WO2011028805A2 - Ensembles d'éclairage à del refroidie - Google Patents

Ensembles d'éclairage à del refroidie Download PDF

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Publication number
WO2011028805A2
WO2011028805A2 PCT/US2010/047537 US2010047537W WO2011028805A2 WO 2011028805 A2 WO2011028805 A2 WO 2011028805A2 US 2010047537 W US2010047537 W US 2010047537W WO 2011028805 A2 WO2011028805 A2 WO 2011028805A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
led
circuit board
leds
heat pipe
Prior art date
Application number
PCT/US2010/047537
Other languages
English (en)
Other versions
WO2011028805A3 (fr
Inventor
David Sooil Koh
Original Assignee
Savenergy Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Savenergy Inc. filed Critical Savenergy Inc.
Publication of WO2011028805A2 publication Critical patent/WO2011028805A2/fr
Publication of WO2011028805A3 publication Critical patent/WO2011028805A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to LED (Light Emitting Diode) illumination systems, particularly illumination systems having cooling devices to improve the LED's efficiency.
  • LED Light Emitting Diode
  • Fig. 1 is an oblique perspective view of an embodiment of a light assembly of the present invention.
  • Fig. 2 is a front perspective view of this embodiment.
  • Fig. 3 is a side perspective view of this embodiment.
  • Fig. 4 is a bottom perspective view of this embodiment.
  • Fig. 5 is an elevation in section of another embodiment of a screw-in light bulb of the present invention through plane 5 of Fig. 6.
  • Fig. 6 is a top plan view thereof through the plane 6 of Fig. 5, showing a fin assembly used in a prototype, having curved fins.
  • Fig. 7 is a side perspective view of a fin assembly of an embodiment similar to fig. 5, having curved fins.
  • Fig. 8 is a cut away perspective view thereof.
  • Fig. 9 is a top oblique perspective view thereof.
  • Fig. 10 is a bottom plan view of the circuit board of that embodiment with some LEDs applied.
  • Fig. 11 is a side elevation of a similar and presently preferred embodiment having planar fins rather than curved fins.
  • Fig. 12 is an exploded view thereof.
  • Fig. 13 is an oblique perspective view of a heat pipe used in this embodiment.
  • Fig. 14 is an oblique perspective view of a center tube for mounting the heat pipes used in this embodiment.
  • Fig. 15 is a perspective view of the fin assembly, having straight fins.
  • Fig. 16 is a bottom plan view of the preferred embodiment as of September 1, 2010.
  • Fig. 17 is a side elevation of part thereof from plane 17 of fig. 16.
  • Fig. 18 is a is a side elevation in section through plane 18 of fig. 16.
  • Fig. 19 is an elevation in partial section of another embodiment of a LED assembly of the present invention designed for use in a florescent tube fixture.
  • Fig. 20 is a side elevation in section through plane 20 of fig. 19.
  • the present invention contemplates using an LED Assembly in which LEDs are adjacent heat pipes, which are preferably wick type heat pipes, comprising a fluid such as acetone or deionized water, in an evacuated copper pipe.
  • the fluid condenses when cool, and evaporates when heated, and thereby moves heat very rapidly around the hot side of an optional Peltier device.
  • the wick in the pipe renders it even more efficient at heat transfer.
  • the heat pipe carries heat from the LEDs to distal heat sinks for dissipation in the ambient fluid medium, such as air.
  • These heat sinks are generally aluminum, but may be of any metal that is a good heat conductor.
  • the invention contemplates a optional Peltier cooling element, powered by wires, to pump heat from an LED to the heat pipe or from heat pipe to heat sink, but, so far, the presently preferred embodiments seem to work better without the thermocouples of the Peltier cooling blanket, and Peltier effect devices have therefore been mostly omitted from our present detailed description of the presently embodiments.
  • the device By cooling the LEDs down to a maximum of 40 degrees C, the device increases LED light vs. power efficiency, significantly.
  • Fig. 1 shows a prototype, generally designated 50. On the top surface 52 is a plurality of Light Emitting Diode (LED) strips 61-75.
  • LED Light Emitting Diode
  • a power supply 120 converts 120 VAC power to 12 VDC to power the LEDs 61- 75 and the thermocouple 1 10. This power supply be changed for different power systems, such as 220 volts in Europe. For use on a 12 volt boat or car, voltage conversion would not be needed.
  • thermocouple 110 is optional, and may be omitted.
  • Fig. 1 details top surface 52.
  • the LEDs 61-75 are wired in series by wires 81-84 and soldered to the LED strips 61-75.
  • the LEDs 61-75 give off heat, but are most efficient when cool. LEDs are housed between three heat conductive metal blocks, such as aluminum blocks 88-90. These are mounted on finned heat sink 92, to dissipate some of the heat generated by the LEDs, fig. 4.
  • heat pipes 101-102 run beneath LEDs 61-75 as in Fig. 1, and continue down to heat sinks 103-104 as in figs. 4-6, to conduct heat efficiently to finned heat sinks 92 & 103-104.
  • a layer 110 between: aluminum blocks 88-90 that form top surface 52, and heat sink 92 is an optional Peltier thermocouple 110.
  • the optional Peltier thermocouple 110 pumps heat from the blocks 88- 90 and the pipes 101-102 to heat sink 92, making the heat sink hotter than the LEDs to radiate more heat and to actively cool the LEDs. LEDs are much more efficient, the colder they are.
  • Fig. 4 is a bottom plan view showing the three finned heat sinks 92 & 103-104.
  • Fig. 5 shows an embodiment, generally designated 200, for screwing into an ordinary Edison light socket.
  • a standard Edison screw-base 202 for a 120 VAC light bulb supplies 120 VAC to a power supply 204, which converts to 12 VDC.
  • Wires 211-212 supply the 12 VDC to the arrays of LEDs 214 below.
  • bases may be provided for other types of light sockets, along with
  • each LED 214 Over each LED 214 is a heat pipe 221-228, which radiates inward from the LEDs 214.
  • Each heat pipe bends as shown in dotted for pipe 228, and rises up within a central aluminum heat sink 230 shown in partial section.
  • Finned radiator 240 slides over the heat sink 230.
  • Radiator 240, and its multiplicity of radiating fins 242 are shown in side elevation in figs. 5; in top plan in fig. 6.; in side perspective in fig. 7, section in Fig. 8; and top oblique perspective in Fig. 9.
  • Figs. 6-9 are from photos of a radiator having curved fins 242, but these can alternatively be straight fins as 414 in figs. 11, 12 & 15.
  • each LED 214 is part of an array in which the LEDs 214 are mounted on a circuit board 252 mounted beneath a heat pipe such as 221. This arrangement repeats in eight radii around the base 254. Bezel 256 is wrapped around base 254 and secures base 254 to the circumference of radiator 240.
  • Fig. 11 is a side elevation of a slightly different and presently preferred embodiment of the socket-based bulb, showing base 462, and lens or cover 433.
  • Fig. 12 is an exploded view thereof. It shows the heat pipes 410, shown isolated in fig. 13, which radiate from lower arm 410A centerward, to bend 410B, up shaft 410C. As in fig. 12, these heat pipes 410 are located behind 10" diameter circuit board 411, which is 1/32" thick, by mount 412 in slots 413 of mount 412. shafts 410C are inserted into fins 414, after being inserted into hollow metal core 420 in channels 422.
  • the core 420 is shown isolated in fig. 14 and helps as a heat sink, in conjunction with the fins 414 which heat sink and radiate heat.
  • Bezel 430 binds clear cover or lens 433 (as appropriate for flood or spot light purposes) to circuit board 411, mount 412, and fins 414.
  • Fig. 13 is an oblique view of a heat tube 410, which tube 410 radiates inward from lower arm 41 OA centerward, to bend 410B, and up shaft 4 IOC.
  • Fig. 14 is an oblique top-side view showing the top ends 41 OA of heat pipes 410 and insert 422.
  • Fig. 16 shows circuit board 411, including annular conductors 441-444.
  • LEDs 451 span between and are powered by conductors 441-442.
  • LEDs 452 span between and are powered by conductors 443-444.
  • the DC power supply resides within neck 460 which screws into 110 VAC Edison screw-base 462. Power is wired to the circuit board 422 which powers LEDs 451- 452. The LEDs generate heat which reduces their efficiency.
  • This heat is transmitted through the 1/32" thin circuit board 411 to heat pipes 410, each located directly behind a radius of LEDs.
  • the heat pipe fluid evaporates quickly in the vacuum pipe 410 to conduct heat to core 420 and fins 414, which radiate it away into the ambient fluid, such as convective air.
  • FIG. 16-18 Another embodiment, presently preferred as of March 5, 2010 is shown in Figs. 16-18. Holes are cut in circuit board 411 so that inner LEDs 451 and outer LEDs 452 can be
  • Fig. 17 is a side elevation of part thereof from plane 24.
  • Fig. 18 is a is a side elevation in section through plane 25 of that part thereof.
  • Figs. 19 and 20 show a light tube 300 for a florescent light socket. Electricity is supplied by probes 302 to the tube 300. Power supply 304 converts it to DC, transmitted through circuit board 306 to LEDs 308. A flat but malleable heat pipe 310 is bent to fit within aluminum heat sink 312 having fins 314 to radiate heat. Heat pipe 310 transmits the heat efficiently from LEDs 308, making the LEDs cooler and more efficient.
  • the arc that is not occupied by heat sink 312 is a clear plastic cover 320. No mercury or gas contained therein, so the glass sealed tube of a florescent bulb is not required to contain the toxic atmosphere that would reside within a florescent tube.
  • End caps 330 cover the ends of the tube 300 and mount the probes 302.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un ensemble de diodes électroluminescentes dans lequel un caloduc transporte la chaleur entre la DEL et un puits de chaleur distant. Une DEL (451) est montée sur une surface d'éclairage, telle qu'une carte imprimée (411). La DEL est en contact thermique avec un caloduc (410) passant à côté de la DEL en formant un contact thermique avec celle-ci. Une structure métallique conductrice (420, 414) sert de puits de chaleur distant. Le caloduc (410) s'étend entre la DEL et le puits de chaleur afin de conduire efficacement la chaleur de la DEL vers le puits de chaleur.
PCT/US2010/047537 2009-09-01 2010-09-01 Ensembles d'éclairage à del refroidie WO2011028805A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US23899409P 2009-09-01 2009-09-01
US61/238,994 2009-09-01
US35602010P 2010-06-17 2010-06-17
US61/356,020 2010-06-17

Publications (2)

Publication Number Publication Date
WO2011028805A2 true WO2011028805A2 (fr) 2011-03-10
WO2011028805A3 WO2011028805A3 (fr) 2011-06-23

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Family Applications (1)

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PCT/US2010/047537 WO2011028805A2 (fr) 2009-09-01 2010-09-01 Ensembles d'éclairage à del refroidie

Country Status (1)

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WO (1) WO2011028805A2 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102878451A (zh) * 2012-08-10 2013-01-16 秦顺宗 一种照明用led光引擎及其散热片
CN103115343A (zh) * 2013-03-11 2013-05-22 深圳市耀嵘科技有限公司 一种灯具散热器及led工矿灯
EP2703711A1 (fr) * 2012-08-28 2014-03-05 Wentai Technology Corporation Lampe à DEL et son dispositif de dissipation de chaleur
CN103953868A (zh) * 2014-05-13 2014-07-30 安徽万东光电科技有限公司 一种散热高效的大功率led照明灯
GB2525852A (en) * 2014-05-01 2015-11-11 Olivewood Data Technologies Ltd Lighting device
WO2016085857A1 (fr) * 2014-11-26 2016-06-02 Leeper Jonathan Douille à dissipation de chaleur pour dispositifs d'éclairage
EP3406446A1 (fr) * 2017-05-27 2018-11-28 GEW (EC) Limited Appareil de durcissement d'impression à del

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571597B (zh) * 2014-07-15 2017-02-21 Light - emitting diode explosion - proof lamp cooling structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070070645A1 (en) * 2005-09-26 2007-03-29 Coushaine Charles M LED lamp with direct optical coupling in axial arrangement
US20090002995A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Led lamp
US20090097241A1 (en) * 2007-10-10 2009-04-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070070645A1 (en) * 2005-09-26 2007-03-29 Coushaine Charles M LED lamp with direct optical coupling in axial arrangement
US20090002995A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Led lamp
US20090097241A1 (en) * 2007-10-10 2009-04-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102878451A (zh) * 2012-08-10 2013-01-16 秦顺宗 一种照明用led光引擎及其散热片
EP2703711A1 (fr) * 2012-08-28 2014-03-05 Wentai Technology Corporation Lampe à DEL et son dispositif de dissipation de chaleur
CN103115343A (zh) * 2013-03-11 2013-05-22 深圳市耀嵘科技有限公司 一种灯具散热器及led工矿灯
WO2014139217A1 (fr) * 2013-03-11 2014-09-18 深圳市耀嵘科技有限公司 Dispositif de dissipation thermique de lampe, et lampe murale à del
GB2525852A (en) * 2014-05-01 2015-11-11 Olivewood Data Technologies Ltd Lighting device
CN103953868A (zh) * 2014-05-13 2014-07-30 安徽万东光电科技有限公司 一种散热高效的大功率led照明灯
WO2016085857A1 (fr) * 2014-11-26 2016-06-02 Leeper Jonathan Douille à dissipation de chaleur pour dispositifs d'éclairage
EP3406446A1 (fr) * 2017-05-27 2018-11-28 GEW (EC) Limited Appareil de durcissement d'impression à del

Also Published As

Publication number Publication date
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