WO2011070681A1 - 有機elパネル及びその製造方法 - Google Patents
有機elパネル及びその製造方法 Download PDFInfo
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- WO2011070681A1 WO2011070681A1 PCT/JP2009/070774 JP2009070774W WO2011070681A1 WO 2011070681 A1 WO2011070681 A1 WO 2011070681A1 JP 2009070774 W JP2009070774 W JP 2009070774W WO 2011070681 A1 WO2011070681 A1 WO 2011070681A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/341—Short-circuit prevention
Definitions
- the present invention relates to an organic EL panel and a manufacturing method thereof.
- An organic EL element has a structure in which an organic layer including a light emitting layer is laminated between a pair of electrodes, and an organic EL panel in which one or a plurality of organic EL elements are arranged on a substrate is structurally or It has an insulating structure that partitions electrically.
- the insulating structure include an insulating film that partitions an electrode formed on a substrate for each pixel, a partition for separating an electrode formed on an organic layer, and the like.
- the surface state of the electrode which is the film formation surface of the organic layer, has a great influence on the quality of the light emission characteristics. If the surface of the electrode is uneven, the film thickness of the organic layer deposited thereon is not uniform, and light emission defects such as leakage are likely to occur in the organic EL element.
- a technique has been developed in which a wet organic layer (conductive polymer or the like) is applied on an electrode, and a light emitting layer or the like is formed on the planarized organic layer.
- Patent Document 1 describes an organic EL panel having an insulating wall as shown in FIG.
- a first electrode J2 corresponding to a plurality of pixels is provided on an insulating surface of a substrate J1
- an insulating wall J3 is provided so as to surround the first electrode J2
- the insulating wall J3 and the first electrode J2 are provided on the insulating surface J3.
- a conductive polymer layer J4 is formed
- an organic layer J5 including a light emitting layer is formed on the conductive polymer layer J4
- a second electrode J6 is formed on the organic layer J5.
- the coating material layer such as the conductive polymer layer fills the unevenness of the electrode surface and flattens its surface, it becomes possible to make the film laminated thereon uniform and resistant. It is possible to improve the light emission performance and durability performance, such as improving leakage.
- an acceptor dopant
- the charge injection efficiency is improved, and a low voltage can be realized.
- the coating material layer is formed in the region surrounded by the insulating wall as shown in FIG. 1, the surface of the coating material layer formed on the electrode by the surface tension of the coating material adhering to the side surface of the insulating wall J3. Is not flat, and the film thickness (evaporated film, etc.) formed thereon differs between the central part and the peripheral part, and uniform light emission cannot be obtained over the entire pixel region surrounded by the insulating wall. Occurs.
- the present invention is an example of a problem to deal with such a problem. That is, the surface of the coating material layer formed on the electrode is flattened, and at the same time, appropriate patterning is performed, and the light emitting characteristics of the organic EL element are improved by making the film formed thereon uniform.
- the organic EL panel and the manufacturing method thereof according to the present invention have at least the following configuration.
- a substrate a first electrode formed directly on the substrate or via another layer, a coating material layer coated on the first electrode, an insulating wall for patterning the coating material layer,
- An organic EL panel having an overhang portion that suppresses sag and an inclined surface or a curved surface that ensures continuity of the second electrode above the coating material layer.
- an organic EL panel manufacturing method is characterized in that a portion of the insulating wall above the coating material layer is deformed to form an inclined surface or a curved surface that ensures the continuity of the second electrode.
- FIG. 1 is an explanatory diagram for explaining the configuration of an organic EL panel according to an embodiment of the present invention
- FIG. 1A is a sectional view taken along line XX in FIG. 1B
- FIG. 1B is a plan view
- FIG. 2 is an explanatory diagram for explaining the configuration of an organic EL panel according to an embodiment of the present invention
- FIG. 2A is a sectional view taken along line XX in FIG. 2B
- FIG. 2B is a plan view.
- An organic EL panel 100 according to an embodiment of the present invention is obtained by forming an organic EL element 1 in which an organic layer 13 including a light emitting layer is laminated between a first electrode 11 and a second electrode 12 on a substrate 10.
- the substrate 10, the first electrode 11 formed on the substrate 10 directly or via another layer, the coating material layer 14 applied and formed on the first electrode 11, and the coating material layer 14 are patterned.
- the insulating wall 20 is formed along the side portion of the first electrode 11, and an opening pattern 20 ⁇ / b> A is formed on the first electrode 11.
- the pattern of the insulating wall 20 is not limited to the opening pattern 20A and can be formed in various forms, and the coating material layer 14 can be patterned into a free shape according to the form of this pattern.
- the insulating wall 20 has an overhang portion 20B in which the side surface 21 in contact with the coating material layer 14 suppresses the spread of the coating material layer 14, and the inclined surface 22 that ensures the continuity of the second electrode 12 above the coating material layer 14. Or it has a curved surface. That is, the insulating wall 20 has a shape in which a side surface 21 in contact with the coating material layer 14 and a portion above the coating material layer 14 are different, and in the illustrated example, the side surface 21 is inclined to be inclined toward the coating material layer 14 side.
- the inclined surface 22 is inclined to the opposite side to the side surface 21.
- the surface of the coating material layer 14 formed on the first electrode 11 is flattened, and at the same time, appropriate patterning is performed, and the organic layer 13 formed thereon is uniformly formed.
- the emission characteristics of the organic EL element 1 can be made uniform over the entire opening pattern 20A.
- FIG. 3 is an explanatory diagram for explaining a method of manufacturing an organic EL panel according to an embodiment of the present invention.
- the first electrode 11 is formed on the substrate 10 directly or through another layer (see FIG. 1A), and the first electrode 11 on the substrate 10 is covered.
- Step 2 of forming the pattern of the insulating wall 20 so as to surround the coating surface see FIG.
- an insulating wall 20 is formed along the side of the first electrode 11 on the substrate 10 to form an opening pattern 20A on the first electrode 11, and the inside of the opening pattern 20A is covered with a coating material. The coated surface.
- a conductive film is formed by, for example, vapor deposition or sputtering on the substrate 10 using glass, plastic, metal having an insulating film formed on the surface, etc., and the first is performed by a pattern forming step such as a photolithography step. A pattern of the electrode 11 is formed.
- the insulating wall 20 is pre-baked by spin-coating, for example, a lift-off negative photoresist whose UV light transmission is intentionally lowered. And it exposes by irradiating UV light through the hard chrome mask provided with the light transmission slit. At this time, since the above-described photoresist has a low transmittance of UV light, a difference in solubility in a developing solution occurs in the depth direction. Therefore, the insulating wall 20 having the overhang portion 20B as shown in FIG. 4B is formed by the difference in developability by spray showering the alkaline developer on the substrate 10.
- the vertical cross-sectional shape of the insulating wall 20 is a substantially inverted isosceles trapezoidal shape.
- the coating material is applied using the coating apparatus 14A.
- coating here includes spray application
- a coating material a polymer material or a polymer material containing a low-molecular material is suitable.
- a polyalkylthiophene derivative, a polyaniline derivative, triphenylamine, an inorganic compound sol-gel film, an organic compound film containing a Lewis acid A conductive polymer can be used.
- the overhang portion 20B is formed on the insulating wall 20, the spread of the coating material layer 14 is suppressed, and the coating material layer 14 forms a layer on the first electrode 11 substantially flat.
- step 4 described above after the coating material layer 14 is formed, the substrate 10 on which the first electrode 11, the insulating wall 20, and the coating material layer 14 are formed is placed in the heating tank M and subjected to heat melting treatment.
- the upper portion of the insulating wall 20 (the portion above the coating material layer 14) is deformed to form the inclined surface 22 shown in FIG. 2 or the curved surface 22A as shown in FIG.
- the insulating wall 20 has an overhang portion 20B in which the side surface 21 in contact with the coating material layer 14 suppresses the spread of the coating material layer 14, and ensures the continuity of the second electrode 12 above the coating material layer 14. It has the inclined surface 22 or the curved surface 22B.
- the organic layer 13 including the light emitting layer is formed by vacuum deposition or the like.
- An example of forming the organic layer 13 formed on the coating material layer 14 will be described.
- NPB N, N-di (naphtalence) -N, N-dipheneyl-benzidene
- the hole transport layer has a function of transporting holes injected from the lower electrode line 2 to the light emitting layer.
- the hole transport layer may be a single layer or a stack of two or more layers.
- the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
- red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask.
- red (R) an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4′-dimethylaminostyryl) -4H-pyran) is used.
- An organic material that emits green light such as an aluminum quinolinol complex (Alq 3 ) is used as green (G).
- an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used.
- a distyryl derivative or a triazole derivative is used.
- other materials or a host-guest layer structure may be used, and the light emission form may be a fluorescent light emitting material or a phosphorescent light emitting material.
- the electron transport layer formed on the light emitting layer is formed by using various materials such as an aluminum quinolinol complex (Alq 3 ) by various film forming methods such as resistance heating vapor deposition.
- the electron transport layer has a function of transporting electrons injected from the upper electrode line 3 to the light emitting layer.
- This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked.
- the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
- the second electrode 12 is formed by vacuum deposition or the like.
- One of the first electrode 11 and the second electrode 12 functions as an anode and the other functions as a cathode.
- the first electrode 11 employs a transparent conductive film such as ITO in the case of a top emission method in which light is extracted from the substrate side.
- the cathode uses a material having a work function lower than that of the anode.
- a magnesium alloy such as aluminum (Al) or Mg—Al can be used as the cathode.
- the overhang portion 20B formed on the insulating wall 20 refers to a shape covering the end portion of the coating material layer 14, and is not limited to the shape of the side surface 21 shown in FIG. It may include a form.
- a protruding portion 21a that protrudes toward the coating material layer 14 is formed on the side surface 21 of the insulating wall 20, and the cross-sectional shape of the insulating wall 20 before heat forming is substantially T-shaped. ing. It changes from the state before heating and melting in (a1) to the state after heating (a2). In the state (a2), the insulating wall 20 covers the side surface and part of the upper surface of the coating material layer 14 to form an overhang portion 20B. A curved surface 22 ⁇ / b> A is formed on the coating material layer 14.
- a protruding portion 21a1 protruding toward the coating material layer 14 is formed on the side surface 21 of the insulating wall 20, and the protruding portion 21a1 has a corner. It changes from the state before heating and melting in (b1) to the state after heating (b2). In the state (b2), the insulating wall 20 covers the side surface and part of the upper surface of the coating material layer 14 to form an overhang portion 20B. A curved surface 22 ⁇ / b> A is formed on the coating material layer 14.
- the cross-sectional shape of the insulating wall 20 does not have to be symmetrical, and the overhang portion 20B may be formed only on one side.
- the side surface 21 has an inclined surface 21a2 on only one side. It changes from the state before heating and melting in (c1) to the state after heating (c2).
- the insulating wall 20 covers the side surface and part of the upper surface of the coating material layer 14 to form an overhang portion 20B.
- a curved surface 22 ⁇ / b> A is formed on the coating material layer 14.
- FIG. 5 shows various cross-sectional shapes of the insulating wall 20 before heating and melting.
- a plurality of protrusions 21 b 1 and 21 b 2 are formed from the side surface 21.
- the protruding widths of the protruding portion 21c1 on one side and the protruding portion 21c2 on the opposite side are different.
- inclined surfaces 21 d 1 and 21 d 2 with different angles are formed on one side surface 21, and inclined surfaces 21 d 3 and 21 d 4 with different angles are also formed on the other side surface 21.
- the protruding portion 21e is formed only on one side surface 21.
- the protruding portion 21d is formed only on one side surface 21, and the protruding portion 21d has a corner.
- 6 to 9 are explanatory views showing examples of forming the organic EL panel according to the embodiment of the present invention. Portions common to the above description are denoted by the same reference numerals, and a part of overlapping description is omitted.
- FIG. 6 shows a plan view of the single panel excluding the second electrode
- FIG. 6 (b) shows a plan view of a plurality of panels formed on a large substrate before division. .
- the coating material layer 14 is patterned by the insulating wall 20.
- a wiring region 10F is formed outside the light emitting region 10E on the substrate 10, and a wiring 30 connected to the first electrode 11 or the second electrode 12 is formed in the wiring region 10F.
- a plurality of panels are simultaneously formed on a large substrate as shown in FIG. 6B, and a plurality of panels are formed in a series of steps by dividing along the dividing lines C1 to C4. be able to.
- FIG. 7 is a plan view excluding the second electrode
- FIG. 7 (b) is an XX sectional view of FIG. 7 (a) including the second electrode
- the insulating wall 20 is formed along the outer edge of the pixel 1G on the substrate 10 in 100.
- a pixel 1G is formed by the organic EL element 1 described above, and an insulating wall 20 is formed along the outer edge of the pixel 1G.
- the second electrode 12 is formed across the plurality of pixels 1G, and the end portion is connected to the wiring 30 by the contact portion 12S.
- FIG. 8 is a plan view excluding the second electrode
- FIG. 8B is an XX sectional view of FIG. 8A including the second electrode
- an insulating wall 20 is formed along the outer edge of the pixel 1G on the substrate 10 in 100
- an electrode separation partition wall 30 having a function of separating the second electrode 12 is formed on the insulating wall 20.
- FIG. 9 shows another example of the insulating wall 20.
- the opening pattern 20A of the insulating wall 20 can take various forms. Since the insulating wall 20 can be patterned in various shapes, it can be in the form of numeric segments, icons, or the like shown in FIG.
- the coating material layer 14 is formed on the first electrode 11 so that the coating material layer 14 fills the unevenness of the electrode surface and flattens its surface. Therefore, the organic layer 13 laminated thereon can be made uniform, and the light emission performance and durability performance can be improved, such as improving the leak resistance. Further, by adding an acceptor (dopant) to the coating material applied on the electrode, the charge injection efficiency is improved, and a low voltage can be realized.
- the overhang portion 20B is formed on the inner side surface of the insulating wall 20 surrounding the periphery of the coating material layer 14, the surface of the coating material layer 14 formed on the first electrode 11 is planarized and at the same time appropriate patterning. Further, the organic layer 13 formed thereon can be made more uniform to improve the light emission characteristics of the organic EL element. In particular, uniform light emission characteristics can be obtained over the entire area of the opening pattern 20A, and the quality of the organic EL panel 100 can be improved.
- the insulating wall 20 has an inclined surface 22 or a curved surface 22A that ensures the continuity of the second electrode 12, the organic layer 13 is laminated on the coating material layer 14.
- the second electrode 12 without disconnection can be formed, and the highly reliable organic EL panel 100 can be obtained.
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Description
Claims (8)
- 基板と、
該基板上に直接又は他の層を介して形成された第1電極と、
前記第1電極上に塗布形成される塗布材料層と、
前記塗布材料層をパターニングする絶縁壁と、
前記塗布材料層上に積層される発光層を含む有機層と、
該有機層上に形成される第2電極とを備え、
前記絶縁壁は、前記塗布材料層に接する側面が当該塗布材料層の広がりを抑えるオーバーハング部を有すると共に、前記塗布材料層の上方では前記第2電極の連続性を確保する傾斜面又は曲面を有することを特徴とする有機ELパネル。 - 前記オーバーハング部は、前記塗布材料層側に傾いた傾斜面であることを特徴とする請求項1記載の有機ELパネル。
- 前記絶縁壁は、前記塗布材料層の側面と上面の一部を覆っていることを特徴とする請求項1又は2記載の有機ELパネル。
- 前記絶縁壁は、パネルの発光領域の外縁に沿って形成されることを特徴とする請求項1~3のいずれかに記載された有機ELパネル。
- 前記絶縁壁は、パネルの画素の外縁に沿って形成されることを特徴とする請求項1~3のいずれかに記載された有機ELパネル。
- 前記絶縁壁の上部に前記第2電極を分離する機能を有する電極分離隔壁を形成することを特徴とする請求項5に記載された有機ELパネル。
- 基板上に直接又は他の層を介して第1電極を形成する工程と、
前記基板上に前記第1電極上の被塗布面を囲むように絶縁壁のパターンを形成する工程と、
前記絶縁壁のパターン内の前記被塗布面上に塗布材料を塗布して塗布材料層を形成する工程と、
前記塗布材料層上に発光層を含む有機層を積層する工程と、
前記有機層上に第2電極を形成する工程とを有し、
前記絶縁壁は、前記パターンの内面に前記塗布材料層の広がりを抑えるオーバーハング部を有し、前記塗布材料層の形成後に、当該絶縁壁を加熱溶融することで、当該絶縁壁における前記塗布材料層の上方の部分を変形させ、前記第2電極の連続性を確保する傾斜面又は曲面を形成することを特徴とする有機ELパネルの製造方法。 - 前記絶縁壁の変形前の断面形状は略逆台形形状又は略T字形状であることを特徴とする請求項7に記載の有機ELパネルの製造方法。
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JP2011545039A JPWO2011070681A1 (ja) | 2009-12-11 | 2009-12-11 | 有機elパネル及びその製造方法 |
PCT/JP2009/070774 WO2011070681A1 (ja) | 2009-12-11 | 2009-12-11 | 有機elパネル及びその製造方法 |
CN2009801624669A CN102612858A (zh) | 2009-12-11 | 2009-12-11 | 有机el面板及其制造方法 |
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CN104882466A (zh) | 2015-05-27 | 2015-09-02 | 深圳市华星光电技术有限公司 | 有机发光显示装置 |
CN108305891A (zh) * | 2018-02-12 | 2018-07-20 | 上海天马微电子有限公司 | 一种显示面板及其制造方法、显示装置 |
US10581011B2 (en) | 2018-06-01 | 2020-03-03 | Int Tech Co., Ltd. | Light emitting device with different light emitting material overlapping width |
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