WO2010123314A2 - 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물 - Google Patents

새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물 Download PDF

Info

Publication number
WO2010123314A2
WO2010123314A2 PCT/KR2010/002567 KR2010002567W WO2010123314A2 WO 2010123314 A2 WO2010123314 A2 WO 2010123314A2 KR 2010002567 W KR2010002567 W KR 2010002567W WO 2010123314 A2 WO2010123314 A2 WO 2010123314A2
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
same
present
resin composition
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/002567
Other languages
English (en)
French (fr)
Other versions
WO2010123314A3 (ko
Inventor
전현애
신승한
김현아
오창호
김윤주
탁상용
이명훈
강태윤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Industrial Technology KITECH
Original Assignee
Korea Institute of Industrial Technology KITECH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Institute of Industrial Technology KITECH filed Critical Korea Institute of Industrial Technology KITECH
Priority to US13/266,126 priority Critical patent/US20120041102A1/en
Priority to JP2012507162A priority patent/JP2012524828A/ja
Publication of WO2010123314A2 publication Critical patent/WO2010123314A2/ko
Publication of WO2010123314A3 publication Critical patent/WO2010123314A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5033Amines aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

본 발명은 내열성, 열팽창 특성 및 공정성이 개선된 새로운 에폭시 수지 및 이를 포함하는 열경화성 수지 조성물에 관한 것으로, 명세서중의 화학식 1의 에폭시 수지, 이를 포함하는 에폭시 수지 조성물 및 이로 형성된 패키징, 기판 및 트랜지스터가 제공된다. 본 발명에 의한 특정한 사이드 작용기를 갖는 에폭시수지 및/또는 특정한 코어 구조를 갖는 에폭시 수지는 이를 포함하는 조성물의 경화시, 에폭시 수지에 대하여 필러가 견고하게 화학적으로 결합되도록 하며, 이에 따라 에폭시 수지에 대한 필러의 충진효과가 극대화될 뿐만 아니라, 특정한 코어구조의 특성으로 인하여, 경화물의 내열성 및 열팽창특성이 크게 향상(CTE 감소)되며, 개선된 유리전이 특성, 강도 및 가공성을 나타낸다.
PCT/KR2010/002567 2009-04-24 2010-04-23 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물 Ceased WO2010123314A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/266,126 US20120041102A1 (en) 2009-04-24 2010-04-23 Novel epoxy resin and epoxy resin composition comprising the same
JP2012507162A JP2012524828A (ja) 2009-04-24 2010-04-23 新しいエポキシ樹脂及びこれを含むエポキシ樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090036010 2009-04-24
KR10-2009-0036010 2009-04-24
KR20090090649 2009-09-24
KR10-2009-0090649 2009-09-24

Publications (2)

Publication Number Publication Date
WO2010123314A2 true WO2010123314A2 (ko) 2010-10-28
WO2010123314A3 WO2010123314A3 (ko) 2011-03-31

Family

ID=43011635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002567 Ceased WO2010123314A2 (ko) 2009-04-24 2010-04-23 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물

Country Status (3)

Country Link
US (1) US20120041102A1 (ko)
JP (1) JP2012524828A (ko)
WO (1) WO2010123314A2 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130112007A (ko) * 2012-04-02 2013-10-11 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
US20140018475A1 (en) * 2012-07-16 2014-01-16 Baker Hughes Incorporated High glass transition temperature thermoset and method of making the same
CN103889977A (zh) * 2011-08-25 2014-06-25 韩国生产技术研究院 具有烷氧基甲硅烷基的环氧化合物、其制备方法、包括它的组合物和固化材料、及其应用
KR101774629B1 (ko) 2011-08-18 2017-09-04 세키스이가가쿠 고교가부시키가이샤 에폭시 화합물, 에폭시 화합물의 혼합물, 경화성 조성물 및 접속 구조체
WO2023121269A1 (ko) * 2021-12-22 2023-06-29 주식회사 포스코 전기강판 절연 피막 조성물, 전기강판, 및 이의 제조 방법

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
WO2013066078A1 (ko) 2011-11-01 2013-05-10 한국생산기술연구원 알콕시실릴기를 갖는 이소시아누레이트 에폭시 화합물, 이의 제조 방법 및 이를 포함하는 조성물과 경화물 및 이의 용도
EP2826777B1 (en) 2012-03-14 2020-08-05 Korea Institute of Industrial Technology Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group
KR101520764B1 (ko) * 2012-06-01 2015-05-15 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 무기입자를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
KR101863111B1 (ko) 2012-07-06 2018-06-01 한국생산기술연구원 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
US9376614B2 (en) * 2012-08-22 2016-06-28 Empire Technology Development Llc Optically active epoxy
JP2015203086A (ja) * 2014-04-16 2015-11-16 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物および硬化物
JP6697416B2 (ja) * 2016-07-07 2020-05-20 信越化学工業株式会社 レジスト下層膜材料、パターン形成方法、レジスト下層膜形成方法、及びレジスト下層膜材料用化合物
US11021574B2 (en) * 2016-12-02 2021-06-01 3M Innovative Properties Company Dual cure monomers
JP7763575B2 (ja) * 2018-05-30 2025-11-04 住友化学株式会社 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
CN111607312B (zh) * 2020-06-04 2022-04-29 杭州每步材料科技有限公司 一种增韧型抗冲磨环氧树脂胶泥及其制备方法
CN112280252B (zh) * 2020-10-31 2023-04-25 武汉双键开姆密封材料有限公司 一种环氧组合物以及该组合物的应用
CN114907291B (zh) * 2022-05-16 2024-01-12 厦门市宜帆达新材料有限公司 一种改性活性稀释剂及其制备方法和碳纤维用环氧树脂及其制备方法
KR20250012050A (ko) * 2022-05-17 2025-01-23 디아이씨 가부시끼가이샤 수산기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체
CN115975343B (zh) * 2023-01-15 2026-03-03 西京学院 一种超低介电损耗的液晶环氧树脂复合材料及其制备方法
CN119707878B (zh) * 2024-12-20 2025-12-30 西北工业大学 一种萘环液晶环氧树脂单体及其制备方法、萘环液晶环氧树脂及其制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271357A (ja) * 1987-04-30 1988-11-09 Matsushita Electric Ind Co Ltd 低温定着トナ−
US5068268A (en) * 1989-09-12 1991-11-26 Shell Oil Company Epoxy polymer materials
JPH0472321A (ja) * 1990-03-27 1992-03-06 Nippon Steel Chem Co Ltd 半導体封止用樹脂組成物及びこれを用いた半導体装置
JP2868190B2 (ja) * 1991-07-29 1999-03-10 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
US5686182A (en) * 1995-09-28 1997-11-11 Xerox Corporation Conductive carrier compositions and processes for making and using
JP4713753B2 (ja) * 2001-03-29 2011-06-29 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びその硬化物
JP3953854B2 (ja) * 2002-03-22 2007-08-08 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物
JP4385116B2 (ja) * 2003-06-23 2009-12-16 京セラケミカル株式会社 電子部品
JP4770229B2 (ja) * 2005-03-29 2011-09-14 住友化学株式会社 エポキシ化合物およびエポキシ樹脂硬化物
US20060286378A1 (en) * 2005-05-23 2006-12-21 Shivkumar Chiruvolu Nanostructured composite particles and corresponding processes

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101774629B1 (ko) 2011-08-18 2017-09-04 세키스이가가쿠 고교가부시키가이샤 에폭시 화합물, 에폭시 화합물의 혼합물, 경화성 조성물 및 접속 구조체
CN103889977A (zh) * 2011-08-25 2014-06-25 韩国生产技术研究院 具有烷氧基甲硅烷基的环氧化合物、其制备方法、包括它的组合物和固化材料、及其应用
EP2767535A4 (en) * 2011-08-25 2015-02-18 Korea Ind Tech Inst EPOXY COMPOUND WITH AN ALKOXYSILYL GROUP, METHOD FOR THE PRODUCTION, COMPOSITION AND HARDENED MATERIAL THEREWITH, AND USE THEREOF
CN103889977B (zh) * 2011-08-25 2016-08-10 韩国生产技术研究院 具有烷氧基甲硅烷基的环氧化合物、其制备方法、包括它的组合物和固化材料、及其应用
KR20130112007A (ko) * 2012-04-02 2013-10-11 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
KR101898526B1 (ko) * 2012-04-02 2018-09-14 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
US20140018475A1 (en) * 2012-07-16 2014-01-16 Baker Hughes Incorporated High glass transition temperature thermoset and method of making the same
WO2023121269A1 (ko) * 2021-12-22 2023-06-29 주식회사 포스코 전기강판 절연 피막 조성물, 전기강판, 및 이의 제조 방법

Also Published As

Publication number Publication date
JP2012524828A (ja) 2012-10-18
WO2010123314A3 (ko) 2011-03-31
US20120041102A1 (en) 2012-02-16

Similar Documents

Publication Publication Date Title
WO2010123314A2 (ko) 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물
WO2008114634A1 (ja) 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
WO2013028045A3 (ko) 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
TW200745262A (en) Resin composition and method for producing the same
ZA200808655B (en) A layer for cables having improved stress whitening resistance
TW200940642A (en) Liquid crystalline polyester, and molded article thereof
WO2012093895A3 (ko) 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
WO2011090361A3 (ko) 경화성 조성물
MY160861A (en) Polybutylene terephthalate resin composition
WO2010059008A3 (ko) 복합탄소소재를 포함하는 전도성 수지조성물
WO2011090364A3 (ko) 경화성 조성물
MY156527A (en) Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
WO2009117729A3 (en) Anti-bleed compounds, compositions and methods for use thereof
MX2012000750A (es) Metodo para manufacturar una composicion de poliester que tiene propiedades al impacto mejoradas.
WO2009084831A3 (en) Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
WO2012044029A3 (ko) 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법
WO2011146580A3 (en) Curable compositions
WO2008096441A1 (ja) 炭素-炭素三重結合を有する化合物を含む熱硬化性樹脂組成物、その低温硬化方法及び製品
WO2010063284A3 (de) Verbundwerkstoff, verfahren zur herstellung eines formkörpers und verwendung des verbundwerkstoffs
MY157414A (en) Epoxy resin composition and semiconductor device
MY160102A (en) Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
WO2004067615A3 (en) Epoxy resin compositions, methods of preparing, and articles made therefrom
TW200801081A (en) Novel phenolic resin, its preparation and its use
MY173820A (en) Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10767328

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2012507162

Country of ref document: JP

Ref document number: 13266126

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 10767328

Country of ref document: EP

Kind code of ref document: A2