WO2011039948A1 - Composition de résine adhésive pour plaques de silicium - Google Patents

Composition de résine adhésive pour plaques de silicium Download PDF

Info

Publication number
WO2011039948A1
WO2011039948A1 PCT/JP2010/005479 JP2010005479W WO2011039948A1 WO 2011039948 A1 WO2011039948 A1 WO 2011039948A1 JP 2010005479 W JP2010005479 W JP 2010005479W WO 2011039948 A1 WO2011039948 A1 WO 2011039948A1
Authority
WO
WIPO (PCT)
Prior art keywords
compound
resin composition
epoxy resin
silicon wafer
bisphenol
Prior art date
Application number
PCT/JP2010/005479
Other languages
English (en)
Japanese (ja)
Inventor
森貴裕
福田芳弘
藤井飛鳥
出口雄一郎
Original Assignee
株式会社Adeka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Adeka filed Critical 株式会社Adeka
Priority to CN201080042465.3A priority Critical patent/CN102575137B/zh
Publication of WO2011039948A1 publication Critical patent/WO2011039948A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3225—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

  • an object of the present invention is to provide a thermosetting resin composition that exhibits good adhesion to a silicon wafer.
  • the epoxy resin is preferably an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton, and the compound having a urea structure is preferably a reaction product of an amine compound and an isocyanate compound.
  • other resins can be used in combination with the epoxy resin.
  • the other resin include phenol resin, polyamide resin, polyimide resin, cyanate ester compound, phenoxy resin, and polybutadiene rubber.
  • a product obtained by replacing a part of phenols with an aromatic compound such as biphenyl it is also possible to use a product obtained by replacing a part of phenols with an aromatic compound such as biphenyl. Furthermore, a phenol resin obtained by connecting the above phenols with dicyclopentadiene can also be used.
  • the silicon wafer adhesive resin composition of the present invention preferably further contains a polyamide compound having a phenolic hydroxyl group adjacent to the amino group and having a structure derived from a phenolic hydroxyl group-containing aromatic diamine. . This further improves the high glass transition temperature, toughness, high adhesion, and low thermal expansion.
  • a resin composition having the composition shown in Table 1 or 2 below and propylene glycol monomethyl ether are mixed and coated on a silicon wafer so that the film thickness after curing is 30 to 40 ⁇ m, and then is applied at 100 ° C. for 10 minutes. The solvent was removed and dried, and then the resin was cured at 180 ° C. for 1 hour.
  • a peel test cross-cut test
  • JIS D0202 cross cut test method
  • a pressure cooker test was performed for 96 hours under the conditions of 121 ° C./2.1 atm / 100% RH, and then a cross cut test was performed.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne une composition de résine adhésive pour plaques de silicium qui, à l'état durci, présente une excellente adhérence à des plaques de silicium, caractérisée en ce qu'elle comprend une résine époxy et un composé de structure urée en quantités telles que la fraction de structure urée du composé est contenue en une quantité de 0,1 à 50 parties en masse pour 100 parties en masse de la résine époxy. La résine époxy est de préférence une résine époxy qui a un squelette de bisphénol A ou un squelette de bisphénol F, tandis que le composé de structure urée est de préférence un produit de réaction d'un composé d'amine avec un composé d'isocyanate.
PCT/JP2010/005479 2009-10-01 2010-09-07 Composition de résine adhésive pour plaques de silicium WO2011039948A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201080042465.3A CN102575137B (zh) 2009-10-01 2010-09-07 硅晶圆用黏合性树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009229185A JP5565931B2 (ja) 2009-10-01 2009-10-01 シリコンウエハ接着性樹脂組成物
JP2009-229185 2009-10-01

Publications (1)

Publication Number Publication Date
WO2011039948A1 true WO2011039948A1 (fr) 2011-04-07

Family

ID=43825801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/005479 WO2011039948A1 (fr) 2009-10-01 2010-09-07 Composition de résine adhésive pour plaques de silicium

Country Status (5)

Country Link
JP (1) JP5565931B2 (fr)
KR (1) KR101638660B1 (fr)
CN (1) CN102575137B (fr)
TW (1) TWI504710B (fr)
WO (1) WO2011039948A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103059786A (zh) * 2011-10-21 2013-04-24 山东轻工业学院 一种绝缘材料胶黏剂

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011118760A1 (de) * 2011-11-15 2013-05-16 Alzchem Ag Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen
WO2021193233A1 (fr) * 2020-03-25 2021-09-30 株式会社Adeka Composition de résine durcissable et procédé de suppression du retrait lors du durcissement d'une composition de résine durcissable

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049086A (ja) * 1999-08-09 2001-02-20 Sumitomo Metal Mining Co Ltd 導電性樹脂組成物
WO2001060938A1 (fr) * 2000-02-15 2001-08-23 Hitachi Chemical Co., Ltd. Composition adhesive, procede de production de ladite resine, film adhesif fabrique a partir de ladite resine, substrat pour montage de semi-conducteur et dispositif semi-conducteur
JP2004189790A (ja) * 2002-12-09 2004-07-08 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2004231932A (ja) * 2002-12-02 2004-08-19 Nitto Denko Corp 接着剤組成物、接着フィルムおよびこれを用いた半導体装置
WO2006090794A1 (fr) * 2005-02-23 2006-08-31 Asahi Kasei Chemicals Corporation Durcisseur latent pour resine epoxy et composition de resine epoxy
WO2006129480A1 (fr) * 2005-05-31 2006-12-07 Adeka Corporation Composition de resine epoxy durcissable
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133856A (en) * 1980-03-21 1981-10-20 Nitto Electric Ind Co Ltd Epoxy resin composition for sealing semiconductor
JP4662793B2 (ja) * 2005-03-01 2011-03-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049086A (ja) * 1999-08-09 2001-02-20 Sumitomo Metal Mining Co Ltd 導電性樹脂組成物
WO2001060938A1 (fr) * 2000-02-15 2001-08-23 Hitachi Chemical Co., Ltd. Composition adhesive, procede de production de ladite resine, film adhesif fabrique a partir de ladite resine, substrat pour montage de semi-conducteur et dispositif semi-conducteur
JP2004231932A (ja) * 2002-12-02 2004-08-19 Nitto Denko Corp 接着剤組成物、接着フィルムおよびこれを用いた半導体装置
JP2004189790A (ja) * 2002-12-09 2004-07-08 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
WO2006090794A1 (fr) * 2005-02-23 2006-08-31 Asahi Kasei Chemicals Corporation Durcisseur latent pour resine epoxy et composition de resine epoxy
WO2006129480A1 (fr) * 2005-05-31 2006-12-07 Adeka Corporation Composition de resine epoxy durcissable
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103059786A (zh) * 2011-10-21 2013-04-24 山东轻工业学院 一种绝缘材料胶黏剂

Also Published As

Publication number Publication date
KR101638660B1 (ko) 2016-07-11
CN102575137B (zh) 2014-11-26
JP2011074298A (ja) 2011-04-14
JP5565931B2 (ja) 2014-08-06
TWI504710B (zh) 2015-10-21
KR20120090984A (ko) 2012-08-17
TW201120172A (en) 2011-06-16
CN102575137A (zh) 2012-07-11

Similar Documents

Publication Publication Date Title
JP5603610B2 (ja) 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
RU2592274C2 (ru) Конструкционный клей и его применение для склеивания
JP5415947B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
JP5365003B2 (ja) ハネムーン型接着剤組成物、実装基板の接着方法および実装基板組み立て体
TWI465477B (zh) A liquid cyanate ester - epoxy composite resin composition
JP4771100B2 (ja) 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
KR101803123B1 (ko) 잠재성 경화제 조성물 및 일액 경화성 에폭시 수지 조성물
JP4776323B2 (ja) 乳化剤組成物
JP4938567B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
JP6886786B2 (ja) 一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5565931B2 (ja) シリコンウエハ接着性樹脂組成物
US7226981B2 (en) Curing agent composition for epoxy resin
JP5881609B2 (ja) 樹脂組成物
JP2015117333A (ja) マスターバッチ型潜在性エポキシ樹脂硬化剤組成物及びこれを用いたエポキシ樹脂組成物
JP4201632B2 (ja) エポキシ樹脂用硬化剤組成物
TW202309215A (zh) 黏接劑組成物及黏接劑組成物之製造方法
JP5361686B2 (ja) 液状アミン系潜在性硬化剤組成物
WO2015083622A1 (fr) Composition de résine thermodurcissable
WO2022190746A1 (fr) Composition de résine durcissable, produit durci et adhésif

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080042465.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10820074

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20127007294

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10820074

Country of ref document: EP

Kind code of ref document: A1