Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/10—Integrated devices
  • H10F39/12—Image sensors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
  • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/10—Integrated devices
  • H10F39/12—Image sensors
  • H10F39/199—Back-illuminated image sensors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/805—Coatings
  • H10F39/8053—Colour filters
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

• the present invention relates generally to electronic image sensors for use in digital cameras and other types of imaging devices, and more particularly to processing techniques for use in forming backside illuminated image sensors.
• a typical electronic image sensor comprises a number of light sensitive picture elements ("pixels") arranged in a two-dimensional array. Such an image sensor may be configured to produce a color image by forming an appropriate color filter array (CFA) over the pixels.
• CFA color filter array
• an image sensor may be implemented using complementary metal-oxide-semiconductor (CMOS) circuitry.
• CMOS complementary metal-oxide-semiconductor
• each pixel typically comprises a photodiode and other circuitry elements that are formed in a silicon sensor layer on a silicon substrate.
• One or more dielectric layers are usually formed above the silicon sensor layer and may incorporate additional circuitry elements as well as multiple levels of metallization used to form interconnects.
• the side of the image sensor on which the dielectric layers and associated levels of metallization are formed is commonly referred to as the frontside, while the side having the silicon substrate is referred to as the backside.
• a frontside illuminated image sensor In a frontside illuminated image sensor, light from a subject scene is incident on the frontside of the image sensor, and the silicon substrate is relatively thick. However, the presence of metallization level interconnects and various other features associated with the dielectric layers on the frontside of the image sensor can adversely impact the fill factor and quantum efficiency of the image sensor.
• a backside illuminated image sensor addresses the fill factor and quantum efficiency issues associated with the frontside dielectric layers by thinning or removing the thick silicon substrate and arranging the image sensor such that light from a subject scene is incident on the backside of the image sensor.
• the incident light is no longer impacted by metallization level interconnects and other features of the dielectric layers, and fill factor and quantum efficiency are improved.
• a problem that can arise in backside illuminated image sensors relates to ensuring proper alignment between image sensor features that are formed using frontside processing operations with those formed using backside processing operations.
• photodiodes may be formed in the sensor layer using frontside processing operations while corresponding color filter elements of the above-noted CFA are formed using backside processing operations.
• Frontside features features formed using frontside processing operations are referred to as frontside features
• backside features features formed using backside processing operations
• Typical conventional approaches utilize frontside alignment marks to align different lithography masks that are applied in various frontside processing operations used to form the frontside features.
• such techniques fail to adequately address the alignment of backside features with the frontside features.
• Illustrative embodiments of the invention provide backside illuminated image sensors having improved performance through the use of polysilicon alignment marks that reduce alignment mismatch between CFA elements and their respective photodiodes.
• a process of forming CFA alignment marks in a backside illuminated image sensor is provided.
• the alignment mark formation process may be part of a wafer level process for forming a plurality of image sensors each having a pixel array configured for backside illumination, with the image sensors being formed utilizing an image sensor wafer.
• the image sensor wafer comprises at least a substrate and a sensor layer formed over the substrate.
• the alignment mark formation process comprises the steps of forming CFA alignment mark openings in the sensor layer, and forming an epitaxial layer on a frontside surface of the sensor layer.
• the epitaxial layer comprises polysilicon CFA alignment marks formed in locations corresponding to respective ones of the CFA alignment mark openings in the sensor layer.
• the image sensor wafer comprises a silicon-on-insulator (SOI) wafer having a buried oxide layer arranged between the substrate and the sensor layer.
• the image sensor wafer may be further processed by exposing a backside surface of the oxide layer, and forming CFAs on the backside surface of the oxide layer in alignment with the CFA alignment marks.
• This approach advantageously provides direct alignment between a frontside feature of the image sensor, namely the CFA alignment marks, and a backside feature of the image sensor, namely the CFAs formed on the backside surface of the oxide layer.
• other frontside features such as photosensitive elements formed in the sensor layer, can also be aligned to the CFA alignment marks, accurate alignment between the color filter elements of the CFAs and their associated photosensitive elements is thereby ensured.
• a backside illuminated image sensor includes a sensor layer comprising photosensitive elements of the pixel array, an epitaxial layer formed on a frontside surface of the sensor layer, and a CFA formed on a backside surface of the sensor layer.
• the epitaxial layer comprises polysilicon CFA alignment marks formed in locations corresponding to respective CFA alignment mark openings in the frontside surface of the sensor layer.
• the CFA is aligned to the CFA alignment marks of the epitaxial layer.
• a backside illuminated image sensor in accordance with the invention may be advantageously implemented in a digital camera or other type of imaging device. Improved performance is provided in such a device through better alignment of CFAs with their associated photosensitive elements, without significantly increasing image sensor die size or cost.
• FIG. 1 is a block diagram of a digital camera having a backside illuminated image sensor configured in accordance with an illustrative embodiment of the invention
• FIGS. 2 through 5 are cross-sectional views showing portions of a backside illuminated image sensor at various steps in an exemplary process for forming such an image sensor, in accordance with an illustrative embodiment of the invention.
• FIG. 6 is a plan view of an image sensor wafer comprising multiple image sensors formed using the exemplary process of FIGS. 2 through 5.
• FIG. 1 shows a digital camera 10 in an illustrative embodiment of the invention, hi the digital camera, light from a subject scene is input to an imaging stage 12.
• the imaging stage may comprise conventional elements such as a lens, a neutral density filter, an iris and a shutter.
• the light is focused by the imaging stage 12 to form an image on an image sensor 14, which converts the incident light to electrical signals.
• the digital camera 10 further includes a processor 16, a memory 18, a display 20, and one or more additional input/output (I/O) elements 22.
• I/O input/output
• the imaging stage 12 may be integrated with the image sensor 14, and possibly one or more additional elements of the digital camera 10, to form a compact camera module.
• the image sensor 14 is assumed in the present embodiment to be a CMOS image sensor, although other types of image sensors may be used in implementing the invention. More particularly, the image sensor 14 comprises a backside illuminated image sensor that is formed in a manner to be described below in conjunction with FIGS. 2 through 5.
• the image sensor generally comprises a pixel array having a plurality of pixels arranged in rows and columns and may include additional circuitry associated with sampling and readout of the pixel array, such as signal generation circuitry, signal processing circuitry, row and column selection circuitry, etc.
• This sampling and readout circuitry may comprise, for example, an analog signal processor for processing analog signals read out from the pixel array and an analog-to-digital converter for converting such signals to a digital form.
• sampling and readout circuitry may be arranged external to the image sensor, or formed integrally with the pixel array, for example, on a common integrated circuit with photodiodes and other elements of the pixel array.
• the image sensor 14 will typically be implemented as a color image sensor having an associated CFA pattern.
• CFA patterns that may be used with the image sensor 14 include those described in the above-cited U.S. Patent Application Publication No. 2007/0024931, although other CFA patterns may be used in other embodiments of the invention.
• a conventional Bayer pattern may be used, as disclosed in U.S. Patent No. 3,971 ,065, entitled "Color Imaging Array,” which is incorporated by reference herein.
• the processor 16 may comprise, for example, a microprocessor, a central processing unit (CPU), an application-specific integrated circuit (ASIC), a digital signal processor (DSP), or other processing device, or combinations of multiple such devices.
• Various elements of the imaging stage 12 and the image sensor 14 may be controlled by timing signals or other signals supplied from the processor 16.
• the memory 18 may comprise any type of memory, such as, for example, random access memory (RAM), read-only memory (ROM), Flash memory, disk-based memory, removable memory, or other types of storage elements, in any combination.
• RAM random access memory
• ROM read-only memory
• Flash memory disk-based memory
• removable memory or other types of storage elements, in any combination.
• Functionality associated with sampling and readout of the pixel array and the processing of corresponding image data may be implemented at least in part in the form of software that is stored in memory 18 and executed by processor 16.
• a given image captured by the image sensor 14 may be stored by the processor 16 in memory 18 and presented on display 20.
• the display 20 is typically an active matrix color liquid crystal display (LCD), although other types of displays may be used.
• the additional I/O elements 22 may comprise, for example, various on-screen controls, buttons or other user interfaces, network interfaces, memory card interfaces, etc.
• the digital camera as shown in FIG. 1 may comprise additional or alternative elements of a type known to those skilled in the art. Elements not specifically shown or described herein may be selected from those known in the art. As noted previously, the present invention may be implemented in a wide variety of other types of digital cameras or imaging devices. Also, as mentioned above, certain aspects of the embodiments described herein may be implemented at least in part in the form of software executed by one or more processing elements of an imaging device. Such software can be implemented in a straightforward manner given the teachings provided herein, as will be appreciated by those skilled in the art.
• the image sensor 14 may be fabricated on a silicon substrate or other type of substrate.
• each pixel of the pixel array includes a photodiode and associated circuitry for measuring the light level at that pixel.
• Such circuitry may comprise, for example, transfer gates, reset transistors, select transistors, output transistors, and other elements, configured in a well-known conventional manner.
• FIGS. 2 through 5 illustrate the process of forming the backside illuminated image sensor 14 in one embodiment of the present invention. It should be noted that these figures are simplified in order to clearly illustrate various aspects of the present invention, and are not necessarily drawn to scale. A given embodiment may include a variety of other features or elements that are not explicitly illustrated but would be familiar to one skilled in the art as being commonly associated with image sensors of the general type described.
• FIG. 2 shows a portion of an image sensor wafer 200 at the completion of a number of initial steps of a conventional CMOS process flow. As these steps are well known in the art, they will not be described in detail herein.
• the image sensor wafer 200 at this stage comprises a silicon substrate 202, a buried oxide (BOX) layer 204 formed over the substrate, and a silicon sensor layer 206 formed over the oxide layer.
• BOX buried oxide
• the image sensor wafer 200 is further processed to form a plurality of image sensors each having a pixel array configured for backside illumination. It should be noted that the image sensor formation process to be described will focus on the formation of CFA alignment marks. Other aspects of image sensor formation, such as the formation of photodiodes and associated circuitry of the pixel array in sensor layer 206, and the formation of additional features, such as circuitry, conductors, bond pads and so on, may be implemented using conventional techniques that are familiar to one skilled in the art.
• the image sensor wafer 200 has a frontside and a backside as indicated in FIG. 2.
• the frontside refers generally to the side of an image sensor on which dielectric layers and associated levels of metallization are formed, while the side having the silicon substrate is referred to as the backside.
• the terms "frontside” and “backside” will be used herein to denote particular sides of an image sensor wafer or an image sensor formed from such a wafer, as well as sides of particular layers of the image sensor wafer or corresponding image sensor.
• the sensor layer 206 has a frontside surface 206F and a backside surface 206B.
• the illustrative embodiments relate to backside illuminated image sensors, that is, image sensors in which light from a subject scene is incident on the photodiodes or other photosensitive elements of the pixel array from a backside of the sensor.
• backside illuminated image sensors that is, image sensors in which light from a subject scene is incident on the photodiodes or other photosensitive elements of the pixel array from a backside of the sensor.
• terms such as “on” or “over” when used in conjunction with layers of an image sensor wafer or corresponding image sensor are intended to be construed broadly, and therefore should not be interpreted to preclude the presence of one or more intervening layers or other intervening image sensor features or elements.
• a given layer that is described herein as being formed on or formed over another layer may be separated from the latter layer by one or more additional layers.
• the image sensor wafer 200 illustrated in FIG. 2 is an example of a silicon-on-insulator (SOI) wafer.
• the thickness of the silicon sensor layer 206 may be approximately 1 to 6 micrometers ( ⁇ m)
• the thickness of the buried oxide layer 204 may be approximately .1 to .5 ⁇ m, although other thicknesses may be used.
• the silicon substrate 202 is typically substantially thicker than the sensor layer or buried oxide layer.
• Alternative embodiments of the invention may utilize other types of wafers to form backside illuminated image sensors, such as, for example, epitaxial wafers or bulk semiconductor wafers that do not include a buried oxide layer, although an SOI wafer generally provides a smoother surface for backside processing.
• the image sensor wafer 200 is further processed in the manner shown in FIGS. 3 through 5 in forming the backside illuminated image sensor 14 of FIG. 1.
• CFA alignment mark openings 302 and 304 are formed in the sensor layer 206 as shown. These openings may be formed, for example, using conventional lithography operations such as photoresist deposition followed by exposing, developing, etching and stripping. The openings are patterned in accordance with a desired alignment mark pattern, which will generally depend upon the particular type of lithography equipment being used to process the image sensor wafer.
• the CFA alignment mark openings 302 and 304 are illustratively shown in FIG. 3 as being etched through the sensor layer 206 to expose an underlying frontside surface of the buried oxide layer 204. This is an example of an arrangement in which the openings are etched down to the oxide layer. In other embodiments, the depth of the etching operation may be adjusted such that the openings terminate within the sensor layer, or extend through the sensor layer and terminate in the oxide layer.
• An epitaxial layer 400 is then formed on a frontside surface of the _ sensor layer 206, as illustrated in FIG. 4.
• This layer may be formed, for example, by epitaxial growth of silicon through deposition over the frontside surface of the sensor layer 206.
• the unetched portions of the frontside surface of the sensor layer generally comprise single crystalline silicon, while the etched openings 302, 304 expose the frontside surface of the underlying buried oxide layer 204.
• Epitaxial growth over single crystalline silicon will result in single crystalline silicon having the same orientation as the underlying single crystalline silicon, while epitaxial growth over an oxide will exhibit no particular orientation, but will instead be in the form of polycrystalline silicon ("polysilicon").
• the formation of the epitaxial layer 400 results in the formation of polysilicon CFA alignment marks 402, 404 in locations corresponding to respective ones of the CFA alignment mark openings 302, 304 in the sensor layer. It can also be seen that the epitaxial growth produces gaps in respective areas denoted 412, 414 over the polysilicon alignment marks 402 and 404 as shown.
• the polysilicon CFA alignment marks 402, 404 in this example are shown as having a cross-sectional shape that is substantially trapezoidal. Other mark shapes may be used, again depending upon the particular characteristics and requirements of the lithography equipment used to process the image sensor wafer.
• FIG. 5 illustrates the image sensor wafer 200 after further processing operations.
• a dielectric layer 500 is formed on a frontside surface of the epitaxial layer 400.
• the dielectric layer in this embodiment comprises multiple layers of dielectric material and may include, for example, an interlayer dielectric (ILD) and an intermetal dielectric (IMD) that separates multiple levels of metallization.
• ILD interlayer dielectric
• IMD intermetal dielectric
• Various image sensor features such as interconnects, gates or other circuitry elements may be formed within the dielectric layer 500 using conventional techniques. It can be seen that at least a portion of the dielectric layer 500 fills the gaps in areas 412, 414.
• FIG. 5 illustrates the image sensor wafer 200 after further processing operations.
• a dielectric layer 500 is formed on a frontside surface of the epitaxial layer 400.
• the dielectric layer in this embodiment comprises multiple layers of dielectric material and may include, for example, an interlayer dielectric (ILD) and an intermetal dielectric (IMD) that
• a handle wafer 502 is attached to a frontside surface of layer 500.
• the handle wafer 502 may be attached using, for example, low temperature oxide-to-oxide bonding.
• the substrate 202 is then removed to expose a backside surface of the buried oxide layer 204.
• the substrate may be removed using, for example, grinding, polishing or etching techniques, in any combination.
• the substrate is removed in its entirety, exposing the buried oxide layer 204 at the backside of the wafer.
• the substrate may be thinned rather than completely removed.
• each of the pixel arrays of the image sensor wafer has a corresponding CFA which includes color filter elements 510 that are arranged over respective photosensitive elements 512 of the sensor layer 206.
• the photosensitive elements may comprise photodiodes.
• a microlens may be associated with each of the color filter elements 510 of CFA layer 504.
• the color filter elements 510 and their associated microlenses are formed in alignment with the polysilicon alignment marks 402, 404.
• the photosensitive elements 512 are also formed in alignment with the polysilicon alignment marks 402, 404. This arrangement ensures accurate alignment between the photosensitive elements 512 of the sensor layer 206 and the corresponding color filter elements 510 of the CFA layer 504.
• the particular lithographic techniques that may be used to align the CFAs, microlenses and photosensitive elements to alignment marks such as the polysilicon alignment marks 402, 404 are well known in the art and therefore not described in detail herein.
• the image sensor wafer as shown in FIG. 5 is then subject to further processing operations in order to form the image sensor 14 utilized in digital camera 10 of FIG. 1.
• the resulting processed image sensor wafer is diced into a plurality of image sensors configured for backside illumination, one of which is the image sensor 14 in digital camera 10.
• the wafer dicing operation will be described in greater detail below in conjunction with FIG. 6.
• the handle wafer 502 in this embodiment is not removed prior to dicing, but instead serves as a permanent handle wafer, portions of which remain part of respective ones of the image sensors that are separated from one another in the dicing operation.
• a temporary carrier wafer may be used in place of the handle wafer 502.
• the temporary carrier wafer may be attached using epoxy or another suitable adhesive.
• the substrate 202 is removed as described above.
• a transparent cover sheet comprising transparent covers overlying respective ones of the CFAs may then be attached to the backside surface of the image sensor wafer prior to removing the temporary carrier wafer.
• Each such glass cover may comprise a central cavity arranged over its corresponding CFA and further comprise peripheral supports secured to the backside surface of the oxide layer 204 via epoxy.
• the transparent cover sheet may be formed of glass or another transparent material. Such a cover sheet may be attached to the wafer as a single sheet which is divided into separate covers when the image sensors are diced from the wafer.
• FIG. 6 shows a plan view of an image sensor wafer 600 comprising a plurality of image sensors 602.
• the image sensors 602 are formed through wafer level processing of the image sensor wafer 600 as described in conjunction with FIGS. 2 through 5.
• the image sensors are then separated from one another by dicing the wafer along dicing lines 604.
• a given one of the image sensors 602 corresponds to image sensor 14 in digital camera 10 of FIG. 1.
• the above-described illustrative embodiments advantageously provide an improved processing arrangement for forming a backside illuminated image sensor.
• the CFA alignment marks 402 and 404 are frontside alignment marks that can be used to directly align a backside feature, illustratively the color filter elements 510 of the CFA layer 504. This allows for better alignment of the color filter elements with their associated photosensitive elements, thereby improving image sensor performance.
• CFA color filter array

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• 2008
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