WO2011064072A1 - Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses - Google Patents
Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses Download PDFInfo
- Publication number
- WO2011064072A1 WO2011064072A1 PCT/EP2010/066650 EP2010066650W WO2011064072A1 WO 2011064072 A1 WO2011064072 A1 WO 2011064072A1 EP 2010066650 W EP2010066650 W EP 2010066650W WO 2011064072 A1 WO2011064072 A1 WO 2011064072A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- coating
- plastic material
- base body
- housing base
- Prior art date
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims abstract description 143
- 238000000576 coating method Methods 0.000 claims abstract description 113
- 239000011248 coating agent Substances 0.000 claims abstract description 112
- 239000004033 plastic Substances 0.000 claims abstract description 110
- 229920003023 plastic Polymers 0.000 claims abstract description 110
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 19
- 238000001746 injection moulding Methods 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000012463 white pigment Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- 238000002845 discoloration Methods 0.000 claims description 9
- 238000002310 reflectometry Methods 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 239000004697 Polyetherimide Substances 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229920000491 Polyphenylsulfone Polymers 0.000 claims description 4
- 239000004954 Polyphthalamide Substances 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 230000006378 damage Effects 0.000 claims description 4
- 229920001601 polyetherimide Polymers 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 229920006375 polyphtalamide Polymers 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 239000004811 fluoropolymer Substances 0.000 claims description 3
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- -1 lithopone Chemical compound 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
- 239000000945 filler Substances 0.000 description 10
- 238000004382 potting Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 4
- 239000012764 mineral filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229920006153 PA4T Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004956 Amodel Substances 0.000 description 1
- 229920006060 Grivory® Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920006106 Zytel® HTN Polymers 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 229920006119 nylon 10T Polymers 0.000 description 1
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000010909 process residue Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Definitions
- An object to be solved is to provide a housing for an optoelectronic component, which is characterized by an increased aging resistance and at the same time improved optical properties.
- a housing for an optoelectronic component is specified.
- the optoelectronic component is, for example, an optoelectronic component
- the optoelectronic semiconductor chip may be radiation-receiving or radiation-emitting.
- the housing may be a housing for at least one light-emitting diode chip, at least one
- Laser diode chip and / or act at least one photodiode chip are used.
- the housing comprises a housing base body having a recess.
- the recess of the housing base body is designed such that it is for receiving at least one
- the recess for example, the recess laterally limiting
- the housing comprises a coating which is connected at least in places in the region of the recess at least in places to the housing base body and in direct contact with the housing Housing body is stationary.
- the coating is thus a part of the housing, for example, directly on an outer surface of the housing body
- the coating is present at least in the region of the recess.
- the coating is present at least in the region of the recess.
- housing body in the region of the recess to be completely covered by the coating Furthermore, it is possible that only side surfaces or parts of side surfaces of the recess of the housing base body are covered by the coating and other regions of the recess, for example their bottom surface, are free of the coating or substantially free of the coating.
- substantially free of the coating may mean that the bottom surface of the recess is at most one
- the coating has a uniform thickness. This means in particular that the thickness of the
- Coating within the manufacturing tolerance does not change throughout the coating.
- the coating is preferably mechanically firmly connected to the housing base body, such that a release of the coating from the housing base body to destroy the
- the housing base body and the coating form a non-destructive dissolvable unit.
- the housing base body is formed with a first plastic material and the coating is provided with a second
- Plastic materials of housing body and coating may have the same components, but differ from each other in at least one component. According to at least one embodiment of the housing
- the first plastic material and the second plastic material differ from one another with regard to at least one of the following material properties:
- the plastic material with the higher temperature resistance is characterized in particular by the fact that it is only from a higher limit temperature than the plastic material with the lower
- the higher temperature resistant plastic material can withstand a longer time of deformation, discoloration, or destruction at a given temperature than the lower temperature resistant material.
- the one plastic material may be a material that resists discoloration for a longer time than the other plastic material, but less resistant to deformation than the other plastic material.
- electromagnetic radiation resistance is understood to mean the material having the higher resistance to electromagnetic radiation deforms or discolors later than the plastic material having the lower resistance
- the electromagnetic radiation is, for example, electromagnetic radiation from the wavelength range of UV radiation or blue light.
- electromagnetic radiation is, for example, electromagnetic radiation from the wavelength range of UV radiation or blue light.
- Discoloration of the plastic material with greater resistance to electromagnetic radiation then occurs delayed as compared to a material with less
- the housing for an optoelectronic component, the housing comprises a
- Housing body which has a recess, a
- Plastic material is formed, the coating is formed with a second plastic material, the first
- Plastic material is different from the second plastic material, and the first plastic material and the second
- Plastic material differ from one another with regard to at least one of the following material properties: temperature resistance with respect to discoloration,
- Temperature resistance with regard to deformation Temperature resistance to destruction, resistance to electromagnetic radiation.
- the plastic material with the higher temperature resistance has the lower resistance to electromagnetic radiation.
- the same plastic materials can be used and the different properties of
- Housing body and coating are adjusted by fillers in the plastic material. Furthermore, it is particularly possible for the body recycled plastics too
- the housing described here is therefore particularly inexpensive to produce and particularly environment-friendly.
- the basic body and the coating of the housing differ in terms of their optical properties
- the plastic materials of the housing base body and the coating are not necessary for the plastic materials of the housing base body and the coating to differ from each other in terms of their optical properties. In this case, the optical
- the coating may be reflective for electromagnetic radiation from a certain wavelength range
- Radiation absorbing for the same or another wavelength range can be performed. It is, however possible that the plastic materials, that is, the first and the second plastic material, have different optical properties from each other. It may then be possible that neither the first plastic material nor the second plastic material for the formation of
- Housing body and coating is provided with a filler.
- the housing base body may then consist of the first plastic material and the coating may consist of the second plastic material.
- the coating for UV radiation has a reflectivity of greater than 80%. That is, for at least one wavelength in the range of UV radiation, the reflectivity of the coating is greater than 80%.
- the reflectivity of the coating may preferably be greater than 90%, particularly preferably greater than 95%.
- the coating for visible radiation has a reflectivity of greater than 80%. That is, for at least one
- the reflectivity of the coating is greater than 80%.
- the coating may have a reflectivity of greater than 90%, preferably greater than 95% for this wavelength. It is also possible that the coating is for a UV radiation and a visible one
- the coating comprises the second plastic material and a
- the white pigment may, for example, in the form of particles and / or in the form of fibers in the second
- the coating can then in particular consist of the second plastic material and the white pigment.
- the white pigment is, for example, an achromatic inorganic pigment having a high refractive index of preferably greater than 1.45, preferably greater than 1.75.
- the white pigment may comprise at least one of the following materials: titanium dioxide in the anatase configuration and / or in the rutile configuration, lithopone, barium sulfate, zinc oxide, zinc sulfide,
- Zirconia, boron nitride, aluminoxane for example
- the second plastic material has a smaller one
- Temperature resistance for example, in terms of a
- the second plastic material optionally forms the coating of the housing with further fillers. It is possible that the second
- Plastic material from locations where elevated temperatures occur in the housing may be spaced. For example, it is possible that the coating is less strongly heated during assembly of the housing by soldering than the housing base body. For the second plastic material may then be less with respect to discoloration
- temperature-resistant plastic material can be selected.
- the second plastic material can be more temperature-resistant than the first plastic material in terms of deformation.
- Plastic material is the first then softer, so for example, slightly melted, which improves the adhesion between the two plastic materials.
- the first plastic material then has a lower melting point than the second plastic material.
- the first plastic material has a lower resistance
- the housing base body can at least in places by the coating of
- Component of the housing or outside of the housing is generated, be shielded. It may therefore be sufficient for the second plastic material to choose a radiation resistant material and for the first plastic material to use a less radiation resistant material.
- the first plastic material is selected from a group comprising at least one of the following materials: polyamide, polyphenylene sulfide, polyetherimide, polyphenylsulfone,
- Polyphthalamide Polyetheretherketone. These materials are found individually or in mixture with others
- Materials as particularly temperature-resistant, so that they can cope, for example, the stresses in a soldering process.
- the second plastic material is selected from a group comprising at least one of the following materials: polyester, fluoropolymer, polyether ketones, liquid crystal polymer,
- the housing has a further coating which, at least
- Housing body is applied, and the other
- Coating differs in terms of their optical properties of the housing base body and the coating.
- the further coating can with the first
- Plastic material to be formed with the second plastic material or another plastic material is
- the further coating is formed with the same plastic material as the coating,
- the further coating may then contain, for example, radiation-absorbing material, such as soot particles, whereby the further coating may then contain, for example, radiation-absorbing material, such as soot particles, whereby the further coating
- Coating radiation-absorbing is formed.
- the contrast between the coating and the further coating in a plan view of the housing is particularly large.
- the further coating consists of the same plastic material as the housing, but of the latter with regard to the optical properties different. So can the further coating
- a filler such as carbon black
- the housing base body, the coating and, if present, the further coating are each injection-molded.
- Injection molding is in this case of other manufacturing processes by typical for the manufacturing process residues such as a seam or the demolition of a spray nozzle on the finished
- the feature injection-molded is therefore an objective feature that can be distinguished from other production methods.
- the housing is manufactured by means of a multi-component injection molding process, for example a two-component injection molding process or a three-component injection molding process.
- the housing base body, the coating and, if present, the further coating can be mechanically connected to one another as connection-free.
- the components of the housing such as the housing base body and the coating form a solid, non-destructive releasable connection, not by a connecting means - such as a
- Adhesive - is mediated between the components. Such a connection means free connection between the
- Components of the housing is in particular by the
- the second plastic material may then be present as a foil, for example with reflective fillers. This is possible in particular if the second plastic material comprises a material or consists of a material
- Injection molding such as some types of PTFE.
- the film can then either be placed in an empty casting tool and back-injected with the first plastic material or the film is placed on the already finished
- the film may then be between 0.1 and 0.5 mm thick and preferably has a reflectivity of greater than 90% for UV radiation and / or visible light.
- the optoelectronic component comprises a housing, as described in at least one of the embodiments described here or in at least one of those described here
- the optoelectronic component further comprises at least one Radiation-emitting semiconductor chip, such as a light-emitting diode chip or a laser diode chip.
- At least one radiation-emitting semiconductor chip is arranged in the recess of the housing base body.
- At least one radiation-emitting semiconductor chip can be fastened to the bottom surface of the recess and electrically connected.
- the housing can be next to the housing body and the coatings
- connection points which are mechanically fixed, for example, by the multi-component injection molding with at least one other component of the housing.
- Figures 1 to 3 show side views of
- FIG. 1 shows a schematic sectional illustration of a first exemplary embodiment of one described here
- the optoelectronic component comprises a housing 1.
- the housing 1 has a
- the housing base 2 on.
- the housing base 2 is formed with a first plastic material.
- Housing main body 2 may contain at least one of the following plastic materials or consist of one of the following plastic materials: high-temperature polyamides, polyphenylene sulfide (PPS), polyetherimide (PEI) and / or
- PPSU Polyphenylsulfone
- LCP polyether ketone
- Recycled types such as recyclates can also be used.
- the housing base 2 is preferably a
- the first plastic material for the first plastic material for the first plastic material
- Housing main body 2 is thus characterized for example by a particularly high temperature resistance.
- the housing base body 2 also has a recess 4, in which in places no material of the housing base body is present.
- the recess 4 is bounded for example by a tapered side wall 4a and a bottom surface 4b.
- the recess 4 is dimensioned such that it
- Receiving at least one optoelectronic semiconductor chip is suitable.
- the housing base body 2 has, on its upper side facing away from the bottom surface 4b of the recess 4, an outer surface 2a, which surrounds the recess 4.
- the housing 1 further comprises a coating 3.
- Coating 3 is formed with a second plastic material made of the first plastic material of the
- Housing body 2 is different.
- one of the following second is suitable for the coating 3
- Plastic materials high temperature polyamides such as Amodel, Grivory, Genestar, Zytel HTN, Stanyl, PA4T, which are used to
- Improvement in aging stability may include other mineral fillers such as glass fibers or other fillers, and / or polyesters such as PBT (Pocan), PET (Impet), PEN, PCT optionally with mineral fillers such as glass fibers or other fillers and / or sprayable fluoropolymers such as PFA,
- FEP optionally with mineral fillers such as glass fibers or other fillers and / or PEEK
- LCP optionally with mineral fillers such as glass fibers or other fillers and / or silicone in liquid silicone injection molding.
- the outer surface 3a of the coating 3 serves for example for the reflection of electromagnetic radiation and is filled with a white pigment for this purpose.
- the coating 3 is made
- the white pigment for example, from the second plastic material and the white pigment, which may be in the form of particles.
- a titanium dioxide is used as white pigment.
- the white pigment is present at between 10% and 35% concentration.
- Housing body 2 applied. Housing body 2 and
- Coating 3 are connected to each other by means of a two-component injection molding.
- the housing 1 further has connection points 9, which in the region of the recess 4 connecting areas 8a, 8b for
- the coating 3 can by means of
- the optoelectronic component also has a
- optoelectronic component for example a
- Optoelectronic semiconductor chip 7 which is preferably a radiation-emitting
- optoelectronic semiconductor chip such as a light-emitting diode chip or a laser diode chip is.
- the optoelectronic semiconductor chip 7 is electrically conductive with the first connection region 8a and the second
- the optoelectronic semiconductor chip 7 by means of a contact wire 6 with the second
- Connection area 8a be electrically conductively connected.
- the recess 4 is presently filled with a potting material 5, which is designed to be radiation-permeable.
- potting material 5 can radiation scattering and / or
- the potting material 5 is, for example, in direct contact with the outer surface 3a of the coating 3.
- the first plastic material has a slightly lower melting point than the second plastic material when the first plastic material is first injected.
- the melting point of the first plastic material is
- Plastic material may be used, for example, in one of the following materials: PA4T, PA8T, PA10T / PA66, PBT, PET.
- one of the following materials may be used for the second plastic material: PA6T / 61, PA6T / 66, PEEK, LCP.
- Coating 3 may be a silicone filled with a white pigment, such as titanium dioxide particles.
- a white pigment such as titanium dioxide particles.
- the potting material 5 also contains a silicone or consists of a silicone.
- the adhesion between the housing 1 and the potting material 5 is particularly high, so that the likelihood of delamination of the potting material 5 during operation of the
- the coating 3 covers the housing base 2 not only in the region of the recess 4, but also the outer surface 2a of the base body 2 is at least in places of the
- the coating 3 can in this case
- the coating 3 is formed black, so that the contrast between that of the optoelectronic
- the housing base body 2 may be formed in this case in a different color, for example white.
- Coating 3 and housing body 2 are also in
- Coating 3 is arranged no connecting means, so that the connection between the two housing components
- a further coating 30 which differs in their optical properties of the optical properties of the housing body 2 and the coating 3.
- the further coating 30 is designed to absorb radiation
- the housing body 2 can then be made less absorbent than the further coating 30 and less reflective than the coating 3.
- the coating 30 can by means of a further injection molding on Housing base 2 and the coating 3 to be attached.
- the housing 1 is generated in the embodiment of Figure 3 by a three-component injection molding.
- the further coating 30 can be made from the first
- Plastic material of the coating 3 or another plastic material may be formed. Overall, a housing described here and an optoelectronic component described here proves to be
- the main body 2 of the housing 1 is made of a low-priced, for example, a recycled plastic, which is characterized for example by a high solder resistance, that is, in particular by a high temperature resistance.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10773316A EP2504861A1 (de) | 2009-11-25 | 2010-11-02 | Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses |
JP2012540348A JP2013512556A (ja) | 2009-11-25 | 2010-11-02 | オプトエレクトロニクス部品のハウジングおよびハウジング製造方法 |
CN201080053529XA CN102630346A (zh) | 2009-11-25 | 2010-11-02 | 用于光电子构件的壳体和用于制造壳体的方法 |
US13/511,414 US9006773B2 (en) | 2009-11-25 | 2010-11-02 | Housing for an optoelectronic component and method for producing a housing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009055786A DE102009055786A1 (de) | 2009-11-25 | 2009-11-25 | Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses |
DE102009055786.5 | 2009-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011064072A1 true WO2011064072A1 (de) | 2011-06-03 |
Family
ID=43383620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/066650 WO2011064072A1 (de) | 2009-11-25 | 2010-11-02 | Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses |
Country Status (8)
Country | Link |
---|---|
US (1) | US9006773B2 (de) |
EP (1) | EP2504861A1 (de) |
JP (1) | JP2013512556A (de) |
KR (1) | KR20120117792A (de) |
CN (1) | CN102630346A (de) |
DE (1) | DE102009055786A1 (de) |
TW (1) | TWI440227B (de) |
WO (1) | WO2011064072A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011120835A1 (de) * | 2010-03-30 | 2011-10-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil, gehäuse hierfür und verfahren zur herstellung des optoelektronischen bauteils |
EP2693854A3 (de) * | 2012-08-02 | 2014-02-26 | Kindwin Opto Electronic (Shen Zhen) Co. Ltd. | Wasserdichte kontrastreiches oberflächenmontierte LED-Lampe |
CN104246364A (zh) * | 2012-04-12 | 2014-12-24 | 夏普株式会社 | 光源基板单元 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US9159892B2 (en) * | 2010-07-01 | 2015-10-13 | Citizen Holdings Co., Ltd. | LED light source device and manufacturing method for the same |
JP2014011029A (ja) * | 2012-06-29 | 2014-01-20 | Toshiba Lighting & Technology Corp | 照明装置 |
WO2013025832A1 (en) * | 2011-08-16 | 2013-02-21 | E. I. Du Pont De Nemours And Company | Reflector for light-emitting diode and housing |
DE102014102258B4 (de) | 2014-02-21 | 2021-08-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement |
DE102014106882A1 (de) * | 2014-05-15 | 2015-11-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
KR102360957B1 (ko) * | 2015-03-27 | 2022-02-11 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 |
CN107615499B (zh) * | 2015-06-01 | 2020-01-24 | 三菱电机株式会社 | 发光装置、显示单元以及视频显示装置 |
JP6728764B2 (ja) * | 2016-02-26 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置及びそれを用いた照明装置 |
JP7117170B2 (ja) * | 2018-06-20 | 2022-08-12 | スタンレー電気株式会社 | 発光装置 |
JP7212241B2 (ja) | 2018-06-21 | 2023-01-25 | 日亜化学工業株式会社 | 発光装置 |
JP7190889B2 (ja) * | 2018-12-07 | 2022-12-16 | スタンレー電気株式会社 | 発光装置及び発光装置モジュール |
TWI740149B (zh) * | 2019-05-24 | 2021-09-21 | 華碩電腦股份有限公司 | 殼體的製造方法 |
CN113410374B (zh) * | 2021-06-17 | 2022-10-04 | 中国科学院半导体研究所 | 一种混色led器件 |
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WO2001082385A1 (de) * | 2000-04-26 | 2001-11-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement |
WO2003038912A2 (de) * | 2001-10-31 | 2003-05-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
DE10229067A1 (de) * | 2002-06-28 | 2004-01-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US20070269927A1 (en) * | 2003-02-28 | 2007-11-22 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body |
US20080054287A1 (en) * | 2006-08-31 | 2008-03-06 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
DE102006046678A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement |
WO2008060490A2 (en) * | 2006-11-09 | 2008-05-22 | Quantum Leap Packaging, Inc. | Led reflective package |
US20080210964A1 (en) * | 2006-09-22 | 2008-09-04 | Kabushiki Kaisha Toshiba | Optical semiconductor device and method for manufacturing optical semiconductor device |
US20090101897A1 (en) * | 2006-01-20 | 2009-04-23 | Hymite A/S | Package for a light emitting element |
DE102008038748A1 (de) * | 2008-08-12 | 2010-02-18 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares, optoelektronisches Halbleiterbauteil |
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JP2004071950A (ja) | 2002-08-08 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体パッケージおよびその製造方法 |
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-
2009
- 2009-11-25 DE DE102009055786A patent/DE102009055786A1/de not_active Withdrawn
-
2010
- 2010-11-02 CN CN201080053529XA patent/CN102630346A/zh active Pending
- 2010-11-02 WO PCT/EP2010/066650 patent/WO2011064072A1/de active Application Filing
- 2010-11-02 KR KR1020127016558A patent/KR20120117792A/ko not_active Application Discontinuation
- 2010-11-02 JP JP2012540348A patent/JP2013512556A/ja active Pending
- 2010-11-02 US US13/511,414 patent/US9006773B2/en not_active Expired - Fee Related
- 2010-11-02 EP EP10773316A patent/EP2504861A1/de not_active Withdrawn
- 2010-11-22 TW TW099140164A patent/TWI440227B/zh not_active IP Right Cessation
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WO2011120835A1 (de) * | 2010-03-30 | 2011-10-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil, gehäuse hierfür und verfahren zur herstellung des optoelektronischen bauteils |
CN104246364A (zh) * | 2012-04-12 | 2014-12-24 | 夏普株式会社 | 光源基板单元 |
EP2693854A3 (de) * | 2012-08-02 | 2014-02-26 | Kindwin Opto Electronic (Shen Zhen) Co. Ltd. | Wasserdichte kontrastreiches oberflächenmontierte LED-Lampe |
Also Published As
Publication number | Publication date |
---|---|
EP2504861A1 (de) | 2012-10-03 |
TWI440227B (zh) | 2014-06-01 |
DE102009055786A1 (de) | 2011-05-26 |
JP2013512556A (ja) | 2013-04-11 |
US9006773B2 (en) | 2015-04-14 |
TW201131826A (en) | 2011-09-16 |
KR20120117792A (ko) | 2012-10-24 |
CN102630346A (zh) | 2012-08-08 |
US20120273811A1 (en) | 2012-11-01 |
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