WO2010082300A1 - Dispositif de transfert - Google Patents

Dispositif de transfert Download PDF

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Publication number
WO2010082300A1
WO2010082300A1 PCT/JP2009/050315 JP2009050315W WO2010082300A1 WO 2010082300 A1 WO2010082300 A1 WO 2010082300A1 JP 2009050315 W JP2009050315 W JP 2009050315W WO 2010082300 A1 WO2010082300 A1 WO 2010082300A1
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WO
WIPO (PCT)
Prior art keywords
transfer
support mechanism
unit
mold
moving
Prior art date
Application number
PCT/JP2009/050315
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English (en)
Japanese (ja)
Inventor
哲也 今井
藤原睦巳
圭亮 太田
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2009/050315 priority Critical patent/WO2010082300A1/fr
Priority to JP2010546485A priority patent/JPWO2010082300A1/ja
Publication of WO2010082300A1 publication Critical patent/WO2010082300A1/fr

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer

Definitions

  • the present invention relates to a transfer device for transferring a concavo-convex pattern to a transfer target.
  • Patent Document 1 Currently, for example, an apparatus as shown in FIG. 1 of Patent Document 1 has been proposed as a transfer apparatus that transfers a fine concavo-convex pattern onto a disk-shaped recording medium substrate using an optical imprint method.
  • an auxiliary apparatus for alignment of the mold and the substrate an auxiliary apparatus for light irradiation must be provided, and the apparatus configuration is increased in size.
  • JP 2008-155522 A JP 2008-155522 A
  • An advantage of some aspects of the invention is that it provides a transfer apparatus that does not increase the size of the apparatus and complicate the apparatus configuration.
  • a transfer device is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, a support mechanism for supporting the transfer target, and the support
  • a support mechanism driving unit that drives the mechanism in a first direction; an irradiation unit that irradiates an energy beam toward the transfer target; and a moving unit that moves the irradiation unit and / or the support mechanism driving unit.
  • a transfer device is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, a support mechanism for supporting the transfer target, and the support Support mechanism driving means for driving the mechanism in the first direction, photographing means for alignment of the transferred object and the mold, and moving means for moving the photographing means and / or the supporting mechanism driving means.
  • a transfer device is a transfer device for transferring a pattern formed on a mold to a transfer target, an irradiation means for irradiating an energy ray toward the transfer target, and the transfer target
  • An imaging unit for alignment of the body and the mold, a moving unit for moving the imaging unit or the irradiation unit, and one of the imaging unit and the irradiation unit is set to a use position according to the progress of the pattern transfer process.
  • Control means for controlling the moving means to be arranged.
  • the transfer device transfers the pattern formed on the first mold to the first surface of the transfer object, and transfers the pattern formed on the second mold to the second surface of the transfer object.
  • a transfer device that performs a series of transfer processes to be transferred to a first support mechanism, a first support mechanism that supports the transfer object, a first support mechanism driving unit that drives the first support mechanism in a first direction, and an energy beam First irradiating means for irradiating the first surface of the transferred body, second irradiating means for irradiating energy rays toward the second surface of the transferred body, the transferred body and the Imaging means for alignment of the first and second molds, a second support mechanism for supporting the transferred object, a second support mechanism driving means for moving the second support mechanism, the imaging means, and the first Transfer the support mechanism driving means or the first irradiation means.
  • a transfer device is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and has a support mechanism that supports the transfer target in a first direction.
  • One of the support mechanism driving means and the irradiating means is set to the use position.
  • a movement control means for moving the slide table to be arranged.
  • a transfer device is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and has a support mechanism that supports the transfer target in a first direction.
  • a transfer device is a transfer device for performing a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and an imaging unit for alignment of the transfer target and the mold , And a slide table on which irradiation means for irradiating an energy beam toward the transfer object is installed, and the slide table is moved so that one of the photographing means and the irradiation means is placed at a use position. And a device station comprising movement control means.
  • FIG. 1 It is a figure which shows schematic structure of the imprint apparatus which concerns on this invention. It is a figure which shows schematic structure of the upper device station 90a seen from the upper surface. It is a figure which shows schematic structure of the upper device station 90a seen from the side surface. It is a figure which shows schematic structure of the lower device station 90b seen from the upper surface. It is a figure which shows schematic structure of the lower device station 90b seen from the side surface. It is a top view which shows the other structure of the upper device station 90a. It is a side view which shows the other structure of the upper device station 90a. It is a figure which shows an example of the manufacturing process of a double-sided magnetic disc.
  • a support mechanism driving means for moving a support mechanism for supporting the transfer object and the mold at the same reference position and a light irradiation means for irradiating light for curing the surface of the substrate are placed on the stage.
  • the installation position of the light irradiating means and the support mechanism driving means with respect to can be moved.
  • FIG. 1 is a view showing a schematic cross-sectional structure of a UV (Ultraviolet) type imprint apparatus according to the present invention.
  • This imprint apparatus uses the upper mold 503a and the lower mold 503b on which the concavo-convex pattern to be transferred is formed to perform pattern transfer on both sides of the substrate 6 as a transfer target to be transferred.
  • the transfer target is referred to as a substrate.
  • the substrate refers to a configuration including a layer to be transferred.
  • the support mechanism refers to a center pin.
  • an upper transfer layer 604a and a lower transfer layer 604b made of a transfer material that is cured when irradiated with ultraviolet rays are formed on both surfaces of the substrate 6, an upper transfer layer 604a and a lower transfer layer 604b made of a transfer material that is cured when irradiated with ultraviolet rays are formed.
  • FIG. 1 the configuration of the imprint apparatus is shown in a state in which the substrate 6, the upper mold 503a, and the lower mold 503b are installed.
  • the imprint apparatus shown in FIG. 1 includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.
  • the upper mechanism unit includes an upper center pin 30a, a camera unit 40, an upper device station 90a, an upper mold XY stage 500a, an upper mold holding unit 501a, an upper stage 505a, an upper center pin driving unit 507a, and an upper UV irradiation unit 508a.
  • the upper center pin 30a and the upper center pin drive unit 507a are integrally formed in order to photograph a tip portion of a lower center pin 30b described later. That is, the upper center pin 30a is also moved by the movement of the upper center pin driving unit 507a.
  • the board-like upper stage 505a has a screw hole portion in which a screw groove into which a ball screw 512 (to be described later) is screwed is formed, along with an opening portion 100a as shown in FIG.
  • An upper mold XY stage 500a having an opening continuous with the opening 100a is installed on the lower surface of the upper stage 505a.
  • an upper mold holding part 501a made of a transparent material is installed so as to cover the opening.
  • Upper mold XY stage 500a is according to the supplied upper XY stage movement signal XY U from the controller 200, the upper mold holding portion 501a, it is moved in the direction of the two-dimensional with respect to the lower surface of the upper stage 505a.
  • the upper mold holding part 501a includes a mold holding surface (a surface with which the upper mold 503a is in contact in FIG. 1) for holding the upper mold 503a.
  • a through hole is provided in the center of the upper mold holding part 501a so that the upper center pin 30a can be moved up and down in a direction perpendicular to the mold holding surface of the upper mold holding part 501a.
  • the upper mold holding unit 501a in accordance with the upper mold holding signal MH U supplied from the controller 200, for example, by vacuum suction, and holds the upper mold 503a on the mold holding surface.
  • the method of holding the upper mold 503a on the mold holding surface is not limited to vacuum suction and may be held by a mechanical method.
  • An upper device station 90a is installed on the upper surface of the upper stage 505a.
  • the upper device station 90a, the camera unit 40, among the upper center pin drive unit 507a and the upper UV irradiation unit 508a, the center position of the opening 100a of one of the units by the supplied unit designation signal US U from the controller 200 Move to.
  • the upper device station 90a moves the installation position of the unit selected above by the distance of the unit position adjustment signal UP U supplied from the controller 200.
  • FIG. 2A is a diagram illustrating a schematic configuration of the upper device station 90a viewed from the top surface
  • FIG. 2B is a diagram illustrating a schematic configuration of the upper device station 90a viewed from the side surface.
  • the upper device station 90a moves the slide table 901a and the slide table 901a on which the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a are installed.
  • a guide rail 902a As shown in FIG. 2A, the guide rail 902a includes two rails arranged in parallel with each other across the region of the opening 100a of the upper stage 505a.
  • the slide table 901a is provided with an opening at a position where each unit is to be arranged.
  • Slide table 901a in response to the supplied unit designation signal US U from the controller 200, only the specified unit (camera unit 40, the upper center pin drive unit 507a or the upper UV irradiation unit 508a) is in the center of the opening 100a It moves along the guide rail 902a so as to be arranged.
  • the upper device station 90a selectively uses one of the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a at the use position, that is, the center position of the substrate 6 arrangement position on the upper stage 505a. It is transferred to the upper part.
  • the use position refers to a position where the camera unit 40, the upper center pin drive unit 507a, and the upper UV irradiation unit 508a are used by performing their functions in the imprint process. Therefore, the use positions of the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a may be the same or different.
  • the camera unit 40 has cameras 40 1 , 40 2 and 40 3 for photographing the alignment marks formed on the molds (503a, 503b), and a camera 40 4 for photographing the tip of the lower center pin 30b. Is provided.
  • Each of the cameras 40 1 , 40 2, and 40 3 is installed with its photographing lens oriented perpendicularly to the surface of the upper mold holding unit 501a through the opening of the slide table 901a. Further, the camera 40 4, the photographing lens through the opening in the slide table 901a, are disposed in a state directed perpendicularly to the distal end portion of the lower center pin 30b.
  • Each of the cameras 40 1 , 40 2 , and 40 3 controls the imaging signals PD 1 , PD 2 , and PD 3 obtained by imaging the upper mold 503a and the lower mold 503b from the respective positions. 200.
  • the camera 40 4 supplies the controller 200 with a photographing signal PD 4 obtained by photographing the tip of the lower center pin 30b.
  • the upper UV irradiation unit 508a applies ultraviolet rays to cure the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200, the opening of the slide table 901a, the opening 100a of the upper stage 505a, and the upper mold holding unit 501a. Then, the light is irradiated toward the upper transfer layer 604a of the substrate 6.
  • Upper center pin drive unit 507a in accordance with the upper center pin movement signal CG U supplied from the controller 200, the upper center pin 30a, is moved to the upper or lower side in the direction of its central axis.
  • the upper center pin 30a supports the vicinity of the center hole of the substrate 6 through the center hole of the upper mold 503a by moving downward. Furthermore, the board
  • the upper center pin drive unit 507a may be provided with a mechanism for rotating the upper center pin 30a.
  • the lower mechanism part of the imprint apparatus includes a lower center pin 30b, a lower device station 90b, a lower mold XY stage 500b, a lower mold holding part 501b, a lower stage 505b, a lower center pin drive unit 507b, a lower part A side UV irradiation unit 508b, a stage vertical drive unit 511, and a ball screw 512 are provided.
  • the board-like lower stage 505b has a through hole through which the ball screw 512 passes, together with the opening 100b as shown in FIG.
  • One end of the ball screw 512 passes through the through hole of the lower stage 505b so that the lower stage 505b and the upper stage 505a are maintained in a parallel state, and the other end is threaded in the upper stage 505a. It is screwed into the part.
  • a lower mold XY stage 500b having an opening larger than the opening 100b is installed on the upper surface of the lower stage 505b.
  • a lower mold holding part 501b made of a transparent material is installed so as to cover the opening.
  • the lower mold XY stage 500b moves the lower mold holding portion 501b in each of two-dimensional directions with respect to the lower surface of the lower stage 505b in accordance with the lower XY stage movement signal XY L supplied from the controller 200.
  • the lower mold holding part 501b includes a mold holding surface (a surface with which the lower mold 503b is in contact in FIG. 1) for holding the lower mold 503b.
  • a through-hole for supporting the lower center pin 30b in a vertically movable state in a direction perpendicular to the mold holding surface of the lower mold holding portion 501b is formed at the center of the lower mold holding portion 501b. Is provided.
  • Lower mold holding portion 501b in accordance with the lower mold holding signal MH L supplied from the controller 200, for example, to hold the lower mold 503b to the mold holding surface by vacuum suction.
  • the method of holding the lower mold 503b on the mold holding surface is not limited to vacuum suction and may be held by a mechanical method.
  • the lower UV irradiation unit 508b transmits ultraviolet light to be cured on the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200 via the opening 100a and the upper mold holding unit 501b. Irradiation is performed toward the transfer layer 604b.
  • Lower center pin drive unit 507b in accordance with the lower center pin moving signal CG L supplied from the controller 200, a lower center pin 30b, a direction perpendicular to the mold holding surface of the lower mold holding portion 501b That is, the upper center pin 30b is moved upward or downward in the central axis direction.
  • the lower center pin drive unit 507b may be provided with a mechanism for rotating the lower center pin 30b.
  • a stage vertical drive unit 511 and a lower device station 90b are provided on the lower surface of the lower stage 505b.
  • the stage vertical drive unit 511 maintains the upper stage 505a parallel to the lower stage 505b by rotating the ball screw 512 clockwise or counterclockwise according to the stage drive signal SG supplied from the controller 200. Move it up or down. That is, the upward movement of the upper stage 505a causes the upper mold holding part 501a to move away from the lower mold holding part 501b in a direction perpendicular to the mold holding surface of the lower mold holding part 501b. . On the other hand, the upper mold holding part 501a moves toward the lower mold holding part 501b by the downward movement of the upper stage 505a.
  • Lower device station 90b is within the lower center pin drive unit 507b and the lower UV irradiation unit 508b, any one of the units by the supplied unit designation signal US L from the controller 200 to the center position of the opening 100b Move.
  • the lower device station 90b moves the installation position of the unit selected above by the distance of the unit position adjustment signal UP L supplied from the controller 200.
  • FIG. 3A is a diagram showing a schematic configuration of the lower device station 90b viewed from the top surface
  • FIG. 3B is a diagram showing a schematic configuration of the lower device station 90b viewed from the side surface.
  • the lower device station 90b moves the slide table 901b on which the lower center pin driving unit 507b and the lower UV irradiation unit 508b are installed, and the slide table 901b.
  • Guide rail 902b As shown in FIG. 3A, the guide rail 902b is composed of two rails arranged in parallel with each other across the region of the opening 100b of the lower stage 505b. Further, as shown in FIG. 3B, the slide table 901b is provided with an opening at a position where each unit is to be arranged.
  • Slide table 901b in response to the supplied units specified signal US L from the controller 200, located only specified unit (lower center pin drive unit 507b or the lower UV irradiation unit 508b) is in the center position of the opening 100b As shown, it moves along the guide rail 902b.
  • the lower device station 90b selectively uses one of the lower center pin drive unit 507b and the lower UV irradiation unit 508b at the use position, that is, the center position of the substrate 6 arrangement position on the lower stage 505b. It is transported.
  • the lower UV irradiation unit 508b generates ultraviolet rays for curing the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200, the opening of the slide table 901b, the opening 100b of the lower stage 505b, and the lower mold. Irradiation is performed toward the lower transfer layer 604b of the substrate 6 through the holding portion 501b.
  • Lower center pin drive unit 507b in accordance with the lower center pin moving signal CG L supplied from the controller 200, a lower center pin 30b, is moved to the upper or lower side in the direction of its central axis.
  • the lower center pin 30b is formed with a first support portion TB1 that supports the upper mold 503a or the lower mold 503b and a second support portion TB2 that supports the substrate 6, respectively.
  • the operation unit 201 accepts various operation commands instructed by the user to operate the imprint apparatus, and supplies an operation command signal indicating the operation command to the controller 200.
  • the controller 200 generates various control signals for controlling the imprint apparatus by executing a processing program corresponding to the operation indicated by the operation command signal supplied from the operation unit 201.
  • the controller 200 executes an imprint processing program.
  • the controller 200 first aligns each of the substrate 6, the upper mold 503a, and the lower mold 503b. (Hereinafter referred to as alignment).
  • the controller 200 first supplies a unit designation signal US U that specifies the camera unit 40 to the upper device station 90a.
  • the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to arrange the camera unit 40 at the center position of the opening 100a.
  • the controller 200 determines the relative positions of the substrate 6, the upper mold 503a, and the lower mold 503b based on the imaging signals PD 1 to PD 4 obtained by imaging with the cameras 40 1 to 40 4 of the camera unit 40. The relationship is detected, and the upper mold XY stage 500a and / or the lower mold XY stage 500b is controlled so that this becomes a predetermined relative positional relationship.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 so as to press the upper mold 503a and the lower mold 503b against the substrate 6.
  • a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 so as to press the upper mold 503a and the lower mold 503b against the substrate 6.
  • the upper transfer layer 604a and the lower transfer layer 604b are in a liquid state (flowable state)
  • the upper transfer layer 604a is deformed along the uneven pattern shape formed on the upper mold 503a
  • the lower transfer layer 604b is Each deforms along the uneven pattern shape formed in the lower mold 503b.
  • the controller 200 in order to cure the upper transfer layer 604a and a lower transfer layer 604b each substrate 6, firstly, to supply the unit designation signal US U that specifies the upper UV irradiation unit 508a on the upper device station 90a, supplying unit designation signal US L specifying the lower UV irradiation unit 508b to the lower device station 90b.
  • the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to place the upper UV irradiation unit 508a at the center position of the opening 100a instead of the camera unit 40.
  • the slide table 901b of the lower device station 90b moves along the guide rail 902b in order to place the lower UV irradiation unit 508b at the center position of the opening 100b instead of the lower center pin driving unit 507b.
  • the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays that should cure the transfer layer material
  • the lower UV irradiation unit 508b transfers lower ultraviolet rays that should cure the transfer layer material. Irradiation is performed toward the layer 604b. Thereby, the transfer layers of the upper transfer layer 604a and the lower transfer layer 604b are cured, and the uneven pattern on the surfaces of the upper transfer layer 604a and the lower transfer layer 604b is determined.
  • the controller 200 in order to release the substrate 6 from the upper mold 503a and the lower mold 503b, first, supplies the unit designation signal US U that specifies the upper center pin drive unit 507a to the upper device station 90a, supplying unit designation signal US L specifying the lower center pin drive unit 507b to the lower device station 90b.
  • the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to place the upper center pin driving unit 507a at the center position of the opening 100a instead of the upper UV irradiation unit 508a.
  • the slide table 901b of the lower device station 90b moves along the guide rail 902b so as to place the lower center pin driving unit 507b at the center of the opening 100b instead of the lower UV irradiation unit 508b.
  • the controller 200 the lower should supplies upper center pin moving signal CG U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a, move the lower center pin 30b upward supplying side center pin movement signal CG L below the center pin drive unit 507b.
  • the substrate 6 moves upward together with the lower center pin 30b, and the upper end portions of the upper center pin 30a and the lower center pin 30b are joined to each other.
  • the upper mold 503a is released from the upper transfer layer 604a of the substrate 6, and the substrate 6 is released from the lower mold 503b.
  • the imprint apparatus shown in FIG. 1 includes the above-described various mechanical components (501a, 501b, 505a, 505b, 511, 512) responsible for the operation for pressing the mold (503a, 503b) against the substrate 6.
  • various auxiliary devices for mounting the alignment, curing the transfer layer, and releasing the substrate / mold are mounted. That is, the camera unit 40 used for performing the alignment as described above, the upper center pin driving unit 507a used for releasing the mold (503a, 503b) from the substrate 6, and the upper transfer layer 604a are cured.
  • An upper UV irradiation unit 508a that emits power ultraviolet light is provided on the upper stage 505a.
  • a lower center pin driving unit 507b that drives the lower center pin 30b that supports the substrate 6 and the lower mold 503b, and a lower UV irradiation unit 508b that emits ultraviolet light to cure the lower transfer layer 604b.
  • the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a as the auxiliary devices as described above are placed on a slide table 901a that moves along the guide rail 902a as shown in FIGS. 2A and 2B. Each is arranged.
  • Slide table 901a the center of one unit (camera unit 40, the upper center pin drive unit 507a or the upper UV irradiation unit 508a) only the upper stage 505a opening 100a indicated by the supplied unit designation signal US U from the controller 200 It moves along the guide rail 902a so that it may be located in. Further, as shown in FIGS. 3A and 3B, the lower center pin drive unit 507b and the lower UV irradiation unit 508b as auxiliary devices are respectively arranged on a slide table 901b that moves along the guide rail 902b.
  • Slide table 901b in response to the supplied units specified signal US L from the controller 200, only one unit represented by the unit designation signal US L (lower center pin drive unit 507b or the lower UV irradiation unit 508b) is It moves along the guide rail 902b so as to be arranged at the center of the opening 100b.
  • the irradiation units (508a, 508b) that emit light for curing the transfer layer and various adjustment auxiliary devices (camera unit 40, upper center pin drive unit 507a, lower center pin drive unit 507b), respectively. It is possible to install one of the two at the optimum position (the center position of the openings 100a and 100b) during use.
  • the irradiation units (508a, 508b) can be moved to a position where the light for curing the transfer layer can be uniformly irradiated over the entire surface of the substrate 6. . Therefore, even if various auxiliary devices (40, 507a, 507b) are mounted on the stage (505a, 505b) together with the irradiation units (508a, 508b), the irradiation units (508a, 508b) are disposed on the entire surface of the substrate 6. It is possible to irradiate light for curing the transfer layer uniformly.
  • the camera unit 40, the upper UV irradiation unit 508a, and the upper center pin drive unit 507a are all installed on one slide table 901a.
  • Each unit (40, 507a, 508a) may be installed on the slide table.
  • 4A and 4B are diagrams showing another configuration of the upper device station 90a made in view of such points.
  • 4A is a diagram showing another configuration of the upper device station 90a viewed from the upper surface side
  • FIG. 4B is a diagram viewed from the side surface side.
  • the slide tables 901 1 and 901 3 have two guide rails 902 1 arranged in parallel with each other across the region of the opening 100a of the upper stage 505a (the region surrounded by the wavy line). Move individually along the line.
  • the slide table 901 2 is arranged in parallel with each other across the region of the opening 100a and moves along the two guide rails 902 2 orthogonal to the guide rail 902 1 .
  • the unit designation signal US U that specifies the upper center pin drive unit 507a from the controller 200 is supplied, only the slide table 901 2 of the slide table 901 1-901 3 along the guide rail 902 2 Then, the upper center pin drive unit 507a is disposed at the center of the opening 100a. Further, the unit designation signal US U that specifies the camera unit 40 from the controller 200 is supplied, only the slide table 901 one of the slide table 901 1-901 3 is moved along the guide rails 902 1, the camera unit 40 is arranged at the center of the opening 100a.
  • the unit designation signal US U for designating the upper UV irradiation unit 508a is supplied from the controller 200, only the slide table 901 3 among the slide tables 901 1 to 901 3 moves along the guide rail 902 1 , The upper UV irradiation unit 508a is disposed at the center of the opening 100a.
  • the imprint operation by the imprint apparatus shown in FIG. 1 can be applied to a manufacturing process of a magnetic recording medium such as a discrete track medium or a bit patterned medium.
  • a method of manufacturing a magnetic disk including the above-described imprint operation will be described with reference to FIG.
  • an upper mold 503a and a lower mold 503b having a desired concavo-convex pattern on the surface of a base material made of a material such as glass that transmits ultraviolet rays are prepared.
  • the concavo-convex pattern is formed by forming a resist pattern on a substrate using, for example, an electron beam drawing apparatus, and then performing a dry etching process or the like using the resist pattern as a mask.
  • the finished upper mold 503a and lower mold 503b are subjected to a surface treatment with a silane coupling agent or the like in order to improve releasability.
  • a substrate made of a material that transmits ultraviolet rays such as glass replicated by an imprint method or the like, may be used as a transfer mold using the upper mold 503a and the lower mold 503b as masters.
  • a substrate made of a material that transmits ultraviolet rays, such as glass duplicated by an imprint method or the like from the duplication disk produced by the above method may be used as a transfer mold. If a duplicate transfer mold is used, the master and / or the base material of the duplicate disk is, for example, ultraviolet rays such as nickel (including alloys) duplicated by a method such as silicon or electroforming. A material that does not transmit can be used.
  • a magnetic disk media substrate (hereinafter referred to as a media substrate) 600 is manufactured.
  • the media substrate 600 has, for example, an upper side on one side (upper side) and the other side (lower side) of a disc-shaped support substrate 601 made of specially processed chemically strengthened glass, silicon wafer, aluminum substrate, or the like.
  • a plurality of layers including the transfer layer 604a and the lower transfer layer 604b are laminated as follows. That is, as shown in FIG. 5A, on the upper surface of the support substrate 601, there is an upper nonmagnetic layer 602a made of a nonmagnetic material, an upper metal layer 603a made of a metal material such as Ta or Ti, and an upper transfer.
  • a layer 604a is stacked.
  • a lower nonmagnetic layer 602b made of a nonmagnetic material, a lower metal layer 603b made of a metal material such as Ta or Ti, and a lower transfer layer 604b are laminated on the lower surface of the support substrate 601.
  • the upper nonmagnetic layer 602a, the upper metal layer 603a, the lower nonmagnetic layer 602b, and the lower metal layer 603b are formed by a sputtering method or the like.
  • the concavo-convex pattern formed on the upper mold 503a and the lower mold 503b is transferred to the upper transfer layer 604a and the lower transfer layer 604b formed on the media substrate 600 by the imprint method described above. That is, the upper transfer layer 604a and the lower transfer layer 604b are formed on the media substrate 600 prepared in the above process by spin coating or the like, and the reference positions of the upper mold 503a and the lower mold 503b are aligned with the central axis of the center pin 30b.
  • the media substrate 600 is mounted on the center pin 30b, and the upper mold 503a is placed on the lower mold in the direction of the center axis of the center pin 30b with the reference position aligned with the center axis of the center pin 30b.
  • the upper mold 503 a is pressed against one surface of the media substrate 600 and the lower mold 503 b is pressed against the other surface of the media substrate 600.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the media substrate 600 with ultraviolet rays to cure the transfer layer
  • the lower UV irradiation unit 508b emits ultraviolet rays to cure the transfer layer.
  • the media substrate 600 is formed with a cross-sectional structure as shown in FIG.
  • etching is performed on both surfaces of the media substrate 600 having a structure as shown in FIG.
  • the etching process first, the remaining film of the upper transfer layer 604a remains in the portion corresponding to the convex portion of the upper mold 503a, and the residual film of the lower transfer layer 604b remains in the portion corresponding to the convex portion of the lower mold 503b.
  • the remaining film is removed by oxygen reactive ion etching (RIE) or the like.
  • RIE oxygen reactive ion etching
  • the upper metal layer 603a and the lower metal layer 603b are etched and patterned by dry etching using the upper transfer layer 604a and the lower transfer layer 604b patterned by the imprint process as a mask.
  • the recesses in the concavo-convex patterns of the upper resist layer 604a and the lower resist layer 604b and the recesses in the upper metal layer 603a and the lower metal layer 603b are formed. Corresponding portions are removed, and a pattern is formed on each of the upper metal layer 603a and the lower metal layer 603b (metal mask patterning step).
  • a transfer layer removal process is performed on both surfaces of the media substrate 600 in the state shown in FIG. 5B by a method such as wet etching or dry ashing. Then, the transfer layer remaining on each of the upper metal layer 603a and the lower metal layer 603b is removed (transfer layer removing process).
  • the non-magnetic material is etched and patterned by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask with respect to the media substrate 600 in a state as shown in FIG. Thereby, as shown in FIG. 5D, a pattern is formed on the nonmagnetic material by a predetermined depth with respect to the exposed regions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b (nonmagnetic). Layer patterning process).
  • the remaining upper metal layer 603a and lower metal layer 603b are removed from both surfaces of the media substrate 600 in a state as shown in FIG. 5D by a method such as a wet etching process or a dry etching process.
  • a method such as a wet etching process or a dry etching process.
  • FIG. 5E the metal layer remaining in each of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b is removed (metal mask removing process).
  • the concave portions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b are filled with a magnetic material (shown in black), and the upper protective layer 605a and the upper lubricating layer are further filled.
  • a layer 606a, a lower protective layer 605b, and a lower lubricating layer 606b are stacked as shown in FIG.
  • the imprint apparatus shown in FIG. 1 performs the processes shown in FIGS.
  • a double-sided magnetic disk having a cross-sectional structure as shown in F) is manufactured.
  • a method of manufacturing a magnetic disk from a media substrate 600 provided with an upper nonmagnetic layer 602a and a lower nonmagnetic layer 602b as shown in FIG. 5A a method of manufacturing a magnetic disk from a media substrate 600 provided with an upper nonmagnetic layer 602a and a lower nonmagnetic layer 602b as shown in FIG. 5A.
  • the magnetic disk may be manufactured from the media substrate 600 employing the upper magnetic layer and the lower magnetic layer made of a magnetic material instead of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b.
  • the magnetic material is etched by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask with respect to the media substrate 600 in the state as shown in FIG.
  • a pattern is formed on the magnetic material by a predetermined depth for each exposed region of the side nonmagnetic layer (magnetic layer patterning step). Then, the magnetic disk is obtained by filling the concave portions of the upper magnetic layer and the lower magnetic layer with a nonmagnetic material.
  • the UV imprint method and the imprint apparatus are described.
  • the present invention is not limited to this, and thermal imprint, light energy (light other than UV) curing imprint, etc.
  • the present invention can be applied to other types of imprint apparatuses.

Landscapes

  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention porte sur un dispositif de transfert qui comporte un moyen d'entraînement de mécanisme de support pour déplacer un mécanisme de support pour supporter un corps transféré et un moyen d'irradiation pour irradier un faisceau d'énergie vers la surface du corps transféré. Dans le dispositif, l'un du moyen d'irradiation de lumière ou du moyen d'entraînement du mécanisme de support est rendu mobile vers une position d'utilisation selon la progression d'un processus de transfert de motif.
PCT/JP2009/050315 2009-01-13 2009-01-13 Dispositif de transfert WO2010082300A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2009/050315 WO2010082300A1 (fr) 2009-01-13 2009-01-13 Dispositif de transfert
JP2010546485A JPWO2010082300A1 (ja) 2009-01-13 2009-01-13 転写装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/050315 WO2010082300A1 (fr) 2009-01-13 2009-01-13 Dispositif de transfert

Publications (1)

Publication Number Publication Date
WO2010082300A1 true WO2010082300A1 (fr) 2010-07-22

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ID=42339569

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Application Number Title Priority Date Filing Date
PCT/JP2009/050315 WO2010082300A1 (fr) 2009-01-13 2009-01-13 Dispositif de transfert

Country Status (2)

Country Link
JP (1) JPWO2010082300A1 (fr)
WO (1) WO2010082300A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006188054A (ja) * 2002-08-29 2006-07-20 Toppan Printing Co Ltd パターン形成装置
JP2007182063A (ja) * 2005-11-04 2007-07-19 Asml Netherlands Bv インプリントリソグラフィ
JP2007281072A (ja) * 2006-04-04 2007-10-25 Canon Inc ナノインプリント方法及びナノインプリント装置
JP2008244441A (ja) * 2007-02-06 2008-10-09 Canon Inc インプリント方法及びインプリント装置、インプリント方法を用いた部材の製造方法
JP2009060091A (ja) * 2007-08-29 2009-03-19 Samsung Electronics Co Ltd 両面インプリントリソグラフィ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006188054A (ja) * 2002-08-29 2006-07-20 Toppan Printing Co Ltd パターン形成装置
JP2007182063A (ja) * 2005-11-04 2007-07-19 Asml Netherlands Bv インプリントリソグラフィ
JP2007281072A (ja) * 2006-04-04 2007-10-25 Canon Inc ナノインプリント方法及びナノインプリント装置
JP2008244441A (ja) * 2007-02-06 2008-10-09 Canon Inc インプリント方法及びインプリント装置、インプリント方法を用いた部材の製造方法
JP2009060091A (ja) * 2007-08-29 2009-03-19 Samsung Electronics Co Ltd 両面インプリントリソグラフィ装置

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