WO2010044391A1 - 電気抵抗膜付き金属箔及びその製造方法 - Google Patents
電気抵抗膜付き金属箔及びその製造方法 Download PDFInfo
- Publication number
- WO2010044391A1 WO2010044391A1 PCT/JP2009/067716 JP2009067716W WO2010044391A1 WO 2010044391 A1 WO2010044391 A1 WO 2010044391A1 JP 2009067716 W JP2009067716 W JP 2009067716W WO 2010044391 A1 WO2010044391 A1 WO 2010044391A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal foil
- electric resistance
- foil
- resistance film
- electric
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Definitions
- the present invention relates to a metal foil with an electric resistance film in which a film made of electric resistance is formed on a metal foil.
- Copper foil is generally used as a wiring material for printed circuit boards. This copper foil is divided into an electrolytic copper foil and a rolled copper foil depending on the production method. The range of the copper foil can be arbitrarily adjusted from a very thin copper foil having a thickness of 5 ⁇ m to a thick copper foil having a thickness of about 140 ⁇ m.
- copper foils are bonded to a substrate made of a resin such as epoxy or polyimide and used as a printed circuit board. Copper foils are required to have sufficient adhesive strength with the resin used as the substrate. For this reason, electrolytic copper foils generally use a rough surface called a matte surface that is formed during foil making. Is used after surface roughening treatment. Similarly, rolled copper foil is used after its surface is roughened.
- a resin such as epoxy or polyimide
- Patent Documents 1 and 2 Recently, it has been proposed to form a thin film layer made of an electric resistance material on a copper foil as a wiring material (see Patent Documents 1 and 2).
- An electric resistance element is indispensable for an electronic circuit board.
- a copper foil provided with a resistance layer is used, an electric resistance film layer formed on the copper foil is removed by using an etching solution such as cupric chloride. It is only necessary to expose the resistance element. Therefore, by incorporating the resistor into the substrate, the limited surface area of the substrate can be effectively used compared to the conventional method of mounting the chip resistor element on the substrate using the solder bonding method. Is possible.
- the conventionally used built-in resistor is composed of one kind of substance on a copper foil.
- two resistors and more than one resistor increase the tolerance of circuit design and reduce the man-hour than one resistor. It is an object of the present invention to provide a resistor built-in metal foil having two or more types of resistors on one metal foil.
- the present invention 1) A copper foil with an electric resistance film having a film having a higher electric resistivity than the metal foil on the metal foil, and a plurality of electric resistance films having different electric resistances are juxtaposed on the same metal foil.
- a layer having a high electric resistivity generally means an electric resistance film.
- “electric resistance film” will be described.
- cross-sectional shape means “thickness” and “width”. Even if the electrical resistance is a material having the same resistivity, the electrical resistance varies depending on the thickness and length. Therefore, the present invention includes changing the electric resistance value by changing the “thickness” and “width”, that is, the cross-sectional shape of the film. 4)
- the plurality of electric resistance films are constituted by a combination of resistors having different electric resistivity and resistors having different cross-sectional shapes, respectively.
- the metal with an electric resistance film according to any one of 1) to 4) above, wherein the electric resistance film is configured by placing different resistors in the length direction of the metal foil.
- Foil 6 Any one of the above 1) to 4), wherein the plurality of electric resistance films are configured such that different resistors are placed in a direction transverse to the length direction of the metal foil. 7) The metal foil with an electric resistance film according to any one of 1) to 6) above, wherein the metal of the metal foil is copper or a copper alloy. provide.
- the present invention also provides: 8) A cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target for sputtering, and an electric resistance film is formed on the metal foil.
- a method for producing a metal foil characterized in that at least two or more cathodes are juxtaposed to face the metal foil, and a plurality of electric resistance films having different electric resistances are formed on the same metal foil.
- a cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target, and a target material is formed on the metal foil.
- a method for producing a metal foil with an electric resistance film wherein a shutter is juxtaposed between a target and the metal foil, and the film thickness is controlled by the shutter.
- the metal foil is a copper or copper alloy foil
- the copper foil incorporating two or more types of electric resistance film layers of the present invention it is not necessary to newly form another electric resistance element independently at the time of circuit design.
- the electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
- an etching solution such as cupric chloride
- Another example of the present invention is shown, and shows a structure manufactured so that two types of resistance layers do not overlap.
- An example is shown in which the resistance is different in the winding direction and the internal copper foil structure is different, and different resistors are manufactured by changing the thickness with the same resistor.
- It is explanatory drawing which shows the example which can make the thickness of a resistance layer variable by providing a shutter between copper foil and a target, and moving this shutter mechanically.
- It is explanatory drawing which shows the example which manufactured the resistance layers 1a and 5a from which thickness differs alternately.
- FIG. 1a The structure of a conventional resistor built-in copper foil is shown in FIG. 1a is a built-in thin film resistor, and 1b is a base copper foil.
- the thin film resistor 1a NiCr or the like is used, and a manufacturing method in which a copper foil is wound on the surface of the thin film resistor by a sputtering method is used.
- 2 and 3 are explanatory views showing an example of manufacturing a conventional resistor built-in copper foil.
- the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
- Argon gas is introduced into the vacuum chamber 2e, and the pressure is maintained at about 0.4 pa.
- FIG. 3 is a plan view of the positional relationship between the target and the copper foil.
- 2f is a cathode
- 2g is a target
- 2c is a copper foil
- an arrow indicates a winding direction of the copper foil.
- FIG. 4 shows an embodiment of the present invention.
- 1b is a base copper foil
- 1a and 3a are resistors, for example, NiCr.
- the addition of 3a is the basic structure of the present invention.
- 1a and 3a are made of the same resistor, NiCr
- two types of built-in resistors having different thicknesses can be obtained.
- 1a is set to 200 mm
- 3a is set to 100 mm.
- 5 and 6 are explanatory views showing a manufacturing example of the resistor built-in copper foil of the present invention.
- the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
- FIG. 5 shows a configuration obtained by adding a second cathode 3f to the conventional method shown in FIG. 1, and FIG. 6 shows a positional relationship in a plan view. While winding the copper foil, the first cathode and the second cathode are operated simultaneously and sputtered onto the copper foil. As a result, a copper foil with a built-in resistor having the structure shown in FIG. 4 is obtained. By changing the lengths of the first and second cathodes, two types of resistors can be manufactured with arbitrary widths. Further, when the third and fourth cathodes are further added, several types of resistors can be built on one copper foil.
- FIG. 7 shows another embodiment.
- 1a is an example of a NiCr resistor
- 1b is a copper foil
- 4a is another resistor, for example CrSiO.
- the difference between the two built-in resistors can be increased.
- a NiCr thickness of 300 ⁇ when sputtering a thickness 500 ⁇ of CrSiO, 50 [Omega / cm 2 and 400 [Omega / cm 2 to increase two different types of internal resistors can.
- the manufacturing method is the same as the method shown in FIGS. 5 and 6.
- the target 3g shown in FIGS. 5 and 6 is made of CrSiO so that the cathode length of 2f is shortened so as not to overlap, and sputtering is performed. Then, the structure of FIG. 7 is formed.
- FIG. 8 shows still another embodiment, which is a structure of a built-in copper foil having different resistances in the winding direction.
- FIG. 8 shows a method of manufacturing different resistors by changing the thickness with the same resistor.
- 1b is a base copper foil
- 1a is, for example, a NiCr resistor
- 5a is, for example, a NiCr resistor having a reduced thickness.
- a method of manufacturing the resistor shown in FIG. 8 is shown in FIG.
- FIG. 9 the positional relationship between the cathode 2f, the copper foil 2c, and the shutter 6a is shown in a plan view.
- the shutter 6a in FIG. 9 can be mechanically moved to cover the target 2g. Therefore, by moving the shutter at a high speed, a partially thin resistor as shown in 5a of FIG. 8 can be produced at an arbitrary location.
- FIG. 10 shows an embodiment in which 1a and 5a are produced alternately.
- two or more types of thin film resistors are metal foils with built-in resistors, but the resistor built-in metal foils with two or more types of resistors are arbitrarily determined according to the circuit design.
- the type of the electric resistance material and the selection of the film thickness and shape of the resistance film are determined in consideration of the function of the resistance element, and are not particularly limited.
- the material used for the electric resistance element include materials such as vanadium, tungsten, zirconium, molybdenum, tantalum, nickel, and chromium.
- it is a metal with a comparatively high electric resistance, it can each be used as an independent film
- the material has a relatively low electrical resistance, such as aluminum, silicon, copper, iron, indium, zinc, tin, etc.
- it should be a material whose electrical resistance is increased by alloying it with other elements.
- electric resistance elements such as NiCr alloy and NiCrAlSi alloy are materials that are attracting attention.
- material oxides, nitrides and silicides selected from the group of oxides, nitrides and silicides of the above elements can be used. As described above, it is to be understood that the selection of these materials is arbitrarily selected according to the circuit design and is not limited to these materials.
- a physical surface treatment method such as sputtering, vacuum deposition, ion beam plating, chemical surface treatment such as thermal decomposition, gas phase reaction, or electroplating, It can be formed using a wet surface treatment method such as an electroless plating method.
- the electroplating method can be manufactured at low cost.
- the sputtering method has an advantage that a high-quality resistive element can be obtained because it is a film having a uniform thickness and isotropic.
- the formation of the electric resistance film layer is formed according to the use of the film, and it is desirable that the adhesion method or the plating method in that case is appropriately selected according to the properties of the electric resistance film layer. I can say that.
- a copper foil is a typical material.
- a copper foil having a thickness of 5 to 70 ⁇ m, particularly a copper foil of 5 to 35 ⁇ m can be used.
- the thickness of this copper foil can be arbitrarily selected according to a use, there exists a restriction
- this invention can form an electrical resistance layer in the surface which gave the roughening process of the electrolytic copper foil or the rolled copper foil. Further, it is possible to perform a roughening treatment in which knot-shaped particles are further adhered to the mat surface of the electrolytic copper foil.
- the roughening process to a rolled copper foil can also be performed as needed.
- a rough surface such as a low profile copper foil having a Rz of 0.3 to 10.0 ⁇ m or a standard profile can be obtained.
- two or more kinds of electric resistance film layers can be incorporated in these metal foils.
- the metal foil incorporating two or more types of electric resistance film layers of the present invention it is not necessary to newly form another electric resistance element independently at the time of circuit design.
- the electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
- an etching solution such as cupric chloride
- the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
- a resistance built-in copper foil containing several kinds of resistors can be manufactured by one manufacturing.
- the space can be expanded and the size and weight can be reduced.
- the degree of freedom in circuit design can be improved.
- a single resistor built-in copper foil has an excellent effect that the design range is widened on the mounting surface of the electronic component. It is extremely useful as a substrate.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
しかしながら、従来は金属箔の上に、特定の電気抵抗膜を形成するに留まり、多品種の電気抵抗膜を形成するという発想はなかった。
1)金属箔上に、該金属箔より電気抵抗率の高い膜を有する電気抵抗膜付銅箔であって、当該同一金属箔上に電気抵抗の異なる複数の電気抵抗膜が並置されていることを特徴とする電気抵抗膜付金属箔
この場合、電気抵抗率の高い層というのは、一般に電気抵抗膜のことを意味する。以下の記載では、「電気抵抗膜」として説明する。
2)複数の電気抵抗膜の形状が同一で、それぞれ電気抵抗率が異なる抵抗体により構成されていることを特徴とする上記1)記載の電気抵抗膜付金属箔
3)複数の電気抵抗が、それぞれ断面形状が異なる抵抗体により構成されていることを特徴とする上記1)記載の電気抵抗膜付金属箔
この場合、「断面形状」とは「厚み」と「幅」を意味する。電気抵抗は、同一抵抗率を有する材料であっても、厚さや長さによって電気抵抗が変化する。したがって、本願発明は、このような「厚み」と「幅」、すなわち膜の断面形状を変えることにより、電気抵抗値を変化させることを含むものである。
4)複数の電気抵抗膜が、それぞれ電気抵抗率が異なる抵抗体と断面形状が異なる抵抗体の組合せにより構成されていることを特徴とする上記1)記載の電気抵抗膜付金属箔
5)複数の電気抵抗膜が、金属箔の長さ方向に、異なる抵抗体が載置されて構成されていることを特徴とする上記1)~4)のいずれか一項に記載の電気抵抗膜付金属箔
6)複数の電気抵抗膜が、金属箔の長さ方向に対して横断する方向に異なる抵抗体が載置された構成であることを特徴とする上記1)~4)のいずれか一項に記載の電気抵抗膜付金属箔
7)金属箔の金属が、銅または銅合金であることを特徴とする上記1)~6)のいずれか一項に記載の電気抵抗膜付金属箔、を提供する。
8)真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、金属箔に対面させて、少なくとも2つ以上のカソードを並置し、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法
9)真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、ターゲットと金属箔の間にシャッターを並置して、当該シャッターにより膜厚を制御することにより、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法
10)金属箔が、銅又は銅合金箔であることを特徴とする上記8)又は9)記載の電気抵抗膜付金属箔の製造方法、を提供する。
また、実装部品や半田数が低減される結果、スペースが拡張でき小型軽量になるという利点もある。これによって回路設計の自由度を向上させることができる。また、このように銅箔に2種以上の抵抗体が内蔵されることにより、高周波領域での信号特性が改善される効果を備えている。
図2及び図3は、従来の抵抗内蔵銅箔の製造例を示す説明図である。図2において、2bの巻き戻しロールに巻かれている銅箔2cは、回転する冷却ドラム2dを介して巻取りロール2aに巻き取られる。
真空チャンバー2e内には、アルゴンガスが導入され、圧力を約0.4paに保たれる。次に、カソード2fに高圧電圧を印加すると、プラズマ状態となりターゲット材2gが飛び出し銅箔上へスパッタリングされる。
図3は、ターゲットと銅箔の位置関係を平面的に観た図であり、2fはカソード、2gはターゲット、2cは銅箔で矢印は銅箔の巻取り方向を示す。
図4の例では1aと3aを、同じ抵抗体であるNiCrで構成すると、厚さの異なった二種類の内蔵抵抗体とすることができる。
例えば、50Ω/cm2と100Ω/cm2の、2種類のシート抵抗値の抵抗体を作る場合には、1aを200Åとし、3aを100Åの膜厚とする。
図5及び図6は、本願発明の抵抗内蔵銅箔の製造例を示す説明図である。図5において、2bの巻き戻しロールに巻かれている銅箔2cは、回転する冷却ドラム2dを介して巻取りロール2aに巻き取られる。
第一と第二のカソードの長さを変えることによって2種類の抵抗を任意の幅で製造出来る。また、更に第三、第四のカソードを追加していくと、1枚の銅箔上へ数種類の抵抗を内蔵させることができる。
例えば、NiCr厚さを300Å、CrSiOの厚さ500Åをスパッタリングすると、50Ω/cm2と400Ω/cm2になり大きく異なった2種類の内蔵抵抗体が出来る。
製造方法は、図5及び図6に示した方法と同じであるが、例えば図5及び図6に示すターゲット3gをCrSiOにして、2fのカソード長を短くし重ならないように配置して、スパッタリングすると図7の構造ができる。
この図8の抵抗体を製造する方法を、図9に示す。図9では、カソード2f、銅箔2c、シャッター6aの各位置関係を平面的に示してある。
実際の装置では、図9において6aのシャッターは、ターゲット2gを覆い隠すように機械的に動くことが出来る。それゆえシャッターを高速で動かすことにより、図8の5aに示すような、部分的に薄い抵抗体を任意の場所で、作製することができる。図10は、1aと5aを交互に製造した実施例である。
すなわち、電気抵抗材料の種類と抵抗膜の膜厚や形状の選択は、抵抗素子の機能を考慮して決定されるものであり、特に制限はない。
電気抵抗素子の材料として用いられる例としては、例えばバナジウム、タングステン、ジルコニウム、モリブデン、タンタル、ニッケル、クロム等の材料を挙げることができる。このように電気抵抗が比較的高い金属であれば、それぞれ単独の膜として又は他の元素との合金膜として使用することができる。
例えば、NiCr合金、NiCrAlSi合金等の電気抵抗素子が注目されている材料である。また、上記の元素の酸化物、窒化物、ケイ化物の群から選択された材料酸化物、窒化物、ケイ化物も使用できる。上記の通り、これらの材料の選択は回路設計に応じて任意に選択されるものであり、これらの材料に制限されるものでないことは理解されるべきことである。
この電気抵抗膜層の形成は、膜の用途に応じて形成されるものであり、その場合の付着方法又はめっき方法は、その電気抵抗膜層の性質に応じて、適宜選択することが望ましいと言える。
さらに、実装部品や半田数が低減される結果、スペースが拡張でき小型軽量になるという利点もある。これによって回路設計の自由度を向上させることができる。また、このように銅箔に2種以上の抵抗体が内蔵されることにより、1枚の抵抗内蔵銅箔で電子部品の実装面で設計の幅が広がるという優れた効果を有するので、プリント回路基板として極めて有用である。
2a:巻取りロール
2b:ベースの銅箔
2c:巻き戻しロールに巻かれている銅箔
2d:回転する冷却ドラム
2g:ターゲット
3a:内蔵抵抗体
3f:第二のカソード
3g:ターゲット
4a:別の抵抗体
5a:厚さを薄くしたNiCr抵抗体
6a:シャッター
Claims (10)
- 金属箔上に、該金属箔より電気抵抗率の高い膜を有する電気抵抗膜付銅箔であって、当該同一金属箔上に電気抵抗の異なる複数の電気抵抗膜が並置されていることを特徴とする電気抵抗膜付金属箔。
- 複数の電気抵抗膜の形状が同一で、それぞれ電気抵抗率が異なる抵抗体により構成されていることを特徴とする請求項1記載の電気抵抗膜付金属箔。
- 複数の電気抵抗が、それぞれ断面形状が異なる抵抗体により構成されていることを特徴とする請求項1記載の電気抵抗膜付金属箔。
- 複数の電気抵抗膜が、それぞれ電気抵抗率が異なる抵抗体と断面形状が異なる抵抗体の組合せにより構成されていることを特徴とする請求項1記載の電気抵抗膜付金属箔。
- 複数の電気抵抗膜が、金属箔の長さ方向に、異なる抵抗体が載置されて構成されていることを特徴とする請求項1~4のいずれか一項に記載の電気抵抗膜付金属箔。
- 複数の電気抵抗膜が、金属箔の長さ方向に対して横断する方向に異なる抵抗体が載置された構成であることを特徴とする請求項1~4のいずれか一項に記載の電気抵抗膜付金属箔。
- 金属箔の金属が、銅または銅合金であることを特徴とする請求項1~6のいずれか一項に記載の電気抵抗膜付金属箔。
- 真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、金属箔に対面させて、少なくとも2つ以上のカソードを並置し、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法。
- 真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、ターゲットと金属箔の間にシャッターを並置して、当該シャッターにより膜厚を制御することにより、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法。
- 金属箔が、銅又は銅合金箔であることを特徴とする請求項8又は9記載の電気抵抗膜付金属箔の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010533893A JP5425801B2 (ja) | 2008-10-14 | 2009-10-13 | 電気抵抗膜付き金属箔及びその製造方法 |
CN2009801404809A CN102177015A (zh) | 2008-10-14 | 2009-10-13 | 带电阻膜的金属箔及其制造方法 |
EP09820569.3A EP2338680A4 (en) | 2008-10-14 | 2009-10-13 | METAL FOIL WITH RESISTANT FILM AND METHOD FOR PRODUCING METAL FOIL |
US13/123,127 US8749342B2 (en) | 2008-10-14 | 2009-10-13 | Metal foil with electric resistance film and method of producing the same |
KR1020117007765A KR101384821B1 (ko) | 2008-10-14 | 2009-10-13 | 전기 저항막 부착 금속박 및 그 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008264759 | 2008-10-14 | ||
JP2008-264759 | 2008-10-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010044391A1 true WO2010044391A1 (ja) | 2010-04-22 |
Family
ID=42106554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/067716 WO2010044391A1 (ja) | 2008-10-14 | 2009-10-13 | 電気抵抗膜付き金属箔及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8749342B2 (ja) |
EP (1) | EP2338680A4 (ja) |
JP (1) | JP5425801B2 (ja) |
KR (1) | KR101384821B1 (ja) |
CN (1) | CN102177015A (ja) |
TW (1) | TW201016865A (ja) |
WO (1) | WO2010044391A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012133567A1 (ja) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | 電気抵抗層付き金属箔の製造方法 |
JP5346408B2 (ja) * | 2011-03-28 | 2013-11-20 | Jx日鉱日石金属株式会社 | 電気抵抗膜を備えた金属箔及びその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8749342B2 (en) * | 2008-10-14 | 2014-06-10 | Jx Nippon Mining & Metals Corporation | Metal foil with electric resistance film and method of producing the same |
JP2012201980A (ja) * | 2011-03-28 | 2012-10-22 | Jx Nippon Mining & Metals Corp | 電気抵抗層付き金属箔及びその製造方法 |
EP2693852A4 (en) * | 2011-03-31 | 2014-09-03 | Jx Nippon Mining & Metals Corp | METALLIC SHEET HAVING AN ELECTRO-RESISTIVE LAYER, AND CIRCUIT BOARD USING SAID SHEET |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002115082A (ja) * | 2000-07-31 | 2002-04-19 | Ga-Tek Inc Dba Gould Electronics Inc | プリント回路基板用クロム被覆銅の形成方法 |
JP2002134301A (ja) * | 2000-09-22 | 2002-05-10 | Ga-Tek Inc Dba Gould Electronics Inc | 多層の抵抗材料を有する抵抗構成要素 |
JP3311338B2 (ja) | 2000-02-08 | 2002-08-05 | ジーエイ−テック インク(ディービーエイ ゴールド エレクトロニックス インク) | プリント回路板用の、クロムで被覆された銅を形成する方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
JPS5378050A (en) * | 1976-12-21 | 1978-07-11 | Nitto Electric Ind Co | Multilayer resistance circuit board |
JPS62257702A (ja) * | 1986-04-30 | 1987-11-10 | イビデン株式会社 | 配線基板の製造方法 |
TW289900B (ja) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
JP3789507B2 (ja) | 1995-03-30 | 2006-06-28 | 株式会社アルバック | スパッタリング装置 |
JP3924849B2 (ja) * | 1997-07-04 | 2007-06-06 | 東洋紡績株式会社 | 透明導電フィルムおよびそれを用いた電磁波シールドフィルター |
US6622374B1 (en) * | 2000-09-22 | 2003-09-23 | Gould Electronics Inc. | Resistor component with multiple layers of resistive material |
EP1261241A1 (en) * | 2001-05-17 | 2002-11-27 | Shipley Co. L.L.C. | Resistor and printed wiring board embedding those resistor |
US8749342B2 (en) * | 2008-10-14 | 2014-06-10 | Jx Nippon Mining & Metals Corporation | Metal foil with electric resistance film and method of producing the same |
-
2009
- 2009-10-13 US US13/123,127 patent/US8749342B2/en active Active
- 2009-10-13 JP JP2010533893A patent/JP5425801B2/ja active Active
- 2009-10-13 KR KR1020117007765A patent/KR101384821B1/ko active IP Right Grant
- 2009-10-13 WO PCT/JP2009/067716 patent/WO2010044391A1/ja active Application Filing
- 2009-10-13 EP EP09820569.3A patent/EP2338680A4/en not_active Withdrawn
- 2009-10-13 CN CN2009801404809A patent/CN102177015A/zh active Pending
- 2009-10-14 TW TW098134724A patent/TW201016865A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3311338B2 (ja) | 2000-02-08 | 2002-08-05 | ジーエイ−テック インク(ディービーエイ ゴールド エレクトロニックス インク) | プリント回路板用の、クロムで被覆された銅を形成する方法 |
JP2002115082A (ja) * | 2000-07-31 | 2002-04-19 | Ga-Tek Inc Dba Gould Electronics Inc | プリント回路基板用クロム被覆銅の形成方法 |
JP3452557B2 (ja) | 2000-07-31 | 2003-09-29 | グールド エレクトロニクス インコーポレイテッド | プリント回路基板で用いられる銅層上に抵抗材料を形成する方法およびシート材料 |
JP2002134301A (ja) * | 2000-09-22 | 2002-05-10 | Ga-Tek Inc Dba Gould Electronics Inc | 多層の抵抗材料を有する抵抗構成要素 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2338680A4 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5346408B2 (ja) * | 2011-03-28 | 2013-11-20 | Jx日鉱日石金属株式会社 | 電気抵抗膜を備えた金属箔及びその製造方法 |
US20130344322A1 (en) * | 2011-03-28 | 2013-12-26 | Jx Nippon Mining & Metals Corporation | Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same |
WO2012133567A1 (ja) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | 電気抵抗層付き金属箔の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8749342B2 (en) | 2014-06-10 |
TW201016865A (en) | 2010-05-01 |
US20110236714A1 (en) | 2011-09-29 |
EP2338680A1 (en) | 2011-06-29 |
CN102177015A (zh) | 2011-09-07 |
KR101384821B1 (ko) | 2014-04-15 |
KR20110050728A (ko) | 2011-05-16 |
JPWO2010044391A1 (ja) | 2012-03-15 |
JP5425801B2 (ja) | 2014-02-26 |
EP2338680A4 (en) | 2014-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4332533B2 (ja) | キャパシタ内蔵型プリント回路基板およびその製造方法 | |
JP5425801B2 (ja) | 電気抵抗膜付き金属箔及びその製造方法 | |
US8389866B2 (en) | Resin circuit board | |
JP2008218966A (ja) | キャパシタ内蔵型プリント基板の製造方法及びキャパシタ内蔵型プリント基板 | |
CN114554712A (zh) | 线路板及其制造方法 | |
US6910264B2 (en) | Method for making a multilayer circuit board having embedded passive components | |
JP2012212761A (ja) | 電気抵抗膜付き金属箔及びその製造方法 | |
KR101012919B1 (ko) | 접착제가 없는 연성금속 적층판 및 그 제조방법 | |
JP2004014975A (ja) | 金属箔付フレキシブル回路基板 | |
US7241510B2 (en) | Peelable circuit board foil | |
JP5835670B2 (ja) | プリント配線基板およびその製造方法 | |
JP2004071865A (ja) | 抵抗層積層材および抵抗層積層材を用いた部品 | |
US20130344322A1 (en) | Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same | |
JP7315102B2 (ja) | 樹脂多層基板 | |
WO2024009886A1 (ja) | 配線回路基板およびその製造方法 | |
JP4304659B2 (ja) | 金属化プラスティックフィルム | |
WO2023017556A1 (ja) | コンデンサおよびその製造方法 | |
KR102119604B1 (ko) | 연성 인쇄회로기판 및 그 제조방법 | |
JP2006229097A (ja) | コンデンサフィルム及びその製造方法 | |
JP2006310758A (ja) | 回路配線板、及びその製造方法 | |
JP4857547B2 (ja) | 部品を内蔵した多層配線基板の製造方法 | |
JP2004071866A (ja) | 抵抗層積層材の製造方法および抵抗層積層材を用いた部品の製造方法 | |
JP4645212B2 (ja) | 配線回路板内蔵抵抗素子 | |
JP2010045119A (ja) | フレキシブル基材およびその製造方法 | |
JP2004322614A (ja) | 平滑積層体および平滑積層体を用いた部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980140480.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09820569 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010533893 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009820569 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20117007765 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13123127 Country of ref document: US |