DE602005019480D1 - Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung - Google Patents

Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung

Info

Publication number
DE602005019480D1
DE602005019480D1 DE602005019480T DE602005019480T DE602005019480D1 DE 602005019480 D1 DE602005019480 D1 DE 602005019480D1 DE 602005019480 T DE602005019480 T DE 602005019480T DE 602005019480 T DE602005019480 T DE 602005019480T DE 602005019480 D1 DE602005019480 D1 DE 602005019480D1
Authority
DE
Germany
Prior art keywords
heat
conducting
carrier
emitting
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005019480T
Other languages
English (en)
Inventor
Jen-Shyan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NeoBulb Technologies Inc
Original Assignee
NeoBulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37481208&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602005019480(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by NeoBulb Technologies Inc filed Critical NeoBulb Technologies Inc
Publication of DE602005019480D1 publication Critical patent/DE602005019480D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE602005019480T 2005-06-03 2005-06-13 Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung Active DE602005019480D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2005100747769A CN100468795C (zh) 2005-06-03 2005-06-03 整合导热/散热模块的半导体发光装置
PCT/CN2005/000838 WO2006128327A1 (fr) 2005-06-03 2005-06-13 Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur

Publications (1)

Publication Number Publication Date
DE602005019480D1 true DE602005019480D1 (de) 2010-04-01

Family

ID=37481208

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005019480T Active DE602005019480D1 (de) 2005-06-03 2005-06-13 Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung

Country Status (11)

Country Link
US (2) US7963678B2 (de)
EP (1) EP1895227B1 (de)
JP (1) JP5011494B2 (de)
KR (1) KR100998480B1 (de)
CN (1) CN100468795C (de)
AT (1) ATE458165T1 (de)
AU (1) AU2005332535B2 (de)
CA (1) CA2610220C (de)
DE (1) DE602005019480D1 (de)
PT (1) PT1895227E (de)
WO (1) WO2006128327A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100468795C (zh) * 2005-06-03 2009-03-11 新灯源科技有限公司 整合导热/散热模块的半导体发光装置
US7648257B2 (en) 2006-04-21 2010-01-19 Cree, Inc. Light emitting diode packages
US8258682B2 (en) 2007-02-12 2012-09-04 Cree, Inc. High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods
BRPI0721345A2 (pt) * 2007-03-01 2013-01-15 Jen Shyan Chen equipamento de iluminaÇço de diodo emissor de luz
CN101294698B (zh) * 2007-04-27 2010-06-02 新灯源科技有限公司 发光二极管照明装置
US7540761B2 (en) * 2007-05-01 2009-06-02 Tyco Electronics Corporation LED connector assembly with heat sink
WO2008137905A1 (en) * 2007-05-07 2008-11-13 Cree Led Lighting Solutions, Inc. Light fixtures and lighting devices
EP1995510A1 (de) * 2007-05-25 2008-11-26 Hong Kuan Technology Co., Ltd. LED lampe
JP5390781B2 (ja) * 2008-03-18 2014-01-15 古河電気工業株式会社 光源冷却装置
WO2009140141A1 (en) * 2008-05-13 2009-11-19 Express Imaging Systems, Llc Gas-discharge lamp replacement
US8567988B2 (en) * 2008-09-29 2013-10-29 Bridgelux, Inc. Efficient LED array
KR101098904B1 (ko) 2009-01-06 2011-12-27 네오벌브 테크놀러지스 인크 에너지 변환 장치 및 에너지 변환 장비
WO2010078691A1 (zh) * 2009-01-06 2010-07-15 Chen Jen-Shyan 能量转换装置及能量转换设备
US20100265708A1 (en) * 2009-04-17 2010-10-21 Kuo-Len Lin Heat-dissipating assembly of led lamp holder
KR20120032472A (ko) 2009-05-01 2012-04-05 익스프레스 이미징 시스템즈, 엘엘씨 수동 냉각을 구비한 가스-방전 램프 교체
US20110026264A1 (en) * 2009-07-29 2011-02-03 Reed William G Electrically isolated heat sink for solid-state light
CN101764190A (zh) 2010-01-01 2010-06-30 中山伟强科技有限公司 一种发光二极管的封装结构
CN102147055A (zh) * 2010-02-08 2011-08-10 新灯源科技有限公司 发光二极管灯源
EP2535641A1 (de) 2010-02-08 2012-12-19 NeoBulb Technologies, Inc. Led-lichtquelle
US9241401B2 (en) 2010-06-22 2016-01-19 Express Imaging Systems, Llc Solid state lighting device and method employing heat exchanger thermally coupled circuit board
TW201200793A (en) * 2010-06-29 2012-01-01 Foxsemicon Integrated Tech Inc Room illumination apparatus
EP2405194A1 (de) * 2010-07-05 2012-01-11 NeoBulb Technologies, Inc. Leuchtdiodenbeleuchtungsplattform
EP2803910B1 (de) * 2010-11-30 2017-06-28 LG Innotek Co., Ltd. Beleuchtungsvorrichtung
KR101713059B1 (ko) * 2011-01-25 2017-03-08 삼성전자 주식회사 발광소자 조명 장치
EP2532956B1 (de) * 2011-06-09 2015-03-04 Zhongshan Weiqiang Technology Co., Ltd LED-Beleuchtungssystem und Hochleistungs-LED-Lampe
US9357906B2 (en) 2014-04-16 2016-06-07 Engineered Medical Solutions Company LLC Surgical illumination devices and methods therefor
US9572230B2 (en) 2014-09-30 2017-02-14 Express Imaging Systems, Llc Centralized control of area lighting hours of illumination
WO2016064542A1 (en) 2014-10-24 2016-04-28 Express Imaging Systems, Llc Detection and correction of faulty photo controls in outdoor luminaires
CA159331S (en) * 2014-10-29 2015-11-05 Lee Siu Woo Recessed luminaire holder
CN105932146A (zh) * 2016-06-15 2016-09-07 青岛杰生电气有限公司 一种紫外发光器
US11375599B2 (en) 2017-04-03 2022-06-28 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10904992B2 (en) 2017-04-03 2021-01-26 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10164374B1 (en) 2017-10-31 2018-12-25 Express Imaging Systems, Llc Receptacle sockets for twist-lock connectors
US11092325B2 (en) * 2018-10-10 2021-08-17 Elumigen, Llc High intensity discharge light assembly

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689761A (en) * 1970-10-07 1972-09-05 Cyril Rosen Dental operating light
US4780799A (en) * 1986-10-23 1988-10-25 Lighting Technology, Inc. Heat-dissipating light fixture for use with tungsten-halogen lamps
US6254262B1 (en) * 1998-11-27 2001-07-03 Crunk Paul D Signaling lamp having led light array with removable plastic lens
US20050279949A1 (en) 1999-05-17 2005-12-22 Applera Corporation Temperature control for light-emitting diode stabilization
US6161910A (en) * 1999-12-14 2000-12-19 Aerospace Lighting Corporation LED reading light
US6465961B1 (en) 2001-08-24 2002-10-15 Cao Group, Inc. Semiconductor light source using a heat sink with a plurality of panels
US20040256630A1 (en) * 2001-08-24 2004-12-23 Densen Cao Illuminating light
US7083305B2 (en) 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
JP2003178602A (ja) * 2001-12-10 2003-06-27 Koito Mfg Co Ltd 照明装置
CN100468609C (zh) 2001-12-29 2009-03-11 杭州富阳新颖电子有限公司 超导热管灯
KR20050002904A (ko) * 2002-03-26 2005-01-10 엔피스 리미티드 냉각된 발광장치
US7093958B2 (en) * 2002-04-09 2006-08-22 Osram Sylvania Inc. LED light source assembly
US6715900B2 (en) * 2002-05-17 2004-04-06 A L Lightech, Inc. Light source arrangement
US7048412B2 (en) * 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
CN2564849Y (zh) 2002-08-21 2003-08-06 财团法人工业技术研究院 光电照明模块
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
US6640888B1 (en) * 2002-10-16 2003-11-04 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
JP2004296245A (ja) * 2003-03-26 2004-10-21 Matsushita Electric Works Ltd Ｌｅｄランプ
CN2644878Y (zh) 2003-08-14 2004-09-29 葛世潮 发光二极管灯
JP4236544B2 (ja) * 2003-09-12 2009-03-11 三洋電機株式会社 照明装置
JP2005093037A (ja) 2003-09-19 2005-04-07 Sharp Corp ピックアップ送り装置、ピックアップのトラバース装置、及びディスクドライブ装置
CN2677742Y (zh) 2004-01-13 2005-02-09 葛世潮 大功率发光二极管灯
CN2685703Y (zh) 2004-02-12 2005-03-16 安提亚科技股份有限公司 高功率发光二极管投射灯
TWI263008B (en) * 2004-06-30 2006-10-01 Ind Tech Res Inst LED lamp
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
US20060100496A1 (en) 2004-10-28 2006-05-11 Jerome Avron Device and method for in vivo illumination
US7331691B2 (en) 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means
CN100468795C (zh) * 2005-06-03 2009-03-11 新灯源科技有限公司 整合导热/散热模块的半导体发光装置
US7824075B2 (en) * 2006-06-08 2010-11-02 Lighting Science Group Corporation Method and apparatus for cooling a lightbulb

Also Published As

Publication number Publication date
EP1895227A4 (de) 2008-08-06
PT1895227E (pt) 2010-05-21
JP5011494B2 (ja) 2012-08-29
ATE458165T1 (de) 2010-03-15
US8267545B2 (en) 2012-09-18
AU2005332535B2 (en) 2011-09-15
AU2005332535A1 (en) 2006-12-07
CN100468795C (zh) 2009-03-11
EP1895227B1 (de) 2010-02-17
US20110228540A1 (en) 2011-09-22
KR20080020668A (ko) 2008-03-05
US7963678B2 (en) 2011-06-21
CA2610220C (en) 2010-05-04
CA2610220A1 (en) 2006-12-07
JP2008543063A (ja) 2008-11-27
WO2006128327A1 (fr) 2006-12-07
CN1874015A (zh) 2006-12-06
US20090225540A1 (en) 2009-09-10
EP1895227A1 (de) 2008-03-05
KR100998480B1 (ko) 2010-12-07

Similar Documents

Publication Publication Date Title
DE602005019480D1 (de) Mit einem wärmeleitenden/-abführenden modul versehene lichtemittierende halbleitervorrichtung
TWI458144B (zh) 分佈型發光二極體光源
CA2610026A1 (en) Light-emitting diode cluster lamp
JP2014007154A5 (de)
US20130307016A1 (en) Led module and lighting assembly
EP2787798A3 (de) Beleuchtungsvorrichtung
TWI613391B (zh) 發光二極體組件及應用此發光二極體組件的發光二極體燈泡
ITMI20121618A1 (it) Lampada a led.
KR20110060476A (ko) 발광다이오드 모듈
KR101077137B1 (ko) Ｌｅｄ 조명장치
WO2014064671A3 (en) A light bulb, a light bulb holder, and a combination of a light bulb and a light bulb holder
KR101276326B1 (ko) 비아홀을 갖는 인쇄회로기판, 이를 구비한 엘이디 모듈 및 led 조명장치
CN102980077A (zh) 一种管状结构led集成光源
KR101244854B1 (ko) Ｌｅｄ 전구에서 발생하는 열을 효율적으로 방출하기 위한 ｌｅｄ 전구 방열 조립체
KR101933046B1 (ko) 볼트리스 타입의 조명장치
US20150123559A1 (en) Optical semiconductor lighting apparatus
JP3168127U (ja) 光源装置
KR101289700B1 (ko) 독립형 발광다이오드 조명 모듈 및 이를 이용한 발광다이오드 가로등
KR200483284Y1 (ko) Led 직관등의 led 모듈 구조
US8333486B2 (en) Illumination device with heat dissipation structure
JP5107786B2 (ja) Ｌｅｄランプ
CN201206816Y (zh) 发光二极管灯具
JP2015173129A5 (de)
KR101537580B1 (ko) 시오비 방열장치 일체형 엘이디 조명 장치
KR20140063922A (ko) Ｌｅｄ 조명장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R082 Change of representative

Ref document number: 1895227

Country of ref document: EP

Representative=s name: JOCHEN MUELLER, 55411 BINGEN, DE