WO2010095373A1 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- WO2010095373A1 WO2010095373A1 PCT/JP2010/000582 JP2010000582W WO2010095373A1 WO 2010095373 A1 WO2010095373 A1 WO 2010095373A1 JP 2010000582 W JP2010000582 W JP 2010000582W WO 2010095373 A1 WO2010095373 A1 WO 2010095373A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat transfer
- ethanol
- liquid refrigerant
- mass
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a boiling cooling device using a refrigerant.
- a boiling cooling device is a device that cools a heating element by using a phase change from a liquid of a refrigerant to a gas.
- the liquid refrigerant that receives heat from the heating element is often an alcohol.
- Patent Document 1 Japanese Patent Application Laid-Open No. 4-257893 (Patent Document 1) describes a mixed solution of water (100) and lower alcohol (5 to 12).
- the refrigerant here is intended mainly for heat pipes used for cooling indoor equipment, and does not freeze at about ⁇ 10 ° C. and is nonflammable.
- Patent Document 2 Japanese Utility Model Publication No. 62-8571
- Patent Document 2 describes a mixture of water and alcohol.
- the refrigerant is prevented from freezing by changing the mixing ratio of water and alcohol.
- burnout film boiling
- heat flux heat generation density
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a boiling cooling device capable of suppressing freezing of a liquid refrigerant and suppressing the occurrence of burnout. .
- the boiling cooling device of the present invention includes a storage unit that stores therein a liquid refrigerant that receives heat from the heating element, and the liquid refrigerant is a mixed liquid composed of at least two types of liquids having different boiling points.
- a heat transfer wall portion that transmits the heat of the body to the liquid refrigerant, and an opposing wall portion that opposes the heat transfer wall portion via the liquid refrigerant, and a separation distance between the heat transfer wall portion and the counter wall portion is 3 mm It is characterized by the following.
- the melting point can be adjusted according to the required specifications, and the liquid refrigerant can be prevented from freezing. And by making the separation distance of a heat-transfer wall part and an opposing wall part into 3 mm or less, heat transfer becomes favorable and generation
- the separation distance between the heat transfer wall portion and the facing wall portion is 2 mm or less. This further improves heat transfer and suppresses the occurrence of burnout. Furthermore, the distance between the heat transfer wall and the opposing wall is preferably 0.5 mm or more and 1.5 mm or less. Thereby, heat transfer becomes better and the occurrence of burnout is suppressed.
- the liquid refrigerant is preferably a mixed liquid of water and ethanol.
- Ethanol has a lower melting point than other alcohols, and tends to lower the melting point in a mixed solution with water. That is, the amount of ethanol required for the mixed solution to reach the target melting point temperature may be smaller than that of mixing other alcohols. Therefore, compared with other alcohols, the ratio of water in the mixed solution can be increased, and the critical heat flux of the mixed solution can be increased.
- ethanol has a greater heat of vaporization (latent heat) than other alcohols. Therefore, the limit heat flux becomes larger by using ethanol. Furthermore, ethanol has a relatively low boiling point, improves heat circulation efficiency, and is effective as a boiling cooling refrigerant. In addition, since ethanol has a boiling point that is not too low, the boiling point is generally higher than the temperature (for example, about 65 ° C.) of a refrigerant (for example, cooling water) used for condensation in the condensing unit, and is more suitable for boiling cooling. In particular, the heat transfer performance is greatly improved by using the above mixed liquid having a high bubble rising speed in the narrow gap. As described above, by using a mixed solution of water and ethanol, freezing is prevented and the occurrence of burnout is also suppressed.
- a refrigerant for example, cooling water
- the ethanol concentration of the mixed solution is preferably 45% by mass or more and 55% by mass or less.
- the melting point becomes less than ⁇ 30 ° C., and the specifications generally required for mounting on a vehicle (for example, freezing at ⁇ 30 ° C.) can be surely cleared.
- water is contained in the mixed liquid, the critical heat flux of the liquid refrigerant becomes larger than that of the alcohol single component. Thereby, the occurrence of burnout is suppressed.
- the boiling cooling device of the present invention may be a sealed-type boiling cooling device that further includes a condensing unit that is connected to the housing unit and condenses the liquid refrigerant boiled by the heat of the heating element.
- the occurrence of burnout is suppressed.
- FIG. 1 is a perspective view showing a boiling cooling device 1.
- FIG. FIG. 2 is a cross-sectional view taken along the line AA in FIG. It is a figure which shows the characteristic of each alcohol. It is a figure which shows the relationship between the ethanol density
- FIG. 3 is a view corresponding to a cross-sectional view taken along the line AA showing the boiling cooling device 100.
- FIG. 1 is a perspective view showing a boiling cooling device 1.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 shows the characteristics of each alcohol.
- FIG. 4 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the critical heat flux.
- FIG. 5 is a diagram illustrating the relationship between the separation distance and the heat transfer coefficient.
- FIG. 6 is a diagram showing the relationship between the return separation distance and the heat transfer coefficient.
- FIG. 7 is a graph showing the relationship between the ethanol concentration of the ethanol-water mixture and the heat transfer coefficient.
- FIG. 8 is a schematic diagram for explaining film boiling.
- FIG. 9 is a diagram showing the relationship between the ethanol concentration of the ethanol-water mixture and the element temperature. 4 is quoted from “Matorir, AS, Heat transfer Soviet Research, 5-1 (1973), 85-89”.
- the boiling cooling device 1 is composed of a container Y in which an internal space is partitioned by a partition plate 23, and includes a storage unit 2 and a condensing unit 3.
- the accommodating part 2 is a substantially rectangular parallelepiped metal container, in which a liquid refrigerant is stored.
- the accommodating portion 2 includes a heat receiving passage 21, a supply passage 22, and a partition plate 23.
- the heat receiving passage 21 includes a side wall surface including a heat transfer wall portion 21a to which the heating element Z of the housing portion 2 is attached, a partition plate 23 facing the side wall surface, and a front side and a rear side of the container Y (on the paper surface in FIG. This is a region surrounded by four surfaces including the side wall surfaces on the back side and the near side.
- the partition plate 23 forms a side surface of the heat receiving passage 21 and a side surface of the supply passage 22, and partitions the internal space of the housing portion 2 into the heat receiving passage 21 and the supply passage 22.
- the heating element Z is, for example, a semiconductor element.
- the heat receiving passage 21 has a substantially rectangular parallelepiped shape, and the upper portion is opened and connected to the condensing unit 3, and the lower portion is opened and connected to the supply passage 22.
- the heat transfer wall portion 21a and the partition plate 23 are parallel to each other, and a portion of the partition plate 23 that faces the heat transfer wall portion 21a is referred to as an opposing wall portion 23a.
- the separation distance between the heat transfer wall portion 21a and the opposing wall portion 23a is approximately 1 mm.
- the heat receiving passage 21 is filled with a liquid refrigerant.
- the heat transfer wall 21a of the heat receiving passage 21 is a part that transfers the heat of the heating element Z to the liquid refrigerant.
- the liquid refrigerant in the heat receiving passage 21 is boiled by receiving heat from the heating element Z, and the liquid refrigerant in the form of bubbles rises in the liquid refrigerant.
- the supply passage 22 will be described later.
- the condensing part 3 is located above the accommodating part 2, and the lower part is open and continues to the heat receiving passage 21 and the supply passage 22.
- a condensing pipe 31 is provided in the condensing unit 3. Cooling water flows through the condensation pipe 31. The condensing unit 3 cools and condenses the steam rising from the heat receiving passage 21.
- the supply passage 22 is arranged in parallel with the heat receiving passage 21, and is the other side portion in which the interior of the housing portion 2 is partitioned from the heat receiving passage 21 by the partition plate 5.
- the supply passage 22 is open at the top and connected to the condensing unit 3, and is opened at the bottom and is connected to the heat receiving passage 21.
- the liquid refrigerant condensed in the condensing unit 3 becomes droplets and drops on the liquid refrigerant surface.
- the supply passage 22 receives the liquid refrigerant dripped from the condensing unit 3 and supplies the liquid refrigerant to the heat receiving passage 21 from below by a pressure difference.
- the boiling cooling device 1 is completely sealed.
- the liquid refrigerant is sealed in a vacuum container (boiling cooling device 1).
- the liquid refrigerant accommodated in the accommodating portion 2 will be described.
- the liquid refrigerant is a mixed liquid of water and ethanol.
- the ethanol concentration of this mixed solution is approximately 50% by mass (wt%).
- Ethanol has a relatively low boiling point of 78.6 ° C.
- Ethanol has a low boiling temperature and is effective as a refrigerant for the boiling cooling device.
- cooling water of approximately 65 ° C. is caused to flow through the condensation pipe 31.
- the boiling point should be reasonably higher than 65 ° C. Also in this respect, it is effective to use ethanol for the mixed solution.
- ethanol has a heat of evaporation (latent heat) of 855 [kJ / kg], and has a higher heat of evaporation than other alcohols. For this reason, ethanol has a large critical heat flux. That is, it is possible to increase the critical heat flux (MW / m 2 ) in the mixed solution of water and ethanol, compared to using other alcohols. Since the burnout occurs when the heat flow rate exceeds the critical heat flux, a larger critical heat flux is advantageous. Note that the heat of evaporation of water is greater than that of ethanol.
- ethanol has a lower melting point ( ⁇ 114.1 ° C.) than other alcohols. For this reason, the amount of mixing required to bring the mixed liquid to the target melting point temperature (here, less than ⁇ 30 ° C.) may be smaller than that of other alcohols.
- the evaporation heat of water is larger than that of alcohols, and the limit heat flux of the mixed liquid becomes larger as the water component is larger. Ethanol can lower the melting point even with a relatively small amount, and as a result, the water component can be increased and the critical heat flux can be increased.
- ethanol is optimal for mixing with water.
- HFE-7200 is used for mixing with water. As shown in FIG. 3, HFE-7200 has a lower melting point than ethanol and is effective in lowering the melting point of the mixed solution. However, since the heat of evaporation is much smaller than that of ethanol, it is difficult to ensure appropriate heat of evaporation after mixing. That is, it becomes difficult to suppress the occurrence of burnout.
- the critical heat flux is different when the ethanol concentration is different in the mixed solution of water and ethanol.
- the critical heat flux is large when the ethanol concentration is about 75% by mass or less. That is, as described above, a larger critical heat flux is advantageous for suppressing burnout, and therefore, it is preferable to use a mixed solution having an ethanol concentration of approximately 75% by mass or less for suppressing burnout. .
- the lower the ethanol concentration the higher the melting point and the easier it is to freeze.
- the liquid refrigerant is generally required not to freeze at about ⁇ 30 ° C.
- the freezing experiment of the liquid mixture whose ethanol concentration is 40 mass% was conducted.
- the mixed solution did not freeze in the ⁇ 35 ° C. atmosphere. That is, when the ethanol concentration is 40% by mass or more, the mixed solution has a melting point lower than that and does not freeze even at ⁇ 30 ° C.
- the required specifications for on-vehicle installation can be cleared.
- the critical heat flux is larger than that of the ethanol single component.
- the liquid refrigerant used in the boiling cooling device of the vehicle is preferably a mixed liquid (water + ethanol) having an ethanol concentration of 40% by mass to 75% by mass. According to this, freezing is prevented and burnout is suppressed.
- the ethanol concentration is preferably 45% by mass or more.
- the melting point becomes lower than ⁇ 40 ° C., and the required specification in a cold region (not frozen at ⁇ 40 ° C.) can be cleared. That is, by using a mixed solution having an ethanol concentration of 45 to 75% by mass, freezing can be more reliably prevented, and the critical heat flux can be increased to suppress burnout.
- the separation distance between the heat transfer wall portion 21a and the opposing wall portion 23a is approximately 1 mm.
- Non-Patent Document 1 describes that heat transfer is promoted as compared to pool boiling when the distance (the gap between the heat transfer wall 21a and the opposing wall 23a) is reduced.
- a pool is a case where there is a sufficient distance with a separation distance of 10 mm or more.
- the separation distance is 2 mm, 1 mm, and 0.6 mm, heat transfer is significantly promoted in the low heat flux region. The greater the heat transfer rate, the better the cooling performance.
- the difference in the heat transfer coefficient was tested by changing the above-mentioned separation distance.
- a mixed solution having an ethanol concentration of 60% by mass is used.
- the heat flux of the heating element is 1 to 2 (MW / m 2 ).
- the heat transfer coefficient is increased when the separation distance is 2 mm or less.
- the critical bubble diameter of the mixture of water and ethanol is about 1.5 mm, and it is considered that good heat transfer is performed up to 3 mm, which is twice as much as the maximum. That is, if the separation distance is 3 mm or less, an advantageous effect in terms of heat transfer can be obtained.
- a separation distance is 2 mm or less.
- a more preferable separation distance is 0.5 mm or more and 1.5 mm or less with 1 mm as the center.
- the same experiment was performed on the separation distance between the partition plate 23 and the wall portion 22a on the supply passage 22 side (hereinafter referred to as return separation distance).
- return separation distance As shown in FIG. 6, the heat transfer coefficient increases rapidly as the return separation distance increases from 1 mm to 2 mm, but the heat transfer coefficient does not improve much after 2 mm.
- the return separation distance of about 2 mm is suitable in order to improve the heat transfer rate while suppressing the enlargement of the apparatus.
- the return separation distance of this embodiment is 2 mm.
- the heat transfer coefficient experiment was performed by changing the ethanol concentration of the mixed solution by setting the separation distance between the heat transfer wall portion 21a and the opposing wall portion 23a to 1 mm.
- a high heat transfer coefficient (approximately 7.8 ⁇ 10 4 [W / m 2 ⁇ K]) is obtained when the ethanol concentration is 50 mass%.
- high heat transfer coefficient (60% by mass: approximately 6.5 ⁇ 10 4 [W / m 2 ⁇ K], 70% by mass: approximately 6.3 ⁇ 10 4 [W / m]. 2 ⁇ K]).
- the critical heat flux is gradually increased from 75% by mass to 30% by mass.
- the ethanol concentration is approximately 45 mass centered on 50 to 70 mass% of the high heat transfer coefficient.
- % To 75% by mass is suitable for mounting on a vehicle.
- a more preferable ethanol concentration is 45% by mass or more and 55% by mass or less centering on 50% by mass of the highest heat transfer coefficient.
- the separation distance is 1 mm, and the ethanol concentration of the mixed solution is 50% by mass.
- Burnout particularly film boiling, occurs in the vicinity of the inner surface of the heat transfer wall portion 21a corresponding to the central portion (the highest temperature portion) of the heating element Z, as shown in FIG.
- the liquid refrigerant cannot contact the heat transfer wall portion 21a, and heat transfer is not performed. According to this, cooling performance will fall.
- the heat transfer is expanded to the surroundings avoiding the film boiling region. That is, the heat conduction distance becomes long. Thereby, heat resistance becomes large with respect to the heat transmitted through the heat transfer wall portion 21a, and the heat transfer performance is also deteriorated.
- the heat generation density of the heating element Z exceeds 1 MW / m 2
- film boiling may occur in an ethanol single component liquid refrigerant.
- the occurrence of film boiling can be suppressed by using the above-described preferred mixed liquid as a liquid refrigerant.
- the liquid refrigerant comes into contact with the inner surface of the heat transfer wall 21a, and the expansion of heat during heat transfer is prevented.
- the heat conduction distance is also shortened, and the cooling performance and heat transfer performance are improved.
- the ethanol concentration is 80 to 100% by mass and the element temperature is slightly higher regardless of the heat generation density. Although it is high, even if the ethanol concentration changes, there is almost no difference in element temperature. This is because the boiling point increases as the ethanol concentration decreases in the open system, so in the open system, the heat transfer performance decreases and the element temperature increases as the ethanol concentration decreases. Since the boiling point depends on the pressure and the pressure depends on the condensing capacity, it is presumed that the difference in the boiling point of the mixed refrigerant is almost eliminated regardless of the ethanol concentration because the condensing capacity is constant in the sealed system.
- the mixed refrigerant it is better to use a sealed system because the lowering of the boiling point due to the decrease in the ethanol concentration in the mixed refrigerant and the accompanying decrease in the heat transfer performance do not occur.
- the ethanol concentration is preferably 80% by mass or less. This result also shows that an ethanol concentration of 40 to 75% by mass is effective.
- FIG. 10 is a schematic diagram showing a simple configuration of the experiment.
- FIG. 11 is a diagram showing the relationship between the output of the heating element and the measured temperature of the thermocouple in the experiment.
- the horizontal axis is the output (W) of the heating element, and the vertical axis is the temperature (° C.).
- thermocouple was arranged between the heat transfer wall 21a and the heating element (heater), and the temperature was measured.
- the liquid refrigerant is a mixed liquid of water and ethanol.
- the distance between the heat transfer wall 21a and the opposing wall 23a is h.
- the measurement temperature of the thermocouple corresponds to the element temperature (heating element temperature).
- the experiment was conducted for a liquid refrigerant having an ethanol concentration of 50% by mass with an infinite h of 1 mm, and for a liquid refrigerant with an ethanol concentration of 100% by mass having an infinite h of 1 mm.
- the element temperature becomes higher than when the value is infinite. That is, in the case of 100% by mass of ethanol, it can be seen that even if the separation distance h between the heat transfer wall portion 21a and the opposing wall portion 23a is reduced, there is no effect, or even if the effect is small.
- the separation distance is 1 mm and the ethanol concentration is 50% by mass, but these numerical values do not exclude errors. Even if there is a slight deviation in the numerical value, the above effect is exhibited. That is, the numerical values in the present embodiment have a certain range, and a slight shift due to an error or the like is included in the present embodiment.
- the ethanol concentration is 50% by mass
- the lower limit may be 49 to 48% by mass and the upper limit may be within the range of 51 to 52% by mass.
- the separation distance of 1 mm may be 0.9 to 1.1 mm.
- the boiling cooling device may have a configuration shown in FIG.
- FIG. 12 is a view corresponding to a cross-sectional view taken along the line AA showing the boiling cooling device 100.
- the boiling cooling device 100 includes a condensing unit 30 and an accommodating unit 20 whose interior is partitioned by two partition plates 51 and 52.
- the housing unit 20 includes a first heat receiving passage 201, a second heat receiving passage 202, a supply passage 203, and partition plates 51 and 52.
- the first heat receiving passage 201 is a substantially rectangular parallelepiped, and is roughly surrounded by a side wall surface including the left partition plate 51 and a side wall surface including the heat transfer wall portions 201a and 201b to which the heating elements Z1 and Z2 are attached. It is a part.
- the second heat receiving passage 202 is a substantially rectangular parallelepiped, and is roughly surrounded by a side wall surface including the right partition plate 52 and a side wall surface including the heat transfer wall portions 202a and 202b to which the heating elements Z3 and Z4 are attached. It is a part.
- the heat receiving passages 201 and 202 are open at the top and connected to the condensing unit 30, and open at the bottom and connected to the supply passage 203.
- the heat receiving passages 201 and 202 contain the liquid refrigerant described above.
- the separation distance between the side wall surface including the heat transfer wall portions 201a and 201b and the partition plate 51 (corresponding to the opposing wall portion) is 3 mm or less (here, approximately 1 mm).
- the separation distance between the side wall surface including the heat transfer wall portions 202a and 202b and the partition plate 52 (corresponding to the opposing wall portion) is also 3 mm or less (here, approximately 1 mm).
- the supply passage 203 is a substantially rectangular parallelepiped, and is a portion sandwiched between the partition plate 51 and the partition plate 52. .
- the separation distance (return separation distance) between the partition plate 51 and the partition plate 52 is approximately 2 mm.
- the condensing unit 30 is located above the heat receiving passages 201 and 202 and the supply passage 203.
- the condensing unit 30 is provided with condensing pipes 301 and 302 through which cooling water flows.
- the liquid refrigerant (mixed liquid) of the present embodiment accommodated in the heat receiving passages 201 and 202 receives heat from the heating elements Z1 to Z4 and boils.
- the rising steam is condensed in the condensing unit 30.
- the condensed liquid refrigerant is dripped mainly into the supply passage 203.
- the supply passage 203 receives the liquid refrigerant dripped from the condensing unit 3 and supplies the liquid refrigerant to the heat receiving passages 201 and 202 from below due to a pressure difference (see arrows in FIG. 12). Also by this, the same effect as this embodiment is exhibited by using the said liquid mixture.
- a heating element is composed of a substrate and a heating element provided on the substrate, and a substrate is disposed so as to form a hole in the side wall of the housing portion and close the hole.
- the structure may be such that is directly in contact with the refrigerant.
- the substrate is regarded as a part of the accommodating portion, and the substrate corresponds to the heat transfer wall portion.
- coolant may be sufficient.
- the heat exchanger is not limited to the heat exchanger in which the refrigerant is accumulated in the bottomed container, and may be a heat exchanger having a structure in which the refrigerant flows without accumulating. As mentioned above, according to this invention, even if it is these structures, the same effect as the above is exhibited.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Description
2、20:収容部、
21:受熱通路、 201:第一受熱通路、 202:第二受熱通路
22、203:供給通路、
21a、201a、201b、202a、202b:伝熱壁部、 23a:対向壁部、
3、30:凝縮部、 31、301、302:凝縮パイプ、
23、51、52:仕切板
Z、Z1~Z4:発熱体
Claims (5)
- 発熱体の熱を受ける液体冷媒を内部に収容する収容部を備え、
前記液体冷媒は、沸点の異なる少なくとも2種類の液体からなる混合液であり、
前記収容部は、前記発熱体の熱を前記液体冷媒に伝える伝熱壁部と、前記液体冷媒を介して前記伝熱壁部に対向する対向壁部と、を有し、
前記伝熱壁部と前記対向壁部との離間距離は、3mm以下であることを特徴とする沸騰冷却装置。 - 前記伝熱壁部と前記対向壁部との離間距離は、2mm以下である請求項1に記載の沸騰冷却装置。
- 前記伝熱壁部と前記対向壁部との離間距離は、0.5mm以上1.5mm以下である請求項2に記載の沸騰冷却装置。
- 前記液体冷媒は、水とエタノールの混合液である請求項1~3の何れか一項に記載の沸騰冷却装置。
- 前記混合液のエタノール濃度は、45質量%以上55質量%以下である請求項4に記載の沸騰冷却装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10743505A EP2400248A4 (en) | 2009-02-23 | 2010-02-01 | FOAMING AND COOLING DEVICE |
CN2010800090065A CN102326047A (zh) | 2009-02-23 | 2010-02-01 | 沸腾冷却装置 |
US13/146,069 US20110284187A1 (en) | 2009-02-23 | 2010-02-01 | Ebullient cooling device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009039249A JP2010196912A (ja) | 2009-02-23 | 2009-02-23 | 沸騰冷却装置 |
JP2009-039249 | 2009-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010095373A1 true WO2010095373A1 (ja) | 2010-08-26 |
Family
ID=42633664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/000582 WO2010095373A1 (ja) | 2009-02-23 | 2010-02-01 | 沸騰冷却装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110284187A1 (ja) |
EP (1) | EP2400248A4 (ja) |
JP (1) | JP2010196912A (ja) |
KR (1) | KR20110106942A (ja) |
CN (1) | CN102326047A (ja) |
WO (1) | WO2010095373A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014510254A (ja) * | 2011-03-21 | 2014-04-24 | ネイキッド エナジー リミテッド | 伝熱装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
JP6285356B2 (ja) * | 2012-07-06 | 2018-02-28 | 治彦 大田 | 沸騰冷却装置 |
JP2014038902A (ja) * | 2012-08-13 | 2014-02-27 | Showa Denko Kk | 沸騰冷却装置 |
JP6160709B2 (ja) * | 2013-12-04 | 2017-07-12 | 富士通株式会社 | 混合作動液を用いた冷却装置及び電子装置の冷却装置 |
JP2015222149A (ja) * | 2014-05-23 | 2015-12-10 | 株式会社デンソー | 熱輸送システム |
US9763359B2 (en) * | 2015-05-29 | 2017-09-12 | Oracle International Corporation | Heat pipe with near-azeotropic binary fluid |
CN117542807B (zh) * | 2024-01-09 | 2024-03-29 | 广东海洋大学 | 一种复合相变载冷及回收利用装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04151860A (ja) * | 1990-10-16 | 1992-05-25 | Fujitsu Ltd | 電子装置の冷却装置 |
JPH08236669A (ja) * | 1994-12-28 | 1996-09-13 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH10173115A (ja) * | 1996-12-06 | 1998-06-26 | Toshiba Corp | 沸騰冷却装置及びその製造方法 |
JP2003042672A (ja) * | 2001-07-31 | 2003-02-13 | Denso Corp | 沸騰冷却装置 |
JP2007513506A (ja) * | 2003-12-08 | 2007-05-24 | ノイズ リミット エーピーエス | バブルポンプを有する冷却システム |
JP2010007893A (ja) * | 2008-06-24 | 2010-01-14 | Toyota Industries Corp | 沸騰冷却装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
CN1755314A (zh) * | 2004-09-28 | 2006-04-05 | 株式会社藤仓 | 热管 |
US20080236795A1 (en) * | 2007-03-26 | 2008-10-02 | Seung Mun You | Low-profile heat-spreading liquid chamber using boiling |
CN101421576B (zh) * | 2006-04-13 | 2010-09-15 | 三菱电机株式会社 | 冷却装置以及电力变换装置 |
US7876564B2 (en) * | 2007-05-25 | 2011-01-25 | CCZ Technology Group, Inc. | Method and apparatus for cooling computer memory |
-
2009
- 2009-02-23 JP JP2009039249A patent/JP2010196912A/ja active Pending
-
2010
- 2010-02-01 WO PCT/JP2010/000582 patent/WO2010095373A1/ja active Application Filing
- 2010-02-01 US US13/146,069 patent/US20110284187A1/en not_active Abandoned
- 2010-02-01 KR KR1020117019365A patent/KR20110106942A/ko not_active Application Discontinuation
- 2010-02-01 CN CN2010800090065A patent/CN102326047A/zh active Pending
- 2010-02-01 EP EP10743505A patent/EP2400248A4/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04151860A (ja) * | 1990-10-16 | 1992-05-25 | Fujitsu Ltd | 電子装置の冷却装置 |
JPH08236669A (ja) * | 1994-12-28 | 1996-09-13 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH10173115A (ja) * | 1996-12-06 | 1998-06-26 | Toshiba Corp | 沸騰冷却装置及びその製造方法 |
JP2003042672A (ja) * | 2001-07-31 | 2003-02-13 | Denso Corp | 沸騰冷却装置 |
JP2007513506A (ja) * | 2003-12-08 | 2007-05-24 | ノイズ リミット エーピーエス | バブルポンプを有する冷却システム |
JP2010007893A (ja) * | 2008-06-24 | 2010-01-14 | Toyota Industries Corp | 沸騰冷却装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2400248A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014510254A (ja) * | 2011-03-21 | 2014-04-24 | ネイキッド エナジー リミテッド | 伝熱装置 |
US9869491B2 (en) | 2011-03-21 | 2018-01-16 | Naked Energy Ltd | Heat transfer device |
Also Published As
Publication number | Publication date |
---|---|
US20110284187A1 (en) | 2011-11-24 |
EP2400248A1 (en) | 2011-12-28 |
JP2010196912A (ja) | 2010-09-09 |
CN102326047A (zh) | 2012-01-18 |
KR20110106942A (ko) | 2011-09-29 |
EP2400248A4 (en) | 2013-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010095373A1 (ja) | 沸騰冷却装置 | |
JP4730624B2 (ja) | 沸騰冷却装置 | |
US11035621B2 (en) | Electronics cooling with multi-phase heat exchange and heat spreader | |
US20070227703A1 (en) | Evaporatively cooled thermosiphon | |
KR20230026360A (ko) | 침지 냉각식 서버 시스템을 위한 확장 가능한 열 라이드-스루 | |
US9638471B2 (en) | Balanced heat exchanger systems and methods | |
US20100252238A1 (en) | Two-phase-flow, panel-cooled, battery apparatus and method | |
JP6285356B2 (ja) | 沸騰冷却装置 | |
JP2010010204A (ja) | 沸騰冷却装置 | |
JP2011108685A (ja) | 自然循環式沸騰冷却装置 | |
JP2004349551A (ja) | 沸騰冷却システム | |
JP2017072334A (ja) | 蓄熱装置及びその装置を用いる方法 | |
JPH0428983A (ja) | 沸騰冷却装置 | |
JP2012169453A (ja) | 沸騰冷却装置 | |
WO2022190868A1 (ja) | 冷却装置 | |
US20230147067A1 (en) | Cooling device having a boiling chamber with submerged condensation and method | |
US20220151098A1 (en) | Cooling devices for cooling electronic components with liquid cooling components | |
JP2013024456A (ja) | 沸騰冷却器 | |
WO2023157536A1 (ja) | 自己再生ブリッジ型ヒートパイプ | |
Tomita et al. | An ultra-thin loop heat pipe with long-distance heat transport for cooling of small electronic devices | |
JP2024008426A (ja) | 沸騰冷却装置 | |
JP2014022478A (ja) | 沸騰冷却装置 | |
JP2021169883A (ja) | 熱輸送装置および熱交換ユニット | |
JP2003042673A (ja) | 気泡ポンプ型熱交換熱輸送機器 | |
JP2020085366A (ja) | 蒸発器及び冷却システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080009006.5 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10743505 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13146069 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010743505 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20117019365 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |