WO2010066410A1 - Procédé et outil pour la fabrication d'un composant électronique comportant un support recouvert de plastique par extrusion - Google Patents

Procédé et outil pour la fabrication d'un composant électronique comportant un support recouvert de plastique par extrusion Download PDF

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Publication number
WO2010066410A1
WO2010066410A1 PCT/EP2009/008787 EP2009008787W WO2010066410A1 WO 2010066410 A1 WO2010066410 A1 WO 2010066410A1 EP 2009008787 W EP2009008787 W EP 2009008787W WO 2010066410 A1 WO2010066410 A1 WO 2010066410A1
Authority
WO
WIPO (PCT)
Prior art keywords
tool
receptacle
carrier
fixing elements
fixing
Prior art date
Application number
PCT/EP2009/008787
Other languages
German (de)
English (en)
Inventor
Georg Mascha
Steffen Irtenkauf
Achim Haertel
Juergen Berger
Original Assignee
Trw Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trw Automotive Gmbh filed Critical Trw Automotive Gmbh
Publication of WO2010066410A1 publication Critical patent/WO2010066410A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B29C2045/1409—Positioning or centering articles in the mould using means being retractable during injection using control means for retraction of the centering means

Definitions

  • the invention relates to a method for producing an electronic component with a plastic-coated carrier.
  • the object of the invention is to simplify the production of a component with a plastic-coated carrier.
  • a carrier is inserted into a receptacle of a tool. Fixing elements provided in the tool are moved to a predetermined position, so that the carrier is in contact with the fixing elements.
  • the tool is closed. Liquid plastic is injected at a first predetermined pressure Tool introduced. At a predetermined degree of filling of the recording, the fixing elements are withdrawn. The space released by the fixing elements in the receptacle is filled with liquid plastic.
  • the carrier is surrounded in this process directly and completely by liquid plastic and also fixed by this plastic compound. A separate housing is no longer required.
  • the carrier Before filling the tool with liquid plastic, the carrier is held by the fixing in the receptacle so that it can be surrounded on all sides by liquid plastic, of course, except for the space occupied by the fixing.
  • the carrier does not touch the inner wall of the recording. It is irrelevant at what time before filling the fixing are driven into the receptacle.
  • the fixing elements are moved to their predetermined position and then the carrier is placed in the receptacle so that it is in its final position before the tool is closed.
  • fixing elements are provided in a multi-part tool in several tool parts, which are each movable.
  • a second predetermined pressure which is lower than the first one, is preferably used.
  • the filling of the receptacle advantageously takes place up to the predetermined degree of filling with normal injection pressure, while the conventional holding pressure phase is utilized in order to fill the space released by the fixing elements.
  • the retraction of the fixing is therefore preferably at the beginning or during the holding pressure phase. At this time, sufficient plasticization has already occurred to hold the carrier without its fixing elements at its predetermined carrier position in the receptacle.
  • the degree of filling of the recording, in which the fixing elements are withdrawn, for example, is about 95%.
  • the fixing elements can advantageously be moved hydraulically, as is also known from conventional slides or core pullers in injection molding tools. Another drive for the movement of the fixing is of course also conceivable.
  • the space released by the fixing elements is filled so that the component, when leaving the tool, has no opening extending from the outside to the support.
  • the plastic casing produced during encapsulation thus surrounds the carrier part completely in the area where the fixing elements had reached the carrier in order to fix it.
  • the carrier Before closing the tool, the carrier can be provided with contact pins. It is also possible to insert the contact pins separately in the tool and to connect before or during the injection molding process by pressure with the wearer.
  • one or more slides and / or core pullers may be inserted into the tool to define a plug receptacle. In this way it is possible to create an arbitrarily coded plug receptacle at the same time during the wrapping of the carrier.
  • the contact pins in the finished component preferably protrude into the plug receptacle and permit electrical contacting of the carrier or the electronic components arranged on it.
  • the component is, for example, a sensor, such as an acceleration sensor or crash sensor, as may be provided in a vehicle.
  • a sensor such as an acceleration sensor or crash sensor
  • the procedure is also suitable for any other carrier with electronic components arranged thereon.
  • the electronic components may preferably comprise one or more A-SICs, as well as various other components, including sensor elements.
  • the invention also relates to a tool for producing an electronic component with a plastic-coated carrier, with two tool parts, in which a receptacle for the carrier is formed in the assembled state, and at least one movably arranged fixing element, which in a fixing position up to a carrier position in the Inner of the receptacle protrudes, and is arranged in a retracted position so that there is a distance between the fixing element and the carrier position.
  • carrier position here is to be understood as meaning the position and the space occupied by a carrier inserted into the receptacle, wherein, as in the previously described method, the carrier is already equipped with all the electronic components required for the component.
  • a carrier in such a tool, can be overmolded with plastic in such a way that it is completely sealed off from the environment to the outside.
  • the fixing element is designed in the form of a pin.
  • other forms of fixation elements can also be used.
  • At least one fixing element is arranged in each tool part in order to be able to achieve a more accurate positioning and fixing of the support.
  • the fixing elements lie opposite one another in the respective tool parts, so that a particularly uniform loading of the carrier takes place during its fixing.
  • each tool part a plurality of fixing elements may be provided.
  • a structure is preferably formed, which can engage in a complementary structure on the carrier in order to securely fix the carrier during the injection phase.
  • the tool is preferably designed so that the receptacle between the carrier and an inner wall of the receptacle can be completely filled with liquid plastic when the fixing element is in the retracted position.
  • FIG. 1 is a schematic partially sectioned view of a tool according to the invention for carrying out the method according to the invention, wherein in Figure 1, a first tool part and in Figure 2, a second tool part of the tool is shown;
  • FIG. 4 shows a component which can be produced in a tool according to the invention according to a method of the invention.
  • FIGS. 1 to 3 show a tool for producing an electronic component with a plastic-encased carrier, wherein FIG. 1 shows a first, here upper tool part 10 and in FIG. 2 a second, here lower tool part 12.
  • FIG. 4 shows an example of a component 100 with a plastic-encapsulated component
  • the component 100 is a sensor with a plastic sheath 102 and a carrier 104 embedded in the plastic sheath 102.
  • the carrier 104 comprises in this case a punched grid and one or more ASIC chips mounted thereon and other electronic components and sensor components, such as resistors. All necessary electronic see components are arranged directly on the stamped grid or directly connected to this (not shown here).
  • Two contact pins 106 are fixedly connected to the carrier 104 and are from this. They provide the electrical contact for the components on the support 104.
  • the plastic covering 102 simultaneously forms the outer surface of the component.
  • the plastic sheath 102 also encloses a connector receptacle 108 into which the contact pins 106 protrude. Between the plug receptacle 108 and the region in which the support 104 is arranged, the plastic covering 102 is formed such that it tightly encloses the contact pins 106.
  • the plug receptacle 108 has a predetermined coding to ensure that only the correct, associated plug and this can only be inserted in the correct position.
  • the carrier 104 is enveloped on all sides by the plastic material of the plastic sheath 102 and sealed off from the environment.
  • a fastening nut 110 is provided, which is provided on the plug receptacle 108 opposite axial end of the sensor.
  • the fastening nut 110 is embedded in the plastic sheath 102.
  • the tool has two tool parts 10, 12, which can be assembled and separated from each other and forms an injection mold, which can be used for a conventional plastic injection molding process.
  • the tool parts 10 and 12 form in the assembled state
  • a carrier 104 is inserted in the open state of the tool, in this case in the lower tool part 12th
  • the carrier 104 in this example is a printed circuit board equipped with electronic components.
  • 100 a punched grid equipped with ASICs, for example, or another suitable carrier with suitable electronic components can be used.
  • the carrier has for example a dimension of about 25 x 22 mm.
  • the carrier 104 is held at a distance from the inner walls 16 of the receptacle 14 in the receptacle 14, namely, by a plurality of fixing elements 18, here in pin form, are provided in two tool parts 10, 12, which initially protrude into the receptacle 14.
  • Each of the fixing elements 18 has an end 20 which engages in a complementary structure 22 on the carrier 104.
  • the end 20 is formed by a, with a shoulder offset from the rest of the fixing element 18, tapered tip, while the structure 22 is realized by a through opening in the carrier 104.
  • the tip has a smaller diameter than the opening, while the fixing element 18 at the shoulder has a larger diameter than the opening.
  • the carrier 104 rests on the shoulder of the fixing element 18 of the lower tool part 10 and is determined and fixed in its vertical position, while it is determined and fixed in its horizontal position by the ends 20 of the respective fixing element 18.
  • the fixing elements 18 are arranged to be movable and are moved linearly by means of a hydraulic system (not shown). In a first, advanced position, the ends 20 protrude a bit into the receptacle 14. In a second, retracted position, the fixing elements 18 are retracted so far that their ends 20 terminate at least substantially flush with the inner wall 16 of the receptacle 14.
  • the fixing elements 18 of the lower tool part 12 are moved into the receptacle 14 before the insertion of the carrier 104 and the carrier 104 is then placed on the fixing elements 18 such that the ends 20 engage in the structures 22. In this way, a predetermined carrier position of the carrier 104 is fixed.
  • the fixing elements 18 at this time form the only contact points of the carrier 104, so that the carrier 104 has no contact with the inner walls 16 of the receptacle 14.
  • the carrier 104 two electrical contact pins 106 are attached in this example, before the carrier 104 is inserted into the receptacle 14.
  • the connection between the carrier 104 and the contact pins 106 could also occur shortly before the injection molding, for example during insertion into the receptacle 14 or only during the injection molding process.
  • the contact pins 106 protrude into a region of the tool that later defines a connector receptacle 108.
  • a slider 24 is provided, which is pushed in a known manner on the contact pins 106 to keep the space for the connector receptacle 108 free.
  • the slider 24 is designed such that it predetermines a predetermined connector coding in order to prevent reverse polarity of a connector which is intended to contact the contact pins 106.
  • the fastening nut 110 is also inserted at a designated location, so that it is also simultaneously embedded in the plastic sheath 102 during the injection molding process.
  • the fixing elements 18 in the upper tool part 10 are either already extended to their first, advanced position or are extended after placing the tool part 10 so that they also come into contact with the carrier 104. In the embodiment shown here, the fixing elements 18 are in the upper
  • Tool part 10 identical to those formed in the lower tool part 12.
  • liquid plastic is injected at a predetermined first pressure in the tool.
  • the injection takes place here with the usual injection pressure, which builds up a conventional injection molding machine.
  • a large part of the intended plastic material is introduced into the receptacle 14.
  • Injection phase and the holding pressure phase is initiated, as is known from conventional plastic injection molding processes.
  • This is the pressure on a is reduced to a predetermined second value, which in this example corresponds to the conventionally used value for the reprint.
  • this second pressure during the emphasis phase is still high enough to squeeze more material into the receptacle 14.
  • the fixing elements 18 are retracted to their second position so that they lose their contact with the carrier 104 and a gap between the carrier 104 and the wall of the receptacle 14 or The ends 20 of the fixing elements 18 is free.
  • the plastic mass in the receptacle 14, which surrounds the carrier 104, is already solidified at this time to the extent that the position of the carrier 104 is no longer changed when the fixing elements 18 are retracted. However, part of the mass is still flowable enough so that the volumes released by the fixing elements 18 fill up substantially or completely with liquid plastic.
  • a plastic sheath 102 is formed, which completely surrounds the carrier 104 on all sides. In particular, no openings remain which extend from the outer surface of the plastic envelope 102 inwardly to the carrier 104. Also in the areas where originally the fixing elements 18 have attacked the carrier 104, the plastic sheath 102 is completely closed after completion of the process.
  • the slide 24 is retracted after connection to the required cooling time when the tool is opened, and then the finished component is removed. In only a single step, both the complete embedding of the carrier 104 in the plastic sheath 102, which completely surrounds the carrier 104, as well as the formation of the plug receptacle 108.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un composant comportant un support recouvert de plastique par extrusion. Le procédé comprend les étapes suivantes : un support (104) est déposé dans le logement (14) d'un outil ; les éléments de fixation (18) prévus dans l'outil sont amenés dans une position prédéterminée de telle sorte que le support (104) soit en contact avec les éléments de fixation (18) ; l'outil est fermé ; du plastique liquide est introduit dans l'outil à une première pression prédéterminée ; les éléments de fixation (18) sont retirés lorsqu'un degré prédéterminé de remplissage du logement (14) est atteint et l'espace libéré par les éléments de fixation (18) dans le logement (14) est rempli de plastique liquide.
PCT/EP2009/008787 2008-12-11 2009-12-09 Procédé et outil pour la fabrication d'un composant électronique comportant un support recouvert de plastique par extrusion WO2010066410A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810061617 DE102008061617A1 (de) 2008-12-11 2008-12-11 Verfahren und Werkzeug zur Herstellung eines elektronischen Bauteils mit einem kunststoffumspritzten Träger
DE102008061617.6 2008-12-11

Publications (1)

Publication Number Publication Date
WO2010066410A1 true WO2010066410A1 (fr) 2010-06-17

Family

ID=41651481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/008787 WO2010066410A1 (fr) 2008-12-11 2009-12-09 Procédé et outil pour la fabrication d'un composant électronique comportant un support recouvert de plastique par extrusion

Country Status (2)

Country Link
DE (1) DE102008061617A1 (fr)
WO (1) WO2010066410A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113858555A (zh) * 2021-09-17 2021-12-31 深圳市创益通技术股份有限公司 塑胶制件侧面内抽芯装置及方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009049724A1 (de) * 2009-10-17 2011-04-28 Kmi-Holding Gmbh Steckverbindervorrichtung und Verfahren zur Herstellung derselben
DE102017219891A1 (de) * 2017-11-09 2019-05-09 Robert Bosch Gmbh Umspritzverfahren für eine Sensoreinheit
JP6881354B2 (ja) * 2018-03-07 2021-06-02 オムロン株式会社 検査ユニットおよび検査装置

Citations (7)

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DE19609253A1 (de) * 1996-02-28 1997-09-04 Martin Quarder Verfahren zum Spritzgießen von Kunststoffteilen mit eingespritzten elektr. Leitern
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink
US6131267A (en) * 1995-10-13 2000-10-17 Bently Nevada Corporation Method of manufacture of an encapsulated transducer
US6309579B1 (en) * 1995-05-19 2001-10-30 Nippondenso Co., Ltd. Method for forming a casting which includes an insert
DE10155537A1 (de) * 2001-01-05 2002-11-28 Continental Teves Ag & Co Ohg Verfahren zur Herstellung von Kraftfahrzeugsensoren
US20070187869A1 (en) * 2006-02-15 2007-08-16 Siemens Vdo Automotive Corporation Single mold active speed sensor
WO2008141218A2 (fr) * 2007-05-11 2008-11-20 Shiloh Industries, Inc. Composant composite et procédé pour sa fabrication

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US3081497A (en) * 1960-05-06 1963-03-19 Ralph M Hill Method for molding objects with inserts
DE1988383U (de) * 1968-02-20 1968-06-27 Gerhard Wittgens Spritz- oder pressform zur herstellung von kunststoffgegenstaenden mit eingeformter mutter.
DE3931358A1 (de) * 1989-09-20 1991-03-28 Rudolf Koose Kunststoffkasten, insbesondere flaschenkasten
DE10326794B4 (de) * 2002-06-26 2012-07-26 Eichsfelder Schraubenwerk Gmbh Verfahren zum Umspritzen eines Formteiles
DE102005040404A1 (de) * 2005-08-26 2007-03-01 Volkswagen Ag Verfahren zur Herstellung eines verstärkten Bauteils für Kraftfahrzeuge sowie Vorrichtung zur Durchführung des Verfahrens

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink
US6309579B1 (en) * 1995-05-19 2001-10-30 Nippondenso Co., Ltd. Method for forming a casting which includes an insert
US6131267A (en) * 1995-10-13 2000-10-17 Bently Nevada Corporation Method of manufacture of an encapsulated transducer
DE19609253A1 (de) * 1996-02-28 1997-09-04 Martin Quarder Verfahren zum Spritzgießen von Kunststoffteilen mit eingespritzten elektr. Leitern
DE10155537A1 (de) * 2001-01-05 2002-11-28 Continental Teves Ag & Co Ohg Verfahren zur Herstellung von Kraftfahrzeugsensoren
US20070187869A1 (en) * 2006-02-15 2007-08-16 Siemens Vdo Automotive Corporation Single mold active speed sensor
WO2008141218A2 (fr) * 2007-05-11 2008-11-20 Shiloh Industries, Inc. Composant composite et procédé pour sa fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113858555A (zh) * 2021-09-17 2021-12-31 深圳市创益通技术股份有限公司 塑胶制件侧面内抽芯装置及方法
CN113858555B (zh) * 2021-09-17 2023-09-08 深圳市创益通技术股份有限公司 塑胶制件侧面内抽芯装置及方法

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