WO2011067946A1 - Carte de circuit imprimé, module de circuit imprimé, et appareil électronique - Google Patents

Carte de circuit imprimé, module de circuit imprimé, et appareil électronique Download PDF

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Publication number
WO2011067946A1
WO2011067946A1 PCT/JP2010/007073 JP2010007073W WO2011067946A1 WO 2011067946 A1 WO2011067946 A1 WO 2011067946A1 JP 2010007073 W JP2010007073 W JP 2010007073W WO 2011067946 A1 WO2011067946 A1 WO 2011067946A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
conductive resin
groove
recess
electrode
Prior art date
Application number
PCT/JP2010/007073
Other languages
English (en)
Japanese (ja)
Inventor
勝裕 井上
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2011067946A1 publication Critical patent/WO2011067946A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a circuit board capable of simultaneously realizing electromagnetic shielding and thinning, and a circuit module and an electronic device including the circuit board.
  • This type of electronic component includes, for example, a sealed or molded product such as an IC or a hybrid module, a component covered with a metal cap, a component stored in a metal cap, or the aforementioned component itself. There are mounted circuit boards, etc.
  • the recess 101 is formed in a part of the main surface excluding the substrate end, and the element component 102 is mounted in the recess 101.
  • the sealing resin layer 103 is formed on the upper surface side of the element component 102.
  • the conductive resin layer 105 is formed so as to cover the electrode 104 and the sealing resin layer 103 provided on the main surface. Since the electrode 104 is internally connected to the constant potential conductor pattern 106, a shielding effect for the component 102 can be obtained. Thereby, an extremely thin structure can be taken while having high noise shielding properties.
  • connection surface between the electrode and the conductive resin is substantially the same surface as the substrate surface, external stress is likely to be applied to the connection surface, and the connection between the electrode and the conductive resin is difficult.
  • portable devices such as mobile phones, it is essential to be able to withstand the stress caused by drop impact, and various developments have been studied to strengthen the connection between the electrode and the conductive resin. Has not been found.
  • the present invention has been made in view of the above-mentioned problems of the prior art, and has a strong electromagnetic shielding property to electronic parts and can be thinly adapted to have a strong connection between an electrode and a conductive resin.
  • the object is to provide a substrate.
  • the circuit board of the present invention includes a base material, a concave portion formed in the base material, an electronic component disposed in the concave portion, a groove formed on the top surface of the concave portion, and provided with an electrode inside, and the concave portion is filled.
  • the thickness can be reduced, and by connecting the electrode and the conductive resin inside the groove, the top surface of the recess and the insulating resin can be formed in the circuit board manufacturing process. Even if both are polished, electrical connection between the electrode and the conductive resin can be secured. Further, since the conductive resin enters the groove, the connection between the base material and the conductive resin can be strengthened. As a result, it is possible to provide a circuit board that is resistant to stress and capable of being thin.
  • Another embodiment of the present invention is the above-described circuit board, in which grooves are formed on four sides of the recess. Thereby, the formed groove can surround all the electronic components arranged in the recess, and a strong electromagnetic shield can be applied to the electronic components.
  • the circuit board is configured such that an electrode is disposed at the bottom of a groove.
  • the side surface of the groove has a structure in which the base material is exposed, and the conductive resin is connected to the base material at the side surface of the groove, whereby the connection between the conductive resin and the base material becomes strong.
  • the connection surface between the electrode and the conductive resin is surrounded by the connection surface between the conductive resin having a high connection strength and the side surface, and the connection strength between the electrode and the conductive resin can be improved.
  • the thickness can be reduced, and by connecting the electrode and the conductive resin inside the groove, the top surface of the recess and the insulating resin can be formed in the circuit board manufacturing process. Even if both are polished, electrical connection between the electrode and the conductive resin can be secured. Further, since the conductive resin enters the groove, the connection between the base material and the conductive resin can be strengthened. As a result, it is possible to provide a circuit board that is resistant to stress and capable of being thin.
  • Sectional drawing which showed the structure of the circuit board by Embodiment 1 of this invention (A)-(D) Sectional view and top view showing a method of manufacturing a circuit board according to the first embodiment of the present invention.
  • the top view which showed the structure of the circuit board by Embodiment 2 of this invention
  • the top view which showed the 1st modification of the groove
  • Sectional drawing which showed the structure of the circuit board by Embodiment 3 of this invention Sectional drawing which showed the structure of the circuit board which has arrange
  • Sectional view showing the configuration of a conventional circuit board Sectional drawing which showed the structure of the circuit board by Embodiment 4 of this invention (A)-(C) Sectional drawing which shows the manufacturing method of the circuit board by Embodiment 4 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment 5 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment 6 of this invention (A)-(D) Sectional drawing which shows the manufacturing method of the circuit board by Embodiment 6 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment 7 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment 8 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment 9 of this invention
  • the top view which showed the structure of the circuit board by Embodiment 10 of this invention (A)-(C) Sectional drawing which shows the manufacturing method of the circuit board by Embodiment 4 of this invention Sectional drawing which showed the structure of the circuit board by Embodiment
  • FIG. 1 shows a circuit board 1 to which the present invention is applied.
  • the circuit board 1 has a rectangular parallelepiped shape with a small thickness, and includes a base material 2, a recess 3, a plurality (two in this embodiment) of electronic components 4, a groove 5, an electrode 6, and insulation.
  • a conductive resin 7 and a conductive resin 8 are provided.
  • the base material 2 is made of an appropriate insulating material such as glass, ceramics, epoxy resin, etc., and has a recess 3 and a groove 5 formed on one or both sides, and the bottom surface 3A of the recess 3 and the substrate surface.
  • the insulating resin 7 seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3 ⁇ / b> A is hardened in a state where it is covered with an appropriate resin material and embedded. .
  • the circuit board 1 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even when an external force of a certain degree of strength acts mechanically, and adheres moisture or dust. Stable operation can be demonstrated by avoiding the above.
  • the substrate 2 of the present embodiment has a groove 5 formed on the top surface 9.
  • the groove 5 is formed to a depth where the bottom surface 5B and the electrode 6B are flush with each other, and the inside is filled with the conductive resin 8.
  • the conductive resin 8 is formed on the insulating resin 7 and inside the groove 5 using a conductive resin made of an appropriate resin material.
  • the conductive resin 8 protects the internal electronic component 4 by shielding external electromagnetic waves and static electricity from the adjacent electronic component, and static electricity generated from the internal electronic component 4 is transferred to the adjacent electronic component. Shield propagation.
  • the electrode 6B is electrically connected to the ground electrode 6C through the via V and the internal wiring.
  • the circuit board 1 of the present embodiment will be described with reference to FIGS.
  • the base material 2 the concave portion 3 and the groove 5 are formed on the surface, the protective electrode 10 covering the groove 5 is provided, and the bottom surface 5 ⁇ / b> A of the groove 5.
  • a pattern wiring including a via V that electrically connects the electrode 6A positioned on the substrate 6 and the grounding electrode 6C positioned on the surface of the substrate 2 is used.
  • the electronic component 16 is mounted on each of the electrodes 4A and 4B of the recess 3 with respect to the base material 2 to achieve electrical connection (mounting process). ).
  • components may be mounted on the recess 3 and the electrode 6 ⁇ / b> D outside the groove 5 or on the back surface of the recess 3.
  • an insulating resin 7 made of an appropriate resin material is formed inside the recess 3 so as to cover the electronic component 4 and laminated together.
  • To harden (mold layer forming step).
  • the top surface 9 of the base material 2, the top surface 11 of the conductive resin, and the protective electrode 10 are polished to a depth at which the groove 5 is exposed, for example, with a grindstone. Then, the groove 5 is formed (groove forming step).
  • the portion covering the groove 5 of the protective electrode 10 is removed by, for example, router processing or mechanical peeling. By doing so, the groove can be formed without affecting the above-described components.
  • the conductive resin is applied by, for example, dispensing until the surface becomes a flat surface state. At this time, if application is performed under vacuum, the filling property of the conductive resin into the grooves 5 is further enhanced. Thereafter, the conductive resin is cured by an appropriate process such as thermosetting (conductive resin layer forming process). From the above, a series of work steps for manufacturing the circuit board 1 is completed.
  • the conductive resin 8 and the electrode 6B are connected inside the groove 5, in order to eliminate the step between the top surface of the insulating resin 7 and the top surface 9 of the recess 3 in the circuit board manufacturing process. Even if the top surface 9 of the recess 3 and the insulating resin 7 are both polished, the electrical connection between the electrode 6B and the conductive resin 8 can be ensured. In addition, even if external stress is applied to the circuit board surface, the stress on the connection surface between the electrode 6B and the conductive resin 8 inside the base material 2 is relieved, so that an electrical connection strong against external stress can be obtained. Further, since the conductive resin 8 enters the groove 5, the connection between the base material 2 and the conductive resin 8 can be strengthened. This makes it possible to provide a circuit board that is thin and resistant to stress.
  • FIG. 3 is a top view of the circuit board 20 according to the second embodiment of the present invention.
  • the circuit board 20 is different from the circuit board 1 of the first embodiment in that grooves 5 are formed on the four sides of the recess 3.
  • the circuit board 20 can completely surround all the electronic components 4 arranged in the recess 3 by forming the grooves 5 on the four sides of the recess 3. Thereby, in addition to the effect of the first embodiment, a strong electromagnetic shield can be applied to the electronic component 4.
  • the substrate 2 having a plurality of grooves 5 formed on one side of the recess 3 is used as the circuit board 20, but for example, on one side of the recess 3 as shown in FIG. 4.
  • One groove 5 may be formed, or the groove 5 may be formed so as to be continuous over the four sides of the recess 3 as shown in FIG.
  • FIG. 6 is a sectional view of a circuit board 30 according to the third embodiment of the present invention.
  • the circuit board 30 is different from the second and third embodiments in that the groove 5 is formed so that the base material 2 is exposed on the side surface 5A.
  • the circuit board 30 has a structure in which the conductive resin 8 is connected to the base material 2 at the side surface 5 ⁇ / b> A of the groove 5. Since the connection strength between the conductive resin 8 and the base material 2 is higher than the connection strength between the metal and the resin, the connection between the conductive resin 8 and the base material 2 becomes strong. Further, when the groove 5 is formed by processing with a router or the like, the side surface of the groove 5 is roughened, so that the adhesion area with the conductive resin 8 is increased, and the effect of improving the strength is obtained. As a result, the connection surface between the electrode 6B and the conductive resin 8 is surrounded by the connection surface between the conductive resin 8 having a high connection strength and the side surface 5A.
  • connection strength between the electrode 6 ⁇ / b> B and the conductive resin 8 can be improved as compared with what is provided. This makes it possible to realize a circuit board that ensures the connection between the electrode 6B and the conductive resin 8.
  • FIG. 9 shows a circuit board 40 to which the present invention is applied.
  • the circuit board 40 has a rectangular parallelepiped shape with a small thickness, and includes a base material 2, a recess 3, a plurality (two in this embodiment) of electronic components 4, a conductive film 13, and electrodes 6. Insulating resin 7 and conductive resin 8 are provided.
  • the base material 2 is made of an appropriate insulating material such as glass, ceramics, epoxy resin, etc., and has a recess 3 formed on one or both sides, and a conductive film on the side surface 3B of the recess 3.
  • electrodes 6A and 6B for mounting the electronic component 4 are provided on the bottom surface 3A and the substrate surface.
  • the conductive film 13 is made of an appropriate conductive material such as a metal or a resin mixed with metal particles.
  • the top surface 9 of the substrate 2 and the recess 3 are formed by an appropriate method such as vapor deposition or plating.
  • the side surface portion 3B and the electrode 6C are in contact with each other.
  • the insulating resin 7 seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3 ⁇ / b> A is hardened in a state where it is covered with an appropriate resin material and embedded. .
  • the circuit board 40 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even when an external force having a certain strength is applied mechanically, and adheres moisture or dust.
  • the conductive resin 8 is formed on the insulating resin 7 using a conductive resin made of an appropriate resin material or the like, and is in contact with the conductive film 13.
  • the conductive resin 8 protects the internal electronic component 4 by shielding external electromagnetic waves and static electricity from the adjacent electronic components, and static electricity generated from the internal electronic components 4 is transferred to the adjacent electronic components. Shield propagation.
  • the conductive resin is electrically connected to the ground electrode 6D through the conductive film 13, the electrode 6C, the via V, the internal wiring, and the like.
  • the concave portion 3 is formed on the surface as the base material 2
  • the conductive film 13 is provided on the side surface portion 3 ⁇ / b> B of the concave portion 3, and is in contact with the conductive film 13.
  • the electrode 6C and the electrode 6D for grounding located on the surface of the substrate 2 are used in which a pattern wiring including a via V for electrically connecting is used.
  • the electronic component 4 is mounted on the electrode 6A of the recess 3 with respect to the base material 2 to achieve electrical connection (mounting process).
  • components may be mounted on the recess 3 and the electrode 6 ⁇ / b> B outside the conductive film 13 or on the back surface of the recess 3.
  • an insulating resin 7 made of an appropriate resin material is formed inside the recess 3 so as to cover the electronic component 4 and laminated together.
  • the conductive resin 8 is applied by, for example, dispensing until the surface is flat.
  • the conductive resin 8 is cured by an appropriate process such as thermosetting (conductive resin layer forming process). From the above, a series of work steps for manufacturing the circuit board 40 is completed.
  • the total thickness of the circuit board can be reduced by disposing the electronic component 4 inside the recess 3 as compared with the conventional structure in which the component is disposed on the substrate without the recess.
  • the shielding effect can be obtained by connecting the conductive film 13 and the conductive resin 8.
  • the shield formation can be completed inside the inner surface of the recess 3, the area of the top surface 9 of the recess 3 can be reduced, and the conductive resin 8 and the inner surface 3 B of the recess 3 can be reduced.
  • FIG. 11 shows a circuit board 50 according to a fifth embodiment of the present invention.
  • the circuit board 50 is different from the circuit board 40 of the fourth embodiment in that the conductive resin 8 is in contact with the inner surface 15 of the conductive film 13.
  • the top surface 14 of the insulating resin 7 is formed in a shape parallel to the bottom surface 3A at a position sandwiched between the top surface 9 of the recess 3 and the bottom surface 3A, and the inner side surface 15 of the conductive film is in contact with the insulating resin 7. Without having a surface 15A in contact with the insulating resin.
  • connection area between the conductive film 13 and the conductive resin 8 can be expanded without providing an electrode around the recess 3, and the conductive film 13 and the conductive resin 8
  • the electrical connection can be made more reliable.
  • a circuit board with high electrical connection strength can be provided without enlarging the external size of the circuit board.
  • FIG. 12 shows a circuit board 60 according to the sixth embodiment of the present invention.
  • the circuit board 60 is different from the circuit board 50 of the fifth embodiment in that a groove 16 is provided between the conductive film 13 and the insulating resin 7, and the conductive resin 8 and the conductive film are formed inside the groove 16. 13 is connected.
  • a protective film 17 in contact with the inner surface of the conductive film 13 is formed on the substrate 2 of the present embodiment.
  • the protective film 17 is made of, for example, a material such as a water-soluble resin, and can be easily removed by using an appropriate removal method. Further, it is desirable that the removing method does not affect the conductive film 13 such as corrosion or peeling.
  • the electronic component 4 is mounted on the electrode 6A of the recess 3 with respect to the base material 2 to achieve electrical connection (mounting process).
  • components may be mounted on the recess 3 and the electrode 6 ⁇ / b> B outside the conductive film 13 or on the back surface of the recess 3.
  • an insulating resin 7 made of an appropriate resin material is formed inside the recess 3 so as to cover the electronic component 4 and laminated together.
  • the protective film 17 is removed by an appropriate removal method to form the groove 16 (protective film removing step). From the above, a series of work steps for forming the groove 16 is completed.
  • the connection area between the conductive resin 8 and the conductive film 13 is achieved. Can be enlarged. Furthermore, the effect of protecting the connection surface from external stress can be obtained by moving the connection surface away from the substrate surface. In addition, since the connection area between the conductive resin 8 and the insulating resin 7 can be increased, the connection strength between the conductive resin 8, the conductive film 13, and the insulating resin 7 can be improved, and the stress can be increased. It is possible to provide a circuit board that is resistant to damage.
  • FIG. 14 shows a circuit board 70 according to a seventh embodiment of the present invention.
  • the circuit board 70 is different from the circuit board 60 of the sixth embodiment in that it has a surface on which the conductive film 13 and the insulating resin 7 come into contact.
  • the depth of the groove 16 can be kept constant regardless of the depth of the recess 3. Therefore, according to the present embodiment, by providing a surface where the conductive film 13 and the insulating resin 7 are in contact with each other, the groove 16 can be formed with a depth that allows the protective film 17 to be reliably removed. As a result, the problem of the circuit board due to the residue of the protective film 17 can be avoided and the filling process of the conductive resin 8 can be ensured by stabilizing the depth of the groove 16.
  • FIG. 15 shows a circuit board 80 according to an eighth embodiment of the present invention.
  • the circuit board 80 is different from the circuit board 40 of the fourth embodiment in that the circuit board 80 has an electrode 18 electrically connected to the conductive film 13 on the top surface 9 of the recess 3.
  • the connection area between the conductive resin 8 and the conductive film 13 can be enlarged via the electrode 18. Therefore, according to the present embodiment, the electrical connection between the conductive resin 8 and the conductive film 13 can be further ensured.
  • the surface of the base material 2 is polished for adjusting the height of the insulating resin 7 or the like, the surface of the electrode 18 is roughened, thereby further strengthening the connection between the electrode 18 and the conductive resin 8. An effect is also born.
  • FIG. 16 shows a circuit board 90 according to a ninth embodiment of the present invention.
  • the circuit board 90 is different from the circuit board 80 of the eighth embodiment in that the top surface 9 has an opening 19 where the base material 2 is exposed without being covered with the electrode 18. Since the conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8, a reinforcing effect is obtained. It is done.
  • a circuit board that is resistant to peeling due to external stress is provided by adding a reinforcing effect by the opening 19 to the effect of improving the connection strength between the conductive film 13 and the conductive resin 8 by the electrode 18. can do.
  • FIG. 17 shows a circuit board 91 according to the tenth embodiment of the present invention.
  • the circuit board 91 is different from the circuit board 90 of the ninth embodiment in that the top surface 9 has an opening 19 that is not covered with the electrode 18 and exposes the base material 2. Since the conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8, a reinforcing effect is obtained. It is done. Therefore, according to the present embodiment, the reinforcing effect by the adhesion between the base material 2 and the conductive resin 8 in the opening 19 can prevent peeling of the electrode 18 and the conductive resin, thereby improving the strength of the circuit board. . It should be noted that the present invention is not limited to those shown in the above-described embodiments, and those skilled in the art can also make changes and applications based on the description and well-known techniques. Yes, included in the scope of protection.
  • the present invention Since the present invention has actual electronic components mounted in the recesses formed in the base material, it can be made thinner.
  • a groove is provided in the base material and a conductive resin is applied to the inside of the groove, so that it has a shielding function and is resistant to external stress, and is small such as a mobile phone, PHS (Personal Handyphone System), PDA (Personal Digital Assistant). It is useful for electronic equipment.
  • Circuit board 2 Base material 3, 101 Recess 3A Bottom surface of recess 3B Side surface of recess 4, 102 Electronic component 5, 16 Groove 5A Groove Side surface 5B Bottom surface of groove 6, 12, 104, 106 Electrode 7, 103 Insulating resin 8, 105 Conductive resin 9 Top surface of substrate 10 Protective electrode 11 Top surface of insulating resin 13 Conductive film 14 Insulating resin 14 Top surface 15 Inner surface of conductive film 17 Protective film 18 Surface electrode 19 Opening V Via

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention a pour objectif de réaliser une carte de circuit imprimé qui possède une fonction de protection de composants électroniques intégrés contre le bruit, et qui présente une résistance aux contraintes extérieures renforcée et une fiabilité élevée pour une carte de circuit imprimé adaptée à des modèles fins ou petits. La carte de circuit imprimé (1) a la forme d'un parallélépipède de fine épaisseur, et est équipée : d'un matériau de base (2), d'une partie en creux (3), de composants électroniques (4), d'une rainure (5), d'électrodes (6), d'une résine isolante (7), et d'une résine conductrice (8). La connexion de la résine conductrice (8) avec une électrode (6B) s'opérant dans la partie interne de la rainure (5), et les contraintes sur la surface de connexion de l'électrode (6B) avec la résine conductrice (8) qui se trouve dans la partie interne étant réduites même lorsque des contraintes extérieures sont exercées sur la surface de la carte de circuit imprimé, une connexion électrique puissante peut être obtenue face aux contraintes extérieures. En outre, la pénétration de la résine conductrice (8) dans la partie interne de la rainure (5), permet une forte connexion du matériau de base (2) avec la résine conductrice (8).
PCT/JP2010/007073 2009-12-04 2010-12-03 Carte de circuit imprimé, module de circuit imprimé, et appareil électronique WO2011067946A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-276292 2009-12-04
JP2009276292A JP2013033776A (ja) 2009-12-04 2009-12-04 回路基板、回路モジュール、及び電子機器

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Publication Number Publication Date
WO2011067946A1 true WO2011067946A1 (fr) 2011-06-09

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