TW202340779A - Electronic device - Google Patents

Abstract

An electronic device including a light-emitting element, an IC chip, a substrate, a wave guide layer and a light signal outlet is provided. The IC chip is configured to control the light-emitting element to emit light signals. The light-emitting element is disposed on a first surface of the substrate, and the IC chip is disposed on a second surface of the substrate. The wave guide layer is disposed on the first surface of the substrate and includes a core layer, a cladding layer and a metal layer. The metal layer is disposed on at least a portion of the interface between the core layer and the cladding layer. The light signal outlet corresponds to the light-emitting element and the light signal arrives the light signal outlet after transmitting in the core layer.

Description

electronic device

The invention relates to an electronic device.

In response to the development of high-frequency and high-speed 5G, the size of components is small and the number of I/Os is high. As the density of circuits increases, when processing a large number of electronic signals, not only will a large number of heat sources be generated, but there will also be serious signal loss. Therefore, if electronic signals are used for transmission, the problems of device overheating and signal loss have long been problems that need to be overcome.

The present invention provides an electronic device that avoids the problems of device overheating and signal loss.

According to an embodiment of the present invention, an electronic device is provided, including at least one light-emitting element, at least one IC chip, a substrate, an optical waveguide layer and at least one optical signal outlet. At least one IC chip is configured to control at least one light emitting element to emit light signals. At least one light-emitting element is arranged on the first surface of the substrate, and at least one IC chip is arranged on the second surface of the substrate. The optical waveguide layer is disposed on the first surface of the substrate, and includes a core layer, a cladding layer and a metal layer. The metal layer is disposed on at least a part of the interface between the core layer and the cladding layer. At least one optical signal outlet corresponds to at least one light-emitting element, and the optical signal reaches the at least one optical signal outlet after being transmitted in the core layer.

In one embodiment, the refractive index of the core layer is greater than the refractive index of the cladding layer.

In one embodiment, a portion of the metal layer surrounds at least one light-emitting element.

In one embodiment, at least one optical signal outlet is disposed on a side surface of the optical waveguide layer.

In one embodiment, at least one optical signal outlet is disposed on the front surface of the optical waveguide layer.

In one embodiment, the number of at least one optical signal outlet is multiple, one of the multiple optical signal outlets is disposed on the front surface of the optical waveguide layer, and the other one of the multiple optical signal outlets is disposed on the optical waveguide layer. on the side surface of the waveguide layer.

In one embodiment, the core layer is patterned, the number of at least one light-emitting element is multiple, and the number of at least one optical signal outlet is one.

In one embodiment, the electronic device further includes a redistribution layer disposed between the substrate and at least one IC chip.

In one embodiment, the substrate has at least one through hole, and the at least one optical signal outlet is located in the through hole.

In one embodiment, the electronic device further includes an optical coupling element and an optical fiber. The optical coupling element is disposed at at least one optical signal outlet and connected to the optical fiber to couple the optical signal emitted by the at least one light-emitting element into the optical fiber.

In one embodiment, the electronic device further includes an optical receiver connected to the optical fiber and converting the optical signal into an electrical signal.

In one embodiment, the substrate has at least one groove disposed on the first surface, and at least one light-emitting element is disposed on the bottom surface of the at least one groove.

In one embodiment, the electronic device further includes a reflective layer disposed on an inclined side surface of at least one groove and surrounding at least one light-emitting element.

In one embodiment, the reflective layer and the metal layer are made of the same material.

Based on the above, the electronic device provided by the embodiment of the present invention uses a photoelectric conversion method to convert the electrical signal of the IC chip into an optical signal through the light-emitting element. The optical signal is transmitted in the optical waveguide layer, and then the optical receiver is used to convert the optical signal into electrical signal. Optical signals can be transmitted through the optical waveguide layer in a total reflection manner, with low loss, high transmission speed, and the ability to transmit multiple frequencies at the same time without generating heat, which can better meet the high-frequency and high-speed requirements of 5G.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

Referring to FIGS. 1A and 1B , FIG. 1A is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention, and FIG. 1B is a perspective view of a partial structure of the electronic device shown in FIG. 1A . Specifically, FIG. 1A corresponds to line I-I' of FIG. 1B.

The electronic device 1 includes a light emitting element 10, an IC chip 20, an optical waveguide layer 100, a substrate 200 and an optical signal outlet 10P. The IC chip 20 is configured to control the light emitting element 10 to emit the light signal 10L. The light-emitting element 10 is arranged on the first surface 201 of the substrate 200 , and the IC chip 20 is arranged on the second surface 202 of the substrate 200 . The optical waveguide layer 100 is disposed on the first surface 201 of the substrate 200 and has two opposite front surfaces 100a and 100b. The optical waveguide layer 100 includes a core layer 101, a cladding layer 102 and a metal layer 103. The optical signal outlet 10P corresponds to the light emitting element 10 . The substrate 200 is not limited to an organic substrate, an inorganic silicon substrate, or others.

In one embodiment, the light-emitting element 10 can be directly connected to the IC chip 20 to emit the light signal 10L. In this embodiment, a redistribution layer (Redistribution Layer) 300 is disposed between the substrate 200 and the IC chip 20 . The redistribution layer 300 is formed through a wafer-level metal rewiring process and a conductive bumping process. The redistribution layer 300 is configured to change the position of the contacts (such as I/O pads) of the IC chip 20 so that the small-sized IC chip 20 can further connect to other multiple components or one component. Specifically, the light-emitting element 10 is electrically connected to the conductive pads 300B on the redistribution layer 300 through the conductive pillars 10E penetrating the substrate 200 to further electrically connect the IC chip 20 . The IC chip 20 drives the light-emitting element 10 to emit the optical signal 10L according to the electrical signal to be transmitted, so that the optical signal 10L has the information of the electrical signal to be transmitted by the IC chip 20 . The optical signals 10L corresponding to different IC chips 20 carry different information. The optical signals 10L corresponding to different IC chips 20 may be light of different wavelengths, or may be light of the same wavelength.

The optical signal outlet 10P is located on a front surface 100a of the optical waveguide layer 100 and is covered by the substrate 200. However, the present invention is not limited to this. In other embodiments, the optical signal outlet 10P is not covered by the substrate 200 (not shown).

In this embodiment, FIG. 1A corresponds to line I-I' of FIG. 1B. That is to say, FIG. 1A shows a schematic cross-sectional view centered on the optical signal outlet 10P of FIG. 1B and along the first direction D1. It should be noted that FIG. 1A can also be a cross-sectional schematic diagram centered on the optical signal outlet 10P of FIG. 1B and along the second direction D2, where the second direction D2 is perpendicular to the first direction D1, and the third direction D3 is perpendicular to the third direction. One direction D1 and a second direction D2. FIG. 1A may also be a schematic cross-sectional view centered on the optical signal outlet 10P of FIG. 1B and along a direction with an included angle of 45 degrees from the first direction D1 . In addition, FIG. 1A may also be a cross-sectional schematic diagram centered on the optical signal outlet 10P of FIG. 1B and extending in a direction with an unspecified angle to the first direction D1. Specifically, the core layer 101 of the electronic device 1 is patterned, and multiple light-emitting elements 10 correspond to the same optical signal outlet 10P. However, the present invention is not limited to this. In other embodiments, one optical signal outlet 10P may correspond to only one light-emitting element 10 .

In this implementation, the optical signal 10L emitted from the light-emitting element 10 is transmitted in the optical waveguide layer 100, and the refractive index of the core layer 101 is greater than the refractive index of the cladding layer 102, so that the optical signal 10L can be fully transmitted in the core layer 101. The reflected form is transmitted to the optical signal outlet 10P. The metal layer 103 is disposed on part of the interface between the core layer 101 and the cladding layer 102 to ensure that the optical signal 10L is reflected by the metal layer 103 and transmitted toward the optical signal outlet 10P. The metal layer 103 is made of metal with high reflectivity, such as aluminum, silver or alloys thereof. However, the present invention is not limited thereto. In some embodiments, the refractive index of the core layer 101 may be less than or equal to the refractive index of the cladding layer 102, and the metal layer 103 is disposed between the core layer 101 and the cladding layer 102. On all interfaces, under such circumstances, the optical signal 10L is transmitted toward the optical signal outlet 10P by being reflected multiple times by the metal layer 103 .

In this embodiment, part of the metal layer 103 surrounds the light-emitting element 10 and is tilted relative to the first surface 201 to ensure that the optical signal 10L emitted by the light-emitting element 10 is transmitted toward the core layer 101 and the optical signal outlet 10P without being redistributed. Layer 300 and IC chip 20 leak light. In addition, the substrate 200 is made of a transparent material (such as glass or a flexible transparent substrate), so that the optical signal 10L transmitted to the substrate 200 in the core layer 101 can penetrate the substrate 200 and be transmitted toward the optical signal outlet 10P.

In order to fully explain various implementation aspects of the invention, other embodiments of the invention will be described below. It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.

Referring to FIG. 2 , a schematic cross-sectional view of an electronic device according to an embodiment of the present invention is shown. The electronic device 2 is different from the electronic device 1 in that the optical signal outlet 10P1 and the optical signal outlet 10P2 of the electronic device 2 respectively correspond to one light-emitting element 10 . The optical waveguide layer 100 has two opposite front surfaces 100a and 100b and two opposite side surfaces 100c and 100d, and the optical signal outlet 10P1 is located on one side surface 100c of the optical waveguide layer 100, and the optical signal outlet 10P2 is located on a front surface of the optical waveguide layer 100. Surface 100a.

Referring to FIG. 3 , a schematic cross-sectional view of an electronic device according to an embodiment of the present invention is shown. The electronic device 3 is different from the electronic device 1 in that the optical signal outlet 10P3 and the optical signal outlet 10P4 of the electronic device 3 respectively correspond to one light-emitting element 10, wherein the optical signal outlet 10P3 and the optical signal outlet 10P4 are respectively located on opposite sides of the optical waveguide layer 100. Side surfaces 100c, 100d. In addition, the metal layer 103 is disposed on all interfaces between the core layer 101 and the cladding layer 102 . The optical signal 10L is transmitted toward the optical signal outlets 10P3 and 10P4 by being reflected multiple times by the metal layer 103.

Referring to FIG. 4 , a schematic diagram of an electronic device according to an embodiment of the present invention is shown. Relative to the electronic device 1 , the electronic device 4 further includes an optical processing system 400 . The optical processing system 400 includes an optical coupling element 401 , an optical fiber 402 and an optical receiver 403 . As shown in FIG. 4 , the optical signal outlet 10P5 of the electronic device 4 is located on one side surface 100c of the optical waveguide layer 100 , and the optical signal outlet 10P6 is located on a front surface 100a of the optical waveguide layer 100 , and optical coupling elements 401 are respectively configured therein. The optical coupling element 401 corresponding to the optical signal outlet 10P5 is arranged at the optical signal outlet 10P5. The optical coupling element 401 corresponding to the optical signal outlet 10P6 is arranged on the redistribution layer 300 and faces the optical signal outlet 10P6. Each optical coupling element 401 is connected to an optical fiber 402 to couple the optical signal 10L emitted by the light-emitting element 10 into the optical fiber 402 and further transmit it to the optical receiver 403 connected to the other end of the optical fiber 402. The optical receiver 403 or its back-end processor converts the optical signal 10L into an electrical signal to obtain the electrical signal to be transmitted by the corresponding IC chip 20 . In this embodiment, the optical signal outlet 10P6 is not covered by the substrate 200 . However, the present invention is not limited to this. In other embodiments, the optical signal outlet 10P6 can be covered by the substrate 200 (not shown). In other embodiments, the optical signal outlet 10P6 may be covered by the substrate 200 and the redistribution layer 300 (not shown).

It should be noted that in this embodiment, each light-emitting element 10 corresponds to a different optical coupling element 401 and optical fiber 402 respectively. However, the present invention is not limited to this. In other embodiments, different light-emitting elements 10 can also correspond to the same optical coupling element 401 and optical fiber 402 . Taking the electronic device 1 shown in FIG. 1A and FIG. 1B as an example, an optical coupling element 401 can be configured at the optical signal outlet 10P corresponding to multiple light-emitting elements 10. This optical coupling element 401 is connected to an optical fiber 402 and a light receiving element. Device 403.

Whether multiple light-emitting elements 10 correspond to one light processing system 400 or multiple light-emitting elements 10 correspond to multiple light processing systems 400 respectively. The optical signals 10L emitted by different light-emitting elements 10 may have the same wavelength or different wavelengths. When the optical signals 10L emitted by different light-emitting elements 10 have the same wavelength, the optical signals 10L emitted by the different light-emitting elements 10 can be distinguished by performing modulation on each optical signal 10L.

Compared with the electronic device 1 , the substrate 200 of the electronic device 4 may have a through hole 200H, the through hole 200H corresponds to a light emitting element 10 , and the optical signal outlet 10P6 is located in the through hole 200H. The optical signal 10L transmitted in the core layer 101 can pass through the through hole 200H and be transmitted toward the optical signal outlet 10P6.

Although FIG. 4 schematically illustrates only one through hole 200H, the present invention is not limited thereto. In some embodiments, the electronic device 4 may have multiple through holes 200H, respectively corresponding to the multiple light emitting elements 10 . In some embodiments, one through hole 200H can also correspond to multiple light-emitting elements 10 . Taking the electronic device 1 shown in FIG. 1A as an example, part of the substrate 200 between the core layer 101 and the optical signal outlet 10P can be removed, so that the substrate 200 has a through hole between the core layer 101 and the optical signal outlet 10P ( (not shown), so that the optical signals 10L coming from different light-emitting elements 10 and transmitted in the core layer 101 can pass through this through hole (not shown) and be directly transmitted toward the optical signal outlet 10P.

The substrate 200 of the electronic device 4 may also have a groove 200G, which is disposed on the first surface 201, and the light-emitting element 10 is disposed on the bottom surface of the groove 200G. Furthermore, the electronic device 4 further includes a reflective layer 200R, which is disposed on the oblique side surface of the groove 200G and surrounds the light-emitting element 10 . The reflective layer 200R may be made of the same material as the metal layer 103 of the optical waveguide layer 100, or may be made of different materials. The reflective layer 200R surrounding the light-emitting element 10 and arranged obliquely with respect to the first surface 201 can ensure that the optical signal 10L emitted by the light-emitting element 10 is transmitted towards the core layer 101 and the optical signal outlets 10P5 and 10P6, but not towards the substrate 200 or the redistribution layer. 300 and IC chip 20 leak light.

The light-emitting element 10 in the above embodiment can be implemented as a laser diode or a light-emitting diode, and is directly embedded in the form of a die between the substrate 200 and the optical waveguide layer 100 without encapsulating the die with encapsulating resin. . Since the light-emitting element 10 is embedded between the substrate 200 and the optical waveguide layer 100, it does not occupy the surface of the redistribution layer 300 away from the substrate 200. Other electronic components can be configured on this surface to improve the functions of the electronic devices 1, 2, 3 and 4. sex.

To sum up, the electronic device provided by the embodiment of the present invention uses a photoelectric conversion method to convert the electrical signal of the IC chip into an optical signal through the light-emitting element. The optical signal is transmitted in the optical waveguide layer, and then the optical signal is converted by the optical receiver. converted into electrical signals. Optical signals can be transmitted through the optical waveguide layer in a total reflection manner, with low loss, high transmission speed, and the ability to transmit multiple frequencies at the same time without generating heat, which can better meet the high-frequency and high-speed requirements of 5G.

1, 2, 3, 4: Electronic devices 10:Light-emitting components 10E: Conductive pillar 10L:Light signal 10P, 10P1, 10P2, 10P3, 10P4, 10P5, 10P6: Optical signal outlet 20:IC chip 100: Optical waveguide layer 100a, 100b: front surface 100c, 100d: side surface 101:Core layer 102: Cladding 103:Metal layer 200:Substrate 200G: Groove 200H:Through hole 200R: Reflective layer 201: First surface 202: Second surface 300:Redistribution layer 300B: Conductive pad 400:Light processing system 401: Optical coupling element 402: Optical fiber 403: Optical receiver D1, D2, D3: direction

1A is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention. FIG. 1B is a perspective view of a partial structure of the electronic device shown in FIG. 1A. 2 and 3 are cross-sectional schematic diagrams of an electronic device according to embodiments of the present invention. FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the present invention.

1: Electronic devices

10:Light-emitting components

10E: Conductive pillar

10L:Light signal

10P: Optical signal outlet

20:IC chip

100: Optical waveguide layer

100a, 100b: front surface

101:Core layer

102: Cladding

103:Metal layer

200:Substrate

201: First surface

202: Second surface

300:Redistribution layer

300B: Conductive pad

D1, D3: direction

Claims (14)

An electronic device including: at least one light-emitting element; At least one IC chip configured to control the at least one light-emitting element to emit a light signal; A substrate, wherein the at least one light-emitting element is disposed on a first surface of the substrate, and the at least one IC chip is disposed on a second surface of the substrate; and An optical waveguide layer is arranged on the first surface of the substrate, and the optical waveguide layer includes: core layer; cladding; and A metal layer disposed on at least a part of the interface between the core layer and the cladding layer; At least one optical signal outlet corresponds to the at least one light-emitting element, and the optical signal reaches the at least one optical signal outlet after being transmitted in the core layer. The electronic device of claim 1, wherein the refractive index of the core layer is greater than the refractive index of the cladding layer. The electronic device of claim 1, wherein part of the metal layer surrounds the at least one light-emitting element. The electronic device of claim 1, wherein the at least one optical signal outlet is disposed on a side surface of the optical waveguide layer. The electronic device of claim 1, wherein the at least one optical signal outlet is disposed on the front surface of the optical waveguide layer. The electronic device of claim 1, wherein the number of the at least one optical signal outlet is multiple, one of the multiple optical signal outlets is disposed on the front surface of the optical waveguide layer, and the Another one of the plurality of optical signal outlets is disposed on a side surface of the optical waveguide layer. The electronic device of claim 1, wherein the core layer is patterned, the number of the at least one light-emitting element is multiple, and the number of the at least one optical signal outlet is one. The electronic device according to claim 1, further comprising a redistribution layer disposed between the substrate and the at least one IC chip. The electronic device of claim 1, wherein the substrate is provided with at least one through hole, and the at least one optical signal outlet is located in the through hole. The electronic device according to claim 1, further comprising an optical coupling element and an optical fiber. The optical coupling element is disposed at the at least one optical signal outlet and connected to the optical fiber to transmit the light emitted by the at least one light-emitting element. Optical signals couple into optical fibers. The electronic device according to claim 10, further comprising an optical receiver connected to the optical fiber and converting the optical signal into an electrical signal. The electronic device of claim 1, wherein the substrate has at least one groove disposed on the first surface, and the at least one light-emitting element is disposed on the bottom surface of the at least one groove. The electronic device according to claim 12, further comprising a reflective layer disposed on the inclined side of the at least one groove and surrounding the at least one light-emitting element. The electronic device according to claim 13, wherein the reflective layer and the metal layer are made of the same material.

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