WO2011086882A1 - カラーフィルタ基板の露光方法 - Google Patents
カラーフィルタ基板の露光方法 Download PDFInfo
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- WO2011086882A1 WO2011086882A1 PCT/JP2011/000049 JP2011000049W WO2011086882A1 WO 2011086882 A1 WO2011086882 A1 WO 2011086882A1 JP 2011000049 W JP2011000049 W JP 2011000049W WO 2011086882 A1 WO2011086882 A1 WO 2011086882A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
Definitions
- the present invention relates to a method for exposing a color filter substrate used in a liquid crystal display device or the like.
- the exposure mask As an exposure method using a small mask, an exposure machine in which a photomask smaller than the size of the substrate is mounted on the exposure head is used, and the entire surface of the substrate to be exposed is repeatedly exposed while the substrate is being transported (hereinafter referred to as “the exposure mask”). "Small mask continuous exposure method").
- FIG. 10 is a plan view showing an exposure method in the small mask continuous exposure method
- FIG. 11 is a side view showing a positional relationship among the substrate, the photomask, and the blind shutter.
- a photomask 130 is placed on the substrate 120.
- a plurality of openings 131 corresponding to dot-like colored pixels and photospacers (hereinafter referred to as “PS”) are provided.
- PS dot-like colored pixels and photospacers
- the substrate 120 is conveyed in the direction of the arrow in the figure, baking is sequentially performed on the display area on the substrate 120 through the opening 131 to form colored pixels and photo spacers (not shown).
- the substrate 120 has a display area 140 where colored pixels are formed and a non-display area 150 surrounding the outer periphery of the display area 140.
- the PS formed in the display region 140 is for keeping the distance between the two substrates constant when the color filter substrate 110 and the TFT substrate as the counter substrate are bonded together.
- PS may also be provided in the non-display area 150 (PS provided in the non-display area 150 is hereinafter referred to as “dummy PS”).
- the dummy PS keeps the distance between the two substrates outside the display area 140 constant and stabilizes the cell gap (the gap between the cells containing the liquid crystal). To play an important role.
- PS (including dummy PS) is not arranged in all parts in the color filter substrate, and the dummy PS is partially formed so as not to interfere with contact with the TFT wiring or cutting out the substrate. There are areas that are not.
- the region where the dummy PS is not formed causes the substrate to bend when the color filter substrate and the TFT substrate are bonded together, and the stress at the time of bonding differs between the display region and its periphery. Therefore, the arrangement density, size, and height of the dummy PS are adjusted separately from the PS in the display area in accordance with the distribution of stress generated when the color filter substrate and the TFT substrate are bonded to each other.
- the dummy PSs are arranged at irregular pitches in the non-display area for the purpose of avoiding interference with an alance mark or the like necessary in the manufacturing process of the color filter substrate.
- the same pattern is repeatedly baked in the substrate transport direction, so the pattern shape and the pattern arrangement pitch cannot be switched in the middle.
- a plurality of color filters 110 are exposed on one substrate 120.
- a display region 140 and a portion sandwiched between display regions 140 arranged in the substrate transport direction are displayed. Do not expose with the same photomask. Therefore, as shown in FIG. 11, a blind shutter 139 that moves in synchronization with the substrate is provided to shield the area between the display areas 140. Thereby, in the non-display area 150, there is a problem that the dummy PS cannot be exposed in a portion along a side orthogonal to the substrate transport direction.
- an object of the present invention is to provide an exposure method capable of efficiently forming a dummy PS in a non-display area outside the display area of the color filter substrate using a small mask continuous exposure method.
- a rectangular display region having a pair of sides extending in a first direction and a pair of sides extending in a second direction orthogonal to the first direction, and each of the sides in the first direction are provided.
- the display area includes a pair of first non-display areas and a pair of second non-display areas along each of the sides in the second direction, and a plurality of colored pixels and a plurality of photospacers (PS) are provided in the display area.
- the present invention relates to a method for exposing a color filter substrate in which a plurality of dummy photospacers (dummy PS) are provided in first and second non-display areas.
- exposure is intermittently performed a plurality of times while a substrate coated with a photoresist is conveyed in a first direction, and a first dummy PS is formed in a first non-display area.
- the step of forming the first layer and the step of forming the second layer are performed in an arbitrary order.
- the first layer and the second layer are formed of a material different from the material for forming the colored pixels.
- a substrate coated with a first color photoresist is intermittently exposed a plurality of times while being conveyed in a first direction, and a first region is exposed in the display area.
- a colored pixel of one color is formed, and a first layer constituting the first dummy PS is formed of the same material as that of the colored pixel of the first color in the first non-display area.
- performing a plurality of exposures intermittently while transporting the substrate coated with the second color photoresist in the second direction to form colored pixels of the second color in the display area.
- a step of intermittently performing a plurality of exposures to form colored pixels of the third color in the display area, and a single exposure to the substrate coated with the photoresist, and in the first non-display area Forming a third layer constituting the first dummy PS on the first layer, and a fourth layer constituting the second dummy PS on the second layer in the second non-display area Forming a step.
- the step of forming the colored pixel of the first color and the first layer, the step of forming the colored pixel of the second color and the second layer, and the step of forming the colored pixel of the third color are optional.
- the third and fourth layers are formed of a material different from the material forming the colored pixels.
- the present invention also provides a rectangular display region having a pair of sides extending in the first direction and a pair of sides extending in the second direction orthogonal to the first direction, and each of the sides in the first direction. And a pair of second non-display areas along each of the sides in the second direction.
- the color filter substrate according to the present invention includes a plurality of colored pixels provided in the display region, a plurality of photo spacers provided in the display region, and a material that forms the colored pixels formed in the first non-display region.
- a first dummy photospacer made of a first layer made of a material different from the first material and a second dummy photospacer formed in a second non-display region and made of a material different from the material forming the colored pixels.
- a second dummy photo spacer made of a layer.
- Another color filter substrate of the present invention includes a colored pixel formed in the display area, a photo spacer formed in the display area, a colored pixel of the first color provided in the first non-display area, A first dummy photo-spacer comprising a first layer formed of the same material and a third layer stacked on the first layer and formed of a material different from the colored pixel; A second layer provided in the display area and formed of the same material as the colored pixel of the second color; and a fourth layer stacked on the second layer and formed of a material different from the colored pixel; And a second dummy PS.
- the dummy PS can be exposed to the entire non-display area located outside the four sides of the display area of the color filter substrate by using the small mask continuous exposure method.
- FIG. 1 is a plan view showing a basic exposure method common to the embodiments of the present invention.
- FIG. 2 is a plan view showing an example of the arrangement of photomask openings common to the embodiments of the present invention.
- FIG. 3 is a plan view showing a basic exposure method common to the embodiments of the present invention.
- FIG. 4 is a plan view of a color filter common to the embodiments of the present invention.
- FIG. 5 is an enlarged view of a portion B shown in FIG.
- FIG. 6 is a cross-sectional view of the PS and dummy PS on the color filter substrate according to the first embodiment.
- FIG. 7 is a plan view showing the color filter substrate exposure method according to the first embodiment.
- FIG. 1 is a plan view showing a basic exposure method common to the embodiments of the present invention.
- FIG. 2 is a plan view showing an example of the arrangement of photomask openings common to the embodiments of the present invention.
- FIG. 3 is a plan view showing a basic exposure
- FIG. 8 is a cross-sectional view of PS and dummy PS on the color filter substrate according to the second embodiment.
- FIG. 9 is a plan view showing the color filter substrate exposure method according to the second embodiment.
- FIG. 10 is a plan view showing an exposure method by a small exposure mask continuous exposure method.
- FIG. 11 is a side view showing the positional relationship among the substrate, photomask, and blind shutter.
- FIG. 1 is a plan view showing a basic exposure method common to the embodiments of the present invention.
- FIG. 2 is a plan view showing the basic arrangement of photomask openings common to the embodiments of the present invention, and is an enlarged view of a portion A in FIG.
- the area indicated by the right-down hatching is a display area in which display pixels are arranged, and the area indicated by the right-up hatching is a first non-display area described later.
- the orientation of the substrate is specified using the X direction and the Y direction orthogonal to each other for convenience of explanation. Specifically, the X direction is a direction parallel to the opposing long side of the display area, and the Y direction is a direction parallel to the opposing short side of the display area (the same applies to the following drawings). ).
- the photomasks 30a to 30l are respectively mounted on a plurality of exposure heads and arranged in two rows aligned in the X direction. More specifically, photomasks 30a, 30c, 30e, 30g, 30i, and 30k are arranged at a predetermined interval on the first line (the side on which the substrate 20 is loaded), and the first line includes the first line. Photomasks 30b, 30d, 30f, 30h, 30j, and 30l are complementarily arranged corresponding to the space portions of the photomask.
- the photomasks 30a to 30l are provided with openings corresponding to a plurality of colored pixels and a plurality of PSs in the display region 40, and further to the left end of the photomask 30a, the right end of 30e, the left end of 30f, and 30k, Openings corresponding to a plurality of dummy PSs formed in a first non-display area 51 described later are provided.
- the photomask 30a is formed with openings 31 and 32 divided into two regions (not shown, but the same applies to the other photomasks 30b to 30l). Is). This is because two patterns can be formed with one photomask.
- the photomask is shifted up and down so that the aperture array 31 or 32 is selectively opposed to the light source, and the aperture array to be used is switched.
- the Y direction of the substrate 20 coincides with the transport direction with respect to the photomasks 30a to 30l arranged as shown in FIG. 1, and intermittently while transporting the substrate 20 at a predetermined speed.
- a plurality of exposures are performed, and colored pixels and PS are sequentially patterned on the display area 40 on the substrate 20, and a pair of areas (hereinafter referred to as “first non-display area”) along each of the Y-direction sides of the display area 40
- the dummy PS is sequentially patterned.
- the area between the display areas 40 adjacent in the substrate transport direction is shielded by using a blind shutter.
- FIG. 3 is a plan view showing a basic exposure method common to the embodiments of the present invention, and shows an exposure method performed in combination with the exposure method of FIG.
- a region indicated by right-down hatching is a display region
- a region indicated by right-up hatching is a second non-display region described later.
- the substrate 20 that has been exposed in the first non-display area 51 is rotated by 90 degrees from the state shown in FIG. 1, and the photomasks 30a to 30l are shown in FIG. Installed as shown (substrate transport direction coincides with substrate X direction).
- the arrangement 32 of the other openings provided in each of the photomasks 30a to 30l are provided with a plurality of colored pixels and a plurality of PS openings in the display region 40.
- the left end of the photomask 30a, the right end of 30c, the left end of 30d, Openings corresponding to the plurality of dummy PSs formed in the second non-display area 52 are provided at the right end, the left end of 30 g, the right end of 30 i, the left end of 30 j, and the right end of 30 l.
- the X direction of the substrate 20 is matched with the transport direction, and exposure is intermittently performed a plurality of times while the substrate 20 is transported at a predetermined speed, and the colored pixels and PS are sequentially displayed on the display region 40 on the substrate 20. Patterning is performed, and the dummy PS is sequentially patterned in a pair of regions (hereinafter referred to as “second non-display regions”) 52 along each of the sides in the X direction in the display region 40. In this process, the area between the display areas 40 adjacent in the substrate transport direction is shielded by using a blind shutter.
- the same color pixels in the display area 40 and the same color layer constituting the PS may be exposed by one scan in the X direction or the Y direction, or two scans in the X and Y directions. The exposure may be performed separately.
- FIG. 4 is a plan view of the color filter substrate after exposure
- FIG. 5 is an enlarged view of a portion B in FIG.
- the color filter substrate 10 after the small mask continuous exposure in the X and Y directions has colored pixels (not shown) and PS90 in the display area 40, and the first non-display area 51 and the second non-display area 51.
- the non-display area 52 has a plurality of dummy PSs 71 and 72.
- FIG. 6 is a cross-sectional view of a part of the color filter substrate according to the first embodiment. More specifically, FIG. 6A shows a portion along the line II and a line II-II in FIG. FIG. 3B is a cross-sectional view corresponding to a portion, and FIG. 5B is a cross-sectional view corresponding to a portion along line III-III in FIG.
- the dummy PS 71 is formed on the substrate 20 on which the black matrix 61 and the ITO film 63 are laminated.
- the first layer 81 or the second layer 82 constituting the dummy PS 72 is formed.
- a black matrix 61, a colored layer 62, and an ITO film 63 are laminated on the substrate 20.
- a layer 91 constituting the first PS 90 is formed on the ITO film 63 on the upper layer of the black matrix 61.
- the first layer 81 and the layer 91 are made of, for example, an insulating resin different from the colored layer that forms the colored pixel.
- FIG. 7 is a plan view showing the color filter substrate exposure method according to the first embodiment. For simplification of description, only a region corresponding to one color filter substrate is illustrated in the entire substrate surface. Further, the upward direction in FIG. 7 is the substrate transport direction.
- the black matrix 61 and the colored pixels 62 are formed on the substrate 20 using a known method, and the ITO film 63 is further formed so as to cover the black matrix 61 and the colored pixels 62. Further, a photoresist is applied on the substrate 20.
- the first region 81 is exposed to the first non-display region 51 (the region indicated by the right-up hatching) on the substrate 20 while the display region 40 ( The layer 91 is exposed in an area indicated by right-downward hatching.
- the substrate 20 is rotated by 90 degrees, and the second layer 82 is applied to the second non-display area 52 (area indicated by right-up hatching) while transporting the board 20 in the X direction shown in (b). Exposure.
- a dummy PS 71 composed of a single layer in the first non-display area 51 with a desired arrangement pitch and shape.
- a dummy PS 72 made of a single layer can be formed in the second non-display area 52.
- FIG. 8 is a cross-sectional view of PS and dummy PS on the color filter substrate according to the second embodiment. More specifically, (a) is a cross-sectional view corresponding to a portion along line II in FIG. 5, and (b) is a cross-sectional view corresponding to a portion along line II-II in FIG. (C) is a cross-sectional view corresponding to a portion taken along line III-III in FIG.
- the first layer 81 and the third layer 83 constituting the dummy PS 71 are formed on the substrate 20 on which the black matrix 61 is formed. And are formed.
- the second non-display area 52 as shown in (b)
- the second layer 82 and the fourth layer 84 constituting the dummy PS 72 are formed on the substrate 20 on which the black matrix 61 is formed. Is formed.
- a black matrix 61 and a colored layer 62 are laminated on the substrate 20.
- layers 91 to 93 constituting the PS 90 are laminated.
- the third layer 83, the fourth layer 84, and the layer 93 are formed of an insulating resin that is different from the colored layer constituting the colored pixel.
- FIG. 9 is a plan view showing a color filter substrate exposure method according to the second embodiment. Also in FIG. 9, the upward direction is the substrate transport direction.
- the black matrix 61 is formed on the substrate 20 using a known means. Further, a red photoresist is applied to the substrate 20, and a small mask continuous exposure is performed while the substrate 20 is being conveyed in the Y direction shown in (a), thereby forming a red colored layer 62 in the display region 40.
- the first layer 81 is formed in the first non-display area 51.
- a green photoresist is applied to the substrate 20, and small mask continuous exposure is performed while transporting the substrate 20 in the X direction shown in (b), so that the green colored pixels and the layer 91 are formed in the display region 40. Then, the second layer 82 is formed in the second non-display area 52.
- a blue photoresist is applied to the substrate 20, and small mask continuous exposure is performed while transporting the substrate 20 in the Y direction shown in (c), so that the blue colored pixels and the layer 92 are formed in the display region 40.
- small mask continuous exposure may be performed while transporting the substrate 20 in the X direction.
- an ITO film 63 is formed so as to cover the display area 40, the first non-display area 51, and the second non-display area 52.
- a photoresist made of an insulating resin is applied to the substrate 20, and the substrate 20 is exposed once as shown in (d), and the first layer 81 in the first non-display area 51 is exposed.
- the fourth layer 84 is formed on the second layer 82 in the second display area 52, and the layer 93 is formed on the layer 92 in the display area 40. .
- a small mask not a single photomask having a size corresponding to a single color filter substrate is used.
- the sub-PS is formed as a laminate of one layer made of the same material as the colored pixels of the first to third colors and one layer made of insulating resin, the first non-display The area, the second non-display area, and the display area can be exposed together. Further, by using a laminated structure, the dummy PS can be formed higher.
- the scan order of the substrate is specified in the X direction and the Y direction.
- the scan order of the substrate is in the X direction, the Y direction, and the X direction.
- the scan order is not limited to these.
- (a) and (b) in FIG. 7 may be performed in the reverse order.
- the PS in the display area is formed while forming the dummy PS in the non-display area.
- the present invention is not limited to this, and the PS is manufactured in a separate process. May be.
- the color and the order of formation of the colored layers are specified, but the color and the order of formation are not limited to the example of the second embodiment and are arbitrary.
- the present invention can be used, for example, in a method for exposing a color filter substrate used in a liquid crystal display device or an organic EL.
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Abstract
Description
図1は、本発明の各実施形態に共通する基本的な露光方法を示す平面図である。図2は、本発明の各実施形態に共通する基本的なフォトマスクの開口の配置を示す平面図であって、図1のA部分の拡大図である。図1において、右下がりのハッチングで示す領域は表示画素が配列される表示領域であり、右上がりのハッチングで示す領域は後述する第1の非表示領域である。また、以降の各図面においては、説明の便宜上、互いに直交するX方向及びY方向を用いて基板の向きを特定する。具体的には、X方向は、表示領域の対向する長辺に平行な方向であり、Y方向は、表示領域の対向するに短辺に平行な方向である(以下の図においても同様である)。
図6は、第1の実施形態に係るカラーフィルタ基板の一部の断面図であり、より特定的には、(a)は、図5のI-Iラインに沿う部分及びII―IIに沿う部分に相当する断面図であり、(b)は、図5のIII-IIIラインに沿う部分に相当する断面図である。
図8は、第2の実施形態に係るカラーフィルタ基板上のPS及びダミーPSの断面図である。より特定的には、(a)は、図5のI-Iラインに沿う部分に相当する断面図であり、(b)は、図5のII―IIに沿う部分に相当する断面図であり、(c)は、図5のIII-IIIラインに沿う部分に相当する断面図である。
20 基板
30 フォトマスク
31、32 開口の配列
40 表示領域
51 第1の非表示領域
52 第2の非表示領域
61 ブラックマトリクス
62 着色層
63 ITO膜
71、72 ダミーPS
81 第1のレイヤー
82 第2のレイヤー
83 第3のレイヤー
84 第4のレイヤー
90 PS
91~93 レイヤー
Claims (4)
- 第1の方向に延びる一対の辺と前記第1の方向と直交する第2の方向に延びる一対の辺とを有する矩形状の表示領域と、前記第1の方向の辺の各々に沿う一対の第1の非表示領域と、前記第2の方向の辺の各々に沿う一対の第2の非表示領域とを有し、前記表示領域に複数の着色画素及び複数のフォトスペーサー(PS)が設けられ、前記第1及び第2の非表示領域に複数のダミーフォトスペーサー(ダミーPS)が設けられるカラーフィルタ基板の露光方法であって、
フォトレジストを塗布した基板を前記第1の方向に搬送しながら、間欠的に複数回の露光を行い、前記第1の非表示領域に第1のダミーPSを構成する第1のレイヤーを形成する工程と、
フォトレジストを塗布した基板を前記第2の方向に搬送しながら、間欠的に複数回の露光を行い、前記第2の非表示領域に第2のダミーPSを構成する第2のレイヤーを形成する工程とを備え、
前記第1のレイヤーを形成する工程と、前記第2のレイヤーを形成する工程とを任意の順序で行い、
前記第1のレイヤーと前記第2のレイヤーとを、前記着色画素を形成する材料とは異なる材料により形成する、カラーフィルタ基板の露光方法。 - 第1の方向に延びる一対の辺と前記第1の方向と直交する第2の方向に延びる一対の辺とを有する矩形状の表示領域と、前記第1の方向の辺の各々に沿う一対の第1の非表示領域と、前記第2の方向の辺の各々に沿う一対の第2の非表示領域とを有し、前記表示領域に複数の着色画素及び複数のフォトスペーサー(PS)が設けられ、前記第1及び第2の非表示領域に複数のダミーフォトスペーサー(ダミーPS)が設けられるカラーフィルタ基板の露光方法であって、
第1の色のフォトレジストを塗布した基板を前記第1の方向に搬送しながら、間欠的に複数回の露光を行い、前記表示領域内に第1の色の着色画素を形成すると共に、前記第1の非表示領域内に前記第1の色の着色画素を形成する材料と同一材料からなり、第1のダミーPSを構成する第1のレイヤーを形成する工程と、
第2の色のフォトレジストを塗布した基板を前記第2の方向に搬送しながら、間欠的に複数回の露光を行い、前記表示領域内に第2の色の着色画素を形成すると共に、前記第2の非表示領域内に前記第2の色の着色画素を形成する材料と同一材料からなり、第2のダミーPSを構成する第2のレイヤーを形成する工程と、
第3の色のフォトレジストを塗布した基板を前記第1または前記第2の方向に搬送しながら、間欠的に複数回の露光を行い、前記表示領域に第3の色の着色画素を形成する工程と、
フォトレジストを塗布した基板に対して1回の露光を行い、前記第1の非表示領域内の第1のレイヤー上に前記第1のダミーPSを構成する第3のレイヤーを形成すると共に、前記第2の非表示領域内の第2のレイヤー上に前記第2のダミーPSを構成する第4のレイヤーを形成する工程とを備え、
前記第1の色の着色画素及び前記第1のレイヤーを形成する工程と、前記第2の色の着色画素及び前記第2のレイヤーを形成する工程と、前記第3の色の着色画素を形成する工程とを任意の順序で行い、
前記第3及び第4のレイヤーを、前記着色画素を形成する材料とは異なる材料により形成する、カラーフィルタ基板の露光方法。 - 第1の方向に延びる一対の辺と前記第1の方向と直交する第2の方向に延びる一対の辺とを有する矩形状の表示領域と、前記第1の方向の辺の各々に沿う一対の第1の非表示領域と、前記第2の方向の辺の各々に沿う一対の第2の非表示領域とを有するカラーフィルタ基板であって、
前記表示領域内に設けられる複数の着色画素と、
前記表示領域内に設けられる複数のフォトスペーサーと、
前記第1の非表示領域内に形成され、前記着色画素を形成する材料とは異なる材料から形成される第1のレイヤーからなる第1のダミーフォトスペーサーと、
前記第2の非表示領域内に形成され、前記着色画素を形成する材料とは異なる材料から形成される第2のレイヤーからなる第2のダミーフォトスペーサーとを備える、カラーフィルタ基板。 - 第1の方向に延びる一対の辺と前記第1の方向と直交する第2の方向に延びる一対の辺とを有する矩形状の表示領域と、前記第1の方向の辺の各々に沿う一対の第1の非表示領域と、前記第2の方向の辺の各々に沿う一対の第2の非表示領域とを有するカラーフィルタ基板であって、
前記表示領域内に形成される着色画素と、
前記表示領域内に形成されるフォトスペーサーと、
前記第1の非表示領域に設けられ、第1の色の前記着色画素と同一材料から形成される第1のレイヤーと、前記第1のレイヤー上に積層され、前記着色画素とは異なる材料から形成される第3のレイヤーとからなる第1のダミーフォトスペーサーと、
前記第2の非表示領域に設けられ、第2の色の前記着色画素と同一材料から形成される第2のレイヤーと、前記第2のレイヤー上に積層され、前記着色画素とは異なる材料から形成される第4のレイヤーとからなる第2のダミーPSとを備える、カラーフィルタ基板。
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TW201603249A (zh) * | 2014-07-14 | 2016-01-16 | 元太科技工業股份有限公司 | 電路保護結構與具有電路保護結構的顯示裝置 |
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US8908302B2 (en) | 2014-12-09 |
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