201137394 六、發明說明： 【發明戶斤屬之技術領域3 發明領域 本發明係有關於空間光調變器、照明光學系統、曝光 裝置、及裝置製造方法。更詳細言之，本發明係有關於一 種適合用以以微影製程製造半導體元件、拍攝元件、液晶 顯示元件、薄膜磁頭等裝置之曝光裝置之照明光學系統的 空間光調變器。 c先前技術；1 發明背景 在此種典型之曝光裝置中，從光源射出之光束藉由作 為光學積分器之複瞳孔透鏡，形成作為由許多光源構成之 實質面光源之二次光源（一般為照明瞳孔之預定光強度分 佈）。以下，將在照明瞳孔之光強度分佈稱為「瞳孔強度分 佈」。又，照明瞳孔係定義為以照明瞳孔與被照射面（為曝 光裝置時，為光罩或晶圓）間之光學系統之作用，被照射面 形成為照明瞳孔之傅立葉轉換面之位置。 來自二次光源之光束以聚光透鏡聚光後，將形成有預 定圖形之光罩重疊地照明。穿透光罩之光藉由投影光學系 統，成像於晶圓上，光罩圖形投影曝光(轉印）至晶圓上。形 成於光罩之圖形高積體化，要將此細微圖形準確地轉印至 晶圓上，在晶圓上取得均一之照明度分佈是不可獲缺的。 習知，已提出不使用變焦光學系統，而可將瞳孔強度 分佈（進而為照明條件）連續變更之照明光學系統（參照專利 201137394 文獻1)。在揭示於專利文獻1之照明光學系統中，使用以排 列成陣列狀，且傾斜角及傾斜方向個別地驅動控制之許多 微小鏡要件構成之可動多鏡（一般為空間光調變器），將入射 光束分割成各反射面之微小單位，使其偏向，藉此，將光 束之截面轉換成所期形狀或所期尺寸，進而實現了所期之 瞳孔強度分佈。 先行技術文獻 專利文獻 專利文獻1 曰本專利公開公報2002-353105號 【發明内容】 發明概要 發明欲解決之課題 在記載於專利文獻1之照明光學系統中，由於使用具有 姿勢可個別控制之許多微小鏡要件之空間光調變器，故關 於瞳孔強度分佈之形狀及尺寸之變更的自由度高。然而， 記載於專利文獻1之空間光調變器中，由於採用使各鏡要件 帶電荷，以電性斥力驅動之帶電驅動方式，故因帶電引起 之隨時間變化之性能惡化，不易準確且穩定地驅動各鏡要 件，而不易實現所期之瞳孔強度分佈（進而為所期之照明條 件）。 本發明即係鑑於前述課題而發明者，其目的係提供可 準確且穩定地驅動各鏡要件之空間光調變器。又，本發明 目的係提供使用可進行各鏡要件之準確且穩定之驅動的空 201137394 間光調變器，而可穩定地實現所期之照明條件之照明光學 系統。又，本發明目的係提供使用穩定地實現所期照明條 件之照明光學系統，而可在按要轉印之圖形之特性而實現 之適當照明條件下，進行完善之曝光的曝光裝置。 用以欲解決課題之手段 為解決前述課題，在本發明之第1形態，提供一種空間 光調變器，其係對入射光施予空間上之調變後將之射出 者，其特徵在於該空間光調變器包含有反射入射光之鏡要 件、基底部、及設於前述基底部與前述鏡要件間，以使前 述基底部與前述鏡要件之相對位置關係變化之致動器； 又，前述致動器具有具電場回應性之驅動源構件及配置成 包夾該驅動源構件之一對電極，前述驅動源構件含有高分 子材料。 在本發明之第2形態提供一種照明光學系統，其特徵在 於包含有第1形態之空間光調變器，並依據光源之光，照明 被照射面。 在本發明之第3形態提供一種曝光裝置，其特徵在於包 含有第1形態之空間光調變器，將預定之圖形曝光至感光性 基板。 在本發明之第4形態提供一種裝置製造方法，其特徵在 於該裝置製造方法具有曝光製程、顯示製程及加工製程， 該曝光製程係使用第3形態之曝光裝置，將前述預定圖形曝 光至前述感光性基板者；該顯像製程係將已轉印前述預定 圖形之前述感光性基板顯像，以將對應於前述預定圖形之 201137394 形狀之光罩層形成於前述感光性基板表面者；該加工製程 係藉由前述光罩層，將前述感光性基板表面加工者。 發明效果 在根據本發明一態樣之空間光調變器中，採用了下述 方式，該方式係使用具有以導電性材料形成，而具有電場 回應性之驅動源構件之複數個伸縮性致動器，將各鏡要件 個別驅動者。因而，不致如習知技術之帶電驅動方式般， 引致帶電引起之隨時間變化之性能惡化，而可準確且穩定 地驅動各鏡要件，進而，可穩定地實現所期之瞳孔強度分 佈（進而為所期之照明條件）。 結果，在本發明之照明光學系統中，使用可進行各鏡 要件之準確且穩定之驅動的空間光調變器，而可穩定地實 現所期之照明條件。又，在本發明之曝光裝置中，使用穩 定地實現所期照明條件之照明光學系統，而可在按要轉印 之圖形之特性而實現之適當照明條件下，進行完善之曝 光，進而，可製造優良之裝置。 圖式簡單說明 第1圖係概略地顯示本發明實施形態之曝光裝置結構 之圖。 第2圖係概略地顯示空間光調變單元之結構及作用之 圖。 第3圖係空間光調變單元中之空間光調變器之部份立 體圖。 第4圖係概略地顯示本實施形態空間光調變器之主要 201137394 部份結構之圖。 第5圖係說明驅動鏡要件之致動器之作動原理的圖 第6圖係概略地顯示第丨變形例空間光調變器之主要部 份結構之圖。 ° 第7圖係概略地顯示第2變形例空間光調變器之主要部 份結構之圖。 第8圖係顯示半導體裝置之製造製程之流程圖。 第9圖係顯示液晶顯示元件等液晶裝置之製造製程之 流程圖。 I：實施方式3 用以實施發明之形態 依據附加圖式，說明本發明之實施形態。第丨圖係概略 地顯示本發明實施形態之曝光裝置結構之圖。在第丨圖中， 沿著為感光性基板之晶圓W之轉印面（曝光面）的法線方向 設定Z軸，在晶圓W之轉印面内沿著與第丨圖之紙面平行之 方向設定X軸，在晶圓W之轉印面内，沿著與第丨圖之紙面 垂直之方向設定Y軸。 參照第1圖，在本發明之曝光裝置，可從光源i供給曝 光光（照明光）。光源1可使用供給193nm之波長之光的ArF 準分子雷射光源或供給248nm波長之光之KrF準分子雷射 光源等。本實施形態之曝光裝置沿著裝置之光軸X包含有具 有空間光調變單元3之照明光學系統〗L、支撐光罩μ之光罩 台MS、投影光學系統PL、支撐晶圓w之晶圓台WS。 來自光源1之光藉由照明光學系統照明光罩Μ。穿透光 7 201137394 罩Μ之光藉由投影光學系統PL ’將光罩Μ之圖形之像形成 於晶圓W上。依據光源1之光照明光罩Μ之圖形面（被照射面） 之照明光學系統IL以空間光調變單元3之作用，進行複數極 照明（2極照明、4極照明等）、輪帶照明等變形照明或普通之 圓形照明。照明光學系統IL沿著光軸ΑΧ從光源1側依序具 有光束送光部2、空間光調變單元3、繼光光學系統4、複眼 透鏡（或微複眼透鏡)5、聚光光學系統6、照明視野闡（光罩 遮蔽物)7、成像光學系統8。 空間光調變單元3依據藉由光束送光部2之光源1之 光，於其遠視野區域（夫朗和斐繞射區域)形成所期之光強度 分佈（瞳孔強度分佈）。關於空間光調變單元3之結構及作用 後述之。光束送光部2具有下述功能，該功能係一面將光源 1之入射光束轉換成具適當尺寸及形狀之截面的光束，一面 將之導引至空間光調變單元3，並且將入射至空間光調變單 元3之光束之位置變動及角度變動修正成主動者。繼光光學 系統4係將空間光調變單元3之光聚集，將之引導至複眼透 鏡5。 複眼透鏡5係由稠密地排列之許多透鏡元件構成之波 面分割型光學積分器。複眼透鏡5將所入射之光束進行波面 分割’以於其後側焦點位置或其附近之照明瞳孔形成由許 多小光源構成之二次光源(實質之面光源；瞳孔強度分佈）。 複眼透鏡5之入射面配置於繼光光學系統4之後側焦點位置 或其附近。複目艮逯鏡5可使用圓柱形微複眼透鏡。圓柱形微 複眼透鏡之結構及作用揭示於美國專利說明書第6913373 201137394 號。 在本實施形態中，將以複眼透鏡5形成之二次光源作為 光源，配置於照明光學系統広之被照射面之光罩Μ進行科 勒照明。因此’形成二次光源之位置與投影光學系統PL^ 孔徑光闌AS之位置在光學上共桃，而可將二次光源之形成 面稱為照明光學糸統IL之照明瞭孔面。典型為，相對於’’、、 明瞳孔面，被照射面（配置光罩Μ之面，或包含投影光學系 統PL在内，視為照明光學系統時，則為配置晶圓W之面）為 光學之傳立葉轉換面。 此外，瞳孔強度分佈係指照明光學系統IL之照明瞳孔 面或與該照明瞳孔面在光學上麸軛之面的光強度分佈（亮 度分佈）。當複眼透鏡5之波面分割數較大時，形成於複眼 透鏡5之入射面之一般情況的光強度分佈與二次光源全體 之一般情況之光強度分佈（瞳孔強度分佈）顯示高度相關。因 此，關於複眼透鏡5之入射面及與該入射面在光學上共軛之 面之光強度分佈亦可稱為曈孔強度分佈。 聚光光學系統6係將從複眼透鏡5射出之光t集 ·: 明視野闌7重疊地照明。通過照明視野闌7之光藉由成像光 1 < a ，部份形成為照 學系統8，於光罩Μ之圖形形成區域之至^ ，在第1圖中’ 明視野闌7之開口部之像的照明區域。此y * 祕从夕折鏡之設置，但 省略用以將光軸（進而為光程）綠折之九私 可依需要，將光程彎曲鏡適宣齡置於照明光紅中 於光罩台MS沿著XY平面（例如水平面）載置光罩M於 晶圓台祕著XY平面載口』w。投#學系統PL依據 201137394 以照明光學系統IL形成於光罩Μ之圖形面上之照明區域的 光，於晶圓W之轉印面（曝光面）上形成光罩Μ之圖形之像。 如此進行’在與投影光學系統PL之光軸ΑΧ垂直相交之平面 (ΧΥ平面）内，將晶圓台WS二維地驅動控制’ 一面進行將晶 圓二維地驅動控制，並且進行批次曝光或掃瞄曝光，藉此， 可將光罩Μ之圖形依序曝光至晶圓w之各曝光區域。 接著，參照第2圖及第3圖，說明空間光調變單元3之結 構及作用。如第2圖所示，空間光調變單元3具有以諸如螢 石之光學材料形成之稜鏡21、靠近稜鏡21之與ΥΖ平面平行 之側面21a而配置之空間光調變器3〇。形成稜鏡21之光學材 料不限於螢石，按光源1供給之光之波長等，可為石英，亦 可為其他光學材料。 稜鏡21具有藉將長方體之1個側面（與靠近空間光調變 器3 0而配置之側面21 a相對之側面）與凹成V字形之側面21 b 及21c置換而得之形態，因沿著χζ平面之截面形狀，亦稱為 K梭鏡。棱鏡21之凹成V字形之側面21b及21c以交又成構成 鈍角之2個平面P1及P2規定。2個平面P1及P2皆與χζ平面垂 直相交，沿著XZ平面呈V字形。 在2個平面P1及P2之切線(於γ方向延伸之直線)p3接觸 之2個侧面21b及21c之内面具有作為反射面R1&R2之功 能。即，反射面R1位於平面P1上，反射面R2位於平面p2上， 反射面R1與R2構成之角度為純角。一例係可令反射面r 1與 R2構成之角度為120度，令與光軸αχ垂直之稜鏡21之入射 面P1與反射面R1構成之角度為60度，令與光軸AX垂直之稜 10 201137394 鏡21之射出面OP與反射面R2構成之角度為60度。 在稜鏡21，靠近空間光調變器30而配置之側面21a與光 軸AX平行，且反射面R1位於光源1側（曝光裝置之上游側： 第2圖中為左側），反射面R2位於複眼透鏡5側（曝光裝置之 下游側：第2圖中為右側）。進一步詳細言之，反射面R1相 對於光軸AX傾斜設置’反射面R2與反射面R1對通過切線P3 且與XY平行之面，對稱地相對於光軸AX傾斜設置。稜鏡 21之側面21a如後述，為與空間光調變器30之排列複數個鏡 要件SE之面（排列面）相對之光學面。 棱鏡21之反射面R1將藉由入射面IP入射之光朝空間光 調變器30反射。空間光調變器30配置於反射面R1與反射面 R2間之光程中’反射經過反射面R1而入射之光。稜鏡21之 反射面R2反射經由空間光調變器30入射之光，藉由射出面 OP，將之導引至繼光光學系統4。於第2圖顯示以1個光學塊 將棱鏡21—體形成之例，亦可如後述，使用複數個光學塊， 構成稜鏡21 ° 空間光調變器3〇對經由反射面IU而入射之光，施予按 照其入射位置之空間上之調變後射出。如第3圖所示，空間 光調變器30具有二維排列之複數個微小鏡要件（光學要 件)SE。為使說明及圖式顯示簡單呈現，而在第2圖及第3圖 顯示空間光調變器30具有4x4=16之鏡要件8£之結構例，實 際上，具有遠多於16個之許多鏡要件SE。201137394 VI. Description of the Invention: [Technical Field of Invention] 3 Field of the Invention The present invention relates to a spatial light modulator, an illumination optical system, an exposure apparatus, and a device manufacturing method. More specifically, the present invention relates to a spatial light modulator suitable for an illumination optical system for an exposure apparatus for manufacturing a semiconductor element, an imaging element, a liquid crystal display element, a thin film magnetic head or the like by a lithography process. c prior art; 1 BACKGROUND OF THE INVENTION In such a typical exposure apparatus, a light beam emitted from a light source is formed as a secondary light source (generally illuminated) as a substantial surface light source composed of a plurality of light sources by a boring lens as an optical integrator The predetermined light intensity distribution of the pupil). Hereinafter, the light intensity distribution of the illumination pupil is referred to as "pupil strength distribution". Further, the illumination pupil is defined as an optical system between the illumination pupil and the illuminated surface (in the case of an exposure device, a mask or a wafer), and the illuminated surface is formed as a position of the Fourier transition surface of the illumination pupil. The light beam from the secondary light source is condensed by the condensing lens, and the reticle forming the predetermined pattern is superimposedly illuminated. Light passing through the reticle is imaged onto the wafer by a projection optical system, and the reticle pattern is projected (transferred) onto the wafer. The pattern formed in the reticle is highly integrated, and it is indispensable to accurately transfer the fine pattern onto the wafer to obtain a uniform illuminance distribution on the wafer. Conventionally, an illumination optical system in which a pupil optical intensity distribution (and thus illumination conditions) can be continuously changed without using a zoom optical system has been proposed (refer to Patent 201137394 Document 1). In the illumination optical system disclosed in Patent Document 1, a movable multi-mirror (generally a spatial light modulator) configured by a plurality of micro-mirror elements that are arranged in an array and that are individually driven and controlled in a tilt angle and an oblique direction is used. The incident beam is divided into small units of the respective reflecting surfaces to be deflected, thereby converting the cross section of the beam into a desired shape or a desired size, thereby realizing the desired pupil strength distribution. OBJECTS OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION In the illumination optical system described in Patent Document 1, many small pieces that can be individually controlled by using a posture are used. The spatial light modulator of the mirror element has a high degree of freedom in changing the shape and size of the pupil strength distribution. However, in the spatial light modulator described in Patent Document 1, since the charging method is adopted in which the mirror elements are charged and driven by electrical repulsive force, the performance due to charging changes with time is deteriorated, and it is difficult to be accurate and stable. The driving of each mirror element is not easy to achieve the desired pupil strength distribution (and thus the expected lighting conditions). The present invention has been made in view of the above problems, and an object thereof is to provide a spatial light modulator capable of accurately and stably driving each mirror element. Further, the object of the present invention is to provide an illumination optical system which can stably realize the desired illumination conditions by using an air conditioner 201137394 optical modulator which can perform accurate and stable driving of each mirror element. Further, it is an object of the present invention to provide an exposure apparatus which can perform perfect exposure under appropriate lighting conditions which are realized under the characteristics of a pattern to be transferred, using an illumination optical system which stably realizes a desired illumination condition. In order to solve the above problems, a first aspect of the present invention provides a spatial light modulator which is characterized in that spatially modulated incident light is modulated and emitted. The spatial light modulator includes a mirror element for reflecting incident light, a base portion, and an actuator disposed between the base portion and the mirror element to change a relative positional relationship between the base portion and the mirror element; The actuator has a drive source member having an electric field responsiveness and a pair of electrodes disposed to sandwich the drive source member, and the drive source member contains a polymer material. According to a second aspect of the present invention, there is provided an illumination optical system comprising the spatial light modulator of the first aspect, wherein the illuminated surface is illuminated according to the light of the light source. According to a third aspect of the present invention, there is provided an exposure apparatus comprising the spatial light modulator of the first aspect, wherein the predetermined pattern is exposed to the photosensitive substrate. According to a fourth aspect of the present invention, a device manufacturing method includes an exposure process, a display process, and a processing process, wherein the exposure process exposes the predetermined pattern to the photosensitive light by using an exposure device of a third aspect. The developing process is to develop the photosensitive substrate on which the predetermined pattern has been transferred to form a photomask layer corresponding to the predetermined pattern of the 201137394 shape on the surface of the photosensitive substrate; The surface of the photosensitive substrate is processed by the photomask layer. Advantageous Effects of Invention In a spatial light modulator according to an aspect of the present invention, a method of using a plurality of stretchable actuators having a drive source member formed of a conductive material and having an electric field responsiveness is employed. The individual components of each mirror are driven. Therefore, as in the case of the charged driving method of the conventional technology, the performance deterioration caused by the charging is deteriorated, and the mirror elements can be driven accurately and stably, and the desired pupil strength distribution can be stably achieved (further The lighting conditions of the period). As a result, in the illumination optical system of the present invention, the spatial light modulator which can perform accurate and stable driving of the respective mirror elements can be used to stably achieve the desired lighting conditions. Further, in the exposure apparatus of the present invention, the illumination optical system which stably realizes the desired illumination condition is used, and the perfect exposure can be performed under appropriate illumination conditions realized by the characteristics of the pattern to be transferred, and further, Make an excellent device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. Fig. 2 is a view schematically showing the structure and function of the spatial light modulation unit. Figure 3 is a partial elevational view of a spatial light modulator in a spatial light modulation unit. Fig. 4 is a view schematically showing a part of the structure of the main 201137394 of the spatial light modulator of the present embodiment. Fig. 5 is a view showing the principle of operation of an actuator for driving a mirror element. Fig. 6 is a view schematically showing the configuration of a main portion of a spatial light modulator of a second modification. Fig. 7 is a view schematically showing the configuration of the main part of the spatial light modulator of the second modification. Fig. 8 is a flow chart showing a manufacturing process of a semiconductor device. Fig. 9 is a flow chart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. I: Embodiment 3 Mode for Carrying Out the Invention An embodiment of the present invention will be described based on an additional drawing. Fig. 1 is a view schematically showing the structure of an exposure apparatus according to an embodiment of the present invention. In the second diagram, the Z-axis is set along the normal direction of the transfer surface (exposure surface) of the wafer W of the photosensitive substrate, and is parallel to the plane of the first sheet in the transfer surface of the wafer W. The X-axis is set, and the Y-axis is set in the direction perpendicular to the paper surface of the first image in the transfer surface of the wafer W. Referring to Fig. 1, in the exposure apparatus of the present invention, exposure light (illumination light) can be supplied from the light source i. As the light source 1, an ArF excimer laser light source that supplies light of a wavelength of 193 nm or a KrF excimer laser light source that supplies light of a wavelength of 248 nm or the like can be used. The exposure apparatus of the present embodiment includes an illumination optical system L having a spatial light modulation unit 3, a mask table MS supporting the mask μ, a projection optical system PL, and a crystal supporting the wafer w along the optical axis X of the apparatus. Round table WS. Light from source 1 illuminates the mask by means of an illumination optics. Penetrating light 7 201137394 The light of the mask is formed on the wafer W by the projection optical system PL'. The illumination optical system IL according to the pattern surface (irradiated surface) of the light illumination mask 光源 of the light source 1 functions as the spatial light modulation unit 3, and performs complex pole illumination (2-pole illumination, 4-pole illumination, etc.), belt illumination, etc. Deformed lighting or ordinary circular lighting. The illumination optical system IL sequentially has a beam light transmitting portion 2, a spatial light modulation unit 3, a relay optical system 4, a fly-eye lens (or a micro fly-eye lens) 5, and a collecting optical system 6 along the optical axis 侧 from the light source 1 side. Illumination field of view (mask mask) 7, imaging optical system 8. The spatial light modulation unit 3 forms a desired light intensity distribution (pupil strength distribution) in its far field of view region (Fran and Fiji diffraction regions) in accordance with the light from the light source 1 of the light beam transmitting portion 2. The structure and function of the spatial light modulation unit 3 will be described later. The beam light-transmitting portion 2 has a function of converting an incident light beam of the light source 1 into a light beam having a cross section of an appropriate size and shape, guiding it to the spatial light modulation unit 3, and incident on the space. The positional change and the angular variation of the light beam of the light modulation unit 3 are corrected to be active. The optical optical system 4 collects the light of the spatial light modulation unit 3 and guides it to the compound eye lens 5. The fly-eye lens 5 is a wave-divided optical integrator composed of a plurality of lens elements densely arranged. The fly-eye lens 5 performs wavefront division of the incident light beam to form a secondary light source (substantial surface light source; pupil strength distribution) composed of a plurality of small light sources at or near the rear focus position. The incident surface of the fly-eye lens 5 is disposed at or near the rear focus position of the relay optical system 4. The bifurcated mirror 5 can use a cylindrical micro fly-eye lens. The structure and function of a cylindrical micro-eye lens is disclosed in U.S. Patent Specification No. 6913373 201137394. In the present embodiment, the secondary light source formed by the fly-eye lens 5 is used as a light source, and is placed in the mask of the illuminated surface of the illumination optical system Μ to perform Kohler illumination. Therefore, the position where the secondary light source is formed and the position of the projection optical system PL^ aperture stop AS are optically shared, and the formation surface of the secondary light source can be referred to as the illuminated aperture surface of the illumination optical system IL. Typically, the irradiated surface (the surface on which the mask is placed or the projection optical system PL is included as the illumination optical system is the surface on which the wafer W is disposed) is used for the '', the open pupil surface). Optical pass-through transition surface. Further, the pupil strength distribution refers to a light pupil intensity distribution (brightness distribution) of the illumination pupil plane of the illumination optical system IL or the surface of the illumination pupil surface on the optical bran yoke. When the number of divisions of the wavefront of the fly-eye lens 5 is large, the light intensity distribution generally formed on the incident surface of the fly-eye lens 5 is highly correlated with the light intensity distribution (pupil strength distribution) of the general case of the entire secondary light source. Therefore, the light intensity distribution of the incident surface of the fly-eye lens 5 and the optically conjugate surface of the incident surface may also be referred to as a pupil strength distribution. The collecting optical system 6 is a collection of light t emitted from the fly-eye lens 5: The bright field 阑 7 is illuminated in an overlapping manner. By illuminating the field of view 阑7 by the imaging light 1 < a , part is formed into the illumination system 8 , in the pattern forming area of the mask 至 to ^, in the first figure 'the opening of the bright field 阑 7 The illuminated area of the image. This y* secret is set from the eve mirror, but the occlusion of the optical axis (and hence the optical path) is folded. The optical path bending mirror is placed in the illumination light red in the mask. The stage MS mounts the reticle M along the XY plane (for example, a horizontal plane) on the wafer table to the XY plane carrier 』w. The projection system PL is based on 201137394. The illumination optical system IL is formed on the illumination area of the mask surface of the mask, and the image of the mask image is formed on the transfer surface (exposure surface) of the wafer W. In this way, 'on the plane perpendicular to the optical axis 投影 of the projection optical system PL (the pupil plane), the wafer table WS is two-dimensionally driven and controlled to perform two-dimensional driving control of the wafer, and batch exposure is performed. Or scanning the exposure, whereby the mask pattern can be sequentially exposed to each exposed area of the wafer w. Next, the structure and operation of the spatial light modulation unit 3 will be described with reference to Figs. 2 and 3 . As shown in Fig. 2, the spatial light modulation unit 3 has a diaphragm 21 formed of an optical material such as fluorite, and a spatial light modulator 3 disposed adjacent to the side surface 21a of the crucible 21 parallel to the pupil plane. The optical material forming the crucible 21 is not limited to fluorite, and may be quartz or other optical material depending on the wavelength of light supplied from the light source 1. The crucible 21 has a form in which one side surface of the rectangular parallelepiped (the side surface opposite to the side surface 21 a disposed adjacent to the spatial light modulator 30) and the side surfaces 21 b and 21 c recessed in a V shape are replaced by the edge The cross-sectional shape of the χζ plane, also known as the K shuttle mirror. The side faces 21b and 21c of the prism 21 which are recessed into a V shape are defined by two planes P1 and P2 which are formed to form an obtuse angle. Both planes P1 and P2 intersect perpendicularly to the pupil plane and are V-shaped along the XZ plane. The inner faces of the two side faces 21b and 21c which are in contact with the tangent of the two planes P1 and P2 (the straight line extending in the γ direction) p3 have the function as the reflecting faces R1 & R2. That is, the reflecting surface R1 is located on the plane P1, the reflecting surface R2 is located on the plane p2, and the angle formed by the reflecting surfaces R1 and R2 is a pure angle. For example, the angle formed by the reflecting surfaces r 1 and R2 is 120 degrees, and the angle between the incident surface P1 and the reflecting surface R1 perpendicular to the optical axis α 为 is 60 degrees, and the edge perpendicular to the optical axis AX is formed. 10 201137394 The angle between the exit surface OP of the mirror 21 and the reflecting surface R2 is 60 degrees. In the crucible 21, the side surface 21a disposed close to the spatial light modulator 30 is parallel to the optical axis AX, and the reflection surface R1 is located on the light source 1 side (the upstream side of the exposure apparatus: the left side in FIG. 2), and the reflection surface R2 is located The side of the fly-eye lens 5 (the downstream side of the exposure device: the right side in Fig. 2). More specifically, the reflecting surface R1 is obliquely disposed with respect to the optical axis AX. The reflecting surface R2 and the reflecting surface R1 are obliquely disposed symmetrically with respect to the optical axis AX with respect to the plane passing through the tangent P3 and parallel to XY. The side surface 21a of the 稜鏡 21 is an optical surface opposed to the surface (arrangement surface) of the plurality of mirror elements SE of the spatial light modulator 30 as will be described later. The reflecting surface R1 of the prism 21 reflects the light incident on the incident surface IP toward the spatial light modulator 30. The spatial light modulator 30 is disposed in the optical path between the reflecting surface R1 and the reflecting surface R2 and reflects light incident on the reflecting surface R1. The reflecting surface R2 of the crucible 21 reflects the light incident through the spatial light modulator 30, and guides it to the relay optical system 4 by the emitting surface OP. FIG. 2 shows an example in which the prism 21 is formed by one optical block. Alternatively, as will be described later, a plurality of optical blocks are used to form a °21° spatial light modulator 3, which is incident on the reflecting surface IU. The light is applied in accordance with the spatial modulation of its incident position and then emitted. As shown in Fig. 3, the spatial light modulator 30 has a plurality of micro mirror elements (optical elements) SE arranged in two dimensions. In order to simplify the description and the graphical display, in the second and third figures, the spatial light modulator 30 has a configuration example of a mirror element 8 of 4x4=16, in fact, there are many more than 16 Mirror element SE.
參照第2圖，沿著與光軸AX平行之方向，人射至空間 光調變單元3之減群巾，級u入射至減個鏡要：SE 201137394 中之鏡要件SEa，光射L2入射至與鏡要件SEa不同之鏡要件 SEb。同樣地’光線L3入射至與鏡要件犯&、8现不同之鏡 要件SEc，光線L4入射至與鏡要件SEa〜SEc不同之鏡要件 SEd。鏡要件SEa~SEd對光L1〜L4施予按其位置設定之空間 上之調變。 在空間光調變單元3中，構造成在空間光調變器3之所 有鏡要件SE之反射面設定成與YZ平面平行之基準狀態，沿 著與光軸AX平行之方向入射至反射面之光線經過空間光 調變器30後，以反射面R2朝與光軸AX平行之方向反射。 又’空間光調變單元3構造成從稜鏡21之入射面IP經過鏡要 件SEa〜SEd至射出面OP之空氣換算長度與從相當於稜鏡21 未配設於光程中時之入射面IP之位置至相當於射出面OP之 位置之空氣換算長度相等。在此’空間換算長度係指將光 學系統中之光程長度換算成折射率1之空氣中之光程長度 者，折射率η之介質中之空氣換算長度係於其光程長度乘上 1/η 者》 空間光調變器30之鏡要件SEa〜SEd之排列面配置於繼 光光學系統4之前側焦點位置或其附近。以空間光調變器3 0 之複數個鏡要件SEa〜SEd反射’而施予了預定角度分佈之 光於繼光光學系統4之後側焦點面4a形成預定光強度分佈 SP1〜SP4。即，繼光光學系統4將空間光調變器30之複數個 鏡要件SEa〜SEd對射出光施予之角度轉換成在為空間光調 變器之遠視野區域（夫朗和斐繞射區域）之面4a上的位置。 再參照第1圖，複眼透鏡5之入射面定位於繼光光學系 12 201137394 統4之後側焦點面4a之位置。因而，形成於複眼透鏡5之正 後方之照明瞳孔之瞳孔強度分佈形成為對應於空間光調變 器30及繼光光學系統4形成於複眼透鏡5之入射面之光強度 分佈SP1〜SP4的分佈。空間光調變器30如第3圖所示，係包 含有在以平面形狀之反射面為上面之狀態下，沿著1個平面 有規則且以二維排列之許多微小鏡要件SE之可動多鏡。 各鏡要件SE為可動，其反射面之傾斜、即，反射面之 傾斜角及傾斜方向可根據主控制系統CR(在第3圖未顯示） 之指令，個別地控制。各鏡要件SE以為與其反射面平行之 二方向’且相互垂直相交之二方向（γ方向及Z方向）為旋轉 軸，連續或離散地旋轉所期旋轉角度。即，可以二維控制 各鏡要件SE之反射面之傾斜。 使各鏡要件SE之反射面離散旋轉時，宜將旋轉角以複 數個狀態（例如.....2.5度、-2.0度、…〇度、+0.5度…+2.5 度、…）切換控制。於第3圖顯示外形為正方形之鏡要件SE， 鏡要件SE之外形形狀不限正方形。惟，從光利用效率之觀 點，宜為可排列成鏡要件8£之間隙可減少之形狀（可填充為 最密之形狀）。又，從光利用效率之觀點，宜將相鄰之2個 鏡要件SE之間隔抑制在所需最小限度。 在空間光調變器3G，按主控制系統CR之控制信號，複 數個鏡要件SE之姿勢各自變化，各鏡要件SE分別設定成預 ^之方向藉空間調變器3G之複數個鏡要件SE分別以預定 角度反射之光藉由繼光光學系統4，於複眼透鏡5之後側焦 位置或’、附近之照明瞳孔形成複數極狀(2極狀、樣狀 13 201137394 等）' 輪帶狀、圓形等光強度分佈（瞳孔強度分佈）。 即’繼光光學系統4及複眼透鏡5構成依據經由空間光 調變單元3中之空間光調變器30之光，於照明光學系統扎之 照明瞳孔形成預定光強度分佈之分佈形成光學系統。再 者’亦於與複眼透鏡5之後側焦點位置或其附近之照明瞳孔 在光學上共軛之其他瞳孔照明位置、即，成像光學系統8之 瞳孔位置及投影光學系統pL之瞳孔位置（孔徑光闌AS之位 置）形成對應於複眼透鏡5正後方之光強度分佈的瞳孔強度 分佈。 在曝光裝置，為將光罩Μ之圖形高精確度地且忠實地 轉印於晶圓W，在按光罩Μ之圖形特性之適當照明條件下， 進行曝光為重要。在本實施形態中，由於使用具有複數個 鏡要件SE之姿勢可個別地變化之空間光調變器如的空間光 調變單元3,故可使以空間光調變器3〇之作用形成之睹孔強 度分佈自由且迅速地變化，進而，可實現多種照明條件。 然而，在記載於專利文獻1之習知空間光調變器中，藉 對對應於各鏡要件而設之複數個電極財電位，使各雷^ 與鏡要件間產生靜電力，而使各電極與鏡要件之間隔變 用了使各鏡要件帶電荷’以電斥力，驅動各鏡 要件之4驅動方式。因此，因帶電引起之隨時間變化之 性能惡化1㈣確且穩定地，轉錢要件而不易 地實現所期之瞳孔強度分佈（進而為所期之照明條件）^ 如第4圖所示，本實施形態之空間光調變㈣具 入射光之鏡要件卿a、31b、31c:對應於第2圖及第3圖之 201137394 SE)、基底部32、及設於基底部32與各鏡要件31間之3個致 動器33。在第4圖之俯視圖中’為明瞭圖式，顯示1個鏡要 件31及對應於此而設之3個致動器33。又，在第4圖之側面 圖，顯示於俯視圖所示之鏡要件31及相鄰之鏡要件之一部 份。 鏡要件31具有具平面形狀為正方形之反射面31 aa之鏡 部31a、配置於鏡部31a之反射面31aa之對側，連結有致動 器33之一端之可動部31b、連結可動部3 lb與鏡部31a之連結 構件31c。鏡部3la具有平行平面板之形態。可動部3ib具圓 形之外形，且具有平行平面板之形態。沿著複數個鏡要件 31之排列面（YZ平面）之法線方向（X方向）觀看時，鏡部31a 大於可動部31b。 連結構件3 lc係將鏡部3la之中心部與可動部3 lb之中 心部連結成固定之棒狀構件。3個致動器33沿著繞可動部 31b之中心一圈之圓之圓周方向隔著等角度間隔來配置，另 一端則連結於基底部32。於基底部32沿著相鄰之2個鏡要件 31之分界線設有分隔構件34。惟，在第4圖之結構中，分隔 構件34非必要之構成要件，而亦可省略其設置。 如第5圖所示’致動器33具有具電場回應性之驅動源構 件33a、配置成包夾驅動源構件33a之一對電極33b、連接於 一對電極33b ’以將電壓以可變之方式施加於驅動源構件 33a之電源33c。驅動源構件33a僅由導電性高分子材料構 件。在致動器33，按對驅動源構件33a之電壓施加，驅動源 構件33a於與電場相同之方向（在第5圖為鉛直方向）收縮，於 15 201137394 與電場垂直之方向（在第5圖為水平方向）膨脹。 即’在致動器33，可按施加之電壓之大小，使驅動源 構件33a之與電場垂直方向（以下稱為「伸縮方向」）之伸縮 率連續變化，只要維持一定之伸縮率（進而為一定形狀），便 幾乎不需要電流。為使一對電極33b可依循驅動源構件33a 之伸縮方向之伸縮，亦可對一對電極33b施予按驅動源構件 33a之電壓施加時之變形特性的伸縮性。 此外’在上述說明中’驅動源構件33a僅由導電性高分 子材料構成，但不限於此，可以含有高分子材料之適當導 電體材料形成驅動源構件。—例係、亦可以由高分子材料、 離子性液體及奈米碳管之膠狀組餘減之導電性材料形 成驅動源構件。使用此種膠狀組成物作為致動器用導電性 材料之技術齡於日本專利公報第侧奶號說明書。 在第4圖之結構中，3個伸縮性致動器Μ配置成可沿著 複數個鏡要㈣之排㈣(γζ平面）之法㈣向（χ方向）伸 縮即在各致動器33，驅動源構件33&(在第4圖未顯示） 具有沿著X方向延伸之柱狀(例如圓柱狀、角柱狀等）之形 〜對電極33b(在第4圖未顯示）以於與X方向垂直相交之 方向（沿著YZ平面之任意方_對之狀態配置於驅動源構 件33a之周圍。 在由1個鏡it件31及對應於此而設之3個致動器 構成之單位、.·α構中，根據來自主控制系統cR之指令，使 施加於3個致動器33之電壓個別變化，而使細致動器33之乂 方向之伸㈣個別變化’藉此’控制可動部训之姿勢，進 16 201137394 而，可控制具有反射面31aa之鏡部31a之姿勢。換+之 個致動器33使基底部32及1個鏡要件31之相對' ° ，3 m打位置關係變 化。 如以上，在本實施形態之空間光調變器3 休用了使 用具有以導電體材料而具電場回應性之驅動源構件Μ 複數個伸縮性致動器33，驅動各鏡要件31之方式。因3之 不致如習知技術之帶電驅動方式般，引致因帶電引起2 ’ 時間變化之性能惡化’而可準確且穩定地驅動各鏡：:4 3卜進而，可穩定地實現所期之瞳孔強度分佈（進 之照明條件）。 乃 結果，在本實施形態之照明光學系統IL，使用可進行 各鏡要件31之準確且穩定之驅動的空間光調變器扣，而了 穩定地實現所期之照明條件。又，在本實施形態之曝光Z 置（IL、MS、PL、WS)中，使用歡地實現所期之照明條 之照明光學系統扎，而可在按要轉印之圖形之特性而實現 之適當照明條件下，進行完善之曝光。 此外，在本實施形態之空間光調變器30，各伸縮性致 動器33從光之入射側(X軸方向側）觀看時，為可動部3化所 遮蔽’且沿著複數個鏡要件31之排列面（YZ平面）之法線方 向（X方向）觀看時’由於鏡部31a大於玎動部31b，故各伸縮 性致動器33曝露於光照射之可能性低。因而，各伸縮性致 動器33不致因光照射而惡化。 在上述實施形態，使用空間光調變器30，形成曈孔強 度分佈之際，亦可一面以瞳孔強度分佈測量裝置測量曈孔 17 201137394 強度分佈，一面按此測量結果，控制空間光調變單元3中之 空間光調變器30。此種技術揭示於日本專利公開公報 2006-54328號、日本專利公開公報2003_22967號及對應於此 之美國專利公開公報第2003/0038225號。 此外，在上述實施形態中，具有與空間光調變器3〇之 排列複數個鏡要件之面相對之光學面的稜鏡構件使用以】 個光學塊一體形成之K稜鏡21。然而，不限於此，可以一對 稜鏡，構成具有與K稜鏡21同樣之功能之構件。又可 個平行平面板與一對三角稜鏡，構成具有與κ稜鏡21同樣之 功能之構件。又，可以丨個平行平面板及—對平面鏡，構成 具有與Κ稜鏡21同樣之功能之組裝光學構件。 又，在上述實施形態中，依據具有第4圖所示之特定結 構之空間光調變器’說明了本說明。然而，關於空間光調 變器之具體結構、即，鏡要件之結構、數、及排列、對應 於各鏡要件而設之致動器之數及配置等，可為各種形態。 舉例。之，如第6圖所示，亦可為以圓環狀第丨可動部3丨以 及圓形第2可動部31bb形成可動部之結構例。在第6圖之俯 視圖’為明瞭’省略分隔構件34及相鄰之其他鏡要件 之圖式顯示。 红在第6圖之第1變形例之空間光調變器，圓環狀第1可動 P3lba藉由於z方向隔著間隔之丨對支撐構件％，以分隔構 件34支揮’並構造成可於連結丨對支料件35之滅周圍搖 動圓形第2可動部3lbb藉由於γ方向隔著間隔之请支擇構 件36 ’以圓環狀第丨可動部Mba支撐，並構造成可於連結i 201137394 對支^構件36之轴線周圍搖動。 〇 於2方向隔著間隔之1對致動器33A之一端連結於 1〔第2可動。Blbb，於丫方向隔著間隔之1對致動器33B之 山連。於1]¾狀第〖可動部3如。丨對致動器之另一端 及一對致動器33B夕η ± 〇 <另一縞連結於基底32。4個伸縮性致動 -33A 33Β配置成可沿著複數個鏡要件η之排列面(γζ平 面）之法線方向（X方向）伸縮。 因而，藉使施加於1對致動器33Α之電壓適宜變化，而 使1對致動益33A之X方向之伸縮率適宜變化，可控制連結】 對支撐構件36之轴線周圍(γ轴周圍）之第2可動部遍之姿 勢。又，藉使施加於1對致動器33B2電壓適宜變化，而使i 對致動器33B之X方向之伸、缩率適宜變化，可控制連結⑼ 支撐構件35之軸線周圍（Z軸周圍）之第1可動部31ba之姿 勢’進而可控制連結1對支撐構件35之軸線周圍之第2可動 部31bb之姿勢。即，可以4個伸縮性致動器33A、33B之作 用’於二軸周圍（2軸周圍及Y軸周圍）控制第2可動部31bb之 姿勢’進而’於二軸周圍控制具有反射面31aa之鏡部313之 姿勢。 此外’在第1變形例之空間光調變器，各伸縮性致動器 33A從光之入射側(X軸方向側）觀看時，為第1及第2可動部 31b、31b遮蔽’且沿著複數個鏡要件31之排列面（γζ平面） 之法線方向（X方向）觀看時，由於鏡部31a大於第1及第2可 動部31ba、31bb’故各伸縮性致動器33A曝露於光照射之可 能性低。因而’各伸縮性致動器33A不致因光照射而惡化。 19 201137394Referring to Fig. 2, along the direction parallel to the optical axis AX, the person is incident on the group of the spatial light modulation unit 3, and the stage u is incident on the reduced mirror: SE 201137394, the mirror element SEa, the light beam L2 incident The mirror element SEb is different from the mirror element SEa. Similarly, the light ray L3 is incident on the mirror element SEc which is different from the mirror element & 8, and the light ray L4 is incident on the mirror element SEd which is different from the mirror element SEa to SEc. The mirror elements SEa to SEd apply light to the light L1 to L4 in accordance with the position setting. In the spatial light modulation unit 3, the reflection surface of all the mirror elements SE of the spatial light modulator 3 is set to a reference state parallel to the YZ plane, and is incident on the reflection surface in a direction parallel to the optical axis AX. After passing through the spatial light modulator 30, the light is reflected by the reflecting surface R2 in a direction parallel to the optical axis AX. Further, the 'space light modulation unit 3 is configured such that the air-converted length from the incident surface IP of the crucible 21 through the mirror elements SEa to SEd to the exit surface OP and the incident surface IP from the equivalent of the 稜鏡21 not disposed in the optical path The air is converted to the same length as the position corresponding to the exit surface OP. Here, the 'space conversion length is the length of the optical path in the air in which the optical path length in the optical system is converted into the refractive index 1. The air conversion length in the medium of the refractive index η is multiplied by the optical path length by 1/1. η 者 ” The arrangement of the mirror elements SEa to SEd of the spatial light modulator 30 is disposed at or near the front focus position of the relay optical system 4. The light having a predetermined angular distribution is applied to the rear side focal plane 4a of the relay optical system 4 by the plurality of mirror elements SEa to SEd reflected by the spatial light modulator 300 to form predetermined light intensity distributions SP1 to SP4. That is, the optical optical system 4 converts the angles of the plurality of mirror elements SEa to SEd of the spatial light modulator 30 to the emitted light to be converted into the far vision region of the spatial light modulator (Fran and Fiji diffraction regions). ) The position on the face 4a. Referring again to Fig. 1, the incident surface of the fly-eye lens 5 is positioned at the position of the rear focal plane 4a of the secondary optical system 12 201137394. Therefore, the pupil intensity distribution of the illumination pupil formed directly behind the fly-eye lens 5 is formed to correspond to the distribution of the light intensity distributions SP1 to SP4 of the incident surface of the fly-eye lens 5 formed by the spatial light modulator 30 and the secondary optical system 4. . As shown in FIG. 3, the spatial light modulator 30 includes a plurality of movable mirror elements SE which are regularly arranged in two dimensions along one plane in a state in which the reflecting surface of the planar shape is above. mirror. Each of the mirror elements SE is movable, and the inclination of the reflecting surface, i.e., the inclination angle and the tilting direction of the reflecting surface, can be individually controlled in accordance with an instruction of the main control system CR (not shown in Fig. 3). Each of the mirror elements SE has two directions (the γ direction and the Z direction) perpendicular to each other in the two directions parallel to the reflecting surface thereof, and is a rotation axis, and the rotation angle is continuously or discretely rotated. Namely, the inclination of the reflecting surface of each of the mirror elements SE can be controlled two-dimensionally. When the reflecting surface of each mirror element SE is discretely rotated, it is preferable to switch the rotation angle in a plurality of states (for example, ..... 2.5 degrees, -2.0 degrees, ... twist, +0.5 degrees, +2.5 degrees, ...). . In Fig. 3, the mirror element SE having a square shape is shown, and the shape of the mirror element SE is not limited to a square shape. However, from the point of view of light utilization efficiency, it is preferable to have a shape which can be arranged into a gap of 8 tons of the mirror element (which can be filled to the most dense shape). Further, from the viewpoint of light use efficiency, it is preferable to suppress the interval between the adjacent two mirror elements SE to the minimum required. In the spatial light modulator 3G, according to the control signal of the main control system CR, the postures of the plurality of mirror elements SE are respectively changed, and the respective mirror elements SE are respectively set to the direction of the pre-^, the plurality of mirror elements SE of the spatial modulator 3G. The light respectively reflected at a predetermined angle is formed by the relay optical system 4 at the side focal position of the fly-eye lens 5 or at the vicinity of the illumination pupil of the vicinity, forming a plurality of poles (2-pole shape, shape 13 201137394, etc.) Circular light intensity distribution (pupil strength distribution). That is, the optical optical system 4 and the fly-eye lens 5 constitute a distribution optical system for forming a predetermined light intensity distribution in the illumination pupil of the illumination optical system in accordance with the light passing through the spatial light modulator 30 in the spatial light modulation unit 3. Furthermore, other pupil illumination positions which are optically conjugate with the illumination pupil at or near the rear focus position of the fly-eye lens 5, that is, the pupil position of the imaging optical system 8 and the pupil position of the projection optical system pL (aperture light) The position of the 阑AS) forms a pupil intensity distribution corresponding to the light intensity distribution immediately behind the fly's eye lens 5. In the exposure apparatus, in order to transfer the pattern of the mask to the wafer W with high precision and faithfulness, it is important to perform exposure under appropriate illumination conditions of the pattern characteristics of the mask. In the present embodiment, since the spatial light modulation unit 3 such as a spatial light modulator having a plurality of mirror elements SE can be individually changed, the spatial light modulator 3 can be formed by the action of the spatial light modulator 3 The pupil strength distribution changes freely and rapidly, and in turn, various illumination conditions can be achieved. However, in the conventional spatial light modulator described in Patent Document 1, by applying a plurality of electrode potentials corresponding to the respective mirror elements, an electrostatic force is generated between each of the lightning elements and the mirror elements, and the electrodes are made. The distance from the mirror element is changed by a four-drive method in which each mirror element is charged with electric repulsion and drives each mirror element. Therefore, the deterioration of performance due to charging due to charging 1 (4) is indeed and stable, and the cost of the dip is not easy to achieve the desired pupil strength distribution (and thus the expected lighting conditions) ^ As shown in Figure 4, this implementation Space light modulation of form (4) Mirror elements with incident light a, 31b, 31c: 201137394 SE) corresponding to Figs. 2 and 3, base portion 32, and between base portion 32 and each mirror element 31 3 actuators 33. In the plan view of Fig. 4, a schematic diagram is shown, and one mirror element 31 and three actuators 33 corresponding thereto are shown. Further, in the side view of Fig. 4, a portion of the mirror element 31 and the adjacent mirror element shown in the plan view are shown. The mirror element 31 has a mirror portion 31a having a square reflecting surface 31aa, a mirror portion 31a disposed on the reflecting surface 31aa of the mirror portion 31a, a movable portion 31b connecting one end of the actuator 33, and a connecting movable portion 31b. The connecting member 31c of the mirror portion 31a. The mirror portion 31a has a form of a parallel flat plate. The movable portion 3ib has a circular outer shape and has a shape of a parallel flat plate. The mirror portion 31a is larger than the movable portion 31b when viewed along the normal direction (X direction) of the arrangement surface (YZ plane) of the plurality of mirror elements 31. The connecting member 3 lc is a rod-shaped member that connects the central portion of the mirror portion 31a and the central portion of the movable portion 3 lb to be fixed. The three actuators 33 are arranged at equal angular intervals in the circumferential direction of a circle around the center of the movable portion 31b, and the other end is coupled to the base portion 32. A partition member 34 is provided on the base portion 32 along the boundary line between the adjacent two mirror elements 31. However, in the structure of Fig. 4, the partition member 34 is not necessarily a constituent element, and the arrangement thereof may be omitted. As shown in Fig. 5, the actuator 33 has an electric field responsive drive source member 33a, is configured to sandwich one of the drive source members 33a, and is connected to the pair of electrodes 33b to bias the voltage. The mode is applied to the power source 33c of the drive source member 33a. The drive source member 33a is composed only of a conductive polymer material member. In the actuator 33, the voltage is applied to the driving source member 33a, and the driving source member 33a is contracted in the same direction as the electric field (in the vertical direction in FIG. 5), and is perpendicular to the electric field in 15 201137394 (in FIG. 5). Expands horizontally). In other words, in the actuator 33, the expansion ratio of the drive source member 33a in the direction perpendicular to the electric field (hereinafter referred to as "stretching direction") can be continuously changed in accordance with the magnitude of the applied voltage, as long as a certain expansion ratio is maintained (further A certain shape), almost no current is needed. In order to allow the pair of electrodes 33b to expand and contract in accordance with the expansion and contraction direction of the drive source member 33a, the pair of electrodes 33b can be subjected to the stretchability of the deformation characteristics when the voltage of the drive source member 33a is applied. Further, in the above description, the drive source member 33a is composed only of a conductive polymer material, but is not limited thereto, and a drive source member may be formed of a suitable conductor material containing a polymer material. For example, the driving source member may be formed of a conductive material which is reduced by a polymer material, an ionic liquid, and a gel-like group of carbon nanotubes. The use of such a gel-like composition as a conductive material for an actuator is in the specification of Japanese Patent Publication No. In the structure of Fig. 4, the three telescopic actuators Μ are arranged to be stretchable in the (χ) direction along the (four) row (four) (γ ζ plane) of the plurality of mirrors (four), that is, in the respective actuators 33, The drive source member 33 & (not shown in Fig. 4) has a columnar shape (e.g., a columnar shape, a prismatic column shape, etc.) extending in the X direction - a counter electrode 33b (not shown in Fig. 4) for the X direction The direction of the vertical intersection (the state along the YZ plane is disposed around the drive source member 33a. The unit consists of one mirror element 31 and three actuators corresponding thereto. In the α configuration, the voltage applied to the three actuators 33 is individually changed according to an instruction from the main control system cR, and the extension of the fine actuator 33 (4) is individually changed 'by this' to control the movable part training. In the posture of 16, 201137394, the posture of the mirror portion 31a having the reflecting surface 31aa can be controlled. The actuator 33 is changed to change the relative position of the base portion 32 and the one mirror member 31 by '° and 3 m. As described above, the spatial light modulator 3 of the present embodiment is used for use as a conductor material. Field responsive drive source component Μ A plurality of telescopic actuators 33 drive the mirror elements 31. Since 3 is not as charged as the conventional technology, the performance of the 2′ time change due to charging is deteriorated. 'It is possible to drive each mirror accurately and stably:: 4 3 and further, the desired pupil strength distribution (into the illumination condition) can be stably achieved. As a result, the illumination optical system IL of the present embodiment can be used. The accurate and stable driving of the spatial light modulator of each of the mirror elements 31 stably achieves the desired lighting conditions. Further, in the exposure Z setting (IL, MS, PL, WS) of the present embodiment, The illumination optical system of the lighting strip of the desired period is realized by using the illumination, and the perfect exposure can be performed under the appropriate illumination conditions realized by the characteristics of the pattern to be transferred. In addition, the spatial light modulation in the embodiment When the stretchable actuator 33 is viewed from the incident side (the X-axis direction side) of the light, it is shielded by the movable portion 3 and along the normal line of the arrangement surface (YZ plane) of the plurality of mirror elements 31. Direction (X direction) In the case where the mirror portion 31a is larger than the swaying portion 31b, the possibility that each of the stretchable actuators 33 is exposed to light is low. Therefore, the respective stretchable actuators 33 are not deteriorated by light irradiation. When the spatial light modulator 30 is used to form the pupil intensity distribution, the intensity distribution of the pupil 17 201137394 can be measured by the pupil strength distribution measuring device, and the spatial light in the spatial light modulation unit 3 can be controlled according to the measurement result. The modulating device 30. This technique is disclosed in Japanese Patent Laid-Open Publication No. Hei. No. 2006-54328, Japanese Patent Laid-Open Publication No. 2003-22967, and No. 2003/0038225. Further, in the above embodiment, the 稜鏡 member having the optical surface opposite to the surface on which the plurality of mirror elements are arranged in the spatial light modulator 3 is K 稜鏡 21 integrally formed by the optical blocks. However, the present invention is not limited thereto, and a pair of members may be used to constitute a member having the same function as that of K稜鏡21. Further, a parallel flat plate and a pair of triangular turns can constitute a member having the same function as the κ 稜鏡 21. Further, an assembly optical member having the same function as that of the crucible 21 can be constructed by a parallel plane plate and a pair of plane mirrors. Further, in the above embodiment, the description has been described based on the spatial light modulator ‘ having the specific structure shown in Fig. 4 . However, the specific configuration of the spatial light modulator, that is, the structure, number, and arrangement of the mirror elements, the number and arrangement of the actuators corresponding to the respective mirror elements, and the like may be various forms. For example. As shown in Fig. 6, a configuration example in which the movable portion is formed by the annular second movable portion 3b and the circular second movable portion 31bb may be employed. The plan view of Fig. 6 is omitted, and the schematic display of the partition member 34 and the adjacent other mirror elements is omitted. In the spatial light modulator according to the first modification of the sixth embodiment, the annular first movable P3lba is configured by the partition member 34 by the partition member in the z direction with a gap therebetween, and is configured to be The connecting 丨 丨 周围 周围 圆形 圆形 圆形 圆形 圆形 圆形 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第201137394 Shake around the axis of the support member 36.对 One of the actuators 33A is connected to one of the actuators 33A in the two directions at a distance of two [2nd movable. Blbb, in the direction of the 丫, is separated by a pair of actuators 33B. In 1] 3⁄4 shape, the movable part 3 is as follows.丨 The other end of the actuator and the pair of actuators 33B η± 〇 < the other 缟 is coupled to the base 32. The four telescopic actuators - 33A 33 Β are arranged to be arranged along the plurality of mirror elements η The normal direction (X direction) of the surface (γ ζ plane) is expanded and contracted. Therefore, if the voltage applied to the pair of actuators 33 is appropriately changed, the expansion ratio of the X-direction of the pair of actuation benefits 33A is appropriately changed, and the connection can be controlled to the periphery of the axis of the support member 36 (around the γ-axis) ) The second movable part is in a posture. Further, if the voltage applied to the pair of actuators 33B2 is appropriately changed, the extension and contraction ratio of the i-direction of the actuator 33B in the X direction are appropriately changed, and the connection (9) around the axis of the support member 35 (around the Z-axis) can be controlled. The posture of the first movable portion 31ba' can further control the posture of the second movable portion 31bb around the axis of the pair of support members 35. In other words, the action of the four stretchable actuators 33A and 33B can control the posture of the second movable portion 31bb around the two axes (around the two axes and around the Y axis) and further control the reflection surface 31aa around the two axes. The posture of the mirror portion 313. In the spatial light modulator of the first modification, when the stretchable actuators 33A are viewed from the light incident side (the X-axis direction side), the first and second movable portions 31b and 31b are shielded from each other. When viewed in the normal direction (X direction) of the arrangement surface (γ ζ plane) of the plurality of mirror elements 31, since the mirror portion 31a is larger than the first and second movable portions 31ba and 31bb', the respective stretch actuators 33A are exposed. The possibility of light exposure is low. Therefore, the respective stretch actuators 33A are not deteriorated by light irradiation. 19 201137394
又，如第7圖所示，亦可為將複數個致動器33C、33D 配置成可沿著複數個鏡要件31之排列面（YZ平面）之面内方 向（Y方向、Z方向等）伸縮之結構例。在第7圖之俯視圖中， 為明瞭圖式，省略分隔構件34及相鄰之其他鏡要件之圖式 顯示。在第7圖之第2變形例之空間光調變器，使用了具比 較厚之平行平面板之形態之圓形可動部3 ib。 於可動部31b之+Z方向側之端面及_2方向側之端面分 別連結有於X方向隔著間配置，可沿著Z方向伸縮之一對致 動器33C之一端。另一方面，於可動部31b之+γ方向側之端 面及-Y方向側之端面分別連結有於χ方向隔著間配置，可沿 著Υ方向伸縮之一對致動器33D(在第7圖之側面圖未顯示） 之一端。各致動器33C、33D之另一端連結於對應之分隔構 件34。 因而，藉使施加於4個致動器33C之電壓適宜變化，而 使4個致動器33〇：之2方向之伸縮率適宜變化，可控制可動部 31b之Y轴周圍之姿勢。又，藉使施加於物致動器加之電 壓適宜變化，而使4個致動器加之丫方向之伸縮率適宜變 化，可控制可動部31kZ軸周圍之姿勢。即，可以8個伸縮 性致動器33C、33D之作用，於二軸周圍⑽周圍及γ 圍）控制可動部爪之姿勢，進而，於二軸周圍控制具有反 射面31aa之鏡部3ia之姿勢。 在上述實施形態中，可使用依據預定電子資料， 預定圖形之可_形形«置來取代鮮。若❹此種可 變圖形形成裝置，即使圖形面為直放，亦可使對同步精確 20 201137394 度造成之影響在最低限度。此外’可變圖形形成裝置可使 用包含依據預定電子資料驅動之複數個反射元件之 DMD(數位微鏡裝置）。使用DMD之曝光骏置揭示於日本專 利公開公報20〇4_304135號、國際專利公開手冊第 2006/080285號及對應於此之美國專利公開公報第 2007/0296936號。又’除了諸如DMD之非發光型反射型空 間光調變器以外’尚可使用穿透型空間光調變器，亦可使 用自發光型圖像顯示元件。在此，將美國專利公開公報第 2〇〇7/〇296936號之指示作為參考而沿用。 上述實施形,％之曝光裝置係藉將包含本案申請專利範 圍列舉之各構成要件之各種副系統組裝成保持預定機械精 確度、電性精確度、光學精確絲製造。為德該等各種 精確度，於此組裝之前後，就各種光學系統，進行用以達 成光學精確度之調整，就各種機械“，進洲以達成機 械精確度之調整，就各種電系統，進行用以達成電性精確 度之調整。從各種·統對曝光裝置之組裝製程包含各種 •統相互之機械連接、電路之配線連接、氣壓線路之配 I連接等。於減各制㈣_^置之喊製程前， =副系統各自之組裝製程是無須贅言的。當純 2光裝置之組裝製程結束後，進行總合触，而可中 體之各種精確度。此外，曝光裝置之製造亦; 在S理溫度及無塵度之無塵室進行。 接著，就使用上述實施形態之 法作說明。第8圖係顯示半導體裝置 <製造製㈣程造圖方 21 201137394 如第8圖所示，在半導體裝置之製造製程中，於作為半導體 裝置之基板之晶圓w沉積金屬膜（步驟S4〇)，於此已沉積之 金屬膜上塗佈為感光性材料之光阻(步驟S42)。接著，使用 上述實施形態之投科光裝置，將形成於光罩之 圖形轉印至晶B1W上之各曝光照射區域(步驟⑽：曝光製 程），進行此轉印結束之晶圓w之顯像、亦即已轉印了圖形 之光阻之顯像(步驟S46 :顯像製程）。 之後，將以步職6生成於晶UW表面之光阻圖形作為 光罩，對晶UW之表面進行關等加工（步驟S48:加工製 程）。在此，光阻圖形係指生成有對應於以上述實施形態之 投影曝光裝置轉印之圖形之形狀的凹凸之光阻層其凹部 貫穿光阻層者。在步驟S48,藉由此光阻圖形，進行晶圓w 表面之加工。在步驟S48進行之加工包含晶圓w表面之蝕刻 或金屬膜等之成膜至少一者。此外，在步驟S44，上述實施 形態之投影曝光裝置將已塗佈光阻之晶圓w作為感光性基 板、亦即底片P，來進行圖形之轉印。 第9圖係顯示液晶顯示元件等液晶裝置之製造製程之 流程圖。如第9圖所示，在液晶裝置之製造製程中，依序進 行圖形形成製程（步驟S50)、濾色器形成製程（步驟S52)、晶 胞組裝製程（步驟S54)及模組組裝製程（步驟S56)。在步驟 S50之圖形形成製程中，於塗佈了光阻作為底片p之玻璃基 板上’使用上述實施形態之投影曝光裝置，形成電路圖形 及電極圖形等預定圖形。此圖形形成製程包含使用上述實 施形態之投影曝光裝置，將圖形轉印至光阻層之曝光製 22 201137394 程、進行轉印了圖形之底片p之顯像、亦即玻璃基板上之光 p層之顯像’而生成對應於圖形之形狀之光阻層的顯像製 程、藉由此已顯像之光阻層，將玻璃基板表面加工之加工 製程。 在步驟S52之濾色器形成製程，形成將對應sR(Red)、 G(Green)、B(Blue)之3個點為_組之許多組排列成矩陣狀或 將R、G、B3條狀濾色器為—組之複數組於水平掃瞄方向排 列之濾色器。在步驟S54之晶胞組裝製程中，使用以步驟S5〇 形成了預定圖形之玻璃基板及以步驟S52形成之濾色器，組 裝液晶面板（液晶晶胞）。具體言之，於玻璃基板與濾色器間 注入液晶，形成液晶面板。在步驟S56之模組組裝製程，對 以步驟S 5 4所組裝之液晶面板，安裝進行此液晶面板之顯示 動作之電路及背光源等各種零件。 又’本發明不限於對半導體裝置製造用曝光裝置之應 用，亦可廣泛應用於形成於角型玻璃板之液晶顯示元件、 或電漿顯示器等顯示器裝置用曝光裝置、用以製造拍攝元 件(CCD等）、微機械、薄膜磁頭、及DNA晶片等各種裝置 之曝光裝置。再者，本發明亦可應用於使用光刻製程，製 造形成有各種裝置之光罩圖形之光罩(ph〇t〇 mask 、reticule 等）的曝光製程(曝光裝置）。 此外，在上述實施形態中’曝光光使用ArF準分子雷射 光(波長：193nm)或KrF準分子雷射光(波長：248nm)，但不 限於此’對其他適當之雷射光源、例如供給波長15711111之雷 射光之F2雷射光源等亦可應用本發明。 23 201137394 又，在上述實施形態中，亦可應用以具有折射率大於 1.1之介質（典型為液體）充滿投影光學系統與感光性基板間 之光程中之手法、即所謂液浸法。此時，於投影光學系統 與感光性基板間之光程中充滿液體之手法可採用如國際公 開手冊第WO99/49504號揭示之局部充滿液體之手法、如曰 本專利公開公報平6-124873號揭示之使保持有曝光對象基 板之台在液槽中移動之手法、或如日本專利公開公報平 10-303114號所揭示，於台上形成預定深度之液體槽，於其 中保持基板之手法等。在此，將國際公開手冊第 WO99/49504號、日本專利公開公報平6_124873號公報及曰 本專利公開公報平10-303114號之指示作為參照而沿用。 又’在上述實施形態中，對在曝光裝置照明光罩之照 明光學系統應用本發明，但不限於此，對照明光罩以外之 被照射面之一般照明光學系統亦可應用本發明。 I：圖式簡單説明3 第1圖係概略地顯示本發明實施形態之曝光裝置結構 之圖。 第2圖係概略地顯示空間光調變單元之結構及作用之 圖。 第3圖係空間光調變單元中之空間光調變器之部份立 體圖。 第4圖係概略地顯示本實施形態空間光調變器之主要 部份結構之圖。 第5圖係說明驅動鏡要件之致動器之作動原理的圖。 24 201137394 第6圖係概略地顯示第1變形例空間光調變器之主要部 份結構之圖。 第7圖係概略地顯示第2變形例空間光調變器之主要部 份結構之圖。 第8圖係顯示半導體裝置之製造製程之流程圖。 第9圖係顯示液晶顯示元件等液晶裝置之製造製程之 流程圖。 【主要元件符號說明】 1...光源 31ba...第1可動部 2...光束送光部 31bb...第2可動部 3.空間光調變單元 31c...連結構件 4...繼光光學系統 32...基底部 4a...後側焦點面 33，33A-33D…致動器 5...複眼透鏡 33a...驅動源構件 6...聚光光學系統 33b...電極 7...照明視野闌 33c...電源 8...成像光學系統 34...分隔構件 21...K稜鏡 35，36…支撐構件 21a，21b，21c...側面 AX...光轴 30...空間光調變器 AS...孔徑光闌 3卜 SE，SEa-SEd···鏡要件 CR...主控制系統 31a...鏡部 IL...照明光學系統 31aa_·.反身=]•面 IP...入射面 31b...可動部 L1-L4···光 25 201137394 Μ...光罩 MS...光罩台 OP...射出面 PL...投影光學系統 PI，P2···平面 P...切線 R1，R2...反射面 SP1-SP4...光強度分佈 S40 ， S42 ， S44 ， S46 ， S48 ...步驟 S50，S52，S54，S56...步驟 WS...晶圓台 W...晶圓 X，Y，Z...方向 26Further, as shown in Fig. 7, the plurality of actuators 33C and 33D may be arranged in an in-plane direction (Y direction, Z direction, etc.) along the arrangement plane (YZ plane) of the plurality of mirror elements 31. Example of the structure of the telescopic. In the plan view of Fig. 7, in order to clarify the drawing, the schematic display of the partition member 34 and the adjacent other mirror elements is omitted. In the spatial light modulator of the second modification of Fig. 7, a circular movable portion 3 ib having a relatively thick parallel plate is used. The end surface on the +Z direction side and the end surface on the _2 direction side of the movable portion 31b are connected to each other in the X direction, and one end of the actuator 33C can be extended and contracted in the Z direction. On the other hand, the end surface on the +γ direction side and the end surface on the -Y direction side of the movable portion 31b are respectively connected to each other in the χ direction, and can be extended and contracted in the Υ direction to the actuator 33D (at the seventh stage). The side view of the figure is not shown) one end. The other end of each of the actuators 33C, 33D is coupled to a corresponding partition member 34. Therefore, the voltage applied to the four actuators 33C is appropriately changed, and the expansion ratio of the two actuators 33 in the two directions is appropriately changed, and the posture around the Y-axis of the movable portion 31b can be controlled. Further, by appropriately changing the voltage applied to the actuator, the expansion ratio of the four actuators in the 丫 direction is appropriately changed, and the posture around the axis of the movable portion 31kZ can be controlled. In other words, the posture of the movable portion claw can be controlled around the two-axis circumference (10) and the γ circumference by the action of the eight telescopic actuators 33C and 33D, and the posture of the mirror portion 3ia having the reflection surface 31aa can be controlled around the two axes. . In the above embodiment, it is possible to use a predetermined shape of the image in accordance with a predetermined electronic material. In the case of such a variable pattern forming device, even if the graphic surface is placed straight, the influence on the synchronization accuracy 20 201137394 degrees can be minimized. Further, the 'variable pattern forming device can use a DMD (Digital Micromirror Device) including a plurality of reflective elements driven in accordance with a predetermined electronic material. The use of the DMD is disclosed in Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Further, in addition to a non-light-emitting reflective spatial light modulator such as a DMD, a transmissive spatial light modulator can be used, and a self-luminous image display element can also be used. The use of the specification of U.S. Patent Publication No. 2/7,296,936 is incorporated herein by reference. In the above embodiment, the % exposure apparatus is assembled by maintaining various sub-systems including the constituent elements recited in the scope of the patent application of the present application to maintain predetermined mechanical precision, electrical accuracy, and optical precision wire. For the various precisions of the Germans, before and after the assembly, various optical systems were used to achieve optical precision adjustments, and various machines were used to achieve mechanical precision adjustments on various electrical systems. It is used to achieve the adjustment of electrical accuracy. The assembly process of various exposure devices includes various mechanical connections, circuit wiring connections, and pneumatic connection of I and others. Before the process, the sub-system's assembly process is not necessary. When the assembly process of the pure 2-optical device is finished, the total touch is performed, and the various precisions of the body can be obtained. In addition, the manufacturing of the exposure device is also The clean room of the temperature and the dust-free degree is performed. Next, the method of the above embodiment will be described. Fig. 8 shows the semiconductor device < manufacturing system (4) process drawing 21 201137394 As shown in Fig. 8, In the manufacturing process of the semiconductor device, a metal film is deposited on the wafer w as a substrate of the semiconductor device (step S4〇), and the photoresist on the deposited metal film is coated as a photosensitive material (step) Step S42). Next, using the light-emitting device of the above embodiment, the pattern formed on the photomask is transferred to each of the exposure irradiation regions on the crystal B1W (step (10): exposure process), and the transfer-finished wafer is performed. The image of w, that is, the image of the photoresist of the pattern has been transferred (step S46: development process). Thereafter, the photoresist pattern formed on the surface of the crystal UW by the step 6 is used as a mask, and the crystal UW is The surface is subjected to processing such as shutdown (step S48: processing). Here, the photoresist pattern refers to a photoresist layer on which irregularities corresponding to the shape of the pattern transferred by the projection exposure apparatus of the above embodiment are formed, and the concave portion penetrates the light. In step S48, the surface of the wafer w is processed by the photoresist pattern. The processing in step S48 includes at least one of etching of the surface of the wafer w or film formation of a metal film or the like. In step S44, the projection exposure apparatus of the above-described embodiment transfers the wafer w to which the resist is applied as a photosensitive substrate, that is, the negative film P. Fig. 9 shows the manufacture of a liquid crystal device such as a liquid crystal display device. Flow chart of the process. As shown in the figure, in the manufacturing process of the liquid crystal device, the pattern forming process (step S50), the color filter forming process (step S52), the unit cell assembly process (step S54), and the module assembly process (step S56) are sequentially performed. In the pattern forming process of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed by using the projection exposure apparatus of the above embodiment on a glass substrate coated with a photoresist as the film p. The pattern forming process includes the use of the above. In the projection exposure apparatus of the embodiment, the pattern is transferred to the exposure layer of the photoresist layer 22 201137394, and the image of the negative transfer of the pattern p, that is, the image of the light p layer on the glass substrate is generated. The processing process of the photoresist layer in the shape of the pattern, and the processing of the surface of the glass substrate by the photoresist layer which has been developed. In the color filter forming process of step S52, a plurality of groups corresponding to three points of sR (Red), G (Green), and B (Blue) are arranged in a matrix or R, G, and B3 strips are formed. The color filter is a color filter in which a plurality of arrays are arranged in a horizontal scanning direction. In the unit cell assembly process of step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate in which the predetermined pattern is formed in step S5, and the color filter formed in step S52. Specifically, liquid crystal is injected between the glass substrate and the color filter to form a liquid crystal panel. In the module assembly process of step S56, various components such as a circuit for performing display operation of the liquid crystal panel and a backlight are mounted on the liquid crystal panel assembled in step S54. Further, the present invention is not limited to the application to an exposure apparatus for manufacturing a semiconductor device, and can be widely applied to an exposure apparatus for a display device such as a liquid crystal display element formed on a sheet glass plate or a plasma display panel, for manufacturing an imaging element (CCD). Exposure devices for various devices such as micromachines, thin film magnetic heads, and DNA wafers. Furthermore, the present invention can also be applied to an exposure process (exposure device) for forming a photomask (ph〇t〇 mask, reticule, etc.) having a mask pattern of various devices using a photolithography process. Further, in the above embodiment, the exposure light uses ArF excimer laser light (wavelength: 193 nm) or KrF excimer laser light (wavelength: 248 nm), but is not limited thereto. For other suitable laser light sources, for example, a supply wavelength of 15711111 The invention can also be applied to a F2 laser source such as a laser light. Further, in the above embodiment, a so-called liquid immersion method in which the medium having a refractive index of more than 1.1 (typically a liquid) is filled in the optical path between the projection optical system and the photosensitive substrate can be applied. In this case, the method of filling the liquid in the optical path between the projection optical system and the photosensitive substrate may be a method of partially filling the liquid as disclosed in International Publication No. WO99/49504, for example, Japanese Patent Laid-Open Publication No. Hei 6-124873 A method of moving a stage in which a substrate to be exposed is held in a liquid bath, or a liquid tank having a predetermined depth on a stage, and a method of holding a substrate therein, etc., as disclosed in Japanese Laid-Open Patent Publication No. Hei No. 10-303114. Herein, the instructions of the International Publication No. WO99/49504, the Japanese Patent Laid-Open Publication No. Hei No. Hei. Further, in the above embodiment, the present invention is applied to the illumination optical system of the exposure device illumination mask, but the present invention is not limited thereto, and the present invention can also be applied to a general illumination optical system of an illuminated surface other than the illumination mask. I: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. Fig. 2 is a view schematically showing the structure and function of the spatial light modulation unit. Figure 3 is a partial elevational view of a spatial light modulator in a spatial light modulation unit. Fig. 4 is a view schematically showing the configuration of a main part of the spatial light modulator of the embodiment. Figure 5 is a diagram illustrating the principle of actuation of an actuator that drives a mirror element. 24 201137394 Fig. 6 is a view schematically showing the configuration of main parts of the spatial light modulator of the first modification. Fig. 7 is a view schematically showing the configuration of main parts of a spatial light modulator of a second modification. Fig. 8 is a flow chart showing a manufacturing process of a semiconductor device. Fig. 9 is a flow chart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. [Description of main component symbols] 1...light source 31ba...first movable portion 2...beam light transmitting portion 31bb...second movable portion 3.space light modulation unit 31c...connection member 4. ..subsequent optical system 32...base portion 4a...back side focus surface 33, 33A-33D...actuator 5...flip eye lens 33a...drive source member 6...concentrating optical system 33b...electrode 7...illumination field of view 阑33c...power source 8...imaging optical system 34...separating member 21...K稜鏡35,36...support member 21a, 21b, 21c.. Side AX...Axis Axis 30...Space Light Modulator AS...Aperture Stopper 3B SE,SEa-SEd··· Mirror Element CR...Main Control System 31a...Mirror Section IL ...lighting optical system 31aa_.. reflexive =]•face IP...incidence surface 31b...movable part L1-L4···light 25 201137394 Μ...mask MS...mask table OP. .. exit surface PL... projection optical system PI, P2 · · plane P... tangent R1, R2 ... reflective surface SP1-SP4... light intensity distribution S40, S42, S44, S46, S48. ..Steps S50, S52, S54, S56...Step WS... Wafer Table W... Wafer X, Y, Z... Direction 26