WO2011021719A1 - Luminaire à del de type lumière fluorescente - Google Patents

Luminaire à del de type lumière fluorescente Download PDF

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Publication number
WO2011021719A1
WO2011021719A1 PCT/JP2010/064426 JP2010064426W WO2011021719A1 WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1 JP 2010064426 W JP2010064426 W JP 2010064426W WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1
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WO
WIPO (PCT)
Prior art keywords
led
cover member
fluorescent lamp
heat
heat dissipation
Prior art date
Application number
PCT/JP2010/064426
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English (en)
Japanese (ja)
Inventor
伊藤　亮
Original Assignee
Itoh Ryoh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itoh Ryoh filed Critical Itoh Ryoh
Priority to JP2011527726A priority Critical patent/JPWO2011021719A1/ja
Publication of WO2011021719A1 publication Critical patent/WO2011021719A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED illuminating lamp that uses an LED (light emitting diode) chip as a light source, and more particularly to a fluorescent lamp type LED illuminating lamp.
  • LED light emitting diode
  • Patent Document 1 discloses a transparent cylindrical pipe (2), a support plate (3) provided inside the pipe (2), and both ends of the support plate (3).
  • the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes an LED package B having an LED chip A, a package substrate C on which the LED package B is mounted on one surface, and the other surface of the package substrate C.
  • Heat sink D stacked on top of each other, heat sink E with a semicircular cross section covering the heat sink D side with both side edges of the heat sink D sandwiched, and a semicircular cross section covering the LED package B side Further, both side edges thereof are provided with translucent covers F connected to both side edges of the heat radiation cover E.
  • JP 2001-351402 A JP 2001-351402 A
  • the fluorescent lamp type LED lighting device described in Patent Document 1 does not include means for radiating heat generated by lighting of the plurality of LEDs (9), each LED (9) is heated to high temperature. Its life is likely to be reduced.
  • the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes a heat radiating plate D and a heat radiating cover E for radiating heat generated by lighting the LED chip A, but an LED package B having the LED chip A. Is mounted on one surface of the package substrate C, and the heat sink D is superimposed on the other surface of the package substrate C.
  • the conventional fluorescent lamp type LED illuminating lamp shown in FIG. 12 is a wide one in which the heat radiating plate D crosses the diameter direction of the fluorescent light type LED illuminating lamp, and the heat radiating cover E covers the heat radiating plate D. Since it has a large arc-shaped cross section, there is a problem that the weight increases.
  • the present invention has been made in response to such problems of the prior art, and can significantly improve the heat dissipation efficiency of the LED chip to achieve a long life, and also achieve a reduction in weight. It is an object of the present invention to provide a fluorescent lamp type LED illumination lamp that can be used.
  • the fluorescent lamp type LED lighting lamp according to the present invention is a straight tube type or annular fluorescent lamp type LED lighting lamp having a base having a terminal connectable to an existing fluorescent lamp socket. And presenting a tubular shape to which a base is attached, a translucent cover having a slit-like opening on a part of its peripheral surface, and a heat dissipation cover member attached to the slit-like opening of the translucent cover,
  • a plurality of LED packages having LED chips have a long plate shape or an annular plate shape arranged in the longitudinal direction, and are fixed to the heat dissipation cover member in a state where the plurality of LED packages are in contact with the inner surface of the heat dissipation cover member.
  • a package substrate is a straight tube type or annular fluorescent lamp type LED lighting lamp having a base having a terminal connectable to an existing fluorescent lamp socket. And presenting a tubular shape to which a base is attached, a translucent cover having a slit-like opening on a part of its peripheral surface
  • the lighting switch when the terminal of the base is connected to the existing fluorescent lamp socket, the lighting switch is turned on, so that a plurality of the LED lamps arranged along the longitudinal direction of the package substrate are provided. Each LED chip of the LED package is turned on, and the lighting light is irradiated through the translucent cover.
  • the generated heat is directly transferred from each LED package to the heat dissipation cover member and efficiently dissipated.
  • each of the plurality of LED packages has an electrode layer in contact with the LED chip in a state of protruding from a base end surface opposite to the light projecting direction of the LED chip.
  • Each LED package can be fitted and mounted in a plurality of mounting holes formed in the package substrate in a state where the LED package is in contact with the inner surface of the heat dissipation cover member.
  • the heat radiating cover member can be formed in a groove shape that enters from the slit-like opening of the translucent cover. In this case, the terminal of the base and the power supply unit connected to the package substrate can be disposed in the groove portion of the heat dissipation cover member.
  • the reflecting surfaces that are inclined so that the width on the side of the rushing end portion becomes gradually narrower than the width on the base end portion side can be formed on the left and right outer surfaces.
  • the fluorescent lamp type LED illuminating lamp of the present invention provided with fastening means for pressing the package substrate against the inner surface side of the heat dissipation cover member together with the LED package, and when the package substrate is fixed to the heat dissipation cover member via the fastening means, Each LED package is pressed and pressed against the inner surface of the heat dissipation cover member, which is preferable because heat transfer from each LED package to the heat dissipation cover member is ensured and heat transfer efficiency is improved.
  • the fluorescent lamp type LED illumination lamp of the present invention when the spring piece elastically contacting each LED package is formed on the inner surface of the heat dissipation cover member, heat transfer from each LED package to the heat dissipation cover member is ensured. At the same time, the heat transfer efficiency is further improved, which is preferable. Further, in the fluorescent lamp type LED illumination lamp of the present invention, when the LED package is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover, the LED chip that transmits the translucent cover This is preferable because the illumination light irradiation area is expanded.
  • the heat generation is caused by the heat radiation cover in which the projecting top surface contacts the electrode layer that contacts each LED chip. Heat is transferred directly and reliably to the member and efficiently radiated. Therefore, according to the present invention, the heat dissipation efficiency of each LED chip can be remarkably improved and the lifetime can be increased.
  • the heat dissipation cover member is attached to the slit-like opening of the translucent cover and protrudes to the inside of the translucent cover.
  • the heat dissipation plate D of the conventional fluorescent lamp type LED illumination lamp (see FIG. 12) and Since it is smaller than the heat radiating cover E, the present invention can achieve weight reduction.
  • FIG. 1 is a perspective view of a fluorescent lamp type LED illumination lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view of the fluorescent lamp type LED illumination lamp shown in FIG. 3 is a longitudinal sectional view taken along line III-III in FIG.
  • FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a first modification of the first embodiment.
  • FIG. 5 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a second modification of the first embodiment.
  • FIG. 6 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a third modification of the first embodiment.
  • FIG. 7 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a fourth modification of the first embodiment.
  • FIG. 1 is a perspective view of a fluorescent lamp type LED illumination lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view of the fluorescent lamp type LED illumination lamp shown in FIG. 3 is a longitudinal sectional view taken
  • FIG. 8 is a longitudinal cross-sectional view corresponding to FIG. 2 schematically showing a main part structure of a fluorescent lamp type LED illumination lamp according to the second embodiment of the present invention.
  • FIG. 9 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a first modification of the second embodiment.
  • FIG. 10 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a second modification of the second embodiment.
  • FIG. 11 is a plan view of a fluorescent lamp type LED illumination lamp according to a third embodiment of the present invention.
  • FIG. 12 is a schematic longitudinal sectional view corresponding to FIG. 2 showing a conventional example.
  • Translucent cover 13A Lenticular lens 13B ... Cut-off opening edge part 14 ... Radiation cover member 14A ... Clamping part 14B ... Bottom part 14C ... Side wall part 14D ... Partition wall 14E ... Radiation fin 15 ... Package board 17 ... LED package 21 ... terminal 22 ... base 23 ... translucent cover 24 ... heat dissipation cover Wood
  • the fluorescent lamp type LED illuminating lamp of the first embodiment is a straight tube type fluorescent lamp type LED illuminating lamp having a standard length in a range of 600 to 2400 mm.
  • caps 2 and 2 each having two terminals 1 and 1 connectable to an existing fluorescent lamp socket (not shown).
  • the caps 2 and 2 are attached to both ends of a straight tubular translucent cover 3 having a slit-like opening on a part of its peripheral surface.
  • a groove-type heat radiation cover member 4 extending along the longitudinal direction of the cover 3 is mounted.
  • the translucent cover 3 is formed by mixing an appropriate light diffusing agent in a transparent resin such as polycarbonate (PC) or acrylic resin, and exhibits a so-called ground glass-like appearance.
  • the translucent cover 3 may have a transparent appearance in which a light diffusing agent is not mixed or a translucent appearance such as milky white.
  • the translucent cover 3 has a diameter of, for example, 32 mm and a thickness of, for example, about 0.8 to 1.0 mm.
  • the groove-type heat radiation cover member 4 is formed by press-molding, for example, an aluminum plate having a thickness of 0.8 to 1.0 mm into a groove-shaped cross-sectional shape shown in FIG. The depth is set to about 8 mm, and the weight is extremely reduced.
  • Engagement recesses 4A and 4A that are detachably engaged with the engagement projections 3A and 3A of the translucent cover 3 are formed at the end of the heat radiation cover member 4 on the opening side by bending.
  • the groove-type heat radiation cover member 4 is detachably attached to the slit-like opening of the translucent cover 3 by engaging the engaging recesses 4A and 4A with the engaging convex portions 3A and 3A of the translucent cover 3.
  • the heat radiating cover member 4 enters from the slit-like opening of the translucent cover 3. Further, as shown in FIG. 3, a long plate-like shape extending along the longitudinal direction of the heat dissipation cover member 4 is formed on the inner surface of the heat dissipation cover member 4 protruding inside the translucent cover 3, that is, the flat protruding top surface 4B.
  • the package substrate 5 is fixed by a plurality of set screws 6 as fastening means.
  • a plurality of mounting holes 5A are formed in the package substrate 5 at predetermined intervals along the longitudinal direction, and the LED packages 7 are respectively fitted in the mounting holes 5A.
  • an LED chip 7C is arranged at the bottom of a reflector recess 7B formed in a thin box-shaped cavity base 7A made of polycarbonate (PC) or ceramics, and the LED chip 7C is filled in the reflector recess 7B. It has a structure enclosed with resin 7D.
  • the LED chip 7C emits blue light to cause the LED package 7 to emit white light, for example.
  • the encapsulating resin 7D is made of an epoxy resin or a silicon resin.
  • a phosphor that emits the complementary yellow light by the blue light of the LED chip 7C is dispersed.
  • Such an LED package 7 is arranged such that the base end surface opposite to the light projecting direction of the LED chip 7 ⁇ / b> C directed downward in FIG. 2 faces the protruding top surface 4 ⁇ / b> B that is the inner surface of the heat dissipation cover member 4.
  • the position where the LED package 7 is disposed is a position that is closer to the slit-shaped opening from the center of the cross section of the translucent cover 3.
  • the package substrate 5 has a plurality of fastening means as fastening means.
  • the proximal end surface side of the LED package 7 is pressed to the protruding top surface 4B side of the heat dissipation cover member 4 by being fixed to the protruding top surface 4B of the heat dissipation cover member 4 by the screws 6.
  • an electrode layer 7 ⁇ / b> F that constitutes a part of a circuit that connects the LED chip 7 ⁇ / b> C to the package substrate 5 is formed in an exposed state on the bottom of the reflector recess 7 ⁇ / b> B on the base end face side of the LED package 7.
  • the electrode layer 7F has a thickness of about 0.025 mm and protrudes from the base end surface of the LED package 7 by about 0.015 to 0.020 mm.
  • the electrode layer 7F contacts the LED chip 7C and protrudes from the heat dissipation cover member 4.
  • the top surface 4B is pressed and pressed.
  • a power supply unit 8 connected to the package substrate 5 and the terminals 1 and 1 of the caps 2 and 2 shown in FIG. It is installed.
  • a reflector plating layer that reflects the light emitted from the LED chip 7C is formed on the peripheral wall surface of the reflector recess 7B of each LED package 7. This plating layer is formed by sequentially laminating, for example, copper (Cu), nickel (Ni), and silver (Ag) plating layers.
  • a lighting switch (not shown) in a state where the terminals 1 and 1 of the caps 2 and 2 at both ends are connected to an existing fluorescent lamp socket.
  • each LED chip 7C of the plurality of LED packages 7 is turned on as shown in FIG. Irradiated.
  • each LED package 7 is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover 3, the lighting light of each LED chip 7 ⁇ / b> C is below the translucent cover 3. Irradiated from a wide area of the half.
  • each LED chip 7C of the plurality of LED packages 7 generates heat when it is turned on, but the heat generation is caused by the projecting top surface 4B of the heat dissipation cover member 4 that is in pressure contact with each electrode layer 7F that contacts each LED chip 7C.
  • the heat is directly and reliably transferred to the heat and is efficiently radiated by the heat radiating cover member 4.
  • the heat dissipation efficiency reaches about 90%, compared with about 25% in the conventional fluorescent lamp type LED lighting having the cross-sectional structure shown in FIG.
  • the temperature of each LED chip 7C can be maintained at about 60 ° C.
  • the heat dissipation efficiency of the LED chip A is about 25%, a large and heavy heat sink D and a heat sink E are required.
  • the heat dissipation efficiency of the LED chip 7C reaches about 90%, so that the heat can be sufficiently radiated by the small and light heat dissipation cover member 4. Therefore, according to the fluorescent lamp type LED illuminating lamp of the first embodiment, the heat dissipation efficiency of each LED chip 7C of the plurality of LED packages 7 can be remarkably improved to achieve a long life, and the weight can be reduced. Can also be achieved.
  • the fluorescent lamp type LED illumination lamp of the present invention is not limited to the first embodiment described above.
  • the heat radiating cover member 4 may be a press-formed product of a stainless steel plate or a three-extrusion product of aluminum alloy or copper.
  • each LED package 7 that emits white light may have a configuration in which three LED chips that emit light of three primary colors of red (R), green (G), and blue (B) are incorporated.
  • the longitudinal cross-sectional shape of the thermal radiation cover member 4 shown in FIG. 2 can be changed into the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 4 has reflection surfaces 4C and 4C that are inclined so that the width on the protruding top surface 4B side is gradually narrowed on the left and right side surfaces on both sides of the protruding top surface 4B.
  • the heat dissipation cover member 4 shown in FIG. 2 can be changed to an extruded product of aluminum or copper having the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 4 is formed by protruding fastening pieces 4D and 4D facing the package substrate 5 from the left and right side surfaces on both sides of the protruding top surface 4B.
  • the left and right edges of the package substrate 5 are fastened to the fastening pieces 4D, 4D via U-shaped cross-section clips 9, 9 as fastening means.
  • the electrode layer 7F is in pressure contact with the protruding top surface 4B of the heat dissipation cover member 4.
  • the longitudinal sectional shape of the cavity substrate 7A of the package substrate 5 and the LED package 7 shown in FIG. 2 can be changed to the longitudinal sectional shape shown in FIG.
  • the left and right inclined wall surfaces 5B and 5B of the package substrate 5 are changed to straight wall surfaces 5C and 5C
  • the left and right inclined side surfaces 7E and 7E of the cavity base 7A face the straight wall surfaces 5C and 5C of the package substrate 5.
  • the straight side surfaces 7G and 7G are changed.
  • the vertical cross-sectional shape of the heat dissipation cover member 4 shown in FIG. 2 can be changed to the vertical cross-sectional shape shown in FIG.
  • spring pieces 4 ⁇ / b> E that elastically contact the electrode layers 7 ⁇ / b> F of the LED packages 7 are formed on the protruding top surface 4 ⁇ / b> B. In this case, the heat transfer efficiency from each electrode layer 7F to the groove-type heat radiating member 4 is further improved.
  • the spring piece 4E shown in FIG. 7 is formed in a single tongue shape that is cut and raised so as to protrude from one side in the width direction of the heat dissipation cover member 4 and extends in the longitudinal direction of the heat dissipation cover member 4. It may be formed in the shape of a plurality of tongue pieces cut and raised so as to protrude in the longitudinal direction of the heat radiation cover member 4 corresponding to each electrode layer 7F, or cut and raised so as to protrude to the electrode layer 7F side. It may be formed in a plurality of spiral pieces.
  • a thin adhesive sheet of about 0.20 mm made of epoxy resin (not shown).
  • each electrode layer 7F of each LED package 7 shown in FIGS. 2, 4, 5, 6, and 7 is provided with a heat dissipation cover member 4 through a uniform and thin adhesive layer such as an epoxy resin. You may adhere to the protruding top surface 4B.
  • the fluorescent lamp type LED illuminating lamp of the second embodiment corresponds to the light transmitting cover 3, the heat radiating cover member 4, the package substrate 5, and the LED package 7 in the fluorescent lamp type LED illuminating lamp of the first embodiment shown in FIG.
  • a translucent cover 13, a heat radiating cover member 14, a package substrate 15 and an LED package 17 as shown in FIG. 8 are provided.
  • a lenticular lens 13 ⁇ / b> A that diffuses the lighting light of the LED package 17 in the circumferential direction is formed on the inner surface of the translucent cover 13.
  • the heat radiation cover member 14 is formed into a groove-shaped cross-sectional shape by extrusion molding of an aluminum alloy, and the slit-like opening edge portions 13B and 13B of the translucent cover 13 are attached to and detached from the end portion on the opening side. Clamping portions 14A and 14A that are freely sandwiched are formed.
  • the LED package 17 has a general structure including lead frames 7F and 17F having a thickness of about 0.15 to 0.20 mm to which the LED chip 17C is connected via wires 17G and 17G as electrodes. Yes.
  • the LED package 17 is fixed to the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 via the package substrate 15, thereby contacting the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14.
  • the fluorescent lamp type LED illuminating lamp of the second embodiment the same effect as that of the fluorescent lamp type LED illuminating lamp of the first embodiment can be obtained, and the lenticular lens 13A of the translucent cover 13 can be used to The lighting light of each LED chip 17C can be diffused in the circumferential direction of the translucent cover 13 and irradiated over a wide range.
  • the heat radiating cover member 14 is formed in a shallow groove shape in which sandwiching portions 14A and 14A are continuous on both sides of the bottom portion 14B, and left and right side wall portions 14C and 14C rise from the sandwiching portions 14A and 14A.
  • Each LED package 17 is installed, and partition walls 14D and 14D having substantially the same height as the left and right side wall portions 14C and 14C are integrally formed on the outer surface of the bottom portion 14B.
  • each LED package 7 installed on the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 is positioned near the slit-like opening of the translucent cover 13.
  • the lighting range of the LED chip 17 ⁇ / b> C expands to the range indicated by ⁇ in FIG. 9 in the circumferential direction of the translucent cover 13.
  • the longitudinal cross-sectional shape of the heat radiating cover member 14 shown in FIG. 8 in the fluorescent lamp type LED lighting lamp of 2nd Embodiment can be changed into the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 14 is formed in a reverse groove shape in which a bottom portion 14B is located radially outward from the slit-like opening of the translucent cover 13, and each LED package 17 is installed on the inner surface of the bottom portion 14B.
  • a plurality of radiating fins 14E and 14E are integrally formed on the outer surface of the bottom portion 14B.
  • each LED package 7 installed on the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 is positioned radially outward from the slit-like opening of the translucent cover 13. Therefore, the irradiation range of the lighting light of each LED chip 17 ⁇ / b> C greatly expands to the range indicated by ⁇ in FIG.
  • the lenticular lens 13A formed on the inner surface of the translucent cover 13 is not essential and may be omitted.
  • the thickness of an LED package is not restrict
  • FIGS. 8 to 10 when the thickness of the LED package is made relatively thin, a straight line is drawn vertically from the center point of the LED chip upper surface (light projecting surface) to the inner wall of the translucent cover. It becomes possible to make the length ( ⁇ ) of the vertical line relatively long.
  • the addition amount of the light diffusing agent contained in the translucent cover can be relatively reduced, and as a result, the LED package can be made difficult to be visually recognized as grains, and the desired brightness is uniformly white. Can be light.
  • the fluorescent lamp type LED lighting lamp in which the distance between the LED package and the translucent cover is short, unless a large amount of light diffusing agent is added, irregular reflection is insufficient and uniform light cannot be obtained. Increasing the amount of the diffusing agent may cause a problem that light is hardly transmitted.
  • the distance from the bottom surface of the LED chip to the protruding top surface 4B of the groove-type heat radiating member 4 is short, for example, 0.3 mm or less, and / or The ⁇ is long, for example, preferably 25 mm or more.
  • the fluorescent lamp type LED illumination lamp of the third embodiment is configured as an annular fluorescent lamp type LED illumination lamp as shown in FIG.
  • This annular fluorescent lamp type LED lighting lamp includes an annular light-transmitting cover 23 having both ends continuous via a single base 22 having four terminals 21, 21.
  • a heat-radiating cover member 24 having an annular shape in plan view, which is attached to a slit-like opening formed in a part of the peripheral surface, and the longitudinal sectional structure thereof is shown in FIGS. 2 and 4 to 10.
  • Various vertical cross-sectional structures can be used.

Abstract

L’invention concerne un luminaire à DEL de type lumière fluorescente plus léger, dont les puces DEL ont un rendement de dissipation de chaleur grandement accru et une plus longue durée de vie. Les bornes dans des bases (2) aux deux extrémités du luminaire à DEL de type lumière fluorescente proposé étant connectées à une douille de lumière fluorescente existante, lorsque l’interrupteur de lumière pour ladite douille est allumé, des puces à DEL (7C) dans une pluralité de boîtiers à DEL (7) agencés dans la direction de la longueur d’un substrat de boîtier (5) s’allument, et la lumière en provenant est émise à travers un couvercle de transmission de lumière (3). Lorsque les puces à DEL (7C) dans la pluralité de boîtiers à DEL (7) émettent de la chaleur en raison de leur allumage, ladite chaleur émise est directement transmise des couches d’électrode (7F) en contact avec les puces à DEL (7C) à une surface supérieure en saillie (4B) d’un organe de dissipation de chaleur de type rainure (4) pressé par les couches d’électrode. La chaleur est alors efficacement dissipée par l’organe de dissipation de chaleur de type rainure (4).
PCT/JP2010/064426 2009-08-20 2010-08-19 Luminaire à del de type lumière fluorescente WO2011021719A1 (fr)

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JP2015222731A (ja) * 2015-08-07 2015-12-10 ローム株式会社 Ｌｅｄ照明装置
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CN112952400A (zh) * 2021-02-01 2021-06-11 西安电子科技大学 一种具有高透射率透波窗口的宽带吸波结构

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US8928025B2 (en) 2007-12-20 2015-01-06 Ilumisys, Inc. LED lighting apparatus with swivel connection
US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US9398661B2 (en) 2008-10-24 2016-07-19 Ilumisys, Inc. Light and light sensor
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US11333308B2 (en) 2008-10-24 2022-05-17 Ilumisys, Inc. Light and light sensor
US10973094B2 (en) 2008-10-24 2021-04-06 Ilumisys, Inc. Integration of LED lighting with building controls
US10932339B2 (en) 2008-10-24 2021-02-23 Ilumisys, Inc. Light and light sensor
US10560992B2 (en) 2008-10-24 2020-02-11 Ilumisys, Inc. Light and light sensor
US10342086B2 (en) 2008-10-24 2019-07-02 Ilumisys, Inc. Integration of LED lighting with building controls
US10182480B2 (en) 2008-10-24 2019-01-15 Ilumisys, Inc. Light and light sensor
US8946996B2 (en) 2008-10-24 2015-02-03 Ilumisys, Inc. Light and light sensor
US10036549B2 (en) 2008-10-24 2018-07-31 Ilumisys, Inc. Lighting including integral communication apparatus
US9101026B2 (en) 2008-10-24 2015-08-04 Ilumisys, Inc. Integration of LED lighting with building controls
US9635727B2 (en) 2008-10-24 2017-04-25 Ilumisys, Inc. Light and light sensor
US9585216B2 (en) 2008-10-24 2017-02-28 Ilumisys, Inc. Integration of LED lighting with building controls
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8840282B2 (en) 2010-03-26 2014-09-23 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US9013119B2 (en) 2010-03-26 2015-04-21 Ilumisys, Inc. LED light with thermoelectric generator
US8894430B2 (en) 2010-10-29 2014-11-25 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
JP2012142167A (ja) * 2010-12-28 2012-07-26 Panasonic Corp ランプ及び照明装置
US8915611B2 (en) 2011-04-08 2014-12-23 Lunera Lighting, Inc. Light well providing wide angle up lighting in an LED luminaire
WO2012138937A1 (fr) * 2011-04-08 2012-10-11 Lunera Lighting, Inc. Puits de lumière produisant un éclairage vers le haut à angle large dans un luminaire à diodes électroluminescentes (del)
JP2013114923A (ja) * 2011-11-29 2013-06-10 Useful Person:Kk 直管形ｌｅｄ照明装置
WO2014008463A1 (fr) * 2012-07-06 2014-01-09 Ilumisys, Inc. Ensemble d'alimentation électrique pour tube lumineux à del
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US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US10260686B2 (en) 2014-01-22 2019-04-16 Ilumisys, Inc. LED-based light with addressed LEDs
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US11428370B2 (en) 2015-06-01 2022-08-30 Ilumisys, Inc. LED-based light with canted outer walls
JP2015222731A (ja) * 2015-08-07 2015-12-10 ローム株式会社 Ｌｅｄ照明装置
WO2020015429A1 (fr) * 2019-02-14 2020-01-23 旭宇光电（深圳）股份有限公司 Élément d'encapsulation à dissipation thermique pour del à lumière blanche de type au phosphore distant haute puissance
CN112952400A (zh) * 2021-02-01 2021-06-11 西安电子科技大学 一种具有高透射率透波窗口的宽带吸波结构
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