WO2010058809A1 - Puce holographique en relief et procédé de fabrication de celle-ci - Google Patents

Puce holographique en relief et procédé de fabrication de celle-ci Download PDF

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Publication number
WO2010058809A1
WO2010058809A1 PCT/JP2009/069603 JP2009069603W WO2010058809A1 WO 2010058809 A1 WO2010058809 A1 WO 2010058809A1 JP 2009069603 W JP2009069603 W JP 2009069603W WO 2010058809 A1 WO2010058809 A1 WO 2010058809A1
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WIPO (PCT)
Prior art keywords
embossed hologram
pits
pit
chip
resin
Prior art date
Application number
PCT/JP2009/069603
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English (en)
Japanese (ja)
Inventor
信明 小松
眞一郎 南條
Original Assignee
国際先端技術総合研究所株式会社
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Priority to JP2010539245A priority Critical patent/JP5674127B2/ja
Publication of WO2010058809A1 publication Critical patent/WO2010058809A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/024—Hologram nature or properties
    • G03H1/0244—Surface relief holograms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/04—Processes or apparatus for producing holograms
    • G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • G06K19/16—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being a hologram or diffraction grating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/0005—Adaptation of holography to specific applications
    • G03H1/0011—Adaptation of holography to specific applications for security or authentication
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/04—Processes or apparatus for producing holograms
    • G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
    • G03H1/182—Post-exposure processing, e.g. latensification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2240/00—Hologram nature or properties
    • G03H2240/50—Parameters or numerical values associated with holography, e.g. peel strength
    • G03H2240/55—Thickness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2250/00—Laminate comprising a hologram layer
    • G03H2250/36—Conform enhancement layer

Definitions

  • the invention according to this application relates to a structure of an object that is easily forged, such as cards, banknotes, securities, and the like, and a chip used for authenticating the authenticity of the object, and a method of manufacturing the chip. .
  • Fig. 1 (a) shows an example of a current cash card.
  • reference numeral 1 denotes a cash card body made of plastic or the like, and a magnetic stripe 2 on which information is recorded and an arrow 3 indicating the insertion direction of the cash card are formed on the front side.
  • illustration was abbreviate
  • cash card and credit card are provided with embossed information such as the owner name, and since this information is also used for magnetic information, the embossed information is a clue for creating counterfeit cards. Yes.
  • biometrics technology that uses pattern recognition technology has been adopted in part.
  • Representative biometric authentication technologies include iris authentication, fingerprint authentication, palm print authentication, finger vein authentication, palm vein authentication, and palmar vein authentication.
  • contact type and non-contact type authentication there are contact type and non-contact type authentication.
  • it is necessary to register a pattern in advance, and it takes time to register the pattern, and it also takes time for authentication, which increases the operation cost.
  • an embossed hologram in which unevenness is formed on a plastic is attached to a credit card, prepaid card, banknote, securities or the like. Since this embossed hologram is very difficult to duplicate, it is virtually impossible to forge the cards with the embossed hologram, but in the current usage form, humans also read it at a glance Therefore, it is possible to forge and use a card or the like using a similar embossed hologram.
  • counterfeiting occurs frequently, and there are so-called counterfeit brand products that cannot be ignored.
  • Some counterfeit brand products can be identified as unauthentic at first glance, but some are so sophisticated that it is extremely difficult to identify that they are not genuine.
  • the operator who inserts the card into the terminal device confirms the authentication pattern visually, i.e., sensory, and is not read by the card terminal device.
  • Sensory authentication is effective for primary screening due to variations in the ability of individuals to authenticate, and even the same person due to variations in authentication environment, psychological state, physical condition, etc. The reliability is low.
  • Authentication using an auxiliary device is performed by using a magnifier such as a fine line, special line, micro character, special shape screen, or magnifying glass, or using a special filter that generates optical interference.
  • a magnifier such as a fine line, special line, micro character, special shape screen, or magnifying glass, or using a special filter that generates optical interference.
  • materials with special optical properties such as luminescent substrates, luminescent laminate films, luminescent inks, thermochromic inks, photochromic inks, etc. are mixed into substrates, laminate films, inks, special filters, ultraviolet lamps, etc.
  • these devices are also unreliable because the final certification relies on human sensuality.
  • Authenticating by mechanical processing is performed by mechanically detecting the characteristics of a material, and detection includes detection of magnetic and optical characteristics.
  • light-emitting materials and magnetic materials are mixed into base materials, laminate films, inks, etc., using detection devices, and specific information encoded is given magnetically or optically using OCR characters or magnetic bar codes.
  • detection devices and specific information encoded is given magnetically or optically using OCR characters or magnetic bar codes.
  • specific information encoded is given magnetically or optically using OCR characters or magnetic bar codes.
  • card description information given when the card is issued to the user and “card body information” given in the card manufacturing process as items subject to illegal use or counterfeiting of the card.
  • Card description information is information that is printed / applied to the card body when the card is issued, and includes information related to issuance such as holder information and expiration date.
  • Tampering which is a typical form of unauthorized use, is an act of rewriting all or part of the information written on the card, and is done by erasing legitimate information and adding unauthorized information.
  • the card body information is information held by the card itself excluding the card description information from the issued card, and the physical shape of the card, the background pattern mainly given in the pre-printing process, the underlying printing layer, and the protective laminate layer Etc., information associated with the card substrate.
  • Counterfeiting is a fraudulent act performed on the card body, and is performed by copying or imitating a pattern or pattern that is information attached to the card body to produce a card that is approximate in appearance. This is done using a printer or the like by reading a design or pattern given to a simple card ticket surface with a scanner or the like, adding processing or correction.
  • Authentication methods for counterfeiting are broadly divided into sensory, auxiliary, and machine processing.
  • Sensory authentication authenticates authenticity with human senses such as visual and tactile sensations, and for visual ones, holograms that change the pattern, color, etc. given by changing the color, watermark, and viewing angle of the main body.
  • tactile sensations include detection of a given uneven shape, detection of the texture of a card body, and the like.
  • logo marks, special fonts, anti-copying image lines, special color inks, holograms, optically changing materials, latent image patterns, etc. that are difficult to duplicate and copy, and that can be easily authenticated visually
  • finger-like and visual authentication such as embossing, concavity and convexity, and perforation.
  • Machine reading of patterns such as biometrics or artifact metrics is generally performed by reading with an imaging device and authenticating with pattern recognition technology. Therefore, there is a possibility of counterfeiting by copying technology.
  • a card using an embossed hologram as a hard-to-copy card is disclosed in JP-B-6-85102, JP-A-11-272836, JP-A-20-298880, JP-A-20-163530, JP-T-20-51481. No. 2, JP-A 22-74283, JP-A 22-347373, and Japanese Patent No. 2522681.
  • Japanese Patent Application No. 27-312861 which is a prior application by the present applicant, describes an invention of an authenticity discriminating member and an authenticity discriminating method for discriminating an authentic product from a counterfeit product by a combination of an IC tag and an embossed hologram. .
  • an embossed hologram chip and an embossed hologram chip that can be added to a conventionally used cash card or credit card without fundamental changes and are effectively used for discrimination of counterfeit products.
  • a novel structure of embossed hologram chips described in WO27 / 072794, WO27 / 072793 and Japanese Patent Application No. 27-312861, and a method of manufacturing these embossed hologram chips Is an issue.
  • this application provides the following means.
  • Hologram pits are regularly arranged on the embossed hologram chip, and pits that generate the hologram phenomenon are randomly arranged.
  • a hologram chip master plate having a size corresponding to a plurality of emboss hologram chips is created, and a plurality of emboss hologram chips are cut out from the master plate.
  • a stamper for manufacturing an embossed hologram chip is created, and an embossed hologram chip is manufactured using the stamper.
  • embossed hologram using the interference of light has a three-dimensional structure, it is impossible to copy other than manufacturing a replica directly from the original. Also, an embossed hologram pattern that is randomly formed based on random numbers or by chance cannot be analyzed, and cannot be forged by analysis.
  • monochromatic embossed hologram chip with pits An example of pit arrangement of a monochromatic embossed hologram chip having pits. An example of pit arrangement of a monochromatic embossed hologram chip created based on random numbers.
  • Example of pit arrangement of multicolor embossed hologram chip Example of pit arrangement of multicolor embossed hologram chip.
  • Example of structure of monochromatic embossed hologram chip. 6 shows another embodiment of a monochromatic embossed hologram chip structure.
  • Example of structure of multicolor embossed hologram chip. 6 shows another embodiment of the structure of a multicolor embossed hologram chip.
  • FIG. 11 illustrates the multi-color embossed hologram chip of FIG. 10.
  • FIG. 9 is still another embodiment of the structure of a multicolor embossed hologram chip. Description of the multicolor embossed hologram chip of FIG. FIG. 9 is still another embodiment of the structure of a multicolor embossed hologram chip.
  • FIG. 15 is a description of the multicolor embossed hologram chip of FIG. 14. Description of a monochromatic embossed hologram chip having protrusions. Description of a multicolor embossed hologram chip having protrusions. Description of monochromatic embossed hologram chip with pits and protrusions. Description of a multicolor embossed hologram chip with pits and protrusions.
  • FIG. 1 shows a basic configuration of a card to which a monochromatic hologram chip by the applicant is attached.
  • A is an overall view of the card
  • (b) is a cross-sectional view of the card
  • (c) is a cross-sectional view of the hologram chip
  • (d) is a functional explanatory diagram of the hologram chip
  • (e) is an output detection signal. .
  • a surface plate 4 is attached on a card base 6 which is light-impermeable, and a hologram chip 5 is attached thereto.
  • a magnetic stripe 2 and an arrow 3 are formed on the surface plate 4.
  • FIG. C shows the basic structure of the hologram chip.
  • Embossed hologram pits (pits) 7 having a depth of 1 ⁇ 4 wavelength of used incident light and flat portions 8 where no pits are formed are arranged on the hologram chip substrate 5.
  • the substrate 5 and the pit 7 are formed with a reflective layer of metal or the like thereon.
  • Reference numeral 9 denotes a protective coating.
  • the function of the hologram chip will be described with reference to (d).
  • Light having a wavelength of ⁇ incident through the protective coating 9 is reflected by the flat portion 8 and the flat bottom of the pit 7, and light having a wavelength ⁇ indicated by a solid line arrow is detected outside.
  • the phase of the light reflected at the upper end and the light reflected at the lower end are 180 ° different from each other. .
  • the reflected light detection signal dip at the edge of the boundary between the flat portion 8 and the pit 7, and this dip occurs twice for one pit 6. By utilizing this fact, the pit 7 can be detected.
  • FIG. 2 shows an example of a hologram chip in which pits 7 and flat portions 8 are regularly arranged.
  • 5 is a hologram chip
  • 6 is a pit
  • 7 is a flat portion.
  • the flat part 7 is visible in (a), it does not actually appear as in (b).
  • the pit arrangement need not be regular, and it may be desirable to arrange the pits irregularly.
  • FIG. 3 shows an example of the arrangement of hologram chips based on binary data obtained by randomizing the pit arrangement of embossed holograms configured as pits. This binary data can be obtained by detecting radiation emitted by nuclear decay of radioactive material.
  • an embossed hologram is arranged as a square of a 32 ⁇ 32 matrix of 1024-bit binary data.
  • blanks are displayed at locations where binary data “0” is written, and “*” is displayed at locations where binary data “1” is written.
  • FIG. 4 shows a basic configuration of a multi-color hologram chip using light of a plurality of wavelengths (in this example, red light R, green light G, and blue light B) by the applicant.
  • A is a sectional view thereof
  • (b) is a functional explanatory diagram thereof
  • (c) is an output detection signal of red light
  • (d) is an output detection signal of green light
  • (e) is output. This is a blue light detection signal.
  • pits 11 R , 11 G and 11 B having a depth of 1 ⁇ 4 wavelength of the red incident light R, the green incident light G and the blue incident light B used for the hologram chip substrate 10 and these pits are formed. a flat portion 11 W which are not is disposed.
  • a reflective layer such as a metal is formed on the hologram chip substrate 10 and the pits 11 R , 11 G and 11 B .
  • Reference numeral 12 denotes a protective coating.
  • the hologram chip will be further described with reference to (b).
  • the pit 11 R having a depth of 1 ⁇ 4 of the wavelength ⁇ R of the red light R used for the substrate 10
  • the pit 11 G having a depth of 1 ⁇ 4 of the wavelength ⁇ G of the green light G
  • the wavelength of the blue light B It pits 11 B having a quarter of the depth of lambda B is formed.
  • the red light having a wavelength of ⁇ R incident through the protective coating 12 is reflected outside the edge of the pit 11 R , and the light of the wavelength ⁇ R indicated by the solid line arrow is detected.
  • the green light having a wavelength of ⁇ G incident through the protective coating 12 is reflected outside the edge of the pit 11 G , and the green light of the wavelength ⁇ G indicated by the solid arrow is detected.
  • Pits 11 G edges in the green light phase, which is reflected by the green light and the lower reflected at the top is different from 180 °, to meet off out each other, a green light having a wavelength lambda G as indicated by broken line arrows g is detected Not.
  • the blue light having a wavelength of ⁇ B incident through the protective coating 12 is reflected at a portion other than the edge of the pit 11 B , and the blue light of the wavelength ⁇ B indicated by the solid line arrow is detected.
  • Pits 11 differs been the 180 ° blue light phase reflected by blue light and the lower reflection at the upper end in the edge of the B, to meet off out each other, the blue light of the wavelength lambda B as indicated by the broken line arrow b is detected Not.
  • FIG. 5 shows an example of a hologram chip in which pits and flat portions are regularly arranged by the applicant.
  • 10 is a hologram chip
  • 11 R , 11 G and 11 B are pits
  • 11 W is a flat portion. Although a flat portion is visible in (a), it does not actually appear as in (b).
  • the pit arrangement need not be regular, and it may be desirable to arrange the pits irregularly.
  • FIG. 6 shows an example of a hologram chip obtained by artificially obtaining an embossed hologram configured as a pit or a convex portion by the applicant.
  • R”, “G”, “B” and white light “W” can be expressed in quaternary numbers, which are four 2-bit numbers, ie, “00”, “01”, “10”. , “11”.
  • FIG. 7 shows a first embodiment of the basic structure of a single color pit.
  • reference numeral 15 denotes a hologram chip base, on which a pit 16 having a depth of a quarter wavelength of the incident light used and a flat portion 17 where no pit is formed are arranged.
  • the hologram chip base 15 and the pits 16 are formed with a reflective layer such as metal.
  • Reference numeral 18 denotes a protective coating.
  • FIG. 8 shows another embodiment 2 of the basic structure of the monochromatic pit.
  • reference numeral 20 denotes a hologram chip substrate, in which pits having a depth of 1 ⁇ 4 wavelength of used incident light are formed in advance, and some of them are filled with a resin 24. .
  • the hologram chip base 20 is provided with the pit 21 having a depth of 1 ⁇ 4 wavelength of the incident light used and the flat portion 22 where no pit is formed.
  • the hologram chip base 20 and the pit 21 are formed with a reflective layer of metal or the like thereon. At the edge of the pit 21 formed in this way, the incident light dip shown in FIG. 1 occurs.
  • Reference numeral 23 denotes a protective coating.
  • FIG. 9 shows a first embodiment of the basic structure of a multicolor pit.
  • reference numeral 25 denotes a hologram chip substrate, and pits 26 R , 26 G , and pits 26 R , 26 G , having a depth of 1 ⁇ 4 of the wavelength of incident light, for example, red light R, green light G, and blue light B, are used.
  • 26 B and a flat portion 27 where no pit is formed are arranged.
  • a reflective layer such as a metal is formed.
  • Reference numeral 18 denotes a protective coating.
  • FIG. 10 shows another embodiment 2 of the basic structure of the multicolor pit.
  • 30 is a hologram chip base, using incident light in the longest wavelength in the hologram chip base 30, for example, a quarter wavelength of the red light R, the depth of the pit is pre-formed, the pits 31 R Is filled with no resin, the pit 31 G is filled with resin so that the depth after filling is 1 ⁇ 4 wavelength of the green light G, and the pit 31 B is filled with blue light B The resin is filled so as to have a quarter wavelength, and the pits 31W are completely filled. Further, a reflective layer made of metal or the like is formed on the upper surface including these pits.
  • Reference numeral 33 denotes a protective coating.
  • FIG. 11 shows the operation of the hologram chip shown in FIG.
  • red light R, green light G, and blue light B are incident on the hologram chip having such a configuration
  • red light R, green light G, and blue light B are incident on the hologram chip having such a configuration
  • only red light R is not emitted from the edge of the pit 31 R as shown in FIG. green light G and blue light B is emitted
  • only the green light G is the edge of the pit 31 G is not emitted
  • the other red light R and the blue light B is emitted
  • the blue light B at the edge of the pit 31 B only it does not exit
  • the other red light R ⁇ color light G emitted in other parts, including the edge of the pit 31 W if all of the light emitted.
  • Signals by these emitted lights R, G, and B are shown in (b), (c), and (d).
  • FIG. 12 shows another embodiment 3 of the basic structure of the multicolor pit. Unlike the multicolor pit embodiments 1 and 2, in this embodiment, a plurality of types of resins having different refractive indexes of the resin filled in the pits are used.
  • reference numeral 35 denotes a hologram chip substrate.
  • a reflective layer 38 of metal or the like is formed.
  • Some of the pits are filled with resin 37 R , 37 G , 37 B , 37 W whose refractive index is selected so that the effective depth is 1/4 of the wavelength of green light G and blue light B. .
  • the resin 37 W is a reflector that reflects light of all wavelengths.
  • Reference numeral 39 denotes a protective coating.
  • FIG. 13 shows the operation of the hologram chip shown in FIG.
  • red light R, green light G, and blue light B are incident on the hologram chip having such a configuration
  • only red light R is not emitted from the edge of the pit 31R as shown in FIG.
  • the light G and the blue light B are emitted, only the green light G is not emitted at the edge of the pit 31 G , the other red light R and the blue light B are emitted, and only the blue light B is emitted at the edge of the pit 31 B.
  • signals by these emitted lights R, G, and B are shown in (b), (c), and (d).
  • FIG. 14 shows another embodiment 4 of the basic structure of the multicolor pit.
  • reference numeral 40 denotes a hologram chip substrate.
  • a reflective layer 42 of metal or the like is formed.
  • Some of the pits are filled with resin 41 R , 41 G , 41 B whose refractive index is selected so that the effective depth is 1/4 of the wavelength of green light G and blue light B.
  • the remaining pits 41 N are filled with a resin that collects light of all wavelengths, and the pits 41 W are filled with a resin that reflects light of all wavelengths.
  • Reference numeral 43 denotes a protective coating.
  • FIG. 15 shows the operation of the hologram chip shown in FIG.
  • red light R, green light G, and blue light B are incident on the hologram chip having such a configuration
  • red light R, green light G, and blue light B are incident on the hologram chip having such a configuration
  • only red light R is not emitted from the edge of the pit 41 R as shown in FIG. green light G and blue light B is emitted
  • only the green light G is the edge of the pit 41 G is not emitted
  • the other red light R and the blue light B is emitted
  • the blue light B at the edge of the pit 41 B Only the other red light R and green light G are emitted, and not all the light is emitted at the edge and inside of the pit 41 N , and all other parts including the edge and inside of the pit 41 are emitted.
  • Light is emitted. Signals by these emitted lights R, G, and B are shown in (b), (c), and (d).
  • FIG. 16 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by projections.
  • reference numeral 50 denotes a hologram chip substrate, on which a projection 52 having a height of a quarter wavelength of the used incident light and a flat portion 51 on which no projection is formed are arranged.
  • the hologram chip base 50 and the protrusion 52 are formed with a reflective layer of metal or the like thereon.
  • Reference numeral 53 denotes a protective coating.
  • FIG. 17 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by projections.
  • reference numeral 55 denotes a hologram chip base, and projections 56 R and 56 G having a height that is 1 ⁇ 4 of the wavelength of the incident light used, for example, red light R, green light G, and blue light B, on the hologram chip base 55. , 56 B and the flat portion 56 W which pits are not formed is disposed.
  • a reflective layer such as a metal is formed on the hologram chip base 55 and the protrusions 56 R , 56 G , 56 B .
  • Reference numeral 58 denotes a protective coating.
  • An embossed hologram chip that obtains an embossed hologram with pits and protrusions will be described.
  • FIG. 18 shows an embossed hologram chip for obtaining a monochromatic embossed hologram by pits and protrusions.
  • reference numeral 60 denotes a hologram chip base.
  • the hologram chip base 60 has a pit 63 having a depth of 1 ⁇ 4 wavelength of the used incident light, a protrusion 62 having a height of 1 ⁇ 4 wavelength of the used incident light, and a pit.
  • a flat portion 61 on which no protrusion is formed is disposed.
  • the hologram chip base 60, the pits 63, and the protrusions 62 are formed with a reflective layer such as metal.
  • Reference numeral 65 denotes a protective coating.
  • the incident light dip similar to that shown in FIG. 1 occurs at the edge of the pit 63 and the edge of the protrusion 62.
  • the signal by this emitted light is shown in (c).
  • the embossed hologram Similar to the embossed hologram, there is a phenomenon of structural color expressed by a transparent medium having a thickness of 1/4 of the wavelength of the light, whereas the embossed hologram does not emit only light having a quarter wavelength.
  • the structural color is a phenomenon that 1 ⁇ 4 wavelength light is emitted strongly. That is, when light is incident, the light is not observed in the embossed hologram, whereas in the structural color, the light is observed stronger than the other light.
  • a hologram-structural color chip that can simultaneously use an embossed hologram and a structural color will be described.
  • hologram flakes or simply “holograms (flakes)” that exhibit structural colors are commercially available.
  • Hologram flakes are not holograms but, like holograms, transparent bodies that are not colored by light interference appear to be colored.
  • a structural color developing body such as a hologram frame is called a structural color piece.
  • 70 is a thin layer of a translucent medium having a thickness d of, for example, a PET resin, placed in a medium having an absolute refractive index n 0 , and the absolute refractive index is n 1 .
  • Reference numeral 71 denotes an incident surface of the translucent medium 70
  • reference numeral 72 denotes a reflecting surface.
  • the reflective surface 72 may be a reflective film such as a metal.
  • the incident light having a wavelength ⁇ 1 that is perpendicularly incident on the incident surface 71 of the translucent medium 70 having the absolute refractive index n 1 from the medium having the absolute refractive index n 0 is A part of the light is reflected by the incident surface 71 of the medium having a different refractive index, and the other part is incident on the translucent medium 70.
  • the light of wavelength ⁇ 1 is incident on the translucent medium 70 perpendicularly, that is, with an incident angle ⁇ of 0 °, but here, it is displayed with a slight angle in the relationship shown in the figure.
  • the light incident on the light-transmitting medium 70 is reflected by the output end face 72 due to the difference in the refractive index of the medium, and is emitted from the light-transmitting medium 70 having the refractive index n 1 into the medium having the absolute refractive index n 0. Is done.
  • the wavelength ⁇ 3 of the light thus selected and emitted or the wavelength of the light ⁇ 4 not emitted depends on the cosine “cos ⁇ r ” of the refraction angle ⁇ r .
  • Reflection angle theta r depends on the incident angle theta i, since the incident angle theta i varies steplessly between 90 ° from 0 °, and emits lists the results is selected in (a) and (c)
  • the wavelength of light or non-emitted light shown in (c) and (d) also changes steplessly.
  • the color that appears in this way is called a structural color, and many colors that have a complex color due to the multi-layer structure exist in nature such as bird feathers, beetle feathers, butterfly scales, and shells.
  • FIG. 21 shows an explanation of the principle of a hologram-structured color chip constituted by pits.
  • reference numeral 70 denotes a base 71, a translucent cover, 72 and 73, pits, 74, a translucent resin, and 75, 76, a light reflecting material such as metal.
  • the base 71, the translucent cover 72, and the translucent resin 74 have different refractive indexes.
  • the optical length of the pit 72 is different from the physical length. Therefore, light having a wavelength of ⁇ 1 is not emitted in a portion where the reflective film is present, and a structural color having a wavelength of ⁇ 2 due to the translucent resin 74 is observed in the pit except the portion where the reflective film 75 is present.
  • the optical length of the pit 73 is different from the physical length. Therefore, light having a wavelength of ⁇ 3 is not emitted in a portion where the reflective film is present, and a structural color having a wavelength of ⁇ 4 due to the translucent resin 71 is observed in the pit except the portion where the reflective film 76 is present. In addition, a structural color of ⁇ 5 depending on the thickness of the translucent cover is observed in a portion where no pit exists.
  • FIG. 22 illustrates the principle of a hologram-structural color chip constituted by protrusions.
  • reference numeral 80 denotes a base 81, a translucent cover, 82, 83 a projection made of a translucent resin, and 84, 85, a light reflecting material such as metal.
  • the base body 80, the translucent cover 81, and the translucent resins 82 and 83 have different refractive indexes.
  • the protrusions 82 and 83 are translucent resin, the optical height of the protrusions 82 and 83 is different from the physical height due to the refractive index. Therefore, light having a wavelength of ⁇ 1 corresponding to the refractive index of the translucent cover 81 is not emitted due to the hologram phenomenon in the portion where the reflection film 84 of the protrusion 82 is present, and the translucent resin 82 is present in a portion where the reflection film 84 is not present. A structural color phenomenon appears and light of ⁇ 2 corresponding to the refractive index is observed. A structural color of ⁇ 2 corresponding to the refractive index of the translucent resin 83 is observed when the reflection film 85 of the protrusion 83 is inside, and all light is emitted when the reflection film 85 is present.
  • the thickness of the cover material is optically meaningful, a structural color of a different wavelength can be obtained between the cover material and the upper surface of the base material or protrusion.
  • FIG. 23 shows a first embodiment of the embossed hologram chip manufacturing method.
  • Reference numeral 1 in (a) denotes an original plate having an area equivalent to 16 embossed hologram chips.
  • Pits 103 are formed on the original plate 1.
  • the original plate 1 on which the pits 103 are formed in this way is cut into an appropriate size as shown in FIG.
  • FIG. 24 shows a manufacturing method for forming an embossed hologram chip directly on a card or the like.
  • Reference numeral 105 in (a) denotes an original plate having an area equivalent to 16 cards. By forming a pit in a part of the original plate 105 using a mask or the like, a card original plate with a chip 107 is obtained, and the original plate is cut as shown in FIG. .
  • FIG. 25 shows a chip manufacturing method in which the pit arrangement is fixed and only pit information is determined by chance.
  • Reference numeral 110 in (a) denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged on the entire chip original plate 110.
  • a light-transmitting uncured resin is sprayed on this original plate and cured to obtain a chip original plate, and this original plate is cut as shown in FIG.
  • FIG. 26 shows a manufacturing method of another form of the chip shown in FIG.
  • Reference numeral 115 in (a) denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged over the entire surface excluding the pit corresponding to the outermost peripheral portion of the chip. Has been.
  • FIG. 27 shows a manufacturing method of still another embodiment of the chip shown in FIG.
  • Reference numeral 120 in (a) denotes an original plate having an area equivalent to 16 chips, and pits are regularly or irregularly arranged over the entire surface of the chip original plate 120.
  • a non-curable resin is injected or masked into a hole corresponding to a portion corresponding to the outermost peripheral portion of the chip.
  • a light-transmitting uncured resin is sprayed on the original plate and cured to obtain a chip original plate with authentication information, and this original plate is cut into an appropriate size as shown in FIG.
  • FIG. 28 shows a chip manufacturing method in which pits are irregularly arranged.
  • the shape of the pit is not circular but elongated, but a circular pit can also be formed.
  • Reference numeral 130 in FIG. 4A denotes an original plate having an area equivalent to 16 chips.
  • the original chip plate 130 elongated pits are irregularly arranged over the entire surface of the chip.
  • the pits having such a shape are obtained by spraying a liquid material that corrodes or dissolves the original plate on the original plate 130 from an inclined direction. In addition, if sprayed from the vertical direction, the shape of the pit becomes circular.
  • a light-transmitting uncured resin is sprayed on the original plate and cured to obtain a chip original plate with authentication information, and this original plate is cut as shown in FIG.
  • an original plate on which pits having the same depth are formed in advance for a monochromatic hologram is used.
  • the pits can be arranged either regularly or irregularly, but the embodiment will be described with reference to an original plate having regularly arranged pits.
  • the original plate can be any of those having the area of a plurality of chips shown in FIGS. 27 to 29 and those having the area of a single chip.
  • FIG. 29 shows the most basic embodiment.
  • 140 shown in (1) is a chip original plate in which pits 141 having a depth of 1 ⁇ 4 of the wavelength of the used light are formed in advance.
  • Uncured resin monomer that is not irradiated with ultraviolet rays and is not cured is removed from the pits.
  • the reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.
  • FIG. 30 shows another embodiment.
  • 140 shown in (1) is a chip original plate in which pits 141 having a depth of 1 ⁇ 4 of the wavelength of the used light are formed in advance.
  • the uncured resin monomer 143 is filled into pits that are not final pits.
  • a thermosetting resin is used in addition to the ultraviolet curable resin.
  • the reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.
  • incident light is not emitted from the edge of the pit 141 but emitted from other portions.
  • FIG. 31 shows still another embodiment.
  • 140 shown in (1) is a chip original plate in which pits 141 having a depth of 1 ⁇ 4 of the wavelength of the used light are formed in advance.
  • a photoresist film 146 is applied to the entire surface.
  • the photoresist film at the position to be pits is irradiated with ultraviolet rays to form a cured photoresist film 147.
  • the reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.
  • FIG. 32 shows still another embodiment.
  • 140 shown in (1) is a chip original plate in which pits 141 having a depth of 1 ⁇ 4 of the wavelength of the used light are formed in advance.
  • a protective film 147 is formed on the uncured resin monomer 143 of the pit that is finally formed as a pit.
  • a thermosetting resin is used in addition to the ultraviolet curable resin.
  • the reflective film 142 is formed on the inner surface of the original plate, the cured resin, and the pits.
  • incident light is not emitted from the edge of the pit 141 but emitted from other portions.
  • Example 11 of Embossing Hologram Chip Manufacturing Method In the embodiments of FIGS. 29 to 32, the chip original plate on which pits having a depth of 1 ⁇ 4 of the wavelength of the used light are formed is used. Can also be supported.
  • a pit is formed on a flat original plate using a stamper without using an original plate on which a pit having the same depth for a monochromatic hologram is previously formed.
  • the pits can be arranged either regularly or irregularly, but the embodiment will be described with reference to an original plate having regularly arranged pits.
  • the original plate can be any of those having the area of a plurality of chips shown in FIGS. 27 to 29 and those having the area of a single chip.
  • FIG. 33 shows the most basic embodiment.
  • 150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of 1 ⁇ 4 of the wavelength of the used light is previously formed.
  • the stamper 154 is formed using the chip original plate mold in which the pit mold is formed.
  • the reflective film 162 is formed on the original plate 160 with pits.
  • FIG. 34 shows another embodiment.
  • 150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of 1 ⁇ 4 of the wavelength of the used light is previously formed.
  • the uncured resin monomer 152 is filled into a pit type that is not a final pit.
  • a thermosetting resin is used in addition to the ultraviolet curable resin.
  • the stamper 154 is formed using the chip original plate mold in which the pit mold is formed.
  • FIG. 35 shows still another embodiment.
  • 150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of 1 ⁇ 4 of the wavelength of the used light is previously formed.
  • a photoresist film 156 is applied to the entire surface.
  • the stamper 154 is formed using the chip original plate mold in which the pit mold is formed.
  • FIG. 36 shows still another embodiment.
  • 150 shown in (1) is a chip original plate mold such as a mold in which a pit mold 151 having a depth of 1 ⁇ 4 of the wavelength of the used light is previously formed.
  • a protective film 155 is formed on a pit-type uncured resin monomer 152 that is finally formed into a pit-type.
  • a thermosetting resin is used in addition to the ultraviolet curable resin.
  • the stamper 154 is formed using the chip original plate mold in which the pit mold is formed.
  • the stamper 154 is released from the chip original plate mold 150.
  • a chip original plate in which a pit type having a depth of 1 ⁇ 4 of the wavelength of the used light is formed is used.
  • a pit type depth of 1 ⁇ 4 of the wavelength of the used light is formed.
  • FIG. 37 170 is a chip in which pits 171 are irregularly arranged, and (a) is a view from above. (B) And (c) is sectional drawing at the time of using the pit 171.
  • FIG. 37 170 is a chip in which pits 171 are irregularly arranged, and (a) is a view from above. (B) And (c) is sectional drawing at the time of using the pit 171.
  • the pits are formed by opening the substrate 170 to a depth of a quarter wavelength of the used light by means such as etching.
  • Reference numeral 172 denotes a cover.
  • the substrate 170 by opening it in a thin film having a quarter wavelength of the used light, instead of etching the substrate 170.
  • FIG. 1 is sectional drawing at the time of using the protrusion 176.
  • FIG. 1 The protrusions 176 are formed by spreading thin pieces having a thickness of 1 ⁇ 4 wavelength of the used light on the base 175.
  • Reference numeral 177 denotes a cover.
  • FIG. 38 180 is a chip in which pits 181R, 181G, 181B having different depths are irregularly arranged, and (a) is a view from above. (B) And (c) is sectional drawing at the time of using the pit 171.
  • the pits are formed by opening the substrate 180 to a depth of a quarter wavelength of the used light by means such as etching.
  • Reference numeral 182 denotes a cover.
  • the substrate 180 by opening it in a thin film having a quarter wavelength of the used light, instead of etching the substrate 180.
  • FIG. 1 is sectional drawing at the time of using the protrusion 176.
  • FIG. 1 The protrusions 176 are formed by spreading thin pieces 186R, 186G, and 186B having a thickness of 1 ⁇ 4 wavelength of the used light on the base 175.
  • Reference numeral 187 denotes a cover.
  • the card having the authentication chip and the authentication chip described above can be used for a bank cash card, credit card, prepaid card, point card, securities, ID card, entrance certificate, certificate, and the like.
  • an optical pattern is generated by the interference of incident light and reflected light as in the embossed hologram, that is, a chip made of natural or artificial material that emits nacreous or has an iridescent color is used in place of the hologram chip.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

L'invention porte sur une structure de puce holographique en relief qui peut être utilisée efficacement dans la discrimination de cartes falsifiées ou de produits de contrefaçon ; l'invention porte également sur un procédé pour la fabrication d'une puce holographique en relief. Par formation régulière de creux ayant une profondeur d'un quart de la longueur d'onde de la lumière utilisée dans un substrat de puce holographique en relief et par remplissage aléatoire de ces creux avec de la résine ou analogue, lesdits creux remplis sont transformés en des creux holographiques non en relief tandis que les creux restants deviennent des creux holographiques en relief. De plus, des saillies ayant une hauteur d'un quart de la longueur d'onde de la lumière utilisée sont formées aléatoirement par distribution de paillettes fines, par exemple, sur le substrat de puce holographique en relief, pour être des saillies holographiques en relief. Les puces sont fabriquées individuellement ou une grande puce est produite et découpée en conséquence. De plus, une machine à poinçonner peut être utilisée dans le procédé de fabrication.
PCT/JP2009/069603 2008-11-19 2009-11-19 Puce holographique en relief et procédé de fabrication de celle-ci WO2010058809A1 (fr)

Priority Applications (1)

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JP2010539245A JP5674127B2 (ja) 2008-11-19 2009-11-19 エンボスホログラムチップ及びその製造方法

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JP2008296138 2008-11-19
JP2008-296138 2008-11-19

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WO2010058809A1 true WO2010058809A1 (fr) 2010-05-27

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TW (1) TWI506561B (fr)
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RU2777614C2 (ru) * 2017-09-06 2022-08-08 Овд Кинеграм Аг Способ изготовления голограммы, а также защитный элемент и защищенный документ
US11679616B2 (en) 2017-09-06 2023-06-20 Ovd Kinegram Ag Method for producing a hologram, and security element and a security document

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JPH07272317A (ja) * 1994-03-30 1995-10-20 Hitachi Ltd 情報記録媒体及びその製造方法
WO2007072794A1 (fr) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. Carte pouvant être authentifiée par une puce holographique
JP2008107483A (ja) * 2006-10-24 2008-05-08 Toppan Printing Co Ltd Ｏｖｄ媒体及びｏｖｄ媒体が貼付された情報印刷物並びにｏｖｄ媒体の製造方法

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JPH07272317A (ja) * 1994-03-30 1995-10-20 Hitachi Ltd 情報記録媒体及びその製造方法
WO2007072794A1 (fr) * 2005-12-19 2007-06-28 International Frontier Technology Laboratory, Inc. Carte pouvant être authentifiée par une puce holographique
JP2008107483A (ja) * 2006-10-24 2008-05-08 Toppan Printing Co Ltd Ｏｖｄ媒体及びｏｖｄ媒体が貼付された情報印刷物並びにｏｖｄ媒体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2777614C2 (ru) * 2017-09-06 2022-08-08 Овд Кинеграм Аг Способ изготовления голограммы, а также защитный элемент и защищенный документ
US11679616B2 (en) 2017-09-06 2023-06-20 Ovd Kinegram Ag Method for producing a hologram, and security element and a security document

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JP5674127B2 (ja) 2015-02-25
JPWO2010058809A1 (ja) 2012-04-19
TWI506561B (zh) 2015-11-01
TW201032140A (en) 2010-09-01

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