201015583 六、發明說明： 【發明所屬之技術領域】 個加工處理 一個上方引 本發月係相關於用於將電子組件定位在 具之中的褒置及方法，其中所述組件可以 導件以及一個下太3丨道u 卜方引導件之間線性地位移。 【先前技術】 在電子組件& 士 $ α . 生產〇口及加工處理之中，一 加用於加工處理$ Μ 項趨勢疋ί 灰相春… 的微型化程度。這些組件通常幻 田回、賈值’使得在處理這些電子口201015583 VI. Description of the Invention: [Technical Field of the Invention] A processing process is related to a device and method for positioning an electronic component in a tool, wherein the component can be a guide and a The lower channel 3 is linearly displaced between the guides. [Prior Art] In the electronic component & 士 $ α. Production 〇 and processing, one is used to process the degree of miniaturization of $ 疋 trend 疋 灰 gray phase spring... These components are usually imaginary, and the value of ya is made to handle these electronic ports.
格的標準。在加工卢理彡^ 万面-又定了 J 隹力工處理組件的習知技術中， 一個下方引導件以月通*會使月 等件以及一個上方引導件，在這些The standard of the grid. In the conventional technique of processing Lu Li 彡 万 万 - 又 又 又 又 又 又 又 一个 一个 一个 一个 一个 一个 一个 一个 一个 一个 一个 一个 一个 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方 下方
的電子組件係可以用韭杳 E 用非常小的運動自由（例如 mm)來進行位移。. J υ· ,… 在電子組件上進行加工處理期間，電3 ，-且件因此係被夾持機構 〜 再例如像疋-個夾持塊件所卡合。 化種現有疋位方法的缺點县 七疋成本很尚，且因為電子組侔相 來越微型化，這亦音4 I h '' 越小，藉以它們也可能更容易受損。 頁變仔越來 【發明内容】 針對本發明之目的，本 ^贫明钕供了一種改良 及一種改良的方法，藉著 褙者该裝置及方法，電子組 一種與習知技術相較下為 .^ ^ 』靠方式且以降低的成本被定位 在加工處理的工具之中。 心姐： 201015583 本發明針對這項目的提供了一種用於將可以線性位移 ‘的電子組件定位在加工工具之中的裝置，其包含有：一個 線性的下方引導件，用於所述電子組件在一個路徑上的引 導支撐；以及一個線性的上方引導件，用於所述電子組件 在一個與該下方引導件㈣的一段距離處之運動自由的引 導限制，其中，至少其中一個引導件係形成了一個平坦金 屬薄板#冑分，企匕薄板設有弱化部位，使得該引導件可 以才目料包圍著該引導件的薄板材料而垂直於所述平坦金 屬薄板彈性地位移至少0侧mm，較佳地至少〇 〇1 _。 所述可以彈性位移的引導件較佳地可以相對於包圍著該^ 導件的薄板材料而彈性地位移最多〇〇5 _ 是位移最多_馳。因此在位移期間，上方以及下:= 件之間的電子組件會有一有限空隙；如此係產生產品在引 導期間發生例如傾斜的很小機會。對於非常小的（分離） 子、且件（例如所§胃的具有〇 3到Q 5 mm大小規模的尺寸 _ 的微型產品）來說也是如此。 在此處“可以彈性地位移，’應被理解為表示垂直於平 坦金屬薄板的運動自由，此係使得在定量的位移期間，在 已紅移除了實現位移的作用力之後，該引導件完全回復到 位移之則的開始情況。介於引導件之間之電子組件的運動 自由可能會受到改變介於上方引導件與下方引導件之間的 距離之影響。然而，現在根據本發明裝置的一項重要優點 ^將電子組件炎在引導件之間而受到損壞的機會很小也 能的。介於引導件之間之電子組件的位移（線性的 5 201015583 引導）因此可能會如所需要的受到阻礙或甚至受到制止， 使得所述電子組件可以被夾持在引導件之間。這對於例如 在電子、’且件上進行加工或是實施測量的目的來說，可能是 有利的。 至j/其中一個引導件相對於圍繞著且支承著此引導件 之4板材料的彈性可位移性的一項優點為：當所述電子組 件被夾在該等引導件之間時，可以補償電子組件之尺寸的 有限變化，及/或當電子組件與一個引導件之間存在污染物 守有可％防止電子組件或引導件受到損壞。除了在其中 除了已經存在的引導件之外通常會提供分開的夾持機構之 習知技術中之夕卜’這個功能可以在沒有為了 &目的所需要 之八有刀開且可控制之懸吊構造的夾持機構的情況下被實 現因此，根據本發明，所需的功能係能夠以有效率且有 放的方式實現。可以彈性地位移的引導件、一個變薄的（彈 性連結部件以及形成支架的周圍薄板材料係從該平坦金 屬薄板一體地被製造出來。 另外項優點為，根據本發明，僅需要相當小之上方 以及下方引導件的相對運動自由（介於G.005與G.G5 mm之 間）。;因為引導以及夾持的功能係被組合於單一的組件之 中’這變成是有可能的。因為對於這些功能來說是不能使 用分開的組件的’並不需要補償不同組件的（累積的）公 差。因此所獲得之具有滿足相當小的運動自由之需要的； 能性現在係再次地使m理相t小型的電子組件成為 201015583 至少其中一個引導件較佳地設有至少-個直立邊緣， 用於在相對於線性位移方向的側向方 ^ J T I疋位。卜方弓| 導件及/或下方引導件因此設有一個直立 的引導件邊緣或-些平行的線性 、x佳的疋線性 緣，除了被限制在上方以及下方引導=緣之 電子組::亦相對於線性的引導件在-個側向方向中= 制。藉者一個且相同的組件可以防止電子組 又 參 鲁 連同垂直位移（“垂直& ## 、、貝1向位移 件的位移）。$直㈣係被理解為表示垂直於引導 在另一項有利的示例性變化形式 彼此而延伸的引導件係被組合在單—的平：：行與 中。使用這個示例性變化形式，可以將多排電子组== =立成彼此相鄰。特別在加工處理較小的組件中（像是從 所提到的所謂高密度框架以及微型產品) 置在ΓΗ平行加工處理。現在藉著將複數個引導件配 有=，?=薄板之中，引導件的成本可以保持在 的障况⑨是因為本發明係使得較大的處理能力⑺ 可能的。相對於可比較的習知技術 置的處理能力因此可以增加多到5。到膽:據“明的裝 使得子組件前進，需要提供驅動機構於該裝置， 下方弓！導件之間被運載沭動 导件” 線桎架或載體而被提供到產„位移通㊉疋透過-個引 前推動的產口μ 是也可以藉著將彼此向 * °°、用來實現。也需要的是能夠改變介於上 7 201015583 方引導件的支架與下方引導件的支架之間的距離。針對這 個目的，S亥裝置係設有一個閉合機構，該距離可以藉著此 閉合機構來調整。所述電子組件不僅因此能夠如所希望地 提供所需的自由而能夠在上方引導件及下方引導件之間位 移（滑移）’而且也能夠被夾在下方引導件以及上方引導件 之間。亦有利的是，上方引導件以及下方引導件可以移動 分開得夠遠（用以開啟），使得所述電子組件能夠在例如故 障2情況中被移除。為了要防止該二個支架被—起移動得 太靠近，藉以可能會產生不需要的大作用力，其進一步需 要限制介於支架之間的最小距離。 y南 在又另一項示例性的變化形式中’該平坦金屬薄板連 同可以彈性地位移的引導件係設有鄰接可位 續凹部。除了以這種方式提供可位移引導件的所== 由之外，如此亦提供可以藉以在引導組件之間加工處理電 子組件之工具的通道M吏用所述裝置，電子組件因此可以 被夾持在上方引導件與下方引導件之間，使得它們被固定 :。它們因此可以在這個固定位置之中被加工處理。對於 、項目的’需要的是該裝置亦設有至少一個用於加工被固 ί在所述引導組件之間的電子組件的工具。如此的工具的 貫施例為衝頭、料工具以及切削1具。彳以彈性地位移 的引導件也可以與此工具一起被位移。該工具& (主要） 運動可以例如因此也被用來移動可以相對於圍繞著引導件 γ板材料而彈性地位移的引導件。此處當然也需要的 疋，在工具開始進行加工處理之前引導件係被位移（短暫 201015583 Ο 地）。針對這個目的，該工具可以設有一個與弓丨導件進行接 觸的失持器，例如一個或多個彈性引導銷。用於將電子組 件夾持在引導件之中的運動自由可以被減少到例如〇 到〇.〇5 mm。這係因為表面可以被結合在單—組件之中且因 此可以非常精確地相對於彼此而被界定而成為可能的。如 此係進一步有助於能夠操控及定位非常小型的組件。在習 头技術之中一項越來越大的問題是，在一個載體上之產品 之間所分隔開的空間是如此的小，以致於對於擠壓組件以 及電:組件所藉以而能夠被加工處理的工具來說，仍然可 以獲传的空間係極小。在本發明之中，擠壓功能以及引導 功能係被纽合在單一組件之中，藉此在空間方面產生一項 利益。本發明係使得設計出用於加工處理具有超高密度之 f體的生產機構是可能的。由於半導體工業能夠藉此來節 ‘原枓的成本，可以預期到的是在未來會加工處理更多的 这些具有超高密度的載體。載體通常銅或其中銅、紹或另 本相當高的材料形成其一部分的合金的主要部件所組 成的，其成本在近幾年來已經提高相當多。 個续ί發明亦提供—種用於在一個線性下方引導件以及-個線性上方引導件之間於加工工具之中 之電子組件的方法，1 1·、.，立移 電4 3有以下的加工步驟：Α)將所述 線性位： 引導與上方引導件之間，使得除了在 線性位移的方向之中， ， 上方引導件的一個* / 係會受到阻礙；Β)將該 接近彼此伯 支架以及該下方引導件的支架移動而更 接近彼此，使得介於所述支架之間的距離係比在加工處理 201015583 © 步驟幻期間更小；c)由於加工處理步驟B)的結果將所 述電子組件夾持在該上方引導件與該下方引導件之間；其 中與相關的支架一起從一個平坦金屬薄板形成的引導件在 加工步驟c)期間係在一個垂直於平坦金屬薄板的方向中彈 性地位移通過一個0.005 mm的距離、較佳地是至少〇〇1出爪 的距離，而該引導件形成了該平坦金屬薄板的一部分。在 此處所述引導件較佳地位移G G3麵的最大值。在加工處 理較大的產品時’亦可能GG5顏的位移最大值。總結此 方法的一些重要優點，可以參照以上描述之根據本發明裝 置的優點。亦描述於此處的是，有利的是，被彈性地夹在 引導件之間的電子組件係以一個工具被加工處理，所述工 具具有通過至少一個在該平坦金屬薄板連同可以彈性地位 移的引導件之中的凹部而可以對所述電子組件的出入口。 【實施方式】 —f 1顯示出通過根據本發明裝置i之一部分的剖面。 、個叹有引線3的電子組件2係被包圍在一個下方引導件4 2一個上方引導件5之間。下方引導件4係與一個承載 6組合在一起。上方引導件5形成了一個此處以影線 於：之平坦金屬薄7的一部分。電子組件2可以在垂直 :可看見的表面的方向中線性地位移。上方引導件5設有 ^固包含有二個直立邊緣8’ 9的輪廓表面，藉以電子組件 可以定位在側向方向（相對於線性位移的方向）之中。 弱化部位10係配置在平坦的金屬薄板7之中，使得上 10 201015583 方引導件5可以在有限範圍（〇 〇〇5至"〇5_)之内相 對於平坦金屬薄板7包圍著上方引導件5的薄板材料Η而 在-個垂直於上方引導件5之引導表面的方向中位移。The electronic components can be displaced with 非常 E with very little freedom of motion (eg mm). J υ· ,... During the processing on the electronic components, the electric 3, and the components are thus engaged by the clamping mechanism ~ again, for example, like a 夹持-clamping block. The shortcomings of the existing niche methods of the seedlings are very costly, and because the electronic groups are more and more miniaturized, the smaller the sounds, the smaller the 4 I h '', so that they may be more vulnerable. For the purpose of the present invention, the present invention provides an improved and improved method. By means of the device and method, the electronic group is compared with the prior art. .^ ^ 』 is positioned in the processing tool at a reduced cost. Sister: 201015583 The present invention provides, for this project, a device for positioning a linearly displaceable electronic component in a processing tool, comprising: a linear lower guide for the electronic component a guide support on a path; and a linear upper guide for guiding freedom of movement of the electronic component at a distance from the lower guide (4), wherein at least one of the guides is formed a flat metal sheet is provided with a weakened portion, so that the guide member can be elastically displaced at least 0 mm apart perpendicular to the flat metal sheet by enclosing the sheet material of the guide member. At least 1 _. Preferably, the resiliently displaceable guide member is resiliently displaceable by a maximum of 〇〇5 _ relative to the sheet material surrounding the guide member. Therefore, during displacement, the upper and lower:= electronic components between the pieces have a limited gap; this creates a small chance that the product will tilt, for example, during the boot. The same is true for very small (separated) sub-pieces, such as micro-products of the size _ 3 to Q 5 mm size of the stomach. Here, "elastically displaceable," should be understood to mean the freedom of movement perpendicular to the flat sheet metal, which causes the guide to be completely removed after the reddish displacement of the force to achieve displacement during the quantitative displacement. Reverting to the beginning of the displacement. The freedom of movement of the electronic components between the guides may be affected by the distance between the upper guide and the lower guide. However, now one of the devices according to the invention Important Advantages ^The chance of damage to the electronic components between the guides is small. The displacement of the electronic components between the guides (linear 5 201015583 guidance) may therefore be affected as needed Obstructing or even being restrained, such that the electronic components can be clamped between the guides. This may be advantageous for purposes such as machining, or machining, or performing measurements on the electronics, to j/. An advantage of the resilient displaceability of one of the guide members relative to the four sheets of material surrounding and supporting the guide member is when the electronic component is Between these guides, a limited variation in the size of the electronic component can be compensated for, and/or when there is a contaminant between the electronic component and a guide, the electronic component or the guide can be prevented from being damaged. In addition to the already existing guides, conventional techniques that provide a separate clamping mechanism are generally available. This function can be used in clips with eight open and controllable suspension configurations for the purpose of & In the case of a holding mechanism, therefore, according to the invention, the required function can be realized in an efficient and detachable manner. The elastically displaceable guide, a thinned (elastic coupling member and the periphery forming the bracket) The sheet material is integrally produced from the flat sheet metal. A further advantage is that, according to the invention, only relatively small upper and lower guides are free to move relative to each other (between G.005 and G.G5 mm). Because the functions of guiding and clamping are combined into a single component' this becomes possible because it is not for these functions. The use of separate components does not require compensation for the (cumulative) tolerances of the different components. Therefore, the obtained ones have the need to satisfy a relatively small amount of freedom of motion; the energy is now again to make m-phase small electronic components 201015583 at least one of the guide members is preferably provided with at least one upright edge for laterally squared relative to the direction of linear displacement. The guide bow and/or the lower guide are thus provided with a Upright guide edges or - parallel linear, x good linear edges, except for the upper and lower guides = edge electronics: also relative to linear guides in a lateral direction = system One and the same component can prevent the electronic group from being associated with the vertical displacement ("vertical &##,, displacement of the 1-way displacement member". $ straight (four) is understood to mean perpendicular to the guidance in another The advantageous exemplary variants of the guides that extend from each other are combined in a single-: flat row. Using this exemplary variation, multiple rows of electrons === can be placed adjacent to each other. Especially in the processing of smaller components (like the so-called high-density frames and micro-products mentioned) placed in parallel processing. Now by incorporating a plurality of guides with =, ? = thin plates, the cost of the guides can be kept at a level 9 because the present invention makes it possible to have a larger processing capacity (7). The processing power relative to comparable prior art techniques can therefore be increased by as much as five. To the gallbladder: According to the "small installation makes the sub-assembly advance, it is necessary to provide the drive mechanism in the device, the lower bow! The guide is carried between the guides", the wire truss or the carrier is provided to the production of the displacement The production port μ that is pushed through the front guide can also be realized by moving each other toward *°°. It is also necessary to be able to change between the bracket of the upper 7 201015583 square guide and the bracket of the lower guide. For this purpose, the S-Hig device is provided with a closing mechanism by which the distance can be adjusted. The electronic component can not only provide the required freedom as desired, but also the upper guide and The displacement (slip) between the lower guides can also be sandwiched between the lower guide and the upper guide. It is also advantageous that the upper guide and the lower guide can be moved apart far enough (to open) In order to enable the electronic component to be removed in the case of, for example, fault 2. In order to prevent the two brackets from being moved too close together, an undesirably large force may be generated. It is further desirable to limit the minimum distance between the brackets. y South In yet another exemplary variation, the flat metal sheet, together with the elastically displaceable guide, is provided with an abutment positionable recess. In addition to providing the == of the displaceable guide in this manner, there is also provided a passage M by means of a tool for processing the electronic component between the guide assemblies, the electronic assembly being able to be clamped thereby Between the upper guide and the lower guide, they are fixed: they can therefore be processed in this fixed position. For the project, it is required that the device is also provided with at least one for machining. A tool for the electronic component between the guiding components. The embodiment of such a tool is a punch, a material tool, and a cutting tool. The elastically displaced guiding member can also be displaced together with the tool. & (primary) movement can, for example, also be used to move a guide that can be elastically displaced relative to the material surrounding the guide gamma plate. If necessary, the guide is displaced (short-term 201015583 Ο ground) before the tool begins processing. For this purpose, the tool can be provided with a missing device, such as one or more, that is in contact with the bow guide. Elastic guide pin. The freedom of movement for clamping the electronic component in the guide can be reduced to, for example, 〇.〇5 mm. This is because the surface can be combined in a single-component and therefore can be very precise It is possible to define the ground relative to each other. This is further helpful in the ability to manipulate and position very small components. One of the growing problems in the technology is the product on a carrier. The space that is separated from each other is so small that the space that can be transmitted is extremely small for the components that can be processed by the extrusion assembly and the electrical components. In the present invention, the squeeze The press function and the boot function are tied together in a single component, thereby creating an advantage in terms of space. The present invention makes it possible to design a production mechanism for processing an ultra-high density f body. Since the semiconductor industry can use this to save the cost of the original, it is expected that more of these ultra-high density carriers will be processed in the future. The carrier usually consists of copper or a major component of an alloy in which copper, or a relatively high material forms part of it, and its cost has increased considerably in recent years. The invention also provides a method for electronic components in a processing tool between a linear lower guide and a linear upper guide, 1 1 , ., and the vertical shift 4 3 has the following Processing step: Α) the linear position: between the guiding and the upper guiding member, so that in addition to the direction of the linear displacement, a * / system of the upper guiding member is hindered; Β) the proximity to each other And the brackets of the lower guide move closer to each other such that the distance between the brackets is smaller than during the processing process 201015583 © step illusion; c) the electrons are due to the result of processing step B) An assembly is sandwiched between the upper guide and the lower guide; wherein the guide formed from a flat sheet of metal together with the associated bracket is resiliently oriented in a direction perpendicular to the flat sheet of metal during processing step c) The distance is moved through a distance of 0.005 mm, preferably at least 1 out of the jaws, and the guide forms part of the flat sheet metal. The guide member here preferably shifts the maximum value of the G G3 plane. It is also possible to maximize the displacement of the GG5 when processing larger products. Summarizing some of the important advantages of this method, reference may be made to the advantages of the device according to the invention described above. It is also described herein that it is advantageous for the electronic components that are elastically sandwiched between the guides to be processed by a tool having at least one of the flat metal sheets that are elastically displaceable therewith. A recess in the guide can be used to access the electronic component. [Embodiment] - f 1 shows a section through a part of the device i according to the invention. The electronic component 2 with the lead 3 is surrounded by a lower guide 4 and an upper guide 5. The lower guide 4 is combined with a carrier 6. The upper guide 5 forms a part of the flat metal thin 7 which is hereby hatched. The electronic component 2 can be linearly displaced in the direction of the vertical: visible surface. The upper guide 5 is provided with a contoured surface comprising two upstanding edges 8'9 whereby the electronic components can be positioned in the lateral direction (relative to the direction of linear displacement). The weakened portion 10 is disposed in the flat metal sheet 7, so that the upper 10 201015583 square guide 5 can surround the upper guide with respect to the flat metal sheet 7 within a limited range (〇〇〇5 to "〇5_) The sheet material of 5 is displaced in a direction perpendicular to the guiding surface of the upper guide 5.
圖2為平;t一金屬薄板7的立體視圖，該平坦金屬薄板7 形成了圖i所示裝置1的一部分。可以清楚看見的是，平 坦金屬薄板7包圍著上方引導件5的薄板材料…系藉著有 限數目的橋接件12的作用被連接到上方引導件5。平坦金 屬薄板7原來圍住橋接件12的材料已經被移除（例如藉著 機械加工及/或化學處理平坦金屬薄板7)。介於平坦金屬薄 板7包圍著上方引導件5的薄板材料u與上方引導件$之 間的連結係因此被弱化，使得由於平坦金屬薄才反7的材料 性質，而能夠獲得所需的彈性可位移能力（〇〇〇5到 麵），然而在同時可以界定出極為精確的相對方位。另一項 觀點是橋接件12留下了在平坦金屬薄板7之中的明晰穿孔 13，藉以工具可以獲得對於電子組件2的取用，例如用於 彎折或切削電子組件2。 、 圖3說明了用於運用在根據本發明裝置之中之平坦金 屬薄板20的選擇性實例變化形式之一部分的俯視圖。平坦 金屬薄板20設有三個平行於彼此延伸的引導部件21。三排 電子組件2因此可以平行於彼此而被引導。引導部件21係 被剛性地固持在一個框架22之中，這個框架22係藉著狹 窄的連結帶23而被連接到平坦金屬薄板2〇圍繞著弓丨導部 件21的一個部件24。可以再次注意到的是，為了清楚起見， 所有的前述組件：引導部件21、框架22、狹窄的連結帶Μ 11 201015583 以及圍繞著引導部件21的部件24全部係形成了平 薄板2 0的一個一體部分。 -金屬 圖4A顯不出上方引導件3G的立體視圖，該上方 件3〇設有一個由—個樞架32所構成的平坦金屬薄板31 該框架32係透過連結部件Μ而被連接到引導部件34 = =個引導件板件35的位移，接觸部件％係施加了—個 力’使付引導部件34可以相對於金屬薄板的樞架 3“被向下壓。引導部件34相對於框架32的相對運動： 由係藉者連結部件33的（受限制的）可撓曲 者。在引導部件之間係留下了暢通的空間，切削工具 以通過所述空間而被向下位移（為了清楚地看，，亦參： 圖:B以及圖4C)。亦如圖-所示，切削工具37係埋置； -個剛硬地連接到-個工具板件39的工具塊件巧之中。、 現在籍者在垂直方向中位移引導件板# 35以及 ❹ 39,用於被加工處理的電子組件（並未顯示在此圖：中) :以先連同其中一個引導部件34被夹住，且後績地藉著其 工具37而被加工處理。在加工處理之中，切削 工^37以及引導部件34係再次被向上移動，使得已經加 =處理過的電子組件可以被排出14c更加詳細地顯示出 -個引㈣件34,且在引導部件34任—側上的切削工具 3 7 (亦被稱為衝頭）将姑& q貝」係被向下移動，使得它們可以坐落在 活動位置之中。 明 說 單 簡 式 圖 12 201015583 本發明將在以下圖式所顯示 的基礎上進一步闡明。其中： '"制性的示例性實例 圖1顯示出通過根據本發明裝 圖2是根據本發明裝置之-部分的立二分的剖面； 圖3係根據本發明裝 ：：圖； 部分的俯視圖； 擇〖生實例之變化形式之- 段係通過一個像是 式之一部分的具有 方引導件的詳細視 ,圖4A係一個區段的立體視圖，該區 形成根據本發明裝置—項實例之變化形 ❿懸吊裝置之上方引導件；以及 圖4B以及圖4c為圖4A所示之上 圖。 【主要元件符號說明】 ❷ 13Figure 2 is a perspective view of a flat sheet of metal sheet 7 forming a portion of the apparatus 1 of Figure i. It can be clearly seen that the flat sheet material of the flat metal sheet 7 surrounding the upper guide member 5 is connected to the upper guide member 5 by the action of a limited number of bridge members 12. The material of the flat metal sheet 7 originally surrounding the bridge member 12 has been removed (e.g., by machining and/or chemically treating the flat metal sheet 7). The connection between the sheet material u and the upper guide member $ between the flat metal sheet 7 and the upper guide member 5 is thus weakened, so that the desired elasticity can be obtained due to the material properties of the flat metal sheet. Displacement ability (〇〇〇5 to face), however at the same time can define extremely precise relative orientation. Another point of view is that the bridge 12 leaves a clear perforation in the flat metal sheet 7, whereby the tool can be used for accessing the electronic component 2, for example for bending or cutting the electronic component 2. Figure 3 illustrates a top view of a portion of a selective example variation of a flat metal sheet 20 for use in a device in accordance with the present invention. The flat metal sheet 20 is provided with three guide members 21 extending parallel to each other. The three rows of electronic components 2 can thus be guided parallel to each other. The guiding member 21 is rigidly held in a frame 22 which is connected to a flat metal sheet 2 around a member 24 of the bow guide member 21 by a narrow connecting belt 23. It can be noted again that, for the sake of clarity, all of the aforementioned components: the guiding member 21, the frame 22, the narrow connecting band Μ 11 201015583 and the member 24 surrounding the guiding member 21 all form one of the flat sheets 20 . One part. - Metal Figure 4A shows a perspective view of the upper guide 3G, which is provided with a flat metal sheet 31 consisting of a pivot 32. The frame 32 is connected to the guide member via a coupling member 34 = = displacement of the guide plate member 35, the contact member % is applied with a force 'to make the guide member 34 can be pressed downward relative to the pivot 3 of the sheet metal. The guide member 34 is opposite to the frame 32 Relative motion: The (restricted) deflector of the attachment member 33 is attached by the tie. A clear space is left between the guide members, and the cutting tool is displaced downward through the space (for clarity) , and also refers to: Figure B and Figure 4C). As shown in the figure - the cutting tool 37 is embedded; - a tool block that is rigidly connected to the tool plate member 39. The user shifts the guide plates #35 and ❹ 39 in the vertical direction for the electronic components to be processed (not shown in this figure:): first with one of the guiding members 34, and then The ground is processed by its tool 37. The cutters 37 and the guide members 34 are again moved upward, so that the electronic components that have been added and processed can be displayed in more detail by the discharge 14c, and the cuttings on the side of the guide member 34 are performed. Tool 3 7 (also known as a punch) moves the & & q 」 down so that they can be placed in the active position. Brief Description Single Figure 12 201015583 The present invention will be further clarified on the basis of the following figures. Wherein: '" Illustrative Example of Manufacture Figure 1 shows a cross-sectional view of a part of a device according to the invention according to the invention; Figure 3 is a plan view of a part according to the invention; </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The upper guide of the sling suspension device; and Figs. 4B and 4c are the top view shown in Fig. 4A. [Main component symbol description] ❷ 13