TWI402549B - Optoelectric interconnection module - Google Patents

Description

Photoelectric interconnect module

The present invention relates to an optoelectronic interconnection module, and more particularly to an optoelectronic interconnection module capable of rapidly aligning optical waveguide components and simultaneously transmitting optical signals and electrical signals.

With the rapid development of communication systems and Very Large Scale Integration (VLSI) technology, the technology applied to optical fiber communication systems and other related optical systems has rapidly developed, and the speed of communication and computer equipment has been greatly increased. Up to now, in the development of Wavelength Division Multiplexing (WDM), the most important thing is the problem of optical coupling between optical waveguide components and optical fiber arrays. The demand for signal transmission is increasing. The way in which copper conductors transmit electronic signals is limited by the lack of bandwidth, and it is impossible to load such a large transmission signal, and copper wires will be generated during high-speed transmission. Electromagnetic interference, reduced transmission reliability, and difficulty in heat dissipation.

In order to improve this problem, in recent years, the technology of developing an opto-electric hybrid circuit has been developed. The optical waveguide component is combined with the optical transceiver component, and the light wave passing through it is split, concentrated, and optically switched through the step of aligning alignment. A functional optical technique for integrating mutually separated photovoltaic elements onto a fabrication substrate to replace conventional metal wires as a medium for transmitting electronic signals. The optical transmission has high parallelism, high frequency width, and extremely low electromagnetic interference (EMI) characteristics, and the opto-electric hybrid substrate has a small overall size, a manufacturing process, and The system has low complexity, low optical loss, and good reliability of optoelectronic components, and is very suitable for signal transmission applications between boards or wafers.

In the conventional optical waveguide coupling structure, a common manufacturing method is an optical fiber-optic connection between the core of the optical fiber and the optical waveguide of the optical waveguide component by an optical and mechanical connection method; the other method is performed on the semiconductor substrate. The etching process is performed to form a V-shaped alignment trench in which the optical fiber is placed, and the Flip-Chip technology is used to align the core of the optical fiber to the optical waveguide, and the alignment of the etching trench of the prior art is performed. The technology is divided into two methods: Passive Alignment and Active Alignment. The passive alignment technique is to form the V-shaped alignment trench and complete the alignment relationship between the optical fiber and the optical waveguide. The active alignment technique first forms an alignment trench, and after the optical fiber core is disposed in the trench, the optical alignment is adjusted (the relative positions of the two are adjusted according to the coupling efficiency thereof) to achieve the alignment step. The fiber and the optical waveguide are optimally matched and docked.

The technical contents of a flexible active signal cable and a photoelectric composite interconnection and electronics device using same are disclosed in the patents of the U.S. Patent No. 7,130,511 and the Patent No. 2006/0067608. The photoelectric conversion element is electrically disposed on the flexible circuit board to form an opto-electric hybrid circuit. However, the structures of the above two patents are susceptible to the excessive order of the optical hybrid circuit substrate due to the sequential sequence of the optical waveguide component and the photovoltaic component (for example, the optical emitter and the optical receiver), and the optical waveguide component and the photovoltaic component. Coupling alignment is not effective, which will cause optical loss, increase light propagation loss, and thus affect the luminous flux of light waves entering or outputting the optical waveguide.

The opto-electric hybrid circuit disclosed in the above previous case must be manufactured in the order of its manufacturing process. Sequential and uninterruptible, if a part of the manufacturing process produces manufacturing errors, the components of the opto-electric hybrid circuit will be damaged, resulting in reduced manufacturing yield and increased manufacturing costs. In addition, when the above-mentioned conventional photoelectric hybrid circuit is used under a high stress load environment, the photovoltaic element disposed on the flexible circuit board has poor supportability, and the optical power supply member is easily deformed by the deflection of the flexible circuit board. The board is detached, causing problems such as reduced reliability and shortened service life.

The invention provides an optoelectronic interconnection module, which improves the photoelectric hybrid circuit of the prior art, and the coupling effect between the optical waveguide component and the optoelectronic component is not good, resulting in poor overall optical coupling efficiency and complicated process of the opto-electric hybrid circuit. And the cost is too high, and the photoelectric element is easily peeled off from the flexible circuit board and damaged.

The optoelectronic interconnection module disclosed in the present invention comprises at least one optical platform, at least one optoelectronic component, and a flexible optical circuit board. The optical platform has at least one pair of bit grooves and a reflecting surface corresponding to one of the alignment grooves, and the photoelectric element is disposed on the optical platform and is adapted to emit or receive an optical signal. The flexible optical circuit board is connected to the optical platform and has at least one optical waveguide component. One end of the optical waveguide component is disposed in the alignment trench and aligned with the reflective surface, so that the optical signal can be injected by the reflection of the reflective surface. The photovoltaic element is either within the optical waveguide component.

The optical interconnect module of another embodiment includes at least one optical platform, at least one optoelectronic component, and a flexible optical circuit board. The optical table has at least a first alignment mark. The optoelectronic component is disposed on the optical platform and is adapted to emit or receive an optical signal. The flexible optical circuit board is coupled to the optical platform, and has at least one optical waveguide component and at least one second alignment mark, and the optical waveguide component is terminated by the first The alignment mark is coupled to the second alignment mark to be aligned with the photovoltaic element such that the optical signal is coupled into the photovoltaic element or the optical waveguide element.

The effect of the invention is that the alignment mechanism of the alignment trench or the alignment mark enables the optical waveguide component to accurately align the photovoltaic component, thereby reducing the coupling loss, thereby improving the light transmission efficiency and improving the conventional photoelectric hybrid circuit. The problem of poor light coupling. The process of the invention is simple, the components can be independently manufactured and then quickly and accurately positioned and assembled, the manufacturing process and the manufacturing man-hour are greatly simplified, and the photoelectric interconnect module of the invention can simultaneously transmit optical signals and electrical signals, so as to be different. Demand for use.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

The embodiment of the present invention includes an optical table 110, a photovoltaic element 120, and a flexible optical circuit board 130. The optical platform 110 has at least one pair of bit trenches 111 and one of the reflective surfaces 112 corresponding to the alignment trenches 111. The optoelectronic component 120 is disposed on the optical platform 110, and the optoelectronic component 120 can be a light emitter or a light. The receiver, such that the optoelectronic component 120 has an optical transceiver 121, and the embodiment may use a surface-emitting optoelectronic component, such as a surface-emitting laser (VCSEL) or a surface-receiving detector (Top-View PD). However, it is not limited to this embodiment, and those skilled in the art may also use edge type photovoltaic elements. When the photoelectric element 120 is actuated, an optical signal is emitted or received by the optical transceiver port 121 to perform an operation of photoelectric signal conversion. The optical transceiver port 121 and the reflecting surface 112 of the optical platform 110 face each other at an angle. Alignment trench The 111 and the reflective surface 112 are formed by microfabrication techniques such as semiconductor process etching, micro-cutting, micro-imprinting, micro-molding, micro-discharge processing, or micro-polishing.

The material of the flexible circuit board 130 is an organic polymer material, for example, an epoxy resin, an acrylic resin, or a polyester resin, but is not limited to the embodiment. The flexible circuit board 130 is connected to the optical platform 110, and the flexible circuit board 130 has at least one conductive circuit 131 for transmitting electrical signals, and at least one optical waveguide element 132 for transmitting optical signals. Wherein, one end of the optical waveguide component 132 is disposed in the alignment trench 111, the optical waveguide component 132 is aligned with the reflective surface 112 by the alignment of the alignment trench 111, and the reflective surface 112 faces the optical waveguide component 132. The angle is inclined from 30 degrees to 60 degrees, and the angle is preferably 45 degrees, but not limited thereto. The optical signal is incident on the optical transceiver 121 or the optical waveguide component 132 by reflection of the reflective surface 112. To perform the conversion of photoelectric signals.

Referring to FIG. 2A to FIG. 2C, another embodiment of the optoelectronic interconnection module is disclosed. The invention includes an optical platform 110, a photoelectric component 120, and a flexible optical circuit board 130. The optical table 110 has at least one first alignment mark 114. The optoelectronic component 120 is disposed on the optical platform 110, and the optoelectronic component 120 can be a light emitter or a light receiver. In this embodiment, an edge-emitting photoelectric component, such as an edge emitting laser (Edge Emitting Laser), is selected. , EEL) or edge light interception detector (EVPD), but not limited to this embodiment, those who are familiar with the technology may also use surface-emitting photoelectric elements. When the optoelectronic component 120 is actuated, the optoelectronic component 120 emits or receives an optical signal to perform an optoelectronic signal conversion operation.

The flexible circuit board 130 is coupled to the optical table 110, and the flexible circuit board 130 has at least one conductive circuit 131, at least one optical waveguide component 132, and at least A second alignment mark 133. The second alignment mark 133 is aligned with the first alignment mark 114 and connected to each other such that one end of the optical waveguide element 132 is accurately aligned with the photoelectric element 120, and the optical signal is coupled and injected into the photoelectric element 120 or light. In the waveguide element 132, the conversion of the photoelectric signal is performed.

The first alignment mark 114 and the second alignment mark 133 are formed on the optical table 110 and the flexible circuit board 130, respectively. When the two alignment marks 114 and 133 are electrically connected to each other, the optical platform 110 and the flexible optical circuit board 130 are electrically connected to transmit electrical signals.

As shown in FIG. 3A to FIG. 3C, the embodiment of the optoelectronic interconnection module of the present invention further includes two optical platforms 110, two optoelectronic components 120, and a flexible optical circuit board 130. The optical platform 110 has two V-shaped alignment trenches 111 and two reflective surfaces 112 corresponding to the alignment trenches 111, and the two photovoltaic elements 120 are respectively a light emitter and a light receiver, and are individually arranged. On the optical platform 110, the two photoelectric elements 120 respectively have an optical transceiver 121. When the photoelectric element 120 is actuated, an optical signal is emitted from the optical transceiver 121 of the optical transmitter, and the optical signal is received by the optical transceiver 121 of the optical receiver. The light emitter disclosed in the present invention may be an edge emitting laser (EEL) or a surface emitting laser (VCSEL), and the optical receiver may be an edge receiving optical detector (EVPD). It is also a Top-View PD, but it is not limited to this embodiment.

The flexible circuit board 130 is connected between the two optical platforms 110, and the flexible circuit board 130 has a plurality of conductive circuits 131 and two optical waveguide elements 132, wherein the conductive circuit 131 and the optical waveguide element 132 are coupled to each other to A flexible optical circuit board 130 is constructed as a unitary structure. In this embodiment, the optical waveguide component 132 is a cylinder. In the optical fiber, the two ends of the optical waveguide component 132 are respectively disposed in the alignment trench 111, and the cylindrical optical waveguide component 132 is in contact with the V-shaped alignment trench 111 by its tangential coplanarity, so that the optical waveguide component 132 It can be stably disposed in the alignment trench 111, so that the end surface of the optical waveguide component 132 is aligned with the reflective surface 112, and the reflective surface 112 faces the optical waveguide component 132 at an angle of 30 degrees to 60 degrees, and The good angle is 45 degrees. However, the reflective surface 112 can be matched with the optical path design of the actual optical waveguide component 132, and is inclined to an appropriate angle, and is not limited to the 45 degree angle disclosed in the embodiment.

The optical signal emitted by the light emitter is reflected into the optical waveguide component 132 by the reflection of the reflective surface 112, and transmitted through the reflective surface 112 of the other optical platform 110 to reflect the optical signal into the optical receiver to perform the photoelectric signal. Conversion. In addition, a metal plating film 1121 can be plated on the reflective surface 112 of the optical platform 110 to increase the reflection effect of the optical signal.

It should be noted that the optoelectronic interconnection module disclosed in the present invention may also be designed as a single optical platform 110 having a photoreceiver to connect two or more optical platforms 110 having optical emitters to achieve multiple optical signal transmission. The effect is to greatly improve the performance. Moreover, the above embodiment can also utilize the alignment mechanism of the first alignment mark 114 and the second alignment mark 133 to align the plurality of optical waveguide elements 132 to the photovoltaic elements 120 on the plurality of optical platforms 110, respectively. The above is disclosed by the alignment mechanism of the alignment trench 111.

Please continue to refer to "3A" to "3C". The optical platform 110 and the flexible circuit board 130 are respectively provided with a plurality of conductive contacts 140. When the flexible optical circuit board 130 is connected to the optical platform 110, the optical interface 110 is electrically connected to the conductive contacts 140 on the flexible circuit board 130 to electrically connect the optical platform 110. With the flexible circuit board 130, the electrical signals generated by the photovoltaic elements can be conducted through the conductive contacts 140 of the optical table 110 through the conductive pads to be conducted in the circuits of the flexible circuit board 130 and the circuit board 160. Among them, the conductive contact 140 is formed by micro-fabrication techniques such as semiconductor process etching, micro-blasting, micro-discharge processing, microelectrochemistry, micro-grinding or micro-drilling, and then using ion sputtering, micro-plating, etc. The surface of the crucible is plated with a conductive material or filled with a conductive material in the conductive contact 140.

At the same time, the conductive contact 140 can also serve as an auxiliary alignment mechanism for the optical waveguide component 132 to be disposed on the alignment trench 111, and for fixing the optical platform 110 and the flexible optical circuit board 130, so as to make the photoelectric interaction of the present invention. The module can be assembled more quickly and has good optical coupling performance. The number and location of the conductive contacts 140 of the present invention may be modified according to the requirements of the actual circuit design, and are not limited to the embodiment.

Referring to FIG. 3D, the optical waveguide component 132 disclosed in the present invention can also use an optical waveguide as a medium for optical signal transmission in addition to the above-mentioned optical fiber type. The optical waveguide of the present invention is a rectangular structure including a first cladding layer 1321, a core layer 1322 covering the first cladding layer 1321, and a second cladding layer 1323 covering the core layer 1322. To form an optical signal transmission path. In addition, the alignment trench 111 of the optical table 110 is designed in a trapezoidal shape and conforms to the shape of the optical waveguide. When the optical waveguide component 132 is disposed on the alignment trench 111, the bottom side of the optical waveguide component 132 is completely fitted into the alignment trench 111 to align the optical waveguide component 132 with the reflective surface 112 of the optical table 110. In addition, as shown in FIG. 3E, the trapezoidal alignment trench 111 of the present invention is further recessed with a matching portion 1111 conforming to the optical waveguide component 132, and the optical waveguide component 132 is disposed on the alignment trench. At 111, it can be accurate and The optical waveguide element 132 is quickly aligned to the reflective surface 112, and the optical waveguide element 132 is less likely to be misaligned, resulting in a problem of reduced optical coupling efficiency. The configuration of the alignment portion 1111 is designed according to the external shape of the optical waveguide component 132. The optical waveguide component 132 can be closely embedded before the alignment portion 1111, and the alignment portion 1111 can be designed into any geometric shape. It is not limited to this embodiment.

As shown in the implementation diagrams of "4A" to "4C", the present invention can also simplify the design of the two alignment trenches 111 of the optical table 110 as a single alignment trench 111. The plurality of optical waveguide elements 132 can share the reflective surface 112 corresponding to the single alignment trench 111 for optical signal transmission, and greatly simplify the manufacturing process of the optical platform 110 for forming the alignment trench 111, and a single alignment trench The slot 111 can accommodate different types of optical waveguide components 132 to improve the commonality of the optoelectronic interconnect modules. Referring to FIG. 5A and FIG. 5B, the optical platform 110 of the present invention is further electrically provided with a driving circuit 150 and electrically connected to the photovoltaic element 120 to actuate the optical component 120 to emit or receive light. Signal and perform the conversion of photoelectric signals.

Referring to FIG. 6 , the conductive circuit 131 and the optical waveguide component 132 of the flexible circuit board 130 of the present invention may also be designed to be separated from each other and disposed between the two optical platforms 110 respectively. In this embodiment, the optical waveguide component 132 and the flexible circuit board 134 respectively transmit optical signals and electrical signals, and the optical signals are emitted from the optical components 120 (ie, light emitters) disposed on the optical platform 110 via the reflective surface 112. The light is transmitted to the optical waveguide component 132 and then transmitted to the photovoltaic component 120 (ie, the optical receiver) on the other optical platform 110 via the optical waveguide component 132; and the electrical signal of the driving circuit 150 is transmitted through the conductive contact 140 of the optical platform 110. The circuit board 160 is electrically connected to the flexible circuit board 134. Wherein, the material of the circuit board 160 of the present invention can be selected from hard materials. The material is made to strengthen the structural strength of the optoelectronic interconnect module, and the flexible optical circuit board 130 is easily damaged by stress concentration, resulting in a reduction in service life.

A schematic diagram of an embodiment of an optoelectronic interconnection module shown in FIG. 7 , the flexible optical circuit board 130 includes a conductive circuit 131 for conducting electrical signals and an optical waveguide component 132 for conducting optical signals, and a flexible optical circuit board According to the conventional soft board standard process, the conductive circuit 131 and the optical waveguide component 132 are combined in the same flexible board, and the conductive circuit 131 can also be designed as an inner layer or an outer layer of the flexible board. limit. The optical waveguide component 132 is disposed in the alignment trench 111 of the optical table 110 and is aligned with the reflective surface 112 by passive alignment of the alignment trench 111. The optical platform 110 and the conductive contacts 140 of the flexible circuit board 130 are aligned with each other, and the optical platform 110 and the flexible optical circuit board 130 are fixedly bonded by metal solder joints.

The photo-electric component 120 is disposed on the optical platform 110 by a flip chip technology, and the emitted optical signal is reflected into the optical waveguide component 132 via the reflective surface 112 of the optical platform 1110, and the optical signal is transmitted through the optical waveguide component 132. The light-emitting element 120 of the other optical table 110 is then reflected by the reflection of the other reflective surface 112. The electrical signals generated by the drive circuit 150 are transmitted through the conductive pads to the circuits of the flexible circuit board 130 and the circuit board 160.

In addition to the alignment of the optical waveguide component 132 by the alignment trench 111, the photoelectric interconnection module of the above-mentioned various types may be first as shown in the implementation diagrams of "8A" to "9th drawing". The interconnection between the alignment mark 114 and the second alignment mark 133 is such that the optical waveguide element 132 is aligned with the photovoltaic element 120 of the optical table 110.

The optoelectronic interconnect module of the present invention is aligned by alignment trench or alignment mark The alignment of the mechanism enables the end face of the optical waveguide component to be quickly and accurately aligned to the reflective surface, and the optical signal is transmitted to the optoelectronic component with minimal optical propagation loss to reduce optical coupling loss and improve optical transmission efficiency.

The process of the optoelectronic interconnection module disclosed in the invention has high integration, simplifies the complexity of the process and the manufacturing cost, and has high tolerance of assembly and positioning deviation of the optical waveguide component, quick assembly and easy, good reliability, and use. The lifetime is long, and the optoelectronic interconnect module of the present invention can simultaneously transmit optical signals and electrical signals to meet different usage requirements.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

110‧‧‧ Optical platform

111‧‧‧ Alignment groove

1111‧‧‧Parts

112‧‧‧reflecting surface

1121‧‧‧Metal coating

114‧‧‧First registration mark

120‧‧‧Optoelectronic components

121‧‧‧Optical transceiver

130‧‧‧Flexible circuit board

131‧‧‧Conductive circuit

132‧‧‧ Optical waveguide components

1321‧‧‧First cladding

1322‧‧‧ core layer

1323‧‧‧Second coating

133‧‧‧ second registration mark

134‧‧‧Flexible circuit board

140‧‧‧Electrical contacts

150‧‧‧ drive circuit

160‧‧‧ boards

1A is an exploded top view of a first embodiment of the present invention; FIG. 1B is a side view showing a first embodiment of the present invention; FIG. 1C is a cross-sectional view showing a first embodiment of the present invention; 2B is a top view of a second embodiment of the present invention; 2C is a side view of a second embodiment of the present invention; and FIG. 3A is an exploded top view of a third embodiment of the present invention; Figure 3B is a side view of a third embodiment of the present invention; 3C is a cross-sectional view showing a third embodiment of the present invention; FIG. 3D is a cross-sectional view showing a third embodiment of the present invention; FIG. 3E is a cross-sectional view showing a third embodiment of the present invention; 4B is a cross-sectional view of a fourth embodiment of the present invention; FIG. 4C is a cross-sectional view of a fourth embodiment of the present invention; and FIG. 5A is an exploded top view of a fifth embodiment of the present invention; 5B is a side view of a fifth embodiment of the present invention; FIG. 6 is a side view of a sixth embodiment of the present invention; and FIG. 7 is a side view of the flexible optical circuit board of the present invention coupled to an optical table; Figure 8 is a side elevational view of the flexible optical circuit board of the present invention coupled to the optical table by the alignment mark; Figure 8B is a side view of the flexible optical circuit board of the present invention coupled to the optical table by the alignment mark; Figure 9 is a side elevational view of the split-type flexible optical circuit board of the present invention bonded to the optical table by alignment marks.

110‧‧‧ Optical platform

111‧‧‧ Alignment groove

112‧‧‧reflecting surface

120‧‧‧Optoelectronic components

130‧‧‧Flexible circuit board

131‧‧‧Conductive circuit

132‧‧‧ Optical waveguide components

140‧‧‧Electrical contacts

150‧‧‧ drive circuit

Claims (17)

An optoelectronic interconnection module comprising: at least one optical platform having at least one pair of bit grooves and a reflecting surface corresponding to the one of the alignment grooves; at least one photoelectric element disposed on the optical platform And transmitting or receiving an optical signal; and a flexible circuit board connected to the optical platform, the flexible optical circuit board having at least one conductive circuit and at least one optical waveguide component, and one end of the optical waveguide component is disposed on the optical waveguide component In the alignment trench, wherein the optical signal is incident on the photo-electric component or the optical waveguide component by reflection of the reflective surface. The optoelectronic interconnection module of claim 1, wherein the alignment trench is a V-shaped trench, and the optical waveguide component is an optical fiber, and the optical fiber is placed in the V-shaped trench and Align the reflective surface. The optoelectronic interconnection module of claim 1, wherein the alignment trench is a trapezoidal trench, and the optical waveguide component is an optical waveguide, and the optical waveguide is placed in the trapezoidal trench Align the reflective surface. The optoelectronic interconnect module of claim 3, wherein the trapezoidal trench further has a pair of locations to position the optical waveguide to align the reflective surface. The optoelectronic interconnect module of claim 1, wherein the reflective surface is inclined at an angle of from 30 degrees to 60 degrees with respect to the optical waveguide element. The optoelectronic interconnect module of claim 1, wherein the reflective surface has a metal coating. The optoelectronic interconnection module of claim 1, wherein the optical platform and the flexible optical circuit board respectively have at least one conductive contact, and the conductive contacts are electrically connected to each other to electrically conduct the Optical platform and the flexible optical circuit board. The optoelectronic interconnection module of claim 1, wherein the optical platform further has a driving circuit electrically connected to the optoelectronic component for actuating the optoelectronic component. . The optoelectronic interconnection module of claim 1, further comprising at least two optical platforms and at least two of the optoelectronic components, wherein the two ends of the optical waveguide components are respectively disposed on the alignment grooves of the optical platforms The slots are aligned with the reflective surfaces of the optical platforms and the optoelectronic components. The optoelectronic interconnect module of claim 1, wherein the optical waveguide component and the conductive circuit are coupled to each other. The optoelectronic interconnect module of claim 1, wherein the optical waveguide component is disposed separately from the conductive circuit. An optoelectronic interconnection module comprising: at least one optical platform having at least one first alignment mark; at least one optoelectronic component disposed on the optical platform, adapted to emit or receive an optical signal; and a flexible circuit board, coupled to the optical platform, the flexible optical circuit board having at least one conductive circuit, at least one optical waveguide component, and at least one second alignment mark, the optical waveguide component being terminated by the second pair The bit mark is aligned with the first alignment mark to be aligned with the photo-electric element, and the optical signal is coupled to the photo-electric element or the optical waveguide element. The optoelectronic interconnection module of claim 12, wherein the first alignment mark and the second alignment mark are a conductive joint. The optoelectronic interconnect module of claim 12, wherein the optical platform further has a driving circuit electrically connected to the optoelectronic component for actuating the optoelectronic component. The optoelectronic interconnection module of claim 12, further comprising at least two optical platforms and at least two of the optoelectronic components, wherein the two ends of the optical waveguide component are respectively disposed on the optical platforms, and respectively These optoelectronic components are permitted. The optoelectronic interconnect module of claim 12, wherein the optical waveguide component and the conductive circuit are coupled to each other. The optoelectronic interconnect module of claim 12, wherein the optical waveguide component is disposed separately from the conductive circuit.