WO2010005246A3 - Dispositif de transfert de substrats - Google Patents
Dispositif de transfert de substrats Download PDFInfo
- Publication number
- WO2010005246A3 WO2010005246A3 PCT/KR2009/003759 KR2009003759W WO2010005246A3 WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3 KR 2009003759 W KR2009003759 W KR 2009003759W WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- conveyed
- conveying device
- workbench
- conveying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
- Intermediate Stations On Conveyors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980126390.4A CN102113108B (zh) | 2008-07-11 | 2009-07-09 | 基板转送装置 |
JP2011517350A JP2011527823A (ja) | 2008-07-11 | 2009-07-09 | 基板移送装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080067805A KR100885877B1 (ko) | 2008-07-11 | 2008-07-11 | 기판 이송장치 |
KR10-2008-0067805 | 2008-07-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2010005246A2 WO2010005246A2 (fr) | 2010-01-14 |
WO2010005246A3 true WO2010005246A3 (fr) | 2010-04-29 |
WO2010005246A9 WO2010005246A9 (fr) | 2010-07-08 |
Family
ID=40682178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/003759 WO2010005246A2 (fr) | 2008-07-11 | 2009-07-09 | Dispositif de transfert de substrats |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2011527823A (fr) |
KR (1) | KR100885877B1 (fr) |
CN (1) | CN102113108B (fr) |
TW (1) | TWI370798B (fr) |
WO (1) | WO2010005246A2 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101069154B1 (ko) | 2009-05-28 | 2011-09-30 | 주식회사 케이씨텍 | 기판 처리장치 |
KR101078487B1 (ko) | 2009-09-17 | 2011-10-31 | 김재석 | 패널용 진공흡착기 유닛 및 복수개의 고무패드가 장착된 진공흡착기 |
WO2011084972A2 (fr) * | 2010-01-08 | 2011-07-14 | Kla-Tencor Corporation | Unité de support de plateau double |
US9435826B2 (en) | 2012-05-08 | 2016-09-06 | Kla-Tencor Corporation | Variable spacing four-point probe pin device and method |
US20150303090A1 (en) * | 2012-09-10 | 2015-10-22 | Applied Materials, Inc. | Substrate transfer device and method of moving substrates |
CN109160210B (zh) * | 2018-09-25 | 2024-06-07 | 中国建材国际工程集团有限公司 | 板材存储输送系统及其使用方法 |
CN112239069A (zh) * | 2019-07-19 | 2021-01-19 | 亚智科技股份有限公司 | 牙叉式基板运输装置及其方法 |
CN111848218B (zh) * | 2020-07-30 | 2022-11-08 | 固安浩瀚光电科技有限公司 | 一种半导体陶瓷浸泡烘干一体装置及其使用方法 |
CN115113015A (zh) * | 2021-03-18 | 2022-09-27 | 深圳麦逊电子有限公司 | 一种fpc测试运料装置、测试系统及其测试方法 |
CN116946487A (zh) * | 2023-09-20 | 2023-10-27 | 长春市景来科技有限公司 | 一种人工智能物流包裹包装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100617453B1 (ko) * | 2006-04-27 | 2006-09-01 | 주식회사 인아텍 | 기판 이송시스템 |
KR100617454B1 (ko) * | 2006-02-23 | 2006-09-05 | 주식회사 인아텍 | 기판 이송시스템 및 이를 이용한 기판 이송방법 |
JP2007035792A (ja) * | 2005-07-25 | 2007-02-08 | Tokyo Electron Ltd | 基板の搬送装置 |
JP2007176631A (ja) * | 2005-12-27 | 2007-07-12 | Tokyo Electron Ltd | 基板搬送システム |
KR100839570B1 (ko) * | 2007-12-31 | 2008-06-20 | 주식회사 인아텍 | 기판 이송방법 및 장치 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2913354B2 (ja) * | 1993-02-26 | 1999-06-28 | 東京エレクトロン株式会社 | 処理システム |
JP4476133B2 (ja) * | 2005-02-24 | 2010-06-09 | 東京エレクトロン株式会社 | 処理システム |
-
2008
- 2008-07-11 KR KR1020080067805A patent/KR100885877B1/ko active IP Right Grant
-
2009
- 2009-07-09 JP JP2011517350A patent/JP2011527823A/ja not_active Ceased
- 2009-07-09 TW TW098123225A patent/TWI370798B/zh active
- 2009-07-09 WO PCT/KR2009/003759 patent/WO2010005246A2/fr active Application Filing
- 2009-07-09 CN CN200980126390.4A patent/CN102113108B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035792A (ja) * | 2005-07-25 | 2007-02-08 | Tokyo Electron Ltd | 基板の搬送装置 |
JP2007176631A (ja) * | 2005-12-27 | 2007-07-12 | Tokyo Electron Ltd | 基板搬送システム |
KR100617454B1 (ko) * | 2006-02-23 | 2006-09-05 | 주식회사 인아텍 | 기판 이송시스템 및 이를 이용한 기판 이송방법 |
KR100617453B1 (ko) * | 2006-04-27 | 2006-09-01 | 주식회사 인아텍 | 기판 이송시스템 |
KR100839570B1 (ko) * | 2007-12-31 | 2008-06-20 | 주식회사 인아텍 | 기판 이송방법 및 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR100885877B1 (ko) | 2009-02-26 |
JP2011527823A (ja) | 2011-11-04 |
WO2010005246A9 (fr) | 2010-07-08 |
WO2010005246A2 (fr) | 2010-01-14 |
CN102113108B (zh) | 2013-07-10 |
CN102113108A (zh) | 2011-06-29 |
TWI370798B (en) | 2012-08-21 |
TW201006748A (en) | 2010-02-16 |
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