WO2010029637A1 - Probe pin contact checking apparatus and liquid crystal substrate inspection apparatus - Google Patents

Probe pin contact checking apparatus and liquid crystal substrate inspection apparatus Download PDF

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Publication number
WO2010029637A1
WO2010029637A1 PCT/JP2008/066562 JP2008066562W WO2010029637A1 WO 2010029637 A1 WO2010029637 A1 WO 2010029637A1 JP 2008066562 W JP2008066562 W JP 2008066562W WO 2010029637 A1 WO2010029637 A1 WO 2010029637A1
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WO
WIPO (PCT)
Prior art keywords
probe pin
liquid crystal
glass substrate
crystal substrate
light source
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Application number
PCT/JP2008/066562
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French (fr)
Japanese (ja)
Inventor
岳 田中
Original Assignee
株式会社島津製作所
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Application filed by 株式会社島津製作所 filed Critical 株式会社島津製作所
Priority to PCT/JP2008/066562 priority Critical patent/WO2010029637A1/en
Publication of WO2010029637A1 publication Critical patent/WO2010029637A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

Definitions

  • the present invention relates to a probe pin contact confirmation device that confirms the position of a probe pin that contacts an electrode provided on a glass substrate such as a liquid crystal substrate, and a liquid crystal substrate inspection device that includes the probe pin contact confirmation device.
  • a liquid crystal substrate or a thin film transistor array substrate includes a TFT array in which thin film transistors (TFTs) constituting a liquid crystal panel are arranged in a matrix on a glass substrate or the like, and electrodes for supplying drive signals to the thin film transistors
  • the thin film transistor is driven by a signal supplied from a scanning signal electrode and a video signal electrode.
  • a substrate inspection device such as a TFT array inspection device or a liquid crystal substrate inspection device is known.
  • the substrate inspection apparatus includes an inspection prober and an inspection circuit that are electrically connected to electrodes for scanning signals and electrodes for video signals.
  • the prober frame of the prober When inspecting the liquid crystal substrate, the prober frame of the prober is stacked from above the liquid crystal substrate, and the probe pin provided on the prober frame is brought into contact with the electrode of the liquid crystal substrate. There is an electrical connection between the two.
  • the inspection circuit detects a current flowing by applying a voltage from a prober or a voltage state, and checks a short circuit between the gate and the source, a point defect, a disconnection, and the like.
  • Substrate inspection requires that inspection signals and control signals be reliably applied to the electrodes on the substrate.
  • inspection signals and control signals be reliably applied to the electrodes on the substrate.
  • the positional accuracy of the probe pin mounted on the prober frame is guaranteed by the processing accuracy of the prober frame.
  • it has become difficult to guarantee the positional accuracy of the probe pins only with the processing accuracy.
  • the position confirmation of the probe pin by the position confirmation pad is performed by irradiating light from the back surface of the glass substrate, observing the probe pin trace by the transmitted light transmitted through the glass substrate and the electrode, and the probe pin and the electrode provided on the glass substrate. This is done by checking whether there is any misalignment between them.
  • the glass substrate may be damaged if the vicinity of the center of the glass substrate is lifted. Also, when the vicinity of the glass substrate is lifted and light is irradiated from the gap formed at the outer peripheral edge of the glass substrate, the glass substrate may be damaged, as in the case of lifting the vicinity of the center. There is a problem that sufficient light does not reach the vicinity and it is difficult to sufficiently check the probe pin mark.
  • FIG. 9 is a diagram for explaining an aspect of observing the probe pin mark on the conventional glass substrate.
  • a panel portion 11 such as a liquid crystal panel and an electrode 12 (not shown) are formed on a glass substrate 10, and a position confirmation sealing material 23 is affixed on the electrode.
  • the probe pin mark (not shown) is formed by bringing the probe pin into contact with the seal material 23 for position confirmation. In order to irradiate light from the back surface of the glass substrate 10, one end of the outer periphery of the glass substrate 10 is lifted, and light from the light source 30 is irradiated from the gap.
  • an object of the present invention is to solve the above-mentioned conventional problems, and to make it possible to confirm the contact position of the probe pin without damaging the liquid crystal substrate even if it is a large glass substrate. It is another object of the present invention to make it possible to confirm the contact position of the probe pin near the center of the large glass substrate.
  • the present invention includes a probe pin contact confirmation device and a probe pin contact confirmation device for confirming a contact position between a probe pin and an electrode of a glass substrate by confirming a trace due to contact of the probe pin formed on the glass substrate. It is a liquid crystal substrate inspection apparatus.
  • the probe pin contact confirmation device provided in the present invention is capable of irradiating light even on a large glass substrate by providing a light source that can be moved below the glass substrate, particularly near the center of the glass substrate. However, it is possible to irradiate light and to confirm the probe pin trace by transmitted light.
  • the probe pin contact confirmation device of the present invention includes a support part that supports the entire surface of the glass substrate from below, a light source that irradiates the lower surface of the glass substrate supported by the support part from below the glass substrate, and a lower part of the glass substrate.
  • the light source driving mechanism moves the light source horizontally with respect to the glass substrate, and positions the irradiation position where the light source irradiates the glass substrate.
  • the light emitted from the light source irradiates the glass substrate from the lower surface and passes through the glass substrate and the electrode provided on the glass substrate.
  • the captured image can be detected by an imaging device such as a CCD camera.
  • each transmitted light of the transmitted light transmitted only through the glass substrate, the transmitted light transmitted through the electrode provided on the glass substrate, and the transmitted light transmitted through the probe pin mark formed by contacting the probe pin is Since there is a difference in the amount of light, it can be distinguished by a difference in brightness by visual observation or a difference in signal intensity of a captured image of the imaging device.
  • the probe pin contact confirmation device confirms probe pin marks formed by contact of the probe pins on the glass substrate with transmitted light transmitted through the glass substrate, and the probe pins and electrodes provided on the glass substrate by the probe pin marks. Check the contact position. Confirmation of the probe pin mark by the transmitted light can be performed visually or by the signal intensity of the captured image of the imaging device.
  • the probe pin mark is formed by attaching a seal material for position confirmation on at least an electrode provided on the glass substrate and bringing the probe pin into contact with the seal material for position confirmation.
  • the probe pin position and the electrode position are aligned, the probe pin comes into contact with the electrode of the glass substrate when the prober is mounted on the glass substrate.
  • the probe pin position and the electrode position is poor, the probe pin cannot contact the electrode of the glass substrate when the prober is mounted on the glass substrate.
  • the probe pin is positioned with the position confirmation seal material when the probe pin position and the electrode position are well aligned. If there is a trace on the seal material for position confirmation and the alignment between the probe pin position and the electrode position is poor, the probe pin does not come into contact with the seal material for position confirmation. There is no trace left. Accordingly, by confirming the probe pin mark left on the position confirmation sealing material, it is possible to confirm whether the probe pin position and the electrode position are aligned properly.
  • a seal material for position confirmation can be attached to the electrode and the area including the periphery of the electrode.
  • the position confirmation sealing material having an area larger than the area of the electrode is used, the position of the electrode and the probe pin mark around the electrode can be confirmed.
  • the probe pin comes into contact with the position confirmation seal material, leaving a trace at the position where it overlaps the electrode of the position confirmation seal material,
  • the probe pin leaves a mark at a position where it does not overlap the electrode of the position confirmation sealing material.
  • the amount of displacement is large and the probe pin does not contact the position confirmation seal material, no trace remains on the position confirmation seal material.
  • the light source provided in the present invention can be a surface light source that irradiates at least a part of the surface of the glass substrate.
  • the surface light source As the light source, it is possible to widen the range of electrodes to be irradiated at the position positioned by the light source driving mechanism.
  • the probe pin contact confirmation device includes an imaging device that images the transmitted light and an imaging device drive mechanism that moves the imaging device in the horizontal direction.
  • This imaging device is arranged on the optical axis passing through the light source and the glass substrate, and continuously moves or intermittently moves the light source driving mechanism and the imaging device driving mechanism in synchronization. With this configuration, it is possible to irradiate the electrode provided on the large glass substrate with light from the light source and to capture the transmitted light with the imaging device.
  • the imaging device has an imaging magnification for imaging a plurality of probe pin traces in one captured image.
  • a plurality of probe pin traces can be confirmed using a captured image obtained by one imaging, and the processing time required for confirmation can be shortened.
  • the present invention can be a liquid crystal substrate inspection device provided with a probe pin contact confirmation device.
  • a liquid crystal substrate inspection apparatus is a liquid crystal substrate inspection device having a prober for liquid crystal substrate inspection that applies an inspection signal to the liquid crystal substrate by bringing a probe pin into contact with an electrode of the liquid crystal substrate, and an inspection equipped with a prober for liquid crystal substrate inspection
  • a load lock chamber for carrying in and out of the liquid crystal substrate between the chamber and the inspection chamber.
  • the liquid crystal substrate inspection apparatus of the present invention can be configured such that the probe pin contact confirmation device is provided in the load lock chamber and the probe pin contact confirmation device is provided outside the chamber of the liquid crystal substrate inspection device.
  • the probe pin contact confirmation device is provided in the load lock chamber.
  • the probe pin contact confirmation device is provided in the load lock chamber.
  • the probe pin is brought into contact with the liquid crystal substrate to form a probe pin mark
  • the liquid crystal substrate is carried from the inspection room into the load lock chamber, and the probe pin mark is confirmed by a contact confirmation device provided in the load lock chamber.
  • the probe pin contact confirmation device is provided outside the chamber of the liquid crystal substrate inspection device.
  • the probe pin is brought into contact with the liquid crystal substrate in the inspection room to form a probe pin mark, and the liquid crystal substrate is passed from the inspection chamber through the load lock chamber.
  • the probe pin contact confirmation device confirms the probe pin mark of the conveyed liquid crystal substrate outside the chamber of the liquid crystal substrate inspection device.
  • the liquid crystal substrate inspection apparatus of the present invention confirms the alignment between the position of the probe pin and the position of the electrode by the probe pin contact confirmation device, and if the alignment is confirmed to be defective, it is attached to the prober. Adjust the position of the probe pin. After the position adjustment of the probe pin is completed, the position is confirmed again by the probe pin contact confirmation device to confirm that the position adjustment has been successfully performed. If necessary, position adjustment and position confirmation are repeated until a good positional relationship is obtained.
  • the position of the probe pin and the position of the electrode by this probe pin contact confirmation device can be confirmed before the inspection of the glass substrate by the prober. After the confirmation or position adjustment is completed, the glass substrate by the prober is used. It is not necessary when performing inspection. Therefore, the liquid crystal substrate inspection apparatus in which the probe pin contact confirmation device is installed in the load lock chamber carries in and out the liquid crystal substrate without confirming the contact position by the probe pin contact confirmation device when inspecting the liquid crystal substrate by the prober.
  • the contact position of the probe pin can be confirmed without damaging the liquid crystal substrate even if it is a large glass substrate.
  • the contact position of the probe pin can be confirmed near the center of the large glass substrate.
  • SYMBOLS 1 Liquid crystal substrate inspection apparatus, 2 ... Inspection room, 3 ... Load lock chamber, 4 ... Probe pin contact confirmation apparatus, 10 ... Glass substrate, 11 ... Panel part, 12, 12a-12e ... Electrode, 13 ... Liquid crystal substrate, 20 ... prober, 21 ... prober frame, 22, 22a to 22e ... probe pin, 23 ... position confirmation seal material, 30 ... light source, 41 ... light source, 42 ... light source drive mechanism, 43 ... imaging device, 44 ... imaging device drive mechanism , 45: Supporting part, 100, 100a to 100e ... Trace of probe pin.
  • the probe pin contact confirmation device of the present invention can be applied to a liquid crystal substrate inspection device.
  • the liquid crystal substrate inspection apparatus includes, for example, an inspection chamber for inspecting an introduced liquid crystal substrate and a load lock chamber for carrying the liquid crystal substrate into and out of the inspection chamber.
  • the inspection room includes, for example, a charged particle source that irradiates a charged particle beam to a liquid crystal substrate to be inspected, a detector that detects secondary electrons emitted from the liquid crystal substrate by irradiation of the charged particles, and a liquid crystal substrate to be inspected.
  • a charged particle source that irradiates a charged particle beam to a liquid crystal substrate to be inspected
  • a detector that detects secondary electrons emitted from the liquid crystal substrate by irradiation of the charged particles
  • a liquid crystal substrate to be inspected Each part such as a stage for supporting and two-dimensionally scanning is provided, and substrate inspection is performed based on a scanning image obtained by a detector.
  • the liquid crystal substrate has, for example, a TFT array formed on a glass substrate.
  • the layout, electrodes, wiring patterns, etc. of the TFT array formed on the liquid crystal substrate are variously set according to the size and specifications of the liquid crystal panel.
  • Thin film transistors are formed in a matrix on the TFT array on the liquid crystal substrate, and signal electrodes (for example, scanning signal electrodes and video signal electrodes) for driving the thin film transistors are formed.
  • an electrode for electrically connecting to the outside of the liquid crystal substrate is formed outside the array of the liquid crystal substrate.
  • the liquid crystal substrate inspection device includes a prober that supplies an inspection signal to the liquid crystal substrate.
  • the prober includes a prober frame provided with probe pins that are electrically connected to the electrodes of the liquid crystal substrate and supply inspection signals.
  • the probe pins are electrically connected to the electrodes of the liquid crystal substrate to supply inspection signals to the liquid crystal substrate.
  • a prober frame is placed on the liquid crystal substrate placed on the stage. Between the liquid crystal substrate and the prober frame, the electrode and the probe pin come into contact to make an electrical connection, and an inspection signal is supplied to the TFT array through the connection between the probe pin and the electrode.
  • the connection between the prober frame and the stage is made by a connector provided on the prober frame and the stage side.
  • FIG. 1 is a diagram for explaining probe pins and electrodes provided on a glass substrate
  • FIG. 2 is a diagram for explaining probe pin marks.
  • a part of the plurality of electrodes 12 included in the glass substrate and a part of the plurality of probe pins 22 provided on the prober frame constituting the prober are shown.
  • FIG. 1 (a) shows a state in which a position confirmation sealing material 23 is laminated and attached to the upper surface of a portion 12a to 12e (indicated by a broken line in the drawing) of the electrode 12 provided on the glass substrate.
  • the seal material 23 for position confirmation is a seal material for leaving a probe pin mark for confirming a position where the probe pin 22 is in contact with the glass substrate when the probe pin 22 is in contact with the glass substrate.
  • the surface of the glass substrate can be affixed.
  • the seal material may be any material as long as it is plastically deformed by the pressure of contact with the probe pin and transmits light.
  • the position confirmation sealing material 23 is pushed by the tip of the probe pin 22 and is plastically deformed.
  • the probe pin mark remains on the position check seal material 23 at the position where the probe pin 22 contacts, and the position of the probe pin 22 and the position of the electrode 12 from the trace position of the probe pin mark. Can be confirmed.
  • the position confirmation sealing material 23 is attached so as to cover at least the electrode 12.
  • the electrodes 12a to 12e are pasted so as to cover a range including the periphery of these electrodes.
  • the range covered by the position confirmation sealing material 23 can be determined based on, for example, a range in which the position where the probe pin 22 contacts the glass substrate varies. As described above, when the position confirmation sealing material 23 is pasted so as to cover the range including the periphery of the electrode 12, when there is no displacement in the installation position of the probe pin 22, the probe pin of the probe pin Since the trace remains at the position on the electrode of the position confirmation sealing material 23, it can be confirmed that the position of the probe pin 22 is aligned with the position of the electrode 12.
  • the probe pin mark remains on the glass substrate because the probe pin mark remains at a position deviated from the electrode 12 of the seal material 23 for position confirmation. It can be confirmed that the contact is made at a position displaced from the electrode 12.
  • FIG. 1 (b) shows a state in which the probe pin 22 is in contact with the glass substrate
  • FIG. 1 (c) shows a state in which the probe pin 22 is released after the probe pin 22 is in contact with the glass substrate.
  • FIG. 1C shows probe pin marks 100a to 100e formed by the probe pins 22a to 22e.
  • FIG. 2 (a) shows the probe pin mark.
  • the probe pin marks 100a, 100d, and 100e are on the electrodes 12a, 12d, and 12e
  • the probe pin mark 100b is at a position away from the electrode 12b
  • a part of the probe pin mark 100c is It shows that it exists on the electrode 12c and the remaining part exists in the position remove
  • the position confirmation sealing material 23 may be attached so as to cover only the electrode 12. As described above, when the position confirmation sealing material 23 is pasted so as to cover only the electrode 12, the probe pin mark of the probe pin is recorded when there is no displacement in the installation position of the probe pin 22. Since it remains in the position confirmation sealing material 23, the contact position of the probe pin 22 on the glass substrate can be confirmed. In addition, if the position of the probe pin 22 is displaced, the probe pin mark of the probe pin does not remain on the seal material 23 for position confirmation, so the probe pin 22 contacts the position displaced from the electrode 12. Alternatively, it can be estimated that the probe pin 22 is not in contact with the electrode 12.
  • the probe pin 22 When the probe pin 22 is brought into contact with the glass substrate, when the position of the probe pin 22 is aligned with the position of the electrode 12, the probe pin 22 presses the seal material 23 for position confirmation, and the probe pin 22 A recess is formed at the contact position, leaving a probe pin mark. On the other hand, when the position of the probe pin 22 is not aligned with the position of the electrode 12, the probe pin 22 does not press the position confirmation seal material 23, so that the probe pin mark remains at the position where the probe pin 22 contacts. Absent.
  • FIG. 2 (b) shows probe pin marks 100a to 100e formed by the probe pins 22a to 22e.
  • the probe pin marks 100a, 100d, and 100e are on the electrodes 12a, 12d, and 12e, and the probe pin mark 100b is positioned away from the electrode 12b.
  • a part of the probe pin mark 100c is on the electrode 12c, and the remaining part is located away from the electrode 12c.
  • the probe pin mark 100b is not observed because it does not remain on the seal material 23 for position confirmation. Further, only a part of the probe pin mark 100c remains on the position confirmation sealing material 23, and only this part can be observed.
  • the probe pin 22 is based on the positional relationship between the probe pin mark remaining on the position confirmation sealing material 23 and each electrode. It can be confirmed whether or not the position of is shifted from the position of the electrode 12.
  • the probe pin contact confirmation device confirms the position of the probe pin mark remaining on the position confirmation sealing material by irradiating light from the back surface of the glass substrate and transmitting the transmitted light.
  • the glass substrate, the electrode, and the position confirmation sealing material transmit light.
  • the amount of light transmitted through the electrode is different from the amount of light transmitted through the position confirmation sealing material, and the amount of transmitted light also differs depending on the presence or absence of probe pin marks on the position confirmation sealing material.
  • FIG. 3 is a diagram for explaining a configuration example of the probe pin contact confirmation device 4 of the present invention.
  • the probe pin contact confirmation device 4 of the present invention includes a support unit 45 that supports the entire surface of the glass substrate 10 from below, and a light source 41 that irradiates the lower surface of the glass substrate 10 supported by the support unit 45 from below the glass substrate 10. And a light source driving mechanism 42 that moves the light source 41 in the horizontal direction at a position below the glass substrate 10.
  • the light source 41 can be a surface light source.
  • the support portions 45 are arranged at intervals such that the glass substrate 10 itself is not damaged by the self-weight deflection of the glass substrate 10 and supports the glass substrate 10 from below. By the support by the support portion 45, a space where the light source 41 can be moved is formed below the glass substrate 10. Moreover, the support part 45 can carry in / out the glass substrate 10 between conveyance mechanisms by providing the lift mechanism which can be raised / lowered freely.
  • the image capturing device 43 and the image capturing device 43 that capture the transmitted light are placed horizontally.
  • An imaging device drive mechanism 44 that moves in the direction is provided.
  • the contact position between the probe pin and the electrode may be confirmed visually without using an imaging device.
  • the transmitted light that has passed through the glass substrate 10, the electrode 12, and the position confirmation sealing material 23 is visually observed. Do by observing with.
  • the imaging device 43 is disposed on the optical axis passing through the light source 41 and the glass substrate 10 and drives the light source driving mechanism 42 and the imaging device driving mechanism 44 in synchronization.
  • the light source drive mechanism 42 moves the light source 41 in the horizontal direction with respect to the glass substrate 10, and positions the irradiation position where the light source 41 irradiates the glass substrate.
  • the light source 41 irradiates the glass substrate 10 from the lower surface (back surface).
  • the transmitted light that has passed through the glass substrate is imaged by the imaging device 43 disposed above. In the captured image, the electrode 12, the seal material 23 for position confirmation, and the probe pin mark 100 are projected.
  • the light source 41 and the imaging device 43 may be moved continuously or intermittently.
  • This synchronous driving is performed by controlling the light source driving mechanism 42 and the imaging device driving mechanism 44 by a control means (not shown).
  • Arbitrary drive mechanisms can be used for the light source drive mechanism 42 and the imaging device drive mechanism 44.
  • a rail may be provided in parallel with the glass substrate 10, a moving mechanism that moves along the rail is provided, and a light source and an imaging device may be installed by the moving mechanism.
  • the position of the light source 41 and the position of the imaging device 43 are moved stepwise by a predetermined distance while maintaining the positions facing each other, and each stop position is Take an image with.
  • the imaging device 43 can confirm the position of a plurality of probe pins in one captured image by capturing the plurality of electrodes 12 and the probe pin trace 100 in one captured image, thereby improving the confirmation efficiency. Can be increased. Note that the number of electrodes and probe pin marks to be captured in the captured image can be set by adjusting an optical system such as an imaging magnification of the imaging apparatus.
  • only the light source 41 may be moved intermittently, and the imaging device 43 may be moved continuously.
  • a surface light source is used as the light source 41, light is emitted from the light source 41 over a wide range, so that even when the imaging device 43 moves with the light source 41 stopped, the light passes through the glass substrate. The transmitted light can be imaged. Therefore, if it is within the range irradiated by the surface light source, it is possible to perform imaging by moving only the imaging device 43 while the light source 41 is stopped.
  • FIG. 4 is a flowchart for explaining an operation example of the probe pin contact confirmation device
  • FIGS. 5 and 6 are operation diagrams for explaining an operation example of the probe pin contact confirmation device.
  • FIG. 5A shows a state of the glass substrate 10 before the position check sealing material 23 is attached
  • FIG. 5B shows the position check seal material 23 attached onto the electrode 12 of the glass substrate 10.
  • the state is shown
  • FIG. 5C shows a state in which the position confirmation sealing material 23 is pasted on the electrode 12 of the glass substrate 10 (S1).
  • the prober frame After placing the glass substrate 10 with the position confirmation sealing material 23 attached below the prober frame (S2), the prober frame is lowered and the probe pins 22 are brought into contact with the glass substrate 10 (S3). After the probe pin 22 is brought into contact with the glass substrate 10 to form a probe pin mark on the position confirmation sealing material 23, the prober frame is raised to separate the probe pin 22 from the glass substrate 10 (S4).
  • Steps S1 to S4 are performed in a place where a prober frame such as an examination room is installed, and the glass substrate 10 on which the probe pin mark is formed on the position confirmation sealing material 23 is moved to the contact confirmation device.
  • Install in. FIG. 6A shows a state where the glass substrate 10 on which the position confirmation sealing material 23 is attached is installed on the support portion 45.
  • the light emitted from the light source 41 passes through the glass substrate 10 and is captured by the imaging device 43 (S5).
  • the light source 41 and the imaging device 43 are moved (S6), and a captured image is acquired by the imaging device 43.
  • 6B and 6C show a state in which a captured image is acquired by the imaging device 43 while moving the light source 41 and the imaging device 43 (S7).
  • the contact position between the probe pin 22 and the electrode 12 is confirmed based on the probe pin mark 100 using the acquired captured image (S8).
  • the installation position of the probe pin provided in the prober frame is good. As a result, the substrate is inspected using this prober.
  • FIG. 7 shows an example in which contact confirmation between a probe pin and an electrode is performed by a probe pin contact confirmation device provided in a load lock chamber.
  • the liquid crystal substrate inspection apparatus 1 includes an inspection chamber 2 having a prober 20 for inspecting a liquid crystal substrate, and a load lock chamber 3 for carrying the liquid crystal substrate 13 in and out of the inspection chamber 2.
  • the prober 20 includes a prober frame 21 provided with a plurality of probe pins.
  • the load lock chamber 3 includes a probe pin contact confirmation device 4.
  • the liquid crystal substrate 13 is introduced into the inspection chamber 2 through the load lock chamber 3 (FIG. 7B).
  • the prober frame 21 is aligned with the liquid crystal substrate 13 in the inspection chamber 2, and the probe pins are brought into contact with the substrate surface of the liquid crystal substrate 13 to form probe pin marks (FIG. 7C).
  • the liquid crystal substrate 13 on which the probe pin mark is formed is transported from the inspection chamber 2 to the load lock chamber 3, and the probe pin contact confirmation device 4 provided in the load lock chamber 3 confirms the contact between the probe pin and the electrode (FIG. 7). (D), (e)).
  • the operation example shown in FIG. 8 shows an example in which the probe pin contact confirmation device is provided separately from the liquid crystal substrate inspection device 1 and the contact confirmation between the probe pin and the electrode is performed outside the liquid crystal substrate inspection device 1.
  • the liquid crystal substrate inspection apparatus 1 includes an inspection chamber 2 including a prober 20 for inspecting a liquid crystal substrate, and a load lock chamber 3 that carries the liquid crystal substrate 13 into and out of the inspection chamber 2.
  • the prober 20 includes a prober frame 21 provided with a plurality of probe pins.
  • the probe pin contact confirmation device 4 is provided outside the liquid crystal substrate inspection device 1.
  • the liquid crystal substrate 13 is carried into the load lock chamber 3 (FIG. 8A)
  • the liquid crystal substrate 13 is introduced into the inspection chamber 2 through the load lock chamber 3 (FIG. 8B).
  • the prober frame 21 is aligned with the liquid crystal substrate 13 in the inspection chamber 2, and the probe pins are brought into contact with the substrate surface of the liquid crystal substrate 13 to form probe pin marks (FIG. 8C).
  • the steps up to here are the same as those in FIGS. 7A to 7C.
  • the liquid crystal substrate 13 on which the probe pin mark is formed is transported from the inspection chamber 2 to the probe pin contact confirmation device 4 provided outside the load lock chamber 3 through the load lock chamber 3 (FIG. 8D).
  • the contact confirmation device 4 confirms the contact between the probe pin and the electrode (FIG. 8 (e)).
  • the probe pin contact confirmation device of the present invention can be applied to an inspection device for inspecting a semiconductor substrate in addition to an organic EL substrate used for an organic EL display or the like in addition to a liquid crystal substrate inspection device.

Abstract

A probe pin contact checking apparatus includes a support section to support a whole area of a glass substrate from the lower side, a light source for irradiating the underside of the glass substrate supported by the support section from the lower side of the glass substrate, and a light source drive mechanism to move the light source in the horizontal direction at the lower side of the glass substrate. The light emitted from the light source irradiates the glass substrate from the lower side, and transmits through the glass substrate and an electrode provided on the glass substrate. In addition to visual observation of the transmitted light, imaged pictures are detected by imaging devices such as a CCD camera to check a probe pin position, an electrode position and displacement. This allows a contact position of the probe pin to be checked without damaging a liquid crystal substrate even for a large-sized glass substrate. Further, a contact position of the probe pin can be checked near the center of the large-sized glass substrate.

Description

プローブピンコンタクト確認装置、および液晶基板検査装置Probe pin contact confirmation device and liquid crystal substrate inspection device
　本発明は、液晶基板等のガラス基板に設けた電極に接触するプローブピンの位置を確認するプローブピンコンタクト確認装置、およびプローブピンコンタクト確認装置を備える液晶基板検査装置に関する。 The present invention relates to a probe pin contact confirmation device that confirms the position of a probe pin that contacts an electrode provided on a glass substrate such as a liquid crystal substrate, and a liquid crystal substrate inspection device that includes the probe pin contact confirmation device.
　液晶基板や薄膜トランジスタアレイ基板（ＴＦＴアレイ基板）は、ガラス基板等の基板上に液晶パネルを構成する薄膜トランジスタ（ＴＦＴ）がマトリックス状に配置されてなるＴＦＴアレイと、この薄膜トランジスタに駆動信号を供給する電極とを備え、薄膜トランジスタは走査信号用の電極，映像信号用の電極から供給された信号により駆動される。 A liquid crystal substrate or a thin film transistor array substrate (TFT array substrate) includes a TFT array in which thin film transistors (TFTs) constituting a liquid crystal panel are arranged in a matrix on a glass substrate or the like, and electrodes for supplying drive signals to the thin film transistors The thin film transistor is driven by a signal supplied from a scanning signal electrode and a video signal electrode.
　基板に形成されるＴＦＴアレイや液晶基板を検査する装置としてＴＦＴアレイ検査装置や液晶基板検査装置等の基板検査装置が知られている。基板検査装置は、走査信号用の電極，映像信号用の電極と電気的に接続する検査用のプローバと検査回路を備える。 As a device for inspecting a TFT array or a liquid crystal substrate formed on a substrate, a substrate inspection device such as a TFT array inspection device or a liquid crystal substrate inspection device is known. The substrate inspection apparatus includes an inspection prober and an inspection circuit that are electrically connected to electrodes for scanning signals and electrodes for video signals.
　液晶基板を検査する際には、液晶基板の上方からプローバのプローバフレームを重ね、プローバフレームに設けたプローブピンを液晶基板の電極に接触させ、このプローブピンと電極との接触によって液晶基板とプローバとに間の電気的接続を行っている。検査回路は、プローバからの電圧印加により流れる電流、あるいは電圧状態を検出して、ゲート－ソース間の短絡、点欠陥、断線等を調べる。 When inspecting the liquid crystal substrate, the prober frame of the prober is stacked from above the liquid crystal substrate, and the probe pin provided on the prober frame is brought into contact with the electrode of the liquid crystal substrate. There is an electrical connection between the two. The inspection circuit detects a current flowing by applying a voltage from a prober or a voltage state, and checks a short circuit between the gate and the source, a point defect, a disconnection, and the like.
　基板検査では、基板の電極に検査信号や制御信号が確実に印加されることが求められる。そのためには、プローバフレームに設けたプローブピンを基板電極に接触させる際に、プローブピンと基板電極との間に位置ずれが生じないことが必要である。 Substrate inspection requires that inspection signals and control signals be reliably applied to the electrodes on the substrate. For this purpose, when the probe pin provided on the prober frame is brought into contact with the substrate electrode, it is necessary that no positional deviation occurs between the probe pin and the substrate electrode.
　従来、プローバフレームに実装されたプローブピンの位置精度は、プローバフレームの加工精度によって保証されている。しかしながら、基板の大型化に伴って、加工精度のみではプローブピンの位置精度を保証することが困難となってきている。 Conventionally, the positional accuracy of the probe pin mounted on the prober frame is guaranteed by the processing accuracy of the prober frame. However, along with the increase in size of the substrate, it has become difficult to guarantee the positional accuracy of the probe pins only with the processing accuracy.
　このように、プローバフレームの加工精度のみでは位置精度を保証することが困難である場合には、加工後においてプローブピン位置を微調整する必要がある。 As described above, when it is difficult to guarantee the position accuracy only with the processing accuracy of the prober frame, it is necessary to finely adjust the position of the probe pin after the processing.
　プローブピンの位置を確認する手法として、通常、ガラス基板に位置確認用パッドを設け、プローブピンを位置確認用パッドに接触させることによって接触痕跡を形成することが知られている（特許文献１参照）。
特開２００６－９０９２６号公報（段落００２６～段落００２８） As a method for confirming the position of the probe pin, it is generally known to form a contact mark by providing a position confirmation pad on a glass substrate and bringing the probe pin into contact with the position confirmation pad (see Patent Document 1). ).
JP 2006-90926 A (paragraph 0026 to paragraph 0028)
　位置確認用パッドによるプローブピンの位置確認は、ガラス基板の裏面から光を照射し、ガラス基板および電極を透過した透過光によってプローブピン跡を観察し、プローブピンとガラス基板に設けられた電極との間に位置ずれが無いかを確認することで行われている。 The position confirmation of the probe pin by the position confirmation pad is performed by irradiating light from the back surface of the glass substrate, observing the probe pin trace by the transmitted light transmitted through the glass substrate and the electrode, and the probe pin and the electrode provided on the glass substrate. This is done by checking whether there is any misalignment between them.
　このようにガラス基板の裏面から光を照射することによって行うプローブピン跡の確認では、基板が大型化すると、基板の中央部分の確認が困難となるという問題が生じる。大型の基板では、ガラス基板の裏面から光を照射させるために、ガラス基板の中央付近を持ち上げるとガラス基板が破損するおそれがある。また、ガラス基板の外周付近を持ち上げ、ガラス基板の外周端部に形成された隙間から光を照射する場合においても、中央付近を持ち上げる場合と同様に、ガラス基板が破損するおそれがある他、中央付近に十分な光が届かず、プローブピン跡の十分な確認が困難であるという問題がある。 Thus, in the confirmation of the probe pin mark performed by irradiating light from the back surface of the glass substrate, there arises a problem that when the substrate is enlarged, it is difficult to confirm the central portion of the substrate. In a large substrate, in order to irradiate light from the back surface of the glass substrate, the glass substrate may be damaged if the vicinity of the center of the glass substrate is lifted. Also, when the vicinity of the glass substrate is lifted and light is irradiated from the gap formed at the outer peripheral edge of the glass substrate, the glass substrate may be damaged, as in the case of lifting the vicinity of the center. There is a problem that sufficient light does not reach the vicinity and it is difficult to sufficiently check the probe pin mark.
　図９は、従来のガラス基板のプローブピン跡を観察する態様を説明するための図である。図９において、ガラス基板１０には液晶パネル等のパネル部１１、および電極１２（図示していない）が形成され、この電極上に位置確認用シール材２３が貼り付けられている。 FIG. 9 is a diagram for explaining an aspect of observing the probe pin mark on the conventional glass substrate. In FIG. 9, a panel portion 11 such as a liquid crystal panel and an electrode 12 (not shown) are formed on a glass substrate 10, and a position confirmation sealing material 23 is affixed on the electrode.
　この位置確認用シール材２３にプローブピンを接触させることでプローブピン跡（図示していない）が形成される。ガラス基板１０の裏面から光を照射させるために、ガラス基板１０の外周の一端を持ち上げ、その隙間から光源３０の光を照射させる。 The probe pin mark (not shown) is formed by bringing the probe pin into contact with the seal material 23 for position confirmation. In order to irradiate light from the back surface of the glass substrate 10, one end of the outer periphery of the glass substrate 10 is lifted, and light from the light source 30 is irradiated from the gap.
　また、ＳＥＭイメージを用いた形状観察を、プローブピンの接触位置の確認に応用することも考えられる。しかしながら、ＳＥＭイメージを用いた形状観察では、プローバフレーム等のガラス基板の検査機構によって、走査電子線の照射や、２次電子や反射電子等の検出が干渉を受け、十分な位置確認が困難となる場合があるという問題がある。 It is also conceivable to apply shape observation using the SEM image to confirm the contact position of the probe pin. However, in the shape observation using the SEM image, it is difficult to confirm the position sufficiently because the scanning electron beam irradiation and the detection of secondary electrons and reflected electrons are interfered by the inspection mechanism of the glass substrate such as a prober frame. There is a problem that sometimes.
　そこで、本発明は前記した従来の問題点を解決し、大型のガラス基板であっても液晶基板を損傷させることなくプローブピンの接触位置の確認を可能とすることを目的とする。また、大型のガラス基板の中央付近において、プローブピンの接触位置の確認を可能とすることを目的とする。 Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to make it possible to confirm the contact position of the probe pin without damaging the liquid crystal substrate even if it is a large glass substrate. It is another object of the present invention to make it possible to confirm the contact position of the probe pin near the center of the large glass substrate.
　本発明は、ガラス基板に形成されたプローブピンの接触による痕跡を確認することによって、プローブピンとガラス基板の電極との接触位置を確認するプローブピンコンタクト確認装置、およびプローブピンコンタクト確認装置を備えた液晶基板検査装置である。 The present invention includes a probe pin contact confirmation device and a probe pin contact confirmation device for confirming a contact position between a probe pin and an electrode of a glass substrate by confirming a trace due to contact of the probe pin formed on the glass substrate. It is a liquid crystal substrate inspection apparatus.
　本発明が備えるプローブピンコンタクト確認装置は、ガラス基板の下方位置に移動自在とする光源を設けることによって、大型のガラス基板であっても光照射を可能とし、特にガラス基板の中央部付近であっても光照射を可能として、透過光によるプローブピン痕跡の確認を可能とするものである。 The probe pin contact confirmation device provided in the present invention is capable of irradiating light even on a large glass substrate by providing a light source that can be moved below the glass substrate, particularly near the center of the glass substrate. However, it is possible to irradiate light and to confirm the probe pin trace by transmitted light.
　本発明のプローブピンコンタクト確認装置は、ガラス基板の全面を下方から支持する支持部と、この支持部で支持されたガラス基板の下面を、ガラス基板の下方から照射する光源と、ガラス基板の下方位置において光源を水平方向に移動する光源駆動機構とを備える。 The probe pin contact confirmation device of the present invention includes a support part that supports the entire surface of the glass substrate from below, a light source that irradiates the lower surface of the glass substrate supported by the support part from below the glass substrate, and a lower part of the glass substrate. A light source driving mechanism for moving the light source in the horizontal direction at the position.
　光源駆動機構は、ガラス基板に対して光源を水平方向に移動し、光源がガラス基板を照射する照射位置を位置決めする。 The light source driving mechanism moves the light source horizontally with respect to the glass substrate, and positions the irradiation position where the light source irradiates the glass substrate.
　光源から発せられた光はガラス基板を下面から照射し、ガラス基板およびガラス基板上に設けられた電極を透過する。透過光は、目視によって観察する他、ＣＣＤカメラ等の撮像装置によって撮像画像を検出することができる。この透過において、ガラス基板のみを透過した透過光、ガラス基板に設けられた電極を透過した透過光、およびプローブピンが接触することで形成されるプローブピン跡を透過した透過光の各透過光は、光量に差があるため、目視による観察による明度差、あるいは撮像装置の撮像画像の信号強度差によって区別することができる。 The light emitted from the light source irradiates the glass substrate from the lower surface and passes through the glass substrate and the electrode provided on the glass substrate. In addition to observing the transmitted light visually, the captured image can be detected by an imaging device such as a CCD camera. In this transmission, each transmitted light of the transmitted light transmitted only through the glass substrate, the transmitted light transmitted through the electrode provided on the glass substrate, and the transmitted light transmitted through the probe pin mark formed by contacting the probe pin is Since there is a difference in the amount of light, it can be distinguished by a difference in brightness by visual observation or a difference in signal intensity of a captured image of the imaging device.
　プローブピンコンタクト確認装置は、ガラス基板を透過した透過光によって、ガラス基板上においてプローブピンの接触で形成されたプローブピン跡を確認し、このプローブピン跡によってプローブピンとガラス基板に設けられた電極との接触位置を確認する。透過光によるプローブピン跡の確認は、目視あるいは撮像装置の撮像画像の信号強度によって行うことができる。 The probe pin contact confirmation device confirms probe pin marks formed by contact of the probe pins on the glass substrate with transmitted light transmitted through the glass substrate, and the probe pins and electrodes provided on the glass substrate by the probe pin marks. Check the contact position. Confirmation of the probe pin mark by the transmitted light can be performed visually or by the signal intensity of the captured image of the imaging device.
　プローブピン跡は、少なくともガラス基板に設けられた電極上に位置確認用シール材を貼り付け、この位置確認用シール材にプローブピンを接触させることによって形成する。プローブピン位置と電極位置とが位置合わせされている場合には、プローバをガラス基板に装着した際に、プローブピンはガラス基板の電極と接触する。一方、プローブピン位置と電極位置との位置合わせが不良である場合には、プローバをガラス基板に装着した際に、プローブピンはガラス基板の電極と接触することができない。 The probe pin mark is formed by attaching a seal material for position confirmation on at least an electrode provided on the glass substrate and bringing the probe pin into contact with the seal material for position confirmation. When the probe pin position and the electrode position are aligned, the probe pin comes into contact with the electrode of the glass substrate when the prober is mounted on the glass substrate. On the other hand, when the alignment between the probe pin position and the electrode position is poor, the probe pin cannot contact the electrode of the glass substrate when the prober is mounted on the glass substrate.
　このとき、少なくとも電極上に位置確認用シール材を貼り付けておくと、プローブピン位置と電極位置との位置合わせが良好に位置合わせされている場合には、プローブピンは位置確認用シール材と接触して位置確認用シール材に痕跡を残し、プローブピン位置と電極位置との位置合わせが不良である場合には、プローブピンは位置確認用シール材と接触せず、位置確認用シール材に痕跡は残らない。したがって、この位置確認用シール材に残されたプローブピン跡を確認することによって、プローブピン位置と電極位置との位置合わせの良・不良を確認することができる。 At this time, if the position confirmation seal material is affixed at least on the electrode, the probe pin is positioned with the position confirmation seal material when the probe pin position and the electrode position are well aligned. If there is a trace on the seal material for position confirmation and the alignment between the probe pin position and the electrode position is poor, the probe pin does not come into contact with the seal material for position confirmation. There is no trace left. Accordingly, by confirming the probe pin mark left on the position confirmation sealing material, it is possible to confirm whether the probe pin position and the electrode position are aligned properly.
　また、位置確認用シール材を、電極およびこの電極の周囲を含む範囲に貼り付けることもできる。このように、電極の面積よりも広い面積の位置確認用シール材を用いた場合には、電極およびその周囲でのプローブピン跡の位置を確認することができる。プローブピン位置と電極位置との位置合わせが良好に位置合わせされている場合には、プローブピンは位置確認用シール材と接触して、位置確認用シール材の電極と重ねる位置に痕跡を残し、プローブピン位置と電極位置との位置合わせが不良である場合には、プローブピンは位置確認用シール材の電極と重ならない位置に痕跡を残す。さらに、位置ずれ量が大きく、プローブピンが位置確認用シール材とも接触しない場合には、位置確認用シール材に痕跡は残らない。 Also, a seal material for position confirmation can be attached to the electrode and the area including the periphery of the electrode. As described above, when the position confirmation sealing material having an area larger than the area of the electrode is used, the position of the electrode and the probe pin mark around the electrode can be confirmed. When the alignment between the probe pin position and the electrode position is satisfactorily aligned, the probe pin comes into contact with the position confirmation seal material, leaving a trace at the position where it overlaps the electrode of the position confirmation seal material, When the alignment between the probe pin position and the electrode position is poor, the probe pin leaves a mark at a position where it does not overlap the electrode of the position confirmation sealing material. Furthermore, when the amount of displacement is large and the probe pin does not contact the position confirmation seal material, no trace remains on the position confirmation seal material.
　したがって、この位置確認用シール材に残されたプローブピン跡を確認することによって、プローブピン位置と電極位置との位置合わせの良・不良を確認することができる。 Therefore, it is possible to confirm whether the probe pin position and the electrode position are good or bad by confirming the probe pin mark left on the position confirmation sealing material.
　本発明が備える光源は、ガラス基板の少なくとも一部の面を照射する面光源とすることができる。光源を面光源とすることによって、光源駆動機構で位置決めした位置において、照射する電極範囲を広くすることができる。 The light source provided in the present invention can be a surface light source that irradiates at least a part of the surface of the glass substrate. By using the surface light source as the light source, it is possible to widen the range of electrodes to be irradiated at the position positioned by the light source driving mechanism.
　透過光によるプローブピン跡の確認を撮像装置で行う場合には、プローブピンコンタクト確認装置は透過光を撮像する撮像装置、および撮像装置を水平方向に移動する撮像装置駆動機構を備える。この撮像装置は、光源およびガラス基板を通る光軸上に配置すると共に、光源駆動機構と撮像装置駆動機構とを同期して連続移動あるいは間歇移動する。この構成によって、大型のガラス基板に設けられた電極に光源からの光を照射すると共に、透過光を撮像装置で撮像することができる。 When the probe pin trace is confirmed by the transmitted light by the imaging device, the probe pin contact confirmation device includes an imaging device that images the transmitted light and an imaging device drive mechanism that moves the imaging device in the horizontal direction. This imaging device is arranged on the optical axis passing through the light source and the glass substrate, and continuously moves or intermittently moves the light source driving mechanism and the imaging device driving mechanism in synchronization. With this configuration, it is possible to irradiate the electrode provided on the large glass substrate with light from the light source and to capture the transmitted light with the imaging device.
　撮像装置は、一つの撮像画像内に複数のプローブピン跡を撮像する撮像倍率を有する。これによって、一撮像で得られる撮像画像を用いて複数のプローブピン跡を確認することができ、確認に要する処理時間を短縮することができる。 The imaging device has an imaging magnification for imaging a plurality of probe pin traces in one captured image. Thus, a plurality of probe pin traces can be confirmed using a captured image obtained by one imaging, and the processing time required for confirmation can be shortened.
　また、本発明はプローブピンコンタクト確認装置を備えた液晶基板検査装置とすることができる。 Further, the present invention can be a liquid crystal substrate inspection device provided with a probe pin contact confirmation device.
　本発明の液晶基板検査装置は、液晶基板の電極にプローブピンを接触させて液晶基板に検査信号を印加する液晶基板検査用プローバを有する液晶基板検査装置であり、液晶基板検査用プローバを備える検査室と、検査室との間で液晶基板の搬出入を行うロードロック室とを備える。 A liquid crystal substrate inspection apparatus according to the present invention is a liquid crystal substrate inspection device having a prober for liquid crystal substrate inspection that applies an inspection signal to the liquid crystal substrate by bringing a probe pin into contact with an electrode of the liquid crystal substrate, and an inspection equipped with a prober for liquid crystal substrate inspection A load lock chamber for carrying in and out of the liquid crystal substrate between the chamber and the inspection chamber.
　本発明の液晶基板検査装置は、プローブピンコンタクト確認装置をロードロック室内に備える形態と、プローブピンコンタクト確認装置を液晶基板検査装置のチャンバ外に設ける形態とすることができる。 The liquid crystal substrate inspection apparatus of the present invention can be configured such that the probe pin contact confirmation device is provided in the load lock chamber and the probe pin contact confirmation device is provided outside the chamber of the liquid crystal substrate inspection device.
　プローブピンコンタクト確認装置をロードロック室内に備える形態では、ロードロック室内にプローブピンコンタクト確認装置を備える。検査室において、プローブピンを液晶基板に接触させてプローブピン跡を形成し、検査室からロードロック室内に液晶基板を搬入し、ロードロック室内に設けたコンタクト確認装置によってプローブピン跡を確認する。 In the form in which the probe pin contact confirmation device is provided in the load lock chamber, the probe pin contact confirmation device is provided in the load lock chamber. In the inspection room, the probe pin is brought into contact with the liquid crystal substrate to form a probe pin mark, the liquid crystal substrate is carried from the inspection room into the load lock chamber, and the probe pin mark is confirmed by a contact confirmation device provided in the load lock chamber.
　プローブピンコンタクト確認装置を液晶基板検査装置のチャンバ外に設ける形態では、検査室において、プローブピンを液晶基板に接触させてプローブピン跡を形成し、液晶基板を、検査室からロードロック室を通ってプローブピンコンタクト確認装置に搬送する。プローブピンコンタクト確認装置は、液晶基板検査装置のチャンバ外において、搬送された液晶基板のプローブピン跡を確認する。 In the configuration in which the probe pin contact confirmation device is provided outside the chamber of the liquid crystal substrate inspection device, the probe pin is brought into contact with the liquid crystal substrate in the inspection room to form a probe pin mark, and the liquid crystal substrate is passed from the inspection chamber through the load lock chamber. To the probe pin contact confirmation device. The probe pin contact confirmation device confirms the probe pin mark of the conveyed liquid crystal substrate outside the chamber of the liquid crystal substrate inspection device.
　本発明の液晶基板検査装置は、プローブピンコンタクト確認装置でプローブピンの位置と電極の位置との位置合わせを確認し、位置合わせが不良であることが確認された場合には、プローバに取り付けられたプローブピンの位置を調整する。プローブピンの位置調整が完了した後、プローブピンコンタクト確認装置によって位置を再度確認して、位置調整が良好に行われたことを確認する。必要があれば、良好な位置関係が得られるまで、位置調整と位置確認とを繰り返す。 The liquid crystal substrate inspection apparatus of the present invention confirms the alignment between the position of the probe pin and the position of the electrode by the probe pin contact confirmation device, and if the alignment is confirmed to be defective, it is attached to the prober. Adjust the position of the probe pin. After the position adjustment of the probe pin is completed, the position is confirmed again by the probe pin contact confirmation device to confirm that the position adjustment has been successfully performed. If necessary, position adjustment and position confirmation are repeated until a good positional relationship is obtained.
　このプローブピンコンタクト確認装置によるプローブピンの位置と電極の位置との位置確認は、プローバによるガラス基板の検査を行う前の段階で行えば済み、確認ないし位置調整が完了した後、プローバによるガラス基板検査を行う際には不要となる。したがって、ロードロック室内にプローブピンコンタクト確認装置を設置した液晶基板検査装置は、プローバによる液晶基板の検査時には、プローブピンコンタクト確認装置によるコンタクト位置の確認は行うことなく、液晶基板を搬出入する。 The position of the probe pin and the position of the electrode by this probe pin contact confirmation device can be confirmed before the inspection of the glass substrate by the prober. After the confirmation or position adjustment is completed, the glass substrate by the prober is used. It is not necessary when performing inspection. Therefore, the liquid crystal substrate inspection apparatus in which the probe pin contact confirmation device is installed in the load lock chamber carries in and out the liquid crystal substrate without confirming the contact position by the probe pin contact confirmation device when inspecting the liquid crystal substrate by the prober.
　本発明によれば、大型のガラス基板であっても液晶基板を損傷させることなくプローブピンの接触位置の確認を可能とすることができる。 According to the present invention, the contact position of the probe pin can be confirmed without damaging the liquid crystal substrate even if it is a large glass substrate.
　また、大型のガラス基板の中央付近において、プローブピンの接触位置の確認を可能とすることができる。 Also, the contact position of the probe pin can be confirmed near the center of the large glass substrate.
プローブピンとガラス基板に設けた電極とを説明するための図である。It is a figure for demonstrating a probe pin and the electrode provided in the glass substrate. プローブピン跡を説明するための図である。It is a figure for demonstrating a probe pin trace. 本発明のプローブピンコンタクト確認装置の構成例を説明するための図である。It is a figure for demonstrating the structural example of the probe pin contact confirmation apparatus of this invention. 本発明のプローブピンコンタクト確認装置の動作例について説明するためのフローチャートである。It is a flowchart for demonstrating the operation example of the probe pin contact confirmation apparatus of this invention. 本発明のプローブピンコンタクト確認装置の動作例を説明するための動作図である。It is an operation | movement figure for demonstrating the operation example of the probe pin contact confirmation apparatus of this invention. 本発明のプローブピンコンタクト確認装置の動作例を説明するための動作図である。It is an operation | movement figure for demonstrating the operation example of the probe pin contact confirmation apparatus of this invention. 本発明のプローブピンコンタクト確認装置を適用した液晶基板検査装置の動作例を説明するための図である。It is a figure for demonstrating the operation example of the liquid crystal substrate test | inspection apparatus to which the probe pin contact confirmation apparatus of this invention is applied. 本発明のプローブピンコンタクト確認装置を適用した液晶基板検査装置の動作例を説明するための図である。It is a figure for demonstrating the operation example of the liquid crystal substrate test | inspection apparatus to which the probe pin contact confirmation apparatus of this invention is applied. 従来のガラス基板のプローブピン跡を観察する態様を説明するための図である。It is a figure for demonstrating the aspect which observes the probe pin trace of the conventional glass substrate.
符号の説明Explanation of symbols
　１…液晶基板検査装置、２…検査室、３…ロードロック室、４…プローブピンコンタクト確認装置、１０…ガラス基板、１１…パネル部、１２，１２ａ～１２ｅ…電極、１３…液晶基板、２０…プローバ、２１…プローバフレーム、２２，２２ａ～２２ｅ…プローブピン、２３…位置確認用シール材、３０…光源、４１…光源、４２…光源駆動機構、４３…撮像装置、４４…撮像装置駆動機構、４５…支持部、１００，１００ａ～１００ｅ…プローブピン跡。 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal substrate inspection apparatus, 2 ... Inspection room, 3 ... Load lock chamber, 4 ... Probe pin contact confirmation apparatus, 10 ... Glass substrate, 11 ... Panel part, 12, 12a-12e ... Electrode, 13 ... Liquid crystal substrate, 20 ... prober, 21 ... prober frame, 22, 22a to 22e ... probe pin, 23 ... position confirmation seal material, 30 ... light source, 41 ... light source, 42 ... light source drive mechanism, 43 ... imaging device, 44 ... imaging device drive mechanism , 45: Supporting part, 100, 100a to 100e ... Trace of probe pin.
　以下、本発明の実施の形態について、図を参照しながら詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
　本発明のプローブピンコンタクト確認装置は、液晶基板検査装置に適用することができる。液晶基板検査装置は、例えば、導入された液晶基板を検査する検査室と、この検査室に対して液晶基板を搬出入するロードロック室を備える。 The probe pin contact confirmation device of the present invention can be applied to a liquid crystal substrate inspection device. The liquid crystal substrate inspection apparatus includes, for example, an inspection chamber for inspecting an introduced liquid crystal substrate and a load lock chamber for carrying the liquid crystal substrate into and out of the inspection chamber.
　検査室は、例えば、検査対象である液晶基板に荷電粒子ビームを照射する荷電粒子源、この荷電粒子の照射によって液晶基板から放出される二次電子を検出する検出器、検査対象の液晶基板を支持すると共に二次元的に走査させるステージ等の各部分を備え、検出器で得られる走査画像に基づいて基板検査を行う。 The inspection room includes, for example, a charged particle source that irradiates a charged particle beam to a liquid crystal substrate to be inspected, a detector that detects secondary electrons emitted from the liquid crystal substrate by irradiation of the charged particles, and a liquid crystal substrate to be inspected. Each part such as a stage for supporting and two-dimensionally scanning is provided, and substrate inspection is performed based on a scanning image obtained by a detector.
　液晶基板は、例えばガラス基板上にＴＦＴアレイが形成されている。この液晶基板に形成されるＴＦＴアレイのレイアウト、電極、配線パターン等は液晶パネルのサイズや仕様に応じて種々に設定される。液晶基板上のＴＦＴアレイには薄膜トランジスタがマトリックス状に形成され、各薄膜トランジスタを駆動する信号電極（例えば、走査信号電極，映像信号電極）が形成されている。また、液晶基板のアレイの外側には、液晶基板の外部と電気的に接続するための電極が形成される。 The liquid crystal substrate has, for example, a TFT array formed on a glass substrate. The layout, electrodes, wiring patterns, etc. of the TFT array formed on the liquid crystal substrate are variously set according to the size and specifications of the liquid crystal panel. Thin film transistors are formed in a matrix on the TFT array on the liquid crystal substrate, and signal electrodes (for example, scanning signal electrodes and video signal electrodes) for driving the thin film transistors are formed. In addition, an electrode for electrically connecting to the outside of the liquid crystal substrate is formed outside the array of the liquid crystal substrate.
　液晶基板検査装置は、液晶基板に検査信号を供給するプローバを備える。プローバは、液晶基板の電極と電気的に接続して検査信号を供給するプローブピンを設けたプローバフレームを備える。プローブピンは液晶基板の電極と電気的に接続することによって、液晶基板に検査信号を供給する。 The liquid crystal substrate inspection device includes a prober that supplies an inspection signal to the liquid crystal substrate. The prober includes a prober frame provided with probe pins that are electrically connected to the electrodes of the liquid crystal substrate and supply inspection signals. The probe pins are electrically connected to the electrodes of the liquid crystal substrate to supply inspection signals to the liquid crystal substrate.
　液晶基板の検査を行うには、ステージに載置した液晶基板にプローバフレームを配置する。液晶基板とプローバフレームとの間において、電極とプローブピンが接触することによって電気的な接続が行われ、プローブピンと電極との接続を通してＴＦＴアレイに検査信号が供給される。また、プローバフレームとステージとの間の接続は、プローバフレーム及びステージ側に設けたコネクタにより行われる。 To inspect the liquid crystal substrate, a prober frame is placed on the liquid crystal substrate placed on the stage. Between the liquid crystal substrate and the prober frame, the electrode and the probe pin come into contact to make an electrical connection, and an inspection signal is supplied to the TFT array through the connection between the probe pin and the electrode. The connection between the prober frame and the stage is made by a connector provided on the prober frame and the stage side.
　図１はプローブピンとガラス基板に設けた電極とを説明するための図であり、図２はプローブピン跡を説明するための図である。ここでは、ガラス基板が備える複数の電極１２の一部と、プローバを構成するプローバフレームに設けられた複数のプローブピン２２の一部を示している。 FIG. 1 is a diagram for explaining probe pins and electrodes provided on a glass substrate, and FIG. 2 is a diagram for explaining probe pin marks. Here, a part of the plurality of electrodes 12 included in the glass substrate and a part of the plurality of probe pins 22 provided on the prober frame constituting the prober are shown.
　図１（ａ）は、ガラス基板に設けられた電極１２の一部１２ａ～１２ｅ（図中の破線で示す）の上面に位置確認用シール材２３を重ねて貼り付けた状態を示している。位置確認用シール材２３は、プローブピン２２がガラス基板に接触した際に、プローブピン２２が接触した位置を確認するためのプローブピン跡を残すためのシール材であり、裏面に接着剤を塗布しておくことによって、ガラス基板の表面の貼り付けることができる。シール材は、プローブピンの接触による押圧によって塑性変形し、光を透過する材質であれば任意とすることができる。 FIG. 1 (a) shows a state in which a position confirmation sealing material 23 is laminated and attached to the upper surface of a portion 12a to 12e (indicated by a broken line in the drawing) of the electrode 12 provided on the glass substrate. The seal material 23 for position confirmation is a seal material for leaving a probe pin mark for confirming a position where the probe pin 22 is in contact with the glass substrate when the probe pin 22 is in contact with the glass substrate. The surface of the glass substrate can be affixed. The seal material may be any material as long as it is plastically deformed by the pressure of contact with the probe pin and transmits light.
　プローブピン２２が位置確認用シール材２３に接触すると、位置確認用シール材２３はプローブピン２２の先端によって押されて塑性変形する。プローブピン２２をガラス基板から離すと、位置確認用シール材２３にはプローブピン２２が接触した位置にプローブピン跡が残り、そのプローブピン跡の痕跡位置からプローブピン２２の位置と電極１２の位置との関係を確認することができる。 When the probe pin 22 comes into contact with the position confirmation sealing material 23, the position confirmation sealing material 23 is pushed by the tip of the probe pin 22 and is plastically deformed. When the probe pin 22 is separated from the glass substrate, the probe pin mark remains on the position check seal material 23 at the position where the probe pin 22 contacts, and the position of the probe pin 22 and the position of the electrode 12 from the trace position of the probe pin mark. Can be confirmed.
　位置確認用シール材２３は、少なくとも電極１２を覆うように貼り付けられる。図１では、電極１２ａ～１２ｅと、これらの電極の周囲を含む範囲を覆うように貼り付けられる。この位置確認用シール材２３が覆う範囲は、例えば、プローブピン２２がガラス基板と接触する位置がばらつく範囲に基づいて定めることができる。このように、電極１２の周囲を含む範囲を覆うように位置確認用シール材２３を貼り付けることによって、プローブピン２２の設置位置に位置ずれが生じていない場合には、そのプローブピンのプローブピン跡は位置確認用シール材２３の電極上の位置に残るため、プローブピン２２の位置が電極１２の位置に位置合わせされていることを確認することができる。 The position confirmation sealing material 23 is attached so as to cover at least the electrode 12. In FIG. 1, the electrodes 12a to 12e are pasted so as to cover a range including the periphery of these electrodes. The range covered by the position confirmation sealing material 23 can be determined based on, for example, a range in which the position where the probe pin 22 contacts the glass substrate varies. As described above, when the position confirmation sealing material 23 is pasted so as to cover the range including the periphery of the electrode 12, when there is no displacement in the installation position of the probe pin 22, the probe pin of the probe pin Since the trace remains at the position on the electrode of the position confirmation sealing material 23, it can be confirmed that the position of the probe pin 22 is aligned with the position of the electrode 12.
　また、プローブピン２２の設置位置に位置ずれが生じた場合においても、そのプローブピンのプローブピン跡が位置確認用シール材２３の電極１２からはずれた位置に残るため、プローブピン２２がガラス基板上の電極１２から位置ずれした位置で接触することを確認することができる。 In addition, even when the position of the probe pin 22 is displaced, the probe pin mark remains on the glass substrate because the probe pin mark remains at a position deviated from the electrode 12 of the seal material 23 for position confirmation. It can be confirmed that the contact is made at a position displaced from the electrode 12.
　図１（ｂ）はプローブピン２２をガラス基板に接触させた状態を示し、図１（ｃ）はプローブピン２２をガラス基板に接触させた後、プローブピン２２を離した状態を示している。 FIG. 1 (b) shows a state in which the probe pin 22 is in contact with the glass substrate, and FIG. 1 (c) shows a state in which the probe pin 22 is released after the probe pin 22 is in contact with the glass substrate.
　プローブピン２２をガラス基板に接触させると、プローブピン２２は位置確認用シール材２３を押圧して、プローブピン２２が接触した位置にくぼみを形成してプローブピン跡を残す。図１（ｃ）は、プローブピン２２ａ～２２ｅにより形成されるプローブピン跡１００ａ～１００ｅを示している。 When the probe pin 22 is brought into contact with the glass substrate, the probe pin 22 presses the position confirmation sealing material 23 to form a dent at a position where the probe pin 22 is in contact, and leave a probe pin mark. FIG. 1C shows probe pin marks 100a to 100e formed by the probe pins 22a to 22e.
　図２（ａ）はプローブピン跡を示している。図２（ａ）に示す例は、プローブピン跡１００ａ，１００ｄ，１００ｅは電極１２ａ，１２ｄ，１２ｅ上にあり、プローブピン跡１００ｂは電極１２ｂから外れた位置にあり、プローブピン跡１００ｃの一部分は電極１２ｃ上にあり、残りの部分は電極１２ｃから外れた位置にあることを示している。 FIG. 2 (a) shows the probe pin mark. In the example shown in FIG. 2A, the probe pin marks 100a, 100d, and 100e are on the electrodes 12a, 12d, and 12e, the probe pin mark 100b is at a position away from the electrode 12b, and a part of the probe pin mark 100c is It shows that it exists on the electrode 12c and the remaining part exists in the position remove | deviated from the electrode 12c.
　この位置確認用シール材２３に残されたプローブピン跡と各電極との位置関係に基づいて、プローブピン２２の位置が電極１２の位置と位置ずれしていないかを確認することができる。 It is possible to confirm whether the position of the probe pin 22 is not displaced from the position of the electrode 12 based on the positional relationship between the probe pin mark remaining on the position confirmation sealing material 23 and each electrode.
　また、位置確認用シール材２３は、電極１２のみを覆うように貼り付けてもよい。このように、電極１２のみを覆うように位置確認用シール材２３を貼り付けた場合には、プローブピン２２の設置位置に位置ずれが生じていない場合には、そのプローブピンのプローブピン跡は位置確認用シール材２３に残るため、プローブピン２２のガラス基板上の接触位置を確認することができる。また、仮にプローブピン２２の設置位置に位置ずれが生じた場合には、そのプローブピンのプローブピン跡は位置確認用シール材２３に残らないため、プローブピン２２が電極１２からずれた位置に接触した、あるいはプローブピン２２が電極１２に接触していないと推定することができる。 Further, the position confirmation sealing material 23 may be attached so as to cover only the electrode 12. As described above, when the position confirmation sealing material 23 is pasted so as to cover only the electrode 12, the probe pin mark of the probe pin is recorded when there is no displacement in the installation position of the probe pin 22. Since it remains in the position confirmation sealing material 23, the contact position of the probe pin 22 on the glass substrate can be confirmed. In addition, if the position of the probe pin 22 is displaced, the probe pin mark of the probe pin does not remain on the seal material 23 for position confirmation, so the probe pin 22 contacts the position displaced from the electrode 12. Alternatively, it can be estimated that the probe pin 22 is not in contact with the electrode 12.
　プローブピン２２をガラス基板に接触させると、プローブピン２２の位置が電極１２の位置と位置合わせされている場合には、プローブピン２２は位置確認用シール材２３を押圧して、プローブピン２２が接触した位置にくぼみを形成してプローブピン跡を残す。一方、プローブピン２２の位置が電極１２の位置と位置合わせされていない場合には、プローブピン２２は位置確認用シール材２３を押圧しないため、プローブピン２２が接触した位置にプローブピン跡は残らない。 When the probe pin 22 is brought into contact with the glass substrate, when the position of the probe pin 22 is aligned with the position of the electrode 12, the probe pin 22 presses the seal material 23 for position confirmation, and the probe pin 22 A recess is formed at the contact position, leaving a probe pin mark. On the other hand, when the position of the probe pin 22 is not aligned with the position of the electrode 12, the probe pin 22 does not press the position confirmation seal material 23, so that the probe pin mark remains at the position where the probe pin 22 contacts. Absent.
　図２（ｂ）は、プローブピン２２ａ～２２ｅにより形成されるプローブピン跡１００ａ～１００ｅを示している。図２（ｂ）に示す例は、図２（ａ）と同様に、プローブピン跡１００ａ，１００ｄ，１００ｅは電極１２ａ，１２ｄ，１２ｅ上にあり、プローブピン跡１００ｂは電極１２ｂから外れた位置にあり、プローブピン跡１００ｃの一部分は電極１２ｃ上にあり、残りの部分は電極１２ｃから外れた位置にある。 FIG. 2 (b) shows probe pin marks 100a to 100e formed by the probe pins 22a to 22e. In the example shown in FIG. 2B, as in FIG. 2A, the probe pin marks 100a, 100d, and 100e are on the electrodes 12a, 12d, and 12e, and the probe pin mark 100b is positioned away from the electrode 12b. Yes, a part of the probe pin mark 100c is on the electrode 12c, and the remaining part is located away from the electrode 12c.
　位置確認用シール材２３が電極１２のみを覆う場合には、プローブピン跡１００ｂは位置確認用シール材２３上に残らないため観察されない。また、プローブピン跡１００ｃは一部のみが位置確認用シール材２３上に残り、この一部分のみを観察することができる。 When the seal material 23 for position confirmation covers only the electrode 12, the probe pin mark 100b is not observed because it does not remain on the seal material 23 for position confirmation. Further, only a part of the probe pin mark 100c remains on the position confirmation sealing material 23, and only this part can be observed.
　位置確認用シール材２３が電極１２のみを覆うように貼り付けられている場合においても、位置確認用シール材２３に残されたプローブピン跡と各電極との位置関係に基づいて、プローブピン２２の位置が電極１２の位置と位置ずれしていないかを確認することができる。 Even when the position confirmation sealing material 23 is attached so as to cover only the electrode 12, the probe pin 22 is based on the positional relationship between the probe pin mark remaining on the position confirmation sealing material 23 and each electrode. It can be confirmed whether or not the position of is shifted from the position of the electrode 12.
　本発明のプローブピンコンタクト確認装置は、この位置確認用シール材に残されたプローブピン跡の位置確認を、ガラス基板の裏面から光を照射し、透過する透過光によって行う。ガラス基板、電極、および位置確認用シール材は光を透過する。この透過において、電極を透過する光量と、位置確認用シール材を透過する光量は相違し、さらに、位置確認用シール材上でプローブピン跡の有無によっても透過光の光量は相違する。 The probe pin contact confirmation device according to the present invention confirms the position of the probe pin mark remaining on the position confirmation sealing material by irradiating light from the back surface of the glass substrate and transmitting the transmitted light. The glass substrate, the electrode, and the position confirmation sealing material transmit light. In this transmission, the amount of light transmitted through the electrode is different from the amount of light transmitted through the position confirmation sealing material, and the amount of transmitted light also differs depending on the presence or absence of probe pin marks on the position confirmation sealing material.
　この透過光の光量の相違からプローブピンの接触位置を確認し、この接触位置が電極上にあるか否かを確認することで、プローブピンの位置が対応する電極位置に位置合わせされているかを確認することができる。 By checking the contact position of the probe pin from the difference in the amount of transmitted light and checking whether or not the contact position is on the electrode, it can be determined whether the probe pin is aligned with the corresponding electrode position. Can be confirmed.
　図３は本発明のプローブピンコンタクト確認装置４の構成例を説明するための図である。本発明のプローブピンコンタクト確認装置４は、ガラス基板１０の全面を下方から支持する支持部４５と、支持部４５で支持されたガラス基板１０の下面を、ガラス基板１０の下方から照射する光源４１と、ガラス基板１０の下方位置において光源４１を水平方向に移動する光源駆動機構４２とを備える。光源４１は面光源を用いることができる。 FIG. 3 is a diagram for explaining a configuration example of the probe pin contact confirmation device 4 of the present invention. The probe pin contact confirmation device 4 of the present invention includes a support unit 45 that supports the entire surface of the glass substrate 10 from below, and a light source 41 that irradiates the lower surface of the glass substrate 10 supported by the support unit 45 from below the glass substrate 10. And a light source driving mechanism 42 that moves the light source 41 in the horizontal direction at a position below the glass substrate 10. The light source 41 can be a surface light source.
　支持部４５は、ガラス基板１０の自重たわみによってガラス基板１０自体が破損しない程度の間隔で配置して、ガラス基板１０を下方から支持する。この支持部４５による支持によって、ガラス基板１０の下方には、光源４１を移動させることができるスペースが形成される。また、支持部４５は、昇降自在とするリフト機構を備えることによって、搬送機構との間でガラス基板１０の搬出入を行うことができる。 The support portions 45 are arranged at intervals such that the glass substrate 10 itself is not damaged by the self-weight deflection of the glass substrate 10 and supports the glass substrate 10 from below. By the support by the support portion 45, a space where the light source 41 can be moved is formed below the glass substrate 10. Moreover, the support part 45 can carry in / out the glass substrate 10 between conveyance mechanisms by providing the lift mechanism which can be raised / lowered freely.
　また、透過光をＣＣＤカメラ等の撮像装置で撮像して取得される撮像画像によって、プローブピンと電極とのコンタクト位置を確認する場合には、透過光を撮像する撮像装置４３および撮像装置４３を水平方向に移動する撮像装置駆動機構４４を備える。 Further, when the contact position between the probe pin and the electrode is confirmed based on a captured image obtained by capturing the transmitted light with an image capturing device such as a CCD camera, the image capturing device 43 and the image capturing device 43 that capture the transmitted light are placed horizontally. An imaging device drive mechanism 44 that moves in the direction is provided.
　プローブピンと電極とのコンタクト位置の確認は、撮像装置を用いることなく目視でおこなっても良く、この場合には、ガラス基板１０、電極１２，および位置確認用シール材２３を透過した透過光を目視で観察することによって行う。 The contact position between the probe pin and the electrode may be confirmed visually without using an imaging device. In this case, the transmitted light that has passed through the glass substrate 10, the electrode 12, and the position confirmation sealing material 23 is visually observed. Do by observing with.
　撮像装置４３は、光源４１およびガラス基板１０を通る光軸上に配置し、光源駆動機構４２と撮像装置駆動機構４４を同期して駆動させる。 The imaging device 43 is disposed on the optical axis passing through the light source 41 and the glass substrate 10 and drives the light source driving mechanism 42 and the imaging device driving mechanism 44 in synchronization.
　光源駆動機構４２は、光源４１をガラス基板１０に対して水平方向に移動し、光源４１がガラス基板を照射する照射位置を位置決めする。光源４１は、ガラス基板１０を下面（裏面）から照射する。ガラス基板を透過した透過光は、上方に配置した撮像装置４３によって撮像される。撮像画像には、電極１２、位置確認用シール材２３、およびプローブピン跡１００が映し出されている。光源駆動機構４２と撮像装置駆動機構４４を同期して駆動することで、常に、撮像装置４３が撮像するガラス基板１０上の位置を光源４１の光で照射することができる。 The light source drive mechanism 42 moves the light source 41 in the horizontal direction with respect to the glass substrate 10, and positions the irradiation position where the light source 41 irradiates the glass substrate. The light source 41 irradiates the glass substrate 10 from the lower surface (back surface). The transmitted light that has passed through the glass substrate is imaged by the imaging device 43 disposed above. In the captured image, the electrode 12, the seal material 23 for position confirmation, and the probe pin mark 100 are projected. By driving the light source driving mechanism 42 and the imaging device driving mechanism 44 in synchronization, the position on the glass substrate 10 taken by the imaging device 43 can always be irradiated with the light of the light source 41.
　同期駆動は、光源４１と撮像装置４３とを連続移動させるほか、間歇移動させてもよい。この同期駆動は、図示しない制御手段によって光源駆動機構４２と撮像装置駆動機構４４とを制御することで行う。光源駆動機構４２および撮像装置駆動機構４４は、任意の駆動機構を用いることができる。例えば、ガラス基板１０と並行にレールを付設し、このレールに沿って移動する移動機構を設け、この移動機構によって光源や撮像装置を設置する構成とすることができる。 In the synchronous drive, the light source 41 and the imaging device 43 may be moved continuously or intermittently. This synchronous driving is performed by controlling the light source driving mechanism 42 and the imaging device driving mechanism 44 by a control means (not shown). Arbitrary drive mechanisms can be used for the light source drive mechanism 42 and the imaging device drive mechanism 44. For example, a rail may be provided in parallel with the glass substrate 10, a moving mechanism that moves along the rail is provided, and a light source and an imaging device may be installed by the moving mechanism.
　光源４１と撮像装置４３とを連続移動させる場合には、光源４１の位置と撮像装置４３の位置は互いに対向する位置を維持した状態で所定速度により連続移動しながら、連続あるいは間欠的に撮像する。 When the light source 41 and the imaging device 43 are continuously moved, images are taken continuously or intermittently while continuously moving at a predetermined speed while maintaining the positions of the light source 41 and the imaging device 43 facing each other. .
　また、光源４１と撮像装置４３とを間歇移動させる場合には、光源４１の位置と撮像装置４３の位置は互いに対向する位置を維持した状態で所定距離分だけステップ状に移動させ、各停止位置で撮像を行う。 Further, when the light source 41 and the imaging device 43 are moved intermittently, the position of the light source 41 and the position of the imaging device 43 are moved stepwise by a predetermined distance while maintaining the positions facing each other, and each stop position is Take an image with.
　撮像装置４３は、一つの撮像画像内に複数の電極１２およびプローブピン跡１００を撮像することで、一つの撮像画像で複数のプローブピンについて位置確認を行うことができ、これによって、確認効率を高めることができる。なお、撮像画像内に撮像する電極やプローブピン跡の個数は、撮像装置の撮像倍率等の光学系を調整することで設定することができる。 The imaging device 43 can confirm the position of a plurality of probe pins in one captured image by capturing the plurality of electrodes 12 and the probe pin trace 100 in one captured image, thereby improving the confirmation efficiency. Can be increased. Note that the number of electrodes and probe pin marks to be captured in the captured image can be set by adjusting an optical system such as an imaging magnification of the imaging apparatus.
　また、光源４１と撮像装置４３との移動において、光源４１のみを間歇移動させ、撮像装置４３を連続移動させる形態としてもよい。光源４１として面光源を用いる場合には、光源４１からは広い範囲に亘って光が照射されるため、光源４１が停止した状態で撮像装置４３が移動した場合であっても、ガラス基板を透過した透過光を撮像することができる。したがって、面光源が照射する範囲内であれば、光源４１を停止させた状態で撮像装置４３のみを移動させて撮像を行うことができる。 In the movement between the light source 41 and the imaging device 43, only the light source 41 may be moved intermittently, and the imaging device 43 may be moved continuously. When a surface light source is used as the light source 41, light is emitted from the light source 41 over a wide range, so that even when the imaging device 43 moves with the light source 41 stopped, the light passes through the glass substrate. The transmitted light can be imaged. Therefore, if it is within the range irradiated by the surface light source, it is possible to perform imaging by moving only the imaging device 43 while the light source 41 is stopped.
　次に、本発明のプローブピンコンタクト確認装置の動作例について説明する。図４はプローブピンコンタクト確認装置の動作例を説明するためのフローチャートであり、図５，６はプローブピンコンタクト確認装置の動作例を説明するための動作図である。 Next, an operation example of the probe pin contact confirmation device of the present invention will be described. FIG. 4 is a flowchart for explaining an operation example of the probe pin contact confirmation device, and FIGS. 5 and 6 are operation diagrams for explaining an operation example of the probe pin contact confirmation device.
　はじめに、ガラス基板１０に設けられた電極１２上に位置確認用シール材２３を貼り付ける。図５（ａ）は、位置確認用シール材２３を貼り付ける前のガラス基板１０の状態を示し、図５（ｂ）は、ガラス基板１０の電極１２上に位置確認用シール材２３を貼り付ける状態を示し、図５（ｃ）は、ガラス基板１０の電極１２上に位置確認用シール材２３を貼り付けた状態を示している（S1）。 First, a position confirmation sealing material 23 is pasted on the electrode 12 provided on the glass substrate 10. FIG. 5A shows a state of the glass substrate 10 before the position check sealing material 23 is attached, and FIG. 5B shows the position check seal material 23 attached onto the electrode 12 of the glass substrate 10. The state is shown, and FIG. 5C shows a state in which the position confirmation sealing material 23 is pasted on the electrode 12 of the glass substrate 10 (S1).
　位置確認用シール材２３を貼り付けたガラス基板１０をプローバフレームの下方に配置した後（S2）、プローバフレームを下降させて、プローブピン２２をガラス基板１０に接触させる(S3)。プローブピン２２をガラス基板１０に接触させて、位置確認用シール材２３にプローブピン跡を形成させた後、プローバフレームを上昇させて、プローブピン２２をガラス基板１０から離す(S4)。 After placing the glass substrate 10 with the position confirmation sealing material 23 attached below the prober frame (S2), the prober frame is lowered and the probe pins 22 are brought into contact with the glass substrate 10 (S3). After the probe pin 22 is brought into contact with the glass substrate 10 to form a probe pin mark on the position confirmation sealing material 23, the prober frame is raised to separate the probe pin 22 from the glass substrate 10 (S4).
　上記S1からS4の工程は、検査室等のプローバフレームが設置された場所で行い、位置確認用シール材２３にプローブピン跡を形成したガラス基板１０をコンタクト確認装置に移動し、支持部４５上に設置する。図６（ａ）は、位置確認用シール材２３を貼り付けたガラス基板１０を支持部４５上に設置した状態を示している。光源４１から照射された光は、ガラス基板１０を透過して撮像装置４３で撮像される (S5)。 Steps S1 to S4 are performed in a place where a prober frame such as an examination room is installed, and the glass substrate 10 on which the probe pin mark is formed on the position confirmation sealing material 23 is moved to the contact confirmation device. Install in. FIG. 6A shows a state where the glass substrate 10 on which the position confirmation sealing material 23 is attached is installed on the support portion 45. The light emitted from the light source 41 passes through the glass substrate 10 and is captured by the imaging device 43 (S5).
　次に、光源４１および撮像装置４３を移動させ（S6)、撮像装置４３によって撮像画像を取得する。図６（ｂ），（ｃ）は、光源４１および撮像装置４３を移動させながら、撮像装置４３によって撮像画像を取得する状態を示している(S7)。 Next, the light source 41 and the imaging device 43 are moved (S6), and a captured image is acquired by the imaging device 43. 6B and 6C show a state in which a captured image is acquired by the imaging device 43 while moving the light source 41 and the imaging device 43 (S7).
　取得した撮像画像を用いてプローブピン跡１００に基づいてプローブピン２２と電極１２との接触位置を確認する（S8）。 The contact position between the probe pin 22 and the electrode 12 is confirmed based on the probe pin mark 100 using the acquired captured image (S8).
　プローブピン跡１００の位置から、プローブピン２２の位置と電極１２の位置が位置ずれしていることが確認された場合には(S9)、プローバフレームのプローブピンの位置を調整し（S10）、前記したS1～S9の工程を繰り返す。 When it is confirmed that the position of the probe pin 22 and the position of the electrode 12 are displaced from the position of the probe pin mark 100 (S9), the position of the probe pin on the prober frame is adjusted (S10), The above steps S1 to S9 are repeated.
　プローブピン跡１００の位置から、プローブピン２２の位置と電極１２の位置が位置ずれしていないことが確認された場合には(S9)、そのプローバフレームに設けられたプローブピンの設置位置が良好であることが確認されたとして、このプローバを用いて基板検査を行う。 When it is confirmed from the position of the probe pin mark 100 that the position of the probe pin 22 and the position of the electrode 12 are not shifted (S9), the installation position of the probe pin provided in the prober frame is good. As a result, the substrate is inspected using this prober.
　次に、本発明のプローブピンコンタクト確認装置を適用した液晶基板検査装置の動作例について図７、図８を用いて説明する。 Next, an operation example of the liquid crystal substrate inspection apparatus to which the probe pin contact confirmation apparatus of the present invention is applied will be described with reference to FIGS.
　図７に示す動作例は、ロードロック室内に設けたプローブピンコンタクト確認装置によってプローブピンと電極とのコンタクト確認を行う例を示している。 The operation example shown in FIG. 7 shows an example in which contact confirmation between a probe pin and an electrode is performed by a probe pin contact confirmation device provided in a load lock chamber.
　液晶基板検査装置１は、液晶基板検査用のプローバ２０を備える検査室２と、検査室２との間で液晶基板１３の搬出入を行うロードロック室３とを備える。プローバ２０は複数のプローブピンを設けたプローバフレーム２１を備える。ロードロック室３は、プローブピンコンタクト確認装置４を備える。 The liquid crystal substrate inspection apparatus 1 includes an inspection chamber 2 having a prober 20 for inspecting a liquid crystal substrate, and a load lock chamber 3 for carrying the liquid crystal substrate 13 in and out of the inspection chamber 2. The prober 20 includes a prober frame 21 provided with a plurality of probe pins. The load lock chamber 3 includes a probe pin contact confirmation device 4.
　はじめに、液晶基板１３をロードロック室３内に搬入した後（図７（ａ））、ロードロック室３を介して検査室２に液晶基板１３を導入する（図７（ｂ））。検査室２内でプローバフレーム２１を液晶基板１３に位置合わせし、プローブピンを液晶基板１３の基板面に接触させ、プローブピン跡を形成する（図７（ｃ））。 First, after the liquid crystal substrate 13 is carried into the load lock chamber 3 (FIG. 7A), the liquid crystal substrate 13 is introduced into the inspection chamber 2 through the load lock chamber 3 (FIG. 7B). The prober frame 21 is aligned with the liquid crystal substrate 13 in the inspection chamber 2, and the probe pins are brought into contact with the substrate surface of the liquid crystal substrate 13 to form probe pin marks (FIG. 7C).
　プローブピン跡を形成した液晶基板１３を、検査室２からロードロック室３に搬送し、ロードロック室３内に設けたプローブピンコンタクト確認装置４によってプローブピンと電極とのコンタクト確認を行う（図７（ｄ），（ｅ））。 The liquid crystal substrate 13 on which the probe pin mark is formed is transported from the inspection chamber 2 to the load lock chamber 3, and the probe pin contact confirmation device 4 provided in the load lock chamber 3 confirms the contact between the probe pin and the electrode (FIG. 7). (D), (e)).
　図８に示す動作例は、プローブピンコンタクト確認装置を液晶基板検査装置１と別置きとし、液晶基板検査装置１の外部においてプローブピンと電極とのコンタクト確認を行う例を示している。 The operation example shown in FIG. 8 shows an example in which the probe pin contact confirmation device is provided separately from the liquid crystal substrate inspection device 1 and the contact confirmation between the probe pin and the electrode is performed outside the liquid crystal substrate inspection device 1.
　液晶基板検査装置１は、図７の構成と同様に、液晶基板検査用のプローバ２０を備える検査室２と、検査室２との間で液晶基板１３の搬出入を行うロードロック室３とを備える。プローバ２０は複数のプローブピンを設けたプローバフレーム２１を備える。図８の構成例では、プローブピンコンタクト確認装置４を液晶基板検査装置１の外部に備える。 As in the configuration of FIG. 7, the liquid crystal substrate inspection apparatus 1 includes an inspection chamber 2 including a prober 20 for inspecting a liquid crystal substrate, and a load lock chamber 3 that carries the liquid crystal substrate 13 into and out of the inspection chamber 2. Prepare. The prober 20 includes a prober frame 21 provided with a plurality of probe pins. In the configuration example of FIG. 8, the probe pin contact confirmation device 4 is provided outside the liquid crystal substrate inspection device 1.
　はじめに、液晶基板１３をロードロック室３内に搬入した後（図８（ａ））、ロードロック室３を介して検査室２に液晶基板１３を導入する（図８（ｂ））。検査室２内でプローバフレーム２１を液晶基板１３に位置合わせし、プローブピンを液晶基板１３の基板面に接触させ、プローブピン跡を形成する（図８（ｃ））。ここまでの工程は、図７（ａ）～図７（ｃ）と同様である。 First, after the liquid crystal substrate 13 is carried into the load lock chamber 3 (FIG. 8A), the liquid crystal substrate 13 is introduced into the inspection chamber 2 through the load lock chamber 3 (FIG. 8B). The prober frame 21 is aligned with the liquid crystal substrate 13 in the inspection chamber 2, and the probe pins are brought into contact with the substrate surface of the liquid crystal substrate 13 to form probe pin marks (FIG. 8C). The steps up to here are the same as those in FIGS. 7A to 7C.
　プローブピン跡を形成した液晶基板１３を、検査室２からロードロック室３を介して、ロードロック室３外に設けたプローブピンコンタクト確認装置４に搬送し（図８（ｄ））、プローブピンコンタクト確認装置４によってプローブピンと電極とのコンタクト確認を行う（図８（ｅ））。 The liquid crystal substrate 13 on which the probe pin mark is formed is transported from the inspection chamber 2 to the probe pin contact confirmation device 4 provided outside the load lock chamber 3 through the load lock chamber 3 (FIG. 8D). The contact confirmation device 4 confirms the contact between the probe pin and the electrode (FIG. 8 (e)).
　本発明のプローブピンコンタクト確認装置は、液晶基板検査装置の他、有機ＥＬディスプレイなどに使われる有機ＥＬ基板の他、半導体基板を検査する検査装置に適用することができる。 The probe pin contact confirmation device of the present invention can be applied to an inspection device for inspecting a semiconductor substrate in addition to an organic EL substrate used for an organic EL display or the like in addition to a liquid crystal substrate inspection device.

Claims (7)

  1. 　ガラス基板の全面を下方から支持する支持部と、
    　前記支持部で支持されたガラス基板の下面を、ガラス基板の下方から照射する光源と、
    　前記ガラス基板の下方位置において前記光源を水平方向に移動する光源駆動機構とを備え、
    　前記光源駆動機構は、前記光源をガラス基板に対して水平方向に移動し、前記光源がガラス基板を照射する照射位置を位置決めし、
    　前記ガラス基板を透過した透過光によって、前記ガラス基板上においてプローブピンの接触で形成されたプローブピン跡を確認し、当該プローブピン跡によってプローブピンとガラス基板に設けられた電極との接触位置を確認することを特徴とするプローブピンコンタクト確認装置。     A support part for supporting the entire surface of the glass substrate from below;
    A light source for irradiating the lower surface of the glass substrate supported by the support portion from below the glass substrate;
    A light source driving mechanism for moving the light source in a horizontal direction at a position below the glass substrate,
    The light source driving mechanism moves the light source in a horizontal direction with respect to the glass substrate, positions the irradiation position where the light source irradiates the glass substrate,
    The probe pin mark formed by the contact of the probe pin on the glass substrate is confirmed by the transmitted light transmitted through the glass substrate, and the contact position between the probe pin and the electrode provided on the glass substrate is confirmed by the probe pin mark. A probe pin contact confirmation device.
  2. 　前記プローブピン跡は、少なくともガラス基板に設けられた電極上に貼り付けられた位置確認用シール材に形成されたプローブピンの痕跡であることを特徴とする、請求項１に記載のプローブピンコンタクト確認装置。 2. The probe pin contact according to claim 1, wherein the probe pin trace is a trace of a probe pin formed on a position confirmation sealing material affixed on at least an electrode provided on a glass substrate. Confirmation device.
  3. 　前記光源は、前記ガラス基板の少なくとも一部の面を照射する面光源であることを特徴とする、請求項１又は２に記載のプローブピンコンタクト確認装置。 3. The probe pin contact confirmation device according to claim 1, wherein the light source is a surface light source that irradiates at least a part of the surface of the glass substrate.
  4. 　前記透過光を撮像する撮像装置および当該撮像装置を水平方向に移動する撮像装置駆動機構を備え、
    　前記撮像装置は、前記光源および前記ガラス基板を通る光軸上に配置し、前記光源駆動機構および前記撮像装置駆動機構を同期して連続移動あるいは間歇移動することを特徴とする、請求項１から３の何れかに記載のプローブピンコンタクト確認装置。     An imaging device that images the transmitted light and an imaging device drive mechanism that moves the imaging device in a horizontal direction,
    The image pickup apparatus is disposed on an optical axis passing through the light source and the glass substrate, and continuously moves or intermittently moves the light source drive mechanism and the image pickup apparatus drive mechanism synchronously. 4. The probe pin contact confirmation device according to any one of 3 above.
  5. 　前記撮像装置は、一つの撮像画像内に複数のプローブピン跡を撮像する撮像倍率を有することを特徴とする請求項４に記載のプローブピンコンタクト確認装置。 5. The probe pin contact confirmation device according to claim 4, wherein the imaging device has an imaging magnification for imaging a plurality of probe pin traces in one captured image.
  6. 　液晶基板の電極にプローブピンを接触させて液晶基板に検査信号を印加する液晶基板検査用プローバを有する液晶基板検査装置であって、
    　液晶基板検査用プローバを備える検査室と、
    　前記検査室との間で液晶基板の搬出入を行うロードロック室とを備え、
    　前記ロードロック室は、前記請求項１から請求項５の何れか一つに記載のプローブピンコンタクト確認装置を備え、
    　前記検査室において、前記プローブピンを前記液晶基板に接触させてプローブピン跡を形成し、
    　前記プローブピンコンタクト確認装置は、前記検査室から前記ロードロック室内に搬入した液晶基板のプローブピン跡を確認することを特徴とする液晶基板検査装置。     A liquid crystal substrate inspection apparatus having a prober for inspecting a liquid crystal substrate that applies an inspection signal to the liquid crystal substrate by bringing a probe pin into contact with an electrode of the liquid crystal substrate,
    An inspection room equipped with a prober for inspecting a liquid crystal substrate;
    A load lock chamber for carrying in and out of the liquid crystal substrate with the inspection room,
    The load lock chamber includes the probe pin contact confirmation device according to any one of claims 1 to 5,
    In the examination room, the probe pin is brought into contact with the liquid crystal substrate to form a probe pin mark,
    The probe pin contact confirmation device confirms a probe pin mark of a liquid crystal substrate carried into the load lock chamber from the inspection chamber.
  7. 　液晶基板の電極にプローブピンを接触させて液晶基板に検査信号を印加する液晶基板検査用プローバを有する液晶基板検査装置であって、
    　液晶基板検査用プローバを備える検査室と、
    　前記検査室との間で液晶基板の搬出入を行うロードロック室と、
    　前記請求項１から請求項５の何れか一つに記載のプローブピンコンタクト確認装置とを備え、
    　前記検査室において、前記プローブピンを前記液晶基板に接触させてプローブピン跡を形成し、
    　前記液晶基板を、前記検査室から前記ロードロック室を通ってプローブピンコンタクト確認装置に搬送し、
    　前記プローブピンコンタクト確認装置によって前記搬送した液晶基板のプローブピン跡を確認することを特徴とする液晶基板検査装置。     A liquid crystal substrate inspection apparatus having a prober for inspecting a liquid crystal substrate that applies an inspection signal to the liquid crystal substrate by bringing a probe pin into contact with an electrode of the liquid crystal substrate,
    An inspection room equipped with a prober for inspecting a liquid crystal substrate;
    A load lock chamber for carrying in and out of the liquid crystal substrate to and from the inspection room;
    The probe pin contact confirmation device according to any one of claims 1 to 5,
    In the examination room, the probe pin is brought into contact with the liquid crystal substrate to form a probe pin mark,
    The liquid crystal substrate is transported from the inspection chamber to the probe pin contact confirmation device through the load lock chamber,
    A liquid crystal substrate inspection apparatus, wherein a probe pin mark of the conveyed liquid crystal substrate is confirmed by the probe pin contact confirmation device.
PCT/JP2008/066562 2008-09-12 2008-09-12 Probe pin contact checking apparatus and liquid crystal substrate inspection apparatus WO2010029637A1 (en)

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Cited By (1)

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JP5163749B2 (en) * 2008-12-16 2013-03-13 株式会社島津製作所 Vacuum drawing method for liquid crystal array inspection apparatus system, liquid crystal array inspection apparatus system, and liquid crystal array inspection apparatus

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JPH075078A (en) * 1991-12-12 1995-01-10 Tokyo Kasoode Kenkyusho:Kk Probe card inspection method
JP2002098934A (en) * 2000-09-25 2002-04-05 Casio Comput Co Ltd Inspection device
JP2007273631A (en) * 2006-03-30 2007-10-18 Tokyo Electron Ltd Method of detecting end position of probe and storage medium recorded therewith, and probe device
WO2008068845A1 (en) * 2006-12-05 2008-06-12 Shimadzu Corporation Pallet conveyance device and substrate inspection device

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JPH075078A (en) * 1991-12-12 1995-01-10 Tokyo Kasoode Kenkyusho:Kk Probe card inspection method
JP2002098934A (en) * 2000-09-25 2002-04-05 Casio Comput Co Ltd Inspection device
JP2007273631A (en) * 2006-03-30 2007-10-18 Tokyo Electron Ltd Method of detecting end position of probe and storage medium recorded therewith, and probe device
WO2008068845A1 (en) * 2006-12-05 2008-06-12 Shimadzu Corporation Pallet conveyance device and substrate inspection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163749B2 (en) * 2008-12-16 2013-03-13 株式会社島津製作所 Vacuum drawing method for liquid crystal array inspection apparatus system, liquid crystal array inspection apparatus system, and liquid crystal array inspection apparatus

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