WO2010113751A1 - 複合rfタグ、該複合rfタグを設置した工具 - Google Patents
複合rfタグ、該複合rfタグを設置した工具 Download PDFInfo
- Publication number
- WO2010113751A1 WO2010113751A1 PCT/JP2010/055196 JP2010055196W WO2010113751A1 WO 2010113751 A1 WO2010113751 A1 WO 2010113751A1 JP 2010055196 W JP2010055196 W JP 2010055196W WO 2010113751 A1 WO2010113751 A1 WO 2010113751A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnetic
- tag
- composite
- antenna
- resin
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 239000007772 electrode material Substances 0.000 claims abstract description 16
- 230000005674 electromagnetic induction Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 239000000696 magnetic material Substances 0.000 abstract description 26
- 239000002184 metal Substances 0.000 abstract description 19
- 229910052751 metal Inorganic materials 0.000 abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 56
- 239000011162 core material Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 15
- 238000004891 communication Methods 0.000 description 14
- 229910000859 α-Fe Inorganic materials 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000003848 UV Light-Curing Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 239000006247 magnetic powder Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 101100545272 Caenorhabditis elegans zif-1 gene Proteins 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- HIZCTWCPHWUPFU-UHFFFAOYSA-N Glycerol tribenzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(OC(=O)C=1C=CC=CC=1)COC(=O)C1=CC=CC=C1 HIZCTWCPHWUPFU-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/04—Adaptation for subterranean or subaqueous use
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
Description
2:電極層(コイル電極)
3:コア
4:コイル
4-1:コイルの最小単位
4-2:コイル開放端面
5:磁性層
6:絶縁層
7:導電層
8:非磁性層
9:ICチップ接続端子
10:ICチップ
11:コンデンサー接続用電極
12:コンデンサー
17:磁性体アンテナ
20:樹脂
L1 ≧ 1/(4π2×(動作周波数)2×(IC容量+アンテナの寄生容量))
L0 ≦ 1/(4π2×(動作周波数)2×(IC容量+アンテナの寄生容量))
本発明に係る磁性体アンテナは、金属・プラスティック部品に貼り付けた状態、あるいは周囲に水分が多い状態でも、交信特性の低下を最小限に抑制できるとともに、破損や割れへの心配がないので、工具や部品管理に好適である。
磁性層用として、900℃焼結後に13.56MHzでの材料としての透磁率が100になるNi-Zn-Cuフェライト仮焼粉(Fe2O3 48.5モル%、NiO 25モル%、ZnO 16モル%、CuO 10.5モル%)100重量部、ブチラール樹脂8重量部、可塑剤5重量部、溶剤80重量部をボールミルで混合しスラリーを製造した。出来たスラリーをドクターブレードでPETフィルム上に150mm角で、焼結時の厚みが0.1mmになるようにシート成型した。
共振周波数は、アジレントテクノロジー株式会社製インピーダンスアナライザー4291Aで測定されるインピーダンスのピーク周波数をもって共振周波数とした。
交信距離は、リーダ/ライタ(株式会社タカヤ製、製品名TR3-A201/TR3-C201)をアンテナとして用いて、作製した複合RFタグの、13.56MHzで通信が可能な限り離れた位置の時のアンテナとRFタグの距離を通信距離とした。
実施例1と同様に製造した磁性体アンテナにホットメルトモールディング成形にて、コート厚みが500μmとなるようポリアミド系樹脂を成形し、複合RFタグ2を得た。
実施例1と同様に製造した磁性体アンテナにUV硬化プロセスにて、コート厚みが200μmとなるようアクリル系UV硬化樹脂を成形し、複合RFタグ3を得た。
実施例1と同様に製造した磁性体アンテナにそのままICを実装し、そのままの状態で共振周波数が13.56MHzに調整しRFタグ4とした。
実施例1と同様に製造した磁性体アンテナに塗装コーティングにて、コート厚みが20μmとなるようエポキシ系樹脂を成形し、複合RFタグ5を得た。
実施例1と同様に製造した磁性体アンテナに塗装コーティングにて、コート厚みが50μmとなるようポリイミド系樹脂を成形し、複合RFタグ6を得た。
実施例1と同様に製造した磁性体アンテナに塗装コーティングにて、コート厚みが100μmとなるようエポキシ系樹脂を成形し、複合RFタグ7を得た。
Claims (4)
- 電磁誘導方式を利用し情報を送受信するための複合RFタグであり、該複合RFタグはICを実装した磁性体アンテナと樹脂とからなり、前記樹脂は前記磁性体アンテナの周囲を全て囲んでおり、前記樹脂の厚みが200μm以上であることを特徴とする複合RFタグ。
- 電磁誘導方式を利用し情報を送受信するための複合RFタグであり、該複合RFタグはICを実装した磁性体アンテナと樹脂とからなり、とからなり、前記磁性体アンテナは六面体状であって磁性体からなるコアを中心として電極材料がコイル状となるように形成され、前記樹脂は前記磁性体アンテナの周囲を全て囲んでおり、前記樹脂の厚みが200μm以上であることを特徴とする複合RFタグ。
- 請求項1又は2記載の樹脂がポリアミド、エポキシ、ポリイミド、ウレタン、ポリオレフィン、アクリル系の樹脂、あるいはその混合物である複合RFタグ。
- 請求項1~3のいずれかに記載の複合RFタグを設置した工具。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080014197.4A CN102365787B (zh) | 2009-03-31 | 2010-03-25 | 复合rf标签、设置有该复合rf标签的工具 |
US13/260,988 US8720787B2 (en) | 2009-03-31 | 2010-03-25 | Composite RF tag, and tool mounted with the composite RF tag |
KR1020117022687A KR101810248B1 (ko) | 2009-03-31 | 2010-03-25 | 복합 rf 태그, 그 복합 rf 태그를 설치한 공구 |
EP10758524A EP2416446A4 (en) | 2009-03-31 | 2010-03-25 | COMPOSITE RADIO FREQUENCY IDENTIFICATION LABEL AND TOOL EQUIPPED WITH THE COMPOSITE RADIO FREQUENCY IDENTIFICATION LABEL |
US14/272,607 US9218559B2 (en) | 2009-03-31 | 2014-05-08 | Composite RF tag, and tool mounted with the composite RF tag |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-088129 | 2009-03-31 | ||
JP2009088129 | 2009-03-31 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/260,988 A-371-Of-International US8720787B2 (en) | 2009-03-31 | 2010-03-25 | Composite RF tag, and tool mounted with the composite RF tag |
US14/272,607 Division US9218559B2 (en) | 2009-03-31 | 2014-05-08 | Composite RF tag, and tool mounted with the composite RF tag |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010113751A1 true WO2010113751A1 (ja) | 2010-10-07 |
Family
ID=42828044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/055196 WO2010113751A1 (ja) | 2009-03-31 | 2010-03-25 | 複合rfタグ、該複合rfタグを設置した工具 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8720787B2 (ja) |
EP (1) | EP2416446A4 (ja) |
JP (1) | JP2010259068A (ja) |
KR (1) | KR101810248B1 (ja) |
CN (1) | CN102365787B (ja) |
TW (1) | TWI479424B (ja) |
WO (1) | WO2010113751A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013171923A1 (ja) * | 2012-05-15 | 2013-11-21 | 株式会社 村田製作所 | インダクタ素子 |
JP5585740B1 (ja) * | 2013-03-18 | 2014-09-10 | 株式会社村田製作所 | 積層型インダクタ素子および通信装置 |
WO2014147881A1 (ja) * | 2013-03-18 | 2014-09-25 | 株式会社 村田製作所 | 積層型インダクタ素子およびその製造方法 |
USD755163S1 (en) | 2014-03-13 | 2016-05-03 | Murata Manufacturing Co., Ltd. | Antenna |
US9406438B2 (en) | 2013-03-18 | 2016-08-02 | Murata Manufacturing Co., Ltd. | Stack-type inductor element and method of manufacturing the same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011118379A1 (ja) * | 2010-03-24 | 2011-09-29 | 株式会社村田製作所 | Rfidシステム |
WO2012144482A1 (ja) * | 2011-04-18 | 2012-10-26 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
CN103703617B (zh) * | 2011-12-22 | 2016-06-08 | 株式会社村田制作所 | 磁性体天线、天线装置及电子设备 |
CN106486779A (zh) | 2012-05-09 | 2017-03-08 | 株式会社村田制作所 | 线圈天线元件以及天线模块 |
WO2014050244A1 (ja) * | 2012-09-25 | 2014-04-03 | 株式会社 村田製作所 | インダクタ素子 |
TWI603531B (zh) * | 2015-04-29 | 2017-10-21 | 佳邦科技股份有限公司 | 通訊模組 |
CN107453048B (zh) * | 2016-05-31 | 2021-03-12 | Skc株式会社 | 天线设备和包括天线设备的便携式终端 |
KR101813386B1 (ko) | 2016-06-21 | 2017-12-28 | 삼성전기주식회사 | 자성체를 포함하는 무선 통신 안테나 |
KR102480127B1 (ko) | 2016-07-08 | 2022-12-22 | 주식회사 위츠 | 무선 통신 안테나 및 이의 제조 방법 |
DE102017205356A1 (de) * | 2017-03-29 | 2018-10-04 | Siemens Aktiengesellschaft | Fahrzeug mit einer Erkennungseinrichtung zum Erkennen einer streckenseitigen Sendeeinrichtung und Verfahren zu deren Betrieb |
US11348067B2 (en) | 2018-03-30 | 2022-05-31 | A-1 Packaging Solutions, Inc. | RFID-based inventory tracking system |
MX2021012976A (es) * | 2019-04-22 | 2022-02-03 | A 1 Packaging Solutions Inc | Sistema de seguimiento de inventario con rfid. |
CN112103059B (zh) * | 2020-09-15 | 2022-02-22 | 横店集团东磁股份有限公司 | 一种薄膜功率电感器的制作方法以及薄膜功率电感器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002207980A (ja) | 2001-01-09 | 2002-07-26 | Denso Corp | 金属貼付用idタグ |
JP2006333403A (ja) * | 2005-05-30 | 2006-12-07 | Hitachi Ltd | 無線icタグ、及び無線icタグの製造方法 |
JP2007019891A (ja) | 2005-07-07 | 2007-01-25 | Toda Kogyo Corp | 磁性体アンテナ |
JP2007041666A (ja) * | 2005-08-01 | 2007-02-15 | Ricoh Co Ltd | Rfidタグ及びその製造方法 |
JP2007133651A (ja) * | 2005-11-10 | 2007-05-31 | Funai Electric Co Ltd | 無線タグ |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2692253B2 (ja) * | 1989-04-17 | 1997-12-17 | 日産自動車株式会社 | 自動車用埋込みアンテナ |
DE9017912U1 (ja) * | 1990-07-20 | 1993-04-01 | Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De | |
JPH0964634A (ja) * | 1995-08-22 | 1997-03-07 | Mitsubishi Materials Corp | トランスポンダ用アンテナ |
WO2001099193A1 (en) * | 2000-06-21 | 2001-12-27 | Hitachi Maxell, Ltd. | Semiconductor chip and semiconductor device using the semiconductor chip |
JP2002366916A (ja) * | 2001-06-06 | 2002-12-20 | Lintec Corp | 複合タグ及びその製造方法 |
US6812707B2 (en) * | 2001-11-27 | 2004-11-02 | Mitsubishi Materials Corporation | Detection element for objects and detection device using the same |
EP1585191A4 (en) | 2002-09-30 | 2007-03-14 | Furukawa Electric Co Ltd | RIFD LABEL AND PROCESS FOR ITS MANUFACTURE |
US7411506B2 (en) | 2003-03-03 | 2008-08-12 | Veroscan, Inc. | Interrogator and interrogation system employing the same |
US7504924B2 (en) | 2003-10-23 | 2009-03-17 | Kabushiki Kaisha Toshiba | Inductive device and method for manufacturing same |
EP1683889B1 (en) * | 2003-10-29 | 2012-08-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Surface treatment method and device |
JP4214913B2 (ja) * | 2003-12-26 | 2009-01-28 | 戸田工業株式会社 | 磁界アンテナ、それを用いて構成したワイヤレスシステムおよび通信システム |
JP2005340759A (ja) * | 2004-04-27 | 2005-12-08 | Sony Corp | アンテナモジュール用磁芯部材、アンテナモジュールおよびこれを備えた携帯情報端末 |
TW200707301A (en) | 2005-05-25 | 2007-02-16 | Ibm | ID tag package and RFID system |
JP4793584B2 (ja) | 2007-01-10 | 2011-10-12 | 戸田工業株式会社 | 磁性体アンテナを実装した基板 |
WO2007007639A1 (ja) * | 2005-07-07 | 2007-01-18 | Toda Kogyo Corporation | 磁性体アンテナ |
US8072387B2 (en) | 2005-07-07 | 2011-12-06 | Toda Kogyo Corporation | Magnetic antenna and board mounted with the same |
US8232621B2 (en) * | 2006-07-28 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2008077140A (ja) * | 2006-09-19 | 2008-04-03 | Nec Tokin Corp | 非接触icタグ |
CN101622756A (zh) * | 2007-03-09 | 2010-01-06 | 株式会社村田制作所 | 基板安装用天线线圈及天线装置 |
JP2009048550A (ja) * | 2007-08-22 | 2009-03-05 | Art Weld Co Ltd | Icタグ |
JP5239499B2 (ja) * | 2008-05-13 | 2013-07-17 | 戸田工業株式会社 | 複合磁性体アンテナ及びrfタグ、該複合磁性体アンテナ又はrfタグを設置した金属部品、金属工具 |
-
2010
- 2010-03-25 KR KR1020117022687A patent/KR101810248B1/ko active IP Right Grant
- 2010-03-25 EP EP10758524A patent/EP2416446A4/en not_active Withdrawn
- 2010-03-25 CN CN201080014197.4A patent/CN102365787B/zh active Active
- 2010-03-25 US US13/260,988 patent/US8720787B2/en active Active
- 2010-03-25 WO PCT/JP2010/055196 patent/WO2010113751A1/ja active Application Filing
- 2010-03-26 TW TW099109204A patent/TWI479424B/zh active
- 2010-03-31 JP JP2010083687A patent/JP2010259068A/ja active Pending
-
2014
- 2014-05-08 US US14/272,607 patent/US9218559B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002207980A (ja) | 2001-01-09 | 2002-07-26 | Denso Corp | 金属貼付用idタグ |
JP2006333403A (ja) * | 2005-05-30 | 2006-12-07 | Hitachi Ltd | 無線icタグ、及び無線icタグの製造方法 |
JP2007019891A (ja) | 2005-07-07 | 2007-01-25 | Toda Kogyo Corp | 磁性体アンテナ |
JP2007041666A (ja) * | 2005-08-01 | 2007-02-15 | Ricoh Co Ltd | Rfidタグ及びその製造方法 |
JP2007133651A (ja) * | 2005-11-10 | 2007-05-31 | Funai Electric Co Ltd | 無線タグ |
Non-Patent Citations (1)
Title |
---|
See also references of EP2416446A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013171923A1 (ja) * | 2012-05-15 | 2013-11-21 | 株式会社 村田製作所 | インダクタ素子 |
US9424981B2 (en) | 2012-05-15 | 2016-08-23 | Murata Manufacturing Co., Ltd. | Inductor element |
JP5585740B1 (ja) * | 2013-03-18 | 2014-09-10 | 株式会社村田製作所 | 積層型インダクタ素子および通信装置 |
WO2014147881A1 (ja) * | 2013-03-18 | 2014-09-25 | 株式会社 村田製作所 | 積層型インダクタ素子およびその製造方法 |
JP2014207432A (ja) * | 2013-03-18 | 2014-10-30 | 株式会社村田製作所 | 積層型インダクタ素子および通信装置 |
US9287625B2 (en) | 2013-03-18 | 2016-03-15 | Murata Manufacturing Co., Ltd. | Stack-type inductor element and method of manufacturing the same, and communication device |
US9406438B2 (en) | 2013-03-18 | 2016-08-02 | Murata Manufacturing Co., Ltd. | Stack-type inductor element and method of manufacturing the same |
USD755163S1 (en) | 2014-03-13 | 2016-05-03 | Murata Manufacturing Co., Ltd. | Antenna |
Also Published As
Publication number | Publication date |
---|---|
US9218559B2 (en) | 2015-12-22 |
US20120091210A1 (en) | 2012-04-19 |
TW201102931A (en) | 2011-01-16 |
EP2416446A4 (en) | 2013-03-13 |
CN102365787A (zh) | 2012-02-29 |
JP2010259068A (ja) | 2010-11-11 |
US8720787B2 (en) | 2014-05-13 |
TWI479424B (zh) | 2015-04-01 |
EP2416446A1 (en) | 2012-02-08 |
KR20110134430A (ko) | 2011-12-14 |
KR101810248B1 (ko) | 2017-12-18 |
CN102365787B (zh) | 2014-09-03 |
US20140239075A1 (en) | 2014-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010113751A1 (ja) | 複合rfタグ、該複合rfタグを設置した工具 | |
KR101593252B1 (ko) | 복합 자성체 안테나 및 rf 태그, 상기 복합 자성체 안테나 또는 rf 태그를 설치한 금속 부품 및 금속 공구 | |
JP5634717B2 (ja) | 磁性体アンテナ及びrfタグ並びに該rfタグを実装した基板 | |
JP5354188B2 (ja) | 磁性体アンテナ、該磁性体アンテナを実装した基板及びrfタグ | |
JP5403279B2 (ja) | Rfタグの製造方法、磁性体アンテナの製造方法及び当該rfタグを実装した基板、通信システム | |
CN110214396B (zh) | 电子器件、天线和rf标签 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080014197.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10758524 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20117022687 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010758524 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13260988 Country of ref document: US |