WO2011007510A1 - グラファイトシートおよびこれを用いた伝熱構造 - Google Patents
グラファイトシートおよびこれを用いた伝熱構造 Download PDFInfo
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- WO2011007510A1 WO2011007510A1 PCT/JP2010/004307 JP2010004307W WO2011007510A1 WO 2011007510 A1 WO2011007510 A1 WO 2011007510A1 JP 2010004307 W JP2010004307 W JP 2010004307W WO 2011007510 A1 WO2011007510 A1 WO 2011007510A1
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- graphite sheet
- main surface
- recess
- heat
- thin film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Definitions
- the present invention relates to a heat radiating sheet used for thermal connection between a heat generating body and a heat radiating body, and more particularly to a graphite sheet and a heat transfer structure using the same.
- the thermal connection structure shown in FIG. 8 includes a semiconductor package 41 containing a semiconductor element that is a heating element, a heat sink 42 that is a radiator, and a thermal connection portion 43 that thermally connects the heating element and the radiator (for example, , See Patent Document 1).
- the semiconductor package 41 is electrically connected to the conductor circuit of the printed wiring board 46 through terminals.
- the heat sink 42 is made of a metal such as an aluminum alloy, and includes a flat core and a plurality of flat fins standing upright on the core.
- the heat connecting portion 43 is provided between the semiconductor package 41 and the heat sink 42 in order to improve the heat dissipation performance from the semiconductor package 41 to the heat sink 42.
- the heat connection portion 43 is brought into contact with the semiconductor package 41 and the heat sink 42 by being tightened and pressurized by an attachment component 45 such as a screw.
- the heat connecting portion 43 is formed of a heat radiating sheet having excellent thermal conductivity in order to increase the cooling effect.
- a pyrolytic graphite sheet 44 having a high thermal conductivity formed by baking a polymer film such as polyimide at a high temperature is known. Since the pyrolytic graphite sheet 44 has flexibility, the surface of the pyrolytic graphite sheet 44 can be brought into close contact with the surfaces of the semiconductor package 41 and the heat sink 42 by being pressed in the thermal connection structure.
- a heat radiating member made of a fluid resin such as silicone grease or silicone oil is applied to the surface of the pyrolytic graphite sheet 44.
- the heat radiation member enters the irregularities on the surface of the semiconductor package 41, the heat sink 42, and the pyrolytic graphite sheet 44 to reduce the air layer in the gap, thereby improving the adhesion and reducing the contact thermal resistance of the thermal connection portion 43. Has been done.
- a fluid radiating member containing a thermally conductive filler such as aluminum nitride having a high thermal conductivity is used.
- a thermally conductive filler such as aluminum nitride having a high thermal conductivity.
- the irregularities on the surface of the pyrolytic graphite sheet 44 are formed when the polymer film is baked, and there are no voids enough to accommodate the thermally conductive filler.
- the pressure is pressed, most of the thermally conductive filler moves on the surface of the pyrolytic graphite sheet 44 and is pushed out to the outer periphery, so that there is a problem that the thermal resistance of the thermal connection portion 43 cannot be reduced.
- the present invention provides a graphite sheet capable of improving the heat dissipation performance of the heat connecting portion and a heat transfer structure using the graphite sheet.
- the graphite sheet of the present invention is a graphite sheet having a first main surface and a second main surface which is a surface opposite to the first main surface and having a large anisotropic thermal conductivity in the main surface direction.
- region with which the said 2nd bottom face overlaps, and the connection hole which penetrates a thin film part and connects the said 1st recessed part and the said 2nd recessed part is provided.
- the heat transfer structure of the present invention is provided on the first main surface, the second main surface opposite to the first main surface, the first main surface, and the first bottom surface.
- a heat radiating member filled in the communication hole, and the heat connecting portion is disposed so that the heating element is in contact with the first main surface side of the graphite sheet.
- FIG. 1 is a plan view of a graphite sheet in an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the graphite sheet in the embodiment of the present invention.
- FIG. 3 is a schematic diagram showing the structure of graphite in the embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a main part of another graphite sheet in the embodiment of the present invention.
- FIG. 5 is a side sectional view showing a heat transfer structure using the graphite sheet in the embodiment of the present invention.
- FIG. 6 is a cross-sectional view of the main part of the heat transfer structure using the graphite sheet in the embodiment of the present invention.
- FIG. 7 is a cross-sectional view showing the swell of the graphite sheet in the embodiment of the present invention.
- FIG. 8 is a side sectional view showing a heat transfer structure using a conventional graphite sheet.
- FIG. 1 is a plan view of a graphite sheet in an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the AA plane in FIG.
- the graphite sheet 11 is provided with a flat first main surface 12 and a second main surface 13, which is the surface opposite to the first main surface 12, in parallel.
- a first recess 14 is provided in the first main surface 12.
- a second recess 15 is provided in the second main surface 13.
- the first recess 14 has a first bottom surface 19.
- the second recess has a second bottom surface 20.
- the thin film portion 21 is a region where at least a part of the first concave portion 14 and the second concave portion 15 overlap in a plan view from a direction perpendicular to the first main surface 12, and the thickness of the thin film portion 21. Is thinner than the portion where no recess is provided. In other words, the thin film portion 21 is provided in a portion where the first bottom surface 19 and the second bottom surface 20 overlap.
- the connecting hole 18 is a hole provided through the thin film portion 21.
- the first recess 14 and the second recess 15 communicate with each other through the connecting hole 18.
- At least one connecting hole 18 is provided in the thin film portion 21.
- the opening diameter in the main surface direction of the connecting hole 18 is preferably shorter than the opening diameters of the opening 16 of the first recess 14 and the opening 17 of the second recess 15.
- a through hole is formed by the first concave portion 14, the second concave portion 15, and the connecting hole 18, and the through hole is filled with a fluid heat dissipation member.
- the graphite sheet 11 is a laminate of graphite, and the graphite has a plane in the ab axis direction in which hexagonal arrangement of carbon atoms is formed in a mesh shape as shown in FIG. Furthermore, the planes in the ab axis direction are arranged in parallel at substantially equal intervals d in the c axis direction perpendicular to the plane. That is, the graphite is oriented substantially parallel to the first main surface 12 and the second main surface 13.
- the graphite sheet 11 has anisotropic thermal conductivity, and the thermal conductivity in the principal surface direction is higher than the thermal conductivity in the thickness direction.
- the principal surface direction is a direction parallel to the first principal surface 12 and the second principal surface 13.
- the graphite sheet 11 is a pyrolytic graphite sheet or a graphite sheet.
- the graphite sheet 11 may be a laminate of at least one of a pyrolytic graphite sheet and a graphite sheet.
- the pyrolytic graphite sheet is formed by baking a polymer film at a high temperature.
- a heat-resistant aromatic polymer such as polyimide, polyamide, and polyamideimide can be used.
- the distance d between the graphites in the pyrolytic graphite sheet shown in FIG. 3 is 3.354 ⁇ 10 ⁇ 8 cm to 3.356 ⁇ 10 ⁇ 8 cm.
- the pyrolytic graphite sheet can have an anisotropic thermal conductivity with a thermal conductivity in the main surface direction of 500 W / mK to 1800 W / mK and a thermal conductivity in the thickness direction of 10 W / mK to 15 W / mK.
- the graphite sheet is formed by press-molding and laminating graphite as a main component, and the graphite uses expanded graphite or scaly or spherical graphite powder such as pyrolytic graphite obtained by heat-treating powder coke at a temperature of about 3000 ° C. be able to.
- the graphite sheet may be added with a small amount of binder such as resin in order to improve the sheet strength.
- binder such as resin
- expanded graphite can be pressure-molded without using a binder because it has plasticity, and a graphite sheet with high thermal conductivity can be obtained.
- Pyrolytic graphite sheet and graphite sheet are flexible and easy to obtain adhesion to heat sinks and semiconductor packages.
- the pyrolytic graphite sheet has high pressure resistance compared to the graphite sheet, so that the adhesion can be increased and the effect of preventing leakage of the fluid radiating member can be enhanced.
- One or more first concave portions 14 and second concave portions 15 of the graphite sheet 11 are provided.
- first recesses 14 are provided on the first main surface 12 and the second recesses 15 are uniformly distributed on the second main surface 13. Thereby, since a fluid heat dissipation member can be reliably disperse
- the first recess 14 is preferably provided such that the area ratio of the opening surface 16 of the first recess 14 to the first main surface 12 is 30% to 70%.
- the fluid heat radiating member can be confined in the through hole to prevent leakage, and the opening area of the opening surface 16 can be increased, so that the contact thermal resistance by the fluid heat radiating member can be reduced.
- the second recess 15 is also preferably provided with an area ratio of the opening surface 17 of the second recess 15 to the second main surface 13 within the same range as the opening surface 16 of the first recess 14. That is, the second recess 15 is preferably provided so that the area ratio of the opening surface 17 of the second recess 15 to the second main surface 13 is 30% to 70%.
- first recess 14 and the second recess 15 can be provided in the same or different shapes.
- the thin film portion 21 is a region formed by overlapping the first concave portion 14 and the second concave portion 15 so as to face each other in the thickness direction. As shown in FIG. 2, the thin film portion 21 is provided so as to protrude at least in the main surface direction in the cross section, and is sandwiched between the first concave portion 14 and the second concave portion 15.
- the thin film portion 21 is formed by laminating graphite and has a high anisotropic thermal conductivity in the main surface direction, the heat conduction in the main surface direction is performed quickly. Furthermore, in the thin film portion 21, since the length in the thickness direction, that is, the length of heat conduction between the first concave portion 14 and the second concave portion 15, is short, the first concave portion 14 and the second concave portion are efficiently heated. 15 can be conducted.
- FIG. 4 shows a cross-sectional view of the main part of another graphite sheet of the present embodiment.
- the thin film portion 22 may be provided so as to become thicker from the tip 23 toward the bottom 24. Thereby, the mechanical strength of the thin film portion 22 can be increased, and the damage to the thin film portion 22 is reduced when the graphite sheet 11a is attached between the semiconductor package and the heat sink or when the graphite sheet 11a is pressed and adhered in the heat connection structure. can do.
- the surface of the thin film portion 22 can be provided stepwise or inclined.
- FIG. 5 is a side sectional view of a heat transfer structure using the graphite sheet according to the embodiment of the present invention.
- FIG. 6 is a cross-sectional view of the main part of the heat transfer structure using the graphite sheet according to the embodiment of the present invention.
- the heat connection portion 31 constituting the heat transfer structure includes the graphite sheet 11 and the heat radiating member 32.
- the thermal connection portion 31 is sandwiched between the flat upper surface of the semiconductor package 36 that is a heat generator and the lower surface of the heat sink 37 that is a heat radiator.
- the thermal connection portion 31 is arranged so that the first main surface 12 of the graphite sheet 11 is provided on the semiconductor package 36 side.
- the through-hole formed by the first recess 14, the second recess 15, and the connection hole 18 is filled with a fluid heat dissipation member 32, and the contact heat resistance of the heat connection portion 31 is reduced by the heat dissipation member 32.
- the effect to do is heightened.
- a heat radiating grease such as silicone oil or a heat conductive resin 33 such as a phase change type paste is used, and a heat conductive filler 34 is further contained so that the heat conductivity is about 1 W / mK ⁇ . Increased to about 20W / mK.
- the phase change paste is a solid paste that is soft at room temperature and has a softening temperature at 40 ° C. to 100 ° C., which is the operating temperature of the semiconductor package 36.
- the phase change paste becomes a low-viscosity material having fluidity at the softening temperature or higher.
- the thermally conductive filler 34 is preferably a powder composed of aluminum nitride, silver, copper, aluminum or the like having a high thermal conductivity and an average particle size of 1 ⁇ m to 10 ⁇ m.
- an alloy containing a low melting point metal such as tin, indium, bismuth or the like that melts at 40 ° C. to 100 ° C. which is the operating temperature of the semiconductor package can be used.
- the first concave portion 14 and the second concave portion 15 are formed by laser processing, punching, or the like, and the shape of the gap can be appropriately provided. Thereby, the heat conductive filler 34 etc. of the heat radiating member 32 can be accommodated in the first recess 14 and the second recess 15.
- the length in the principal surface direction of the opening surfaces 16 and 17 in the cross section is formed larger than the depth in the thickness direction of the gap.
- the graphite sheet 11 is flexible, the first main surface 12 and the second main surface 13 are in close contact with the semiconductor package 36 and the heat sink 37 when the graphite sheet 11 is pressed. Thereby, it is possible to suppress the heat radiation member 32 from leaking from the interface between the graphite sheet 11 and each of the semiconductor package 36 and the heat sink 37, and to prevent the occurrence of malfunction of the electric circuit due to contamination of the printed circuit board or electronic components and insulation deterioration. .
- the heat of the heat spot of the semiconductor package 36 is easily conducted to the heat radiating member 32 of the first recess 14 having a small contact thermal resistance.
- the heat conducted from the semiconductor package 36 to the heat radiating member 32 of the first recess 14 is dissipated in a substantially isotropic manner to reach the thin film portion 21 and further rapidly dissipate heat in the main surface direction through the thin film portion 21. Simultaneously conducts in the thickness direction.
- heat can be efficiently transferred to the heat radiating member 32 of the second recess 15, and the heat radiating performance can be improved.
- first recesses 14 and second recesses 15 when there are a plurality of first recesses 14 and second recesses 15, heat diffusion is easy between adjacent first recesses 14 and adjacent second recesses 15 due to anisotropic thermal conduction of the graphite sheet 11. The heat dissipation performance can be further improved.
- connection hole 18 in the thin film portion 21 the pressure difference applied to the upper and lower surfaces of the thin film portion 21 by the heat radiation member 32 of the first recess 14 and the second recess 15 when the graphite sheet 11 is used for the heat transfer structure. Can be reduced through the heat dissipating member 32 of the connecting hole 18. Therefore, it can suppress that the thin film part 21 deform
- the thermal conductivity of the fluid heat radiating member is desirable to make the thermal conductivity of the fluid heat radiating member larger than the thermal conductivity in the thickness direction of the graphite sheet, and by doing so, the heat radiating performance can be further improved.
- the graphite sheet according to the embodiment of the present invention can hold a fluid heat radiating member to prevent leakage and improve the heat radiating performance of the heat connecting portion.
- a method for manufacturing a graphite sheet according to an embodiment of the present invention will be described.
- a pyrolytic graphite sheet is used as the graphite sheet.
- a specific description will be given using a polyimide film as a polymer film as a raw material of the pyrolytic graphite sheet.
- the polyimide film to be used a film formed by stretching a gel film obtained from a polyamic acid solution is preferable. By baking such a polyimide film at 2400 ° C. or higher, a thin pyrolytic graphite sheet having high orientation and a very high thermal conductivity in the principal surface direction can be formed. By using such a pyrolytic graphite sheet, the thermal conductivity of the heat connecting portion can be improved.
- the polyimide film to be used preferably has an end tear resistance per unit thickness of 8500 N / (20 mm ⁇ mm) to 15000 N / (20 mm ⁇ mm).
- an end tear resistance per unit thickness of 8500 N / (20 mm ⁇ mm) to 15000 N / (20 mm ⁇ mm thereby, a pyrolytic graphite sheet having a high orientation of the crystal structure of graphite and a high thermal conductivity in the principal surface direction can be obtained. Further, the undulation of the pyrolytic graphite sheet can be reduced and the flatness can be enhanced.
- the end tear resistance per unit thickness of the polyimide film is more preferably 9500 N / (20 mm ⁇ mm) or more. Thereby, the swell of the pyrolytic graphite sheet obtained can be remarkably reduced.
- the undulation is small in this manner, it is possible to improve the adhesion because the pyrolytic graphite sheet can be suppressed from wrinkles generated in the pyrolytic graphite sheet when it is sandwiched between the heating element and the heat radiating body as a heat connection part. In addition, leakage of the fluid radiating member in use for a long time can be reduced.
- the end tear resistance was measured on a polyimide film test piece having a width of 20 mm and a length of about 200 mm according to JIS C2151 B method.
- the end tear resistance per unit thickness was obtained by dividing the end tear resistance by the film thickness. Value.
- the undulation of the pyrolytic graphite sheet is, for example, as shown in FIG. 7, when the main surface of the graphite sheet 11 is placed on the flat plate 52 without applying a load to the graphite sheet 11 and has a undulation height 51. It appears in
- the polyimide film preferably has a film thickness of 30 ⁇ m to 150 ⁇ m. By using such a polyimide film, a flat pyrolytic graphite sheet having a high thermal conductivity can be obtained.
- the polyimide film is formed by first dissolving at least one aromatic dianhydride and at least one diamine in an equimolar amount in an organic solvent to obtain a polyamic acid solution. Next, the polyamic acid solution is coated on the support with a uniform thickness, and then dried by heating and partially imidized to obtain a gel film containing 10 to 50% by weight of a solid content and capable of being self-supported.
- a gel film may be prepared by mixing a cyclization catalyst and a dehydrating agent in a polyamic acid solution.
- aromatic dianhydride examples include pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,3 ′, 3,4′-biphenyltetracarboxylic Acid dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 2,3,6,7-naphthalenedicarboxylic dianhydride, 2,2-bis (3,4-dicarboxy Phenyl) ether dianhydride, pyridine-2,3,5,6-tetracarboxylic dianhydride and amide-forming derivatives thereof.
- diamine examples include paraphenylenediamine, metaphenylenediamine, benzidine, paraxylylenediamine, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, 3,3 '-Dimethyl-4,4'-diaminodiphenylmethane, 1,5-diaminonaphthalene, 3,3'-dimethoxybenzidine, 1,4-bis (3methyl-5aminophenyl) benzene and amide-forming derivatives thereof Is mentioned.
- the gel film is peeled from the support and stretched in the running direction (MD direction) while being pulled by a nip roll with a force of about 500 N / m to about 2000 N / m. Thereafter, the tenter device is stretched in the lateral direction (TD direction) while holding both ends of the gel film in the width direction with a tenter clip. In this way, the gel film is stretched in the biaxial direction. Biaxial stretching may be performed simultaneously.
- the molecular orientation in the film surface direction of the polyimide film can be increased, and the end resistance per unit thickness can be increased.
- the polyimide film is preferably formed using pyromellitic dianhydride as the aromatic dianhydride and 4,4'-diaminodiphenyl ether as the diamine. Thereby, it can be set as a high draw ratio and the end tear resistance per unit thickness can be enlarged.
- the polyimide film is cut into a predetermined size, and the polyimide film is placed in a graphite holding container and fired.
- a polyimide film was provided in a range of 1200 ° C. to 1500 ° C. at a constant temperature increase rate from room temperature to 1 ° C./min to 10 ° C./min in an inert gas atmosphere such as nitrogen or argon or a vacuum non-oxidizing atmosphere.
- the temperature is raised to the firing temperature.
- the polyimide film is carbonized by holding at this firing temperature for 30 minutes to 2 hours.
- elements other than carbon are released by thermal decomposition of the polyimide film, carbon-carbon recombination is performed, and the polyimide film is fired and contracted.
- the carbonized sheet was provided in a range of 2400 ° C. to 3500 ° C. at a constant temperature increase rate of 1 ° C./min to 10 ° C./min in an inert gas such as nitrogen or argon or a vacuum non-oxidizing atmosphere.
- the temperature is raised to the maximum firing temperature. Holding at this firing temperature for 30 minutes to 2 hours, firing and graphitization.
- carbon-carbon bonds are converted into graphite crystals.
- the calcination temperature in the graphitization step is lower than 2400 ° C., the graphitization of the polyimide film is insufficient, so that high-quality graphite crystals cannot be formed and the thermal conductivity is low.
- the pyrolytic graphite sheet after firing by sandwiching it with a rolling roller.
- This rolling process can improve flexibility and increase the density of the pyrolytic graphite sheet after firing to increase the thermal conductivity. Further, the undulation can be further reduced by maintaining the relationship of the undulation height in the pyrolytic graphite sheet after firing by rolling treatment.
- the first recess 14, the second recess 15, and the connection hole 18 are formed by irradiating the pyrolytic graphite sheet after firing or the graphite sheet rolled after firing with laser in the atmosphere to oxidize and disappear the graphite. To do.
- the first concave portion 14 is compared with the case where the concave portion is formed by compressing the pyrolytic graphite sheet by a mechanical method such as punching.
- region can be kept uniform. That is, the density can be made substantially uniform in all regions of the graphite sheet. For this reason, when the graphite sheet is pressurized in the heat transfer structure, the entire pyrolytic graphite sheet is uniformly compressed. Therefore, the reduction of the void volume of the first recess 14 and the second recess 15 can be reduced, and the effect of preventing the leakage of the heat conductive filler can be enhanced.
- a polyimide film having an end tear resistance per unit thickness of 9500 N / (20 mm ⁇ mm) is baked at a maximum temperature of 3000 ° C. in nitrogen gas. Thereafter, rolling is performed at a pressure of 0.3 MPa to form a rectangular pyrolytic graphite sheet having one side of the first main surface 12 and the second main surface 13 of 15 to 50 mm and a thickness of 17 ⁇ m.
- the thermal conductivity of the pyrolytic graphite sheet in the principal surface direction and the thickness direction is 1750 W / mK and 15 W / mK, respectively, and the swell height is 7 ⁇ m or less.
- a YAG laser is scanned to irradiate the pyrolytic graphite sheet, and the first concave portion 14 having a flat plate-like gap having a square shape with a side of 0.8 mm to 1.0 mm and a depth of 4 to 6 ⁇ m is formed in the first recess 14.
- the main surface 12 is formed.
- a plurality of first recesses 14 are appropriately provided according to the dimensions of the first main surface 12 such that the total area of the opening surface 16 is 40% to 60% of the area ratio with respect to the first main surface 12.
- the first recesses 14 are formed at equal intervals in the width direction and the length direction of the second main surface 13. Thereby, a lattice-like weir 25 is formed on the first main surface 12.
- the second concave portion 15 is provided in the same shape as the first concave portion 14, and the second concave portion 15 is formed so that almost all of the first concave portion 14 overlaps in a plan view from a direction perpendicular to the main surface.
- the center of the bottom surface of the first recess 14 is irradiated with a laser, and one annular connecting hole 18 having a diameter of 0.3 mm penetrating perpendicularly to the first main surface 12 is provided in each first recess 14.
- the thin film portion 21 is formed as a flat plate having a thickness of 5 ⁇ m to 9 ⁇ m, and is provided in parallel to the first main surface 12 and the second main surface 13.
- the graphite sheet of the present invention has an effect of improving the heat dissipation performance of the heat connection part, and is useful for a heat dissipation sheet used for heat connection between the heat generator and the heat radiator.
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Abstract
Description
本発明の実施の形態のグラファイトシートについて説明する。図1は本発明の実施の形態におけるグラファイトシートの平面図である。図2は図1におけるA-A面の断面図である。図1・図2に示すようにグラファイトシート11は平坦な第1の主面12と、第1の主面12と反対の面である第2の主面13とが平行に設けられる。第1の主面12には第1の凹部14が設けられる。第2の主面13には第2の凹部15が設けられている。第1の凹部14は、第1の底面19を有する。第2の凹部は第2の底面20を有する。
本実施の形態のグラファイトシートについて図1・図2を用いて具体的に説明する。
12 第1の主面
13 第2の主面
14 第1の凹部
15 第2の凹部
16,17 開口面
18 連結孔
19 第1の底面
20 第2の底面
21,22 薄膜部
23 先端
24 底部
31 熱接続部
32 放熱部材
33 樹脂
34 熱伝導性フィラー
36 半導体パッケージ(発熱体)
37 ヒートシンク(放熱体)
Claims (8)
- 第1の主面と
前記第1の主面の反対側の面である第2の主面とが設けられ主面方向に大きい異方性熱伝導率を有するグラファイトシートであって、
前記第1の主面に設けられ、第1の底面を備える第1の凹部と、
前記第2の主面に設けられ、第2の底面を備える第2の凹部と、
前記第1の底面と前記第2の底面とが重なり合う領域に形成された薄膜部と、
前記薄膜部を貫通して前記第1の凹部と前記第2の凹部とを連通する連結孔と、を備えた
グラファイトシート。 - 前記薄膜部は前記薄膜部の先端から底部に向かって厚く設けられる
請求項1に記載のグラファイトシート。 - 前記グラファイトシートは高分子フィルムを焼成して生成されるものである
請求項1に記載のグラファイトシート。 - 前記高分子フィルムはポリイミドフィルムであり、前記ポリイミドフィルムの単位厚み当りの端裂抵抗が8500N/(20mm・mm)~15000N/(20mm・mm)である
請求項3に記載のグラファイトシート。 - すべての領域において密度が均一である
請求項1に記載のグラファイトシート。 - 前記第1の凹部および前記第2の凹部はレーザ照射により形成されたものである請求項5に記載のグラファイトシート。
- 第1の主面と、
前記第1の主面と反対側の面である第2の主面と、
前記第1の主面に設けられ、第1の底面を有する第1の凹部と、
前記第2の主面に設けられ、第2の底面を有する第2の凹部と、
前記第1の底面と前記第2の底面とが重なり合う領域に形成された薄膜部と、
前記薄膜部を貫通して前記第1の凹部と前記第2の凹部とを連通する連通孔とを、備え、主面方向に大きい異方熱伝導性を有するグラファイトシートと、
前記第1の凹部と前記第2の凹部と前記連通孔とに充填された流動性の放熱部材と、
を備える熱接続部を備え、
前記グラファイトシートの前記第1の主面側に発熱体が接するように前記熱接続部が配置される
伝熱構造。 - 前記グラファイトシートの主面方向に垂直な方向の熱伝導率よりも、前記流動性の放熱部材の熱伝導率を大きくした請求項7に記載の伝熱構造。
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CN201080016706.7A CN102396302B (zh) | 2009-07-13 | 2010-06-30 | 石墨板及使用该石墨板的传热结构 |
US13/143,880 US8720537B2 (en) | 2009-07-13 | 2010-06-30 | Graphite sheet and heat transfer structure using same |
JP2011522700A JP5435032B2 (ja) | 2009-07-13 | 2010-06-30 | グラファイトシートおよびこれを用いた伝熱構造 |
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US20110265980A1 (en) | 2011-11-03 |
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CN102396302B (zh) | 2015-04-08 |
US8720537B2 (en) | 2014-05-13 |
CN102396302A (zh) | 2012-03-28 |
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