonding (main pressure bonding) is performed with the adhesive layer to obtain an optical element mounting component (G1 ′) 1308 on which the optical element is mounted (FIG. 21F).
The optical element 1307 does not need to have a metal protrusion on the electrode (conductive member) as in the above embodiment, and may have a conductive member for electrical connection.

  As a fourth aspect, the optical waveguide layer 90 obtained as described above is provided with a through hole 104 for receptor structure, a conductor circuit 303 is provided on the optical element mounting surface, and the electrical connection between the conductor circuit 303 and the wiring component is provided. In order to conduct electricity, an optical circuit board (G2) 305 provided on the conductor circuit 303 is provided with a conductor portion 302 that penetrates the optical waveguide layer 90 and is metal-bonded to the conductive member of the wiring component. be able to.

  The manufacturing method of the fourth aspect can be manufactured by the same method as the third aspect. First, the stud bump 1401 is formed in the receptor structure of the optical circuit board (G2) 305, and the stud bump is provided. An optical circuit board (G2 ′) 1402 is obtained (FIG. 22A). As a method for forming the stud bump, the stud bump is formed on the conductor layer 901 in the same manner as described above before the conductor layer 901 is etched in the optical circuit board (G2) 305 to form the conductor circuit 303. The optical circuit board (G2) 305 in which the conductor circuit 303 is formed on the surface on the optical element mounting side using the optical waveguide structure 9 having the conductor layers on both sides is manufactured. There is a method of forming a stud bump in the same manner as described above, leaving a conductor layer so as to cover at least the receptor structure through-hole 104 on the surface side.

  Next, using an optical circuit board (G2 ′) 1402 having a stud bump, an adhesive layer 1403 is formed at a predetermined position on the bonding surface of the optical circuit board (G2 ′) 1402 with the wiring component, In an optical waveguide layer 90 having a core portion and a cladding portion, a receptor structure for conducting electrical conduction between the electrode of the optical element and the pad of the wiring component, and for conducting the electrical conduction in the receptor structure An adhesive-equipped optical circuit board (G2 ′) 1404 having a stud bump as a conductive member and having an adhesive layer electrically connecting the conductive members on the joint surface with the wiring component can be obtained ( FIG. 22 (b)).

  Next, an optical circuit board with adhesive (G2 ′) 1404 obtained above and a wiring component 601 ′ in which a gold film 605 is formed on an optical element mounting portion pad are prepared, and an optical circuit board (G2 ′) 1402 is prepared. The stud bump 1401 formed in the above and the gold film 605 on the pad are aligned and overlapped to obtain an optical element mounting component (G2 ′) 1405 (FIG. 22C).

Next, the electrode of the optical element 1406 is aligned with the protruding stud bump 1401 in the receptor structure formed on the optical circuit board 106 in the optical element mounting component (G2 ′) 1405, and the electrode of the optical element 1406 is While applying a weight so as to be pressed against the stud bump 1401, ultrasonic bonding is performed in the same manner as described above, and the electrode of the optical element 1401 and the stud bump 1401 are metal-bonded by the same method as the bonding method in the first aspect. Then, adhesion (main pressure bonding) is performed with the adhesive layer to obtain an optical element mounting component (G2 ′) 1407 on which the optical element is mounted (FIG. 22D).
The optical element 1406 does not need to have a metal protrusion on the electrode (conductive member) as in the above embodiment, and may have a conductive member for electrical connection.

Next, an example of the manufacturing method of the fifth aspect will be described.
<5th aspect (FIG. 23)>
As shown in FIG. 23 (c) or FIG. 23 (e), the fifth mode is an optical device having a wiring component provided with an optical element mounting portion for mounting an optical element, a core portion, and a cladding portion. An optical element mounting component comprising a waveguide layer and comprising an optical circuit board having a receptor structure for conducting electrical conduction between the conductive member of the optical element and the conductive member of the wiring component. An optical element is mounted on the optical element mounting portion of the wiring component via the optical circuit board, and the conductive member of the optical element and the conductive member of the wiring component are within the receptor structure. As a conductor portion, a metal post including a conductor post formed in the receptor structure is bonded. In the fifth aspect, the conductor post 402 is partially formed from the bottom surface on the conductor part wiring component side, and as the conductor part in the receptor structure, a partially formed conductor post 402, It is formed by a metal protrusion 906 provided on the electrode of the optical element. Thereby, since the height of a conductor part can fully be ensured, metal bondability improves more.

  As the optical element used in the fifth aspect, it is preferable to use metal protrusions (bumps) 906 formed on the electrodes of the optical element. However, sufficient metal bondability is ensured as the conductor part in the receptor structure. What is necessary is just to have the height which can be performed (FIG. 23 (a)).

Next, an example of the manufacturing method of the fifth aspect will be described.
First, the optical circuit board (G3) 405 obtained above and a wiring component 601 ′ having a gold film 605 formed on a pad for mounting an optical element are prepared, and the receptor formed on the optical circuit board (G3) 405 is prepared. The metal joint (gold film 403b) with the wiring component on the conductor post 402 in the structure is aligned with the gold film 605 on the pad, and the metal joint (gold film 403b) in the receptor structure becomes the gold film 605. Ultrasonic bonding is performed while applying a weight so as to be pressed to obtain an optical element mounting component (G3) 903 (FIG. 23B).

Next, the metal protrusion 906 of the optical element 905 having the metal protrusion is aligned with the conductor post 402 (gold film 403a) in the receptor structure formed on the optical element mounting component (G3) 903, and a predetermined amount is obtained. The optical projection mounting component (G3) 904 on which the optical element is mounted is obtained by performing ultrasonic bonding while applying a weight so that the metal protrusion 906 is pressed against the gold film 403a in the receptor structure. Is obtained (FIG. 23 (d)).
The weighting and ultrasonic bonding conditions at this time are the same as in the first aspect.

  In the above description, the method of mounting the optical element after forming the optical element mounting component (G3) 903 by metal bonding the optical circuit board and the pad of the wiring component has been described. The circuit board, the wiring component, and the optical element may be aligned at the same time, and metal bonding may be performed collectively by ultrasonic bonding.

In addition, in the case of having an adhesive layer on the joint surface between the optical circuit board and the wiring component,
First, an optical circuit board (G3) 407 with an adhesive layer obtained above and a wiring component 601 ′ having a gold film 605 formed on a pad (conductive member) for mounting an optical element are prepared. G3) The metal joint (gold film 403b) with the wiring component on the conductor post (conductive member) 402 in the receptor structure formed on 405 and the gold film 605 on the pad are aligned and overlapped, An optical element mounting component (G3) 903 ′ is obtained (FIG. 23D).
At this time, the optical circuit board (G3) 407 with the adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer to manufacture the optical element mounting component (G3) 903 ′. be able to. The bonding method is the same as in the first aspect.

  Further, in the production of the optical element mounting component (G3) 903 ′, the optical circuit board (G3) 407 with an adhesive layer and the wiring component 601 ′ were subjected to main pressure bonding with the adhesive layer. Here, the adhesive layer-attached optical circuit board (G3) 407 and the wiring component 601 ′ are previously bonded (temporary pressure bonding) with the adhesive layer by the same method as the adhesive layer temporary pressing method. The optical element mounting component (G1) 903 ′ can be manufactured, and the main pressure bonding can be performed when mounting the optical element.

Next, the metal protrusion 906 of the optical element 905 having the metal protrusion is applied to the conductor post 402 (gold film 403a) in the receptor structure formed on the optical circuit board 405 in the optical element mounting component (G3) 903 ′. Aligning and placing in a predetermined position, ultrasonic bonding is performed while applying a weight so that the metal protrusion 906 is pressed against the gold film 403a in the receptor structure, and the metal protrusion 906 of the optical element 905 The conductor post 402 (gold film 403a) is metal-bonded to obtain an optical element mounting component (G3) 904 ′ on which an optical element is mounted (FIG. 23C).
The ultrasonic bonding method is the same as in the first aspect.

  At this time, when solder or the like is used for the metal protrusion 906 of the optical element 905, first, the optical circuit board (G3) 407 with the adhesive layer and the wiring component 601 ′ are the same as the temporary pressure bonding method in the first aspect. According to the method, the optical element mounting component (G3) 903 ′ can be manufactured by performing temporary pressure bonding with the adhesive layer. Next, the optical element 905 is mounted in the receptor structure through-hole 104 of the optical element mounting component (G3) 903 ′, and the optical circuit board (G3) 405 is formed by the same operation as the bonding method in the first aspect. The wiring component 601 ′ is bonded, and the metal bonding portion (gold film 403b) with the wiring component on the conductor post (conductive member) 402 and the optical element mounting portion pad of the wiring component 601 ′ are metal-bonded. Can metal-bond the metal protrusion 906 of the optical element 905 and the gold coating 403a on the conductor post (conductive member) 402 to obtain an optical element mounting component (G3) 904 ′ on which the optical element is mounted. .

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G3) 405, and the optical element 905 are In order, the metal protrusions 906 of the optical element 905 and the conductor post 402 (gold film 403a) are metal-bonded in the same manner as described above, and the optical circuit board (G3) 405 and the wiring component 601 ′ is bonded, and a metal joint (gold film 403b) with a wiring component on the conductor post (conductive member) 402 and an optical element mounting portion pad of the wiring component 601 ′ are metal-bonded to form an optical element. An optical device mounting component (G3) 904 ′ on which is mounted can be obtained. Moreover, you may use wiring components with an adhesive layer.

Next, the sixth aspect will be described.
In the sixth aspect, the optical circuit board has a conductor circuit on the optical element mounting surface, penetrates the optical circuit board, and can conduct electrical continuity between the conductor circuit and the wiring component. Using the optical circuit base substrate (G2) in which a conductor part for metal bonding to the conductive member of the wiring component is formed on the conductor circuit, and the electrode of the optical element and the pad of the wiring component And a metal protrusion (conductive member) provided on the electrode of the optical element is directly metal-bonded as a conductor in the receptor structure and formed on the optical element mounting surface. The conductor part (conductive member) for penetrating the optical circuit board on the conductor circuit and metal-bonding to the conductive member of the wiring component and the corresponding conductive member of the wiring component are metal-bonded. It is done.
As the optical element used in this case, the same optical element as that used in the fifth aspect having a metal protrusion (bump) (conductive member) serving as a conductor in the receptor structure can be used.

Next, an example of the manufacturing method of the sixth aspect will be described.
First, an optical circuit board (G3 ′) 1102 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on an optical element mounting portion pad portion (conductive member) are prepared, and an optical circuit base is prepared. The receptor structure through-hole 104 formed in the substrate (G2) 305 is aligned with the gold film 605 on the pad, and the conductive member of the wiring component is metal-bonded through the optical circuit board. A conductor post 302 as a conductor portion for this purpose and a conductive member (not shown) of a wiring component corresponding thereto are aligned and overlapped to obtain an optical element mounting component (G3 ′) 1103 (FIG. 24). (B)). At this time, the optical circuit board (G3 ′) 1102 with the adhesive layer and the wiring component 601 ′ are temporarily bonded by the adhesive layer in the same manner as described above.

Next, the metal protrusion 906 of the optical element 905 having the metal protrusion, and the receptor structure through-hole 104 formed in the optical circuit base substrate (G2) 305 in the optical element mounting component (G3 ′) 1102 The optical circuit base substrate (G2) 305 and the wiring component 601 ′ are bonded to each other and the optical circuit base substrate (G2) 305 and the wiring component 601 ′ are bonded together, and the metal protrusion 906 of the optical element 905 and the optical element mounting of the wiring component 601 ′. A metal post to connect the conductive post 302 and the conductive member of the wiring component corresponding to the conductive component of the wiring component. Then, an optical element mounting component (G3 ′) 1104 on which the optical element is mounted is obtained (FIG. 24C).
The bonding method at this time is the same as in the first embodiment.

<Seventh aspect (FIG. 25)>
As shown in FIG. 25 (c) or FIG. 25 (e), the seventh aspect is an optical device having a wiring component provided with an optical element mounting portion for mounting an optical element, a core portion, and a cladding portion. An optical device mounting component comprising a waveguide layer and comprising an optical circuit board having a receptor structure for conducting electrical conduction between the electrode (conductive member) of the optical device and the conductive member of the wiring component. An optical element is mounted on the optical element mounting portion of the wiring component via the optical circuit board, and an electrode (conductive member) of the optical element and a conductive member of the wiring component are provided. In the receptor structure, the conductor portion is metal-bonded by a conductor post protruding from the optical element mounting surface of the optical circuit board and formed in the receptor structure. In the seventh aspect, the conductor post 501 is formed all over the receptor structure from the bottom surface on the conductor part wiring component side, and further the metal bondability can be improved, and the optical element Those having no metal protrusions on the electrode (conductive member) can be used.

  As the optical element 1001 used in the seventh aspect, it is not necessary to form a metal protrusion on the electrode (conductive member) as in the above-described aspect, as long as it has a conductive member for electrical connection. good.

Next, an example of the manufacturing method of the 7th aspect is demonstrated.
First, an optical circuit board (G4) 503 obtained above and a wiring component 610 ′ having a gold film 605 formed on a pad for mounting an optical element are prepared, and the receptor formed on the optical circuit board (G4) 503 is prepared. The metal joint (gold film 502b) with the pad of the wiring component on the conductor post 501 in the structure is aligned with the gold film 605 on the pad, and the metal joint (gold film 502b) in the receptor structure becomes the gold film. Ultrasonic bonding is performed while applying a weight so as to be pressed by 605 to obtain an optical element mounting component (G4) 1002 (FIG. 25B).

Next, the electrode of the optical element 1001 is aligned with the gold film 502a on the protruding conductor post 501 in the receptor structure formed on the optical element mounting component (G4) 1003, and the electrode of the optical element 1001 is Ultrasonic bonding is performed while applying a weight so as to be pressed against the gold film 502a of the protruding conductor post 501 in the receptor structure to obtain an optical element mounting component (G4) 1003 on which an optical element is mounted (FIG. 25 (c). )).
The weighting and ultrasonic bonding conditions at this time are the same as in the first aspect. Further, the gold film 502a of the protruding conductor post 501 in the receptor structure may be formed on the electrode of the optical element 1001.

  In the above description, the method of mounting the optical element after forming the optical element mounting component (G4) 1003 by metal-bonding the optical circuit board and the electrode of the electric circuit board has been described. The optical circuit board, the electric circuit board, and the optical element may be aligned at the same time, and metal bonding may be performed collectively by ultrasonic bonding.

In addition, in the case of having an adhesive layer on the joint surface between the optical circuit board and the wiring component,
First, an optical circuit board (G4) 505 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on a pad portion (conductive member) for mounting an optical element are prepared. (G4) The metal joint (gold film 502b) with the wiring component on the conductor post (conductive member) 501 in the receptor structure formed in 503 is aligned with the gold film 605 on the pad, and superimposed. Thus, an optical element mounting component (G4) 1002 ′ is obtained (FIG. 25D).
At this time, the optical circuit board (G4) 505 with the adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer by the same method as the bonding method in the first aspect. A component mounting component (G4) 1002 ′ can be manufactured.

Next, the electrode of the optical element 1001 is aligned with the gold film 502a on the protruding conductor post 501 in the receptor structure formed on the optical circuit board 503 in the optical element mounting component (G4) 1002 ′, so Ultrasonic bonding is performed while applying a weight so that the electrode of the element 1001 is pressed against the gold film 502a of the protruding conductor post 501 in the receptor structure, and the electrode of the optical element 1001 and the conductor post 501 (gold film 502a) Are optically bonded to obtain an optical element mounting component (G4) 1003 ′ on which an optical element is mounted (FIG. 25E).
The ultrasonic bonding method at this time is the same as in the first aspect. Further, the gold film 502a of the protruding conductor post 501 in the receptor structure may be formed on the electrode of the optical element 1001.

  In the above, when solder or the like is used for the protruding conductor post 501 in the receptor structure formed on the optical circuit board 503 in the optical element mounting component (G4) 1002 ′ (however, the gold film 502a is not provided), first. The optical circuit board (G4) 505 with the adhesive layer and the wiring component 601 ′ are subjected to temporary pressure bonding with the adhesive layer by the same method as the temporary pressure bonding method in the adhesive layer, so that an optical element mounting component ( G4) 1002 ′ can be manufactured. Next, the electrode of the optical element 1001 is positioned and mounted on the protruding conductor post 501 in the receptor structure, and the optical circuit board (G4) 503 and the wiring component 601 are operated by the same operation as the bonding method in the first aspect. And bonding the metal joint (gold film 502b) with the wiring component on the conductor post (conductive member) 501 and the optical element mounting portion pad portion of the wiring component 601 ′, The electrode of the optical element 1001 and the conductor post 501 are metal-bonded to obtain an optical element mounting component (G4) 1003 ′ on which the optical element is mounted.

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G4) 503, and the optical element 1001 are The electrodes of the optical element 1001 and the conductor post 501 (gold film 502a) are metal-bonded in the same manner as described above, and the optical circuit board (G4) 503, the wiring component 601 ′, and the like. Are bonded together, and a metal joint (gold film 502b) with a wiring component on the conductor post (conductive member) 501 is metal-bonded with an optical element mounting portion pad of the wiring component 601 ′ to mount an optical element. In addition, an optical element mounting component (G4) 1003 ′ can be obtained. Moreover, you may use wiring components with an adhesive layer.

Next, an eighth aspect will be described.
Aside from the seventh aspect, an aspect in which an optical element that does not have a metal protrusion on an electrode (conductive member) can be used will be described.
In this case, as a first example, in the manufacturing process of the optical element mounting component (G3) 903 ′, instead of the optical circuit board with adhesive layer (G3) 407, the optical circuit board with adhesive obtained above ( G3 ″) 410 is used to bond the optical circuit board with adhesive (G3 ″) 410 and the wiring component 601 ′ to the adhesive layer by the same method as the bonding method in the first mode (main pressure bonding). Thus, an optical element mounting component (G3 ″) 1004 can be manufactured (FIG. 26A).
As a second example, the optical circuit mounting component (G3) 903 ′ obtained above is used as a conductor portion on the conductor post 402 in the receptor structure formed on the optical circuit board 405, and the optical circuit A stud bump 408 is formed in the receptor structure so as to protrude from the optical element mounting surface of the substrate 405, and an optical element mounting component (G3 ″) 1004 can be manufactured (FIG. 26A).

  Next, the electrode of the optical element 1001 similar to the seventh aspect is aligned with the protruding stud bump 408 in the receptor structure formed on the optical circuit board 409 in the optical element mounting component (G3 ″) 1004. Ultrasonic bonding is performed in the same manner as described above while applying a weight so that the electrode of the optical element 1001 is pressed against the stud bump 408, and the electrode of the optical element 1001 and the stud bump 408 are metal-bonded. The mounted optical element mounting component (G3 ″) 1005 is obtained (FIG. 26C).

Next, a ninth aspect will be described.
In the ninth aspect, similarly to the second aspect, the optical circuit board has a conductor circuit on the optical element mounting surface, penetrates the optical circuit board, and electrical conduction between the conductor circuit and the wiring component is achieved. Can be measured.
As the optical element used in this case, the same optical element as that used in the seventh embodiment, which does not have a metal protrusion (bump) (conductive member) on the electrode of the optical element, can be used.

Next, an example of a manufacturing method according to the ninth aspect will be described.
First, an optical circuit board (G4 ′) 1202 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on an optical element mounting portion pad portion (conductive member) are prepared, and an optical circuit base is prepared. The metal joint (gold film 502b ′) with the wiring component on the conductor post (conductive member) 501 ′ in the receptor structure formed on the substrate (G2) 305 is aligned with the gold film 605 on the pad. Then, an optical element mounting component (G4 ′) 1203 is obtained by superimposing (FIG. 27B). At this time, the optical circuit board (G4 ′) 1202 with an adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer in the same manner as described above.

Next, the electrode of the optical element 1001 and the gold film 502a ′ on the protruding conductor post 501 ′ in the receptor structure formed on the optical circuit base substrate (G2) 305 in the optical element mounting component (G4 ′) 1203 are applied. Alignment is performed and ultrasonic bonding is performed while applying a weight so that the electrode of the optical element 1001 is pressed against the gold film 502a ′ of the protruding conductor post 501 ′ in the receptor structure. The post 501 ′ (gold film 502a ′) is metal-bonded to obtain an optical element mounting component (G4 ′) 1204 (FIG. 27C) on which the optical element is mounted.
The bonding method and ultrasonic bonding method at this time are the same as in the first embodiment. Further, the gold film 502a ′ of the protruding conductor post 501 ′ in the receptor structure may be formed on the electrode of the optical element 1001.

  Furthermore, in the above aspect, the structure for mounting the optical element on the optical element mounting component composed of the optical circuit board and the wiring component and the manufacturing method thereof have been described. The receptor structure is also formed at the other end with respect to the part, for example, the end where the receptor structure is formed, to form a wiring component and an optical element mounting component, and the optical circuit board is bridged Thus, an optical element can be mounted. In this case, the receptor structures and the wiring components formed at both ends of the optical circuit board may be different structures.

  The optical element mounting component thus obtained will be described with reference to FIG. 29. For example, in the case of the optical element mounting component (G1), in the receptor structure formed at one end of the optical circuit board (G1) 106, wiring is performed. An optical element 701 ′ having a light emitting portion is mounted on the optical element mounting portion of the component 601 ′, and in the receptor structure formed at the other end with the optical circuit board (G 1) 106 as a bridge, the light of the wiring component 601 ′ A device in which an optical element 701 ″ having a light receiving portion is mounted on the element mounting portion can be mentioned. In other embodiments, similarly, a bridged structure can be mentioned. Further, an electronic component may be mounted on the wiring component 601 '.

  Furthermore, in the above aspect, the optical element can be mounted on both surfaces of the wiring component via the optical circuit board.

  Further, in the optical element mounting component of the present invention, an optical connection component having an optical path connection portion such as a multi-fiber optical connector at the other end portion of the optical circuit substrate with respect to the end portion where the receptor structure of the optical circuit substrate is formed. Can be used for optical connection.

  Examples of the multi-fiber optical connector include a multi-dimensional array in which a plurality of optical fiber holes are formed. For example, as described above, the array of optical fiber holes is 8 cores × 2 stages, 12 cores. X 2 stages, 12 cores x 5 stages, 16 cores x 5 stages, etc. are mentioned.

  As such an example, the optical circuit board 112 having the staggered structure end portion 113 is disposed so as to face the optical path changing portion of the core portion 115 and the optical fiber hole 114 of the multi-fiber optical connector 111, In accordance with the connector fixing guide 116, a fixing cover (not shown) is fixed to produce an optical wiring component (FIG. 31), and this is a wiring component in which an optical element is directly mounted on the same wiring component. Can be manufactured in advance and optically connected to the light receiving / emitting part of the optical element to obtain an optical element mounting component.

FIG. 31 shows an example in which an optical path conversion section 119 is provided at the end of the core section 115 of the optical waveguide layer of the optical circuit board 112 having the staggered structure end, and the optical path conversion section 119 and the optical fiber holes 114 This is an example in which
At this time, by using the optical circuit board (FIG. 38) provided with the alignment hole 124 opposed to the fixing guide, the alignment is achieved by inserting the guide pin into the alignment hole 124 and the fixing guide. Thus, the alignment hole and the fixing guide can be easily fitted, and the optical path conversion portion of the optical circuit board and the optical fiber hole can be passively fitted accurately and passively.
In addition, as the fixing cover, a flat plate, a connector ferrule, or the like having an alignment hole or a guide pin at a position facing the alignment hole can be used.

The optical wiring component assembled as described above can have a structure in which the optical fiber 120 is inserted into the optical fiber hole 114 and the optical path of the optical waveguide and the optical fiber are optically connected (FIG. 33). The optical wiring component is disposed at a predetermined position on the wiring component, and the other end portion of the optical fiber is disposed so as to match the light receiving / emitting portion of the optical element on the wiring component to obtain an optical element mounting component. be able to.
In the above example (FIG. 33), the example in which the optical path changing unit 119 and the optical fiber 120 are optically connected by the optical fiber hole 114 is shown. However, the optical fiber 120 is further inserted using the optical fiber hole 114 as a guide, The optical path converter 119 and the optical fiber 120 can be directly optically connected (FIG. 36). This makes it possible to efficiently join an optical fiber and a waveguide with little optical loss, and further reduce the space by the staggered structure. In these cases, alignment is facilitated by providing the alignment holes 124.

  Further, the optical wiring component can be directly connected to an optical element such as a light emitting element and a light receiving element without using an optical fiber. For example, the optical fiber 120 is not inserted into the optical fiber hole 114. In the optical fiber hole 114, an optical element mounting component can be obtained as a structure (FIG. 34) in which the optical element 121 on the wiring component is arranged on the side opposite to the side where the optical path changing portion 119 is provided. At this time, the optical path of the optical waveguide is arranged to be transmitted to the light receiving / emitting unit 122 of the optical element through the optical fiber hole 114.

  Further, the optical wiring component may be such that the optical path of the core part is directly optically connected to the light receiving / emitting part of the optical element from the optical path converting part. As optical elements formed in a plurality of stages, two optical elements 121 in which the light receiving / emitting portions 122 are arranged in one stage are arranged on a substrate 125 such as an electric circuit board (or two or more optical elements 121 may be provided). The light receiving / emitting unit 122 may have a structure in which the optical path changing unit 119 of the optical circuit board 112 is disposed (FIG. 37). FIG. 37 shows an example in which a fixing cover 126 provided with an alignment hole is placed on top of the optical circuit board, and the optical circuit board is sandwiched and fixed. In these cases, alignment is facilitated by providing the alignment holes 124.

  As these specific examples, one end of the optical circuit board uses an optical element mounting component optically connected to any one of the optical wiring components using the multi-fiber optical connector 123, and the other end has the receptor structure portion. In order to make an optical connection with the side provided with the optical circuit board, a branching portion 118 is provided on the optical circuit board having the curved portion 117, and the optical element mounting component provided with the plurality of receptor structure portions is connected. (FIG. 32).

Hereinafter, specific examples of the present invention will be described.
In the following, hexyl norbornene (CAS number 22094-83-3) is “HxNB”, diphenylmethylnorbornene methoxysilane (CAS number 376634-34-3) is “diPhNB”, phenylethyl norbornene ( CAS number 29415-09-6) is “PENB”, butylnorbornene (CAS number 22094-81-1) is “BuNB”, and decylnorbornene (CAS number 22094-85-5) is “ DeNB ", benzylnorbornene (CAS number 2665989-73-9)" BzNB ", methylglycidyl ether norbornene (CAS number 3188-75-8)" AGENB ", norbornenylethyltrimethoxy Silane (CAS No. 68245-19- No.) "TMSENB", triethoxysilyl norbornene (CAS number 18401-43-9) "TESNB", trimethoxysilyl norbornene (CAS number 7538-46-7) "TMSNB", Dimethylbis (norbornenemethoxy) silane (CAS No. 376609-87-9) is replaced with “SiX” and 1,1,3,3-tetramethyl-1,3-bis [2- (5-norbornene-2- Yl) ethyl] disiloxane (CAS No. 198570-39-7) may be abbreviated as “Si ₂ X”, respectively.

1. Synthesis of Polymer and Preparation of Polymer Solution As shown below, each polymer P1-5 was synthesized and the solution was prepared.
<< Polymer P1: Synthesis of Butyl Norbornene (BuNB) / Methyl Glycidyl Ether Norbornene (AGENB) Copolymer and Preparation of Polymer P1 Solution >>

  BuNB (10.52 g, 0.07 mol), AGENB (5.41 g, 0.03 mol), and toluene (58.0 g) are mixed in a sealum bottle and heated to 80 ° C. in an oil bath to obtain a mixed solution. Got.

Next, a toluene solution (5 g) of (η ⁶ -toluene) Ni (C ₆ F ₅ ) ₂ (0.69 g, 0.0014 mol) was added to this solution.

  After the addition, the resulting solution was maintained at room temperature for 4 hours. Next, a toluene solution (87.0 g) was added to the reaction solution, and methanol was added dropwise to the vigorously stirred reaction mixture to precipitate a copolymer.

  The precipitated copolymer was collected by filtration and dried in a vacuum atmosphere in an oven at 60 ° C. The weight after drying was 12.74 g (yield: 80%).

  When the molecular weight of the copolymer obtained above was measured by GPC method (gel permeation chromatography method) with a THF solvent (in terms of polystyrene), it was Mw = 320,000 and Mn = 130,000.

The copolymer composition was determined by ¹ H-NMR to be 78/22 = BuNB / AGENB copolymer.

  When the refractive index of the copolymer was measured by the prism coupling method, it was 1.5162 in the TE mode and 1.5157 in the TM mode at a wavelength of 633 nm.

  And the dried copolymer was melt | dissolved in toluene, and it was set as the 30 wt% polymer P1 solution.

<< Polymer P2: Synthesis of Hexyl Norbornene (HxNB) / Methyl Glycidyl Ether Norbornene (AGENB) Copolymer and Preparation of Polymer P2 Solution >>

  HxNB (12.48 g, 0.07 mol), AGENB (5.41 g, 0.03 mol), and toluene (58.0 g) were added to the sealum bottle in the dry box and the solution was added to an 80 ° C. oil bath. Stir in.

Next, a toluene solution (5 g) of (η ⁶ -toluene) Ni (C ₆ F ₅ ) ₂ (0.69 g, 0.0014 mol) was added to this solution.

  After the addition, the resulting mixture was maintained at room temperature for 4 hours. Next, a toluene solution (87.0 g) was added to the reaction solution, and methanol was added dropwise to the vigorously stirred reaction mixture to precipitate a copolymer.

  The precipitated copolymer was collected by filtration and dried in an oven at 60 ° C. under vacuum. The weight after drying was 13.78 g (yield: 77%).

  When the molecular weight of the copolymer obtained above was measured by the GPC method with a THF solvent (polystyrene conversion), Mw = 150,000 and Mn = 76,000.

The copolymer composition was determined by ¹ H-NMR to be 79/21 = HxNB / AGENB copolymer.

  When the refractive index of the copolymer was measured by the prism coupling method, it was 1.5159 in the TE mode and 1.5153 in the TM mode at a wavelength of 633 nm.

  And the dried copolymer was melt | dissolved in toluene, and it was set as the 30 wt% polymer P2 solution.

<< Polymer P3: Synthesis of Decyl Norbornene (DeNB) / Methyl Glycidyl Ether Norbornene (AGENB) Copolymer and Preparation of Polymer P3 Solution >>

  DeNB (16.4 g, 0.07 mol), AGENB (5.41 g, 0.03 mol), and toluene (58.0 g) were added to the sealum bottle in the dry box, and this solution was added to an 80 ° C. oil bath. Stir in.

Next, a toluene solution (5 g) of (η ⁶ -toluene) Ni (C ₆ F ₅ ) ₂ (0.69 g, 0.0014 mol) was added to this solution.

  After the addition, the resulting mixture was maintained at room temperature for 4 hours. Next, a toluene solution (87.0 g) was added to the reaction solution, and methanol was added dropwise to the vigorously stirred reaction mixture to precipitate a copolymer.

  The precipitated copolymer was collected by filtration and dried in a vacuum atmosphere in an oven at 60 ° C. The weight after drying was 17.00 g (yield: 87%).

  When the molecular weight of the copolymer obtained above was measured by a GPC method using a THF solvent (polystyrene conversion), it was Mw = 45,000 and Mn = 26,000.

The composition of the copolymer was measured by ¹ H-NMR and found to be 77/23 = DeNB / AGENB copolymer.

  When the refractive index of the copolymer was measured by the prism coupling method, it was 1.5153 in the TE mode and 1.5151 in the TM mode at a wavelength of 633 nm.

  And the dried copolymer was melt | dissolved in toluene, and it was set as the 30 wt% polymer P3 solution.

<< Polymer P4: Synthesis of Hexyl Norbornene (HxNB) / Diphenylmethyl Norbornene Methoxysilane (diPhNB) Copolymer and Preparation of Polymer P4 Solution >>

  HxNB (8.94 g, 0.050 mol), diPhNB (16.1 g, 0.050 mol), 1-hexene (2.95 g, 0.035 mol), and toluene (142 g) were weighed into a 250 mL sealam bottle. And heated to 80 ° C. in an oil bath to obtain a mixed solution.

Next, [Pd (PCy ₃ ) ₂ (O ₂ CCH ₃ ) (NCCH ₃ )] tetrakis (pentafluorophenyl) borate (hereinafter abbreviated as “Pd1446”) (5.8 × 10 ⁻³ g) was added to this solution. , 4.0 × 10 ⁻⁶ mol) and N, N-dimethylanilinium tetrakis (pentafluorophenyl) borate (hereinafter abbreviated as “DANFABA”) (3.2 × 10 ⁻³ g, 4. 0 × 10 ⁻⁶ mol) was added.

  At this time, the ratio of norbornene monomer / Pd1446 / DANFABA was 25000/1/1 in molar ratio.

  The mixture was maintained at 80 ° C. for 7 hours, after which 20 mL of acetonitrile was added to quench the activity of the Pd catalyst. Thereafter, when methanol was added dropwise to the reaction mixture, the copolymer was precipitated.

  The precipitated copolymer was collected by filtration and dried in a vacuum atmosphere in an oven at 60 ° C. The weight after drying was 19.8 g (yield: 79%).

  When the molecular weight of the copolymer obtained above was measured by the GPC method with a THF solvent (polystyrene conversion), it was Mw = 86,000 and Mn = 21,000.

The composition of the copolymer ^was determined by 1 H-NMR, was 46/54 = HxNB / diPhNB copolymer.

  When the refractive index of the copolymer was measured by the prism coupling method, it was 1.5569 in the TE mode and 1.5556 in the TM mode at a wavelength of 633 nm.

  And the dried copolymer was melt | dissolved in toluene, and it was set as the 30 wt% polymer P4 solution.

<< Polymer P5: Synthesis of Butylnorbornene (BuNB) / Phenylethylnorbornene (PENB) Copolymer and Preparation of Polymer P5 Solution >>

  BuNB (4.78 g, 0.032 mol), PENB (25.22 g, 0.127 mol), 1-hexene (13.36 g, 0.16 mol), and toluene (170.0 g) were added to a 500 mL sealam bottle. And heated to 80 ° C. in an oil bath to obtain a mixed solution.

To this solution was then added Pd1446 (0.0092 g, 6.36 × 10 ⁻⁶ mol) and DANFABA (0.020 g, 2.54 × 10 ⁻⁵ mol), each in the form of a concentrated dichloromethane solution. It was.

  After the addition, the resulting solution was maintained at 80 ° C. for 50 minutes. Next, when methanol was added dropwise to the vigorously stirred mixture, a copolymer was precipitated.

  The precipitated copolymer was collected by filtration and dried in a vacuum atmosphere in an oven at 60 ° C. The weight after drying was 23.60 g (yield: 79%).

  When the molecular weight of the copolymer obtained above was measured by a GPC method using a THF solvent (polystyrene conversion), it was Mw = 73,000 and Mn = 28,000.

The composition of the copolymer was measured by ¹ H-NMR and found to be 15/85 = BuNB / PENB copolymer.

  When the refractive index of the copolymer was measured by the prism coupling method, it was 1.5684 in the TE mode and 1.5657 in the TM mode at a wavelength of 633 nm.

And the dried copolymer was melt | dissolved in toluene, and it was set as the 30 wt% polymer P5 solution.
Each polymer synthesized above is summarized in Table 1 below.

2. Synthesis of norbornene monomer << bis (norbornenemethyl) acetal (NM ₂ X) >>

  In a flask directly connected to the Dean-Stark trap, norbornenemethanol (100 g, 0.81 mol), formaldehyde (-37%) (32.6 g, 0.40 mol), and a suitable amount of p-toluenesulfonic acid (0 .2g) was fed to obtain a mixture.

  The mixture was then heated at 100 ° C. As the reaction progressed, the amount of water in the trap increased. Within about 3 hours, the reaction was complete and the pure product was obtained by vacuum distillation (72.8% -70% yield).

3. Preparation of varnish Each varnish V1-4 and V51-65 were prepared as follows.

<< Preparation of Varnish V1 >>
HxNB (42.03 g, 0.24 mol) and SiX (7.97 g, 0.026 mol) were weighed and placed in a glass bottle.

  CIR, IRGANOX 1076 (0.5 g) as a phenolic antioxidant, and Ciba, IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant are added to the monomer solution. An antioxidant solution was obtained.

To the polymer P4 solution (30.0 g), a monomer antioxidant solution (3.0 g) and a catalyst precursor, Pd (OAc) ₂ (PCy ₃ ) ₂ (4.93 × 10 ⁻⁴ g, 6. 28 × 10 ⁻⁷ mol, in 0.1 mL of methylene chloride) and a photoacid generator (co-catalyst) manufactured by Rhodia, RHODROSIL PHOTOINITIATOR 2074 (2.55 × 10 ⁻³ g, 2.51 × 10 ^{− 6} mol, in 0.1 mL of methylene chloride) was added to obtain varnish V1.
This varnish V1 was used after being filtered with a 0.2 μm pore filter.

  In the following, “Ciba, IRGANOX 1076” is “IRGANOX 1076”, “Ciba, IRGAFOS 168” is “IRGAFOS 168”, “Rhodia, RHODORSIL PHOTOINITIATOR 2074” is “RHODORSIL 2074”. Abbreviated.

<< Preparation of Varnish V2 >>
HxNB (16.64 g, 0.093 mol) and SiX (33.36 g, 0.110 mol) were weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (0.5 g) as a phenolic antioxidant and IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

To the polymer P5 solution (30.0 g), a monomer antioxidant solution (2.16 g) and a catalyst precursor, Pd (OAc) ₂ (PCy ₃ ) ₂ (1.47 × 10 ⁻³ g, 1. 88 × 10 ⁻⁶ mol, in 0.1 mL of methylene chloride), and RHODORSIL 2074 (7.67 × 10 ⁻³ g, 7.54 × 10 ⁻⁶ mol, methylene chloride) as a photoacid generator (promoter) In 0.1 mL) was added to obtain varnish V2.
This varnish V2 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V3 >>
Into the above polymer P4 (5 g), mesitylene (20 g), IRGANOX 1076 (0.05 g) as a phenolic antioxidant, IRGAFOS 168 (0.0125 g) as an organic phosphorus antioxidant, and photoacid generation As an agent (release agent), RHODORSIL 2074 (4.0 × 10 ⁻³ g, in 0.1 mL of methylene chloride) was added to prepare varnish V3.
This varnish V3 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V4 >>
2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl (6.4 g, 0.02 mol), 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride ( 4.44 g, 0.01 mol) and pyromellitic dianhydride (2.18 g, 0.01 mol) were dissolved in dimethylacetamide (86.6 g) and stirred at room temperature for 2 days in a nitrogen atmosphere. The polyimide resin precursor varnish V4 was obtained.
This varnish V4 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V51 >>
To the above polymer P2 solution (30.0 g), TMSENB (0.45 g), as a phenolic antioxidant, IRGAOX 1076 (0.09 g), as an organophosphorus antioxidant, IRGAFOS 168 (0.023 g), And TAG-372R (0.05g) by Toyo Ink Manufacturing Co., Ltd. was added as a photo-acid generator, and it melted and mixed by stirring for 2 hours using the magnetic stirrer, and obtained varnish V51.
This varnish V51 was used after being filtered with a 0.2 μm pore filter.

  Hereinafter, “TAG-372R manufactured by Toyo Ink Manufacturing Co., Ltd.” is abbreviated as “TAG-372R”.

<< Preparation of Varnish V52 >>
To the above polymer P2 solution (30.0 g), TENSB (0.9 g), as a phenolic antioxidant, IRGAOX 1076 (0.09 g), as an organic phosphorus antioxidant, IRGAFOS 168 (0.023 g), RHODORSIL 2074 (0.09 g) was added as a photoacid generator and dissolved and mixed by stirring for 2 hours using a magnetic stirrer to obtain varnish V52.
This varnish V52 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V53 >>
In the above polymer P2 solution (30.0 g), TMSNB (0.3 g), as a phenolic antioxidant, IRGAOX 1076 (0.09 g), as an organic phosphorus antioxidant, IRGAFOS 168 (0.023 g), And TAG-372R (0.36g) was added as a photo-acid generator, and it melted and mixed by stirring for 2 hours using the magnetic stirrer, and obtained varnish V53.
This varnish V53 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V54 >>
In the above polymer P2 solution (30.0 g), 3-glycidoxypropyltrimethoxysilane (GPTMS) (0.2 g), phenolic antioxidant as IRGANOX 1076 (0.09 g), organophosphorus antioxidant IRGAFOS 168 (0.023 g) as an agent and TAG-372R (0.02 g) as a photoacid generator were added and dissolved and mixed by stirring for 2 hours using a magnetic stirrer to obtain varnish V54. .
This varnish V54 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V55 >>
To the above polymer P2 solution (30.0 g), epoxy silicone (“X-22-169AS: number average molecular weight 1000” manufactured by Shin-Etsu Chemical Co., Ltd.) (0.45 g), IRGANOX 1076 ( 0.09 g), IRGAFOS 168 (0.023 g) as an organophosphorus antioxidant, and TAG-372R (0.18 g) as a photoacid generator, and stirring for 2 hours using a magnetic stirrer To obtain varnish V55.
This varnish V55 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V56 >>
In the above polymer P3 solution (16.7 g), IRGANOX 1076 (0.05 g) as a phenol-based antioxidant, IRGAFOS 168 (1.25 × 10 ⁻² g) as an organic phosphorus-based antioxidant, and RHODORSIL 2074 (0.1 g) was added as a photoacid generator, and dissolved and mixed by stirring for 2 hours using a magnetic stirrer to obtain varnish V56.
The varnish V56 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V57 >>
In the above polymer P3 solution (16.7 g), IRGANOX 1076 (0.05 g) as a phenol-based antioxidant, IRGAFOS 168 (1.25 × 10 ⁻² g) as an organic phosphorus-based antioxidant, and TAG-372R (0.1 g) was added as a photoacid generator, and dissolved and mixed by stirring for 2 hours using a magnetic stirrer to obtain varnish V57.
This varnish V57 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V58 >>
IRGANOX 1076 (0.05 g) as a phenolic antioxidant and IRGAFOS 168 (1.25 × 10 ⁻² g) as an organic phosphorus antioxidant to the polymer P3 solution (16.7 g). In addition, the mixture was dissolved and mixed by stirring for 2 hours using a magnetic stirrer to obtain varnish V58.
This varnish V58 was used after being filtered through a filter having a pore size of 0.2 μm.

<< Preparation of Varnish V59 >>
Dissolve 5 g of 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl and 10 g of 2,2′-bis (3,4-dicarboxyphenyl) hexafluoropropane in 85 g of dimethylacetamide. Thus, varnish V59 was obtained.
This varnish V59 was used after being filtered with a 0.2 μm pore filter.

<< Preparation of Varnish V60 >>
TMSENB (0.32 g, 1.50 mmol) and SiX (0.16 g, 0.525 mmol) were weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (0.5 g) as a phenolic antioxidant and IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

To the above polymer P3 solution (6.7 g), as a monomer antioxidant solution (total amount), and [2-methyllyl Pd (PCy3) 2] tetrakis (pentafluorophenyl) borate (Pd1401) (9 .37 × 10 ⁻⁴ g, 6.69 × 10 ⁻⁷ mol, in 0.1 mL of methylene chloride) was added to obtain varnish V60.
This varnish V60 was used after being filtered with a 0.2 μm pore filter.

  And this varnish V60 was apply | coated to the application | coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 50 degreeC for 15 minutes, and formed the film.

  Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 200 ° C. according to the DMA measurement result was 73 MPa.

  In addition, the measurement of the glass transition temperature (Tg) of a film was performed by tensile mode (temperature rising rate of 5 degree-C / min) using TMA (TMA / SS120C by Seiko Instruments Inc.) (hereinafter the same). ).

  Moreover, the storage elastic modulus of the film was measured using a dynamic viscoelasticity measuring apparatus (EXSTAR6000 manufactured by Seiko Instruments Inc.) (the same applies hereinafter).

<< Preparation of Varnish V61 >>
HxNB (0.16 g, 0.897 mmol) and SiX (0.32 g, 1.05 mmol) were weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (0.5 g) as a phenolic antioxidant and IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

In the above polymer P2 solution (6.7 g), monomer antioxidant solution (total amount), and Pd1446 (6.0 × 10 ⁻⁴ g, 4.15 × 10 ⁻⁷ mol, methylene chloride) as a catalyst precursor In 0.1 mL) was added to obtain varnish V61.
This varnish V61 was used after being filtered with a 0.2 μm pore filter.

  And this varnish V61 was apply | coated to the application | coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 80 degreeC for 20 minutes, and 150 degreeC for 1 hour, and formed the film.

  Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 250 ° C. according to the DMA measurement result was 80 MPa.

<< Preparation of Varnish V62 >>
SiX (4.8 g, 0.0158 mol) was weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (5 g) as a phenol-based antioxidant and IRGAFOS 168 (1.25 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

To the polymer P1 solution (30.0 g), as a monomer antioxidant solution (total amount) and [Pd (PCy3) 2H (NCCH3)] tetrakis (pentafluorophenyl) borate (Pd1147) (3 .62 × 10 ⁻³ g, 3.15 × 10 ⁻⁶ mol, in 0.1 mL of methylene chloride) was added to obtain varnish V62.
This varnish V62 was used after being filtered with a 0.2 μm pore filter.

  And this varnish V62 was apply | coated to the coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 80 degreeC for 20 minutes, and 150 degreeC for 1 hour, and formed the film.

  Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 250 ° C. according to the DMA measurement result was 67 MPa.

<< Preparation of Varnish V63 >>
TESNB (1.0 g, 0.039 mol) was weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (5 g) as a phenol-based antioxidant and IRGAFOS 168 (1.25 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

To the above polymer P2 solution (30.0 g), monomer antioxidant solution (total amount), and [Pd (P (iPr) 3) 2 (OCOCH3) (NCCH3)] tetrakis (pentafluorophenyl) as a catalyst precursor ) Borate (Pd1206) (4.07 × 10 ⁻⁴ g, 3.90 × 10 ⁻⁷ mol, in 0.1 mL of methylene chloride) was added to obtain varnish V63.
This varnish V63 was used after being filtered with a filter having a pore size of 0.2 μm.

  And this varnish V63 was apply | coated to the coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 80 degreeC for 20 minutes, and 150 degreeC for 1 hour, and formed the film.

  Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 250 ° C. according to the DMA measurement result was 70 MPa.

<< Preparation of Varnish V64 >>
Si ₂ X (2.16 g, 4.67 mmol) was weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (0.5 g) as a phenolic antioxidant and IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

In the polymer P3 solution (30.0 g), monomer antioxidant solution (total amount), and Pd1446 (3.22 × 10 ⁻³ g, 2.23 × 10 ⁻⁶ mol, methylene chloride) as a catalyst precursor Varnish V64 was obtained.
This varnish V64 was used after being filtered with a 0.2 μm pore filter.

  And this varnish V64 was apply | coated to the application | coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 80 degreeC for 20 minutes, and 150 degreeC for 1 hour, and formed the film.

  Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 200 ° C. according to the DMA measurement result was 82 MPa.

<< Preparation of Varnish V65 >>
Bis (norbornenemethyl) acetal (NM ₂ X) (3.00 g, 0.104 mol) was weighed and placed in a glass bottle.

  To this monomer solution, IRGANOX 1076 (0.5 g) as a phenolic antioxidant and IRGAFOS 168 (0.125 g) as an organophosphorus antioxidant were added to obtain a monomer antioxidant solution.

In the polymer P3 solution (30.0 g), monomer antioxidant solution (total amount), and Pd1446 (3.33 × 10 ⁻³ g, 2.30 × 10 ⁻⁶ mol, methylene chloride) as a catalyst precursor In 0.1 mL) was added to obtain varnish V65.
This varnish V65 was used after being filtered with a 0.2 μm pore filter.

  And this varnish V65 was apply | coated to the application | coating thickness of 70 micrometers with the doctor blade on the glass substrate, this was set | placed on the hotplate, and it heated at 80 degreeC for 20 minutes, and 150 degreeC for 1 hour, and formed the film.

Using this film, the glass transition temperature and the storage elastic modulus were measured. Table 3 shows the measurement results of the glass transition temperature. The storage elastic modulus at 250 ° C. according to the DMA measurement result was 120 MPa.
The compositions of the varnishes prepared above are summarized in Tables 2 and 3 below.

4). Production and Evaluation of Optical Waveguide Structure 4-1. Fabrication of optical waveguide structure

  As shown below, ten optical waveguide structures of Examples 1 to 14 and Comparative Example were produced.

(Example 1)
First, varnish V51 as a cladding layer forming material was poured onto a 4-inch thick glass substrate and spread to a substantially constant thickness with a doctor blade.

Next, this was placed on a hot plate and heated at 50 ° C. for 15 minutes, and this was irradiated with UV light using an ultrahigh pressure mercury lamp without a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm).

  Subsequently, the lower clad layer was formed by curing using a clean oven at 100 ° C. for 15 minutes and further at 160 ° C. for 1 hour.

  Next, varnish V1 as a core layer forming material was poured onto the surface of the cured lower clad layer and spread to a substantially constant thickness with a doctor blade.

  This was then placed on a hot plate and heated at 45 ° C. for 10 minutes to evaporate the solvent and form a substantially dry solid film.

The film was irradiated with UV light through a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm) and then heated on a hot plate at 45 ° C. for 30 minutes, and a linear core pattern appeared.

  The obtained sample was heated in a clean oven at 85 ° C. for 30 minutes and further at 150 ° C. for 60 minutes to obtain a patterned varnish V1 cured layer (core layer).

  Next, the upper clad layer is formed on the core layer in the same manner as the lower clad layer using varnish V51 as a clad layer forming material, and a linear shape having a width of 0.5 cm and a length of 10 cm is formed on the glass substrate. An optical waveguide was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 50 μm (the width of the core part: 50 μm), and the average thickness of the clad layers (upper and lower parts) was 50 μm.

  Next, this optical waveguide was peeled off from the substrate, and a copper layer (conductor layer) having an average thickness of 45 μm was bonded to each of the both surfaces by a roll laminating method to produce an optical waveguide structure.

(Example 2)
First, varnish V52 as a cladding layer forming material was poured onto a silicon wafer substrate and spread to a substantially constant thickness with a doctor blade.

Next, this was placed on a hot plate and heated at 50 ° C. for 15 minutes, and this was irradiated with UV light using an ultrahigh pressure mercury lamp without a photomask (irradiation amount: 1500 mJ / cm ² , wavelength: 365 nm).

  Then, it further heated at 150 degreeC for 1 hour using clean oven, and created the lower clad layer.

  Next, a varnish V4 of a polyimide precursor is applied as a core layer forming material on the lower clad layer with a bar coater, and heated at 320 ° C. for 1 hour in a nitrogen atmosphere using an oven. did.

  Next, an aluminum layer having a thickness of 0.3 μm was vapor-deposited on the core layer to form a mask layer. Further, a positive photoresist (diazonaphthoquinone-novolak resin system, manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name OFPR-800) was applied on the aluminum layer by spin coating, and prebaked at about 95 ° C.

  Next, a photomask (Ti) for forming a linear optical waveguide pattern is arranged, irradiated with ultraviolet rays using an ultrahigh pressure mercury lamp, and then developed as a positive resist developer (TMAH: tetramethylammonium hydroxide aqueous solution, Tokyo, Japan). Development was performed using a product name of NMD-3).

  Thereafter, post-baking was performed at 135 ° C. Next, the aluminum layer was wet etched to transfer the resist pattern to the aluminum layer.

  Further, the core layer was processed by dry etching using the patterned aluminum layer as a mask.

Next, the linear core part was formed by removing an aluminum layer with an etching liquid.
The core part had a width of 50 μm and a height (average thickness) of 50 μm.

  Next, varnish V52 is poured as a clad layer forming material from above the obtained core part, and an upper clad layer is prepared in the same manner as the lower clad layer. A linear optical waveguide having a length of 10 cm was obtained.

  In the obtained optical waveguide, the average thickness of the cladding layers (upper and lower parts) was 50 μm.

  Next, this optical waveguide was peeled off from the substrate, and a copper layer (conductor layer) having an average thickness of 45 μm was bonded to each of the both surfaces by a roll laminating method to produce an optical waveguide structure.

(Example 3)
First, varnish V53 as a cladding layer forming material was poured onto a glass substrate that had been subjected to a mold release treatment, and spread to a substantially constant thickness with a doctor blade.

Next, this was placed on a hot plate and heated at 50 ° C. for 15 minutes, and this was irradiated with UV light using an ultrahigh pressure mercury lamp without a photomask (irradiation amount: 2500 mJ / cm ² , wavelength: 365 nm).

  Then, it further heated at 150 degreeC for 1 hour using clean oven, and created the lower clad layer.

On top of that, as a core layer forming material, a UV curable epoxy resin (E3135 manufactured by NTT-AT) having a higher refractive index than that of the cladding layer forming material was spin-coated, and then by photolithography using a photomask, The linear core part was directly patterned.
The core part had a width of 35 μm and a height (average thickness) of 35 μm.

  Thereafter, using the same varnish V53 as that for forming the lower clad layer as the clad layer forming material, an upper clad layer is formed in the same manner as the lower clad layer, and a width of 0.5 cm and a length are formed on the glass substrate. A 10 cm linear optical waveguide was obtained.

  In the obtained optical waveguide, the average thickness of the cladding layers (upper part and lower part) was 35 μm.

  Next, this optical waveguide was peeled off from the substrate, and a copper layer (conductor layer) having an average thickness of 45 μm was bonded to each of the both surfaces by a roll laminating method to produce an optical waveguide structure.

Example 4
First, varnish V54 was poured as a clad layer forming material on the roughened surface of a copper foil having an average thickness of 18 μm and spread to a substantially constant thickness with a doctor blade.

Next, this was placed on a hot plate and heated and dried at 50 ° C. for 15 minutes, and then irradiated with UV light using an ultrahigh pressure mercury lamp without a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm). Thus, a lower clad layer with copper foil was formed. Moreover, the upper clad layer with a copper foil was also prepared by the same material and method.

  On the other hand, the filtered varnish V2 as a core layer forming material was poured onto a quartz glass substrate and spread to a substantially constant thickness with a doctor blade.

  This was then placed on a hot plate and heated at 45 ° C. for 10 minutes to evaporate the solvent and form a substantially dry solid film.

The film was irradiated with UV light through a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm) and then heated on a hot plate at 45 ° C. for 30 minutes, and a linear core pattern appeared.

  The obtained sample was heated in a clean oven at 85 ° C. for 30 minutes and further at 150 ° C. for 60 minutes to obtain a patterned varnish V2 cured layer (film).

  The film was peeled from the quartz glass substrate in water, washed with sufficient water, and dried in an oven at 45 ° C. for 1 hour to obtain a single core layer.

  The core layer is sandwiched between the upper and lower clad layers and heated at 150 ° C. for 1 hour while applying a pressure of 10 MPa using an electrothermal press to have a copper layer (conductor layer) on both sides of 0.5 cm in width. A linear optical waveguide structure having a length of 10 cm was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 35 μm (the width of the core portion: 35 μm), and the average thickness of the clad layers (upper and lower portions) was 35 μm.

(Example 5)
First, varnish V55 was poured as a clad layer forming material onto a release-treated PET film substrate and spread to a substantially constant thickness with a doctor blade.

Next, after placing this on a hot plate and heating and drying at 50 ° C. for 15 minutes, this was irradiated with UV light using an ultrahigh pressure mercury lamp without a photomask (irradiation amount: 2000 mJ / cm ² , wavelength: 365 nm). After that, it was peeled off from the PET film to form a single lower clad layer. A single upper clad layer was also prepared using the same material and method.

  On the other hand, filtered varnish V3 as a core layer forming material was poured onto a quartz glass substrate and spread to a substantially constant thickness with a doctor blade.

  This was then placed on a hot plate and heated at 45 ° C. for 10 minutes to evaporate the solvent and form a substantially dry solid film.

This film was irradiated with UV light through a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm) and then heated in a clean oven at 85 ° C. for 30 minutes, and a linear core pattern appeared.

  Furthermore, the cured layer (film) of the varnish V3 patterned by heating at 160 degreeC for 2 hours was obtained.

  The film was peeled from the quartz glass substrate in water, washed with sufficient water, and dried in an oven at 45 ° C. for 1 hour to obtain a single core layer.

  The core layer is sandwiched between the upper and lower clad layers and heated at 150 ° C. for 1 hour while applying a pressure of 6 MPa using an electrothermal press, and a linear light beam having a width of 0.5 cm and a length of 10 cm. A waveguide was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 50 μm (the width of the core part: 50 μm), and the average thickness of the clad layers (upper and lower parts) was 50 μm.

  Next, a copper layer (conductor layer) having an average thickness of 45 μm was bonded to both surfaces of the optical waveguide by a roll laminating method to produce an optical waveguide structure.

(Example 6)
An optical waveguide structure was obtained in the same manner as in Example 5 except that varnish V56 was used as the cladding layer forming material.

(Example 7)
An optical waveguide structure was obtained in the same manner as in Example 1 except that varnish V57 was used as the cladding layer forming material and varnish V2 was used as the core layer forming material.

(Example 8)
First, varnish V58 was poured as a clad layer forming material onto a release-treated PET film substrate and spread to a substantially constant thickness with a doctor blade.

  Next, this was placed on a hot plate, heated and dried at 50 ° C. for 15 minutes, and then peeled off from the PET film to form a single lower clad layer. A single upper clad layer was also prepared using the same material and method.

  On the other hand, filtered varnish V3 as a core layer forming material was poured onto a quartz glass substrate and spread to a substantially constant thickness with a doctor blade.

  This was then placed on a hot plate and heated at 45 ° C. for 10 minutes to evaporate the solvent and form a substantially dry solid film.

This film was irradiated with UV light through a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm) and then heated in a clean oven at 85 ° C. for 30 minutes, and a linear core pattern appeared.

  Furthermore, the cured layer (film) of the varnish V3 patterned by heating at 160 degreeC for 2 hours was obtained.

  The film was peeled from the quartz glass substrate in water, washed with sufficient water, and dried in an oven at 45 ° C. for 1 hour to obtain a single core layer.

  The core layer is sandwiched between the upper and lower clad layers, and heated at 150 ° C. for 1 hour while applying a pressure of 3 MPa using an electrothermal press, and a linear light beam having a width of 0.5 cm and a length of 10 cm. A waveguide was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 50 μm (the width of the core part: 50 μm), and the average thickness of the clad layers (upper and lower parts) was 50 μm.

  Next, a copper layer (conductor layer) having an average thickness of 45 μm was bonded to both surfaces of the optical waveguide by a roll laminating method to produce an optical waveguide structure.

Example 9
An optical waveguide structure was obtained in the same manner as in Example 4 except that varnish V60 was used as the cladding layer forming material.

(Example 10)
An optical waveguide structure was obtained in the same manner as in Example 4 except that varnish V61 was used as the cladding layer forming material.

(Example 11)
First, varnish V62 as a cladding layer forming material was poured onto a 4-inch thick glass substrate and spread to a substantially constant thickness with a doctor blade.

  Next, this was placed on a hot plate, heated at 50 ° C. for 15 minutes, cured at 80 ° C. for 20 minutes, and then cured at 150 ° C. for 1 hour to form a lower cladding layer.

  Next, varnish V3 as a core layer forming material was poured onto the surface of the cured lower cladding layer and spread to a substantially constant thickness with a doctor blade.

  Thereafter, the coated glass substrate was heated at 45 ° C. for 10 minutes using a hot plate to form a substantially dry solid film.

Next, the solid film formed from varnish V3 is irradiated with UV light (wavelength: 365 nm) through a photomask (irradiation amount: 3000 mJ / cm ² ), aged at room temperature for 30 minutes, and then heated at 85 ° C. for 30 minutes. Then, it was further heated at 150 ° C. for 60 minutes to obtain a core layer.

  In addition, the pattern of the core part was able to be confirmed visually when heated at 85 ° C. for 30 minutes.

  Next, as a cladding layer forming material, varnish V61 was poured onto the surface of the hardened layer formed from varnish V3 and spread to a substantially constant thickness with a spin coater.

  This coated glass substrate is placed on a hot plate and heated at 50 ° C. for 15 minutes, followed by curing at 80 ° C. for 20 minutes and then at 150 ° C. for 1 hour to form an upper cladding layer on the glass substrate. A linear optical waveguide having a width of 0.5 cm and a length of 10 cm was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 35 μm (the width of the core part: 35 μm), and the average thickness of the clad layers (upper and lower) was 35 μm.

  Next, this optical waveguide was peeled off from the substrate, and a copper layer (conductor layer) having an average thickness of 45 μm was bonded to each of the both surfaces by a roll laminating method to produce an optical waveguide structure.

(Example 12)
An optical waveguide structure was obtained in the same manner as in Example 11 except that varnish V63 was used as the cladding layer forming material.

(Example 13)
When forming the core layer using varnish V64 as the cladding layer forming material and varnish V1 as the core layer forming material, 45 ° C × 30 minutes prior to heating at 85 ° C. × 30 minutes after UV light irradiation. An optical waveguide structure was obtained in the same manner as in Example 11 except that heating was performed for 30 minutes.

(Example 14)
An optical waveguide structure was obtained in the same manner as in Example 4 except that varnish V65 was used as the cladding layer forming material.

(Comparative example)
First, varnish V59 as a cladding layer forming material was applied on a silicon wafer with a spin coater to a substantially uniform thickness, and then heated in a nitrogen oven at 350 ° C. for 1 hour, thereby forming a lower cladding layer. Formed.

  Next, varnish V1 as a core layer forming material was poured onto the surface of the lower cladding layer and spread to a substantially constant thickness with a doctor blade.

  This was then placed on a hot plate and heated at 45 ° C. for 10 minutes to evaporate the solvent and form a substantially dry solid film.

The film was irradiated with UV light through a photomask (irradiation amount: 3000 mJ / cm ² , wavelength: 365 nm) and then heated on a hot plate at 45 ° C. for 30 minutes, and a linear core pattern appeared.

  The obtained sample was heated in a clean oven at 85 ° C. for 30 minutes and further at 150 ° C. for 60 minutes to obtain a patterned varnish V1 cured layer (core layer).

  Next, as the cladding layer forming material, the same varnish as that used for the lower cladding layer is used, and the upper cladding layer is formed on the core layer in the same manner as the lower cladding layer. A linear optical waveguide having a length of 0.5 cm and a length of 10 cm was obtained.

  In the obtained optical waveguide, the average thickness of the core layer was 50 μm (the width of the core part: 50 μm), and the average thickness of the clad layers (upper and lower parts) was 50 μm.

  Next, this optical waveguide was peeled off from the substrate, and a copper layer (conductor layer) having an average thickness of 45 μm was bonded to each of the both surfaces by a roll laminating method to produce an optical waveguide structure.

4-2. Evaluation 4-2-1. Measurement of light propagation loss

  For each of the optical waveguide structures of Examples and Comparative Examples, the light propagation loss was measured using the “cutback method”.

This is because the light generated from the laser diode is input from one end of the core part through the optical fiber, the output from the other end is measured, and the length of the core part is cut into several lengths. This was done by measuring the light output.
The total optical loss in each length of the core part is expressed by the following formula.

Total optical loss (dB) = -10 log (Pn / Po)
Where Pn is the measured output at the other end of each core portion of length P1, P2,... Pn, and Po is at the end of the optical fiber before coupling the optical fiber to one end of the core portion. This is the measurement output of the light source.

  Next, the total optical loss is plotted as shown in FIG. 35 (Chart 1). The regression line of this data is expressed by the following equation.

y = mx + b
In the formula, m represents a light propagation loss, and b represents a coupling loss.

  In Example 2, light having a wavelength of 1300 nm was used. In other cases, light having a wavelength of 850 nm was used.

4-2-2. Adhesion test Adhesion tests between the core layer and the clad layer were performed on the optical waveguide structures of the examples and comparative examples.

This was performed by a peel test in which the clad layer was peeled upward 90 ° from the core layer.
The results of measurement of light propagation loss and adhesion test are shown in Table 4 below.

In addition, each numerical value in a table | surface shows an average value of 5 each.
As is clear from Table 4, each of the optical waveguide structures of each example has a small light propagation loss, high optical transmission performance, and high adhesion between the core layer and the cladding layer. It was a thing.

  On the other hand, the optical waveguide structure of the comparative example has a large light propagation loss and a low adhesion force between the core layer and the cladding layer, and is inferior in characteristics. This is probably because the adhesion at the interface between the core layer and the clad layer is poor and peeling occurs in part, and the light propagation loss is also increased.

Further, after the optical waveguide structures of the examples and comparative examples were exposed to a high humidity environment (60 ° C., 90% RH, 2000 hours), the light propagation loss was measured in the same manner as described above. As a result, almost no change was observed in the optical waveguide structures of each Example before exposure to a high humidity environment. On the other hand, in the optical waveguide structure of the comparative example, a significant increase in light propagation loss was observed.

  Furthermore, the conductor layers of the optical waveguide structures (before exposure to a high humidity environment) produced in each example and comparative example are patterned to form wirings, and light emitting elements and light receiving elements are formed at predetermined locations. Was mounted to produce a composite device.

  When these composite devices were operated, the composite devices using the optical waveguide structures of the respective examples were faster than the composite devices using the optical waveguide structures of the comparative examples. It was confirmed that operation was possible.

(Example 15)
(Receptor structure)
Using the optical waveguide structure obtained in the same manner as in Example 1, each conductor layer was patterned to form a wiring, and this was then used as an excimer laser (wavelength: 193 nm, device name: ProMaster (OPTEC)). The sample holder was fixed with a vacuum chuck. The laser intensity is set to 7 mJ, the laser oscillation frequency is 250 Hz, the opening of the stainless steel mask that cuts the laser beam is 1 mm × 1 mm, the moving speed of the processing table is set to 45 μm / s, and the moving distance to the processing table is set to 150 μm. Irradiating a portion of the optical waveguide formed with the clad portion joined to the outer periphery of the core portion with a laser (four portions of the core portion at both ends of the optical element mounting portion and the optical waveguide layer), By changing the laser irradiation region relative to the optical waveguide layer 101, the laser irradiation time to the part of the optical waveguide layer forming the optical path changing portion is partially changed, and the depth of the optical waveguide layer of the laser is changed. While adjusting the reach in the vertical direction, the constituent material of the optical waveguide layer was removed to form an optical path conversion section. As a result of observing the processed cross section (reflecting portion) with a microscope, the region where the resin of the upper clad layer and the core layer was removed was an isosceles triangle, and the apex angle was approximately 90 °. Next, in the optical element mounting portion (four locations on both ends of the optical waveguide layer), a mask provided with openings at predetermined positions for forming the receptor structure in accordance with the electrodes (conductive member bumps) (diameter: 100 μm) of the optical element In the same manner as described above, by irradiating with a laser, a receptor structure through-hole 104 penetrating the optical element mounting surface and the wiring component bonding surface was provided to obtain an optical circuit board (G1).

(Wiring parts)
The FR-4 core substrate 602 having a double-sided copper foil is drilled with a drill machine to provide an opening 603, and then the opening 603 is plated by electroless plating so that both sides of the core substrate 602 are electrically connected. I planned. Next, the copper foil was etched to form a conductor circuit 604 including a pad serving as a mounting portion for conducting electrical conduction between the conductive member of the optical element and the conductive member of the wiring component (FIG. 28A). ). On the surface of the pad, a nickel film was formed by electrolytic plating as a metal diffusion prevention layer, and further, a gold film 605 was formed by electroplating to obtain two wiring components (20 mm × 20 mm).

Next, acrylic rubber (butyl acrylate / ethyl acrylate / acrylonitrile = 30 mol% / 30 mol% / 40 mol%, molecular weight = 850,000) 25.9 parts by weight, 2- [4- (2,3-epoxypropoxy) phenyl] 2- [4- [1,1-bis [4- (2,3-epoxypropoxy) phenyl] ethyl] phenyl] propane and 1,3-bis [4- [1- [4- (2,3- 24.5 parts by weight of a mixture with epoxypropoxy) phenyl] -1- [4- [1- [4- (2,3-epoxypropoxy) phenyl] -1-methyl] ethyl] phenyl] phenoxy] -2-propanol , Cresol novolac type epoxy resin (softening point 80 ° C.) 16.3 parts by weight, liquid bis F type epoxy resin (epoxy equivalent = 170) 7.5 parts by weight, phenol novolac Resin (softening point = 100 ° C., OH equivalent = 104) 20.2 parts by weight, 3-glycidoxypropyltrimethoxysilane 0.1 part by weight, N-phenyl-3-aminopropyltrimethoxysilane 0.35 Parts by weight, 0.15 parts by weight of 2-phenylhydroxyimidazole, 5.0 parts by weight of sebacic acid, 60 parts by weight of solder powder (Sn / Bi = 42/58, melting point = 138 ° C., average particle size 35 μm), Each component was dissolved in methyl ethyl ketone, and the resulting varnish was applied to a polyester sheet and dried at a temperature at which the organic solvent volatilized to obtain a good film-forming adhesive tape (thickness 40 μm).

  The size of the adhesive tape obtained above is adjusted to 20 mm × 20 mm according to the joint, and then the adhesive tape is attached to the joint surface (two places on both ends) of the optical circuit board obtained above. 1 was bonded at a temperature of 100 ° C. with a pressure of 1 MPa applied for 10 seconds to produce an optical circuit board with an adhesive layer.

  Next, VCSEL (surface emitting laser) (850 nm) and PD (photodiode) (850 nm) were prepared as optical elements. The optical element used here has metal protrusions (bumps) that serve as conductors in the receptor structure of the optical circuit board on the electrodes. The metal protrusions used were three solder bumps with a diameter of 80 μmφ formed on the electrodes.

  Next, using the optical circuit board with adhesive layer (G1) obtained above and the wiring component obtained above, the adhesive layer surface of the optical circuit board with adhesive layer and the optical element of the wiring component The optical device mounting is performed by aligning and superposing the optical device mounting portion pad of the wiring component and the through hole of the receptor structure portion of the optical circuit board with the adhesive layer with the mounting portion pad surface facing each other. Parts (G1) were obtained.

  Next, the metal protrusion of the optical element prepared above was aligned with the through hole for receptor structure formed on the optical circuit board (G1) in the optical element mounting component, and was placed in the through hole. Next, while heating at a temperature of 160 ° C., pressurizing at a pressure of 1 MPa for 500 seconds, and thermocompression bonding, the optical circuit board (G1) and the wiring component are bonded, and the metal protrusion of the optical element and the wiring The optical element mounting part pad of the component was metal-bonded while being self-aligned to obtain an optical element mounting component (G1) on which the optical element was mounted.

(Examples 16 to 28 and Comparative Example 2)
In Example 1, it replaced with the optical waveguide structure obtained in Example 1, and it carried out similarly to Example 1 except having used each of the optical waveguide structure obtained in Examples 2-14, and Example 16 -28 optical element mounting parts were obtained.
Similarly, in Example 1, the optical waveguide structure obtained in Comparative Example 1 was used in place of the optical waveguide structure obtained in Example 1, and the same procedure as in Example 1 was performed. The optical element mounting component of Example 1 was obtained.

The optical element mounting component obtained above was evaluated.
As an evaluation method, in the optical element mounting component obtained above, a 10 Gbps signal was transmitted from the VCSEL side using a pulse pattern generator (10 Ghz), and the signal waveform received by the oscilloscope was confirmed from the PD side. For comparison, similarly, a device in which a VCSEL and a PD are optically connected by an optical fiber is prepared, a signal is transmitted under the same conditions as described above, and the signal waveform is confirmed by an oscilloscope. The signal waveform was the same as the comparative waveform. However, the signal of the comparative example showed no waveform. Thereby, in the Example, it turned out that sufficient conduction | electrical_connection is acquired.
From the above results, it was confirmed that sufficient conduction was ensured through the adhesive layer.

1 is a perspective view (partially cut away) showing an embodiment of an optical waveguide layer of an optical circuit board in the present invention. 1 is a perspective view (partially cut away) showing an embodiment of an optical waveguide structure used when manufacturing an optical circuit board in the present invention. FIG. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 1st manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is sectional drawing which shows typically the process example of the 4th manufacturing method of the optical waveguide layer and optical waveguide structure in this invention. It is a schematic diagram for demonstrating the manufacture example of the optical circuit board (G1) in this invention. It is a schematic diagram for demonstrating the manufacture example of the optical circuit board | substrate (G2), optical circuit board | substrate (G3 '), and optical circuit board | substrate (G4') in this invention. It is a schematic diagram for demonstrating the manufacture example of the optical circuit board (G3) in this invention. It is a schematic diagram for demonstrating the manufacture example of the optical circuit board (G4) in this invention. It is a schematic diagram for demonstrating the manufacture example of the 1st aspect (G1) of the components for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 2nd aspect (G2) of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 3rd aspect (G1 ') of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 4th aspect (G2 ') of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 5th aspect (G3) of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 6th aspect (G3 ') of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 7th aspect (G4) of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 8th aspect (G3 '') of the component for optical element mounting of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating the manufacture example of the 9th aspect (G4 ') of the optical element mounting component of this invention, and an optical element mounting component. It is a schematic diagram for demonstrating an example of the wiring component in this invention. It is a schematic diagram which shows the example of the optical element mounting component of this invention. It is a figure for demonstrating the example of the optical element in this invention. In this invention, it is the top view to which the connection part of an optical circuit board and a multi-core optical connector was expanded. It is a perspective view for demonstrating an example of an optical wiring component in this invention. It is a perspective view for demonstrating an example of an optical wiring component in this invention. It is a perspective view for demonstrating an example of an optical wiring component in this invention. It is a chart which shows the change of the total optical loss accompanying the change of the length of a core part. It is a perspective view for demonstrating an example of an optical wiring component in this invention. It is a perspective view for demonstrating an example of an optical wiring component in this invention. In this invention, it is the top view to which the connection part of an optical circuit board and a multi-core optical connector was expanded.

Explanation of symbols

9 Optical waveguide structure 90 Optical waveguide layer 90
91, 92 Clad layer 93 Core layer 94 Core part 95 Clad part 104 Receptor structure through-hole 105 Optical path conversion parts 106, 106 ', 106''Optical circuit board (G1)
107 Adhesive Layer 108 Optical Circuit Board with Adhesive (G1)
111, 123 Multi-fiber optical connector 112 Optical circuit board 113 Staggered structure end 114 Optical fiber hole 115 Core part 116 Fixing guide 117 Bending part 118 Branching part 119 Optical path changing part 120 Optical fiber 121 Optical element 122 Light receiving / light emitting part 124 Alignment Hole 125 Substrate 126 Fixing cover 302 Conductor post 303 Conductor circuit 304 Gold film 305 Optical circuit board (G2)
306 Adhesive layer 307 Optical circuit board with adhesive (G2)
402 Conductor post (conductor part)
403a, 403b, 403a ′, 403b ′ Gold coating 405 Optical circuit board (G3)
406 Adhesive layer 407 Optical circuit board with adhesive (G3)
408 Stud bump 409 in receptor structure Optical circuit board (G3 ″)
410 Optical circuit board with adhesive (G3 ″)
501, 501 ′ Conductor posts 502a, 502b, 502a ′, 502b ′ Gold coating 503 Optical circuit board (G4)
505 Optical circuit board with adhesive (G4)
601, 601 ′ Wiring component 602 Core substrate 603 Opening 604 Conductor circuit 605 Gold film 606 Adhesive layer 701, 701 ′ Optical element 702 Metal protrusion (bump)
702a Metal projection portion 702b provided on signal line connection electrode 702b Metal projection portion 702c provided on ground connection electrode Metal projection portion 703 for positioning and fixing Light receiving / light emitting portions 704, 704 ′ Optical element mounting component (G1)
705, 705 ′ optical element mounting component (G1)
801 Optical element 802 Metal protrusion (bump)
803, 803 'Optical element mounting component (G2)
804, 804 'Optical element mounting component (G2)
900 Core layer forming material 901, 902 Conductor layer 905 Optical element 906 Metal protrusion (bump)
903, 903 'Optical element mounting component (G3)
904, 904 'Optical element mounting component (G3)
910 Layer 915 Polymer 920 Additive 925 Irradiated area 930 Actinic radiation 935 Mask 9351 Opening 940 Unirradiated areas 951 and 952 Support substrate 1000 Support substrate 1001 Optical elements 1002 and 1002 ′ Optical element mounting component (G4)
1003, 1003 ′ Optical element mounting component (G4)
1004 Components for mounting optical elements (G3 ″)
1005 Optical device mounting parts (G3 ″)
1101 Optical circuit board (G3 ′)
1102 Optical circuit board with adhesive (G3 ′)
1103 Components for mounting optical elements (G3 ′)
1104 Optical element mounting parts (G3 ′)
1110 1st layer 1120 2nd layer 1130 3rd layer 1201 Optical circuit board (G4 ′)
1202 Optical circuit board with adhesive (G4 ')
1203 Components for mounting optical elements (G4 ′)
1204 Optical device mounting parts (G4 ′)
1301 Conductor layer 1302 Stud bump 1303 in receptor structure Optical circuit board (G1 ′) having stud bump
1304 Adhesive Layer 1305 Optical Circuit Board with Adhesive (G1 ′)
1306 Components for mounting optical elements (G1 ′)
1307 Optical element 1308 Optical element mounting component (G1 ′)
1401 Stud bump 1402 in receptor structure Optical circuit board (G2 ′) having stud bump
1403 Adhesive layer 1404 Optical circuit board with adhesive (G2 ′)
1405 Optical element mounting parts (G2 ′)
1406 Optical element 1407 Optical element mounting component (G2 ′)
2000 Laminate

Claims (69)

A wiring component having a pad on which an optical element having an electrode is mounted;
A core comprising a core part and a clad part having a lower refractive index than the core part, laminated on one surface side of a wiring component having a mounting part for mounting an optical element having electrodes and a pad on the mounting part. An optical circuit board composed of an optical waveguide layer having a layer and a cladding layer provided in contact with at least one surface of the core layer and having a refractive index lower than that of the core portion;
Comprising
The optical circuit board includes a receptor structure for measuring electrical conduction between the electrode of the optical element and the pad of the wiring component,
The clad layer is a component for mounting an optical element, wherein the main material is a norbornene-based polymer.   The optical element mounting component according to claim 1, wherein the norbornene-based polymer is an addition polymer.   The optical element mounting component according to claim 1, wherein the norbornene-based polymer includes a repeating unit of alkyl norbornene.   4. The component for mounting an optical element according to claim 1, wherein the norbornene-based polymer includes a norbornene repeating unit having a substituent containing a polymerizable group. 5. The optical element mounting component according to any one of claims 1 to 4, wherein the norbornene-based polymer is mainly one represented by the following chemical formula (1).


[Wherein R represents an alkyl group having 1 to 10 carbon atoms, a represents an integer of 0 to 3, b represents an integer of 1 to 3, and p / q is 20 or less. ]   6. The component for mounting an optical element according to claim 4, wherein at least a part of the norbornene-based polymer is cross-linked at a polymerizable group. The optical element mounting component according to any one of claims 1 to 6, wherein an average thickness of the cladding layer is 0.1 to 1.5 times an average thickness of the core layer. The core layer may initiate a reaction of the monomer with a polymer, a monomer that is compatible with the polymer and has a refractive index different from that of the polymer, and a first substance that is activated by irradiation with actinic radiation. Forming a layer containing a second substance, the second substance having an activation temperature changed by the action of the activated first substance;
Thereafter, the first substance is activated in the irradiation region irradiated with the actinic radiation by selectively irradiating the layer with the actinic radiation, and the activation temperature of the second substance. Change
Next, by performing heat treatment on the layer, the lower one of the second substance or the second substance whose activation temperature has changed is activated, and the irradiation region or the Either one of the irradiated region and the unirradiated region is caused by reacting the monomer in any one of the unirradiated regions of actinic radiation to generate a refractive index difference between the irradiated region and the unirradiated region. The optical element mounting component according to any one of claims 1 to 7, wherein the core portion is obtained and the other is obtained as the clad portion.   The core layer is obtained by collecting the unreacted monomer from the other region as the reaction of the monomer proceeds in either the irradiated region or the unirradiated region of the layer. The component for mounting an optical element according to claim 8.   The first substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the active radiation, and the second substance has an activation temperature due to the action of the weakly coordinating anion. The component for mounting an optical element according to claim 8 or 9, wherein:   The activation temperature of the second substance is lowered by the action of the activated first substance, and the second substance is activated without being irradiated with the actinic radiation by heating at a temperature higher than the temperature of the heat treatment. The component for mounting an optical element according to claim 8, wherein the component is mounted. The component for mounting an optical element according to claim 11, wherein the second substance includes a compound represented by the following formula Ia.
(E (R) ₃ ) ₂ Pd (Q) ₂ ... (Ia)
[Wherein E (R) ₃ represents a neutral electron donor ligand of Group 15; E represents an element selected from Group 15 of the periodic table; and R represents a hydrogen atom (or One of its isotopes) or a moiety containing a hydrocarbon group, Q represents an anionic ligand selected from carboxylate, thiocarboxylate and dithiocarboxylate. ] The component for mounting an optical element according to claim 11, wherein the second substance contains a compound represented by the following formula Ib.
[(E (R) ₃ ) _a Pd (Q) (LB) _b ] _p [WCA] _r (Ib)
[Wherein E (R) ₃ represents a neutral electron donor ligand of Group 15; E represents an element selected from Group 15 of the periodic table; and R represents a hydrogen atom (or One of its isotopes) or a moiety containing a hydrocarbon group, Q represents an anionic ligand selected from carboxylate, thiocarboxylate and dithiocarboxylate, LB represents a Lewis base, WCA Represents a weakly coordinating anion, a represents an integer of 1 to 3, b represents an integer of 0 to 2, the sum of a and b is 1 to 3, p and r are This represents the number that balances the charge between the palladium cation and the weakly coordinated anion. ]   The component for mounting an optical element according to claim 13, wherein p and r are each selected from an integer of 1 or 2.   The core layer is obtained by heat-treating the layer at a second temperature higher than the temperature of the heat treatment after the heat treatment. Optical device mounting parts.   16. The core layer according to claim 15, wherein the core layer is obtained by heat-treating the layer at a third temperature higher than the second temperature after the heat treatment at the second temperature. Components for mounting optical elements.   The component for mounting an optical element according to claim 16, wherein the third temperature is 20 ° C. or more higher than the second temperature.   The component for mounting an optical element according to claim 8, wherein the monomer includes a crosslinkable monomer.   The component for mounting an optical element according to claim 8, wherein the monomer is mainly a norbornene-based monomer.   The component for mounting an optical element according to claim 18, wherein the monomer is mainly a norbornene-based monomer and contains dimethylbis (norbornenemethoxy) silane as the crosslinkable monomer.   The polymer has a leaving group capable of leaving at least a part of the molecular structure from the main chain by the action of the activated first substance, and the layer is selectively irradiated with the actinic radiation. 21. The component for mounting an optical element according to claim 8, wherein the leaving group of the polymer is detached in the irradiation region.   The first substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the actinic radiation, and the leaving group is an acid leaving group that is released by the action of the cation. The component for mounting an optical element according to claim 21. The core layer includes a substance that is activated by irradiation with actinic radiation, a main chain and a branch that is branched from the main chain, and at least part of the molecular structure can be detached from the main chain by the action of the activated substance. Forming a layer containing a polymer having a functional group,
Thereafter, by selectively irradiating the layer with the actinic radiation, the substance is activated in the irradiation region irradiated with the actinic radiation, and the leaving group of the polymer is released, By producing a refractive index difference between the irradiation region and the non-irradiation region of the active radiation, either the irradiation region or the non-irradiation region was obtained as the core portion, and the other was obtained as the cladding portion. The component for mounting an optical element according to claim 1, wherein the component is for mounting an optical element.   24. The component for mounting an optical element according to claim 23, wherein the core layer is obtained by performing a heat treatment on the layer after the irradiation with the active radiation.   The substance includes a compound that generates a cation and a weakly coordinating anion upon irradiation with the actinic radiation, and the leaving group is an acid leaving group that is released by the action of the cation. The component for mounting an optical element according to 23 or 24.   The component for mounting an optical element according to claim 22 or 25, wherein the acid leaving group has at least one of an -O- structure, an -Si-aryl structure, and an -O-Si- structure.   27. The optical element mounting component according to claim 21, wherein the detachable group causes a decrease in the refractive index of the polymer by the detachment.   28. The component for mounting an optical element according to claim 27, wherein the leaving group is at least one of a -Si-diphenyl structure and a -O-Si-diphenyl structure.   29. The component for mounting an optical element according to claim 8, wherein the active radiation has a peak wavelength in a range of 200 to 450 nm. 30. The component for mounting an optical element according to claim 8, wherein the irradiation amount of the active radiation is 0.1 to 9 J / cm < ² >.   31. The component for mounting an optical element according to claim 8, wherein the active radiation is applied to the layer through a mask.   The optical element mounting component according to any one of claims 8 to 31, wherein the layer further contains an antioxidant.   The optical element mounting component according to claim 8, wherein the layer further contains a sensitizer.   34. The component for mounting an optical element according to any one of claims 8 to 33, wherein the polymer is mainly a norbornene-based polymer.   The optical element mounting component according to claim 34, wherein the norbornene-based polymer is an addition polymer.   The core portion is composed of a first norbornene-based material as a main material, and the cladding portion is composed of a second norbornene-based material having a lower refractive index than that of the first norbornene-based material. The component for mounting an optical element according to any one of claims 1 to 7.   The first norbornene-based material and the second norbornene-based material both contain the same norbornene-based polymer and contain a reaction product of a norbornene-based monomer having a refractive index different from that of the norbornene-based polymer. 37. The component for mounting an optical element according to claim 36, wherein the refractive indexes thereof are different due to different amounts.   38. The light according to claim 37, wherein the reactant is at least one of a polymer of the norbornene monomer, a crosslinked structure that bridges the norbornene polymers, and a branched structure that branches from the norbornene polymer. Component mounting parts.   The component for mounting an optical element according to claim 37 or 38, wherein the norbornene-based polymer contains a repeating unit of aralkylnorbornene.   The component for mounting an optical element according to claim 37 or 38, wherein the norbornene-based polymer contains a repeating unit of benzylnorbornene.   39. The component for mounting an optical element according to claim 37 or 38, wherein the norbornene-based polymer includes a repeating unit of phenylethyl norbornene. The norbornene-based polymer has a leaving group that is branched from a main chain and the main chain, and at least a part of the molecular structure can be removed from the main chain,
The core part and the clad part are different in the number of leaving groups bonded to the main chain, and the content of a reaction product of a norbornene monomer having a refractive index different from that of the norbornene polymer. 42. The component for mounting an optical element according to any one of claims 37 to 41, wherein the refractive indexes thereof are different due to being different. The core layer is mainly composed of a norbornene-based polymer having a main chain and a main chain branched from the main chain, and having a leaving group capable of leaving at least a part of the molecular structure from the main chain,
37. The refractive index of the first norbornene-based material and the second norbornene-based material are different from each other in that the number of the leaving groups bonded to the main chain is different. Components for mounting optical elements.   44. The component for mounting an optical element according to claim 42, wherein the norbornene-based polymer includes a repeating unit of diphenylmethylnorbornenemethoxysilane.   45. The component for mounting an optical element according to any one of claims 37 to 44, wherein the norbornene-based polymer includes a repeating unit of alkyl norbornene.   45. The component for mounting an optical element according to claim 37, wherein the norbornene-based polymer includes a repeating unit of hexyl norbornene.   47. The component for mounting an optical element according to claim 37, wherein the norbornene-based polymer is an addition polymer.   The optical element according to any one of claims 1 to 47, wherein the receptor structure part has a conductor part that electrically connects an electrode of the optical element and a pad of the mounting part therein. Mounting parts.   49. The component for mounting an optical element according to claim 48, wherein the conductor portion in the receptor structure portion includes a conductor post provided on a wiring component side bottom in the receptor structure.   50. The component for mounting an optical element according to claim 49, wherein the conductor post of the conductor part in the receptor structure part protrudes from the optical element mounting surface of the optical circuit board.   The component for mounting an optical element according to any one of claims 1 to 50, wherein an adhesive layer is provided between the wiring component and the optical circuit board.   52. The optical element mounting component according to claim 51, wherein the first adhesive layer electrically connects an electrode of the optical element and a pad of the mounting portion.   52. The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and the solder powder and the curing agent having flux activity are present in the resin. Or the component for optical element mounting of 52.   54. The component for mounting an optical element according to claim 1, wherein the optical circuit board has a conductor circuit on the optical waveguide layer.   The optical circuit board penetrates the conductor circuit on the optical element mounting surface side and the optical circuit board, and electrically connects the wiring component on the conductor circuit. 55. The component for mounting an optical element according to any one of claims 1 to 54, which has a conductor portion for performing the operation.   56. The optical circuit board according to any one of claims 1 to 55, wherein the optical circuit board includes an optical path conversion unit that bends the optical path of the core unit toward the light receiving and emitting unit of the optical element. A component for mounting an optical element as described in 1.   The optical element mounting component according to any one of claims 1 to 56, wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board. Parts.   The optical waveguide layer has a plurality of core parts, and the core part is optically connected to an optical connection component having a plurality of stages of optical path connection parts at an end opposite to the side where the receptor structure part is provided. 58. The component for mounting an optical element according to any one of claims 1 to 57, which has a structure as described above.   59. The optical element mounting according to claim 58, wherein the optical connection component having the plurality of stages of optical path connection parts is a multi-core optical connector having a plurality of stages of optical fiber holes or an optical element having a plurality of stages of receiving / emitting parts. parts.   The optical waveguide layer is configured to bend an optical path of the core portion toward an optical path connecting portion of the plurality of stages at the end opposite to the side where the receptor structure portion is provided. 60. The component for mounting an optical element according to claim 59, having a portion.   The optical waveguide layer is arranged such that the optical path conversion unit is disposed so as to be opposed to the optical path connection units of the plurality of stages. 61. The component for mounting an optical element according to claim 60, which has a staggered structure end portion patterned by repeating this in order with respect to the optical path connection portions of the steps.   62. The core portion end portion is configured such that the core portion is curved toward the end portion so that the patterning is arranged to face the plurality of stages of optical path connecting portions. A component for mounting an optical element as described in 1.   The optical element mounting component according to any one of claims 1 to 62, wherein the optical circuit board has an alignment hole. An optical element having an electrode;
64. An optical element mounting component according to any one of claims 1 to 63;
Comprising
The optical element is mounted on the pad of the wiring component having a pad for mounting the optical element through the optical circuit board in the optical element mounting component,
The optical circuit board and the wiring component, the optical element mounting, wherein the electrode of the optical element and the pad of the wiring component are electrically joined via a receptor structure formed on the optical circuit board parts.   65. The optical element mounting component according to claim 64, wherein the electrical connection part in the receptor structure part is composed of a protrusion provided on the electrode of the optical element and a conductor post.   66. The electrical connection portion in the receptor structure portion is a conductor post protruding from the optical element mounting surface of the optical circuit board and an electrode of the optical element, which are metal-bonded. Optical element mounting parts.   A conductor formed on the optical circuit board on the side of the optical element mounting surface and a conductor that penetrates the optical circuit board and is electrically connected to the conductive member of the wiring component on the conductor circuit. The optical element mounting component according to any one of claims 64 to 66, wherein the portion and the conductive member of the wiring component are metal-bonded.   68. The optical element mounting component according to claim 64, wherein the wiring component in the optical element mounting component is an electronic device wiring component.   69. The optical element mounting component according to any one of claims 64 to 68, wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board. .