WO2010003278A1 - Substance de conditionnement ignifuge pour élément électronique - Google Patents

Substance de conditionnement ignifuge pour élément électronique Download PDF

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Publication number
WO2010003278A1
WO2010003278A1 PCT/CN2008/001509 CN2008001509W WO2010003278A1 WO 2010003278 A1 WO2010003278 A1 WO 2010003278A1 CN 2008001509 W CN2008001509 W CN 2008001509W WO 2010003278 A1 WO2010003278 A1 WO 2010003278A1
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WO
WIPO (PCT)
Prior art keywords
flame
encapsulating material
retardant
electronic components
silicone resin
Prior art date
Application number
PCT/CN2008/001509
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English (en)
Chinese (zh)
Inventor
高卫国
张艳飞
Original Assignee
天津市凯华绝缘材料有限公司
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Application filed by 天津市凯华绝缘材料有限公司 filed Critical 天津市凯华绝缘材料有限公司
Publication of WO2010003278A1 publication Critical patent/WO2010003278A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/02—Inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals

Definitions

  • the present invention relates to a flame-retardant encapsulating material for electronic components. Specifically, the present invention relates to a silicone resin flame-retardant encapsulating material for electronic components, and belongs to the technical field of electronic component packaging materials. Background technique
  • halogen flame retardant and the lanthanide synergist are used to cause the combustion to terminate spontaneously after a certain period of time, under certain circumstances, it is still a fire hazard, and the halogenated flame retardant tends to generate a large amount when burning.
  • the highly carcinogenic substance - polybrominated dibenzodioxane and polybrominated dibenzofuran, is extremely harmful. Therefore, in view of the many challenges faced by epoxy encapsulants, it is necessary to develop a flame-retardant electronic packaging material using environmentally friendly flame retardants.
  • Silicone resin is a material with both mechanical and inorganic properties. It has excellent electrical properties, high dielectric strength and electrical resistivity, low dielectric loss, and little variation over a wide range of temperatures and frequencies. It performs well in heat resistance, weather resistance, water repellency, and flame retardancy, and is suitable for packaging materials.
  • the low carbon content of methyl silicone resin has excellent non-combustible properties, and it does not need to add flame retardant to have non-combustible properties.
  • the silicone resin with slightly higher carbon content needs to add a small amount of environmentally friendly flame retardant to achieve resistance. Combustion performance. Solvent-based coating products using silicone resins as base materials have been used for insulation encapsulation of electronic components and have achieved good results.
  • xylene is commonly used as a solvent. It is well known that xylene is a toxic and flammable organic solvent, which is harmful to operators and the environment. Therefore, it is difficult to obtain widespread application.
  • the silicone resin encapsulating material can better solve the above problems.
  • the powder coating is produced by the melt extrusion method, and the organic solvent is not used in the production and use process, and the flame retardant is safe and environmentally friendly or does not need to be added with a flame retardant.
  • European Patent EP 0 950 695 A1 discloses a silicone resin composition which can be used for heat-resistant coatings, but has the following disadvantages when used for packaging coatings: (1) The thickness of the coating film can only reach several tens of micrometers, and excessive thickness tends to cause cracking and peeling of the coating film. The thickness of the coating film formed by the surface encapsulation material of the electronic component should be at least 300 ⁇ m ; (2) the curing temperature exceeds 230 ° C, and the heat resistance temperature of the electronic component generally does not exceed 180 ° C, otherwise the solder joint may fall off. public account For the Chinese patent application of CN101163748A, a silicone encapsulant is mentioned, and the product is formed by heat molding, and self-leveling by heating cannot be achieved. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a flame-retardant encapsulating material for electronic components according to the deficiencies of the prior art, wherein the encapsulating material is mainly composed of a silicone resin, which is environmentally friendly, high temperature resistant, flame retardant, and cured. Low temperature, self-leveling, good electrical insulation and so on.
  • a flame-retardant encapsulating material for electronic components are: silicone resin 15-60%;
  • a pigment and a flame retardant may be added to the constituent components, wherein the flame retardant is added in an amount of from 0 to 30% by weight based on the weight of the filler.
  • the type and amount of the pigment are selected according to the color, such as: carbon black.
  • the silicone resin is obtained by polymerizing one or more of the organochlorosilane monomers having the following structure, or by first oxidizing and then performing a polymerization reaction by an alcoholysis reaction.
  • the property parameter of the silicone resin is such that the weight content of the phenyl group and the methyl group should be ⁇ 50%, preferably ⁇ 30%; and the molar ratio of the phenyl group to the methyl group is between 0-5: 1, preferably 0.2-3.3: 1; glass transition temperature Tg>45. C.
  • the filler is at least one material selected from the group consisting of silicon micropowder, talc, mica powder, wollastonite powder and BaSO 4 , at least one or any combination of several of them.
  • the plasticizer is at least one material selected from the group consisting of silicone rubber, silicone oil, silane, at least one or any combination of several of them.
  • the catalyst is at least one material selected from the group consisting of: an organic acid complex of divalent zinc, acetyl propyl
  • the ketone aluminum, 12-aminododecanoic acid, p-toluenesulfonic acid or a salt thereof, a quaternary ammonium salt or any combination thereof may preferably be a combination of aluminum acetylacetonate and 12-aminododecanoic acid.
  • the auxiliary agent is at least one selected from the group consisting of at least one of an auxiliary agent such as an adhesion promoter, an antifoaming agent, a leveling agent, a wetting agent, and a brightener.
  • an auxiliary agent such as an adhesion promoter, an antifoaming agent, a leveling agent, a wetting agent, and a brightener.
  • the flame retardant may be selected from environmentally friendly flame retardants known in the prior art, such as: Al(OH) 3 , Mg(OH) 2 , zinc borate, ammonium polyphosphate having a degree of polymerization greater than 100, and trimeric europium At least one or a combination of several of the amine cyanurates.
  • the pigment may be a commercially available inorganic or organic pigment having a heat-resistant temperature of 200 ° C or more and which does not adversely affect the encapsulating material.
  • Another technical problem to be solved by the present invention is to provide a method for preparing a flame-retardant encapsulant for electronic components according to the deficiencies of the prior art, which comprises applying the components of the composition to the technical field of the art.
  • Common equipment and methods are fully mixed and dispersed. For example: After mixing uniformly, it is melt extruded at a certain temperature in a twin-screw extruder to obtain a composition of the present invention.
  • the silicone resin encapsulating material does not use any organic solvent during production, processing and use, and is safe and environmentally friendly;
  • the silicone resin encapsulating material uses an environmentally friendly and harmless flame retardant, or can achieve a flame retardant effect without adding a flame retardant, and does not produce a substance harmful to the human body or the environment when burned or burned by a flame. ;
  • the silicone resin encapsulating material is capable of heating self-leveling and forming a continuous glossy encapsulation layer
  • the curing temperature of the silicone resin encapsulating material is lower than 180 ° C, and is suitable for use with electronic components having solder joints;
  • the invention has the characteristics of environmental protection, high temperature resistance, flame retardancy, low curing temperature, self-leveling heating, good electrical insulation performance, etc., and is used for encapsulation of electronic components such as varistor, thermistor and ceramic capacitor. . detailed description
  • organochlorosilane monomers having the following structure:
  • One or more of the above monomers are subjected to a polymerization reaction, or alkoxylation is carried out by an alcoholysis reaction followed by a polymerization reaction to obtain a solid polysiloxane having a three-dimensional crosslinked structure.
  • R-methyl or phenyl groups dashed lines represent omitted repeating units.
  • the weight content of the phenyl group and the methyl group in the solid polysiloxane should be ⁇ 50%, preferably ⁇ 30%, and the lower the content, the better the flame retardancy; the molar ratio of the phenyl group to the methyl group is between 0-5: 1, preferably 0.2-3.3: 1, the higher the phenyl content, the slower the curing speed of the paint film, and the lower the flame retardancy, but the advantageous side is to improve the toughness of the paint film.
  • Silicone resin products that meet the above requirements are Dowcoming® 220, 233, 249, Z-6018 from Dowcoming, USA, Silres® 604, 610 from Wacker, Germany.
  • the content of the silicone resin is 15-60%, preferably 20-55%.
  • the filler may be at least one of silicon fine powder, talc powder, mica powder, wollastonite powder, BaS0 4 , or the like, and the particle size is between 150 mesh and 3000 mesh, preferably 200 mesh. -800 mesh.
  • the lamellar structure of mica powder and the rod-like structure of wollastonite can play the role of reinforcing ribs in the coating film.
  • talc can improve the toughness of the film.
  • the content of the filler is 20-80%, and for the filler having a large specific gravity, such as wollastonite powder, BaS0 4 , preferably 50-60%.
  • Plasticizers are generally used to improve the brittleness of silicone materials, improve the toughness of the coating film, and are less prone to cracking. Depending on the type, the amount may be from 1 to 20%, and may be silicone rubber, silicone oil, silicon germanium or the like which is compatible with the solid silicone, and one or a combination of them may be used in the present invention. 4. Catalyst - The catalyst is generally a complex of divalent zinc such as zinc octoate or zinc stearate with high catalytic activity, aluminum acetylacetonate, 12-aminododecanoic acid, p-toluenesulfonic acid and its salt or quaternary ammonium salt.
  • divalent zinc such as zinc octoate or zinc stearate with high catalytic activity, aluminum acetylacetonate, 12-aminododecanoic acid, p-toluenesulfonic acid and its salt or quaternary ammonium salt.
  • the aluminum acetylacetonate and the 12-aminododecanoic acid composition are catalytically active to catalyze the reaction of the silicone resin between 120 and 170 ° C, and the amount of the catalyst is 0.5 to 1.5%.
  • Additives include adhesion promoters, as well as defoamers, leveling agents, wetting agents, brighteners and other functional additives commonly used in powder coatings; adhesion promoters help to improve the adhesion of the coating film to the substrate. Force, defoamer is used to remove small molecules of volatiles generated during the curing reaction.
  • the leveling agent helps the coating to form a dense, continuous, smooth coating, such as Exytront A-4 and Resiflow P-67 from Estron Chemical Inc. Wait.
  • the total amount of additives is 0.5-5%.
  • Flame Retardant The flame retardancy of silicone resin varies with the content of hydrocarbon groups such as methyl or phenyl. When the content of hydrocarbon group is high, the flame retardancy is poor, in order to ensure the flame retardancy of the packaging material. To achieve UL-94 V0 level, a flame retardant is required. Flame retardants are selected from the flame retardants known in the prior art, especially several environmentally friendly flame retardants which have been commercialized, such as: Al(OH)3, Mg(OH) 2 , zinc borate, degree of polymerization greater than 100 A combination of one or more of ammonium polyphosphate or melamine cyanurate.
  • the flame retardant mechanism absorbs a large amount of heat, and it liberates crystallization water or inert gas to dilute the combustible gas.
  • the first three flame retardants can also be thermally crosslinked to form a dense inorganic protective film, so that oxygen can not enter the inside of the coating film. Flame retardant effect.
  • the flame retardant may be used in an amount of from 0 to 30% by weight based on the total amount of the filler.
  • the pigment may be a commercially available inorganic or organic pigment having a heat-resistant temperature of 200 ° C or higher and having no adverse effect on the encapsulating material.
  • the preparation method is:
  • a flame-retardant silicone resin encapsulating material for electronic components each component and its parts by weight are respectively -
  • Example 3 The preparation method is the same as in Example 1.
  • Example 3 The preparation method is the same as in Example 1.
  • a flame-retardant silicone resin encapsulating material for electronic components each component and its parts by weight are:
  • Example 4 The preparation method is the same as that in the first embodiment.
  • Example 4 is the same as that in the first embodiment.
  • the preparation method is the same as in Example 1.
  • composition of the raw materials of the examples is summarized as follows:
  • Example 1 2 3 4 Raw material Dowcorning® 220 10 10
  • Plasticizer 107 Silicone oil (viscosity 5000c.s) 2 2 2 2 2 Aluminum acetylacetonate 1 1 1 1 Catalyst
  • the preheating temperature of the electronic component and the leveling temperature of the powder are both 160 ° C, and the number of coatings is determined according to the thickness of the coating film.
  • the film thickness is controlled at 300-350 ⁇ m; the curing condition is 140 ° C, 20 min.
  • the silicone resin encapsulating material provided by the invention does not use any organic solvent during production, processing and use, and is safe and environmentally friendly; the use of environmentally friendly and harmless flame retardant, or the addition of a flame retardant can be achieved Flame-retardant effect, and does not produce harmful substances to the human body or the environment when burned or burned by flame; can heat self-leveling and form a continuous glossy encapsulation layer; the curing temperature of the encapsulating material is lower than 180 ° C, Suitable for use with electronic components with solder joints; the invention has the characteristics of environmental protection, high temperature resistance, flame retardancy, low curing temperature, self-leveling by heating, good electrical insulation performance, etc., and is used for varistor, thermistor, ceramic Encapsulation of electronic components such as capacitors. It should be noted that the above embodiments are only intended to illustrate the invention and are not to be construed as limiting the scope of the invention. The spirit and scope of the invention are intended to be included within the scope of the appended claims.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une substance de conditionnement ignifuge à base de résine de silicium organique utilisée pour un élément électronique, les composants et leurs pourcentages en poids étant comme suit : 15 à 60 % en poids de résine de silicium organique, 20 à 80 % en poids de substance de remplissage, 1 à 20 % en poids d'un plastifiant, 0,5 à 1,5 % en poids d'un catalyseur, 0,5 à 5 % en poids d'un assistant et 0,5 à 5 % en poids d'un pigment. La substance de l'invention présente les avantages suivants : pas de pollution de l'environnement, une résistance aux températures élevées, une excellente propriété ignifuge, une faible température de durcissement, un auto-nivelage et de bonnes propriétés d'isolation électrique etc. La substance est également appropriée pour conditionner des éléments électroniques tels qu'une résistance piézo, une résistance thermique et un condensateur en céramique et équivalents.
PCT/CN2008/001509 2008-07-10 2008-08-22 Substance de conditionnement ignifuge pour élément électronique WO2010003278A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA2008100538042A CN101302343A (zh) 2008-07-10 2008-07-10 电子元器件用阻燃有机硅粉末封装材料
CN200810053804.2 2008-07-10

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WO2010003278A1 true WO2010003278A1 (fr) 2010-01-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8906978B2 (en) 2009-04-08 2014-12-09 Energ2 Technologies, Inc. Manufacturing methods for the production of carbon materials
EP3070720A4 (fr) * 2013-11-13 2017-11-29 Nippon Chemi-Con Corporation Composant électronique et son procédé de fabrication

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CN103709754A (zh) * 2013-12-13 2014-04-09 芜湖佳诚电子科技有限公司 一种耐磨损矩形圈用橡胶
CN103756336B (zh) * 2013-12-30 2016-01-20 宁国市龙驰电器有限公司 一种电容器用微晶石蜡粉末包封料及其制备方法
CN104987729A (zh) * 2015-06-04 2015-10-21 常熟市林芝电子有限责任公司 一种陶瓷热敏电阻器用高耐压有机硅包封料
CN105504823A (zh) * 2016-01-28 2016-04-20 天津凯华绝缘材料股份有限公司 一种耐高温有机硅粉末包封料及其制备方法
CN106189249A (zh) * 2016-07-19 2016-12-07 黄飞必 一种led封装材料
CN107033609A (zh) * 2017-05-19 2017-08-11 合肥尚强电气科技有限公司 一种用于输变电线路的绝缘层
CN111592763B (zh) * 2020-05-25 2022-03-08 深圳市莱美斯硅业有限公司 一种防火硅胶布及其制备方法及用途

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JPS60238380A (ja) * 1984-05-10 1985-11-27 Nitto Boseki Co Ltd 耐火性シ−リング材
WO1994011455A1 (fr) * 1992-11-11 1994-05-26 Vispak Limited Materiau d'etancheite
EP0950695B1 (fr) * 1998-03-31 2004-02-11 Morton International, Inc. Composition en poudre pour des revêtements résistants aux temperatures elevées
CN1793272A (zh) * 2005-11-22 2006-06-28 浙江大学 单组分表面可修饰性有机硅密封材料及其制备方法和用途
CN101121870A (zh) * 2007-07-27 2008-02-13 上海回天化工新材料有限公司 新型脱醇型有机硅灌封胶

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60238380A (ja) * 1984-05-10 1985-11-27 Nitto Boseki Co Ltd 耐火性シ−リング材
WO1994011455A1 (fr) * 1992-11-11 1994-05-26 Vispak Limited Materiau d'etancheite
EP0950695B1 (fr) * 1998-03-31 2004-02-11 Morton International, Inc. Composition en poudre pour des revêtements résistants aux temperatures elevées
CN1793272A (zh) * 2005-11-22 2006-06-28 浙江大学 单组分表面可修饰性有机硅密封材料及其制备方法和用途
CN101121870A (zh) * 2007-07-27 2008-02-13 上海回天化工新材料有限公司 新型脱醇型有机硅灌封胶

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8906978B2 (en) 2009-04-08 2014-12-09 Energ2 Technologies, Inc. Manufacturing methods for the production of carbon materials
EP3070720A4 (fr) * 2013-11-13 2017-11-29 Nippon Chemi-Con Corporation Composant électronique et son procédé de fabrication
US9892830B2 (en) 2013-11-13 2018-02-13 Nippon Chemi-Con Corporation Electronic component and production method therefor

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