WO2011093960A2 - Variable pressure brush/pad - Google Patents

Variable pressure brush/pad Download PDF

Info

Publication number
WO2011093960A2
WO2011093960A2 PCT/US2010/061314 US2010061314W WO2011093960A2 WO 2011093960 A2 WO2011093960 A2 WO 2011093960A2 US 2010061314 W US2010061314 W US 2010061314W WO 2011093960 A2 WO2011093960 A2 WO 2011093960A2
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
brush
rigid core
workpiece
brushes
Prior art date
Application number
PCT/US2010/061314
Other languages
English (en)
French (fr)
Other versions
WO2011093960A3 (en
Inventor
Kenneth C. Miller
Original Assignee
Xyratex Technology Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xyratex Technology Ltd. filed Critical Xyratex Technology Ltd.
Priority to CN2010800621967A priority Critical patent/CN102714154A/zh
Priority to SG2012040077A priority patent/SG181457A1/en
Priority to JP2012551161A priority patent/JP2013517941A/ja
Publication of WO2011093960A2 publication Critical patent/WO2011093960A2/en
Publication of WO2011093960A3 publication Critical patent/WO2011093960A3/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/008—Disc-shaped brush bodies
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B11/00—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46D—MANUFACTURE OF BRUSHES
    • A46D1/00—Bristles; Selection of materials for bristles
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46D—MANUFACTURE OF BRUSHES
    • A46D1/00—Bristles; Selection of materials for bristles
    • A46D1/02—Bristles details
    • A46D1/0246—Hollow bristles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Definitions

  • Figure 9A is a simplified schematic diagram illustrating and expandable brush in accordance with one embodiment of the invention.
  • roller assemblies While illustrated with a disc 106, the roller assemblies are configured to accommodate multiple discs that are placed into the support structure 100 by an automated carrier moving between roller assembly 102a and roller assembly 102b.
  • the distance between roller assembly 102a and roller assembly 102b defines the width of a support nest of Figure 1.
  • Features of the roller assembly 102a and 102b enable support nests that can accommodate large diameter discs while in other configurations enabling accommodation of smaller diameter discs.
  • the relative size of the support structure 100 shown in Figure IB is not intended to be limiting.
  • the support structure 100 can be modified in order to
  • compartments 160 may be varied independently.
  • FIG. 9B is a simplified schematic diagram illustrating a cross-sectional view of a brush in accordance with one embodiment of the invention.
  • Tube 210 extends along the length of brush 204.
  • the walls of tube 210 define a plurality of openings 220 that extend through the tube wall.
  • Brush material 214 is disposed around tube 210.
  • tube 210 is composed of a flexible membrane.
  • tube 210 is a rigid material.
  • brush 214 may include a flexible membrane that will contract and expand according to an amount of pressure from the fluid being delivered from tube 210, through openings 220 to the flexible membrane disposed between the brush material 214 and an outer surface of tube 210. Thus, the expansion of the flexible membrane will cause the brush to expand.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Brushes (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
PCT/US2010/061314 2010-01-26 2010-12-20 Variable pressure brush/pad WO2011093960A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010800621967A CN102714154A (zh) 2010-01-26 2010-12-20 可变压力刷/垫
SG2012040077A SG181457A1 (en) 2010-01-26 2010-12-20 Variable pressure brush/pad
JP2012551161A JP2013517941A (ja) 2010-01-26 2010-12-20 可変圧力ブラシ／パッド

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/694,188 2010-01-26
US12/694,188 US20110182653A1 (en) 2010-01-26 2010-01-26 Variable Pressure Brush/Pad

Publications (2)

Publication Number Publication Date
WO2011093960A2 true WO2011093960A2 (en) 2011-08-04
WO2011093960A3 WO2011093960A3 (en) 2011-12-08

Family

ID=44309061

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/061314 WO2011093960A2 (en) 2010-01-26 2010-12-20 Variable pressure brush/pad

Country Status (6)

Country Link
US (1) US20110182653A1 (zh)
JP (1) JP2013517941A (zh)
CN (1) CN102714154A (zh)
SG (1) SG181457A1 (zh)
TW (1) TW201200066A (zh)
WO (1) WO2011093960A2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311634A (en) * 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
US6006391A (en) * 1997-11-10 1999-12-28 Speedfam-Ipec Corporation Workpiece cleaning element with improved rib configuration
US20020100132A1 (en) * 2001-01-30 2002-08-01 Mcmullen Daniel T. Porous polymeric substrate treatment device and method
US20070084004A1 (en) * 2005-10-13 2007-04-19 Noritake Shizawa Disc cleaning machinery, disc cleaning device thereof and rotary brush thereof
US20080182488A1 (en) * 2006-10-03 2008-07-31 Dave Frost Spiral brush for cleaning and conveying a substrate
US20080313833A1 (en) * 2007-06-25 2008-12-25 Noritake Shizawa Disc cleaning mechanism and disc cleaning device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1943422A (en) * 1929-05-29 1934-01-16 Compo Shoe Machinery Corp Upper-roughing machine
US2509957A (en) * 1946-06-11 1950-05-30 Goodall Sanford Inc Machine for liquid cleaning of upholstered articles, fabrics, rugs, carpets, etc.
US2680938A (en) * 1949-11-09 1954-06-15 Osborn Mfg Co Apparatus for conditioning metal sheets and the like
US4061136A (en) * 1976-09-09 1977-12-06 Giuseppe Vaniglia Portable washer and massager apparatus for bathtubs
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US5016311A (en) * 1988-04-27 1991-05-21 Minnesota Mining And Manufacturing Company Apparatus and brush segment arrangement for finishing wheel brushes; and method
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly
KR950703296A (ko) * 1992-10-02 1995-09-20 하르트무트 벤케르트 표면 세척용 브러시 헤드 (brush head for cleaning surfaces)
US5778481A (en) * 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5964006A (en) * 1997-01-13 1999-10-12 3M Innovative Properties Company Rotary surface treatment tool
JP3399772B2 (ja) * 1997-02-28 2003-04-21 株式会社藤森技術研究所 半導体製造装置の洗浄装置
US5870792A (en) * 1997-03-31 1999-02-16 Speedfam Corporation Apparatus for cleaning wafers and discs
US5966766A (en) * 1997-10-06 1999-10-19 Advanced Micro Devices, Inc. Apparatus and method for cleaning semiconductor wafer
US6076217A (en) * 1998-04-06 2000-06-20 Micron Technology, Inc. Brush alignment platform
JP3200036B2 (ja) * 1998-05-22 2001-08-20 アイオン株式会社 洗浄用回転ブラシ
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6240588B1 (en) * 1999-12-03 2001-06-05 Lam Research Corporation Wafer scrubbing brush core
JP4087581B2 (ja) * 2001-06-06 2008-05-21 株式会社荏原製作所 研磨装置
US6641462B2 (en) * 2001-06-27 2003-11-04 Speedfam-Ipec Corporation Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
US20100186180A1 (en) * 2009-01-23 2010-07-29 Xyratex Corporation Support structure for multiple workpiece support rollers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311634A (en) * 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
US6006391A (en) * 1997-11-10 1999-12-28 Speedfam-Ipec Corporation Workpiece cleaning element with improved rib configuration
US20020100132A1 (en) * 2001-01-30 2002-08-01 Mcmullen Daniel T. Porous polymeric substrate treatment device and method
US20070084004A1 (en) * 2005-10-13 2007-04-19 Noritake Shizawa Disc cleaning machinery, disc cleaning device thereof and rotary brush thereof
US20080182488A1 (en) * 2006-10-03 2008-07-31 Dave Frost Spiral brush for cleaning and conveying a substrate
US20080313833A1 (en) * 2007-06-25 2008-12-25 Noritake Shizawa Disc cleaning mechanism and disc cleaning device

Also Published As

Publication number Publication date
WO2011093960A3 (en) 2011-12-08
TW201200066A (en) 2012-01-01
US20110182653A1 (en) 2011-07-28
CN102714154A (zh) 2012-10-03
SG181457A1 (en) 2012-07-30
JP2013517941A (ja) 2013-05-20

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