Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/0092—Treatment of the terminal leads as a separate operation

Definitions

• the present invention relates to a device and a method for positioning electronic components in a processing tool, wherein the components are linearly displaceable between an upper guide and a lower guide.
• the present invention has for its object to provide an improved device and an improved method with which electronic components can be positioned in a processing tool in a reliable manner and at reduced cost compared to the prior art.
• the present invention provides for this purpose a device for positioning linearly displaceable electronic components in a processing tool, comprising: a linear lower guide for guided support of the electronic components over a path; and a linear upper guide for guided limiting of the freedom of movement of the electronic components at a distance from the lower guide, wherein at least one of the guides forms part of a flat metal sheet, this sheet being provided with weakened portions such that the guide is resiliently displaceable at least 0.005 mm, preferably at least 0.01 mm, perpendicularly of the flat metal sheet relative to the sheet material surrounding the guide.
• the resiliently displaceable guide is preferably resiliently displaceable a maximum of 0.05 mm, or still more desirably a maximum of 0.0 3 mm, relative to the sheet material surrounding the guide.
• Resiliency displaceable is here understood to mean a freedom of movement perpendicularly of the flat metal sheet which is such that during the quantified displacement, after the force with which the displacement is effected has been removed, the guide returns fully to the starting situation prior to the displacement.
• the freedom of movement of the electronic components between the guides can be influenced by varying the distance between the upper guide and the lower guide.
• An important advantage of the device according to the invention is now however that it also becomes possible to clamp the electronic components between the guides with little chance of damage. Displacement (linear guiding) of the electronic components between the guides can thus be obstructed or even prevented, as desired, such that the electronic components are clamped between the guides. This can for instance be advantageous for the purpose of performing processes on the electronic components or carrying out measurements.
• An advantage of the resilient displaceability of at least one of the guides relative to the sheet material surrounding and bearing this guide is that, when the electronic components are clamped between the guides, limited variations in the dimensions of the electronic components can be compensated and/or, when contaminants are present between the electronic components and a guide, it is possible to prevent the electronic components or the guides being damaged.
• this functionality is realized without separate clamping means with a separate and controllable suspension construction being required for this purpose. The desired functionality is thus realized according to the present invention in an efficient and effective manner.
• the resilient Iy displaceable guide, a thinned (resilient) coupling part and the surrounding sheet material forming the holder are manufactured integrally from the flat metal sheet.
• a further advantage is that according to the present invention only a relatively small relative freedom of movement (between 0.005 and 0.05 mm) of the upper and lower guide is required. This becomes possible because the functions of guiding and clamping are assembled in a single component. Because separate components are not applied for these functions, it is not necessary to compensate for the (cumulative) tolerances of the different components. The thus obtained possibility of sufficing with a relatively small freedom of movement now once again makes possible the processing of relatively small electronic components.
• At least one of the guides is preferably provided with at least one upright edge for positioning in lateral direction relative to the direction of linear displacement.
• the upper guide and/or lower guide is thus provided with an upright, preferably linear guide edge or a number of parallel linear guide edges, with which, in addition being bounded between the upper and lower guide, the electronic components are also bounded in a lateral direction relative to the linear guides. Lateral displacement of the electronic components, together with the vertical displacement ("vertical displacement” being understood to mean the displacement perpendicularly of the guides), is prevented with one and the same component.
• a plurality of guides running parallel to each other are combined in a single flat metal sheet.
• multiple rows of electronic components can be simultaneously positioned adjacently of each other.
• smaller components such as from so-called high-density frames and the miniature products also referred to in this text
• multiple rows of electronic components are processed in parallel.
• UHP processing capacity
• the device For advancing of the electronic components it is desirable to provide the device with drive means such that the electronic components can be pushed forward or be carried/moved along between the upper guide and lower guide. This displacement is usually imparted to the products via a lead frame or carrier, but can also be realized by means of the products pushing each other forward. It is also desirable to be able to vary the distance between the holder of the upper guide and the holder of the lower guide.
• the device is desirably provided for this purpose with a closing mechanism with which this distance can be adjusted. Not only can the electronic components thus be given the necessary freedom, as desired, to be displaceable (slidable) between the upper guide and lower guide, but can also be clamped between the lower guide and the upper guide.
• the upper guide and the lower guide can also be advantageous for the upper guide and the lower guide to be movable so far apart (to open) that electronic components can be removed, for instance in the case of breakdown.
• the flat metal sheet with the resiliently displaceable guide is provided with continuous recesses adjoining the displaceable guide.
• this also provides passage for tools with which the electronic components can be processed between the guide elements.
• the electronic components can thus be clamped between the upper guide and the lower guide such that they are fixed. They can then be processed in this fixed position.
• the device is also provided with at least one tool for processing electronic components held between the guide elements. Examples of such tools are punches, bending tools and cutting tools.
• the resiliently displaceable guide can also be displaced with this tool.
• the (main) movement of the tool can for instance thus be used to also move the resiliently displaceable guide relative to the sheet material surrounding the guide. It is of course desirable here for the guide to be displaced (shortly) before the tool begins a processing.
• the tool can be provided for this purpose with a gripper which makes contact with the guide, for instance one or more resilient leading pins.
• the freedom of movement for clamping the electronic components between the guides can be reduced to for instance 0.005 - 0.05 mm. This is made possible because all reference surfaces can be incorporated in a single component and can therefore be very precisely defined relative to each other. This further contributes toward being able to handle and position very small components.
• the present invention also provides a method for positioning linearly displaceable electronic components in a processing tool between a linear lower guide and a linear upper guide, comprising the processing steps of: A) placing the electronic components between the lower guide and the upper guide such that the freedom of movement thereof is obstructed, except in the direction of linear displacement; B) moving a holder of the upper guide and a holder of the lower guide closer to each other so that the distance between the holders is smaller than during processing step A); C) clamping the electronic components between the upper guide and the lower guide as a result of processing step B); wherein the guide, which is formed together with the associated holder from a flat metal sheet, is resilient Iy displaced during processing step C) through a distance of about 0.005 mm, preferably at least 0.01 mm, in a direction perpendicularly of the flat metal sheet of which the guide forms part.
• the guide is preferably displaced here a maximum of 0.03 mm. In the processing of larger products it is also possible to opt for a displacement of a maximum of 0.05 mm.
• figure 1 shows a cross-section through a part of the device according to the present invention
• figure 2 is a perspective view of a part of the device according to the present invention
• figure 3 is a top view of a part of an alternative embodiment variant of the device according to the present invention
• figure 4A is a perspective view of a section through an upper guide with suspension such as forms part of an embodiment variant of a device according to the present invention
• figures 4B and 4C are detail views of the upper guide shown in figure 4A.
• Figure 1 shows a cross-section through a part of a device 1 according to the present invention.
• An electronic component 2 provided with leads 3 is enclosed between a lower guide 4 and an upper guide 5.
• Lower guide 4 is assembled with a carrier plate 6.
• Upper guide 5 forms part of a flat metal sheet 7 shown here with hatching.
• Electronic component 2 is linearly displaceable in a direction perpendicularly of the visible surface.
• Upper guide 5 is provided with a profiled surface comprising two upright edges 8, 9 whereby electronic component 2 is also positioned in lateral direction (relative to the direction of linear displacement).
• Weakened portions 10 are arranged in the flat metal sheet 7 such that upper guide 5 is displaceable to a limited extent (0.005 - 0.05 mm) in a direction perpendicularly of the guide surface of upper guide 5 relative to sheet material 11 of the flat metal sheet 7 surrounding upper guide 5.
• FIG 2 is a perspective view of the flat metal sheet 7 as forms part of device 1 shown in figure 1.
• sheet material 11 of the flat metal sheet 7 surrounding upper guide 5 is connected by means of a limited number of bridge pieces 12 to upper guide 5.
• the material of the flat metal sheet 7 originally enclosing bridge pieces 12 has been removed (for instance by machining and/or chemical treatment of the flat metal sheet 7).
• the coupling between the sheet material 11 of the flat metal sheet 7 surrounding upper guide 5 and the upper guide 5 is thus weakened such that, as a result of the material properties of the flat metal sheet 7, the desired resilient displaceability (of 0.005 to 0.05 mm) is obtained while an extremely precise relative orientation is nevertheless defined.
• FIG. 3 shows a top view of a part of an alternative embodiment variant of a flat metal sheet 20 for applying in a device according to the present invention.
• Flat metal sheet 20 is provided with three guide parts 21 extending parallel to each other. Three rows of electronic components 2 can thus be guided parallel to each other.
• Guide parts 21 are held rigidly in a frame 22, this frame 22 being connected with narrowed coupling strips 23 to a part 24 of flat metal sheet 20 surrounding guide parts 21. It is once again noted for the sake of clarity that all said components: guide parts 21, frame 22, narrowed coupling strips 23 and the part 24 surrounding guide parts 21, all form an integral part of flat metal sheet 20.
• Figure 4 A shows a perspective view of an upper guide 30 provided with a flat metal sheet 31 consisting of a frame 32 which is connected via coupling parts 33 to guide parts 34.
• a guide plate 35 Through displacement of a guide plate 35 the contact parts 36 exert a force such that guide parts 34 are pressed downward relative to frame 32 of metal sheet 31.
• the relative freedom of movement of guide parts 34 relative to frame 32 is made possible by the (limited) flexibility of coupling parts 33.
• Left clear between the guide parts are spaces through which cutting tools 37 can be displaced downward (for a clearer view hereof see also figures 4B and 4C).
• cutting tools 37 are embedded in a tool block 38 rigidly connected to a tool plate 39.
• FIG. 4C shows a guide part 34 in more detail, and cutting tools 37 (also referred to as punches) on either side of guide part 34 are moved downward such that they are situated in an active position.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Supply And Installment Of Electrical Components (AREA)
• Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
• Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
• Jigs For Machine Tools (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=40565119

Family Applications (1)

Country Status (5)

Citations (2)

Family Cites Families (2)

• 2008
  • 2008-10-08 NL NL2002073A patent/NL2002073C/nl not_active IP Right Cessation
• 2009
  • 2009-09-30 CN CN200980139676.6A patent/CN102172114B/zh not_active Expired - Fee Related
  • 2009-09-30 WO PCT/NL2009/050585 patent/WO2010041933A1/en active Application Filing
  • 2009-09-30 MY MYPI2011001416A patent/MY163401A/en unknown
  • 2009-10-05 TW TW098133672A patent/TWI449053B/zh not_active IP Right Cessation

Patent Citations (2)

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