WO2011004764A1 - 板状体の研磨装置及び板状体の研磨方法 - Google Patents

板状体の研磨装置及び板状体の研磨方法 Download PDF

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Publication number
WO2011004764A1
WO2011004764A1 PCT/JP2010/061283 JP2010061283W WO2011004764A1 WO 2011004764 A1 WO2011004764 A1 WO 2011004764A1 JP 2010061283 W JP2010061283 W JP 2010061283W WO 2011004764 A1 WO2011004764 A1 WO 2011004764A1
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WO
WIPO (PCT)
Prior art keywords
polishing
plate
back pad
glass substrate
pad
Prior art date
Application number
PCT/JP2010/061283
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
順也 森下
吉幸 舟山
辰彦 甲斐
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to CN2010800301761A priority Critical patent/CN102548709A/zh
Priority to JP2011521899A priority patent/JPWO2011004764A1/ja
Publication of WO2011004764A1 publication Critical patent/WO2011004764A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Definitions

  • FIG. 1 is a perspective view of a polishing apparatus 10 for a glass substrate G according to the embodiment.
  • FIG. 2 is a schematic plan view of the polishing apparatus 10 shown in FIG. 1, in which the contents relating to the shape, arrangement position, and operation of the polishing pad 12 are shown.
  • the polishing apparatus 10 for example, continuously conveys a glass substrate G for liquid crystal display having a size of 2200 mm (width) ⁇ 2600 mm (length) or more and a thickness of 0.1 to 1.1 mm along the conveyance path.
  • the glass substrate G is continuously polished by a plurality of circular polishing pads 12, 12...
  • the glass substrate G to be polished has a urethane resin back pad 16 bonded to the upper surface of the table 14 and a surface (second surface of the main surface) opposite to the surface to be polished (second surface of the main surface).
  • the first surface) is held by suction.
  • the table 14 is continuously conveyed in the horizontal direction indicated by the arrow X in FIGS. 1 and 2 by a conveying device (not shown).
  • the surface to be polished has a flatness required for the glass substrate G for liquid crystal display by each of the polishing pads 12, 12... Of the plurality of polishing machines installed above the transfer path during transfer of the table 14. Polished.
  • FIG. 6 is an overall perspective view of the leaf-type polishing apparatus 30 to which the plate-like polishing method of the present invention is applied.
  • Each leaf type polishing apparatus 30 is an apparatus for polishing a single glass substrate G into a thin plate that satisfies the flatness required for a glass substrate for a liquid crystal display.
  • a circular polishing pad 34 is disposed on a cylindrical polishing surface plate 32 so as to be rotatable around its center, and the polishing pad 34 is provided on the polishing surface plate 32. It is rotated in the direction of arrow A by a motor (not shown).
  • the polishing pad 34 is configured to be larger than the size of the glass substrate G.
  • FIG. 7 is an overall perspective view of another continuous polishing apparatus 50 to which the plate-like body polishing method of the present invention is applied, and is the same or similar member as the continuous polishing apparatus 10 shown in FIGS. 1 and 2. Will be described with the same reference numerals.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
PCT/JP2010/061283 2009-07-06 2010-07-01 板状体の研磨装置及び板状体の研磨方法 WO2011004764A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800301761A CN102548709A (zh) 2009-07-06 2010-07-01 板状体的研磨装置以及板状体的研磨方法
JP2011521899A JPWO2011004764A1 (ja) 2009-07-06 2010-07-01 板状体の研磨装置及び板状体の研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-159537 2009-07-06
JP2009159537 2009-07-06

Publications (1)

Publication Number Publication Date
WO2011004764A1 true WO2011004764A1 (ja) 2011-01-13

Family

ID=43429186

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/061283 WO2011004764A1 (ja) 2009-07-06 2010-07-01 板状体の研磨装置及び板状体の研磨方法

Country Status (5)

Country Link
JP (1) JPWO2011004764A1 (zh)
KR (1) KR20120033327A (zh)
CN (1) CN102548709A (zh)
TW (1) TW201111113A (zh)
WO (1) WO2011004764A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105397596A (zh) * 2015-10-21 2016-03-16 无锡清杨机械制造有限公司 一种机械磨削设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319758A (ja) * 1989-06-16 1991-01-28 Toshiba Corp 研削方法
JP2000094308A (ja) * 1998-09-22 2000-04-04 Canon Inc 矩形基板保持治具および矩形基板研磨方法
JP2007190657A (ja) * 2006-01-20 2007-08-02 Asahi Glass Co Ltd 板状体の研磨方法及びその装置
JP2009095923A (ja) * 2007-10-16 2009-05-07 Sd Future Technology Co Ltd 研磨装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004090119A (ja) * 2002-08-30 2004-03-25 Central Glass Co Ltd 板状体の片面研磨装置および該装置に用いるバックパッドとその成形方法
CN100551624C (zh) * 2005-01-31 2009-10-21 三芳化学工业股份有限公司 用以固定抛光基材的吸附片材及其制造方法及抛光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319758A (ja) * 1989-06-16 1991-01-28 Toshiba Corp 研削方法
JP2000094308A (ja) * 1998-09-22 2000-04-04 Canon Inc 矩形基板保持治具および矩形基板研磨方法
JP2007190657A (ja) * 2006-01-20 2007-08-02 Asahi Glass Co Ltd 板状体の研磨方法及びその装置
JP2009095923A (ja) * 2007-10-16 2009-05-07 Sd Future Technology Co Ltd 研磨装置

Also Published As

Publication number Publication date
CN102548709A (zh) 2012-07-04
KR20120033327A (ko) 2012-04-06
JPWO2011004764A1 (ja) 2012-12-20
TW201111113A (en) 2011-04-01

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