WO2010043517A3 - Bondvorrichtung, ultraschall-transducer und bondverfahren - Google Patents

Bondvorrichtung, ultraschall-transducer und bondverfahren Download PDF

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Publication number
WO2010043517A3
WO2010043517A3 PCT/EP2009/063000 EP2009063000W WO2010043517A3 WO 2010043517 A3 WO2010043517 A3 WO 2010043517A3 EP 2009063000 W EP2009063000 W EP 2009063000W WO 2010043517 A3 WO2010043517 A3 WO 2010043517A3
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
ultrasonic transducer
bonding device
axis
extension
Prior art date
Application number
PCT/EP2009/063000
Other languages
English (en)
French (fr)
Other versions
WO2010043517A2 (de
Inventor
Hans-Jürgen HESSE
Jörg WALLASCHEK
Michael BRÖKELMANN
Piotr Vasiljev
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Priority to EP09744989.6A priority Critical patent/EP2344295B1/de
Priority to US13/123,745 priority patent/US8434659B2/en
Priority to CN200980140650.3A priority patent/CN102186620B/zh
Priority to JP2011531442A priority patent/JP5683470B2/ja
Publication of WO2010043517A2 publication Critical patent/WO2010043517A2/de
Publication of WO2010043517A3 publication Critical patent/WO2010043517A3/de

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Die Erfindung betrifft eine Bondvorrichtung, insbesondere zur Herstellung von Bondverbindungen zwischen elektrischen Leitern aus Draht- oder Bandmaterial und Kontaktstellen von Substraten wie insbesondere von elektrischen Schaltungen, wobei die Bondvorrichtung einen um eine, insbesondere senkrechte, geometrische Drehachse (D) drehbaren Bondkopf aufweist, an dem ein Bondwerkzeug (5) und ein Ultraschalltransducer (35) zur Ultraschall-Schwingungsanregung des Bondwerkzeugs (5) vorgesehen sind. Um eine Bondvorrichtung der eingangs genannten Art vorteilhaft weiterzubilden, wird vorgeschlagen, dass sich die Haupterstreckungsrichtung (36) des Ultraschalltransducers (35) und/oder dessen Erstreckungsrichtung in Richtung der Achse des minimalen Massenträgheitsmoments parallel zu der geometrischen Drehachse (D) des Bondkopfes erstreckt. Gemäß weiteren Aspekten betrifft die Erfindung ebenfalls eine Bondvorrichtung oder einen Ultraschalltransducer (35).
PCT/EP2009/063000 2008-10-14 2009-10-07 Bondvorrichtung, ultraschall-transducer und bondverfahren WO2010043517A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP09744989.6A EP2344295B1 (de) 2008-10-14 2009-10-07 Bondvorrichtung, und bondverfahren zur herstellung von bondverbindungen
US13/123,745 US8434659B2 (en) 2008-10-14 2009-10-07 Bonding device, ultrasonic transducer, and bonding method
CN200980140650.3A CN102186620B (zh) 2008-10-14 2009-10-07 接合装置，超声波转换器和用于建立接合连接的方法
JP2011531442A JP5683470B2 (ja) 2008-10-14 2009-10-07 ボンディング装置、超音波トランスデューサおよびボンディング方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008037450.4 2008-10-14
DE102008037450 2008-10-14
DE102009003312.2 2009-01-06
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren

Publications (2)

Publication Number Publication Date
WO2010043517A2 WO2010043517A2 (de) 2010-04-22
WO2010043517A3 true WO2010043517A3 (de) 2010-07-29

Family

ID=41821369

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/063000 WO2010043517A2 (de) 2008-10-14 2009-10-07 Bondvorrichtung, ultraschall-transducer und bondverfahren

Country Status (9)

Country Link
US (1) US8434659B2 (de)
EP (1) EP2344295B1 (de)
JP (1) JP5683470B2 (de)
KR (1) KR20110084899A (de)
CN (1) CN102186620B (de)
DE (1) DE102009003312A1 (de)
MY (1) MY158655A (de)
TW (1) TWI519017B (de)
WO (1) WO2010043517A2 (de)

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
US20120109207A1 (en) * 2010-10-29 2012-05-03 Warsaw Orthopedic, Inc. Enhanced Interfacial Conformance for a Composite Rod for Spinal Implant Systems with Higher Modulus Core and Lower Modulus Polymeric Sleeve
US8640760B2 (en) * 2011-08-19 2014-02-04 Lg Chem, Ltd. Ultrasonic welding machine and method of aligning an ultrasonic welding horn relative to an anvil
DE102014109630A1 (de) * 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN108555429B (zh) * 2018-05-16 2023-06-20 华侨大学 金属箔大范围连续超声焊接装置
DE102019109262A1 (de) * 2019-04-09 2020-10-15 Lisa Dräxlmaier GmbH VORRICHTUNG ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
CN112427281B (zh) * 2020-09-18 2022-05-24 集美大学 一种复频超声振动加工装置
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

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GB1164600A (en) * 1967-10-31 1969-09-17 Matsushita Electric Ind Co Ltd Piezo-Electric Transformer
GB1326692A (en) * 1970-02-12 1973-08-15 Ibm Ultrasonic bonding device
JPH0653291A (ja) * 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
US20010054230A1 (en) * 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
US20060208615A1 (en) * 2005-03-15 2006-09-21 Fujitsu Limited Oscillating apparatus
US20060283253A1 (en) * 2005-05-20 2006-12-21 Samsung Electro-Mechanics Co., Ltd. Piezoelectric vibrator and ultrasonic motor having piezoelectric vibrator
US20070236107A1 (en) * 2006-04-11 2007-10-11 Canon Kabushiki Kaisha Stacked piezoelectric element and vibration wave driving apparatus

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JPH0777229B2 (ja) * 1988-10-28 1995-08-16 株式会社新川 超音波ワイヤボンディング装置
US6233818B1 (en) * 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
JP2000040716A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd ボンディング装置
JP2007150188A (ja) * 2005-11-30 2007-06-14 Ngk Insulators Ltd 圧電デバイスの制御方法
TW200801513A (en) * 2006-06-29 2008-01-01 Fermiscan Australia Pty Ltd Improved process
EP2133191A4 (de) * 2007-03-02 2013-05-15 Compania Espanola De Ultrasonidos Sa Ultraschallkopf und wandler zum ultraschalllöten von kunststoffen
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164600A (en) * 1967-10-31 1969-09-17 Matsushita Electric Ind Co Ltd Piezo-Electric Transformer
GB1326692A (en) * 1970-02-12 1973-08-15 Ibm Ultrasonic bonding device
JPH0653291A (ja) * 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
US20010054230A1 (en) * 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
US20060208615A1 (en) * 2005-03-15 2006-09-21 Fujitsu Limited Oscillating apparatus
US20060283253A1 (en) * 2005-05-20 2006-12-21 Samsung Electro-Mechanics Co., Ltd. Piezoelectric vibrator and ultrasonic motor having piezoelectric vibrator
US20070236107A1 (en) * 2006-04-11 2007-10-11 Canon Kabushiki Kaisha Stacked piezoelectric element and vibration wave driving apparatus

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US20110266329A1 (en) 2011-11-03
TWI519017B (zh) 2016-01-21
KR20110084899A (ko) 2011-07-26
CN102186620B (zh) 2014-03-05
JP5683470B2 (ja) 2015-03-11
WO2010043517A2 (de) 2010-04-22
EP2344295A2 (de) 2011-07-20
DE102009003312A1 (de) 2010-04-15
US8434659B2 (en) 2013-05-07
MY158655A (en) 2016-10-31
JP2012505083A (ja) 2012-03-01
EP2344295B1 (de) 2020-03-11
CN102186620A (zh) 2011-09-14
TW201025771A (en) 2010-07-01

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