WO2010061582A1 - 回路モジュールの基板及びその製造方法 - Google Patents
回路モジュールの基板及びその製造方法 Download PDFInfo
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- WO2010061582A1 WO2010061582A1 PCT/JP2009/006329 JP2009006329W WO2010061582A1 WO 2010061582 A1 WO2010061582 A1 WO 2010061582A1 JP 2009006329 W JP2009006329 W JP 2009006329W WO 2010061582 A1 WO2010061582 A1 WO 2010061582A1
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- dielectric layer
- coaxial connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Definitions
- the present invention relates to a circuit module substrate having a coaxial connector and a manufacturing method thereof, and more particularly to a connection structure between a substrate on which a transmission line is formed and a coaxial connector.
- the present application claims priority based on Japanese Patent Application No. 2008-3000027 filed in Japan on November 26, 2008 and Japanese Patent Application No. 2009-115879 filed on May 12, 2009 in Japan. , The contents of which are incorporated herein.
- Various functional circuits for example, an amplifier circuit, a multiplexing circuit, and a separation circuit
- IC integrated circuit
- IC module or circuit module
- a coaxial connector is used as an input / output terminal for a high-frequency signal of the circuit module.
- BGA Ball Grid Array
- the coaxial connector is connected to the wiring pattern on the printed circuit board.
- Patent Document 1 discloses a “circuit module having a coaxial connector” and has a connection structure between a high-frequency transmission line and a coaxial connector as shown in FIGS. 71 and 72.
- 71 is a perspective view showing the structure of the circuit module
- FIG. 72 is a cross-sectional view taken along the line BB parallel to the transmission signal.
- connection structure includes a dielectric 90, a coaxial connector composed of an inner conductor core wire 80 and an outer conductor (module base) 70, and a multilayer circuit board 40 having a signal line 10 corresponding to a coplanar line as a surface layer pattern. It consists of.
- a multilayer circuit board 40 shown in FIG. 72 has three or more layers in which a ground 20 (first layer) and a ground 50 (second layer) are connected to both sides of a coplanar line by conductors 21 such as plating on the end face of the board. It is a circuit board.
- the distance 20a between the grounds 20 constituting the coplanar line is made shorter than the diameter 70a of the derivative 90 constituting the coaxial connector.
- the grounds 20 and 50 constituting the coplanar line are connected by the conductor 21 at the end face of the substrate, and the ground 20 and the outer conductor 70 of the coaxial connector are electrically connected by the solder 23. This reduces the impedance between the outer conductor (or ground) 70 of the coaxial connector and the ground 20 of the coplanar line, thereby improving the reflection characteristics.
- Patent Document 2 discloses a “high-frequency connector with flange” and has a connection structure between a high-frequency transmission line and a coaxial connector as shown in FIG.
- FIG. 73 is a perspective view.
- the connection structure between the high-frequency transmission line and the coaxial connector includes a coaxial connector including a core wire 80 and an outer conductor 70 which are inner conductors, and a coplanar line having a signal line 10 and grounds 20 on both sides thereof.
- the outer conductor grounding reinforcement pin 70f integrated with the outer conductor 70 together with the core wire 80 as the inner conductor is contact-connected to the signal line 10 and the ground 20 constituting the coplanar line.
- Patent Document 1 has the following problems. Since the ground 20 of the coplanar line and the outer conductor 70 of the coaxial connector are electrically connected by the solder 70, the second layer constituting the coplanar line with the outer conductor 70 of the coaxial connector below the core wire 80 of the coaxial connector. A gap (or a gap) corresponding to the thickness to which the solder 23 is applied may be formed between the ground 50 of the eyes.
- the outer conductor 70 of the coaxial connector is located below the core wire 80 of the coaxial connector. It is difficult to completely eliminate the gap between the ground and the ground layer 50 of the second layer of the coplanar line and eliminate the electrical contact between them.
- the electrical connection between the ground 20 and the outer conductor 70 of the coaxial connector is ensured, and even if the ground 20 and the outer conductor 70 of the coaxial connector are as close as possible, the outer conductor 70 of the coaxial connector and the ground of the coplanar line 50, it is difficult to reduce the gap dimension in the direction perpendicular to the signal transmission direction.
- the transmission signal becomes higher in frequency, a part of the transmission signal component is radiated from the gap between the outer conductor 70 and the ground 50 below the core wire 80 of the coaxial connector, and the insertion loss increases.
- Patent Document 2 has the following problems. Since the coplanar line and the coaxial connector are in contact connection only from above, the second-layer (or inner-layer) conductor (the inner layer) constituting the coplanar line with the outer conductor 70 of the coaxial connector below the core wire 80 of the coaxial connector. It is difficult to electrically connect (not shown in FIG. 73, corresponding to the ground 50 in FIG. 72). Even if the gap between the outer conductor 70 of the coaxial connector and the second layer conductor of the coplanar line is completely eliminated to establish electrical contact between the two, due to mechanical stress or thermal stress, both electrical It is difficult to maintain contact.
- the outer conductor 70 of the coaxial connector In the gap between the conductors of the coplanar line, it is difficult to reduce the gap dimension in the direction perpendicular to the signal transmission direction. As the transmission signal becomes higher in frequency, a part of the transmission signal is radiated from the gap between the outer conductor 70 and the conductor below the core wire 80 which is the inner conductor of the coaxial connector, and the insertion loss increases.
- An object of the present invention is to provide a circuit module substrate that solves the above-described problems and prevents an increase in insertion loss due to electromagnetic radiation, and a manufacturing method thereof. That is, the first purpose is to prevent an increase in insertion loss due to electromagnetic radiation in a high frequency range, and the second purpose is to prevent an increase in insertion loss due to reflection.
- the present invention relates to a high-frequency substrate having a coplanar line and connected to a coaxial connector.
- the coplanar line is formed on the surface of the first dielectric layer and the first dielectric layer, and the inner conductor of the coaxial connector.
- a signal line connected to each other, a first ground formed with a gap from the signal line in regions on both sides of the signal line, and a second ground formed on the back surface of the first dielectric layer Including.
- the second dielectric layer is laminated on the first dielectric layer so as to sandwich the second ground, and the second ground is exposed in a predetermined region of the first dielectric layer. The exposed portion of the ground is connected to the outer conductor of the coaxial connector.
- the present invention also relates to a high-frequency module including a high-frequency substrate on which a coplanar line connected to a coaxial connector is formed.
- the coplanar line is formed on the surface of the first dielectric layer and the first dielectric layer.
- a second ground is laminated on the first dielectric layer so as to sandwich the second ground, and the second ground is exposed in a predetermined region of the first dielectric layer. The exposed portion of the ground is connected to the outer conductor of the coaxial connector.
- the present invention relates to a method for manufacturing a high-frequency substrate including a coplanar line connected to a coaxial connector.
- the second conductor layer, the first dielectric layer, and the first dielectric layer are formed on the second dielectric layer.
- the first conductor layer and the first dielectric layer are selectively removed to expose a predetermined region of the second conductor layer, and the first conductor layer is selectively removed.
- forming a signal line connected to the inner conductor of the coaxial connector on the first dielectric layer and providing a gap from the signal line in a region on both sides of the signal line on the end face to which the coaxial connector is connected.
- a coplanar line including a signal line, a ground, and a second dielectric layer is formed.
- a second conductor layer, a first dielectric layer, and a first conductor layer are sequentially stacked on the second dielectric layer. Then, the second dielectric layer is selectively removed to expose the second conductor layer in the regions on both sides of the signal line at the end face to which the coaxial connector is connected, and the first conductor layer is selectively removed.
- the exposed portion of the lower ground of the coplanar line and the outer conductor of the coaxial connector are securely connected by the conductive member. Therefore, it is possible to suppress electromagnetic wave radiation of the frequency component of the transmission signal from the gap surrounded by the outer conductor, the lower layer ground, and the conductive member. In addition, since electromagnetic radiation in a desired band can be suppressed from the gap between the outer conductor and the lower ground, insertion loss due to electromagnetic radiation can be reduced.
- a conductive member that electrically connects the exposed portion of the lower ground of the coplanar line and the outer conductor of the coaxial connector is continuously formed upward from the extension line of the lower ground at the contact portion with the outer conductor, and The height is equal to or higher than the center position of the core wire of the coaxial connector.
- FIG. 2 is a cross-sectional view taken along arrow XX in FIG. 1.
- 1 is a top view of a high-frequency module and a substrate according to Embodiment 1 of the present invention.
- FIG. 4 is a cross-sectional view taken along line XX in FIG. 3.
- FIG. 4 is a cross-sectional view taken along line YY in FIG. 3.
- FIG. 4 is a sectional view taken along the line ZZ in FIG. 3.
- FIG. 6 is a side view for explaining the method for manufacturing the high-frequency substrate according to the first embodiment.
- FIG. 10 is a cross-sectional view taken along line YY in FIG. 9.
- FIG. 10 is a sectional view taken along the line ZZ in FIG. 9.
- FIG. 6 is a rear view of the high frequency module and the substrate according to the second embodiment.
- FIG. 10 is a side view for explaining the method for manufacturing the high-frequency substrate according to the second embodiment.
- FIG. 17 is a cross-sectional view taken along the line XX in FIG. 16.
- FIG. 17 is a cross-sectional view taken along the line XX in FIG. 16.
- FIG. 17 is a cross-sectional view taken along line YY in FIG. 16.
- FIG. 17 is a cross-sectional view taken along the line ZZ in FIG. 16.
- FIG. 22 is a cross-sectional view taken along the line XX of FIG.
- FIG. 22 is a cross-sectional view taken along line YY in FIG. 21.
- FIG. 22 is a cross-sectional view taken along the line ZZ in FIG. 21.
- FIG. 6 is a back view of the high frequency module and the substrate according to the fourth embodiment.
- FIG. 28 is a cross-sectional view taken along arrow AA in FIG. 27.
- FIG. 28 is a cross-sectional view taken along line BB in FIG. 27.
- FIG. 28 is a cross-sectional view taken along the line DD in FIG. 27, and the conductive member has a rectangular shape.
- FIG. 28 is a cross-sectional view taken along the line DD in FIG. 27, and the conductive member has a triangular shape.
- FIG. 36 is a cross-sectional view taken along the line AA in FIG.
- FIG. 36 is a sectional view taken along the line BB in FIG.
- FIG. 36 is a sectional view taken along the line CC of FIG.
- FIG. 36 is a sectional view taken along the line DD of FIG.
- FIG. 42 is a sectional view taken along the line BB in FIG. 41.
- FIG. 42 is a sectional view taken along the line DD of FIG. 41.
- FIG. 10 is a top view of a substrate according to Example 7. AA sectional view of FIG. FIG.
- Example 46 is a sectional view taken along line BB in FIG. 45.
- FIG. 46 is a sectional view taken along the line CC of FIG.
- FIG. 46 is a DD sectional view of FIG. 45.
- FIG. 46 is a DD sectional view of FIG. 45.
- the top view which shows an example of the ground shown in FIG.
- the top view which shows the modification of the ground
- FIG. 10 is a top view of a substrate according to an eighth embodiment.
- FIG. 64 is a cross-sectional view taken along arrows AA in FIGS. 57 and 63;
- FIG. 64 is a cross-sectional view taken along the line BB in FIGS. 57 and 63;
- FIG. 58 is a sectional view taken along the line CC of FIG.
- FIG. 58 is a sectional view taken along the line DD of FIG.
- FIG. 64 is a cross-sectional view taken along the line CC of FIG. 63.
- FIG. 64 is a cross-sectional view taken along the line DD in FIG. 63.
- FIG. 59 is a top view showing an example of the ground shown in FIG. 58.
- FIG. 59 is a top view showing a modification of the ground shown in FIG. 58.
- FIG. 59 is a top view showing a modification of the ground shown in FIG. 58.
- FIG. 72 is a sectional view taken along arrow BB in FIG. 71.
- FIGS. 1 is a top view of the circuit module
- FIG. 2 is a cross-sectional view taken along the line XX of FIG.
- the same components as those shown in FIGS. 71 and 72 are denoted by the same reference numerals.
- a multilayer circuit board 40 shown in FIGS. 1 and 2 includes a first dielectric layer 40a and a signal line 10 connected to a coaxial connector core wire 80 formed on the surface of the first dielectric layer 40a.
- the second ground 50 is exposed from the regions on both sides of the line 10, and the exposed portion is connected to the outer conductor 70 of the coaxial connector.
- the second ground 50 constituting the coplanar line since the second ground 50 constituting the coplanar line is exposed, it is easy to visually recognize the electrical connection state between the exposed portion and the outer conductor 70 of the coaxial connector. Both can be reliably connected. Even if the gap 100 is generated between the second ground 50 and the outer conductor 70 below the core wire 80 of the coaxial connector, the gap in the direction perpendicular to the signal transmission direction (that is, the direction parallel to the XX line) Since the length of 100 can be easily limited, electromagnetic radiation can be suppressed, and an increase in insertion loss due to electromagnetic radiation can be prevented.
- FIGS. 3 is a top view of the high-frequency module
- FIG. 4 is a cross-sectional view taken along the line XX of FIG. 3
- FIG. 5 is a cross-sectional view taken along the line YY of FIG. It is.
- the same components as those shown in FIGS. 71 and 72 are denoted by the same reference numerals.
- the high frequency module according to the first embodiment includes a high frequency substrate 40 having dielectric layers 40a and 40b.
- a coplanar line is formed on the upper surface of the high-frequency substrate 40.
- the coplanar line includes a signal line 10 and a ground 20 (or planar ground) formed on the same layer as the signal line 10 with the signal line 10 interposed therebetween.
- a planar ground 50 is formed inside the high-frequency substrate 40 as a lower-layer ground of the coplanar line.
- the ground 20 of the coplanar line and the ground 50, which is the lower ground of the coplanar line, are connected to each other by a plurality of conductive vias 30 arranged at predetermined intervals along the signal transmission direction of the coplanar line.
- the coaxial connector in the high-frequency module includes an outer conductor 70, a core wire 80 that is an inner conductor, and a dielectric 90.
- the core wire 80 and the signal line 10 are electrically connected by a conductive member 81 such as solder or a conductive adhesive.
- the outer conductor 70 and the ground 20 are electrically connected by a conductive member 71 such as solder or a conductive adhesive.
- the ground 20 is electrically connected by a conductive member 71 and a pair of protruding portions protruding so as to sandwich the core wire 80 from the end face of the outer conductor 70 from which the core wire 80 extends.
- the ground 50 (that is, the lower layer ground) of the coplanar line is exposed from regions on both sides of the surface of the high-frequency substrate 40 where the signal line 10 is sandwiched at the end where the coaxial connector is connected.
- the exposed portion of the ground 50 is securely connected to the outer conductor 70 of the coaxial connector by conductive members 60a and 60b such as solder or conductive adhesive.
- the condition 1 is set so that the shortest distance dx [ ⁇ m] is less than a half wavelength of the maximum frequency of the transmission signal.
- the shortest distance dx [ ⁇ m] is set to be less than a half wavelength of the maximum frequency of the transmission signal. It is preferable to satisfy Condition 2 (Formula 2).
- the maximum frequency of the transmission signal is f [GHz]
- the wavelength of the maximum frequency in consideration of the wavelength shortening rate by the dielectric layer 40b is
- the wavelength of the maximum frequency in consideration of the wavelength shortening rate by the dielectric layer 40a is ⁇ a [ ⁇ m].
- the ground 50 and the outer conductor 70 of the coaxial connector are electrically connected by the conductive members 60a and 60b, and dx, ⁇ a, and ⁇ b are set so as to satisfy the formulas 1 and 2, whereby the ground 50, the frequency component of the transmission signal leaking from the gap 100 between the outer conductor 70 and the outer conductor 70 to the dielectric layer 40b can be suppressed.
- the shortest distance dy between the conductive members 60a and 60b at the intersection of the extension line of the ground 50 in the signal transmission direction and the outer conductor 70 of the coaxial connector is equal to or shorter than the shortest distance dx.
- the ground 50 of the coplanar line is formed from the regions on both sides of the signal line 10 at the end of the surface of the high frequency substrate 40 to which the coaxial connector is connected.
- the outer conductor 70 of the coaxial connector and the exposed portion of the ground 50 are securely connected by the conductive members 60a and 60b. Therefore, even if a gap 100 is generated between the ground 50 and the outer conductor 70 due to a manufacturing error or the like, the shortest distance between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 so as to satisfy the expressions 1 and 2.
- the distance dx By setting the distance dx, the relative dielectric constant ⁇ a of the dielectric layer 40a, and the relative dielectric constant ⁇ b of the dielectric layer 40b, it is possible to suppress the frequency component of the transmission signal leaking from the gap 100. Insertion loss due to electromagnetic radiation can be reduced.
- the above effect can be obtained as long as the outer conductor 70 of the coaxial connector and the exposed portion of the ground 50 are electrically connected, and the shape of the exposed portion of the ground 50 is arbitrary. Further, the end face of the high-frequency substrate 40 from which the ground 50 is exposed may or may not be plated. Furthermore, the exposed portion of the ground 50 and the planar ground 20 may or may not be electrically connected at the end face of the high-frequency substrate 40.
- FIGS. 7A to 7D are side views of the high-frequency substrate 40 viewed from the side connected to the coaxial connector.
- FIG. 7A a conductor layer (or second conductor layer) corresponding to the ground 50, a dielectric layer 40a, and a conductor layer 45 (or first conductor layer) are sequentially stacked on the dielectric layer 40b. Is done.
- FIG. 7B The ground 50 is exposed in the regions on both sides of the signal line 10 shown in FIG. 3 by selectively removing the conductor layer 45 and the dielectric layer 40a using a laser or a drill.
- FIG. 7C The signal line 10 and the ground 20 are formed on the dielectric layer 40a by selectively removing the conductor layer 45.
- FIG. 7D A coaxial connector is soldered to the high-frequency substrate 40 thus manufactured.
- soldering area of the ground 50 is indicated by hatching, this is an example, and the soldering area may be soldered to another area of the ground 50, and a gap 100 (see FIG. 3) is provided below the signal line 10. This may occur and soldering may not be performed in the corresponding area.
- the process of FIG. 7B for exposing the ground 50 and the process of FIG. 7C for forming the surface pattern of the high-frequency substrate 40 can be performed in any order.
- the high-frequency substrate 40 is made of a resin that forms a dielectric layer 40 a with a relative dielectric constant of 3.35 located above the ground 50 and a dielectric layer 40 b with a relative dielectric constant of 4.85 located immediately below the ground 50. It is a multilayer wiring board.
- the thickness of the dielectric layer 40a is 135 [ ⁇ m]
- the width of the signal line 10 is 300 [ ⁇ m]
- the distance between the signal line 10 and the ground 20 is 990 [ ⁇ m]
- the diameter of the conductive via 30 is 50 [ ⁇ m].
- the interval along the signal transmission direction of the plurality of conductive vias 30 is 800 [ ⁇ m].
- the signal line 10 and the ground 20 each have a thickness of 15 [ ⁇ m]
- the ground 50 has a thickness of 35 [ ⁇ m].
- the diameter of the dielectric connector 90 having a relative dielectric constant of 3.3 of the coaxial connector is 1397 [ ⁇ m]
- the diameter of the core wire 80 as the inner conductor is 300 [ ⁇ m].
- the exposed portion of the ground 50 has a semicircular shape with a curvature radius of 400 [ ⁇ m]
- the shortest distance dx between the exposed portions of the ground 50 on the end surface of the high-frequency substrate 40 is 1840 [ ⁇ m].
- a gap is generated between the outer conductor 70 of the coaxial connector and the ground 50, and the distance between the outer conductor 70 and the ground 50 is 100 ⁇ m, and the exposed portion of the ground 50 and the outer conductor 70 are Electrically connected.
- the shortest distance dx between the exposed portion of the ground 50 on the end surface of the high-frequency substrate 40 and the comparative example in which the ground 50 has no exposed portion and the ground 50 and the outer conductor 70 of the coaxial connector are not connected are defined as 1840 [ ⁇ m].
- the high frequency module according to Example 1 in which the outer conductor 70 of the coaxial connector and the exposed portion of the ground 50 are electrically connected is analyzed under the above numerical conditions, and the insertion loss (
- the band where the insertion loss is less than 2 dB it is 0 to 37 GHz in the first embodiment of the present invention compared to 0 to 27 GHz in the comparative example, and the band improvement of about 10 GHz is improved. Proven.
- FIGS. 9 is a top view of the high-frequency module
- FIG. 10 is a cross-sectional view taken along the line XX of FIG. 9
- FIG. 11 is a cross-sectional view taken along the line YY of FIG.
- FIG. 13 is a back view of the high-frequency module.
- the same components as those shown in FIGS. 71 and 72 are denoted by the same reference numerals.
- the coplanar line formed on the upper surface of the high-frequency substrate 40 of the high-frequency module according to the second embodiment includes the signal line 10 and the ground 20 formed by sandwiching the signal line 10 and the same layer.
- a planar ground 50 is formed inside the high-frequency substrate 40 as a lower-layer ground of the coplanar line.
- the grounds 20 and 50 are connected to each other by a plurality of conductive vias 30 arranged at a predetermined interval along the signal transmission direction of the coplanar line.
- the coaxial connector of the high-frequency module includes an outer conductor 70, a core wire 80 that is an inner conductor, and a dielectric 90.
- the signal line 10 and the core wire 80 are electrically connected by a conductive member 81 such as solder or a conductive adhesive.
- the ground 20 and the outer conductor 70 are also electrically connected by a conductive member 71 such as solder or a conductive adhesive.
- the configuration of the above-described second embodiment is the same as that of the first embodiment, but in the second embodiment, the following changes are made to the first embodiment. That is, the ground 50 of the coplanar line is exposed in the regions on both sides of the signal line 10 between the front and back surfaces of the high-frequency substrate 40 on which the signal line 10 is formed, to which the coaxial connector is connected. .
- the exposed portion of the ground 50 is reliably connected to the outer conductor 70 by conductive members 61a and 61b such as solder or conductive adhesive.
- the shortest distance dx between the exposed portions of the ground 50 is set to a suitable value according to the maximum frequency of the transmission signal in the desired band at the end face to which the coaxial connector of the high-frequency board 40 is connected. That is, it is preferable to limit the shortest distance dx between the exposed portions of the ground 50 to less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate. Thereby, electromagnetic radiation due to half-wave resonance between the exposed portions of the ground 50 can be suppressed.
- the shortest distance dx is less than a half wavelength of the maximum frequency of the transmission signal, and the ground 50
- the shortest distance dx is less than a half wavelength of the maximum frequency of the transmission signal.
- the ground 50 and the outer conductor 70 are electrically connected by the conductive members 61a and 61b, and dx, ⁇ a, and ⁇ b are set so as to satisfy Equations 1 and 2, whereby the ground 50 The frequency component of the transmission signal leaking into the dielectric layer 40b from the gap 100 between the outer conductor 70 and the outer conductor 70 can be suppressed.
- the shortest distance dy between the conductive members 61a and 61b is equal to or less than the shortest distance dx in the intersection line between the extension line in the signal transmission direction of the ground 50 and the outer conductor 70 of the coaxial connector. Thereby, the distance dx between the conductive members 61a and 61b connecting the ground 50 and the outer conductor 70 can be easily reproduced.
- the ground 50 of the coplanar line is exposed, and the exposed portion of the ground 50 is securely connected by the outer conductor 70 of the coaxial connector and the conductive members 61a and 61b. Therefore, even if a gap 100 is generated between the ground 50 and the outer conductor 70 due to a manufacturing error or the like, the shortest distance dx between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 and the ratio of the dielectric layers 40a and 40b.
- the dielectric constants ⁇ a and ⁇ b so as to satisfy Equations 1 and 2
- the frequency component of the transmission signal leaking into the gap 100 can be suppressed, thereby reducing the insertion loss due to electromagnetic radiation. be able to.
- the above effect can be obtained as long as the outer conductor 70 of the coaxial connector is electrically connected to the exposed portion of the ground 50. Therefore, the shape of the exposed portion of the ground 50 is arbitrary. Further, the dielectric end face of the exposed portion of the ground 50 may be plated or not plated.
- 14A to 14D are side views of the high-frequency board 40 as viewed from the side connected to the coaxial connector.
- FIG. 14A The conductor layer 50 that becomes the ground 50, the dielectric layer 40a, and the conductor layer 45 are sequentially stacked on the dielectric layer 40b.
- FIG. 14B By selectively removing the dielectric layer 40b using a laser or a drill, the ground 50 is exposed in the regions on both sides of the signal line 10 as shown in FIG.
- FIG. 14C The signal line 10 and the ground 20 are formed on the dielectric layer 40a by selectively removing the conductor layer 45. That is, in the ground 50, the regions on both sides of the signal line 10 are exposed in a state where the signal line 10 (conductor layer 45), the dielectric layer 40 a, and the ground 50 are seen through from above.
- FIG. 14B By selectively removing the dielectric layer 40b using a laser or a drill, the ground 50 is exposed in the regions on both sides of the signal line 10 as shown in FIG.
- FIG. 14C The signal line 10 and the ground 20 are formed on the dielectric layer 40a by selectively removing the conductor
- the soldering area of the ground 50 is indicated by hatching. This soldering area is an example, and soldering may be performed on other areas of the ground 50. Further, a gap 100 (see FIG. 9) may be generated below the signal line 10 and soldering may not be performed in the corresponding region.
- the process of FIG. 14B for exposing the ground 50 and the process of FIG. 14C for forming the surface pattern can be performed in any order.
- the high-frequency substrate 40 is a multilayer made of a resin that constitutes a dielectric layer 40 a having a relative dielectric constant of 3.35 located above the ground 50 and a dielectric layer 40 b having a relative dielectric constant of 4.85 located below the ground 50. It is a wiring board.
- the thickness of the dielectric layer 40a is 135 [ ⁇ m]
- the width of the signal line 10 is 300 [ ⁇ m]
- the distance between the signal line 10 and the ground 20 is 990 [ ⁇ m]
- the diameter of the conductive via 30 is 50 [ ⁇ m]
- the interval along the signal transmission direction of the plurality of conductive vias 30 is 800 [ ⁇ m].
- the signal line 10 and the ground 20 have a thickness of 15 [ ⁇ m]
- the ground 50 has a thickness of 35 [ ⁇ m].
- the relative dielectric constant of the dielectric 90 of the coaxial connector is 3.3, the diameter of the dielectric 90 is 1397 [ ⁇ m], and the diameter of the core wire 80 which is the inner conductor is 300 [ ⁇ m].
- the exposed portion of the ground 50 has a semicircular shape with a locality radius of 400 [ ⁇ m], and the shortest distance dx between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 is 1840 [ ⁇ m]. Further, it is assumed that a gap is generated between the outer conductor 70 of the coaxial connector and the ground 50, and the distance between the outer conductor 70 and the ground 50 is 100 [ ⁇ m], and the exposed portion of the ground 50 and the outer conductor 70 are electrically connected. It is connected.
- the shortest distance dx between the exposed portion of the ground 50 on the end face of the high-frequency substrate 40 and the comparative example in which the ground 50 is not exposed and the ground 50 and the outer conductor 70 are not connected are 1840 [ ⁇ m].
- Example 2 in which the exposed portion and the outer conductor 70 were electrically connected was analyzed under the above numerical conditions, and the insertion loss (
- Example 2 the band where the insertion loss is less than 2 dB is improved by about 10 GHz from 0 to 27 GHz to 0 to 37 GHz as compared with the comparative example.
- FIGS. 16 is a top view of the high-frequency module and the high-frequency substrate 40 according to the third embodiment
- FIG. 17 is a cross-sectional view taken along the line XX in FIG. 16
- FIG. 18 is a cross-sectional view taken along the line YY in FIG. 16 is a cross-sectional view taken along the line ZZ.
- the same components as those shown in FIGS. 71 and 72 are denoted by the same reference numerals.
- Example 3 has the following changes compared to Example 1.
- a conductive via 110 is formed below the ground 50.
- ZZ arrow cross section the intersection line between the vertical plane (ZZ arrow cross section) including the symmetry line of the signal line 10 and the ground 50.
- a part of the transmission signal component leaking from the gap between the outer conductor 70 and the ground 50 propagates in the dielectric below the ground 50, and the vertical plane (ZZ including the symmetric line of the signal line 10).
- the electrolytic distribution in the vicinity of the line of intersection between the cross section (in the direction of the arrow) and the ground 50 can be maximally enhanced.
- a plurality of conductive vias 110 may be formed.
- a step of forming the conductive via 110 from the ground 50k toward the dielectric layer 40b is included.
- Example 3 the insertion loss characteristics of the high-frequency module according to Example 3 are described.
- the same numerical conditions as in Example 1 are used, and the conductive via 110 is arranged around a position 920 [ ⁇ m] away from the end of the high-frequency substrate 40 to which the coaxial connector is connected, The length is 1070 [ ⁇ m] and the diameter is 300 [ ⁇ m].
- the band where the insertion loss is less than 2 dB is 0 to 27 GHz in the comparative example, whereas in Example 3, the band is improved by about 13 GHz from 0 to 40 GHz. Further, in Example 3, compared with Example 1, the dip near the frequency of 37 GHz moves to the high frequency side, and the depth of the dip is reduced by about 0.8 dB.
- FIGS. 21 is a top view of the high-frequency module and the high-frequency substrate 40 according to the fourth embodiment
- FIG. 22 is a cross-sectional view taken along the line XX in FIG. 21
- FIG. 23 is a cross-sectional view taken along the line YY in FIG.
- FIG. 25 is a rear view of the high frequency module and the high frequency substrate 40 according to the fourth embodiment.
- the same components as those shown in FIGS. 71 and 72 are denoted by the same reference numerals.
- the conductive via 110 is formed below the ground 50. That is, it is desirable to form at least one conductive via 110 on the intersection line between the vertical plane (Z-Z cross section) including the symmetry line of the signal line 10 and the ground 50. As a result, a part of the transmission signal component leaking from the gap between the ground 50 and the outer conductor 70 propagates in the dielectric below the ground 50 and includes a vertical plane (Z ⁇ ) including the symmetry line of the signal line 10. The electrolytic distribution is maximally strengthened in the vicinity of the intersection line between the Z cross section) and the ground 50.
- a plurality of conductive vias 110 may be formed.
- the method for manufacturing the high-frequency substrate 40 according to the fourth embodiment includes a step of forming the conductive via 110 from the ground 50 toward the dielectric layer 40b in addition to the steps of FIGS.
- Example 4 the insertion loss characteristics of the high-frequency module according to Example 4 are described.
- the same numerical conditions as in Example 2 were used, and the conductive via 110 was arranged around a position 920 [ ⁇ m] away from the end face of the high-frequency substrate 40 to which the coaxial connector is connected.
- the length was 1070 [ ⁇ m] and the diameter was 300 [ ⁇ m].
- the shortest distance dx between them is 1840 [ ⁇ m]
- the exposed portion of the ground 50 is electrically connected to the outer conductor 70 of the coaxial connector, and the conductive via 110 is not formed;
- the shortest distance dx between the exposed portions of the ground 50 is 1840 [ ⁇ m] at the end face of the wire
- the outer conductor 70 of the coaxial connector is electrically connected to the exposed portion of the ground 50
- the conductive via 110 is formed. 4 was analyzed under the above numerical conditions, and the insertion loss (
- the band where the insertion loss is less than 2 dB is 0 to 27 GHz in the comparative example, whereas the band improvement of about 13 GHz is obtained in the fourth embodiment from 0 to 40 GHz.
- the dip near the frequency of 37 GHz moves to the high frequency side, and the depth of the dip is reduced by about 0.8 dB.
- conductive vias are used as means for connecting different layers, but it is not necessary to limit to this.
- other electrical connection means having conductivity such as a through hole can be applied.
- the application field of the first to fourth embodiments is not limited to the high-frequency substrate, and can be applied to substrates of various circuit modules.
- Embodiments 1 to 4 can be applied to various information communication terminals such as mobile phones and PDAs (Personal Digital Assistants) and circuit module boards incorporated in electronic devices.
- FIGS. 27 is a top view of the high-frequency transmission line and the high-frequency substrate 40 according to the fifth embodiment
- FIG. 28 is a top view of only the high-frequency substrate 40
- FIG. 29 is a cross-sectional view taken along the line AA in FIG.
- FIG. 31 is a sectional view taken along the line CC of FIG. 27,
- FIGS. 32 and 33 are sectional views taken along the line DD of FIG.
- the same components as those shown in FIGS. 71, 72, and 73 are denoted by the same reference numerals.
- the coplanar line formed on the upper surface of the high-frequency substrate 40 includes the signal line 10 and the ground 20 formed on the same layer as the signal line 10.
- a planar ground 50 is formed inside the high frequency substrate 40 as a lower layer ground of the coplanar line.
- the grounds 20 and 50 are connected to each other by a plurality of conductive vias 30 arranged at predetermined intervals along the signal transmission direction of the coplanar line.
- the coaxial connector includes an outer conductor 70, a core wire 80 that is an inner conductor, and a dielectric 90.
- the signal line 10 and the core line 80 are electrically connected by a conductive member 81 such as solder or a conductive adhesive.
- the ground 20 and the outer conductor 70 are also electrically connected by a conductive member 71 such as solder or a conductive adhesive.
- the ground 50 of the coplanar line is exposed in regions on both sides of the signal line 10, and the exposed part is a conductive member 60a such as solder or conductive adhesive. , 60b is securely connected to the outer conductor 70.
- connection range of the ground 50 and the outer conductor 70 by the conductive members 60a and 60b is continuous upward from the extension line in the signal transmission direction of the lower ground 50 of the coplanar line, and the center position of the core wire 80 of the coaxial connector It is preferable that it is more than the height. It is preferable that the exposed portion of the ground 50 is connected to the conductive members 60a and 60b over the entire end surface of the high-frequency substrate 40. Since the ground structure gradually changes from the lower ground 50 of the coplanar line to the outer conductor 70 of the coaxial connector, the coaxial connector is used when transmitting a signal from the coplanar line to the coaxial connector or when transmitting a signal from the coaxial connector to the coplanar line.
- the cross-sectional shape of the conductive members 60a and 60b in the signal transmission direction may be an arbitrary shape.
- the conductive members 60a and 60b are each rectangular (three-dimensional structure is a prismatic shape), or as shown in FIG. 33, the conductive members 60a and 60b are each triangular (three-dimensional structure). As a wedge shape).
- the shortest distance dx between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 is preferably set to a suitable value according to the maximum frequency of the transmission signal in the desired band. That is, it is preferable to limit the shortest distance dx between the exposed portions of the ground 50 to less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate. Thereby, electromagnetic radiation due to half-wave resonance between the exposed portions of the ground 50 can be suppressed.
- the shortest distance dx is equal to or less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate by the dielectric layer 40b having the relative dielectric constant ⁇ b located immediately below the ground 50, It is preferable to satisfy Condition 2 (Formula 2) that is equal to or less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate of the dielectric layer 40a having the relative dielectric constant ⁇ a located immediately above the ground 50.
- Condition 2 (Formula 2) that is equal to or less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate of the dielectric layer 40a having the relative dielectric constant ⁇ a located immediately above the ground 50.
- the maximum frequency of the transmission signal is f [GHz]
- the wavelength of the maximum frequency in consideration of the wavelength shortening rate by the dielectric layer 40b is ⁇ b [ ⁇ m]
- the wavelength of the maximum frequency in consideration of the wavelength shortening rate by the dielectric layer 40a is ⁇ a [ ⁇ m].
- the ground 50 and the outer conductor 70 are electrically connected by the conductive members 60 a and 60 b, and dx, ⁇ a, and ⁇ b are set so as to satisfy Equations 1 and 2, whereby the gap 100 between the ground 50 and the outer conductor 70 is set. Therefore, it is possible to suppress the frequency component of the transmission signal that leaks into the dielectric layer 40b.
- the shortest distance dy between the conductive members 60 a and 60 b is equal to or shorter than the shortest distance dx between the exposed portions of the ground 50 at the intersection line between the extension line of the ground 50 in the signal transmission direction and the outer conductor 70 of the coaxial connector. Is preferred. Thereby, the space
- the ground 50 of the coplanar line is exposed in the regions on both sides of the signal line 10 on the end face of the high-frequency substrate 40, and the exposed portion is electrically connected to the outer conductor 70 of the coaxial connector. It is possible to reliably connect the elastic members 60a and 60b. Therefore, even if a gap 100 is generated between the ground 50 and the outer conductor 70 due to a manufacturing error or the like, the shortest distance dx between the exposed portions of the ground 50 on the end surface of the high-frequency substrate 40 and the relative dielectric constant ⁇ a of the dielectric layer 40a.
- the relative dielectric constant ⁇ b of the dielectric layer 40b are set so as to satisfy Equations 1 and 2, the frequency component of the transmission signal leaking from the gap 100 can be suppressed, and electromagnetic radiation can be suppressed. The insertion loss due to can be reduced.
- the above effect can be obtained as long as the outer conductor 70 of the coaxial connector is electrically connected to the exposed portion of the ground 50. Therefore, the shape of the exposed portion of the ground 50 is arbitrary. Further, the dielectric end surface of the exposed portion of the ground 50 may be plated or may not be plated. Furthermore, the exposed portion of the ground 50 and the planar ground 20 may or may not be electrically connected at the dielectric end face.
- the high-frequency substrate 40 is made of a resin that constitutes a dielectric layer 40 a having a relative dielectric constant of 3.88 located above the ground 50 and a dielectric layer 40 b having a relative dielectric constant of 4.85 located immediately below the ground 50. It is a multilayer wiring board.
- the thickness of the dielectric layer 40a is 250 [ ⁇ m]
- the width of the signal line 10 is 450 [ ⁇ m]
- the distance between the signal line 10 and the ground 20 is 880 [ ⁇ m]
- the diameter of the conductive via 30 is 250 [ ⁇ m].
- the intervals along the signal transmission direction of the plurality of conductive vias 30 are 500 [ ⁇ m].
- the thickness of the signal line 10 and the ground 20 is 71 [ ⁇ m]
- the thickness of the ground 50 is 35 [ ⁇ m].
- the relative dielectric constant of the coaxial connector derivative 90 is 3.3, its diameter is 1397 [ ⁇ m], and the inner conductor core wire 80 has a diameter of 300 [ ⁇ m].
- the exposed portion of the ground 50 has a semicircular shape with a curvature radius of 400 [ ⁇ m], and the shortest distance dx between the outer peripheries of the exposed portions is 1000 [ ⁇ m]. Further, a gap is formed between the ground 50 and the outer conductor 70, and the distance between the two is 100 [ ⁇ m], and the exposed portion of the ground 50 and the outer conductor 70 are electrically connected.
- Example 5 in which the exposed portion of the connector and the outer conductor 70 of the coaxial connector were electrically connected were analyzed under the above numerical conditions, and the insertion loss (
- the band in which the insertion loss is less than 1 dB is 0 to 16.5 GHz in the comparative example, but the band of about 30 GHz is improved from 0 to 47 GHz in Example 5A.
- the 44 GHz band is improved from 0 to 60 GHz.
- FIGS. 35 and 41 are top views of the high-frequency transmission line and the high-frequency substrate 40 according to the sixth embodiment
- FIG. 36 is a top view of only the high-frequency substrate 40
- FIG. 37 is a cross-sectional view taken along arrows AA in FIGS. 38 is a sectional view taken along the line BB in FIG. 35
- FIG. 39 is a sectional view taken along the line CC in FIGS. 35 and 41
- FIG. 40 is a sectional view taken along the line DD in FIG. 42 is a cross-sectional view taken along the line BB in FIG. 41
- FIG. 43 is a cross-sectional view taken along the line DD in FIG.
- the same components as those shown in FIGS. 71, 72, and 73 are denoted by the same reference numerals.
- the coplanar line formed on the upper surface of the high-frequency substrate 40 includes a signal line 10 and a ground formed with the same layer as the signal line 10 interposed therebetween.
- a planar ground 50 is formed inside the high-frequency substrate 40 as a lower-layer ground of the coplanar line.
- the ground 20 of the coplanar line and the lower ground 50 are connected to each other by a plurality of conductive vias 30 arranged at predetermined intervals along the signal transmission direction of the coplanar line.
- the coaxial connector includes an outer conductor 70, a core wire 80 that is an inner conductor, and a dielectric 90.
- the signal line 10 and the core line 80 are electrically connected by a conductive member 81 such as solder or a conductive adhesive.
- a conductive member 81 such as solder or a conductive adhesive.
- the ground 20 and the outer conductor 70 are also electrically connected by a conductive member 71 such as solder or a conductive adhesive.
- the ground 50 of the coplanar line is exposed in the regions on both sides of the signal line 10, and the exposed part and the outer conductor 70 are soldered or conductive adhesive or the like.
- the conductive members 60a and 60b are securely connected.
- Example 6 has the same configuration as Example 5 with the following changes.
- Protrusions 70 a and 70 b are formed on the outer conductor 70 of the coaxial connector with the core wire 80 interposed therebetween.
- the ground 50, the outer conductor 70, and the protrusions 70a and 70b are electrically connected by the conductive members 60a and 60b.
- the ground 50 and the conductive members 60 a and 60 b are preferably connected over the entire exposed portion of the end face of the high-frequency substrate 40.
- the connection range between the exposed portion of the ground 50 and the outer conductor 70 by the conductive member 60a and the protruding portion 70a, and the conductive member 60b and the protruding portion 70b is continuous upward from the extension line in the signal transmission direction of the coplanar line.
- the ground structure gradually changes from the ground 50 to the outer conductor 70, at the time of signal transmission from the coplanar line to the coaxial connector, or at the time of signal transmission from the coaxial connector to the coplanar line, the electromagnetic field distribution at the connection portion between them is reduced. Large changes can be reduced.
- the cross-sectional shapes in the signal transmission direction of the conductive member 60a and the protrusion 70a, and the conductive member 60b and the protrusion 70b may be arbitrary.
- the joining cross section of the conductive member 60a and the protrusion 70a is rectangular (three-dimensional structure is a quadrangular prism), or as shown in FIG. May be wedge-shaped).
- the shortest distance dx between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 is preferably set to a desired value at the maximum frequency in the desired band. That is, it is preferable to limit the shortest distance dx between the exposed portions of the ground 50 to less than a half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate. Thereby, electromagnetic radiation due to half-wave resonance between the exposed portions of the ground 50 can be suppressed.
- the shortest distance dx is a condition 1 (equation) in which the wavelength shortening rate of the dielectric layer 40b having a relative permittivity ⁇ b located immediately below the ground 50 is considered to be equal to or less than a half wavelength of the maximum frequency of the transmission signal. 1), and Condition 2 (Formula 2) that satisfies the half wavelength of the maximum frequency of the transmission signal in consideration of the wavelength shortening rate of the dielectric layer 40a having the relative dielectric constant ⁇ a located immediately above the ground 50 Set as follows.
- the conductive members 61a and 61b By electrically connecting the ground 50 and the outer conductor 70 by the conductive members 61a and 61b and setting dx, ⁇ a, and ⁇ b so as to satisfy the conditions 1 and 2 (Equations 1 and 2), The frequency component of the transmission signal leaking from the gap 100 between the ground 50 and the outer conductor 70 to the dielectric layer 40b can be suppressed.
- the shortest distance dy between the conductive members 61a and 61b be equal to or shorter than the shortest distance dx in the intersection line between the extension line of the ground 50 in the signal transmission direction and the outer conductor 70. Thereby, the space
- the ground 50 of the coplanar line is exposed on both sides of the signal line 10 on the end face of the high-frequency substrate 40, and the exposed portion and the outer conductor 70 are electrically conductive.
- the members 60a and 60b are securely connected. Therefore, even if a gap 100 is generated between the ground 50 and the outer conductor 70 due to a manufacturing error or the like, the shortest distance dx between the exposed portions of the ground 50 and the relative dielectric constant of the dielectric layer 40a on the end face of the high-frequency substrate 40.
- the above effect can be obtained as long as the exposed portion of the ground 50 and the outer conductor 70 are electrically connected. Therefore, the shape of the exposed portion of the ground 50 is arbitrary. Further, the dielectric end surface of the exposed portion of the ground 50 may be plated or not plated.
- the high-frequency substrate 40 is a multilayer made of a resin that constitutes a dielectric layer 40 a having a relative dielectric constant of 3.88 located above the ground 50 and a dielectric layer 40 b having a relative dielectric constant of 4.85 located below the ground 50. It is a wiring board.
- the thickness of the dielectric layer 40a is 250 [ ⁇ m]
- the width of the signal line 10 is 450 [ ⁇ m]
- the distance between the signal line 10 and the ground 20 is 880 [ ⁇ m]
- the diameter of the conductive via 30 is 250 [ ⁇ m].
- the interval along the signal transmission direction of the plurality of conductive vias 30 is 500 [ ⁇ m].
- the thickness of the signal line 10 and the ground 20 is 71 [ ⁇ m]
- the thickness of the ground 50 is 35 [ ⁇ m]
- the relative dielectric constant of the dielectric 90 of the coaxial connector is 3.3
- the diameter of the dielectric 90 is 1397. [ ⁇ m]
- the diameter of the core wire 80 is 300 [ ⁇ m].
- the radius of curvature of the semicircular exposed portion of the ground 50 is 400 [ ⁇ m]
- the shortest distance dx between the outer peripheries of the exposed portions of the ground 50 is 1000 [ ⁇ m].
- the distance between the ground 50 and the outer conductor 70 is 100 [ ⁇ m], and although there is a gap between them, the two are electrically connected.
- the shortest distance dx between the exposed portions of the ground 50 on the end face of the high-frequency substrate 40 is set to 1000 [ ⁇ m] in the comparative example in which the ground 50 has no exposed portion and the ground 50 and the outer conductor 70 are not connected, and the ground 50 Example 6 in which the exposed portion of the electrode and the outer conductor 70 were electrically connected were analyzed under the above numerical conditions, and the insertion loss (
- the analysis results are shown in FIG.
- two types of characteristic curves are presented as Example 6. That is, as shown in FIGS.
- the exposed portion of the ground 50 is electrically connected by the protrusions 70a, 70b of the outer conductor 70 and the conductive members 60a, 60b, and the ground
- the height of the conductive member 60a and the protruding portion 70a, and the combined height of the conductive member 60b and the protruding portion 70b is set to 321 [ ⁇ m]
- Example 6B is set to 1199 [ ⁇ m]. is there.
- the conductive member 60a and the protrusion 70a, and the conductive member 60b and the protrusion 70b each have a semi-cylindrical shape. As can be seen from the graph of FIG.
- the band in which the insertion loss is less than 1 dB is 0 to 16.5 GHz in the comparative example, and in Example 6A, the band is improved by about 30 GHz from 0 to 47 GHz. In 6B, it is improved by about 44 GHz from 0 to 60 GHz.
- FIGS. 45 is a top view of the high-frequency transmission line and the high-frequency substrate 40 according to the seventh embodiment
- FIG. 46 is a top view of only the high-frequency substrate 40
- FIG. 47 is a cross-sectional view taken along the line AA in FIG. 49 is a sectional view taken along the line BB
- FIG. 49 is a sectional view taken along the line CC in FIG. 45
- FIGS. 50 and 51 are sectional views taken along the line DD in FIG. 52 to 54 are top views showing modifications of the ground 50 shown in FIG.
- the same components as those shown in FIGS. 71, 72, and 73 are denoted by the same reference numerals.
- Example 7 the following changes are made compared to Example 5.
- the exposed portion of the ground 50 is formed with a trapezoidal or triangular notch from the end of the high-frequency substrate 40.
- the length of the notch is preferably about the length in the signal transmission direction in which the core wire 80 of the coaxial connector and the signal line 10 overlap. Since the ground structure gradually changes from the lower ground 50 of the coplanar line to the outer conductor 70 of the coaxial connector, both signals are transmitted when the signal is transmitted from the coplanar line to the coaxial connector or when the signal is transmitted from the coaxial connector to the coplanar line. A large change in the electromagnetic field distribution can be reduced at the connection portion. Note that the notch need not be limited to one trapezoidal region as shown in FIG.
- the notch is constituted by a plurality of trapezoidal regions, the trapezoidal regions are partially connected, and the hypotenuses of the trapezoidal regions are arranged substantially linearly. Also good. Thereby, the reflection characteristic in the high frequency region can be improved without deteriorating the reflection characteristic in the medium frequency region of the high frequency substrate 40.
- Example 7 the insertion loss characteristic in the high-frequency transmission line according to Example 7 is described.
- the same numerical conditions as in Example 5 were used.
- a trapezoidal region having an end of the high-frequency substrate as a lower side (the length of the upper side is 300 [ ⁇ m], the length of the lower side is 756 [ ⁇ m], and the height is 1422 [ ⁇ m]) notches are formed.
- the trapezoidal region shown in FIG. 53 the trapezoidal region shown in FIG. ]. That is, two trapezoidal cutouts are formed in the ground 50 of FIG.
- the ground 50 shown in FIG. 54 with respect to the two trapezoidal regions shown in FIG.
- Example 5 There is no exposed portion of the ground 50, and the comparative example in which the ground 50 and the outer conductor 70 of the coaxial connector are not connected, and the shortest distance dx of the exposed portion of the ground 50 is 1000 [ ⁇ m], and the exposed portion of the ground 50 and the coaxial connector
- the outer conductor 70 is electrically connected by the semi-cylindrical conductive members 60a and 60b, and the height of the conductive members 60a and 60b above the ground 50 is 1199 [ ⁇ m].
- Example 7A, Example 7B, and Example 7C in which the notches shown in FIGS. 51, 52, and 53 were formed in the ground 50 were analyzed under the above numerical conditions, and insertion loss (
- the band where the insertion loss is less than 1 dB is 0 to 16.5 GHz in the comparative example, and about 44 GHz from 0 to 60 GHz in any of Examples 7A to 7C. Improvement is obtained. Also, in FIG. 55, there is no significant difference in insertion loss between Example 5B and Examples 7A to 7C, but in the reflection characteristics shown in FIG. 56, the band where the reflection amount is less than ⁇ 15 dB is implemented. Compared to 0-54 GHz in Example 5B, Example 7A improves by about 8 GHz from 0-62 GHz, in Example 7B improves by about 4.5 GHz from 0-58.5 GHz, and in Example 7C 0-60 GHz To about 6 GHz.
- FIGS. 57 and 63 are top views of the high-frequency transmission line and the high-frequency substrate 40 according to the eighth embodiment
- FIG. 58 is a top view of the high-frequency substrate 40
- FIG. 59 is a cross-sectional view taken along arrows AA in FIGS. 60 is a sectional view taken along the line BB in FIGS. 57 and 63
- FIG. 61 is a sectional view taken along the line CC in FIG. 57
- FIG. 62 is a sectional view taken along the line DD in FIG. CC is a cross-sectional view taken along the line CC
- FIG. 65 is a cross-sectional view taken along the line DD in FIG. 66 to 68 are top views of the ground 50 shown in FIG.
- the same components as those shown in FIGS. 71, 72, and 73 are denoted by the same reference numerals.
- Example 8 the following changes are made to Example 6.
- a trapezoidal or triangular cutout is formed from the end of the high-frequency substrate 40 in a region sandwiched between the exposed portions of the ground 50.
- the length of the notch from the end of the high-frequency substrate 40 is preferably the same as the length in the signal transmission direction in which the signal line 10 and the core wire 80 of the coaxial connector overlap. Since the ground structure gradually changes from the lower ground 50 of the coplanar line to the outer conductor 70 of the coaxial connector, when the coplanar line transmits a signal to the coaxial connector, or when a signal is transmitted from the coaxial connector to the coplanar line, the connection between the two is established.
- the cutouts do not need to have a single trapezoidal shape as shown in FIG. 66, but are formed into a plurality of trapezoidal shapes as shown in FIG. 67, and the hypotenuses of each trapezoidal shape are arranged linearly. Good. Furthermore, as shown in FIG. 68, two trapezoidal cutouts may be partially connected, and the hypotenuses of each trapezoid may be arranged linearly. Thereby, the reflection characteristic in the high frequency region can be improved without deteriorating the reflection characteristic in the medium frequency region of the high frequency substrate 40.
- Example 8 the insertion loss characteristic according to Example 8 will be described.
- the ground 50 has a trapezoidal shape with the end of the high-frequency substrate 40 as the lower side (upper side length 300 [ ⁇ m], lower side length 756 [ ⁇ m], height 1422 [ ⁇ m]) notches are formed.
- Example 8B according to FIG. 67 the trapezoidal notch shown in FIG.
- Example 8C is separated from the end of the high-frequency substrate 40 into two trapezoids at positions of 100 [ ⁇ m] and 711 [ ⁇ m], and The distance between them was 200 [ ⁇ m].
- two trapezoidal cutouts shown in FIG. 67 are placed at a length of 200 [ ⁇ m] at positions of 100 [ ⁇ m] and 711 [ ⁇ m] from the end of the high-frequency substrate 40, and The two rectangular cutouts having a width of 300 [ ⁇ m] were combined to form a polygonal cutout.
- the protrusions 70a and 70b of the outer conductor 70 are electrically connected by the conductive members 60a and 60b, and the protrusion 70a and the conductive member 60a, and the protrusion 70b and the conductive member 60b have a semi-cylindrical shape.
- the band in which the insertion loss is less than 1 dB is 0 to 16.5 GHz in the comparative example, and the improvement of about 44 GHz is obtained from 0 to 60 GHz in the examples 8A to 8C. It was.
- the insertion loss is not significantly different from that in Example 6B, but the band in which the reflection amount is less than ⁇ 15 dB in the reflection characteristics is 0 to 54 GHz in Example 6B, compared to 0 in Example 8A. Improvements of 8 GHz, 4.5 GHz, and 6 GHz were obtained, respectively, to 62 GHz, 0 to 58.5 GHz in Example 8B, and 0 to 60 GHz in Example 8C.
- the conductive via is used as a means for connecting different layers.
- the present invention is not limited to this, and other electrical connection means having conductivity such as a through hole is applied. be able to.
- the high-frequency substrate based on the above embodiment can be incorporated into, for example, a mobile phone, a PDA (Personal Digital Assistant), and other electronic devices.
- the high-frequency substrate according to the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea defined in the appended claims.
- the high-frequency module and the substrate according to the present invention can prevent an increase in insertion loss due to electromagnetic radiation and reflection particularly at a high frequency, it can be applied to various electronic devices.
- Coplanar line signal line 20 Coplanar line ground (first ground) 30 conductive via 40 high frequency substrate 40a dielectric layer (first dielectric layer) 40b Dielectric layer (second dielectric layer) 45 conductor layer 50 lower ground of the coplanar line (second ground, second conductor layer) 60a Conductive Member 60b Conductive Member 61a Conductive Member 61b Conductive Member 70 Coaxial Connector Outer Conductor 70a Outer Conductor Protrusion 70b Outer Conductor Protrusion 71 Conductive Member 80 Coaxial Connector Core Wire (Inner Conductor) 81 Conductive member 90 Coaxial connector dielectric 100 Clearance between lower ground and outer conductor 110 Conductive via
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Abstract
Description
本願は、2008年11月26日に日本国に出願された特願2008-300278号、及び2009年5月12日に日本国に出願された特願2009-115879号に基づき優先権を主張し、その内容をここに援用する。
コプレーナ線路のグランド20と同軸コネクタの外導体70とが半田70で電気的に接続されているため、同軸コネクタの芯線80の下方において、同軸コネクタの外導体70とコプレーナ線路を構成する第2層目のグランド50との間に、半田23が塗布される厚み分の隙間(或いは、空隙)が形成されることがある。
コプレーナ線路と同軸コネクタとが上方からのみ接触接続しているため、同軸コネクタの芯線80の下方において、同軸コネクタの外導体70とコプレーナ線路を構成する第2層目(或いは、内層)の導体(図73には不図示。図72のグランド50に相当する。)を電気的に接続することは困難である。同軸コネクタの外導体70とコプレーナ線路の第2層目の導体との間の隙間を完全になくして両者の電気的接触を確立したとしても、機械的応力や熱的応力により、両者の電気的接触を維持するのは困難である。また、グランド20(即ち、表層グランド)と同軸コネクタの外導体70を電気的に接続し、更に、グランド20と同軸コネクタの外導体70とを極力近づけたとしても、同軸コネクタの外導体70とコプレーナ線路の導体との間の隙間において、信号伝送方向に垂直な方向の隙間寸法を減少させることは困難である。伝送信号が高周波になるにつれて、同軸コネクタの内導体である芯線80の下方において、外導体70と導体との隙間から伝送信号の一部が放射され、挿入損失が増加する。
図7(b):レーザー又はドリルを用いて導体層45及び誘電体層40aを選択的に除去することにより、図3に示す信号線路10の両側の領域でグランド50を露出する。
図7(c):導体層45を選択的に除去することにより、誘電体層40a上に信号線路10及びグランド20を形成する。
図7(d):このようにして製造した高周波基板40に同軸コネクタを半田付けする。グランド50の半田付け領域を斜線で示すが、これは例示であり、グランド50の他の領域に半田付けされていてもよいし、また、信号線路10の下方に隙間100(図3参照)が生じて該当領域において半田付けがなされないこともあり得る。
尚、グランド50を露出する図7(b)の工程と、高周波基板40の表面パターンを形成する図7(c)の工程とは順不同に実施可能である。
図14(b):レーザー又はドリルを用いて誘電体層40bを選択的に除去することにより、図13に示すように信号線路10の両側の領域にてグランド50が露出される。
図14(c):導体層45を選択的に除去することにより、誘電体層40a上に信号線路10及びグランド20が形成される。即ち、グランド50のうち、上方から信号線路10(導体層45)、誘電体層40a、及びグランド50を透視した状態において、信号線路10の両側の領域が露出される。
図14(d):グランド50の半田付け領域が斜線にて示される。この半田付け領域は例示であり、グランド50の他の領域に半田付けがなされてもよい。また、信号線路10の下方に隙間100(図9参照)が生じて、該当領域において半田付けがなされないこともあり得る。
尚、グランド50を露出させる図14(b)の工程と、表面パターンを形成する図14(c)の工程とは順不同に実施可能である。
挿入損失特性を検証するにあたり、以下の数値条件とした。高周波基板40は、グランド50の上層に位置する比誘電率3.88の誘電体層40a、及びグランド50の下層に位置する比誘電率4.85の誘電体層40bを構成する樹脂よりなる多層配線基板である。ここで、誘電体層40aの厚さは250[μm]、信号線路10の幅は450[μm]、信号線路10とグランド20の間隔は880[μm]、導電性ビア30の直径は250[μm]、複数の導電性ビア30の信号伝送方向に沿った間隔は500[μm]である。また、信号線路10及びグランド20の厚さは71[μm]、グランド50の厚さは35[μm]、同軸コネクタの誘電体90の比誘電率は3.3、誘電体90の直径は1397[μm]、芯線80の直径は300[μm]である。グランド50の半円形状の露出部の曲率半径を400[μm]とし、グランド50の露出部の外周間の最短距離dxを1000[μm]とする。更に、グランド50と外導体70の間隔は100[μm]であり、両者の間に隙間が生じているものの、両者は電気的に接続されている。
20 コプレーナ線路のグランド(第1のグランド)
30 導電性ビア
40 高周波基板
40a 誘電体層(第1の誘電体層)
40b 誘電体層(第2の誘電体層)
45 導体層
50 コプレーナ線路の下層グランド(第2のグランド、第2の導体層)
60a 導電性部材
60b 導電性部材
61a 導電性部材
61b 導電性部材
70 同軸コネクタの外導体
70a 外導体の突起部
70b 外導体の突起部
71 導電性部材
80 同軸コネクタの芯線(内導体)
81 導電性部材
90 同軸コネクタの誘電体
100 下層グランドと外導体との隙間
110 導電性ビア
Claims (17)
- コプレーナ線路を有し同軸コネクタと接続される高周波基板であり、
前記コプレーナ線路は
第1の誘電体層と、
第1の誘電体層の表面上に形成され同軸コネクタの内導体と接続される信号線路と、
信号線路の両側の領域において当該信号線路から隙間を設けて形成された第1のグランドと、
第1の誘電体層の裏面上に形成された第2のグランドを含み、
第2のグランドを挟むように第1の誘電体層に第2の誘電体層を積層し、
第1の誘電体層の所定領域において第2のグランドが露出されており、当該第2のグランドの露出部が同軸コネクタの外導体と接続される高周波基板。 - 第1の誘電体層の表面又は第2の誘電体層の第1の誘電体層と対向する面と反対側の面のうち、同軸コネクタが接続される端部における信号線路の両側の領域において第2のグランドが露出している請求項1記載の高周波基板。
- 第2のグランドと露出部と同軸コネクタの外導体との接続部が、当該露出部から第1の誘電体層の表面に向けて同軸コネクタの外導体の表面に連続的に沿って配置された柱形状若しくは楔形状である請求項1記載の高周波基板。
- 第2のグランドの露出部と同軸コネクタの外導体の柱形状或いは楔形状の接続部の少なくとも一部を同軸コネクタの外導体の突起部より構成してなる請求項3記載の高周波基板。
- 第2のグランドの露出部から第1の誘電体層の表面への方向における柱形状或いは楔形状の接続部の高さが、同軸コネクタの内導体の中心位置の高さ以上である請求項3記載の高周波基板。
- 同軸コネクタが接続される端面における第2のグランドの露出部間の最短距離が、波長短縮率を考慮して伝送信号の最大周波数の半波長以下である請求項1記載の高周波基板。
- 第2のグランドにおいて、その露出部により挟まれた領域における同軸コネクタが接続された端部を底辺とする台形状或いは三角形状の切り欠きが形成されている請求項2記載の高周波基板。
- 第2のグランドにおいて、その露出部により挟まれた領域における同軸コネクタが接続された端部を基準として複数の台形状の切り欠きを夫々独立して形成し、両者の斜辺が直線状に配列されてなる請求項2記載の高周波基板。
- 第2のグランドにおいて、その露出部により挟まれた領域における同軸コネクタが接続された端部を基準として複数の台形状の切り欠きを形成し、それらを相互に連結して多角形状の切り欠きを形成してなる請求項2記載の高周波基板。
- 第2のグランドから第2の誘電体層に向けて少なくとも1つの導電性ビアを形成してなる請求項1記載の高周波基板。
- 導電性ビアの中心を信号線路の対称線を含む鉛直面と第2のグランドとの交線上に配置してなる請求項12記載の高周波基板。
- 第1のグランドは、同軸コネクタの外導体からその内導体が延出する端面側において内導体を挟むように突出した一対の突出部と接続されてなる請求項1記載の高周波基板。
- 同軸コネクタと接続されるコプレーナ線路が形成された高周波基板を含む高周波モジュールであり、
前記コプレーナ線路は
第1の誘電体層と、
第1の誘電体層の表面上に形成され同軸コネクタの内導体と接続される信号線路と、
信号線路の両側の領域において当該信号線路から隙間を設けて形成された第1のグランドと、
第1の誘電体層の裏面上に形成された第2のグランドを含み、
第2のグランドを挟むように第1の誘電体層に第2の誘電体層を積層し、
第1の誘電体層の所定領域において第2のグランドが露出されており、当該第2のグランドの露出部が同軸コネクタの外導体と接続される高周波モジュール。 - 同軸コネクタと接続されるコプレーナ線路を含む高周波基板の製造方法であって、
第2の誘電体層上に、第2の導体層、第1の誘電体層、及び第1の導体層を順次積層し、
第1の導体層及び第1の誘電体層を選択的に除去して、第2の導体層の所定領域を露出せしめ、
第1の導体層を選択的に除去して第1の誘電体層上に同軸コネクタの内導体と接続される信号線路を形成し、
同軸コネクタが接続される端面において、信号線路の両側の領域に当該信号線路から隙間を設けてグランドを形成し、以って、信号線路、グランド、及び第2の誘電体層を含むコプレーナ線路を形成するようにした高周波基板の製造方法。 - 同軸コネクタと接続されるコプレーナ線路を含む高周波基板の製造方法であって、
第2の誘電体層上に、第2の導体層、第1の誘電体層、及び第1の導体層を順次積層し、
第2の誘電体層を選択的に除去して、同軸コネクタが接続される端面において信号線路の両側の領域にて第2の導体層を露出せしめ、
第1の導体層を選択的に除去して、第1の誘電体層上に同軸コネクタの内導体と接続される信号線路を形成し、
信号線路の両側の領域において当該信号線路から隙間を設けてグランドを形成し、以って、信号線路、第2の導体層、及びグランドを含むコプレーナ線路を形成するようにした高周波基板の製造方法。
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US13/130,675 US20110226518A1 (en) | 2008-11-26 | 2009-11-24 | Substrate of circuit module and manufacturing method therefor |
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US20110226518A1 (en) | 2011-09-22 |
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