CN116931194A

CN116931194A - Electronic device

Info

Publication number: CN116931194A
Application number: CN202210767748.9A
Authority: CN
Inventors: 郭俊宏; 王梓瑄
Original assignee: Unimicron Technology Corp
Current assignee: Unimicron Technology Corp
Priority date: 2022-04-01
Filing date: 2022-07-01
Publication date: 2023-10-24
Also published as: TW202340779A

Abstract

The invention provides an electronic device, which comprises a light emitting element, an IC chip, a substrate, an optical waveguide layer and an optical signal outlet. The IC chip is configured to control the light emitting element to emit light signals. The light emitting element is disposed on the first surface of the substrate, and the IC chip is disposed on the second surface of the substrate. The optical waveguide layer is disposed on the first surface of the substrate, and includes a core layer, a cladding layer, and a metal layer. The metal layer is disposed on at least a portion of the interface between the core layer and the cladding layer. The optical signal outlet corresponds to the light emitting element, and the optical signal reaches the optical signal outlet after being transmitted by the core layer.

Description

Electronic device

Technical Field

The present invention relates to an electronic device.

Background

In response to the development of 5G high frequency and high speed, the device has a small size and a high I/O number. With the increase of the circuit density, when a large number of electronic signals are processed, a large number of heat sources are generated, and serious signal loss is caused. Therefore, if electronic signals are used for transmission, the problems of overheating of the device and signal loss are long-felt problems.

Disclosure of Invention

The invention provides an electronic device, which avoids the problems of overheat and signal loss of the device.

According to an embodiment of the present invention, an electronic device is provided, which includes at least one light emitting element, at least one IC chip, a substrate, an optical waveguide layer, and at least one optical signal outlet. The at least one IC chip is configured to control the at least one light emitting element to emit light signals. At least one light emitting element is arranged on the first surface of the substrate, and at least one IC chip is arranged on the second surface of the substrate. The optical waveguide layer is disposed on the first surface of the substrate, and includes a core layer, a cladding layer, and a metal layer. The metal layer is disposed on at least a portion of the interface between the core layer and the cladding layer. The at least one optical signal outlet corresponds to the at least one light-emitting element, and the optical signal reaches the at least one optical signal outlet after being transmitted by the core layer.

In one embodiment, the refractive index of the core layer is greater than the refractive index of the cladding layer.

In one embodiment, a portion of the metal layer surrounds at least one light emitting element.

In one embodiment, the at least one optical signal outlet is disposed on a side surface of the optical waveguide layer.

In one embodiment, the at least one optical signal outlet is disposed on the front surface of the optical waveguide layer.

In one embodiment, the number of the at least one optical signal outlet is plural, one of the plurality of optical signal outlets is disposed on the front surface of the optical waveguide layer, and the other of the plurality of optical signal outlets is disposed on the side surface of the optical waveguide layer.

In one embodiment, the core layer is patterned, the number of the at least one light emitting device is plural, and the number of the at least one light signal outlet is one.

In one embodiment, the electronic device further includes a redistribution layer disposed between the substrate and the at least one IC chip.

In one embodiment, the substrate is provided with at least one through hole, and the at least one optical signal outlet is located in the through hole.

In an embodiment, the electronic device further includes an optical coupling element and an optical fiber, wherein the optical coupling element is disposed at the at least one optical signal outlet and is connected to the optical fiber, so as to couple the optical signal emitted by the at least one light emitting element into the optical fiber.

In one embodiment, the electronic device further comprises an optical receiver connected to the optical fiber and converting the optical signal into an electrical signal.

In one embodiment, the substrate is provided with at least one groove, the at least one light emitting element is disposed on the first surface, and the at least one light emitting element is disposed on a bottom surface of the at least one groove.

In an embodiment, the electronic device further includes a reflective layer disposed on an inclined side of the at least one recess and surrounding the at least one light emitting element.

In one embodiment, the reflective layer is formed of the same material as the metal layer.

Based on the above, the electronic device provided in the embodiment of the present invention converts the electrical signal of the IC chip into the optical signal by the light emitting element by using the photoelectric conversion method, the optical signal is transmitted in the optical waveguide layer, and then the optical signal is converted into the electrical signal by using the optical receiver. The optical signal can be transmitted in the optical waveguide layer in a total reflection mode, the loss is low, the transmission speed is high, multiple sections of frequencies can be transmitted simultaneously, heat cannot be generated, and the requirement of 5G high frequency and high speed can be met.

In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1A is a schematic cross-sectional view of an electronic device according to an embodiment of the invention;

FIG. 1B is a partial perspective view of the electronic device of FIG. 1A;

FIGS. 2 and 3 are schematic cross-sectional views of an electronic device according to an embodiment of the invention;

fig. 4 is a schematic diagram of an electronic device according to an embodiment of the invention.

Reference numerals illustrate:

1. 2, 3, 4 electronic device

10 luminous element

10E conductive post

10L optical signal

10P, 10P1, 10P2, 10P3, 10P4, 10P5, 10P6: optical signal outlet

20 IC chip

100 optical waveguide layer

100a, 100b front surface

100c, 100d side surfaces

101 core layer

102 coating layer

103 Metal layer

200 substrate

200G groove

200H through hole

200R reflection layer

201 first surface

202 second surface

300 redistribution layer

300B conductive pad

400 light processing system

401 optical coupling element

402 optical fiber

403 light receiver

D1, D2, D3 direction

Detailed Description

Referring to fig. 1A and 1B, fig. 1A is a schematic cross-sectional view of an electronic device according to an embodiment of the invention, and fig. 1B is a perspective view of a portion of the electronic device shown in fig. 1A. Specifically, FIG. 1A corresponds to line I-I' of FIG. 1B.

The electronic device 1 includes a light emitting element 10, an IC chip 20, an optical waveguide layer 100, a substrate 200, and an optical signal outlet 10P. The IC chip 20 is configured to control the light emitting element 10 to emit the light signal 10L. The light emitting element 10 is disposed on the first surface 201 of the substrate 200, and the IC chip 20 is disposed on the second surface 202 of the substrate 200. The optical waveguide layer 100 is disposed on the first surface 201 of the substrate 200, and has two opposite front surfaces 100a and 100b, and the optical waveguide layer 100 includes a core layer 101, a cladding layer 102, and a metal layer 103. The light signal outlet 10P corresponds to the light emitting element 10. The substrate 200 is not limited to an organic substrate, an inorganic silicon substrate, or others.

In an embodiment, the light emitting element 10 may be directly connected to the IC chip 20 to emit the light signal 10L. In the present embodiment, a redistribution layer (Redistribution Layer) 300 is disposed between the substrate 200 and the IC chip 20. The redistribution layer 300 is formed by a wafer level metal re-routing process and a conductive bump process. The redistribution layer 300 is configured to change the contact (I/O pad) position of the IC chip 20, so that the small-sized IC chip 20 can be further connected to other components or a component. Specifically, the light emitting device 10 is electrically connected to the conductive pads 300B on the redistribution layer 300 through the conductive pillars 10E penetrating the substrate 200, so as to further electrically connect to the IC chip 20. The IC chip 20 drives the light emitting element 10 to emit the optical signal 10L according to the electric signal to be transmitted, so that the optical signal 10L has information of the electric signal to be transmitted by the IC chip 20. The information carried by the optical signals 10L corresponding to the different IC chips 20 is different. The optical signals 10L corresponding to the different IC chips 20 may be different wavelengths of light or the same wavelength of light.

The optical signal outlet 10P is located on a front surface 100a of the optical waveguide layer 100 and is covered by the substrate 200. However, the present invention is not limited thereto, and in other embodiments, the optical signal outlet 10P is not covered by the substrate 200 (not shown).

In this embodiment, FIG. 1A corresponds to line I-I' of FIG. 1B. That is, fig. 1A shows a schematic cross-sectional view centering on the optical signal outlet 10P of fig. 1B and along the first direction D1. It should be noted that, fig. 1A may also be a schematic cross-sectional view centered on the optical signal outlet 10P of fig. 1B and along the second direction D2, where the second direction D2 is perpendicular to the first direction D1, and the third direction D3 is perpendicular to the first direction D1 and the second direction D2. Fig. 1A may also be a schematic cross-sectional view centered on the optical signal outlet 10P of fig. 1B and along a direction having an angle of 45 degrees with the first direction D1. In addition, fig. 1A may be a schematic cross-sectional view centered on the optical signal outlet 10P of fig. 1B and along a direction having an unspecified angle with the first direction D1. Specifically, the core layer 101 of the electronic device 1 is patterned, and the plurality of light emitting elements 10 correspond to the same optical signal outlet 10P. However, the present invention is not limited thereto, and in other embodiments, one light signal outlet 10P may correspond to only one light emitting element 10.

In this embodiment, the optical signal 10L emitted from the light emitting element 10 is transmitted in the optical waveguide layer 100, and the refractive index of the core layer 101 is larger than that of the cladding layer 102, so that the optical signal 10L can be transmitted to the optical signal outlet 10P in a total reflection manner in the core layer 101. The metal layer 103 is disposed on a portion of the interface between the core layer 101 and the cladding layer 102 to ensure that the optical signal 10L is reflected by the metal layer 103 and transmitted toward the optical signal outlet 10P. The metal layer 103 is composed of a metal having high reflectivity, such as aluminum, silver, or an alloy thereof. However, the present invention is not limited thereto, in some embodiments, the refractive index of the core layer 101 may be less than or equal to the refractive index of the cladding layer 102, and the metal layer 103 is disposed at all interfaces between the core layer 101 and the cladding layer 102, in which case the optical signal 10L is transmitted toward the optical signal outlet 10P by being reflected by the metal layer 103 multiple times.

In the present embodiment, a portion of the metal layer 103 surrounds the light emitting element 10 and is disposed obliquely with respect to the first surface 201, so as to ensure that the optical signal 10L emitted from the light emitting element 10 is transmitted toward the core layer 101 and the optical signal outlet 10P without leaking light toward the redistribution layer 300 and the IC chip 20. In addition, the substrate 200 is made of a transparent material (e.g., glass or a flexible transparent substrate), so that the optical signal 10L transmitted to the substrate 200 in the core layer 101 is transmitted through the substrate 200 toward the optical signal outlet 10P.

In order to fully illustrate the various embodiments of the invention, other embodiments of the invention will be described below. It should be noted that the following embodiments use the element numbers and part of the content of the foregoing embodiments, where the same numbers are used to denote the same or similar elements, and descriptions of the same technical content are omitted. For the description of the omitted parts, reference is made to the foregoing embodiments, and the following embodiments are not repeated.

Referring to fig. 2, a schematic cross-sectional view of an electronic device according to an embodiment of the invention is shown. The electronic device 2 is different from the electronic device 1 in that the optical signal outlet 10P1 and the optical signal outlet 10P2 of the electronic device 2 respectively correspond to one light emitting element 10. The optical waveguide layer 100 has opposite front surfaces 100a, 100b and opposite side surfaces 100c, 100d, and the optical signal outlet 10P1 is located on one side surface 100c of the optical waveguide layer 100, and the optical signal outlet 10P2 is located on one front surface 100a of the optical waveguide layer 100.

Referring to fig. 3, a schematic cross-sectional view of an electronic device according to an embodiment of the invention is shown. The electronic device 3 is different from the electronic device 1 in that the optical signal outlet 10P3 and the optical signal outlet 10P4 of the electronic device 3 respectively correspond to one light emitting element 10, wherein the optical signal outlet 10P3 and the optical signal outlet 10P4 are respectively located on two opposite side surfaces 100c and 100d of the optical waveguide layer 100. The metal layer 103 is disposed at all interfaces between the core layer 101 and the cladding layer 102. The optical signal 10L is transmitted to the optical signal outlets 10P3 and 10P4 by being reflected by the metal layer 103 a plurality of times.

Referring to fig. 4, a schematic diagram of an electronic device according to an embodiment of the invention is shown. With respect to the electronic device 1, the electronic device 4 further comprises an optical processing system 400, the optical processing system 400 comprising an optical coupling element 401, an optical fiber 402 and an optical receiver 403. As shown in fig. 4, the optical signal outlets 10P5 of the electronic device 4 are located on one side surface 100c of the optical waveguide layer 100, and the optical signal outlets 10P6 are located on a front surface 100a of the optical waveguide layer 100 and are respectively and correspondingly configured with optical coupling elements 401. The optical coupling element 401 corresponding to the optical signal outlet 10P5 is disposed at the optical signal outlet 10P5. The optical coupling element 401 corresponding to the optical signal outlet 10P6 is disposed on the redistribution layer 300 and faces the optical signal outlet 10P6. Each optical coupling element 401 is connected to an optical fiber 402 to couple the optical signal 10L emitted from the light emitting element 10 into the optical fiber 402 and further to be transmitted to an optical receiver 403 connected to the other end of the optical fiber 402. The optical receiver 403 or a processor at the rear end thereof converts the optical signal 10L into an electrical signal to obtain an electrical signal to be transferred by the corresponding IC chip 20. In the present embodiment, the optical signal outlet 10P6 is not covered by the substrate 200. However, the invention is not limited thereto, and in other embodiments, the optical signal outlet 10P6 may be covered by the substrate 200 (not shown). In other embodiments, the optical signal outlet 10P6 may be covered by the substrate 200 and the redistribution layer 300 (not shown).

It should be noted that, in the present embodiment, each light emitting element 10 corresponds to a different optical coupling element 401 and an optical fiber 402. However, the present invention is not limited thereto, and in other embodiments, different light emitting elements 10 may correspond to the same optical coupling element 401 and optical fiber 402. Taking the electronic device 1 shown in fig. 1A and 1B as an example, one optical coupling element 401 may be disposed at the optical signal outlet 10P corresponding to the plurality of light emitting elements 10, and the optical coupling element 401 is connected to one optical fiber 402 and one optical receiver 403.

Whether the plurality of light emitting elements 10 corresponds to one light processing system 400 or the plurality of light emitting elements 10 corresponds to a plurality of light processing systems 400, respectively. The light signals 10L emitted from the different light emitting elements 10 may have the same wavelength or may have different wavelengths. When the light signals 10L emitted from different light emitting elements 10 have the same wavelength, the light signals 10L emitted from different light emitting elements 10 can be distinguished by modulating (modulating) the respective light signals 10L.

In comparison with the electronic device 1, the substrate 200 of the electronic device 4 may have a through hole 200H, the through hole 200H corresponds to one light emitting element 10, and the optical signal outlet 10P6 is located in the through hole 200H. The optical signal 10L transmitted in the core layer 101 is transmitted through the through-hole 200H toward the optical signal outlet 10P6.

Although fig. 4 schematically illustrates only one through hole 200H, the present invention is not limited thereto. In some embodiments, the electronic device 4 may have a plurality of through holes 200H corresponding to the plurality of light emitting elements 10, respectively. In some embodiments, one through hole 200H may also correspond to a plurality of light emitting elements 10. Taking the electronic device 1 shown in fig. 1A as an example, a portion of the substrate 200 between the core layer 101 and the optical signal outlet 10P may be removed, such that the substrate 200 has a through hole (not shown) between the core layer 101 and the optical signal outlet 10P, such that the optical signals 10L from different light emitting elements 10 and transmitted in the core layer 101 can pass through the through hole (not shown) and directly transmit toward the optical signal outlet 10P.

The substrate 200 of the electronic device 4 may further have a groove 200G disposed on the first surface 201, and the light emitting element 10 is disposed on a bottom surface of the groove 200G. The electronic device 4 further includes a reflective layer 200R, where the reflective layer 200R is disposed on the inclined side (oblique side surface) of the recess 200G and surrounds the light emitting element 10. The reflective layer 200R may be formed of the same material as the metal layer 103 of the optical waveguide layer 100 or may be formed of a different material. The reflective layer 200R surrounding the light emitting device 10 and disposed obliquely with respect to the first surface 201 can ensure that the light signal 10L emitted from the light emitting device 10 is transmitted toward the core layer 101 and the light signal outlets 10P5 and 10P6 without leaking light toward the substrate 200, the redistribution layer 300 and the IC chip 20.

The light emitting element 10 in the above embodiment may be implemented as a laser diode or a light emitting diode, and is directly buried between the substrate 200 and the optical waveguide layer 100 in the form of a die, without encapsulating the die with an encapsulation resin. Since the light emitting element 10 is embedded between the substrate 200 and the optical waveguide layer 100, it does not occupy the surface of the redistribution layer 300 away from the substrate 200, and the surface is configured with other electronic components, so as to improve the functionality of the electronic devices 1, 2, 3, and 4.

In summary, in the electronic device provided by the embodiment of the invention, the electrical signal of the IC chip is converted into the optical signal by the light emitting element by using the photoelectric conversion method, the optical signal is transmitted in the optical waveguide layer, and then the optical signal is converted into the electrical signal by using the optical receiver. The optical signal can be transmitted in the optical waveguide layer in a total reflection mode, the loss is low, the transmission speed is high, multiple sections of frequencies can be transmitted simultaneously, heat cannot be generated, and the requirement of 5G high frequency and high speed can be met.

Claims

1. An electronic device, comprising:

at least one light emitting element;

at least one IC chip configured to control the at least one light emitting element to emit light signals;

a substrate, wherein the at least one light emitting element is configured on a first surface of the substrate, and the at least one IC chip is configured on a second surface of the substrate; and

an optical waveguide layer disposed on the first surface of the substrate, the optical waveguide layer comprising:

a core layer;

a coating layer; and

a metal layer disposed on at least a portion of an interface between the core layer and the cladding layer; the at least one optical signal outlet corresponds to the at least one light-emitting element, and the optical signal reaches the at least one optical signal outlet after being transmitted by the core layer.

2. The electronic device of claim 1, wherein the refractive index of the core layer is greater than the refractive index of the cladding layer.

3. The electronic device of claim 1, wherein a portion of the metal layer surrounds the at least one light emitting element.

4. The electronic device of claim 1, wherein the at least one optical signal outlet is disposed on a side surface of the optical waveguide layer.

5. The electronic device of claim 1, wherein the at least one optical signal outlet is disposed on a front surface of the optical waveguide layer.

6. The electronic device of claim 1, wherein the at least one optical signal outlet is a plurality of optical signal outlets, one of the plurality of optical signal outlets is disposed on a front surface of the optical waveguide layer, and another of the plurality of optical signal outlets is disposed on a side surface of the optical waveguide layer.

7. The electronic device of claim 1, wherein the core layer is patterned, the number of the at least one light emitting element is a plurality, and the number of the at least one light signal outlet is one.

8. The electronic device of claim 1, further comprising a redistribution layer disposed between the substrate and the at least one IC chip.

9. The electronic device of claim 1, wherein the substrate has at least one through hole, and the at least one optical signal outlet is located in the through hole.

10. The electronic device of claim 1, further comprising an optical coupling element disposed at the at least one optical signal outlet and connected to the optical fiber to couple the optical signal from the at least one light emitting element into the optical fiber.

11. The electronic device of claim 10, further comprising an optical receiver coupled to the optical fiber and converting the optical signal to an electrical signal.

12. The electronic device of claim 1, wherein the substrate has at least one groove disposed on the first surface, and the at least one light emitting element is disposed on a bottom surface of the at least one groove.

13. The electronic device of claim 12, further comprising a reflective layer disposed on an oblique side of the at least one recess and surrounding the at least one light emitting element.

14. The electronic device of claim 13, wherein the reflective layer is constructed of the same material as the metal layer.