WO2011125645A1 - 車載用電子機器 - Google Patents

車載用電子機器 Download PDF

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Publication number
WO2011125645A1
WO2011125645A1 PCT/JP2011/057785 JP2011057785W WO2011125645A1 WO 2011125645 A1 WO2011125645 A1 WO 2011125645A1 JP 2011057785 W JP2011057785 W JP 2011057785W WO 2011125645 A1 WO2011125645 A1 WO 2011125645A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing material
electronic device
metal base
recess
connector
Prior art date
Application number
PCT/JP2011/057785
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
拓 小山
博幸 阿部
利昭 石井
弘二 佐藤
円丈 露野
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Publication of WO2011125645A1 publication Critical patent/WO2011125645A1/ja

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/088—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings or inlets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Definitions

  • the present invention relates to an in-vehicle electronic device having a first constituent member (for example, a metal base) and a second constituent member (for example, a connector or a metal cover) that are bonded with an adhesive that also serves as a sealing material.
  • a first constituent member for example, a metal base
  • a second constituent member for example, a connector or a metal cover
  • an in-vehicle electronic device such as an engine control unit for automobiles, a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, a base for holding the circuit board and the connector, A device having a connector and a sealing cover that covers the base to cover the circuit board is known.
  • the base and the connector, the connector and the cover, and the cover and the base are usually sealed and sealed with a sealing material between them, and the cover and the base are fixed with screws. Fixed.
  • Patent Document 1 in a seal structure in which a sealing material is interposed between seal surfaces facing each other to seal between the seal surfaces, at least one edge of the seal surface has a large interval between the seal surfaces.
  • a seal structure is disclosed in which a gap is formed by cutting a gap between the seal surfaces and between the seal surfaces. Attempts have been made to achieve such a seal structure that is resistant to initial sealability and vibration shock.
  • In-vehicle electronic devices used outside the passenger compartment such as the engine room are required to be durable and waterproof in consideration of use in various environments in addition to the initial waterproofness.
  • the housing of an in-vehicle electronic device is often composed of a highly rigid metal in consideration of use in various environments.
  • calcium chloride is sprayed for melting and freezing prevention of roads.
  • Patent Document 1 is effective as a seal structure excellent in initial sealability and impact resistance, but has not been sufficiently studied from the viewpoint of salt corrosion resistance.
  • An object of the present invention is to provide an in-vehicle electronic device having a seal structure with high salt corrosion resistance and excellent durability and waterproofness.
  • the present invention provides a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, and a metal on which the circuit board is mounted and the connector is bonded via a sealing material
  • a vehicle-mounted electrical apparatus comprising: a base; and a metal cover that is bonded to the metal base and the connector via a sealing material and seals a part of the circuit board and the connector, wherein the metal base or the metal cover is sealed
  • a plurality of recesses are formed inside the housing of the adhesive bonding surface, and the recesses are filled with a sealing material.
  • a plurality of recesses are formed inside the casing of the sealant bonding surface of the metal base or the metal cover, and protrusions are formed on the metal base or the metal cover at a portion facing the recess via a sealing material.
  • the sealing material is filled in the gap between the recess and the protrusion.
  • the width of one recess is larger than the width of the other projection, and the recess and the projection are bonded by a sealing material so as to face each other.
  • the depth of the recess or the height of the protrusion is larger than the thickness of the sealing material.
  • planarization can be performed by mechanical polishing or by applying a liquid that forms a flat film after drying, which is composed of polyamideimide.
  • the inside of the case with the sealing agent bonding surface means the space side sealed by the metal cover, and the outside of the case with the sealing agent bonding surface means the opposite side.
  • an in-vehicle electronic device having a seal structure with high salt corrosion resistance and excellent durability and waterproofness.
  • FIG. 1A is an external perspective view showing an embodiment of an in-vehicle electronic device according to the present invention
  • FIG. 1B is a development view showing an internal structure of the in-vehicle electronic device
  • FIG. FIG. 3 is a schematic sectional view and FIG.
  • the in-vehicle electronic device 10 of the present embodiment is used as an automobile engine control unit, and an electric circuit board 14 and external sensors and control mechanisms are electrically connected to a circuit board 14 on which an electronic component 21 is mounted.
  • the connector 13 is connected and fixed to the metal base 15, the connector 13 is bonded to the heat radiating metal base 15 on which the circuit board 14 is mounted via the adhesive 20 that also serves as a sealing material, and the metal cover 11 is sealed to the metal base 15.
  • the connector 13 and the metal cover 11 are bonded via the sealing material 20.
  • the circuit board 14 is a rectangular resin printed wiring board.
  • a eutectic solder paste is printed on the surface of the circuit board 14 by a screen printing machine, and a required electronic component 21 is mounted by an automatic mounting machine, and then soldered by a solder reflow furnace.
  • the electronic component 21 is an arithmetic IC, a chip resistor, a chip capacitor, an aluminum electrolytic capacitor, or the like.
  • the connector 13 includes a substantially rectangular parallelepiped housing 13A formed of a thermoplastic resin and a required number of metal terminals 13B accommodated in the housing 13A.
  • the housing 13A is a rounded circle into which an external harness plug is inserted.
  • a rectangular plate-like large and small socket parts 13c, 13d, a thick plate-like terminal holding holding wall part 13e for holding the metal terminal 13B, and a front view outer shape protruding inward from the terminal holding wall part 13e is trapezoidal. And has a cylindrical inward protruding portion 13f.
  • the metal terminal 13B is, for example, a 0.5 mm thick copper plate punched out to a width of 0.5 mm, and press-formed into an L shape. Tin-plated. Also, the metal terminal 13B has X terminal (for example, 80 terminals) for input to the larger socket part 13c, and Y terminal (for example, 40 terminals) for output to the smaller socket part 13d, respectively. 13e and the inwardly projecting portion 13f are inserted into through holes formed in the bottom surface portion, and are held and fixed (in the drawing, each portion is depicted in a simplified manner).
  • the connector 13 is integrally attached and fixed to the front end portion of the circuit board 14 with fixing claws.
  • the lower end portion of the metal terminal 13B of the connector 13 is inserted into a through hole 14s formed in the circuit board 14 so as to protrude about 1 mm downward therefrom, and this lower end portion is soldered to the circuit board 14. Are joined and electrically connected.
  • the heat radiating metal base 15 is made of aluminum die-casting and is rectangular in plan view. On the main surface side on which the circuit board 14 is mounted, a convex portion 15d on which the circuit board 14 is placed protrudes. A heat dissipation fin 15b is formed on the back side.
  • the metal cover 11 is formed by pressing a steel plate having a thickness of 0.5 mm into a tray shape, has a rectangular shape in plan view, a portion 11A covering the circuit board 14 has a depth of about 19 mm, and a connector 13 (inward protruding portion 13f of the connector 13).
  • 11B has a depth of about 30 mm, and the outer peripheral portion of the three sides excluding the front end side is laid down to form an L-shaped flange portion 11C.
  • the flange portion 11C is a portion that comes into contact with the sealing material 20 (third adhesive material layer 20C) applied on the three side end portions 15B, 15C, and 15D of the metal base 15, and is close to the four corners thereof.
  • a screw-fastening stepped convex portion 18 for fastening and fixing the metal cover 11 to the metal base 15 with a screw 19, and the metal base through a screw through hole formed in the stepped convex portion 18.
  • a screw 19 is screwed into the female screw portion 15 (see FIG. 2).
  • the flange portion 11C is formed so as to draw an arc on the inner side of the stepped convex portion 18 for screwing to avoid the flange portion 11C.
  • a hole for attaching the waterproof filter 22 is formed in the central portion of the metal cover 11, and the entire surface of the metal cover 11 is galvanized.
  • FIG. 4 shows a cross-sectional structure of the seal portion and a perspective view of the metal base.
  • FIG. 4 shows an example in which a plurality of recesses 530 are intermittently formed inside the housing of the sealing material bonding surface 512 of the metal base 15.
  • the sealing material 20 is applied to the sealing material bonding surface 512 of the metal base 15 on which the circuit board 14 is mounted.
  • the plurality of recesses 530 are filled with the sealing material 20.
  • the metal cover 11 is attached to the metal base 15, and the metal base 15 and the metal cover 11 are bonded with a sealing material.
  • a protrusion 504 for ensuring the thickness of the sealing material is formed on the sealing material bonding surface 512, and the height of the sealing material is adjusted by the protrusion 504.
  • the protrusion 504 may be a stepped protrusion 18 for screwing.
  • the metal cover 11 is configured to cover a part of the side surface of the metal base 15, and the sealing material bonding surface 512 of the metal base 15 is configured by a plurality of upper and side surfaces. Therefore, it is preferable because the intrusion of salt water in the seal portion is suppressed.
  • a plurality of recesses are formed in the metal base 15, but a plurality of recesses may be formed in the sealing material bonding surface 511 of the metal cover 11. Note that it is only necessary that the recess 530 is filled with the sealing material 20 to the extent that an adhesive force is developed, and the sealing material 20 does not necessarily have to be completely filled in the recess 530.
  • FIG. 5 shows another embodiment of the seal structure of the in-vehicle electronic device according to the present invention.
  • FIG. 5 is a cross-sectional view of a sealing structure in which a protrusion 540 is provided on the sealing material adhesion surface 511 of the metal cover 11 and a recess 530 is provided on the sealing material adhesion surface 512 of the metal base 15. Moreover, the side view which looked at the side surface of the dotted line part from the housing
  • a plurality of recesses 530 are formed inside the housing of the sealing material bonding surface 512 of the metal base 15, a protrusion 540 is formed in a portion facing the recess 530 of the metal cover, and a sealing material is filled in a gap between the recess 530 and the protrusion 540.
  • the wall surface 531 which comprises a sealing material interface is increased rather than the sealing structure of FIG. 4, and the adhesiveness of a sealing material can be improved more.
  • the thickness of the sealing material on the outside of the housing is d1 and the thickness of the sealing material on the inside of the housing is d4
  • it is desirable that the width d2 of the protrusion 540 is smaller than the width d3 of the recess, and the protrusion 540 and the recess 530 are opposed to each other.
  • FIG. 6 shows another embodiment of the seal structure of the in-vehicle electronic device according to the present invention.
  • This configuration is an example in which the outer surfaces of the sealing material bonding surfaces 511 and 512 are further flattened in the configuration of FIG.
  • the surfaces of the metal base 15 and the metal cover 11 have undulations in consideration of processing accuracy.
  • FIG. 6 by flattening the outer surfaces of the sealing material adhesion surfaces 511 and 512 that are in contact with salt water, the amount of exposure of the sealing material adhesion interface with respect to salt water is reduced, and the sealing material adhesion interface is reached. It is possible to suppress the salt water from adhering to salt water.
  • salt corrosion at the sealing material adhesion interface is mainly used to seal the sealing material at the center between the bolt that secures the cover and the base, and to fix the chassis to the engine room. It has been confirmed that this is likely to occur at locations where the amount of deformation of the sealing material is large, such as the seal portion near the bolt, or where the load on the housing is likely to be subject to vibrations.
  • the above-described seal structure mainly increases the amount of deformation of the sealing material, such as the central portion between the bolts that fix the metal cover of the casing and the metal base, and the seal portions near the bolts that fix the casing to the engine room.
  • the intermittent recesses and protrusions described above may be formed on the entire sealing material bonding surface, but may be limited to the above-described locations where salt corrosion is likely to occur. In this way, if a recess or protrusion is selectively provided at a predetermined location where salt corrosion is likely to occur, the amount of sealing material applied can be reduced, and the manufacturing cost of the electronic device can be reduced.
  • the sealing structure of the present invention improves the bonding area of the sealing material and makes it difficult for the sealing material to be peeled off even if salt corrosion on the sealing material bonding interface progresses, thereby preventing in-vehicle electronic equipment from being damaged by salt corrosion.
  • the on-vehicle electronic device of the present invention can be applied to a hybrid vehicle, an electric vehicle, or the like.
  • the seal structure shown in FIG. 4 is applied to the in-vehicle electronic device shown in FIG.
  • the metal base 15 is provided with a heat radiating sheet 521 fixed by the concave groove 522, and the circuit board 14 is disposed so as to be in contact with the heat radiating sheet 521.
  • An electronic component 21 is mounted on the circuit board 14.
  • a connector 13 is attached to the circuit board, and electrical signals are input / output between the circuit board and the outside via the connector 13.
  • a plurality of intermittent recesses 530 are formed on the inner side of the housing on the sealing material bonding surface of the metal base 15 to the metal cover 11.
  • the sealing material 520 is applied to the sealing material adhesion surface 512 of the metal base 15, and the recess 530 is filled with the sealing material.
  • the sealing material is provided so as not to come into contact with the circuit board 507, and the coating height of the sealing material is defined by a protrusion 504 for maintaining the sealing coating height provided in the vicinity of the fixing screw 19.
  • the connector 13 is disposed at a predetermined position of the metal base 15.
  • the sealing material 20 is applied to the sealing material adhesion surface of the connector 13 to the metal cover 11, the metal cover 11 to which the waterproof ventilation filter is attached is attached, and the metal base 15, the connector 13, and the metal cover are adhered by the sealing material 20.
  • the inside of the housing is sealed with a metal cover.
  • the in-vehicle electronic device 10 is installed and used in an engine room with an engine room assembling bolt.
  • the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution.
  • a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion and a 5% NaCl aqueous solution.
  • the humidity in the salt spray tank was set to 85% RH, and salt water was sprayed again.
  • the seal part did not leak even after 30 days and satisfied the required characteristics. did.
  • the adhesive force of the seal material 20 on the wall surface 531 of the recess 530 causes the seal material 20 to Even if thermal deformation or vibration due to temperature difference in the room is applied, peeling of the sealing material can be suppressed.
  • the seal structure shown in FIG. 5 is applied to the in-vehicle electronic device shown in FIG.
  • a protrusion 540 is provided on the sealing material bonding surface 511 of the metal cover 11, and a recess 530 is formed on the sealing material bonding surface 512 of the metal base.
  • the width d3 of the recess 530 is larger than the width d2 of the protrusion 540, and the height d4 of the sealing material 20 inside the housing is higher than the height d1 of the sealing material 20 outside the housing.
  • a protrusion 540 is formed so as to face the recess 530.
  • the on-vehicle electronic device 10 was manufactured in the same manner as in the first example.
  • the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution.
  • a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion and a 5% NaCl aqueous solution.
  • the humidity in the salt spray tank was set to 85% RH, and salt water was sprayed again.
  • the seal did not leak even after 40 days, and the required characteristics were satisfied. did.
  • the seal structure shown in FIG. 6 is applied to the in-vehicle electronic device shown in FIG.
  • the outer portions of the casing of the sealing material adhesion surface 511 of the metal cover and the sealing material adhesion surface 512 of the metal base 15 are flattened.
  • Other configurations are the same as those in the second embodiment.
  • Coating film 508 was formed by applying and curing a coating agent composed of polyamideimide on the surface of the outer side of the housing of sealing material adhesion surface 511 of metal cover and sealing material adhesion surface 512 of metal base 15. By this film 508, the surface becomes flatter than the surface of the inner part of the casing of the sealing material adhesion surfaces 511 and 512.
  • a coating agent composed of polyamideimide was used, but other coating agents can be used as long as they can be planarized.
  • the flattening process may be performed mechanically.
  • an in-vehicle electronic device was manufactured by the same method as in Example 1.
  • the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution.
  • the humidity in the salt water spray tank was then set to 85% RH, and salt water was sprayed again. Increased by 4 days and improved reliability.
  • FIG. 7 shows a comparative example of the present invention. It was set as the structure which provided the continuous notch 612 over the inner periphery of the housing inside the housing of the seal
  • FIG. The in-vehicle electronic device 10 was produced by the same method as in Example 1.
  • the in-vehicle electronic device of this comparative example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution.
  • a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution was sprayed on the electronic equipment, and then the humidity in the salt spray tank was set to 85% RH and salt water was sprayed again.
  • the seal part leaked in 18 days, and salt water entered the circuit board 14.
  • An electronic device has been destroyed.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
PCT/JP2011/057785 2010-04-01 2011-03-29 車載用電子機器 WO2011125645A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010084775A JP5350311B2 (ja) 2010-04-01 2010-04-01 車載用電子機器
JP2010-084775 2010-04-01

Publications (1)

Publication Number Publication Date
WO2011125645A1 true WO2011125645A1 (ja) 2011-10-13

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JP (1) JP5350311B2 (enrdf_load_stackoverflow)
WO (1) WO2011125645A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061407A (ja) * 2013-09-19 2015-03-30 株式会社デンソー 車両用回転電機
CN113424285A (zh) * 2019-03-04 2021-09-21 欧姆龙株式会社 传感器
US12088039B2 (en) 2019-11-13 2024-09-10 Hanon Systems Seal arrangement of a plug-in connection for establishing electrical connections and a device for driving a compressor with the seal arrangement

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JP5829110B2 (ja) * 2011-11-29 2015-12-09 日立オートモティブシステムズ株式会社 電子モジュール
JP2014003206A (ja) * 2012-06-20 2014-01-09 Hitachi Automotive Systems Ltd 車載電子機器および防水シール
JP6074839B2 (ja) * 2012-10-22 2017-02-08 パナソニックＩｐマネジメント株式会社 車載用照明装置
JP2014086682A (ja) * 2012-10-26 2014-05-12 Denso Corp 収納ケースおよびその製造方法
JP6144227B2 (ja) * 2014-04-18 2017-06-07 日立オートモティブシステムズ株式会社 電子制御装置
EP3032929B1 (en) * 2014-12-10 2018-08-22 Continental Automotive GmbH Housing for electronic control unit
JP2017143638A (ja) * 2016-02-09 2017-08-17 アスモ株式会社 モータ
JP6583065B2 (ja) 2016-03-09 2019-10-02 株式会社デンソー 電子装置
JP2017175067A (ja) 2016-03-25 2017-09-28 株式会社デンソー 電子制御装置
JP2017175066A (ja) 2016-03-25 2017-09-28 株式会社デンソー 電子制御装置
JP2017175069A (ja) 2016-03-25 2017-09-28 株式会社デンソー 電子制御装置
JP6590869B2 (ja) * 2017-06-21 2019-10-16 矢崎総業株式会社 電子部品ユニット、ワイヤハーネス、及び、通気部防水構造
JP6652312B1 (ja) * 2019-04-22 2020-02-19 三菱電機株式会社 電子制御装置
JP7707715B2 (ja) * 2021-07-27 2025-07-15 日本ケミコン株式会社 モジュールおよびその製造方法
US12060930B1 (en) 2023-04-26 2024-08-13 Deere & Company Sealing system for multiple fluids

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Publication number Priority date Publication date Assignee Title
JP2001085858A (ja) * 1999-09-17 2001-03-30 Denso Corp 電子制御機器のケース
JP2003258451A (ja) * 2002-03-04 2003-09-12 Hitachi Unisia Automotive Ltd 箱形制御ユニット
JP2010056493A (ja) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd 電子制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085858A (ja) * 1999-09-17 2001-03-30 Denso Corp 電子制御機器のケース
JP2003258451A (ja) * 2002-03-04 2003-09-12 Hitachi Unisia Automotive Ltd 箱形制御ユニット
JP2010056493A (ja) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd 電子制御装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061407A (ja) * 2013-09-19 2015-03-30 株式会社デンソー 車両用回転電機
CN113424285A (zh) * 2019-03-04 2021-09-21 欧姆龙株式会社 传感器
US12088039B2 (en) 2019-11-13 2024-09-10 Hanon Systems Seal arrangement of a plug-in connection for establishing electrical connections and a device for driving a compressor with the seal arrangement

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JP2011217547A (ja) 2011-10-27
JP5350311B2 (ja) 2013-11-27

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