WO2011070853A1 - Modulateur spatial de lumière, système optique d'éclairage, appareil d'exposition et procédé de fabrication du dispositif - Google Patents

Modulateur spatial de lumière, système optique d'éclairage, appareil d'exposition et procédé de fabrication du dispositif Download PDF

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Publication number
WO2011070853A1
WO2011070853A1 PCT/JP2010/068246 JP2010068246W WO2011070853A1 WO 2011070853 A1 WO2011070853 A1 WO 2011070853A1 JP 2010068246 W JP2010068246 W JP 2010068246W WO 2011070853 A1 WO2011070853 A1 WO 2011070853A1
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Prior art keywords
spatial light
light modulator
mirror
optical system
drive source
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PCT/JP2010/068246
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English (en)
Japanese (ja)
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範夫 三宅
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株式会社ニコン
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets

Definitions

  • the present invention relates to a spatial light modulator, an illumination optical system, an exposure apparatus, and a device manufacturing method. More specifically, the present invention relates to a spatial light modulator suitable for an illumination optical system of an exposure apparatus for manufacturing a device such as a semiconductor element, an imaging element, a liquid crystal display element, and a thin film magnetic head in a lithography process. .
  • a light beam emitted from a light source is passed through a fly-eye lens as an optical integrator, and a secondary light source (generally an illumination pupil) as a substantial surface light source composed of a number of light sources.
  • a secondary light source generally an illumination pupil
  • a predetermined light intensity distribution the light intensity distribution in the illumination pupil is referred to as “pupil intensity distribution”.
  • the illumination pupil is a position where the illumination surface becomes the Fourier transform plane of the illumination pupil by the action of the optical system between the illumination pupil and the illumination surface (a mask or a wafer in the case of an exposure apparatus). Defined.
  • the light beam from the secondary light source is condensed by the condenser lens and then illuminates the mask on which a predetermined pattern is formed in a superimposed manner.
  • the light transmitted through the mask forms an image on the wafer via the projection optical system, and the mask pattern is projected and exposed (transferred) onto the wafer.
  • the pattern formed on the mask is highly integrated, and it is indispensable to obtain a uniform illumination distribution on the wafer in order to accurately transfer the fine pattern onto the wafer.
  • Patent Document 1 there has been proposed an illumination optical system capable of continuously changing the pupil intensity distribution (and thus the illumination condition) without using a zoom optical system.
  • a movable multi-mirror generally a spatial light modulator configured by a large number of minute mirror elements arranged in an array and whose tilt angle and tilt direction are individually driven and controlled.
  • the incident light beam is divided into minute units for each reflecting surface and deflected, thereby converting the cross section of the light beam into a desired shape or a desired size, thereby realizing a desired pupil intensity distribution.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a spatial light modulator capable of driving each mirror element accurately and stably. Another object of the present invention is to provide an illumination optical system capable of stably realizing desired illumination conditions using a spatial light modulator capable of accurately and stably driving each mirror element. To do. Also, an exposure apparatus capable of performing good exposure under appropriate illumination conditions realized according to the characteristics of the pattern to be transferred using an illumination optical system that stably realizes desired illumination conditions. The purpose is to provide.
  • a spatial light modulator that emits light by applying spatial modulation to incident light
  • a mirror element that reflects incident light
  • a base part An actuator that is provided between the base portion and the mirror element and changes a relative positional relationship between the base portion and the mirror element
  • the actuator includes a drive source member having electric field responsiveness, and a pair of electrodes arranged so as to sandwich the drive source member,
  • the drive source member includes a polymer material, and provides a spatial light modulator.
  • an illumination optical system comprising the spatial light modulator of the first aspect and illuminating a surface to be irradiated based on light from a light source.
  • an exposure apparatus comprising the spatial light modulator according to the first aspect and exposing a predetermined pattern onto a photosensitive substrate.
  • an exposure step of exposing the predetermined pattern to the photosensitive substrate Developing the photosensitive substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the photosensitive substrate; And a processing step of processing the surface of the photosensitive substrate through the mask layer.
  • the spatial light modulator employs a system in which each mirror element is individually driven using a plurality of stretchable actuators including a drive source member formed of a conductive material and having electric field response. is doing. Accordingly, each mirror element can be driven accurately and stably without causing deterioration in performance over time due to charging as in the case of the charge driving method in the prior art, and as a result, a desired pupil intensity distribution (and thus a desired pupil intensity distribution). Lighting conditions) can be realized stably.
  • the illumination optical system of the present invention it is possible to stably realize desired illumination conditions using a spatial light modulator that can accurately and stably drive each mirror element. Further, the exposure apparatus of the present invention uses the illumination optical system that stably realizes desired illumination conditions, and performs good exposure under appropriate illumination conditions realized according to the characteristics of the pattern to be transferred. Which can be done and thus a good device can be produced.
  • FIG. 1 shows schematically the structure of the exposure apparatus concerning embodiment of this invention. It is a figure which shows roughly the structure and effect
  • FIG. 1 is a drawing schematically showing a configuration of an exposure apparatus according to an embodiment of the present invention.
  • the Z axis is along the normal direction of the transfer surface (exposure surface) of the wafer W, which is a photosensitive substrate
  • the X axis is along the direction parallel to the paper surface of FIG.
  • the Y-axis is set along the direction perpendicular to the paper surface of FIG.
  • exposure light (illumination light) is supplied from a light source 1 to the exposure apparatus of the present embodiment.
  • the light source for example, an ArF excimer laser light source that supplies light with a wavelength of 193 nm, a KrF excimer laser light source that supplies light with a wavelength of 248 nm, or the like can be used.
  • the exposure apparatus of this embodiment supports an illumination optical system IL including a spatial light modulation unit 3, a mask stage MS that supports a mask M, a projection optical system PL, and a wafer W along the optical axis AX of the apparatus. Wafer stage WS.
  • the light from the light source 1 illuminates the mask M through the illumination optical system IL.
  • the light transmitted through the mask M forms an image of the pattern of the mask M on the wafer W via the projection optical system PL.
  • the illumination optical system IL that illuminates the pattern surface (illuminated surface) of the mask M based on the light from the light source 1 is a multipolar illumination (bipolar illumination, quadrupole illumination, etc.) Deformation illumination such as annular illumination or normal circular illumination is performed.
  • the illumination optical system IL includes, in order from the light source 1 side along the optical axis AX, a beam transmission unit 2, a spatial light modulation unit 3, a relay optical system 4, a fly eye lens (or micro fly eye lens) 5, and A condenser optical system 6, an illumination field stop (mask blind) 7, and an imaging optical system 8.
  • the spatial light modulation unit 3 forms a desired light intensity distribution (pupil intensity distribution) in the far field region (Fraunhofer diffraction region) based on the light from the light source 1 via the beam transmitting unit 2.
  • the configuration and operation of the spatial light modulation unit 3 will be described later.
  • the beam transmitter 2 guides the incident light beam from the light source 1 to the spatial light modulation unit 3 while converting the incident light beam into a light beam having an appropriate size and shape, and changes the position of the light beam incident on the spatial light modulation unit 3. And a function of actively correcting the angular variation.
  • the relay optical system 4 condenses the light from the spatial light modulation unit 3 and guides it to the fly-eye lens 5.
  • the fly-eye lens 5 is, for example, a wavefront division type optical integrator composed of a large number of densely arranged lens elements.
  • the fly-eye lens 5 divides the incident light beam into a wavefront and forms a secondary light source (substantial surface light source; pupil intensity distribution) composed of a large number of small light sources at the illumination pupil at or near the rear focal position.
  • the incident surface of the fly-eye lens 5 is disposed at or near the rear focal position of the relay optical system 4.
  • a cylindrical micro fly-eye lens can be used as the fly-eye lens 5, for example.
  • the configuration and operation of the cylindrical micro fly's eye lens are disclosed in, for example, US Pat. No. 6,913,373.
  • the secondary light source formed by the fly-eye lens 5 is used as a light source, and the mask M arranged on the irradiated surface of the illumination optical system IL is Koehler illuminated.
  • the position where the secondary light source is formed is optically conjugate with the position of the aperture stop AS of the projection optical system PL, and the formation surface of the secondary light source can be called the illumination pupil plane of the illumination optical system IL.
  • the irradiated surface (the surface on which the mask M is disposed or the surface on which the wafer W is disposed when the illumination optical system including the projection optical system PL is considered) is optical with respect to the illumination pupil plane.
  • a Fourier transform plane is used as a light source, and the mask M arranged on the irradiated surface of the illumination optical system IL is Koehler illuminated.
  • the pupil intensity distribution is a light intensity distribution (luminance distribution) on the illumination pupil plane of the illumination optical system IL or a plane optically conjugate with the illumination pupil plane.
  • the overall light intensity distribution formed on the entrance surface of the fly-eye lens 5 and the overall light intensity distribution (pupil intensity distribution) of the entire secondary light source Indicates a high correlation.
  • the light intensity distribution on the incident surface of the fly-eye lens 5 and the surface optically conjugate with the incident surface can also be referred to as a pupil intensity distribution.
  • the condenser optical system 6 condenses the light emitted from the fly-eye lens 5 and illuminates the illumination field stop 7 in a superimposed manner.
  • the light that has passed through the illumination field stop 7 forms an illumination region that is an image of the opening of the illumination field stop 7 in at least a part of the pattern formation region of the mask M via the imaging optical system 8.
  • the installation of the optical path bending mirror for bending the optical axis (and thus the optical path) is omitted, but the optical path bending mirror can be appropriately arranged in the illumination optical path as necessary. .
  • the mask M is placed on the mask stage MS along the XY plane (for example, the horizontal plane), and the wafer W is placed on the wafer stage WS along the XY plane.
  • the projection optical system PL forms an image of the pattern of the mask M on the transfer surface (exposure surface) of the wafer W based on the light from the illumination area formed on the pattern surface of the mask M by the illumination optical system IL. .
  • batch exposure or scan exposure is performed while the wafer stage WS is two-dimensionally driven and controlled in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL, and thus the wafer W is two-dimensionally driven and controlled.
  • the pattern of the mask M is sequentially exposed in each exposure region of the wafer W.
  • the spatial light modulation unit 3 includes a prism 21 made of an optical material such as fluorite, and a spatial light modulation unit disposed close to a side surface 21a parallel to the YZ plane of the prism 21.
  • Device 30 The optical material forming the prism 21 is not limited to fluorite, and may be quartz or other optical material according to the wavelength of light supplied from the light source 1 or the like.
  • the prism 21 has a form obtained by replacing one side surface of the rectangular parallelepiped (a side surface facing the side surface 21a where the spatial light modulator 30 is disposed in the vicinity) with side surfaces 21b and 21c recessed in a V shape. , Also called a K prism because of the cross-sectional shape along the XZ plane. Sides 21b and 21c of the prism 21 that are recessed in a V shape are defined by two planes P1 and P2 that intersect to form an obtuse angle. The two planes P1 and P2 are both orthogonal to the XZ plane and have a V shape along the XZ plane.
  • the inner surfaces of the two side surfaces 21b and 21c that are in contact with the tangent line (straight line extending in the Y direction) P3 between the two planes P1 and P2 function as the reflection surfaces R1 and R2. That is, the reflective surface R1 is located on the plane P1, the reflective surface R2 is located on the plane P2, and the angle formed by the reflective surfaces R1 and R2 is an obtuse angle. As an example, the angle between the reflecting surfaces R1 and R2 is 120 degrees, the angle between the incident surface IP of the prism 21 perpendicular to the optical axis AX and the reflecting surface R1 is 60 degrees, and the prism 21 perpendicular to the optical axis AX.
  • the angle formed by the exit surface OP and the reflective surface R2 can be 60 degrees.
  • the side surface 21a in which the spatial light modulator 30 is disposed close to the optical axis AX is parallel, and the reflection surface R1 is on the light source 1 side (upstream side of the exposure apparatus: left side in FIG. 2).
  • the reflecting surface R2 is located on the fly eye lens 5 side (downstream side of the exposure apparatus: right side in FIG. 2). More specifically, the reflecting surface R1 is obliquely arranged with respect to the optical axis AX, and the reflecting surface R2 is obliquely inclined with respect to the optical axis AX symmetrically with respect to the reflecting surface R1 with respect to a plane passing through the tangent line P3 and parallel to the XY plane. It is installed.
  • the side surface 21a of the prism 21 is an optical surface facing a surface (array surface) on which the plurality of mirror elements SE of the spatial light modulator 30 are arrayed.
  • the reflecting surface R1 of the prism 21 reflects the light incident through the incident surface IP toward the spatial light modulator 30.
  • the spatial light modulator 30 is disposed in the optical path between the reflecting surface R1 and the reflecting surface R2, and reflects the light incident through the reflecting surface R1.
  • the reflecting surface R2 of the prism 21 reflects the light incident through the spatial light modulator 30 and guides it to the relay optical system 4 through the exit surface OP.
  • FIG. 2 shows an example in which the prism 21 is integrally formed by one optical block, the prism 21 may be configured by using a plurality of optical blocks as will be described later.
  • the spatial light modulator 30 emits the light incident through the reflecting surface R1 after applying spatial modulation according to the incident position.
  • the spatial light modulator 30 includes a plurality of minute mirror elements (optical elements) SE arranged two-dimensionally.
  • the light beam L1 is the mirror element SEa of the plurality of mirror elements SE
  • the light beam L2 is the mirror element.
  • the light is incident on a mirror element SEb different from SEa.
  • the light beam L3 is incident on a mirror element SEc different from the mirror elements SEa and SEb
  • the light beam L4 is incident on a mirror element SEd different from the mirror elements SEa to SEc.
  • the mirror elements SEa to SEd give spatial modulations set according to their positions to the lights L1 to L4.
  • the spatial light modulation unit 3 in the reference state where the reflection surfaces of all the mirror elements SE of the spatial light modulator 30 are set parallel to the YZ plane, the light enters the reflection surface R1 along the direction parallel to the optical axis AX. After passing through the spatial light modulator 30, the light beam is configured to be reflected in the direction parallel to the optical axis AX by the reflecting surface R2.
  • the spatial light modulation unit 3 corresponds to the air conversion length from the incident surface IP of the prism 21 through the mirror elements SEa to SEd to the exit surface OP, and the incident surface IP when the prism 21 is not disposed in the optical path.
  • the air-converted length from the position to the position corresponding to the exit surface OP is configured to be equal.
  • the air conversion length is the optical path length in the optical system converted into the optical path length in the air with a refractive index of 1, and the air conversion length in the medium with the refractive index n is 1 / the optical path length. multiplied by n.
  • the array surface of the plurality of mirror elements SEa to SEd of the spatial light modulator 30 is disposed at or near the front focal position of the relay optical system 4.
  • the light reflected by the plurality of mirror elements SEa to SEd of the spatial light modulator 30 and given a predetermined angular distribution forms predetermined light intensity distributions SP1 to SP4 on the rear focal plane 4a of the relay optical system 4. . That is, the relay optical system 4 determines the angle that the plurality of mirror elements SEa to SEd of the spatial light modulator 30 gives to the emitted light on the surface 4a that is the far field region (Fraunhofer diffraction region) of the spatial light modulator 30. The position is converted.
  • the entrance surface of the fly-eye lens 5 is positioned at the rear focal plane 4a of the relay optical system 4. Therefore, the pupil intensity distribution formed on the illumination pupil immediately after the fly-eye lens 5 corresponds to the light intensity distributions SP1 to SP4 formed on the entrance surface of the fly-eye lens 5 by the spatial light modulator 30 and the relay optical system 4. Distribution.
  • the spatial light modulator 30 includes a large number of minute mirror elements SE arranged regularly and two-dimensionally along one plane, for example, with a planar reflecting surface on the top. Is a movable multi-mirror.
  • Each mirror element SE is movable, and the tilt of the reflecting surface, that is, the tilt angle and tilt direction of the reflecting surface are individually controlled according to a command from the main control system CR (not shown in FIG. 3).
  • Each mirror element SE can be rotated continuously or discretely by a desired rotation angle with two directions (Y direction and Z direction) that are parallel to the reflecting surface and orthogonal to each other as rotation axes. . That is, it is possible to two-dimensionally control the inclination of the reflection surface of each mirror element SE.
  • each mirror element SE When the reflection surface of each mirror element SE is rotated discretely, the rotation angle is set in a plurality of states (for example,..., -2.5 degrees, -2.0 degrees, ... 0 degrees, +0.5 degrees) ... +2.5 degrees,.
  • FIG. 3 shows a mirror element SE having a square outer shape
  • the outer shape of the mirror element SE is not limited to a square.
  • a shape that can be arranged so as to reduce the gap between the mirror elements SE (a shape that can be closely packed) is preferable. Further, from the viewpoint of light utilization efficiency, it is preferable to minimize the interval between two adjacent mirror elements SE.
  • the postures of the plurality of mirror elements SE are changed according to the control signal from the main control system CR, and each mirror element SE is set in a predetermined direction.
  • the light reflected by the plurality of mirror elements SE of the spatial light modulator 30 at a predetermined angle is transmitted through the relay optical system 4 to the rear focal position of the fly-eye lens 5 or an illumination pupil near the fly-eye lens 5.
  • Shape dipole shape, quadrupole shape, etc.
  • annular shape, circular shape, etc. are formed.
  • the relay optical system 4 and the fly-eye lens 5 are distributions that form a predetermined light intensity distribution in the illumination pupil of the illumination optical system IL based on the light that has passed through the spatial light modulator 30 in the spatial light modulation unit 3.
  • the forming optical system is configured. Further, another illumination pupil position optically conjugate with the rear focal position of the fly-eye lens 5 or the vicinity of the illumination pupil, that is, the pupil position of the imaging optical system 8 and the pupil position of the projection optical system PL (aperture stop AS). ), A pupil intensity distribution corresponding to the light intensity distribution immediately after the fly-eye lens 5 is also formed.
  • the exposure apparatus in order to transfer the pattern of the mask M onto the wafer W with high accuracy and faithfully, it is important to perform exposure under appropriate illumination conditions according to the pattern characteristics of the mask M, for example.
  • the spatial light modulation unit 3 including the spatial light modulator 30 in which the postures of the plurality of mirror elements SE individually change is used, the pupil intensity formed by the action of the spatial light modulator 30 is used.
  • the distribution can be freely and quickly changed, and various illumination conditions can be realized.
  • the spatial light modulator 30 of the present embodiment includes mirror elements 31 (31a, 31b, 31c: corresponding to SE in FIGS. 2 and 3) that reflect incident light, a base portion 32, Three actuators 33 provided between the base portion 32 and each mirror element 31 are provided.
  • mirror elements 31 31a, 31b, 31c: corresponding to SE in FIGS. 2 and 3
  • Three actuators 33 provided between the base portion 32 and each mirror element 31 are provided.
  • FIG. 4 for the sake of clarity of the drawing, one mirror element 31 and three actuators 33 provided corresponding thereto are shown.
  • a part of mirror element adjacent to the mirror element 31 shown in the top view is shown.
  • the mirror element 31 includes, for example, a mirror part 31a having a planar and square reflecting surface 31aa, a movable part 31b disposed on the opposite side of the reflecting surface 31aa of the mirror part 31a and connected to one end of the actuator 33, It has the connection member 31c which connects the movable part 31b and the mirror part 31a.
  • the mirror part 31a has a form of a plane parallel plate, for example.
  • the movable part 31b has, for example, a circular outer shape and a form of a plane parallel plate. When viewed along the normal direction (X direction) of the array plane (YZ plane) of the plurality of mirror elements 31, the mirror portion 31a is larger than the movable portion 31c.
  • the connecting member 31c is, for example, a rod-like member that fixedly connects the central portion of the mirror portion 31a and the central portion of the movable portion 31b.
  • the three actuators 33 are arranged, for example, at equiangular intervals along the circumferential direction of a circle around the center of the movable portion 31 b, and the other ends are connected to the base portion 32.
  • the base portion 32 is provided with a partition member 34 along the boundary line between two adjacent mirror elements 31.
  • the partition member 34 is not an essential component, and its installation can be omitted.
  • the actuator 33 includes a drive source member 33a having electric field responsiveness, a pair of electrodes 33b disposed so as to sandwich the drive source member 33a, and a drive source member connected to the pair of electrodes 33b. And a power source 33c for variably applying a voltage to 33a.
  • the drive source member 33a is made of only a conductive polymer material, for example.
  • the drive source member 33a contracts in the same direction as the electric field (vertical direction in FIG. 5) and expands in the direction perpendicular to the electric field (horizontal direction in FIG. 5). To do.
  • the actuator 33 can continuously change the expansion / contraction rate in the direction perpendicular to the electric field of the drive source member 33a (hereinafter referred to as “extension / contraction direction”) according to the magnitude of the applied voltage. Almost no current is needed to maintain the rate (and hence the constant shape).
  • the pair of electrodes 33b may be provided with stretchability according to the deformation characteristics when the voltage of the drive source member 33a is applied.
  • the drive source member 33a is made of only a conductive polymer material.
  • the drive source member 33a is not limited to this, and the drive source member can be formed of an appropriate conductor material including a polymer material.
  • the drive source member can be formed of a conductive material made of a polymer material, an ionic liquid, and a gel-like composition of carbon nanotubes. A technique using this type of gel composition as a conductor material for an actuator is disclosed in, for example, Japanese Patent No. 4038685.
  • the three stretchable actuators 33 are arranged so as to stretch and contract along the normal direction (X direction) of the array plane (YZ plane) of the plurality of mirror elements 31. That is, in each actuator 33, the drive source member 33a (not shown in FIG. 4) has a columnar shape (for example, a columnar shape, a prismatic shape, etc.) extending along the X direction, and a pair of electrodes 33b (in FIG. 4). (Not shown) is arranged around the drive source member 33a so as to face, for example, a direction orthogonal to the X direction (an arbitrary direction along the YZ plane).
  • the voltages applied to the three actuators 33 are individually changed in accordance with a command from the main control system CR.
  • the posture of the movable portion 31b can be controlled, and thus the posture of the mirror portion 31a having the reflecting surface 31aa can be controlled.
  • the three actuators 33 change the relative positional relationship between the base portion 32 and one mirror element 31.
  • each mirror element 31 is driven using the plurality of stretchable actuators 33 including the drive source member 33a formed of a conductive material and having electric field responsiveness.
  • the method to do is adopted. Therefore, each mirror element 31 can be driven accurately and stably without causing deterioration in performance over time due to charging unlike the charge driving method in the prior art, so that a desired pupil intensity distribution (and thus desired) Can be stably realized.
  • the illumination optical system IL of the present embodiment desired illumination conditions can be stably realized by using the spatial light modulator 30 capable of driving each mirror element 31 accurately and stably.
  • the illumination optical system IL that stably realizes desired illumination conditions is used and is appropriately realized according to the characteristics of the pattern to be transferred. Good exposure can be performed under various illumination conditions.
  • each stretchable actuator 33 is hidden by the movable portion 31b when viewed from the light incident side (X-axis direction side), and the plurality of mirror elements 31 When viewed along the normal direction (X direction) of the array surface (YZ plane), the mirror portion 31a is larger than the movable portion 31b, and therefore, each elastic actuator 33 is less likely to be exposed to light irradiation. . Therefore, each elastic actuator 33 is not easily deteriorated by light irradiation.
  • the pupil intensity distribution is formed using the spatial light modulator 30
  • the pupil intensity distribution is measured by the pupil intensity distribution measuring apparatus, and the spatial light modulation unit 3 in the spatial light modulation unit 3 is measured according to the measurement result.
  • the spatial light modulator 30 may be controlled.
  • Such a technique is disclosed in, for example, Japanese Patent Application Laid-Open No. 2006-54328, Japanese Patent Application Laid-Open No. 2003-22967, and US Patent Publication No. 2003/0038225 corresponding thereto.
  • the K prism 21 integrally formed with one optical block is used as the prism member having an optical surface facing the surface on which the plurality of mirror elements of the spatial light modulator 30 are arranged.
  • the present invention is not limited to this, and a prism member having a function similar to that of the K prism 21 can be configured by a pair of prisms.
  • a prism member having the same function as the K prism 21 can be configured by one plane-parallel plate and a pair of triangular prisms.
  • an assembly optical member having the same function as that of the K prism 21 can be constituted by one parallel plane plate and a pair of plane mirrors.
  • the present invention is described based on the spatial light modulator having the specific configuration shown in FIG.
  • various forms are possible for the specific configuration of the spatial light modulator, that is, the configuration, number, and arrangement of mirror elements, the number and arrangement of actuators provided corresponding to each mirror element, and the like.
  • the specific configuration of the spatial light modulator that is, the configuration, number, and arrangement of mirror elements, the number and arrangement of actuators provided corresponding to each mirror element, and the like.
  • FIG. 6 a configuration example in which the movable portion is formed by the annular first movable portion 31ba and the circular second movable portion 31bb is also possible.
  • the partition member 34 and other adjacent mirror elements are not shown for the sake of clarity.
  • the annular first movable portion 31ba is supported by the partition member 34 via a pair of support members 35 spaced in the Z direction, and a pair of supports. It is configured to be swingable about an axis connecting the members 35.
  • the circular second movable portion 31bb is supported by the annular first movable portion 31ba via a pair of support members 36 spaced apart in the Y direction, and can swing around an axis connecting the pair of support members 36. It is configured.
  • one end of a pair of actuators 33A spaced in the Z direction is connected to the circular second movable portion 31bb, and one end of the pair of actuators 33B spaced in the Y direction is an annular first movable portion 31ba. It is connected to.
  • the other end of the pair of actuators 33A and the other end of the pair of actuators 33B are connected to the base 32.
  • the four stretchable actuators 33A and 33B are disposed so as to stretch and contract along the normal direction (X direction) of the array plane (YZ plane) of the plurality of mirror elements 31.
  • the second around the axis connecting the pair of support members 36 (around the Y axis).
  • the attitude of the movable part 31bb can be controlled.
  • the first around the axis connecting the pair of support members 35 (around the Z axis). It is possible to control the attitude of the movable part 31ba and, in turn, the attitude of the second movable part 31bb around the axis connecting the pair of support members 35.
  • the posture of the second movable portion 31bb is controlled around two axes (around the Z axis and around the Y axis) by the action of the four stretchable actuators 33A and 33B, and consequently the posture of the mirror portion 31a having the reflecting surface 31aa. Controlled around two axes.
  • each stretchable actuator 33A is hidden by the first and second movable portions 31ba and 31bb when viewed from the light incident side (X-axis direction side). And, when viewed along the normal direction (X direction) of the array surface (YZ plane) of the plurality of mirror elements 31, the mirror portion 31a is larger than the first and second movable portions 31ba, 31bb, The possibility that each elastic actuator 33A is exposed to light irradiation is low. Therefore, each elastic actuator 33A is not easily deteriorated by light irradiation.
  • a plurality of actuators 33C and 33D are arranged so as to expand and contract along the in-plane direction (Y direction, Z direction, etc.) of the array plane (YZ plane) of the plurality of mirror elements 31. Examples are also possible.
  • the partition member 34 and other adjacent mirror elements are not shown for the sake of clarity.
  • a circular movable portion 31b having a relatively thick plane parallel plate shape is used.
  • One end of a pair of actuators 33C that are arranged at an interval in the X direction and extend and contract along the Z direction is connected to the end surface on the + Z direction side and the end surface on the ⁇ Z direction side of the movable portion 31b.
  • a pair of actuators 33D (not shown in the side view of FIG. 7) are arranged on the end surface on the + Y direction side and the end surface on the ⁇ Y direction side of the movable portion 31b and spaced apart in the X direction to expand and contract along the Y direction.
  • One end of each is connected.
  • the other end of each actuator 33C, 33D is connected to a corresponding partition member 34.
  • the posture of the movable portion 31b around the Y axis can be controlled by appropriately changing the voltages applied to the four actuators 33C and appropriately changing the expansion / contraction ratio of the four actuators 33C in the Z direction. Further, the posture of the movable portion 31b around the Z-axis can be controlled by appropriately changing the voltages applied to the four actuators 33D and appropriately changing the expansion / contraction rate in the Y direction of the four actuators 33D. That is, the posture of the movable portion 31b is controlled around two axes (around the Z axis and around the Y axis) by the action of the eight stretchable actuators 33C and 33D, and the orientation of the mirror portion 31a having the reflecting surface 31aa is biaxial. It is controlled around.
  • variable pattern forming apparatus that forms a predetermined pattern based on predetermined electronic data can be used instead of a mask.
  • a variable pattern forming apparatus for example, a DMD (digital micromirror device) including a plurality of reflecting elements driven based on predetermined electronic data can be used.
  • An exposure apparatus using DMD is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-304135, pamphlet of International Patent Publication No. 2006/080285 and US Patent Publication No. 2007/0296936 corresponding thereto.
  • a transmissive spatial light modulator may be used, or a self-luminous image display element may be used.
  • a transmissive spatial light modulator may be used, or a self-luminous image display element may be used.
  • the exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy.
  • the assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
  • the exposure apparatus may be manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
  • FIG. 8 is a flowchart showing a semiconductor device manufacturing process.
  • a metal film is vapor-deposited on a wafer W to be a substrate of the semiconductor device (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film.
  • Step S42 the pattern formed on the mask (reticle) M is transferred to each shot area on the wafer W (step S44: exposure process), and the wafer W after the transfer is completed.
  • Development that is, development of the photoresist to which the pattern has been transferred (step S46: development process).
  • step S48 processing step.
  • the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the pattern transferred by the projection exposure apparatus of the above-described embodiment is generated, and the recess penetrates the photoresist layer. It is.
  • the surface of the wafer W is processed through this resist pattern.
  • the processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like.
  • the projection exposure apparatus of the above-described embodiment performs pattern transfer using the wafer W coated with the photoresist as the photosensitive substrate, that is, the plate P.
  • FIG. 9 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element.
  • a pattern forming process step S50
  • a color filter forming process step S52
  • a cell assembling process step S54
  • a module assembling process step S56
  • a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with a photoresist as the plate P using the projection exposure apparatus of the above-described embodiment.
  • the pattern forming step includes an exposure step of transferring the pattern to the photoresist layer using the projection exposure apparatus of the above-described embodiment, and development of the plate P on which the pattern is transferred, that is, development of the photoresist layer on the glass substrate. And a developing step for generating a photoresist layer having a shape corresponding to the pattern, and a processing step for processing the surface of the glass substrate through the developed photoresist layer.
  • a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three R, G, and B
  • a color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction.
  • a liquid crystal panel liquid crystal cell
  • a liquid crystal panel is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52.
  • a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter.
  • various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.
  • the present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device, for example, an exposure apparatus for a display device such as a liquid crystal display element formed on a square glass plate or a plasma display, It can also be widely applied to an exposure apparatus for manufacturing various devices such as an image sensor (CCD or the like), a micromachine, a thin film magnetic head, and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.
  • an exposure apparatus for manufacturing a semiconductor device for example, an exposure apparatus for a display device such as a liquid crystal display element formed on a square glass plate or a plasma display
  • various devices such as an image sensor (CCD or the like), a micromachine, a thin film magnetic head, and a DNA chip.
  • the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask,
  • ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm) is used as the exposure light.
  • the present invention is not limited to this, and other appropriate laser light sources are used.
  • the present invention can also be applied to an F 2 laser light source that supplies laser light having a wavelength of 157 nm.
  • a so-called immersion method is applied in which the optical path between the projection optical system and the photosensitive substrate is filled with a medium (typically liquid) having a refractive index larger than 1.1. You may do it.
  • a technique for filling the liquid in the optical path between the projection optical system and the photosensitive substrate a technique for locally filling the liquid as disclosed in International Publication No. WO99 / 49504, a special technique, A method of moving a stage holding a substrate to be exposed as disclosed in Kaihei 6-124873 in a liquid tank, or a predetermined stage on a stage as disclosed in Japanese Patent Laid-Open No. 10-303114. A method of forming a liquid tank having a depth and holding the substrate therein can be employed.
  • the teachings of WO99 / 49504, JP-A-6-124873 and JP-A-10-303114 are incorporated by reference.
  • the present invention is applied to the illumination optical system that illuminates the mask in the exposure apparatus.
  • the present invention is not limited to this, and a general illumination surface other than the mask is illuminated.
  • the present invention can also be applied to an illumination optical system.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention porte sur un modulateur spatial de lumière qui peut commander chaque élément miroir de façon précise et stable. L'invention porte plus précisément sur un modulateur spatial de lumière qui module dans l'espace une lumière incidente et émet la lumière incidente modulée dans l'espace, ledit modulateur spatial de lumière étant pourvu d'un élément miroir qui réfléchit la lumière incidente, d'une partie de base et d'un actionneur qui est disposé entre la partie de base et l'élément miroir et qui fait varier la relation de position relative entre la partie de base et l'élément miroir. L'actionneur comporte un élément source de commande qui présente une capacité de réponse au champ électrique et une paire d'électrodes disposées de manière à encadrer entre elles l'élément source de commande. L'élément source de commande contient une matière polymère.
PCT/JP2010/068246 2009-12-10 2010-10-18 Modulateur spatial de lumière, système optique d'éclairage, appareil d'exposition et procédé de fabrication du dispositif WO2011070853A1 (fr)

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WO2020097468A1 (fr) * 2018-11-08 2020-05-14 Silicon Light Machines Corporation Modulateur spatial de lumière à grande étendue
WO2022052934A1 (fr) * 2020-09-08 2022-03-17 青岛海信激光显示股份有限公司 Dispositif de projection laser et procédé d'affichage par projection associé
CN114779464A (zh) * 2022-05-24 2022-07-22 北京有竹居网络技术有限公司 光学信号调制器、控制方法及投影设备

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TWI676856B (zh) * 2018-09-27 2019-11-11 明基電通股份有限公司 投影系統

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JP2002328315A (ja) * 2001-04-27 2002-11-15 Nec Corp ミラー駆動機構
JP2006043778A (ja) * 2003-07-22 2006-02-16 Ngk Insulators Ltd アクチュエータ装置
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Publication number Priority date Publication date Assignee Title
WO2020097468A1 (fr) * 2018-11-08 2020-05-14 Silicon Light Machines Corporation Modulateur spatial de lumière à grande étendue
WO2022052934A1 (fr) * 2020-09-08 2022-03-17 青岛海信激光显示股份有限公司 Dispositif de projection laser et procédé d'affichage par projection associé
CN114779464A (zh) * 2022-05-24 2022-07-22 北京有竹居网络技术有限公司 光学信号调制器、控制方法及投影设备

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