WO2011102010A1 - Polarization film lamination apparatus, and lcd device production system equipped with same - Google Patents

Polarization film lamination apparatus, and lcd device production system equipped with same Download PDF

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Publication number
WO2011102010A1
WO2011102010A1 PCT/JP2010/063572 JP2010063572W WO2011102010A1 WO 2011102010 A1 WO2011102010 A1 WO 2011102010A1 JP 2010063572 W JP2010063572 W JP 2010063572W WO 2011102010 A1 WO2011102010 A1 WO 2011102010A1
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WO
WIPO (PCT)
Prior art keywords
substrate
polarizing film
film
bonding
transport mechanism
Prior art date
Application number
PCT/JP2010/063572
Other languages
French (fr)
Japanese (ja)
Inventor
力也 松本
幸治 植田
和範 岸▲崎▼
Original Assignee
住友化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Priority to KR1020117018214A priority Critical patent/KR101093298B1/en
Priority to CN2010800066206A priority patent/CN102405438B/en
Publication of WO2011102010A1 publication Critical patent/WO2011102010A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0073Optical laminates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528Polarisers

Definitions

  • the present invention relates to a polarizing film laminating apparatus and a liquid crystal display manufacturing system including the same.
  • liquid crystal display devices have been widely manufactured.
  • a polarizing film is bonded to a substrate (liquid crystal panel) used in a liquid crystal display device in order to control transmission or blocking of light.
  • the polarizing film is bonded so that the absorption axes thereof are orthogonal.
  • Patent Document 1 discloses an optical display device manufacturing system.
  • the said manufacturing system rotates a board
  • optical film polarizing film
  • Patent No. 4307510 (issued on Aug. 5, 2009)
  • the conventional apparatus has the following problems.
  • the work is usually performed in a clean room in order to prevent foreign matters such as dust from entering the bonding surface.
  • air is rectified. This is because it is necessary to bond the polarizing film in a state in which rectification is performed on the substrate in a downflow in order to suppress the yield reduction due to the foreign matter.
  • the manufacturing system of Patent Document 1 has a configuration in which a polarizing film is bonded to the substrate from the upper surface and the lower surface.
  • a demerit that airflow (downflow) is hindered by the polarizing film and the rectification environment to the substrate is deteriorated.
  • FIGS. 14 (a) and 14 (b) show air velocity vectors in the top-paste type manufacturing system. In FIG.
  • a region A is a region where an unwinding unit and the like for unwinding the polarizing film are installed, a region B is a region through which the polarizing film mainly passes, and a region C is a peeling removed from the polarizing film. This is an area in which a take-up unit or the like for winding the film is installed.
  • clean air is supplied from a HEPA (High Efficiency Particulate Air) filter 40.
  • HEPA High Efficiency Particulate Air
  • FIG. 14A since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41.
  • FIG. 14B since the grating 41 is not installed, the airflow moves along the floor after contacting the floor at the bottom of FIG. 14B.
  • the areas A to C are arranged on the 2F (second floor) portion, and the clean air from the HEPA filter 40 is blocked by the polarizing film. Therefore, it is difficult to generate an airflow in the vertical direction with respect to the substrate passing through the 2F portion.
  • the airflow vector in the horizontal direction is large (vector density is high). That is, it can be said that the rectification environment has deteriorated.
  • the objective is to provide the manufacturing system of a polarizing film bonding apparatus and a liquid crystal display device provided with the same which do not disturb a rectification environment. is there.
  • the polarizing film laminating apparatus of the present invention transports a rectangular substrate with a long side or a short side along the transport direction, and the first substrate.
  • a first bonding unit that bonds a polarizing film to the lower surface of the substrate in the transport mechanism;
  • a reversing mechanism that reverses the substrate transported by the first substrate transport mechanism and places the substrate in the second substrate transport mechanism;
  • a second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction, and a second bonding unit for bonding a polarizing film to the lower surface of the substrate in the second substrate transport mechanism;
  • the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction, and the reversing mechanism includes a suction part that sucks the substrate, and a substrate.
  • a substrate reversing unit for reversing the substrate by a first rotation for rotating to a first angle and a second rotation for reversing the substrate from the first angle, and a substrate connected to the substrate reversing unit and rotated by the first rotation And a substrate rotating unit that rotates the substrate 90 degrees in a direction parallel to the surface of the substrate in the first substrate transport mechanism.
  • a polarizing film is bonded to the lower surface of a board
  • the bonding apparatus according to the present invention is very simple to install and is excellent in area efficiency.
  • the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction, and the reversing mechanism attracts the substrate.
  • a substrate rotating unit that rotates the substrate rotated by the first rotation by 90 ° in a direction parallel to the surface of the substrate in the first substrate transport mechanism.
  • the substrate can be reversed by the reversing mechanism, and the long side and the short side with respect to the transport direction can be changed.
  • a polarizing film can be bonded from the lower surface with respect to both surfaces of a board
  • the operation of the reversing mechanism is a simple four operation, the tact time is short. Therefore, it is possible to realize bonding with a short tact time.
  • the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and also has an effect of being excellent in area efficiency.
  • FIG. 10 is a plan view showing a process of reversing the substrate by the reversing mechanism of FIG. 9. It is a top view which shows the modification of the bonding apparatus which concerns on this invention. It is a block diagram which shows the relationship of each member with which the manufacturing system of the liquid crystal display device which concerns on this invention is provided. It is a flowchart which shows operation
  • Embodiment 1 An embodiment of the present invention will be described below with reference to FIGS. 1 to 11, but the present invention is not limited to this. First, the structure of the manufacturing system (liquid crystal display device manufacturing system) according to the present invention will be described below.
  • the manufacturing system includes a bonding apparatus according to the present invention.
  • FIG. 1 is a cross-sectional view showing a manufacturing system.
  • the manufacturing system 100 has a two-stage structure, a 1F (first floor) portion is a film transport mechanism 50, and a 2F (second floor) portion is a bonding apparatus 60 including a substrate transport mechanism. It has become.
  • the film transport mechanism 50 plays the role of unwinding the polarizing film (polarizing plate) and transporting it to the nip rolls 6 ⁇ 6a and 16 ⁇ 16a and winding up the peeling film that is no longer needed.
  • the bonding device 60 plays a role of bonding the polarizing film unwound by the film transport mechanism 50 to the substrate (liquid crystal panel) 5.
  • the film transport mechanism 50 includes a first film transport mechanism 51 and a second film transport mechanism 52.
  • the 1st film conveyance mechanism 51 conveys a polarizing film to the nip roll 6 * 6a which bonds a polarizing film to the lower surface of the board
  • the substrate 5 has a rectangular shape.
  • the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
  • the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
  • the first film transport mechanism 51 includes a first unwinding unit 1, a second unwinding unit 1a, a first winding unit 2, a second winding unit 2a, a half cutter 3, a knife edge 4, and a defect film winding roller. 7 ⁇ 7a.
  • the first unwinding unit 1 is provided with a polarizing film original, and the polarizing film is unwound.
  • a known polarizing film may be used as the polarizing film. Specifically, a polyvinyl alcohol film is dyed with iodine or the like, and a film stretched in a uniaxial direction can be used. Although it does not specifically limit as thickness of the said polarizing film, A polarizing film 5 micrometers or more and 400 micrometers or less can be used preferably.
  • the polarizing film has a pressure-sensitive adhesive layer protected by a release film.
  • a release film also referred to as a protective film or a separator
  • a polyester film, a polyethylene terephthalate film, or the like can be used.
  • the peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably.
  • the manufacturing system 100 includes two unwinding portions and two unwinding portions corresponding to the unwinding portions, the first unwinding portion 1 has a low remaining amount of raw material. It is possible to connect the original fabric provided in the two unwinding portions 1 a to the original fabric of the first unwinding portion 1. As a result, it is possible to continue the operation without stopping the unwinding of the polarizing film. With this configuration, production efficiency can be increased.
  • a plurality of unwinding sections and winding sections may be provided, and three or more winding sections may be provided.
  • the 1st unwinding part 1 and the 2nd unwinding part 1a shown in FIG. 1 have a structure which can replace a mutual position with a turret.
  • the first unwinding portion 1 and the second unwinding portion 1a move while drawing a circular trajectory, automatically cut the polarizing film of the first unwinding portion 1, and then the second winding.
  • the polarizing film of the protruding portion 1a can be automatically connected.
  • the first unwinding part 11 and the second unwinding part 11a are also configured to rotate by a turret. According to the structure of the turret, the unwinding portions or the winding portions can be easily replaced with each other, which is excellent in that the films can be easily connected.
  • the structure shown in FIG. 2 is mentioned as a modification of a winding part.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c of FIG. 2 have a structure which can move horizontally with respect to the direction of the core 1d of a polarizing film.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c have a structure which can move along the width direction of a polarizing film.
  • the structure is movable in at least one of both directions along the core 1d (the back side direction in the drawing (marked with a cross in the circle) and the front side of the drawing. It can move in at least one of the lateral directions (marked with a circle in the circle).
  • the bonding device 60 is provided on the upper part of the first unwinding portion 1b and the second unwinding portion 1c.
  • the first unwinding portion 1b and the second unwinding portion are provided. Since the portion 1c is structured to move horizontally in the direction of the core 1d, it is not necessary to secure a space for the unwinding portions to move upward. Therefore, the space between the conveyor roll 15 provided at the upper portion and the unwinding portion can be saved. As a result, it is possible to provide a downsized bonding apparatus, and thus a manufacturing system.
  • the present invention is greatly different from a conventional manufacturing system having a turret in that such downsizing can be achieved.
  • a manufacturing system having a turret is disclosed, for example, in Japanese Patent Laid-Open No. Hei 8-208083.
  • the roll remaining amount of the polarizing film provided in the 1st unwinding part 1b decreases, it connects with the polarizing film of the 2nd unwinding part 1c by an operator.
  • the conveyance speed of the polarizing film is 0 m / min.
  • the operator cuts the polarizing film on the first unwinding portion 1b side.
  • polarizing films are connected using a single-sided adhesive tape, for example.
  • the second winding unit 2a, the first winding unit 12 and the second winding unit 12a in FIG. 1 in FIG. 1 can be set as the structure which can move horizontally with respect to this direction.
  • the space between the conveyor roll 15 and the winding unit can be saved, and a more compact bonding apparatus, and thus a manufacturing system can be provided. is there.
  • Half cutter (cutting unit) 3 half-cuts a polarizing film (a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film) protected by a peeling film, and cuts the polarizing film and the pressure-sensitive adhesive layer.
  • a polarizing film a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film
  • the half cutter 3 a known member may be used. Specifically, a cutter, a laser cutter, etc. can be mentioned. After the polarizing film and the pressure-sensitive adhesive layer are cut by the half cutter 3, the release film is removed from the polarizing film by the knife edge (removal part) 4.
  • the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic, epoxy, and polyurethane pressure-sensitive adhesive layers.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 5 to 40 ⁇ m.
  • the 2nd film conveyance mechanism 52 is the structure similar to the 1st film conveyance mechanism 51, and is the 1st unwinding part 11, the 2nd unwinding part 11a, the 1st winding part 12, and the 2nd winding part 12a. , Half cutter 13, knife edge 14 and defect film winding rollers 17 and 17 a. About the member which attached
  • the manufacturing system 100 includes a cleaning unit 71.
  • the cleaning unit 71 cleans the substrate 5 before the polarizing film is bonded to the lower surface of the substrate 5 by the nip rolls 6 and 6a.
  • a known cleaning unit composed of a nozzle and a brush for injecting a cleaning liquid may be used. By cleaning the substrate 5 immediately before the bonding by the cleaning unit 71, the bonding can be performed in a state where there are few adhered foreign substances on the substrate 5.
  • FIG. 3 is a cross-sectional view showing a peripheral portion of the nip rolls 6 and 6a in the manufacturing system 100.
  • FIG. FIG. 3 shows a situation in which the substrate 5 is transported from the left direction and the polarizing film 10a having an adhesive layer (not shown, the same hereinafter) is transported from the lower left direction.
  • the polarizing film 10 is provided with a release film 10b, and the polarizing film 10a and the pressure-sensitive adhesive layer are cut by the half cutter 3, and the release film 10b is not cut (half cut).
  • the knife edge 4 is installed on the peeling film 10b side.
  • the knife edge 4 is an edge-shaped member for peeling the peeling film 10 b, and the polarizing film 10 a and the peeling film 10 b having a low adhesive force are peeled off along the knife edge 4.
  • the release film 10b is wound around the first winding portion 2 of FIG.
  • it can replace with a knife edge and can also use the structure which winds up a peeling film using an adhesion roller.
  • the winding efficiency of a peeling film can be improved by providing an adhesive roller in two places similarly to a winding part.
  • the bonding apparatus 60 conveys the board
  • clean air is supplied to the upper surface of the substrate 5 in the bonding apparatus 60. That is, downflow rectification is performed. Thereby, it is possible to perform conveyance and bonding of the substrate 5 in a stable state.
  • the bonding device 60 is provided on the upper part of the film transport mechanism 50. Thereby, space saving of the manufacturing system 100 can be achieved.
  • a substrate transport mechanism including a conveyor roll is installed in the bonding device 60, whereby the substrate 5 is transported in the transport direction (the first substrate transport device 61 and the second substrate described later in FIG. 10).
  • the substrate transfer device 62 corresponds to a substrate transfer mechanism).
  • the substrate 5 is transported from the left side, and then transported from the right side in the drawing, that is, from the top of the first film transport mechanism 51 to the top of the second film transport mechanism 52.
  • the nip rolls 6 * 6a (1st bonding part) and the nip rolls 16 * 16a (2nd bonding part) which are bonding parts are each provided.
  • the nip rolls 6, 6 a and 16, 16 a are members that play a role of bonding the polarizing film 10 a from which the release film 10 b has been removed to the lower surface of the substrate 5.
  • the substrate 5 is reversed by the reversing mechanism 65 after the polarizing film 10a is bonded to one surface by the nip rolls 6 and 6a.
  • the reversing mechanism 65 will be described later.
  • the polarizing film 10a conveyed to the nip rolls 6 and 6a is bonded to the lower surface of the substrate 5 through an adhesive layer.
  • known configurations such as a pressure roll and a pressure roll can be employed.
  • what is necessary is just to adjust the pressure and temperature at the time of bonding in the nip rolls 6 and 6a suitably.
  • the configuration of the nip rolls 16 and 16a is the same.
  • a defect display (mark) detection unit is provided between the first unwinding unit 1 and the half cutter, and a polarizing film having a defect is detected. It has a configuration.
  • the said defect display is provided at the time of the 1st unwinding part 11 or the 2nd unwinding part 11a rather than a defect display detection part by performing the detection at the time of original film production of a polarizing film, and providing a defect display. It attaches
  • the defect display imparting unit includes a camera, an image processing device, and a defect display forming unit. First, a polarizing film is imaged by the camera, and the presence or absence of a defect can be inspected by processing the imaging information. Specific examples of the drawback include foreign matters such as dust and fish eyes. When a defect is detected, a defect display is formed on the polarizing film by the defect display forming unit. A mark such as ink is used as the defect display.
  • a bonding avoiding unit discriminates the mark with a camera and transmits a stop signal to the bonding apparatus 60 to stop the conveyance of the substrate 5. Thereafter, the polarizing film in which the defect is detected is not bonded by the nip rolls 6 and 6a and is wound by the defect film winding roller (collecting unit) 7 and 7a. Thereby, pasting with substrate 5 and a polarizing film which has a fault can be avoided. If such a series of structures is provided, it is possible to avoid the bonding between the polarizing film having a defect and the substrate 5, so that the yield can be increased, which is preferable.
  • a publicly known inspection sensor can be used suitably as a fault detection part and a pasting avoidance part.
  • the substrate 5 is conveyed to the nip rolls 16 and 16a. Then, a polarizing film is bonded to the lower surface of the substrate 5. As a result, the polarizing film is bonded to both surfaces of the substrate 5, and the two polarizing films are bonded to both surfaces of the substrate 5 with different absorption axes. Thereafter, if necessary, the both sides of the substrate 5 are inspected for misalignment.
  • the inspection can be usually performed by an inspection unit equipped with a camera.
  • the bonding is performed from the lower surface of the substrate 5, and the rectifying environment to the substrate 5 is not hindered. For this reason, foreign matter mixing into the bonding surface of the substrate 5 can be prevented, and more accurate bonding can be performed.
  • FIG. 4 (a) and FIG. 4 (b) show the velocity vector of the airflow in the under-paste type manufacturing system similar to the present invention.
  • the area A is an area where the unwinding part is installed
  • the area B is an area where the polarizing film mainly passes
  • the area C is an area where the winding part is installed. It is.
  • clean air is supplied from the HEPA filter 40.
  • FIG. 4A since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41.
  • FIG.4 (b) since the grating 41 is not installed, after an airflow contacts a floor, it will move along a floor.
  • FIGS. 4 (a) and 4 (b) Since the manufacturing system shown in FIGS. 4 (a) and 4 (b) is a bottom-attached type, the air current from the HEPA filter 40 is not hindered by the polarizing film as shown in FIGS. 14 (a) and 14 (b). For this reason, the direction of the airflow vector is almost directed toward the substrate, and it can be said that a preferable rectification environment is realized in the clean room.
  • the grating 41 is installed and not installed in FIG. 4B, but the same preferable state is shown in both figures.
  • the substrate transport mechanism is formed horizontally, but is not installed as a series of structures. For this reason, the airflow can pass between the substrate transport mechanisms. After the substrate is held by a reversing mechanism to be described later, the substrate is transferred between the substrate transport mechanisms.
  • substrate 5 is first conveyed by a long side opening (a long side is orthogonal to a conveyance direction), and is conveyed by a short side opening (a short side is orthogonal to a conveyance direction) after that. It has become.
  • FIG. 5 is a cross-sectional view showing a modification of the bonding apparatus 60 according to the present invention.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c in the 1st film conveyance mechanism 51 which concern on FIG. 5 are the structures which can move along a horizontal with respect to the direction of the core 1d of a polarizing film similarly to FIG. It has become.
  • the 1st film conveyance mechanism 51 is provided with the film connection part (1st film connection part) 83 and the film connection part (2nd film connection part) 93, and can connect the polarizing films 10 and 20 by these. .
  • FIG. 6 is a perspective view showing the film connecting portion 83 and the cutting machine 87.
  • the film connecting portion 83 includes suction portions 84 and 84 a and a cutting and bonding portion 85.
  • the adsorption portions 84 and 84a are members for adsorbing and fixing the polarizing film.
  • the suction portions 84 and 84a have a flat plate shape and include a plurality of suction mechanisms 89 on the surface thereof.
  • the adsorption mechanism 89 is not particularly limited as long as the polarizing film can be adsorbed, and a configuration in which the polarizing film is adsorbed by sucking air with a pump can be adopted.
  • the cutting and bonding part 85 is rotatable and has a plurality of surfaces. Specifically, the cut bonding part 85 has a polygonal shape. Moreover, it arrange
  • the cutting and bonding part 85 is in a direction perpendicular to the polarizing film 10 and can be moved in a direction close to the polarizing film 10 to return to the original position. Thereby, it is possible to avoid reliably that the corner
  • lamination bonding part 85 is a polygonal shape and is also provided with the cutting
  • a mating surface may be further provided.
  • the cut bonding part 85 of FIG. 6 between the bonding surfaces and between the cutting support surface and the bonding surface are chamfered, and the corner part is formed, the cutting bonding part 85 and the polarizing film.
  • the size of the cut and bonded portion 85 may be appropriately determined depending on the width of the polarizing film 10 and is not particularly limited.
  • the length is 200 mm or more and 2000 mm or less, and the width is 10 mm or more and 300 mm or less. can do.
  • FIG. 7 is a perspective view showing the cutting and bonding part 85.
  • FIG. 7 shows a state in which the cutting and bonding portion 85 of FIG. 6 is rotated by 1/3 turn clockwise.
  • the cutting and bonding unit 85 includes a cutting support surface 85 a that supports the polarizing film 10 along the width direction of the polarizing film 10. Moreover, it has the bonding surfaces 85b and 85c provided with the adsorption
  • a groove-shaped opening 86 is formed in the cutting support surface 85a, and the blade portion of the cutting machine 87 provided in the cutting bonding portion 85 shown in FIG. By forming the opening 86, the cutting machine 87 can be reliably passed along the width direction of the polarizing film 10, and the polarizing films 10 and 20 can be more accurately connected.
  • the cutting machine 87 As the cutting machine 87, a known cutter can be adopted, and the polarizing film 10 can be easily cut. Further, the cutting machine 87 is supported by a base portion 88 that can be driven in the width direction of the polarizing film 10.
  • the bonding surfaces 85b and 85c have the same configuration as each other, and include a plurality of suction mechanisms 89 in the same manner as the suction portions 84 and 84a.
  • the single-sided adhesive tape (connection material) 85d is arrange
  • the above single-sided adhesive tape 85d only needs to be able to bond polarizing films together, and a known single-sided adhesive tape can be used.
  • the film material of the single-sided adhesive tape 85d include polyethylene terephthalate film (PET film), cellulose, Japanese paper, aluminum, non-woven fabric, polytetrafluoroethylene, polyvinyl chloride, polyvinylidene chloride, polycarbonate, polyurethane, ABS resin, polyester, Examples thereof include polystyrene, polyethylene, polypropylene, polyacetal resin, polylactic acid, polyimide, and polyamide.
  • the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer includes acrylic, epoxy, polyurethane, synthetic rubber, EVA, silicone, vinyl chloride, chloroprene rubber, cyanoacrylate, isocyanate, and polyvinyl alcohol. And pressure sensitive adhesives such as melamine resin.
  • the film connecting portion 83 is disposed so as to face the polarizing film 10. For this reason, in FIG. 5, since the polarizing film 10 is arrange
  • the film connecting portion 93 has the same structure as the film connecting portion 83. As shown in FIG. 5, the film connecting portions 83 and 93 are arranged so that the suction mechanisms of the suction portions provided in the film connecting portions 83 and 93 face each other. Moreover, the film connection parts 83 and 93 are arranged with the passage positions of the polarizing film 10 and the polarizing film 20 interposed therebetween. In addition, the manufacturing system 100 provided with the film connection part 83 * 93 is a preferable form in this Embodiment, and it is also possible to set it as the form which is not provided with the film connection part 83 * 93.
  • the polarizing film 10 is unwound from the 1st unwinding part 1 (unwinding process). Then, as shown in FIG. 3, only the polarizing film 10a is half-cut with a half cutter (not shown), and the release film 10b is peeled off with the knife edge 4 (peeling step). Further, the polarizing film 10a from which the release film 10b has been peeled and the substrate 5 are bonded together by pressure bonding with the nip rolls 6 and 6a (bonding step). The peeled release film 10b is wound up and collected by a winder (not shown). Through the series of steps, the substrate 5 and the polarizing film 10a are bonded to obtain an optical display device.
  • the polarizing film 10 of the first unwinding part 1 (11, 1b) and the polarizing film 20 of the second unwinding part 1a (11a, 1c) are cut. And among the polarizing film 10 of the 1st unwinding part 1 (11, 1b) and the polarizing film 20 of the 2nd unwinding part 1a (11a, 1c), the line side of the 1st unwinding part 1 (11, 1b) The polarizing film 10 or the second unwinding part 1a (11a, 1c) of the line side polarizing film 20 and the unwinding part of the second unwinding part 1a (11a, 1c) of the polarizing film 20 or first unwinding The polarizing film 10 on the unwinding part side of the part 1 (11, 1b) is connected. In other words, the “line side” indicates a direction in which the polarizing film is unwound. Examples of the connecting step include (1) a technique by an operator and (2) a technique using the
  • the conveyance speed of the polarizing film 10 is set to 0 m / min. After the above (after stopping the polarizing film 10), the operator cuts the polarizing film 10. Next, after unwinding the polarizing film 20 from the 1st unwinding part 11 and cut
  • the two unwinding portions of the first unwinding portions 1 and 11 are provided, so that the polarizing film 10. 20, the film can be immediately connected, and the polarizing film 20 can be unwound quickly. Therefore, unlike the conventional manufacturing system in which the unwinding unit is installed only at one place, the original roll roll can be replaced at the unwinding unit that is vacant during operation. Can be reduced. As a result, it is possible to shorten the manufacturing time of the optical display device.
  • the roll of the polarizing film 10 of the first unwinding unit 1 is replaced with a new roll while the polarizing film 20 is unwound.
  • the remaining amount of the polarizing film 20 decreases, it is of course possible to connect the polarizing film 20 and the polarizing film 10 in the same manner.
  • FIG. 8 is a process diagram illustrating a connection process by a manufacturing system including a film connection part.
  • the conveyance speed of the polarizing film 10 is set to 0 m / min.
  • the suction portions 84 and 84a and the cutting and bonding portion 85 are moved in the vertical direction with respect to the polarizing film 10.
  • the polarizing film 10 is sucked and fixed by the suction mechanism 89 of the suction portions 84 and 84a (suction process).
  • the cutting support surface 85a is in contact with the polarizing film 10 in the cutting and bonding unit 85.
  • the polarizing film 10 is cut by moving a cutting machine (not shown) along the opening 86 (cutting step).
  • the cutting and bonding part 85 is moved in the direction perpendicular to the polarizing film 10 and away from the polarizing film 10 (right side in the figure), rotated counterclockwise by 1/3 turn, and the polarizing film 10 In the direction perpendicular to the polarizing film 10 (the left side in the figure).
  • the single-sided adhesive tape 85d of the bonding surface 85b is bonded together so that the cutting line of the polarizing film 10 which opposes the single-sided adhesive tape 85d (not shown) may be covered. Joint process).
  • the said cutting line shows the edge
  • the single-sided adhesive tape 85d is disposed so as to cover the cutting line, that is, the polarizing film 10 is also disposed on a portion where the polarizing film 10 does not exist beyond the cutting line.
  • the single-sided adhesive tape 95d is adhered to the polarizing film 20 in the same manner as in FIGS. 8A to 8C.
  • the same members as those described above are given the same names, and the description thereof is omitted.
  • a cutting machine (not shown) is formed on the cutting support surface 95a.
  • the polarizing film 20 is cut by moving along the opening 96.
  • the cut and bonded portion 95 is moved in a direction perpendicular to the polarizing film 20 and away from the polarizing film 20 (left side in the figure), and rotated clockwise by 1/3 turn to the polarizing film 20 On the other hand, it is moved in a direction perpendicular to the polarizing film 20 (right side in the figure).
  • the single-sided adhesive tape 95d can be affixed so that the cutting line of the polarizing film 20 facing the single-sided adhesive tape 95d of the bonding surface 95b may be covered.
  • the adsorbing portions 84 and 84a and the cutting and bonding portion 85 are brought close to the adsorbing portions 94 and 94a and the cutting and bonding portion 95 (film connecting portion 93).
  • the cut surfaces of the polarizing film 10 and the polarizing film 20 are matched with each other (proximity step). Thereby, among the single-sided adhesive tapes 85d and 95d that cover the cutting line of the polarizing film 10/20, the part beyond the cutting line (the part not bonded to the polarizing film 10/20) is the other polarizing film 20/20.
  • the polarizing films 10 and 20 are connected to each other.
  • the film connecting part 83 is brought close to the film connecting part 93, but the film connecting part 93 may be made close to the film connecting part 83, and the film connecting parts 83 and 93 are made close to each other. May be.
  • the cutting and bonding parts 85 and 95 are perpendicular to the polarizing films 10 and 20, respectively, and are moved away.
  • the cutting and bonding part 85 is rotated clockwise by 1/3 turn, and the cutting and bonding part 95 is rotated counterclockwise by 1/3 turn. Then, the cutting and bonding parts 85 and 95 are moved in the direction perpendicular to the polarizing films 10 and 20 and in the adjacent directions.
  • the adsorbing portions 84 and 84a and the cutting and bonding portion 85 are returned to the positions shown in FIG. 8A, and the series of steps is completed.
  • the single-sided adhesive tapes 85d and 95d are preliminarily adsorbed on the bonding surfaces 85c and 95c, after a new roll of the polarizing film 10 is installed on the second unwinding portion 1c. 8 (a) to (c) are performed on the polarizing film 20, and the steps of FIGS. 8 (d) to (e) are performed on the polarizing film 10.
  • FIGS. The polarizing films 20 and 10 can be connected through the step h). Of course, it is also possible to continuously connect the polarizing films by supplementing the used single-sided adhesive tapes 85d and 95d.
  • the polarizing film is adsorbed, cut, and bonded in a shorter time and more accurately than the connecting step by the operator. Is preferable.
  • the manufacturing system when only the first unwinding portion 1 is used, the first unwinding portion 11 is not used, and further, the film connecting portions 83 and 93 are not used, the operator can move to the first unwinding portion 1. Since it is necessary to replace the polarizing film 10 after replacing a new polarizing film, the connecting step requires about 30 minutes. For this reason, it is clear that the manufacturing system according to the present embodiment is useful.
  • FIGS. 9A to 9D are perspective views showing the process of reversing the substrate 5 by the reversing mechanism.
  • 9A shows a state in which the substrate 5 transported by the first substrate transport mechanism is adsorbed
  • FIGS. 9B and 9C show a process of moving the substrate 5
  • the substrate transport mechanism is omitted in FIG. 9, but will be described later with reference to FIG.
  • the reversing mechanism 65 includes a suction unit 66, a substrate reversing unit 67, and a substrate rotating unit 68.
  • the adsorption unit 66 is a member that adsorbs to the surface of the substrate 5. As a result, the surface of the substrate 5 is held by the suction portion 66.
  • a known adsorption unit can be used, and for example, an air suction type adsorption unit can be used.
  • the substrate reversing unit 67 includes a suction unit 66 and reverses the substrate 5 with the long side or the short side of the substrate 5 as the lower side.
  • the substrate reversing unit 67 has a rotating shaft structure, and the suction unit 66 is rotated by rotating the substrate reversing unit 67.
  • the substrate reversing unit 67 is not limited to this structure, and may be a structure in which the suction unit 66 is rotated by the driving unit.
  • the substrate reversing unit 67 reverses the substrate 5 in the first rotation and the second rotation.
  • the inversion of the substrate 5 is divided into a first rotation and a second rotation. Inversion means that the substrate 5 is rotated to the opposite surface, in other words, that the surface of the substrate 5 is arranged to be the back surface.
  • FIG. 9A shows a case where the short side of the substrate 5 is along the transport direction.
  • the substrate 5 rotates with the long side of the substrate 5 as the lower side.
  • FIG. 9 (a) ⁇ FIG. 9 (b)
  • the substrate 5 is rotated to the first angle.
  • the first angle is X ° less than 180 °.
  • X ° is 80 ° or more and 110 ° or less. Is preferably 85 ° or more and 95 ° or less, and most preferably 90 °.
  • the substrate rotating unit 68 is provided in the substrate reversing unit 67, and the substrate 5 rotated by the first rotation is transferred to the substrate 5 in the first substrate transport mechanism (not shown), that is, the surface of the substrate 5 shown in FIG. Is rotated by 90 ° in a direction parallel to the axis.
  • the rotation direction of 90 ° is made such that the long side or the short side located on the transport direction side is the inner side out of the two long sides or short sides orthogonal to the transport direction.
  • the substrate reversing part 67 shown in FIG. 9C has a structure in which the base part rotates.
  • the substrate rotating unit 68 is not limited to the illustrated structure as long as it can rotate the substrate 5 by 90 ° in a direction parallel to the surface of the substrate 5 in the first substrate transport mechanism.
  • a robot arm having a control unit is used as the substrate reversing unit 67 and / or the substrate rotating unit 68, it is preferable because precise operation of the substrate 5 is possible.
  • a known robot arm can be used as the robot arm, and the structure is not particularly limited as long as the substrate reversing unit 67 and / or the substrate rotating unit 68 can be operated.
  • the substrate 5 rotated by the first rotation by the substrate reversing unit 67 is further rotated and inverted with the long side or the short side of the substrate 5 as the lower side. .
  • the substrate 5 is inverted and the short side is in a state along the transport direction.
  • the long side of the substrate 5 is the lower side. Which of the long side and the short side of the substrate 5 is set as the lower side in the first rotation and the second rotation is determined so that the long side is the lower side and the long side is in the transport direction if the short side is in the transport direction.
  • the short side is the lower side if it is in a line.
  • the substrate 5 can be reversed in any state.
  • FIG. 10 is a plan view showing the rotation process of the substrate 5 in FIG.
  • FIG. 10 illustrates the first substrate transport mechanism 61 and the second substrate transport mechanism 62 in addition to the reversing mechanism 65.
  • the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are provided with conveyor rolls.
  • the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are arranged in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus 60 according to the present invention is very simple to install and is excellent in area efficiency.
  • the surface of the substrate 5 is held by the suction portion 66, and the substrate reversing portion 67 is rotated 90 ° as the first rotation in the direction of the arrow (FIG. 10 (a) ⁇ FIG. 10 ( b)).
  • the substrate 5 rotated by the first rotation is rotated by 90 ° in a direction parallel to the surface of the substrate 5 in the first substrate transport mechanism 61, that is, the substrate 5 of FIG. b) rotation in the direction of the arrow, FIG. 10 (b) ⁇ FIG. 10 (c)).
  • the substrate 5 is reversed by the second rotation of the substrate reversing section 67 ((FIG. 10 (c) ⁇ FIG. 10 (d)).
  • the suction section 66 and the conveyor roll (not shown) of the second substrate transport mechanism 62 After the suction of the suction part 66 is released, the substrate 5 is released from being held, and then the substrate 5 is transported by the second substrate transport mechanism 62. Then, the reversing mechanism 65 is provided. Returns to the position shown in FIG. 10A, and the other substrates 5 that are sequentially conveyed are reversed by the same operation.
  • the reversing mechanism 65 As described above, according to the reversing mechanism 65, four simple operations of suction by the suction unit 66, first rotation, 90 ° rotation from the first substrate transport mechanism 61 to the second substrate transport mechanism 62, and second rotation. By reversing the substrate 5, the long side and the short side with respect to the transport direction can be changed. After performing the said operation
  • the substrate 5 is temporarily stopped between the first rotation and the second rotation described above. However, when the substrate is temporarily stopped during the first rotation and the second rotation, that is, when the rotation is performed stepwise, respectively. It is included in the first rotation and the second rotation.
  • the rotation of the substrate reversing unit 67 by the substrate reversing unit 67 before and after the rotation of the substrate 5 by the substrate rotating unit 68 can be referred to as a first rotation and a second rotation, respectively.
  • the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are not arranged in a straight line but have adjacent structures. This is because the substrate 5 is rotated by 90 ° by the substrate rotating unit 68 as shown in FIG. 10C, so that the final transfer direction of the substrate 5 is the same as that of the first substrate transfer mechanism 61 and the first as shown in FIG. This is because there is a deviation from the two-substrate transport mechanism 62.
  • FIG. 11 is a plan view showing a modification of the bonding apparatus 60 using two reversing mechanisms 65. Changes in the modification include (1) two reversing mechanisms 65, (2) the first substrate transport mechanism 61 includes the substrate platform 61a, and (3) the first substrate transport mechanism. 61 and the second substrate transport mechanism 62 are arranged in a straight line. The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are the same in that they are arranged in the same direction.
  • the substrate platform 61a and the reversing mechanism 65 are arranged at both ends of the first substrate transport mechanism 61 on the second substrate transport mechanism 62 side, which are horizontal with respect to the transport direction of the first substrate transport mechanism 61 at the end. Are provided along.
  • the reversing mechanism 65 has the structure described with reference to FIGS.
  • the said edge part is equipped with the conveyance means which conveys the board
  • the substrate platform 61a is a place that becomes the end point of the transport of the substrate 5 before the first rotation. According to this structure, the substrates 5 transported to the first substrate transport mechanism 61 are transported alternately to the two substrate platforms 61a. Since the substrate platform 61a and the reversing mechanism 65 are provided in two pairs, the substrate 5 transported to the substrate platform 61a is rotated by the reversing mechanism 65 for the first rotation, 90 ° rotation, and second rotation. Inverted.
  • the two substrate platforms 61 a are provided along both horizontal directions of the first substrate transport mechanism 61, so the inverted substrate 5 is along the transport direction of the first substrate transport mechanism 61. Will be placed. Therefore, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 can be arranged on a straight line.
  • the substrate 5 can be processed twice per unit time. Thereby, since many substrates 5 can be reversed per unit time, the tact time is shortened.
  • the bonding apparatus of the structure excellent in area efficiency can be provided. Especially in a clean room, since the area efficiency is required, the bonding apparatus is very preferable.
  • the manufacturing system 100 includes a control unit 70, a cleaning unit 71, a misalignment inspection device 72, a bonded foreign matter automatic inspection device 73, and a sorting and conveying device 74.
  • the bonding deviation inspection device 72, the bonded foreign substance automatic inspection device 73, and the sorting and conveying device 74 perform processing such as inspection on the substrate 5 after bonding, that is, the liquid crystal display device.
  • FIG. 12 is a block diagram showing the relationship of each member included in the above-described liquid crystal display device manufacturing system
  • FIG. 13 is a flowchart showing the operation of the liquid crystal display device manufacturing system.
  • the operation of the liquid crystal display device will be described together with the description of each member.
  • the control unit 70 is connected to the cleaning unit 71, the misalignment inspection device 72, the bonded foreign matter automatic inspection device 73, and the sorting and conveying device 74, and controls them by transmitting control signals thereto.
  • the control unit 70 is mainly configured by a CPU (Central Processing Unit) and includes a memory or the like as necessary.
  • CPU Central Processing Unit
  • the cleaning unit 71 In the case where the cleaning unit 71 is provided in the manufacturing system 100, the substrate 5 in the first substrate transport mechanism 61 is transported to the cleaning unit 71 at the front edge of the long side in order to reduce the tact time in the cleaning unit 71. Is preferred. Usually, since the cleaning in the cleaning unit 71 takes a long time, this configuration is very effective from the viewpoint of shortening the tact time.
  • a bonding step of bonding the polarizing film to both surfaces of the substrate 5 is performed (S2 in FIG. 13). This step is as described with reference to FIGS.
  • the sticking deviation inspection device 72 is for inspecting the presence or absence of sticking deviation of the polarizing film on the bonded substrate 5.
  • the sticking deviation inspection device 72 is constituted by a camera and an image processing device, and the camera is installed at the bonding position of the substrate 5 on which the polarizing film is bonded by the nip rolls 16 and 16a.
  • the substrate 5 is photographed by the camera, and by processing the photographed image information, the substrate 5 can be inspected for the presence or absence of sticking (sticking slip inspection step, S3 in FIG. 13).
  • the misalignment inspection apparatus 72 a conventionally known misalignment inspection apparatus can be used as the misalignment inspection apparatus 72.
  • the bonded foreign matter automatic inspection device 73 inspects the presence or absence of foreign matter on the bonded substrate 5.
  • the bonded foreign matter automatic inspection device 73 is configured by a camera and an image processing device, like the misalignment inspection device 72, and transports the second substrate of the substrate 5 after the polarizing film is bonded by the nip rolls 16 and 16a.
  • the camera is installed in the mechanism (bonding device 60).
  • substrate 5 is image
  • the foreign matter include foreign matters such as dust, fish eyes, and the like.
  • a conventionally well-known bonding foreign material inspection apparatus can be used as the bonding foreign material automatic inspection apparatus 73.
  • S3 and S4 may be performed in the reverse order or simultaneously. One step can be omitted.
  • the sorting and conveying device 74 determines the presence or absence of sticking misalignment and foreign matter based on the inspection results from the sticking misalignment inspection device 72 and the bonded foreign matter automatic inspection device 73.
  • the sorting and conveying device 74 only needs to receive an output signal based on the inspection result from the sticking misalignment inspection device 72 and the bonding foreign matter automatic inspection device 73 and can sort the bonded substrates 5 into non-defective products or defective products. . Therefore, a conventionally known sorting and conveying system can be used.
  • both the misalignment and foreign matter are detected.
  • the bonded substrate 5 is not used. Sorted as good (S7).
  • the bonded substrates 5 are classified as non-defective products (S6).
  • the non-defective product and the defective product can be quickly sorted, and the tact time can be shortened.
  • the sorting and conveying device 74 may be configured to determine the presence / absence of only one of the sticking misalignment and the foreign matter.
  • the present invention also includes the following aspects.
  • the first substrate transport mechanism and the second substrate transport mechanism are arranged in a straight line, and at the end of the first substrate transport mechanism on the second substrate transport mechanism side.
  • the substrate mounting portion and the reversing mechanism are provided in two pairs along both directions parallel to the transport direction of the first substrate transport mechanism at the end portion, and the end portion includes the substrate from the end portion to the substrate. It is preferable that transport means for transporting the substrate to the placement unit is provided, and the reversing mechanism reverses the substrate transported to each of the substrate placement units and places it on the second substrate transport mechanism.
  • the substrate can be processed twice per unit time. Thereby, since many substrates can be reversed per unit time, the tact time is shortened. Furthermore, since the 1st board
  • the 1st film conveyance mechanism and 2nd film conveyance mechanism which convey a polarizing film are provided, and the said 1st film conveyance mechanism was protected by the peeling film.
  • a plurality of unwinding sections for unwinding the polarizing film, a cutting section for cutting the polarizing film, a removing section for removing the release film from the polarizing film, and a plurality of winding sections for winding the removed release film are provided.
  • the second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the peeling film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film.
  • the first bonding unit is provided on the top of the structure and the second film transport mechanism, and bonds the polarizing film from which the release film has been removed to the substrate.
  • the unwinding part and the winding part are provided in plural, when the remaining amount of the original film of the polarizing film in one unwinding part decreases, the other unwinding part is provided in the original film. It is possible to connect raw materials. As a result, the operation can be continued without stopping the unwinding of the polarizing film, and the production efficiency can be increased.
  • the unwinding part can move horizontally with respect to the core direction of the polarizing film, and the first unwinding part and the second unwinding are the unwinding parts. It is preferable that the parts are arranged side by side.
  • the 1st film connection part and 2nd which connect the polarizing film unwound from the 1st unwinding part, and the polarizing film unwound from the 2nd unwinding part.
  • the film connecting part is interposed between the passage positions of both the polarizing films, and the first film connecting part is disposed to face the polarizing film unwound from the first unwinding part, and the second film connecting part is It arrange
  • the said 1st film connection part and 2nd film connection part are two adsorption
  • the plurality of surfaces of the cutting and bonding unit includes a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and an adsorption mechanism that adsorbs and holds the connecting material that connects the polarizing films to each other. It has at least the above bonding surface, and it is preferable that the first film connecting portion and the second film connecting portion can be close to each other.
  • the polarizing film can be adsorbed by the adsorbing portion, and the adsorbing polarizing film can be cut by the cutting machine while being supported by the cutting support surface. Then, the cutting bonding part can be rotated and the connection material of a bonding surface can be bonded with respect to the cut
  • an opening through which the cutting machine can pass is formed in the cutting support surface along the width direction of the polarizing film.
  • the cutting machine can be reliably passed along the width direction of the polarizing film, and the polarizing films can be more accurately connected later.
  • the cutting machine has a round blade shape.
  • the cutting and bonding part is movable in the vertical direction with respect to the polarizing film adsorbed by the adsorption part.
  • the cutting and bonding part when the cutting and bonding part rotates, the cutting and bonding part can move in a direction perpendicular to the polarizing film and away from the polarizing film, and then rotate. Thereby, when a cutting bonding part rotates, it can avoid reliably contacting a polarizing film.
  • the first film transporting mechanism before the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, the first film transporting mechanism includes a cleaning unit for cleaning the substrate. It is preferable to transport the substrate with the short side of the substrate along the transport direction.
  • the substrate can be cleaned by the cleaning unit in a state where the long sides of the substrate are orthogonal to the substrate transport direction. That is, since the distance of the substrate along the transport direction can be reduced, the tact time required for cleaning can be further shortened. As a result, it is possible to provide a polarizing film laminating apparatus that is further excellent in production efficiency.
  • the first film transport mechanism and the second film transport mechanism detect a defect display attached to the polarizing film unwound from the first unwinding section. It is preferable to have a defect detection unit, a bonding avoidance unit that discriminates the defect display and stops the conveyance of the substrate, and a recovery unit that recovers the polarizing film from which bonding with the substrate is avoided.
  • the yield can be increased.
  • the manufacturing system of the liquid crystal display device of this invention is equipped with the bonding apparatus of the said polarizing film, and the sticking
  • the presence / absence of sticking misalignment is determined based on the inspection result of the sticking misalignment inspection apparatus, and the substrate on which the polarizing film is bonded is classified based on the determination result. It is preferable to provide a transport device.
  • inspects the foreign material in the board
  • the presence or absence of a foreign material is determined based on the inspection result by the said bonded foreign material automatic test
  • the manufacturing system of the liquid crystal display device of this invention has the bonding foreign material automatic test
  • a determination is made as to whether there is a sticking deviation and a foreign matter, and based on the determination result, a sorting and conveying device is provided that sorts the substrate on which the polarizing film is bonded. It is preferable.
  • the polarizing film bonding apparatus according to the present invention can be used in the field of bonding a polarizing film to a substrate.

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Abstract

The disclosed lamination apparatus (60) comprises a first substrate conveying mechanism (61) for conveying a rectangular substrate (5), nip rolls for laminating a polarization film on the bottom surface of the substrate (5) in the first substrate conveying mechanism (61), an inversion mechanism (65), a second substrate conveying mechanism (62) for conveying the substrate (5), and nip rollers for laminating a polarization film on the bottom surface of the substrate (5) in the second substrate conveying mechanism (62), wherein the first substrate conveying mechanism (61) and the second substrate conveying mechanism (62) are disposed so as to be oriented in the same direction, and the inversion mechanism (65) is provided with a suction unit (66) for applying suction to the substrate (5), a substrate inversion unit (67) for inverting the substrate (5) by means of a first rotation, during which the substrate is rotated to a first angle with either the long end or the short end thereof at the bottom, and a second rotation, during which the substrate (5) is inverted from the first angle, and a substrate rotation unit (68) for rotating the substrate (5) in a direction parallel to the surface of the substrate (5) after the substrate has been rotated to the first angle in the first substrate conveying mechanism.

Description

偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムPolarizing film laminating apparatus and liquid crystal display manufacturing system having the same
 本発明は、偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムに関するものである。 The present invention relates to a polarizing film laminating apparatus and a liquid crystal display manufacturing system including the same.
 従来、液晶表示装置が広く製造されている。液晶表示装置に用いられる基板(液晶パネル)には、光の透過または遮断を制御するために、偏光フィルムが貼合されることが通常である。偏光フィルムはその吸収軸が直交するように貼合されている。 Conventionally, liquid crystal display devices have been widely manufactured. In general, a polarizing film is bonded to a substrate (liquid crystal panel) used in a liquid crystal display device in order to control transmission or blocking of light. The polarizing film is bonded so that the absorption axes thereof are orthogonal.
 基板に偏光フィルムを貼合する方法としては、偏光フィルムを基板に応じたサイズにカットした後に貼合する所謂 chip to panel 方式が挙げられる。しかしながら、この方式では、基板に対して、一枚ずつ偏光フィルムを貼合するため、生産効率が低いという欠点がある。一方、他の方式として、偏光フィルムをコンベアーロールに供給し、連続的に基板に貼合する所謂 roll to panel 方式が挙げられる。当該方法によれば、高い生産効率にて貼合が可能となる。 As a method for bonding the polarizing film to the substrate, there is a so-called “chip-to-panel” method in which the polarizing film is bonded after being cut into a size corresponding to the substrate. However, this method has a disadvantage that the production efficiency is low because the polarizing films are bonded to the substrate one by one. On the other hand, as another method, there is a so-called “roll-to-panel” method in which a polarizing film is supplied to a conveyor roll and continuously bonded to a substrate. According to this method, bonding can be performed with high production efficiency.
 roll to panel 方式の例として、特許文献1に光学表示装置の製造システムが開示されている。上記製造システムは、基板の上面に光学フィルム(偏光フィルム)を貼合した後に、基板を旋回させ、下面から偏光フィルムを貼合するものである。 As an example of a roll-to-panel method, Patent Document 1 discloses an optical display device manufacturing system. The said manufacturing system rotates a board | substrate after bonding an optical film (polarizing film) on the upper surface of a board | substrate, and bonds a polarizing film from a lower surface.
日本国公開特許公報「特許第4307510号公報(2009年8月5日発行)」Japanese Patent Publication “Patent No. 4307510 (issued on Aug. 5, 2009)”
 しかしながら、上記従来の装置では、以下の問題がある。 However, the conventional apparatus has the following problems.
 まず、基板に対して偏光フィルムを貼合する場合、埃などの異物が貼合面へ混入することを回避するため、クリーンルームにて作業がなされるのが通常である。そして、クリーンルームでは、空気の整流がなされている。基板に対してダウンフローにて整流がなされた状態にて偏光フィルムの貼合がなされることが、異物による歩留低下を抑制するために必要だからである。 First, when a polarizing film is bonded to a substrate, the work is usually performed in a clean room in order to prevent foreign matters such as dust from entering the bonding surface. In the clean room, air is rectified. This is because it is necessary to bond the polarizing film in a state in which rectification is performed on the substrate in a downflow in order to suppress the yield reduction due to the foreign matter.
 この点に関して、特許文献1の製造システムは、基板に対して、上面および下面から偏光フィルムを貼合する構成となっている。しかし、偏光フィルムの上面から貼合を行う場合、気流(ダウンフロー)が偏光フィルムによって妨げられ、基板への整流環境が悪化してしまうというデメリット挙げられる。偏光フィルムの上面から貼合を行う場合の例として、図14(a)および図14(b)に上貼り型の製造システムにおける気流の速度ベクトルを示す。図14における、領域Aは、偏光フィルムを巻出す巻出部等が設置される領域であり、領域Bは主に偏光フィルムが通過する領域、および、領域Cは、偏光フィルムから除去された剥離フィルムを巻き取る巻取部等が設置される領域である。 In this regard, the manufacturing system of Patent Document 1 has a configuration in which a polarizing film is bonded to the substrate from the upper surface and the lower surface. However, when bonding is performed from the upper surface of the polarizing film, there is a demerit that airflow (downflow) is hindered by the polarizing film and the rectification environment to the substrate is deteriorated. As an example of pasting from the upper surface of the polarizing film, FIGS. 14 (a) and 14 (b) show air velocity vectors in the top-paste type manufacturing system. In FIG. 14, a region A is a region where an unwinding unit and the like for unwinding the polarizing film are installed, a region B is a region through which the polarizing film mainly passes, and a region C is a peeling removed from the polarizing film. This is an area in which a take-up unit or the like for winding the film is installed.
 また、HEPA(High Efficiency Particulate Air)フィルター40からはクリーンエアーが供給される。なお、図14(a)では、クリーンエアーが通過可能なグレーチング41が設置されているためグレーチング41を介して気流が垂直方向に移動することが可能である。一方、図14(b)では、グレーチング41が設置されていないため、気流は図14(b)最下部の床に接触した後、床に沿って移動することとなる。 Also, clean air is supplied from a HEPA (High Efficiency Particulate Air) filter 40. In FIG. 14A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG. 14B, since the grating 41 is not installed, the airflow moves along the floor after contacting the floor at the bottom of FIG. 14B.
 図14(a)・(b)には、領域A~Cが2F(2階)部分に配置されており、HEPAフィルター40からのクリーンエアーが偏光フィルムによって妨げられる。したがって、2F部分を通過する基板に対して垂直方向に向う気流が生じ難い。これに対して、水平方向の気流ベクトルは大きな(ベクトルの密度が濃い)状態となっている。すなわち、整流環境が悪化した状態であるといえる。 14A and 14B, the areas A to C are arranged on the 2F (second floor) portion, and the clean air from the HEPA filter 40 is blocked by the polarizing film. Therefore, it is difficult to generate an airflow in the vertical direction with respect to the substrate passing through the 2F portion. On the other hand, the airflow vector in the horizontal direction is large (vector density is high). That is, it can be said that the rectification environment has deteriorated.
 本発明は、上記従来の問題点に鑑みなされたものであって、その目的は、整流環境を妨げることのない偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムを提供することにある。 This invention is made | formed in view of the said conventional problem, Comprising: The objective is to provide the manufacturing system of a polarizing film bonding apparatus and a liquid crystal display device provided with the same which do not disturb a rectification environment. is there.
 本発明の偏光フィルムの貼合装置は、上記課題を解決するために、長方形の基板を長辺または短辺が搬送方向に沿った状態にて搬送する第1基板搬送機構と、上記第1基板搬送機構における上記基板の下面に偏光フィルムを貼合する第1貼合部と、上記第1基板搬送機構にて搬送された上記基板を反転させて第2基板搬送機構に配置する反転機構と、上記基板を短辺または長辺が搬送方向に沿った状態にて搬送する第2基板搬送機構と、上記第2基板搬送機構における上記基板の下面に偏光フィルムを貼合する第2貼合部とを含む偏光フィルムの貼合装置であって、上記第1基板搬送機構と第2基板搬送機構とは同一方向に向かって配置されており、上記反転機構は上記基板を吸着する吸着部と、基板の長辺または短辺を下辺として、基板を第1角度まで回転させる第1回転および第1角度から基板を反転させる第2回転によって基板を反転させる基板反転部と、上記基板反転部に連結されており、上記第1回転によって回転された基板を、第1基板搬送機構における基板の表面に対して平行な方向に90°回転させる基板回転部とを備える。 In order to solve the above problems, the polarizing film laminating apparatus of the present invention transports a rectangular substrate with a long side or a short side along the transport direction, and the first substrate. A first bonding unit that bonds a polarizing film to the lower surface of the substrate in the transport mechanism; a reversing mechanism that reverses the substrate transported by the first substrate transport mechanism and places the substrate in the second substrate transport mechanism; A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction, and a second bonding unit for bonding a polarizing film to the lower surface of the substrate in the second substrate transport mechanism; The first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction, and the reversing mechanism includes a suction part that sucks the substrate, and a substrate. The long side or short side of A substrate reversing unit for reversing the substrate by a first rotation for rotating to a first angle and a second rotation for reversing the substrate from the first angle, and a substrate connected to the substrate reversing unit and rotated by the first rotation And a substrate rotating unit that rotates the substrate 90 degrees in a direction parallel to the surface of the substrate in the first substrate transport mechanism.
 上記の発明によれば、第1貼合部によって基板の下面に偏光フィルムを貼合し、反転機構における基板反転部による、(1)吸着部による基板の吸着、(2)基板反転部による基板の第1回転、(3)基板回転部による基板の90°回転、(4)基板反転部による基板の第2回転によって、基板を反転させると共に、搬送方向に対する長辺および短辺を変更することができる。その後、第2貼合部によって基板の下面に偏光フィルムを貼合することができる。すなわち、基板の両面に対して、下面から偏光フィルムを貼合することができるため、整流環境を妨げることがない。また、反転機構の動作は単純な4動作であるため、タクトタイムが短い。したがって、タクトタイムの短い貼合をも実現できる。さらに、上記第1基板搬送機構と第2基板搬送機構とが同一方向に向かって配置されている。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置は、設置が非常に簡便であり、面積効率に優れる。 According to said invention, a polarizing film is bonded to the lower surface of a board | substrate by a 1st bonding part, (1) Adsorption of the board | substrate by an adsorption | suction part by the board | substrate inversion part in a reversing mechanism, (2) Substrate by a board | substrate inversion part (3) 90 ° rotation of the substrate by the substrate rotation unit, and (4) reversing the substrate by the second rotation of the substrate by the substrate reversing unit, and changing the long side and the short side with respect to the transport direction. Can do. Then, a polarizing film can be bonded to the lower surface of a board | substrate by a 2nd bonding part. That is, since a polarizing film can be bonded from the lower surface to both surfaces of the substrate, the rectifying environment is not hindered. Further, since the operation of the reversing mechanism is a simple four operation, the tact time is short. Therefore, it is possible to realize bonding with a short tact time. Further, the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and is excellent in area efficiency.
 本発明の偏光フィルムの貼合装置は、以上のように、上記第1基板搬送機構と第2基板搬送機構とは同一方向に向かって配置されており、上記反転機構は上記基板を吸着する吸着部と、基板の長辺または短辺を下辺として、基板を第1角度まで回転させる第1回転および第1角度から基板を反転させる第2回転によって基板を反転させる基板反転部と、上記基板反転部に連結されており、上記第1回転によって回転された基板を、第1基板搬送機構における基板の表面に対して平行な方向に90°回転させる基板回転部を備えているものである。 In the polarizing film laminating apparatus of the present invention, as described above, the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction, and the reversing mechanism attracts the substrate. A substrate reversing unit for reversing the substrate by a first rotation for rotating the substrate to the first angle and a second rotation for reversing the substrate from the first angle, with the long side or short side of the substrate as the lower side, and the substrate reversal And a substrate rotating unit that rotates the substrate rotated by the first rotation by 90 ° in a direction parallel to the surface of the substrate in the first substrate transport mechanism.
 それゆえ、上記反転機構によって基板を反転させると共に、搬送方向に対する長辺および短辺を変更することができる。これにより、基板の両面に対して、下面から偏光フィルムを貼合することができるため、整流環境を妨げることがない。また、反転機構の動作は単純な4動作であるため、タクトタイムが短い。したがって、タクトタイムの短い貼合をも実現できる。さらに、上記第1基板搬送機構と第2基板搬送機構とが同一方向に向かって配置されている。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置は、設置が非常に簡便であり、面積効率に優れるという効果をも奏する。 Therefore, the substrate can be reversed by the reversing mechanism, and the long side and the short side with respect to the transport direction can be changed. Thereby, since a polarizing film can be bonded from the lower surface with respect to both surfaces of a board | substrate, a rectification environment is not prevented. Further, since the operation of the reversing mechanism is a simple four operation, the tact time is short. Therefore, it is possible to realize bonding with a short tact time. Further, the first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and also has an effect of being excellent in area efficiency.
 本発明の他の目的、特徴、および優れた点は、以下に示す記載によって十分分かるであろう。また、本発明の利点は、添付図面を参照した次の説明によって明白になるであろう。 Other objects, features, and superior points of the present invention will be fully understood from the following description. The advantages of the present invention will become apparent from the following description with reference to the accompanying drawings.
本発明に係る製造システムの実施の一形態を示す断面図である。It is sectional drawing which shows one Embodiment of the manufacturing system which concerns on this invention. 本発明における巻出部の変形例を示す断面図である。It is sectional drawing which shows the modification of the unwinding part in this invention. 図1の製造システムにおけるニップロールの周辺部分を示す断面図である。It is sectional drawing which shows the peripheral part of the nip roll in the manufacturing system of FIG. 本発明と同様の下貼り型の製造システムにおける気流の速度ベクトルを示す断面図である。It is sectional drawing which shows the velocity vector of the airflow in the underlay type manufacturing system similar to this invention. 本発明に係る貼合装置の変形例を示す断面図である。It is sectional drawing which shows the modification of the bonding apparatus which concerns on this invention. 本発明に係るフィルム連結部および切断機を示す斜視図である。It is a perspective view which shows the film connection part and cutting machine which concern on this invention. 本発明に係る切断貼合部を示す斜視図である。It is a perspective view which shows the cutting bonding part which concerns on this invention. 本発明に係る製造システムによる連結工程を示す工程図である。It is process drawing which shows the connection process by the manufacturing system which concerns on this invention. 本発明における反転機構によって基板を反転させる過程を示す斜視図である。It is a perspective view which shows the process in which a board | substrate is reversed by the inversion mechanism in this invention. 図9の反転機構によって基板を反転させる過程を示す平面図である。FIG. 10 is a plan view showing a process of reversing the substrate by the reversing mechanism of FIG. 9. 本発明に係る貼合装置の変形例を示す平面図である。It is a top view which shows the modification of the bonding apparatus which concerns on this invention. 本発明に係る液晶表示装置の製造システムが備える各部材の関連を示すブロック図である。It is a block diagram which shows the relationship of each member with which the manufacturing system of the liquid crystal display device which concerns on this invention is provided. 本発明に係る液晶表示装置の製造システムの動作を示すフローチャートである。It is a flowchart which shows operation | movement of the manufacturing system of the liquid crystal display device which concerns on this invention. 上貼り型の製造システムにおける気流の速度ベクトルを示す断面図である。It is sectional drawing which shows the velocity vector of the airflow in an upper sticking type manufacturing system.
 〔実施の形態1〕
 本発明の一実施形態について図1~図11に基づいて説明すれば以下の通りであるが、本発明はこれに限定されるものではない。まず、本発明に係る製造システム(液晶表示装置の製造システム)の構成について以下に説明する。製造システムは、本発明に係る貼合装置を含んでいる。
[Embodiment 1]
An embodiment of the present invention will be described below with reference to FIGS. 1 to 11, but the present invention is not limited to this. First, the structure of the manufacturing system (liquid crystal display device manufacturing system) according to the present invention will be described below. The manufacturing system includes a bonding apparatus according to the present invention.
 図1は、製造システムを示す断面図である。同図に示すように、製造システム100は2段構造となっており、1F(1階)部分はフィルム搬送機構50であり、2F(2階)部分は基板搬送機構を含む貼合装置60となっている。 FIG. 1 is a cross-sectional view showing a manufacturing system. As shown in the figure, the manufacturing system 100 has a two-stage structure, a 1F (first floor) portion is a film transport mechanism 50, and a 2F (second floor) portion is a bonding apparatus 60 including a substrate transport mechanism. It has become.
 <フィルム搬送機構>
 まず、フィルム搬送機構50について説明する。フィルム搬送機構50は、偏光フィルム(偏光板)を巻出してニップロール6・6aおよび16・16aまで搬送し、不要となった剥離フィルムを巻き取る役割を果たす。一方、貼合装置60はフィルム搬送機構50によって巻出された偏光フィルムを基板(液晶パネル)5に対して貼合する役割を果たすものである。
<Film transport mechanism>
First, the film transport mechanism 50 will be described. The film transport mechanism 50 plays the role of unwinding the polarizing film (polarizing plate) and transporting it to the nip rolls 6 · 6a and 16 · 16a and winding up the peeling film that is no longer needed. On the other hand, the bonding device 60 plays a role of bonding the polarizing film unwound by the film transport mechanism 50 to the substrate (liquid crystal panel) 5.
 フィルム搬送機構50は、第1フィルム搬送機構51および第2フィルム搬送機構52を備えている。第1フィルム搬送機構51は、基板5の下面に最初に偏光フィルムを貼合するニップロール6・6aに偏光フィルムを搬送するものである。なお、基板5は長方形形状を有している。一方、第2フィルム搬送機構52は、反転された基板5の下面に偏光フィルムを搬送するものである。
一方、第2フィルム搬送機構52は、反転された基板5の下面に偏光フィルムを搬送するものである。
The film transport mechanism 50 includes a first film transport mechanism 51 and a second film transport mechanism 52. The 1st film conveyance mechanism 51 conveys a polarizing film to the nip roll 6 * 6a which bonds a polarizing film to the lower surface of the board | substrate 5 first. The substrate 5 has a rectangular shape. On the other hand, the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
On the other hand, the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
 第1フィルム搬送機構51は、第1巻出部1、第2巻出部1a、第1巻取部2、第2巻取部2a、ハーフカッター3、ナイフエッジ4、および欠点フィルム巻取ローラー7・7aを備えている。第1巻出部1には偏光フィルムの原反が設置されており、偏光フィルムが巻出される。上記偏光フィルムとしては公知の偏光フィルムを用いればよい。具体的には、ポリビニルアルコールフィルムにヨウ素等によって染色がなされており、1軸方向に延伸されたフィルム等を用いることができる。上記偏光フィルムの厚さとしては、特に限定されないが、5μm以上、400μm以下の偏光フィルムを好ましく用いることができる。 The first film transport mechanism 51 includes a first unwinding unit 1, a second unwinding unit 1a, a first winding unit 2, a second winding unit 2a, a half cutter 3, a knife edge 4, and a defect film winding roller. 7 · 7a. The first unwinding unit 1 is provided with a polarizing film original, and the polarizing film is unwound. A known polarizing film may be used as the polarizing film. Specifically, a polyvinyl alcohol film is dyed with iodine or the like, and a film stretched in a uniaxial direction can be used. Although it does not specifically limit as thickness of the said polarizing film, A polarizing film 5 micrometers or more and 400 micrometers or less can be used preferably.
 上記偏光フィルムの原反では、流れ方向(MD方向)に吸収軸の方向が位置している。上記偏光フィルムは剥離フィルムによって粘着剤層が保護されている。上記剥離フィルム(保護フィルムまたはセパレーターともいう)としては、ポリエステルフィルム、ポリエチレンテレフタラートフィルムなどを用いることができる。上記剥離フィルムの厚さとしては、特に限定されないが、5μm以上、100μm以下の剥離フィルムを好ましく用いることができる。 In the original film of the polarizing film, the direction of the absorption axis is located in the flow direction (MD direction). The polarizing film has a pressure-sensitive adhesive layer protected by a release film. As the release film (also referred to as a protective film or a separator), a polyester film, a polyethylene terephthalate film, or the like can be used. Although it does not specifically limit as thickness of the said peeling film, The peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably.
 製造システム100には、巻出部が2つ、巻出部に対応する巻取部が2つ備えられているため、第1巻出部1の原反の残量が少なくなった場合、第2巻出部1aに備えられた原反を第1巻出部1の原反に連結させることが可能である。その結果、偏光フィルムの巻出しを停止させることなく、作業を続行することが可能である。本構成により、生産効率を高めることができる。なお、上記巻出部および巻取部はそれぞれ複数備えられていればよく、3つ以上備えられていてももちろんよい。 Since the manufacturing system 100 includes two unwinding portions and two unwinding portions corresponding to the unwinding portions, the first unwinding portion 1 has a low remaining amount of raw material. It is possible to connect the original fabric provided in the two unwinding portions 1 a to the original fabric of the first unwinding portion 1. As a result, it is possible to continue the operation without stopping the unwinding of the polarizing film. With this configuration, production efficiency can be increased. Of course, a plurality of unwinding sections and winding sections may be provided, and three or more winding sections may be provided.
 図1に示す第1巻出部1・第2巻出部1aは、ターレットにより互いの位置を入れ替えることが可能な構造となっている。位置が入れ替わる際には、第1巻出部1・第2巻出部1aが円の軌道を描きながら移動し、自動的に第1巻出部1の偏光フィルムを切断した後、第2巻出部1aの偏光フィルムとを自動的に連結することができる。第1巻出部11・第2巻出部11aも同様である。また、第1巻取部2・第2巻取部2a・第1巻取部12・第2巻取部12aについてもターレットにより回転する構造となっている。ターレットによる当該構造によれば、巻出部同士または巻取部同士を容易に入れ替えることができ、フィルム同士の連結を容易に行える点で優れている。 The 1st unwinding part 1 and the 2nd unwinding part 1a shown in FIG. 1 have a structure which can replace a mutual position with a turret. When the positions are switched, the first unwinding portion 1 and the second unwinding portion 1a move while drawing a circular trajectory, automatically cut the polarizing film of the first unwinding portion 1, and then the second winding. The polarizing film of the protruding portion 1a can be automatically connected. The same applies to the first unwinding part 11 and the second unwinding part 11a. Further, the first winding unit 2, the second winding unit 2a, the first winding unit 12, and the second winding unit 12a are also configured to rotate by a turret. According to the structure of the turret, the unwinding portions or the winding portions can be easily replaced with each other, which is excellent in that the films can be easily connected.
 また、巻取部の変形例として図2に示す構造が挙げられる。図2の第1巻出部1b・第2巻出部1cは偏光フィルムの巻芯1dの方向に対して水平に移動可能な構造となっている。換言すると、第1巻出部1b・第2巻出部1cは、偏光フィルムの幅方向に沿って移動可能な構造となっている。具体的には、図2の右部に示すように、巻芯1dに沿った両方向の少なくとも一方に移動可能な構となっている(図面奥側方向(○中に×のマーク)および図面手前側方向(○中に・のマーク)の少なくとも一方に移動可能)。 Moreover, the structure shown in FIG. 2 is mentioned as a modification of a winding part. The 1st unwinding part 1b and the 2nd unwinding part 1c of FIG. 2 have a structure which can move horizontally with respect to the direction of the core 1d of a polarizing film. In other words, the 1st unwinding part 1b and the 2nd unwinding part 1c have a structure which can move along the width direction of a polarizing film. Specifically, as shown in the right part of FIG. 2, the structure is movable in at least one of both directions along the core 1d (the back side direction in the drawing (marked with a cross in the circle) and the front side of the drawing. It can move in at least one of the lateral directions (marked with a circle in the circle).
 本構成によれば、偏光フィルムのロールを交換する場合、巻芯1dの方向に水平に移動された第1巻出部1bまたは第2巻出部1cに対して新たな偏光フィルムのロールを設置することができる。したがって、ターレットを有する構成とは異なり、第1巻出部1b・第2巻出部1cは上方に向かって移動しない。 According to this structure, when exchanging the polarizing film roll, a new polarizing film roll is installed on the first unwinding section 1b or the second unwinding section 1c moved in the direction of the core 1d. can do. Therefore, unlike the configuration having a turret, the first unwinding portion 1b and the second unwinding portion 1c do not move upward.
 図2に示すように第1巻出部1b・第2巻出部1cの上部に貼合装置60が備えられているが、本構造によれば、第1巻出部1b・第2巻出部1cは巻芯1dの方向に水平に移動する構造であるため、これら巻出部が上方へ移動する空間を確保する必要がない。したがって、上部に備えられたコンベアーロール15と巻出部との空間を省スペースとすることができる。その結果、小型化された貼合装置、ひいては製造システムを提供することができる。本願発明は、このような小型化が達成できる点でターレットを有する従来の製造システムと大きく異なっている。ターレットを有する製造システムは、例えば、特開平8-208083号公報に開示されている。 As shown in FIG. 2, the bonding device 60 is provided on the upper part of the first unwinding portion 1b and the second unwinding portion 1c. According to this structure, the first unwinding portion 1b and the second unwinding portion are provided. Since the portion 1c is structured to move horizontally in the direction of the core 1d, it is not necessary to secure a space for the unwinding portions to move upward. Therefore, the space between the conveyor roll 15 provided at the upper portion and the unwinding portion can be saved. As a result, it is possible to provide a downsized bonding apparatus, and thus a manufacturing system. The present invention is greatly different from a conventional manufacturing system having a turret in that such downsizing can be achieved. A manufacturing system having a turret is disclosed, for example, in Japanese Patent Laid-Open No. Hei 8-208083.
 なお、第1巻出部1bに備えられた偏光フィルムのロール残量が少なくなった場合、オペレーターにより第2巻出部1cの偏光フィルムと連結を行う。この場合、偏光フィルムの搬送速度を0m/min.とした後に、オペレーターが第1巻出部1b側の偏光フィルムを切断する。次に、第2巻出部1cから偏光フィルムを巻き出し、端部を切断した後に、例えば、片面粘着テープを用いて偏光フィルム同士を連結する。 In addition, when the roll remaining amount of the polarizing film provided in the 1st unwinding part 1b decreases, it connects with the polarizing film of the 2nd unwinding part 1c by an operator. In this case, the conveyance speed of the polarizing film is 0 m / min. Then, the operator cuts the polarizing film on the first unwinding portion 1b side. Next, after unwinding a polarizing film from the 2nd unwinding part 1c and cut | disconnecting an edge part, polarizing films are connected using a single-sided adhesive tape, for example.
 また、図1の第1巻取部2・第2巻取部2a・第1巻取部12・第2巻取部12aに関しても、図2の巻出部と同様に、剥離フィルムの巻芯の方向に対して水平に移動可能な構造とすることができる。巻取部についても当該構成とすることによって、コンベアーロール15と巻取部との空間を省スペースとすることができ、より小型化された貼合装置、ひいては製造システムを提供することが可能である。 Further, with respect to the first winding unit 2, the second winding unit 2a, the first winding unit 12 and the second winding unit 12a in FIG. 1, as in the unwinding unit in FIG. It can be set as the structure which can move horizontally with respect to this direction. By adopting such a configuration also for the winding unit, the space between the conveyor roll 15 and the winding unit can be saved, and a more compact bonding apparatus, and thus a manufacturing system can be provided. is there.
 ハーフカッター(切断部)3は、剥離フィルムに保護された偏光フィルム(偏光フィルム、粘着剤層および剥離フィルムから構成されるフィルム積層体)をハーフカットし、偏光フィルムおよび粘着剤層を切断する。ハーフカッター3としては、公知の部材を用いればよい。具体的には、刃物、レーザカッターなどを挙げることができる。ハーフカッター3によって偏光フィルムおよび粘着剤層が切断された後に、ナイフエッジ(除去部)4によって剥離フィルムが偏光フィルムから除去される。 Half cutter (cutting unit) 3 half-cuts a polarizing film (a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film) protected by a peeling film, and cuts the polarizing film and the pressure-sensitive adhesive layer. As the half cutter 3, a known member may be used. Specifically, a cutter, a laser cutter, etc. can be mentioned. After the polarizing film and the pressure-sensitive adhesive layer are cut by the half cutter 3, the release film is removed from the polarizing film by the knife edge (removal part) 4.
 偏光フィルムと剥離フィルムとの間には粘着剤層が塗布されており、剥離フィルムが除去された後、粘着剤層は偏光フィルム側に残存する。上記粘着剤層としては、特に限定されるものではなく、アクリル系、エポキシ系、ポリウレタン系などの粘着剤層を挙げることができる。粘着剤層の厚さは特に制限されないが、通常5~40μmである。 An adhesive layer is applied between the polarizing film and the release film. After the release film is removed, the adhesive layer remains on the polarizing film side. The pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic, epoxy, and polyurethane pressure-sensitive adhesive layers. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 5 to 40 μm.
 一方、第2フィルム搬送機構52は、第1フィルム搬送機構51と同様の構成であり、第1巻出部11、第2巻出部11a、第1巻取部12、第2巻取部12a、ハーフカッター13、ナイフエッジ14および欠点フィルム巻取ローラー17・17aを備えている。同一の部材名を付した部材については第1フィルム搬送機構51における部材と同一の作用を示す。 On the other hand, the 2nd film conveyance mechanism 52 is the structure similar to the 1st film conveyance mechanism 51, and is the 1st unwinding part 11, the 2nd unwinding part 11a, the 1st winding part 12, and the 2nd winding part 12a. , Half cutter 13, knife edge 14 and defect film winding rollers 17 and 17 a. About the member which attached | subjected the same member name, the effect | action same as the member in the 1st film conveyance mechanism 51 is shown.
 好ましい形態として製造システム100は、洗浄部71を備えている。洗浄部71はニップロール6・6aによって基板5の下面に偏光フィルムを貼合する前に、基板5を洗浄するものである。洗浄部71としては、洗浄液を噴射するノズルおよびブラシなどから構成される公知の洗浄部を用いればよい。洗浄部71によって貼合の直前に基板5を洗浄することによって、基板5の付着異物が少ない状態にて貼合を行うことができる。 As a preferred embodiment, the manufacturing system 100 includes a cleaning unit 71. The cleaning unit 71 cleans the substrate 5 before the polarizing film is bonded to the lower surface of the substrate 5 by the nip rolls 6 and 6a. As the cleaning unit 71, a known cleaning unit composed of a nozzle and a brush for injecting a cleaning liquid may be used. By cleaning the substrate 5 immediately before the bonding by the cleaning unit 71, the bonding can be performed in a state where there are few adhered foreign substances on the substrate 5.
 次に、図3を用いて、ナイフエッジ4について説明する。図3は、製造システム100におけるニップロール6・6aの周辺部分を示す断面図である。図3は、基板5が左方向から搬送され、左下方向から粘着剤層を有する(図示せず、以降同じ)偏光フィルム10aが搬送される状況を示している。偏光フィルム10には剥離フィルム10bが備えられており、ハーフカッター3によって偏光フィルム10aおよび粘着剤層が切断され、剥離フィルム10bは切断されていない(ハーフカット)。 Next, the knife edge 4 will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a peripheral portion of the nip rolls 6 and 6a in the manufacturing system 100. FIG. FIG. 3 shows a situation in which the substrate 5 is transported from the left direction and the polarizing film 10a having an adhesive layer (not shown, the same hereinafter) is transported from the lower left direction. The polarizing film 10 is provided with a release film 10b, and the polarizing film 10a and the pressure-sensitive adhesive layer are cut by the half cutter 3, and the release film 10b is not cut (half cut).
 剥離フィルム10b側には、ナイフエッジ4が設置されている。ナイフエッジ4は、剥離フィルム10bを剥離させるためのエッジ状部材であり、偏光フィルム10aと接着力が低い剥離フィルム10bがナイフエッジ4を伝って剥離されることとなる。 The knife edge 4 is installed on the peeling film 10b side. The knife edge 4 is an edge-shaped member for peeling the peeling film 10 b, and the polarizing film 10 a and the peeling film 10 b having a low adhesive force are peeled off along the knife edge 4.
 その後、剥離フィルム10bは、図1の第1巻取部2に巻き取られることとなる。なお、ナイフエッジに代えて、粘着ローラーを用いて剥離フィルムを巻き取る構成を用いることも可能である。その場合、巻取部と同様に、粘着ローラーを2箇所に備えることによって、剥離フィルムの巻取効率を高めることができる。 Thereafter, the release film 10b is wound around the first winding portion 2 of FIG. In addition, it can replace with a knife edge and can also use the structure which winds up a peeling film using an adhesion roller. In that case, the winding efficiency of a peeling film can be improved by providing an adhesive roller in two places similarly to a winding part.
 次に、貼合装置60について説明する。貼合装置60は基板5を搬送し、フィルム搬送機構50によって搬送された偏光フィルムを基板に貼合するものである。図示しないが、貼合装置60では基板5の上面に対して、クリーンエアーが供給されている。すなわち、ダウンフローの整流が行われている。これによって、基板5の搬送および貼合を安定した状態にて行うことが可能である。 Next, the bonding apparatus 60 will be described. The bonding apparatus 60 conveys the board | substrate 5, and bonds the polarizing film conveyed by the film conveyance mechanism 50 to a board | substrate. Although not shown, clean air is supplied to the upper surface of the substrate 5 in the bonding apparatus 60. That is, downflow rectification is performed. Thereby, it is possible to perform conveyance and bonding of the substrate 5 in a stable state.
 <貼合装置>
 貼合装置60はフィルム搬送機構50の上部に備えられている。これにより、製造システム100の省スペース化を図ることができる。図示しないが、貼合装置60にはコンベアーロールを備える基板搬送機構が設置されており、これにより基板5が搬送方向へ搬送される(図10にて後述する第1基板搬送装置61・第2基板搬送装置62が基板搬送機構に該当する)。
<Bonding device>
The bonding device 60 is provided on the upper part of the film transport mechanism 50. Thereby, space saving of the manufacturing system 100 can be achieved. Although not shown, a substrate transport mechanism including a conveyor roll is installed in the bonding device 60, whereby the substrate 5 is transported in the transport direction (the first substrate transport device 61 and the second substrate described later in FIG. 10). The substrate transfer device 62 corresponds to a substrate transfer mechanism).
 製造システム100では、左側から基板5が搬送され、その後、図中右側、つまり、第1フィルム搬送機構51の上部から第2フィルム搬送機構52の上部へと搬送される。フィルム搬送機構50と貼合装置60との間には、貼合部であるニップロール6・6a(第1貼合部)およびニップロール16・16a(第2貼合部)がそれぞれ備えられている。ニップロール6・6aおよび16・16aは、基板5の下面に剥離フィルム10bが除去された偏光フィルム10aを貼合わせる役割を果たす部材である。なお、基板5の両面には下面から偏光フィルム10aが貼合されるため、ニップロール6・6aにて片面に偏光フィルム10aが貼合された後に、基板5は反転機構65によって反転される。反転機構65については後述する。 In the manufacturing system 100, the substrate 5 is transported from the left side, and then transported from the right side in the drawing, that is, from the top of the first film transport mechanism 51 to the top of the second film transport mechanism 52. Between the film conveyance mechanism 50 and the bonding apparatus 60, the nip rolls 6 * 6a (1st bonding part) and the nip rolls 16 * 16a (2nd bonding part) which are bonding parts are each provided. The nip rolls 6, 6 a and 16, 16 a are members that play a role of bonding the polarizing film 10 a from which the release film 10 b has been removed to the lower surface of the substrate 5. In addition, since the polarizing film 10a is bonded to both surfaces of the substrate 5 from the lower surface, the substrate 5 is reversed by the reversing mechanism 65 after the polarizing film 10a is bonded to one surface by the nip rolls 6 and 6a. The reversing mechanism 65 will be described later.
 ニップロール6・6aへ搬送された偏光フィルム10aは、粘着剤層を介して基板5の下面に貼合される。ニップロール6・6aとしては、それぞれ圧着ロール、加圧ロールなどの公知の構成を採用することができる。また、ニップロール6・6aにおける貼合時の圧力および温度は適宜調整すればよい。ニップロール16・16aの構成も同様である。なお、図示しないが、製造システム100では、好ましい構成として、第1巻出部1からハーフカッターまでの間に欠点表示(マーク)検出部が備えられており、欠点を有する偏光フィルムが検出される構成となっている。 The polarizing film 10a conveyed to the nip rolls 6 and 6a is bonded to the lower surface of the substrate 5 through an adhesive layer. As the nip rolls 6 and 6a, known configurations such as a pressure roll and a pressure roll can be employed. Moreover, what is necessary is just to adjust the pressure and temperature at the time of bonding in the nip rolls 6 and 6a suitably. The configuration of the nip rolls 16 and 16a is the same. Although not shown, in the manufacturing system 100, as a preferable configuration, a defect display (mark) detection unit is provided between the first unwinding unit 1 and the half cutter, and a polarizing film having a defect is detected. It has a configuration.
 なお、上記欠点表示は、偏光フィルムの原反作成時に検出を行って欠点表示を付与する、または、欠点表示検出部よりも第1巻出部11または第2巻出部11a側に備えられた欠点表示付与部によって偏光フィルムに付される。欠点表示付与部は、カメラ、画像処理装置および欠点表示形成部によって構成されている。まず、上記カメラによって偏光フィルムの撮影がなされ、当該撮影情報を処理することによって、欠点の有無を検査することができる。上記欠点としては、具体的には、埃などの異物、フィッシュアイなどが挙げられる。欠点が検出された場合、欠点表示形成部によって偏光フィルムに欠点表示が形成される。欠点表示としては、インクなどのマークが用いられる。 In addition, the said defect display is provided at the time of the 1st unwinding part 11 or the 2nd unwinding part 11a rather than a defect display detection part by performing the detection at the time of original film production of a polarizing film, and providing a defect display. It attaches | subjects to a polarizing film by a fault display provision part. The defect display imparting unit includes a camera, an image processing device, and a defect display forming unit. First, a polarizing film is imaged by the camera, and the presence or absence of a defect can be inspected by processing the imaging information. Specific examples of the drawback include foreign matters such as dust and fish eyes. When a defect is detected, a defect display is formed on the polarizing film by the defect display forming unit. A mark such as ink is used as the defect display.
 さらに、図示しない貼合回避部は、上記マークをカメラにより判別して、貼合装置60に停止信号を送信して基板5の搬送を停止させる。その後、欠点が検出された偏光フィルムは、ニップロール6・6aによって貼合が行われず、欠点フィルム巻取ローラー(回収部)7・7aにて巻き取られる。これにより、基板5と、欠点を有する偏光フィルムとの貼合わせを回避することができる。当該一連の構成が備えられていれば、欠点を有する偏光フィルムと基板5との貼合わせを回避できるため、歩留まりを高めることができ好ましい。欠点検出部および貼合回避部としては、公知の検査センサを適宜用いることができる。 Further, a bonding avoiding unit (not shown) discriminates the mark with a camera and transmits a stop signal to the bonding apparatus 60 to stop the conveyance of the substrate 5. Thereafter, the polarizing film in which the defect is detected is not bonded by the nip rolls 6 and 6a and is wound by the defect film winding roller (collecting unit) 7 and 7a. Thereby, pasting with substrate 5 and a polarizing film which has a fault can be avoided. If such a series of structures is provided, it is possible to avoid the bonding between the polarizing film having a defect and the substrate 5, so that the yield can be increased, which is preferable. A publicly known inspection sensor can be used suitably as a fault detection part and a pasting avoidance part.
 図1に示すように、反転機構65によって基板5が反転状態となった後、基板5はニップロール16・16aに搬送される。そして、基板5の下面に偏光フィルムが貼合される。その結果、基板5の両面に偏光フィルムが貼合わされることとなり、基板5の両面に2枚の偏光フィルムが互いに異なる吸収軸にて貼合された状態となる。その後、必要に応じて、貼りずれが生じていないか、基板5の両面について検査がなされる。当該検査は、通常、カメラを備える検査部等によってなされる構成を採用できる。 As shown in FIG. 1, after the substrate 5 is reversed by the reversing mechanism 65, the substrate 5 is conveyed to the nip rolls 16 and 16a. Then, a polarizing film is bonded to the lower surface of the substrate 5. As a result, the polarizing film is bonded to both surfaces of the substrate 5, and the two polarizing films are bonded to both surfaces of the substrate 5 with different absorption axes. Thereafter, if necessary, the both sides of the substrate 5 are inspected for misalignment. The inspection can be usually performed by an inspection unit equipped with a camera.
 このように製造システム100では、基板5へ偏光フィルムを貼合わせる際、基板5の下面から貼合を行う構成となっており、基板5への整流環境を妨げることがない。このため、基板5の貼合面への異物混入をも防止することができ、より正確な貼合わせが可能となる。 Thus, in the manufacturing system 100, when the polarizing film is bonded to the substrate 5, the bonding is performed from the lower surface of the substrate 5, and the rectifying environment to the substrate 5 is not hindered. For this reason, foreign matter mixing into the bonding surface of the substrate 5 can be prevented, and more accurate bonding can be performed.
 図4(a)および図4(b)に本発明と同様の下貼り型の製造システムにおける気流の速度ベクトルを示す。図4(a)・(b)における領域Aは巻出部が設置される領域であり、領域Bは主に偏光フィルムが通過する領域、および、領域Cは巻取部等が設置される領域である。また、HEPAフィルター40からはクリーンエアーが供給される。なお、図4(a)では、クリーンエアーが通過可能なグレーチング41が設置されているため、グレーチング41を介して、気流が垂直方向に移動することが可能である。一方、図4(b)では、グレーチング41が設置されていないため、気流は床に接触した後、床に沿って移動することとなる。 FIG. 4 (a) and FIG. 4 (b) show the velocity vector of the airflow in the under-paste type manufacturing system similar to the present invention. 4A and 4B, the area A is an area where the unwinding part is installed, the area B is an area where the polarizing film mainly passes, and the area C is an area where the winding part is installed. It is. Further, clean air is supplied from the HEPA filter 40. In FIG. 4A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG.4 (b), since the grating 41 is not installed, after an airflow contacts a floor, it will move along a floor.
 図4(a)・(b)に示す製造システムは下貼り型であるため、図14(a)・(b)で示したように、偏光フィルムによってHEPAフィルター40からの気流が妨げられない。このため、気流ベクトルの方向はほとんど基板に向う方向となっており、クリーンルームにて好ましい整流環境が実現されているといえる。図4(a)では、グレーチング41が設置され、図4(b)では設置されていないが、両図とも同様の好ましい状態が示されている。なお、図4および図14では、基板搬送機構は水平に形成されているが、一連の構造としては設置されていない。このため、基板搬送機構間を気流が通過可能な構成となっている。基板は後述する反転機構によって保持された後、基板搬送機構間を移送される構成となっている。 Since the manufacturing system shown in FIGS. 4 (a) and 4 (b) is a bottom-attached type, the air current from the HEPA filter 40 is not hindered by the polarizing film as shown in FIGS. 14 (a) and 14 (b). For this reason, the direction of the airflow vector is almost directed toward the substrate, and it can be said that a preferable rectification environment is realized in the clean room. In FIG. 4A, the grating 41 is installed and not installed in FIG. 4B, but the same preferable state is shown in both figures. In FIGS. 4 and 14, the substrate transport mechanism is formed horizontally, but is not installed as a series of structures. For this reason, the airflow can pass between the substrate transport mechanisms. After the substrate is held by a reversing mechanism to be described later, the substrate is transferred between the substrate transport mechanisms.
 また、製造システム100では、まず、基板5を長辺間口(長辺が搬送方向と直交する)にて搬送し、その後、短辺間口(短辺が搬送方向と直交する)にて搬送する構成となっている。 Moreover, in the manufacturing system 100, the board | substrate 5 is first conveyed by a long side opening (a long side is orthogonal to a conveyance direction), and is conveyed by a short side opening (a short side is orthogonal to a conveyance direction) after that. It has become.
 〔フィルム連結部の構成〕
 さらに、本発明に係る貼合装置のさらなる変形例について説明する。図5は本発明に係る貼合装置60の変形例を示す断面図である。図5に係る第1フィルム搬送機構51における第1巻出部1b・第2巻出部1cは、図2と同様に偏光フィルムの巻芯1dの方向に対して水平に沿って移動可能な構造となっている。
[Structure of film connecting part]
Furthermore, the further modification of the bonding apparatus which concerns on this invention is demonstrated. FIG. 5 is a cross-sectional view showing a modification of the bonding apparatus 60 according to the present invention. The 1st unwinding part 1b and the 2nd unwinding part 1c in the 1st film conveyance mechanism 51 which concern on FIG. 5 are the structures which can move along a horizontal with respect to the direction of the core 1d of a polarizing film similarly to FIG. It has become.
 第1フィルム搬送機構51は、フィルム連結部(第1フィルム連結部)83およびフィルム連結部(第2フィルム連結部)93を備えており、これらにより偏光フィルム10・20の連結を行うことができる。 The 1st film conveyance mechanism 51 is provided with the film connection part (1st film connection part) 83 and the film connection part (2nd film connection part) 93, and can connect the polarizing films 10 and 20 by these. .
 図6は、フィルム連結部83および切断機87を示す斜視図である。図6に示すように、フィルム連結部83は、吸着部84・84aおよび切断貼合部85を備えている。 FIG. 6 is a perspective view showing the film connecting portion 83 and the cutting machine 87. As shown in FIG. 6, the film connecting portion 83 includes suction portions 84 and 84 a and a cutting and bonding portion 85.
 吸着部84・84aは、偏光フィルムを吸着して固定するための部材である。吸着部84・84aは、平板形状を有しており、その表面に複数の吸着機構89を備えている。吸着機構89は偏光フィルムを吸着することができれば特に限定されるものではなく、ポンプによって空気を吸引して偏光フィルムを吸着する構成を採用することができる。 The adsorption portions 84 and 84a are members for adsorbing and fixing the polarizing film. The suction portions 84 and 84a have a flat plate shape and include a plurality of suction mechanisms 89 on the surface thereof. The adsorption mechanism 89 is not particularly limited as long as the polarizing film can be adsorbed, and a configuration in which the polarizing film is adsorbed by sucking air with a pump can be adopted.
 切断貼合部85は回転可能であり、複数面を有する。具体的には、切断貼合部85は多角形形状を有している。また、回転可能に配置されている。さらに、好ましい形態として、偏光フィルム10に対して垂直方向に移動可能となっている。偏光フィルム10に対して垂直方向に移動可能であることによって、切断貼合部85が回転する際、切断貼合部85は偏光フィルム10に対して垂直方向であって、偏光フィルム10から遠ざかる方向に移動でき、その後、回転することができる。その後、切断貼合部85は偏光フィルム10に対して垂直方向であって、偏光フィルム10に近接する方向に移動して元の位置に戻ることができる。これにより、切断貼合部85の角部(貼合面85bと貼合面85cとの間に隣接する狭面を含む部分)が偏光フィルム10に接触することを確実に回避することが可能であり、非常に好ましい。 The cutting and bonding part 85 is rotatable and has a plurality of surfaces. Specifically, the cut bonding part 85 has a polygonal shape. Moreover, it arrange | positions so that rotation is possible. Furthermore, as a preferable form, it is movable in the vertical direction with respect to the polarizing film 10. By being movable in the vertical direction with respect to the polarizing film 10, when the cutting and bonding unit 85 rotates, the cutting and bonding unit 85 is in a direction perpendicular to the polarizing film 10 and away from the polarizing film 10. Can then be moved and then rotated. Thereafter, the cutting and bonding part 85 is in a direction perpendicular to the polarizing film 10 and can be moved in a direction close to the polarizing film 10 to return to the original position. Thereby, it is possible to avoid reliably that the corner | angular part (part containing the narrow surface adjacent between the bonding surface 85b and the bonding surface 85c) of the cutting bonding part 85 contacts the polarizing film 10. FIG. Yes, very preferable.
 なお、切断貼合部85は多角形形状であり、図7にも示すように、その3面に切断支持面85a、貼合面85b・85cを備えているが、切断支持面および/または貼合面をさらに備えていてもよい。例えば、切断支持面を1面に、貼合面を3面または4面に備えている構成および切断支持面を2面に、貼合面を3面または4面に備えている構成を挙げることができる。なお、図6の切断貼合部85のように、貼合面間および切断支持面・貼合面間が面取りされており、角部が形成されていれば、切断貼合部85と偏光フィルムとの接触を回避できる観点から好ましい。切断貼合部85の大きさは、偏光フィルム10の幅によって適宜決定すればよく、特に限定されるものではないが、例えば、200mm以上、2000mm以下の長さ、10mm以上、300mm以下の幅とすることができる。 In addition, although the cutting | lamination bonding part 85 is a polygonal shape and is also provided with the cutting | disconnection support surface 85a and the bonding surfaces 85b * 85c in 3 surfaces as shown also in FIG. A mating surface may be further provided. For example, a configuration in which the cutting support surface is provided on one surface, a bonding surface is provided on three or four surfaces, and a cutting support surface is provided on two surfaces, and a configuration in which a bonding surface is provided on three or four surfaces are given. Can do. In addition, like the cut bonding part 85 of FIG. 6, between the bonding surfaces and between the cutting support surface and the bonding surface are chamfered, and the corner part is formed, the cutting bonding part 85 and the polarizing film. It is preferable from the viewpoint of avoiding contact with. The size of the cut and bonded portion 85 may be appropriately determined depending on the width of the polarizing film 10 and is not particularly limited. For example, the length is 200 mm or more and 2000 mm or less, and the width is 10 mm or more and 300 mm or less. can do.
 図7は切断貼合部85を示す斜視図である。図7は、図6の切断貼合部85を時計回りに1/3周回転させた状態を示している。図7に示すように、切断貼合部85は、偏光フィルム10の幅方向に沿って偏光フィルム10を支持する切断支持面85aを備えている。また、切断された偏光フィルム10の切断線を覆うように偏光フィルム10・20を連結する連結材を吸着する吸着機構89を備える貼合面85b・85cを有している。貼合面は2以上備えられた構成とすることもできる。 FIG. 7 is a perspective view showing the cutting and bonding part 85. FIG. 7 shows a state in which the cutting and bonding portion 85 of FIG. 6 is rotated by 1/3 turn clockwise. As shown in FIG. 7, the cutting and bonding unit 85 includes a cutting support surface 85 a that supports the polarizing film 10 along the width direction of the polarizing film 10. Moreover, it has the bonding surfaces 85b and 85c provided with the adsorption | suction mechanism 89 which adsorb | sucks the connection material which connects the polarizing films 10 and 20 so that the cutting line of the cut | disconnected polarizing film 10 may be covered. Two or more bonding surfaces may be provided.
 切断支持面85aには溝状の開口86が形成されており、図6に示す切断貼合部85が備える切断機87の刃の部分が通過できる構造となっている。開口86が形成されていることによって、切断機87の通過を、偏光フィルム10の幅方向に沿って確実に行うことができ、偏光フィルム10・20の連結をより正確に行うことができる。 A groove-shaped opening 86 is formed in the cutting support surface 85a, and the blade portion of the cutting machine 87 provided in the cutting bonding portion 85 shown in FIG. By forming the opening 86, the cutting machine 87 can be reliably passed along the width direction of the polarizing film 10, and the polarizing films 10 and 20 can be more accurately connected.
 切断機87は公知のカッターを採用することができ、偏光フィルム10を容易に切断できることから、丸刃状であることが好ましい。また、切断機87は偏光フィルム10の幅方向に駆動可能な台部88によって支持されている。 As the cutting machine 87, a known cutter can be adopted, and the polarizing film 10 can be easily cut. Further, the cutting machine 87 is supported by a base portion 88 that can be driven in the width direction of the polarizing film 10.
 貼合面85b・85cは互いに同様の構成であり、吸着部84・84aと同様に複数の吸着機構89を備えている。また、貼合面85b・85cには片面粘着テープ(連結材)85dが配置されており、片面粘着テープ85dの非粘着面が吸着機構89によって保持され、片面粘着テープ85dの粘着面が貼合面85b・85cと反対面となるように配置されている。 The bonding surfaces 85b and 85c have the same configuration as each other, and include a plurality of suction mechanisms 89 in the same manner as the suction portions 84 and 84a. Moreover, the single-sided adhesive tape (connection material) 85d is arrange | positioned at the bonding surfaces 85b and 85c, the non-adhesive surface of the single-sided adhesive tape 85d is hold | maintained by the adsorption mechanism 89, and the adhesive surface of the single-sided adhesive tape 85d is bonded. It arrange | positions so that it may become a surface opposite surface 85b * 85c.
 上記片面粘着テープ85dは偏光フィルム同士を貼合できればよく、公知の片面粘着テープを用いることができる。片面粘着テープ85dのフィルム材料としては例えば、ポリエチレンテレフタラートフィルム(PETフィルム)、セルロース、和紙、アルミ、不織布、ポリテトラフルオロエチレン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリカーボネート、ポリウレタン、ABS樹脂、ポリエステル、ポリスチレン、ポリエチレン、ポリプロピレン、ポリアセタール樹脂、ポリ乳酸、ポリイミド、ポリアミドなどを挙げることができる。また、粘着剤層に用いられる粘着剤としては、アクリル系、エポキシ系、ポリウレタン系、合成ゴム系、EVA系、シリコーン系、塩化ビニル系、クロロプレンゴム系、シアノアクリレート系、イソシアネート系、ポリビニルアルコール系、メラミン樹脂系などの粘着剤を挙げることができる。 The above single-sided adhesive tape 85d only needs to be able to bond polarizing films together, and a known single-sided adhesive tape can be used. Examples of the film material of the single-sided adhesive tape 85d include polyethylene terephthalate film (PET film), cellulose, Japanese paper, aluminum, non-woven fabric, polytetrafluoroethylene, polyvinyl chloride, polyvinylidene chloride, polycarbonate, polyurethane, ABS resin, polyester, Examples thereof include polystyrene, polyethylene, polypropylene, polyacetal resin, polylactic acid, polyimide, and polyamide. The pressure-sensitive adhesive used in the pressure-sensitive adhesive layer includes acrylic, epoxy, polyurethane, synthetic rubber, EVA, silicone, vinyl chloride, chloroprene rubber, cyanoacrylate, isocyanate, and polyvinyl alcohol. And pressure sensitive adhesives such as melamine resin.
 フィルム連結部83は、偏光フィルム10に対して対向するように配置される。このため、図5では、偏光フィルム10が垂直に配置されていることから、フィルム連結部83も垂直に配置されている。一方、偏光フィルム10が例えば斜め方向(または水平方向など)に配置されている場合、フィルム連結部83と偏光フィルム10とが対向するように、フィルム連結部83も斜め方向(または水平方向など)に配置される構造とすればよい。 The film connecting portion 83 is disposed so as to face the polarizing film 10. For this reason, in FIG. 5, since the polarizing film 10 is arrange | positioned perpendicularly, the film connection part 83 is also arrange | positioned perpendicularly. On the other hand, when the polarizing film 10 is disposed, for example, in an oblique direction (or horizontal direction), the film connecting portion 83 is also in an oblique direction (or horizontal direction) so that the film connecting portion 83 and the polarizing film 10 face each other. What is necessary is just to set it as the structure arrange | positioned.
 フィルム連結部93はフィルム連結部83と同様の構造である。図5に示すように、フィルム連結部83・93は、フィルム連結部83・93に備えられた吸着部の吸着機構同士が対向するように配置されている。また、フィルム連結部83・93は、偏光フィルム10および偏光フィルム20の通過位置を介在させて配置されている。なお、フィルム連結部83・93を備える製造システム100は、本実施の形態における好ましい形態であり、フィルム連結部83・93を備えない形態とすることも可能である。 The film connecting portion 93 has the same structure as the film connecting portion 83. As shown in FIG. 5, the film connecting portions 83 and 93 are arranged so that the suction mechanisms of the suction portions provided in the film connecting portions 83 and 93 face each other. Moreover, the film connection parts 83 and 93 are arranged with the passage positions of the polarizing film 10 and the polarizing film 20 interposed therebetween. In addition, the manufacturing system 100 provided with the film connection part 83 * 93 is a preferable form in this Embodiment, and it is also possible to set it as the form which is not provided with the film connection part 83 * 93.
 〔フィルム連結部の動作〕
 以下に、本実施の形態に係る製造システムの動作について説明する。なお、当該動作に係る説明は、光学表示装置の製造方法の説明を兼ねている。
[Operation of film connecting part]
Hereinafter, the operation of the manufacturing system according to the present embodiment will be described. Note that the description related to the operation also serves as a description of a method of manufacturing the optical display device.
 まず、図1に示すように、第1巻出部1から偏光フィルム10を巻き出す(巻出工程)。その後、図3に示すように、図示しないハーフカッターによって偏光フィルム10aのみをハーフカットし、剥離フィルム10bをナイフエッジ4によって剥離する(剥離工程)。さらに、剥離フィルム10bが剥離された偏光フィルム10aと基板5とをニップロール6・6aによって圧着することによって貼合する(貼合工程)。なお、剥離された剥離フィルム10bは図示しない巻取部によって巻き取られ、回収される。上記一連の工程によって、基板5と偏光フィルム10aとが貼合されて光学表示装置を得ることができる。 First, as shown in FIG. 1, the polarizing film 10 is unwound from the 1st unwinding part 1 (unwinding process). Then, as shown in FIG. 3, only the polarizing film 10a is half-cut with a half cutter (not shown), and the release film 10b is peeled off with the knife edge 4 (peeling step). Further, the polarizing film 10a from which the release film 10b has been peeled and the substrate 5 are bonded together by pressure bonding with the nip rolls 6 and 6a (bonding step). The peeled release film 10b is wound up and collected by a winder (not shown). Through the series of steps, the substrate 5 and the polarizing film 10a are bonded to obtain an optical display device.
 上記一連の工程において偏光フィルム10を巻き出すにつれ、第1巻出部1に保持された偏光フィルム10のロールの残量は減少していくこととなる。以下に偏光フィルム同士を連結させる連結工程について説明する。 As the polarizing film 10 is unwound in the series of steps described above, the remaining amount of the roll of the polarizing film 10 held by the first unwinding unit 1 decreases. Below, the connection process which connects polarizing films is demonstrated.
 連結工程では、上記第1巻出部1(11、1b)の偏光フィルム10および第2巻出部1a(11a、1c)の偏光フィルム20を切断する。そして、第1巻出部1(11、1b)の偏光フィルム10および第2巻出部1a(11a、1c)の偏光フィルム20のうち、第1巻出部1(11、1b)のライン側の偏光フィルム10または第2巻出部1a(11a、1c)のライン側の偏光フィルム20と、第2巻出部1a(11a、1c)の巻出部側の偏光フィルム20または第1巻出部1(11、1b)の巻出部側の偏光フィルム10とを連結する。上記「ライン側」とは、換言すると、偏光フィルムが巻き出される方向を示す。上記連結工程としては、(1)オペレーターによる手法と、(2)フィルム連結部83・93を用いる手法とを挙げることができる。 In the connecting step, the polarizing film 10 of the first unwinding part 1 (11, 1b) and the polarizing film 20 of the second unwinding part 1a (11a, 1c) are cut. And among the polarizing film 10 of the 1st unwinding part 1 (11, 1b) and the polarizing film 20 of the 2nd unwinding part 1a (11a, 1c), the line side of the 1st unwinding part 1 (11, 1b) The polarizing film 10 or the second unwinding part 1a (11a, 1c) of the line side polarizing film 20 and the unwinding part of the second unwinding part 1a (11a, 1c) of the polarizing film 20 or first unwinding The polarizing film 10 on the unwinding part side of the part 1 (11, 1b) is connected. In other words, the “line side” indicates a direction in which the polarizing film is unwound. Examples of the connecting step include (1) a technique by an operator and (2) a technique using the film connecting portions 83 and 93.
 まず、(1)のオペレーターによる手法について具体的に説明する。オペレーターにより偏光フィルム同士を連結させる場合、偏光フィルム10の搬送速度を0m/min.とした後(偏光フィルム10を停止させた後)に、オペレーターが偏光フィルム10を切断する。次に、第1巻出部11から偏光フィルム20を巻き出し、端部を切断した後に、例えば、上述した片面粘着テープ85dを用いて連結する手法が挙げられる。 First, the method by the operator of (1) will be explained specifically. When the polarizing films are connected by an operator, the conveyance speed of the polarizing film 10 is set to 0 m / min. After the above (after stopping the polarizing film 10), the operator cuts the polarizing film 10. Next, after unwinding the polarizing film 20 from the 1st unwinding part 11 and cut | disconnecting an edge part, the method connected using the single-sided adhesive tape 85d mentioned above is mentioned, for example.
 このように、本発明に係る製造システムでは、第1巻出部1・11の2つの巻出部が備えられており、偏光フィルムのロールを新たなロールに交換せずとも、偏光フィルム10・20を用いて即座にフィルムを連結させることができ、速やかに偏光フィルム20を巻き出すことができる。したがって、従来の巻出部が1箇所にのみ設置された製造システムとは異なり、運転中に空いている方の巻出部において、原反ロールの交換作業が行える為、交換作業に必要な時間を削減することができる。その結果、光学表示装置の製造時間を短縮することが可能である。製造システムでは、偏光フィルム10・20の連結を終えた後、偏光フィルム20を巻き出す間に、第1巻出部1の偏光フィルム10のロールを新たなロールに交換する。偏光フィルム20の残量が減少した場合、同様に偏光フィルム20および偏光フィルム10を連結することももちろん可能である。 Thus, in the manufacturing system according to the present invention, the two unwinding portions of the first unwinding portions 1 and 11 are provided, so that the polarizing film 10. 20, the film can be immediately connected, and the polarizing film 20 can be unwound quickly. Therefore, unlike the conventional manufacturing system in which the unwinding unit is installed only at one place, the original roll roll can be replaced at the unwinding unit that is vacant during operation. Can be reduced. As a result, it is possible to shorten the manufacturing time of the optical display device. In the manufacturing system, after the connection of the polarizing films 10 and 20 is finished, the roll of the polarizing film 10 of the first unwinding unit 1 is replaced with a new roll while the polarizing film 20 is unwound. When the remaining amount of the polarizing film 20 decreases, it is of course possible to connect the polarizing film 20 and the polarizing film 10 in the same manner.
 次に、フィルム連結部83・93を用いる場合について図8を用いて具体的に説明する。図8は、フィルム連結部を備えた製造システムによる連結工程を示す工程図である。偏光フィルム10の残量が減少すると、偏光フィルム10の図8(a)に示すように、偏光フィルム10の搬送速度を0m/min.とした後に、吸着部84・84aおよび切断貼合部85(フィルム連結部83)を偏光フィルム10に対して垂直方向に移動させる。次に、吸着部84・84aの吸着機構89によって、偏光フィルム10を吸着して固定する(吸着工程)。 Next, the case where the film connecting portions 83 and 93 are used will be specifically described with reference to FIG. FIG. 8 is a process diagram illustrating a connection process by a manufacturing system including a film connection part. When the remaining amount of the polarizing film 10 decreases, as shown in FIG. 8A of the polarizing film 10, the conveyance speed of the polarizing film 10 is set to 0 m / min. Then, the suction portions 84 and 84a and the cutting and bonding portion 85 (film connecting portion 83) are moved in the vertical direction with respect to the polarizing film 10. Next, the polarizing film 10 is sucked and fixed by the suction mechanism 89 of the suction portions 84 and 84a (suction process).
 この際、切断貼合部85では、切断支持面85aが偏光フィルム10に接触している。その後、図8(b)に示すように、図示しない切断機を開口86に沿って移動させて偏光フィルム10を切断する(切断工程)。切断後、切断貼合部85を偏光フィルム10に対して垂直方向であって、偏光フィルム10から遠ざかる方向(図中右側)に移動し、反時計回りに1/3周回転させ、偏光フィルム10に対して垂直方向であって、偏光フィルム10から接近する方向(図中左側)に移動させる。これにより、図8(c)に示すように、片面粘着テープ85d(図示せず)と対向する偏光フィルム10の切断線を覆うように、貼合面85bの片面粘着テープ85dを貼り合わせる(貼合工程)。上記切断線とは、切断工程によって、偏光フィルム10に生じた切断面のうち、貼合面85bと対向する辺を示す。貼合工程では、片面粘着テープ85dは上記切断線を覆うように配置される、すなわち、偏光フィルム10が上記切断線を越えて、偏光フィルム10が存在しない部分についても配置される。 At this time, the cutting support surface 85a is in contact with the polarizing film 10 in the cutting and bonding unit 85. Thereafter, as shown in FIG. 8B, the polarizing film 10 is cut by moving a cutting machine (not shown) along the opening 86 (cutting step). After cutting, the cutting and bonding part 85 is moved in the direction perpendicular to the polarizing film 10 and away from the polarizing film 10 (right side in the figure), rotated counterclockwise by 1/3 turn, and the polarizing film 10 In the direction perpendicular to the polarizing film 10 (the left side in the figure). Thereby, as shown in FIG.8 (c), the single-sided adhesive tape 85d of the bonding surface 85b is bonded together so that the cutting line of the polarizing film 10 which opposes the single-sided adhesive tape 85d (not shown) may be covered. Joint process). The said cutting line shows the edge | side which opposes the bonding surface 85b among the cut surfaces produced in the polarizing film 10 by the cutting process. In the bonding step, the single-sided adhesive tape 85d is disposed so as to cover the cutting line, that is, the polarizing film 10 is also disposed on a portion where the polarizing film 10 does not exist beyond the cutting line.
 さらに、偏光フィルム20に対しても、図8(a)~(c)と同様にして、偏光フィルム20の切断支持面95aに片面粘着テープ95dを粘着する。上述した部材と同様の部材には同一の名称を付し、その説明を省略する。 Furthermore, the single-sided adhesive tape 95d is adhered to the polarizing film 20 in the same manner as in FIGS. 8A to 8C. The same members as those described above are given the same names, and the description thereof is omitted.
 まず、偏光フィルム20を第1巻出部11から巻き出して、図8(a)と同様に、偏光フィルム20の端部を切断した後、図示しない切断機を、切断支持面95aに形成された開口96に沿って移動させて偏光フィルム20を切断する。切断後、切断貼合部95を偏光フィルム20に対して垂直方向であって、偏光フィルム20から遠ざかる方向(図中左側)に移動し、時計回りに1/3周回転させ、偏光フィルム20に対して垂直方向であって、偏光フィルム20から近接する方向(図中右側)に移動させる。これにより、図8(e)に示すように、貼合面95bの片面粘着テープ95dと対向する偏光フィルム20の切断線を覆うように、片面粘着テープ95dを貼り付けることができる。 First, after the polarizing film 20 is unwound from the first unwinding portion 11 and the end portion of the polarizing film 20 is cut as in FIG. 8A, a cutting machine (not shown) is formed on the cutting support surface 95a. The polarizing film 20 is cut by moving along the opening 96. After cutting, the cut and bonded portion 95 is moved in a direction perpendicular to the polarizing film 20 and away from the polarizing film 20 (left side in the figure), and rotated clockwise by 1/3 turn to the polarizing film 20 On the other hand, it is moved in a direction perpendicular to the polarizing film 20 (right side in the figure). Thereby, as shown in FIG.8 (e), the single-sided adhesive tape 95d can be affixed so that the cutting line of the polarizing film 20 facing the single-sided adhesive tape 95d of the bonding surface 95b may be covered.
 次に、図8(f)に示すように、吸着部84・84aおよび切断貼合部85(フィルム連結装置3)を吸着部94・94aおよび切断貼合部95(フィルム連結部93)に近接させ、偏光フィルム10および偏光フィルム20の切断面同士を合わせる(近接工程)。これにより、偏光フィルム10・20の切断線を覆う片面粘着テープ85d・95dのうち、切断線を越えた部分(偏光フィルム10・20に貼合していない部分)が、他方の偏光フィルム20・10に貼合することによって、偏光フィルム10・20が連結される。図8(f)では、フィルム連結部83をフィルム連結部93へ近接させたが、フィルム連結部93をフィルム連結部83へ近接させてもよく、また、フィルム連結部83・93を互いに近接させてもよい。 Next, as shown in FIG. 8 (f), the adsorbing portions 84 and 84a and the cutting and bonding portion 85 (film connecting device 3) are brought close to the adsorbing portions 94 and 94a and the cutting and bonding portion 95 (film connecting portion 93). The cut surfaces of the polarizing film 10 and the polarizing film 20 are matched with each other (proximity step). Thereby, among the single-sided adhesive tapes 85d and 95d that cover the cutting line of the polarizing film 10/20, the part beyond the cutting line (the part not bonded to the polarizing film 10/20) is the other polarizing film 20/20. The polarizing films 10 and 20 are connected to each other. In FIG. 8 (f), the film connecting part 83 is brought close to the film connecting part 93, but the film connecting part 93 may be made close to the film connecting part 83, and the film connecting parts 83 and 93 are made close to each other. May be.
 偏光フィルム10・20を連結させた後には、準備工程として、図8(g)に示すように、切断貼合部85・95をそれぞれ偏光フィルム10・20に対して垂直方向であって、遠ざかる方向へ移動させ、切断貼合部85を時計回りに1/3周回転させ、切断貼合部95を反時計回りに1/3周回転させる。そして、切断貼合部85・95をそれぞれ偏光フィルム10・20に対して垂直方向であって、近接する方向へ移動させる。 After connecting the polarizing films 10 and 20, as a preparatory step, as shown in FIG. 8 (g), the cutting and bonding parts 85 and 95 are perpendicular to the polarizing films 10 and 20, respectively, and are moved away. The cutting and bonding part 85 is rotated clockwise by 1/3 turn, and the cutting and bonding part 95 is rotated counterclockwise by 1/3 turn. Then, the cutting and bonding parts 85 and 95 are moved in the direction perpendicular to the polarizing films 10 and 20 and in the adjacent directions.
 最後に、吸着部84・84aおよび切断貼合部85(フィルム連結部83)を図8(a)の位置に戻し、一連の工程が終了する。なお、貼合面85c・95cには、片面粘着テープ85d・95dが予め吸着された状態にて備えられているため、第2巻出部1cに新たな偏光フィルム10のロールが設置された後に、偏光フィルム20に対して図8(a)~(c)の工程、偏光フィルム10に対して図8(d)~(e)の工程を行い、上述したように図8(f)~(h)の工程を経て、偏光フィルム20・10を連結させることができる。また、使用した片面粘着テープ85d・95dを補充することによって、連続して偏光フィルムを連結することももちろん可能である。 Finally, the adsorbing portions 84 and 84a and the cutting and bonding portion 85 (film connecting portion 83) are returned to the positions shown in FIG. 8A, and the series of steps is completed. In addition, since the single-sided adhesive tapes 85d and 95d are preliminarily adsorbed on the bonding surfaces 85c and 95c, after a new roll of the polarizing film 10 is installed on the second unwinding portion 1c. 8 (a) to (c) are performed on the polarizing film 20, and the steps of FIGS. 8 (d) to (e) are performed on the polarizing film 10. As described above, FIGS. The polarizing films 20 and 10 can be connected through the step h). Of course, it is also possible to continuously connect the polarizing films by supplementing the used single-sided adhesive tapes 85d and 95d.
 上述のように、フィルム連結部83・93を用いた連結工程の場合、オペレーターによる連結工程と比較して、偏光フィルムの吸着、切断、貼合をより短時間に、また、より正確に行うことが可能となるため好ましい。 As described above, in the case of the connecting step using the film connecting portions 83 and 93, the polarizing film is adsorbed, cut, and bonded in a shorter time and more accurately than the connecting step by the operator. Is preferable.
 具体的には、当該製造システムにおいて、オペレーターによる連結工程の場合、10分程度必要であったが、フィルム連結部83・93を用いた場合、1分以下とすることができた。 Specifically, in the manufacturing system, about 10 minutes were required in the case of the connecting step by the operator, but when the film connecting portions 83 and 93 were used, the time could be reduced to 1 minute or less.
 なお、当該製造システムにおいて、第1巻出部1のみを使用し、第1巻出部11を使用せず、さらにフィルム連結部83・93も使用しない場合、オペレーターは第1巻出部1に新たな偏光フィルムを交換した後に偏光フィルム10を交換する必要があることから、連結工程には30分程度必要である。このため、本実施の形態に係る製造システムが有益であることは明らかである。 In the manufacturing system, when only the first unwinding portion 1 is used, the first unwinding portion 11 is not used, and further, the film connecting portions 83 and 93 are not used, the operator can move to the first unwinding portion 1. Since it is necessary to replace the polarizing film 10 after replacing a new polarizing film, the connecting step requires about 30 minutes. For this reason, it is clear that the manufacturing system according to the present embodiment is useful.
 <反転機構>
 反転機構65は、短辺または長辺が搬送方向に沿った基板5を、長辺または短辺が搬送方向に沿った状態であり、反転された状態に配置を変更するものである。図9(a)~(d)は反転機構によって基板5を反転させる過程を示す斜視図である。図9(a)は、第1基板搬送機構によって搬送された基板5を吸着する状態を示し、図9(b)および(c)は基板5を移動させる過程を示し、図9(d)は基板5を第2基板反転機構によって反転させた状態を示している。なお、図示の便宜上、図9では基板搬送機構を省略しているが、図10を用いて後述する。
<Reversing mechanism>
The reversing mechanism 65 changes the arrangement of the substrate 5 whose short side or long side is along the transport direction to a state where the long side or short side is along the transport direction and reversed. FIGS. 9A to 9D are perspective views showing the process of reversing the substrate 5 by the reversing mechanism. 9A shows a state in which the substrate 5 transported by the first substrate transport mechanism is adsorbed, FIGS. 9B and 9C show a process of moving the substrate 5, and FIG. A state in which the substrate 5 is reversed by the second substrate reversing mechanism is shown. For convenience of illustration, the substrate transport mechanism is omitted in FIG. 9, but will be described later with reference to FIG.
 図9(a)に示すように、反転機構65は吸着部66、基板反転部67および基板回転部68を備えている。吸着部66は、基板5の表面に吸着する部材である。これにより基板5の表面は吸着部66に保持される。吸着部66としては、公知の吸着部を用いることができ、例えば、空気吸引方式の吸着部を用いることができる。 As shown in FIG. 9A, the reversing mechanism 65 includes a suction unit 66, a substrate reversing unit 67, and a substrate rotating unit 68. The adsorption unit 66 is a member that adsorbs to the surface of the substrate 5. As a result, the surface of the substrate 5 is held by the suction portion 66. As the adsorption unit 66, a known adsorption unit can be used, and for example, an air suction type adsorption unit can be used.
 基板反転部67は、吸着部66を備えており、基板5の長辺または短辺を下辺として、基板5を反転させるものである。図9では基板反転部67は回転軸構造となっており、基板反転部67が回転することにより吸着部66を回転させる構成となっている。しかしながら、基板反転部67は当該構造に限定されず、駆動部によって吸着部66を回転させる構造であってもよい。 The substrate reversing unit 67 includes a suction unit 66 and reverses the substrate 5 with the long side or the short side of the substrate 5 as the lower side. In FIG. 9, the substrate reversing unit 67 has a rotating shaft structure, and the suction unit 66 is rotated by rotating the substrate reversing unit 67. However, the substrate reversing unit 67 is not limited to this structure, and may be a structure in which the suction unit 66 is rotated by the driving unit.
 基板反転部67は、第1回転および第2回転に分けて基板5を反転させる。基板5の反転は、第1回転および第2回転に分けてなされる。反転とは基板5を反対面に回転させることを示し、換言すると基板5の表面が裏面となるよう配置することである。 The substrate reversing unit 67 reverses the substrate 5 in the first rotation and the second rotation. The inversion of the substrate 5 is divided into a first rotation and a second rotation. Inversion means that the substrate 5 is rotated to the opposite surface, in other words, that the surface of the substrate 5 is arranged to be the back surface.
 図9(a)では、基板5の短辺が搬送方向に沿っている場合を示しており、図9(b)のように、第1回転では基板5の長辺を下辺として基板5が回転される(図9(a)→図9(b))。上記第1回転では基板5は第1角度まで回転される。第1角度とは、180°未満のX°である。第1回転にて回転された基板5を基板回転部68によって回転させる際のバランス、および、反転機構65の設計を簡便とする観点から、X°は、80°以上、110°以下であることが好ましく、85°以上、95°以下であることが好ましく、90°であることが最も好ましい。 FIG. 9A shows a case where the short side of the substrate 5 is along the transport direction. As shown in FIG. 9B, in the first rotation, the substrate 5 rotates with the long side of the substrate 5 as the lower side. (FIG. 9 (a) → FIG. 9 (b)). In the first rotation, the substrate 5 is rotated to the first angle. The first angle is X ° less than 180 °. From the viewpoint of simplifying the balance when the substrate 5 rotated by the first rotation is rotated by the substrate rotating unit 68 and the design of the reversing mechanism 65, X ° is 80 ° or more and 110 ° or less. Is preferably 85 ° or more and 95 ° or less, and most preferably 90 °.
 基板回転部68は、基板反転部67に備えられており、第1回転によって回転された基板5を、図示しない第1基板搬送機構における基板5、すなわち図9(a)に示す基板5の表面に対して平行な方向に90°回転させるものである。90°の回転方向は、搬送方向に直交する2つの長辺または短辺のうち、より搬送方向側に位置する長辺または短辺を内側としてなされる。 The substrate rotating unit 68 is provided in the substrate reversing unit 67, and the substrate 5 rotated by the first rotation is transferred to the substrate 5 in the first substrate transport mechanism (not shown), that is, the surface of the substrate 5 shown in FIG. Is rotated by 90 ° in a direction parallel to the axis. The rotation direction of 90 ° is made such that the long side or the short side located on the transport direction side is the inner side out of the two long sides or short sides orthogonal to the transport direction.
 図9(c)に示す基板反転部67は土台部分が回転する構造となっている。しかしながら、基板回転部68は、基板5を第1基板搬送機構における基板5の表面に対して平行な方向に90°回転させることができればよく、図示した構造に限定されるものではない。基板反転部67および/または基板回転部68として、制御部を有するロボットアームを用いた場合、精密な基板5の操作が可能であるため好ましい。ロボットアームとしては公知のロボットアームを用いることができ、基板反転部67および/または基板回転部68の動作が可能であれば構造は特に限定されない。 The substrate reversing part 67 shown in FIG. 9C has a structure in which the base part rotates. However, the substrate rotating unit 68 is not limited to the illustrated structure as long as it can rotate the substrate 5 by 90 ° in a direction parallel to the surface of the substrate 5 in the first substrate transport mechanism. When a robot arm having a control unit is used as the substrate reversing unit 67 and / or the substrate rotating unit 68, it is preferable because precise operation of the substrate 5 is possible. A known robot arm can be used as the robot arm, and the structure is not particularly limited as long as the substrate reversing unit 67 and / or the substrate rotating unit 68 can be operated.
 最後に図9(d)に示すように、基板反転部67による第2回転によって、第1回転によって回転された基板5を、基板5の長辺または短辺を下辺として、さらに回転させ反転させる。これによって、基板5は反転され、しかも短辺が搬送方向に沿った状態となる。 Finally, as shown in FIG. 9D, the substrate 5 rotated by the first rotation by the substrate reversing unit 67 is further rotated and inverted with the long side or the short side of the substrate 5 as the lower side. . As a result, the substrate 5 is inverted and the short side is in a state along the transport direction.
 図9(d)では基板5の長辺が下辺となっている。第1回転および第2回転において基板5の長辺および短辺のうち何れを下辺とするかは、短辺が搬送方向に沿った状態であれば長辺が下辺となり、長辺が搬送方向に沿った状態であれば短辺が下辺となる。何れの状態であっても基板5の反転は可能である。 In FIG. 9D, the long side of the substrate 5 is the lower side. Which of the long side and the short side of the substrate 5 is set as the lower side in the first rotation and the second rotation is determined so that the long side is the lower side and the long side is in the transport direction if the short side is in the transport direction. The short side is the lower side if it is in a line. The substrate 5 can be reversed in any state.
 図10は、図9における基板5の回転過程を示す平面図である。図10では、反転機構65に加えて第1基板搬送機構61および第2基板搬送機構62を図示している。第1基板搬送機構61および第2基板搬送機構62にはコンベアーロールが備えられている。第1基板搬送機構61と第2基板搬送機構62とは同一方向に向かって配置されている。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置60は、設置が非常に簡便であり、面積効率に優れる。 FIG. 10 is a plan view showing the rotation process of the substrate 5 in FIG. FIG. 10 illustrates the first substrate transport mechanism 61 and the second substrate transport mechanism 62 in addition to the reversing mechanism 65. The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are provided with conveyor rolls. The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are arranged in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus 60 according to the present invention is very simple to install and is excellent in area efficiency.
 図9にて説明したように、まず、吸着部66によって基板5の表面が保持され、矢印方向に基板反転部67が第1回転として90°回転される(図10(a)→図10(b))。 As described in FIG. 9, first, the surface of the substrate 5 is held by the suction portion 66, and the substrate reversing portion 67 is rotated 90 ° as the first rotation in the direction of the arrow (FIG. 10 (a) → FIG. 10 ( b)).
 その後、第1回転によって回転された基板5が第1基板搬送機構61における基板5、すなわち、図10(a)の基板5の表面に対して平行な方向に90°回転される(図10(b)の矢印方向への回転、図10(b)→図10(c))。 Thereafter, the substrate 5 rotated by the first rotation is rotated by 90 ° in a direction parallel to the surface of the substrate 5 in the first substrate transport mechanism 61, that is, the substrate 5 of FIG. b) rotation in the direction of the arrow, FIG. 10 (b) → FIG. 10 (c)).
 最後に、基板反転部67の第2回転により基板5が反転される((図10(c)→図10(d))。吸着部66と、第2基板搬送機構62の図示しないコンベアーロールとは接触しないように配置されている。吸着部66の吸着が解除されることにより基板5の保持が解かれた後、基板5は第2基板搬送機構62によって搬送される。そして、反転機構65は図10(a)の位置に戻り、順次搬送される他の基板5を同様の動作にて反転させる。 Finally, the substrate 5 is reversed by the second rotation of the substrate reversing section 67 ((FIG. 10 (c) → FIG. 10 (d)). The suction section 66 and the conveyor roll (not shown) of the second substrate transport mechanism 62 After the suction of the suction part 66 is released, the substrate 5 is released from being held, and then the substrate 5 is transported by the second substrate transport mechanism 62. Then, the reversing mechanism 65 is provided. Returns to the position shown in FIG. 10A, and the other substrates 5 that are sequentially conveyed are reversed by the same operation.
 このように反転機構65によれば、吸着部66による吸着、第1回転、第1基板搬送機構61から第2基板搬送機構62への90°回転、および、第2回転の4つの単純な動作によって基板5を反転させると共に、搬送方向に対する長辺および短辺を変更することができる。上記動作を行った後、基板5の両面に対して下面から偏光フィルムを貼合することができる。また、上記動作は単純な4動作であるため、タクトタイムが短い。したがって、整流環境を妨げることなく、タクトタイムの短い貼合をも実現することができる。 As described above, according to the reversing mechanism 65, four simple operations of suction by the suction unit 66, first rotation, 90 ° rotation from the first substrate transport mechanism 61 to the second substrate transport mechanism 62, and second rotation. By reversing the substrate 5, the long side and the short side with respect to the transport direction can be changed. After performing the said operation | movement, a polarizing film can be bonded with respect to both surfaces of the board | substrate 5 from a lower surface. Moreover, since the above operations are simple four operations, the tact time is short. Therefore, it is possible to realize bonding with a short tact time without disturbing the rectification environment.
 上述した第1回転および第2回転の間では、一旦基板5を停止させているが、第1回転および第2回転中に一旦基板を停止させる場合、すなわち、段階的に回転を行う場合もそれぞれ第1回転および第2回転に含まれる。換言すると、基板回転部68による基板5の回転の前後における、基板反転部67による基板反転部67の回転をそれぞれ第1回転および第2回転ということができる。 The substrate 5 is temporarily stopped between the first rotation and the second rotation described above. However, when the substrate is temporarily stopped during the first rotation and the second rotation, that is, when the rotation is performed stepwise, respectively. It is included in the first rotation and the second rotation. In other words, the rotation of the substrate reversing unit 67 by the substrate reversing unit 67 before and after the rotation of the substrate 5 by the substrate rotating unit 68 can be referred to as a first rotation and a second rotation, respectively.
 図10では、第1基板搬送機構61および第2基板搬送機構62はその搬送方向が一直線上に配置されず、隣接した構造となっている。これは、図10(c)のように基板回転部68によって基板5を90°回転させるため、図10(d)のように最終的な基板5の搬送方向が第1基板搬送機構61と第2基板搬送機構62とではずれが生じるためである。 In FIG. 10, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are not arranged in a straight line but have adjacent structures. This is because the substrate 5 is rotated by 90 ° by the substrate rotating unit 68 as shown in FIG. 10C, so that the final transfer direction of the substrate 5 is the same as that of the first substrate transfer mechanism 61 and the first as shown in FIG. This is because there is a deviation from the two-substrate transport mechanism 62.
 図11は、反転機構65を2つ用いた貼合装置60の変形例を示す平面図である。当該変形例の変更点としては、(1)反転機構65が2つであり、(2)第1基板搬送機構61に基板載置部61aが備えられており、(3)第1基板搬送機構61および第2基板搬送機構62が一直線上に配置されている点である。なお、第1基板搬送機構61および第2基板搬送機構62が同一方向に向かって配置されている点は同じである。 FIG. 11 is a plan view showing a modification of the bonding apparatus 60 using two reversing mechanisms 65. Changes in the modification include (1) two reversing mechanisms 65, (2) the first substrate transport mechanism 61 includes the substrate platform 61a, and (3) the first substrate transport mechanism. 61 and the second substrate transport mechanism 62 are arranged in a straight line. The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are the same in that they are arranged in the same direction.
 基板載置部61aおよび反転機構65は、第1基板搬送機構61における第2基板搬送機構62側の端部において、上記端部の第1基板搬送機構61の搬送方向に対して水平な両方向に沿って備えられている。反転機構65は図9および図10にて説明した構造である。また、上記端部には、基板載置部61aへ基板5を搬送する搬送手段が備えられており、具体的には、例えば、コンベアーロールを挙げることができる。 The substrate platform 61a and the reversing mechanism 65 are arranged at both ends of the first substrate transport mechanism 61 on the second substrate transport mechanism 62 side, which are horizontal with respect to the transport direction of the first substrate transport mechanism 61 at the end. Are provided along. The reversing mechanism 65 has the structure described with reference to FIGS. Moreover, the said edge part is equipped with the conveyance means which conveys the board | substrate 5 to the board | substrate mounting part 61a, Specifically, a conveyor roll can be mentioned, for example.
 基板載置部61aは、第1回転前に基板5が搬送される終点となる場である。当該構造によれば、第1基板搬送機構61に搬送された基板5は、2つの基板載置部61aに交互に搬送される。基板載置部61aおよび反転機構65は2対ずつ備えられているため、基板載置部61aに搬送された基板5は、反転機構65によって第1回転、90°回転および第2回転がなされて反転される。 The substrate platform 61a is a place that becomes the end point of the transport of the substrate 5 before the first rotation. According to this structure, the substrates 5 transported to the first substrate transport mechanism 61 are transported alternately to the two substrate platforms 61a. Since the substrate platform 61a and the reversing mechanism 65 are provided in two pairs, the substrate 5 transported to the substrate platform 61a is rotated by the reversing mechanism 65 for the first rotation, 90 ° rotation, and second rotation. Inverted.
 当該変形例では、2つの基板載置部61aは第1基板搬送機構61の水平な両方向に沿ってそれぞれ備えられているため、反転した基板5は、第1基板搬送機構61の搬送方向に沿って配置されることとなる。したがって、第1基板搬送機構61および第2基板搬送機構62を一直線上に配置することが可能である。 In the modified example, the two substrate platforms 61 a are provided along both horizontal directions of the first substrate transport mechanism 61, so the inverted substrate 5 is along the transport direction of the first substrate transport mechanism 61. Will be placed. Therefore, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 can be arranged on a straight line.
 当該変形例によれば、(1)反転機構65が2つ備えられているため、基板5を単位時間当り2倍処理することができる。これにより、単位時間当たり多くの基板5の反転が可能なため、タクトタイムが短縮される。(2)さらに、第1基板搬送機構61および第2基板搬送機構62が一直線上に配置されているため、より面積効率に優れた構造の貼合装置を提供できる。特にクリーンルームにおいては面積効率が要求されるため、当該貼合装置は非常に好ましい。 (1) Since two reversing mechanisms 65 are provided, the substrate 5 can be processed twice per unit time. Thereby, since many substrates 5 can be reversed per unit time, the tact time is shortened. (2) Furthermore, since the 1st board | substrate conveyance mechanism 61 and the 2nd board | substrate conveyance mechanism 62 are arrange | positioned on the straight line, the bonding apparatus of the structure excellent in area efficiency can be provided. Especially in a clean room, since the area efficiency is required, the bonding apparatus is very preferable.
 <その他の付帯的構成>
 さらに、好ましい形態として、製造システム100は、制御部70、洗浄部71、貼りずれ検査装置72および貼合異物自動検査装置73および仕分け搬送装置74を備えている。貼りずれ検査装置72、貼合異物自動検査装置73および仕分け搬送装置74は、貼合後の基板5、すなわち、液晶表示装置に対して検査等の処理を行うものである。
<Other incidental configurations>
Furthermore, as a preferable form, the manufacturing system 100 includes a control unit 70, a cleaning unit 71, a misalignment inspection device 72, a bonded foreign matter automatic inspection device 73, and a sorting and conveying device 74. The bonding deviation inspection device 72, the bonded foreign substance automatic inspection device 73, and the sorting and conveying device 74 perform processing such as inspection on the substrate 5 after bonding, that is, the liquid crystal display device.
 図12は上記液晶表示装置の製造システムが備える各部材の関連を示すブロック図であり、図13は液晶表示装置の製造システムの動作を示すフローチャートである。以下、液晶表示装置が備える各部材の説明と共にその動作について説明する。 FIG. 12 is a block diagram showing the relationship of each member included in the above-described liquid crystal display device manufacturing system, and FIG. 13 is a flowchart showing the operation of the liquid crystal display device manufacturing system. Hereinafter, the operation of the liquid crystal display device will be described together with the description of each member.
 制御部70は、洗浄部71、貼りずれ検査装置72、貼合異物自動検査装置73および仕分け搬送装置74と接続されており、これらに制御信号を送信して制御するものである。制御部70は、主としてCPU(Central Processing Unit)により構成され、必要に応じてメモリ等を備える。 The control unit 70 is connected to the cleaning unit 71, the misalignment inspection device 72, the bonded foreign matter automatic inspection device 73, and the sorting and conveying device 74, and controls them by transmitting control signals thereto. The control unit 70 is mainly configured by a CPU (Central Processing Unit) and includes a memory or the like as necessary.
 製造システム100に洗浄部71が備えられている場合、洗浄部71でのタクトタイムを短縮するため、第1基板搬送機構61における基板5は、長辺間口にて洗浄部71に搬送されることが好ましい。通常、洗浄部71での洗浄は長時間を要するため、タクトタイムを短縮する観点から当該構成は非常に有効である。 In the case where the cleaning unit 71 is provided in the manufacturing system 100, the substrate 5 in the first substrate transport mechanism 61 is transported to the cleaning unit 71 at the front edge of the long side in order to reduce the tact time in the cleaning unit 71. Is preferred. Usually, since the cleaning in the cleaning unit 71 takes a long time, this configuration is very effective from the viewpoint of shortening the tact time.
 次に、偏光フィルムを基板5の両面に貼合する貼合工程を行うが(図13のS2)、本工程については、図1~図11を用いて説明した通りである。 Next, a bonding step of bonding the polarizing film to both surfaces of the substrate 5 is performed (S2 in FIG. 13). This step is as described with reference to FIGS.
 貼りずれ検査装置72は、貼合された基板5における偏光フィルムの貼りずれの有無を検査するものである。貼りずれ検査装置72は、カメラおよび画像処理装置によって構成されており、ニップロール16・16aによって偏光フィルムが貼合された基板5の貼合位置に上記カメラが設置されている。上記カメラにて基板5の撮影が行われ、撮影された画像情報を処理することによって、基板5に貼りずれの有無を検査することができる(貼りずれ検査工程、図13のS3)。なお、貼りずれ検査装置72としては、従来公知の貼りずれ検査装置を使用可能である。 The sticking deviation inspection device 72 is for inspecting the presence or absence of sticking deviation of the polarizing film on the bonded substrate 5. The sticking deviation inspection device 72 is constituted by a camera and an image processing device, and the camera is installed at the bonding position of the substrate 5 on which the polarizing film is bonded by the nip rolls 16 and 16a. The substrate 5 is photographed by the camera, and by processing the photographed image information, the substrate 5 can be inspected for the presence or absence of sticking (sticking slip inspection step, S3 in FIG. 13). Note that as the misalignment inspection apparatus 72, a conventionally known misalignment inspection apparatus can be used.
 貼合異物自動検査装置73は、貼合された基板5における異物の有無を検査するものである。貼合異物自動検査装置73は、貼りずれ検査装置72と同様に、カメラおよび画像処理装置によって構成されており、ニップロール16・16aによって偏光フィルムが貼合された後の基板5の第2基板搬送機構(貼合装置60)に上記カメラが設置されている。上記カメラにて基板5の撮影が行われ、撮影された画像情報を処理することによって、基板5に貼合異物の有無を検査することができる(貼合異物検査工程、S4)。上記異物としては、埃などの異物、フィッシュアイなどが挙げられる。なお、貼合異物自動検査装置73としては、従来公知の貼合異物検査装置を使用可能である。 The bonded foreign matter automatic inspection device 73 inspects the presence or absence of foreign matter on the bonded substrate 5. The bonded foreign matter automatic inspection device 73 is configured by a camera and an image processing device, like the misalignment inspection device 72, and transports the second substrate of the substrate 5 after the polarizing film is bonded by the nip rolls 16 and 16a. The camera is installed in the mechanism (bonding device 60). The board | substrate 5 is image | photographed with the said camera, and the presence or absence of the bonding foreign material to the board | substrate 5 can be test | inspected by processing the image | photographed image information (bonding foreign material inspection process, S4). Examples of the foreign matter include foreign matters such as dust, fish eyes, and the like. In addition, as the bonding foreign material automatic inspection apparatus 73, a conventionally well-known bonding foreign material inspection apparatus can be used.
 S3およびS4は逆の順序でなされてもよいし、同時になされてもよい。また、一方の工程を省略することも可能である。 S3 and S4 may be performed in the reverse order or simultaneously. One step can be omitted.
 仕分け搬送装置74は、貼りずれ検査装置72および貼合異物自動検査装置73からの検査結果に基づき、貼りずれおよび異物の有無を判定する。仕分け搬送装置74は、貼りずれ検査装置72および貼合異物自動検査装置73から検査結果に基づく出力信号を受信して、貼合された基板5を良品または不良品に仕分けできるものであればよい。したがって、従来公知の仕分け搬送システムを用いることができる。 The sorting and conveying device 74 determines the presence or absence of sticking misalignment and foreign matter based on the inspection results from the sticking misalignment inspection device 72 and the bonded foreign matter automatic inspection device 73. The sorting and conveying device 74 only needs to receive an output signal based on the inspection result from the sticking misalignment inspection device 72 and the bonding foreign matter automatic inspection device 73 and can sort the bonded substrates 5 into non-defective products or defective products. . Therefore, a conventionally known sorting and conveying system can be used.
 当該液晶表示装置の製造システムでは好ましい態様として貼りずれおよび異物の両方を検出する構成となっており、貼りずれまたは異物が検査されたと判定された場合(YES)、貼合された基板5は不良品として仕分けされる(S7)。一方、貼りずれおよび異物のいずれもが検知されなかったと判定された場合(NO)、貼合された基板5は良品として仕分けされる(S6)。 In the manufacturing system of the liquid crystal display device, as a preferred mode, both the misalignment and foreign matter are detected. When it is determined that the misalignment or foreign matter has been inspected (YES), the bonded substrate 5 is not used. Sorted as good (S7). On the other hand, when it is determined that neither sticking deviation nor foreign matter is detected (NO), the bonded substrates 5 are classified as non-defective products (S6).
 仕分け搬送装置74を備える液晶表示装置の製造システムによれば、良品および不良品の仕分けを速やかに行うことができ、タクトタイムを短縮することが可能である。貼りずれ検査装置72または貼合異物自動検査装置73のみが備えられている場合、仕分け搬送装置74は、貼りずれおよび異物の一方のみ有無を判定する構成であってもよい。 According to the manufacturing system of the liquid crystal display device provided with the sorting and conveying device 74, the non-defective product and the defective product can be quickly sorted, and the tact time can be shortened. When only the sticking misalignment inspection device 72 or the bonded foreign matter automatic inspection device 73 is provided, the sorting and conveying device 74 may be configured to determine the presence / absence of only one of the sticking misalignment and the foreign matter.
 なお、発明の詳細な説明の項においてなされた具体的な実施形態は、あくまでも、本発明の技術内容を明らかにするものであって、そのような具体例にのみ限定して狭義に解釈されるべきものではなく、本発明の精神と次に記載する請求の範囲内において、いろいろと変更して実施することができるものである。 It should be noted that the specific embodiments made in the detailed description of the invention are merely to clarify the technical contents of the present invention, and are limited to such specific examples and are interpreted narrowly. It should be understood that the invention can be practiced with various modifications within the spirit of the invention and within the scope of the following claims.
 また、本発明には以下の態様も含まれる。 The present invention also includes the following aspects.
 また、本発明の偏光フィルムの貼合装置では、上記第1基板搬送機構および第2基板搬送機構が一直線上に配置されており、第1基板搬送機構における第2基板搬送機構側の端部において、上記端部の第1基板搬送機構の搬送方向に対して水平な両方向に沿って、基板載置部および上記反転機構が2対ずつ備えられ、上記端部には、上記端部から上記基板載置部へ基板を搬送する搬送手段が備えられており、上記反転機構は上記基板載置部のそれぞれに搬送された基板を反転させて第2基板搬送機構に配置することが好ましい。 In the polarizing film bonding apparatus of the present invention, the first substrate transport mechanism and the second substrate transport mechanism are arranged in a straight line, and at the end of the first substrate transport mechanism on the second substrate transport mechanism side. The substrate mounting portion and the reversing mechanism are provided in two pairs along both directions parallel to the transport direction of the first substrate transport mechanism at the end portion, and the end portion includes the substrate from the end portion to the substrate. It is preferable that transport means for transporting the substrate to the placement unit is provided, and the reversing mechanism reverses the substrate transported to each of the substrate placement units and places it on the second substrate transport mechanism.
 上記構成によれば、反転機構が2つ備えられているため、基板を単位時間当り2倍処理することができる。これにより、単位時間当たり多くの基板の反転が可能なため、タクトタイムが短縮される。さらに、第1基板搬送機構および第2基板搬送機構が一直線上に配置されているため、より面積効率に優れた構造の貼合装置を提供できる。 According to the above configuration, since two reversing mechanisms are provided, the substrate can be processed twice per unit time. Thereby, since many substrates can be reversed per unit time, the tact time is shortened. Furthermore, since the 1st board | substrate conveyance mechanism and the 2nd board | substrate conveyance mechanism are arrange | positioned on the straight line, the bonding apparatus of the structure excellent in area efficiency can be provided.
 また、本発明の偏光フィルムの貼合装置では、偏光フィルムを搬送する第1フィルム搬送機構および第2フィルム搬送機構が備えられており、上記第1フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、上記第2フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、上記第1基板搬送機構および第2基板搬送機構は上記第1フィルム搬送機構および第2フィルム搬送機構の上部に備えられており、上記剥離フィルムが除去された偏光フィルムを基板に貼合する上記第1貼合部が上記第1フィルム搬送機構と第1基板搬送機構との間に、上記剥離フィルムが除去された偏光フィルムを基板に貼合する第2貼合部が上記第2フィルム搬送機構と第2基板搬送機構との間にそれぞれ備えられていることが好ましい。 Moreover, in the bonding apparatus of the polarizing film of this invention, the 1st film conveyance mechanism and 2nd film conveyance mechanism which convey a polarizing film are provided, and the said 1st film conveyance mechanism was protected by the peeling film. A plurality of unwinding sections for unwinding the polarizing film, a cutting section for cutting the polarizing film, a removing section for removing the release film from the polarizing film, and a plurality of winding sections for winding the removed release film are provided. The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the peeling film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding units for winding the removed release film, wherein the first substrate transport mechanism and the second substrate transport mechanism are the first film transport. The first bonding unit is provided on the top of the structure and the second film transport mechanism, and bonds the polarizing film from which the release film has been removed to the substrate. The first film transport mechanism, the first substrate transport mechanism, It is preferable that the 2nd bonding part which bonds the polarizing film from which the said peeling film was removed to between a board | substrate is provided between the said 2nd film conveyance mechanism and the 2nd board | substrate conveyance mechanism.
 これにより、巻出部および巻取部が複数備えられているため、一方の巻出部における偏光フィルムの原反の残量が少なくなった場合、その原反に他方の巻出部に備えられた原反を連結させることが可能である。その結果、偏光フィルムの巻出しを停止させることなく、作業を続行することができ、生産効率を高めることができる。 Thereby, since the unwinding part and the winding part are provided in plural, when the remaining amount of the original film of the polarizing film in one unwinding part decreases, the other unwinding part is provided in the original film. It is possible to connect raw materials. As a result, the operation can be continued without stopping the unwinding of the polarizing film, and the production efficiency can be increased.
 また、本発明の偏光フィルムの貼合装置では、上記巻出部は偏光フィルムの巻芯方向に対して水平に移動可能であり、上記巻出部である第1巻出部および第2巻出部が並設されていることが好ましい。 In the polarizing film laminating apparatus of the present invention, the unwinding part can move horizontally with respect to the core direction of the polarizing film, and the first unwinding part and the second unwinding are the unwinding parts. It is preferable that the parts are arranged side by side.
 これにより、巻出部は巻芯方向に水平に移動するため、巻出部が上方へ移動する空間を確保する必要がない。したがって、上部に備えられた第1基板搬送機構および第2基板搬送機構と、下部の上記第1フィルム搬送機構および第2フィルム搬送機構が備える巻出部との空間を省スペースとすることができる。その結果、小型化された貼合装置を提供することができる。 Thereby, since the unwinding part moves horizontally in the core direction, it is not necessary to secure a space for the unwinding part to move upward. Therefore, the space between the first substrate transport mechanism and the second substrate transport mechanism provided in the upper part and the unwinding part provided in the first film transport mechanism and the second film transport mechanism in the lower part can be saved. . As a result, a miniaturized bonding apparatus can be provided.
 また、本発明の偏光フィルムの貼合装置では、第1巻出部から巻出された偏光フィルムおよび第2巻出部から巻出された偏光フィルムを連結させる、第1フィルム連結部および第2フィルム連結部が、上記の両偏光フィルムの通過位置を介在し、かつ、第1フィルム連結部は第1巻出部から巻出された偏光フィルムに対向して配置され、第2フィルム連結部は第2巻出部から巻出された偏光フィルムに対向して配置されており、上記第1フィルム連結部および第2フィルム連結部は、偏光フィルムを吸着可能な吸着機構を備える2つの吸着部と、上記2つの吸着部の間であり、かつ、偏光フィルムの幅方向に沿って回転可能に配置された、切断貼合部とを備えており、上記切断貼合部は、偏光フィルムを切断する切断機を備えていると共に、切断貼合部が有する複数面は、偏光フィルムの幅方向に沿って偏光フィルムを支持する切断支持面と、上記偏光フィルム同士を連結する連結材を吸着して保持する吸着機構を備えた、2以上の貼合面とを少なくとも有しており、上記第1フィルム連結部および第2フィルム連結部は、互いに近接可能であることが好ましい。 Moreover, in the bonding apparatus of the polarizing film of this invention, the 1st film connection part and 2nd which connect the polarizing film unwound from the 1st unwinding part, and the polarizing film unwound from the 2nd unwinding part. The film connecting part is interposed between the passage positions of both the polarizing films, and the first film connecting part is disposed to face the polarizing film unwound from the first unwinding part, and the second film connecting part is It arrange | positions facing the polarizing film unwound from the 2nd unwinding part, The said 1st film connection part and 2nd film connection part are two adsorption | suction parts provided with the adsorption | suction mechanism which can adsorb | suck a polarizing film, and And a cutting and bonding part that is disposed between the two adsorbing parts and is rotatably arranged along the width direction of the polarizing film. The cutting and bonding part cuts the polarizing film. With a cutting machine The plurality of surfaces of the cutting and bonding unit includes a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and an adsorption mechanism that adsorbs and holds the connecting material that connects the polarizing films to each other. It has at least the above bonding surface, and it is preferable that the first film connecting portion and the second film connecting portion can be close to each other.
 これにより、上記吸着部によって偏光フィルムを吸着し、吸着した偏光フィルムを切断支持面にて支持した状態にて切断機によって切断することができる。その後、切断貼合部を回転させて、切断した偏光フィルムに対して、貼合面の連結材を貼合することができる。さらに、第1フィルム連結部および第2フィルム連結部を互いに近接させ、連結材が貼合された2枚の偏光フィルムを接触させて容易に連結することができる。 Thereby, the polarizing film can be adsorbed by the adsorbing portion, and the adsorbing polarizing film can be cut by the cutting machine while being supported by the cutting support surface. Then, the cutting bonding part can be rotated and the connection material of a bonding surface can be bonded with respect to the cut | disconnected polarizing film. Furthermore, the 1st film connection part and the 2nd film connection part can mutually be brought close, and the two polarizing films with which the connection material was bonded can be contacted and can be connected easily.
 また、本発明の偏光フィルムの貼合装置では、上記切断支持面には、上記偏光フィルムの幅方向に沿って上記切断機が通過可能な開口が形成されていることが好ましい。 In the polarizing film laminating apparatus of the present invention, it is preferable that an opening through which the cutting machine can pass is formed in the cutting support surface along the width direction of the polarizing film.
 これにより、切断機の通過を、偏光フィルムの幅方向に沿って確実に行うことができ、後に偏光フィルム同士の連結をより正確に行うことができる。 Thereby, the cutting machine can be reliably passed along the width direction of the polarizing film, and the polarizing films can be more accurately connected later.
 また、本発明の偏光フィルムの貼合装置では、上記切断機が丸刃状であることが好ましい。 Moreover, in the polarizing film laminating apparatus of the present invention, it is preferable that the cutting machine has a round blade shape.
 これにより、偏光フィルムの切断をより容易に行うことが可能となる。 This makes it possible to cut the polarizing film more easily.
 また、本発明の偏光フィルムの貼合装置では、上記切断貼合部は、吸着部によって吸着された偏光フィルムに対して垂直方向に移動可能であることが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, it is preferable that the cutting and bonding part is movable in the vertical direction with respect to the polarizing film adsorbed by the adsorption part.
 これにより、切断貼合部が回転する際、切断貼合部は偏光フィルムに対して垂直方向であって、偏光フィルムに遠ざかる方向に移動でき、その後、回転することができる。これにより、切断貼合部が回転する際、偏光フィルムに接触することを確実に回避することができる。 Thereby, when the cutting and bonding part rotates, the cutting and bonding part can move in a direction perpendicular to the polarizing film and away from the polarizing film, and then rotate. Thereby, when a cutting bonding part rotates, it can avoid reliably contacting a polarizing film.
 また、本発明の偏光フィルムの貼合装置では、上記第1貼合部によって基板の下面に偏光フィルムを貼合する前に、基板を洗浄する洗浄部を備え、上記第1基板搬送機構は、基板の短辺が搬送方向に沿った状態にて基板を搬送することが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, before the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, the first film transporting mechanism includes a cleaning unit for cleaning the substrate. It is preferable to transport the substrate with the short side of the substrate along the transport direction.
 これにより、基板の搬送方向に対して基板の長辺が直交する状態にて、洗浄部による基板の洗浄を行うことができる。すなわち、搬送方向に沿った基板の距離を小さくすることができるため、洗浄に必要なタクトタイムをより短縮することができる。その結果、さらに生産効率に優れた偏光フィルムの貼合装置を提供することができる。 Thereby, the substrate can be cleaned by the cleaning unit in a state where the long sides of the substrate are orthogonal to the substrate transport direction. That is, since the distance of the substrate along the transport direction can be reduced, the tact time required for cleaning can be further shortened. As a result, it is possible to provide a polarizing film laminating apparatus that is further excellent in production efficiency.
 また、本発明の偏光フィルムの貼合装置では、上記第1フィルム搬送機構および上記第2フィルム搬送機構には、第1巻出部から巻出された偏光フィルムに付された欠点表示を検出する欠点検出部と、上記欠点表示を判別して、上記基板の搬送を停止させる貼合回避部と、基板との貼合が回避された偏光フィルムを回収する回収部とを有することが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, the first film transport mechanism and the second film transport mechanism detect a defect display attached to the polarizing film unwound from the first unwinding section. It is preferable to have a defect detection unit, a bonding avoidance unit that discriminates the defect display and stops the conveyance of the substrate, and a recovery unit that recovers the polarizing film from which bonding with the substrate is avoided.
 上記欠点検出部、貼合回避部および回収部によれば、欠点を有する偏光フィルムと基板との貼合わせを回避できるため、歩留まりを高めることができる。 According to the defect detection unit, the bonding avoidance unit, and the recovery unit, since it is possible to avoid the bonding between the polarizing film having a defect and the substrate, the yield can be increased.
 本発明の液晶表示装置の製造システムは、上記偏光フィルムの貼合装置と、上記第2貼合部によって偏光フィルムの貼合がなされた基板における貼りずれを検査する貼りずれ検査装置を備えるものである。 The manufacturing system of the liquid crystal display device of this invention is equipped with the bonding apparatus of the said polarizing film, and the sticking | shift detection apparatus which test | inspects the sticking gap in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part. is there.
 これにより、偏光フィルムを貼合した基板に生じた貼りずれを検査することが可能である。 This makes it possible to inspect for misalignment occurring on the substrate to which the polarizing film is bonded.
 また、本発明の液晶表示装置の製造システムでは、上記貼りずれ検査装置による検査結果に基づき貼りずれの有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Further, in the liquid crystal display manufacturing system of the present invention, the presence / absence of sticking misalignment is determined based on the inspection result of the sticking misalignment inspection apparatus, and the substrate on which the polarizing film is bonded is classified based on the determination result. It is preferable to provide a transport device.
 これにより、偏光フィルムが貼合された基板に貼りずれが生じている場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thereby, when there is a sticking error on the substrate on which the polarizing film is bonded, it is possible to quickly sort defective products and shorten the tact time.
 また、本発明の液晶表示装置の製造システムでは、偏光フィルムの貼合装置と、上記貼合装置における第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置とを備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, the bonding foreign material automatic which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the bonding apparatus of a polarizing film and the 2nd bonding part in the said bonding apparatus. It is preferable to provide an inspection device.
 これにより、偏光フィルムを貼合した液晶パネルに混入した異物を検査することが可能である。 This makes it possible to inspect foreign matter mixed in the liquid crystal panel to which the polarizing film is bonded.
 また、本発明の液晶表示装置の製造システムでは、上記貼合異物自動検査装置による検査結果に基づき異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, the presence or absence of a foreign material is determined based on the inspection result by the said bonded foreign material automatic test | inspection apparatus, and the board | substrate with which the polarizing film was bonded is performed based on the said determination result. It is preferable to provide a sorting and conveying device.
 これにより、偏光フィルムを貼合した液晶パネルに異物が混入している場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thus, when foreign matter is mixed in the liquid crystal panel bonded with the polarizing film, it is possible to quickly sort defective products and shorten the tact time.
 また、本発明の液晶表示装置の製造システムでは、上記第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置を備え、上記貼りずれ検査装置による検査結果、および、上記貼合異物自動検査装置による検査結果に基づき、貼りずれおよび異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, it has the bonding foreign material automatic test | inspection apparatus which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part, and test | inspected by the said sticking | shift detection apparatus Based on the result and an inspection result by the bonded foreign matter automatic inspection device, a determination is made as to whether there is a sticking deviation and a foreign matter, and based on the determination result, a sorting and conveying device is provided that sorts the substrate on which the polarizing film is bonded. It is preferable.
 これにより、偏光フィルムを貼合した液晶パネルに貼りずれまたは異物の混入が生じている場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thus, when the liquid crystal panel on which the polarizing film is bonded is stuck or mixed with foreign matter, defective products can be quickly sorted and the tact time can be shortened.
 本発明に係る偏光フィルムの貼合装置は、偏光フィルムを基板に貼合する分野にて利用可能である。 The polarizing film bonding apparatus according to the present invention can be used in the field of bonding a polarizing film to a substrate.
 1・1b  第1巻出部
 1a・1c 第2巻出部
 1d    巻芯
 2    第1巻取部
 2a   第2巻取部
 3    ハーフカッター
 4    ナイフエッジ
 5    基板
 6・6a ニップロール(第1貼合部)
 7・7a 欠点フィルム巻取ローラー
 10・20 偏光フィルム
 10a   偏光フィルム
 10b   剥離フィルム
 11   第1巻出部
 11a  第2巻出部
 12   第1巻取部
 12a  第2巻取部
 13   ハーフカッター
 14   ナイフエッジ
 15   コンベアーロール
 16・16a ニップロール(第2貼合部)
 17・17a 欠点フィルム巻取ローラー
 40   HEPAフィルター
 41   グレーチング
 50   フィルム搬送機構
 51   第1フィルム搬送機構
 52   第2フィルム搬送機構
 60   貼合装置(偏光フィルムの貼合装置)
 61   第1基板搬送機構
 61a  基板載置部
 62   第2基板搬送機構
 65   反転機構
 66   吸着部
 67   基板反転部
 68   基板回転部
 70   制御部
 71   洗浄部
 72   検査装置
 73   貼合異物自動検査装置
 74   搬送装置
 83・93   フィルム連結部
 84・84a・94・94a   吸着部
 85・95   切断貼合部
 85a・95a 切断支持面
 85b・85c・95b・95c 貼合面
 85d・95d 片面粘着テープ
 86・96   開口
 87   切断機
 88   台部
 89   吸着機構
 100  製造システム(液晶表示装置の製造システム)
DESCRIPTION OF SYMBOLS 1 * 1b 1st unwinding part 1a * 1c 2nd unwinding part 1d Winding core 2 1st winding part 2a 2nd winding part 3 Half cutter 4 Knife edge 5 Board | substrate 6 * 6 Nip roll (1st bonding part)
7.7a Defect film winding roller 10.20 Polarizing film 10a Polarizing film 10b Peeling film 11 First unwinding part 11a Second unwinding part 12 First winding part 12a Second winding part 13 Half cutter 14 Knife edge 15 Conveyor roll 16.16a Nip roll (second bonding part)
17.17a Defect film winding roller 40 HEPA filter 41 Grating 50 Film transport mechanism 51 First film transport mechanism 52 Second film transport mechanism 60 Bonding device (polarizing film bonding device)
61 First substrate transport mechanism 61a Substrate placement unit 62 Second substrate transport mechanism 65 Reversing mechanism 66 Suction unit 67 Substrate reversing unit 68 Substrate rotating unit 70 Control unit 71 Cleaning unit 72 Inspection device 73 Bonding foreign matter automatic inspection device 74 Conveyance device 83/93 Film connecting part 84 / 84a / 94 / 94a Adsorbing part 85/95 Cutting and bonding part 85a / 95a Cutting support surface 85b / 85c / 95b / 95c Bonding surface 85d / 95d Single-sided adhesive tape 86/96 Opening 87 Cutting Machine 88 Stand 89 Adsorption mechanism 100 Manufacturing system (Liquid crystal display manufacturing system)

Claims (15)

  1.  長方形の基板を長辺または短辺が搬送方向に沿った状態にて搬送する第1基板搬送機構と、
     上記第1基板搬送機構における上記基板の下面に偏光フィルムを貼合する第1貼合部と、
     上記第1基板搬送機構にて搬送された上記基板を反転させて第2基板搬送機構に配置する反転機構と、
     上記基板を短辺または長辺が搬送方向に沿った状態にて搬送する第2基板搬送機構と、
     上記第2基板搬送機構における上記基板の下面に偏光フィルムを貼合する第2貼合部とを含む偏光フィルムの貼合装置であって、
     上記第1基板搬送機構と第2基板搬送機構とは同一方向に向かって配置されており、
     上記反転機構は上記基板を吸着する吸着部と、
     基板の長辺または短辺を下辺として、基板を第1角度まで回転させる第1回転および第1角度から基板を反転させる第2回転によって基板を反転させる基板反転部と、
     上記基板反転部に連結されており、上記第1回転によって回転された基板を、第1基板搬送機構における基板の表面に対して平行な方向に90°回転させる基板回転部とを備える偏光フィルムの貼合装置。
    A first substrate transport mechanism for transporting a rectangular substrate with a long side or a short side along the transport direction;
    A first bonding unit for bonding a polarizing film to the lower surface of the substrate in the first substrate transport mechanism;
    A reversing mechanism for inverting the substrate transported by the first substrate transporting mechanism and placing it on the second substrate transporting mechanism;
    A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction;
    A polarizing film laminating apparatus comprising: a second laminating unit for laminating a polarizing film on the lower surface of the substrate in the second substrate transport mechanism,
    The first substrate transport mechanism and the second substrate transport mechanism are arranged in the same direction,
    The reversing mechanism includes a suction portion that sucks the substrate;
    A substrate reversing unit for reversing the substrate by a first rotation for rotating the substrate to the first angle and a second rotation for reversing the substrate from the first angle, with the long side or the short side of the substrate as the lower side;
    A polarizing film comprising: a substrate rotating unit connected to the substrate reversing unit and rotating the substrate rotated by the first rotation by 90 ° in a direction parallel to the surface of the substrate in the first substrate transport mechanism. Bonding device.
  2.  上記第1基板搬送機構および第2基板搬送機構が一直線上に配置されており、
     第1基板搬送機構における第2基板搬送機構側の端部において、上記端部の第1基板搬送機構の搬送方向に対して水平な両方向に沿って、基板載置部および上記反転機構が2対ずつ備えられ、
     上記端部には、上記端部から上記基板載置部へ基板を搬送する搬送手段が備えられており、
     上記反転機構は上記基板載置部のそれぞれに搬送された基板を反転させて第2基板搬送機構に配置する請求項1に記載の偏光フィルムの貼合装置。
    The first substrate transport mechanism and the second substrate transport mechanism are arranged on a straight line,
    At the end portion of the first substrate transport mechanism on the second substrate transport mechanism side, two pairs of substrate mounting portions and reversing mechanisms are provided along both directions parallel to the transport direction of the first substrate transport mechanism at the end portion. One by one,
    The end portion is provided with a transport means for transporting the substrate from the end portion to the substrate mounting portion.
    The polarizing film laminating device according to claim 1, wherein the reversing mechanism reverses the substrate transported to each of the substrate mounting portions and places the substrate on the second substrate transporting mechanism.
  3.  偏光フィルムを搬送する第1フィルム搬送機構および第2フィルム搬送機構が備えられており、
     上記第1フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、
     上記第2フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、
     上記第1基板搬送機構および第2基板搬送機構は上記第1フィルム搬送機構および第2フィルム搬送機構の上部に備えられており、
     上記剥離フィルムが除去された偏光フィルムを基板に貼合する上記第1貼合部が上記第1フィルム搬送機構と第1基板搬送機構との間に、上記剥離フィルムが除去された偏光フィルムを基板に貼合する第2貼合部が上記第2フィルム搬送機構と第2基板搬送機構との間にそれぞれ備えられている請求項1または2に記載の偏光フィルムの貼合装置。
    A first film transport mechanism and a second film transport mechanism for transporting the polarizing film;
    The first film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
    The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
    The first substrate transport mechanism and the second substrate transport mechanism are provided above the first film transport mechanism and the second film transport mechanism,
    The first bonding portion for bonding the polarizing film from which the release film has been removed to the substrate is between the first film transport mechanism and the first substrate transport mechanism, and the polarizing film from which the release film has been removed is the substrate. The bonding apparatus of the polarizing film of Claim 1 or 2 with which the 2nd bonding part bonded together is provided between the said 2nd film conveyance mechanism and the 2nd board | substrate conveyance mechanism, respectively.
  4.  上記巻出部は偏光フィルムの巻芯方向に対して水平に移動可能であり、
     上記巻出部である第1巻出部および第2巻出部が並設されている請求項3に記載の偏光フィルムの貼合装置。
    The unwinding part is movable horizontally with respect to the core direction of the polarizing film,
    The bonding apparatus of the polarizing film of Claim 3 with which the 1st unwinding part and 2nd unwinding part which are the said unwinding parts are arranged in parallel.
  5.  第1巻出部から巻出された偏光フィルムおよび第2巻出部から巻出された偏光フィルムを連結させる、第1フィルム連結部および第2フィルム連結部が、上記の両偏光フィルムの通過位置を介在し、かつ、第1フィルム連結部は第1巻出部から巻出された偏光フィルムに対向して配置され、第2フィルム連結部は第2巻出部から巻出された偏光フィルムに対向して配置されており、
     上記第1フィルム連結部および第2フィルム連結部は、偏光フィルムを吸着可能な吸着機構を備える2つの吸着部と、上記2つの吸着部の間であり、かつ、偏光フィルムの幅方向に沿って回転可能に配置された、切断貼合部とを備えており、
     上記切断貼合部は、偏光フィルムを切断する切断機を備えていると共に、切断貼合部が有する複数面は、偏光フィルムの幅方向に沿って偏光フィルムを支持する切断支持面と、上記偏光フィルム同士を連結する連結材を吸着して保持する吸着機構を備えた、2以上の貼合面とを少なくとも有しており、
     上記第1フィルム連結部および第2フィルム連結部は、互いに近接可能である請求項4に記載の偏光フィルムの貼合装置。
    The first film connecting part and the second film connecting part for connecting the polarizing film unwound from the first unwinding part and the polarizing film unwound from the second unwinding part pass through the both polarizing films. And the first film connecting part is disposed opposite to the polarizing film unwound from the first unwinding part, and the second film connecting part is disposed on the polarizing film unwound from the second unwinding part. Are placed opposite each other,
    The first film connecting part and the second film connecting part are between two adsorbing parts having an adsorbing mechanism capable of adsorbing a polarizing film, and the two adsorbing parts, and along the width direction of the polarizing film. It is equipped with a cutting and pasting part arranged so as to be rotatable,
    The cutting and bonding unit includes a cutting machine that cuts the polarizing film, and the plurality of surfaces that the cutting and bonding unit has include a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and the polarized light. It has at least two or more bonding surfaces provided with an adsorption mechanism that adsorbs and holds a coupling material that couples the films,
    The said 1st film connection part and the 2nd film connection part are the bonding apparatuses of the polarizing film of Claim 4 which can mutually adjoin.
  6.  上記切断支持面には、上記偏光フィルムの幅方向に沿って、上記切断機が通過可能な開口が形成されている請求項5に記載の偏光フィルムの貼合装置。 The polarizing film laminating device according to claim 5, wherein an opening through which the cutting machine can pass is formed along the width direction of the polarizing film on the cutting support surface.
  7.  上記切断機が丸刃状である請求項6に記載の偏光フィルムの貼合装置。 The polarizing film laminating apparatus according to claim 6, wherein the cutting machine has a round blade shape.
  8.  上記切断貼合部は、吸着部によって吸着された偏光フィルムに対して垂直方向に移動可能である請求項5~7の何れか1項に記載の偏光フィルムの貼合装置。 The polarizing film bonding apparatus according to any one of claims 5 to 7, wherein the cutting and bonding unit is movable in a direction perpendicular to the polarizing film adsorbed by the adsorption unit.
  9.  上記第1貼合部によって基板の下面に偏光フィルムを貼合する前に、基板を洗浄する洗浄部を備え、
     上記第1基板搬送機構は、基板の短辺が搬送方向に沿った状態にて基板を搬送する請求項1~8の何れか1項に記載の偏光フィルムの貼合装置。
    Before the polarizing film is bonded to the lower surface of the substrate by the first bonding unit, a cleaning unit for cleaning the substrate is provided,
    The polarizing film laminating apparatus according to any one of claims 1 to 8, wherein the first substrate transport mechanism transports the substrate in a state where the short side of the substrate is along the transport direction.
  10.  上記第1フィルム搬送機構および上記第2フィルム搬送機構には、第1巻出部から巻出された偏光フィルムに付された欠点表示を検出する欠点検出部と、
     上記欠点表示を判別して、上記基板の搬送を停止させる貼合回避部と、
     基板との貼合が回避された偏光フィルムを回収する回収部とを有する請求項3~8の何れか1項に記載の偏光フィルムの貼合装置。
    In the first film transport mechanism and the second film transport mechanism, a defect detection unit that detects a defect display attached to the polarizing film unwound from the first unwinding unit;
    A bonding avoidance unit that determines the defect display and stops the conveyance of the substrate,
    The polarizing film laminating apparatus according to any one of claims 3 to 8, further comprising a recovery unit that recovers the polarizing film from which pasting with the substrate is avoided.
  11.  請求項1~10の何れか1項に記載の偏光フィルムの貼合装置と、
     上記第2貼合部によって偏光フィルムの貼合がなされた基板における貼りずれを検査する貼りずれ検査装置を備える液晶表示装置の製造システム。
    A polarizing film laminating device according to any one of claims 1 to 10,
    The manufacturing system of a liquid crystal display device provided with the sticking | shift detection apparatus which test | inspects the sticking gap in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part.
  12.  上記貼りずれ検査装置による検査結果に基づき貼りずれの有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項11に記載の液晶表示装置の製造システム。 The liquid crystal display device according to claim 11, further comprising: a sorting and conveying device that determines presence / absence of pasting deviation based on an inspection result by the pasting deviation inspection apparatus and sorts a substrate on which a polarizing film is bonded based on the determination result. Manufacturing system.
  13.  請求項1~10の何れか1項に記載の偏光フィルムの貼合装置と、
     上記貼合装置における第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置とを備える液晶表示装置の製造システム。
    A polarizing film laminating device according to any one of claims 1 to 10,
    The manufacturing system of a liquid crystal display device provided with the bonded foreign material automatic test | inspection apparatus which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the 2nd bonding part in the said bonding apparatus.
  14.  上記貼合異物自動検査装置による検査結果に基づき異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項13に記載の液晶表示装置の製造システム。 The liquid crystal display according to claim 13, further comprising a sorting and conveying device that determines the presence or absence of foreign matter based on an inspection result by the bonded foreign matter automatic inspection device and sorts a substrate on which a polarizing film is bonded based on the determination result. Equipment manufacturing system.
  15.  上記第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置を備え、
     上記貼りずれ検査装置による検査結果、および、上記貼合異物自動検査装置による検査結果に基づき、貼りずれおよび異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項11に記載の液晶表示装置の製造システム。
    It is equipped with a bonded foreign matter automatic inspection device that inspects foreign matters on the substrate on which the polarizing film has been bonded by the second bonding portion,
    Based on the inspection result by the pasting inspection device and the inspection result by the pasting foreign matter automatic inspection device, the presence or absence of pasting and foreign matter is determined, and the substrate on which the polarizing film is pasted is determined based on the determination result. The manufacturing system of the liquid crystal display device of Claim 11 provided with the sorting conveyance apparatus which performs.
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