WO2010078691A1 - 能量转换装置及能量转换设备 - Google Patents

能量转换装置及能量转换设备 Download PDF

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Publication number
WO2010078691A1
WO2010078691A1 PCT/CN2009/000017 CN2009000017W WO2010078691A1 WO 2010078691 A1 WO2010078691 A1 WO 2010078691A1 CN 2009000017 W CN2009000017 W CN 2009000017W WO 2010078691 A1 WO2010078691 A1 WO 2010078691A1
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WO
WIPO (PCT)
Prior art keywords
energy conversion
conversion device
heat dissipating
semiconductor structure
dissipating member
Prior art date
Application number
PCT/CN2009/000017
Other languages
English (en)
French (fr)
Inventor
陈振贤
林俊仁
Original Assignee
Chen Jen-Shyan
Lin Chung-Zen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Jen-Shyan, Lin Chung-Zen filed Critical Chen Jen-Shyan
Priority to US12/518,165 priority Critical patent/US20100294465A1/en
Priority to EA200970511A priority patent/EA200970511A1/ru
Priority to JP2010545347A priority patent/JP2011509533A/ja
Priority to EP09744589A priority patent/EP2387070A1/en
Priority to PCT/CN2009/000017 priority patent/WO2010078691A1/zh
Priority to AU2009225293A priority patent/AU2009225293B2/en
Priority to CA2672629A priority patent/CA2672629A1/en
Publication of WO2010078691A1 publication Critical patent/WO2010078691A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

Definitions

  • the present invention relates to a light source measuring method and a light source measuring system, and more particularly to a light source measuring method and a light source measuring system using a look-up table constructed based on an optical spectrum model.
  • the invention discloses an energy conversion device, which can effectively dissipate the heat generated by the energy conversion member during operation, avoiding the energy conversion member from being subjected to thermal shock and maintaining a relatively high photoelectric conversion efficiency and prolonging the service life.
  • the energy conversion device of the present invention comprises a heat pipe, a first heat dissipating member, a second heat dissipating member, and an energy conversion member.
  • the heat pipe includes a contact portion and a flat portion. The contact portion extends in one direction.
  • the first heat dissipating member includes a plurality of fins that are approximately parallel to the direction.
  • the second heat dissipating member is connected to the first heat dissipating member to form an accommodating space.
  • the contact portion is received in the accommodating space and simultaneously contacts the first heat dissipating member and the second heat dissipating member.
  • the energy conversion member for example, comprising a solar cell or a light emitting diode, is in contact with the flat portion.
  • the first heat dissipating member includes a first half groove along the direction
  • the second heat dissipating member includes a second half groove along the direction, the first half groove and the second half groove forming the capacity Set the space.
  • the heat generated by the energy conversion member during operation will be conducted into the heat conduit via the flat portion in contact therewith.
  • the conducted heat is transferred in the heat pipe and conducted to the first heat radiating member and the second heat radiating member via the contact portion.
  • the heat is dissipated through the first heat dissipating member and the second heat dissipating member.
  • the plurality of fins of the first heat dissipating member contribute to heat dissipation, and the heat dissipation efficiency of the first heat dissipating member is raised.
  • the second heat dissipating member includes a circuit accommodating space for accommodating a control module circuit for controlling the energy conversion member, which facilitates modularization of the energy conversion device of the present invention.
  • the plurality of fins disposed in parallel with the direction can reduce the situation in which heat dissipation is affected by the set angle of the energy conversion device.
  • the energy conversion device of the present invention comprises a frame and a plurality of energy conversion devices.
  • the frame includes a panel that includes a plurality of through holes.
  • the plurality of energy conversion devices are disposed on the frame corresponding to the plurality of through holes.
  • the energy conversion device further includes a control module circuit disposed on the frame and electrically connected to the plurality of energy conversion devices.
  • the energy conversion device is connected and fixed by a frame, and is controlled by a single control module circuit to realize the benefits of the cluster. Further, the energy conversion device of different energy conversion modes can be appropriately configured at the same time to form self-sufficiency. Charging / lighting system.
  • the energy conversion device has a combined heat dissipation structure to facilitate assembly of the heat pipe, and further reduce contact thermal resistance and increase thermal conductivity.
  • FIG. 1 is a schematic diagram of an energy conversion device in accordance with a first preferred embodiment.
  • Fig. 3A is a schematic view of the first heat radiating member.
  • Fig. 3B is a schematic view of the tubular body of the second heat dissipating member.
  • 4A is a schematic view showing the structure of an optical modulation member that is rotationally fixed to a stage via a threaded structure.
  • 4B is a schematic view showing the structure of the optical modulation member holding the carrier via a hook structure.
  • Fig. 4C is a schematic view showing the engagement of the hook of the optical modulation member with the card slot of the stage.
  • Figure 5 is a schematic view showing the structure of the stage being rotationally fixed to the heat pipe via a threaded structure.
  • Fig. 6A is a plan view of an energy conversion member and a stage of the energy conversion device.
  • Figure 6B is a cross-sectional view of the energy conversion member, the stage, and a portion of the heat pipe taken along line Z-Z of Figure 6A.
  • 7 is a cross-sectional view of an energy conversion member, a stage, and a portion of a heat pipe, in accordance with an embodiment.
  • Figure 8 is a cross-sectional view of an energy conversion member, a stage, and a portion of a heat pipe in accordance with another embodiment.
  • Figure 9 is a cross-sectional view of an energy conversion member, a stage, and a portion of a heat pipe in accordance with another embodiment.
  • Figure 10 is a cross-sectional view of an energy conversion member, a stage, and a portion of a heat pipe in accordance with another embodiment.
  • Figure 11 is a schematic illustration of an energy conversion device in accordance with a second preferred embodiment.
  • Fig. 12A is a schematic view of the first heat radiating member.
  • Fig. 12B is a schematic view of the second heat radiating member.
  • Figure 13A is a schematic illustration of an energy conversion device in accordance with a third preferred embodiment.
  • Figure 13B is a partial cross-sectional view of the energy conversion device.
  • first heat dissipation member 14 second heat dissipation member
  • Lens 192 Metal wire
  • Lens structure 226 Fixed ring
  • Figure 1 is a schematic illustration of an energy conversion device 1 in accordance with a first preferred embodiment.
  • 2 is a cross-sectional view of the energy conversion device 1 in which the profile is symmetric throughout the entire energy transfer The apparatus 1 is changed, the viewing angle of FIG. 2 is the direction X shown in FIG. 1, and for the simplified view, the control module circuit 24 and the connector 26 are not sectioned, and the cross section of the energy conversion member 18 has been simplified.
  • the energy conversion device 1 of the present invention comprises a first heat dissipation member 12, a second heat dissipation member 14, a heat pipe 16, a energy conversion member 18, a stage 20, and an optical modulation member. 22.
  • the first heat radiating member 12 includes a plate-like body 122 and fins 124 extending from the plate-like body 122.
  • the second heat radiating member M includes a tubular body 142, a front cover 144, and a rear cover 146. The front cover 144 and the rear cover 146 respectively engage the two open ends of the tubular body 142 to form an accommodating space S2.
  • the accommodating space S2 is for accommodating the control module circuit 24 and a portion of the connector 26, wherein the control module circuit 24 is disposed on the protrusion 142a of the tubular body 142 (refer to FIG. 3B). Further, if the protruding portion 142a is formed into a chute structure, the function of the fixed control module circuit 24 can be exerted.
  • the first heat dissipation member 12 is coupled to the second heat dissipation member 14 and forms an accommodation space Sl.
  • the accommodating space S 1 is slightly straight and is for accommodating the heat pipe 16.
  • the heat pipe 16 has a contact portion 162 and a flat portion 164.
  • the contact portion 162 is located in the accommodating space S1 and is in contact with the first heat radiating member 12 and the second heat radiating member 14 at the same time. It is additionally noted that the heat pipe 16 can also be replaced by other materials having a high thermal conductivity.
  • the stage 20 is fixed to one end of the heat pipe 16, and is substantially flush with the flat portion 164 of the heat pipe 16, but the invention is not limited thereto.
  • the energy conversion member 18 is fixed to the stage 20 and is in contact with the flat portion 164 such that heat generated by the energy conversion member 18 during operation can be conducted into the heat pipe 16 via the flat portion 164 and then through the contact portion of the heat pipe 16 162 is conducted to the first heat dissipating member 12 (and its fins 124) and the second heat dissipating member 14, and is dissipated.
  • the optical modulation member 22 includes an annular body 222, a lens structure 224, and a stationary ring 226.
  • the annular body 222 is coupled to the stage 20, and the lens structure 224 is disposed adjacent to the energy conversion member 18 and is secured to the annular body 222 by a retaining ring 226.
  • control module circuit 24 includes a circuit board and associated electronic components.
  • the control module circuit 24 is electrically connected to the energy conversion member 18 via an electric wire L1 (shown in bold in FIG. 2) electrically connected to the connector 24a.
  • the stage 20 is also formed with a through hole 202 for the passage of the electric wire.
  • the control module circuit 24 is further electrically connected to the connector 26 (e.g., the terminal block) via an electric wire L2 (shown in bold in FIG. 2) electrically connected to the connector 24b.
  • the connector 26 is further connected to the power source via the wire 26a to obtain the control module circuit 24 to control the energy transfer.
  • the electrical energy required to operate the replacement component 18, for example, the energy conversion mode is the conversion of electrical energy into light energy (eg, energy conversion of the light emitting diode); or the connector 26 provides external electrical energy via the electrical line 26a, for example, the energy conversion mode is photoelectric Converted into electrical energy (such as energy conversion of solar cells).
  • Fig. 3A is a schematic view of the first heat radiating member 12, in which the first heat radiating member 12 has been turned over with respect to the energy converting device 1 shown in Fig. 1 to facilitate the subsequent explanation.
  • 3B is a schematic view of the tubular body 142 of the second heat dissipating member 14.
  • the plate-shaped body 122 of the first heat dissipation member 12 includes a first half groove 122b which is semicircular and extends in the direction Y.
  • the tubular body 142 of the second heat dissipation member 12 A second half recess 142b is included, which is also semi-circular and extends in the direction Y.
  • the heat pipe 16 may be first placed into the first half recess 122b or the second half recess 142b, and then passed through the through hole 122a and screwed into the screw hole 142c to insert the plate body 122 and the tubular shape.
  • the body 142 is fixed to the abutment of the first heat dissipating member 12 and the second heat dissipating member 14 , and the heat pipe 16 is also accommodated in the accommodating space S1 formed by the first and second recesses 122 b and 142 b .
  • the present invention is not limited thereto, and for example, it may be fixed by welding or a C-shaped snap.
  • the contact portion 162 of the heat pipe 16 is closely adhered to the first heat radiating member 12 and the second heat radiating member 14 by being pressed.
  • the pressurized engagement mode causes a slight deformation of the heat pipe 16, and in addition to strengthening the connection strength between the heat pipe 14 and the first heat dissipation member 12 and the second heat dissipation member 14, the contact portion 162 and the first half groove 122b may be added. And the contact area of the second half groove 142b, thereby increasing the heat transfer efficiency.
  • first half groove 122b and the second half groove 142b are not limited to the volume occupying the accommodating space S1; in other words, the first half groove 122b also occupies the accommodating space S1. Most of the volume.
  • the second half groove 142b may have a substantially planar shape (or the second heat dissipating member 12 has no obvious second half groove 142b).
  • the accommodation space SI can still be formed with the first half groove 122b. Therefore, it is only necessary to form the accommodating space S1 after the first heat dissipating member 12 and the second heat dissipating member 14 are engaged.
  • the present invention does not require the geometric structure of the first heat dissipating member 12 and the second heat dissipating member 14 to have irregularities.
  • the direction Y is a linear direction
  • the present invention is not limited thereto, and the curve may also be used.
  • the plane in which the first heat dissipation member 12 and the second heat dissipation member 14 are joined is logically the division surface of the accommodation space S1 to be divided into the first half groove 122b and the second half groove 142b. In principle, if the accommodating space S1 extends along a curve, the curve is located on the dividing surface.
  • the fins 124 are disposed parallel to the direction Y, so that when the energy conversion device 1 is vertically disposed or horizontally disposed (or the heat conduit 16 is vertically or horizontally disposed), it flows through the fins 124. The airflow between the two can still be kept smooth.
  • the arrangement of the fins 124 parallel to the direction Y also includes the case where each of the fins 124 is still parallel to the direction Y but in a radial arrangement.
  • Fig. 4A is a schematic view showing the structure in which the optical modulation member 22 is rotationally fixed to the stage 20 via a threaded structure.
  • Fig. 4B is a schematic view showing the structure of the optical modulation member 22 for holding the stage 20 via a hook structure.
  • the threaded structure is formed by forming an internal thread 228 on the annular body 222 and forming an external thread 204 on the side of the stage 20.
  • the annular body 222 of the optical modulation member 22 can be screwed onto the stage 20. It is added that the wall thickness of the stage 20 at the threaded structure is slightly different from that shown in Fig. 2, which is adjusted by the different connection structures.
  • the hook structure can be composed of a hook 230 formed on the annular body 222 alone.
  • the optical modulation member 22 can be attached to the stage 20 by the chuck 230 holding the stage 20. If the loading table 20 correspondingly forms the card slot 206, the hook structure is composed of the hook 230 and the card slot 204.
  • the card slot 206 has a limit function for the hook 230, as shown in Fig. 4C.
  • the card slot 206 has the function of securing the hook 230 by designing an appropriate card slot 206 size.
  • Fig. 5 is a schematic view showing the structure of the stage 20 which is rotationally fixed to the heat pipe 16 via a threaded structure.
  • the threaded structure is formed by forming an inner thread 208 in the through hole of the stage 20 and forming an external thread 166 in the heat pipe 16. Thereby, the stage 20 can be screwed onto one end of the heat pipe 16.
  • the external thread 166 of the heat pipe 16 can be Directly tapping with a conventional tapping knife; when the wall thickness of the heat pipe 16 is insufficient to withstand the cutting force, or the remaining wall thickness after cutting is insufficient to withstand the locking of the stage 20, the external thread 166 can be rolled Rolling is formed in such a manner that the external thread 166 can be formed without excessively changing the wall thickness, and has a work hardening effect, thereby reinforcing the strength of the external thread 166. It is also worth mentioning that the energy conversion members 18 of Figures 4A through 4C and Figure 5 are shown schematically, and the actual details of the energy conversion member 18 are not shown.
  • Fig. 6A is a plan view of the energy conversion member 18 and the stage 20 of the energy conversion device 1.
  • Figure 6B is a cross-sectional view of the energy conversion member 18, the stage 20 and a portion of the heat pipe 16 taken along line Z-Z of Figure 6A.
  • the energy conversion member 18 includes an energy conversion semiconductor structure 182, a substrate 184, and a pedestal 186.
  • the energy conversion semiconductor structure 182 is located on the substrate 184.
  • the pedestal 186 includes a first recessed portion 186a and a second recessed portion 186b that communicates with the first recessed portion 186a.
  • the substrate 184 contacts the flat portion 164 and is connected to the second recessed portion 186b, and the energy conversion semiconductor structure 182 is exposed to the first recessed portion. Part 186a.
  • the energy conversion semiconductor structure 182 is a separate chip that is then die bonded to the substrate 184.
  • the energy conversion semiconductor structure 182 is also connected to the internal electrode of the pedestal 186 by a metal wire 192, and electrically connected to the control module ⁇ 24 through the electric wire L1 soldered to the external electrode 186c connected to the internal electrode on the pedestal 186 ( See also Figure 2).
  • the energy conversion semiconductor structure 182 and the metal lines 192 are fixed or sealed by the encapsulation material 188 on the substrate 184.
  • the base 186 is then locked to the stage 20 via a through hole 186d.
  • the encapsulating material 188 also has an optical modulation function. For example, when the outline of the encapsulating material 188 is formed into a protruding shape as shown in FIG. 6B, the encapsulating material 188 has a collecting effect.
  • the energy conversion member 18 further includes a lens 190 disposed on the base 186.
  • This lens 190 also has the effect of collecting light, but the invention is not limited thereto.
  • the effect of converging or diverging light can be exhibited by appropriately designing the curvature of the sides of the lens 190 to meet the needs of different optical modulations.
  • the optical modulation effect of the energy conversion device 1 requires consideration of the optical characteristics of the lens structure 224 of the optical modulation member 22.
  • the lens structure 224 of the optical modulation member 22 of the present invention is not limited to a general convex lens. Referring to Figure 4A, the lens structure 224 has a depression in the middle so that the lens structure 224 is generally focused in a ring shape.
  • the pedestal 186 can be fabricated by embedding a lead frame of a metal material into a mold and then injecting liquid crystal plastic (LCP), so that the lead frame is exposed in the first recess 186a. Electrode and exposed external electrode on the pedestal 186 186c. In addition, the energy conversion semiconductor structure 182 is also pulled in series, as shown by the dashed line in FIG. 6B. At this time, the energy conversion semiconductor structure 182 in FIG. 6B retains only one metal line 192 electrically connected to the susceptor 186.
  • LCP liquid crystal plastic
  • the energy conversion semiconductor structure 182 may be first drawn onto the substrate 184 and electrically connected to the pedestal 186 through the substrate 184. . If the substrate 184 is not designed to be electrically connected, the substrate 184 may be made of metal or other high thermal conductivity material to increase the heat transfer efficiency of the heat generated by the energy conversion semiconductor structure 182 to the flat portion 164.
  • Figure 7 is a cross-sectional view of the energy conversion member 18, the stage 20, and a portion of the heat pipe 16 in accordance with an embodiment.
  • the substrate 184 of FIG. 7 is completely accommodated in the second recess 186b, so that the bottom surface 186e of the base 186 slightly protrudes from the bottom surface 184a of the substrate 184 (to be in contact with the flat portion 164).
  • the flat portion 164 protrudes from the stage 20.
  • the flat portion 164 protrudes slightly above the recessed depth of the bottom surface 184a of the substrate 184 to ensure that the substrate 184 abuts the flat portion 164.
  • the flat portion 164 can only protrude slightly from the stage 20, and the bottom surface 186e of the base 186 is substantially coplanar with the bottom surface 184a of the substrate 184, as well as the above-described ensuring adhesion.
  • the thermal conductive adhesive may be applied to the bottom surface or the flat portion 164 of the pedestal 186 in advance so that the thermal conductive adhesive can fill the gap.
  • the thermal conductive adhesive may be applied to the bottom surface 186e or the flat portion 164 of the base 186 in advance to fill the gap formed by the surface roughness of the bottom surface 186e or the flat portion 164.
  • Figure 8 is a cross-sectional view of an energy conversion member 18, a stage 20, and a portion of a heat pipe 16 in accordance with another embodiment.
  • the energy conversion semiconductor structure 182 of Fig. 8 is formed directly on the substrate 184, for example, the substrate 184 itself is a semiconductor substrate (e.g., a silicon substrate). Therefore, the energy conversion semiconductor structure 182 can be integrally formed on the substrate 184 in an integrated semiconductor process.
  • the electrodes of the energy conversion semiconductor structure 182 formed directly on the semiconductor substrate 184 can be integrated on the substrate 184 in advance, so that the entire energy conversion member 18 requires only two wire drawing operations, which greatly improves the stability of the process.
  • FIG. 6B and FIG. 9. 9 is a cross-sectional view of an energy conversion member 18, a stage 20, and a portion of a heat pipe 16 in accordance with another embodiment.
  • the energy conversion semiconductor structure 182 of FIG. 9 is not disposed on the substrate 184 of FIG. 6B, but is directly disposed on the base 186' having a recess 186f.
  • the base 186' can also be directly a flat plate.
  • the energy conversion semiconductor structure 182 is disposed directly thereon.
  • Other descriptions of the energy conversion member 18 of Fig. 6B are also applicable herein and will not be described again.
  • Figure 10 is a cross-sectional view of an energy conversion member 18, a stage 20, and a portion of a heat pipe 16 in accordance with another embodiment.
  • the difference from FIG. 6B is that the energy conversion semiconductor structure 182 of FIG. 10 is formed directly on the pedestal 186'.
  • the base 186' can also be a flat plate.
  • the foregoing description of the energy conversion member 18 of Fig. 8 is also applicable here and will not be described again.
  • the energy conversion device 1 of the present invention when the energy conversion semiconductor structure 182 is a light emitting diode semiconductor structure, the energy conversion device 1 of the present invention can be used as an illumination device; when the energy conversion semiconductor structure 182 is a solar cell semiconductor structure, The energy conversion device 1 of the present invention can be used as a solar cell.
  • the energy conversion member 18 can include both a light emitting diode semiconductor structure and a solar cell semiconductor structure, and the control circuit 24 can contain a sufficient amount of capacitance to store electrical energy.
  • the energy conversion device 1 of the present invention can charge the capacitor during the day using the solar cell semiconductor structure, and the electrical energy stored by the capacitor can cause the light emitting diode semiconductor structure to emit light at night.
  • FIG. 11 is a schematic illustration of an energy conversion device 3 in accordance with a second preferred embodiment.
  • the difference from the energy conversion device 1 shown in FIG. 1 is that the second heat dissipation member 14 of the energy conversion device 3 is symmetrical with the first heat dissipation member 12, and also includes a plate-shaped body 142' and fins extending from the plate-like body 142'. Slice 148.
  • the second heat dissipating member 14 of the energy conversion device 3 itself does not include the accommodating space S2 (as shown in FIG. 2) that can accommodate the control module circuit 24, the energy conversion device 3 does not include the control module circuit 24 in principle.
  • Connector 26 since the second heat dissipating member 14 of the energy conversion device 3 itself does not include the accommodating space S2 (as shown in FIG. 2) that can accommodate the control module circuit 24, the energy conversion device 3 does not include the control module circuit 24 in principle.
  • Connector 26 since the second heat dissipating member 14 of the energy conversion device 3 itself does not include the accommodating space
  • the energy conversion device 3 can connect an electrical box to the end of the first heat dissipating member 12 and the second heat dissipating member 14 (relative to the front end of the optical modulation member 22) to accommodate the control module circuit 24 and the connector 26.
  • FIG. 12A and FIG. 12B are schematic views of the first heat dissipation member 12 and the second heat dissipation member 14, respectively.
  • the second heat dissipating member 14 does not include the accommodating space S2 of the energy conversion device 1
  • the first heat dissipating member 12 and the second heat dissipating member 14 of the energy conversion device 3 respectively include the half channels 122c, 142d to the first heat dissipating member 12
  • a through passage can be formed for the electric wires electrically connected to the energy conversion member 18 to pass.
  • FIG. 13A is a schematic illustration of an energy conversion device 5 in accordance with a third preferred embodiment.
  • FIG. 13B is a partial cross-sectional view of the energy conversion device 5 showing only the relative structure of the energy conversion device 3 and the panel 54.
  • the energy conversion device 5 includes a frame 52 and a plurality of the aforementioned energy conversion devices 3, and the plurality of energy conversion devices 3 are fixed to the frame 52. In other words, the energy conversion device 5 is a group of energy conversion devices.
  • the frame 52 includes a panel 54.
  • the panel 54 includes a plurality of through holes 542 corresponding to the plurality of energy conversion devices 3.
  • the external threads 204 on the sides of the stage 20 of each of the energy conversion devices 3 are exposed to the corresponding through holes 542, whereby the internal threads 228 of the optical modulation member 22 of each energy conversion device 3 can be externally and externally threaded from the panel 54. 204 lock.
  • the energy conversion device 5 further includes a control module circuit 56 that is fixed to the frame 52 and electrically connected to the plurality of energy conversion devices 3 via wires 32. Therefore, the plurality of energy conversion devices 3 need only share the same control module circuit 56.
  • the control module circuit 56 is then connected via an electrical line 58 to an external power source to obtain the required electrical energy, or as a medium for externally providing power. Further, the frame 52 can be fixed to the other fixed objects by the fixing portion 60.
  • the energy conversion device 5 already includes the control module circuit 56, its architecture is still applicable to the energy conversion device 1 (see FIG. 1), and since the energy conversion device 1 already has its own control module circuit 24, The control function of the control module circuit 56 can be simplified.
  • the energy conversion device 5 is not limited to the energy conversion device 3 including the same type, that is, the energy conversion device 5 may include a plurality of energy conversion devices 3 (for example, including a light emitting diode semiconductor structure) and a plurality of electrical energy.
  • the light-converting energy conversion device 3 (for example, including a solar cell semiconductor structure) is disposed on average, taking into account the benefits of illuminating illumination and light absorbing and storing energy, and further becomes a self-sufficient charging/illuminating system.
  • the wires 58 can in principle be omitted.
  • the energy conversion device of the present invention has a combined heat dissipation structure, which is advantageous for assembly of the heat pipe, and further reduces contact thermal resistance and improves thermal conductivity.
  • the fins of the energy conversion device of the present invention can be disposed parallel to the heat pipe, reducing the situation in which the airflow through the fins is not smooth due to the installation angle of the energy conversion device.
  • a plurality of energy conversion devices are connected through a frame, and a single control module circuit is synchronously controlled to exert the benefits of the cluster; further, the energy conversion devices of different energy conversion modes are appropriately configured at the same time to form a self-sufficient charging. /Lighting system.

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Description

能量转换装置及能量转换设备
技术领域
本发明涉及一种光源量测方法及光源量测系统， 并且特别涉及一种利用 基于一光学频谱模型建构的对照表的光源量测方法及光源量测系统。
背景技术
随着石油能源日渐耗竭， 对各种替代能源的需求急速成长， 在同时顾及 对生态环境的冲击， 以太阳能、 风力、 水力为发展主轴， 其中又以太阳能最 为持续且丰沛不绝。 然而在太阳能转换的过程中， 并非所有的入射光谱都能 被太阳能电池所吸收， 并完全转成电流。 有一半左右的光谱因能量太低 (小于 半导体的能隙)， 对电池的输出没有贡献， 而再另一半被吸收的光子中， 除了 产生电子电洞对所需的能量外， 约有一半左右的能量以热的形式释放掉。 释 放的热能将影响着太阳能电池， 而过高的工作温度将使太阳能电池的光电转 换效率下降， 如此将恶性循环， 使得有更多的输入的太阳能以热的形式消耗, 再进一步恶化太阳能电池的光电转换效率。
另一方面， 能源的使用也逐渐朝向节能方向发展。 随着半导体发光元件 的发展， 发光二极管已成为一种新兴的光源， 具有省电、 耐震、 反应快、 适 合量产等等许多优点。 因此， 以发光二极管做为指示器已属常见， 并且以发 光二极管做为光源的照明产品， 亦已渐成趋势。 然而， 为提供足够的照明， 以发光二极管做为光源的照明装置多使用高功率的发光二极管， 但却也带来 散热的问题。 发光二极管于运行中产生的热若未能及时散逸出去， 将使发光 二极管受到热冲击， 进而影响发光效率并减少使用寿命， 反而有违节能发展 方向。
因此， 现有技术并无法有效将对于光能与电能之间的转换而产生的热散 逸出去， 使得光电转换效率无法提升或维持， 甚至对太阳能电池或发光二极 管造成损耗。 发明内容 本发明披露一种能量转换装置， 可将能量转换构件于运行中产生的热有 效散逸出去， 避免能量转换构件遭受热冲击而能维持相当的光电转换效率， 延长使用寿命。
根据一具体实施例， 本发明的能量转换装置包含一热导管、 一第一散热 构件、 一第二散热构件及一能量转换构件。 该热导管包含一接触部及一平坦 部。 该接触部沿一方向延伸。 该第一散热构件包含多个鳍片， 所述多个鳍片 近似平行于该方向。该第二散热构件与该第一散热构件连接形成一容置空间。 该接触部容置于该容置空间中并同时与该第一散热构件及该第二散热构件接 触。该能量转换构件， 例如包含太阳能电池或发光二极管， 与该平坦部接触。 其中， 该第一散热构件沿该方向包含一第一半凹槽， 该第二散热构件沿该方 向包含一第二半凹槽， 该第一半凹槽及该第二半凹槽形成该容置空间。
该能量转换构件于运行中产生的热将可经由与其接触的该平坦部传导至 该热导管中。 该传导进来的热在该热导管中传递， 并经由该接触部传导至该 第一散热构件及该第二散热构件。 以此， 该热即经由该第一散热构件及该第 二散热构件散逸出去。 其中， 该第一散热构件的该多个鳍片有助于散热， 提. 升该第一散热构件的散热效率。
此外， 该第二散热构件包含一电路容置空间， 可用以容置控制该能量转 换构件的一控制模块电路， 有利于本发明的能量转换装置的模块化。 平行该 方向设置的该多个鳍片可减少因该能量转换装置的设置角度而影响散热的情 形。
根据另一具体实施例， 本发明的能量转换设备包含一框架及多个能量转 换装置。 于此具体实施例中， 该框架包含一面板， 该面板包含多个通孔。 该 多个能量转换装置对应该多个通孔设置于该框架上。 该能量转换设备进一步 包含控制模块电路， 设置于该框架上并与所述多个能量转换装置电性连接。 该能量转换设备通过框架衔接、 固定多个能量转换装置， 并得以单一控制模 块电路同步控制， 以发挥群集的效益； 进一步地， 适当地同时配置不同能量 转换模式的能量转换装置， 可形成自给自足的充电 /发光系统。
本发明的有益技术效果在于， 该能量转换装置具有组合式的散热结构有 利于热导管的组装， 并进一步降低接触热阻、 提升导热率。
关于本发明的优点与精神可以通过以下的发明详述及附图得到进一步的 了解 附图说明
图 1为根据第一较佳具体实施例的能量转换装置的示意图。
图 2为能量转换装置 1的剖面图。
图 3A为第一散热构件的示意图。
图 3B为第二散热构件的管状本体的示意图。
图 4A为光学调制构件经由一螺紋结构以旋转固定于载台的结构示意图。 图 4B为光学调制构件经由一卡勾结构以卡持载台的结构示意图。
图 4C为光学调制构件的卡勾与载台的卡槽衔接的示意图。
图 5为载台经由一螺紋结构以旋转固定于热导管的结构示意图。
图 6A为能量转换装置的能量转换构件及载台的俯视图。
图 6B为能量转换构件、 载台及部分热导管沿图 6A中线 Z-Z的剖面图。 图 7为根据一具体实施例的能量转换构件、载台及部分热导管的剖面图。 图 8为根据另一具体实施例的能量转换构件、 载台及部分热导管的剖面 图。
图 9为根据另一具体实施例的能量转换构件、 载台及部分热导管的剖面 图。
图 10为根据另一具体实施例的能量转换构件、载台及部分热导管的剖面 图。
图 1 1为根据第二较佳具体实施例的能量转换装置的示意图。
图 12A为第一散热构件的示意图。
图 12B为第二散热构件的示意图。
图 13A为根据第三较佳具体实施例的能量转换设备的示意图。
图 13B为能量转换设备的局部剖视图。
其中， 附图标记说明如下：
3： 能量转换装置 5: 能量转换设备
12： 第一散热构件 14: 第二散热构件
16： 热导管 18: 能量转换构件
20： 载台 22: 光学调制构件 24： 控制模块电路 24a、 24b: 连接器
26： 连接器 26a: 电线
32： 电线 52： 框架
54： 面板 56： 控制模块电路
58： 电线 60： 固定部
122： 板状本体 122a: 通孔
122b: 第一半凹槽 122c: 半通道
124： 鳍片 142： 管状本体
142': 板状本体 142a: 突出部
142b: 第二半凹槽 142c: 螺孔
142d: 半通道 144： 前盖
146： 后盖 148： 鳍片
162： 接触部 164： 平坦部
166： 外螺紋 182： 能量转换半导体结构
184： 基板 184a: 底面
186、 186': 基座 186a: 第一凹陷部
186b: 第二凹陷部 186c: 外电极
186d: 通孔 186e: 底面
186f: 凹陷 188： 封装材料
190： 透镜 192： 金属线
202： 通孔 204： 外螺紋
206： 卡槽 222： 环状本体
224： 透镜结构 226： 固定环
228： 内螺纹 230： 卡勾
Ll、 L2: 电线 Sl、 S2: 容置空间
X、 Y: 方向 具体实施方式
请参阅图 1及图 2。 图 1为根据第一较佳具体实施例的能量转换装置 1 的示意图。 图 2为能量转换装置 1的剖面图， 其中剖面对称贯穿整个能量转 换装置 1， 图 2的视角如图 1所示的方向 X， 并且为简化视图， 控制模块电 路 24及连接器 26均未予剖面， 此外能量转换构件 18的剖面亦己经过简化。
根据该第一较佳具体实施例， 本发明的能量转换装置 1包含第一散热构 件 12、 第二散热构件 14、 热导管 16(Heat pipe)、 能量转换构件 18、 载台 20、 光学调制构件 22、控制模块电路 24及连接器 26。第一散热构件 12包含板状 本体 122及自板状本体 122延伸的鳍片 124。第二散热构件 M包含管状本体 142、 前盖 144及后盖 146。 前盖 144及后盖 146分别衔接管状本体 142的两 开口端， 以形成一容置空间 S2。此容置空间 S2用以容置控制模块电路 24及 部分的连接器 26,其中控制模块电路 24设置于管状本体 142的突出部 142a (此 可参阅图 3B)上。 此外， 若突出部 142a成形为滑槽结构， 则更可发挥固定控 制模块电路 24的功能。
第一散热构件 12与第二散热构件 14衔接并形成一容置空间 Sl。此容置 空间 S 1略呈直筒状， 用以容置热导管 16。 热导管 16具有接触部 162及平坦 部 164。 接触部 162位于容置空间 S1中并同时与第一散热构件 12及第二散 热构件 14接触。 补充说明的是， 热导管 16亦可以其它具有高导热率的物质 替代。
载台 20固定于热导管 16的一端，原则上与热导管 16的平坦部 164大致 成一平面， 但本发明不以此为限。 能量转换构件 18固定于载台 20上并且与 平坦部 164接触，致使能量转换构件 18于运行中所产生的热可经由该平坦部 164传导至热导管 16中， 再经由热导管 16的接触部 162传导至第一散热构 件 12(及其鳍片 124)及第二散热构件 14， 并散逸出去。光学调制构件 22包含 环状本体 222、 透镜结构 224及固定环 226。 环状本体 222与载台 20连接， 透镜结构 224正对能量转换构件 18设置， 并以固定环 226固定于环状本体 222上。
补充说明的是，控制模块电路 24包含电路板及相关电子元件。控制模块 电路 24通过与连接器 24a电性连接的电线 L1 (以粗虚线示于图 2中)以与能量 转换构件 18电性连接。 载台 20亦形成有通孔 202， 以供该电线通过。 控制 模块电路 24另通过与连接器 24b电性连接的电线 L2(以粗虚线示于图 2中) 以与连接器 26(例如端子台)电性连接。根据能量转换构件 18的能量转换模式， 连接器 26再经由电线 26a连接至电源， 以获取控制模块电路 24控制能量转 换构件 18运行所需的电能， 例如该能量转换模式为电能转换成光能 (例如发 光二极管的能量转换)； 或是连接器 26再经由电线 26a以对外提供电能， 例 如该能量转换模式为光电转换成电能 (例如太阳能电池的能量转换)。
请参阅图 3A及图 3B。 图 3A为第一散热构件 12的示意图， 图中第一散 热构件 12已相对于图 1所示的能量转换装置 1翻转以方便后续说明。 图 3B 为第二散热构件 14的管状本体 142的示意图。 如图 3A及图 3B所示， 第一 散热构件 12的板状本体 122包含一第一半凹槽 122b， 呈半圆形并沿方向 Y 延伸； 对应地， 第二散热构件 12的管状本体 142包含一第二半凹槽 142b， 同样呈半圆形并沿方向 Y延伸。 当第一散热构件 12与第二散热构件 14对接 后， 第一半凹槽 122b及第二半凹槽 142b即形成容置空间 S l。
于实际组装中， 可先将热导管 16 置入第一半凹槽 122b或第二半凹槽 142b中， 再利用螺丝穿过通孔 122a并旋入螺孔 142c以将板状本体 122与管 状本体 142固定， 以达到第一散热构件 12与第二散热构件 14的对接， 而热 导管 16亦同时容置于第一半凹槽 122b及第二半凹槽 142b所形成的容置空间 S1中。 关于固定的方式， 本发明不以此为限， 例如利用焊接、 C形卡扣固定 亦可。
若热导管 16的外径略小于容置空间 S1的内径，或是热导管 16的截面轮 廓与容置空间 S1 的截面轮廓有尺寸干涉的现象。 则经由上述组装， 热导管 16的接触部 162即因受压而同时紧密地贴合于第一散热构件 12与第二散热 构件 14。 此加压的接合方式使得热导管 16产生些许的变形， 除了可强化热 导管 14与第一散热构件 12与第二散热构件 14的连接强度，亦可增加接触部 162与第一半凹槽 122b及第二半凹槽 142b的接触面积， 进而增加热传导效 率。
值得一提的是， 第一半凹槽 122b及第二半凹槽 142b不以平均占有容置 空间 S1的体积为限； 换句话说， 第一半凹槽 122b亦得占有容置空间 S1绝 大部分的体积。 例如， 当热导管 16(以热导管为例)的截面为矩形， 则第二半 凹槽 142b可近乎呈现出平面外形 (或第二散热构件 12并无明显的第二半凹槽 142b), 仍可与第一半凹槽 122b形成容置空间 SI。 因此， 仅需于第一散热构 件 12与第二散热构件 14衔接后可形成容置空间 S1即可，本发明不以第一散 热构件 12与第二散热构件 14均有凹凸的几何结构为必要。 补充说明的是，方向 Y虽为直线方向，但本发明不以此为限， 曲线亦可。 第一散热构件 12与第二散热构件 14接合的平面， 逻辑上即为容置空间 S1 的分割面， 以分割成第一半凹槽 122b及第二半凹槽 142b。 原则上， 若容置 空间 S1为沿一曲线延伸时， 该曲线则位于该分割面上。此外， 于第一较佳具 体实施例中， 鳍片 124平行于方向 Y设置， 因此当能量转换装置 1垂直设置 或水平设置 (或热导管 16垂直设置或水平设置)时， 流经鳍片 124间的气流仍 能保持顺畅。 顺带一提， 前述鳍片 124的平行于方向 Y设置亦包含每个鳍片 124均仍与方向 Y平行但呈辐射状的排列的情形。
另外， 于图 2所示的光学调制构件 22的环状本体 222可通过贴着、紧配 合夹持或另以螺丝贯穿环状本体 222并锁入载台 20的方式以固定于载台 20 上。 但本发明不以此为限。 请参阅图 4A及图 4B。 图 4A为光学调制构件 22 经由一螺纹结构以旋转固定于载台 20的结构示意图。 图 4B为光学调制构件 22经由一卡勾结构以卡持载台 20的结构示意图。如图 4A所示， 该螺纹结构 通过于环状本体 222形成一内螺纹 228及于载台 20的侧边形成一外螺纹 204 构成。 以此， 光学调制构件 22的环状本体 222即可旋锁于载台 20上。 补充 说明的是， 载台 20于该螺紋结构处的壁厚略不同于图 2所示，此因配合不同 的连接结构所作的调整。
如图 4B所示， 该卡勾结构可单独由形成于环状本体 222上的卡勾 230 组成。光学调制构件 22即可通过卡勾 230卡持载台 20以与载台 20连接。若 载台 20对应地形成卡槽 206， 此时该卡勾结构则由卡勾 230及卡槽 204共同 组成。当光学调制构件 22的卡勾 230卡持于载台 20的卡槽 206后，卡槽 206 对卡勾 230具有限位功能， 如图 4C所示。 通过设计适当的卡槽 206尺寸， 卡槽 206具有固定卡勾 230的功能。
另外， 于图 2所示的载台 20可通过贴着、紧配合夹持或另以螺丝贯穿载 台 20并紧抵热导管 16的方式以固定于热导管 16的一端上。但本发明不以此 为限。 请参阅图 5。 图 5为载台 20经由一螺紋结构以旋转固定于热导管 16 的结构示意图。如图 5所示， 该螺纹结构通过于载台 20的通孔内形成一内螺 纹 208及于热导管 16形成一外螺纹 166构成。 以此， 载台 20即可旋锁于热 导管 16的一端上。
补充说明的是， 当热导管 16的壁厚足够时， 热导管 16的外螺纹 166可 直接用传统攻牙刀直接攻牙； 当热导管 16的壁厚不足以承受切削力量，或是 切削后所剩的壁厚不足以承受载台 20的锁入时，外螺纹 166可以滚压的方式 (rolling)形成， 此成形方式除了可在不过度改变壁厚的条件下成形外螺纹 166 夕卜， 并且具有加工硬化的效果， 进而强化外螺纹 166的强度。 另外值得一提 的是， 图 4A至 4C及图 5中的能量转换构件 18为示意性示出， 图中并未展 示能量转换构件 18的实际细节。
请参阅图 6A及图 6B。图 6A为能量转换装置 1的能量转换构件 18及载 台 20的俯视图。 图 6B为能量转换构件 18、 载台 20及部分热导管 16沿图 6A中线 Z-Z的剖面图。 根据第一较佳具体实施例， 能量转换构件 18包含能 量转换半导体结构 182、基板 184及基座 186。能量转换半导体结构 182位于 基板 184上。 基座 186包含第一凹陷部 186a以及与第一凹陷部 186a连通的 第二凹陷部 186b， 基板 184接触平坦部 164并与第二凹陷部 186b连接， 能 量转换半导体结构 182则露出于第一凹陷部 186a。
能量转换半导体结构 182为独立的芯片， 再固晶于基板 184上。 能量转 换半导体结构 182还以金属线 192拉线至基座 186的内电极上， 再通过与基 座 186上与内电极连接的外电极 186c焊接的电线 L1 以与控制模块电跻 24 电性连接 (可并参阅图 2)。基板 184上再以封装材料 188固定或密封能量转换 半导体结构 182及金属线 192。基座 186再利用螺丝经由通孔 186d锁固于载 台 20上。封装材料 188亦具有光学调制功能，例如当封装材料 188的轮廓形 成如图 6B所示的突出状时， 封装材料 188则具有聚光的效果。
根据第一较佳具体实施例， 能量转换构件 18还包含一透镜 190， 设置于 基座 186上。 此透镜 190亦具聚光的效果， 但本发明不以此为限。 经由适当 地设计透镜 190两侧的曲率而可呈现出汇聚光线或是发散光线的效果， 以满 足不同的光学调制的需求。 于实际应用上， 能量转换装置 1的光学调制效果 尚需一并考虑光学调制构件 22的透镜结构 224的光学特性。 值得一提的是， 本发明的光学调制构件 22的透镜结构 224并不限一般的凸透镜。 请参阅图 4A，透镜结构 224于中间处具有一凹陷，因此透镜结构 224大致聚焦成环状。
请参阅图 6A及图 6B。 补充说明的是， 基座 186可利用先埋入金属材质 的导线架至模具中， 再射出液晶塑料 (Liquid Crystal Plastic, LCP)的方式制造， 致使该导线架于第一凹陷 186a内露出该内电极，并于基座 186上露出外电极 186c。 另外， 能量转换半导体结构 182亦得以串接方式拉线， 如图 6B的虚 线所示。 此时， 图 6B中的能量转换半导体结构 182仅保留一条金属线 192 与基座 186电性连接。 若基板 184具有线路， 例如于制程中形成线路的半导 体基板或具有金属披覆线路的电路板， 则能量转换半导体结构 182可先拉线 至基板 184上， 再通过基板 184与基座 186电性连接。 若基板 184设计上不 需担负电性连接媒介， 则基板 184可采用金属或其它高导热率的材质， 以增 加由能量转换半导体结构 182产生的热传导至平坦部 164的热传导效率。
请参阅图 7。 图 7为根据一具体实施例的能量转换构件 18、载台 20及部 分热导管 16的剖面图。与图 6不同的是， 图 7的基板 184完全容置于第二凹 陷 186b， 因此基座 186的底面 186e略突出于基板 184的底面 184a (用以与平 坦部 164接触)。对应地， 平坦部 164则突出于载台 20。平坦部 164突出的高 度略大于基板 184的底面 184a凹入的深度，以确保基板 184紧贴平坦部 164。
基于相同的设计理由， 平坦部 164可仅略微突出于载台 20， 而基座 186 的底面 186e则与基板 184的底面 184a大致共平面， 同样可达到上述确保紧 贴的目的。 而于图 6B所示的结构中， 若基座 186与平坦部 164间有空隙存 在时， 可事先将导热胶涂于基座 186底面或平坦部 164上， 以使导热胶可充 满空隙。 当然， 于图 7所示的结构中， 导热胶亦可事先涂于基座 186的底面 186e或平坦部 164上， 以充满因底面 186e或平坦部 164的表面粗糙所形成 的空隙。
请参阅图 6B及图 8。 图 8为根据另一具体实施例的能量转换构件 18、 载台 20及部分热导管 16的剖面图。 与图 6B不同的处在于， 图 8的能量转 换半导体结构 182直接形成于基板 184上， 例如基板 184本身即为半导体基 板 (例如硅基板)。 因此， 能量转换半导体结构 182可整合地于半导体制程，. 轻易地形成于基板 184上。 并且， 直接形成于半导体基板 184的能量转换半 导体结构 182的电极可事先整合于基板 184上， 使得整个能量转换构件 18 仅需两个拉线作业， 大幅提升制程的稳定性。
请参阅图 6B及图 9。 图 9为根据另一具体实施例的能量转换构件 18、 载台 20及部分热导管 16的剖面图。 与图 6B不同的处在于， 图 9的能量转 换半导体结构 182并非设置于如图 6B的基板 184上， 而是直接设置于具有 一凹陷 186f的底座 186'。此外，于实际运用中，底座 186'亦可直接为一平板， 能量转换半导体结构 182直接设置于其上。 其它关于图 6B的能量转换构件 18的说明， 于此亦有适用， 不再赘述。
请参阅图 9及图 10。 图 10为根据另一具体实施例的能量转换构件 18、 载台 20及部分热导管 16的剖面图。 与图 6B不同的处在于， 图 10的能量转 换半导体结构 182直接形成于基座 186'上。 当然， 于实际运用中， 底座 186' 亦可直接为一平板。前述关于图八的能量转换构件 18的说明，于此亦有适用， 不再赘述。
于前述各具体实施例中， 当能量转换半导体结构 182为一发光二极管半 导体结构时， 本发明的能量转换装置 1即可作为一照明装置； 当能量转换半 导体结构 182为一太阳能电池半导体结构时， 本发明的能量转换装置 1即可 作为一太阳能电池。当然， 能量转换构件 18可同时包含发光二极管半导体结 构及太阳能电池半导体结构，并且控制电路 24可包含足够仍量的电容，用以 储存电能。 以此， 本发明的能量转换装置 1可于白天利用太阳能电池半导体 结构充电该电容， 而于晚上利用该电容储存的电能使发光二极管半导体结构 发光。
请参阅图 1、 图 2及图 11。 图 11为根据第二较佳具体实施例的能量转换 装置 3的示意图。 与图 1所示的能量转换装置 1不同之处在于， 能量转换装 置 3的第二散热构件 14与第一散热构件 12对称， 亦包含板状本体 142'及自 板状本体 142'延伸的鳍片 148。 但由于能量转换装置 3的第二散热构件 14本 身不包含可容置控制模块电路 24的容置空间 S2(如图 2所示)，因此能量转换 装置 3原则上亦不包含控制模块电路 24及连接器 26。 但能量转换装置 3可 于第一散热构件 12及第二散热构件 14的尾端 (相对光学调制构件 22所在的 前端)连接一电气盒， 以容置控制模块电路 24及连接器 26。
请参阅图 12A及图 12B。 图 12A及图 12 B分别为第一散热构件 12及第 二散热构件 14的示意图。 虽然第二散热构件 14未包含如能量转换装置 1的 容置空间 S2，但能量转换装置 3的第一散热构件 12及第二散热构件 14分别 包含半通道 122c、 142d, 于第一散热构件 12及第二散热构件 14接合后， 可 形成贯穿的通道， 以供与能量转换构件 18电性连接的电线通过。于前述各实 施例中， 具有相同命名的元件的描述可用于第二较佳具体实施例中， 亦有适 用， 故不再赘述。 请参阅图 13A及图 13B。图 13A为根据第三较佳具体实施例的能量转换 设备 5的示意图。 图 13B为能量转换设备 5的局部剖视图， 其仅示出能量转 换装置 3与面板 54的相对结构。 能量转换设备 5包含框架 52及多个前述能 量转换装置 3， 所述多个能量转换装置 3固定于框架 52上。 换句话说， 能量 转换设备 5为能量转换装置群。
框架 52包含一面板 54， 面板 54包含多个通孔 542， 对应所述多个能量 转换装置 3。每一个能量转换装置 3的载台 20侧边的外螺纹 204露出于对应 的通孔 542， 以此， 每一个能量转换装置 3的光学调制构件 22的内螺纹 228 能自面板 54外部与外螺紋 204锁合。 能量转换设备 5还包含控制模块电路 56, 其固定于框架 52上并通过电线 32与该多个能量转换装置 3电性连接。 因此，所述多个能量转换装置 3仅需共享同一个控制模块电路 56即可。控制 模块电路 56再经由电线 58与外部电源连接以获取所需电能， 或作为对外提 供电能的媒介。 此外， 框架 52可通过固定部 60以固定至其它固定物件上。
补充说明的是， 虽然能量转换设备 5已包含控制模块电路 56， 但其架构 仍适用于能量转换装置 1(可参阅图 1)， 并且因为能量转换装置 1已有各自的 控制模块电路 24， 所以控制模块电路 56的控制功能可简化。 此外， 能量转 换设备 5不以包含同型态的能量转换装置 3为限， 即能量转换设备 5可包含 多个光能转电能的能量转换装置 3(例如包含发光二极管半导体结构)及多个 电能转光能的能量转换装置 3(例如包含太阳能电池半导体结构)并平均配置， 兼顾发光照明与吸光储能的效益， 进一步成为自给自足的充电 /发光系统。 于 此情形， 电线 58原则上可省却。 工业实用性
综上所述， 本发明的能量转换装置具有组合式的散热结构， 有利于热导 管的组装， 并进一步降低接触热阻、 提升导热率。 并且， 本发明的能量转换 装置的鳍片可平行于热导管设置， 减少因能量转换装置的装设角度而导致流 经鳍片的气流不顺的情形。 此外， 通过框架衔接、 固定多个能量转换装置， 并得以单一控制模块电路同步控制， 以发挥群集的效益； 进一步地， 适当地 同时配置不同能量转换模式的能量转换装置， 可形成自给自足的充电 /发光系 统。 通过以上较佳具体实施例的详述， 希望能更加清楚描述本发明的特征与 精神， 而并非以上述所披露的较佳具体实施例来对本发明的范畴加以限制。 相反地， 其目的是希望能涵盖各种改变及具等同性的安排于本发明所欲保护 的范围内。

Claims

权利要求
1.一种能量转换装置， 包含：
一热导管， 包含一接触部及一平坦部， 其中该接触部沿一方向延伸； 一第一散热构件， 包含多个第一鳍片， 其中所述多个第一鳍片近似平行 于该方向；
一第二散热构件， 与该第一散热构件连接形成一容置空间， 该接触部容 置于该容置空间中并同时与该第一散热构件及该第二散热构件接触； 以及 一能量转换构件， 与该平坦部接触；
其中该第一散热构件沿该方向包含一第一半凹槽， 该第二散热构件沿该 方向包含一第二半凹槽， 该第一半凹槽及该第二半凹槽形成该容置空间。
2.如权利要求 1所述的能量转换装置， 其中该第二散热构件包含多个第 二鳍片， 其中所述多个第二鳍片近似平行于该方向。
3.如权利要求 1所述的能量转换装置， 其中该第二散热构件包含一电路 容置空间， 用以容置控制该能量转换构件的一控制模块电路。
4.如权利要求 3所述的能量转换装置，该能量转换装置还包含一连接器， 该连接器露出于该第二散热构件并与该控制模块电路电性连接。
5.如权利要求 3所述的能量转换装置， 其中该第二散热构件包含一管状 本体、 一前盖及一后盖， 该前盖及该后盖衔接该管状本体的两侧以形成该电 路容置空间。
6.如权利要求 1所述的能量转换装置， 其中该第一散热构件及该第二散 热构件紧压该接触部。
7.如权利要求 1所述的能量转换装置， 其中该能量转换构件包含一能量 转换半导体结构、 一基板及一基座， 该能量转换半导体结构位于该基板上， 该基板与该基座连接以露出该能量转换半导体结构。
8.如权利要求 7所述的能量转换装置， 其中该能量转换半导体结构形成 于该基板上。
9.如权利要求 7所述的能量转换装置， 其中该能量转换半导体结构为一 固晶于该基板上的芯片。
10.如权利要求 7所述的能量转换装置，其中该能量转换半导体结构为一 发光二极管半导体结构或一太阳能电池半导体结构。
11.如权利要求 7所述的能量转换装置，其中该基座包含一第一凹陷部以 及与该第一凹陷部连通的一第二凹陷部， 该基板接触该平坦部并与该第二凹 陷部连接， 该能量转换半导体结构露出于该第一凹陷部。
12.如权利要求 1所述的能量转换装置，其中该能量转换构件包含一能量 转换半导体结构及一基座， 该能量转换半导体结构位于该基座上。
13.如权利要求 12所述的能量转换装置， 其中该基座包含一凹陷， 该能 量转换半导体结构位于该凹陷。
14.如权利要求 12所述的能量转换装置， 其中该能量转换半导体结构形 成于该基座上。
15.如权利要求 12所述的能量转换装置， 其中该能量转换半导体结构为 一固晶于该基座上的芯片。
16.如权利要求 12所述的能量转换装置， 其中该能量转换半导体结构为 一发光二极管半导体结构或一太阳能电池半导体结构。
17.如权利要求 1所述的能量转换装置，该能量转换装置还包含一该热导 管连接的载台， 其中该能量转换构件固定于该载台上使该能量转换构件与该 平坦部接触。
18.如权利要求 17所述的能量转换装置， 该能量转换装置还包含一与该 载台连接的光学调制构件。
19.如权利要求 18所述的能量转换装置， 其中该载台的侧边包含一螺紋 结构， 使该光学调制构件经由该螺紋结构以旋转固定于该载台。
20.如权利要求 18所述的能量转换装置， 其中该光学调制构件经由一卡 勾结构以卡持于该载台。
21.如权利要求 18所述的能量转换装置， 其中该光学调制构件包含一正 对该能量转换构件的透镜结构。
22.—种能量转换设备， 包含：
一框架， 包含一面板， 该面板包含多个通孔； 以及
多个能量转换装置， 对应所述多个通孔设置于该框架上， 每一个能量转 换装置包含：
一热导管，包含一接触部及一平坦部，其中该接触部沿一方向延伸； 一第一散热构件， 包含多个第一鳍片， 其中所述多个第一鳍片近似 平行于该方向；
一第二散热构件， 与该第一散热构件连接形成一容置空间， 该接触 部容置于该容置空间中并同时与该第一散热构件及该第二散热构件接 触； 以及
一能量转换构件， 与该平坦部接触；
其中该第一散热构件沿该方向包含一第一半凹槽， 该第二散热构件 沿该方向包含一第二半凹槽， 该第一半凹槽及该第二半凹槽形成该容置 空间。
23.如权利要求 22所述的能量转换设备， 其中每一个能量转换装置包含 一与该热导管连接的载台， 该能量转换构件固定于该载台上以使该能量转换 构件与该平坦部接触。
24.如权利要求 23所述的能量转换设备， 其中每一个能量转换装置包含 一光学调制构件， 该载台包含一露出于对应的通孔的螺紋结构， 该光学调制 构件经由该螺纹结构旋转固定于该载台上。
25.如权利要求 22所述的能量转换设备， 该能量转换装置还包含一控制 模块电路， 该控制模块电路设置于该框架上并与所述多个能量转换装置电性 连接。
PCT/CN2009/000017 2009-01-06 2009-01-06 能量转换装置及能量转换设备 WO2010078691A1 (zh)

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EA200970511A EA200970511A1 (ru) 2009-01-06 2009-01-06 Устройство для преобразования энергии и оборудование для преобразования энергии
JP2010545347A JP2011509533A (ja) 2009-01-06 2009-01-06 エネルギー変換装置及びエネルギー変換機器
EP09744589A EP2387070A1 (en) 2009-01-06 2009-01-06 Device for energy conversion and equipment for energy conversion
PCT/CN2009/000017 WO2010078691A1 (zh) 2009-01-06 2009-01-06 能量转换装置及能量转换设备
AU2009225293A AU2009225293B2 (en) 2009-01-06 2009-01-06 Energy transducing apparatus and energy transducing equipment
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