WO2010005246A3 - Dispositif de transfert de substrats - Google Patents

Dispositif de transfert de substrats Download PDF

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Publication number
WO2010005246A3
WO2010005246A3 PCT/KR2009/003759 KR2009003759W WO2010005246A3 WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3 KR 2009003759 W KR2009003759 W KR 2009003759W WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conveyed
conveying device
workbench
conveying
Prior art date
Application number
PCT/KR2009/003759
Other languages
English (en)
Korean (ko)
Other versions
WO2010005246A9 (fr
WO2010005246A2 (fr
Inventor
신동혁
Original Assignee
(주)인아텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)인아텍 filed Critical (주)인아텍
Priority to CN200980126390.4A priority Critical patent/CN102113108B/zh
Priority to JP2011517350A priority patent/JP2011527823A/ja
Publication of WO2010005246A2 publication Critical patent/WO2010005246A2/fr
Publication of WO2010005246A3 publication Critical patent/WO2010005246A3/fr
Publication of WO2010005246A9 publication Critical patent/WO2010005246A9/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
  • Intermediate Stations On Conveyors (AREA)

Abstract

Un problème associé aux dispositifs de transfert de substrats est que, quand un premier substrat (1) a été placé sur un élévateur d'alimentation, (11) et est transféré d'un plateau supérieur (10) à un plateau inférieur (20), une attente est imposée à un deuxième substrat (2) qui a fini de subir un processus de nettoyage par UV sur le plateau supérieur (10) (Figure 2); par conséquent, la productivité est réduite en raison du retard d'approvisionnement d'autres substrats par la section (15) d'alimentation et de décharge. Pour y remédier, l'invention présente comprend un dispositif de transfert de substrats dans lequel un substrat fourni à partir d'une première position supérieure est transféré d'une position haute à une deuxième position inférieure tandis qu'un substrat qui a été transféré à la deuxième position inférieure est déplacé et déchargé au moyen d'un rail de transfert. Ledit dispositif de transfert de substrats est tel qu'un premier et un deuxième support tournant supérieurs et un premier et un deuxième support tournant inférieurs tournent en étant espacés l'un de l'autre verticalement.
PCT/KR2009/003759 2008-07-11 2009-07-09 Dispositif de transfert de substrats WO2010005246A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980126390.4A CN102113108B (zh) 2008-07-11 2009-07-09 基板转送装置
JP2011517350A JP2011527823A (ja) 2008-07-11 2009-07-09 基板移送装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080067805A KR100885877B1 (ko) 2008-07-11 2008-07-11 기판 이송장치
KR10-2008-0067805 2008-07-11

Publications (3)

Publication Number Publication Date
WO2010005246A2 WO2010005246A2 (fr) 2010-01-14
WO2010005246A3 true WO2010005246A3 (fr) 2010-04-29
WO2010005246A9 WO2010005246A9 (fr) 2010-07-08

Family

ID=40682178

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003759 WO2010005246A2 (fr) 2008-07-11 2009-07-09 Dispositif de transfert de substrats

Country Status (5)

Country Link
JP (1) JP2011527823A (fr)
KR (1) KR100885877B1 (fr)
CN (1) CN102113108B (fr)
TW (1) TWI370798B (fr)
WO (1) WO2010005246A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101069154B1 (ko) 2009-05-28 2011-09-30 주식회사 케이씨텍 기판 처리장치
KR101078487B1 (ko) 2009-09-17 2011-10-31 김재석 패널용 진공흡착기 유닛 및 복수개의 고무패드가 장착된 진공흡착기
WO2011084972A2 (fr) * 2010-01-08 2011-07-14 Kla-Tencor Corporation Unité de support de plateau double
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
US20150303090A1 (en) * 2012-09-10 2015-10-22 Applied Materials, Inc. Substrate transfer device and method of moving substrates
CN109160210B (zh) * 2018-09-25 2024-06-07 中国建材国际工程集团有限公司 板材存储输送系统及其使用方法
CN112239069A (zh) * 2019-07-19 2021-01-19 亚智科技股份有限公司 牙叉式基板运输装置及其方法
CN111848218B (zh) * 2020-07-30 2022-11-08 固安浩瀚光电科技有限公司 一种半导体陶瓷浸泡烘干一体装置及其使用方法
CN115113015A (zh) * 2021-03-18 2022-09-27 深圳麦逊电子有限公司 一种fpc测试运料装置、测试系统及其测试方法
CN116946487A (zh) * 2023-09-20 2023-10-27 长春市景来科技有限公司 一种人工智能物流包裹包装装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100617453B1 (ko) * 2006-04-27 2006-09-01 주식회사 인아텍 기판 이송시스템
KR100617454B1 (ko) * 2006-02-23 2006-09-05 주식회사 인아텍 기판 이송시스템 및 이를 이용한 기판 이송방법
JP2007035792A (ja) * 2005-07-25 2007-02-08 Tokyo Electron Ltd 基板の搬送装置
JP2007176631A (ja) * 2005-12-27 2007-07-12 Tokyo Electron Ltd 基板搬送システム
KR100839570B1 (ko) * 2007-12-31 2008-06-20 주식회사 인아텍 기판 이송방법 및 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2913354B2 (ja) * 1993-02-26 1999-06-28 東京エレクトロン株式会社 処理システム
JP4476133B2 (ja) * 2005-02-24 2010-06-09 東京エレクトロン株式会社 処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035792A (ja) * 2005-07-25 2007-02-08 Tokyo Electron Ltd 基板の搬送装置
JP2007176631A (ja) * 2005-12-27 2007-07-12 Tokyo Electron Ltd 基板搬送システム
KR100617454B1 (ko) * 2006-02-23 2006-09-05 주식회사 인아텍 기판 이송시스템 및 이를 이용한 기판 이송방법
KR100617453B1 (ko) * 2006-04-27 2006-09-01 주식회사 인아텍 기판 이송시스템
KR100839570B1 (ko) * 2007-12-31 2008-06-20 주식회사 인아텍 기판 이송방법 및 장치

Also Published As

Publication number Publication date
KR100885877B1 (ko) 2009-02-26
JP2011527823A (ja) 2011-11-04
WO2010005246A9 (fr) 2010-07-08
WO2010005246A2 (fr) 2010-01-14
CN102113108B (zh) 2013-07-10
CN102113108A (zh) 2011-06-29
TWI370798B (en) 2012-08-21
TW201006748A (en) 2010-02-16

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