CN1874015A - 整合导热/散热模块的半导体发光装置 - Google Patents

整合导热/散热模块的半导体发光装置 Download PDF

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CN1874015A
CN1874015A CNA2005100747769A CN200510074776A CN1874015A CN 1874015 A CN1874015 A CN 1874015A CN A2005100747769 A CNA2005100747769 A CN A2005100747769A CN 200510074776 A CN200510074776 A CN 200510074776A CN 1874015 A CN1874015 A CN 1874015A
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light
heat
emitting
crystal grain
emitting device
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陈振贤
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NEW LIGHT SOURCE TECHNOLOGY Co Ltd
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Priority to JP2008513891A priority patent/JP5011494B2/ja
Priority to PT05752496T priority patent/PT1895227E/pt
Priority to US11/921,464 priority patent/US7963678B2/en
Priority to DE602005019480T priority patent/DE602005019480D1/de
Priority to AT05752496T priority patent/ATE458165T1/de
Priority to KR1020087000116A priority patent/KR100998480B1/ko
Priority to EP05752496A priority patent/EP1895227B1/en
Priority to PCT/CN2005/000838 priority patent/WO2006128327A1/zh
Priority to AU2005332535A priority patent/AU2005332535B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

本发明提供一种发光装置。该发光装置包括一导热/散热模块以及至少一半导体发光模块。该导热/散热模块包括一大体上成柱状的导热装置与至少一散热鳍片。该导热装置具有至少一平坦部。该至少一散热鳍片固定于该导热装置的一周围上。该至少一半导体发光模块包括一载台、多个外部电极、至少一半导体发光晶粒与至少两导线。该载台平整接合于该导热装置的至少一平坦部上。该多个外部电极系设置于该载台上。该至少一半导体发光晶粒系固定于该载台上并且分别电连接至该多个外部电极。该至少两导线电连接该多个外部电极系用以外接电源或接地。

Description

整合导热/散热模块的半导体发光装置
技术领域
本发明涉及一种发光装置(Light-emitting apparatus)，特别是涉及本发明的发光装置整合一导热/散热模块(Heat conducting/dissipating module)。
背景技术
由于发光二极管(Light emitting diode，LED)具有如省电、耐震、反应快以及适合量产等许多优点，因此目前以发光二极管为光源的照明产品日益广泛。目前已有数家制造商投入制造不同外型的高亮度发光二极管套件，这些高亮度发光二极管套件使用较大的发光驱动芯片(Emitter chip)，但也相应地造成较高的电力需求。虽然能够产生远高于传统发光二极管灯泡亮度的输出，但它也产生大量的热量，在持续发亮一段时间后，会有结点温度(Junction temperature)过高的问题，使得发光二极管本身的发光效率下降，造成亮度无法提高。因此，各种应用高功率的发光二极管的产品都需要外加良好的散热机制。
请参阅图1A以及图1B，图1A绘示现有的包括一散热模块并为独立元件的发光装置的示意图。图1B绘示图1A的发光装置的剖视图。如图1A以及图1B所示，一半导体发光模块4包括一基板46，该基板上具有一凹槽44。多个芯片42设置于该凹槽44上。该基板46为一金属材料、一陶瓷材料或一多分子材料制成，于其上具有一绝缘层，并有一导线层覆盖该绝缘层，以电连接该多个芯片42。该多个芯片42所产生的热，经过该基板46，经由传导才到达一散热模块5。该散热模块5通常为鳍片状的散热板，该多个芯片42所产生的热能经由多层材料而传导，而非直接接触散热模块5来消散热能，因此热能无法快速被引导散开，因而无法有效散热，芯片的散热效率也无法被准确地控制。在高功率的应用时，发光二极管芯片的结点温度常超过安全范围。此种散热模块无法快速引导热能散开，芯片之散热效率也无法被准确地控制，尤其是高功率的半导体发光模块非常容易因散热效率不好而过热损坏。
因此，本发明提供一种能够挂载高亮度半导体发光模块同时包括良好导热/散热装置的发光装置，在封装阶层内即降低热阻(Thermal resistance)，达到部分解热效果，有效降低半导体芯片的结点温度，可有效解决先前技术中的散热问题外，并提供高强度的发光效果。
发明内容
本发明提供一种发光装置，根据本发明的发光装置包括一导热/散热模块以及至少一半导体发光模块。
该导热/散热模块包括一大体上成柱状的导热装置与至少一散热鳍片。该导热装置具有至少一平坦部。该至少一散热鳍片固定于该导热装置的一周围上。该至少一半导体发光模块包括一载台、多个外部电极、至少一半导体发光晶粒与至少两导线。该载台平整接合于该导热装置的至少一平坦部上。该多个外部电极设置于该载台上。该至少一半导体发光晶粒固定于该载台上并且分别电连接至该多个外部电极。该至少两导线电连接该多个外部电极用以外接电源或接地。
当该发光装置连接至一电源而发光时，该发光装置所产生的热是由该导热装置自其本身的该至少一平坦部导引至该至少一散热鳍片，进而由该至少一散热鳍片散热。
本发明所提供的发光装置是将导热/散热模块与半导体发光模块有效的整合在一起而成为一独立的具有散热功能的发光装置，成为一具有散热效能的发光引擎(Light engine)。该导热/散热模块可通过该柱状的导热装置将该至少一半导体发光模块所产生的热能有效导引，该导热装置不但比现有技术具有较大散热面积，并且能将热能导引远离该半导体发光模块。之后，各散热鳍片立即将热能发散至周围的空气中，大幅度提高散热效率。因此，相比较于先前技术，根据本发明的发光装置通过将半导体发光模块整平接合导热装置的平整端面，有效降低结点温度，比先前技术更适合应用于需要高效率的发光二极管芯片的照明装置中。
本发明的发光装置能广泛整合现有的照明设备中的二极管发光模块与导热/散热模块成一独立式元件，并且能有效导热且具有更佳的散热效率。关于本发明的优点与精神可以通过以下的发明详述及所附图式得到进一步的了解。
附图说明
图1A为现有的包括一散热模块并为独立元件的发光装置的示意图；
图1B为现有的包括一散热模块并为独立元件的发光装置的剖视图；
图2为本发明的发光装置的外观视图；
图3为沿图2中L-L线的剖视图，其显示根据本发明的发光装置；
图4为本发明的一较佳具体实施例的发光装置的顶视图；
图5、图6及图7为本发明的发光装置的各种实施方式。
具体实施方式
本发明提供一种具有高散热效率高功率的发光装置，以防止高功率发光二极管芯片因结点(P-N junction)温度过高而降低其发光效率及寿命。并且，本发明的发光装置为一种系统构装(System-in-package)结构，整合一阶封装(First-level package)的半导体发光模块以及二阶组装(Second-levelassembly)的高效率的散热模块，成为一具散热功能的独立整合发光元件。
请参阅图2及图3，图2为根据本发明的发光装置的外观视图。图3绘示沿图2中L-L线的剖视图。根据本发明的发光装置1包括一导热/散热模块10以及一半导体发光模块(Semiconductor light-emitting module)20。
如图2及图3所示，该导热/散热模块10包括一大体上成柱状的导热装置(Heat conducting device)12与至少一散热鳍片(Heat-dissipating fin)14。该导热装置12具有至少一平坦部位于其之一端或周围上。在一具体实施例中，该导热装置12是一热导管(Heat pipe)、热导柱(Heat column)或由一高导热系数的材料，例如铜、铝等所成形的柱体，并且该柱体的长度超过其至少一平坦部的最大宽度的两倍，而该至少一平坦部是在此类柱状结构的导热体制作过程中加工处理而成。该至少一散热鳍片14固定于该导热装置12的周围，用以提高散热效率。该至少一散热鳍片14中的每一散热鳍片14上都具有至少一孔洞142，该各孔洞142可以作为散逸通道，使受该至少一散热鳍片14所导引的热所引发的热空气散逸，进而增加该发光装置1的散热效率，并且可让导线穿过该等孔洞142以隐藏导线。
请参阅图4，图4绘示根据本发明的一较佳具体实施例的发光装置的顶视图。如图4以及图5所示，该至少一半导体发光模块20包括一载台(Carrier)22、多个外部电极(Exterior electrode)24、至少一半导体发光晶粒(Semiconductor light-emitting die)26与至少两导线(Conducting wire)28。该载台22是由一高分子材料、一金属材料或一陶瓷材料所制成，且固定于该导热装置12的至少一平坦部上，并与该至少一平坦部平整接合。该载台22上具有多个通孔23，用以隐藏该至少两导线28。该载台22上进一步包括一支撑架(Holder)21，该支撑架21位于该载台22的下方且套设于该导热装置12，该载台22可以螺丝通过其上的多个通孔23锁于该支撑架21上，增加接合压力以降低接合界面的热阻系数。
该至少一半导体发光晶粒26固定于该载台22上并且分别电连接至该多个外部电极24。该至少两导线28电连接该多个外部电极24。该至少两导线28可穿过该各散热鳍片14上的至少一孔洞142以外接电源或接地。
在一实施例中，该至少一半导体发光模块进一步包括一封装材质(Package material)，以覆盖该至少一半导体发光晶粒。该至少一半导体发光模块包括一光学模块，该光学模块固定于该载台上以使该至少一半导体发光晶粒所发出的光线聚焦。
请再参阅图3，如图3所示，当该发光装置1连接至一电源时，该至少一半导体发光晶粒26在发光时所产生的热是由该导热装置12自其本身的该至少一平坦部导引至该至少一散热鳍片14，进而由该至少一散热鳍片14散热。由于根据本发明中的至少一半导体发光晶粒通过载台22与该导热/散热模块12的至少一平坦部紧密接合，而与外接的电源或控制模块之间保持有一段距离，可避免电源或控制电路模块直接受到该至少一半导体发光晶粒26所产生的热能影响。
如图3所示，本发明的发光装置进一步包括一嵌合构件30以便利组装。该嵌合构件30套设于该载台22上，且其上具有两弹性体(Resilient body)。举例来说，当使用者欲将该的发光装置1组装在一墙壁上或一天花板上的一孔洞时，使用者可先将两弹性体分别弯曲成与该导热装置12平行，再将发光装置1嵌进墙壁上或天花板上的孔洞。当发光装置1嵌进孔洞时，两弹性体会因弹力而欲回复原来状态，使得发光装置1可以与孔洞互相嵌合。
请参阅图5、图6及图7，图5、图6及图7绘示根据本发明的发光装置的各种实施方式。由以上各图可得知，本发明的发光装置并不局限导热装置以及载台的形态，可因不同实际应用的需要而做改善。
在一实施例中，本发明的发光装置中的该至少一半导体发光晶粒包括至少一发光二极管(Light emitting diode，LED)晶粒或至少一激光二极管(Laser diode)晶粒。该半导体发光晶粒可能为一蓝光二极管晶粒或是包括至少一红光二极管晶粒、至少一蓝光二极管晶粒以及至少一绿光二极管晶粒；控制该各红光二极管晶粒、蓝光二极管晶粒以及绿光二极管晶粒，使得该各不同颜色的发光二极管晶粒以不同的发光比例可组成各种不同颜色的光线。
本发明所提供的发光装置是将导热/散热模块与半导体发光模块有效的整合在一起而成为一独立的具高效散热功能的发光装置。本发明的发光装置将半导体发光模块平整接合于导热装置的平整端面，通过导热装置其大体呈柱状的结构将热引导开，而能有效降低半导体晶粒的结点温度。该导热/散热模块可通过该柱状的导热装置将该至少一半导体发光模块所产生的热能有效导引，该导热装置不但比先前技术具有较大散热面积，并且能将热能导引远离该半导体发光模块。散热鳍片能立即将导热装置传导的热能发散至周围的空气中，大幅度提高散热效率。借着散热效率的改善，解决了因过热造成半导体发光晶粒效率下降的问题。
因此，根据本发明的发光装置通过将半导体发光模块平整接合导热装置的平整端面，通过导热装置其大体呈柱状的结构将热引导开，而能有效降低半导体晶粒的结点温度，使得本发明的发光装置能驱动至较高瓦数(大于10瓦)，而大幅度提高发光效率。
通过以上较佳具体实施例的详述，希望能更加清楚描述本发明的特征与精神，而并非以上述所揭露的较佳具体实施例来对本发明的范畴加以限制。相反地，其目的是希望能涵盖各种改变及具有相等性的安排于本发明所欲申请的权利要求的范畴内。

Claims (14)

1.一种发光装置(Light-emitting apparatus)，包括：
一导热/散热模块(Heat conducting/dissipating module)，包括：
一大体上成柱状的导热装置(Heat conducting device)，该导热装置具有至少一平坦部；以及
至少一散热鳍片(Heat-dissipating fin)，该至少一散热鳍片固定于该导热装置的一周围上；以及
至少一半导体发光模块(Semiconductor light-emitting module)，包括：
一载台(Carrier)，该载台是以其的一底部平整接合该导热装置的至少一平坦部；
多个外部电极(Exterior electrode)，该多个外部电极设置于该载台上；
至少一半导体发光晶粒(Semiconductor light-emitting die)，该至少一半导体发光晶粒固定于该载台上并且分别电连接至该多个外部电极；以及
至少两导线(Conducting wire)，该至少两导线电连接该多个外部电极。
2.如权利要求1所述的发光装置，其中该载台是由一多分子材料、一金属材料或一陶瓷材料所制成。
3.如权利要求1所述的发光装置，其中该至少一半导体发光模块进一步包括：
一光学模块，该光学模块固定于该载台上以使该至少一半导体发光晶粒所发出的光线聚焦。
4.如权利要求1所述的发光装置，其中该导热装置为一热导管(Heatpipe)或热导柱(Heat column)。
5.如权利要求1所述的发光装置，其中该导热装置为一高导热系数的材料所成形的柱体，并且该柱体的长度超过其至少一平坦部的最大宽度的两倍。
6.如权利要求1所述的发光装置，其中该至少一平坦部位于该导热装置的一端。
7.如权利要求1所述的发光装置，其中该至少一平坦部位于该导热装置的周围上。
8.如权利要求1所述的发光装置，其中该至少一半导体发光晶粒包括至少一发光二极管(Light emitting diode，LED)晶粒或至少一激光二极管(Laser diode)晶粒。
9.如权利要求1所述的发光装置，其中该至少一半导体发光晶粒包括一蓝光二极管晶粒。
10.如权利要求1所述的发光装置，其中该至少一半导体发光晶粒包括至少一红光二极管晶粒、至少一蓝光二极管晶粒以及至少一绿光二极管晶粒。
11.如权利要求1所述的发光装置，其中进一步包括一嵌合构件(Embedding assembly)，该嵌合构件是套设于该载台上用以组装该发光装置。
12.如权利要求1所述的发光装置，该载台上具有多个通孔，用以隐藏该至少两导线。
13.如权利要求1所述的发光装置，其中进一步包括一支撑架(Holder)，该支撑架位于该载台的下方且套设于该导热装置，该载台上具有多个通孔，用以将该载台锁于该支撑架上。
14.如权利要求1所述的发光装置，其中该至少一散热鳍片中的每一散热鳍片上都具有至少一孔洞，使得该至少两导线可穿过该各孔洞，以外接一电源或接地。
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AT05752496T ATE458165T1 (de) 2005-06-03 2005-06-13 Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung
EP05752496A EP1895227B1 (en) 2005-06-03 2005-06-13 A semiconductor light-emitting apparatus provided with a heat conducting/dissipating module
PT05752496T PT1895227E (pt) 2005-06-03 2005-06-13 Um aparelho semicondutor para emissão de luz, equipado com um módulo para condução/dissipação de calor
US11/921,464 US7963678B2 (en) 2005-06-03 2005-06-13 Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
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CA2610220A CA2610220C (en) 2005-06-03 2005-06-13 Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
KR1020087000116A KR100998480B1 (ko) 2005-06-03 2005-06-13 열전달/발산 모듈을 구비한 반도체 발광 장치
JP2008513891A JP5011494B2 (ja) 2005-06-03 2005-06-13 熱伝導／消散ユニット一体型半導体発光装置
PCT/CN2005/000838 WO2006128327A1 (fr) 2005-06-03 2005-06-13 Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur
AU2005332535A AU2005332535B2 (en) 2005-06-03 2005-06-13 A semiconductor light-emitting apparatus provided with a heat conducting/dissipating module
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CN100468795C (zh) 2009-03-11
PT1895227E (pt) 2010-05-21
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