WO2011074987A1 - Structure de transistor à effet de champ - Google Patents

Structure de transistor à effet de champ Download PDF

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Publication number
WO2011074987A1
WO2011074987A1 PCT/NO2010/000467 NO2010000467W WO2011074987A1 WO 2011074987 A1 WO2011074987 A1 WO 2011074987A1 NO 2010000467 W NO2010000467 W NO 2010000467W WO 2011074987 A1 WO2011074987 A1 WO 2011074987A1
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layer
silicon carbide
layers
fin
gate
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PCT/NO2010/000467
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Muhammad Nawaz
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Universitetssenteret På Kjeller
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8213—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using SiC technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1606—Graphene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7781—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Definitions

  • the present invention generally relates to field effect transistor structures. DESCRIPTION OF RELATED ART AND BACKGROUND OF THE INVENTION
  • CMOS complementary metal-oxide-semiconductor
  • SOI silicon-cqa ⁇ insulator
  • CMOS complementary metal-oxide-semiconductor
  • the transistor switching delay, i.e., propagation delay, of a typical CMOS device is a function of the device load capacitance, the drain voltage, and the saturation currents for both the n- and p-channel devices, limit the maximum operating frequency for an integrated circuit device.
  • the n-MOS transistor behaves fairly faster than the p-MOS transistor.
  • CMOS devices This imbalance of electron and hole mobility in CMOS devices is further exacerbated for devices with strained silicon channels, since the strained silicon channel, i.e., process induced strain in Si and Si channel on relaxed SiGe type, does not enhance the hole mobility in the p-MOS transistor as much as it does in electron mobility in the n-MOS transistor.
  • the strained silicon channel i.e., process induced strain in Si and Si channel on relaxed SiGe type
  • CMOS devices Another common problem associated with conventional CMOS devices is the self heating effect. Self-heating caused by the conversion of electrical energy into thermal energy, increases the lattice temperature which influences the electron mobility, ionization and saturation velocity. The more heat generated in the active region of the device, the more influence on device performance will be. Devices operating at high drain voltage and current suffer from the reduction of carrier mobility and saturation velocity, resulting in reduction in the drain current and transconductance . Other severe problems such as increased electromigration and enhanced impact ionization because of increased device heating, affect the reliability of the devices. This problem is basically associated with difference in the thermal conductivities of Si, SiGe and Si0 2 for all standard CMOS technologies. For example, the thermal conductivity of bulk silicon is 150, compared to Sio.
  • CMOS complementary metal-oxide-semiconductor
  • Si based CMOS designs can therefore not fulfill the demand of different technological applications which require high performance, low power, and high temperature operation.
  • low power and high performance devices need superior transport properties while high temperature and high power application demand is only fulfilled with material having high breakdown strength and wide band gap.
  • analog application circuitry also needs material with superior transport properties.
  • Si is used in combination with SiGe for the design of high speed CMOS.
  • SiC silicon carbide
  • SiC silicon carbide
  • SiC exist in many forms with most common crystal polytypes such as 4H-SiC, 6H-SiC and 3C-SiC are found interesting from device application point of view.
  • the electron and hole mobility values of 4H-SiC lie around 950 and 120 cm2/V.sec.
  • Graphene is a member of the class of two-dimensional materials which consists of a hexagonal array of sp 2 -bonded carbon atoms, just like those found in bulk graphite.
  • Graphene is a one-atom- thick planar sheet of sp 2 -bonded carbon atoms that are densely- packed in a honeycomb crystal lattice where the carbon-carbon bond length in graphene is about 0.142 nm.
  • the intrinsic graphene is a semi-metal or zero-gap semiconductor. Excellent transport properties of few layers graphene on oxidized silicon wafers with reported mobilities between 3000 and 270002 cm 2 /V.s making it an ideal choice for nanoelectronic devices.
  • carrier mobilities on MOS structures have found to be 4780 and 4790 cm 2 /V.s for electrons and holes, respectively at an effective field of 0.4 MV/cm.
  • graphene mobility values are promising for CMOS electronics. Therefore, graphene can be used to make excellent transistors. Electrons in graphene also travel ballistically over sub-micron distances. As a result, graphene-based transistors can run at higher frequencies and more efficiently that the silicon transistors used today. Electron and hole mobility values lie very close to each other, which enables balanced CMOS chip with improved switching capability. Additionally, the mobility is nearly independent of temperature between 10 K and 10OK which implies that the dominant scattering mechanism is defect scattering.
  • Thermal conductivity of graphene is reported to be 4000-5000 W/m.K at room temperature. Combined with high thermal conductivity of SiC material, i.e., 400 W/m.K at 300K, the graphene integrated SiC based CMOS chip provides extra motivation for extended application range where thermal management is critical issue. interesting to note that the thermal conductivity of graphene is far superior to that of conventional silicon, i.e., 150 W/m.K at 300K. Compared to silicon or other III-V materials, graphene is extremely hard and transparent over wide spectral range and therefore well-suited as passivation layer for solar cell applications as well. A single layer or multi layer graphene growth on another material is well known in the art; see references 1-6 in the detailed description.
  • the most common technique of graphene fabrication is exfoliation of highly oriented pyrolytic graphite (HOPG) on to a Si0 2 film, a difficult process for device fabrication on the wafer scale.
  • Another technique is to grow graphene layers using chemical vapor deposition (CVD) using methane gas at temperature 1000-1200 °C on different substrates.
  • Yet another technique to produce graphene is through thermal decomposition of Sic or metal carbides at high temperature in ultra-high vacuum.
  • the graphene/SiC structure is favored over exfoliation, due to better reproducibility, a highly reliable interface, and commercially available high quality semi- insulating Sic wafers.
  • Epitaxial graphene on silicon carbide can be patterned using standard microelectronics methods .
  • US 2009/0020764A1 presents a general concept of graphene based transistors where the graphene layer is placed over silicon carbide substrate.
  • a manufacturing method is presented for discrete MOSFETs over silicon carbide substrate. Since silicon carbide exist in many polyforms, the type of silicon carbide substrate and its conductivity is not known since it is not disclosed. The application area of the embodiments is not targeted.
  • the source-drain implants are introduced before the gate oxide and gate metal process in all embodiments and inconsistency in the manufacturability also exists because of the absence of spacer layers around the gate material in the first and third embodiments.
  • the gate stack i.e., the gate dielectric and gate metal, and spacers are defined in the short trench region and extra angled halo implant is inserted between the source-drain region and channel region around the gate .
  • a main object of the present invention is to provide preferably a high speed field effect transistor structure which is capable of not only providing an increased electron mobility in n-MOS transistors but also an increased hole mobility in p-MOS transistors using the same semiconductor material on a silicon carbide substrate.
  • Another object of the present invention is to find an alternate technique for CMOS devices to minimize the thermal problems, i.e., self-heating, by employing an approach based on the combined use of graphene and SiC materials .
  • Yet another object of the invention is to provide a field effect transistor structure which is also well-suited for high power and high temperature CMOS applications (> 100 °C) .
  • a field effect transistor structure which comprises a first layer of undoped silicon carbide on or above the 4H-SiC substrate, a second layer of silicon carbide on or above the first layer of silicon carbide, wherein the second layer of silicon carbide has different conductivity than the first layer of silicon carbide, and a third layer of different material type than the first two layers of silicon carbide, preferably graphene, grown over the second layer of silicon carbide.
  • the second layer of silicon carbide is further divided into two portions of different conductivities, which are separated by insulating dielectric material, and the third layer is further divided into two portions of different conductivities, which are separated by the insulating dielectric material which is in direct contact with the third and the second layer.
  • CMOS chip By means of the present invention, a more balanced CMOS chip can be designed with improved speed performance using graphene as a channel material, which does possess approximately equal electron and hole mobilities.
  • Silicon carbide can be used as a subchannel layer and the complete transistor structure can be designed on the undoped silicon carbide substrate.
  • the two portions of the second layer are a left portion and a right portion, the left portion being p-type doped and the right portion being n-type doped, and the dopants are provided either by an implantation technique or by in-situ epitaxial growth technique.
  • the two portions of the third layer may be a left portion and a right portion, and the transistor structure may further comprise a pair of left and right gate dielectric layers which are directly contacting the left and right portions of third layer, and a pair of left and right gate metal layers which are directly contacting the left and right gate dielectric layers .
  • the transistor structure may comprise vertical LDD implants of two different dopant types wherein a first dopant type implant being of n-type is introduced in the left portions of the second and third layers in regions outside of the left gate dielectric and metal layers, and a second dopant type implant being of p-type is introduced in the right portions of the second and third layers in regions outside of the right gate dielectric and metal layers .
  • a field effect transistor structure which comprises a first layer of undoped silicon carbide on or above a 4H-SiC substrate, a second layer of silicon carbide on the first layer of silicon carbide, wherein the second layer has a fin structure and is of different conductivity than the first layer of silicon carbide, and a third layer of different material, preferably graphene, grown over the first two layers of silicon carbide.
  • the third layer is grown over the fin structure such that the third layer is in direct contact with the fin on each side of the fin and on top of the fin.
  • the second layer of silicon has a fin structure comprising two fins arranged side by side, and the third layer is grown over the fin structure such that the third layer is in direct contact with each of the two fins on each side of the fin and on top of the fin.
  • the current handling capability of devices can be further increased.
  • Several fins can simultaneously be etched fairly close to one another on undoped 4H-SiC substrate.
  • Fig. 1 displays schematically, in a cross-sectional view, a field effect transistor device according to an embodiment of the invention.
  • Fig. 2 displays schematically a CMOS manufacturing process flow for manufacturing the field effect transistor device of Fig. 1.
  • Figs. 3a-d display schematically, in cross-sectional views
  • Figs. 4a-e display schematically, in perspective views, a field effect transistor device according to an embodiment of the invention during its manufacture.
  • Figs. 5a-b display schematically, in perspective views, a field effect transistor device according to a further embodiment of the invention during its manufacture.
  • CMOS complementary metal-oxide-semiconductor
  • SiC silicon carbide
  • complete transistor structure can be designed on an undoped SiC substrate.
  • SiC and 3C-SiC substrate materials are possible to use in the present invention, only undoped 4H-SiC substrate will preferably be used as a substrate material.
  • the SiC material exist in many forms such as 3C-SiC, 4H-SiC and 6H-SiC where the material quality, epitaxy growth and process conditions and physical properties are different to each other.
  • Fig. 1 shows an exemplary embodiment of a simple CMOS structure with graphene as a channel layer 12, 13.
  • An undoped SiC layer 11 of 1-2 ⁇ is first grown on an undoped 4H-SiC substrate 10.
  • a thin layer of graphene 12 , 13 on SiC can be grown by many techniques such as molecular beam epitaxy, see reference 1, thermal decomposition of SiC or metal carbide at high temperature in ultra high vacuum environment. When annealed at elevated temperatures (1100-1400 °C) under vacuum, silicon carbide surfaces show a tendency towards graphitization. This process begins to appear around 1100 °C.
  • the layer structure 10, 11, 11a and lib may be grown in a single growth step. Threshold voltage adjustment is provided by suitable dopants in the channel and/or subchannel layer.
  • the dopants in the subchannel layer 11a, lib can in fact be introduced either during the epitaxy growth step of SiC or through external threshold voltage implants .
  • nitrogen (N) and phosphorus (P) is suitable for n type dopant in the concentration range 0.1-5 xlO 18 cm "3 while aluminum (Al) and boron (B) is well-suited for p-type dopant in the subchannel layer in the concentration range 0.1-5 xlO 18 cm "3 .
  • the conductivity of the subchannel layer 11a is p-type (with dopants Al or B) and conductivity of the subchannel layer lib is n-type (with dopants N or P) .
  • the dopants in the subchannel layer may preferably be introduced through an in-situ epitaxy step in order to keep better control of the epitaxy quality and simultaneously to avoid activation anneal process needed after implantation step.
  • the ion-implantation technique where the dose and energy of the ion implantation is controlled to get the required concentration profile and depth of the concentration.
  • this is the first step required on a blanket wafer to selectively introduce appropriate dopants in the epilayer over the substrate.
  • the threshold voltage may further be adjusted by workfunction of the gate material 16 and thickness of the gate dielectric material 15.
  • the device manufacturing starts first by depositing a thin layer (e.g., 50-100 nm) of insulating dielectric mask (Si 3 N 4 ) on an area where n-MOSFET and p-MOSFET devices are to be defined. This process first starts by patterning the area using lithographic technique using suitable resist as a mask. After patterning, the resist is removed while dielectric mask (Si 3 N 4 ) still covers the area of n- and p-MOSFET device areas. The area between them is then dry etched using plasma reactive ion etching technique which isolates the two devices to make CMOS logic. The area or space 14 between the two device areas is then filled by a suitable insulator or dielectric material such as Si0 2 or Si 3 N 4 .
  • a suitable insulator or dielectric material such as Si0 2 or Si 3 N 4 .
  • This filled dielectric material may or may not be the same type of the dielectric mask material.
  • the mask material is removed and the structure is then planarized before further processing. At this stage the base structure is ready for CMOS chip.
  • Another suitable dielectric material 15 is then grown on the graphene surface 12, 13 which isolates the gate metal from the graphene surface.
  • the dielectric material may be Si0 2 , Si 3 N 4 , SiON, Hf0 2 , or A1 2 0 3 where the properties and processing condition vary from one dielectric material to other dielectric material .
  • the gate dielectric material may be grown by atomic layer deposition (ALD) technique, thermal or plasma oxidation, thermal or plasma nitridation, plasma vapor deposition (PVD) and/or chemical vapor deposition (CVD) techniques. It is also possible to grow same or different gate dielectric material over the graphene surface for the two types of MOSFET devices.
  • the thickness of the gate dielectric material may be 1-20 nm and may either be the same or different over the two graphene layers 12, 13.
  • the gate dielectric material will be in contact with the top surface of the graphene layers 12, 13.
  • a polysilicon or metal layer 16 with required work function is then grown over the gate dielectric.
  • Ti or TiN or Al or Ti/Al is well-suited for metal gates on 4H-SiC.
  • One of the purposes of this material is to adjust the threshold voltage of the two MOSFET devices and may either be the same gate material or different for the two devices.
  • the thickness of the gate material 16 may be round 100- 200 nm.
  • LDD lightly doped drain
  • the dose and energy of the LDD implant is adjusted to get the required concentration profile on the surface area in the channel and subchannel regions .
  • This implant further increases the conductivity of surface areas around the gate region and hence decreases the series resistance of the device.
  • the gate region i.e. gate metal
  • the vertical implant is introduced over the wafer surface. It is important to note that the LDD implant should only appear on the exposed surface of the device (exterior surface of the gate region) and dopants should not be introduced or moved laterally underneath the gate area.
  • the dose and energy of this implant are of low to medium range in order to provide the improved conductivity in the shallow region around the gate electrode.
  • N or P is used for n- MOSFET devices and Al or B may be used for pMOSFET devices in the LDD implants .
  • the dopant concentration of this implant at the surface region may preferably be in the range 0.1-1 xlO 20 cm " 3 .
  • the dopants (and their conductivity) of the LDD implant will be of opposite type with respect to that of the optional threshold voltage implant or the dopants in the channel region.
  • n type dopants i.e. N or P
  • dopants in the threshold voltage implant will be of p-type (Al or B) for nMOSFET devices.
  • the LDD implant step should follow the dopant activation anneal step which may be performed at temperature between 1200-1700 °C for 50-100 seconds .
  • the spacer layers 17 may either be of Si0 2 or Si 3 N 4 material . Depending on the technology requirement , the spacer layers are laterally extended to few nanometers (50-200 nm) from the gate edge. This dielectric material in the spacer layer may be of the same type as (or different than) the material used earlier in the gate oxide layer 15. The thickness of the spacer layers 17 may be equal to the combined thickness of the gate metal and gate dielectric material .
  • the spacer layer process is performed by deposition of conformal dielectric layer using plasma enhanced chemical vapor deposition technique (PECVD) and etched using reactive ion etching technique.
  • PECVD plasma enhanced chemical vapor deposition technique
  • Source-drain implants are then provided to make source- drain region of the device.
  • the source-drain implant can be N (nitrogen) or P (phosphorous) for nMOSFET devices and Al (aluminum) or B (boron) for pMOSFET devices.
  • the dose and energy of this implant is higher than dose and energy of the LDD implant used earlier so as to provide higher dopant concentration in the source-drain regions.
  • the dopant concentration in the source-drain region may be in the range 0.1-1 xlO 21 cm "3 and preferable be higher than 1 xlO 19 cm "3 . Note that the dopants and their conductivity will be of the same type as the LDD implant for n- and pMOSFET devices used earlier in the process flow.
  • the dopants should only be introduced at the exposed surface of the device (i.e. the area not covered by the gate metal) and should not be laterally introduced in the channel region underneath the gate.
  • the source-drain implant step should follow the dopant activation anneal which may be performed at temperature between 1200-1700 °C for 50-100 seconds.
  • the source-drain metal contact layers 18 of any suitable metal are then deposited.
  • the devices are then annealed to make source-drain contact ohmic .
  • the source- drain contact metal may be Ni/Ti, Ni/Ti/Pt, Ni/Ti/Al of total thickness 800-1000 nm and annealed at 600-1100 °C where the annealing time may vary from 10 to 60 seconds.
  • Fig. 2 is an overview of the CMOS manufacturing process flow.
  • Figs. 3a-d and 4a-e shows another embodiment of present invention where multigate structure is provided.
  • Multigate Field effect transistors (MuGFETs) or FinFETs are devices where a double metal gate is placed around the fin sidewalls or a triple metal gate is placed around the thin fin sidewalls and top of the fin region, thus providing extra current handling capability.
  • the manufacturing process starts with the growth of undoped SiC layer 21 of 0.5-1.5 ⁇ thickness over an undoped 4H-SiC substrate 20. Over this, a thin layer of doped SiC 22 is grown, which will define the current conducting area of the device.
  • the dopants in the layer 22 may be p-type (e.g. Al or B) for n- MOSFET devices and n-type (N or P) for p-MOSFET devices. It is also possible to in-situ dope this layer using molecular beam epitaxy or dope it externally using ion implantation technique before the start of other manufacturing steps .
  • the dopant concentration may preferably be in the range 1 xlO 16 cm "3 to 1 xlO 18 cm “3 in the layer 22 and will be used to define the threshold voltage of the device.
  • a thin fin from the top layer 22 is first dry etched using reactive ion etching technique.
  • the fin definition process starts by first depositing a thin dielectric layer (lOOnm) of Si0 2 or Si 3 N 4 material .
  • the layer is then patterned using lithography technique and the dielectric is dry etched using resist as a mask over the place other than the fin area.
  • the resist is then removed and wafer is thoroughly cleaned.
  • the remaining SiC material is dry etched using reactive ion etching technique with dielectric material as a mask over the fin area.
  • the dielectric is finally removed before further processing.
  • a three-dimensional view of the fin structure is shown in Fig. 4a while a two-dimensional view is given in Fig. 3a.
  • the height (h) of the fin may be 50-200 nm and thickness (w) of the fin may be 50-100 nm. Note that the fin definition process must be well controlled since the fin width and height may have an impact on the performance of the devices (e.g. variation of threshold voltage) and its geometrical non uniformity may have an impact on the yield over the wafer.
  • a threshold voltage of the device is dependent on the fin thickness (w) , fin height (h) , dopants in the fin area and gate metal work function.
  • the total width of the device is defined as 2h + w.
  • a thin graphene layer 23 is then grown over the fin area by anyone of the mentioned techniques above.
  • a graphene layer 23 may only cover the fin or entire area of the undoped SiC substrate.
  • a gate dielectric is grown around the fin.
  • the gate dielectric 24 is deposited around the fin sidewalls and at top surface of the device.
  • the gate dielectric may be of Si0 2 , Si 3 N , Hf0 2 , or Al 2 0 3 material.
  • the thickness of the gate dielectric may be 1-20 nm.
  • the gate dielectric may preferably be thermally grown around the fin.
  • the gate dielectric is grown by atomic layer deposition (ALD) technique or may be deposited using plasma enhance'd chemical vapor deposition (PECVD) techniques. It is also possible to grow different thickness of the gate dielectric over top area of the fin and along the fin sidewalls. Those skilled in the art may also know that it is possible at this point to grow only gate oxide along the fin side walls and thus having only two conducting side gates while top surface of the fin may be non-conducting due to thick insulating oxide (i.e. 100-200 nm) sitting over it.
  • ALD atomic layer deposition
  • PECVD plasma enhance'd chemical vapor deposition
  • a polysilicon or gate metal 25 with required work function is then deposited at side walls and top surface of the fin. Since the gate is wrapping around the fin at top surface, and two sidewalls, the structure is therefore called as triple gate or multigate FET (MuGFET) or FinFET.
  • MoGFET multigate FET
  • the gate dielectric layer 24 and gate metal 25 are visible at top surface and along one side of the fin (Fig. 4b) . In fact, real device has gate dielectric and gate metal at other side of the fin (see Figs. 3c-d) as well.
  • the gate metal may be Al or TiN or Ti/Al or Ni/Ti/Al.
  • the thickness of the metal gate may be 100-200 nm. Although, it may be possible to deposit thicker gate metal .
  • an optional shallow LDD angled implant is performed around the gate region.
  • the LDD implant also is followed by an activation anneal as well which may be performed at temperature between 1200-1700 °C for 50-100 seconds.
  • the LDD implant may be N or P (nitrogen or phosphorus) for n-MOSFET devices and Al (aluminum) or B (boron) for p- MOSFET devices.
  • the dopant concentration of this implant at the surface region may preferably be in the range 0.1-1 xlO 20 cm “3 .
  • the dopants (and their conductivity) of the LDD implant will be of opposite type with respect to that of the optional threshold voltage implant or conductivity of the fin region.
  • n type dopants i.e., N or P
  • optional threshold voltage implant will be of p- type (Al or B) for nMOSFET devices.
  • the optional LDD implant may be provided vertically to the top surface of the fin or perpendicular to the fin sidewalls while covering region underneath the gate area by a suitable insulating mask. Dopants of the LDD implant should not move underneath the gate region.
  • a spacer layer 26 is then defined after the LDD implant.
  • a spacer layer 26 may have lateral width of 50-200 nm and thickness should be equal to the combined thickness of the gate stack (i.e. gate metal and gate dielectric) .
  • Spacer layers (shown in Figs 4c-e) may be of Si0 2 or Si 3 N 4 material system. Furthermore, the spacer layer may be of the same material like gate dielectric or of different material.
  • the spacer layers are defined on both sides of the gate (along z-axis) and also along both sides of the fin (along x-axis) .
  • the deposition method of the spacer layer is similar to the first embodiment.
  • the source-drain implant can be N (nitrogen) or P (phosphorus) for nMOSFET devices or Al (aluminum) or B (boron) for pMOSFET devices.
  • the source-drain implant is performed vertical to the device top surface and dopants should be of the same conductivity as the LDD implant.
  • the dose and energy of the source-drain implant should be higher than that of the LDD implant so as to provide required dopant concentration and junction depth.
  • the dopant concentration in the source-drain region may be in the range 0.1-1 xlO 21 cm "3 and preferable be higher than 1 xlO 19 cm "3 .
  • Source-drain contact metal may be Ti/Al annealed at 600-1100 °C where the annealing time may vary from 10 to 60 seconds. A complete three-dimensional view is given in Fig. 4e.
  • a multi fin structure can be realized to further increase the current handling capability of the device.
  • several fins can simultaneously be etched on undoped 4H-SiC substrate.
  • a gate dielectric along with a metal gate is placed covering the top surface and two side walls of the fins.
  • While the present invention deals with only MuGFETs or FinFETs, several modifications are possible to realize such type of design structures.
  • FinFETs can be provided using similar manufacturing method with 3, 4, 5, 6, 7, 8, 9, 10, and even more number of fins on the same 4H-SiC substrate. These fins may be of different width, of different height and may use different gate or source-drain material. These modifications are sometimes needed to optimize the performance of the structure to particular applications .
  • the scope of this invention therefore covers all such modifications using undoped 4H-SiC substrate along with combined SiC and graphene epitaxial materials .
  • the invention may be varied in a plurality of ways . Such variations are not to be regarded as a departure from the scope of the invention. All such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the appended claims .

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  • Manufacturing & Machinery (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)

Abstract

L'invention concerne une structure de transistor à effet de champ qui comprend une première couche (11) de carbure de silicium non dopé sur le ou au-dessus du substrat 4H-SiC (10), une deuxième couche (11a-b) de carbure de silicium sur ou au-dessus de la première couche de carbure de silicium, la deuxième couche de carbure de silicium possédant une conductivité différente de celle de la première couche de carbure de silicium, et une troisième couche (12, 13) d'un type de matière différent de celui des deux premières couches de carbure de silicium, de préférence du graphène, dont la croissance s'est déroulée sur la deuxième couche de carbure de silicium. La deuxième couche de carbure de silicium est encore divisée en deux parties (11a-b) de conductivités différentes, qui sont séparées par un matériau diélectrique isolant (14); et la troisième couche est encore divisée en deux parties (12, 13) de conductivités différentes, qui sont séparées par le matériau diélectrique isolant qui se trouve en contact direct avec la troisième et la deuxième couche.
PCT/NO2010/000467 2009-12-17 2010-12-16 Structure de transistor à effet de champ WO2011074987A1 (fr)

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WO2013122724A1 (fr) * 2012-02-13 2013-08-22 Tyco Electronics Corporation Procédé de fabrication de conducteurs électriques
JP2014524672A (ja) * 2011-08-23 2014-09-22 マイクロン テクノロジー， インク． 縦型トランジスタ素子、縦型トランジスタ素子のアレイを含む半導体素子構造体、および製造方法
GB2503847B (en) * 2011-04-18 2015-07-01 Ibm Graphene nanoribbons and carbon nanotubes fabricated from sic fins or nanowire templates
TWI587504B (zh) * 2015-11-26 2017-06-11 上海新昇半導體科技有限公司 雙通道ＦｉｎＦＥＴ元件及其製造方法
CN107578989A (zh) * 2017-09-13 2018-01-12 中国电子科技集团公司第十三研究所 N型SiC欧姆接触电极的制作方法
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CN108956742A (zh) * 2018-07-24 2018-12-07 中国电子科技集团公司第四十九研究所 一种石墨烯场效应晶体管阵列生物传感器及其制备方法和检测方法

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GB2503847B (en) * 2011-04-18 2015-07-01 Ibm Graphene nanoribbons and carbon nanotubes fabricated from sic fins or nanowire templates
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JP2014524672A (ja) * 2011-08-23 2014-09-22 マイクロン テクノロジー， インク． 縦型トランジスタ素子、縦型トランジスタ素子のアレイを含む半導体素子構造体、および製造方法
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WO2013049144A1 (fr) * 2011-09-27 2013-04-04 Georgia Tech Research Corporation Transistor au graphène
WO2013122724A1 (fr) * 2012-02-13 2013-08-22 Tyco Electronics Corporation Procédé de fabrication de conducteurs électriques
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TWI587504B (zh) * 2015-11-26 2017-06-11 上海新昇半導體科技有限公司 雙通道ＦｉｎＦＥＴ元件及其製造方法
DE102017103666A1 (de) 2017-02-22 2018-08-23 Infineon Technologies Ag Halbleitervorrichtung und Verfahren zu ihrer Fertigung
CN107578989A (zh) * 2017-09-13 2018-01-12 中国电子科技集团公司第十三研究所 N型SiC欧姆接触电极的制作方法
CN108956742A (zh) * 2018-07-24 2018-12-07 中国电子科技集团公司第四十九研究所 一种石墨烯场效应晶体管阵列生物传感器及其制备方法和检测方法
CN108956742B (zh) * 2018-07-24 2020-06-30 中国电子科技集团公司第四十九研究所 一种石墨烯场效应晶体管阵列生物传感器及其制备方法和检测方法

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