WO2010001790A1 - 荷電粒子線装置 - Google Patents
荷電粒子線装置 Download PDFInfo
- Publication number
- WO2010001790A1 WO2010001790A1 PCT/JP2009/061550 JP2009061550W WO2010001790A1 WO 2010001790 A1 WO2010001790 A1 WO 2010001790A1 JP 2009061550 W JP2009061550 W JP 2009061550W WO 2010001790 A1 WO2010001790 A1 WO 2010001790A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stage
- sample
- pattern
- observation
- alignment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/282—Determination of microscope properties
- H01J2237/2826—Calibration
Definitions
- the inspection stage is used for the purpose of improving the quality control yield in the fee for forming the circuit pattern typified by the conductor c.
- the degree of a circuit pattern can be measured from a secondary number obtained from a material by irradiating charged particles, or an image can be generated from a secondary number obtained from a material by irradiating charged particles. Child microscopes for evaluating things are known.
- an interest rate of 30 or more may be applied.
- the view at this time is 0.5 below. Therefore, in order to display the circuit pattern or defect to be observed near the center of the screen, it is necessary to recognize the sample mark at a level that is four minutes below the observation range, for example, 0 .
- the stage of the equipment for loading the c becomes a considerable type.
- an output mechanism for speeding up the stage is required.
- the heat generated by the motor of the high-output dynamic mechanism is raised, and the generated heat causes a change in the sample or the sample side as a component, and the target that irradiates charged particles deviates from the target.
- the sample will expand and contract with time, leading to the above problems.
- the irradiated particles themselves are also converted to energy to some extent, resulting in temperature changes.
- Patent 2 if a method of simulating the movement of the material due to a change in the degree of the energy based on the particle energy applied to the material or performing an experiment to correct the coordinate deviation is known, Patent 2).
- a sample such as C is necessary to measure the temperature of the sample and to control it to a constant temperature, a heat source such as a heater, and the need to control these. It is inevitable.
- the charge of the control object or the capacity of the parts is large, the number of temperatures is large and it takes a long time to set.
- the heat source cannot be turned off, it cannot be controlled locally. Therefore, there is a possibility that the expansion of the material will end up unevenly and the specimen will be damaged.
- the secondary sample generated by irradiating the sample placed on the stage with a particle is detected, and the sample image is displayed.
- the standard value is known from the secondary order generated from the alignment pattern of the fee Calculates the amount of displacement between the sample stage and the coordinate data, generates coordinate data, outputs at least a secondary signal generated from the alignment pattern, and updates the coordinate data. And control to execute alignment.
- Sectional drawing which shows the composition of a child microscope.
- FIG. 1 shows the relationship between the stages.
- Figure 3 is a flow chart showing the order of alignment of the scanning microscope.
- Figure 4 is a screen view of observation 90 in observation 9.
- Figure 5 shows the screen of Observation 90 in Observation 9.
- Figure 6 is a side view of.
- Fig. 7 is a time chart showing the amount of stage movement.
- Figure 8 shows the relationship between the above image and the stage.
- FIG. 5 is a cross-sectional view showing the structure of a scanning microscope.
- the essential structure of the child microscope is to generate 2 electrons and emit 0 times.
- An electronic system consisting of a lens group is housed and kept in a vacuum.
- stage 2 that is movable in two directions and stage with sample 0 are placed.
- 2 to keep 2 in a vacuum.
- 2 is installed on the floor of the cream etc. in 6 through und 4 which removes the movement. 2 is evacuated by a vacuum pump 5 and is kept in a vacuum pump by an unillustrated vacuum pump.
- the 2 is equipped with a mouth lock 3 on which a pot 3 for sending the sample 0 is installed.
- the lock 3 is provided with a getval 3 2 that separates from the sample 2 and an atmospheric getval 3 3 that separates from the atmosphere.
- open the atmosphere get valve 3 3 and transfer the sample 0 from the atmosphere to the mouth lock 3 by the robot 3.
- close the atmosphere get valve 3 3 and evacuate the inside of the lock 3 with a vacuum pump (not shown).
- a vacuum pump not shown.
- the pressure reaches the same level as sample 2
- Zero is attached and held by the electrostatic Yatta 24 attached to the stage 2.
- Sample 2 can be staged 2 by the fact that the am of pot 3 extends to the part of sample 2.
- Stage 2 has a rod-shaped mirror attached to it, and by managing the relative distance between 2 and 3 attached to specimen 2, stage 2 can be managed. .
- stage 7 2 data measured in step 3 is sent. Information is generated and sent to stage 72, which drives stage 2. Stage 7 2 performs feedback control so that there is no difference from the current target. For feedback control, it is possible to use control that uses only simple position feedback, PD control that improves the response and position by adding information on the degree of the stage and the difference between the stages.
- the sample 0 is placed in the column where the electrons generated by the electricity in the column are displayed.
- Electron lens for convergence 3 Thinned by lens 6 and focused on sample 0 and projected. In order to generate an image of the sample 0 with the generated electrons 2, the electrons 2 are irradiated so as to scan the surface of 0 by 4B of the deflection 4. From 0, secondary electrons and signs are generated by electron 2 and detected by detection 5.
- the secondary data scan 4B detected in step 5 is transmitted to image 73.
- An image is generated on the basis of the information from the detector obtained here and displayed on the display 74 as an image.
- Fig. 2 shows the relationship of the stage.
- X 80 Y 8 of the stage is based on the level of the stage. It is always fixed regardless of the stage and shape of the stage. On the other hand, it is determined by the position of the formed pattern. 8 2 8 3 is the stage. Is based on. It depends on the accuracy of the pattern. In addition, the standard value of one point on U, which varies depending on the degree of the stage,
- the alignment is performed by using the number of alignment patterns formed in C.
- Fig. 3 is a flowchart showing the order of future alignment of the scanning microscope. First, use sample 0 as the stage
- Step 3 do the alignment pattern of the number of c in the field of the rate range.
- the mark in the shape c is only registered.
- the target of the pattern on the stage is collected (step 303).
- calculate a mark in step for the step For example, this is expressed as the degree of origin offset, which is the departure of the originator.
- the state based on the stage is corrected as a step (3). This value is called scale because the separation of the stage is not absolutely correct but is a relative scale value. Calculate the data to be converted to the stage from the position of the stage and the scale value. Convert to stage
- the standard mark for the stage is converted to the stage, and the desired inspection is possible.
- the alignment pattern must be at least 2 to convert to the U stage.
- Figure 4 is a screen shot of observation 90 in observation 9.
- the inspection if there is a temperature change on the side, the expansion and contraction of c will change, and the relationship with the level of the stage will change. In the example shown in Fig. 4, there is a deviation of A in the direction and A in the direction.
- the pattern or defect which is the observation object, shifts to a position away from the center of the observation area, and when the temperature change is extremely large, it is out of the observation area.
- Figure 5 shows observation 90 in observation 9 as in 4. 5a from the inspection unit, as shown 0
- the observation 90 mark was taken at the heart of the observation field at a rate, the reference pattern shown in 5 was compared, the deviation of observation 90 was obtained, and this deviation was corrected to make observation 90 the Do the high rate shown in 5c. In this order, at the rate of the rate image
- the ratio is not corrected, but the alignment is performed to correct the misalignment, the ratio is corrected, and the ratio pattern or design data pattern is further corrected.
- the alignment is performed by correcting the misalignment by ching, and this is repeated.
- a method of executing the alignment work when a certain period of time has passed since the start of alignment.
- the coordinate data is updated by the alignment, and if the observation is performed again, the deviation of the coordinates is reset, and the sample observation with improved coordinate degree becomes possible.
- a method of executing a certain value such as 0 execution
- a method of performing a constant method such as executing execution of 00 times
- Alignment timing is not time It is also conceivable to divide the c into a number of areas and execute the alignment every time the inspection of the area is completed. For example, as shown in Fig. 6, the sample 10 is divided into a number of ABCs, and when the transition to the next region B is completed after the observation of the region A is completed, the alignment is performed when the CZ line is performed from the region B. There is a way to do it. No. 05 indicates the observation order.
- stage movement amount A can be set arbitrarily by inputting the value on the screen.
- the child microscope has a patterning function to calculate the deviation from the design data observation pattern, it can be used to correct one position deviation and execute the alignment. Since the amount of deviation is monitored by one patterning, there is a point that alignment work can be performed accurately. Another possible method is to execute alignment and update the coordinate data when the deviation exceeds the expected value.
- the threshold of the deviation amount may be set arbitrarily, but as shown in Fig. 4, it may be automatically set according to the observation represented by f and the observation rate. For example, if there is a deviation of 4 in the observation range, set the alignment to be executed.
- the amount of deviation in the mark can be ascertained and corrected.
- the deviation is added to the coordinate data, and the observation is repeated while updating the data.
- Fig. 8 shows the relationship between the above-mentioned image and the stage, and shows the shape 3 of the reference pattern and the shape 2 of the observation pattern.
- Fig. 8 shows 2 for the reference pattern generated from the data such as data and 3 for the observation pattern actually taken for stage X80 and stage Y8. It is.
- the reference pattern 9 6 9 8 is a known 2 2 because it is generated from the setting data such as data, so it does not need to be obtained.
- Past pattern 9 7 Past pattern 9 8 Deviation Current observation pattern 9 5 Reference pattern 9 7 Deviation amount Past and present can be output.
- the deviation amount of the reference pattern 98 is, for example, a certain previous view, is a fixed coordinate, and is a deviation amount of a coordinate observed a certain time ago. From above, the scale of C and shift AX can be calculated. This time, we will explain the calculation based on two observation patterns.
- the shift AX AY can be calculated by considering the scale rotation.
- the coordinate data can be set again, and the deviation of the next pattern reference pattern can be reduced.
- renewing the data it is possible to realize the degree of avoidance of lowering the throughput due to the alignment work from the end to the end.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020107029710A KR101187957B1 (ko) | 2008-07-02 | 2009-06-18 | 하전 입자선 장치 |
US13/001,532 US8880374B2 (en) | 2008-07-02 | 2009-06-18 | Charged particle beam device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-172881 | 2008-07-02 | ||
JP2008172881A JP5202136B2 (ja) | 2008-07-02 | 2008-07-02 | 荷電粒子線装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010001790A1 true WO2010001790A1 (ja) | 2010-01-07 |
Family
ID=41465887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/061550 WO2010001790A1 (ja) | 2008-07-02 | 2009-06-18 | 荷電粒子線装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8880374B2 (ja) |
JP (1) | JP5202136B2 (ja) |
KR (1) | KR101187957B1 (ja) |
WO (1) | WO2010001790A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012169505A1 (ja) * | 2011-06-09 | 2012-12-13 | 株式会社日立ハイテクノロジーズ | ステージ装置およびステージ装置の制御方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5325681B2 (ja) * | 2009-07-08 | 2013-10-23 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
JP5542478B2 (ja) * | 2010-03-02 | 2014-07-09 | 株式会社日立ハイテクノロジーズ | 荷電粒子線顕微鏡 |
US10354405B2 (en) | 2010-05-17 | 2019-07-16 | Kla-Tencor Corporation | Run-time correction of defect locations during defect review |
EP2626885A1 (en) * | 2012-02-13 | 2013-08-14 | FEI Company | Forming a vitrified sample for an electron microscopy |
US8884248B2 (en) | 2012-02-13 | 2014-11-11 | Fei Company | Forming a vitrified sample for electron microscopy |
JP6068624B2 (ja) * | 2013-04-22 | 2017-01-25 | 株式会社日立ハイテクノロジーズ | 試料観察装置 |
JP2021039880A (ja) * | 2019-09-03 | 2021-03-11 | 株式会社日立ハイテク | 荷電粒子線装置 |
US20230107036A1 (en) * | 2021-10-04 | 2023-04-06 | Nuflare Technology, Inc. | Charged particle beam writing method and charged particle beam writing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151564A (ja) * | 1992-11-09 | 1994-05-31 | Hitachi Ltd | ウェーハパターン装置 |
JPH10135288A (ja) * | 1996-11-01 | 1998-05-22 | Jeol Ltd | 部品検査システム |
JP2007093458A (ja) * | 2005-09-29 | 2007-04-12 | Hitachi High-Technologies Corp | 荷電粒子ビーム装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5923467B2 (ja) * | 1979-04-16 | 1984-06-02 | 株式会社日立製作所 | 位置検出方法 |
US5329130A (en) * | 1991-08-06 | 1994-07-12 | Fujitsu Limited | Charged particle beam exposure method and apparatus |
KR100439466B1 (ko) * | 1995-09-11 | 2004-09-18 | 가부시키가이샤 야스가와덴끼 | 로봇제어장치 |
US6299960B1 (en) * | 1997-07-11 | 2001-10-09 | Southpac Trust Int'l, Inc. | Decorative grass formed of polymeric materials having a texture and appearance assimilating paper |
US6107637A (en) * | 1997-08-11 | 2000-08-22 | Hitachi, Ltd. | Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus |
JP3987267B2 (ja) * | 2000-05-12 | 2007-10-03 | 株式会社日立製作所 | 荷電粒子線装置 |
JP2004128196A (ja) * | 2002-10-02 | 2004-04-22 | Hitachi High-Technologies Corp | 電子線描画装置と電子線描画方法 |
JP5134188B2 (ja) * | 2004-10-15 | 2013-01-30 | ケーエルエー−テンカー コーポレイション | 試料上の欠陥を分析する装置 |
EP1670028B1 (en) * | 2004-12-07 | 2017-02-08 | JEOL Ltd. | Apparatus for automatically correcting a charged-particle beam |
JP2008085120A (ja) * | 2006-09-28 | 2008-04-10 | Nuflare Technology Inc | 荷電粒子ビーム描画装置の位置補正係数算出方法及び荷電粒子ビーム描画装置の位置補正係数更新方法 |
-
2008
- 2008-07-02 JP JP2008172881A patent/JP5202136B2/ja not_active Expired - Fee Related
-
2009
- 2009-06-18 KR KR1020107029710A patent/KR101187957B1/ko not_active IP Right Cessation
- 2009-06-18 US US13/001,532 patent/US8880374B2/en not_active Expired - Fee Related
- 2009-06-18 WO PCT/JP2009/061550 patent/WO2010001790A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151564A (ja) * | 1992-11-09 | 1994-05-31 | Hitachi Ltd | ウェーハパターン装置 |
JPH10135288A (ja) * | 1996-11-01 | 1998-05-22 | Jeol Ltd | 部品検査システム |
JP2007093458A (ja) * | 2005-09-29 | 2007-04-12 | Hitachi High-Technologies Corp | 荷電粒子ビーム装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012169505A1 (ja) * | 2011-06-09 | 2012-12-13 | 株式会社日立ハイテクノロジーズ | ステージ装置およびステージ装置の制御方法 |
JP2012256516A (ja) * | 2011-06-09 | 2012-12-27 | Hitachi High-Technologies Corp | ステージ装置およびステージ装置の制御方法 |
CN103608890A (zh) * | 2011-06-09 | 2014-02-26 | 株式会社日立高新技术 | 台装置以及台装置的控制方法 |
US8907303B2 (en) | 2011-06-09 | 2014-12-09 | Hitachi High-Technologies Corporation | Stage device and control method for stage device |
CN103608890B (zh) * | 2011-06-09 | 2015-01-28 | 株式会社日立高新技术 | 台装置以及台装置的控制方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101187957B1 (ko) | 2012-10-05 |
US20110098960A1 (en) | 2011-04-28 |
KR20110025785A (ko) | 2011-03-11 |
JP5202136B2 (ja) | 2013-06-05 |
US8880374B2 (en) | 2014-11-04 |
JP2010015732A (ja) | 2010-01-21 |
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