WO2010050063A1 - Procédé de fabrication de haut-parleur - Google Patents

Procédé de fabrication de haut-parleur Download PDF

Info

Publication number
WO2010050063A1
WO2010050063A1 PCT/JP2008/069944 JP2008069944W WO2010050063A1 WO 2010050063 A1 WO2010050063 A1 WO 2010050063A1 JP 2008069944 W JP2008069944 W JP 2008069944W WO 2010050063 A1 WO2010050063 A1 WO 2010050063A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
speaker
manufacturing
infrared
joining
Prior art date
Application number
PCT/JP2008/069944
Other languages
English (en)
Japanese (ja)
Inventor
政敏 佐藤
千秋 小池
賢 半沢
伸之 槙
道郎 松田
Original Assignee
パイオニア株式会社
東北パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社, 東北パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP2010535603A priority Critical patent/JP5026596B2/ja
Priority to CN2008801317789A priority patent/CN102204282A/zh
Priority to PCT/JP2008/069944 priority patent/WO2010050063A1/fr
Publication of WO2010050063A1 publication Critical patent/WO2010050063A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Definitions

  • the present invention relates to a method for manufacturing a speaker.
  • the speaker includes a diaphragm, an edge that supports the diaphragm on the frame, a voice coil, a voice coil support part (voice coil bobbin), a damper that supports the voice coil support part on the frame, and the like to drive the vibrator.
  • the drive unit includes a magnetic circuit composed of a yoke, a magnet, a plate, and the like, and a frame that supports the vibrating body and the drive unit.
  • the adhesive is generally cured by heating.
  • a voice coil bobbin and a diaphragm are immersed in a thermosetting resin, and the voice coil bobbin and the diaphragm are thermoset. It is described that after impregnating a resin, it is put in a heating container and thermoformed.
  • an adhesive with high hardness after curing is used to harden the joint at a joint where vibration propagation needs to be improved, and at a joint where it is necessary to alleviate fatigue due to bending during vibration.
  • an adhesive that can obtain a certain degree of elasticity after curing is used.
  • a two-component reaction-curing acrylic adhesive is used at the joining portion such as the former, and a moisture-curing silicone adhesive is used at the joining portion such as the latter.
  • an adhesive such as a moisture-curing silicone type can be accelerated by simply heating, but an adhesive such as a two-component reaction-curing acrylic system is rapid. If heated to a low temperature, the viscosity will drop before curing and fluidity will occur, which may cause defects such as inflows to other than the joints. There is a problem that cannot be cured.
  • moisture-curing type adhesives have an extremely slow curing rate at low temperatures and low humidity, and conversely cure rapidly at high temperatures and high humidity. There is a problem that it is difficult to obtain a certain productivity.
  • the present invention is an example of a problem to deal with such a problem. That is, in the manufacturing method of the speaker, at each joint location using different types of adhesives, the curing time of the adhesive is effectively shortened at each joint location to shorten the manufacturing time. To shorten the manufacturing time by effectively shortening the curing time of the adhesive at each joint location, without excessively heating unnecessary locations, and quickly when moving to the next process It is an object of the present invention to be able to handle by hand, to obtain a certain productivity regardless of the working environment.
  • a speaker manufacturing method and a speaker according to the present invention include at least the configurations according to the following independent claims.
  • [Claim 1] A method of manufacturing a speaker comprising a vibrating body, a driving unit that drives the vibrating body, and a frame that supports the vibrating body and the driving unit. And a part of another constituent member of the speaker via an adhesive, and the joining step includes a part of one constituent member of the speaker at a first joining point.
  • a speaker comprising a vibrating body, a driving unit that drives the vibrating body, a frame that supports the vibrating body and the driving unit, and a part of one component of the speaker, It has a joining part which joins some other structural members of a speaker via adhesives, and this jointing part is a part of one constituent member of the speaker, and a part of other constituent member of the speaker
  • the first adhesive is to join a first joining portion that joins each other through a first adhesive, a part of one constituent member of the speaker, and a part of another constituent member of the speaker.
  • An absorption peak that has a second joint location to be joined via different types of second adhesive, and the first adhesive and the second adhesive have an absorption peak at a specific wavelength in the infrared region. It has a peak wavelength band including the wavelength, and the absorption peak wavelength is in the far infrared region.
  • Speaker characterized by Rukoto.
  • Embodiments of the present invention are premised on a speaker including a vibrating body, a driving unit that drives the vibrating body, and a frame that supports the vibrating body and the driving unit, and a manufacturing method thereof. It has.
  • One feature includes a joining step of joining a part of one constituent member of the speaker and a part of another constituent member of the speaker via an adhesive, and this joining step is performed at the first joining location.
  • the first step of joining a part of one constituent member of the speaker and a part of the other constituent member of the speaker via the first adhesive, and one constitution of the speaker at the second joining location A second step of joining a part of the member and a part of the other constituent member of the speaker via a second adhesive different in type from the first adhesive, and the first step After the 2nd process, it has the infrared irradiation process which irradiates the infrared rays of the wavelength band according to the hardening characteristic of each adhesive agent to the 1st adhesive and the 2nd adhesive.
  • a drive unit for driving the body includes a magnetic circuit composed of a yoke, a magnet, a plate, and the like, and a frame for supporting the vibrating body and the drive unit.
  • the infrared irradiation process of irradiating the 1st adhesive and the 2nd adhesive with the infrared of the wavelength band according to the hardening characteristic of each adhesive is performed. According to this, even when different types of adhesives are used at different joint locations, the adhesive is heat-cured by irradiation with infrared rays in the wavelength band according to the curing characteristics of each adhesive, so each adhesive The agent can be properly cured, and problems such as inflowing with one adhesive can be solved. Moreover, since the wavelength band which does not heat things other than an adhesive agent to high temperature can be selected, the problem which heats an unnecessary location excessively can also be avoided.
  • the first joining portion is a joining portion between the outer peripheral portion of the edge and the frame for joining a diaphragm which is a part of the vibrating body to the frame, and a voice coil support which is a part of the vibrating body.
  • a diaphragm which is a part of the vibrating body to the frame
  • a voice coil support which is a part of the vibrating body.
  • Including one or both of an outer peripheral portion of a damper that supports a portion on the frame and a joint portion between the frame, and the second joint portion is a joint portion between the voice coil support portion and the inner peripheral portion of the diaphragm.
  • One or both of the joining locations of the voice coil support part and the inner peripheral part of the damper are included.
  • the first adhesive an adhesive having high flexibility at the time of curing suitable for this is selected, and the second joint location is the joint location between the voice coil support portion and the inner peripheral portion of the diaphragm or the voice coil support.
  • an adhesive having a high hardness at the time of curing is selected as the second adhesive so as to be suitable for this. be able to.
  • the second joint location described above includes a plurality of joint locations using a plurality of adhesives different in kind from the first adhesive. That is, when there are a number of different joints such as first, second, third, etc., a second adhesive different from the first adhesive is used at the second, third, etc. joints, or Even in the case of using the second and third adhesives different from the first adhesive, it is possible to irradiate infrared rays in the wavelength band corresponding to the curing characteristics of the respective adhesives in the same manner. Similar advantages can be obtained.
  • the infrared irradiation process described above forms a plurality of infrared irradiation areas in which a plurality of infrared irradiation apparatuses having different set temperatures are arranged, and sequentially passes through the plurality of infrared irradiation areas while moving the speaker. It is characterized by. According to this, infrared irradiation corresponding to different adhesives or joint positions at different positions can be made to correspond to a plurality of infrared irradiation areas, and in a series of passing steps, appropriate for all joint parts or all adhesives. Heat curing treatment can be performed.
  • the plurality of infrared irradiation areas described above are set to a far infrared band having a high set temperature on the entrance side where the speaker is inserted and set to an infrared band having a low set temperature on the exit side.
  • infrared rays in the far-infrared band necessary for curing the adhesive are irradiated on the entrance side, and heating is kept low on the exit side before proceeding to the next step, so that it can be promptly performed when proceeding to the next step.
  • the temperature can be lowered to a temperature that can be handled by hand.
  • the first adhesive and the second adhesive have a peak wavelength band including an absorption peak wavelength at which absorption reaches a peak at a specific wavelength in the infrared range. It is set according to the absorption peak wavelength of one or both of the adhesive and the second adhesive. According to this, since the set temperature of the plurality of infrared irradiation areas is set according to the absorption peak wavelength of one or both of the first adhesive and the second adhesive, each adhesive in the plurality of infrared irradiation areas A wavelength band suitable for the curing characteristics can be selected, and a heat curing treatment can be sufficiently applied to one kind of adhesive in one infrared irradiation area.
  • the first adhesive and the second adhesive have a peak wavelength band including an absorption peak wavelength at which absorption reaches a peak at a specific wavelength in the infrared region, and the absorption peak wavelength is in the far infrared region.
  • the above-described absorption peak wavelength is characterized in that the first adhesive and the second adhesive are close or part of the peak wavelength band overlap. According to this, both the first adhesive and the second adhesive can be appropriately heat-cured using a plurality of infrared irradiation devices having one or a similar wavelength band.
  • one or both of the first adhesive and the second adhesive have a plurality of absorption peak wavelengths, one of which is in the mid-infrared region. According to this, by setting the infrared irradiation area of one infrared irradiation device to the mid-infrared area, it is possible to change the multiple infrared irradiation areas in stages and efficiently heat the multiple joints in stages. A heat curing treatment can be performed.
  • the infrared irradiation device is arranged both above and below the moving speaker, and on the diaphragm side of the speaker with respect to the distance between the infrared irradiation device and the speaker arranged on the magnetic circuit side of the speaker. It is characterized in that the distance between the arranged infrared irradiation device and the speaker is increased. According to this, the infrared irradiation device disposed on the magnetic circuit side having a large heat capacity is brought close to the speaker joint, and the infrared irradiation device disposed on the diaphragm side of the speaker having a relatively high temperature rise speed is connected to the speaker joint.
  • the heat capacity of the component members arranged on the diaphragm side among the plurality of component members constituting the speaker is relatively small compared to the heat capacity of the component members arranged on the magnetic circuit side.
  • the infrared irradiation device includes a casing made of a metal member, a heating element disposed in the casing, and an insulating layer disposed between the heating element and the casing. . According to this, safety can be improved by electrically insulating the heating element and the housing.
  • the first adhesive is a moisture curable adhesive
  • the second adhesive is a two-component reaction curable adhesive.
  • the 1st junction location using the 1st adhesive is made into the junction location of the form suitable for moisture hardening type adhesives
  • the 2nd junction location using the 2nd adhesive is 2 liquid reaction hardening type adhesion Adhesives can be appropriately selected in accordance with the form of the joint by using the joint suitable for the agent.
  • a step of wetting the first joint with water is added before applying the first adhesive to the first joint.
  • a step of wetting the first joint with water before the application is added, so that the moisture curable adhesive is cured in the working environment. Regardless of the working environment, the manufacturing time can be shortened and a constant productivity can be obtained.
  • the first adhesive is a moisture curable adhesive
  • the second adhesive is an ultraviolet curable adhesive
  • a speaker according to an embodiment of the present invention is a speaker including a vibrating body, a driving unit that drives the vibrating body, and a frame that supports the vibrating body and the driving unit. And a part of another constituent member of the speaker are joined via an adhesive, and the joint part is a part of one constituent member of the speaker and a part of another constituent member of the speaker.
  • the first adhesive is different in type from the first adhesive, and a part of one constituent member of the speaker and a part of the other constituent member of the speaker are different from each other.
  • the absorption peak wavelengths of the first adhesive used at the first joint location and the second adhesive used at the second joint location are both in the far infrared region.
  • Two types of adhesives can be effectively heat-cured using a far-infrared infrared irradiation device set at a high temperature. According to this, using two types of adhesives, for example, it is possible to appropriately bond, for example, a joint portion that needs to improve propagation of vibration and a joint portion that needs to reduce fatigue due to bending during vibration. And a good cured state can be obtained in a short adhesive curing time.
  • FIG. 1 is an explanatory view showing general components of a speaker.
  • the manufacturing method of the speaker according to the embodiment of the present invention is not particularly limited to such a speaker form.
  • a speaker having a cone-shaped diaphragm and an inner magnet type magnetic circuit or an outer magnet type magnetic circuit a speaker having a dome shaped diaphragm and an inner magnet type magnetic circuit or an outer magnet type magnetic circuit, and an inverted dome shape Speaker having a diaphragm, an inner magnet type magnetic circuit or an outer magnet type magnetic circuit, a speaker having a flat diaphragm and an inner magnet type or an outer magnet type magnetic circuit, vibration of the diaphragm and the voice coil Including a driving member for transmitting a vibration to the diaphragm, a plurality of edges for supporting each of the diaphragm and the driving member on a frame, and an inner or outer magnetic circuit, a folded diaphragm and an inner magnet Or a speaker provided with a magnetic circuit of an outer magnet type, other well-known speakers, etc.
  • the magnetic circuit described above may be an internal magnetic type / external magnetic type magnetic circuit, a repulsive magnetic circuit, or the like.
  • the constituent members of the speaker 1 include a diaphragm 10, an edge 11, a voice coil 12, a voice coil support unit (voice coil bobbin) 13, a damper 14 and the like as a vibrating body, and a yoke as a driving unit for driving the vibrating body. 21, a magnetic circuit 20 formed by a magnet 22 and a plate 23, and a frame 30 that supports the vibrating body and the drive unit. Further, the frame 30 is arranged as a separate member from the yoke 21 in FIG.
  • the yoke 21 may have the function of the frame 30.
  • the yoke 21 includes a bottom surface portion and a cylindrical portion surrounding the bottom surface portion, and the outer peripheral portion of the cylindrical portion of the yoke 21 extends to the vicinity of the outer peripheral portions of the diaphragm 10 and the edge 11, and the edge 11 is To support.
  • a step portion is formed in the cylindrical portion of the yoke 21, and an outer peripheral portion of the damper 14 is attached to the step portion.
  • the diaphragm 10 is a component related to the reproduction frequency characteristic of the speaker, and includes a dome shape, a ribbon shape, a flat plate shape, etc. in addition to the cone shape as shown in the figure.
  • a polymer material, a metal material, a composite material, a ceramic material, or the like is employed depending on the application.
  • the edge 11 is a flexible connecting member for supporting the outer peripheral edge of the diaphragm 10 to the frame 30, and includes a corrugated shape, a V shape, and the like in addition to the roll shape as illustrated.
  • As the edge material a resin material such as leather or rubber, a material coated with a cloth, or the like is used.
  • the voice coil 12 is formed by winding a conducting wire to which an audio current is input, and is a constituent member that is positioned in the magnetic gap 20G of the magnetic circuit 20 and generates a driving force (Lorentz force) by the audio current.
  • the voice coil support portion 13 is a structural member that supports the voice coil 12 and transmits the driving force described above to the diaphragm 10.
  • the damper 14 is a constituent member for supporting the voice coil support portion 13 on the frame 30, and is a member for supporting the voice coil support portion 13 so that the voice coil 12 is positioned in the magnetic gap 20G.
  • the magnetic circuit 20 forms a desired magnetic flux in the magnetic gap 20G by components such as a yoke 21, a magnet 22, and a plate 23.
  • the frame 30 is a structural member for supporting the drive unit including the vibrating body and the magnetic circuit 20 and for attaching the speaker 1 itself to a mounting location or an enclosure. Further, the frame 30 is arranged as a separate member from the yoke 21 in FIG. 1 and has a function of supporting the vibrating body and the magnetic circuit 20, but the yoke 21 may have the function of the frame 30.
  • the yoke 21 includes a bottom surface portion and a cylindrical portion surrounding the bottom surface portion, and the outer peripheral portion of the cylindrical portion of the yoke 21 extends to the vicinity of the outer peripheral portions of the diaphragm 10 and the edge 11, and the edge 11 is To support.
  • a step portion is formed in the cylindrical portion of the yoke 21, and an outer peripheral portion of the damper 14 is attached to the step portion.
  • Such a loudspeaker has many joint portions where the constituent members are joined together, and the joint portions join a part of one constituent member and a part of another constituent member via an adhesive. It is a thing.
  • the joining process at this joining location is the main process.
  • main joints include a joint part A that joins the outer peripheral part of the edge 11 and the outer peripheral support part of the frame 30, a joint part A1 that joins the inner peripheral part of the edge 11 and the outer peripheral part of the diaphragm 10, and a damper. 14, a joint B that joins the outer peripheral portion of 14 and the inner support portion of the frame 30, a joint C that joins the inner peripheral portion of the diaphragm 10 and the outer peripheral surface of the voice coil support portion 13, and the inner peripheral portion of the damper 14 Joint location D for joining the outer peripheral surface of the voice coil support portion 13, joint location for joining the voice coil 12 and the voice coil support portion 13, joint location for joining the bottom surface of the frame 30 and the top surface of the magnetic circuit 20. Etc.
  • a drive member that transmits the vibration of the voice coil to the diaphragm, a plurality of edges, and an internal magnet type or an external magnet type magnetic circuit
  • the drive member is supported in addition to the above-described joints. Examples include a joining portion that joins the edge and the frame.
  • joints A, B, C, and D described above are joined via an adhesive.
  • a moisture-curing adhesive that can provide a certain degree of elasticity after curing in order to ensure the flexibility of the joints is used. It is used.
  • an adhesive having a high hardness after curing is often used to harden the joints.
  • a moisture-curing silicone adhesive is used at the joints such as the former, and a two-component reaction curable acrylic adhesive or an ultraviolet curable adhesive is used at the joints such as the latter. The agent is used.
  • the joining process described above is performed at the first joining location such as the joining locations A and B, and the first adhesive (e.g. The first adhesive that is bonded via the moisture-curing adhesive) and the second bonding points such as the bonding points C and D are different in type from the first adhesive between the constituent members of the speaker 1.
  • a second step of joining via a second adhesive for example, a two-component reaction curing type adhesive.
  • the first joining location includes one or both of the joining location A and the joining location B described above
  • the second joining location is one or both of the joining location C and the joining location D described above.
  • the second joint location includes a plurality of joint locations using a plurality of adhesives of different types from the first adhesive, and includes cases where multiple types of adhesives are used. In the description, the use of two types of adhesive will be described as an example.
  • both the adhesives can be appropriately heat-cured by selecting the wavelength band corresponding to the curing characteristics of each adhesive and performing infrared irradiation.
  • FIG. 2 is a graph showing examples of infrared absorption spectra of two types of adhesives (the vertical axis represents reflectance (%) and the horizontal axis represents wave number (1 / cm)). Although the graph shows the reflectance of infrared rays, the absorptance is indicated by 1-reflectance, so the absorptance is also shown at the same time.
  • the figure (a) is the infrared absorption spectrum before hardening which mixed A liquid and B liquid of 2 liquid reaction hardening type adhesive, The figure (b) shows the infrared absorption spectrum before hardening of moisture hardening type adhesive. Show.
  • the absorption peak as shown in the figure a is in the far-infrared band, and the absorption peak wavelength there is 1 / n1.
  • the absorption peak as shown in illustration b exists in a far-infrared zone
  • an absorption peak as shown in the figure c is also present in the mid-infrared band.
  • the peak wavelength at which the infrared radiation intensity peaks is set to be close to or substantially the same as the peak wavelength at which the infrared absorption of the adhesive peaks. It is preferable that the adhesive is cured quickly.
  • the wavelength band of the infrared ray irradiated in the infrared irradiation step is set so as to include the far infrared band, or the wavelength band of the infrared ray is set so as to include the mid-infrared band.
  • FIG. 3 is an explanatory diagram showing an infrared irradiation process in the embodiment of the present invention.
  • the infrared irradiation process can be performed by placing the speaker 1 on a conveying means 41 such as a conveyor belt and moving it so as to pass through the heating chamber 40.
  • a conveying means 41 such as a conveyor belt
  • a plurality of infrared irradiation devices 42A, 42B, 43A, 43B, 44A, and 44B are installed.
  • the infrared irradiation process includes a plurality of infrared irradiation zones Z 1 , Z 2 , Z 3 in which a plurality of infrared irradiation devices (42A, 42B), (43A, 43B), (44A, 44B) having different set temperatures are arranged. , And a plurality of infrared irradiation zones Z 1 , Z 2 , and Z 3 are sequentially passed while moving the speaker 1.
  • a zone Z 4 without an infrared irradiation device is provided on the outlet side in the heating chamber 40.
  • a plurality of infrared irradiation zones Z 1 , Z 2 , and Z 3 can be made to correspond to infrared irradiation corresponding to different adhesives or bonding positions at different positions, and all bonding can be performed in a series of passing steps.
  • Appropriate heat-curing treatment can be performed on a part or all of the adhesive.
  • the plurality of infrared irradiation zones Z 1 , Z 2 , and Z 3 are set in the far infrared band having a high set temperature in the infrared irradiation zone Z 1 on the entrance side of the speaker 1 and set in the infrared zone Z 3 on the exit side.
  • the infrared band is set at a low temperature. According to this, infrared rays in the far-infrared band necessary for curing the adhesive are irradiated on the entrance side, and heating is kept low on the exit side before proceeding to the next step, so that it can be promptly performed when proceeding to the next step.
  • the temperature can be lowered to a temperature that can be handled by hand. In the illustrated example, since the zone Z 4 without the infrared irradiation device is provided before the exit, the temperature of the speaker 1 can be further lowered before the next process, and quick handling becomes possible.
  • the set temperature of the plurality of infrared irradiation zones Z 1 , Z 2 , Z 3 in the infrared irradiation process is set to the absorption peak wavelength (1 / n1, 1 / n2) of one or both of the first adhesive and the second adhesive.
  • the set temperature here refers to, for example, the surface temperature of the constituent member of the speaker or the temperature in the heating chamber that heats the constituent member of the speaker.
  • the surface temperature of the constituent member of the speaker is preferably set to the set temperature.
  • the peak wavelength band here is defined by two specific wavelengths found in the infrared absorption characteristics, rising from one specific wavelength toward the peak wavelength, and falling from the peak wavelength toward the other specific wavelength, A peak having a peak, which is a band between the two specific wavelengths.
  • the adhesive can be efficiently cured using an apparatus, and even if it is an infrared irradiation apparatus of one wavelength band, an effective heat curing treatment can be applied to two types of adhesive. it can.
  • the absorption peak wavelengths (1 / n1, 1 / n2) of the two adhesives are plural so that they are close or part of the peak wavelength band of the two adhesives overlap.
  • a plurality of types of adhesive can be appropriately heat-cured together using one or a plurality of infrared irradiation devices having a similar wavelength band.
  • a case having an absorption peak wavelength (1 / n3) in the mid-infrared region is adopted.
  • One of the plurality of infrared irradiation devices 42A, 42B, 43A, 43B, 44A, 44B can be set to the mid-infrared region, and the plurality of infrared irradiation regions Z 1 , Z 2 , Z 3 can be changed stepwise. Since it can do, a some joint location can be heated in steps and a heat-hardening process can be performed efficiently.
  • the infrared radiation characteristics radiated by one infrared irradiation device in the infrared radiation characteristics radiated by one infrared irradiation device, two adhesive reds within the wavelength band in which infrared radiation can be emitted. It is preferable to set so that there is a peak wavelength or peak wavelength band where the external absorption reaches a peak. In addition, in the wavelength band in which the infrared radiation device can radiate, the peak wavelength at which infrared absorption peaks in one or both of the two adhesives is near or at the peak wavelength at which the radiation intensity peaks at a specific wavelength. It is preferable to set so as to be substantially the same.
  • infrared irradiation devices are arranged vertically.
  • Infrared irradiation devices (42A, 42B), (43A, 43B), (44A, 44B) are arranged in a pair on both the upper and lower sides.
  • this infrared irradiation apparatus (42A, 42B), (43A, 43B), (44A, 44B) adjoins the speaker 1 with infrared irradiation apparatus 42B, 43B, 44B arrange
  • Infrared irradiation devices 42A, 43A, 44A arranged on the diaphragm 10 side of the speaker 1 are arranged away from the speaker 1. Specifically, the infrared irradiation devices 42B, 43B, and 44B arranged on the magnetic circuit 20 side of the speaker 1 are arranged such that the distance from the speaker 1 is the infrared irradiation devices 42A and 43A arranged on the diaphragm 10 side of the speaker 1. 44A and the speaker 1 are arranged so as to be smaller than the distance between them.
  • the infrared irradiation devices 42B, 43B, 44B arranged on the magnetic circuit 20 side having a large heat capacity are brought close to the joint portion of the speaker 1, and the temperature rise rate of the speaker 1 having a relatively high temperature (relatively small heat capacity).
  • the surface temperature at each joining position is set to a desired set temperature. The difference in temperature rise due to the difference can be equalized, and the heat curing process at the joint portion of the entire speaker can be made efficient.
  • FIG. 4 shows a structural example of the infrared irradiation devices 42A, 42B, 43A, 43B, 44A, 44B according to the embodiment of the present invention.
  • the infrared irradiation devices 42A to 44B include a casing 50 made of a metal member, a heating element 51 disposed in the casing 50, an insulating layer 52 disposed between the heating element 51 and the casing 50, 53. Further, soaking plates 54 and 55 are provided in the housing 50, and an infrared radiation layer 56 is provided on the outer periphery of the housing 50.
  • safety can be improved by electrically insulating the heating element 51 and the casing 50, and uniform infrared rays can be radiated throughout the casing 50 by the heat equalizing plates 54 and 55. Infrared rays can be emitted from the radiation layer 56 in a predetermined direction.
  • one of a plurality of types of adhesives is a moisture curable adhesive
  • a step of wetting the joint with water before applying the moisture curable adhesive to the joint is added. In this way, the curing rate of the adhesive can be further increased.
  • FIG. 5 and FIG. 6 are explanatory views showing specific examples of the joining process when a moisture-curing adhesive is used.
  • FIG. 5 shows a process of joining the damper 14 to which the voice coil support portion 13 is joined to the frame 30.
  • 6 shows a step of joining the diaphragm 10 and the edge 11 to the frame 30 and the voice coil support portion 13 after the step shown in FIG.
  • the water jetting nozzle 60 toward the joint B 02 is spraying water or an aqueous solution in a mist form.
  • the joint location B 01 of the damper 14 to which the voice coil support portion 13 is joined in advance is joined to the joint location B 02 of the frame 30.
  • water or an aqueous solution may be ejected to the joint B 01 of the damper 14, or a moisture-curing adhesive may be applied to the joint B 01 .
  • the fibrous damper 14 is impregnated with water or an aqueous solution by pressure-injecting the water or the aqueous solution, A moderate wet state can be maintained.
  • the adhesive layer is interposed between the joint B 02 of the frame 30 and the joint B 01 of the damper 14, and then both are joined.
  • a pressing step for applying pressure P is performed.
  • the thickness of the adhesive layer can be set to a value necessary for increasing the bonding force.
  • the thickness of the adhesive layer required to increase the curing speed and the bonding force is about 0.1 mm to about 0.35 mm.
  • Examples of the pressing means include known techniques such as pressurizing the adhesive layer with a pressing member and pressurizing with a water spray or the like, and are not particularly limited. Since the adhesive layer that has undergone the pressing step is impregnated with water or an aqueous solution, the peak wavelength at which absorption of infrared rays at a specific wavelength peaks, indicating that the adhesive and water or the aqueous solution have reacted and cured. It can be seen. In addition, since this peak wavelength is in the infrared region, particularly in the far infrared region, it is presumed that as the curing of the adhesive proceeds, the infrared absorption intensity at the peak wavelength increases and the temperature of the adhesive increases relatively. It is possible to accelerate the curing of the adhesive and to cure the adhesive in a short time.
  • FIGS. 6A to 6C After the steps of FIGS. 5A to 5C, the steps of FIGS. 6A to 6C are performed to join the diaphragm 10 and the edge 11 to the frame 30 and the voice coil support portion 13.
  • the frame 30 to which the magnetic circuit 20 is bonded is placed on the turntable described above, the center axis of the frame 30 is aligned with the rotation axis O, and the water jet nozzle 60 is bonded to the turntable at a fixed position.
  • agent discharge nozzles 70 are arranged to direct the respective nozzle joint a 02.
  • a moisture hardening type adhesive agent is discharged from the adhesive discharge nozzle 70.
  • FIG. After the adhesive has been applied to the entire adhesive portion A 02, the discharge of the adhesive from the adhesive discharge nozzle 70 is stopped, by continuing the rotation of the turntable, the water jet nozzle 60 onto the applied adhesive Water or an aqueous solution may be ejected from the water.
  • the water jetting nozzle 60 toward the joint A 02 is spraying water or an aqueous solution in a mist form.
  • the joining location A 01 of the edge 11 where the diaphragm 10 is joined in advance is joined to the joining location A 02 of the frame 30.
  • water or an aqueous solution may be ejected to the joining portion A 01 of the edge 11, or a moisture-curing adhesive may be applied to the joining portion A 01 .
  • the thickness of the adhesive layer can be set to a value necessary for increasing the bonding force. Also in this case, the thickness of the adhesive layer necessary to increase the curing speed and the bonding force is about 0.1 mm to about 0.35 mm.
  • an adhesive different in type from the above-mentioned moisture-curing adhesive for example, a two-component reaction curing type or an ultraviolet curing.
  • a two-component reaction curing type or an ultraviolet curing Use mold adhesive.
  • the infrared irradiation process as described above is performed, and the adhesive portions are heat-cured with respect to the joints A, B, and C.
  • the infrared irradiation process also serves as a drying process at the joints A and B.
  • the curing time and the drying time of the adhesive can be shortened.
  • the drying time can be shortened as compared with the case where water or aqueous solution is attached to the entire speaker.
  • the wettability of the joints of the components that make up the speaker is increased by surface treatment, and after applying a water-based paint to the joints of each member, a moisture-curing adhesive is applied and the components are bonded together.
  • a pretreatment step such as surface treatment may be appropriately performed.
  • an aqueous solution in which additives such as chlorine, metal particles, and mineral particles are mixed like tap water can be used.
  • the aqueous solution is used for the adhesive after curing.
  • the mixed components remain, there is no problem as a function of the adhesive.
  • the temperature of the adhesive can be improved by infrared irradiation, and the adhesive can be cured and dried efficiently.
  • the aqueous solution may contain water, an organic solvent such as ethanol or methanol, or a surfactant, and may contain a known additive as long as water can easily penetrate into the adhesive. .
  • each of the above-described embodiments can divert each other's technology as long as there is no particular contradiction or problem in its purpose and configuration.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

L'invention porte sur un procédé de fabrication de haut-parleur, qui a une période de temps de fabrication raccourcie par raccourcissement des périodes de temps de prise d'adhésifs de différents types, lorsqu'ils sont utilisés, de manière efficace au niveau de parties de jonction individuelles. Ce procédé de jonction comprend une première étape consistant à joindre deux éléments constitutifs du haut-parleur par un premier adhésif, et une seconde étape consistant à joindre les deux éléments constitutifs du haut-parleur par un second adhésif d'un type différent de celui du premier adhésif. Le procédé de jonction effectue, après la première étape et la seconde étape, une étape d'irradiation par rayons infrarouges consistant à irradier le premier adhésif et le second adhésif par les rayons infrarouges de bandes de longueurs d'onde adaptées aux caractéristiques de prise des adhésifs individuels.
PCT/JP2008/069944 2008-10-31 2008-10-31 Procédé de fabrication de haut-parleur WO2010050063A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010535603A JP5026596B2 (ja) 2008-10-31 2008-10-31 スピーカの製造方法
CN2008801317789A CN102204282A (zh) 2008-10-31 2008-10-31 扬声器的制造方法
PCT/JP2008/069944 WO2010050063A1 (fr) 2008-10-31 2008-10-31 Procédé de fabrication de haut-parleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/069944 WO2010050063A1 (fr) 2008-10-31 2008-10-31 Procédé de fabrication de haut-parleur

Publications (1)

Publication Number Publication Date
WO2010050063A1 true WO2010050063A1 (fr) 2010-05-06

Family

ID=42128441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069944 WO2010050063A1 (fr) 2008-10-31 2008-10-31 Procédé de fabrication de haut-parleur

Country Status (3)

Country Link
JP (1) JP5026596B2 (fr)
CN (1) CN102204282A (fr)
WO (1) WO2010050063A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012024681A (ja) * 2010-07-22 2012-02-09 Toppan Printing Co Ltd 無溶剤型接着剤組成物の塗工方法及び塗工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111098A (ja) * 1984-11-05 1986-05-29 Matsushita Electric Ind Co Ltd スピ−カ
JPH01502436A (ja) * 1987-02-20 1989-08-24 ヘンケル・テロゾン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング コーキング剤及び接着剤並びにその使用
JPH05291351A (ja) * 1992-04-13 1993-11-05 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法
JPH07114974A (ja) * 1993-10-15 1995-05-02 Dairin Shoji:Kk 遠赤外線輻射体および遠赤外線輻射方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111098A (ja) * 1984-11-05 1986-05-29 Matsushita Electric Ind Co Ltd スピ−カ
JPH01502436A (ja) * 1987-02-20 1989-08-24 ヘンケル・テロゾン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング コーキング剤及び接着剤並びにその使用
JPH05291351A (ja) * 1992-04-13 1993-11-05 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法
JPH07114974A (ja) * 1993-10-15 1995-05-02 Dairin Shoji:Kk 遠赤外線輻射体および遠赤外線輻射方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012024681A (ja) * 2010-07-22 2012-02-09 Toppan Printing Co Ltd 無溶剤型接着剤組成物の塗工方法及び塗工装置

Also Published As

Publication number Publication date
JP5026596B2 (ja) 2012-09-12
CN102204282A (zh) 2011-09-28
JPWO2010050063A1 (ja) 2012-03-29

Similar Documents

Publication Publication Date Title
US11325366B2 (en) Method and apparatus for adhesive activation
JP2017135397A5 (fr)
JP5026596B2 (ja) スピーカの製造方法
CN1568528A (zh) 层叠铁心的制造装置及制造方法
JP5509529B2 (ja) 接合組立品の製造方法および接合組立品の製造装置
TWI666738B (zh) 半導體晶片的安裝裝置及安裝方法
US20160016395A1 (en) Device Structures Bonded With Adhesive Films
WO2010050062A1 (fr) Procédé de fabrication de haut-parleur
CN104685256A (zh) 用于将摩擦衬片元件安置在摩擦衬片承载件上的方法和设备
JP5727773B2 (ja) 接着剤供給装置及び接着剤供給方法
JPH04361010A (ja) 複合レンズの成形方法とその装置
WO2016103508A1 (fr) Procédé de modification de la surface de matériau composite, procédé de collage de matériau composite, matériau composite et structure collée
KR20010083215A (ko) 실리콘 고무의 경화방법 및 경화장치
JP2007522756A (ja) 電気音響トランスジューサ用の膜体の特性を変更する方法及び装置
WO2013166499A2 (fr) Procédé de durcissement et adhésif entre au moins deux panneaux
CN214412945U (zh) 扬声器组件的装配装置及扬声器组件
JP4845025B2 (ja) 磁気デバイス用コアの接着方法およびその接着装置
JP5437049B2 (ja) 板状部材の保持装置および保持方法
JP5936747B2 (ja) 表示装置を構成する部材の製造装置および製造方法
JPH07246657A (ja) 内装材の製造方法及び装置
JP2019133997A (ja) ダイボンド用樹脂の敷設方法
JP5320867B2 (ja) 接合組立品の製造方法および接合組立品の製造装置
CN112019990B (zh) 应用超音波接合的复层导线弹波制造方法
KR20170045755A (ko) Mccl용 적층판 제작 장치 및 방법
JP6161759B2 (ja) 貼合ワークの製造装置及び貼合ワークの製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880131778.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08877773

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2010535603

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08877773

Country of ref document: EP

Kind code of ref document: A1