Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
  • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/075—Silicon-containing compounds
  • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/094—Multilayer resist systems, e.g. planarising layers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
  • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
  • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
  • H01L21/0274—Photolithographic processes

Definitions

• the present invention relates to a composition for forming a lower layer film between a substrate used for manufacturing a semiconductor device and a resist (for example, a photoresist or an electron beam resist). More specifically, the present invention relates to a resist underlayer film forming composition for lithography for forming an underlayer film used as a lower layer of a photoresist in a lithography process for manufacturing a semiconductor device. Moreover, it is related with the formation method of the resist pattern using the said lower layer film formation composition.
• microfabrication by lithography using a photoresist has been performed in the manufacture of semiconductor devices.
• the microfabrication is obtained by forming a thin film of photoresist on a semiconductor substrate such as a silicon wafer, irradiating it with an actinic ray such as ultraviolet rays through a mask pattern on which a semiconductor device pattern is drawn, and developing it.
• an actinic ray such as ultraviolet rays
• fine irregularities corresponding to the pattern are formed on the substrate surface by etching the substrate using the photoresist pattern as a protective film.
• a film known as a hard mask containing a metal element such as silicon or titanium is used (for example, see Patent Document 1).
• the rate of removal by dry etching largely depends on the type of gas used for dry etching.
• the gas type it is possible to remove the hard mask by dry etching without greatly reducing the thickness of the photoresist.
• a resist underlayer film has been arranged between a semiconductor substrate and a photoresist in order to achieve various effects including an antireflection effect.
• compositions for resist underlayer films is desired because of the variety of required characteristics.
• a film known as a hard mask containing a metal element such as silicon or titanium is used (for example, see Patent Document 1).
• the rate of removal by dry etching largely depends on the type of gas used for dry etching. Then, by appropriately selecting the gas type, it is possible to remove the hard mask by dry etching without a significant decrease in the thickness of the photoresist.
• a resist underlayer film has been disposed between a semiconductor substrate and a photoresist in order to achieve various effects including an antireflection effect.
• compositions for a resist underlayer film have been studied, but development of a new material for the resist underlayer film is desired because of the variety of required characteristics.
• a composition and a pattern formation method using a compound having a bond between silicon and silicon are known (see, for example, Patent Document 2).
• a silicon-containing top antireflection film having a dicarboximide structure is described (for example, see Patent Document 3).
• An object of the present invention is to provide a resist underlayer film forming composition for lithography that can be used for manufacturing a semiconductor device. Specifically, it is to provide a resist underlayer film forming composition for lithography for forming a resist underlayer film that can be used as a hard mask. Another object of the present invention is to provide a resist underlayer film forming composition for lithography for forming a resist underlayer film that can be used as an antireflection film. Another object of the present invention is to provide a resist underlayer film for lithography that does not cause intermixing with the resist and has a higher dry etching rate than the resist, and a resist underlayer film forming composition for forming the underlayer film. An object of the present invention is to provide a method for forming a resist pattern using the resist underlayer film forming composition for lithography.
• the present invention is a resist underlayer film forming composition for lithography comprising a hydrolyzable organosilane, a hydrolyzate thereof, a hydrolysis condensate thereof or a mixture thereof as a silane compound,
• a resist underlayer film forming composition for lithography comprising a silane compound containing an organic group containing an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both in the molecule;
• the ratio of the silane compound containing an amide bond and an organic group containing a carboxylic acid part or a carboxylic acid ester part or both in the entire silane compound is less than 5 mol%.
• a resist underlayer film forming composition for lithography As a third aspect, the ratio of the silane compound containing an organic group containing an amide bond and a carboxylic acid part or a carboxylic acid ester part or both in the whole silane compound is 0.5 to 4.9 mol%.
• the resist underlayer film forming composition for lithography according to the first aspect As a fourth aspect, the hydrolyzable organosilane has the formula (1): (Wherein R 3 represents an organic group containing an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both, and represents a group bonded to a silicon atom by a Si—C bond.
• R 1 represents An organic group having an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group, and bonded to a silicon atom through a Si-C bond and .
• R 2 represents a group which is alkoxy group, an acyloxy group, or a halogen atom.
• a represents an integer of 0 or 1
• b is a compound represented by the representative.
• an integer of 1 or 2 The composition according to any one of the first to third aspects;
• the formula (2) (Wherein R 4 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an alkoxyaryl group, an acyloxyaryl group, or a cyano group.
• composition As a sixth aspect, a hydrolysis condensate of a hydrolyzable organosilane represented by the above formula (1), or a hydrolyzable organosilane represented by the above formula (1) and a compound represented by the following formula (2)
• the composition according to any one of the first to fifth aspects comprising a hydrolyzed condensate as a polymer
• the composition according to any one of the first to sixth aspects further comprising an acid as a hydrolysis catalyst
• the composition according to any one of the first to seventh aspects further comprising water
• a resist underlayer film obtained by applying and baking the resist underlayer film forming composition according to any one of the first to eighth aspects on a semiconductor substrate
• a step of applying the resist underlayer film forming composition according to any one of the first to eighth aspects on a semiconductor substrate and baking to form a resist underlayer film, on the underlayer film A step of applying a resist composition to form a resist
• a hydrolyzable group such as an alkoxy group, an acyloxy group, or a halogen atom is hydrolyzed or partially hydrolyzed, and then a polysiloxane structure is formed as a main chain by a condensation reaction of a silanol group.
• the resist underlayer film containing the polymer has high dry etching resistance against oxygen-based dry etching gas.
• the polymer has a carbon-nitrogen bond or a carbon-oxygen bond. With this configuration, the film containing the polymer has a high dry etching rate with a halogen-based gas, and the upper resist pattern can be transferred to this film.
• the resist underlayer film formed from the resist underlayer film forming composition of the present invention containing the polymer can function as a hard mask.
• the method for manufacturing a semiconductor device of the present invention it is possible to accurately transfer the upper resist pattern to the resist lower layer film compared to the case where the conventional resist lower layer film is used. Is obtained.
• a resist underlayer film is formed on a substrate by a coating method, or a resist underlayer film is formed thereon by an organic underlayer film on a substrate, and a resist film (for example, , Photoresist, electron beam resist).
• a resist film for example, , Photoresist, electron beam resist.
• a resist pattern is formed by exposure and development, and the resist underlayer film is dry-etched using the resist pattern to transfer the pattern, and the substrate is processed by the pattern, or the organic underlayer film is etched by pattern transfer.
• the substrate is processed with the organic underlayer film.
• the resist film thickness tends to be thin in order to prevent pattern collapse.
• the resist underlayer film (containing an inorganic silicon compound) of the present invention is coated on the substrate with or without an organic underlayer film, and a resist film (organic resist) is formed thereon. Film).
• the organic component film and the inorganic component film differ greatly in the dry etching rate depending on the selection of the etching gas.
• the organic component film has an oxygen-based gas and the dry etching rate increases.
• the inorganic component film has a halogen-containing gas. This increases the dry etching rate.
• a resist pattern is formed, and the resist underlayer film of the present invention present in the lower layer is dry-etched with a halogen-containing gas to transfer the pattern to the resist underlayer film, and the pattern transferred to the resist underlayer film contains halogen.
• Substrate processing is performed using gas.
• the organic underlayer film under the layer is dry-etched with an oxygen-based gas to transfer the pattern to the organic underlayer film, and the pattern-transferred organic underlayer film is halogen-containing. Substrate processing is performed using gas.
• the resist underlayer film functions as a hard mask
• a hydrolyzable group such as an alkoxy group, an acyloxy group, or a halogen atom in the structure of the above formula (1) is hydrolyzed or partially hydrolyzed, and then a polysiloxane structure polymer is formed by a condensation reaction of a silanol group.
• This polyorganosiloxane structure has a sufficient function as a hard mask.
• These bonding sites contained in the polyorganosiloxane have carbon-nitrogen bonds or carbon-oxygen bonds, and the dry etching rate with a halogen-based gas is higher than that of the carbon-carbon bonds. This is effective when transferring to the resist underlayer film.
• the polyorganosiloxane structure (intermediate film) is effective as a hard mask for etching an organic underlayer film existing underneath and processing (etching) a substrate. That is, it has sufficient dry etching resistance against oxygen dry etching gas of the organic underlayer film during substrate processing.
• the resist underlayer film of the present invention has an improvement in dry etching rate with respect to these upper layer resists and resistance to dry etching during substrate processing. A good resist pattern shape can be formed.
• the present invention relates to a resist underlayer film forming composition for lithography comprising a hydrolyzable organosilane, a hydrolyzate thereof, or a hydrolyzed condensate thereof as a silane compound, the silane compound comprising an amide bond, a carboxyl
• a resist underlayer film forming composition for lithography comprising a silane compound containing an organic group containing an acid part or a carboxylic acid ester part or both.
• the hydrolyzable organosilane is described as having an organic group containing an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both in the molecule. It has either a combination of acid moieties (amic acid structure), an amide bond and a carboxylic acid ester moiety (amic acid ester structure), or both.
• the silane compound containing an organic group containing an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both in the entire silane compound is less than 5 mol%, for example, 0.5 to 4.9 mol%, 0 0.5 to 1.0 mol%, or 0.5 to 0.999 mol%.
• the above-mentioned hydrolyzable organosilane, its hydrolyzate, and its hydrolysis condensate can also be used as a mixture thereof. It can be used in a condensate obtained by hydrolyzing a hydrolyzable organosilane and condensing the obtained hydrolyzate.
• a partial hydrolyzate or a silane compound in which hydrolysis is not completely completed when obtaining a hydrolyzed condensate can be mixed with the hydrolyzed condensate, and the mixture can also be used.
• This condensate is a polymer having a polysiloxane structure.
• This polysiloxane has an amide bond and an organic group containing a carboxylic acid moiety or a carboxylic acid ester moiety or both.
• the resist underlayer film forming composition of the present invention is a hydrolyzable organosilane having an organic group containing an amide bond and a carboxylic acid part or a carboxylic acid ester part or both, a hydrolyzate thereof, or a hydrolysis condensate thereof. And a solvent.
• a solvent As optional components, acid, water, alcohol, curing catalyst, acid generator, other organic polymer, light-absorbing compound, surfactant and the like can be included.
• the solid content in the resist underlayer film forming composition of the present invention is, for example, 0.5 to 50% by mass, 1 to 30% by mass, or 1 to 25% by mass. Here, the solid content is obtained by removing the solvent component from all components of the resist underlayer film forming composition.
• the proportion of hydrolyzable organosilane, its hydrolyzate, and its hydrolysis condensate in the solid content is 20% by mass or more, for example, 50 to 100% by mass, 60 to 100% by mass, 70 to 100% by mass. %.
• the hydrolyzable organosilane used in the present invention has a structure represented by the formula (1).
• R 3 is an organic group containing an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both, and represents a group bonded to a silicon atom by a Si—C bond.
• R 1 is an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkenyl group, or an organic group having an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group, and silicon by a Si—C bond.
• R 2 represents an alkoxy group, an acyloxy group, or a halogen atom group.
• a represents an integer of 0 or 1
• b represents an integer of 1 or 2.
• the alkyl group is a linear or branched alkyl group having 1 to 10 carbon atoms, such as a methyl group, ethyl group, n-propyl group, i-propyl group, n- Butyl, i-butyl, s-butyl, t-butyl, n-pentyl, 1-methyl-n-butyl, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl-n-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, n-hexyl group, 1-methyl -N-pentyl group, 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-butyl group, 1,2-
• a cyclic alkyl group can also be used as the alkyl group.
• the cyclic alkyl group having 1 to 10 carbon atoms includes a cyclopropyl group, a cyclobutyl group, a 1-methyl-cyclopropyl group, a 2-methyl-cyclopropyl group.
• Cyclopentyl group 1-methyl-cyclobutyl group, 2-methyl-cyclobutyl group, 3-methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group, 2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclo Propyl group, 2-ethyl-cyclopropyl group, cyclohexyl group, 1-methyl-cyclopentyl group, 2-methyl-cyclopentyl group, 3-methyl-cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3 -Ethyl-cyclobutyl group, 1,2-dimethyl-cyclobutyl group, 1 3-dimethyl-cyclobutyl group, 2,2-dimethyl-cyclobutyl group, 2,3-dimethyl-cyclobutyl group, 2,4-dimethyl-cyclobutyl group, 3,3-dimethyl-cyclobutyl group, 1-
• aryl group examples include aryl groups having 6 to 20 carbon atoms, such as a phenyl group, o-methylphenyl group, m-methylphenyl group, p-methylphenyl group, o-chlorophenyl group, m-chlorophenyl group, p -Chlorophenyl group, o-fluorophenyl group, p-mercaptophenyl group, o-methoxyphenyl group, p-methoxyphenyl group, p-aminophenyl group, p-cyanophenyl group, ⁇ -naphthyl group, ⁇ -naphthyl group, o-biphenylyl group, m-biphenylyl group, p-biphenylyl group, 1-anthryl group, 2-anthryl group, 9-anthryl group, 1-phenanthryl group, 2-phenanthryl group, 3-phenanthryl group, 4-
• alkenyl group examples include alkenyl groups having 2 to 10 carbon atoms, such as ethenyl group, 1-propenyl group, 2-propenyl group, 1-methyl-1-ethenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 2-methyl-1-propenyl group, 2-methyl-2-propenyl group, 1-ethylethenyl group, 1-methyl-1-propenyl group, 1-methyl-2-propenyl group, 1-pentenyl group 2-pentenyl group, 3-pentenyl group, 4-pentenyl group, 1-n-propylethenyl group, 1-methyl-1-butenyl group, 1-methyl-2-butenyl group, 1-methyl-3-butenyl group Group, 2-ethyl-2-propenyl group, 2-methyl-1-butenyl group, 2-methyl-2-butenyl group, 2-methyl-3-butenyl group, 3-methyl-1-butenyl group, 3 Methyl
• Examples of the organic group having an epoxy group include a glycidoxymethyl group, a glycidoxyethyl group, a glycidoxypropyl group, a glycidoxybutyl group, and an epoxycyclohexyl group.
• Examples of the organic group having an acryloyl group include an acryloylmethyl group, an acryloylethyl group, and an acryloylpropyl group.
• Examples of the organic group having a methacryloyl group include methacryloylmethyl, methacryloylethyl group, and methacryloylpropyl group.
• Examples of the organic group having a mercapto group include an ethyl mercapto group, a butyl mercapto group, a hexyl mercapto group, and an octyl mercapto group.
• Examples of the organic group having a cyano group include a cyanoethyl group and a cyanopropyl group.
• alkoxy group having 1 to 20 carbon atoms in R 2 of the formula (1) examples include alkoxy groups having a linear, branched or cyclic alkyl moiety having 1 to 20 carbon atoms, such as a methoxy group and an ethoxy group.
• the acyloxy group having 1 to 20 carbon atoms is, for example, a methylcarbonyloxy group, an ethylcarbonyloxy group, an n-propylcarbonyloxy group, an i-propylcarbonyloxy group, or an n-butylcarbonyloxy group.
• the hydrolyzable organosilane represented by the formula (1) can be exemplified below.
• a commercially available product can be used as the hydrolyzable organosilane represented by the formula (1), but it can also be synthesized. For example, it can synthesize
• a hydrolyzable organosilane represented by the formula (1) and at least one organosilicon compound selected from the group consisting of compounds represented by the formulas (2) and (3) are used in combination. Can be used.
• the hydrolyzable organosilane represented by the formula (1), the hydrolyzate thereof, or the hydrolysis condensate thereof, the organosilicon compound represented by the formula (2), and the organic represented by the formula (3) At least one organic silicon compound selected from the group consisting of silicon compounds, a hydrolyzate thereof, and a hydrolysis condensate thereof can be used in combination.
• the ratio of the hydrolyzable organosilane represented by the above formula (1) to the organosilicon compound represented by the formula (2) and / or the organosilicon compound represented by the formula (3) is 1 in molar ratio. : 0 to 1: 200.
• a hydrolyzable organosilane represented by formula (1), an organosilicon compound represented by formula (2) and / or an organosilicon compound represented by formula (3) The molar ratio of 1: 199 to 1:19 can be used.
• the organosilicon compound selected from the group consisting of the organosilicon compound represented by formula (2) and the organosilicon compound represented by formula (3) is preferably an organosilicon compound represented by formula (2). . These are preferably used as hydrolysis condensates (polyorganosiloxane polymers). Hydrolysis condensation of hydrolyzable organosilane represented by formula (1) and organosilicon compound represented by formula (2) It is preferable to use a product (polymer of polyorganosiloxane).
• Examples described in the above formula (1) can be given.
• the organic group having an alkoxyaryl group or acyloxyaryl group a combination of the above alkoxy group, acyloxy group and aryl group can be used.
• organosilicon compound represented by the formula (2) examples include tetramethoxysilane, tetrachlorosilane, tetraacetoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, tetraacetoxysilane, Methyltrimethoxysilane, methyltrichlorosilane, methyltriacetoxysilane, methyltripropoxysilane, methyltriacetoxysilane, methyltributoxysilane, methyltriamyloxysilane, methyltriphenoxysilane, methyltribenzyloxysilane, methyltriphenethyloxy Silane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, ⁇ -glycidoxyethyltrimethoxysilane
• organosilicon compound represented by the formula (3) examples include methylene bistrimethoxysilane, methylene bistrichlorosilane, methylene bistriacetoxysilane, ethylene bistriethoxysilane, ethylene bistrichlorosilane, ethylene bistriacetoxysilane, propylene bistriethoxysilane, and butylene bistrimethoxy.
• Silane phenylenebistrimethoxysilane, phenylenebistriethoxysilane, phenylenebismethyldiethoxysilane, phenylenebismethyldimethoxysilane, naphthylenebistrimethoxysilane, bistrimethoxydisilane, bistriethoxydisilane, bisethyldiethoxydisilane, bismethyldimethoxydisilane, etc. Is mentioned.
• hydrolysis condensate of the hydrolyzable organosilane represented by the formula (1) and the organosilicon compound represented by the formula (2) include condensates having the following unit structures.
• the hydrolysis condensate (polyorganosiloxane) with the organosilicon compound represented by the formula (3) can be obtained as a condensate having a weight average molecular weight of 1,000 to 1,000,000 or 1,000 to 100,000. These molecular weights are molecular weights obtained in terms of polystyrene by GPC analysis.
• GPC measurement conditions are, for example, GPC apparatus (trade name HLC-8220GPC, manufactured by Tosoh Corporation), GPC column (trade names Shodex KF803L, KF802, KF801, Showa Denko), column temperature is 40 ° C., eluent (elution solvent) Is tetrahydrofuran, the flow rate (flow rate) is 1.0 ml / min, and the standard sample is polystyrene (made by Showa Denko KK).
• hydrolysis of the alkoxysilyl group, acyloxysilyl group, or halogenated silyl group 0.5 to 100 mol, preferably 1 to 10 mol of water is used per mol of the hydrolyzable group. Further, 0.001 to 10 mol, preferably 0.001 to 1 mol of a hydrolysis catalyst can be used per mol of the hydrolyzable group.
• the reaction temperature during the hydrolysis and condensation is usually 20 to 80 ° C. Hydrolysis may be performed completely or partially. That is, a hydrolyzate or a monomer may remain in the hydrolysis condensate.
• a catalyst can be used in the hydrolysis and condensation. Examples of the hydrolysis catalyst include metal chelate compounds, organic acids, inorganic acids, organic bases, and inorganic bases.
• Examples of the metal chelate compound as the hydrolysis catalyst include triethoxy mono (acetylacetonato) titanium, tri-n-propoxy mono (acetylacetonato) titanium, tri-i-propoxy mono (acetylacetonato) titanium, tri -N-Butoxy mono (acetylacetonato) titanium, tri-sec-butoxy mono (acetylacetonato) titanium, tri-t-butoxy mono (acetylacetonato) titanium, diethoxy bis (acetylacetonato) titanium , Di-n-propoxy bis (acetylacetonato) titanium, di-i-propoxy bis (acetylacetonato) titanium, di-n-butoxy bis (acetylacetonato) titanium, di-sec-butoxy bis (Acetylacetonate) titanium, di-t Butoxy bis (acetylacetonato) titanium, monoethoxy tris (acetylacetonato) titanium
• Organic acids as hydrolysis catalysts include, for example, acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacin Acid, gallic acid, butyric acid, meritic acid, arachidonic acid, mikimic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid Benzenesulfonic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid
• Organic bases as hydrolysis catalysts include, for example, pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, diazine.
• Examples include zabicyclononane, diazabicycloundecene, and tetramethylammonium hydroxide.
• the inorganic base include ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like. Of these catalysts, metal chelate compounds, organic acids, and inorganic acids are preferred, and these may be used alone or in combination of two or more.
• organic solvent used in the hydrolysis examples include n-pentane, i-pentane, n-hexane, i-hexane, n-heptane, i-heptane, 2,2,4-trimethylpentane, n-octane, i- Aliphatic hydrocarbon solvents such as octane, cyclohexane and methylcyclohexane; Benzene, toluene, xylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propyl benzene, i-propyl benzene, diethylbenzene, i-butylbenzene, triethylbenzene, di-i-propyl benzene, n-amylnaphthalene, trimethylbenzene, etc.
• Aromatic hydrocarbon solvents Methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, t-butanol, n-pentanol, i-pentanol, 2-methylbutanol, sec-pentanol, t- Pentanol, 3-methoxybutanol, n-hexanol, 2-methylpentanol, sec-hexanol, 2-ethylbutanol, sec-heptanol, heptanol-3, n-octanol, 2-ethylhexanol, sec-octanol, n- Nonyl alcohol, 2,6-dimethylheptanol-4, n-decanol, sec-undecyl alcohol, trimethylnonyl alcohol, sec-tetradecyl alcohol, sec-heptadec
• solvents can be used alone or in combination of two or more.
• acetone methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl-i-butyl ketone, methyl-n-pentyl ketone, ethyl-n-butyl ketone, methyl-n-hexyl ketone, di- Ketone solvents such as i-butyl ketone, trimethylnonanone, cyclohexanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, diacetone alcohol, acetophenone, fenchon (1,1,3-trimethyl-2-norbornene) Is preferable from the viewpoint of storage stability of the solution.
• the resist underlayer film forming composition of the present invention can contain a curing catalyst.
• the curing catalyst functions as a curing catalyst when a coating film containing polyorganosiloxane composed of a hydrolysis condensate is heated and cured.
• As the curing catalyst ammonium salts, phosphines, phosphonium salts, and sulfonium salts can be used.
• the formula (D-1) (Where, m is an integer of 2 to 11, n is 2 or 3, the R 11 is an alkyl group or an aryl group, Y A - represents an anion.)
• the formula (D-7) (Wherein, R 21, R 22, R 23, and R 24 represents an alkyl group or an aryl group independently, P is represents a phosphorus atom, Y A - represents an anion, and R 21, R 22 , R 23 , and R 24 are each independently bonded to a phosphorus atom by a CP bond).
• the formula (D-8) (However, R 25 , R 26 , and R 27 each independently represents an alkyl group or an aryl group, S represents a sulfur atom, Y A ⁇ represents an anion, and R 25 , R 26 , and R 27 27 are each independently bonded to a sulfur atom by a C—S bond).
• the compound represented by the above formula (D-1) represents a quaternary ammonium salt derived from an amine, m represents 2 to 11, and n represents an integer of 2 to 3.
• R 11 of this quaternary ammonium salt represents an alkyl group or an aryl group having 1 to 18 carbon atoms, preferably an alkyl group having 2 to 10 carbon atoms or an aryl group having 6 to 18 carbon atoms, for example, an ethyl group And straight chain alkyl groups such as propyl group and butyl group, benzyl group, cyclohexyl group, cyclohexylmethyl group, dicyclopentadienyl group and the like.
• anion (Y A ⁇ ) examples include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ). -), alcoholates (-O - can be given) acid groups and the like.
• the compound represented by the above formula (D-2) is a quaternary ammonium salt represented by R 12 R 13 R 14 R 15 N + Y A — .
• R 12 , R 13 , R 14 and R 15 each independently represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms, or (D-2 ) Represents a silane compound bonded to a silicon atom by a Si—C bond.
• the anion (Y A ⁇ ) is a halogen ion such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
• This quaternary ammonium salt can be obtained commercially, for example, tetramethylammonium acetate, tetrabutylammonium acetate, triethylbenzylammonium chloride, triethylbenzylammonium bromide, trioctylmethylammonium chloride, tributylbenzyl chloride.
• Examples include ammonium and trimethylbenzylammonium chloride.
• the compound represented by the above formula (D-3) represents a quaternary ammonium salt derived from 1-substituted imidazole, wherein R 16 and R 17 have 1 to 18 carbon atoms, R 16 and The total number of carbon atoms of R 17 is preferably 7 or more.
• R 16 include a methyl group, an ethyl group, a propyl group, a phenyl group, and a benzyl group
• examples of R 17 include a benzyl group, an octyl group, and an octadecyl group.
• Examples of the anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
• This compound can be obtained as a commercial product.
• imidazole compounds such as 1-methylimidazole and 1-benzylimidazole are reacted with alkyl halides and aryl halides such as benzyl bromide and methyl bromide. Can be manufactured.
• the compound represented by the above formula (D-4) is a quaternary ammonium salt derived from pyridine, and R 18 is an alkyl group having 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms, or Represents an aryl group having 6 to 18 carbon atoms, and examples thereof include a butyl group, an octyl group, a benzyl group, and a lauryl group.
• Examples of the anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
• This compound can also be obtained as a commercial product. For example, pyridine is reacted with an alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide. Can be manufactured. Examples of this compound include N-laurylpyridinium chloride and N-benzylpyridinium bromide.
• the compound represented by the above formula (D-5) is a quaternary ammonium salt derived from a substituted pyridine represented by picoline or the like, and R 19 has 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms.
• R 20 represents an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms.
• R 20 represents a methyl group.
• Examples of the anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
• halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ).
• acid groups such as alcoholate (—O ⁇ ).
• substituted pyridine such as picoline and alkyl halide such as methyl bromide, octyl bromide, lauryl chloride, benzyl chloride, benzyl bromide, or aryl halide.
• Examples of this compound
• the compound represented by the above formula (D-6) is a tertiary ammonium salt derived from an amine, m represents an integer of 2 to 11, and n represents an integer of 2 to 3.
• the anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ).
• - alcoholates (-O - can be given) acid groups and the like.
• the compound represented by the formula (D-6) can be produced by reacting an amine with a weak acid such as carboxylic acid or phenol.
• Examples of the carboxylic acid include formic acid and acetic acid.
• the anion (Y A ⁇ ) represents (HCOO ⁇ )
• the anion (Y A ⁇ ) represents (CH 3 COO ⁇ )
• the anion (Y A ⁇ ) represents (C 6 H 5 O ⁇ ).
• the compound represented by the above formula (D-7) is a quaternary phosphonium salt having a structure represented by R 21 R 22 R 23 R 24 P + Y A — .
• R 21 , R 22 , R 23 , and R 24 represent an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms, or a silane compound that is bonded to a silicon atom by a Si—C bond.
• three of the four substituents R 21 to R 24 represent a phenyl group or a substituted phenyl group, and examples of the three substituents include a phenyl group and a tolyl group.
• the remaining one substituent is an alkyl group having 1 to 18 carbon atoms, an aryl group having 6 to 18 carbon atoms, or a silyl group bonded to a silicon atom by a Si—C bond.
• anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ). -), alcoholates (-O - can be given) acid groups and the like.
• This compound can be obtained as a commercial product, for example, a halogenated tetraalkylphosphonium such as tetra-n-butylphosphonium halide, tetra-n-propylphosphonium halide, or triethylbenzylphosphorane halide.
• a halogenated tetraalkylphosphonium such as tetra-n-butylphosphonium halide, tetra-n-propylphosphonium halide, or triethylbenzylphosphorane halide.
• halogenated triphenylmonoalkylphosphonium such as triphenylmethylphosphonium halide, triphenylethylphosphonium halide, triphenylmonoarylphosphonium halide such as triphenylbenzylphosphonium halide , Tritolyl monoaryl phosphonium halides such as tolyl monophenyl phosphonium halide, and trityl monoalkyl phosphonium halides such as tolyl monomethyl phosphonium halide (halogen atom is chlorine or bromine atom) preferable.
• the phosphines include methylphosphine, ethylphosphine, propylphosphine, isopropylphosphine, isobutylphosphine, phenylphosphine and other first phosphine, dimethylphosphine, diethylphosphine, diisopropylphosphine, diisoamylphosphine, diphenylphosphine and other second phosphine.
• tertiary phosphines such as trimethylphosphine, triethylphosphine, triphenylphosphine, methyldiphenylphosphine, and dimethylphenylphosphine.
• R 25 R 26 R 27 S + Y A - is a tertiary sulfonium salt having a structure represented by.
• R 25 , R 26 , and R 27 represent an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms, or a group bonded to a silicon atom by a Si—C bond,
• R 25 to R 27 three are phenyl groups or substituted phenyl groups. Examples of these three substituents include phenyl and tolyl groups, and the remaining 1 One substituent is an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms.
• alkyl groups and aryl groups can exemplify functional groups having the corresponding number of carbon atoms in the examples described above.
• anion (Y A ⁇ ) include halogen ions such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ).
• - alcoholates (-O - can be given) acid groups and the like. This compound can be obtained as a commercial product.
• a halogenated tetraalkylphosphonium such as tri-n-butylsulfonium halide and tri-n-propylsulfonium halide
• a trihalogenated halogen such as diethylbenzylsulfonium halide.
• the amount of the curing catalyst is 0.01 to 10 parts by mass, 0.01 to 5 parts by mass, or 0.01 to 3 parts by mass with respect to 100 parts by mass of the polyorganosiloxane.
• Hydrolyzable organosilane is hydrolyzed and condensed using a catalyst in a solvent, and the resulting hydrolyzed condensate (polymer) is obtained by performing distillation under reduced pressure or the like as a by-product alcohol or a hydrolysis catalyst used. Water can be removed simultaneously.
• the acid or base catalyst used for the hydrolysis can be removed by neutralization or ion exchange.
• the resist underlayer film forming composition containing the hydrolysis condensate can be added with an organic acid, water, alcohol, or a combination thereof for stabilization. .
• organic acid examples include oxalic acid, malonic acid, methylmalonic acid, succinic acid, maleic acid, malic acid, tartaric acid, phthalic acid, citric acid, glutaric acid, citric acid, lactic acid, and salicylic acid. Of these, oxalic acid and maleic acid are preferred.
• the organic acid to be added is 0.5 to 5.0 parts by mass with respect to 100 parts by mass of the condensate (polyorganosiloxane).
• pure water, ultrapure water, ion exchange water, etc. can be used for the water to add, The addition amount can be 1 thru
• alcohol to add what is easy to be scattered by the heating after application
• coating is preferable, for example, methanol, ethanol, propanol, isopropanol, a butanol etc. are mentioned.
• the added alcohol can be 1 to 20 parts by mass with respect to 100 parts by mass of the resist underlayer film forming composition.
• the underlayer film forming composition for lithography of the present invention can contain an organic polymer compound, a photoacid generator, a surfactant, and the like, if necessary, in addition to the above components.
• an organic polymer compound By using an organic polymer compound, the dry etching rate (thickness reduction per unit time), attenuation coefficient, refractive index, etc. of the resist underlayer film formed from the underlayer film forming composition for lithography of the present invention are adjusted. can do.
• an organic polymer compound A various organic polymer can be used. Polycondensation polymers and addition polymerization polymers can be used.
• Addition polymerization polymers and condensation polymerization polymers such as polyester, polystyrene, polyimide, acrylic polymer, methacrylic polymer, polyvinyl ether, phenol novolak, naphthol novolak, polyether, polyamide, and polycarbonate can be used.
• An organic polymer having an aromatic ring structure such as a benzene ring, a naphthalene ring, an anthracene ring, a triazine ring, a quinoline ring, and a quinoxaline ring that functions as a light absorption site is preferably used.
• organic polymer compounds include addition polymerizable monomers such as benzyl acrylate, benzyl methacrylate, phenyl acrylate, naphthyl acrylate, anthryl methacrylate, anthryl methyl methacrylate, styrene, hydroxystyrene, benzyl vinyl ether, and N-phenylmaleimide.
• addition-polymerized polymers containing as a structural unit, and polycondensation polymers such as phenol novolac and naphthol novolak.
• the polymer compound When an addition polymerization polymer is used as the organic polymer compound, the polymer compound may be a homopolymer or a copolymer.
• An addition polymerizable monomer is used for the production of the addition polymerization polymer.
• examples of such addition polymerizable monomers include acrylic acid, methacrylic acid, acrylic ester compounds, methacrylic ester compounds, acrylamide compounds, methacrylamide compounds, vinyl compounds, styrene compounds, maleimide compounds, maleic anhydride, acrylonitrile and the like. It is done.
• acrylic ester compounds include methyl acrylate, ethyl acrylate, normal hexyl acrylate, isopropyl acrylate, cyclohexyl acrylate, benzyl acrylate, phenyl acrylate, anthryl methyl acrylate, 2-hydroxyethyl acrylate, 3-chloro-2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2-trichloroethyl acrylate, 2-bromoethyl acrylate, 4-hydroxybutyl acrylate, 2-methoxyethyl acrylate, tetrahydrofurfuryl acrylate, 2-Methyl-2-adamantyl acrylate, 5-acryloyloxy-6-hydroxynorbornene-2- Rubokishirikku 6- lactone, 3-acryloxypropyl triethoxysilane, and glycidyl acrylate.
• Methacrylic acid ester compounds include methyl methacrylate, ethyl methacrylate, normal hexyl methacrylate, isopropyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, phenyl methacrylate, anthryl methyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2,2, 2-trifluoroethyl methacrylate, 2,2,2-trichloroethyl methacrylate, 2-bromoethyl methacrylate, 4-hydroxybutyl methacrylate, 2-methoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, 2-methyl-2-adamantyl methacrylate, 5 -Methacryloyloxy-6-hydroxynorbornene-2-carbox Rick 6- lactone, 3-methacryloxypropyl triethoxysilane, glycidyl
• acrylamide compounds include acrylamide, N-methyl acrylamide, N-ethyl acrylamide, N-benzyl acrylamide, N-phenyl acrylamide, N, N-dimethyl acrylamide and N-anthryl acrylamide.
• examples include methacrylamide compounds, methacrylamide, N-methyl methacrylamide, N-ethyl methacrylamide, N-benzyl methacrylamide, N-phenyl methacrylamide, N, N-dimethyl methacrylamide and N-anthryl acrylamide.
• vinyl compounds include vinyl alcohol, 2-hydroxyethyl vinyl ether, methyl vinyl ether, ethyl vinyl ether, benzyl vinyl ether, vinyl acetic acid, vinyl trimethoxysilane, 2-chloroethyl vinyl ether, 2-methoxyethyl vinyl ether, vinyl naphthalene and vinyl anthracene.
• styrene compound include styrene, hydroxystyrene, chlorostyrene, bromostyrene, methoxystyrene, cyanostyrene, and acetylstyrene.
• the maleimide compound include maleimide, N-methylmaleimide, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide and N-hydroxyethylmaleimide.
• examples of such a polymer include a polycondensation polymer of a glycol compound and a dicarboxylic acid compound.
• examples of the glycol compound include diethylene glycol, hexamethylene glycol, butylene glycol and the like.
• examples of the dicarboxylic acid compound include succinic acid, adipic acid, terephthalic acid, maleic anhydride and the like.
• examples thereof include polyesters such as polypyromellitimide, poly (p-phenylene terephthalamide), polybutylene terephthalate, polyethylene terephthalate, polyamide, and polyimide.
• the organic polymer compound contains a hydroxyl group
• this hydroxyl group can form a crosslinking reaction with the polyorganosiloxane.
• a polymer compound having a weight average molecular weight of, for example, 1,000 to 1,000,000, 3,000 to 300,000, 5,000 to 200,000, or 10,000 to 100,000 can be used. Only one organic polymer compound can be used, or two or more organic polymer compounds can be used in combination.
• the proportion thereof is 1 to 200 parts by mass, 5 to 100 parts by mass, or 10 to 50 parts by mass, or 20 with respect to 100 parts by mass of the condensate (polyorganosiloxane). Thru
• the resist underlayer film forming composition of the present invention may contain an acid generator.
• the acid generator include a thermal acid generator and a photoacid generator.
• the photoacid generator generates an acid when the resist is exposed. Therefore, the acidity of the lower layer film can be adjusted. This is a method for matching the acidity of the lower layer film with the acidity of the upper layer resist. Further, the pattern shape of the resist formed in the upper layer can be adjusted by adjusting the acidity of the lower layer film.
• Examples of the photoacid generator contained in the resist underlayer film forming composition of the present invention include onium salt compounds, sulfonimide compounds, and disulfonyldiazomethane compounds.
• onium salt compounds include diphenyliodonium hexafluorophosphate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoronormalbutanesulfonate, diphenyliodonium perfluoronormaloctanesulfonate, diphenyliodonium camphorsulfonate, bis (4-tert-butylphenyl) iodonium camphor.
• Iodonium salt compounds such as sulfonate and bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate, and triphenylsulfonium hexafluoroantimonate, triphenylsulfonium nonafluoronormal butanesulfonate, triphenylsulfonium camphorsulfonate, and triphenyls Sulfonium salt compounds such as phosphonium trifluoromethanesulfonate, and the like.
• sulfonimide compounds include N- (trifluoromethanesulfonyloxy) succinimide, N- (nonafluoronormalbutanesulfonyloxy) succinimide, N- (camphorsulfonyloxy) succinimide and N- (trifluoromethanesulfonyloxy) naphthalimide. Can be mentioned.
• disulfonyldiazomethane compound examples include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, and bis (2,4-dimethylbenzenesulfonyl). And diazomethane, and methylsulfonyl-p-toluenesulfonyldiazomethane.
• a photo-acid generator can use only 1 type, or can be used in combination of 2 or more type.
• the ratio is 0.01 to 5 parts by mass, 0.1 to 3 parts by mass, or 0.5 to 0.5 parts by mass with respect to 100 parts by mass of the condensate (polyorganosiloxane). 1 part by mass.
• the surfactant is effective in suppressing the occurrence of pinholes and installations when the resist underlayer film forming composition for lithography of the present invention is applied to a substrate.
• the surfactant contained in the resist underlayer film forming composition of the present invention include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether.
• surfactants may be used alone or in combination of two or more.
• the ratio is 0.0001 to 5 parts by mass, or 0.001 to 1 part by mass, or 0.01 to 0 with respect to 100 parts by mass of the condensate (polyorganosiloxane). .5 parts by mass.
• a rheology adjusting agent, an adhesion aid and the like can be added to the resist underlayer film forming composition of the present invention.
• the rheology modifier is effective in improving the fluidity of the underlayer film forming composition.
• the adhesion aid is effective for improving the adhesion between the semiconductor substrate or resist and the lower layer film.
• rheology modifier examples include phthalic acid derivatives such as dimethyl phthalate, diethyl phthalate, diisobutyl phthalate, dihexyl phthalate, and butyl isodecyl phthalate; , Maleic acid derivatives such as dinormal butyl maleate, diethyl maleate and dinonyl maleate, oleic acid derivatives such as methyl oleate, butyl oleate and tetrahydrofurfuryl oleate, or stearic acid derivatives such as normal butyl stearate and glyceryl stearate be able to. These rheology modifiers are usually blended at a ratio of less than 30% by mass with respect to 100% by mass of the total composition of the resist underlayer film forming composition.
• adhesion assistant examples include chlorosilanes such as trimethylchlorosilane, dimethylvinylchlorosilane, methyldiphenylchlorosilane, chloromethyldimethylchlorosilane, trimethylmethoxysilane, dimethyldiethoxysilane, methyldimethoxysilane, dimethylvinylethoxysilane, diphenyldimethoxysilane, Alkoxysilanes such as phenyltriethoxysilane, hexamethyldisilazane, N, N′-bis (trimethylsilyl) urea, silazanes such as dimethyltrimethylsilylamine, trimethylsilylimidazole, vinyltrichlorosilane, ⁇ -chloropropyltrimethoxysilane, ⁇ -Silanes such as aminopropyltriethoxysilane and ⁇ -glycidoxypropyltrimethoxysilane,
• any solvent can be used without particular limitation as long as it can dissolve the solid content.
• solvents include methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl isobutyl carbinol, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol mono Ether ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate , Ethyl
• the resist underlayer film forming composition of the present invention is applied by an appropriate application method such as a spinner or a coater, and then baked to form a resist underlayer film.
• the conditions for firing are appropriately selected from firing temperatures of 80 ° C. to 250 ° C. and firing times of 0.3 to 60 minutes.
• the firing temperature is 150 ° C.
• the thickness of the lower layer film to be formed is, for example, 10 to 1000 nm, 20 to 500 nm, 50 to 300 nm, or 100 to 200 nm.
• a photoresist layer for example, is formed on the resist underlayer film. Formation of the photoresist layer can be performed by a well-known method, that is, by applying and baking a photoresist composition solution on the lower layer film.
• the film thickness of the photoresist is, for example, 50 to 10,000 nm, 100 to 2000 nm, or 200 to 1000 nm.
• the resist underlayer film of the present invention can be formed thereon, and a photoresist can be further coated thereon.
• the substrate can be processed by selecting an appropriate etching gas.
• an appropriate etching gas For example, it is possible to process the resist underlayer film of the present invention using a fluorine-based gas that has a sufficiently high etching rate for photoresist as an etching gas, and a sufficiently high etching rate for the resist underlayer film of the present invention.
• the organic underlayer film can be processed using an oxygen-based gas as an etching gas, and the substrate can be processed using a fluorine-based gas that provides a sufficiently high etching rate for the organic underlayer film as an etching gas.
• the photoresist formed on the resist underlayer film of the present invention is not particularly limited as long as it is sensitive to light used for exposure. Either a negative photoresist or a positive photoresist can be used.
• a positive photoresist comprising a novolac resin and 1,2-naphthoquinonediazide sulfonic acid ester, a chemically amplified photoresist comprising a binder having a group capable of decomposing by an acid and increasing the alkali dissolution rate and a photoacid generator, an acid
• a chemically amplified photoresist comprising a low-molecular compound that decomposes to increase the alkali dissolution rate of the photoresist, an alkali-soluble binder, and a photoacid generator, and a binder having a group that decomposes with an acid to increase the alkali dissolution rate
• a chemically amplified photoresist composed of a low molecular weight compound that decompos
• trade name APEX-E manufactured by Shipley Co., Ltd. trade name PAR710 manufactured by Sumitomo Chemical Co., Ltd., and trade name SEPR430 manufactured by Shin-Etsu Chemical Co., Ltd. may be used.
• Proc. SPIE, Vol. 3999, 330-334 (2000) Proc. SPIE, Vol. 3999, 357-364 (2000), Proc. SPIE, Vol. 3999, 365-374 (2000), and fluorine-containing atom polymer-based photoresists.
• exposure is performed through a predetermined mask.
• a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), an F2 excimer laser (wavelength 157 nm), or the like can be used.
• post-exposure bake can be performed as necessary.
• the post-exposure heating is performed under conditions appropriately selected from a heating temperature of 70 ° C. to 150 ° C. and a heating time of 0.3 to 10 minutes.
• a resist for electron beam lithography can be used in place of the photoresist as the resist.
• the electron beam resist either a negative type or a positive type can be used.
• Chemically amplified resist comprising a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate, a low molecular weight compound that decomposes with an alkali-soluble binder, an acid generator and an acid to change the alkali dissolution rate of the resist
• a chemically amplified resist comprising: a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate; and a chemically amplified resist comprising a low-molecular compound that decomposes with an acid to change the alkali dissolution rate of the resist,
• non-chemically amplified resists composed of a binder having a group that changes the alkali dissolution rate by being decomposed by an electron beam, and non-
• Developers include aqueous solutions of alkali metal hydroxides such as potassium hydroxide and sodium hydroxide, aqueous solutions of quaternary ammonium hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline, ethanolamine, propylamine, An alkaline aqueous solution such as an aqueous amine solution such as ethylenediamine can be mentioned as an example. Further, a surfactant or the like can be added to these developers.
• the development conditions are appropriately selected from a temperature of 5 to 50 ° C. and a time of 10 to 600 seconds.
• the resist underlayer film (intermediate layer) of the present invention is removed using the photoresist (upper layer) pattern thus formed as a protective film, and then the patterned photoresist and the resist underlayer film of the present invention are removed.
• the organic underlayer film (lower layer) is removed using the film made of (intermediate layer) as a protective film.
• the semiconductor substrate is processed using the patterned resist underlayer film (intermediate layer) and organic underlayer film (lower layer) of the present invention as a protective film.
• the resist underlayer film (intermediate layer) of the present invention in the portion where the photoresist has been removed is removed by dry etching to expose the semiconductor substrate.
• dry etching of the resist underlayer film of the present invention tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, carbon monoxide, argon, oxygen, Gases such as nitrogen, sulfur hexafluoride, difluoromethane, nitrogen trifluoride and chlorine trifluoride, chlorine, trichloroborane and dichloroborane can be used.
• a halogen-based gas is preferably used for dry etching of the resist underlayer film.
• a photoresist made of an organic substance is basically difficult to remove.
• the resist underlayer film of the present invention containing a large amount of silicon atoms is quickly removed by the halogen-based gas. Therefore, it is possible to suppress a decrease in the film thickness of the photoresist accompanying dry etching of the resist underlayer film. As a result, the photoresist can be used as a thin film.
• the dry etching of the resist underlayer film is preferably performed using a fluorine-based gas.
• fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), and perfluoropropane (C 3 F 8 ). , Trifluoromethane, and difluoromethane (CH 2 F 2 ).
• the organic underlayer film is removed using the patterned photoresist and the film made of the resist underlayer film of the present invention as a protective film.
• the organic underlayer film (underlayer) is preferably formed by dry etching with an oxygen-based gas. This is because the resist underlayer film of the present invention containing a large amount of silicon atoms is difficult to remove by dry etching with an oxygen-based gas.
• the semiconductor substrate is processed. The processing of the semiconductor substrate is preferably performed by dry etching with a fluorine-based gas.
• fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, and difluoromethane (CH 2 F 2 ). Can be mentioned.
• an organic antireflection film can be formed on the resist underlayer film of the present invention before forming the photoresist.
• the antireflective coating composition used there is not particularly limited, and can be arbitrarily selected from those conventionally used in the lithography process, and can be used by a conventional method such as a spinner.
• the antireflection film can be formed by coating and baking with a coater.
• the substrate to which the resist underlayer film forming composition of the present invention is applied may have an organic or inorganic antireflection film formed on its surface by a CVD method or the like.
• the underlayer film of the invention can also be formed.
• the resist underlayer film formed from the resist underlayer film forming composition of the present invention may have absorption of the light depending on the wavelength of light used in the lithography process. In such a case, it can function as an antireflection film having an effect of preventing reflected light from the substrate. Further, the underlayer film of the present invention has a function for preventing an adverse effect on a substrate of a layer for preventing an interaction between the substrate and the photoresist, a material used for the photoresist or a substance generated upon exposure to the photoresist.
• the resist underlayer film formed from the resist underlayer film forming composition is applied to a substrate on which via holes used in the dual damascene process are formed, and can be used as a filling material that can fill the holes without gaps. Moreover, it can also be used as a planarizing material for planarizing the surface of an uneven semiconductor substrate.
• the hydrolyzable silane represented by the formula (1) used as a raw material was synthesized.
• the obtained compound was identified by 1 H-NMR measurement.
• Sample tube 5 mm
• solvent deuterated chloroform
• measurement temperature room temperature
• pulse interval 5 seconds
• integration count 32 times
• reference sample tetramethylsilane (TMS).
• the compound 2 was used instead of the compound 1 used in the synthesis example 1, and the synthesis example 2 was obtained by the same operation.
• the compound 3 was used instead of the compound 1 used in the synthesis example 1, and the synthesis example 3 was obtained by the same operation. Moreover, the same operation was performed without using the compound corresponding to Compound 1 used in Synthesis Example 1, and Comparative Synthesis Examples 1 and 2 were obtained.
• Table 1 shows the blending ratio of the silane compounds in the compositions of Synthesis Examples 1 to 3 and Comparative Synthesis Examples 1 and 2.
• the obtained polymer corresponds to a polymer having a unit structure represented by Formula (2-2).
• the polymer obtained has a unit structure represented by Formula (2-3). It corresponded to the polymer which has.
• the polymers obtained in Comparative Synthesis Examples 1 and 2 corresponded to the polymer having a unit structure represented by the following formula (3-1).
• Example 1 To 20.00 g of the polymer solution (solid content: 15.00 mass percent) obtained in Synthesis Example 1, 0.03 g of maleic acid, 19.36 g of ultrapure water, 0.01 g of benzyltriethylammonium chloride, propylene glycol monomethyl ether acetate 7 0.02 g, 14.89 g of propylene glycol monomethyl ether, and 90.64 g of propylene glycol monoethyl ether were added to prepare a resist underlayer film material.
• Example 2 A resist underlayer film material was prepared in the same manner as in Example 1 except that the polymer solution obtained in Synthesis Example 2 (solid content: 15.00 mass percent) was used instead of the polymer obtained in Synthesis Example 1. .
• Example 3 A resist underlayer film material was prepared in the same manner as in Example 1 except that the polymer solution obtained in Synthesis Example 3 (solid content: 15.00 mass percent) was used instead of the polymer obtained in Synthesis Example 1. .
• Example 4 To 20.00 g of the polymer solution (solid content: 15.00 mass percent) obtained in Synthesis Example 1, 0.03 g of maleic acid, 19.36 g of ultrapure water, 0.01 g of triphenylsulfonium chloride, propylene glycol monomethyl ether acetate 7 0.02 g, 14.89 g of propylene glycol monomethyl ether, and 90.64 g of propylene glycol monoethyl ether were added to prepare a resist underlayer film material.
• Example 5 To 20.00 g of the polymer solution obtained in Synthesis Example 1 (solid content: 15.00 mass percent), 0.03 g of maleic acid, 19.36 g of ultrapure water, 0.01 g of triphenylsulfonium maleate, propylene glycol monomethyl ether 7.02 g of acetate, 14.89 g of propylene glycol monomethyl ether, and 90.64 g of propylene glycol monoethyl ether were added to prepare a resist underlayer film material.
• Example 6 To 20.00 g of the polymer solution (solid content: 15.00 mass percent) obtained in Synthesis Example 1, 0.03 g of maleic acid, 19.36 g of ultrapure water, N- (3-triethoxysilylpropyl) -4,5 -A resist underlayer film material was prepared by adding 0.01 g of dihydroimidazole, 7.02 g of propylene glycol monomethyl ether acetate, 14.89 g of propylene glycol monomethyl ether, and 90.64 g of propylene glycol monoethyl ether.
• Comparative Example 1 A resist underlayer film material was prepared in the same manner as in Example 1 except that the polymer solution obtained in Comparative Synthesis Example 1 (solid content: 15.00 mass percent) was used instead of the polymer obtained in Synthesis Example 1. did.
• Comparative Example 2 A resist underlayer film material was prepared in the same manner as in Example 1 except that the polymer solution obtained in Comparative Synthesis Example 2 (solid content: 15.00 mass percent) was used instead of the polymer obtained in Synthesis Example 1. did.
• Example resist underlayer films 1 to 6 the resist underlayer films obtained from the resist underlayer film forming compositions of Examples 1 to 6 are referred to as Example resist underlayer films 1 to 6.
• the resist underlayer films obtained from the resist underlayer film forming compositions of Comparative Examples 1 and 2 were designated as Comparative Example Resist Underlayer Films 1 and 2.
• the resist underlayer film forming composition was applied onto a silicon wafer using a spinner. Heating was performed at 240 ° C. for 1 minute on a hot plate to form a resist underlayer film (film thickness 0.09 ⁇ m). These resist underlayer films were subjected to a refractive index (n value) and an optical absorption coefficient (k value, attenuation coefficient) at a wavelength of 193 nm using a spectroscopic ellipsometer (manufactured by JA Woollam, VUV-VASE VU-302). (Also called). The results are shown in Table 3.
• the following etchers and etching gases were used to measure the dry etching rate.
• the etcher was ES401 (trade name, manufactured by Nippon Scientific) and etched with CF 4 gas.
• Etcher was etched with O 2 gas using RIE-10NR (trade name, manufactured by Samco).
• the resist underlayer film forming composition solutions prepared in Examples 1 to 6 and Comparative Examples 1 and 2 were each applied onto a silicon wafer using a spinner. Heating was performed at 240 ° C. for 1 minute on a hot plate to form a resist underlayer film, and the etching rate was measured using each etching gas.
• the etching rate was measured using CF 4 gas as an etching gas when the resist underlayer film thickness was 0.20 ⁇ m, and the etching rate was measured using O 2 gas as the etching gas when the resist underlayer film thickness was 0.08 ⁇ m.
• a 0.20 ⁇ m resist film was formed on a silicon wafer by using a photoresist solution (product name: UV113, manufactured by Shipley Co., Ltd.) using a spinner.
• the dry etching rate was measured using CF 4 gas and O 2 gas as the etching gas. Then, the dry etching rates of the resist underlayer film and the resist film were compared. The results are shown in Table 4.
• the speed ratio is a dry etching speed ratio of (resist underlayer film) / (resist).
• the obtained polymer (formula (3-2)) was measured by 13 C, 1 H-NMR and GPC, and the molar ratio of acenaphthylene: 4-hydroxystyrene was 86:14.
• the weight average molecular weight Mw was 6000, and the weight average molecular weight Mw / number average molecular weight Mn was 1.5.
• the solution is filtered using a polyethylene microfilter having a pore size of 0.10 ⁇ m, further filtered using a polyethylene microfilter having a pore size of 0.05 ⁇ m, and a solution of an organic underlayer film forming composition used in a lithography process using a multilayer film Was prepared.
• An organic underlayer film (A layer) forming composition containing the above polymer (formula (3-2)) is applied onto a silicon wafer, heated on a hot plate at 240 ° C. for 1 minute, and an organic underlayer film having a thickness of 250 nm (A layer) was obtained.
• the Si-containing resist underlayer film (B layer) compositions obtained in Examples 1 to 6 and Comparative Examples 1 to 2 were applied, respectively, and heated on a hot plate at 240 ° C. for 1 minute, A Si-containing resist underlayer film (B layer) having a thickness of 35 nm was obtained.
• a commercially available photoresist solution (manufactured by Sumitomo Chemical Co., Ltd., trade name: PAR855) was applied on each of them with a spinner, heated on a hot plate at 100 ° C. for 1 minute, and a 150 nm thick photoresist film (C Layer).
• the resist patterning is performed using an immersion exposure machine TWINSCAN XT: 1900 Gi scanner (wavelength: 193 nm, NA, ⁇ : 1.20, 0.94 / 0.74 (C-quad) immersion liquid: water) manufactured by ASML. It was.
• the target is a so-called line-and-space (dense line) in which the photoresist line width and the width between the lines are 0.05 ⁇ m after development, and exposure is performed through a mask set so that 15 lines are formed. went. Thereafter, it was baked on a hot plate at 105 ° C. for 60 seconds, cooled, and developed with a 2.38% tetramethylammonium hydroxide developer in an industrial standard 60-second single paddle process.
• Footing is a bottoming phenomenon at the bottom of the pattern in the resist pattern shape
• undercut is a thinning phenomenon at the bottom of the pattern in the resist pattern shape, both of which are not preferable because they do not show a rectangular pattern shape.
• the resist underlayer film obtained from the resist underlayer film forming composition having an amic acid or amic acid ester structure according to the present invention contains a lot of heteroelements, it has a sufficiently high dry etching rate with respect to the photoresist film. ing.
• the etching rate by the fluorine-based gas is improved as compared with Comparative Examples 1 and 2, so that the resist pattern of the upper layer of the resist underlayer film of the present invention is accurately transferred to the resist underlayer film of the present invention. Is possible.
• the resist underlayer films obtained from the resist underlayer film forming compositions of Examples 1 to 6 have the same etching resistance by oxygen gas as the resist underlayer films obtained from the resist underlayer film forming compositions of Comparative Examples 1 to 2. Therefore, the resist underlayer film of the present invention has a sufficiently high function as a hard mask when processing an organic underlayer film or a substrate below the resist underlayer film. Further, when the resist patterning of 0.08 ⁇ m was performed, comparing Examples 1, 4 to 6 with Comparative Example 1, the refractive index n and the optical extinction coefficient k are equivalent (the optical extinction coefficient k is It can be seen that Examples 1 and 4 to 6 in which the terminal carboxylic acid moiety is not closed at the time of film formation are effective in reducing resist skirting.
• Example 2 in which a ring is closed and an imide structure is formed, and in Example 3 which is an amide carboxylic acid ester, good lithographic properties (adhesion) are shown, and it can be seen that there is an effect in improving adhesion with a resist.
• the resist underlayer film forming composition having an amic acid or an amic acid ester structure according to the present invention can control the resist shape depending on whether or not the structure changes during film formation.

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