WO2011021719A1 - Fluorescent-light-type led lighting appliance - Google Patents

Fluorescent-light-type led lighting appliance Download PDF

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Publication number
WO2011021719A1
WO2011021719A1 PCT/JP2010/064426 JP2010064426W WO2011021719A1 WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1 JP 2010064426 W JP2010064426 W JP 2010064426W WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1
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WO
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Patent type
Prior art keywords
led
fluorescent
cover member
heat
light
Prior art date
Application number
PCT/JP2010/064426
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French (fr)
Japanese (ja)
Inventor
伊藤 亮
Original Assignee
Itoh Ryoh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/02Refractors for light sources of prismatic shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

Provided is a lighter-weight fluorescent-light-type LED lighting appliance, the LED chips of which have greatly increased heat-dissipation efficiency and longer life. With terminals in bases (2) on both ends of the provided fluorescent-light-type LED lighting appliance connected to an existing fluorescent light socket, when the light switch for said socket is turned on, LED chips (7C) in a plurality of LED packages (7) arranged along the long direction of a package substrate (5) turn on, and the light therefrom is emitted through a light-transmitting cover (3). When the LED chips (7C) in the plurality of LED packages (7) emit heat due to having been turned on, said emitted heat is directly transmitted from electrode layers (7F) in contact with the LED chips (7C) to a protruding top surface (4B) of a groove-type heat-dissipation member (4) up against which the electrode layers press. The heat is then efficiently dissipated by the groove-type heat-dissipation member (4).

Description

Fluorescent LED lighting

The present invention relates to a LED lighting to an LED (light emitting diode) chip and a light source, and more particularly to a LED lighting of a fluorescent lamp type.

The LED chip as the LED lighting lamp as a light source, an existing fluorescent lamp type fluorescent lamp die having a terminal corresponding to the socket is provided at both ends LED lighting lamp is generally known prior art (for example, Patent Document 1 reference). Further, as the fluorescent LED lamp of this kind, also known conventionally having a sectional structure as shown in FIG. 12.
Here, Patent Document 1, a transparent cylinder pipe (2), a support plate provided inside the pipe (2) and (3), provided at both ends of the support plate (3), a fluorescent light fixture a terminal to be fitted into the socket section (14) (11) (4), and this was connected to the terminal (4), the support plate (3) AC / DC converters provided on the upper surface (7), which It is connected to the fluorescent lamp type LED lighting device including a voltage control unit for adjusting the voltage supplied to the plurality of LED (9) provided on the bottom surface and (8) of the support plate (3) has been proposed .
On the other hand, the conventional fluorescent LED lighting shown in FIG. 12, the LED package B having an LED chip A, and the package substrate C that implements this LED package B on one side, the other surface of the package substrate C radiating plate and D superimposed on, forming a heat dissipating cover E of semicircular cross-section which covers the heat radiation plate D side in a state in which sandwich the side edges of the heat radiating plate D, the semicircular cross-section which covers the LED package B side is, both side edges and a translucent cover F which is connected to both side edges of the radiator cover E.
JP 2001-351402 JP

Meanwhile, fluorescent LED lighting apparatus described in Patent Document 1, since no means for dissipating heat generated by lighting of the plurality of LED (9), each LED (9) is heated to a high temperature by lighting is greater risk that the service life is reduced.
On the other hand, the conventional fluorescent LED lighting shown in FIG. 12, although provided with a heat radiating plate D and the heat dissipation cover E for dissipating heat generated by lighting of the LED chips A, LED package B having an LED chip A is mounted on one surface of the package substrate C, the heat radiating plate D are superimposed on the other surface of the package substrate C. Therefore, heat dissipation from the LED chip A to the heat sink D becomes a be performed via the LED package B and package substrate C, the heat dissipation efficiency, for example, becomes low as 25% efficiency.
Semicircular addition, conventional fluorescent LED lighting shown in FIG. 12, to cover the heat dissipation plate D are those wide across the diameter direction of the fluorescent lamp type LED illumination, the heat dissipation cover E is a radiator plate D for those of arcuate cross sectional large, there is a problem that the weight is increased.
The present invention has been made in response to such problems of the prior art, the heat dissipation efficiency of LED chips remarkably improved can achieve its longer life, even lighter in addition achieved and to provide a fluorescent lamp type LED lighting capable of.

To solve such problems, fluorescent LED lighting lamp according to the present invention, fluorescent LED lighting lamp straight tube or annular with a die having a connectable terminal in an existing fluorescent lamp socket a is, exhibit tubular mouthpiece is attached, and a translucent cover having a cut-split-shaped opening portion in a part thereof the circumferential surface, a heat dissipating cover member attached to the cut-split-shaped opening portion of the translucent cover, a plurality of LED packages exhibit long plate-like or annular plate are arranged along the longitudinal direction having an LED chip is fixed to the heat dissipation cover member in a state in which a plurality of LED packages on the inner surface of the heat radiating cover member contacts characterized in that it includes a package substrate.
Multiple The fluorescent LED lighting lamp according to the present invention, which in a state where the ferrule terminal is connected to an existing fluorescent lamp socket, by the lighting switch is turned on, which are arranged along the longitudinal direction of the package substrate each LED chips of the LED package is lit, its lighting beam is irradiated through the translucent cover.
Here, when the LED chips of the plurality of LED packages generates heat by lighting, the heating is directly heat transfer to the heat dissipation cover member from each LED package is efficiently dissipated.
In fluorescent LED lamp of the present invention, the plurality of LED packages, an electrode layer in contact with the LED chip in a state of protruding from the proximal end face of the light projection direction of the LED chips opposite assumed to have each respective electrode layers There may be a configuration in which the LED package in a state of contact with the inner surface of the heat radiating cover member is mounted fitted to a plurality of mounting holes formed in the package substrate.
Further, in the fluorescent LED lamp of the present invention, the heat dissipation cover member may be formed in a groove-type to rush from cut-split-shaped opening in the translucent cover. In this case, it is possible to arrange the power supply unit connected to the terminal and the package substrate of the die in the groove of the heat dissipating cover member. Also, In such groove-shaped heat dissipating cover member, it is possible to form a reflecting surface inclined so that the width of the inrush end side becomes gradually narrower than the width of the base end side on the outer surface of the left and right.
In fluorescent LED lamp of the present invention, comprises a fastening means for pressing the package substrate on the inner surface of the heat radiating cover member with an LED package, the package substrate through the fastening means is fixed to the heat dissipation cover member, each LED package is pressed is pressed against the inner surface of the heat radiating cover member, the heat transfer is ensured to the heat dissipation cover member from each LED package, preferably improved heat transfer efficiency.
Further, in the fluorescent LED lamp of the present invention, the spring piece that elastically contacts the respective LED package is formed on the inner surface of the heat radiating cover member, the heat transfer is ensured to the heat dissipation cover member from each LED package with preferred because it further improves the heat transfer efficiency.
Further, in the fluorescent LED lamp of the present invention, the LED package in position near the center of the section of the translucent cover to cut-split-shaped opening portion is disposed, the LED chip passes through the translucent cover It preferred because the irradiation area of ​​the lighting beam is expanded.

The fluorescent LED lighting lamp according to the present invention, the respective LED chips of the plurality of LED packages generates heat by lighting, the heat dissipation cover the fever, the protruding top surface in contact therewith from each electrode layer in contact with the LED chip directly and reliably be heat transfer is efficiently radiated to the member. Therefore, according to the present invention, it is possible to achieve the long-life and significantly improve the heat radiation efficiency of each LED chip.
Further, the heat dissipation cover member is attached to the cut-split-shaped opening portion of the translucent cover is intended to project inwardly of the translucent cover, radiator plate D and the conventional fluorescent lamp type LED illumination (see FIG. 12) because it is small compared to the heat dissipation cover E, according to the present invention, it is possible to achieve weight reduction.

Figure 1 is a perspective view of a fluorescent LED lamp according to a first embodiment of the present invention.
Figure 2 is a schematic longitudinal sectional view of a fluorescent LED lamp shown in FIG.
Figure 3 is a longitudinal sectional view taken along the line III-III in FIG.
Figure 4 is a longitudinal sectional view corresponding to FIG. 2 showing a first modification of the first embodiment schematically.
Figure 5 is a longitudinal sectional view corresponding to FIG. 2 showing a second modification of the first embodiment schematically.
6 is a longitudinal sectional view corresponding to FIG. 2 showing a third modification of the first embodiment schematically.
Figure 7 is a longitudinal sectional view corresponding to FIG. 2 showing a fourth modification of the first embodiment schematically.
Figure 8 is a longitudinal sectional view of the essential structure of the fluorescent LED lamp, corresponding to FIG. 2 showing schematically according to a second embodiment of the present invention.
Figure 9 is a longitudinal sectional view corresponding to FIG. 8 showing a first modification of the second embodiment schematically.
Figure 10 is a longitudinal sectional view corresponding to FIG. 8 showing a second modification of the second embodiment schematically.
Figure 11 is a plan view of a fluorescent LED lamp according to a third embodiment of the present invention.
Figure 12 is a schematic longitudinal sectional view corresponding to FIG. 2 showing a conventional example.

1 ... terminal 2 ... mouthpiece 3 ... translucent cover 3A ... engaging portion 4 ... radiator cover member 4A ... engaging recess 4B ... protruding top surface 4C ... reflecting surface 4D ... fastening piece 4E ... spring piece 5 ... package substrate 5A ... mounting hole 5B ... inclined wall 6 ... screw 7 ... LED package 7A ... cavity substrate 7B ... reflector recess 7C ... LED chips 7D ... encapsulating resin 7E ... inclined side surface 7F ... electrode layer 7G ... straight side 7H ... flange 8 ... power unit 9 ... clip 13 ... translucent cover 13A ... lenticular lens 13B ... cut-split-shaped opening edge portion 14 ... radiator cover member 14A ... clamping portion 14B ... bottom 14C ... side wall portion 14D ... partition wall 14E ... radiation fins 15 ... package substrate 17 ... LED package 21 ... terminal 22 ... cap 23 ... translucent cover 24 ... radiator cover Wood

Hereinafter, an embodiment of the fluorescent LED lamp according to the present invention with reference to the accompanying drawings. As shown in FIG. 1, fluorescent LED lamp in the first embodiment is a fluorescent lamp type LED illumination of the straight tube having a length of standard range of 600 ~ 2400 mm, at both ends It is mouthpiece 2,2 having two terminals 1,1 which can be connected to an existing fluorescent lamp socket (not shown) are respectively provided.
Mouthpiece 2,2 is mounted on both ends of the translucent cover 3 straight pipe having a cut-split-shaped opening portion in a part circumference, the cut-split-shaped opening portion of the translucent cover 3, translucent radiator cover member 4 of the channel extending along the longitudinal direction of the cover 3 is attached.
Translucent cover 3, for example, polycarbonate is molded by mixing an appropriate light diffusing agent in a transparent resin such as (PC) or acrylic resin, exhibiting a so-called ground-glass appearance. Note that translucent cover 3, which exhibits a transparent appearance light diffusing agent is not mixed or may be one that exhibits a translucent appearance, such as milky white.
The translucent cover 3 is formed into, for example, 32 mm, wall thickness, for example, about 0.8 ~ 1.0 mm in diameter. Then, this is cut-split-shaped opening portion of the translucent cover 3, as shown in FIG. 2, chevron cross section of the engaging projection 3A for mounting the radiator cover member 4 of the channel, 3A are opposed to each other It is formed Te.
Radiator cover member 4 of the channel is, for example, those thickness is pressed into the groove-shaped cross section showing an aluminum plate of 0.8 ~ 1.0 mm 2, the opening width of the groove is approximately 8 ~ 12 mm , depth have been set to about 8mm, and is extremely lightweight. At the end of the opening side of the radiator cover member 4, the engaging projection 3A of the translucent cover 3, the engaging recess 4A to be engaged detachably in 3A, 4A are formed by bending.
Radiator cover member 4 of the channel, the engagement recess 4A, 4A is detachably attached to the cut-split-shaped opening portion of the translucent cover 3 by engaging the engaging projection 3A, 3A of the translucent cover 3 It is, radiator cover member 4 in this mounted state is entered from the cut-split-shaped opening in the translucent cover 3. Then, 4 of the inner surface of the heat dissipation cover member protruding to the inside of the translucent cover 3, that is, a flat projecting top surface 4B, as shown in FIG. 3, a long plate shape extending along the longitudinal direction of the radiator cover member 4 package board 5 is fixed by a plurality of screws 6 as fastening means.
The package substrate 5, LED package 7 are fitted respectively to a plurality of which mounting holes 5A is formed at predetermined intervals along the longitudinal direction, each of the mounting holes 5A. Of the wall of the mounting hole 5A of the package substrate 5, the left and right wall surfaces appearing in cross section as shown in FIG. 2, the mutual distance of the radiator cover member 4 side is wide, inclined symmetrically as mutual spacing on the opposite side is narrowed inclined wall surface 5B which is a 5B.
LED package 7, LED chips 7C is disposed in the bottom of the polycarbonate (PC) consisting of or ceramic thin box-shaped reflector recess 7B formed in the cavity substrate 7A, encapsulation of the LED chip 7C is filled in the reflector recess 7B having encapsulated structure by resin 7D. LED chips 7C is for emitting blue light to emit white light LED package 7 for example. Encapsulating resin. 7D, an epoxy resin or a silicon resin, The encapsulating resin 7D, phosphor emitting yellow light of the complementary color with the blue light of the LED chip 7C are dispersed.
Such LED package 7 is disposed so as to face the base end surface of the opposite side to the protruding top surface 4B is an inner surface of the heat radiating cover member 4 and the light emitting direction of the LED chip 7C toward downward in FIG 2. The position LED package 7 is arranged, it has a position close to the cut-split shape opening side from the center of the section of the translucent cover 3.
Of the outer surface of the cavity substrate 7A of the LED package 7, the left and right outside faces of appearing in cross section as shown in FIG. 2, left and right inclined wall surface 5B of the package substrate 5, the inclined side surface 7E inclined at the same angle as 5B, and 7E It is. The inclined side face 7E is a base end side of the LED package 7, the inclined wall 5B of the base end portion of the 7E package substrate 5, engages the inclined surface engaging the 5B, a plurality of stop of the package substrate 5 in this state fastening means by being fixed to the protruding top surface 4B of the radiator cover member 4 by screws 6, the base end surface side of the LED package 7 is pressed against the protruding top surface 4B side of the radiator cover member 4.
Here, the bottom portion of the reflector recess 7B serving as the base end side of the LED package 7, the electrode layer 7F which forms part of circuit for connecting the LED chip 7C on the package substrate 5 are formed at the exposed state. The electrode layer 7F has a thickness a of about 0.025 mm, from the proximal end face of the LED package 7 protrudes about 0.015 ~ 0.020 mm, while in contact with the LED chip 7C, the protrusion of the radiator cover member 4 It is pressed in pressure contact with the top surface 4B.
Further, as shown in FIG. 2, within the groove of the heat dissipating cover member 4 of the channel, the power supply unit 8 which is connected to the terminals 1,1 of the cap 2, 2 shown on the package board 5 and FIG. 1 arrangement It has been set. Although not shown, the circumferential wall surface of the reflector recess 7B of each LED package 7, the plating layer of the reflector for reflecting the light projected LED chip 7C is formed. The plating layer is, for example, copper (Cu), is obtained by sequentially laminating a plated layer of nickel (Ni), silver (Ag).
The fluorescent LED lighting lamp according to the first embodiment configured as described above, in a state in which the terminals 1,1 of the cap 2, 2 at both ends are connected to a conventional fluorescent lamp socket, the lighting switch (not shown) through There Once turned on, the longitudinal LED chips 7C of the plurality of LED packages 7 direction arranged along the lights, illuminated light transmitting cover 3 of the white light of the package substrate 5, as shown in FIG. 3 It is irradiated.
Here, each LED package 7, since it is arranged at a position closer to the cut-split shape opening side from the center of the section of the translucent cover 3, the lighting light of each LED chip 7C, under the translucent cover 3 It emitted from wide half region.
At that time, the LED chips 7C of the plurality of LED packages 7 generates heat by its lighting, the heating, the protruding top surface 4B of the radiator cover member 4 which is pressed against the respective electrode layers 7F in contact with each LED chip 7C directly and reliably be transferred to the, it is efficiently radiated by the radiation cover member 4. Its heat radiation efficiency, whereas in the conventional fluorescent LED lamp is about 25% having a cross-sectional structure shown in FIG. 13, it reaches about 90%. As a result, the temperature of each LED chip. 7C, it is possible to hold at about 60 ° C..
Further, in the conventional fluorescent lamp type LED illumination sectional structure shown in FIG. 12, since the heat dissipation efficiency of the LED chip A is about 25%, requires a heat dissipation plate D and the radiator cover E increase large and heavy whereas, in the LED illuminating lamp in the first embodiment, since the heat dissipation efficiency of LED chips 7C reaches about 90%, it can be sufficiently radiated by the light-weight radiator cover member 4 compact.
Therefore, according to the fluorescent LED lamp in the first embodiment, it is possible to achieve the long-life and significantly improve the heat radiation efficiency of each LED chip 7C of the plurality of LED packages 7, weight it can also be achieved.
Fluorescent LED lamp of the present invention is not limited to the first embodiment described above. For example, the heat dissipation cover member 4, may be used as the stainless steel plate of the press-molded product, it may be three extrusion of aluminum alloy or copper. Further, each LED package 7 which emits white light, red (R), green (G), may be configured with a built-in three LED chips that emit three primary colors of light of blue (B).
Furthermore, longitudinal sectional shape of the heat dissipation cover member 4 shown in Figure 2, may be changed in the longitudinal sectional shape shown in FIG. The radiator cover member 4, the side surfaces of the left and right sides of the projecting top surface 4B, reflective surface 4C of the width of the protruding top surface 4B side is inclined become gradually narrower, in which 4C is formed. In this case, since a part of the light projected from the LED chip 7C reflected by the inner surface of the translucent cover 3 is irradiated obliquely downward from both sides of the left and right are reflected translucent cover 3 by the reflecting surface 4C, 4C, LED the amount of illumination light is increased.
Furthermore, the heat dissipation cover member 4 shown in FIG. 2 can be modified to extrusion of aluminum or copper having a longitudinal section shown in FIG. The radiator cover member 4 is a fastening piece 4D facing the package substrate 5, 4D are formed to protrude from both sides of the left and right side surfaces of the projecting top surface 4B. The fastening piece 4D, the 4D, is fastened edges of the left and right of the package substrate 5 via the clip 9,9 of the U-shaped cross section as fastening means, each of the LED packages 7 in the fastening state electrode layer 7F is pressed against the protruding top surface 4B of the radiator cover member 4.
Furthermore, longitudinal sectional shape of the cavity substrate 7A of the package substrate 5 and the LED package 7 shown in FIG. 2, may be changed in the longitudinal sectional shape shown in FIG. Here, the left and right inclined wall surface 5B of the package substrate 5, 5B is Straight wall 5C, it is changed to 5C, inclined side surface 7E of the right and left cavity substrate 7A, 7E, the straight wall 5C of the package substrate 5, facing the 5C straight side 7G, has been changed to 7G. Then, the distal end portion of the proximal end face of the LED package 7 on the opposite side of the cavity substrate 7A flange portion 7H, and 7H is formed, the flange portion 7H, 7H is soldered to the package substrate 5.
Furthermore, longitudinal section of the heat dissipation cover member 4 shown in Figure 2, may be changed in the longitudinal sectional shape shown in FIG. The radiator cover member 4 is a spring piece 4E which elastically contacts to each electrode layer 7F of the LED package 7 is formed on the protruding top surface 4B. In this case, to further improve heat transfer efficiency to the channel-shaped heat radiating member 4 from each electrode layer 7F.
Incidentally, the spring piece 4E shown in FIG. 7 has been formed in a single tongue-shaped extending cut and raised to protrude from the width direction side of the radiator cover member 4 in the longitudinal direction of the radiator cover member 4, it may be formed in a plurality of tongue shape that is cut and raised to protrude in the longitudinal direction of the radiator cover member 4 corresponding to the respective electrode layers 7F, to put off so as to protrude to the respective electrode layers 7F side it may be formed in a plurality of spiral pieces like that is.
Here, FIGS. 2, 4, 5, 6, on the surface of each electrode layer 7F of the LED package 7 shown in FIG. 7, for example, a thin adhesive sheet of 0.20mm degree of epoxy resin (not shown ) attached to, it may be pressed in close contact to the protruding top surface 4B of the radiator cover member 4 each electrode layer 7F through the adhesive sheet. In this case, since the thin adhesive sheet of 0.20mm around a small thermal resistance adhering the respective electrode layers 7F the protruding top surface 4B of the radiator cover member 4, heat radiation efficiency of each LED package 7 is further increased.
For the same reason, 2, 4, 5, 6, each electrode layer 7F of the LED package 7 shown in FIG. 7, the heat dissipation cover member 4 through an adhesive layer such as a uniform and thin epoxy resin it may be adhered to the protruding top surface 4B.
Next, the fluorescent LED lighting lamp according to a second embodiment of the present invention. Fluorescent LED lighting of the second embodiment corresponds to the first light-transmitting cover 3 in fluorescent LED lighting embodiment, the heat dissipation cover member 4, the package substrate 5 and the LED package 7 shown in FIG. 2 as part, and a translucent cover 13, the heat dissipation cover member 14, the package substrate 15 and the LED packages 17 as shown in FIG.
As shown in FIG. 8, on the inner surface of the translucent cover 13, a lenticular lens 13A to diffuse lighting beam of the LED package 17 in the circumferential direction is formed. Further, the heat dissipation cover member 14 is formed into a groove-shaped cross section by extrusion molding of aluminum alloy, the end of the opening side, cut-split-shaped opening edge 13B of the translucent cover 13, the 13B detachable sandwiching portion 14A sandwiching freely, 14A are formed. Here, LED package 17, LED chip 17C wire 17G, lead frame 7F having a thickness of about 0.15 ~ 0.20 mm, which is connected via a 17G, is a common structure with 17F as an electrode there. Then, the LED package 17, by being fixed to the bottom portion 14B of the heat dissipation cover member 14 through the package substrate 15, in contact with the inner surface of the bottom portion 14B of the heat dissipation cover member 14.
In the fluorescent lamp type LED illumination of the second embodiment, in addition to the same effect as fluorescent LED lamp in the first embodiment can be obtained, by the lenticular lens 13A of the translucent cover 13, of the LED packages 17 lighting light of each LED chip 17C is diffused in the circumferential direction of the translucent cover 13 can be irradiated over a wide range.
Here, longitudinal section of the heat dissipation cover member 14 shown in FIG. 8 in the fluorescent LED lamp of the second embodiment can be changed in the longitudinal sectional shape shown in FIG. The radiator cover member 14, both sides sandwiching portion 14A of the bottom part 14B, 14A are continuous, clamping portion 14A, side wall portions 14C of the left and right from 14A, are formed in a shallow trench type 14C rises, the inner surface of the bottom portion 14B is installed each LED package 17, the outer surface of the bottom portion 14B, the left and right side wall portions 14C, partition walls 14D of substantially the same height as the 14C, 14D are formed integrally.
In a variant of the second embodiment shown in FIG. 9, since each LED package 7 installed on the inner surface of the bottom portion 14B of the heat dissipation cover member 14 is positioned in the vicinity of the cut-split-shaped opening portion of the translucent cover 13, each irradiation range of lighting light LED chip 17C is kept circumferential direction of the translucent cover 13 is extended to a range indicated by α in Fig.
Furthermore, longitudinal sectional shape of the heat dissipation cover member 14 shown in FIG. 8 in the fluorescent LED lamp of the second embodiment can be changed in the longitudinal sectional shape shown in FIG. 10. The radiator cover member 14 is formed into a reverse trench, the inner surface of the bottom portion 14B is the LED packages 17 installed to the bottom 14B radially outward from the cut-split-shaped opening in the translucent cover 13 is positioned is, on the outer surface of the bottom portion 14B, plural rows of radiating fins 14E, 14E are integrally formed.
Figure in the modification of the second embodiment shown in 10, located radially outward of cut-split-shaped opening of each LED package 7 is translucent cover 13 installed on the inner surface of the bottom portion 14B of the heat dissipation cover member 14 to order, irradiation range of the lighting light of each LED chip 17C is kept circumferential direction of the translucent cover 13, it is greatly expanded to a range indicated by β in FIG. 10.
Incidentally, in the modification of the second embodiment shown in FIGS. 9 and 10, a lenticular lens 13A formed on the translucent cover 13 the inner surface is not essential, it may be omitted.
Further, in the fluorescent LED lamp in the second embodiment, the thickness of the LED package is not in any way be limited, but will be described below the thickness is less manner.
For example, in FIGS. 8-10, by the thickness of the LED package relatively thin, when a straight line is drawn in the vertical direction with respect to the translucent cover the inner wall from the center point of the LED chip top surface (light emitting surface) it is possible to the length of the vertical line of the ([delta]) relatively long. By doing so, it is possible to relatively reduce the amount of the light diffusing agent contained in the translucent cover, the results LED package can be less visible as grain, bright overall uniform white desired it can be set to light.
In contrast, LED package and the distance of the translucent cover is short fluorescent LED lighting lamp, unless put more light diffusing agent, irregular reflection is insufficient, not only can not be a uniform light, light there is a risk of causing a problem that the light is less likely transmitted by increasing the diffusing agent.
As an example of a fluorescent lamp type LED illumination of the second embodiment, the distance from the LED chip bottom surface to protrude the top surface 4B of the channel radiating member 4 is short, for example, at 0.3mm or less, and / or, It said δ is long, it is preferable that for example, 25mm or more.
Next, explaining the fluorescent LED lighting lamp according to a third embodiment of the present invention. Fluorescent LED lighting of the third embodiment is configured as a fluorescent LED lamp of annular as shown in Figure 11. Fluorescent LED lamp of this annular includes a translucent cover 23 of the annular both ends through a single die 22 are continuous with the four terminals 21, 21 ..., the translucent cover 23 are those in which a heat radiating cover member 24 in plan view an annular mounted in cut-split-shaped opening portion formed on a part circumference, longitudinal sectional structure thereof, FIG. 2, shown in FIGS. 4 to 10 various may be longitudinal sectional structure.

Claims (8)

  1. A fluorescent lamp type LED illumination of straight tube or annular with a die having a connectable terminal in an existing fluorescent lamp socket,
    Exhibits a tubular which the ferrule is mounted, and a translucent cover having a cut-split-shaped opening portion in a part thereof periphery,
    A radiator cover member attached to the cut-split-shaped opening portion of the translucent cover,
    A plurality of LED packages exhibit long plate-like or annular plate are arranged along the longitudinal direction having an LED chip, fixed to the heat dissipation cover member in a state where the plurality of LED packages on the inner surface of the heat dissipation cover member contacts fluorescent LED lighting lamp, characterized in that it includes a package substrate to be.
  2. Wherein the plurality of LED packages comprises an electrode layer in contact with the LED chip in a state of protruding from the proximal end face of the side opposite to the light projection direction of the LED chips respectively, each electrode layer is in contact with the inner surface of the heat dissipating cover member fluorescent LED lighting lamp according to claim 1, each LED package is characterized in that it is mounted fitted to a plurality of mounting holes formed in the package substrate in a state.
  3. The heat dissipation cover member fluorescent LED lighting lamp according to claim 1 or 2, characterized in that it is formed in a groove-type to rush from cut-split-shaped opening of the translucent cover.
  4. Comprising a fastening means for pressing the package substrate on the inner surface of the heat dissipation cover member together with the LED package, according to claim 1 to 3, a package substrate via the fastening means, characterized in that it is fixed to the heat dissipation cover member fluorescent LED lighting lamp according to any one of.
  5. Wherein the inner surface of the heat radiating cover member, fluorescent LED lighting lamp according to any one of claims 1 to 4, characterized in that the spring piece that elastically contacts the each LED package is formed.
  6. According to any one of claims 3 to 5, characterized in that the power supply unit connected to the terminal and the package substrate of the die is placed in the groove of the heat dissipation cover member formed in a groove-type fluorescent LED lighting.
  7. Wherein the outer surface of the left and right of the heat dissipating cover member formed in a groove-type to rush from cut-split-shaped opening in the translucent cover, such that the width of the inrush end side becomes gradually narrower than the width of the base end fluorescent LED lighting lamp according to any one of claims 3-6, characterized in that the reflecting surface inclined is formed.
  8. Fluorescent LED according to any one of claims 1 to 7, characterized in that the LED package to a position closer to the cut-split shape opening side from the center of the section of the translucent cover is arranged lighting.
PCT/JP2010/064426 2009-08-20 2010-08-19 Fluorescent-light-type led lighting appliance WO2011021719A1 (en)

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US9013119B2 (en) 2010-03-26 2015-04-21 Ilumisys, Inc. LED light with thermoelectric generator
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JP2012142167A (en) * 2010-12-28 2012-07-26 Panasonic Corp Lamp and lighting system
WO2012138937A1 (en) * 2011-04-08 2012-10-11 Lunera Lighting, Inc. Light well providing wide angle up lighting in a led luminaire
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JP2013114923A (en) * 2011-11-29 2013-06-10 Useful Person:Kk Straight-tube type led lighting device
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WO2014008463A1 (en) * 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
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