WO2010055621A1 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- WO2010055621A1 WO2010055621A1 PCT/JP2009/005796 JP2009005796W WO2010055621A1 WO 2010055621 A1 WO2010055621 A1 WO 2010055621A1 JP 2009005796 W JP2009005796 W JP 2009005796W WO 2010055621 A1 WO2010055621 A1 WO 2010055621A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- ethanol
- mass
- heat transfer
- liquid refrigerant
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/006—Preventing deposits of ice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a boiling cooling device using a refrigerant.
- a boiling cooling device is a device that cools a heating element by using a phase change from a liquid of a refrigerant to a gas.
- the liquid refrigerant that receives heat from the heating element is often an alcohol.
- Patent Document 1 Japanese Patent Application Laid-Open No. 4-257893 (Patent Document 1) describes a mixed solution of water (100) and lower alcohol (5 to 12).
- the refrigerant here is intended mainly for heat pipes used for cooling indoor equipment, and does not freeze at about ⁇ 10 ° C. and is nonflammable.
- Patent Document 2 Japanese Utility Model Publication No. 62-8571
- Patent Document 2 describes a mixture of water and alcohol.
- the refrigerant is prevented from freezing by changing the mixing ratio of water and alcohol.
- the limit heat flux is smaller than that of water, and burnout (film boiling) may occur for a heating element that generates a high heat flux. If the heat flux received near the heat transfer surface that transfers the heat of the heating element to the liquid refrigerant exceeds the critical heat flux of the liquid refrigerant, a burnout phenomenon occurs.
- the refrigerant has a higher melting point (freezing point) than alcohol and easily freezes. This cannot clear the general required specification (no frost at about -30 ° C) of the boiling cooling device mounted on the vehicle.
- the heat transfer efficiency may be reduced.
- the heat flux heat generation density
- the heat flux increases (for example, 1 MW / m 2 ), and a burnout is likely to occur in a mixed solution having a small critical heat flux. In a region where burnout occurs, heat transfer is not performed and cooling performance is degraded.
- Patent Document 1 a composition liquid in which alcohol is mixed at 20% by volume or more has a problem that the decrease in latent heat is larger than that of water. Describes a method of ensuring heat transport by reducing the proportion of alcohol, such as volume%. Therefore, in the case of mixing a large amount of alcohol (20% by volume or more), there is no suggestion about the type or mixing ratio of the alcohol.
- Patent Document 2 it is described in Table 1 that the freezing point can be set to ⁇ 29 ° C. by using a mixed solution in which 40% of alcohol is mixed with 60% of water. In order to do so, it is necessary to further increase the mixing ratio of the alcohol. However, when the mixing ratio of alcohol is increased, the amount of heat transport is reduced and burnout is likely to occur, but no countermeasure has been suggested.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a boiling cooling device that can prevent the liquid refrigerant from freezing and suppress the occurrence of burnout.
- the boiling cooling device of the present invention is a boiling cooling device that is provided in a vehicle and includes a storage portion that stores therein a liquid refrigerant that receives heat from a heating element, and the liquid refrigerant is a mixture of water and ethanol.
- the ethanol concentration of the mixed solution is 40% by mass or more.
- the boiling cooling device of the present invention may further include a condensing unit that is connected to the housing unit and condenses the liquid refrigerant boiled by the heat of the heating element, and may be a sealed system.
- the melting point becomes less than ⁇ 30 ° C., and the specifications generally required for mounting on a vehicle (for example, freezing at ⁇ 30 ° C.) are cleared. be able to. Furthermore, the limit heat flux of the liquid refrigerant becomes larger than the alcohol single component because water is contained in the mixed liquid. Thereby, the occurrence of burnout is suppressed.
- ethanol has a greater heat of vaporization (latent heat) than other alcohols. Therefore, the limit heat flux becomes larger by using ethanol. Furthermore, ethanol has a relatively low boiling point, improves heat circulation efficiency, and is effective as a boiling cooling refrigerant. In addition, since ethanol has a boiling point that is not too low, the boiling point is generally higher than the temperature (for example, about 65 ° C.) of a refrigerant (for example, cooling water) used for condensation in the condensing unit, and is more suitable for boiling cooling.
- a refrigerant for example, cooling water
- the liquid refrigerant composed of water and ethanol is used, so that the liquid refrigerant is prevented from freezing and the occurrence of burnout is suppressed.
- the ethanol concentration of the mixed solution is preferably 45% by mass or more and 75% by mass or less. Thereby, freezing is prevented more reliably and burnout is suppressed. Furthermore, the ethanol concentration of the mixed solution is preferably 45% by mass or more and 55% by mass or less.
- the housing portion includes a heat transfer wall portion that transmits heat of the heating element to the liquid refrigerant, and an opposite wall portion that faces the heat transfer wall portion via the liquid refrigerant, and the heat transfer wall portion and the opposite wall portion. Is preferably 3 mm or less. Thereby, a heat transfer rate improves and cooling performance improves. Furthermore, the separation distance between the heat transfer wall and the opposing wall is preferably 2 mm or less. Furthermore, it is preferable that the separation distance between the heat transfer wall and the opposing wall is 0.5 mm or more and 1.5 mm or less.
- the freezing of the liquid refrigerant can be prevented and the occurrence of burnout is suppressed.
- FIG. 1 is a perspective view showing a boiling cooling device 1.
- FIG. FIG. 2 is a cross-sectional view taken along the line AA in FIG. It is a figure which shows the characteristic of each alcohol. It is a figure which shows the relationship between the ethanol density
- FIG. 3 is a view corresponding to a cross-sectional view taken along the line AA showing the boiling cooling device 100.
- FIG. 1 is a perspective view showing a boiling cooling device 1.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 shows the characteristics of each alcohol.
- FIG. 4 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the critical heat flux.
- FIG. 5 is a diagram illustrating the relationship between the separation distance and the heat transfer coefficient.
- FIG. 6 is a diagram showing the relationship between the return separation distance and the heat transfer coefficient.
- FIG. 7 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the heat transfer coefficient.
- FIG. 8 is a schematic diagram for explaining film boiling.
- FIG. 1 is a perspective view showing a boiling cooling device 1.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 shows the characteristics of each alcohol.
- FIG. 4 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the critical heat flux.
- FIG. 9 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the element temperature.
- FIG. 10 is a view corresponding to a cross-sectional view taken along the line AA showing the boiling cooling device 100. 4 is quoted from “Matorir, AS, Heat transfer Soviet Research, 5-1 (1973), 85-89”.
- the boiling cooling device 1 is composed of a container Y in which an internal space is partitioned by a partition plate 5, and includes a storage unit 2 and a condensing unit 3.
- the accommodating part 2 is a metal container having a rectangular parallelepiped section, and stores a liquid refrigerant therein.
- the accommodating portion 2 includes a heat receiving passage 21, a supply passage 22, and a partition plate 23.
- the heat receiving passage 21 is roughly surrounded by a side wall surface (four surfaces) including a side wall surface including the heat transfer wall portion 21a to which the heating element Z of the housing portion 2 is attached and a partition plate 23 facing the side wall surface. It is a part.
- the partition plate 23 forms a side surface of the heat receiving passage 21 and a side surface of the supply passage 22, and partitions the internal space of the housing portion 2 into the heat receiving passage 21 and the supply passage 22.
- the heating element Z is, for example, a semiconductor element.
- the heat receiving passage 21 has a substantially rectangular parallelepiped shape, and the upper portion is opened and connected to the condensing unit 3, and the lower portion is opened and connected to the supply passage 22.
- the heat transfer wall 21a and the partition plate 23 are parallel.
- the separation distance between the heat transfer wall portion 21a and the partition plate 23 is approximately 1 mm.
- the heat receiving passage 21 contains liquid refrigerant inside.
- the heat transfer wall 21a of the heat receiving passage 21 is a part that transfers the heat of the heating element Z to the liquid refrigerant.
- the liquid refrigerant in the heat receiving passage 21 boils by receiving heat from the heating element Z, and rises in the liquid refrigerant as bubbles.
- the supply passage 22 will be described later.
- the condensing part 3 is located above the accommodating part 2, and the lower part is open and continues to the heat receiving passage 21 and the supply passage 22.
- a condensing pipe 31 is provided in the condensing unit 3. Cooling water flows through the condensation pipe 31. The condensing unit 3 cools and condenses the steam rising from the heat receiving passage 21.
- the supply passage 22 is a portion on the other side in parallel with the heat receiving passage 21 and the inside of the accommodating portion 2 partitioned from the heat receiving passage 21 by the partition plate 5.
- the supply passage 22 is open at the top and connected to the condensing unit 3, and is opened at the bottom and is connected to the heat receiving passage 21.
- the liquid refrigerant condensed in the condensing unit 3 is mainly dropped into the supply passage 22 as droplets.
- the supply passage 22 receives the liquid refrigerant dripped from the condensing unit 3 and supplies the liquid refrigerant to the heat receiving passage 21 from below by a pressure difference.
- the boiling cooling device 1 is completely sealed.
- the liquid refrigerant is sealed in a vacuum container (boiling cooling device 1).
- the liquid refrigerant accommodated in the accommodating portion 2 will be described.
- the liquid refrigerant is a mixed liquid of water and ethanol.
- the ethanol concentration of this mixed solution is approximately 50% by mass (wt%).
- Ethanol has a relatively low boiling point of 78.6 ° C.
- Ethanol has a low boiling temperature and is effective as a refrigerant for the boiling cooling device.
- cooling water of approximately 65 ° C. is caused to flow through the condensation pipe 31.
- the boiling point should be reasonably higher than 65 ° C. Also in this respect, it is effective to use ethanol for the mixed solution.
- ethanol has a heat of evaporation (latent heat) of 855 [kJ / kg], and has a higher heat of evaporation than other alcohols. For this reason, ethanol has a large critical heat flux. That is, it is possible to increase the critical heat flux (MW / m 2 ) in the mixed solution of water and ethanol, compared to using other alcohols. Since the critical heat flux is proportional to the heat flux causing burnout, it is advantageous that the critical heat flux is large. Note that the heat of evaporation of water is greater than that of ethanol.
- ethanol has a lower melting point ( ⁇ 114.1 ° C.) than other alcohols. For this reason, the amount of mixing required to bring the mixed liquid to the target melting point temperature (here, less than ⁇ 30 ° C.) may be smaller than that of other alcohols.
- the evaporation heat of water is larger than that of alcohols, and the limit heat flux of the mixed liquid becomes larger as the water component is larger. Ethanol can lower the melting point even with a relatively small amount, and as a result, the water component can be increased and the critical heat flux can be increased.
- ethanol is optimal for mixing with water.
- HFE-7200 is used for mixing with water. As shown in FIG. 3, HFE-7200 has a lower melting point than ethanol and is effective in lowering the melting point of the mixed solution. However, since the heat of evaporation is much smaller than that of ethanol, it is difficult to ensure appropriate heat of evaporation after mixing. That is, it becomes difficult to suppress the occurrence of burnout.
- the critical heat flux is different when the ethanol concentration is different in the mixed solution of water and ethanol.
- the magnitude of the critical heat flux is proportional to the magnitude of the heat flux at which burnout occurs.
- the critical heat flux is large when the ethanol concentration is about 75% by mass or less. That is, it is preferable to use a mixed solution having an ethanol concentration of about 75% by mass or less for suppressing burnout.
- the lower the ethanol concentration the higher the melting point and the easier it is to freeze.
- the liquid refrigerant is generally required not to freeze at about ⁇ 30 ° C.
- the freezing experiment of the liquid mixture whose ethanol concentration is 40 mass% was conducted.
- the mixed solution did not freeze in the ⁇ 35 ° C. atmosphere. That is, when the ethanol concentration is 40% by mass or more, the mixed solution has a melting point lower than that and does not freeze even at ⁇ 30 ° C.
- the required specifications for on-vehicle installation can be cleared.
- the critical heat flux is larger than that of the ethanol single component.
- the liquid refrigerant used in the boiling cooling device of the vehicle is preferably a mixed liquid (water + ethanol) having an ethanol concentration of 40% by mass to 75% by mass. According to this, freezing is prevented and burnout is suppressed.
- the ethanol concentration is preferably 45% by mass or more.
- the melting point becomes lower than ⁇ 40 ° C., and the required specification in a cold region (not frozen at ⁇ 40 ° C.) can be cleared. That is, by using a mixed solution having an ethanol concentration of 45 to 75% by mass, freezing can be more reliably prevented, and the critical heat flux can be increased to suppress burnout.
- Non-Patent Document 1 describes that heat transfer is promoted as compared to pool boiling when the distance (the gap between the heat transfer wall 21a and the partition plate 23) is reduced. For example, when the separation distance is 2 mm, 1 mm, and 0.6 mm, heat transfer is significantly promoted in the low heat flux region. The greater the heat transfer rate, the better the cooling performance.
- the difference in the heat transfer coefficient was tested by changing the above-mentioned separation distance.
- a mixed solution having an ethanol concentration of 60% by mass is used.
- the heat flux of the heating element is 1 to 2 (MW / m 2 ).
- the heat transfer coefficient is increased when the separation distance is 2 mm or less.
- the critical bubble diameter of the mixture of water and ethanol is about 1.5 mm, and it is considered that good heat transfer is performed up to 3 mm, which is twice as much as the maximum. That is, if the separation distance is 3 mm or less, it is advantageous in terms of heat transfer.
- the separation distance is 2 mm or less.
- a more preferable separation distance is 0.5 mm or more and 1.5 mm or less centering on 1 mm.
- return separation distance the separation distance between the partition plate 23 and the wall portion 22a on the supply passage 22 side.
- a return separation distance of about 2 mm is suitable.
- the return separation distance of this embodiment is 2 mm.
- the heat transfer coefficient experiment was performed by changing the ethanol concentration of the mixed solution by setting the separation distance between the heat transfer wall portion 21a and the partition plate 23 to 1 mm.
- a high heat transfer coefficient (approximately 7.8 ⁇ 10 4 [W / m 2 ⁇ K]) is obtained.
- a high heat transfer coefficient (60% by mass: approximately 6.5 ⁇ 10 4 [W / m 2 ⁇ K], 70% by mass: approximately 6.3 ⁇ 10 4 [W / m]. 2 ⁇ K]).
- the critical heat flux is gradually increased from 75% by mass to 30% by mass.
- the ethanol concentration is approximately 45 mass centered on 50 to 70 mass% of the high heat transfer coefficient.
- % To 75% by mass is suitable for mounting on a vehicle. Further, it is preferably 45% by mass or more and 55% by mass or less, centering on 50% by mass of the highest heat transfer coefficient.
- the cause of the improvement in the heat transfer coefficient is considered to be a difference in physical properties of water vapor and ethanol vapor against boiling in a narrow gap of a separation distance of 3 mm or less.
- the separation distance is 1 mm, and the ethanol concentration of the mixed solution is 50% by mass.
- burnout particularly film boiling, occurs in the vicinity of the inner surface of the heat transfer wall portion 21a corresponding to the central portion (the portion having the highest temperature) of the heating element Z, as shown in FIG.
- the liquid refrigerant cannot contact the heat transfer wall portion 21a, and heat transfer is not performed. According to this, cooling performance will fall.
- the heat transfer is expanded to the surroundings avoiding the film boiling region. That is, the heat conduction distance becomes long. Thereby, heat resistance becomes large with respect to the heat transmitted through the heat transfer wall portion 21a, and the heat transfer performance is also deteriorated.
- film boiling may occur in an ethanol single component liquid refrigerant.
- the occurrence of film boiling can be suppressed by using the above-described preferred mixed liquid as a liquid refrigerant.
- the liquid refrigerant comes into contact with the inner surface of the heat transfer wall 21a, and the expansion of heat during heat transfer is prevented.
- the heat conduction distance is also shortened, and the cooling performance and heat transfer performance are improved.
- the element temperature is high when the ethanol concentration is 80 to 100% by mass regardless of the heat generation density. That is, it is understood that the ethanol concentration is preferably 80% by mass or less. This result also shows that an ethanol concentration of 40 to 75% by mass is effective.
- the separation distance is 1 mm and the ethanol concentration is 50% by mass, but these numerical values do not exclude errors. Even if there is a slight deviation in the numerical value, the above effect is exhibited. That is, the numerical values in the present embodiment have a certain range, and a slight shift due to an error or the like is included in the present embodiment.
- the ethanol concentration is 50% by mass
- the lower limit may be 49 to 48% by mass and the upper limit may be within the range of 51 to 52% by mass.
- the separation distance of 1 mm may be 0.9 to 1.1 mm.
- the boiling cooling device may have a configuration shown in FIG. FIG. 10 is a view corresponding to a cross-sectional view taken along the line AA showing the boiling cooling device 100.
- the boiling cooling device 100 includes a condensing unit 30 and an accommodating unit 20 whose interior is partitioned by two partition plates 51 and 52.
- the housing unit 20 includes a first heat receiving passage 201, a second heat receiving passage 202, a supply passage 203, and partition plates 51 and 52.
- the first heat receiving passage 201 is a substantially rectangular parallelepiped, and is roughly surrounded by a side wall surface including the left partition plate 51 and a side wall surface including the heat transfer wall portions 201a and 201b to which the heating elements Z1 and Z2 are attached. It is a part.
- the second heat receiving passage 202 is a substantially rectangular parallelepiped, and is roughly surrounded by a side wall surface including the right partition plate 52 and a side wall surface including the heat transfer wall portions 202a and 202b to which the heating elements Z3 and Z4 are attached. It is a part.
- the heat receiving passages 201 and 202 are open at the top and connected to the condensing unit 30, and open at the bottom and connected to the supply passage 203.
- the heat receiving passages 201 and 202 contain the liquid refrigerant described above.
- the separation distance between the side wall surface including the heat transfer wall portions 201a and 201b and the partition plate 51 is 3 mm or less (here, approximately 1 mm).
- the separation distance between the side wall surface including the heat transfer wall portions 202a and 202b and the partition plate 52 is also 3 mm or less (here, approximately 1 mm).
- the supply passage 203 is a substantially rectangular parallelepiped, and is a portion sandwiched between the partition plate 51 and the partition plate 52. .
- the separation distance between the partition plate 51 and the partition plate 52 is approximately 2 mm.
- the condensing unit 30 is located above the heat receiving passages 201 and 202 and the supply passage 203.
- the condensing unit 30 is provided with condensing pipes 301 and 302 through which cooling water flows.
- the liquid refrigerant (mixed liquid) of the present embodiment accommodated in the heat receiving passages 201 and 202 receives heat from the heating elements Z1 to Z4 and boils.
- the rising steam is condensed in the condensing unit 30.
- the condensed liquid refrigerant is dripped mainly into the supply passage 203.
- the supply passage 203 receives the liquid refrigerant dripped from the condensing unit 3 and supplies the liquid refrigerant to the heat receiving passages 201 and 202 from below due to a pressure difference (see arrow in FIG. 10). Also by this, the same effect as this embodiment is exhibited by using the said liquid mixture.
- a heating element is composed of a substrate and a heating element provided on the substrate, a hole is formed in the side wall of the housing portion, and the substrate is disposed so as to close the hole.
- the structure may be such that is directly in contact with the refrigerant.
- the substrate is regarded as a part of the accommodating portion, and the substrate corresponds to the heat transfer wall portion.
- coolant may be sufficient.
- the heat exchanger is not limited to the heat exchanger in which the refrigerant is accumulated in the bottomed container, and may be a heat exchanger having a structure in which the refrigerant flows without accumulating. As mentioned above, according to this invention, even if it is these structures, the same effect as the above is exhibited.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
2、20:収容部、
21:受熱通路、 201:第一受熱通路、 202:第二受熱通路
22、203:供給通路、
21a、201a、201b、202a、202b:伝熱壁部、
3、30:凝縮部、 31、301、302:凝縮パイプ、
23、51、52:仕切板、
Z、Z1~Z4:発熱体
Claims (4)
- 発熱体の熱を受ける液体冷媒を内部に収容する収容部を備え、車両に搭載される沸騰冷却装置であって、
前記液体冷媒は、水とエタノールの混合液であり、
前記混合液のエタノール濃度は、40質量%以上であることを特徴とする沸騰冷却装置。 - 前記収容部に連なり、前記発熱体の熱によって沸騰した前記液体冷媒を凝縮させる凝縮部を更に備え、
前記沸騰冷却装置は密封系となっている請求項1に記載の沸騰冷却装置。 - 前記混合液のエタノール濃度は、45質量%以上75質量%以下である請求項1または2に記載の沸騰冷却装置。
- 前記混合液のエタノール濃度は、45質量%以上55質量%以下である請求項1~3の何れか一項に記載の沸騰冷却装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/127,356 US20110220327A1 (en) | 2008-11-17 | 2009-10-30 | Ebullient cooling device |
CN2009801447293A CN102209875A (zh) | 2008-11-17 | 2009-10-30 | 沸腾冷却装置 |
EP09825875A EP2348271A4 (en) | 2008-11-17 | 2009-10-30 | BOILING COOLING APPARATUS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008293254A JP4730624B2 (ja) | 2008-11-17 | 2008-11-17 | 沸騰冷却装置 |
JP2008-293254 | 2008-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010055621A1 true WO2010055621A1 (ja) | 2010-05-20 |
Family
ID=42169767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/005796 WO2010055621A1 (ja) | 2008-11-17 | 2009-10-30 | 沸騰冷却装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110220327A1 (ja) |
EP (1) | EP2348271A4 (ja) |
JP (1) | JP4730624B2 (ja) |
KR (1) | KR20110059799A (ja) |
CN (1) | CN102209875A (ja) |
WO (1) | WO2010055621A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
TW201437591A (zh) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | 熱管結構 |
US9763359B2 (en) * | 2015-05-29 | 2017-09-12 | Oracle International Corporation | Heat pipe with near-azeotropic binary fluid |
US10746474B2 (en) | 2016-04-11 | 2020-08-18 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
US10353445B2 (en) | 2016-04-11 | 2019-07-16 | Qualcomm Incorporated | Multi-phase heat dissipating device for an electronic device |
US9999157B2 (en) | 2016-08-12 | 2018-06-12 | Qualcomm Incorporated | Multi-phase heat dissipating device embedded in an electronic device |
WO2019221474A1 (ko) * | 2018-05-16 | 2019-11-21 | 한온시스템 주식회사 | 냉각 장치 |
US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
EP3963625A1 (en) * | 2019-04-29 | 2022-03-09 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107149A (ja) * | 1982-12-10 | 1984-06-21 | Fuji Electric Corp Res & Dev Ltd | 太陽熱集熱器 |
JPS628571U (ja) * | 1985-06-24 | 1987-01-19 | ||
JP2008028122A (ja) * | 2006-07-20 | 2008-02-07 | Tokyo Univ Of Science | 沸騰冷却方法、沸騰冷却装置およびその応用製品 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3777811A (en) * | 1970-06-01 | 1973-12-11 | Trw Inc | Heat pipe with dual working fluids |
US3933198A (en) * | 1973-03-16 | 1976-01-20 | Hitachi, Ltd. | Heat transfer device |
JP2874100B2 (ja) * | 1990-10-16 | 1999-03-24 | 富士通株式会社 | 電子装置の冷却装置 |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
JP3487382B2 (ja) * | 1994-12-28 | 2004-01-19 | 株式会社デンソー | 沸騰冷却装置 |
JP3608272B2 (ja) * | 1995-07-05 | 2005-01-05 | 株式会社デンソー | 沸騰冷却装置およびその製造方法 |
JP2003042672A (ja) * | 2001-07-31 | 2003-02-13 | Denso Corp | 沸騰冷却装置 |
KR100495699B1 (ko) * | 2002-10-16 | 2005-06-16 | 엘에스전선 주식회사 | 판형 열전달장치 및 그 제조방법 |
KR20070112370A (ko) * | 2005-01-03 | 2007-11-23 | 노이즈 리미트 에이피에스 | 버블 펌프를 구비한 다중 배향 냉각 시스템 |
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
US20120273164A1 (en) * | 2008-10-28 | 2012-11-01 | Jan Vetrovec | Thermal management for solid state high-power electronics |
-
2008
- 2008-11-17 JP JP2008293254A patent/JP4730624B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-30 KR KR1020117009558A patent/KR20110059799A/ko not_active Application Discontinuation
- 2009-10-30 WO PCT/JP2009/005796 patent/WO2010055621A1/ja active Application Filing
- 2009-10-30 US US13/127,356 patent/US20110220327A1/en not_active Abandoned
- 2009-10-30 CN CN2009801447293A patent/CN102209875A/zh active Pending
- 2009-10-30 EP EP09825875A patent/EP2348271A4/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107149A (ja) * | 1982-12-10 | 1984-06-21 | Fuji Electric Corp Res & Dev Ltd | 太陽熱集熱器 |
JPS628571U (ja) * | 1985-06-24 | 1987-01-19 | ||
JP2008028122A (ja) * | 2006-07-20 | 2008-02-07 | Tokyo Univ Of Science | 沸騰冷却方法、沸騰冷却装置およびその応用製品 |
Non-Patent Citations (2)
Title |
---|
MATORIR, A.S., HEAT TRANSFER SOVIET RESEARCH, vol. 5-1, 1973, pages 85 - 89 |
See also references of EP2348271A4 |
Also Published As
Publication number | Publication date |
---|---|
CN102209875A (zh) | 2011-10-05 |
EP2348271A4 (en) | 2013-02-20 |
US20110220327A1 (en) | 2011-09-15 |
JP4730624B2 (ja) | 2011-07-20 |
EP2348271A1 (en) | 2011-07-27 |
JP2010121791A (ja) | 2010-06-03 |
KR20110059799A (ko) | 2011-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010055621A1 (ja) | 沸騰冷却装置 | |
WO2010095373A1 (ja) | 沸騰冷却装置 | |
US10209009B2 (en) | Heat exchanger including passageways | |
US11116113B2 (en) | Cooling electronic devices in a data center | |
JP6217835B1 (ja) | 液浸冷却装置 | |
US9951999B2 (en) | Cooling device and electronic equipment | |
US9638471B2 (en) | Balanced heat exchanger systems and methods | |
WO2003085345A1 (fr) | Thermosiphon du type a boucle et refrigerateur a cycle de stirling | |
JP6285356B2 (ja) | 沸騰冷却装置 | |
EP3147617B1 (en) | Heat exchanger | |
WO2012042695A1 (ja) | 蓄熱装置およびこれを備える空気調和装置 | |
EP3837484A1 (en) | Thermal accumulator containing a pcm, and refrigerated container equiped with said thermal accumulator | |
JP2010010204A (ja) | 沸騰冷却装置 | |
WO2022190766A1 (ja) | 冷却装置 | |
US9007768B2 (en) | System for thermally controlling an apparatus | |
JP2017072334A (ja) | 蓄熱装置及びその装置を用いる方法 | |
JPH0428983A (ja) | 沸騰冷却装置 | |
JP6596986B2 (ja) | 冷却部品及び電子機器 | |
US20060060329A1 (en) | Heat pipe | |
JP7433982B2 (ja) | 熱輸送装置および熱交換ユニット | |
US20220151098A1 (en) | Cooling devices for cooling electronic components with liquid cooling components | |
RU2731573C2 (ru) | Холодильник и/или морозильник | |
JP2013024456A (ja) | 沸騰冷却器 | |
JP2005009752A (ja) | ヒートパイプ | |
WO2023081401A1 (en) | Cooling device having a boiling chamber with submerged condensation and method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980144729.3 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09825875 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20117009558 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13127356 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009825875 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |