JP4730624B2 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- JP4730624B2 JP4730624B2 JP2008293254A JP2008293254A JP4730624B2 JP 4730624 B2 JP4730624 B2 JP 4730624B2 JP 2008293254 A JP2008293254 A JP 2008293254A JP 2008293254 A JP2008293254 A JP 2008293254A JP 4730624 B2 JP4730624 B2 JP 4730624B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- ethanol
- liquid refrigerant
- wall portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/006—Preventing deposits of ice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
2、20:収容部、
21:受熱通路、 201:第一受熱通路、 202:第二受熱通路
22、203:供給通路、
21a、201a、201b、202a、202b:伝熱壁部、
3、30:凝縮部、 31、301、302:凝縮パイプ、
23、51、52:仕切板
Z、Z1〜Z4:発熱体
Claims (4)
- 発熱体の熱を受ける液体冷媒を内部に収容する収容部と、前記収容部に連なり前記発熱体の熱によって沸騰した前記液体冷媒を凝縮させる凝縮部と、を備え、車両に搭載される密封系の沸騰冷却装置であって、
前記液体冷媒は、水とエタノールの混合液であり、
前記混合液のエタノール濃度は、40質量%以上75質量%以下であり、
前記収容部は、前記発熱体の熱を液体冷媒に伝える伝熱壁部と、液体冷媒を介して前記伝熱壁部に対向する対向壁部と、を有し、
前記伝熱壁部と前記対向壁部との離間距離は、0.5mm以上3mm以下であり、
前記対向壁部は、前記収容部内を、上方が開口して前記凝縮部に連なり下方が開口した受熱通路と、上方が開口して前記凝縮部に連なり下方が開口して前記受熱通路に連なる供給通路とに仕切る仕切板であることを特徴とする沸騰冷却装置。 - 前記伝熱壁部と前記対向壁部との離間距離は、0.5mm以上2mm以下である請求項1に記載の沸騰冷却装置。
- 前記伝熱壁部と前記対向壁部との離間距離は、0.5mm以上1.5mm以下である請求項2に記載の沸騰冷却装置。
- 前記混合液のエタノール濃度は、45質量%以上55質量%以下である請求項1〜3の何れか一項に記載の沸騰冷却装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008293254A JP4730624B2 (ja) | 2008-11-17 | 2008-11-17 | 沸騰冷却装置 |
US13/127,356 US20110220327A1 (en) | 2008-11-17 | 2009-10-30 | Ebullient cooling device |
EP09825875A EP2348271A4 (en) | 2008-11-17 | 2009-10-30 | BOILING COOLING APPARATUS |
KR1020117009558A KR20110059799A (ko) | 2008-11-17 | 2009-10-30 | 비등 냉각 장치 |
PCT/JP2009/005796 WO2010055621A1 (ja) | 2008-11-17 | 2009-10-30 | 沸騰冷却装置 |
CN2009801447293A CN102209875A (zh) | 2008-11-17 | 2009-10-30 | 沸腾冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008293254A JP4730624B2 (ja) | 2008-11-17 | 2008-11-17 | 沸騰冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010121791A JP2010121791A (ja) | 2010-06-03 |
JP4730624B2 true JP4730624B2 (ja) | 2011-07-20 |
Family
ID=42169767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008293254A Expired - Fee Related JP4730624B2 (ja) | 2008-11-17 | 2008-11-17 | 沸騰冷却装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110220327A1 (ja) |
EP (1) | EP2348271A4 (ja) |
JP (1) | JP4730624B2 (ja) |
KR (1) | KR20110059799A (ja) |
CN (1) | CN102209875A (ja) |
WO (1) | WO2010055621A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
TW201437591A (zh) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | 熱管結構 |
US9763359B2 (en) * | 2015-05-29 | 2017-09-12 | Oracle International Corporation | Heat pipe with near-azeotropic binary fluid |
US10746474B2 (en) | 2016-04-11 | 2020-08-18 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
US10353445B2 (en) | 2016-04-11 | 2019-07-16 | Qualcomm Incorporated | Multi-phase heat dissipating device for an electronic device |
US9999157B2 (en) | 2016-08-12 | 2018-06-12 | Qualcomm Incorporated | Multi-phase heat dissipating device embedded in an electronic device |
US11792963B2 (en) * | 2018-05-16 | 2023-10-17 | Hanon Systems | Cooling apparatus |
US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107149A (ja) * | 1982-12-10 | 1984-06-21 | Fuji Electric Corp Res & Dev Ltd | 太陽熱集熱器 |
JPH04151860A (ja) * | 1990-10-16 | 1992-05-25 | Fujitsu Ltd | 電子装置の冷却装置 |
JPH08236669A (ja) * | 1994-12-28 | 1996-09-13 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH09167818A (ja) * | 1995-07-05 | 1997-06-24 | Denso Corp | 沸騰冷却装置およびその製造方法 |
JP2008028122A (ja) * | 2006-07-20 | 2008-02-07 | Tokyo Univ Of Science | 沸騰冷却方法、沸騰冷却装置およびその応用製品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3777811A (en) * | 1970-06-01 | 1973-12-11 | Trw Inc | Heat pipe with dual working fluids |
US3933198A (en) * | 1973-03-16 | 1976-01-20 | Hitachi, Ltd. | Heat transfer device |
JPS628571U (ja) * | 1985-06-24 | 1987-01-19 | ||
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
JP2003042672A (ja) * | 2001-07-31 | 2003-02-13 | Denso Corp | 沸騰冷却装置 |
KR100495699B1 (ko) * | 2002-10-16 | 2005-06-16 | 엘에스전선 주식회사 | 판형 열전달장치 및 그 제조방법 |
EP1836449A1 (en) * | 2005-01-03 | 2007-09-26 | Noise Limit ApS | A multi-orientational cooling system with a bubble pump |
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
US20120273164A1 (en) * | 2008-10-28 | 2012-11-01 | Jan Vetrovec | Thermal management for solid state high-power electronics |
-
2008
- 2008-11-17 JP JP2008293254A patent/JP4730624B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-30 CN CN2009801447293A patent/CN102209875A/zh active Pending
- 2009-10-30 WO PCT/JP2009/005796 patent/WO2010055621A1/ja active Application Filing
- 2009-10-30 EP EP09825875A patent/EP2348271A4/en not_active Withdrawn
- 2009-10-30 US US13/127,356 patent/US20110220327A1/en not_active Abandoned
- 2009-10-30 KR KR1020117009558A patent/KR20110059799A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107149A (ja) * | 1982-12-10 | 1984-06-21 | Fuji Electric Corp Res & Dev Ltd | 太陽熱集熱器 |
JPH04151860A (ja) * | 1990-10-16 | 1992-05-25 | Fujitsu Ltd | 電子装置の冷却装置 |
JPH08236669A (ja) * | 1994-12-28 | 1996-09-13 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH09167818A (ja) * | 1995-07-05 | 1997-06-24 | Denso Corp | 沸騰冷却装置およびその製造方法 |
JP2008028122A (ja) * | 2006-07-20 | 2008-02-07 | Tokyo Univ Of Science | 沸騰冷却方法、沸騰冷却装置およびその応用製品 |
Also Published As
Publication number | Publication date |
---|---|
KR20110059799A (ko) | 2011-06-03 |
CN102209875A (zh) | 2011-10-05 |
WO2010055621A1 (ja) | 2010-05-20 |
EP2348271A4 (en) | 2013-02-20 |
JP2010121791A (ja) | 2010-06-03 |
EP2348271A1 (en) | 2011-07-27 |
US20110220327A1 (en) | 2011-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4730624B2 (ja) | 沸騰冷却装置 | |
WO2010095373A1 (ja) | 沸騰冷却装置 | |
US10845127B2 (en) | Cooling device | |
US9638471B2 (en) | Balanced heat exchanger systems and methods | |
DE602006000243T2 (de) | Flussigskeitsgekühlter Thermosiphon für elektronische Bauelemente | |
US20070227703A1 (en) | Evaporatively cooled thermosiphon | |
JP6394331B2 (ja) | 冷却部品及び電子機器 | |
EP3147617B1 (en) | Heat exchanger | |
JP6285356B2 (ja) | 沸騰冷却装置 | |
JP2011108685A (ja) | 自然循環式沸騰冷却装置 | |
US9007768B2 (en) | System for thermally controlling an apparatus | |
JPH07332810A (ja) | 冷凍装置用オイルミストセパレータ | |
JP2010007893A (ja) | 沸騰冷却装置 | |
JP2010040958A (ja) | 冷却装置 | |
JP6596986B2 (ja) | 冷却部品及び電子機器 | |
JP2013024456A (ja) | 沸騰冷却器 | |
WO2022190868A1 (ja) | 冷却装置 | |
US20220151098A1 (en) | Cooling devices for cooling electronic components with liquid cooling components | |
JP2012169453A (ja) | 沸騰冷却装置 | |
RU2731573C2 (ru) | Холодильник и/или морозильник | |
JP2014022478A (ja) | 沸騰冷却装置 | |
JP2024008426A (ja) | 沸騰冷却装置 | |
JP2017030391A (ja) | 車両用空調装置 | |
JP2020085366A (ja) | 蒸発器及び冷却システム | |
JP2003343986A (ja) | ヒートパイプ式冷却器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100304 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100907 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101108 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110406 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140428 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140428 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |